Huawei Technologies MC703 Wireless Module supporting CDMA/EvDO 800/1900 User Manual MC703 Product Description

Huawei Technologies Co.,Ltd Wireless Module supporting CDMA/EvDO 800/1900 MC703 Product Description

Contents

User Manual 2

 Product Description   MC703 CDMA EV-DO Wireless Module V100R001  Issue  1.00 Date  2009-08-24  HUAWEI TECHNOLOGIES CO., LTD.
  Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. Please feel free to contact our local office or company headquarters.  Huawei Technologies Co., Ltd. Address:  Huawei Industrial Base Bantian, Longgang Shenzhen 518129 People's Republic of China Website:  http://www.huawei.comEmail:  support@huawei.com        Copyright © Huawei Technologies Co., Ltd. 2009. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd.  Trademarks and Permissions   and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd. All other trademarks and trade names mentioned in this document are the property of their respective holders.  Notice The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute the warranty of any kind, express or implied.  Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 2 of 45
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 3 of 45About This Document History Issue  Details  Date  Author  Approved by V1.00  Initial formal release.  2009-8-24  Zhang Jun  zhou Zhaoxing
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 4 of 45Contents 1 Product Overview .........................................................................................................................9 1.1 About This Chapter ..........................................................................................................................................9 1.2 Functions of the MC703 CDMA EV-DO Module............................................................................................9 1.3 Application Block Diagram of the MC703 CDMA EV-DO Module ............................................................. 11 2 Interface Description..................................................................................................................12 2.1 About This Chapter ........................................................................................................................................12 2.2 Signal Connector Interface.............................................................................................................................12 2.2.1 Interface Signals....................................................................................................................................12 2.3 Antenna Interfaces..........................................................................................................................................15 2.3.1 Antenna Interface Circuits ....................................................................................................................15 3 Electrical Features of the Interfaces.........................................................................................18 3.1 About This Chapter ........................................................................................................................................18 3.2 Application Extremes.....................................................................................................................................18 3.3 Operating and Storage Temperature...............................................................................................................19 3.4 Levels of the I/O Interface .............................................................................................................................19 3.5 Power Supply Features...................................................................................................................................19 3.5.1 Input Power Supply...............................................................................................................................19 3.5.2 Operating Current .................................................................................................................................20 3.5.3 Power-on, Power-off, and Reset Processes...........................................................................................21 3.5.4 RTC Power Supply ...............................................................................................................................23 3.6 Reliability Features ........................................................................................................................................24 3.7 ESD Features..................................................................................................................................................25 3.7.1 Overview...............................................................................................................................................25 3.7.2 ESD Protection on the Antenna Interface .............................................................................................25 3.7.3 ESD Protection on the RUIM Card Interface........................................................................................25 4 Interface Applications................................................................................................................27 4.1 About This Chapter ........................................................................................................................................27 4.2 UART Interface..............................................................................................................................................27 4.3 RUIM Card Interface .....................................................................................................................................30 4.4 Audio Interfaces .............................................................................................................................................32 4.5 Power Supply Interface.................................................................................................................................. 33 4.6 USB Bus.........................................................................................................................................................34
