Huawei ME906s LTE M.2 Module Hardware Guide (V100R001 04, English)

2018-05-24

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HUAWEI ME906s LTE M.2 Module

Hardware Guide

Issue

Date

2017-12-11

Copyright © Huawei Technologies Co., Ltd. 2017. All rights reserved.
No part of this manual may be reproduced or transmitted in any form or by any means without prior written
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The product described in this manual may include copyrighted software of Huawei and possible licensors.
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reverse engineer, lease, assign, or sublicense the said software, unless such restrictions are prohibited by
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, and
are trademarks or registered trademarks of Huawei Technologies Co., Ltd.
LTE is a trade mark of ETSI.
Other trademarks, product, service and company names mentioned may be the property of their respective
owners.

Notice
Some features of the product and its accessories described herein rely on the software installed, capacities
and settings of local network, and therefore may not be activated or may be limited by local network operators
or network service providers.
Thus, the descriptions herein may not exactly match the product or its accessories which you purchase.
Huawei reserves the right to change or modify any information or specifications contained in this manual
without prior notice and without any liability.

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HUAWEI ME906s LTE M.2 Module
Hardware Guide

About This Document

About This Document
Revision History
Document
Version

Date

2015-06-10

2015-07-23

2017-06-23

2017-12-11

Issue 04 (2017-12-11)

Chapter

Descriptions
Creation

2.2

Updated dimensions in Table 2-1
Features

3.4.2

Updated the maximum value of the pullup resistor

4.3.1

Updated the test instrument

4.4.2

Updated Table 4-4 Conducted Tx power

5.4.1

Updated Table 5-4 Requirements for
input current

5.5

Updated test duration of temperature
cycle in Table 5-10 Test conditions and
results of the reliability

6.2

Updated the dimensions

9.13.1

Updated section 9.13.1 EU
Regulatory Conformance
Deleted privacy policy

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Contents

Contents
1 Introduction.................................................................................................................................... 7
2 Overall Description ...................................................................................................................... 8
2.1 About This Chapter ........................................................................................................................... 8
2.2 Function Overview............................................................................................................................ 8
2.3 Circuit Block Diagram ....................................................................................................................... 9

3 Description of the Application Interfaces .............................................................................. 11
3.1 About This Chapter .......................................................................................................................... 11
3.2 75-pin Gold Finger........................................................................................................................... 11
3.3 Power Interface .............................................................................................................................. 19
3.3.1 Overview ................................................................................................................................ 19
3.3.2 Power Supply 3.3V Interface ................................................................................................. 19
3.3.3 USIM Power Output USIM_PWR .......................................................................................... 21
3.4 Signal Control Interface .................................................................................................................. 21
3.4.1 Overview ................................................................................................................................ 21
3.4.2 Power_On_Off Control Pin .................................................................................................... 23
3.4.3 RESET# Pin .......................................................................................................................... 28
3.4.4 LED# Pin ............................................................................................................................... 30
3.4.5 W_DISABLE# Pin .................................................................................................................. 30
3.4.6 GPS_DISABLE# Pin.............................................................................................................. 31
3.4.7 Wake_On_WWAN# Pin ......................................................................................................... 32
3.4.8 BodySAR_N Pin .................................................................................................................... 32
3.4.9 USIM_DET Pin ...................................................................................................................... 33
3.5 USB Interface ................................................................................................................................. 35
3.6 USIM Card Interface ...................................................................................................................... 36
3.6.1 Overview ................................................................................................................................ 36
3.6.2 Circuit Recommended for the USIM Card Interface .............................................................. 37
3.7 Tunable Antenna Control ................................................................................................................ 38
3.8 Config Pins ..................................................................................................................................... 39
3.9 Reserved Pins ................................................................................................................................ 40
3.10 NC Pins ........................................................................................................................................ 41
3.11 RF Antenna Interface.................................................................................................................... 41
3.11.1 RF Connector location ......................................................................................................... 41

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3.11.2 Coaxial RF Connector Guidelines ....................................................................................... 42

4 RF Specifications ......................................................................................................................... 45
4.1 About This Chapter ......................................................................................................................... 45
4.2 Operating Frequencies ................................................................................................................... 45
4.3 Conducted RF Measurement ......................................................................................................... 46
4.3.1 Test Environment ................................................................................................................... 46
4.3.2 Test Standards ....................................................................................................................... 46
4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 46
4.4.1 Conducted Receive Sensitivity .............................................................................................. 46
4.4.2 Conducted Transmit Power ................................................................................................... 48
4.5 Antenna Design Requirements ...................................................................................................... 49
4.5.1 Antenna Design Indicators..................................................................................................... 49
4.5.2 Interference ........................................................................................................................... 51
4.5.3 Antenna Requirements .......................................................................................................... 51

