Hangzhou Tuya Information Technology TYBT3 BLE Module User Manual TYBT2 EN V1x

Hangzhou Tuya Information Technology Co.,Ltd BLE Module TYBT2 EN V1x

User Manual

TYBT3 DATASHEET Tuya Smart BLE Module 1. Product OverviewTYBT3 is a Bluetooth (BLE) module designed by Hangzhou Tuya Information Technology Co., Ltd. The BLE Module consists of a highly integrated wireless Bluetooth chip TLSR8267 and some extra electric circuits that have been programed with Bluetooth network protocol and plenty of software examples.TYBT3 include a 32-bit CPU, BLE, 512K byte flash, 16k SRAM, and 9 multiplex IO pins. Figure 1 shows the block diagram of the TYBT3. Figure 1. The block diagram of the TYBT31.1 Features Integrated low power consumption 32-bit CPU, also known as application processorBasic frequency of the CPU can support 48 MHzSupply voltage range: 1.9V to 3.6VPeripherals: 5*PWM,1*I2C, 1*UARTBLE RF features:Compatible with BLE 4.2Transmitting data rate can go up to 1MbpsTX transmitting power: +6.06dBmRX receiving sensitivity: -92dBmAES hardware encryptionOn-board PCB antennaBLE IO interface 12M Crystal PCB on-board antenna BLEMCU FREQ 48MHz SRAM 16K Bytes FLASH 512K I2C 3.3V input PWM UART
TYBT3 DATASHEET Operating temperature range: -20℃ to 85℃1.2 Main Application Fields Intelligent LEDIntelligent household applicationsIntelligent low-power consumption sensors
TYBT3 DATASHEET 2. Dimensions and Footprint2.1Dimensions TYBT3 have double sides of pins. The distance between each Pin is 2.0mm. Size of TYBT3: 15mm(W)*16.5mm(L). Figure 2 shows the dimensions of TYBT3. Figure 2. The dimensions of TYBT3 2.2 Pin Definition Table 1 shows the general pin attributes of TYBT3 Table 1. The typical pin definition of TYBT3 PIN NO. NAME TYPE DESCRIPTION 1 SDA I/O I2C, data interface,internal pull-up 4.7k resistance 2 SCL I/O I2C, clock interface, internal pull-up 4.7k resistance 3 G I/O normal IO pin, can be used as PWM output pin, default for Green LED line 4 B I/O normal IO pin, can be used as PWM output pin, default for Blue LED line 5 WW I/O normal IO pin, can be used as PWM output pin, default for Warm White LED line 6 CW I/O normal IO pin, can be used as PWM output pin, default for Cold White LED line 7 R I/O normal IO pin, can be used as PWM output pin, default for Red LED line 8 3.3V P Supply voltage
TYBT3 DATASHEET 9 TX I/O UART TX,can be used as normal IO pin 10 RX I/O UART RX,can be used as normal IO pin 11 GND P Ground 12 SW I/O Bluetooth chipset burning pin 13 RST I reset pin for the module,internal pull-up 4.7k resistance 14 GND P Ground Note: P: Power supply pins; I/O: Digital input or output pins. SW pin is ONLY used for burning firmware, Can NOT be used for other functions. There are 4.7 pull-up resistance internally for I2C pins, external pull-up resistances are not necessary. When WW pin is outputting PWM signal, It has opposite phase comparing the PWM signal from R/G/B/CW pin. If there’s any customization needed for PWM output, please contact our BD manager.
TYBT3 DATASHEET 3. Electrical Characteristics3.1 Absolute Maximum Ratings Table 2. Absolute Maximum Ratings PARAMETERS DESCRIPTION MIN MAX UNIT Ts Storage temperature -20 85 ℃ VCC Supply voltage -0.3 3.9 V Electrostatic release quantity (Human body model) TAMB-25℃ - 2 KV Electrostatic release quantity (Machine model) TAMB-25℃ - 0.5 KV 3.2 Electrical Conditions Table 3. Electrical Conditions PARAMETERS DESCRIPTION MIN TYPICAL MAX UNIT Ta Temperature for Commercial grade -20 - 85 ℃ VCC Supply voltage VIL IO negative level inputVIH IO positive level inputVOL IO negative level outputVoH IO positive level output3.3Transmitting Current Consumptions Table 4. TX current consumption PARAMETERS MODE TYPICAL UNIT Itx Continuously transmitting, 0dBm power outputIrx Continuously receiving IDC Normal working mode 1.9 3.3 3.6 V -0.3 - VCC*0.3 VVCC*0.7 - VCC V VSS - 0.3 V VCC-0.3 - VCC V 15 mA 12 mA27 mA18 uAIdeepsleep Sleep mode
TYBT3 DATASHEET 4. Radio Specification4.1 Basic Radio Frequency Characteristics Table 5.Basic Radio frequency characteristics PARAMETERS DESCRIPTION Working Frequency 2.4GHz ISM band Radio standard BLE 4.2 Data transmitting rate Type of Antenna On-board PCB Antenna 4.2Transmitting Power Table 6. Transmitting power PARAMETERS MIN TYPICAL MAX UNIT RF Average output power consumption 5.46 5.70 dBm 4.3Receiving Sensitivity Table 7. Receiving sensitivity PARAMETERS MIN TYPICAL MAX UNIT RX sensitivity Frequency bias error Co-channel interference Restrain - - -7 - dB 1Mbps6.061Mbps -93 -92 -90 dBm 1Mbps -300 - +300 KHz
