Huawei Release Notes F Tanjim OTB Y210 Maintenance Manual

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Y210 Mobile Phone

Maintenance Manual

Issue

1.0

Date

2012-11-28

HUAWEI TECHNOLOGIES CO., LTD.

Copyright © Huawei Technologies Co., Ltd. 2012. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.

Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.

Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees or
representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.
Address:

Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China

Website:

http://www.huawei.com

Email:

support@huawei.com

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About This Document

About This Document
Author
Prepared by

R&D

Date

-

Reviewed by

Maintenance support team

Date

-

Approved by

Service representative

Date

-

Change History
Date

Version

Issue 1.0 (2012-11-28)

Change Reason Section

Description

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Author

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Contents

Contents
About This Document .................................................................................................................... ii
1 Product Overview ......................................................................................................................... 1
1.1 Appearance ....................................................................................................................................................... 1
1.2 Features ............................................................................................................................................................ 2

2 Applicable Scope and Precautions ............................................................................................ 4
2.1 Applicable Scope .............................................................................................................................................. 4
2.2 Precautions ....................................................................................................................................................... 4
2.3 How to Obtain Product and Repair Information .............................................................................................. 4

3 Exploded View............................................................................................................................... 5
4 Components on the PCBA ........................................................................................................... 7
5 Software Upgrade ......................................................................................................................... 9
5.1 Upgrade Preparation......................................................................................................................................... 9
5.2 Performing an Upgrade .................................................................................................................................... 9

6 Maintenance Tools ...................................................................................................................... 11
7 Disassembly Procedure .............................................................................................................. 13
8 Assembly Procedure ................................................................................................................... 17
9 Principles and Failure Analysis ............................................................................................... 21
9.1 Block Diagram ............................................................................................................................................... 21
9.1.1 Functions of the PCBA ......................................................................................................................... 22
9.2 Baseband Unit ................................................................................................................................................ 26
9.2.1 Power-on Management Circuits ............................................................................................................ 26
9.2.2 Charging Management Circuits ............................................................................................................ 30
9.3 RF Unit ........................................................................................................................................................... 31
9.3.1 RF Failure ............................................................................................................................................. 31
9.3.2 GPS ....................................................................................................................................................... 35
9.3.3 Wi-Fi/Bluetooth/FM Module ................................................................................................................ 35
9.4 Peripheral Circuits .......................................................................................................................................... 37
9.4.1 Display .................................................................................................................................................. 37
9.4.2 Camera .................................................................................................................................................. 40

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Contents

9.4.3 USB....................................................................................................................................................... 43
9.4.4 Headset Jack.......................................................................................................................................... 44
9.4.5 Keys and Buttons .................................................................................................................................. 46
9.4.6 Tricolor Indicator and Touch Key Backlight Circuits ........................................................................... 47
9.4.7 Battery Connector ................................................................................................................................. 48
9.4.8 Accelerometer ....................................................................................................................................... 49
9.4.9 Compass ................................................................................................................................................ 50
9.4.10 Proximity Sensor ................................................................................................................................. 50
9.4.11 Vibration Motor ................................................................................................................................... 52
9.4.12 Receiver .............................................................................................................................................. 53
9.4.13 Microphone ......................................................................................................................................... 56
9.4.14 Touch Panel ......................................................................................................................................... 57
9.4.15 SIM Card............................................................................................................................................. 58
9.4.16 microSD Card ..................................................................................................................................... 59

10 Solder Points on the PCBA and BGA Chip ......................................................................... 61
11 Functional Tests......................................................................................................................... 67
11.1 MMI Test ...................................................................................................................................................... 67
11.2 Voice Call Test .............................................................................................................................................. 70

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1 Product Overview

1

Product Overview

1.1 Appearance
Figure 1-1 shows the appearance of the HUAWEI Ascend Y210 mobile phone (Y210 for
short).
Figure 1-1 Y210 mobile phone

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1 Product Overview

1.2 Features
Table 1-1 describes the features of the Y210.
Table 1-1 Features
Item

Description

Dimensions (H x W x D)

12.4 mm x 117 mm × 62 mm

Technical standards



Y210-0010: W2100/W900,
GSM900/1800/1900



Y210-0100: W2100/W900,
GSM850/900/1800/1900



Y210-0151: W2100/W1900/W850,
GSM850/900/1800/1900



Y210-0200: W2100/W900,
GSM850/900/1800/1900



Y210-0251: W2100/W1900/W850,
GSM850/900/1800/1900

GSM = Global System for Mobile
Communications
Frequency bands



Y210-0010: W2100/W900,
GSM900/1800/1900



Y210-0100: W2100/W900,
GSM850/900/1800/1900



Y210-0151: W2100/W1900/W850,
GSM850/900/1800/1900



Y210-0200: W2100/W900,
GSM850/900/1800/1900



Y210-0251: W2100/W1900/W850,
GSM850/900/1800/1900

Frequency ranges:

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

WCDMA 900 MHz: 880–915 MHz (uplink),
925–960 MHz (downlink)



WCDMA 2100 MHz: 1920–1980 MHz
(uplink), 2110–2170 MHz (downlink)



WCDMA 1900 MHz: 1850–1910 MHz
(uplink), 1930–1990 MHz (downlink)



WCDMA 850 MHz: 824–849 MHz (uplink),
869–894 MHz (downlink)



GSM 850 MHz: 824–849 MHz (uplink),
869–894 MHz (downlink)



GSM 900 MHz: 880–915 MHz (uplink),
925–960 MHz (downlink)



GSM 1800 MHz: 1710–1785 MHz (uplink),
1805–1880 MHz (downlink)



GSM 1900 MHz: 1850–1910 MHz (uplink),

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1 Product Overview

Item

Description
1930–1990 MHz (downlink)
WCDMA = Wideband Code Division Multiple
Access

Weight

< 130 g with battery

Type

Bar type

Antenna

Built-in

Card type

Subscriber identity module (SIM) and universal
subscriber identity module (USIM)

Charger

5 V, 550 mA

Battery

1250 mAh Li-ion

Display

Ports



Standby time: up to 305 hours



Talk time: up to 670 minutes (depending on
network conditions)

Resolution

320 x 480 pixels

Liquid crystal
display (LCD) type

Thin film transistor (TFT)

Color

262K

LCD size

3.5 inches

Charging port

Micro Universal Serial Bus (USB) port

USB port

Micro USB port

microSD card slot

microSD card slot

Headset jack

3.5 mm (LRGM)

Maximum
transmit power

23–33 dBm

Static sensitivity

≤ –104 dBm

Temperature



Operating temperature: –10°C to +55°C



Storage temperature: –40°C to +70°C

Humidity

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Operating humidity: 5% to 95% RH

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2 Applicable Scope and Precautions

2

Applicable Scope and Precautions

2.1 Applicable Scope
This document provides repair instructions for technicians at service centers authorized by
Huawei. Being Huawei proprietary, this document is accessible only for authorized service
centers and companies. Although every effort was made to ensure the accuracy of this
document, errors may still exist. If you find any errors or have any suggestions, please contact
Huawei's customer service.

