High Flying Electronics Technology HF-LPB125 HF-LPB125 User Manual
High-Flying Electronics Technology Co., Ltd. HF-LPB125 Users Manual
User Manual
| Download: |  |
| Mirror Download [FCC.gov] | |
| Document ID | 3201000 |
| Application ID | AB0Ysww/Rh6LiPYHTGge1Q== |
| Document Description | User Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 58.09kB (726112 bits) |
| Date Submitted | 2016-11-21 00:00:00 |
| Date Available | 2016-11-21 00:00:00 |
| Creation Date | 2016-09-26 11:41:59 |
| Producing Software | Acrobat Distiller 9.3.3 (Windows) |
| Document Lastmod | 2016-11-17 16:53:29 |
| Document Title | Users Manual |
| Document Creator | PScript5.dll Version 5.2.2 |
| Document Author: | anbotek |
HF-LPB125 Low Power Wi-Fi Module User Manual HF-LPB125 Low Power Wi-Fi Module User Manual V 1.0 Overview of Characteristic Support IEEE802.11b/g/n Wireless Standards Based on Self-developed High Cost SOC Ultra-Low-Power for Battery Applications with Excellent Power Save Scheme Support UART/GPIO Data Communication Interface Support Work As STA/APMode Support Smart Link Function (APP program provide) Support Wireless and Remote Firmware Upgrade Function Support Internal Antenna Option Single +5V Power Supply, +5V UART Voltage. Smallest Size: 41.3mm x 24.1mm x 6mm, 2x4 Pin 2.54mm pin header or 4 Pin 2.5mm Header FCC/CE Certificated Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 1- HF-LPB125 Low Power Wi-Fi Module User Manual TABLE OF CONTENTS LIST OF FIGURES.................................................................................................................................................3 LIST OF TABLES.................................................................................................................................................. 4 HISTORY................................................................................................................................................................. 5 1. PRODUCT OVERVIEW............................................................................................................................ 6 1.1. 1.1.1 Device Features..............................................................................................................................6 1.1.2 Device Paremeters.........................................................................................................................7 1.1.3 Key Application............................................................................................................................... 7 1.2. Hardware Introduction........................................................................................................................ 8 1.2.1. Pins Definition................................................................................................................................. 8 1.2.2. Electrical Characteristics............................................................................................................... 9 1.2.3. 1.2.4. Mechanical Size........................................................................................................................... 10 Order Information......................................................................................................................... 11 1.3. 2. General Description.............................................................................................................................6 Typical Application............................................................................................................................11 PACKAGE INFORMATION.................................................................................................................. 12 2.1. Recommended Reflow Profile........................................................................................................ 12 2.2. Device Handling Instruction (Module IC SMT Preparation)....................................................12 2.3. Shipping Information(TBD)............................................................................................................. 13 APPENDIX E: CONTACT INFORMATION............................................................................................... 16 Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 2- HF-LPB125 Low Power Wi-Fi Module User Manual LIST OF FIGURES Figure 1. HF-LPB125 Pins Map........................................................................................................................ 8 Figure 2. HF-LPB125 Mechanical Dimension.............................................................................................. 10 Figure 3. HF-LPB125 Order Information....................................................................................................... 11 Figure 4. Reflow Soldering Profile..................................................................................................................12 Figure 5. Shipping Information........................................................................................................................13 Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 3- HF-LPB125 Low Power Wi-Fi Module User Manual LIST OF TABLES Table 1 HF-LPB125 Module Technical Specifications.................................................................................7 Table 2 HF-LPB125 Pins Definition................................................................................................................ 