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 5 of 454.7 GPIO Interface ...............................................................................................................................................34 4.8 ADC Interfaces...............................................................................................................................................35 4.9 Status Indication Pins.....................................................................................................................................35 4.9.1 LED Circuits......................................................................................................................................... 35 4.10 Pin Sequence................................................................................................................................................37 5 Mechanics .....................................................................................................................................38 5.1 Overview........................................................................................................................................................38 5.2 Mechanical Dimensions of the MC703 CDMA EV-DO Module...................................................................38 5.3 Mechanical Dimensions of the B2B Connector.............................................................................................40 A Acronyms and Abbreviations..................................................................................................44
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 6 of 45Figures Figure 1-1 Application block diagram of the MC703 CDMA EV-DO module................................................... 11 Figure 2-1 Dimensions of the RF connector........................................................................................................16 Figure 2-2 RF connector......................................................................................................................................17 Figure 3-1 Power-on process of the MC703 CDMA EV-DO module.................................................................21 Figure 3-2 Normal power-off process of the MC703 CDMA EV-DO module....................................................22 Figure 3-3 Reset process of the MC703 CDMA EV-DO module........................................................................23 Figure 3-4 Recommended circuit for the ESD protection on the antenna interface............................................25 Figure 3-5 Recommended circuit for ESD protection on the RUIM card interface............................................25 Figure 4-1 Connections between the DCE and DTE........................................................................................... 28 Figure 4-2 Connections between the serial interface and the 3 V single-chip microcontroller ...........................29 Figure 4-3 Connections for the 3-wire serial interface........................................................................................29 Figure 4-4 Electrical connections for the 9-wire serial interface with the flow control function........................30 Figure 4-5 Circuits of the RUIM card interface .................................................................................................. 31 Figure 4-6 Sequence of the pins of the RUIM card.............................................................................................31 Figure 4-7 Sequence of the pins of a RUIM card seat.........................................................................................31 Figure 4-8 Circuits of the first audio interface ....................................................................................................33 Figure 4-9 Connections between the MC703 CDMA EV-DO module and the 8-ohm speaker...........................33 Figure 4-10 Reference circuits for the design of the LDO power supply............................................................34 Figure 4-11 Reference circuits of the design of the ADC interfaces ...................................................................35 Figure 4-12 Recommended circuits of the LED pins..........................................................................................36 Figure 4-13 Sequence of the pins on the MC703 CDMA EV-DO module.......................................................... 37 Figure 5-1 Mechanical dimensions of the MC703 CDMA EV-DO module (unit: mm)......................................39 Figure 5-2 Recommended shape of the toaling hole close to the B2B connector on the user application board 40 Figure 5-3 Mechanical dimensions of the MU103 module.................................................................................40 Figure 5-4 HRS DF12(3.0)-60DS-0.5V(86) connector on the MC703 CDMA EV-DO module.........................41 Figure 5-5 HRS DF12(3.0)-60DP-0.5V(86) mating header on the user board....................................................41
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 7 of 45Figure 5-6 Dimensions of the connector on the MC703 CDMA EV-DO module (unit: mm).............................42 Figure 5-7 Dimensions of the connector pad on the user interface board of the MC703 CDMA EV-DO module..............................................................................................................................................................................42
