Hansong DECT Wireless Module User Manual XCO DECT 1

Hansong(Nanjing) Technology Ltd. Wireless Module XCO DECT 1

XCO-DECT_User Manual_1

User manual DECT Module User Manual Abstract This document provides user guide lines for the DECT Module reference design: HW description, schematic and PCB details, testability.
HANSONG Contents Abstract ................................................................................................................................................ 1 Contents ............................................................................................................................................... 2 Figures .................................................................................................................................................. 2 Tables ................................................................................................................................................... 2 1 Terms and definitions ................................................................................................................... 3 2 References ..................................................................................................................................... 3 3 Introduction.................................................................................................................................... 4 4 General description, block diagram ............................................................................................ 5 5 Specifications ................................................................................................................................ 6 6 Schematics..................................................................................................................................... 7 7 Interface Pinning ........................................................................................................................... 8 8 Layout ........................................................................................................................................... 10 9 BoM ............................................................................................................................................... 11 10 PCB Stackup ................................................................................................................................ 12 11 Application PCB guidelines ....................................................................................................... 13 11.1 RF considerations ............................................................................................................... 13 11.2 Routing ................................................................................................................................ 13 11.3 Testability ............................................................................................................................ 14 11.4 Debug interface ................................................................................................................... 15 11.5 USB interface ...................................................................................................................... 16 11.6 Buttons and LEDs ............................................................................................................... 16 Revision history ................................................................................................................................. 17 Figures Figure 1: Block diagram of DECT Module ............................................................................................. 5 Figure 2: DECT Module Schematics ..................................................................................................... 7 Figure 3: Layout plot of DECT Module ................................................................................................ 10 Figure 4: Debug connector .................................................................................................................. 15 Figure 5. USB interface ....................................................................................................................... 16 Figure 6. Buttons and LEDs on the application / host PCB ................................................................ 