Huawei Technologies ME309-562 eMTC Module User Manual pt 1

Huawei Technologies Co.,Ltd eMTC Module pt 1

User Manual pt 1

HUAWEI ME309-562 eMTC LGA Module Hardware Guide Issue 03 Date 2017-07-18
Copyright © Huawei Technologies Co., Ltd. 2015. All rights reserved. No part of this manual may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd. and its affiliates ("Huawei"). The product described in this manual may include copyrighted software of Huawei and possible licensors. Customers shall not in any manner reproduce, distribute, modify, decompile, disassemble, decrypt, extract, reverse engineer, lease, assign, or sublicense the said software, unless such restrictions are prohibited by applicable laws or such actions are approved by respective copyright holders. Trademarks and Permissions , , and are trademarks or registered trademarks of Huawei Technologies Co., Ltd. LTE is a trade mark of ETSI. Other trademarks, product, service and company names mentioned may be the property of their respective owners. Notice Some features of the product and its accessories described herein rely on the software installed, capacities and settings of local network, and therefore may not be activated or may be limited by local network operators or network service providers. Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Huawei reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability. DISCLAIMER ALL CONTENTS OF THIS MANUAL ARE PROVIDED “AS IS”. EXCEPT AS REQUIRED BY APPLICABLE LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO EVENT SHALL HUAWEI BE LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, OR LOSS OF PROFITS, BUSINESS, REVENUE, DATA, GOODWILL SAVINGS OR ANTICIPATED SAVINGS REGARDLESS OF WHETHER SUCH LOSSES ARE FORSEEABLE OR NOT. THE MAXIMUM LIABILITY (THIS LIMITATION SHALL NOT APPLY TO LIABILITY FOR PERSONAL INJURY TO THE EXTENT APPLICABLE LAW PROHIBITS SUCH A LIMITATION) OF HUAWEI ARISING FROM THE USE OF THE PRODUCT DESCRIBED IN THIS MANUAL SHALL BE LIMITED TO THE AMOUNT PAID BY CUSTOMERS FOR THE PURCHASE OF THIS PRODUCT. Import and Export Regulations Customers shall comply with all applicable export or import laws and regulations and be responsible to obtain all necessary governmental permits and licenses in order to export, re-export or import the product mentioned in this manual including the software and technical data therein. Privacy Policy To better understand how we protect your personal information, please see the privacy policy at http://consumer.huawei.com/privacy-policy.
HUAWEI ME309-562 eMTC LGA Module Hardware Guide About This Document Revision History Document Version Date Chapter Descriptions 01 2017-03-23 - Draft release 02 2017-05-26 - 1.Cancel SPI/I2C function; 2.Cancel wake_up out function, use RING to replace it; 3.Update the pin map interface picture because the change above. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 3
HUAWEI ME309-562 eMTC LGA Module Hardware Guide Contents 1 Introduction.................................................................................................................................... 5 2 Overall Description ...................................................................................................................... 6 2.1 About This Chapter ........................................................................................................................... 6 2.2 Function Overview............................................................................................................................ 6 2.3 Circuit Block Diagram ....................................................................................................................... 7 2.4 Application Block Diagram ............................................................................................................... 8 3 Description of the Application Interfaces .............................................................................. 10 3.1 About This Chapter ......................................................................................................................... 10 3.2 LGA Interface ................................................................................................................................. 10 4 Mechanical Specifications ......................................................................................................... 20 4.1 About This Chapter ......................................................................................................................... 