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 8 of 45Tables Table 1-1 Product features...................................................................................................................................10 Table 2-1 Functions of the signals on the signal connector interface .................................................................. 12 Table 2-2 RF performance of the main diversity antenna interface..................................................................... 17 Table 2-3 RF performance of the diversity antenna and GPS antenna interface .................................................17 Table 3-1 Extreme application values of the MC703 CDMA EV-DO module....................................................18 Table 3-2 Temperature ranges of the MC703 CDMA EV-DO module................................................................19 Table 3-3 Levels of the I/O interfaces on the MC703 CDMA EV-DO module (VDD_PX = 2.6 V) ....................... 19 Table 3-4 Input power supply range of the MC703 CDMA EV-DO module ......................................................19 Table 3-5 Operating current of the MC703 CDMA EV-DO module (TBD) .......................................................20 Table 3-6 Parameters in the power-on process and power-off process................................................................22 Table 3-7 VCOIN pin for the input of the RTC power supply.............................................................................23 Table 3-8 Parameters of the RTC power supply pin............................................................................................ 23 Table 3-9 Conditions and results of the part mechanical reliability tests.............................................................24 Table 3-10 ESD performance ..............................................................................................................................25 Table 4-1 Signals on UART1 of the MC703 CDMA EV-DO module.................................................................28 Table 4-2 Pins of the RUIM card interface..........................................................................................................30 Table 4-3 Signals of the audio interfaces............................................................................................................. 32 Table 4-4 Signals of the USB interface................................................................................................................34 Table 4-5 Signals of the GPIO interfaces ............................................................................................................34 Table 4-6 Status of the LEDs...............................................................................................................................36 Table 5-1 DF12 series that are compatible with the MC703 CDMA EV-DO module.........................................41
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 9 of 451 Product Overview 1.1 About This Chapter is  Access (CDMA) Evolution-Data Only (EV-DO) module, with the following information included: z Functions of the MC703 CDMA EV-DO Module 1.2 Functio s 1900 MHz ositioning System (GPS), optional  data, and supplementary services interfaces including the following: 2. nterface interface (supporting the 3.0 V nna connector z Supporting the standard AT command set and the extended AT command set of Huawei estriction of Hazardous Substances (RoHS) certification The feat C703 CDMA EV-DO module. Th  chapter provides an overview of the MC703 Code Division Multiplez Application Block Diagram of the MC703 CDMA EV-DO Module n  of the MC703 CDMA EV-DO Module The MC703 CDMA EV-DO module has the following functions:z Supporting the frequency bands of CDMA 800 MHz and/or CDMA z Supporting the diversity receiving antenna z Supporting the Global Pz Supporting voice, short message,z Providing various user signal 1. Power supply interface One 9-wire serial i3. Two analog audio interfaces 4. One Removable User Identity Module (RUIM) card RUIM card)   5. One full-speed Universal Serial Bus (USB) 2.0 interface 6. Eight General Purpose Input/Output (GPIO) interfaces 7. Two Analog-to-Digital Converter (ADC) interfaces z Providing two kinds of antenna interfaces: antenna pad and antez Complying with the Rable 1-1 shows t ures of the M
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 10 of 45Table 1-1 Product features Product Feature  Description CDMA: Double bands including 800 MHz and 1900 MHz Frequency bands GPS: 1574.42 MHz to 1576.42 MHz Technical standards   CDMA 2000 1XRTT   Compatible to CDMA IS-95 A/B 800/1900MHz CDMA 2000 1x EV-DO Rev.0 800/1900 MHzCDMA 2000 1x EV-DO Rev.A 800/1900 MHzMaximum transmit power CDMA 800 MHz: +23 dBm (Power Class 3) CDMA 1900 MHz: +23 dBm (Power Class 2) Normal operation temperature: –30  to +75℃℃ Extended operation temperature: –35  to +80℃℃ Operating temperature  to +90℃ Storage temperature: –40℃Power supply voltage   3.8 V is recommended.) 3.4 V to 4.2 V (The voltage ofShutdown mode: < 10 uA Standby mode: < TBD mA Power consumption (current) maximum power consumption: < 680 mA Operating current under the Data services   3.1 Mbit/s and UL 1.8 Mbit/s EV-DO Rev.A data services of up to DLAT commands  Standard AT command set Extended AT command set of Huawei One 9-wire Universal asynchronous receiver-transmitter (UART) interface One standard RUIM card interface (3 V) Eight GPIO interfaces One hardware reset in60-pin board-to-board (BTB) connector terface Two analog audio interfaces Two ADC interfaces Power supply interface Supporting the main antenna interface and receiving diversity antenna interface  with the receiving diversity antenna.) (The GPS antenna shares the connectorAntenna interfaces Astron 51-3612-50-H RF connector and antenna pad Voice services  FR, EFR, HR, and AMR voice coding Mobile Originated (MO) and Mobile Terminated (MT) Point-to-point broadcast and cell broadcast Short message service (SMS) essages in text mode Short m
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 11 of 45Product Feature  Description Supplementary services  Caller ID display, call forwarding, call holding, call waiting, and three-way calling Physical characteristics   Weight: 9.8±0.2 g Dimensions: 31 mm x 45 mm x 5 mmRoHS  Complying with the RoHS standards CE certification  Complying with the Conformite Europeenne (CE) standards (CE0168)  1.3 Application Block Diagram of the MC703 CDMA EV-DO Module O module. Figure 1-1 shows the application block diagram of the MC703 CDMA EV-DFigure 1-1 Application block diagram of the MC703 CDMA EV-DO module
