Huawei Release Notes F Tanjim OTB Y210 Maintenance Manual
2014-08-11
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Y210 Mobile Phone
Maintenance Manual
Issue
1.0
Date
2012-11-28
HUAWEI TECHNOLOGIES CO., LTD.
Issue 1.0 (2012-11-28)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
i
Copyright © Huawei Technologies Co., Ltd. 2012. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.
Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees or
representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.
Address:
Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website:
http://www.huawei.com
Email:
support@huawei.com
Y210 Mobile Phone
Maintenance Manual
About This Document
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ii
About This Document
Author
Prepared by
R&D
Date
-
Reviewed by
Maintenance support team
Date
-
Approved by
Service representative
Date
-
Change History
Date
Version
Change Reason
Section
Description
Author
Y210 Mobile Phone
Maintenance Manual
Contents
Issue 1.0 (2012-11-28)
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Copyright © Huawei Technologies Co., Ltd.
iii
Contents
About This Document .................................................................................................................... ii
1 Product Overview ......................................................................................................................... 1
1.1 Appearance ....................................................................................................................................................... 1
1.2 Features ............................................................................................................................................................ 2
2 Applicable Scope and Precautions ............................................................................................ 4
2.1 Applicable Scope .............................................................................................................................................. 4
2.2 Precautions ....................................................................................................................................................... 4
2.3 How to Obtain Product and Repair Information .............................................................................................. 4
3 Exploded View............................................................................................................................... 5
4 Components on the PCBA ........................................................................................................... 7
5 Software Upgrade ......................................................................................................................... 9
5.1 Upgrade Preparation ......................................................................................................................................... 9
5.2 Performing an Upgrade .................................................................................................................................... 9
6 Maintenance Tools ...................................................................................................................... 11
7 Disassembly Procedure .............................................................................................................. 13
8 Assembly Procedure ................................................................................................................... 17
9 Principles and Failure Analysis ............................................................................................... 21
9.1 Block Diagram ............................................................................................................................................... 21
9.1.1 Functions of the PCBA ......................................................................................................................... 22
9.2 Baseband Unit ................................................................................................................................................ 26
9.2.1 Power-on Management Circuits ............................................................................................................ 26
9.2.2 Charging Management Circuits ............................................................................................................ 30
9.3 RF Unit ........................................................................................................................................................... 31
9.3.1 RF Failure ............................................................................................................................................. 31
9.3.2 GPS ....................................................................................................................................................... 35
9.3.3 Wi-Fi/Bluetooth/FM Module ................................................................................................................ 35
9.4 Peripheral Circuits .......................................................................................................................................... 37
9.4.1 Display .................................................................................................................................................. 37
9.4.2 Camera .................................................................................................................................................. 40
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9.4.3 USB ....................................................................................................................................................... 43
9.4.4 Headset Jack.......................................................................................................................................... 44
9.4.5 Keys and Buttons .................................................................................................................................. 46
9.4.6 Tricolor Indicator and Touch Key Backlight Circuits ........................................................................... 47
9.4.7 Battery Connector ................................................................................................................................. 48
9.4.8 Accelerometer ....................................................................................................................................... 49
9.4.9 Compass ................................................................................................................................................ 50
9.4.10 Proximity Sensor ................................................................................................................................. 50
9.4.11 Vibration Motor ................................................................................................................................... 52
9.4.12 Receiver .............................................................................................................................................. 53
9.4.13 Microphone ......................................................................................................................................... 56
9.4.14 Touch Panel ......................................................................................................................................... 57
9.4.15 SIM Card ............................................................................................................................................. 58
9.4.16 microSD Card ..................................................................................................................................... 59
10 Solder Points on the PCBA and BGA Chip ......................................................................... 61
11 Functional Tests......................................................................................................................... 67
11.1 MMI Test ...................................................................................................................................................... 67
11.2 Voice Call Test .............................................................................................................................................. 70
Y210 Mobile Phone
Maintenance Manual
1 Product Overview
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1
1 Product Overview
1.1 Appearance
Figure 1-1 shows the appearance of the HUAWEI Ascend Y210 mobile phone (Y210 for
short).
Figure 1-1 Y210 mobile phone
Y210 Mobile Phone
Maintenance Manual
1 Product Overview
Issue 1.0 (2012-11-28)
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2
1.2 Features
Table 1-1 describes the features of the Y210.
Table 1-1 Features
Item
Description
Dimensions (H x W x D)
12.4 mm x 117 mm × 62 mm
Technical standards
- Y210-0010: W2100/W900,
GSM900/1800/1900
- Y210-0100: W2100/W900,
GSM850/900/1800/1900
- Y210-0151: W2100/W1900/W850,
GSM850/900/1800/1900
- Y210-0200: W2100/W900,
GSM850/900/1800/1900
- Y210-0251: W2100/W1900/W850,
GSM850/900/1800/1900
GSM = Global System for Mobile
Communications
Frequency bands
- Y210-0010: W2100/W900,
GSM900/1800/1900
- Y210-0100: W2100/W900,
GSM850/900/1800/1900
- Y210-0151: W2100/W1900/W850,
GSM850/900/1800/1900
- Y210-0200: W2100/W900,
GSM850/900/1800/1900
- Y210-0251: W2100/W1900/W850,
GSM850/900/1800/1900
Frequency ranges:
- WCDMA 900 MHz: 880–915 MHz (uplink),
925–960 MHz (downlink)
- WCDMA 2100 MHz: 1920–1980 MHz
(uplink), 2110–2170 MHz (downlink)
- WCDMA 1900 MHz: 1850–1910 MHz
(uplink), 1930–1990 MHz (downlink)
- WCDMA 850 MHz: 824–849 MHz (uplink),
869–894 MHz (downlink)
- GSM 850 MHz: 824–849 MHz (uplink),
869–894 MHz (downlink)
- GSM 900 MHz: 880–915 MHz (uplink),
925–960 MHz (downlink)
- GSM 1800 MHz: 1710–1785 MHz (uplink),
1805–1880 MHz (downlink)
- GSM 1900 MHz: 1850–1910 MHz (uplink),
Y210 Mobile Phone
Maintenance Manual
1 Product Overview
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Item
Description
1930–1990 MHz (downlink)
WCDMA = Wideband Code Division Multiple
Access
Weight
< 130 g with battery
Type
Bar type
Antenna
Built-in
Card type
Subscriber identity module (SIM) and universal
subscriber identity module (USIM)
Charger
5 V, 550 mA
Battery
1250 mAh Li-ion
- Standby time: up to 305 hours
- Talk time: up to 670 minutes (depending on
network conditions)
Display
Resolution
320 x 480 pixels
Liquid crystal
display (LCD) type
Thin film transistor (TFT)
Color
262K
LCD size
3.5 inches
Ports
Charging port
Micro Universal Serial Bus (USB) port
USB port
Micro USB port
microSD card slot
microSD card slot
Headset jack
3.5 mm (LRGM)
Maximum
transmit power
23–33 dBm
Static sensitivity
≤ –104 dBm
Temperature
- Operating temperature: –10°C to +55°C
- Storage temperature: –40°C to +70°C
Humidity
Operating humidity: 5% to 95% RH
Y210 Mobile Phone
Maintenance Manual
2 Applicable Scope and Precautions
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2 Applicable Scope and Precautions
2.1 Applicable Scope
This document provides repair instructions for technicians at service centers authorized by
Huawei. Being Huawei proprietary, this document is accessible only for authorized service
centers and companies. Although every effort was made to ensure the accuracy of this
document, errors may still exist. If you find any errors or have any suggestions, please contact
Huawei's customer service.