20 4.2 Storage Requirement ..................................................................................................................... 20 4.3 Moisture Sensitivity ........................................................................................................................ 20 4.4 Dimensions ..................................................................................................................................... 20 4.5 Customer PCB Design ................................................................................................................... 22 4.5.1 PCB Surface Finish ............................................................................................................... 22 4.5.2 PCB Pad Design .................................................................................................................... 22 4.5.3 Solder Mask ........................................................................................................................... 24 4.5.4 Requirements on PCB Layout ............................................................................................... 24 4.5.5 Stencil Design ........................................................................................................................ 24 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 4
HUAWEI ME309-562 eMTC LGA Module Hardware Guide 1 Introduction This document describes the hardware application interfaces and air interfaces provided by HUAWEI ME309-562 eMTC LGA module (hereinafter referred to as the ME309-562 module). This document helps hardware engineer to understand the interface specifications, electrical features and related product information of the ME309-562 module. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 5
HUAWEI ME309-562 eMTC LGA Module Hardware Guide 2 Overall Description 2.1 About This Chapter This chapter gives a general description of the ME309-562 module and provides:  Function Overview  Circuit Block Diagram  Application Block Diagram 2.2 Function Overview Table 2-1 ME309-562 module features Feature Description Physical Dimensions  Dimensions (W × L × H): 18 mm × 24 mm × 2.5 mm  Weight TBD Operating Bands  HD-FDD LTE: Band 2, Band 4, Band 12, Band13 Operating Temperature Normal operating temperature: –30°C to +75°C (Characteristics guaranteed) Extended operating temperature[1]: –40°C to +85°C (Normal working) Storage Temperature –40°C to +95°C Power Voltage 3.3 V to 4.2 V (3.8 V is recommended.) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 6
HUAWEI ME309-562 eMTC LGA Module Hardware Guide Feature Description Application Interface (120-pin LGA interface) GPIO x 5 UART interface (one 8-wire UART0, two 4-wire UART1&UART2, and UART2 is only for debugging) Standard SIM interface ADC interface x 2 SPI interface (software not support) I2C interface (software not support) LED interface x 2 JTAG interface Power supply interface Power on/off interface Hardware reset interface Wake in/out interface Antenna Interface RF antenna pad x 1 Data Services LTE FDD: DL 300kbps; UL 375kbps @1.4MHz BW catM1  [1]: When the ME309-562 module works at –40°C to –30°C or +75°C to +85°C, NOT all its RF performances comply with the 3GPP specifications. 2.3 Circuit Block Diagram Figure 2-1 shows the circuit block diagram of the ME309-562 module. The major functional units of the ME309-562 module contain the following parts:  Baseband controller  Nor flash  RF Circuit Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 7
HUAWEI ME309-562 eMTC LGA Module Hardware Guide Figure 2-1 Circuit block diagram of the ME309-562 module 2.4 Application Block Diagram Figure 2-2 Application block diagram of the ME309-562 module UART Interface: The module supports 3 UART interfaces. Two are 4-wire UARTs, and the other one is 8-wire UART. Uart02 is only for debugging. SIM Interface: The SIM interface provides the interface for a SIM card. GPIO: General Purpose I/O pins. External Power Supply: DC 3.8 V is recommended. ADC: Analog-to-Digital Converter I2C: Inter－Integrated Circuit Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 8
HUAWEI ME309-562 eMTC LGA Module Hardware Guide SPI: Serial Peripheral Interface RF Pad: RF antenna interface. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 9
HUAWEI ME309-562 eMTC LGA Module Hardware Guide 3 Description of the Application Interfaces 3.1 About This Chapter This chapter mainly describes the external application interfaces of the ME309-562 module LGA Interface. 3.2 LGA Interface The ME309-562 module uses a 120-pin LGA as its external interface. For details about the module and dimensions, see 4.4 Dimensions. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 10