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 12 of 452 Interface Description 2.1 About This Chapter gnal interfaces of the MC703 CDMA EV-DO module, with the following interfaces included: z Signal Connector Interface 2.2 Signal Connector Interface 2.2.1 Interface Signle adopts the 60-pin B2B connector as the external signal interface. l connector interface of the M 3   mo . Table 2- ns of the signals o tor interface This chapter describes the siz Antenna Interfaces als The MC703 CDMA EV-DO moduTable 2-1 shows the function definition of the signals on the signaC70 CDMA EV-DO dule1 Functio n the signal connecNo.  Signal Name  IO  Function  Remarks 1  VBAT  pply input  he voltage ranges from 3.4  P  Power su TV to 4.2 V. The voltage of 3.8V is recommended. 2 GND  P Ground   3  VBAT  pply input  he voltage ranges from 3.4  P  Power su TV to 4.2 V. The voltage of 3.8V is recommended. 4 GND  P Ground   5  VBAT  pply input  he voltage ranges from 3.4  P  Power su TV to 4.2 V. The voltage of 3.8V is recommended.
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 13 of 45No.  Signal Name  IO  Function  Remarks 6 GND  P Ground   7  VBAT  P  Power supply input  The voltage ranges from 3.4 V to 4.2 V. The voltage of 3.8 V is recommended. 8 GND  P Ground   9  VBAT  P  Power supply input  The voltage ranges from 3V to 4.2 .4 V. The voltage of 3.8 V is recommended. 10 GND  P  Ground   11 MODE_LED  AO Mode indicator  This pin is a current sink output. 12  VCOIN  P  Input of the backup power supply  This pin can be connected to a e capacitance.button-type battery or a capacitor of larg13 STATUS_LED  AO Status indicator  current sink This pin is a output. 14  VREG_MSMP  P  Output of the 2.6 V voltage  es voltage for See Note 1. This pin providperipherals. 15  NC  -  -  be left unconnected. This pin must 16 RESET_N  DI Reset  Active low. 17  NC  -  -  be left unconnected. This pin must 18 TERM_ON  DI  Active low. Power-on 19  NC  -  -  This pin must be left unconnected. 20  UART1_RTS  DO Request To Send (RTS) signal of   UART1  21  FORCE_LOAD_N ctive low. DI  Force-load signal  A22  UART1_RING  DO Ringing signal of UART1   23  UART1_RD  DI  RD signal of UART1   24  UART1_DSR  DO eady (DSR) signal of UART1  Data set r25 GPIO_7  IO GPIO 7   26  UART1_CTS  DO d (CTS) signal of UART1  Clear to Sen
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 14 of 45No.  Signal Name  IO  Function  Remarks 27  UART1_TD  DO TD signal of UART1   28  UART1_DTR  DI  eady (DTR) signal  UART1  Data terminal rof29 GPIO_8  IO GPIO 8   30  UART1_DCD  DO Data carrier detect (DCD) signal 1  of UART31  NC  -  -  This pin must be left unconnected. 32 GPIO_1  IO GPIO 1   33 GPIO_2  IO GPIO 2   34 MODULE_WAKEUP  wake up the module by the host DI  Signal to  35 GPIO_3  IO GPIO 3   36  USB_D-  IO  USB data signal, negative   37 GPIO_4  IO   GPIO 4 38  USB_D+  IO  USB data signal, positive   39 GPIO_5  IO GPIO 5   40 HOST_WAKEUP DO wake up the host by the   Signal to module 41 GPIO_6  IO GPIO 6   42  RUIM_CLK  DO Clock signal of the RUIM   interface 43  I2C_SCL  IO  Clock signal of the I2C bus  Reserved 44  VREG_RUIM  P  Power supply of the RUIM interface  45  I2C_SDA  IO  Data signal of the I2C bus  Reserved 46  RUIM_IO  IO  Data signal of the RUIM interface  47  EAR1_N  AO output of the first audio interface  Negative pole of the 48  RUIM_RST  DO Reset signal of the RUIM interface  49  EAR1_P  AO utput of the first audio interface Positive pole of the o  50 RUIM_IN  DI Signal for detecting the presence   of the RUIM card
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 15 of 45No.  Signal Name  IO  Function  Remarks 51  MIC1_N  AI  Negative pole of the input of the first audio interface See section 4.4 "Audio Interfaces." 52 GND  P Ground   53  MIC1_P  AI  Positive pole of the input of the first audio interface  54  SPKR_OUT_N  e second audio interface AO Negative pole of the output of th  55 GND  P Ground   56  SPKR_OUT_P  AO Positive pole of the output of the   second audio interface 57  ADC_1  AI  Input of the first ADC channel  The input voltage ranges from  V to 2.6 V. 058  MIC2_N  AI  Negative pole of the input of the second audio interface  59  e ranges from ADC_2  AI  Input of the second ADC channel  The input voltag0 V to 2.6 V. 60 AI  Positive pole of the input of the second audio interface    MIC2_P NOTE Note 1:   pin exports the voltage of 2.6 V with the capability of 50 mA. Note 2:  IO: Digital Input/Digital Output.   2.3 Antenn2.3.1 AntenThe MC703 CDMA EV-DO module supports the main antenna interface and the diversity antenna interface. Both of these two antenna interfaces include two connection types, a RF connector and an antenna pad. Either of these two antenna connection types can be selected for use. The selected cable and antenna must have an impedance of 50 ohm.   The VREG_MSMPTerms description: AI: Analog Input.   AO: Analog Output. P: Power/Ground.   DI: Digital Input.   DO: Digital Output. NC: Not Connected. a Interfaces na Interface Circuits
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 16 of 45The MC703 CDMA EV-DO module adopts the 51-3612-50-H RF connector supplied by Astron. Figure 2-1 shows the dimensions of the RF connector. Figure 2-1 Dimensions of the RF connector   Figure 2-2 shows the RF connector. The two interfaces on the RF connector are pointed by the red arrows. The antenna pad is located at the bottom of the RF connector. A coaxial cablebe soldere  can d on the antenna pad for connecting an external antenna to the MC703 CDMA The RF connector and antenna pad can only be applied alternatively. When using the antenna pad, make sure that the surface of the soldering points is smooth to reduce the impact of the soldering on RF signals. EV-DO module. The interface marked with M is the main diversity antenna interface and the interface marked with A is the interface used by both the diversity antenna and the GPS antenna.
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 17 of 45Figure 2-2 RF connector   Table 2-2 and Table 2-3 show the RF performance of the antenna interfaces. Table 2-2 RF performance of the main diversity antenna interface Frequency Range (MHz)  Maximum Transmit Power (dBm)  Receiving Sensitivity of the Antenna Interface (dBm) Frequency Band Uplink  Downlink  Minimum Value Typical Value Maximum Value Minimum Value Typical Value Maximum Value CDMA 800  824 to 849  869 to 894  23  24.5  26  /  –107.5  –106 CDMA 1900  1850 to 1910  1930 to 1990  23  24.5  26  /  –107.5  –106  Table 2-3 RF performance of the diversity antenna and GPS antenna interface Frequency Band Frequency Range (MHz) Receiving Sensitivity of the Antenna Interface (dBm) CDMA 800  869 to 894  <  –106 CDMA 1900  1930 to 1990  <  –106 GPS 1575.42  <  –155.8 (50% Time)  The antenna whose gain value is less than 1 dBi is recommended. According to the layout of the circuit board, adjust the reference value of each component. You can connect an inductor of 68 nH to 100 nH for electrostatic discharge (ESD) protection to the ground. Pay special attention to the impedance matching of the antenna and ESD protection capability or lightning protection capability.