2.2 Precautions


Only qualified technicians are allowed to perform repair and calibration.



Perform all operations in electrostatic discharge (ESD) rooms and wear ESD wrist straps
throughout the operations.



Ensure that all the components, screws, and insulators are properly installed after repair
and calibration, and that all cables and wires are installed and connected correctly.



Ensure that the soldering is lead-free and compliant with eco-friendly requirements.

2.3 How to Obtain Product and Repair Information
To obtain product and maintenance information, visit Huawei website at:
http://www.huaweidevice.com/cn/technicaIndex.do.

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3 Exploded View

3

Exploded View

Figure 3-1 shows the exploded view of the Y210.
Figure 3-1 Exploded view

The components listed in the following table are structural parts of the phone and cannot be used as
reference to request spare parts.

Table 3-1 lists the components in the exploded view.
Table 3-1 Components in the exploded view
No.

Description

Quantity

1

Touch panel

1

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3 Exploded View

No.

Description

Quantity

2

Front cover assembly

1

3

Power button flexible printed circuit (FPC) assembly

1

4

Receiver

1

5

LCD

1

6

LCD conductive rubber

2

7

Receiver insulation film

1

8

Printed circuit board assembly (PCBA)

1

9

Volume button FPC assembly

1

10

Motor

1

11

Speaker

1

12

Main antenna support assembly

1

13

Camera support foam

1

14

Camera

1

15

Rear cover assembly

1

16

Battery

1

17

Screws

8

18

Battery cover

1

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4 Components on the PCBA

4
J1101 headset jack
Faults caused if damaged:
Handset malfunctions

J1601 touch panel port
Faults caused if damaged:
Touch panel malfunctions

Components on the PCBA
J1302 LCD port
Faults caused if damaged:
LCD malfunctions

L901 motor contact

J901 USB port
Faults caused if damaged:
USB connection failure

U6100 Wi-Fi chip
Faults caused if damaged:
Wi-Fi malfunctions

U1204 Gravity sensor
Faults caused if damaged:
Gravity sensor malfunctions

U1303 backlight driver IC
Faults caused if damaged:
Black screen

J1402 SIM card holder
Faults caused if damaged:
SIM card identification failure

U6000 Bluetooth & FM chip
Faults caused if damaged:
Bluetooth or FM malfunctions

J1403 dual card SIM 2 card
holder
Faults caused if damaged:
SIM card identification failure

U601 MCP chip
Faults caused if damaged:
Power-on failure or software
failure

U3801 WCMDA/GSM
transception chip
Faults caused if damaged:
RF function error

J1605 volume button FPC
port
Faults caused if damaged:
Volume button malfunctions

U3302 power module, PA
Faults caused if damaged:

U401 CPU-MSM7225A
Faults caused if damaged:
Power-on failure or system
not responding

U3501 power module, PA
Faults caused if damaged:
GSM900 transmit error

U201 PMIC-PM8029
Faults caused if damaged:
Power failure

U3201 RF switch
Faults caused if damaged:
Network registration failure

J902 battery connector
Faults caused if damaged:
Battery power supply failure

SP1501 speaker contact
Faults caused if damaged:
Speaker malfunctions

J3204 RF connector
Faults caused if damaged:
Network registration failure

U3401 power module, PA
Faults caused if damaged:
RF transmit error

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J1401 SD card slot
Faults caused if damaged:
SD card malfunctions

U4202 power module, PA
Faults caused if damaged:
RF transmit error

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4 Components on the PCBA

D1601 tri-color indicator
Faults caused if damaged:
Indicator off

SP1502 receiver contact

MIC1501 microphone
Faults caused if damaged:
No sounds for recordings

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J1608 J1608 power button
spring
Faults caused if damaged:
Power button malfunctions

D1602 D1603 D1604 power
button LED
Faults caused if damaged:
Functional keys backlight off

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5 Software Upgrade

5

Software Upgrade

5.1 Upgrade Preparation
Prepare the items listed in Table 5-1 before a software upgrade.
Table 5-1 Items to be prepared
Item

Description

Remarks

Upgrade
environment

Computer

The computer is used to copy upgrade
software.

microSD card

The microSD card must have more than 1 GB
free space.

Battery

The battery level must not be lower than 30%.

Main upgrade package

dload/UPDATE.app

Vendor upgrade
package

vendor_XXX_XXX/UPDATE.app

Using the microSD card

Normal upgrade

Upgrade file

Upgrade
method

Forcible upgrade

5.2 Performing an Upgrade
To upgrade the Y210, perform the following steps:
Step 1 Format the microSD card.
Step 2 Create a dload folder in the microSD card's root directory.
Step 3 Copy the upgrade file to the dload folder.
Step 4 Insert the microSD card to the Y210, and power on the phone. On the standby screen, enter
*#*#2846579#*#*, select SD card upgrade, and touch Confirm.

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5 Software Upgrade

Before the upgrade, NV items backup is performed (if the phone's NV items has never been
backed up). Then, the phone restarts and the upgrade starts.
The upgrade progress is displayed on the LCD.
Figure 5-1 shows the upgrade progress.
Figure 5-1 Upgrade progress

After the upgrade, the phone restarts and the NV items are restored.
Step 5 After the phone is upgraded using the main upgrade package, upgrade the phone using the
vendor upgrade package in the same way.
----End
If the phone fails to start, use either of the following methods to perform a forcible upgrade:


Install the battery on the phone. If the screen splashes, remove the battery, wait for 5
seconds, and re-install the battery. Press and hold the volume up and down buttons, and
press the power button. The phone then enters forcible upgrade mode. The software
download process is similar to that during a normal upgrade.



If no battery is installed, press and hold the volume up and down buttons, and connect
the charger. The phone then enters forcible upgrade mode. It is recommended that you
upgrade the software using the charger. If the upgrade still fails, replace the microSD
card and try again.

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6 Maintenance Tools

6

Maintenance Tools

Name: constant-temperature heat gun
Usage: to heat components

Name: constant-temperature heat gun
Usage: to heat components

Name: soldering iron
Usage: to maintain and solder components

Name: direct current (DC) power supply
Usage: to supply DC current

Name: soldering table
Usage: to secure the PCBA

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6 Maintenance Tools

Name: lead-free solder wire
Usage: to solder components

Name: digital multimeter
Usage: to measure during repair

Name: toolkit
Usage: to assemble and disassemble phone

Name: electric screwdriver
Usage: to fasten and remove screws

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7 Disassembly Procedure

7

Disassembly Procedure

1. Wear an electro-static discharge (ESD) wrist strap,
and ensure that the strap is grounded properly.

2. Follow the Y210 disassembly instructions.

3. Remove the battery cover: Press the upper part of
the battery cover and push it towards the bottom.

4. Remove the battery.

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7 Disassembly Procedure

5. Remove the eight screws from the rear cover.

7. Use the disassembly tab to release the latch in the
upper left corner.

9. Remove the volume key.

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6. Use the disassembly tab to release the latch in the
upper left corner.

