Hangzhou Gubei Electronics Technology WT1FBS Embedded Wi-Fi Module User Manual Use Manualx
Hangzhou Gubei Electronics Technology Co.,Ltd Embedded Wi-Fi Module Use Manualx
Users Manual
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| Document ID | 2772742 |
| Application ID | wWQbYDKcwNGkaQx4jsXpsg== |
| Document Description | Users Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
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| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 148.91kB (1861406 bits) |
| Date Submitted | 2015-10-05 00:00:00 |
| Date Available | 2015-10-05 00:00:00 |
| Creation Date | 2017-09-10 18:47:42 |
| Producing Software | GPL Ghostscript 9.18 |
| Document Lastmod | 2017-09-10 18:47:42 |
| Document Title | Microsoft Word - Use Manual.docx |
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| Document Author: | baclks52 |
BiTrend d™ EssentialSerriesWi-F Fi Module Datashe eet WT1FBS Han ngzhou Gubei Ele ectronics Technology Co., Ltd. Co opyrigh ht Inforrmatio on The information n contained in this docu ument is the e proprietarry informatio on of Hangzzhou Gub bei Electroniics Technolo ogy Co., Ltd d. (hereinaftter referred as BroadLiink). Furtherr, no porttion of this document may m be alterred or edite ed in any forrm or by an ny meanswithout the prior written n consent off BroadLink, the copyrightholder. Furtther BroadLink reserves the right to make modiifications, ad dditions anddeletions to o this document due e to typogrraphical errrors, inaccurate inform mation, orim mprovements to ducts mentioned in the document at any time and withou ut notice. Su uch changess will, prod neve ertheless be e incorporatted into new w editions of this docum ment or pub blished as errata shee et. Ve ersion History V 1.0.0 17/07 7/2015 1sttissue of pre eliminary doccument 1w www.ibroadlink k.com Table of Con ntents 1. In ntroduction ................................................................................................................................... 3 ew .............................................................................................................................. 3 1.1 Overvie 1.2 Applications......................................................................................................................... 4 1.3 Key Fea atures ........................................................................................................................ 4 2. Product Overrview ......................................................................................................................... 5 2.1 Productt Picture ................................................................................................................... 5 2.2 Block Diagram ..................................................................................................................... 6 3. Ellectrical Cha aracteristics............................................................................................................... 6 3.1 Absolutte Maximum m Ratings – Voltage & Cu urrent ......................................................... 6 3.2 Digital I/O I Port Cha aracteristics ........................................................................................ 7 3.3 Currentt consumptio on ........................................................................................................ 7 3.4 Absolutte maximum m ratings – Te emperature .................................................................... 8 3.5 Absolutte maximum m ratings – ES SD ................................................................................... 8 4. RF Characteristics .......................................................................................................................... 8 4.1 Basic Ch haracteristiccs .......................................................................................................... 8 ........................................................................................ 