HUNAN FN LINK TECHNOLOGY F89FTSM13 Wifi Module User Manual

Download:
Mirror Download [FCC.gov]
Document ID	3019997
Application ID	JrH0e2mSKY1IxzZGx5p3bg==
Document Description	15_F89FTSM13 UserMan, r2.pdf
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	174.57kB (2182173 bits)
Date Submitted	2016-06-07 00:00:00
Date Available	2016-06-07 00:00:00
Creation Date	2017-12-07 14:42:08
Producing Software	GPL Ghostscript 9.18
Document Lastmod	2017-12-07 14:42:08
Document Title	Users Manual
Document Creator	WPS Office
Document Author:	YlmF

F89FTSM13
CONTENTS
FN-LINK TECHNOLOGY LIMITED
REVESION HISTORY............................................................................................................................................... 3
INTRODUCTIONS......................................................................................................................................................4
1.1
OVERVEIW..........................................................................................................................................................4
1.2
PRODUCT FEATURES..................................................................................................................................... 4
GENERAL SPECIFICATION.................................................................................................................................... 5
2.1
WIFI RF SPECIFICATION................................................................................................................................ 5
2.2
POWER CONSUMPTION.................................................................................................................................5
MECHANICAL SPECIFICATION............................................................................................................................. 6
3.1
OUTLINE DRAWING......................................................................................................................................... 6
3.2
PCB LAYOUT......................................................................................................................................................6
3.3
PIN DEFINITION.................................................................................................................................................7
3.4
APPLICATION CIRCUIT.................................................................................................................................... 8
ENVIRONMENTAL REQUIREMENTS................................................................................................................... 9
4.1
OPERATING & STORAGE TEMPRETURE...................................................................................................9
4.2
RECOMMENDED REFLOW PROFILE.......................................................................................................... 9
4.3
NOTICE................................................................................................................................................................ 9
PACKING INFORMATION...................................................................................................................................... 10
http://www.fn-link.com
Page2/12
FN-LINK TECHNOLOGY LIMITED
0. Revision History
REV NO
Date
Rev.1.0
2015-7-9
http://www.fn-link.com
Modifications
First Released
Draft
Allen Hu
Page3/12
FN-LINK TECHNOLOGY LIMITED
1. Introduction
1.1 Overview
F89FTSM13 is a highly integrated and excellent performance Wireless LAN (WLAN) SDIO network
interface device. High-speed wireless connection up to 150 Mbps.
The general hardware for the module is shown in Figure 1. This WLAN Module design is based on Realtek
RTL8189FTV. It is a highly integrated single-chip 1*1 MIMO (Multiple In Multiple Out) Wireless LAN (WLAN)
SDIO network interface controller complying with the 802.11n specification. It combines a MAC, a 1T1R
capable baseband, and RF in a single chip. It is designed to provide excellent performance with low power
Consumption and enhance the advantages of robust system and cost-effective.
26MHz
1.2 Product Features