8. Use a cover opener to release the latches between
the rear cover and the front cover.

10. Release the volume key FPC.

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7 Disassembly Procedure

11. Release the BTB connector cable between the
touch panel and the LCD.

12. Release the two latches on the PCBA.

13. Remove the PCBA.
14. Release the BTB connector, and remove the
camera.

15. Remove the LCD.

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16. Apply a protective film on the LCD.

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7 Disassembly Procedure

17. Apply a protective film on the inner side of the
touch panel.

18. Remove the power button FPC.

20. Remove the speaker.
19. Remove the receiver.

21. Remove the motor.
22. The phone is then disassembled.

The Y210 has two versions: single card and dual card versions. The pictures for disassembling and
assembling a single-card Y210 are used. The phone disassembly and assembly methods for the two
versions are the same.

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8 Assembly Procedure

8

Assembly Procedure

2. Follow the Y210 assembly instructions.
1. Wear an ESD wrist strap, and ensure that the strap is
grounded properly.

3. Install the motor.

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4. Install the speaker.

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8 Assembly Procedure

5. Install the receiver.

6. Install the power button FPC.

7. Remove the protective film from the LCD.

8. Install the LCD. Ensure that the two latches are
snapped in place and that the LCD is even.

9. Place the PCBA on the front cover. Ensure that the
PCBA is in good contact with the front cover at the
power button position. Snap the latches in place.

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10. Gently press the PCBA to close the latches and
secure the PCBA.

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8 Assembly Procedure

11. Snap the LCD's BTB connector and then the touch
panel's BTB connector in place.

12. Install the volume button: Install the volume button
FPC into the ZIF connector, and attach them to the
front cover.

14. Install the eight screws onto the rear cover.
13. Install the rear cover: Snap the rear cover's bottom,
and press its top.

15. Install the battery: Insert it into the battery
compartment bottom first.

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16. Install the battery cover.

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8 Assembly Procedure

17. The phone is then assembled.

The Y210 has two versions: single card and dual card versions. The pictures for disassembling and
assembling a single-card Y210 are used. The phone disassembly and assembly methods for the two
versions are the same.

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9 Principles and Failure Analysis

9

Principles and Failure Analysis

9.1 Block Diagram
Figure 9-1 shows the block diagram of the Y210.
Figure 9-1 Block diagram

MSM7X2XA (The Y210U uses the MSM7225A) is the baseband signal processing chip,
mainly responsible for processing the input and output of image, video, audio, memory
support, RF interface, and connectivity signals. The baseband chip provides keypad, LCD,
microSD card, Wi-Fi, Bluetooth, camera, microphone, and touch panel interfaces.

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9 Principles and Failure Analysis

The PM8029 is mainly responsible for:


Detecting the connection and disconnection of the external power supply.



Supplying power to the phone.



Providing analog multi-channel switch, real-time clock circuit, temperature compensated
crystal oscillator (TCXO) clock circuit, motor driver circuit, and speaker driver circuit.

The RTR6285A is the radio frequency (RF) signal processing chip, responsible for converting
Universal Mobile Telecommunications System (UMTS)/GSM uplink/downlink RF signals
and using I/Q signals to exchange data with the baseband chip.

9.1.1 Functions of the PCBA
By function, the PCBA can be divided into four subsystems: baseband, RF, power, and user
interface subsystems. Table 9-1 describes the subsystems' modules and units, as well as their
functions.
Table 9-1 PCBA subsystems' modules, units, and their functions
Subsystem

Module

Unit

Function

Baseband
subsystem

MSM7225A

Modem subsystem

The modem subsystem includes the
ARM11 processor, modem digital
signal processor (DSP), modem
Advanced High-performance Bus
(AHB), interruption controller, and
sleep controller.
The ARM9 is a 400 MHz modem
processor, responsible for modulation
and demodulation of WCDMA,
Global Positioning System (GPS),
and GSM signals.

Application subsystem

The subsystem includes Advanced
RISC Machines (ARM) A5 processor,
application DSP, and dedicated data
mover.
The A5 processor has a clock rate of
1400 MHz, supporting function
modules such as the microSD card,
EBI2, UART/USIM, I2C, GPIO, and
clock modules.

User interface processing unit

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

UART = universal asynchronous
receiver/transmitter



I2C = Inter-Integrated Circuit



GPIO = General Purpose
Input/Output

Provides camera, pulse code
modulation (PCM), broadband codec,
vocoder, RF, HKADC, LCD,
microSD card, USB, UART, USIM
card, southbound interface (SBI),
GPIO, JTAG/ETM, and keypad

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Subsystem

Module

9 Principles and Failure Analysis

Unit

Function
interfaces.

Multimedia and game engine

The multimedia and game engine of
the MSM7227 runs Mpeg/jpeg
hardware engine and game engine,
JAVA accelerator, and provides
MP3/MMS/MIDI functions.


MP3 = MPEG audio layer-3



MMS = multimedia messaging
service



MIDI = musical instrument digital
interface

Power supply voltage
monitoring

Lists objects being monitored, such as
the external power supply input,
Li-ion battery, and charger.

Temperature monitoring

Monitors the battery temperature.

NAND

NAND feature, power
consumption, file system
support

Stores applications and NV items.
Capacity: 4 GB.

DDR1 RAM

Memory

Provides storage space for running
applications. Capacity: 512 GB.

PM8029

RAM = random access memory
RF
subsystem

WCDMA, and
GSM/DCS signal
transmission and
reception

AFC circuit, APC circuit, AGC
circuit, and each component

Performs the RF function of
WCDMA signal reception and
transmission, and mainly includes the
RTR6285A RF chip and the
peripheral circuit.

GPS

GPS reception

Receives and processes GPS signals
and mainly includes the RTR6285A
chip and the peripheral circuit.

Bluetooth interface

Bluetooth/Wi-Fi/Frequency
modulation (FM) 3-in-1
module

Performs baseband function for
Bluetooth and Wi-Fi signals, and
transmits and receives Bluetooth and
Wi-Fi RF signals. It mainly includes
the Bluetooth and Wi-Fi module and
its peripheral circuit.

Wi-Fi interface

Same as the Bluetooth
interface.

Same as the Bluetooth interface.

Oscillator and
frequency
synthesizer

Crystal oscillators

Generates highly accurate VCTCXO
frequency for the 19.2 MHz local
reference clock. The RTR6285A has a
built-in local oscillator (LO)
providing clock frequency for
transmitting and receiving WCDMA
and GPS signals.
VCTCXO = Voltage Controlled

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Subsystem

9 Principles and Failure Analysis

Module

Unit

Function
Temperature Compensated Crystal
Oscillator

User
interface
subsystem

Antenna

External antenna, internal
interface component, antenna
protection

The phone uses internal antennas for
wireless communication, supporting
WCDMA high and low frequency
bands. The antennas are the main
antenna, GPS antenna, diversity
antenna, Wi-Fi/Bluetooth antenna,
and FM antenna (headset).