8 4.2 IEEE802 2.11b Mode ..................... ........................................................................................ 9 4.3 IEEE802 2.11g Mode ..................... 4.4 IEEE802 2.11n 20Mhzz Bandwidth Mode .......................................................................... 10 5. Mechanical Characteristic cs ....................................................................................................... 13 6. Module Interfaces ....................................................................................................................... 14 6.1 PIN Layyout ......................................................................................................................... 14 6.2 PIN Deffinitions .................................................................................................................. 15 7. Re eference De esign ........................................................................................................................ 16 8. Antenna Characteristics ............................................................................................................. 17 ...................................................................................... 17 8.1 Antenna Selection ..................... 8.2 Minimizzing Radio In nterference ...................................................................................... 18 8.3 Specificcation of On-Board Ante enna .............................................................................. 19 pendix A ...................................................................................................................................... 21 App App pendix B .................................................................................................................................... 23 Con ntact Us ....................................................................................................................................... 25 2w www.ibroadlink k.com 1. Introd duction 1.1 1 Overview BiTre end™ Essenttialis the ind dustrial lead ding 2.4Ghz 802.11 b/g//n embedde ed Wi-Fi mo odule whicch delivers unmatched performance e and codele ess developm ment in a co ompact pack kage, provviding a quick, easy and d cost effective way forr developerss and manufacturers to add Wi-Fi connectivvity for home e automatio on, lighting control, energy efficienccy and otherr IOT applications. BiTre end™ Essenttial family co ombines a 2.4Ghz 802.1 11 b/g/n rad dio transceivver with a 32 2-bit micrroprocessor and embe edded with MAC, baseband proce essing and o optimized Wi-Fi netw work stack. It I is an ideal solution forr developerss and manuffacturers with limited RFF and emb bedded prog gramming expertise as it i significanttly reduces RF R design tim me and removes the burden of te esting and certification. Benefitted from m BroadLink’s turn-key solution, BiT Trend™ Essen ntial is an id deal solution n for deve elopers with h limited Wi--Fi or RF exp pertise or for those seekking faster tiime to mark ket. It redu uces RF dessign time an nd removes the burden n of testing and certificcation. BiTre end™ Esse ential is fullyy compliant with w IEEE 80 02.11 b/g/n standard and certified w with CE, FCC C and RoH HS. BiTre end™ Essen ntial is a hig ghly integratted Wi-Fi SoC(system on o Chip) sin ngle chip, which supp portsIEEE802.11b/g/n single stream m, providing GPIO for in ntelligent co ontrol, and UART interfaces for de evice communication. BiTre end™ Essen ntial has 8Mbits flash an nd integrate es power am mplifier, low noise amplifier, and RF switch to reduce the module size and RF R design ca apability req quired. And also integrate powerr manage un nit for single e 3.3V power source for cost effectivve design. BiTre end™ Essenttial embedd ded 32-bit RIISC MCU forr 802.11b/g//n drivers, su upplicant, TC CP/IP prottocol stack, and networking applica ations, can be b operated in station m mode and so oftAP mod de. The WT1 1FBS is an ideal solution for embedd ded device to o enable nettworking service with h minimized design effort. 