High Flying Electronics Technology HF-LPB300-1 Wi-Fi Module User Manual
High-Flying Electronics Technology Co., Ltd. Wi-Fi Module
User Manual
HF-LPB300-1 Low Power WiFi Module User Manual
High-Flying Electronics Technology Co., Ltd. (www.hi-flying.com)
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HF-LPB300-1
Low Power WiFi Module User Maunal
V 1.0
HF-LPB300-1 Low Power WiFi Module User Manual
High-Flying Electronics Technology Co., Ltd. (www.hi-flying.com)
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TABLE OF CONTENTS
LIST OF FIGURES ................................................................................................................................... 3
LIST OF TABLES .................................................................................................................................... 3
HISTORY .................................................................................................................................................. 3
PRODUCT OVERVIEW ......................................................................................................................... 4
General Description ........................................................................................................................... 4
Device Features ............................................................................................................................... 4
Device Paremeters ........................................................................................................................... 5
Key Application ................................................................................................................................. 5
Hardware Introduction ....................................................................................................................... 6
Pins Definition .................................................................................................................................. 6
Electrical Characteristics .................................................................................................................. 7
Mechanical Size ............................................................................................................................... 8
On-board Chip Antenna ................................................................................................................... 9
Order Information ...........................................................................................................................10
PACKAGE INFORMATION ................................................................................................................10
Recommended Reflow Profile ........................................................................................................10
Device Handling Instruction (Module IC SMT Preparation) .........................................................11
Shipping Information .......................................................................................................................11
APPENDIX A: 88MW300 PIN MAPING ...........................................................................................12
HF-LPB300-1 Low Power WiFi Module User Manual
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LIST OF FIGURES
Figure 1. HF-LPB300-1 Demo .................................................................................................................. 6
Figure 2. HF-LPB300-1 Pins Map ............................................................................................................. 6
Figure 3. HF-LPB300-1 Mechanical Dimension ....................................................................................... 8
Figure 4. HF-LPB300-1 PCB Symbol Size ............................................................................................... 9
Figure 5. Suggested Module Placement Region ...................................................................................... 9
Figure 6. HF-LPB300-1 Order Information .............................................................................................10
Figure 7. Reflow Soldering Profile ..........................................................................................................10
Figure 8. Shipping Information ................................................................................................................11
LIST OF TABLES
Table 1 HF-LPB300-1 Module Technical Specifications ......................................................................... 5
Table 2 HF-LPB300-1 Pins Definition ...................................................................................................... 6
Table 3 Reflow Soldering Parameter ......................................................................................................10
FCC Statement ..........................................................................................................................................13
HISTORY
Ed. V1.0 Created on 4-2-2015.
HF-LPB300-1 Low Power WiFi Module User Manual
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PRODUCT OVERVIEW
General Description
The HF-LPB300-1 is a fully self-contained small form-factor, single stream, 802.11b/g/n-HT20 Wi-Fi
module, which provide a wireless interface to any equipment with a Serial/SPI/USB/GPIO interface for
data transfer.HF-LPB300-1 integrate MAC, baseband processor, RF transceiver with power amplifier in
hardware and all Wi-Fi protocol and configuration functionality and networking stack, in embedded
firmware to make a fully self-contained 802.11b/g/n Wi-Fi solution for a variety of applications.
HF-LPB300-1 support AP+STA wireless networking and support Wi-Fi Direct mode. HF-LPB300-1
also provides wireless and remote firmware upgrade, which satisfied all kinds of application
requirement. HF-LPB300-1 support wakup-on-wireless feature which make it a very suitable
solution for battery applications with excellent power save scheme.
The HF-LPB300-1 employs the world's lowest power consumption embedded architecture. It has
been optimized for all kinds of client applications in the home automation, smart grid, handheld
device, personal medical application and industrial control that have lower data rates, and transmit or
receive data on an infrequent basis.
The HF-LPB300-1 integrates all Wi-Fi functionality into a low-profile, 23.1x32.8x 2.7mm SMT
module package that can be easily mounted on main PCB with application specific circuits.
Device Features
Single stream Wi-Fi @ 2.4 GHz with support for WEP security mode as well as WPA/WPA2
Fully self-contained serial-to-wireless functionality.