8 Table 11 Reflow Soldering Parameter............................................................................................................12 Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 4- HF-LPB125 Low Power Wi-Fi Module User Manual HISTORY Ed. V1.0 03-02-2016 First Version. Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 5- HF-LPB125 Low Power Wi-Fi Module User Manual 1. PRODUCT OVERVIEW 1.1. General Description The HF-LPB125 is a fully self-contained small form-factor, single stream, 802.11b/g/n Wi-Fi module, which provide a wireless interface to any equipment with a Serial/SPI interface for data transfer.HFLPB125 integrate MAC, baseband processor, RF transceiver with power amplifier in hardware and all Wi-Fi protocol and configuration functionality and networking stack, in embedded firmware to make a fully self-contained 802.11b/g/n Wi-Fi solution for a variety of applications. The HF-LPB125 employs the world's lowest power consumption embedded architecture. It has been optimized for all kinds of client applications in the home automation, smart grid, handheld device, personal medical application and industrial control that have lower data rates, and transmit or receive data on an infrequent basis. The HF-LPB125 integrates all Wi-Fi functionality into a low-profile, 41.3mm x 24.1mm x 6mm SMT module package that can be easily mounted on main PCB with application specific circuits. Also, module provides built-in antenna option. 1.1.1 Device Features Single stream Wi-Fi @ 2.4 GHz with support for WEP security mode as well as WPA/WPA2 Based on Self-developed High Cost Performance MCU Ultra-low-power operation with all kinds of power-save modes. Includes all the protocol and configuration functions for Wi-Fi connectivity. Support STA/AP Mode Support Smart Link Function Support Wireless and Remote Firmware Upgrade Function Integrated PCB antenna or I-PEX antenna connector options. Compact surface mount module 41.3mm x 24.1mm x 6mm. Full IPv4 stack. Low power RTOS and drivers. CE/FCC Certified. RoHS compliant. Single supply – 5V operation. Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 6- HF-LPB125 Low Power Wi-Fi Module User Manual 1.1.2 Device Paremeters Table 1 Class Wireless Parameters HF-LPB125 Module Technical Specifications Item Parameters Certification Wireless standard Frequency range FCC/CE 802.11 b/g/n 2.412GHz-2.462GHz 802.11b: +16 +/-2dBm (@11Mbps) 802.11g: +14 +/-2dBm (@54Mbps) 802.11n: +13 +/-2dBm (@HT20, MCS7) 802.11b: -93 dBm (@11Mbps ,CCK) 802.11g: -85 dBm (@54Mbps, OFDM) 802.11n: -82 dBm (@HT20, MCS7) Transmit Power Receiver Sensitivity Antenna Option Data Interface Operating Voltage Hardware Parameters Operating Current Operating Temp. Storage Temp. Dimensions and Size External Interface Software Parameters Network Type Security Mechanisms Encryption Update Firmware Customization Network Protocol User Configuration Internal:On-board PCB antenna UART GPIO 4.75~6V Peak [Continuous TX]: ~300mA Normal [WiFi ON/OFF, DTIM=100ms]: Average. ~12mA, Peak: 300mA -20℃- 85℃ -40℃- 125℃ 41.3mm x 24.1mm x 6mm 2x4 pin 2.54mm PIN or 4pin 2.5mm header STA /AP WEP/WPA-PSK/WPA2-PSK WEP64/WEP128/TKIP/AES Local Wireless, Remote Support SDK for application develop IPv4, TCP/UDP/HTTP AT+instruction set. Android/ iOS Smart Link APP tools 1.1.3 Key Application Remote equipment monitoring Asset tracking and telemetry Security Industrial sensors and controls Home automation Medical devices Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 7- HF-LPB125 Low Power Wi-Fi Module User Manual 1.2. Hardware Introduction 1.2.1. Pins Definition Figure 1. HF-LPB125 Pins Map Table 2 HF-LPB125 Pins Definition Describtion Net Name +5V Power Ground UART0 DVDD GND UART0_RX Signal Type Power Power I,PU UART0 UART0_TX O,PU Multi-Function nReload I,PU Module Reset GPIO EXT_RESETn GPIO5 I,PU I/O GPIO GPIO6 I/O Pin Comments 5V@250mA 5V, GPIO19. No connect if not use. 5V, GPIO20. No connect if not use. 3.3V, GPIO2. Detailed functions see3.3V, “Low” effective reset input. 3.3V I/O, UART1_TXD debug output No connect if not use. 3.3V I/O, UART1_RXD debug input No connect if not use. Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 8- HF-LPB125 Low Power Wi-Fi Module User Manual Module Pin4 must be high when bootup. nReload Pin (Button) function： 1. When this pin is set to “low” during module boot up, the module will enter wireless firmware and config upgrade mode. This mode is used for customer manufacture. (See Appendix D to download software tools for customer batch configuration and upgrade firmware during mass production) 2. After module is powered up, short press this button ( “Low” < = 2s ) to make the module go into “Smart Link “ config mode, waiting for APP to set password and other information. (See Appendix D to download SmartLink APP) 3. After module is powered up, long press this button ( “Low” >= 4s ) to make the module recover to factory setting. High-Flying strongly suggest customer fan out this pin to connector or button for “Manufacture” and “ Smart Link” application. 1.2.2. Electrical Characteristics Absolute Maximum Ratings: Parameter Condition Storage temperature range Maximum soldering temperature Min. Typ. -40 IPC/JEDEC J-STD-020 Max. Unit 125 °C 260 °C Supply voltage 4.75 Voltage on any I/O pin 5/3.3 ESD (Human Body Model HBM) TAMB=25°C 2.5 KV ESD (MM) TAMB=25°C 0.25 KV Power Supply & Power Consumption: Parameter Condition Operating Supply voltage Min. Typ. Max. Unit 4.75 Supply current, peak Continuous Tx 280 mA Supply current, IEEE PS DTIM=100ms 20 mA Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 9- HF-LPB125 Low Power Wi-Fi Module User Manual 1.2.3. Mechanical Size HF-LPB125 modules physical size （Unit: mm） as follows: Figure 2. HF-LPB125 Mechanical Dimension Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 10 - HF-LPB125 Low Power Wi-Fi Module User Manual 1.2.4. Order Information Base on customer detailed requirement, HF-LPB125 series modules provide different variants and physical type for detailed application. Figure 3. HF-LPB125 Order Information 1.3. Typical Application Refer to HF-LPB120 user manual for detailed application and module usage. Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 11 - HF-LPB125 Low Power Wi-Fi Module User Manual 2. PACKAGE INFORMATION 2.1. Recommended Reflow Profile Figure 4. Reflow Soldering Profile Table 11 Reflow Soldering Parameter NO. Item Reflow Time Peak-Temp Temperature (Degree) Time of above 220 Time(Sec) 35~55 sec 260 max Note: 1. Recommend to supply N2 for reflow oven. 2. N2 atmosphere during reflow (O2<300ppm) 2.2. Device Handling Instruction (Module IC SMT Preparation) 1. Shelf life in sealed bag: 12 months, at <30℃ and <60% relative humidity (RH) 2. After bag is opened, devices that will be re-baked required after last baked with window time 168 hours. 3. Recommend to oven bake with N2 supplied 4. Recommend end to reflow oven with N2 supplied 5. Baked required with 24 hours at 125+-5℃ before rework process for two modules, one is new module and two is board with module 6. Recommend to store at ≦10% RH with vacuum packing 7. If SMT process needs twice reflow: (1) Top side SMT and reflow (2) Bottom side SMT and reflow Case 1: Wifi module mounted on top side. Need to bake when bottom side process over 168 hours window time, no need to bake within 168 hours Case 2: Wifi module mounted on bottom side, follow normal bake rule before process Note: Window time means from last bake end to next reflow start that has 168 hours space. Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 12 - HF-LPB125 Low Power Wi-Fi Module User Manual 2.3. Shipping Information(TBD) BOX TAPE Size: 340*340*70 mm Size: 340*340*350 mm (inside) Figure 5. Shipping Information Note: 1 tape = 500pcs 1 box = 5 tapes = 5 * 500 pcs = 2500pcs FCC STATEMENT: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. Warning: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 13 - HF-LPB125 Low Power Wi-Fi Module User Manual by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. FCC INFORMATION (additional) OEM INTEGRATION INSTRUCTIONS: This device is intended only for OEM integrators under the following conditions: The module must be installed in the host equipment such that 20 cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna. The module shall be only used with the internal antenna(s) that has been originally tested and certified with this module. As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Validity of using the module certification: In the event that these conditions cannot be met (for example certain laptop configurations or colocation with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization. Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 14 - HF-LPB125 Low Power Wi-Fi Module User Manual End product labeling: The final end product must be labeled in a visible area with the following: “Contains FCC ID: 2ACSVHF-LPB125”. Information that must be placed in the end user manual: The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Antenna Specification: Type: PCB Antenna Model: HF-LPB125 Brand: High-Flying Gain: 3dBi Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 15 - HF-LPB125 Low Power Wi-Fi Module User Manual APPENDIX E: CONTACT INFORMATION -----------------------------------------------------------------------------------------------------------Address: Room 1002,Building 1,No.3000,Longdong Avenue,Pudong New Area,Shanghai,China,201203 Web: www.hi-flying.com Service Online: 400-189-3108/18616078755 Sales Contact: sales@hi-flying.com ----------------------------------------------------------------------------------------------------------- For more information about High-Flying modules, applications, and solutions, please visit our web site http://www.hi-flying.com/en/ © Copyright High-Flying, May, 2011 The information disclosed herein is proprietary to High-Flying and is not to be used by or disclosed to unauthorized persons without the written consent of High-Flying. The recipient of this document shall respect the security status of the information. The master of this document is stored on an electronic database and is “write-protected” and may be altered only by authorized persons at High-Flying. Viewing of the master document electronically on electronic database ensures access to the current issue. Any other copies must be regarded as uncontrolled copies. Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 16 -
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.5 Linearized : No XMP Toolkit : Adobe XMP Core 4.2.1-c043 52.372728, 2009/01/18-15:08:04 Creator Tool : PScript5.dll Version 5.2.2 Modify Date : 2016:11:17 16:53:29+08:00 Create Date : 2016:09:26 11:41:59+08:00 Metadata Date : 2016:11:17 16:53:29+08:00 Format : application/pdf Title : <5C5C3139322E3136382E322E3137365CB0B8BCFEBDF8D0D0D6D05CA1F9D7CAC1CF4F4BA1F95C3031313630393131314920BABAB7E320CEDECFDFC4A3BFE93F48462D4C50423132352D313020D7A3BFADC7BF2D616D792D4643432D49445CD7CAC1CF4F4B5C5573657273204D616E75616C2E646F6378> Creator : anbotek Producer : Acrobat Distiller 9.3.3 (Windows) Document ID : uuid:69fe417d-68a3-4dbe-be2f-1a40c5a481e4 Instance ID : uuid:674a00fa-3dd8-4e4d-8ab5-a03e5a8d4fb9 Page Count : 16 Author : anbotekEXIF Metadata provided by EXIF.tools