3w www.ibroadlink k.com RF_IN RF receiver Base eband RFF_OUTP RFF_OUTN RF transmitter MAC / Packet buffer / security engine UART Syystem co ntrol UART GPIO/LED Figure 1. WT1FBS blocck diagram 1.2 2 Applica ations Smart hom me appliances Remote Co ontrol Medical/He ealth Care Network co onsumer devvices 1.3 3 Key Features a． Supportt IEEE802.11 1b/g/n Fre equency Ran nge 2.412 GHz - 2.462 2 GHz Wii-Fi Standard IEEE 802.11 b/g/n Tra ansmitter Po ower 802.11b:17dBm 802.11g:19dBm 802.11n:19dBm MIIN Receiver Sensitivity 802.11b<-78dBm 802.11g<-68dBm 802.11n<-66dBm Da ata rate 11M@ @802.11b, 54M@802.11 1g, MCS7@8 802.11n Se ecurity Encryyption Standard：WEP/W WEPA/WPA2 EncryyptionAlgoritthm：WEP6 64/WEP128/T TKIP/AES Wii-Fi Modes STA/A AP b． Supportt UARTtransparent transsfer c． Supportt STA\AP d． Patent SmartConfig g™ technolog gy e． Supportt IPv4, TCP/U UDP/ DNS/D DHCP f． PCB prin nted antenn na g． Antenna type PCB printed ANT IPEX connector fo or external antenna 4w www.ibroadlink k.com h． Power source: 3.3V i． Peripherals: 1*UART 4*GPIO j Dimension 37.5mm*20.4mm*4m j． mm k． ESD: 2KV l． Absolutte maximum ratings Symbol Descriptio on Min. Max. Units Ts Sto orage tempe erature -40 125 ℃ TAMBIENT Am mbient Temp perature -10 70 ℃ Vdd Supply volttage 3.63 Vio Voltage on IO O pin -0.28 3.63 VESD HBM(human body model) 2000 2. Product Overview 2.1 1 Producct Picturre 5w www.ibroadlink k.com 2.2 2 Block Diagram 40MHz OSC UART PCB Antenna Filter Circuit MTK7681 802.1 11 b/g/n SoC Balun Circuit SPI FLASH Multipllex Circuiit GPIO 3. Electriical Cha aracterristics 3.1 1Absolutte Maxim mum Ra atings – Voltage e & Curre ent Usin ng products above the absolute maximum ratings may ca ause perman nent damag ge to the device. The ese are maxximum rating gs only and d functional operation o of the devicce at thesse condition ns is not im mplied. Expo osure to maximum ratin ng condition ns for exten nded periods may a ect the relia ability of the device. Symbol Rating MIN TYP MAX Unit VDD D33 3.3V Supply Voltage 2..97 3.3 3.63 VDD D12 1.2V Supply Voltage 1..14 1.2 1.26 VDD D15 1.5V Supply Voltage 1..425 1.5 1.575 6w www.ibroadlink k.com 2 Digitall I/O Porrt Characteristiccs 3.2 Outtputvoltag gelevels Sym mbol Parame eter Condittions MIN MAX Unit VIL Input Low Voltage LVT TTL -0.28 0.6 VIH Input High Voltage 2.0 3.63 VT- Schmitt Trigge er Negative Go oing Thresho old Voltage 0.68 1.36 LVT TTL VT+ Schmitt Trigger Po ositive Going g Threshold Voltag ge 1.36 1.7 VOL Output Low w Voltage |IOL| = 1.6~14 mA -0.28 0.4 VOH Output High h Voltage |IOH| = 1.6~14 mA 2.4 VDD D33+0.33 RPU Input Pull-Up Resistance PU=h high, PD=low 40 190 KΩ RPD Inpu ut Pull-Down Resistance PU=llow, PD=h high 40 190 KΩ 3.3 3Currentt consum mption Symbol Note IRF IDLE mode IRF IRF IRF RX Active, HT4 40, MCS7 Condiition Performa ance TYP Unit 80 mA 151 mA TX HT40, MCS7 @ 15d dBm 210 mA TX CCK 11Mbps @ 18dBm 250 mA Note: All result is me easured at the antenna port and d VDD33 is 3.3V 7w www.ibroadlink k.com 3.4 4 Absolu ute maxiimum ra atings – Temperature Ra Symbol Max Unit TSTG Storagettemperature – to+125 –40 ℃ TA Workingtemperature -10 to+70 ℃ Humidit Non condensin ng, relative hu umidity 90% RH 3.5 5 Absolu ute maxiimum ra atings – ESD Symbol VESSD(HBM) Ratin ngs Condition ns Class Max Unit Electrostaticc discharge vo oltage (human bod dy model) TA = +25 °C conforming g to JESD22-A114 2000 4. RF Cha aracterristics 4.1 1Basic Characterristics Specificatiion Item Op peratingFrequ uency 2.412 GHzz - 2.462 GHzz Wi-FiStandard IEEE 802.1 11b/g/n 11b: DBPS SK, DQPSK,CCK for DSSS Mo odulationType 11g: BPSK K, QPSK, 16Q QAM, 64QAM M for OFDM 11n: MCS0~7,OFDM 11b:1,2,5.5 5and 11Mbp ps Data Rates 11g:6,9,12 2,18,24,36,48 and 54 Mbp ps 11n:MCS0 0~7,up to150 0Mbps IPEX conn nectorforexte ernalantenna Antennatype PCBprinte edANT 4.2 2 IEEE802.11b Mode Item Mo odulationType Specificatiion DSSS/CCK 8w www.ibroadlink k.com Fre equencyrange 2412MHz~2462MHz Channel CH1 toCH H11 Datarate 1,2,5.5,11M Mbps TX Characterist