Huawei Technologies MC509 CDMA1X EVDO Rev.A Module User Manual English

Huawei Technologies Co.,Ltd CDMA1X EVDO Rev.A Module English

Installation Manual

Copyright © Huawei Technologies Co., Ltd. 2011.
All rights reserved.
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Notice
Some features of the product and its accessories described herein rely on the
software installed, capacities and settings of local network, and may not be
activated or may be limited by local network operators or network service
providers, thus the descriptions herein may not exactly match the product or its
accessories you purchase.
Huawei Technologies Co., Ltd reserves the right to change or modify any
information or specifications contained in this manual without prior notice or
obligation.
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Contents
Getting to Know the MC509 ....................................................................... 1
PCB Design ............................................................................................. 3
Assembly ................................................................................................ 4
Safety Information ............................................................ 错误！未定义书签。
1
Thank you for purchasing HUAWEI MC509 CDMA Module
(hereinafter referred to as the MC509)
Note:
This manual briefly describes the preparation, the process for PCB Design,
Assembly and safety precautions.
You are recommended to read the manual before using the MC509.
Getting to Know the MC509
The package of the LGA module is 145 pin LGA with a dimension of 30 mm ×
30 mm × 2.65 mm. It is applied to the user interface board, and can be used
as a wireless terminal in a network environment.
2
3
PCB Design
PCB Pad Design
To achieve high efficiency of the production and solder joints of high reliability,
it is recommended that the PCB pad size be designed as follows: the size of
the middle region is the same as the pad size of the product package; other
pads are 0.05 mm larger than the unilateral pad of the product package. For
details, see the following figure:
4
Requirements on PCB Layout
Other devices must be located more than 3 mm away from the LGA module.
It is
recommended to be 5 mm. The minimum distance between the LGA module
and the PCB edge is 1.5 mm.
When the PCB layout is double sided, it is recommended that the LGA module
be placed on the second side for assembly.
Design of Solder Mask
The PCB pad design can be solder mask defined (SMD), or non-solder mask
defined (NSMD).NSMD is recommended. In addition, the solder mask of the
NSMD pad design is larger than the pad so the reliability of the solder joint can
be improved.
The solder mask must be 100 um to150 um larger than the pad, that is, the
single side of the solder mask must be 50 um to 75 um larger than the pad.
The specific size depends on the processing capability of the PCB
manufacturer.
Assembly
Stencil Design
It is recommended that the stencil for the LGA module be 0.12 mm in
thickness. For the stencil design, see the following figure：
5
Reflow Profile
For the soldering temperature of the LGA module, see the following figure:
6
Reflow parameters:

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