Hansong DECT Wireless Module User Manual XCO DECT 1

Hansong(Nanjing) Technology Ltd. Wireless Module XCO DECT 1

XCO-DECT_User Manual_1

                 User manual  DECT  Module  User Manual          Abstract  This document provides user guide lines for the DECT Module reference design:  HW description, schematic and PCB details, testability.
                           HANSONG    Contents  Abstract ................................................................................................................................................ 1 Contents ............................................................................................................................................... 2 Figures .................................................................................................................................................. 2 Tables ................................................................................................................................................... 2 1 Terms and definitions ................................................................................................................... 3 2 References ..................................................................................................................................... 3 3 Introduction.................................................................................................................................... 4 4 General description, block diagram ............................................................................................ 5 5 Specifications ................................................................................................................................ 6 6 Schematics..................................................................................................................................... 7 7 Interface Pinning ........................................................................................................................... 8 8 Layout ........................................................................................................................................... 10 9 BoM ............................................................................................................................................... 11 10 PCB Stackup ................................................................................................................................ 12 11 Application PCB guidelines ....................................................................................................... 13  11.1 RF considerations ............................................................................................................... 13  11.2 Routing ................................................................................................................................ 13  11.3 Testability ............................................................................................................................ 14  11.4 Debug interface ................................................................................................................... 15  11.5 USB interface ...................................................................................................................... 16  11.6 Buttons and LEDs ............................................................................................................... 16 Revision history ................................................................................................................................. 17    Figures  Figure 1: Block diagram of DECT Module ............................................................................................. 5 Figure 2: DECT Module Schematics ..................................................................................................... 7  Figure 3: Layout plot of DECT Module ................................................................................................ 10 Figure 4: Debug connector .................................................................................................................. 15 Figure 5. USB interface ....................................................................................................................... 16 Figure 6. Buttons and LEDs on the application / host PCB ................................................................ 16   Tables  Table 1: Specifications table ................................................................................................................. 6 Table 2: Interface connector pinning ..................................................................................................... 8  Table 3: Bill of Materials List ............................................................................................................... 11 Table 4: PCB Layer Stackup ............................................................................................................... 12 Table 2: Pin out of connector , the debug interface of the DECT module........................................... 15        User manual Revision 1.0 12-13-2017        2 of 18 © 2017    Hansong