ics Min Typical Max. Unit Tran nsmitter Output Power 17 11bT Target Power Freq quency Errorr -20 dBm +20 ppm Con nstellation Errror( peak EVM)@ targe et power -17 -10 Typical Max. Unit -95 -83 dBm -93 -80 dBm 5.5M Mbps (FER≦8 8%) -91 -79 dBm 11M Mbps (FER≦8 8%) -89 -76 dBm 1~11Mbps RX Characterist tics Min Min nimum Inputt Level Sensitivity 1Mb bps (FER≦8% %) 2Mb bps (FER≦8% %) Maxximum Input Level (FER≦8%) -20 -10 dBm 4.3 3 IEEE802.11g Mode Item Specifica ation Mo odulationType OFDM Fre equencyrange 2412MHz~2462MHz Channel CH1 toCH H11 Datarate 6,9,12,18,2 24,36,48,54M Mbps TX Characterist ics Min Typical Max. Unit Tran nsmitter Output Power 19 11gT Target Power +20 ppm 6Mb bps -5 dB 9Mb bps -8 dB 12M Mbps -10 dB Freq quency Errorr -20 dBm Con nstellation Errror( peak EVM)@ targe et power 9w www.ibroadlink k.com 18M Mbps -13 dB 24M Mbps -16 dB 36M Mbps -19 dB 48M Mbp -22 dB 54M Mbps -25 dB @11 1MHz 20 dBr @20 0MHz -28 dBr @30 0MHz -40 dBr Max. Unit -90 -83 dBm -88 -80 dBm 12M Mbps -86 -79 dBm 18M Mbps -85 -76 dBm 24M Mbps -82 dBm 36M Mbps -79 dBm 48M Mbps -75 dBm 54M Mbps -72 dBm Tran nsmit spectrrum mask RX Characterist tics Min Typical Min nimum Inputt Level Sensitivity 6Mb bps 9Mb bps Maxximum Input Level (FER≦10%) -20 dBm 4.4 4 IEEE802.11n 20 0Mhz Ba andwidtth Mode Item Specifica ation ModulationType OFDM Frequencyra ange 2412MHz~2462MHz Channel CH1 toCH H11 Datarate MCS0/1/2 2/3/4/5/6/7 TX Characterist ics Min Typical Max. Unitt Tran nsmitter Output Power Freque ency Error dBm 19 11n HT20 Target Powe er -20 +20 ppm 10w www.ibroadlink k.com Con nstellation Errror( peak EVM)@ targe et power MCS0 -5 dB MCS1 -10 dB MCS2 -13 dB MCS3 -16 dB MCS4 -19 dB MCS5 -22 dB MCS6 -25 dB MCS7 -28 dB @1 11MHz 20 dBr @2 20MHz -28 dBr @3 30MHz -40 dBr Max. Unitt -89 -82 dBm -86 -79 dBm MCS2 -84 -77 dBm MCS3 -82 -74 dBm MCS4 -78 -70 dBm MCS5 -74 -66 dBm MCS6 -72 -65 dBm MCS7 -69 -64 dBm Tran nsmit spectrrum mask RX Characterist tics Min Typical Min nimum Inputt Level Sensitivity MCS0 MCS1 Ma aximum Input Level (FER≦ ≦10%) -20 dBm 11w www.ibroadlink k.com 4.5 5 IEEE802.11n 40 0Mhz Ba andwidtth Mode Item Specifica ation ModulationType OFDM Frequencyra ange 2422MHz~2452MHz Channel CH3 toCH H9 Datarate MCS0/1/2 2/3/4/5/6/7 TX Characterist ics Min Typical Max. Unitt Tran nsmitter Output Power dBm 19 11n HT20 Target Powe er +20 ppm MCS0 -5 dB MCS1 -10 dB MCS2 -13 dB MCS3 -16 dB MCS4 -19 dB MCS5 -22 dB MCS6 -25 dB MCS7 -28 dB @1 11MHz 20 dBr @2 20MHz -28 dBr @3 30MHz -40 dBr Max. Unitt -89 -82 dBm -86 -79 dBm MCS2 -84 -77 dBm MCS3 -82 -74 dBm MCS4 -78 -70 dBm MCS5 -74 -66 dBm Freque ency Error -20 Con nstellation Errror( peak EVM)@ targe et power Tran nsmit spectrrum mask RX Characterist tics Min Typical Min nimum Inputt Level Sensitivity MCS0 MCS1 12w www.ibroadlink k.com M MCS6 -72 -65 dBm MCS7 -69 -64 dBm Ma aximum Input Level (FER≦ ≦10%) -20 dBm 5. Mecha anical Charact teristiccs Figure2.WT1FBS 13w www.ibroadlink k.com Antenna Shielding Case WiFii Module Figure3.WTT1FBSview(M Metricunits) 6. Module Interrfaces 6.1 1 PIN Lay yout WT1 1FBS has one group of pins1X9. The e layout of PINs are show wn in the fig gure below. 14w www.ibroadlink k.com Figure6.WTT1FBSpin-outt 6.2 2 PIN De efinition ns PIN N Assignme ent PIN PIN NAM ME Pin1 VDD Pin2 GND Pin3 GPIO0 Pin4 GPIO1 Pin5 GPIO2 Pin6 GPIO3 Pin7 GPIO0 Pin8 UART_TX Pin9 UART_RX NOTE S Rest; Higgh Level On Soft O for transsparent transsfer Only 15w www.ibroadlink k.com 7. Refere ence De esign WiFi Mod dule User Equip pment 3.3v 3.3vv 3.3v For the devices using powe er source of 3.3V, the UA ARTs of host device and W WiFi module e can be connected directly as the picture ab bove to start communica ating. The WT1FBS uses power so ource of 3.3V V. It is recom mmended that the powe er supply current shou uld be morre than 300 0mA. The VD DD power supply is co onnected in n parallel wiith a filtering capacitor and rectiffication capa acitor to enssure voltage stability. It is recommen nded thatt the value of o C1 is not le ess than 100 0uF. 16w