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 18 of 453 Electrical Features of the Interfaces 3.1 About This Chapter es of the interfaces of the MC703 CDMA EV-DO d es included: e Temperature O Interface ly Features z z  This chapter describes the electrical featurmo ule with the following featurz Application Extremes z Operating and Storagz Levels of the I/z Power SuppReliability Features ESD Features  the electrical features of the external interfaces of the MC703 CDMA 3.2 Applic module. When e may be caused to t D odule. T Extre e 3 CDMA EV- odule This chapter describes mainlyEV-DO module. ation Extremes Table 3-1 shows the extreme application values of the MC703 CDMA EV-DOa voltage lower or higher than the limit values is used, a permanent damaghe MC703 C MA EV-DO mable 3-1 me application values of th  MC70 DO mParameter  Description  Minimum Value  Maximum Value  Unit VBAT    age of the MC703 CDMA EV-DO module –0.5  5.0 V Input voltVIN  Input voltage of the I/O interface –0.5  5.0 V
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 19 of 453.3 OperatTa ws the temperature ranges ofTf the MC703 CDMA EV-DO moing and Storage Temperature ble 3-2 sho  the MC703 CDMA EV-DO module. able 3-2 Temperature ranges o dule Parameter  Minimum Value  Maximum Value  Unit Normal operating temperature  –30  75 ℃ Extended operating temperature  –35  80  ℃ Storage temperature  –40  90  ℃  3.4 Levels Ta nterfaces CDMTable 3-3 Leve on the M DMA EV-DO  (V PX =  V) of the I/O Interface ble 3-3 shows the levels of the I/O i  on the MC703  A EV-DO module.   ls of the I/O interfaces  C703 C  module DD_ 2.6 Parameter  Description  M um Valueinim   Maximum Value  Unit VIH High-level input voltage  0.65 x VDD_PX X + 0.3 VDD_P V VIL Low-level input voltage  –0.3  5 x VDD_PX0.3 V VOH t voltage  VDD_PX – 0.45  VDD_PX V High-level outpuVOL e  45 Low-level output voltag 0  0. V IIH Current leakage during high-level input - 1 µA IIL Current leakage during low-level input –1  - µA CIN Input capacitance  -  7  pF  3.5 Power 3.5.1 Input PTa ws the  ply ra 703 CD e. le 3-4 Input power supply range of the MC703 CDMA EV-DO module Supply Features ower Supply ble 3-4 sho input power sup nge of the MC MA EV-DO modulTabParameter  Minimum Value  Typical Value  Maximum Value  Unit VBAT 3.4  3.8  4.2  V
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 20 of 45  The time when any interface on the MC703 CDMA EV-DO module is powered on must notbe earlier than the time when the module is pow  ered on. Otherwise, the MC703 CDMA e abnormal or damaged. EV-DO module may b3.5.2 OperaTg curr C70 O moting Current Table 3-5 shows the operating current of the MC703 CDMA EV-DO module. able 3-5 Operatin ent of the M 3 CDMA EV-D dule (TBD)  Operating Mode  Minimum VTypical Value  Maximum Value  Unit alue Idle state  -  - TBD mA Calling state  -  TBD -  mA EV-DO data transmission state -  TBD -  mA Off state  -  TBD TBD  µA
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 21 of 453.5.3 Power-on, Power-off, and Reset Processes When the voltage of the power supplied to the MC703 CDMA EV-DO module is higher than 3.4 V and the TERM_ON pin is driven low for at least 300 ms, the MC703 CDMA EV-DO module can be powered on. Figure 3-1 shows the power-on process of the MC703 CDMA EV-DO module. Figure 3-1 Power-on process of the MC703 CDMA EV-DO module    If the power supply with the lower voltage (for example 3.4 V) is used, the cable connecting the external power supply and the module should be as short as possible and the power supply input should be configured with a capacitor of higher than 1000 µF. Otherwise, the voltage that is actually imported to the MC703 CDMA EV-DO module may be lower than 3.4 V, resulting in the deterioration of RF indicators and unstable operation of the MC703 CDMA EV-DO module. The power-off process is classified into normal power-off and urgent power-off.   Normal power-off An external CPU drives the TERM_ON pin low for more than 3s. Then, the MC703 CDMA EV-DO module is normally powered off. During the normal power-off process, the MC703 CDMA EV-DO module can save information and log out of the network. Figure 3-2 shows the normal power-off process.
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 22 of 45Figure 3-2 Normal power-off process of the MC703 CDMA EV-DO module   Table 3-6 shows the parameters in the power-on process and power-off process. Table 3-6 Parameters in the power-on process and power-off process Parameter  Minimum Value  Typical Value  Maximum Value  Unit tsettle 0.36 6.36 10.36  ms treset0 10.72 26.72 40.72  ms treset1 400 500 600  ms toff 7.27 10.6 15.6  ms  Urgent power-off An external CPU sends the AT%MSO command to the MC703 CDMA EV-DO module to directly cut off the power supply to the VBAT pin. Then, the MC703 CDMA EV-DO module can be directly powered off.   During the urgent power-off process, the MC703 CDMA EV-DO module cannot perform the operation of logging out of the network.  For the details about the AT%MSO command, refer to the HUAWEI MC703 Wireless Module AT Command Interface Specification.  When the RESET_N pin is driven low for 50 ms, the MC703 CDMA EV-DO module can be reset. Figure 3-3 shows the reset process of the MC703 CDMA EV-DO module.