Coupler

Power coupler

Couples part of the power output
from the WCDMA power amplifier to
the RTR6285A for power monitoring.

UART interface

-

MSM7225A subsystem's UART1
interface for Bluetooth.

USB interface

Driver, protection circuit,
output interface component

The peripheral circuit, protection
circuit and interface connectors of the
USB interface in the MSM7225A
subsystem. It is the major data service
channel for the engineering sample,
and can be used to debug and test
devices during product development.

USIM card interface

Power supply, protection
circuit, USIM card holder

Mainly includes the USIM card
holder and related connection circuits.

Keypad and
backlight

Keypad driver circuit, external
keypad, backlight light emitting
diode (LED) control circuit



Supports GPIO for keypad
scanning.



Provides backlight LED. When a
key is pressed, the backlight is on.



Works in conjunction with
PM8029 to provide the keypad
backlight brightness adjustment
function.

Color LCD and
backlight

LCD driver, interface mode,
and backlight control

Phone's LCD with 256K colors. The
brightness of the LCD backlight can
be adjusted by users.

Speaker for playback
of MIDI ringtone

Driver mode, connection mode,
speaker component

Plays polyphonic ringtones for
incoming calls. The maximum power
of the speaker is 500 mW.
It has good frequency response for
playing 20–20000 Hz ringtones. It
can also play monophonic MP3 audio
files.

Receiver

Driver mode, connection mode,
receiver component

Emits sound during a call.

Microphone

Interface circuit, connection
mode, microphone component

The phone has two built-in
microphones to eliminate the

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Subsystem

Module

9 Principles and Failure Analysis

Unit

Function
environmental noise.

Power
subsystem

Headset

Headset, headset interface
circuit, microphone interface
circuit

The phone provides a headset jack to
output music playback audio or voice
during a call. The microphone on the
headset cable can pick sound and
input it into the phone. The headset
jack is compatible with iPhone
headsets.

Vibration motor
interface

Driver mode, connection mode,
motor

When there is an incoming call, the
motor can vibrate to notify the user of
the call.

Accelerometer

I2C interface control

Senses acceleration to help implement
game functions.

Battery

Li-ion battery

3.7 V/1700 mAh (the battery must be
certified and comply with relevant
safety regulations).

External power
supply (travel
charger)

Adapter and interface
component



The charger meets the
requirements of China, Europe,
the USA, and Australia.



Charger specifications: 90–240 V,
45–55 Hz, AC input. The model
differs with different markets.



The output voltage of the charger
is 5 ±0.25 V. The charger must be
CE and CCC certified.



The charger's output current must
be able to charge the battery and
supply power to the phone for
normal operation at the same time.



The charging current requirement
is 550 mA.

Power distribution
network and power
management
function

Power distribution network

Includes filter networks and PCB
traces for the power supply.

PM8029 enhanced
function

Battery management, charging
circuit, charging mode, and
charging protection

Manages battery charging and
discharging, provides overcharging
and over-discharging protection, and
charges the capacitor that supplies
power to maintain the real-time clock
(RTC).

Board circuit power
management (power-on/off
analysis)

Mainly controls the low-dropout
(LDO) regulator power supply to
flexibly manage power supply.
Based on the service status and the
requirements of the protocols and

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9 Principles and Failure Analysis

Module

Unit

Function
power-saving analysis, the board
software manages the power supplies
to the units on the board to reduce
power consumption.

RTC

The built-in RTC circuit uses a sleep
clock of 32.768 kHz to provide
precise time.

HKADC

Contains 8 multipurpose pin (MPP)
interfaces. Analog-to-digital
conversion can be implemented inside
the PM8029.

TCXO driver

The PM8029 has a built-in TCXO
driver providing two analog signal
output channels and two digital signal
output channels.

UVLO

Provides the Undervoltage-Lockout
(UVLO) function. When the input
voltage is lower than the threshold for
a specific period of time, the phone
powers off.

Overheat protection

When the on-chip junction
temperature exceeds 150°C, the
phone powers off.

Internal driver circuit

Provides one vibration motor driver
and one speaker driver.

Interrupt management

The built-in interrupt manager
handles related interrupt signals.

USB driver

Supports USB 2.0; does not support
USB On-The-Go (USB OTG).

9.2 Baseband Unit
9.2.1 Power-on Management Circuits
On the Y210U, most power supplies are provided by the power management chip PM8029.
The PM8029 provides two types (switched-mode power supply and LDO regulators) of
programmable voltage regulators with a total of 24 output channels. Table 9-2 lists the voltage
regulator parameters.

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Table 9-2 Voltage regulator specifications

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Troubleshooting Process
To troubleshoot the power-on failure, check whether the I/O connector (battery connector) is
damaged. If the I/O connector (battery connector) is not damaged, use a DC regulated power
supply to supply power to the phone, and test the phone's current.
The power-on failure may be caused by any of the following conditions:


No current

Figure 9-2 No current

Power-on failure:
no current

Is the battery
connector J902
normal?

N

Replace J902

Y

Is Q201 normal?

N

Replace Q201

Y
Re-solder or replace
U201



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Weak current

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Figure 9-3 Weak current
Power-on failure:
weak current

Reinstall the phone's
firmware. Is the problem
solved?

Y

End

N

Is U210's output
voltage normal?

N

Replace U201

Y

Does X301 have
32.768 kHz output?

N

Replace X301

Y

Replace U601 and reinstall
the phone's firmware. Is the
problem solved?

Y

End

N
Replace U401



Excessive current

Excessive current is caused by short circuits. When excessive current occurs, to prevent
damage to components, do not connect the charger to the phone. Power-on failure due to
excessive current is usually the result of short-circuited VBAT circuit.

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Figure 9-4 Excessive current

Power-on failure:
excessive current

Test the VBAT circuit. Is it
a short circuit?

N

Check whether
VPH_PWR and
PM outputs are
short-circuited.

Y

N
Is J902 normal?

Re-solder or
replace J902.

Y

Is Q201 normal?

N

Replace Q201.

Y

Remove U201. Do short
circuits still exist?

Y

Replace U201.

N
Replace U401.

9.2.2 Charging Management Circuits
Figure 9-5 Charging management circuits

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Troubleshooting Charging Failure
Figure 9-6 Charging failure

Charging failure

N

Is the charger working
properly?

Replace the
charger

Y

Is J901 poorly
soldered?

Y

Re-solder J901

N
N
Is the battery in good
contact with the battery
connector?

Repair or replace
J902

Y

N

Does VPH_PWR have
voltages?

Replace U201

Y
Is there voltage difference
Y Q201' pin 2 and
between
pin 3?

Y

N
Replace Q201

Y

Is the battery damaged?

Replace the
battery

N
End

9.3 RF Unit
9.3.1 RF Failure
Troubleshooting Transmission Failure


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GSM/DCS transmission failure

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Before starting the following process, ensure that the USIM card and the antenna are well
connected.
Figure 9-7 GSM/DCS transmission failure
GSM/DCS transmission
failure

N
When the RF cable is not
inserted, are J3204's pin
1 and pin 2 connected?