2.2 Precautions
- Only qualified technicians are allowed to perform repair and calibration.
- Perform all operations in electrostatic discharge (ESD) rooms and wear ESD wrist straps
throughout the operations.
- Ensure that all the components, screws, and insulators are properly installed after repair
and calibration, and that all cables and wires are installed and connected correctly.
- Ensure that the soldering is lead-free and compliant with eco-friendly requirements.
2.3 How to Obtain Product and Repair Information
To obtain product and maintenance information, visit Huawei website at:
http://www.huaweidevice.com/cn/technicaIndex.do.
Y210 Mobile Phone
Maintenance Manual
3 Exploded View
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3 Exploded View
Figure 3-1 shows the exploded view of the Y210.
Figure 3-1 Exploded view
The components listed in the following table are structural parts of the phone and cannot be used as
reference to request spare parts.
Table 3-1 lists the components in the exploded view.
Table 3-1 Components in the exploded view
No.
Description
Quantity
1
Touch panel
1
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3 Exploded View
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No.
Description
Quantity
2
Front cover assembly
1
3
Power button flexible printed circuit (FPC) assembly
1
4
Receiver
1
5
LCD
1
6
LCD conductive rubber
2
7
Receiver insulation film
1
8
Printed circuit board assembly (PCBA)
1
9
Volume button FPC assembly
1
10
Motor
1
11
Speaker
1
12
Main antenna support assembly
1
13
Camera support foam
1
14
Camera
1
15
Rear cover assembly
1
16
Battery
1
17
Screws
8
18
Battery cover
1
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Maintenance Manual
4 Components on the PCBA
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4 Components on the PCBA
J1101 headset jack
Faults caused if damaged:
Handset malfunctions
L901 motor contact
U6100 Wi-Fi chip
Faults caused if damaged:
Wi-Fi malfunctions
U1303 backlight driver IC
Faults caused if damaged:
Black screen
U6000 Bluetooth & FM chip
Faults caused if damaged:
Bluetooth or FM malfunctions
U601 MCP chip
Faults caused if damaged:
Power-on failure or software
failure
J1605 volume button FPC
port
Faults caused if damaged:
Volume button malfunctions
U401 CPU-MSM7225A
Faults caused if damaged:
Power-on failure or system
not responding
U201 PMIC-PM8029
Faults caused if damaged:
Power failure
J1601 touch panel port
Faults caused if damaged:
Touch panel malfunctions
J1302 LCD port
Faults caused if damaged:
LCD malfunctions
J1401 SD card slot
Faults caused if damaged:
SD card malfunctions
J901 USB port
Faults caused if damaged:
USB connection failure
U1204 Gravity sensor
Faults caused if damaged:
Gravity sensor malfunctions
J1402 SIM card holder
Faults caused if damaged:
SIM card identification failure
J1403 dual card SIM 2 card
holder
Faults caused if damaged:
SIM card identification failure
U3801 WCMDA/GSM
transception chip
Faults caused if damaged:
RF function error
U3302 power module, PA
Faults caused if damaged:
U3501 power module, PA
Faults caused if damaged:
GSM900 transmit error
U3201 RF switch
Faults caused if damaged:
Network registration failure
J3204 RF connector
Faults caused if damaged:
Network registration failure
J902 battery connector
Faults caused if damaged:
Battery power supply failure
SP1501 speaker contact
Faults caused if damaged:
Speaker malfunctions
U3401 power module, PA
Faults caused if damaged:
RF transmit error
U4202 power module, PA
Faults caused if damaged:
RF transmit error
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Maintenance Manual
4 Components on the PCBA
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SP1502 receiver contact
J1608 J1608 power button
spring
Faults caused if damaged:
Power button malfunctions
MIC1501 microphone
Faults caused if damaged:
No sounds for recordings
D1602 D1603 D1604 power
button LED
Faults caused if damaged:
Functional keys backlight off
D1601 tri-color indicator
Faults caused if damaged:
Indicator off
Y210 Mobile Phone
Maintenance Manual
5 Software Upgrade
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5 Software Upgrade
5.1 Upgrade Preparation
Prepare the items listed in Table 5-1 before a software upgrade.
Table 5-1 Items to be prepared
Item
Description
Remarks
Upgrade
environment
Computer
The computer is used to copy upgrade
software.
microSD card
The microSD card must have more than 1 GB
free space.
Battery
The battery level must not be lower than 30%.
Upgrade file
Main upgrade package
dload/UPDATE.app
Vendor upgrade
package
vendor_XXX_XXX/UPDATE.app
Upgrade
method
Using the microSD card
Normal upgrade
Forcible upgrade
5.2 Performing an Upgrade
To upgrade the Y210, perform the following steps:
Step 1 Format the microSD card.
Step 2 Create a dload folder in the microSD card's root directory.
Step 3 Copy the upgrade file to the dload folder.
Step 4 Insert the microSD card to the Y210, and power on the phone. On the standby screen, enter
*#*#2846579#*#*, select SD card upgrade, and touch Confirm.
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Maintenance Manual
5 Software Upgrade
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Before the upgrade, NV items backup is performed (if the phone's NV items has never been
backed up). Then, the phone restarts and the upgrade starts.
The upgrade progress is displayed on the LCD.
Figure 5-1 shows the upgrade progress.
Figure 5-1 Upgrade progress
After the upgrade, the phone restarts and the NV items are restored.
Step 5 After the phone is upgraded using the main upgrade package, upgrade the phone using the
vendor upgrade package in the same way.
----End
If the phone fails to start, use either of the following methods to perform a forcible upgrade:
- Install the battery on the phone. If the screen splashes, remove the battery, wait for 5
seconds, and re-install the battery. Press and hold the volume up and down buttons, and
press the power button. The phone then enters forcible upgrade mode. The software
download process is similar to that during a normal upgrade.
- If no battery is installed, press and hold the volume up and down buttons, and connect
the charger. The phone then enters forcible upgrade mode. It is recommended that you
upgrade the software using the charger. If the upgrade still fails, replace the microSD
card and try again.
Y210 Mobile Phone
Maintenance Manual
6 Maintenance Tools
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6 Maintenance Tools
Name: constant-temperature heat gun
Usage: to heat components
Name: constant-temperature heat gun
Usage: to heat components
Name: soldering iron
Usage: to maintain and solder components
Name: direct current (DC) power supply
Usage: to supply DC current
Name: soldering table
Usage: to secure the PCBA
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Maintenance Manual
6 Maintenance Tools
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Name: lead-free solder wire
Usage: to solder components
Name: digital multimeter
Usage: to measure during repair
Name: toolkit
Usage: to assemble and disassemble phone
Name: electric screwdriver
Usage: to fasten and remove screws
Y210 Mobile Phone
Maintenance Manual
7 Disassembly Procedure
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7 Disassembly Procedure
4. Remove the battery.
3. Remove the battery cover: Press the upper part of
the battery cover and push it towards the bottom.
