High Flying Electronics Technology HF-LPB125 HF-LPB125 User Manual

High-Flying Electronics Technology Co., Ltd. HF-LPB125 Users Manual

User Manual

HF-LPB125 Low Power Wi-Fi Module User ManualShanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -1-HF-LPB125Low Power Wi-Fi Module User ManualV1.0Overview of CharacteristicSupport IEEE802.11b/g/n Wireless StandardsBased on Self-developed High Cost SOCUltra-Low-Power for Battery Applications with Excellent Power Save SchemeSupport UART/GPIO Data Communication InterfaceSupport Work As STA/APModeSupport Smart Link Function (APP program provide)Support Wireless and Remote Firmware Upgrade FunctionSupport Internal Antenna OptionSingle +5V Power Supply, +5V UART Voltage.Smallest Size: 41.3mm x 24.1mm x 6mm, 2x4 Pin 2.54mm pin header or 4 Pin 2.5mmHeaderFCC/CE Certificated
HF-LPB125 Low Power Wi-Fi Module User ManualShanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -2-TABLE OF CONTENTSLIST OF FIGURES.................................................................................................................................................3LIST OF TABLES.................................................................................................................................................. 4HISTORY................................................................................................................................................................. 51. PRODUCT OVERVIEW............................................................................................................................ 61.1. General Description.............................................................................................................................61.1.1 Device Features..............................................................................................................................61.1.2 Device Paremeters.........................................................................................................................71.1.3 Key Application...............................................................................................................................71.2. Hardware Introduction........................................................................................................................ 81.2.1. Pins Definition................................................................................................................................. 81.2.2. Electrical Characteristics............................................................................................................... 91.2.3. Mechanical Size........................................................................................................................... 101.2.4. Order Information......................................................................................................................... 111.3. Typical Application............................................................................................................................112. PACKAGE INFORMATION.................................................................................................................. 122.1. Recommended Reflow Profile........................................................................................................ 122.2. Device Handling Instruction (Module IC SMT Preparation)....................................................122.3. Shipping Information(TBD)............................................................................................................. 13APPENDIX E: CONTACT INFORMATION............................................................................................... 16
HF-LPB125 Low Power Wi-Fi Module User ManualShanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -3-LIST OF FIGURESFigure 1. HF-LPB125 Pins Map........................................................................................................................ 8Figure 2. HF-LPB125 Mechanical Dimension.............................................................................................. 10Figure 3. HF-LPB125 Order Information....................................................................................................... 11Figure 4. Reflow Soldering Profile..................................................................................................................12Figure 5. Shipping Information........................................................................................................................13
HF-LPB125 Low Power Wi-Fi Module User ManualShanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -4-LIST OF TABLESTable 1 HF-LPB125 Module Technical Specifications.................................................................................7Table 2 HF-LPB125 Pins Definition................................................................................................................ 8Table 11 Reflow Soldering Parameter............................................................................................................12
HF-LPB125 Low Power Wi-Fi Module User ManualShanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -5-HISTORYEd. V1.0 03-02-2016 First Version.
HF-LPB125 Low Power Wi-Fi Module User ManualShanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -6-1. PRODUCT OVERVIEW1.1. General DescriptionThe HF-LPB125 is a fully self-contained small form-factor, single stream, 802.11b/g/n Wi-Fi module,which provide a wireless interface to any equipment with a Serial/SPI interface for data transfer.HF-LPB125 integrate MAC, baseband processor, RF transceiver with power amplifier in hardware and allWi-Fi protocol and configuration functionality and networking stack, in embedded firmware to make afully self-contained 802.11b/g/n Wi-Fi solution for a variety of applications.The HF-LPB125 employs the world's lowest power consumption embedded architecture. It has beenoptimized for all kinds of client applications in the home automation, smart grid, handheld device,personal medical application and industrial control that have lower data rates, and transmit or receivedata on an infrequent basis.The HF-LPB125 integrates all Wi-Fi functionality into a low-profile, 41.3mm x 24.1mm x 6mm SMTmodule package that can be easily mounted on main PCB with application specific circuits. Also,module provides built-in antenna option.1.1.1 Device FeaturesSingle stream Wi-Fi @ 2.4 GHz with support for WEP security mode as well as WPA/WPA2Based on Self-developed High Cost Performance MCUUltra-low-power operation with all kinds of power-save modes.Includes all the protocol and configuration functions for Wi-Fi connectivity.Support STA/AP ModeSupport Smart Link FunctionSupport Wireless and Remote Firmware Upgrade FunctionIntegrated PCB antenna or I-PEX antenna connector options.Compact surface mount module 41.3mm x 24.1mm x 6mm.Full IPv4 stack.Low power RTOS and drivers.CE/FCC Certified.RoHS compliant.Single supply – 5V operation.