Check J3204

Y
N
Are U3201's control signals
normal?

Check U3201 and
U401

Y
N
Are U3501's GSM output
and DCS output
approximately 33 dBm and
30 dBm respectively?
Y

Check U3501

N

Do U3801's
Y pin A10 and pin
A9 have output?

Check U3801

Y
Check U401

Table 9-3 and Table 9-4 describe the working status of the GSM/DCS power amplifier U3501.
Table 9-3 U3501 working status (1)
GSM_PA_EN

PA

H

ON

L

OFF

Table 9-4 U3501 working status (2)
GSM_PA_BAND

Mode

L

GSM850/900

H

DCS1800/1900

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H: voltage higher than 1.3 V. L: voltage lower than 0.5 V.


WCDMA transmission failure (use W2100 as an example)

Before starting the following process, ensure that the USIM card and the antenna are well
connected.

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Figure 9-8 WCDMA transmission failure
W2100 transmission
failure

Check J3204

N

When the RF cable is not
inserted, are J3204's pin 1
and pin 2 connected?

Check J3204

Y
N
Are U3201's control signals
normal?

Check U3201 and
U401

Y
N
Is the insertion loss
between U3304's pin 1 and
pin 3 approximately 1.1–1.4
dB?

Check U3304

Y

N

Is the insertion loss
Y U3302's pin 2 and
between
pin 9 approximately 0.6 dB?

Y

Check U3302

N

Check U3301

Is U3301's output 24 dB?
Y

Y

N

Does U3801's pin A7 have
output?

Check U3801

Check U401

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Table 9-5 and Table 9-6 describe the working status of the WCDMA power amplifier.

Table 9-5 WCDMA power amplifier working status (1)
PA_ON

PA

H

ON

L

OFF

Table 9-6 WCDMA power amplifier working status (1)
PA_R

PA_R1

Mode

L

L

HI Power

L

H

MI Power

H

H

LO Power

H: 1.3–1.8 V. L: < 0.5 V.

9.3.2 GPS
The GPS channel consists of filter U4102, filter U4103 and LNA U4101. GPS signals are sent
to the RTR6285A's input interface after going through the filters and LNA. Figure 9-9 shows
the circuit.
Figure 9-9 GPS circuit

9.3.3 Wi-Fi/Bluetooth/FM Module
The Y210 uses a WCN2243 (Bluetooth/FM 2-in-1 module)+AR6005 (Wi-Fi module)+switch
to realize Wi-Fi, Bluetooth, and FM functions.
The Bluetooth and Wi-Fi functions share one antenna and one RF switch.

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The MSM7225A provides PCM and UART interfaces that are directly connected to the
Bluetooth module's PCM and UART signal output. Table 9-7 describes the signals'
definitions.
Table 9-7 Signal definitions (PCM and UART interfaces)
MSM7225A

Signal

Definition

GPIO_44

UART1_CTS_N

"ready to receive" signal sent from the host to the
slave.

GPIO_43

UART1_RFR_N

"clear to send" signal sent from the slave to the host.

GPIO_46

UART1_TX

Transmission signal

GPIO_45

UART1_RX

Reception signal

GPIO_69

AUX_PCM_DIN

PCM input

GPIO_68

AUX_PCM_DOUT

PCM output

GPIO_70

AUX_PCM_SYNC

PCM synchronization

GPIO_71

AUX_PCM_CLK

PCM clock

GPIO_107

MSM_WAKES_BT

Waking up the host

GPIO_83

BT_WAKES_MSM

Waking up the Bluetooth

The MSM7225A provides SDIO3 interfaces that are directly connected to the Wi-Fi module's
SDIO signal output. Table 9-8 describes the signals' definitions.
Table 9-8 Signal definitions (SDIO3 interface)
MSM7225A

Signal

Definition

GPIO_64

SDC2_DATA3

GPIO_65

SDC2_DATA2

GPIO_66

SDC2_DATA1

GPIO_67

SDC2_DATA0

GPIO_62

SDC2_CLK

Clock

GPIO_63

SDC2_CMD

Control signal

Data

The PM8029 provides audio input interfaces that are directly connected to the FM module's
left and right channels. Table 9-9 describes the signals' definitions.
Table 9-9 Signal definitions (audio input interfaces)
BCM4330

Network

MSM7225A

Description

FM_RXP

FM_ANT

-

FM antenna (headset)

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BCM4330

Network

MSM7225A

Description

FM_RXN

-

-

-

FM_VDD2P5

SR_AVDD2P5

-

-

FM_AOUT1

FM_OUT_L

PM8029
LINE_IN_LP

FM OUTPUT

FM_AOUT2

FM_OUT_R

PM8029
LINE_IN_RM

FM OUTPUT

9.4 Peripheral Circuits
9.4.1 Display
The MSM7225A uses Mobile Industry Processor Interfaces (MIPIs) to send instructions and
data to the LCD. The Y210's LCD uses MIPIs, supporting a 60 Hz refresh rate, and requiring
only one pair of differential clock lines, one pair of differential signal lines, and one pair of
power supply lines. The LCD also supports frame synchronization, using the MDP_VSYNC
signals (GPIO_097) as data transmission synchronization signals to avoid screen tearing.


Dot matrix: Half-size VGA (HVGA, 480 x 320 pixels)



Color: 256K colors

Figure 9-10 shows the connections between the MSM7225A and the LCD.
Figure 9-10 Connections between the MSM7225A and the LCD

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Table 9-10 describes the signals' definitions.
Table 9-10 Signal definitions
Category

Description

Name in the
Circuit
Network

MSM7225A
GPIO/PM8029 MPP

Power supply

Digital power supply
input

VREG_S3

VREG_S3 (PM8029)

Analog power input

VREG_L12_2P8
5

VREG_L12_2P85
(PM8029)

MIPI data

MIPI_DSI_LAN
E1_P

MIPI_DSI_LANE1_P

MIPI data

MIPI_DSI_LAN
E1_N

MIPI_DSI_LANE1_N

Synchronization
signal

Frame
synchronization clock

MDP_VSYNC_
P

GPIO97

Clock signal

MIPI clock

MIPI_DSI_CLK
_P

MIPI_DSI_CLK_P

MIPI clock

MIPI_DSI_CLK
_N

MIPI_DSI_CLK_N

Control signal

Reset

LCD_RESET_N

GPIO129

Identification
signal

LCD model
identification

LCD_ID0

GPIO9 (PM8029)

LCD model
identification

LCD_ID1

GPIO10 (PM8029)

Data

Y210's LCD backlight control:
The Y210 uses a 3.5-inch LCD whose backlight is provided by six LEDs connected in series.
The backlight LEDs are controlled by the backlight driver chip TPS61160A. The ground
resistance of the driver chip pin FB is set to 10 Ω, providing up to 20 mA current to the LEDs
(duty:100%). The backlight brightness (driver output current) is controlled by the PWM
signal.