Operate at ISM frequency bands (2.4GHz)
SDIO Interface for WiFi
IEEE standards support: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n,
Enterprise level security which can apply WPA/WPA2 certification for WiFi.
WiFi 1 transmitter and 1 receiver allow data rates supporting up to 150 Mbps downstream and 150 Mbps
upstream PHY rates
http://www.fn-link.com
Page4/12
FN-LINK TECHNOLOGY LIMITED
2. GENERAL SPECIFICATION
2.1 WiFi RF Specifications
Main Chipset
RTL8189FTV
Operating Frequency
2.400～2.4835GHz
Standards
WiFi:
IEEE 802.11b,
IEEE 802.11g,
IEEE 802.11n,
Modulation
WiFi:
802.11b: CCK(11, 5.5Mbps), QPSK(2Mbps), BPSK(1Mbps),
802.11 g/n: OFDM
PHY Data rates
WiFi:
802.11b: 11,5.5,2,1 Mbps
802.11g: 54,48,36,24,18,12,9,6 Mbps
802.11n: up to 150Mbps
Transmit Output Power WiFi:
802.11b <16dBm
802.11g <14dBm
802.11n <13dBm
Receiver Sensitivity
Operating Channel
Media Access Control
Antenna
Network Architecture
Security
OS Supported
Host Interface
Operating Voltage
Dimension
802.11b@11Mbps -82±1dBm
802.11g@54Mbps -71±1dBm
802.11n
-67±1dBm (MCS 7_HT20)
-64±1dBm (MCS 7_HT40)
WiFi 2.4GHz:
11: (Ch. 1-11) – United States
WiFi: CSMA/CA with ACK
Integral (1dBi Max)
WiFi: Ad-hoc mode (Peer-to-Peer )
Infrastructure mode
Software AP
WiFi Direct
WiFi: WPA, WPA-PSK, WPA2, WPA2-PSK, WEP 64bit & 128bit,
Android /Linux
WiFi: SDIO/GPIO
3.3Vdc ±10% I/O supply voltage
Typical L12.0*W12. 0*H1.6mm
2.2 Power Consumption
Mode
OS
Windows XP
http://www.fn-link.com
Status
Power(mA)
Link
130
RX
130
20M
190
20M(MCS7)
175
40M(MCS7)
TX
Note
Page5/12
3. Mechanical Specification
FN-LINK TECHNOLOGY LIMITED
3.1 Outline Drawing
3.2 PCB LAYOUT (Unit: ±0.15mm)
http://www.fn-link.com
Page6/12
FN-LINK TECHNOLOGY LIMITED
3.3 PIN Assignment
Pin #
Name
Description
GND
GND
RF
RF OUTPUT
GND
GND
4~8
NC
NC
VBAT
3.3V Optional
10
NC
NC
11
NC
NC
12
WL_REG_ON
WL_REG_ON
13
WL_HOST_WAKE
WAKE UP
14
SDIO_DATA_2
SDIO_D2
15
SDIO_DATA_3
SDIO_D3
16
SDIO_DATA_CMD
SDIO_CMD
17
SDIO_DATA_CLK
SDIO_CLK
18
SDIO_DATA_D0
SDIO_D0
19
SDIO_DATA_D1
SDIO_D1
20
GND
GND
21
NC
NC
22
VDIO
1.8~3.3V
23
NC
NC
24
LPO
CLK_REQ
25~29
NC
NC
30
TCXO_IN
26MHz_IN
31
GND
GND
http://www.fn-link.com
Page7/12
FN-LINK TECHNOLOGY LIMITED
32
NC
NC
33
GND
GND
34~35
NC
NC
36
GND
GND
37~40
NC
NC
41
GND
GND
42~44
NC
NC
3.4 Application Circuit
http://www.fn-link.com
Page8/12
FN-LINK TECHNOLOGY LIMITED
4. Environmental Requirements
4.1 Operating & storage tempreture
Operating
Storage
MTBF (Mean Time Between Failures)
Temperature: -5°C to +55°C
Relative Humidity: 10-90% (non-condensing)
Temperature: -40°C to +80°C (non-operating)
Relative Humidity: 5-90% (non-condensing)
Over 150,000hours
4.2 Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : ≤2 times
4.3 Patch WIFI modules installed before the notice:
WIFI module installed note:
1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil
2. Take and use the WIFI module, please insure the electrostatic protective measures.
3. Reflow soldering temperature should be according to the customer the main size of the products, such as
the temperature set at 250 + 5 ℃ for the MID motherboard.
About the module packaging, storage and use of matters needing attention are as follows:
1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment
conditions: temperature in: < 40 ℃, relative humidity: < 90% r.h.
2. The module vacuum packing once opened, time limit of the assembly:
Card: 1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink), or
greater than 40% (red) the module have been moisture absorption.
2.) factory environmental temperature humidity control: ≦ -30℃, ≦ 60% r.h..
3). Once opened, the workshop the preservation of life for 168 hours.
http://www.fn-link.com
Page9/12
3. Once opened, such as when not used up within 168 hours:
1). The module must be again to remove the module moisture absorption.
2). The baking temperature: 125 ℃, 8 hours.
3.) After baking, put the right amount of desiccant to seal packages.
FN-LINK TECHNOLOGY LIMITED
5. PACKING INFORMATION
5.1 Blister packaging
A piece of 100 PCS
5.2 Coiling Packaging
A roll of
2000pcs
http://www.fn-link.com
Page10/12