2. Follow the Y210 disassembly instructions.
1. Wear an electro-static discharge (ESD) wrist strap,
and ensure that the strap is grounded properly.
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7 Disassembly Procedure
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10. Release the volume key FPC.
9. Remove the volume key.
8. Use a cover opener to release the latches between
the rear cover and the front cover.
7. Use the disassembly tab to release the latch in the
upper left corner.
6. Use the disassembly tab to release the latch in the
upper left corner.
5. Remove the eight screws from the rear cover.
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7 Disassembly Procedure
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16. Apply a protective film on the LCD.
15. Remove the LCD.
14. Release the BTB connector, and remove the
camera.
13. Remove the PCBA.
12. Release the two latches on the PCBA.
11. Release the BTB connector cable between the
touch panel and the LCD.
Y210 Mobile Phone
Maintenance Manual
7 Disassembly Procedure
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The Y210 has two versions: single card and dual card versions. The pictures for disassembling and
assembling a single-card Y210 are used. The phone disassembly and assembly methods for the two
versions are the same.
22. The phone is then disassembled.
21. Remove the motor.
20. Remove the speaker.
19. Remove the receiver.
18. Remove the power button FPC.
17. Apply a protective film on the inner side of the
touch panel.
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8 Assembly Procedure
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8 Assembly Procedure
4. Install the speaker.
3. Install the motor.
2. Follow the Y210 assembly instructions.
1. Wear an ESD wrist strap, and ensure that the strap is
grounded properly.
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8 Assembly Procedure
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10. Gently press the PCBA to close the latches and
secure the PCBA.
9. Place the PCBA on the front cover. Ensure that the
PCBA is in good contact with the front cover at the
power button position. Snap the latches in place.
8. Install the LCD. Ensure that the two latches are
snapped in place and that the LCD is even.
7. Remove the protective film from the LCD.
6. Install the power button FPC.
5. Install the receiver.
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8 Assembly Procedure
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16. Install the battery cover.
15. Install the battery: Insert it into the battery
compartment bottom first.
14. Install the eight screws onto the rear cover.
13. Install the rear cover: Snap the rear cover's bottom,
and press its top.
12. Install the volume button: Install the volume button
FPC into the ZIF connector, and attach them to the
front cover.
11. Snap the LCD's BTB connector and then the touch
panel's BTB connector in place.
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8 Assembly Procedure
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The Y210 has two versions: single card and dual card versions. The pictures for disassembling and
assembling a single-card Y210 are used. The phone disassembly and assembly methods for the two
versions are the same.
17. The phone is then assembled.
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Maintenance Manual
9 Principles and Failure Analysis
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9 Principles and Failure Analysis
9.1 Block Diagram
Figure 9-1 shows the block diagram of the Y210.
Figure 9-1 Block diagram
MSM7X2XA (The Y210U uses the MSM7225A) is the baseband signal processing chip,
mainly responsible for processing the input and output of image, video, audio, memory
support, RF interface, and connectivity signals. The baseband chip provides keypad, LCD,
microSD card, Wi-Fi, Bluetooth, camera, microphone, and touch panel interfaces.
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9 Principles and Failure Analysis
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The PM8029 is mainly responsible for:
- Detecting the connection and disconnection of the external power supply.
- Supplying power to the phone.
- Providing analog multi-channel switch, real-time clock circuit, temperature compensated
crystal oscillator (TCXO) clock circuit, motor driver circuit, and speaker driver circuit.
The RTR6285A is the radio frequency (RF) signal processing chip, responsible for converting
Universal Mobile Telecommunications System (UMTS)/GSM uplink/downlink RF signals
and using I/Q signals to exchange data with the baseband chip.
9.1.1 Functions of the PCBA
By function, the PCBA can be divided into four subsystems: baseband, RF, power, and user
interface subsystems. Table 9-1 describes the subsystems' modules and units, as well as their
functions.
Table 9-1 PCBA subsystems' modules, units, and their functions
Subsystem
Module
Unit
Function
Baseband
subsystem
MSM7225A
Modem subsystem
The modem subsystem includes the
ARM11 processor, modem digital
signal processor (DSP), modem
Advanced High-performance Bus
(AHB), interruption controller, and
sleep controller.
The ARM9 is a 400 MHz modem
processor, responsible for modulation
and demodulation of WCDMA,
Global Positioning System (GPS),
and GSM signals.
Application subsystem
The subsystem includes Advanced
RISC Machines (ARM) A5 processor,
application DSP, and dedicated data
mover.
The A5 processor has a clock rate of
1400 MHz, supporting function
modules such as the microSD card,
EBI2, UART/USIM, I2C, GPIO, and
clock modules.
- UART = universal asynchronous
receiver/transmitter
- I2C = Inter-Integrated Circuit
- GPIO = General Purpose
Input/Output
User interface processing unit
Provides camera, pulse code
modulation (PCM), broadband codec,
vocoder, RF, HKADC, LCD,
microSD card, USB, UART, USIM
card, southbound interface (SBI),
GPIO, JTAG/ETM, and keypad
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9 Principles and Failure Analysis
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Subsystem
Module
Unit
Function
interfaces.
Multimedia and game engine
The multimedia and game engine of
the MSM7227 runs Mpeg/jpeg
hardware engine and game engine,
JAVA accelerator, and provides
MP3/MMS/MIDI functions.
- MP3 = MPEG audio layer-3
- MMS = multimedia messaging
service
- MIDI = musical instrument digital
interface
PM8029
Power supply voltage
monitoring
Lists objects being monitored, such as
the external power supply input,
Li-ion battery, and charger.
Temperature monitoring
Monitors the battery temperature.
NAND
NAND feature, power
consumption, file system
support
Stores applications and NV items.
Capacity: 4 GB.
DDR1 RAM
Memory
Provides storage space for running
applications. Capacity: 512 GB.
RAM = random access memory
RF
subsystem
WCDMA, and
GSM/DCS signal
transmission and
reception
AFC circuit, APC circuit, AGC
circuit, and each component
Performs the RF function of
WCDMA signal reception and
transmission, and mainly includes the
RTR6285A RF chip and the
peripheral circuit.
GPS
GPS reception
Receives and processes GPS signals
and mainly includes the RTR6285A
chip and the peripheral circuit.
Bluetooth interface
Bluetooth/Wi-Fi/Frequency
modulation (FM) 3-in-1
module
Performs baseband function for
Bluetooth and Wi-Fi signals, and
transmits and receives Bluetooth and
Wi-Fi RF signals. It mainly includes
the Bluetooth and Wi-Fi module and
its peripheral circuit.
Wi-Fi interface
Same as the Bluetooth
interface.
Same as the Bluetooth interface.