16 Tables Table 1: Specifications table ................................................................................................................. 6 Table 2: Interface connector pinning ..................................................................................................... 8 Table 3: Bill of Materials List ............................................................................................................... 11 Table 4: PCB Layer Stackup ............................................................................................................... 12 Table 2: Pin out of connector , the debug interface of the DECT module........................................... 15 User manual Revision 1.0 12-13-2017 2 of 18 © 2017 Hansong
HANSONG 1 Terms and definitions BoM CODEC GPIO GND HDI I2C I2S JTAG LED Lx PCB RF SMD UART USB Bill of Materials COder / DECoder General Purpose Input / Output (pin) Ground High Density Interconnect Inter-IC (serial communication interface) Inter-IC sound; in the context of this document it is in relation to the interface on the module that is the scope in this document Joint Test Action Group (specification of debug interface) Light Emitting Diode Layer x Printed Circuit Board Radio Frequency Surface Mount Device Universal Asynchronous Receiver / Transmitter Universal Serial Bus digital audio 2 References [1] Dialog SmartBeat Wireless Audio brochure [2] SC14492_493, Datasheet: “Single Chip ZBS DECT Audio Transceiver with USB”, Dialog Semiconductor User manual Revision 1.0 12-13-2017 3 of 18 © 2017 Hansong
HANSONG 3 Introduction This document aims to serve as a guide line in regard to the DECT Module and its use on application level. The DECT Module is an example HW implementation of the SC14492 chip on a module, to support the development of wireless speaker systems. The air interface is based on the DECT standard, meaning that the system can coexist with regular DECT systems such as DECT phones. The audio CODEC that is used for audio compression is CELT (sample rate: 48kHz). The DECT Module is meant to serve as a reference design only. The design files can be made available upon request. User manual Revision 1.0 12-13-2017 4 of 18 © 2017 Hansong
HANSONG 4 General description, block diagram The DECT Module is a reference design for a SC14492-based module/product. It is a self-contained unit, including the required supporting components such as crystal, FLASH, DC supply and RF circuitry. The module enables a platform-based product development, in which the RF development is leveraged over multiple products. To further support this platform-based approach, the module is suited to run the Hansong firmware that is fully configurable and enables easy customization without requiring full SW development. The module supports all required standard interfacing, such as I2S, I2C, USB and GPIO. The following figure shows the basic module’s block diagram and its interfacing to the application PCB: IPEX Connector QSPI Flash RX RX/TX Ant Control XTAL (20.736MHz) balun Switch Switch TX Sc14492 balun DP/DM DC_IN and VBUS I2C I2S/PCM BXTAL UART JTAG GPIO LED 1V8 Reset MAIN MODULE Board interconnect Board interconnect Add-on board Figure 1: Block diagram of DECT Module User manual Revision 1.0 12-13-2017 5 of 18 © 2017 Hansong
HANSONG 5 Specifications Table 1: Specifications table Parameter Value Note Module size 40.8mm x 36.5mm x 1.6mm Fully embedded module, including RF, FLASH, crystal Mating connector R6850-36TR-SMT Or equivalent Operating temperature range 0…+50C Ambient Interfacing I2S (input and output) FP = I2S Slave, PP = I2S I2C Master USB JTAG UART GPIOs For LEDs and buttons Antennas 2 printed PIFA Optional up to 2 external Antenna diversity support antennas (U.FL Hirose / IPEX) Antenna radiation pattern Dipole, 2dBi Operating frequency range 1880 - 1930MHz EU DECT, US DECT Current consumption 160 / 95 mA FP / PP Input power supply voltage 3.6V~5.0V ±150 mV GPIO I/O levels 1.8 V Type approval ETSI/FCC Pre-test only. Full certification will need to be performed by the customer. Changes to the reference design may invalidate the pre-test results.l Range 50 m indoor, 300 m outdoor User manual Revision 1.0 12-13-2017 6 of 18 © 2017 Hansong
HANSONG 6 Schematics
Figure 2: DECT Module Schematics User manual Revision 1.0 12-13-2017 7 of 18 © 2017 Hansong FCC FrequencyCE Frequency