                           HANSONG     1 Terms and definitions    BoM  CODEC  GPIO  GND  HDI  I2C  I2S  JTAG  LED  Lx  PCB  RF  SMD  UART  USB     Bill of Materials  COder / DECoder  General Purpose Input / Output (pin)  Ground  High Density Interconnect  Inter-IC (serial communication interface)  Inter-IC sound; in the context of this document it is in relation to the  interface on the module that is the scope in this document  Joint Test Action Group (specification of debug interface)  Light Emitting Diode  Layer x  Printed Circuit Board  Radio Frequency  Surface Mount Device  Universal Asynchronous Receiver / Transmitter  Universal Serial Bus              digital audio   2  References  [1]  Dialog SmartBeat Wireless Audio brochure  [2]  SC14492_493, Datasheet: “Single Chip ZBS DECT Audio Transceiver with USB”, Dialog Semiconductor                               User manual Revision 1.0 12-13-2017        3 of 18 © 2017     Hansong
                           HANSONG     3  Introduction  This document aims to serve as a guide line in regard to the DECT Module and its use on application level.  The DECT Module is an example HW implementation of the SC14492 chip on a module, to support the development of wireless speaker systems. The air interface is based on the DECT standard, meaning that the system can coexist with regular DECT systems such as DECT phones.  The audio CODEC that is used for audio compression is CELT (sample rate: 48kHz).  The DECT Module is meant to serve as a reference design only. The design files can be made available upon request.                                                     User manual Revision 1.0 12-13-2017        4 of 18 © 2017     Hansong
                           HANSONG      4  General description, block diagram  The DECT Module is a reference design for a SC14492-based module/product. It is a self-contained unit, including the required supporting components such as crystal, FLASH, DC supply and RF circuitry.  The module enables a platform-based product development, in which the RF development is leveraged over multiple products. To further support this platform-based approach, the module is suited to run the Hansong firmware that is fully configurable and enables easy customization without requiring full SW development.  The module supports all required standard interfacing, such as I2S, I2C, USB and GPIO.  The following figure shows the basic module’s block diagram and its interfacing to the application PCB:      IPEX Connector   QSPI                                                                                        Flash                                         RX   RX/TX      Ant    Control  XTAL (20.736MHz)  balun   Switch      Switch                                                                                                                      TX       Sc14492                 balun                                                           DP/DM DC_IN and VBUS I2C I2S/PCM BXTAL UART JTAG GPIO LED 1V8 Reset                        MAIN MODULE   Board interconnect   Board interconnect    Add-on board      Figure 1: Block diagram of DECT Module          User manual Revision 1.0 12-13-2017        5 of 18 © 2017     Hansong
                           HANSONG      5 Specifications     Table 1: Specifications table          Parameter  Value Note       Module size  40.8mm x 36.5mm x 1.6mm Fully embedded module,      including RF, FLASH, crystal       Mating connector  R6850-36TR-SMT Or equivalent       Operating temperature range  0…+50C Ambient       Interfacing  I2S (input and output) FP = I2S Slave, PP = I2S     I2C Master          USB      JTAG      UART      GPIOs For LEDs and buttons            Antennas  2 printed PIFA Optional up to 2 external     Antenna diversity support antennas (U.FL Hirose / IPEX)            Antenna radiation pattern  Dipole, 2dBi       Operating frequency range 1880 - 1930MHz EU DECT, US DECT       Current consumption  160 / 95 mA FP / PP       Input power supply voltage  3.6V~5.0V ±150 mV       GPIO I/O levels  1.8 V        Type approval  ETSI/FCC Pre-test only. Full certification      will need to be performed by      the customer. Changes to the      reference design may invalidate      the pre-test results.l       Range  50 m indoor, 300 m outdoor                    User manual Revision 1.0 12-13-2017        6 of 18 © 2017     Hansong
                           HANSONG      6  Schematics
                           Figure 2: DECT Module Schematics  User manual Revision 1.0 12-13-2017            7 of 18 © 2017     Hansong FCC FrequencyCE Frequency