Oscillator and
frequency
synthesizer
Crystal oscillators
Generates highly accurate VCTCXO
frequency for the 19.2 MHz local
reference clock. The RTR6285A has a
built-in local oscillator (LO)
providing clock frequency for
transmitting and receiving WCDMA
and GPS signals.
VCTCXO = Voltage Controlled
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9 Principles and Failure Analysis
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Subsystem
Module
Unit
Function
Temperature Compensated Crystal
Oscillator
Antenna
External antenna, internal
interface component, antenna
protection
The phone uses internal antennas for
wireless communication, supporting
WCDMA high and low frequency
bands. The antennas are the main
antenna, GPS antenna, diversity
antenna, Wi-Fi/Bluetooth antenna,
and FM antenna (headset).
Coupler
Power coupler
Couples part of the power output
from the WCDMA power amplifier to
the RTR6285A for power monitoring.
User
interface
subsystem
UART interface
-
MSM7225A subsystem's UART1
interface for Bluetooth.
USB interface
Driver, protection circuit,
output interface component
The peripheral circuit, protection
circuit and interface connectors of the
USB interface in the MSM7225A
subsystem. It is the major data service
channel for the engineering sample,
and can be used to debug and test
devices during product development.
USIM card interface
Power supply, protection
circuit, USIM card holder
Mainly includes the USIM card
holder and related connection circuits.
Keypad and
backlight
Keypad driver circuit, external
keypad, backlight light emitting
diode (LED) control circuit
- Supports GPIO for keypad
scanning.
- Provides backlight LED. When a
key is pressed, the backlight is on.
- Works in conjunction with
PM8029 to provide the keypad
backlight brightness adjustment
function.
Color LCD and
backlight
LCD driver, interface mode,
and backlight control
Phone's LCD with 256K colors. The
brightness of the LCD backlight can
be adjusted by users.
Speaker for playback
of MIDI ringtone
Driver mode, connection mode,
speaker component
Plays polyphonic ringtones for
incoming calls. The maximum power
of the speaker is 500 mW.
It has good frequency response for
playing 20–20000 Hz ringtones. It
can also play monophonic MP3 audio
files.
Receiver
Driver mode, connection mode,
receiver component
Emits sound during a call.
Microphone
Interface circuit, connection
mode, microphone component
The phone has two built-in
microphones to eliminate the
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Subsystem
Module
Unit
Function
environmental noise.
Headset
Headset, headset interface
circuit, microphone interface
circuit
The phone provides a headset jack to
output music playback audio or voice
during a call. The microphone on the
headset cable can pick sound and
input it into the phone. The headset
jack is compatible with iPhone
headsets.
Vibration motor
interface
Driver mode, connection mode,
motor
When there is an incoming call, the
motor can vibrate to notify the user of
the call.
Accelerometer
I2C interface control
Senses acceleration to help implement
game functions.
Battery
Li-ion battery
3.7 V/1700 mAh (the battery must be
certified and comply with relevant
safety regulations).
Power
subsystem
External power
supply (travel
charger)
Adapter and interface
component
- The charger meets the
requirements of China, Europe,
the USA, and Australia.
- Charger specifications: 90–240 V,
45–55 Hz, AC input. The model
differs with different markets.
- The output voltage of the charger
is 5 ± 0.25 V. The charger must be
CE and CCC certified.
- The charger's output current must
be able to charge the battery and
supply power to the phone for
normal operation at the same time.
- The charging current requirement
is 550 mA.
Power distribution
network and power
management
function
Power distribution network
Includes filter networks and PCB
traces for the power supply.
PM8029 enhanced
function
Battery management, charging
circuit, charging mode, and
charging protection
Manages battery charging and
discharging, provides overcharging
and over-discharging protection, and
charges the capacitor that supplies
power to maintain the real-time clock
(RTC).
Board circuit power
management (power-on/off
analysis)
Mainly controls the low-dropout
(LDO) regulator power supply to
flexibly manage power supply.
Based on the service status and the
requirements of the protocols and
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Subsystem
Module
Unit
Function
power-saving analysis, the board
software manages the power supplies
to the units on the board to reduce
power consumption.
RTC
The built-in RTC circuit uses a sleep
clock of 32.768 kHz to provide
precise time.
HKADC
Contains 8 multipurpose pin (MPP)
interfaces. Analog-to-digital
conversion can be implemented inside
the PM8029.
TCXO driver
The PM8029 has a built-in TCXO
driver providing two analog signal
output channels and two digital signal
output channels.
UVLO
Provides the Undervoltage-Lockout
(UVLO) function. When the input
voltage is lower than the threshold for
a specific period of time, the phone
powers off.
Overheat protection
When the on-chip junction
temperature exceeds 150°C, the
phone powers off.
Internal driver circuit
Provides one vibration motor driver
and one speaker driver.
Interrupt management
The built-in interrupt manager
handles related interrupt signals.
USB driver
Supports USB 2.0; does not support
USB On-The-Go (USB OTG).
9.2 Baseband Unit
9.2.1 Power-on Management Circuits
On the Y210U, most power supplies are provided by the power management chip PM8029.
The PM8029 provides two types (switched-mode power supply and LDO regulators) of
programmable voltage regulators with a total of 24 output channels. Table 9-2 lists the voltage
regulator parameters.
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Table 9-2 Voltage regulator specifications
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Troubleshooting Process
To troubleshoot the power-on failure, check whether the I/O connector (battery connector) is
damaged. If the I/O connector (battery connector) is not damaged, use a DC regulated power
supply to supply power to the phone, and test the phone's current.
The power-on failure may be caused by any of the following conditions:
- No current
Figure 9-2 No current
Replace J902
N
Power-on failure:
no current
Is the battery
connector J902
normal?
Replace Q201
N
Is Q201 normal?
Y
Re-solder or replace
U201
Y
- Weak current
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Figure 9-3 Weak current
End
Y
Power-on failure:
weak current
Reinstall the phone's
firmware. Is the problem
solved?
Is U210's output
voltage normal? Replace U201
N
N
Replace U401
N
Does X301 have
32.768 kHz output?
Replace U601 and reinstall
the phone's firmware. Is the
problem solved?
Y
Replace X301
N
End
Y
Y
- Excessive current
Excessive current is caused by short circuits. When excessive current occurs, to prevent
damage to components, do not connect the charger to the phone. Power-on failure due to
excessive current is usually the result of short-circuited VBAT circuit.
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Figure 9-4 Excessive current
Check whether
VPH_PWR and
PM outputs are
short-circuited.
N
Power-on failure:
excessive current
Test the VBAT circuit. Is it
a short circuit?
Is J902 normal? Re-solder or
replace J902.
N
Y
Replace U401.
N
Is Q201 normal?
Remove U201. Do short
circuits still exist?
Y
Replace Q201.
N
Replace U201.
Y
Y
9.2.2 Charging Management Circuits
Figure 9-5 Charging management circuits
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Troubleshooting Charging Failure
Figure 9-6 Charging failure
Charging failure
Is J901 poorly
soldered? Re-solder J901
Is the battery in good
contact with the battery
connector?
End
Does VPH_PWR have
voltages?