weld TYBT3 module and other electrical 5. Antenna Information5.1 Antenna Type e is5.2 Reduce Antenna Interferencestrt and the other metal pieces.Since PCBA manufacture usecomponents onto the PCB board, RF performance will depend on the layout location and pattof the On-board PCB antenna. The following figures are some recommended anddis-recommended demonstrations from out R&D team.In demonstration 1 and 2 of figure 3, the onframe. It’s recommended to use layout pattern shown inon-board PCB antenna lays outside of the PCB frame directly or PCB framearea for the antenna. The overall PCBAtesting the module independently.Restricted due to some reason, iframe, it’s suggested to refer to demonstration 3.copperor wire beneath the antenna.It’s NOT recommended to use demonstrathere are copper and wire beneath it. RF performance will haveDemonstration 1: Antenna lay outside thePCB frameTYBT3 DATASHEET Antenna Informationmnterference n order to have theIn order to have the best RF performance, it’s recommended to keep a minimum between the ante15mm distance between the antenna nna pa part and the other metal pieces. A manufacture use SMT process to weld TYBT3 module and other electricalcomponents onto the PCB board, RF performance will depend on the layout location and pattboard PCB antenna. The following figures are some recommended anddemonstrations from out R&D team. 1 and 2 of figure 3, the on-board PCB antenna lays outsideIt’s recommended to use layout pattern shown in demonstration 1 and 2. Either theoutside of the PCB frame directly or PCB frame caroverall PCBA performance for these two ways will be the same astesting the module independently. Restricted due to some reason, if the on-board PCB antenna layout has to be inside the PCBer to demonstration 3. The antenna lays inside the PCB frame,the antenna. RF performance will have some loss, approximately 1~2 dBm.It’s NOT recommended to use demonstration 4, the antenna lays inside the PCB frame, andthere are copper and wire beneath it. RF performance will have tionFigure 3.layout demostrations Demonstration 1: Antenna lay outside the PCB frame Demonstration 2: Antenna laythe PCB frame with carved areaAntenna for TYBT3 modulodule is using 2.4 GHz MIFA On-board PCB antenna. to keepcomponents onto the PCB board, RF performance will depend on the layout location and pattern board PCB antenna. The following figures are some recommended and outside of the PCB 1 and 2. Either the carve out a certain for these two ways will be the same as ut has to be inside the PCB enna lays inside the PCB frame, but no RF performance will have some loss, approximately 1~2 dBm. lays inside the PCB frame, and attesignificant attenuanuation. Demonstration 2: Antenna lay outside the PCB frame with carved area
Demonstration 3: Antenna lay inside the PCBframe without copper or wire beneath itTYBT3 DATASHEET Demonstration 3: Antenna lay inside the PCB without copper or wire beneath it Demonstration 4: Antenna lay inside the PCBframe with copper or wire beneath itDemonstration 4: Antenna lay inside the PCB frame with copper or wire beneath it
TYBT3 DATASHEET 6. Packaging Information And Production Guide6.1 Mechanical Dimensions Figure 4.Dimensions of the module 6.2 Production Guide The storage for the delivered module should meet the following condition:1. The anti-moisture bag should be kept in the environment with temperature< 30℃ andhumidity< 85% RH. 2. The expiration date is 6 months since the dry packaging products was sealed.Cautions:1. All the operators should wear electrostatic ringin the whole process of production.2. While operating, water and dirt should not have any contact with the modules.
FCC Statement: Any Changes or modifications not expressly approved by the party responsible for compliance could voidthe user’s authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:(1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment .This equipment should be installed and operated with minimum distance 20cm between the radiator& your body.FCC Label Instructions:The outside of final products that contains this module device must display a label referring to the enclosed module. This exterior label can use wording such as: “Contains Transmitter Module FCC ID: 2ANDL-TYBT3 ”,or “Contains FCC ID: 2ANDL-TYBT3 ”, Any similar wording that expresses the same meaning may be used.

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