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 23 of 45Figure 3-3 Reset process of the MC703 CDMA EV-DO module    The RESET_N pin is sensitive to interference. Therefore, the lines on the interface board of the MC703 CDMA EV-DO module should be not longer than 2 cm. Otherwise, the MC703 CDMA EV-DO module may be reset because of interference. 3.5.4 RTC Power Supply The power supply pin for the real-time clock (RTC) can obtain current from the VBAT pin through software enabling to charge the backup battery of the RTC. The power supply input is monitored by a CPU. The MC703 CDMA EV-DO module defines the VCOIN pin for the input of the backup power supply on the 60-pin B2B connector to implement the power supply input for the RTC. Table 3-7 VCOIN pin for the input of the RTC power supply PIN  Name  I/O Function  Remarks 12  VCOIN  P  Input of the backup power supply This pin is connected to a button-type battery or a capacitor of large capacitance.  If the RTC backup battery is not used, you can connect the pin to the primary power supply, or use an electrolytic capacitor of large capacitance. Table 3-8 Parameters of the RTC power supply pin
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 24 of 453.6 Reliability Features Table 3-9 shows the conditions and results of the part mechanical reliability tests performed on the MC703 CDMA EV-DO module. Table 3-9 Conditions and results of the part mechanical reliability tests Test Item  Test Condition  Test Standard Random vibration  Frequency range: 5 Hz to 20 Hz, PSD: 1.0 m²/s3; Frequency range: 20 Hz to 200 Hz,  –3 dB/oct; Three axial directions with one hour for each direction IEC 68-2-6 Shock test  Half sine wave shock Acceleration: 20 g Shock period: 11 ms Six axial directions with one shock in each direction (± x, y, and z) TIA/EIA 603 3.3.5 GB/T15844.2 4.1 Temperature shock    Low temperature:  –40°C±2°C High temperature: 85°C±2°C Changeover time: < 30s   Test duration: 1 hour Repetition times: 100 IEC 68-2-14 Na Damp heat cyclic  High temperature: 55°C±2°C Low temperature: 25°C±2°C Humidity: 95% Repetition times: 4 Test duration: 12 hours + 12 hours IEC 68-2-30 Db Low-temperature operation Temperature:  –30°C±2°C Test period: 24 hours IEC 68-2-1 Ab   High-temperature operation Temperature: 75°C±2°C Test period: 24 hours IEC 68-2-2 Bb Low-temperature storage Temperature: –60°C±2°C Test period: 24 hours IEC 68-2-1 Ab High-temperature storage Temperature: 90°C±2°C Test period: 24 hours IEC 68-2-2 Bb Salt spray test  Temperature: 35°C Density of the NaCl solution: 5%±1% Spraying duration: 48 hours Duration of exposing the module to the temperature of 35 ºC: 16 hours IEC 68-2-11
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 25 of 453.7 ESD Features 3.7.1 Overview When the MC703 CDMA EV-DO module is in use, the ESD protection should be considered. The ESD performance of the MC703 CDMA EV-DO module has been tested according to the EN61000-4-2 standard. Table 3-10 shows the test results. Table 3-10 ESD performance Interface  Air Discharge  Contact Discharge RUIM card interface  ±8000 V  ±4000 V USB interface  ±8000 V  ±4000 V  3.7.2 ESD Protection on the Antenna Interface The antenna interface of the MC703 CDMA EV-DO module is sensitive to ESD. Poor ESD protection may cause permanent damage to internal RF components. Figure 3-4 shows the recommended circuit for the ESD protection on the antenna interface.   Figure 3-4 Recommended circuit for the ESD protection on the antenna interface   3.7.3 ESD Protection on the RUIM Card Interface Figure 3-5 shows the recommended circuit for the ESD protection on the RUIM card interface of the MC703 CDMA EV-DO module. The transient voltage suppressor (TVS) diode should be placed as close to the RUIM card seat as possible. Figure 3-5 Recommended circuit for ESD protection on the RUIM card interface
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 26 of 45
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 27 of 454 Interface Applications 4.1 About This Chapter pplications of the interfaces of the MC703 CDMA EV-DO module, th rfaces included: d Interface  terface  z ADC Interfaces z Status Indication Pins 4.2 UART Interface  a rol function and a maximum transmission rate UART1 supports programmable data width, data stop bit, and parity check (or no parity check). In addition, UART1 supports a maximum baud rate of 230.4 kbps and a default baud rate of 115.2 kbps. The set baud rate can be saved even if the interface is powered off. This chapter describes the awi  the following intez UART Interface z RUIM Carz Audio Interfacesz Power Supply Inz USB Bus z GPIO Interfacez Pin Sequence The MC703 CDMA EV-DO module has one UART interface, that is, UART1. UART1 is9-wire serial interface supporting the flow contof 4 Mbit/s. UART1 supports data services. You can set up the Point-to-Point Protocol (PPP) dial-up connection for data services through UART1.
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 28 of 45Figure 4-1 Connections between the DCE and DTE   Table 4-1 shows the definitions of the interface signals. Table 4-1 Signals on UART1 of the MC703 CDMA EV-DO module Pin Number Signal Name  Description  Feature  Direction 27  UART1_TD    Data transmission end of the module The Date Terminal Equipment (DTE) receives serial data. DCE–DTE 23  UART1_RD  Data receiving end of the module The DTE transmits serial data. DTE–DCE 22 UART1_RING Ringing indication of the module The DTE is notified of a remote call. DCE–DTE 20 UART1_RTS RTS on the module  The DTE notifies the Data Communications Equipment (DCE) of sending requests. DCE–DTE 28 UART1_DTR DTR on the module  The DTE is ready.  DTE–DCE 24 UART1_DSR DSR on the module    The DCE is ready.  DCE–DTE 26 UART1_CTS CTS on the module  The DCE switches to the receiving mode.   DTE–DCE 30 UART1_DCD DCD on the module  Data links are connected.  DCE–DTE
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 29 of 45When MC703 CDMA EV-DO module is connected to a 3V single-chip microcontroller. a 1000-ohm resistor should be added between the pin UART1_RD and the pin TXD of the microcontroller. Figure 4-2 Connections between the serial interface and the 3 V single-chip microcontroller   You can use a Category 232 chip to connect the MC703 CDMA EV-DO module to a standard RS-232-C interface. In the case of a 3-wire serial interface, the MAX3232 chip is recommended. The UART1-RD pin of the module connects to the TXD pin of the DTE after being converted through the MAX3232 chip, and the TXD pin of the DTE connects to the UART1_TD pin of the module after being converted through the MAX232 chip. Figure 4-3 Connections for the 3-wire serial interface   In the case of a full-serial interface, the MAX3232, SP3238, or MAX3238 chip is recommended.