Repair or replace
J902
Replace U201
N
Y
Y
Y
N
N
Is the battery damaged? Replace the
battery
Y
N
Y
Y
Is there voltage difference
between Q201' pin 2 and
pin 3?
Replace Q201
N
Is the charger working
properly?
Replace the
charger
N
Y
9.3 RF Unit
9.3.1 RF Failure
Troubleshooting Transmission Failure
- GSM/DCS transmission failure
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Before starting the following process, ensure that the USIM card and the antenna are well
connected.
Figure 9-7 GSM/DCS transmission failure
GSM/DCS transmission
failure
When the RF cable is not
inserted, are J3204's pin
1 and pin 2 connected? Check J3204
Are U3201's control signals
normal?
Check U401
Are U3501's GSM output
and DCS output
approximately 33 dBm and
30 dBm respectively?
Check U3201 and
U401
Check U3501
Y
N
Y
Y
Y
N
N
Do U3801's pin A10 and pin
A9 have output? Check U3801
N
Y
Table 9-3 and Table 9-4 describe the working status of the GSM/DCS power amplifier U3501.
Table 9-3 U3501 working status (1)
GSM_PA_EN
PA
H
ON
L
OFF
Table 9-4 U3501 working status (2)
GSM_PA_BAND
Mode
L
GSM850/900
H
DCS1800/1900
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H: voltage higher than 1.3 V. L: voltage lower than 0.5 V.
- WCDMA transmission failure (use W2100 as an example)
Before starting the following process, ensure that the USIM card and the antenna are well
connected.
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Figure 9-8 WCDMA transmission failure
W2100 transmission
failure
When the RF cable is not
inserted, are J3204's pin 1
and pin 2 connected? Check J3204
Are U3201's control signals
normal?
Check U401
Is the insertion loss
between U3304's pin 1 and
pin 3 approximately 1.1–1.4
dB?
Check U3201 and
U401
Check U3304
Y
N
Y
Y
Y
N
N
Is U3301's output 24 dB? Check U3301
N
Y
Y
Y
Is the insertion loss
between U3302's pin 2 and
pin 9 approximately 0.6 dB? Check U3302
N
Check U3801
N
Does U3801's pin A7 have
output?
Check J3204
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Table 9-5 and Table 9-6 describe the working status of the WCDMA power amplifier.
Table 9-5 WCDMA power amplifier working status (1)
PA_ON
PA
H
ON
L
OFF
Table 9-6 WCDMA power amplifier working status (1)
PA_R
PA_R1
Mode
L
L
HI Power
L
H
MI Power
H
H
LO Power
H: 1.3–1.8 V. L: < 0.5 V.
9.3.2 GPS
The GPS channel consists of filter U4102, filter U4103 and LNA U4101. GPS signals are sent
to the RTR6285A's input interface after going through the filters and LNA. Figure 9-9 shows
the circuit.
Figure 9-9 GPS circuit
9.3.3 Wi-Fi/Bluetooth/FM Module
The Y210 uses a WCN2243 (Bluetooth/FM 2-in-1 module)+AR6005 (Wi-Fi module)+switch
to realize Wi-Fi, Bluetooth, and FM functions.
The Bluetooth and Wi-Fi functions share one antenna and one RF switch.
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The MSM7225A provides PCM and UART interfaces that are directly connected to the
Bluetooth module's PCM and UART signal output. Table 9-7 describes the signals'
definitions.
Table 9-7 Signal definitions (PCM and UART interfaces)
MSM7225A
Signal
Definition
GPIO_44
UART1_CTS_N
"ready to receive" signal sent from the host to the
slave.
GPIO_43
UART1_RFR_N
"clear to send" signal sent from the slave to the host.
GPIO_46
UART1_TX
Transmission signal
GPIO_45
UART1_RX
Reception signal
GPIO_69
AUX_PCM_DIN
PCM input
GPIO_68
AUX_PCM_DOUT
PCM output
GPIO_70
AUX_PCM_SYNC
PCM synchronization
GPIO_71
AUX_PCM_CLK
PCM clock
GPIO_107
MSM_WAKES_BT
Waking up the host
GPIO_83
BT_WAKES_MSM
Waking up the Bluetooth
The MSM7225A provides SDIO3 interfaces that are directly connected to the Wi-Fi module's
SDIO signal output. Table 9-8 describes the signals' definitions.
Table 9-8 Signal definitions (SDIO3 interface)
MSM7225A
Signal
Definition
GPIO_64
SDC2_DATA3
Data
GPIO_65
SDC2_DATA2
GPIO_66
SDC2_DATA1
GPIO_67
SDC2_DATA0
GPIO_62
SDC2_CLK
Clock
GPIO_63
SDC2_CMD
Control signal
The PM8029 provides audio input interfaces that are directly connected to the FM module's
left and right channels. Table 9-9 describes the signals' definitions.
Table 9-9 Signal definitions (audio input interfaces)
BCM4330
Network
MSM7225A
Description
FM_RXP
FM_ANT
-
FM antenna (headset)
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BCM4330
Network
MSM7225A
Description
FM_RXN
-
-
-
FM_VDD2P5
SR_AVDD2P5
-
-
FM_AOUT1
FM_OUT_L
PM8029
LINE_IN_LP
FM OUTPUT
FM_AOUT2
FM_OUT_R
PM8029
LINE_IN_RM
FM OUTPUT
9.4 Peripheral Circuits
9.4.1 Display
The MSM7225A uses Mobile Industry Processor Interfaces (MIPIs) to send instructions and
data to the LCD. The Y210's LCD uses MIPIs, supporting a 60 Hz refresh rate, and requiring
only one pair of differential clock lines, one pair of differential signal lines, and one pair of
power supply lines. The LCD also supports frame synchronization, using the MDP_VSYNC
signals (GPIO_097) as data transmission synchronization signals to avoid screen tearing.
- Dot matrix: Half-size VGA (HVGA, 480 x 320 pixels)
- Color: 256K colors
Figure 9-10 shows the connections between the MSM7225A and the LCD.
Figure 9-10 Connections between the MSM7225A and the LCD
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Table 9-10 describes the signals' definitions.
Table 9-10 Signal definitions
Category
Description
Name in the
Circuit
Network
MSM7225A
GPIO/PM8029 MPP
Power supply
Digital power supply
input
VREG_S3
VREG_S3 (PM8029)
Analog power input
VREG_L12_2P8
5
VREG_L12_2P85
(PM8029)
Data
MIPI data
MIPI_DSI_LAN
E1_P
MIPI_DSI_LANE1_P
MIPI data
MIPI_DSI_LAN
E1_N
MIPI_DSI_LANE1_N
Synchronization
signal
Frame
synchronization clock
MDP_VSYNC_
P
GPIO97
Clock signal
MIPI clock
MIPI_DSI_CLK
_P
MIPI_DSI_CLK_P
MIPI clock
MIPI_DSI_CLK
_N
MIPI_DSI_CLK_N
Control signal
Reset
LCD_RESET_N
GPIO129
Identification
signal
LCD model
identification
LCD_ID0
GPIO9 (PM8029)
LCD model
identification
LCD_ID1
GPIO10 (PM8029)
Y210's LCD backlight control:
The Y210 uses a 3.5-inch LCD whose backlight is provided by six LEDs connected in series.
