High Flying Electronics Technology HF-LPB300-1 Wi-Fi Module User Manual

High-Flying Electronics Technology Co., Ltd. Wi-Fi Module

User Manual

HF-LPB300-1 Low Power WiFi Module User Manual High-Flying Electronics Technology Co., Ltd. (www.hi-flying.com) - 1 - HF-LPB300-1 Low Power WiFi Module User Maunal V 1.0
HF-LPB300-1 Low Power WiFi Module User Manual High-Flying Electronics Technology Co., Ltd. (www.hi-flying.com) - 2 - TABLE OF CONTENTS LIST OF FIGURES ................................................................................................................................... 3LIST OF TABLES .................................................................................................................................... 3HISTORY .................................................................................................................................................. 3PRODUCT OVERVIEW ......................................................................................................................... 4General Description ........................................................................................................................... 4Device Features ............................................................................................................................... 4Device Paremeters ........................................................................................................................... 5Key Application ................................................................................................................................. 5Hardware Introduction ....................................................................................................................... 6Pins Definition .................................................................................................................................. 6Electrical Characteristics .................................................................................................................. 7Mechanical Size ............................................................................................................................... 8On-board Chip Antenna ................................................................................................................... 9Order Information ...........................................................................................................................10PACKAGE INFORMATION ................................................................................................................10Recommended Reflow Profile ........................................................................................................10Device Handling Instruction (Module IC SMT Preparation) .........................................................11Shipping Information .......................................................................................................................11APPENDIX A: 88MW300 PIN MAPING ...........................................................................................12
HF-LPB300-1 Low Power WiFi Module User Manual High-Flying Electronics Technology Co., Ltd. (www.hi-flying.com) - 3 - LIST OF FIGURES Figure 1. HF-LPB300-1 Demo .................................................................................................................. 6Figure 2. HF-LPB300-1 Pins Map ............................................................................................................. 6Figure 3. HF-LPB300-1 Mechanical Dimension ....................................................................................... 8Figure 4. HF-LPB300-1 PCB Symbol Size ............................................................................................... 9Figure 5. Suggested Module Placement Region ...................................................................................... 9Figure 6. HF-LPB300-1 Order Information .............................................................................................10Figure 7. Reflow Soldering Profile ..........................................................................................................10Figure 8. Shipping Information ................................................................................................................11LIST OF TABLES Table 1 HF-LPB300-1 Module Technical Specifications ......................................................................... 5Table 2 HF-LPB300-1 Pins Definition ...................................................................................................... 6Table 3 Reflow Soldering Parameter ......................................................................................................10 FCC Statement ..........................................................................................................................................13HISTORY Ed. V1.0 Created on 4-2-2015.