                           HANSONG     7 Interface Pinning   Table 2: Interface connector pinning          Connector pinning  Pin  Description  Pin Description       1  GND  19 GND       2  DC-PWR-IN  20 GPIO_P1.4       3  DC-PWR-IN  21 GPIO_P1.3       4  GND  22 GPIO_P1.5       5  GND  23 GND       6  1V8  24 I2C_SDA2       7  GND  25 I2C_SCL2       8  VBUS  26 GND       9  GND  27 UART_TX       10  USB_DM  28 UART_RX       11  USB_DP  29 GND       12  GND  30 JTAG       13  GND  31 GND       14  BXTAL  32 GPIO_P2.1(LED)       15  I2S_SDIN  33 GPIO_P2.0(LED)       16  I2S_LRCK  34 GND       17  I2S_SDOUT  35 RSTN       18  I2S_SCLK  36 GND        The interface connector pins are also available on test pins (see also section 11.3).  Next to the connector pinning described here above, the DECT Module also holds two RF connectors that can be used to connect one or two external antenna(s). These are standard U.FL Hirose (IPEX) connectors.  Note that using these will require changing some components on the PCB. Please contact Hansong support for further details.                       User manual Revision 1.0 12-13-2017        8 of 18 © 2017     Hansong
                           HANSONG           Name/  Description     Power  Power supply input pin of I2S module.               GND  Connect to application PCB GND plane    JTAG  JTAG debug pin of SC14492 (pin A10)    UART_TX  UART TX, P0[0] of SC14492, connect to application PCB     UART RX pin if UART support is required         UART_RX  UART RX, P0[1] of SC14492, connect to application PCB     UART TX pin if UART support is required         LED 1/2  Can be used to drive external LED 1/2    GPIO1/2/3  GPIO pin used to connect to external switch, LED or other     digital IO device           I2C_SDA  I2C interface serial data pin, P0[2] of SC14492; requires     external pull up resistor           I2C_SCL  I2C interface serial clock pin, P0[3] of SC14492; requires     external pull up resistor           I2S data in I2S interface data input of SC14492 on I2S module (connect     to external audio ADC/DAC I2S output)         I2S data out  I2S interface data output of SC14492 on I2S module     (connect to external audio ADC/DAC I2S input)         BCLK  I2S interface bit clock     LRCK  I2S interface left/right clock     USB _DM  USB interface data ”-”     USB_DP  USB interface data ”+”     RF ANT 1/2  RF antenna 1/2: printed antenna with optional U.FL/IPEX     connector for external antenna support         VBUS  USB supply voltage (input to module)    1V8 1V8 power supply output of I2S module that can be used to     supply e.g. external audio ADC/DAC           Optional I2S master clock output: note that this is a    BXTAL 10.368MHz signal. In case e.g. 12.288MHz is required, an      external PLL may be required.    Reset  Active low reset signal to reset SC14492 of I2S module    Note that the digital IO levels (except I2C) are 1.8V. Please also refer to the SC14492 datasheet [2] for further pinning details.                       User manual Revision 1.0 12-13-2017        9 of 18 © 2017     Hansong
                           HANSONG      8  Layout  Here below a layout plot is depicted of the DECT Module:                                              Figure 3: Layout plot of DECT Module                   User manual Revision 1.0 12-13-2017        10 of 18 © 2017     Hansong
                           HANSONG      9 BoM    Table 3: Bill of Materials List         ID Description Manufacturer Order number Count 1 MX25U8035EM1I-10G MXIC MX25U8035EM1I-10G 1 2 SC14492,ZBS DECT Transceiver with USB Dialog Semiconductor SC14492A76R101ULC 1 3 SKY13453-385LF SKYWORKS SKY13453-385LF 2 4 AP2112K-3.3TRG1 Diodes(BCD) MMBT4403M3T5G 1 5 MMBT4403M3T5G ON MMBT4403M3T5G 1 6 0Ω,0201,1/20W,±5%,RC0201JR-070RL YAGEO RC0201JR-070RL 1 7 0Ω,0201,1/20W,±5%,RC0201JR-070RL YAGEO RC0201JR-070RL pcb antenna:2 8 0Ω,0201,1/20W,±5%,RC0201JR-070RL YAGEO RC0201JR-070RL external antenna:2 9 0Ω,0402,1/16W,±5%,RC0402JR-070RL Yageo/Phicomp RC0402JR-070RL 1 10 10KΩ,0201,1/20W,±5%,RC0201JR-0710KL Yageo RC0201JR-0710KL 1 11 22R±5%,0201 YAGEO  2 12 2K7±5%,0201 YAGEO  1 13 33Ω,0201,1/20W,5%, RC0201JR-0733RL Yageo RC0201JR-0733RL 4 14 560R±5%,0201 YAGEO  1 15 56k 1% 0201 YAGEO  1 16 0.6p +/- 0.05 NP0,0201   2 17 1uK,16V,0402,X5R,C1005X5R1C105K TDK/Phicomp C1005X5R1C105K 2 18 100nF,10V,±10%,X5R,C0201KRX5R6BB104 TDK / YAGEO C0201KRX5R6BB104 7 19 10nK,10V,0201,X7R,C0603X7R1A103KT00NN Yageo/Phicomp C0603X7R1A103KT00NN 3 20 10pF 25V ±5% 0201NPO,GRM0335C1E100JD01D Murata GRM0335C1E100JD01D 12 21 10uK,10V,0603,X5R,CL10A106KP8NNNC Samsung CL10A106KP8NNNC 1 22 CAP,0201,C0G,1.0pF,+/-0.1pF,25V Murata  4 23 1.2pC,25V,0201,NPO,C0603C0G1E1R2C TDK/Yageo C0603C0G1E1R2C 1 24 1p5 ,+/-0.1pF NP0 25V Murata  5 25 22pF 50V  ±5% 0201 NPO, CC0201JRNPO9BN220 Murata CC0201JRNPO9BN220 7 26 CAP,0201,C0G,2.7pF,+/-0.25pF,25V MURATA  1 27 2.2uM,6.3V,0402,X5R