The backlight LEDs are controlled by the backlight driver chip TPS61160A. The ground
resistance of the driver chip pin FB is set to 10 Ω, providing up to 20 mA current to the LEDs
(duty:100%). The backlight brightness (driver output current) is controlled by the PWM
signal.
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Figure 9-11 LCD backlight circuit
Backlight
signals
Anode of the backlight LED
LED_A
Anode of the
backlight LED
Cathode of the backlight LED
LED_K
Cathode of the
backlight LED
Brightness control signals from the
LCD
PWM_OU
T
Reserved
Brightness control signals from the
phone's main chip
LCD_BL_
PWM
GPIO1 (PM8029)
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Troubleshooting Display Failure
Figure 9-12 Display failure
LCD fails to display
Return the phone
to the factory
Clean the LCD 50-pin male
& female connectors. Snap
them in place again. Is the
problem solved?
End
Y
N
Re-install the phone's
firmware. Is the problem
solved?
End
Y
N
Replace the LCD. Is the
problem solved? End
Y
N
9.4.2 Camera
The Y210 uses a 3.0-megapixel full-frame camera.
The 3.0-megapixel full-frame camera uses a 24-pin board to board (BTB) connector and is
controlled by the I2C bus. The data is transmitted in MIPI mode.
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Figure 9-13 Camera circuit
Table 9-11 Signal definitions
Signal Name
Pin
Camera
Voltage
Remarks
CAM_VIO
VREG_S3 (analog
switch)
IOVDD
1.8
-
CAM_VIO
VREG_S3 (analog
switch)
DVDD
1.8
-
VREG_CAM_2P85
VREG_L17 (PM8029)
AVDD
2.85
Power supply to the
camera autofocus
motor
CAM_AVDD
VREG_L17 (PM8029)
AVDD
2.85
-
CAMIF_MCLK
GPIO_015 (MSM7225A)
MCLK
1.8
Camera reference
clock
MCAMIF_SHDN
GPIO_119 (MSM7225A)
PWDN
1.8
Camera shutdown
signal
CAM_VCM_PD_N
GPIO_07 (MSM7225A)
-
1.8
Camera autofocus
motor control signal
I2C0_SCL
GPIO_060 (MSM7225A)
I2C_SCL
1.8
I2C control signal
I2C0_SDA
GPIO_061 (MSM7225A)
I2C_SDA
1.8
-
MCAMIF_RESET
GPIO_049 (MSM7225A)
Reset
1.8
Reset signal
MCAMIF_ID
GPIO_9 (MSM7225A)
ID
1.8
Module supplier
identification
MIPI_CSI2_CLK_P
MIPI_CSI2_CLK_P
PCLK
-
MIPI clock
MIPI_CSI2_CLK_N
MIPI_CSI2_CLK_N
NCLK
-
MIPI clock
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Signal Name
Pin
Camera
Voltage
Remarks
MIPI_CSI2_LANE1_P
MIPI_CSI2_LANE1_P
MIPI DATA
-
Data
communication
signal
MIPI_CSI2_LANE1_N
MIPI_CSI2_LANE1_N
MIPI DATA
-
Data
communication
signal
MIPI_CSI2_LANE0_P
MIPI_CSI2_LANE0_P
MIPI DATA
-
Data
communication
signal
MIPI_CSI2_LANE0_N
MIPI_CSI2_LANE0_N
MIPI DATA
-
Data
communication
signal
The camera interface circuit is designed for compatibility with multiple types of cameras. The Y210 uses
a 3.0-megapixel full-frame camera, so the CAM_VCM_PD_N and VREG_CAM_2P85 lines are not
used.
Troubleshooting Camera Failure
Figure 9-14 Camera failure
Failure to take photos or
record video using the
camera
Replace the
camera. Is the
problem solved? End
Is J1001 poorly soldered or
are its contacts defective?
Return the phone
to the factory
Re-solder or replace
J1001
Y
N
Y
Reinstall the phone's
firmware. Is the
problem solved?
End
Y
N
N
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9.4.3 USB
Figure 9-15 USB circuit
Troubleshooting USB Connection Failure
Figure 9-16 USB connection failure
USB connection failure
Re-install the
phone's firmware.
Is the problem
solved?
End
Is the 5-pin mini USB
connector poorly soldered?
Return the phone
to the factory
Re-solder the USB
connector
Y
N
Y
Use a normal USB
cable. Is the problem
solved? End
Y
N
N
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9.4.4 Headset Jack
The Y210 has a 3.5-mm headset jack. When the headset jack has no headset inserted, the
headset jack's pin 3 and pin 4 are open, and the headset detection voltage is at a high level.
After a headset is inserted, pin 3 and pin 4 are closed, and the headset detection voltage is at a
low level, indicating the insertion of a headset. The HS_DETECT (GPIO86) pin is used to
detect the headset insertion.
The HSED_MICBIAS (PM8029/HSED_BIAS1) supplies power to the headset microphone.
The HSED_HSKEY_ADC (PM8029 MPP5) is used to detect the headset button press.
The Y210 supports only the LRGM headsets and does not support LRMG headsets.
Figure 9-17 Headset jack circuit
- No sound comes from the headset during a call.
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Figure 9-18 No sound
After a call is established, no
sound can be heard from the
headset
Is a headset icon
displayed on the
screen?
Replace the
headset jack
Replace the headset. Is the
problem solved?
Return the phone
to the factory
End
Y
Y
N
Is the in-call volume
set to a normal level? End
N
N
Y
- The headset button cannot be used to answer a call.
Figure 9-19 Headset button malfunctioning
The headset button cannot be
used to answer a call
Insert the headset. Is the
voltage on J1101's pin 4 at
a low level?
Return the phone
to the factory
Check that J1101 is
properly soldered.
N
Replace the headset.
Is the problem solved? End
Y
Y
N
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9.4.5 Keys and Buttons
The Y210 has six keys and buttons, three of which are the Menu, Home and Back keys on the
touch panel.
The MSM7225A's GPIO_42 and GPIO_41 pins are connected to the volume up and down
buttons. The side key FPC is connected to the PCBA via the ZIF connector J1605.
The power button press is detected by the PM8029's KYPD_PWR_N pin. The power button
FPC is connected to the PCBA using press-fit contacts.
Figure 9-20 Key and button circuit
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Troubleshooting Key or Button Failure
Figure 9-21 Key or button failure
Key or button failure
Are the FPC and ZIF
connector connected
properly? Re-connect them
Return the phone
to the factory
Y
N
Is the keypad on the
FPC in good contact
with the dome sheet?
Clean the
keypad and the
dome sheet
N
Y
9.4.6 Tricolor Indicator and Touch Key Backlight Circuits
The Y210's battery charging indicator (tricolor indicator) provides red, green and blue light
sources that are driven by the PM8029's three LED driver.