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 30 of 45Figure 4-4 Electrical connections for the 9-wire serial interface with the flow control function   4.3 RUIM Card Interface The MC703 CDMA EV-DO module can connect to a 3 V or a 1.8 V RUIM card. Table 4-2 shows the signals of the RUIM card interface. The level of the RUIM card interface is 3 V or 1.8 V. Table 4-2 Pins of the RUIM card interface Pin Number  Signal Name  Description 44  VREG_RUIM  Power supply of the RUIM card 48  RUIM_RST  Reset signal of the RUIM card 42  RUIM_CLK  Clock signal of the RUIM card 46  RUIM_IO  Data signal of the RUIM card  GND  Ground
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 31 of 45Figure 4-5 Circuits of the RUIM card interface   Figure 4-6 Sequence of the pins of the RUIM card     Figure 4-7 Sequence of the pins of a RUIM card socket   The typical rate of the RUIM card interface is about 3.25 MHz. Therefore, the RUIM card seat should be as close to the module interface as possible and the line should not exceed 10 cm. This prevents the communications quality of signals from being affected by serious waveform distortion because of too long lines. Ground lines should be used to enclose the lines used for transmitting RUIM_CLK signals and RUIM_IO signals. To filter out the interference from antenna signals, you need to add a 0.1µF or a 0.22µF capacitor to the RUIM_VCC signal and a 33pF capacitor to the RUIM_CLK, RUIM_IO, and RUIM_RST signals based on the GND network. In addition, you need to add TVS diodes to
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 32 of 45these four signals for ESD protection. The TVS diodes should be placed as close to the RUIM card socket as possible. 4.4 Audio Interfaces The MC703 CDMA EV-DO module provides two audio channels and each channel includes one input and one output interfaces. Table 4-3 shows the signals of the audio interfaces.   Table 4-3 Signals of the audio interfaces Pin Number  Signal Name  Description 51  MIC1_N  Negative pole of the input of the first audio interface 53  MIC1_P  Positive pole of the input of the first audio interface 47  EAR1_N  Negative pole of the output of the first audio interface 49  EAR1_P  Positive pole of the output of the first audio interface 58  MIC2_N  Negative pole of the input of the second audio interface 60  MIC2_P  Positive pole of the output of the second audio interface 54  SPKR_OUT_N  Negative pole of the output of the second audio interface 56  SPKR_OUT_P  Positive pole of the output of the second audio interface  The input and output signals on the first audio interface are fully differential and thus have good performance of resisting RF interference. This audio interface can be used in handset connection mode without any external audio frequency amplifier (AFA). As the audio signals are in differential pairs, the lines on the printed circuit board (PCB) should be equidistantly laid in parallel with each other. The lines should be as short as possible, the filter circuits of the two sides should be symmetric, the differential pair signals should be close to each other, and the grounding is required. The differential pair signals of the audio output and the differential pair signals of the audio output should be effectively separated through grounding. In addition, the signals should be away from the circuits of the power supply, RF, and antenna.   Differentiate and isolate functional modules during PCB design of the application board which the MC703 CDMA EV-DO module is applied on.
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 33 of 45Figure 4-8 Circuits of the first audio interface   Differential signals are transmitted on the first audio interface. By reserving a place for the resistor in the loop, you can adjust the quality and volume of the voice. It is recommended that you place a TVS on the related interface to provide protection against ESD and protect components such as the internal integrated circuit (IC) component. The output signals of the second audio interface can directly drive an 8-ohm speaker. Figure 4-9 Connections between the MC703 CDMA EV-DO module and the 8-ohm speaker   4.5 Power Supply Interface An external power supply with the voltage of 3.3 V to 4.2 V (the typical value is 3.8 V) powers the MC703 CDMA EV-DO module through the VBAT pin. When the network signals are weak, the antenna transmits signals with the highest power and the maximum transient current can be up to 1.1A. In this case, it is recommended that you use a low dropout (LDO) regulator or a switching-mode power supply whose current is higher than 1.1 A.   Considering the voltage drop that may occur during the transmission with high power, you can add a large capacitor on the power supply interface of the module. The electrolytic capacitor of over 220 µF is recommended.
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 34 of 45Figure 4-10 Reference circuits for the design of the LDO power supply   4.6 USB Bus Working with the drives of a PC, the USB interface can be mapped to a serial interface of the PC. The USB interface is mainly used for updating module applications, capturing software logs, and testing module applications.   Table 4-4 Signals of the USB interface Pin Number  Signal Name  Description 36 USB_D-  USB data line 38 USB_D+  USB data line  4.7   GPIO Interface The MC703 CDMA EV-DO module supports up to eight GPIO interfaces. Table 4-5 shows the signals of the GPIO interfaces. Table 4-5 Signals of the GPIO interfaces Pin Number  Signal  I/O  Description 32 GPIO_1  I/O GPIO 1 33 GPIO_2  I/O GPIO 2 35 GPIO_3  I/O GPIO 3 37 GPIO_4  I/O GPIO 4 39 GPIO_5  I/O GPIO 5 41 GPIO_6  I/O GPIO 6
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 35 of 45Pin Number  Signal  I/O  Description 25 GPIO_7  I/O GPIO 7 29 GPIO_8  I/O GPIO 8  4.8 ADC Interfaces The MC703 CDMA EV-DO module supports two ADC interfaces for monitoring analog variables, such as the environmental temperature variable. Figure 4-11 Reference circuits of the design of the ADC interfaces    4.9 Status Indication Pins 4.9.1 LED Circuits The MC703 CDMA EV-DO module supplies two signals which can be used to light the LEDs. One LED indicates the network mode and the other LED indicates the signal status. The LEDs are controlled by the current sink. The high voltage is the voltage of VBAT (with the typical value of 3.8 V). Table 4-6 shows the status of the LEDs.