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Figure 9-11 LCD backlight circuit

Backlight
signals

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Anode of the backlight LED

LED_A

Anode of the
backlight LED

Cathode of the backlight LED

LED_K

Cathode of the
backlight LED

Brightness control signals from the
LCD

PWM_OU
T

Reserved

Brightness control signals from the
phone's main chip

LCD_BL_
PWM

GPIO1 (PM8029)

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Troubleshooting Display Failure
Figure 9-12 Display failure

LCD fails to display

Y

Re-install the phone's
firmware. Is the problem
solved?

End

N

Clean the LCD 50-pin male
& female connectors. Snap
them in place again. Is the
problem solved?

Y
End

N
Replace the LCD. Is the
problem solved?

Y
End

N
Return the phone
to the factory

9.4.2 Camera
The Y210 uses a 3.0-megapixel full-frame camera.
The 3.0-megapixel full-frame camera uses a 24-pin board to board (BTB) connector and is
controlled by the I2C bus. The data is transmitted in MIPI mode.

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Figure 9-13 Camera circuit

Table 9-11 Signal definitions
Signal Name

Pin

Camera

Voltage

Remarks

CAM_VIO

VREG_S3 (analog
switch)

IOVDD

1.8

-

CAM_VIO

VREG_S3 (analog
switch)

DVDD

1.8

-

VREG_CAM_2P85

VREG_L17 (PM8029)

AVDD

2.85

Power supply to the
camera autofocus
motor

CAM_AVDD

VREG_L17 (PM8029)

AVDD

2.85

-

CAMIF_MCLK

GPIO_015 (MSM7225A)

MCLK

1.8

Camera reference
clock

MCAMIF_SHDN

GPIO_119 (MSM7225A)

PWDN

1.8

Camera shutdown
signal

CAM_VCM_PD_N

GPIO_07 (MSM7225A)

-

1.8

Camera autofocus
motor control signal

I2C0_SCL

GPIO_060 (MSM7225A)

I2C_SCL

1.8

I2C control signal

I2C0_SDA

GPIO_061 (MSM7225A)

I2C_SDA

1.8

-

MCAMIF_RESET

GPIO_049 (MSM7225A)

Reset

1.8

Reset signal

MCAMIF_ID

GPIO_9 (MSM7225A)

ID

1.8

Module supplier
identification

MIPI_CSI2_CLK_P

MIPI_CSI2_CLK_P

PCLK

-

MIPI clock

MIPI_CSI2_CLK_N

MIPI_CSI2_CLK_N

NCLK

-

MIPI clock

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Signal Name

Pin

Camera

Voltage

Remarks

MIPI_CSI2_LANE1_P

MIPI_CSI2_LANE1_P

MIPI DATA

-

Data
communication
signal

MIPI_CSI2_LANE1_N

MIPI_CSI2_LANE1_N

MIPI DATA

-

Data
communication
signal

MIPI_CSI2_LANE0_P

MIPI_CSI2_LANE0_P

MIPI DATA

-

Data
communication
signal

MIPI_CSI2_LANE0_N

MIPI_CSI2_LANE0_N

MIPI DATA

-

Data
communication
signal

The camera interface circuit is designed for compatibility with multiple types of cameras. The Y210 uses
a 3.0-megapixel full-frame camera, so the CAM_VCM_PD_N and VREG_CAM_2P85 lines are not
used.

Troubleshooting Camera Failure
Figure 9-14 Camera failure
Failure to take photos or
record video using the
camera
Y
Reinstall the phone's
firmware. Is the
problem solved?

End

N
Y
Is J1001 poorly soldered or
are its contacts defective?

Re-solder or replace
J1001

N
Y
Replace the
camera. Is the
problem solved?

End

N
Return the phone
to the factory

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9.4.3 USB
Figure 9-15 USB circuit

Troubleshooting USB Connection Failure
Figure 9-16 USB connection failure

USB connection failure
Y
Use a normal USB
cable. Is the problem
solved?

End

N
Y
Is the 5-pin mini USB
connector poorly soldered?

Re-solder the USB
connector

N
Re-install the
phone's firmware.
Is the problem
solved?

Y
End

N
Return the phone
to the factory

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9.4.4 Headset Jack
The Y210 has a 3.5-mm headset jack. When the headset jack has no headset inserted, the
headset jack's pin 3 and pin 4 are open, and the headset detection voltage is at a high level.
After a headset is inserted, pin 3 and pin 4 are closed, and the headset detection voltage is at a
low level, indicating the insertion of a headset. The HS_DETECT (GPIO86) pin is used to
detect the headset insertion.
The HSED_MICBIAS (PM8029/HSED_BIAS1) supplies power to the headset microphone.
The HSED_HSKEY_ADC (PM8029 MPP5) is used to detect the headset button press.
The Y210 supports only the LRGM headsets and does not support LRMG headsets.

Figure 9-17 Headset jack circuit



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No sound comes from the headset during a call.

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Figure 9-18 No sound
Af ter a call is established, no
sound can be heard from the
headset
N
Is the in-call volume
set to a normal level?

End

Y
Y
Replace the headset. Is the
problem solved?

End

N

N
Is a headset icon
displayed on the
screen?

Replace the
headset jack

Y
Return the phone
to the f actory



The headset button cannot be used to answer a call.

Figure 9-19 Headset button malfunctioning
The headset button cannot be
used to answer a call
Y
Replace the headset.
Is the problem solved?

End

N
Insert the headset. Is the
voltage on J1101's pin 4 at
a low level?

N
Check that J1101 is
properly soldered.

Y
Return the phone
to the factory

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9.4.5 Keys and Buttons
The Y210 has six keys and buttons, three of which are the Menu, Home and Back keys on the
touch panel.
The MSM7225A's GPIO_42 and GPIO_41 pins are connected to the volume up and down
buttons. The side key FPC is connected to the PCBA via the ZIF connector J1605.
The power button press is detected by the PM8029's KYPD_PWR_N pin. The power button
FPC is connected to the PCBA using press-fit contacts.
Figure 9-20 Key and button circuit

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Troubleshooting Key or Button Failure
Figure 9-21 Key or button failure

Key or button failure
N
Is the keypad on the
FPC in good contact
with the dome sheet?

Clean the
keypad and the
dome sheet

Y
N
Are the FPC and ZIF
connector connected
properly?

Re-connect them

Y
Return the phone
to the factory

9.4.6 Tricolor Indicator and Touch Key Backlight Circuits
The Y210's battery charging indicator (tricolor indicator) provides red, green and blue light
sources that are driven by the PM8029's three LED driver.
Table 9-12 Light source and driver pins
Light Source

Driver Pin (PM8029)

Remarks

Red

LED_RED_DRV_N (MPP3)

Adjusted using electric current

Green

LED_GREEN_DRV_N (MPP5)

Adjusted using electric current

Blue

LED_BLUE_DRV_N (MPP8)

Adjusted using electric current

Figure 9-22 Status indicator circuit

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The KYPD_DRV_N (PM8029) is used to adjust the brightness of the keypad's backlight, and
VPH_PWR is used to supply power to the backlight LEDs. The keypad backlight is provided
by two white LEDs. The light from the LEDs is transmitted to the key area using a light guide
film.
Table 9-13 Keypad backlight driver
Keypad Backlight Driver
VPH_PWR

Power supply

Backlight power supply

KPD_DRV_N

Backlight driver
pin

When this pin's voltage is at a low level, the two
backlight LEDs turn on.