Table 9-12 Light source and driver pins
Light Source
Driver Pin (PM8029)
Remarks
Red
LED_RED_DRV_N (MPP3)
Adjusted using electric current
Green
LED_GREEN_DRV_N (MPP5)
Adjusted using electric current
Blue
LED_BLUE_DRV_N (MPP8)
Adjusted using electric current
Figure 9-22 Status indicator circuit
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The KYPD_DRV_N (PM8029) is used to adjust the brightness of the keypad's backlight, and
VPH_PWR is used to supply power to the backlight LEDs. The keypad backlight is provided
by two white LEDs. The light from the LEDs is transmitted to the key area using a light guide
film.
Table 9-13 Keypad backlight driver
Keypad Backlight Driver
VPH_PWR
Power supply
Backlight power supply
KPD_DRV_N
Backlight driver
pin
When this pin's voltage is at a low level, the two
backlight LEDs turn on.
Figure 9-23 Touch key backlight circuit
9.4.7 Battery Connector
Figure 9-24 Battery connector circuit
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9.4.8 Accelerometer
Figure 9-25 Accelerometer circuit
Table 9-14 Accelerometer pins
Component
Pin
Network
MSM7225A
Pin
Description
SCL
I2C1_SCL
GPIO_131
I2C bus
SDA
I2C1_SDA
GPIO_132
INT1
MEMS_INT1
GPIO_28
Accelerometer interrupt signal
INT2
MEMS_INT2
GPIO_111
Accelerometer interrupt signal
(sleep)
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9.4.9 Compass
Figure 9-26 Compass circuit
Table 9-15 Compass pins
Component Pin
Network
MSM7225A Pin
Description
SCL
I2C1_SCL
GPIO_131
I2C bus
SDA
I2C1_SDA
GPIO_132
DRDY
COMPASS_INT
GPIO_18
Compass interrupt signal
9.4.10 Proximity Sensor
The Y210 uses a 3-in-1 light, proximity and infrared sensor.
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Figure 9-27 Sensor circuit
Table 9-16 Sensor pins
Component Pin
Network
MSM7225A-0 Pin
Description
SCL
I2C1_SCL
GPIO_131
I2C bus
SDA
I2C1_SDA
GPIO_132
INT
PRO_INT
GPIO_17
3-in-1 interrupt signal
Functions
- Detect the intensity of environmental light.
- Detect the proximity of objects.
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Figure 9-28 Sensor failure
The phone's display does not turn off when
near the user's ear during a call (The phone is
in portrait orientation; no headset is connected;
handsfree mode is disabled.)
Is U1207 poorly soldered
or dirty? Re-solder, clean
or replace U1207
Re-install the phone's
firmware. Is the problem
solved?
Return the phone
to the factory
End
Y
N
Y
Is the touch panel's light
sensor hole dirty or
blocked?
Clean the hole
Y
N
N
9.4.11 Vibration Motor
Figure 9-29 Vibration motor circuit
The vibration motor's driving voltage is controlled by PM VIB_DRV_N.
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Troubleshooting Vibration Failure
Figure 9-30 Vibration failure
Vibration failure
Is the voltage on
VIB_DRV_N equal to
the battery voltage? Replace D902
Replace the motor. Is the
problem solved?
Return the phone
to the factory
End
Y
N
Y
Re-install the phone's
firmware. Is the
problem solved?
End
Y
N
N
9.4.12 Receiver
The receiver receives differential earphone output from the MSM chip.
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Figure 9-31 Receiver circuit
The MSM chip's EARI output signal is connected to the receiver. D1503 and D1504 are the
ESD protection components on the receiver.
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Troubleshooting the Failure that No Sound Can Be Heard During a Call
Figure 9-32 No sound during a call
No sound is heard
during a call
Replace the
receiver. Is the
problem solved? End
Does the phone mistakenly
detect the insertion of a
headset?
Return the phone
to the factory
Replace the
headset connector
Y
N
Y
Is the in-call volume
set to a normal level? End
N
N
Y
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9.4.13 Microphone
Figure 9-33 Microphone circuit
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Troubleshooting the Failure that No Sound Can Be Heard by the Other Party
During a Call
Figure 9-34 No sound heard by the other party during a call
No sound can be heard by
the other party during a call
Replace the
microphone. Is the
problem solved? End
Is the MIC_BIAS voltage
equal to 1.8 V?
Return the phone
to the factory
Check U201
N
N
Y
Re-install the phone's
firmware. Is the
problem solved? End
Y
Y
N
9.4.14 Touch Panel
Figure 9-35 Touch panel circuit
The Y210's 3.5-inch capacitive touch panel has a touch key area containing three touch keys.
The backlight LEDs for the three touch keys are located on the PCBA. A light guide film is
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used to guide light from the LEDs to the touch key area. Table 9-17 describes the interfaces
between the touch panel, MSM7225A, and PM8029.
Table 9-17 Interfaces between touch panel, MSM7225A, and PM8029
Touch Panel
Interface
Pin
Description
VDD_2V8_TP
VREG_L12_2P85
(PM8029)
Touch panel analog power supply, 2.85 V
VREG_S3
VREG_S3 (PM8029)
Touch panel digital power supply and I/O
connector power supply, 1.8 V
TOUCH_INT
GPIO_82
(MSM7225A)
Touch panel interrupt signal
I2C1_SCL
GPIO_131
(MSM7225A)
Touch panel's I2C clock
I2C1_SDA
GPIO_132
(MSM7225A)
Touch panel's I2C data
TOUCH_RST_N
GPIO_96
(MSM7225A)
Touch panel reset signal
9.4.15 SIM Card
The MSM7225A is not compatible with the SIM card interface. The PM8029's MPP pins are
used to convert voltage levels of the signals for communication between the MSM7225A and
the SIM card.
The voltage of VREG_L16_UIM1 can be set to 1.5–3.05 V. The USIM interface's operating
voltage is usually 1.8 V or 3.0 V. Table 9-18 describes the voltage level conversion interface
of the PM8029.
Table 9-18 Voltage level conversion interface of the PM8029
Signal for Interfacing
with the MSM
Voltage
Level
Signal for Interfacing
with the USIM Card
Voltage Level
-
VREG_S3
UIM1_RESET
VREG_L16_UIM1
(configured by the
phone's firmware)
UIM1_MSM_CLK
UIM1_CLK
UIM1_MSM_DATA
UIM1_DATA
Considering that SIM card operations are frequent, transient-voltage-suppression (TVS) diodes are
added to the circuit to provide ESD and surge protection.
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Table 9-19 USIM card circuit
9.4.16 microSD Card
The microSD card connector's SD_DETECT pin is used to detect the insertion of a microSD
card. When a microSD card is inserted, the pin is grounded and its voltage is at a low level.
When no microSD is inserted, its voltage is at a high level. The U1402 is an electromagnetic
interference (EMI) and ESD protection component for the microSD card.
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Figure 9-36 microSD card circuit
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10 Solder Points on the PCBA and BGA
Chip
Red (R: 255, G: 0, B: 0) : Vacant point
Green (R: 0, G: 255, B: 0) : Ground point
Blue (R: 0, G: 0, B: 255) : Solder point
Figure 10-1, Figure 10-2, Figure 10-3, and Figure 10-4 show magnified views of sections.