HF-LPB300-1 Low Power WiFi Module User Manual High-Flying Electronics Technology Co., Ltd. (www.hi-flying.com) - 4 - PRODUCT OVERVIEW General Description The HF-LPB300-1 is a fully self-contained small form-factor, single stream, 802.11b/g/n-HT20 Wi-Fi module, which provide a wireless interface to any equipment with a Serial/SPI/USB/GPIO interface for data transfer.HF-LPB300-1 integrate MAC, baseband processor, RF transceiver with power amplifier in hardware and all Wi-Fi protocol and configuration functionality and networking stack, in embedded firmware to make a fully self-contained 802.11b/g/n Wi-Fi solution for a variety of applications. HF-LPB300-1 support AP+STA wireless networking and support Wi-Fi Direct mode. HF-LPB300-1 also provides wireless and remote firmware upgrade, which satisfied all kinds of application requirement. HF-LPB300-1 support wakup-on-wireless feature which make it a very suitable solution for battery applications with excellent power save scheme. The HF-LPB300-1 employs the world's lowest power consumption embedded architecture. It has been optimized for all kinds of client applications in the home automation, smart grid, handheld device, personal medical application and industrial control that have lower data rates, and transmit or receive data on an infrequent basis. The HF-LPB300-1 integrates all Wi-Fi functionality into a low-profile, 23.1x32.8x 2.7mm SMT module package that can be easily mounted on main PCB with application specific circuits. Device Features Single stream Wi-Fi @ 2.4 GHz with support for WEP security mode as well as WPA/WPA2Fully self-contained serial-to-wireless functionality.Support IEEE802.11b/g/n-HT20 Wireless StandardsUltra-Low-Power for Battery Applications with Excellent Power Save SchemeSupport UART/SPI/USB/PWM/ADC/GPIO Data Communication InterfaceSupport Work As STA/AP/AP+STA/Wi-Fi Direct ModeSupport Smart Link Function (APP for smart configuration)Support Wireless (OTA) and Remote Firmware Upgrade FunctionSupport Wakeup-on-Wireless and Wakeup LocalSupport TLS/SSL and mDNS ProtocalSupport PCB Antenna Internal 4MB Flash InsideSingle +3.3V Power SupplySmallest Size: 23.1mm x 32.8mm x2.7mmFCC/CE Certificated
HF-LPB300-1 Low Power WiFi Module User Manual High-Flying Electronics Technology Co., Ltd (www.hi-flying.com) - 5 - Device Paremeters Table 1 HF-LPB300-1 Module Technical Specifications Class Item Parameters Wireless Parameters Certification FCCWireless standard 802.11 b/g/n-HT20 Frequency range 2.412GHz-2.462GHz RF Output Power(Peak) 802.11b:20.05 dBm (@1Mbps) 802.11g: 18.89dBm (@6Mbps ) 802.11n-HT20: 17.88dBm (@HT20, MCS0) Antenna On-board PCB antenna Hardware Parameters Data Interface UART SPI, PWM, GPIO… Others: USB, ADC, RTC… Operating Voltage 2.97V~3.63V Operating Current Peak [Continuous TX]: ~240mA Normal [WiFi ON/OFF, DTIM=100ms]: AP Associate: ~21mA; No-AP Associate:~26mA Wakeup-on-Wireless Mode: ~10mA; Deep Sleep: <100uA Operating Temp. -40℃- 85℃ Storage Temp. -45℃- 125℃ Dimensions and Size 23.1mm×32.8mm×2.7mm Software Parameters Network Type STA /AP/STA+AP/Wi-Fi Direct Security Mechanisms WEP/WPA-PSK/WPA2-PSK Encryption WEP64/WEP128/TKIP/AESUpdate Firmware Local Wireless (OTA), Remote Network Protocol IPv4,TCP/UDP/FTP/HTTP,FTTPS,TLS,mDNS User Configuration AT+instruction set, Web page/ Android/ iOS Smart Link APP tools Key Application Remote equipment monitoringSmart Home/EnergyIndustrial sensors and controlsHome automationMedical/Healthcare devices
HF-LPB300-1 Low Power WiFi Module User Manual High-Flying Electronics Technology Co., Ltd (www.hi-flying.com) - 6 - Hardware Introduction Pins Definition Figure 1. HF-LPB300-1 Pins Map Table 2 HF-LPB300-1 Pins Definition Pin Describtion Net Name Signal Type Comments 1,17,32,48 Ground GND Power 2 JTAG Function JTAG_TCK I, PU JTAG/Debug functional pin, No connect if not use. No connect 3 JTAG Function JTAG_TDO O 4 JTAG Function JTAG_TDI I,PU 5 JTAG Function JTAG_TMS I,PU 6 JTAG Function JTAG_nTRST I,PU 7 GPIO WAKEUP0 I/O GPIO7, No connect if not use.8 GPIO WAKEUP1 I/O GPIO8, No connect if not use.9 +3.3V Power DVDD Power HF-LPB300-1
HF-LPB300 Low Power WiFi Module User Manual High-Flying Electronics Technology Co., Ltd (www.hi-flying.com) - 7 - 10 GPIO BOOT0 I/O GPIO10, No connect if not use.11 A/D Input 1 ADC1 I/O GPIO11, No connect if not use.12 A/D Input 2 ADC2 I/O GPIO12, No connect if not use.13 GPIO RTC_XIN I/O GPIO13, No connect if not use.14 GPIO RTC_XOUT I/O GPIO14, No connect if not use.15 GPIO BOOT1 I/O GPIO15, No connect if not use.16 N.C No connect 18 GPIO UART1_TXD I/O GPIO18, No connect if not use.19 N.C No connect 20 GPIO UART1_RXD I/O GPIO20, No connect if not use.21 N.C No connect 22 N.C No connect 23 N.C No connect 24 GPIO GPIO24 I/O GPIO24, No connect if not use.25 I2C Interface I2C_SCL I/O GPIO25, No connect if not use.26 I2C Interface I2C_SDA I/O GPIO26, No connect if not use.27 SPI Data In SPI_MISO I GPIO27, No connect if not use.28 SPI Interface SPI_CLK I/O GPIO28, No connect if not use.29 SPI Interface SPI_CS I/O GPIO29, No connect if not use.30 SPI Data Out SPI_MOSI O GPIO30, No connect if not use.31 +3.3V Power DVDD Power 33 N.C No connect 34 +3.3 Power DVDD Power 35 N.C No connect 36 N.C No connect 37 N.C No connect 38 N.C No connect 39 UART0 UART0_TX O UART Communication Pin 40 UART0 UART0_RTS I/O UART Pin (Or RS485 Control)41 UART0 UART0_RX I UART Communication Pin 42 UART0 UART0_CTS I/O UART Communication Pin 43 GPIO nLink I/O GPIO43, No connect if not use.44 GPIO nReady I/O GPIO44, No connect if not use.45 GPIO nReload I/O,PU GPIO45, No connect if not use.46 N.C No connect 47 Module Reset EXT_RESETn I,PU “Low” effective reset input. Electrical Characteristics Absolute Maximum Ratings: Parameter Condition Min. Typ. Max. Unit Storage temperature range -45 125 °C Maximum soldering temperature IPC/JEDEC J-STD-020 260 °C Supply voltage 0 3.8 V Voltage on any I/O pin 0 3.3 V ESD (Human Body Model HBM) TAMB=25°C 2 KV