Figure 9-23 Touch key backlight circuit

9.4.7 Battery Connector
Figure 9-24 Battery connector circuit

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9.4.8 Accelerometer
Figure 9-25 Accelerometer circuit

Table 9-14 Accelerometer pins
Component
Pin

Network

MSM7225A
Pin

Description

SCL

I2C1_SCL

GPIO_131

I2C bus

SDA

I2C1_SDA

GPIO_132

INT1

MEMS_INT1

GPIO_28

Accelerometer interrupt signal

INT2

MEMS_INT2

GPIO_111

Accelerometer interrupt signal
(sleep)

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9.4.9 Compass
Figure 9-26 Compass circuit

Table 9-15 Compass pins
Component Pin

Network

MSM7225A Pin

Description

SCL

I2C1_SCL

GPIO_131

I2C bus

SDA

I2C1_SDA

GPIO_132

DRDY

COMPASS_INT

GPIO_18

Compass interrupt signal

9.4.10 Proximity Sensor
The Y210 uses a 3-in-1 light, proximity and infrared sensor.

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Figure 9-27 Sensor circuit

Table 9-16 Sensor pins
Component Pin

Network

MSM7225A-0 Pin

Description

SCL

I2C1_SCL

GPIO_131

I2C bus

SDA

I2C1_SDA

GPIO_132

INT

PRO_INT

GPIO_17

3-in-1 interrupt signal

Functions


Detect the intensity of environmental light.



Detect the proximity of objects.

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Figure 9-28 Sensor failure
The phone's display does not turn off when
near the user's ear during a call (The phone is
in portrait orientation; no headset is connected;
handsfree mode is disabled.)
Y
Is the touch panel's light
sensor hole dirty or
blocked?

Clean the hole

N
Y

Re-install the phone's
firmware. Is the problem
solved?

End

N
Y
Is U1207 poorly soldered
or dirty?

Re-solder, clean
or replace U1207

N

Return the phone
to the factory

9.4.11 Vibration Motor
Figure 9-29 Vibration motor circuit

The vibration motor's driving voltage is controlled by PM VIB_DRV_N.

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Troubleshooting Vibration Failure
Figure 9-30 Vibration failure
Vibration failure
Y
Re-install the phone's
firmware. Is the
problem solved?

End

N
Y
Replace the motor. Is the
problem solved?

End

N
Y
Is the voltage on
VIB_DRV_N equal to
the battery voltage?

Replace D902

N
Return the phone
to the factory

9.4.12 Receiver
The receiver receives differential earphone output from the MSM chip.

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Figure 9-31 Receiver circuit

The MSM chip's EARI output signal is connected to the receiver. D1503 and D1504 are the
ESD protection components on the receiver.

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Troubleshooting the Failure that No Sound Can Be Heard During a Call
Figure 9-32 No sound during a call

No sound is heard
during a call
N
Is the in-call volume
set to a normal level?

End

Y

Y

Does the phone mistakenly
detect the insertion of a
headset?

Replace the
headset connector

N
Y
Replace the
receiver. Is the
problem solved?

End

N
Return the phone
to the f actory

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9.4.13 Microphone
Figure 9-33 Microphone circuit

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Troubleshooting the Failure that No Sound Can Be Heard by the Other Party
During a Call
Figure 9-34 No sound heard by the other party during a call

No sound can be heard by
the other party during a call
Y
Re-install the phone's
firmware. Is the
problem solved?

End

N
N
Is the MIC_BIAS voltage
equal to 1.8 V?

Check U201

Y
Y
Replace the
microphone. Is the
problem solved?

End

N
Return the phone
to the factory

9.4.14 Touch Panel
Figure 9-35 Touch panel circuit

The Y210's 3.5-inch capacitive touch panel has a touch key area containing three touch keys.
The backlight LEDs for the three touch keys are located on the PCBA. A light guide film is

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used to guide light from the LEDs to the touch key area. Table 9-17 describes the interfaces
between the touch panel, MSM7225A, and PM8029.
Table 9-17 Interfaces between touch panel, MSM7225A, and PM8029
Touch Panel
Interface

Pin

Description

VDD_2V8_TP

VREG_L12_2P85
(PM8029)

Touch panel analog power supply, 2.85 V

VREG_S3

VREG_S3 (PM8029)

Touch panel digital power supply and I/O
connector power supply, 1.8 V

TOUCH_INT

GPIO_82
(MSM7225A)

Touch panel interrupt signal

I2C1_SCL

GPIO_131
(MSM7225A)

Touch panel's I2C clock

I2C1_SDA

GPIO_132
(MSM7225A)

Touch panel's I2C data

TOUCH_RST_N

GPIO_96
(MSM7225A)

Touch panel reset signal

9.4.15 SIM Card
The MSM7225A is not compatible with the SIM card interface. The PM8029's MPP pins are
used to convert voltage levels of the signals for communication between the MSM7225A and
the SIM card.
The voltage of VREG_L16_UIM1 can be set to 1.5–3.05 V. The USIM interface's operating
voltage is usually 1.8 V or 3.0 V. Table 9-18 describes the voltage level conversion interface
of the PM8029.
Table 9-18 Voltage level conversion interface of the PM8029
Signal for Interfacing
with the MSM

Voltage
Level

Signal for Interfacing
with the USIM Card

Voltage Level

-

VREG_S3

UIM1_RESET

VREG_L16_UIM1

UIM1_MSM_CLK

UIM1_CLK

(configured by the
phone's firmware)

UIM1_MSM_DATA

UIM1_DATA

Considering that SIM card operations are frequent, transient-voltage-suppression (TVS) diodes are
added to the circuit to provide ESD and surge protection.

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Table 9-19 USIM card circuit

9.4.16 microSD Card
The microSD card connector's SD_DETECT pin is used to detect the insertion of a microSD
card. When a microSD card is inserted, the pin is grounded and its voltage is at a low level.
When no microSD is inserted, its voltage is at a high level. The U1402 is an electromagnetic
interference (EMI) and ESD protection component for the microSD card.

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Figure 9-36 microSD card circuit

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10 Solder Points on the PCBA and BGA Chip

10

Solder Points on the PCBA and BGA
Chip

Red (R: 255, G: 0, B: 0)
Green (R: 0, G: 255, B: 0)
Blue (R: 0, G: 0, B: 255)

: Vacant point
: Ground point
: Solder point

Figure 10-1, Figure 10-2, Figure 10-3, and Figure 10-4 show magnified views of sections.
Figure 10-5 shows the complete PCB view.