Yageo  3 28 3p3 ,+/-0.1pF NP0 25V,0201 Murata  1 29 4.7pF,+/-0.1pF,25V,0201,NPO TDK/Yageo/和伸堂  2 30 Coil, chip 18nH Wirewound ±3%,LQW15AN18NH00x,0402 Murata LQW15AN18NH00x 2 31 Inductor Chip 1n2,±0.1nH,LQP03TN1N2B02,0201 Murata LQP03TN1N2B02 1 32 Inductor Chip 1n5'±0.1nH,LQP03TN1N5B02,0201 Murata LQP03TN1N5B02 1 33 HK0603 2N2S-T,2.2 ±0.3nH,LQP03TN2N2B02#,0201 TAIYO YUDEN LQP03TN2N2B02# 2 34 Inductor Chip 3n3,±0.1nH,LQP03TN3N3B02,0201 Murata LQP03TN3N3B02 1 35 Inductor Chip 3n9'±0.1nH,LQP03TN3N9B02#,0201 TDK LQP03TN3N9B02# 2 36 4.7nH ±0.3nH,LQP03TN4N7H02,0201 WE LQP03TN4N7H02 2 37 5n6 '±3%,LQP03TN5N6H02,0201 Murata LQP03TN5N6H02 2 38 KFM110Z-1002-7F FOXCONN  external antenna:2 39 36PIN,0.5mm, R6850-36TR-SMT 晋宇 R6850-36TR-SMT 1 40 SHIELDING  COVER FRAM-2   1 41 SHIELDING  COVER   1 42 TZ1284B,  20.736 MHz TAI-SAW Technology TZ1284B 1      User manual Revision 1.0 12-13-2017        11 of 18 © 2017     Hansong
                           HANSONG      10  PCB Stackup  Table 4: PCB Layer Stackup  Parameter Value Note    Board Definition PCB Rigid    Stack-up 1-2-1     SMD Single-sided     Via-type Through, microvia     Layer Definition Multilayer – 4L     Laminate FR-4     Board size 36.5mm x 40.0mm +/-0.2mm    Board thickness 1.6mm +/-10%    Surface finish Immersion Gold                                                        User manual Revision 1.0 12-13-2017        12 of 18 © 2017     Hansong
                           HANSONG      11  Application PCB guidelines  This section describes some guidelines in relation to the use of the DECT Module with the application (host) PCB.  11.1 RF considerations  To ensure optimum wireless performance of the DECT Module, special attention should be paid to the antenna selection and placement. In case the internal/embedded printed antennas are used, the module location would be best selected by focusing on the following:  ● Ensure that the antennas are uninhibited as much as possible (e.g. by placing the module at the corner of the application PCB  ● Ensure that no components , traces or ground/power planes are close to the module; they should preferably be spaced >>2cm away  ● The module location with respect to the product’s enclosure should be such that the antennas are not close to conductive parts (e.g. metallic paint, metal parts, wiring, …)  ○ Should this be insufficiently feasible, it can be considered to use external antennas instead, to have optimum design freedom with respect to the antenna placement for optimum performance  ● The antennas may radiate significant RF power. Care should be taken to ensure that e.g. an analog audio ADC/DAC is not affected by this (i.e. rectifying the RF energy inside the ADC/DAC and causing audible artefacts). This can be accomplished by any of the following:  ○ Ensure sufficient physical separation between the antennas  ○ Use a C-R-C filtering pi-network at the analog audio IO (e.g. R=33Ohm, C=10pF)  ● The module has a provision for an optional RF shield that can be used to minimize EMC/EMI in case this is required on the application level  11.2 Routing  High speed signals, such as the I2S bus (most notably the BLCK) and/or other digital/clock signals should be routed with great care, to ensure that their harmonics aren’t received by the module’s antennas, limiting its receiver sensitivity. To this effect, the following can be considered:  ● Use C-R-C filtering pi-networks on signal lines that are high speed  ● Route high speed signals on inner layers, while ensuring that they are sandwiched between power/GND planes for optimum shielding/isolation  Other general audio/RF design guidelines would apply, such as the use of a good (uninterrupted) system ground plane, sufficiently thick traces for the power supply routing, etc.  Also, to minimize current switching noise from the module to the application PCB, it may be advisable to use solid, wide frequency1 decoupling close to the connector.               1 E.g. at least a large valued capacitor, e.g. 100uF, to buffer the larger LF current peaks and 10pF to decouple the RF content.  User manual Revision 1.0 12-13-2017        13 of 18 © 2017     Hansong
                           HANSONG      11.3 Testability  BAT files can be made available that configure the module in specific test modes that can be used for production level testing.  The interface pins are also available on test pins, located on the bottom side of the PCB, suitable for a bed-of-nails (pogo-pins) test bed (pin-to-pin spacing >100 mil).                                                           User manual Revision 1.0 12-13-2017        14 of 18 © 2017     Hansong