HUAWEI ME309-562 eMTC LGA Module Hardware Guide Figure 3-1 Pin map of LGA interface (Top view) Update 26/05/2017 Figure 3-2 Appearance of ME309-562 module (without label) Top View Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 11
HUAWEI ME309-562 eMTC LGA Module Hardware Guide Table 3-1 Definitions of pins on the LGA interface Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments A8 UART0_TX O UART0 transmit output VOH 1.44 1.8 1.8 - VOL 0 - 0.36 - A7 UART0_RX I UART0 receive data input VIH 1.26 1.8 1.8 - VIL 0 - 0.54 - B7 UART0_CTS I UART0 clear to send VIH 1.26 1.8 1.8 - VIL 0 - 0.54 - B8 UART0_RTS O UART0 ready for receive VOH 1.44 1.8 1.8 - VOL 0 - 0.36 - C7 UART0_DTR I Data terminal ready VIH 1.26 1.8 1.8 - VIL 0 - 0.54 - C6 UART0_DSR O UART0 data set ready VOH 1.44 1.8 1.8 - VOL 0 - 0.36 - B6 UART0_DCD O UART0 data carrier detect VOH 1.44 1.8 1.8 - VOL 0 - 0.36 - A6 UART0_RING O UART0 ring indicator VOH 1.44 1.8 1.8 Use as wake_up out VOL 0 - 0.36 A4 UART1_TX O UART1 transmit output VOH 1.44 1.8 1.8 - VOL 0 - 0.36 - A5 UART1_RX I UART1 receive data input VIH 1.26 1.8 1.8 - VIL 0 - 0.54 - B4 UART1_CTS I UART1 clear to send VIH 1.26 1.8 1.8 - VIL 0 - 0.54 - B5 UART1_RTS O UART1 ready for receive VOH 1.44 1.8 1.8 - VOL 0 - 0.36 - F3 UART2_TX O UART2 transmit output VOH 1.44 1.8 1.8 - VOL 0 - 0.36 - F1 UART2_RX I UART2 receive data input VIH 1.26 1.8 1.8 - VIL 0 - 0.54 - Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 12
HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments F2 UART2_CTS I UART2 clear to send VIH 1.26 1.8 1.8 - VIL 0 - 0.54 - E2 UART2_RTS O UART2 ready for receive VOH 1.44 1.8 1.8 - VOL 0 - 0.36 - D1 SPI_CS_N O Active low chip select to SPI device VOH 1.44 1.8 1.8 NOT support VOL 0 - 0.36 D2 SPI_CLK O Clock to SPI device, running at 104MHz VOH 1.44 1.8 1.8 NOT support VOL 0 - 0.36 C2 SPI_MOSI O Serial data line for transmitted data, master out VOH 1.44 1.8 1.8 NOT support VOL 0 - 0.36 C1 SPI_MISO I Serial data line for received data, master in VIH 1.26 1.8 1.8 NOT support VIL 0 - 0.54 G1 I2C_SCL O I2C bus serial clock line (need pull up to VCC_EXT) VOH 1.44 1.8 1.8 NOT support VOL 0 - 0.36 H1 I2C_SDA I/O I2C bus serial data line (need pull up to VCC_EXT) VOH 1.44 1.8 1.8 NOT support VOL 0 - 0.36 VIH 1.26 1.8 1.8 VIL 0 - 0.54 D9 SIM_VCC PO Power supply for SIM - - 1.8/ 3.0 - - D10 SIM_IO I/O SIM data - - 1.8/ 3.0 - - B9 SIM_CLK O SIM clock - - 1.8/ 3.0 - - C9 SIM_RST O SIM reset - - 1.8/ 3.0 - - C10 SIM_DETECT I SIM hot swap VIH 1.26 1.8 1.8 If not use, please pull it Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 13
HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments detection H: SIM is resent L: SIM is absent VIL 0 - 0.54 high to VCC_EXT on your board. E3 SIM_SWITCH O Switch from one card to the other, should cooperate with SIM switch IC chip. VOH 1.44 1.8 1.8 If not use, please leave it open. VOL 0 - 0.36 L8 WAKEUP_IN I The host sets the module into sleep mode or wakes up the module from sleep mode. H: Sleep mode is disabled. L: Sleep mode is enabled. (default L ) VIH 1.26 1.8 1.8 - VIL 0 - 0.54 - L3 WAKEUP_OUT O Module wakes up the host VOH 1.44 1.8 1.8 NOT support, please use RING as wake_up out VOL 0 - 0.36 K3 SLEEP_STATUS O Sleep status indicator H: The module is in wakeup state. L: The module is in sleep state. VOH 1.44 1.8 1.8 - VOL 0 - 0.36 - J8 LED_MODE O Network mode indicator. VOH 1.44 1.8 1.8 - VOL 0 - 0.36 - E8 GPIO1 I/O General Purpose I/O pins. VOH 1.44 1.8 1.8 Default configuration is input pull down. VOL 0 - 0.36 VIH VIH 1.26 1.8 VIL VIL 0 - G8 GPIO2 I/O General Purpose I/O VOH 1.44 1.8 1.8 Default configuration is input pull VOL 0 - 0.36 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 14
HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments pins. VIH VIH 1.26 1.8 down. VIL VIL 0 - D3 GPIO3 I/O General Purpose I/O pins. VOH 1.44 1.8 1.8 Default configuration is input pull down. VOL 0 - 0.36 VIH VIH 1.26 1.8 VIL VIL 0 - F8 GPIO4 I/O General Purpose I/O pins. VOH 1.44 1.8 1.8 Default configuration is input pull down. VOL 0 - 0.36 VIH VIH 1.26 1.8 VIL VIL 0 - H8 GPIO5 I/O General Purpose I/O pins. VOH 1.44 1.8 1.8 Default configuration is input pull down. VOL 0 - 0.36 VIH VIH 1.26 1.8 VIL VIL 0 - L2 JTAG_TMS I JTAG test mode select VIH 1.26 1.8 1.8 - VIL 0 - 0.54 - M2 JTAG_TRST_N I JTAG test reset VIH 1.26 1.8 1.8 - VIL 0 - 0.54 - K2 JTAG_TCK I JTAG test clock VIH 1.26 1.8 1.8 - VIL 0 - 0.54 - L1 JTAG_TDO O JTAG test data output VOH 1.44 1.8 1.8 - VOL 0 - 0.36 - M1 JTAG_TDI I JTAG test serial data input VIH 1.26 1.8 1.8 - VIL 0 - 0.54 - K1 ADC_1 AI Conversion interface for analog signals to digital signals - -0.036 - 1.836 The ADC’s resolution is 10bit J1 ADC_2 AI Conversion interface for analog signals to digital signals - -0.036 - 1.836 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 15
HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments D8 POWER_ON I System power -on - - 1.8 - Not support, will cancel it J3 POWER_OFF I System power -off - - 1.8 - Not support, will cancel it F9 RESIN_N I System reset, active low. - - 1.8 - Please add a pull-high resister to 1.8V on your board (not VCC_EXT). K8 BOOT_MODE I Boot mode configure H: boot from flash L: boot from host VIH 1.26 1.8 1.8 Please design a pull-high resister to VCC_EXT and a pull down resister to Ground on your board, default pull high resister is on the PCB board. VIL 0 - 0.54 K10 VCC_EXT PO Pin for external power output - 1.71 1.8 1.89 Max current is 10mA L9 VCC_Module PI Power supply Input - 3.3 3.8 4.2 Max current is about 300mA L10 VCC_Module PI Power supply input - 3.3 3.8 4.2 P3 RF_ANT RF RF pin of module - - - - - A3 Reserved - Reserved, please keep this pin open. - - - - - B2 Reserved - Reserved, please keep this pin open. - - - - - B3 Reserved - Reserved, please keep this pin open. - - - - - C3 Reserved - Reserved, please keep this pin open. - - - - - Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 16
HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments G9 Reserved - Reserved, please keep this pin open. - - - - - G10 Reserved - Reserved, please keep this pin open. - - - - - F10 Reserved - Reserved, please keep this pin open. - - - - - E9 Reserved - Reserved, please keep this pin open. - - - - - J10 Reserved - Reserved, please keep this pin open. - - - - - H9 Reserved - Reserved, please keep this pin open. - - - - - C5 Reserved - Reserved, please keep this pin open. - - - - - G2 Reserved - Reserved, please keep this pin open. - - - - - G3 Reserved - Reserved, please keep this pin open. - - - - - H2 Reserved - Reserved, please keep this pin open. - - - - - H3 Reserved - Reserved, please keep this pin open. - - - - - P8 Reserved - Reserved, please keep this pin open. - - - - - C4 Reserved - Reserved, please keep this pin open. - - - - - A1 NC - Not connected - - - - - Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 17
HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments A10 NC - Not connected - - - - - P1 NC - Not connected - - - - - P10 NC - Not connected - - - - - A2 GND - Ground - - - - - A9 GND - Ground - - - - - B1 GND - Ground - - - - - B10 GND - Ground - - - - - C8 GND - Ground - - - - - E1 GND - Ground - - - - - E5 GND - Ground - - - - - E6 GND - Ground - - - - - E10 GND - Ground - - - - - F5 GND - Ground - - - - - F6 GND - Ground - - - - - G5 GND - Ground - - - - - G6 GND - Ground - - - - - H5 GND - Ground - - - - - H6 GND - Ground - - - - - H10 GND - Ground - - - - - J2 GND - Ground - - - - - J5 GND - Ground - - - - - J6 GND - Ground - - - - - J9 GND - Ground - - - - - K5 GND - Ground - - - - - K6 GND - Ground - - - - - K9 GND - Ground - - - - - M3 GND - Ground - - - - - M4 GND - Ground - - - - - M5 GND - Ground - - - - - M6 GND - Ground - - - - - Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 18
HUAWEI ME309-562 eMTC LGA Module Hardware Guide Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments M7 GND - Ground - - - - - M8 GND - Ground - - - - - M9 GND - Ground - - - - - M10 GND - Ground - - - - - N1 GND - Ground - - - - - N2 GND - Ground - - - - - N3 GND - Ground - - - - - N4 GND - Ground - - - - - N5 GND - Ground - - - - - N6 GND - Ground - - - - - N7 GND - Ground - - - - - N8 GND - Ground - - - - - N9 GND - Ground - - - - - N10 GND - Ground - - - - - P2 GND - Ground - - - - - P4 GND - Ground - - - - - P5 GND - Ground - - - - - P6 GND - Ground - - - - - P7 GND - Ground - - - - - P9 GND - Ground - - - - -  I indicates pins for digital signal input; O indicates pins for digital signal output; AI indicates pins for analog signal input; PI indicates power input pins; PO indicates power output pins; P indicates power pins.  VIL indicates low-level input voltage; VIH indicates high-level input voltage; VOL indicates low-level output voltage; VOH indicates high-level output voltage.  The NC (Not Connected) pins are floating and there are no signal connected to these pins.  The Reserved pins are internally connected to the module. Therefore, these pins should not be used, otherwise they may cause problems. Please contact with us for more details about this information. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 19