www.ibroadlink k.com 8. AntennaCharracteristics 8.1 1 Antenn na Selection The WT1FBS supports on-b board PCB printed anten nna.When th he Operating g Frequencyis betw ween 2.4G~2 2.5GH, S11 of o antenna port is less than-10dB an nd peak gainis about 2d dBi. Figure 7. Antenna radiation pattern simulation Figure 8. Antenna port S1 11simulation curve In practical use, WT1FB BS is welded on user’s boardand value of S11 ha as some changes. When choo ose the external antenna a, it needs to o move the resistance frrom the loca ation 17w www.ibroadlink k.com of L3 to R18, as shown in th he red rectan ngle of the picture below w. 8.2 2 Minimizing Ra adio Inte erference Whe en integratin ng the Wi-Fii module witth on board PCB printed d antenna, m make sure the thre ee points bellow: 1. The area un nder the antenna end of the mod dule should be keep cclear of metallic com mponents, co onnectors, vias, traces and other ma aterials that can interferre with the radio sign nal. 2. Th he area arou und the ante enna end the e module prrotrudes at le east 10mm ffrom the mo other board PCB and any metal enclosure. 3. When planning PCB layo out, it is reccommended d that user places the a antenna of Wi-Fi mod dule as close as possiblle to the edge of board der to ensurre the good performancce of ante enna, which is shown in the picture below. 18w www.ibroadlink k.com 8.3 3 Specifiication of o On-Bo oard Anttenna Op peratingFrequ uency 2.4G G~2.5GHz VSW WR(max) Pea ak Gain 2dBii AntennaType IFA 8.4 4 IPEX Connecto or 19w www.ibroadlink k.com 20w www.ibroadlink k.com Ap ppendix A ADC AES ANT AP BPS SK DBP PSK DC CCK CDM Analogg‐to ‐Digital Converter Advanced Encrypttion Standaard Antenn na Wireleess Access Point Binaryy Phase Shiftt Keying DHC CP Dynam mic Host Con nfiguration Protocol CMO OS DNS DQP PSK DSS SS DTIM EMS SP ESD EVM FCC FER GND GPIO HBM IEEE IO IOT IPv4 LED LVT TTL MAC MCS MCU MIM MO MSL NC NRS ST OFD DM OSC PCB PIFA QPS SK Compllementary Metal Oxide e Semicondu uctor Differe ential binary phase shift keying Direct Current Compllementary Code Keyingg Chargee Device Mo odel Determ mination of non-significa ance Differe ential quadra ature phase shift keying Deman nd assigned signaling an nd switching g subsystem Digital Transmissio on Interface Module Enhancced Modular Signal Proccessor Electro ostatic Discha arge Error Vector Magnitude Federa al Communiccations Com mmission Floating Error Ground Genera al Purpose In nput/Outputt Human n body model Institutte of Electriccal and Electtronics Engin neers Input/o output Individual operatio on test Interne et Protocol version Light-e emitting diod de Low Vo oltage Transistor Logic Medium m Access Co ontrol layer Modulation and co oding schem me Microccontroller Un nit Multiple-Input Multiple-Outpu ut Multila ayer Switchin ng Protocol Numerrical Control Negative Reset Orthog gonal Freque ency Division Multiplexing Oscilla ator Printed d Circuit Boa ard Planar inverted F antenna Quadra ature Phase Shift Keyin 21w www.ibroadlink k.com RC RF RISC RoH HS RX SDIO SoC SPD DT SPI STA TCP TKIP TX IP UAR RT UDP UFL Resista ance- capacitance Radio Frequency Reduce ed Instructio on Set Comp puter Restriction of Haza ardous Substances Receive er Serial Digital Inputt/Output System m on Chip Single--Pole Double e-Throw Serial Peripheral In nterface Spanniing Tree Algorithm Transfe er Control Prrotocol Tempo oral Key Integ grity Protoco ol Transm mitter Interne et Protocol Universsal Asynchro onous Receivver/Transmittter User Datagram Pro otocol a min niature coaxial RF connector fo or high-freq quency sig gnals manufa actured by Hirose Electric Group VSW WR WEP WEP PA WEP P64 WEP P128 WPA A2 XTA AL QAM 802 2.11 b/g/n Voltage e Standing Wave Ratio Wired Equivalent Privacy Welded d Electronic Packaging Association 64 bit Wired Equivalent Priva acy 128 bitt Wired Equivalent Privvacy Wi-Fi Protected Acccess 2 Externa al Crystal Osscillator Quadra ature Amplittude Modula ation The IEE EE 802.11 b//g/n 22w www.ibroadlink k.com Ap ppendix B [1] IEEE 802.11b/g/n- pu