HF-LPB125 Low Power Wi-Fi Module User ManualShanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -7-1.1.2 Device ParemetersTable 1 HF-LPB125 Module Technical SpecificationsClass Item ParametersWirelessParametersCertification FCC/CEWireless standard 802.11 b/g/nFrequency range 2.412GHz-2.462GHzTransmit Power802.11b: +16 +/-2dBm (@11Mbps)802.11g: +14 +/-2dBm (@54Mbps)802.11n: +13 +/-2dBm (@HT20, MCS7)Receiver Sensitivity802.11b: -93 dBm (@11Mbps ,CCK)802.11g: -85 dBm (@54Mbps, OFDM)802.11n: -82 dBm (@HT20, MCS7)Antenna Option Internal:On-board PCB antennaHardwareParametersData Interface UARTGPIOOperating Voltage 4.75~6VOperating CurrentPeak [Continuous TX]: ~300mANormal [WiFi ON/OFF, DTIM=100ms]:Average. ~12mA, Peak: 300mAOperating Temp. -20℃-85℃Storage Temp. -40℃- 125℃Dimensions and Size 41.3mm x 24.1mm x 6mmExternal Interface 2x4 pin 2.54mm PIN or 4pin 2.5mmheaderSoftwareParametersNetwork Type STA /APSecurity Mechanisms WEP/WPA-PSK/WPA2-PSKEncryption WEP64/WEP128/TKIP/AESUpdate Firmware Local Wireless, RemoteCustomization Support SDK for application developNetwork Protocol IPv4, TCP/UDP/HTTPUser Configuration AT+instruction set. Android/ iOSSmart Link APP tools1.1.3 KeyApplicationRemote equipment monitoringAsset tracking and telemetrySecurityIndustrial sensors and controlsHome automationMedical devices
HF-LPB125 Low Power Wi-Fi Module User ManualShanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -8-1.2. Hardware Introduction1.2.1. Pins DefinitionFigure 1. HF-LPB125 Pins MapTable 2 HF-LPB125 Pins DefinitionPin Describtion Net Name SignalTypeComments1 +5V Power DVDD Power 5V@250mA2Ground GNDPower3 UART0 UART0_RX I,PU 5V, GPIO19. No connect if notuse.4 UART0 UART0_TX O,PU 5V, GPIO20. No connect if notuse.5 Multi-Function nReload I,PU 3.3V, GPIO2. Detailedfunctions see <Notes>6 Module Reset EXT_RESETn I,PU 3.3V, “Low” effective reset input.7 GPIO GPIO5 I/O 3.3V I/O, UART1_TXD debugoutputNo connect if not use.8 GPIO GPIO6 I/O 3.3V I/O, UART1_RXD debuginputNo connect if not use.
HF-LPB125 Low Power Wi-Fi Module User ManualShanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -9-<Notes>Module Pin4 must be high when bootup.nReload Pin (Button) function：1. When this pin is set to “low” during module boot up, the module will enter wirelessfirmware and config upgrade mode. This mode is used for customer manufacture.(See Appendix D to download software tools for customer batch configuration andupgrade firmware during mass production)2. After module is powered up, short press this button ( “Low” < = 2s ) to make themodule go into “Smart Link “ config mode, waiting for APP to set password andother information. (See Appendix D to download SmartLink APP)3. After module is powered up, long press this button ( “Low” >= 4s ) to make themodule recover to factory setting.High-Flying strongly suggest customer fan out this pin to connector or button for“Manufacture” and “ Smart Link” application.1.2.2. Electrical CharacteristicsAbsolute Maximum Ratings:Parameter Condition Min. Typ.Max. UnitStorage temperature range -40 125 °CMaximum soldering temperature IPC/JEDEC J-STD-020 260 °CSupply voltage 4.75 6 VVoltage on any I/O pin 0 5/3.3 VESD (Human Body Model HBM) TAMB=25°C 2.5 KVESD (MM) TAMB=25°C 0.25 KVPower Supply & Power Consumption:Parameter Condition Min. Typ.Max. UnitOperating Supply voltage 4.75 5 6 VSupply current, peak Continuous Tx 280 mASupply current, IEEE PS DTIM=100ms 20 mA
HF-LPB125 Low Power Wi-Fi Module User ManualShanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -10 -1.2.3.Mechanical SizeHF-LPB125 modules physical size （Unit: mm）as follows:Figure 2. HF-LPB125 Mechanical Dimension
HF-LPB125 Low Power Wi-Fi Module User ManualShanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -11 -1.2.4.Order InformationBase on customer detailed requirement, HF-LPB125 series modules provide different variants andphysical type for detailed application.Figure 3. HF-LPB125 Order Information1.3. Typical ApplicationRefer to HF-LPB120 user manual for detailed application and module usage.