HUAWEI ME309-562 eMTC LGA Module Hardware Guide 4 Mechanical Specifications 4.1 About This Chapter  Storage Requirement  Moisture Sensitivity  Dimensions  Customer PCB Design 4.2 Storage Requirement The module must be stored and sealed properly in vacuum package under a temperature below 40°C and the relative humidity less than 90% in order to ensure the weldability within 12 months. 4.3 Moisture Sensitivity  The moisture sensitivity is level 3.  After unpacking, the module must be assembled within 168 hours under the environmental conditions that the temperature is lower than 30°C and the relative humidity is less than 60%. If the preceding conditions cannot be met, the module needs to be baked according to the parameters specified in Table 4-1 . Table 4-1 Baking parameters Baking Temperature Baking Condition Baking Duration Remarks 125°C±5°C Relative humidity ≤ 60% 8 hours Refer to JESD-033C in detail Moving, storing, and processing the product must comply with IPC/JEDEC J-STD-033. 4.4 Dimensions Figure 4-1 shows the dimensions of the ME309-562 module in details. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 20
HUAWEI ME309-562 eMTC LGA Module Hardware Guide Figure 4-1 Dimensions (Unit: mm) The detail information about the corner and the module pin description top view: 1. the yellow pins, diameter is 0.76 mm, pitch is 1.35 mm, 2. the blue pins, diameter is 0.89 mm, pitch is 1.60 mm. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 21
HUAWEI ME309-562 eMTC LGA Module Hardware Guide 4.5 Customer PCB Design 4.5.1 PCB Surface Finish The PCB surface finish recommended is Electroless Nickel Immersion Gold (ENIG). Organic Solderability Preservative (OSP) may also be used, ENIG preferred. 4.5.2 PCB Pad Design To achieve assembly yields and solder joints of high reliability, it is recommended that the PCB pad size be designed as follows: Figure 4-2 Footprint design of customer's PCB (Unit: mm) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 22
HUAWEI ME309-562 eMTC LGA Module Hardware Guide Some detail information about the recommend module footprint: 1. the yellow pins, diameter is 0.71 mm, pitch is 1.35 mm, 2. the blue pins, diameter is 0.81 mm, pitch is 1.60 mm. Figure 4-3 Detail information about the recommend module footprint Figure 4-4 Recommended Package Size on HUAWEI motherboard (Unit: mm) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 23
HUAWEI ME309-562 eMTC LGA Module Hardware Guide 4.5.3 Solder Mask Non Solder Mask Defined (NSMD) is recommended. In addition, the solder mask of the NSMD pad design is larger than the pad so the reliability of the solder joint can be improved. The solder mask must be 100 µm–150 µm larger than the pad, that is, the single side of the solder mask must be 50 µm–75 µm larger than the pad. The specific size depends on the processing capability of the PCB manufacturer. 4.5.4 Requirements on PCB Layout  To reduce deformation, a thickness of at least 1.0 mm is recommended.  Other devices must be located more than 3 mm (5 mm recommended) away from the two parallel sides of the LGA module (rework requirement),and other sides with 0.6 mm. The minimum distance between the LGA module and the PCB edge is 0.3 mm.  When the PCB layout is double sided, the LGA module must be placed on the second side for assembly; so as to avoid module dropped from PCB or component (located in module) re-melding defects caused by uneven weight.  Customers PCB together with ME309-562 should be placed in an enclosed box to reduce the impact of high humidity as far as possible.  The bottom of the module is not allowed to put non-ground line or non-ground hole. If the design can not be achieved, then the non-gound line and hole must be covered by green oil. 4.5.5 Stencil Design It is recommended that the stencil for the LGA module be 0.15 mm in thickness. The stencil design is shown as Figure 4-5 : Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 24
HUAWEI ME309-562 eMTC LGA Module Hardware Guide Figure 4-5 Recommended stencil design of LGA module (Unit: mm) The stencil design has been qualified for HUAWEI motherboard assembly, customers can adjust the parameters by their motherboard design and process situation to assure LGA soldering quality and no defect. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 25

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