ublished IEE EE 802.11-2 2007wirelesss networking standard and pub blished IEEE 802.11-2012 standard for Informa ation technology - Cla ause 19 off the pub blishedIEEE 802.11-200 07 standard, and Clause 19 of the published IEEE 802.11-2012 sta andard. FC CC WARNING GS： Any Changes orr modification ns not expresssly approve ed by the partty responsible for compliance e the equipm ment.This de evice complie es with part 15 1 of coulld void the user’s authority to operate the FCC Rules. Operation iss subject to the t following two conditio ons: (1) Thiss device may y n ot his device must accept any interferre nce received, causse harmful interference,, and (2) th inclu uding interferrence that may m cause un ndesired operration. FCC C Radiation n Exposure e Statemen nt: 23w www.ibroadlink k.com Thiss equipment complies witth FCC radia ation exposurre limits set forth for an u uncontrolled enviironment. Th his equipmen nt should be installed and d operated with minimum distance 20cm betw ween the radiator& your body. This tra ansmitter mu ust not be co o-located or o operating in conjjunction with any other an ntenna or tra ansmitter. No ote: This equipment has b been tested and foun nd to comply with the limits for a Class B digital de evice, pursua ant to part 15 5 of the FCC Rule es. These lim mits are desig gned to proviide reasonab ble protection n against harrmful interference in a residential in nstallation. This equipme ent generates s uses and can c radiate ra adio frequenc cy enerrgy and, if no ot installed and used in accordance with w the instru uctions, mayy cause harm mful interrference to ra adio commun nications. Ho owever, there e is no guara antee that intterference will not occu ur in a particular installatiion. If this eq quipment doe es cause harrmful interferrence to radio o or televvision recepttion, which ca an be determ mined by turn ning the equiipment off an nd on, the us ser is enco ouraged to trry to correct the interference by one or o more of the following m measures: —Reorient or relocate the re eceiving ante enna. —In ncrease the separation be etween the equipment an nd receiver. —Connect the equipment intto an outlet on o a circuit different from that to which h the receive er is nected. conn —Consult the de ealer or an experienced radio/TV tech hnician for he elp. with FCC Pa art 15C, thiss module is listed as a Single Mod dular Transm mitter In accordance deviice.Therefore e, the final host productt must be su ubmitted to [HangZhou G Gubei Electro onics Tech hnology Co., Ltd.] for con nfirmation th hat the instaallation of the module in nto the host is in com mpliance with h the regulations of FCC C .Specifically, if an anttenna other than the model docu umented in the Filing is ussed, a Class 2 Permissive Change must be filed with the FCC. FCC C Label Instru uctions The outside of final productss that contain ns this modulle device mu ust display a label referring to the enclosed mod dule. This exxterior label can c use word ding such ass the follo owing: “Conta ains Transmiitter Module FCC ID: 2AC CDZ-WT1FB BS” or “Conta ains FCC ID: 2AC CDZ-WT1FBS S” Any simila ar wording th hat expresses the same meaning mayy be used. To satisfy FCC RF R Exposure e requiremen nts for mobile e and base sttation transm mission devices, a sepa aration dista ance of 20 cm c or more should be maintained between the e antenna off this deviice and perssons during operation. To T ensure compliance, operation at closer than n this dista ance is not re ecommended. The anten nna(s) used for f this transmitter must n not be co-loc cated or operating in conjunction w any other antenna orr transmitter. with 24w www.ibroadlink k.com Co ontact Us Han ngzhou Gu ubei Electronics Tecchnology Co., C Ltd. Roo om 106, Build ding 1, No. 611 6 Jianghong Road, Bin njiang, Hang gzhou, Zhejiang, P.R.Chin na T: +86-571-851 159281 71-86631817 F: +86-57 E: in ntl@broadlin nk.com.cn W: www.ibroadlink.co om.cn 25w www.ibroadlink k.com
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