HANSONG 7 Interface Pinning Table 2: Interface connector pinning Connector pinning Pin Description Pin Description 1 GND 19 GND 2 DC-PWR-IN 20 GPIO_P1.4 3 DC-PWR-IN 21 GPIO_P1.3 4 GND 22 GPIO_P1.5 5 GND 23 GND 6 1V8 24 I2C_SDA2 7 GND 25 I2C_SCL2 8 VBUS 26 GND 9 GND 27 UART_TX 10 USB_DM 28 UART_RX 11 USB_DP 29 GND 12 GND 30 JTAG 13 GND 31 GND 14 BXTAL 32 GPIO_P2.1(LED) 15 I2S_SDIN 33 GPIO_P2.0(LED) 16 I2S_LRCK 34 GND 17 I2S_SDOUT 35 RSTN 18 I2S_SCLK 36 GND The interface connector pins are also available on test pins (see also section 11.3). Next to the connector pinning described here above, the DECT Module also holds two RF connectors that can be used to connect one or two external antenna(s). These are standard U.FL Hirose (IPEX) connectors. Note that using these will require changing some components on the PCB. Please contact Hansong support for further details. User manual Revision 1.0 12-13-2017 8 of 18 © 2017 Hansong
HANSONG Name/ Description Power Power supply input pin of I2S module. GND Connect to application PCB GND plane JTAG JTAG debug pin of SC14492 (pin A10) UART_TX UART TX, P0[0] of SC14492, connect to application PCB UART RX pin if UART support is required UART_RX UART RX, P0[1] of SC14492, connect to application PCB UART TX pin if UART support is required LED 1/2 Can be used to drive external LED 1/2 GPIO1/2/3 GPIO pin used to connect to external switch, LED or other digital IO device I2C_SDA I2C interface serial data pin, P0[2] of SC14492; requires external pull up resistor I2C_SCL I2C interface serial clock pin, P0[3] of SC14492; requires external pull up resistor I2S data in I2S interface data input of SC14492 on I2S module (connect to external audio ADC/DAC I2S output) I2S data out I2S interface data output of SC14492 on I2S module (connect to external audio ADC/DAC I2S input) BCLK I2S interface bit clock LRCK I2S interface left/right clock USB _DM USB interface data ”-” USB_DP USB interface data ”+” RF ANT 1/2 RF antenna 1/2: printed antenna with optional U.FL/IPEX connector for external antenna support VBUS USB supply voltage (input to module) 1V8 1V8 power supply output of I2S module that can be used to supply e.g. external audio ADC/DAC Optional I2S master clock output: note that this is a BXTAL 10.368MHz signal. In case e.g. 12.288MHz is required, an external PLL may be required. Reset Active low reset signal to reset SC14492 of I2S module Note that the digital IO levels (except I2C) are 1.8V. Please also refer to the SC14492 datasheet [2] for further pinning details. User manual Revision 1.0 12-13-2017 9 of 18 © 2017 Hansong
HANSONG 8 Layout Here below a layout plot is depicted of the DECT Module: Figure 3: Layout plot of DECT Module User manual Revision 1.0 12-13-2017 10 of 18 © 2017 Hansong
HANSONG 9 BoM Table 3: Bill of Materials List ID Description Manufacturer Order number Count 1 MX25U8035EM1I-10G MXIC MX25U8035EM1I-10G 1 2 SC14492,ZBS DECT Transceiver with USB Dialog Semiconductor SC14492A76R101ULC 1 3 SKY13453-385LF SKYWORKS SKY13453-385LF 2 4 AP2112K-3.3TRG1 Diodes(BCD) MMBT4403M3T5G 1 5 MMBT4403M3T5G ON MMBT4403M3T5G 1 6 0Ω,0201,1/20W,±5%,RC0201JR-070RL YAGEO RC0201JR-070RL 1 7 0Ω,0201,1/20W,±5%,RC0201JR-070RL YAGEO RC0201JR-070RL pcb antenna：2 8 0Ω,0201,1/20W,±5%,RC0201JR-070RL YAGEO RC0201JR-070RL external antenna：2 9 0Ω,0402,1/16W,±5%,RC0402JR-070RL Yageo/Phicomp RC0402JR-070RL 1 10 10KΩ,0201,1/20W,±5%,RC0201JR-0710KL Yageo RC0201JR-0710KL 1 11 22R±5%,0201 YAGEO 2 12 2K7±5%,0201 YAGEO 1 13 33Ω,0201,1/20W,5%, RC0201JR-0733RL Yageo RC0201JR-0733RL 4 14 560R±5%,0201 YAGEO 1 15 56k 1% 0201 YAGEO 1 16 0.6p +/- 0.05 NP0,0201 2 17 1uK,16V,0402,X5R,C1005X5R1C105K TDK/Phicomp C1005X5R1C105K 2 18 100nF,10V,±10%,X5R,C0201KRX5R6BB104 TDK / YAGEO C0201KRX5R6BB104 7 19 10nK,10V,0201,X7R,C0603X7R1A103KT00NN Yageo/Phicomp C0603X7R1A103KT00NN 3 20 10pF 25V ±5% 0201NPO,GRM0335C1E100JD01D Murata GRM0335C1E100JD01D 12 21 10uK,10V,0603,X5R,CL10A106KP8NNNC Samsung CL10A106KP8NNNC 1 22 CAP,0201,C0G,1.0pF,+/-0.1pF,25V Murata 4 23 1.2pC,25V,0201,NPO,C0603C0G1E1R2C TDK/Yageo C0603C0G1E1R2C 1 24 1p5 ,+/-0.1pF NP0 25V Murata 5 25 22pF 50V ±5% 0201 NPO, CC0201JRNPO9BN220 Murata CC0201JRNPO9BN220 7 26 CAP,0201,C0G,2.7pF,+/-0.25pF,25V MURATA 1 27 2.2uM,6.3V,0402,X5R Yageo 3 28 3p3 ,+/-0.1pF NP0 25V,0201 Murata 1 29 4.7pF,+/-0.1pF,25V,0201,NPO TDK/Yageo/和伸堂 2 30 Coil, chip 18nH Wirewound ±3%,LQW15AN18NH00x,0402 Murata LQW15AN18NH00x 2 31 Inductor Chip 1n2,±0.1nH,LQP03TN1N2B02,0201 Murata LQP03TN1N2B02 1 32 Inductor Chip 1n5'±0.1nH,LQP03TN1N5B02,0201 Murata LQP03TN1N5B02 1 33 HK0603 2N2S-T,2.2 ±0.3nH,LQP03TN2N2B02#,0201 TAIYO YUDEN LQP03TN2N2B02# 2 34 Inductor Chip 3n3,±0.1nH,LQP03TN3N3B02,0201 Murata LQP03TN3N3B02 1 35 Inductor Chip 3n9'±0.1nH,LQP03TN3N9B02#,0201 TDK LQP03TN3N9B02# 2 36 4.7nH ±0.3nH,LQP03TN4N7H02,0201 WE LQP03TN4N7H02 2 37 5n6 '±3%,LQP03TN5N6H02,0201 Murata LQP03TN5N6H02 2 38 KFM110Z-1002-7F FOXCONN external antenna：2 39 36PIN,0.5mm, R6850-36TR-SMT 晋宇 R6850-36TR-SMT 1 40 SHIELDING COVER FRAM-2 1 41 SHIELDING COVER 1 42 TZ1284B, 20.736 MHz TAI-SAW Technology TZ1284B 1 User manual Revision 1.0 12-13-2017 11 of 18 © 2017 Hansong
HANSONG 10 PCB Stackup Table 4: PCB Layer Stackup Parameter Value Note Board Definition PCB Rigid Stack-up 1-2-1 SMD Single-sided Via-type Through, microvia Layer Definition Multilayer – 4L Laminate FR-4 Board size 36.5mm x 40.0mm +/-0.2mm Board thickness 1.6mm +/-10% Surface finish Immersion Gold User manual Revision 1.0 12-13-2017 12 of 18 © 2017 Hansong
HANSONG 11 Application PCB guidelines This section describes some guidelines in relation to the use of the DECT Module with the application (host) PCB. 11.1 RF considerations To ensure optimum wireless performance of the DECT Module, special attention should be paid to the antenna selection and placement. In case the internal/embedded printed antennas are used, the module location would be best selected by focusing on the following: ● Ensure that the antennas are uninhibited as much as possible (e.g. by placing the module at the corner of the application PCB ● Ensure that no components , traces or ground/power planes are close to the module; they should preferably be spaced >>2cm away ● The module location with respect to the product’s enclosure should be such that the antennas are not close to conductive parts (e.g. metallic paint, metal parts, wiring, …) ○ Should this be insufficiently feasible, it can be considered to use external antennas instead, to have optimum design freedom with respect to the antenna placement for optimum performance ● The antennas may radiate significant RF power. Care should be taken to ensure that e.g. an analog audio ADC/DAC is not affected by this (i.e. rectifying the RF energy inside the ADC/DAC and causing audible artefacts). This can be accomplished by any of the following: ○ Ensure sufficient physical separation between the antennas ○ Use a C-R-C filtering pi-network at the analog audio IO (e.g. R=33Ohm, C=10pF) ● The module has a provision for an optional RF shield that can be used to minimize EMC/EMI in case this is required on the application level 11.2 Routing High speed signals, such as the I2S bus (most notably the BLCK) and/or other digital/clock signals should be routed with great care, to ensure that their harmonics aren’t received by the module’s antennas, limiting its receiver sensitivity. To this effect, the following can be considered: ● Use C-R-C filtering pi-networks on signal lines that are high speed ● Route high speed signals on inner layers, while ensuring that they are sandwiched between power/GND planes for optimum shielding/isolation Other general audio/RF design guidelines would apply, such as the use of a good (uninterrupted) system ground plane, sufficiently thick traces for the power supply routing, etc. Also, to minimize current switching noise from the module to the application PCB, it may be advisable to use solid, wide frequency1 decoupling close to the connector. 1 E.g. at least a large valued capacitor, e.g. 100uF, to buffer the larger LF current peaks and 10pF to decouple the RF content. User manual Revision 1.0 12-13-2017 13 of 18 © 2017 Hansong
HANSONG 11.3 Testability BAT files can be made available that configure the module in specific test modes that can be used for production level testing. The interface pins are also available on test pins, located on the bottom side of the PCB, suitable for a bed-of-nails (pogo-pins) test bed (pin-to-pin spacing >100 mil). User manual Revision 1.0 12-13-2017 14 of 18 © 2017 Hansong