Support IEEE802.11b/g/n-HT20 Wireless Standards
Ultra-Low-Power for Battery Applications with Excellent Power Save Scheme
Support UART/SPI/USB/PWM/ADC/GPIO Data Communication Interface
Support Work As STA/AP/AP+STA/Wi-Fi Direct Mode
Support Smart Link Function (APP for smart configuration)
Support Wireless (OTA) and Remote Firmware Upgrade Function
Support Wakeup-on-Wireless and Wakeup Local
Support TLS/SSL and mDNS Protocal
Support PCB Antenna
Internal 4MB Flash Inside
Single +3.3V Power Supply
Smallest Size: 23.1mm x 32.8mm x2.7mm
FCC/CE Certificated
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Device Paremeters
Table 1 HF-LPB300-1 Module Technical Specifications
Class Item Parameters
Wireless
Parameters
Certification FCC
Wireless standard 802.11 b/g/n-HT20
Frequency range 2.412GHz-2.462GHz
RF Output Power(Peak)
802.11b:20.05 dBm (@1Mbps)
802.11g: 18.89dBm (@6Mbps )
802.11n-HT20: 17.88dBm (@HT20, MCS0)
Antenna On-board PCB antenna
Hardware
Parameters
Data Interface
UART
SPI, PWM, GPIO…
Others: USB, ADC, RTC…
Operating Voltage 2.97V~3.63V
Operating Current
Peak [Continuous TX]: ~240mA
Normal [WiFi ON/OFF, DTIM=100ms]:
AP Associate: ~21mA; No-AP Associate:~26mA
Wakeup-on-Wireless Mode: ~10mA;
Deep Sleep: <100uA
Operating Temp. -40℃- 85℃
Storage Temp. -45℃- 125℃
Dimensions and Size 23.1mm×32.8mm×2.7mm
Software
Parameters
Network Type STA /AP/STA+AP/Wi-Fi Direct
Security Mechanisms WEP/WPA-PSK/WPA2-PSK
Encryption WEP64/WEP128/TKIP/AES
Update Firmware Local Wireless (OTA), Remote
Network Protocol IPv4,TCP/UDP/FTP/HTTP,FTTPS,TLS,mDNS
User Configuration AT+instruction set, Web page/ Android/ iOS
Smart Link APP tools
Key Application
Remote equipment monitoring
Smart Home/Energy
Industrial sensors and controls
Home automation
Medical/Healthcare devices
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Hardware Introduction
Pins Definition
Figure 1. HF-LPB300-1 Pins Map
Table 2 HF-LPB300-1 Pins Definition
Pin Describtion Net Name Signal Type Comments
1,17,32,48 Ground GND Power
2 JTAG Function JTAG_TCK I, PU JTAG/Debug functional pin,
No connect if not use.
No connect
3 JTAG Function JTAG_TDO O
4 JTAG Function JTAG_TDI I,PU
5 JTAG Function JTAG_TMS I,PU
6 JTAG Function JTAG_nTRST I,PU
7 GPIO WAKEUP0 I/O GPIO7, No connect if not use.
8 GPIO WAKEUP1 I/O GPIO8, No connect if not use.
9 +3.3V Power DVDD Power
HF-LPB300-1
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10 GPIO BOOT0 I/O GPIO10, No connect if not use.