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 36 of 45Table 4-6 Status of the LEDs Operating Mode of the MC703 CDMA EV-DO Module  LED Status The module is searching for a network or no network is available. The LED flashes once. (The LED is on for 100 ms and off for 0.9s. Each cycle lasts 1s.) The module finds out a 2G network.  The LED flashes once. (The LED is on for 100 ms and off for 1.9s. Each cycle lasts 2s.) The module finds out a 3G network.  The LED flashes once. (The LED is on for 100 ms and off for 2.9s. Each cycle lasts 3s.) The module is processing the CDMA 1X data services through the dial-up service. The LED flashes twice. (The LED is on for 100 ms and off for 300 ms, and then on for 100 ms and off for 1.5s. Each cycle lasts 2s.) The module is processing the EV-DO data services through the dial-up service. The LED flashes twice. (The LED is on for 100 ms and off for 200 ms, and then on for 100 ms and off for 600 ms. Each cycle lasts 1s.) The module is in factory test mode (FTM).  The LED flashes slowly. (The LED is on for 1s and off for 1s. Each cycle lasts 2s.) The module is upgrading software.  The LED flashes quickly. (The LED is on for 100 ms and off for 100 ms. Each cycle lasts 0.2s.)  Figure 4-12 shows the recommended circuits of the LED pins. Figure 4-12 Recommended circuits of the LED pins
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 37 of 454.10 Pin Sequence Figure 4-13 shows the sequence of the pins on the 60-pin B2B connector of the MC703 CDMA EV-DO module. Figure 4-13 Sequence of the pins on the MC703 CDMA EV-DO module 605921
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 38 of 455 Mechanics 5.1 Overview the MC703 CDMA EV-DO module, with the following dimensions included: z Mechanical Dimensions of the MC703 CDMA EV-DO Module 5.2 Mechanical Dimensions of the MC703 CDMA EV-DO Module Weight: 9.8 (±0.2) g Figure 5-1 shows the mechanical dimensions of the MC703 CDMA EV-DO module. This chapter describes the mechanical dimensions of z Mechanical Dimensions of the B2B Connector Dimensions: 31±0.20 mm x 45±0.20 mm x 5±0.20 mm
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 39 of 45Figure 5-1 Mechanical dimensions of the MC703 CDMA EV-DO module (unit: mm)    If the MC703 CDMA EV-DO module is required to be compatible with other products, such as the MU103 module, it is recommended that the mounting hole close to the B2B connector on the user application board should be designed to be track-shaped, as shown in Figure 5-2.
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 40 of 45Figure 5-2 Recommended shape of the toaling hole close to the B2B connector on the user application board   Figure 5-3 Mechanical dimensions of the MU103 module   5.3 Mechanical Dimensions of the B2B Connector The MC703 CDMA EV-DO module adopts the DF12(3.0)-60DS-0.5V(86) 60-pin B2B connector supplied by HRS, with the pin spacing of 0.5 mm, the stacking height of 3 mm, and pluggable times of less than 50. The connector can be mated with the DF12(3.0)-60DP-0.5V(86), DF12(3.5)-60DP-0.5V(86), DF12(4.0)-60DP-0.5V(86), and DF12(5.0)-60DP-0.5V(86) supplied by HRS.
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 41 of 45Figure 5-4 HRS DF12(3.0)-60DS-0.5V(86) connector on the MC703 CDMA EV-DO module   Figure 5-5 HRS DF12(3.0)-60DP-0.5V(86) mating header on the user board   Table 5-1 DF12 series that are compatible with the MC703 CDMA EV-DO module Product  Model  Stacking Height (mm) HRS Number Connector used on the MC703 CDMA EV-DO module DF12(3.0)-60DS-0.5V(86) 3.0 537-0611-1-86 Headers on the interface board  DF12(3.0)-60DP-0.5V(86) 3.0  537-0731-3-86
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 42 of 45Figure 5-6 Dimensions of the connector on the MC703 CDMA EV-DO module (unit: mm)   For more information about the connectors of Hirose, access http://www.hirose-connectors.com. Figure 5-7 Dimensions of the connector pad on the user interface board of the MC703 CDMA EV-DO module
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 43 of 45
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 44 of 45A Acronyms and Abbreviations AMR Adaptive Multi-rate BER Bit Error Rate BTS  Base Transceiver Station B2B Board-to-Board Connector CSD  Circuit Switched Data   DSP Digital Signal Processor DCE  Data circuit-terminating equipment DTE Data terminal equipment DTR  Data Terminal Ready DTX Discontinuous Transmission EFR  Enhanced Full Rate   EGSM Enhanced GSM EMC Electromagnetic Compatibility ESD Electrostatic Discharge  GMSK    imum Shift Keying Gaussian MinIMEI  ty International Mobile Equipment IdentiI/O Input/Output ISO International Standards Organization ITU International Telecommunications Union kbps kbits per second LED   Light Emitting DiodeMO   Mobile Originated  MT Mobile Terminated
  MC703 CDMA EV-DO Wireless Module Product Description Issue 1.00 (2009-08-24)  Huawei Proprietary and Confidential Page 45 of 45NTC Negative Temperature Coefficient PCS  Personal Cellular System PCL Power Control Level PCS  Personal Communication System PPP Point-to-point protocol   QPSK Quadrate Phase Shift Keying RTC Real Time Clock UART  Universal asynchronous receiver-transmitter   EV-DO Evolution-Data Only VSWR  Voltage Standing Wave Ratio

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