HF-LPB300-1 Low Power WiFi Module User Manual High-Flying Electronics Technology Co., Ltd (www.hi-flying.com) - 8 - ESD (Charged Device Model, CDM) TAMB=25°C 500 V Power Supply & Power Consumption: Parameter Condition Min. Typ. Max. Unit Operating Supply voltage 2.97 3.3 3.63 V Supply current, peak Continuous Tx 200 250 mA Supply current, IEEE PS DTIM=100ms 21 mA Input high voltage VDD*70% VDD+0.4 V Input low voltage -.04 VDD*30% V Input leakage current VDD On 2 uA Input capacitance 5 pF Pullup strength 10 50 uA Pulldowm strength 10 50 uA Analog input range 0 3 V Analog output range 0 3 V Mechanical Size HF-LPB300-1 modules physical size （Unit: mm） as follows: Figure 2. HF-LPB300-1 Mechanical Dimension HF-LPB300-1 Module PCB symbol size (mm) as follows:
HF-LPB300-1 Low Power WiFi Module User Manual High-Flying Electronics Technology Co., Ltd (www.hi-flying.com) - 9 - Figure 3. HF-LPB300-1 PCB Symbol Size On-board PCB Antenna HF-LPB300-1 module support internal on-board PCB antenna . When customer select internal antenna, you shall comply with following antenna design rules and module location suggestions: For customer PCB, RED color region (8.3x18.4mm) can’t put componet or paste GND net;Antenna must away from metal or high components at least 10mm;Antenna can’t be shieldedby any meal enclosure; All cover, include plastic, shall away fromantenna at least 10mm;Figure 4. Suggested Module Placement Region High-Flying suggest HF-LPB300-1 module better locate in following region at customer board, which to reduce the effect to antenna and wireless signal, and better consult High-Flying technical people when you structure your module placement and PCB layout.
HF-LPB300-1 Low Power WiFi Module User Manual High-Flying Electronics Technology Co., Ltd (www.hi-flying.com) - 10 - PACKAGE INFORMATION Recommended Reflow Profile Figure 5. Reflow Soldering Profile Table 11 Reflow Soldering Parameter Note: 1. Recommend to supply N2 for reflow oven. 2. N2 atmosphere during reflow (O2<300ppm)NO. Item Temperature (Degree) Time(Sec) 1 Reflow Time Time of above 220 35~55 sec 2 Peak-Temp 260 max
HF-LPB300-1 Low Power WiFi Module User Manual High-Flying Electronics Technology Co., Ltd (www.hi-flying.com) - 11 - Device Handling Instruction (Module IC SMT Preparation) 1. Shelf life in sealed bag: 12 months, at <30℃ and <60% relative humidity (RH)2. After bag is opened, devices that will be re-baked required after last baked with window time168 hours.3. Recommend to oven bake with N2 supplied4. Recommend end to reflow oven with N2 supplied5. Baked required with 24 hours at 125+-5℃ before rework process for two modules, one isnew module and two is board with module6. Recommend to store at ≦10% RH with vacuum packing7. If SMT process needs twice reflow: (1) Top side SMT and reflow 　　(2) Bottom side SMT and reflow Case 1: Wifi module mounted on top side. Need to bake when bottom side process over 168 hours window time, no need to bake within 168 hours Case 2: Wifi module mounted on bottom side, follow normal bake rule before process Note: Window time means from last bake end to next reflow start that has 168 hours space. Shipping Information TAPE BOX Size: 340*340*70 mm Size: 340*340*350 mm (inside) Figure 7. Shipping Information Note: 1 tape = 500pcs 1 box = 5 tapes = 5 * 500 pcs = 2500pcs Company: High-Flying Electronics Technology Co., Ltd. Add: Room 1002, Building 1, No.3000, Longdong Avenue, Pudong New Area, Shanghai, China 201203 Tel: 400-189-3108 Fax: 021-31291158-8089
HF-LPB300-1 Low Power WiFi Module User Manual High-Flying Electronics Technology Co., Ltd (www.hi-flying.com) - 12 - APPENDIX A: 88MW300 PIN MAPING
HF-LPB300-1 Low Power WiFi Module User Manual High-Flying Electronics Technology Co., Ltd (www.hi-flying.com) - 13 - FCC Statement Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment .This equipment should be installed and operated with minimum distance 20cm between the radiator& your body. FCC Label InstructionsThe outside of final products that contains this module device must display a label referring to the enclosed module. This exterior label can use wording such as: “Contains Transmitter Module FCC ID:2ACSV-HF-LPB300-1”,or “Contains FCC ID:2ACSV-HF-LPB300-1”, Any similar wording that expresses the same meaning may be used.

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