HF-LPB125 Low Power Wi-Fi Module User ManualShanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -12 -2. PACKAGE INFORMATION2.1. Recommended Reflow ProfileFigure 4. Reflow Soldering ProfileTable 11 Reflow Soldering ParameterNote: 1. Recommend to supply N2 for reflow oven.2. N2 atmosphere during reflow (O2<300ppm)2.2. Device Handling Instruction (Module IC SMT Preparation)1. Shelf life in sealed bag: 12 months, at <30℃and <60% relative humidity (RH)2. After bag is opened, devices that will be re-baked required after last baked with window time168 hours.3. Recommend to oven bake with N2 supplied4. Recommend end to reflow oven with N2 supplied5. Baked required with 24 hours at 125+-5℃before rework process for two modules, one isnew module and two is board with module6. Recommend to store at ≦10% RH with vacuum packing7. If SMT process needs twice reflow:(1) Top side SMT and reflow 　　(2) Bottom side SMT and reflowCase 1: Wifi module mounted on top side. Need to bake when bottom side processover168hours window time, no need to bake within 168 hoursCase 2: Wifi module mounted on bottom side, follow normal bake rule before processNote: Window time means from last bake end to next reflow start that has 168 hours space.NO. Item Temperature (Degree) Time(Sec)1 Reflow Time Time of above 220 35~55 sec2 Peak-Temp 260 max
HF-LPB125 Low Power Wi-Fi Module User ManualShanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -13 -2.3. Shipping Information(TBD)TAPE BOXSize: 340*340*70 mm Size: 340*340*350 mm (inside)Figure 5. Shipping InformationNote:1tape=500pcs1 box = 5 tapes = 5 * 500 pcs = 2500pcsFCC STATEMENT:This device complies with Part 15 of the FCC Rules. Operation is subject to the following twoconditions:(1) This device may not cause harmful interference, and(2) This device must accept any interference received, including interference that may causeundesired operation.Warning: Changes or modifications not expressly approved by the party responsible for compliancecould void the user's authority to operate the equipment.NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device,pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protectionagainst harmful interference in a residential installation.This equipment generates uses and can radiate radio frequency energy and, if not installed and usedin accordance with the instructions, may cause harmful interference to radio communications.However, there is no guarantee that interference will not occur in a particular installation. If thisequipment does cause harmful interference to radio or television reception, which can be determined
HF-LPB125 Low Power Wi-Fi Module User ManualShanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -14 -by turning the equipment off and on, the user is encouraged to try to correct the interference by one ormore of the following measures:Reorient or relocate the receiving antenna.Increase the separation between the equipment and receiver.Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.Consult the dealer or an experienced radio/TV technician for help.FCC Radiation Exposure Statement:This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.This equipment should be installed and operated with minimum distance 20cm between the radiator &your body.FCC INFORMATION (additional)OEM INTEGRATION INSTRUCTIONS:This device is intended only for OEM integrators under the following conditions: The module mustbe installed in the host equipment such that 20 cm is maintained between the antenna and users,and the transmitter module may not be co-located with any other transmitter or antenna. Themodule shall be only used with the internal antenna(s) that has been originally tested andcertified with this module. As long as 3 conditions above are met, further transmitter test will notbe required. However, the OEM integrator is still responsible for testing their end-product for anyadditional compliance requirements required with this module installed (for example, digitaldevice emissions, PC peripheral requirements, etc.).Validity of using the module certification:In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization for this module in combination withthe host equipment is no longer considered valid and the FCC ID of the module cannot be usedon the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
HF-LPB125 Low Power Wi-Fi Module User ManualShanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -15 -End product labeling:Information that must be placed in the end user manual:The OEM integrator has to be aware not to provide information to the end user regarding how toinstall or remove this RF module in the user's manual of the end product which integrates thismodule. The end user manual shall include all required regulatory information/warning as show inthis manual.Antenna Specification:Type: PCB AntennaModel: HF-LPB125Brand: High-FlyingGain: 3dBiThe final end product must be labeled in a visible area with the following: “Contains FCC ID: 2ACSVHF-LPB125”.
HF-LPB125 Low Power Wi-Fi Module User ManualShanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -16 -APPENDIX E: CONTACT INFORMATION------------------------------------------------------------------------------------------------------------Address: Room 1002,Building 1,No.3000,Longdong Avenue,Pudong NewArea,Shanghai,China,201203Web: www.hi-flying.comService Online: 400-189-3108/18616078755Sales Contact: sales@hi-flying.com-----------------------------------------------------------------------------------------------------------For more information about High-Flying modules, applications, and solutions, please visit our web sitehttp://www.hi-flying.com/en/<END OF DOCUMENT>© Copyright High-Flying, May, 2011The information disclosed herein is proprietary to High-Flying and is not to be used by or disclosed tounauthorized persons without the written consent of High-Flying. The recipient of this document shall respect thesecurity status of the information.The master of this document is stored on an electronic database and is “write-protected” and may be altered onlyby authorized persons at High-Flying. Viewing of the master document electronically on electronic databaseensures access to the current issue. Any other copies must be regarded as uncontrolled copies.

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