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Figure 10-1 PM section

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Figure 10-2 MSM7225A+NAND MCP section

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Figure 10-3 Wi-Fi/Bluetooth/FM section

Figure 10-4 RTR8285A section

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Figure 10-5 Complete PCB view

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11 Functional Tests

11

Functional Tests

11.1 MMI Test
On the home screen, enter *#*#2846579#*#* to enter MMI test mode. Press the volume down
button to start a test. Touch the Menu key on the touch panel to skip the current test and go to
the next step. Touch the Back key to return to the previous test.
NOTE


When no battery is installed or the battery voltage is low, the phone will prompt that the battery is
low and MMI test cannot be started.



During a test, if you touch the Menu key on the touch panel, the test will be skipped and marked as a
failed test.

Table 11-1 MMI test
No.

Category

Item

Test Method

1

microSD card
test

microSD card test

Automatically test the microSD card functions. If a microSD
card is found and is available, the test passes; otherwise, the test
fails.
If this test passes, the next test automatically starts.

2

SIM card test

SIM card test

Automatically test whether the SIM card can be recognized. If
the SIM card cannot be recognized, a message will be displayed,
indicating that this test fails.
If this test passes, the next test automatically starts.

3

Battery test

Battery test

Automatically test whether the battery is in place and whether its
power is sufficient. If this test fails, a message will be displayed.
If this test passes, the next test automatically starts.

4

Keypad test

Keys

Touch or press all the keys and buttons.
When a key or button is touched or pressed, the color of the
corresponding key displayed on the screen will change (from
white to blue, or from blue to white).
Press the volume down button to start the next test.

5

LCD test

White screen

The LCD displays a white screen.
Press the volume down button to start the next test.

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No.

Category

11 Functional Tests

Item

Test Method

Black screen

The LCD displays a black screen.
Press the volume down button to start the next test.

Red and blue bars

The LCD displays red and blue bars.
Press the volume down button to start the next test.

6

LCD backlight
test

LCD backlight
and tricolor status
indicator

If the LCD backlight repeatedly turns on and off, the LCD
backlight is normal. The status indicator is normal if its color
repeatedly changes in the sequence of red, green and blue.
Press the volume down button to start the next test.

7

Keypad
backlight test

Keypad backlight
LEDs

If the keypad backlight repeatedly turns on and off, the backlight
LEDs are normal.
Press the volume down button to start the next test.

8

Camera test

Camera test

Automatically test the camera. The phone's camera is turned on,
and the LCD displays the preview. Check the image quality
visually and test the camera's response speed to determine the
camera's performance.
Press the volume down button to start the next test.

9

Touch panel
test

Touch panel

Place your finger on the touch panel, and slide your finger along
the touch panel edges. The areas near the route that your finger
passes should turn red.
Press the volume down button to start the next test.

10

11

12

Proximity test

Environmental
light test

Vibration test

Proximity and
light sensor's
proximity
detection function

Place the light shielding plate approximately 4 mm above the
light hole. If the portrait icon changes to an in-call icon, the
function is normal.

Proximity and
light sensor's
function to sense
environmental
light

Check whether the environmental light sensing data is detected:
Use your hand to block the light hole, the light sensing number
will decrease to approximately 10 if the light sensor functions
properly.

Vibration motor

The motor will vibrate intermittently.

If this test passes, the next test automatically starts.

If this test passes, the next test automatically starts.

Check whether the vibration (including the vibration sound) is
normal.
Press the volume down button to start the next test.
13

Speaker test

Speaker test

Automatically test the speaker. (Do not insert the headset.) If the
speaker emits sound during the test, it is normal.
Press the volume down button to start the next test.

14

Main
microphone
loopback test

Main microphone
(located near the
USB port)

Do not insert the headset. Touch the Record button. Speak to the
main microphone, and then touch the Play button. If the main
microphone is normal, you can hear the voice recording from
the receiver.
Press the volume down button to start the next test.

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No.

Category

Item

Test Method

15

Secondary
microphone
loopback test

Secondary
microphone
(located above the
camera at the
phone's rear)

Do not insert the headset. Touch the Record button. Speak to the
secondary microphone, and then touch the Play button. If the
secondary microphone is normal, you can hear the voice
recording from the receiver.

Main and
secondary
microphones

Do not insert the headset. Touch the Record button. Speak to the
phone as you do during a call, and then touch the Play button. If
the main and secondary microphones are normal, you can hear
the voice recording from the receiver.

16

Dual
microphone
loopback test

Press the volume down button to start the next test.

Press the volume down button to start the next test.
17

Headset
loopback test

Insert the headset. Touch the Record button. Speak to the
headset microphone, and then touch the Play button. If the
headset is normal, you can hear the voice recording from the
headset's earphones.

Headset

Keep the headset inserted. Press the volume down button to start
the next test.
18

FM test

The testing software will detect whether a headset is inserted. If
no headset is inserted, a message requesting a headset to be
inserted will be displayed. After a headset is inserted, the phone
will search for and play an FM channel. Three frequencies (88
MHz, 98 MHz and 107 MHz) will be tested. The 88 MHZ
frequency will be tested first. To test the next frequency, touch
Next.

FM test

Remove the headset. Press the volume down button to start the
next test.
19

Headset button
test

Headset button
test

Insert the headset. The IN icon will turn green.
Press the headset button, the round dot will become smaller.
Remove the headset, the OUT icon will turn green.
Press the volume down button to start the next test.

20

Bluetooth test

Bluetooth test

Automatically test the Bluetooth functions.
During the test, the phone will search for nearby Bluetooth
devices, and display the MAC addresses of the Bluetooth
devices that have been found. (Note: This test requires another
device with Bluetooth enabled.)
Press the volume down button to start the next test.

21

Tilt-sensor test

Accelerometer

The LCD displays the current acceleration in the X, Y and Z
axes. Place the phone in a position where the angles between the
X, Y and Z axes are 45°. If the acceleration in the X, Y and Z
axes is equal to each other, the phone passes this test.
If this test passes, the next test automatically starts.

22

Compass test

Compass

If this test passes, the next test automatically starts. If this test
fails, a message will appear, indicating the failure.

23

Wi-Fi test

Wi-Fi test

Automatically test the Wi-Fi functions.
During the test, the phone will search for nearby hotspots, and

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No.

11 Functional Tests

Category

Item

Test Method
display the MAC addresses of the hotspots that have been found.
(Note: This test requires an active hotspot in the testing
environment.)
Press the volume down button to start the next test.

24

Displaying test
results

Displaying test
results

Display the MMI test results.
Failed test items will be listed.

11.2 Voice Call Test
To test the voice call function, perform the following steps:
Step 1 Install a UIM card and battery on the phone.
Step 2 Press the power button to power the phone on.
Step 3 Check whether the signal strength displayed on the LCD is normal (given that the network is
normal).
Step 4 Make a call to a fixed-line phone, and check the voice quality during the call.
If no problems are found, finish the voice call test. If any problems are found, troubleshoot
the phone or send it to an advanced service site for repair.
----End

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Title                           : Release Notes
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