FN-LINK TECHNOLOGY LIMITED
The module will be responsible to satisfy SAR/RF Exposure requirements, when the module integrated
into any (portable, mobile, fixed) host device.
2AATL-F89FTSM13
http://www.fn-link.com
Page11/12
FN-LINK TECHNOLOGY LIMITED
This devic has been evaluated and shown compliant with the FCC RF Exposure limits under fixed
exposure conditions (antennas are greater than 20cm from a person's body) when installed in certain
specific OEM configurations.
FCC Radiation Exposure Statement:
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Due to missing shielding the module is strictly limited to integration by the Grantee himself or his dedicated
OEM integrator under control of the Grantee.However, the OEM integrator is still responsible for testing
their end-product for any additional compliance requirements required with this module installed.
Note 1: The wifi module has no shielding and tested stand alone.
This module is tested and approved as Limited modular approval with stand alone configuration, any OEM
incorporated this radio module into any system are require additional testing and evaluation.
Note 2: The module is only certified with the installed antenna. Any change of the antenna
will void the certification. The host device including this RF module need to undergo separate
cetification.
http://www.fn-link.com
Page12/12
Attention: Limited Modular Approval ‐ this RF Module may not be sold to the generic public
and requires professional installation.
Due to the fact that this RF Module is not equipped with an own shielding, the end‐product
incl. this RF Module has to show compliance to the FCC rules (15C / radiated emissions).
(OEM) Integrator has to assure compliance of the entire end‐product
incl. the integrated RF Module. Additional measurements (15C) and/or equipment authorizations
(e.g either a complete new certification or a Class II Permissive Change. )
may need to be addressed depending on co‐location or simultaenous
transmission issues if applicable.
Integrator is reminded to assure that these installation instructions
will not be made available to the end‐user of the final host device.
the Integrator will be responsible to satisfy SAR/ RF Exposure requirements,
when the module integrated into any (portable, mobile, fixed) host device.
The final host device, into which this RF Module is integrated" has to be labelled
with an auxilliary lable stating the FCC ID of the RF Module, such as
"Contains FCC ID: 2AATL-F89FTSM13
Depending on the size of the final end‐product, the §15.19 FCC statement
"This device complies with part 15 of the FCC rules. Operation is subject to the following two
conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including
interference that may cause undesired operation."
should be placed also on the device or alternatively within a prominent location of the users
manual
The §15.21 "Changes or modifications to this unit not expressly
approved by the party responsible for compliance could
void the user’s authority to operate the equipment." statement has to be included in a prominent
location of the users manual

---

Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.7
Linearized                      : No
Encryption                      : Standard V4.4 (128-bit)
User Access                     : Print, Extract, Print high-res
Author                          : YlmF
Create Date                     : 2016:03:14 10:33:32Z
Modify Date                     : 2016:06:07 17:05:24+08:00
Has XFA                         : No
XMP Toolkit                     : Adobe XMP Core 4.2.1-c043 52.372728, 2009/01/18-15:08:04
Format                          : application/pdf
Creator                         : YlmF
Title                           : 产品特点：
Creator Tool                    : WPS Office
Metadata Date                   : 2016:06:07 17:05:24+08:00
Document ID                     : uuid:e551cdf4-4bc1-4bc2-ae03-bc9520cfba2b
Instance ID                     : uuid:23fd2eea-f50b-4a74-958e-8604c232ebf1
Page Count                      : 13

EXIF Metadata provided by EXIF.tools