11 A/D Input 1 ADC1 I/O GPIO11, No connect if not use.
12 A/D Input 2 ADC2 I/O GPIO12, No connect if not use.
13 GPIO RTC_XIN I/O GPIO13, No connect if not use.
14 GPIO RTC_XOUT I/O GPIO14, No connect if not use.
15 GPIO BOOT1 I/O GPIO15, No connect if not use.
16 N.C No connect
18 GPIO UART1_TXD I/O GPIO18, No connect if not use.
19 N.C No connect
20 GPIO UART1_RXD I/O GPIO20, No connect if not use.
21 N.C No connect
22 N.C No connect
23 N.C No connect
24 GPIO GPIO24 I/O GPIO24, No connect if not use.
25 I2C Interface I2C_SCL I/O GPIO25, No connect if not use.
26 I2C Interface I2C_SDA I/O GPIO26, No connect if not use.
27 SPI Data In SPI_MISO I GPIO27, No connect if not use.
28 SPI Interface SPI_CLK I/O GPIO28, No connect if not use.
29 SPI Interface SPI_CS I/O GPIO29, No connect if not use.
30 SPI Data Out SPI_MOSI O GPIO30, No connect if not use.
31 +3.3V Power DVDD Power
33 N.C No connect
34 +3.3 Power DVDD Power
35 N.C No connect
36 N.C No connect
37 N.C No connect
38 N.C No connect
39 UART0 UART0_TX O UART Communication Pin
40 UART0 UART0_RTS I/O UART Pin (Or RS485 Control)
41 UART0 UART0_RX I UART Communication Pin
42 UART0 UART0_CTS I/O UART Communication Pin
43 GPIO nLink I/O GPIO43, No connect if not use.
44 GPIO nReady I/O GPIO44, No connect if not use.
45 GPIO nReload I/O,PU GPIO45, No connect if not use.
46 N.C No connect
47 Module Reset EXT_RESETn I,PU “Low” effective reset input.
Electrical Characteristics
Absolute Maximum Ratings:
Parameter Condition Min. Typ. Max. Unit
Storage temperature range -45 125 °C
Maximum soldering temperature IPC/JEDEC J-STD-020 260 °C
Supply voltage 0 3.8 V
Voltage on any I/O pin 0 3.3 V
ESD (Human Body Model HBM) TAMB=25°C 2 KV
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ESD (Charged Device Model, CDM) TAMB=25°C 500 V
Power Supply & Power Consumption:
Parameter Condition Min. Typ. Max. Unit
Operating Supply voltage 2.97 3.3 3.63 V
Supply current, peak Continuous Tx 200 250 mA
Supply current, IEEE PS DTIM=100ms 21 mA
Input high voltage VDD*70% VDD+0.4 V
Input low voltage -.04 VDD*30% V
Input leakage current VDD On 2 uA
Input capacitance 5 pF
Pullup strength 10 50 uA
Pulldowm strength 10 50 uA
Analog input range 0 3 V
Analog output range 0 3 V
Mechanical Size
HF-LPB300-1 modules physical size （Unit: mm） as
follows:
Figure 2. HF-LPB300-1 Mechanical
Dimension HF-LPB300-1 Module PCB symbol size (mm) as follows:
HF-LPB300-1 Low Power WiFi Module User Manual
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Figure 3. HF-LPB300-1 PCB Symbol Size
On-board PCB Antenna
HF-LPB300-1 module support internal on-board PCB antenna . When customer select internal
antenna, you shall comply with following antenna design rules and module location suggestions:
For customer PCB, RED color region (8.3x18.4mm) can’t put componet or paste GND net;
Antenna must away from metal or high components at least 10mm;
Antenna can’t be shieldedby any meal enclosure; All cover, include plastic, shall away from
antenna at least 10mm;
Figure 4. Suggested Module Placement Region
High-Flying suggest HF-LPB300-1 module better locate in following region at customer board, which
to reduce the effect to antenna and wireless signal, and better consult High-Flying technical people
when you structure your module placement and PCB layout.
HF-LPB300-1 Low Power WiFi Module User Manual
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PACKAGE INFORMATION
Recommended Reflow Profile
Figure 5. Reflow Soldering Profile
Table 11 Reflow Soldering Parameter
Note: 1. Recommend to supply N2 for reflow oven.
2. N2 atmosphere during reflow (O2<300ppm)
NO. Item Temperature (Degree) Time(Sec)
1 Reflow Time Time of above 220 35~55 sec
2 Peak-Temp 260 max
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Device Handling Instruction (Module IC SMT Preparation)
1. Shelf life in sealed bag: 12 months, at <30℃ and <60% relative humidity (RH)
2. After bag is opened, devices that will be re-baked required after last baked with window time
168 hours.
3. Recommend to oven bake with N2 supplied
4. Recommend end to reflow oven with N2 supplied
5. Baked required with 24 hours at 125+-5℃ before rework process for two modules, one is
new module and two is board with module
6. Recommend to store at ≦10% RH with vacuum packing
7. If SMT process needs twice reflow:
(1) Top side SMT and reflow (2) Bottom side SMT and reflow
Case 1: Wifi module mounted on top side. Need to bake when bottom side process over 168
hours window time, no need to bake within 168 hours
Case 2: Wifi module mounted on bottom side, follow normal bake rule before process
Note: Window time means from last bake end to next reflow start that has 168 hours space.
Shipping Information
TAPE BOX
Size: 340*340*70 mm Size: 340*340*350 mm (inside)
Figure 7. Shipping Information
Note:
1 tape = 500pcs
1 box = 5 tapes = 5 * 500 pcs = 2500pcs
Company: High-Flying Electronics
Technology Co., Ltd.
Add: Room 1002, Building 1, No.3000,
Longdong Avenue, Pudong New Area,
Shanghai, China 201203
Tel: 400-189-3108
Fax: 021-31291158-8089
HF-LPB300-1 Low Power WiFi Module User Manual
High-Flying Electronics Technology Co., Ltd (
www.hi-flying.com)
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APPENDIX A: 88MW300 PIN MAPING
HF-LPB300-1 Low Power WiFi Module User Manual
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FCC Statement
Any Changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
This device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that
may cause undesired operation.
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment .This equipment should be installed and operated with
minimum distance 20cm between the radiator& your body.
FCC Label Instructions
The outside of final products that contains this module device must display a label
referring to the enclosed module. This exterior label can use wording such as: “Contains
Transmitter Module FCC ID:2ACSV-HF-LPB300-1”,or “Contains FCC ID:2ACSV-HF-
LPB300-1”, Any similar wording that expresses the same meaning may be used.