HANSONG 11.4 Debug interface On the application / host PCB, in order to support application programming debugging, there needs to be a provision for the debug connector. For connecting the Unity box the standard (white) connector has to be used. Table 5: Pin out of connector , the debug interface of the DECT module Pin Label Connect to Function 1 GND GND 2 URX See picture, pin 4 UART 3 UTX See picture, pin 3 UART 4 JTAG See picture, pin 2 1wire JTAG 5 1v8 See picture, pin 1, Power including resistor Figure 4: Debug connector User manual Revision 1.0 12-13-2017 15 of 18 © 2017 Hansong
HANSONG 11.5 USB interface Here below the USB interface to/from the DECT module is depicted. Note that D1 should become part of the application / host PCB. Figure 5. USB interface 11.6 Buttons and LEDs Here below a possible implementation of buttons/LEDs is depicted for the application / host PCB: Figure 6. Buttons and LEDs on the application / host PCB
Federal Communications Commission (FCC) Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentiallinstallation. This equipment generate, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment doescause harmful interference to radio or television reception, which can be determined by turning the equipmentoff and on, the user is encouraged to try to correct the interference by one of the following measures:  Reorient or relocate the receiving antenna.  Increase the separation between the equipment and receiver.  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. RF exposure warning This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment must be installed and operated in accordance with provided instructions and the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter.
Industry Canada (IC) CAN ICES-3 (B)/NMB-3(B) This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Cetappareilestconforme à la norme RSS d'Industrie Canada. Son fonctionnementestsujet aux deux conditions suivantes: (1) ledispositif ne doit pas produire de brouillagepréjudiciable, et (2) cedispositifdoit accepter tout brouillagereçu, y compris un brouillage susceptible de provoquer un fonctionnementindésirable. IMPORTANT NOTE: Radiation Exposure Statement: This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Déclarationd'exposition aux radiations: Cetéquipementestconforme aux limitesd'exposition aux rayonnements IC établies pour unenvironnement non contrôlé. Cetéquipementdoitêtreinstalléetutilisé avec un minimum de 20cm de distance entre la source de rayonnement et votre corps.
OEM Integration Instructions： This device is intended only for OEM integrators under the following conditions： The module can be used to installation in other host. The antenna must be installed such that 20 cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmit or antenna. The module shall be only used with the integral antenna(s) that has been originally tested and certified with this module. As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirement with this module installed (for example, digital device emission, PC peripheral requirements, etc.) IMPORTANT NOTE： In the event that these conditions cannot be met (for example certain laptop configuration or co-location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these and circumstance, the OEM integrator will be responsible for re-evaluating. The end product (including the transmitter) and obtaining a separate FCC authorization. The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: XCO-DECT or Contains FCC ID: XCO-DECT”. Antenna Specification: Antenna Type Part No. Peak Antenna Gain Dipole Antenna N/A 2dBi Monopole Antenna 45-2-000272 2dBi PCB Antenna RC12WFI0283A1 2dBi
IMPORTANT NOTE： This DECT Module (IC: 7756A-DECT) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. The Host Marketing Name(HMN) must be displayed (according to e-labelling requirements) or indicated at any location on the exterior of the host product or product packaging or product literature, which shall be available with the host product or online. The host product shall be properly labelled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labelled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows: Contains IC: 7756A-DECT. Antenna Specification: Antenna Type Part No. Peak Antenna Gain Dipole Antenna N/A 2dBi Monopole Antenna 45-2-000272 2dBi PCB Antenna RC12WFI0283A1 2dBi User manual Revision 1.0 12-13-2017 16 of 18 © 2017 Hansong
Revision history Revision Date Description 1.0 13-Dec-2017 Initial version. User manual Revision 1.0 12-13-2017 17 of 18 © 2017 Hansong

Navigation menu