Figure 10-5 shows the complete PCB view.
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Figure 10-1 PM section
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Figure 10-2 MSM7225A+NAND MCP section
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Figure 10-3 Wi-Fi/Bluetooth/FM section
Figure 10-4 RTR8285A section
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Figure 10-5 Complete PCB view
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11 Functional Tests
11.1 MMI Test
On the home screen, enter *#*#2846579#*#* to enter MMI test mode. Press the volume down
button to start a test. Touch the Menu key on the touch panel to skip the current test and go to
the next step. Touch the Back key to return to the previous test.
NOTE
- When no battery is installed or the battery voltage is low, the phone will prompt that the battery is
low and MMI test cannot be started.
- During a test, if you touch the Menu key on the touch panel, the test will be skipped and marked as a
failed test.
Table 11-1 MMI test
No.
Category
Item
Test Method
1
microSD card
test
microSD card test
Automatically test the microSD card functions. If a microSD
card is found and is available, the test passes; otherwise, the test
fails.
If this test passes, the next test automatically starts.
2
SIM card test
SIM card test
Automatically test whether the SIM card can be recognized. If
the SIM card cannot be recognized, a message will be displayed,
indicating that this test fails.
If this test passes, the next test automatically starts.
3
Battery test
Battery test
Automatically test whether the battery is in place and whether its
power is sufficient. If this test fails, a message will be displayed.
If this test passes, the next test automatically starts.
4
Keypad test
Keys
Touch or press all the keys and buttons.
When a key or button is touched or pressed, the color of the
corresponding key displayed on the screen will change (from
white to blue, or from blue to white).
Press the volume down button to start the next test.
5
LCD test
White screen
The LCD displays a white screen.
Press the volume down button to start the next test.
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No.
Category
Item
Test Method
Black screen
The LCD displays a black screen.
Press the volume down button to start the next test.
Red and blue bars
The LCD displays red and blue bars.
Press the volume down button to start the next test.
6
LCD backlight
test
LCD backlight
and tricolor status
indicator
If the LCD backlight repeatedly turns on and off, the LCD
backlight is normal. The status indicator is normal if its color
repeatedly changes in the sequence of red, green and blue.
Press the volume down button to start the next test.
7
Keypad
backlight test
Keypad backlight
LEDs
If the keypad backlight repeatedly turns on and off, the backlight
LEDs are normal.
Press the volume down button to start the next test.
8
Camera test
Camera test
Automatically test the camera. The phone's camera is turned on,
and the LCD displays the preview. Check the image quality
visually and test the camera's response speed to determine the
camera's performance.
Press the volume down button to start the next test.
9
Touch panel
test
Touch panel
Place your finger on the touch panel, and slide your finger along
the touch panel edges. The areas near the route that your finger
passes should turn red.
Press the volume down button to start the next test.
10
Proximity test
Proximity and
light sensor's
proximity
detection function
Place the light shielding plate approximately 4 mm above the
light hole. If the portrait icon changes to an in-call icon, the
function is normal.
If this test passes, the next test automatically starts.
11
Environmental
light test
Proximity and
light sensor's
function to sense
environmental
light
Check whether the environmental light sensing data is detected:
Use your hand to block the light hole, the light sensing number
will decrease to approximately 10 if the light sensor functions
properly.
If this test passes, the next test automatically starts.
12
Vibration test
Vibration motor
The motor will vibrate intermittently.
Check whether the vibration (including the vibration sound) is
normal.
Press the volume down button to start the next test.
13
Speaker test
Speaker test
Automatically test the speaker. (Do not insert the headset.) If the
speaker emits sound during the test, it is normal.
Press the volume down button to start the next test.
14
Main
microphone
loopback test
Main microphone
(located near the
USB port)
Do not insert the headset. Touch the Record button. Speak to the
main microphone, and then touch the Play button. If the main
microphone is normal, you can hear the voice recording from
the receiver.
Press the volume down button to start the next test.
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No.
Category
Item
Test Method
15
Secondary
microphone
loopback test
Secondary
microphone
(located above the
camera at the
phone's rear)
Do not insert the headset. Touch the Record button. Speak to the
secondary microphone, and then touch the Play button. If the
secondary microphone is normal, you can hear the voice
recording from the receiver.
Press the volume down button to start the next test.
16
Dual
microphone
loopback test
Main and
secondary
microphones
Do not insert the headset. Touch the Record button. Speak to the
phone as you do during a call, and then touch the Play button. If
the main and secondary microphones are normal, you can hear
the voice recording from the receiver.
Press the volume down button to start the next test.
17
Headset
loopback test
Headset
Insert the headset. Touch the Record button. Speak to the
headset microphone, and then touch the Play button. If the
headset is normal, you can hear the voice recording from the
headset's earphones.
Keep the headset inserted. Press the volume down button to start
the next test.
18
FM test
FM test
The testing software will detect whether a headset is inserted. If
no headset is inserted, a message requesting a headset to be
inserted will be displayed. After a headset is inserted, the phone
will search for and play an FM channel. Three frequencies (88
MHz, 98 MHz and 107 MHz) will be tested. The 88 MHZ
frequency will be tested first. To test the next frequency, touch
Next.
Remove the headset. Press the volume down button to start the
next test.
19
Headset button
test
Headset button
test
Insert the headset. The IN icon will turn green.
Press the headset button, the round dot will become smaller.
Remove the headset, the OUT icon will turn green.
Press the volume down button to start the next test.
20
Bluetooth test
Bluetooth test
Automatically test the Bluetooth functions.
During the test, the phone will search for nearby Bluetooth
devices, and display the MAC addresses of the Bluetooth
devices that have been found. (Note: This test requires another
device with Bluetooth enabled.)
Press the volume down button to start the next test.
21
Tilt-sensor test
Accelerometer
The LCD displays the current acceleration in the X, Y and Z
axes. Place the phone in a position where the angles between the
X, Y and Z axes are 45°. If the acceleration in the X, Y and Z
axes is equal to each other, the phone passes this test.
If this test passes, the next test automatically starts.
22
Compass test
Compass
If this test passes, the next test automatically starts. If this test
fails, a message will appear, indicating the failure.
23
Wi-Fi test
Wi-Fi test
Automatically test the Wi-Fi functions.
During the test, the phone will search for nearby hotspots, and
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No.
Category
Item
Test Method
display the MAC addresses of the hotspots that have been found.
(Note: This test requires an active hotspot in the testing
environment.)
Press the volume down button to start the next test.
24
Displaying test
results
Displaying test
results
Display the MMI test results.
Failed test items will be listed.
11.2 Voice Call Test
To test the voice call function, perform the following steps:
Step 1 Install a UIM card and battery on the phone.
Step 2 Press the power button to power the phone on.
Step 3 Check whether the signal strength displayed on the LCD is normal (given that the network is
normal).
Step 4 Make a call to a fixed-line phone, and check the voice quality during the call.
If no problems are found, finish the voice call test. If any problems are found, troubleshoot
the phone or send it to an advanced service site for repair.
----End