                           HANSONG     11.4 Debug interface  On the application / host PCB, in order to support application programming debugging, there needs to be a provision for the debug connector. For connecting the Unity box the standard (white) connector has to be used.    Table 5: Pin out of connector , the debug interface of the DECT module  Pin Label Connect to Function 1 GND  GND 2 URX See picture, pin 4 UART 3 UTX See picture, pin 3 UART 4 JTAG See picture, pin 2 1wire  JTAG 5 1v8 See picture, pin 1, Power   including resistor               Figure 4: Debug connector                                     User manual Revision 1.0 12-13-2017        15 of 18 © 2017     Hansong
                           HANSONG     11.5 USB interface  Here below the USB interface to/from the DECT module is depicted.  Note that D1 should become part of the application / host PCB.          Figure 5. USB interface    11.6 Buttons and LEDs  Here below a possible implementation of buttons/LEDs is depicted for the application / host PCB:               Figure 6. Buttons and LEDs on the application / host PCB
Federal Communications Commission (FCC) Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentiallinstallation. This equipment generate, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment doescause harmful interference to radio or television reception, which can be determined by turning the equipmentoff and on, the user is encouraged to try to correct the interference by one of the following measures:   Reorient or relocate the receiving antenna.   Increase the separation between the equipment and receiver.   Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.   Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. RF exposure warning This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment must be installed and operated in accordance with provided instructions and the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter.
Industry Canada (IC) CAN ICES-3 (B)/NMB-3(B)  This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.    Cetappareilestconforme à la norme RSS d'Industrie Canada. Son fonctionnementestsujet aux deux conditions suivantes: (1) ledispositif ne doit pas produire de brouillagepréjudiciable, et (2) cedispositifdoit accepter tout brouillagereçu, y compris un brouillage susceptible de provoquer un fonctionnementindésirable.   IMPORTANT NOTE:  Radiation Exposure Statement: This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Déclarationd'exposition aux radiations: Cetéquipementestconforme aux limitesd'exposition aux rayonnements IC établies pour unenvironnement non contrôlé. Cetéquipementdoitêtreinstalléetutilisé avec un minimum de 20cm de distance entre la source de rayonnement et votre corps.
OEM Integration Instructions: This device is intended only for OEM integrators under the following conditions: The module can be used to installation in other host. The antenna must be installed such that 20 cm is maintained between the antenna and users, and the transmitter module may not be co-located with  any other transmit or  antenna. The module shall be only used with the integral antenna(s) that has been originally tested and certified with this module. As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirement with this module installed (for example,  digital device emission, PC peripheral requirements, etc.)  IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop configuration or co-location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these and circumstance, the OEM integrator will be responsible for re-evaluating. The end product (including the transmitter) and obtaining a separate FCC authorization. The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: XCO-DECT or Contains FCC ID: XCO-DECT”. Antenna Specification: Antenna Type Part No. Peak Antenna Gain Dipole Antenna N/A 2dBi Monopole Antenna 45-2-000272 2dBi PCB Antenna RC12WFI0283A1 2dBi
IMPORTANT NOTE: This DECT Module (IC: 7756A-DECT) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.  The Host Marketing Name(HMN) must be displayed (according to e-labelling requirements) or  indicated at any location on the exterior of the host product or product packaging or product literature,  which shall be available with the host product or online.  The host product shall be properly labelled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be  clearly visible at all times when installed in the host product; otherwise, the host product must be  labelled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains” or similar wording expressing the same meaning, as  follows: Contains IC: 7756A-DECT. Antenna Specification: Antenna Type Part No. Peak Antenna Gain Dipole Antenna N/A 2dBi Monopole Antenna 45-2-000272 2dBi PCB Antenna RC12WFI0283A1 2dBi                                        User manual Revision 1.0 12-13-2017        16 of 18 © 2017     Hansong
  Revision history  Revision Date Description    1.0 13-Dec-2017 Initial version.                                                                  User manual Revision 1.0 12-13-2017        17 of 18 © 2017     Hansong

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