5 Electrical and Reliability Features ........................................................................................... 53
5.1 About This Chapter ......................................................................................................................... 53
5.2 Absolute Ratings ............................................................................................................................ 53
5.3 Operating and Storage Temperatures ............................................................................................ 53
5.4 Power Supply Features .................................................................................................................. 54
5.4.1 Input Power Supply ............................................................................................................... 54
5.4.2 Power Consumption .............................................................................................................. 55
5.5 Reliability Features ......................................................................................................................... 60
5.6 EMC and ESD Features ................................................................................................................. 63

6 Mechanical Specifications ......................................................................................................... 65
6.1 About This Chapter ......................................................................................................................... 65
6.2 Dimensions ..................................................................................................................................... 65
6.3 Packing System.............................................................................................................................. 66

7 Installation.................................................................................................................................... 67
7.1 About This Chapter ......................................................................................................................... 67
7.2 Connect ME906s to board ............................................................................................................. 67
7.3 Thermal Management .................................................................................................................... 68
7.4 Antenna Plug .................................................................................................................................. 68

8 Certifications ................................................................................................................................ 70
9 Safety Information ...................................................................................................................... 71
9.1 Interference .................................................................................................................................... 71
9.2 Medical Device ............................................................................................................................... 71
9.3 Area with Inflammables and Explosives ......................................................................................... 71
9.4 Traffic Security................................................................................................................................ 72
9.5 Airline Security................................................................................................................................ 72

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9.6 Safety of Children ........................................................................................................................... 72
9.7 Environment Protection .................................................................................................................. 72
9.8 WEEE Approval .............................................................................................................................. 72
9.9 RoHS Approval ............................................................................................................................... 72
9.10 Laws and Regulations Observance ............................................................................................. 73
9.11 Care and Maintenance ................................................................................................................. 73
9.12 Emergency Call ............................................................................................................................ 73
9.13 Regulatory Information ................................................................................................................. 73
9.13.1 EU Regulatory Conformance .............................................................................................. 73
9.13.2 FCC Statement .................................................................................................................... 74

10 Appendix A Circuit of Typical Interface .............................................................................. 75
11 Appendix B Acronyms and Abbreviations .......................................................................... 76

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HUAWEI ME906s LTE M.2 Module
Hardware Guide

Introduction

This document describes the hardware application interfaces and air interfaces that
are provided when HUAWEI ME906s LTE M.2 Module (hereinafter referred to as the
ME906s module) is used.
M.2 is the new name for NGFF (Next Generation Form Factor), which is the
specification of PCI-SIG (Peripheral Component Interconnect Special Interest
Group).
This document helps you to understand the interface specifications, electrical
features and related product information of the ME906s module.

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Overall Description

2.1 About This Chapter
This chapter gives a general description of the ME906s module and provides:


Function Overview



Circuit Block Diagram

2.2 Function Overview
Table 2-1 Features
Feature

Description

Physical
Features

Dimensions (L × W × H): 42 mm × 30 mm × 2.22 mm

Operating
Bands

FDD LTE: Band 1, Band 2, Band 3, Band 5, Band 7, Band 8,
Band 20, Band 28, all bands with diversity

Weight: about 6 g

WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5, Band
8, all bands with diversity
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz
GPS/GLONASS: L1
Operating
Temperature

Normal operating temperature: –10°C to +55°C

Storage
Temperature

–40°C to +85°C

Power Voltage

3.135 V to 4.4 V (3.3 V is typical)

Application
Interface (75pin Gold
Finger)

USIM (3.0 V or 1.8 V)

Issue 04 (2017-12-11)

Extended operating temperature[1]: –20°C to +70°C

USIM_DET pin (USIM Hot Swap Detection)
USB 2.0 (High-Speed)

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Feature

Overall Description

Description
Power_On_Off pin
RESET# pin
LED# pin
W_DISABLE# pin
GPS_DISABLE# pin
Tunable Antenna control (4 GPIOs)
Wake_On_WWAN# pin
BodySAR_N pin
Power supply (5 pins)

Antenna
Connectors

MAIN and AUX (supports Diversity and GPS simultaneously)

SMS

Supports MO and MT
Supports formats of PDU
Point-to-point and cell broadcast

Data Services

GPRS: DL 85.6 kbit/s; UL 85.6 kbit/s
EDGE: DL 236.8 kbit/s; UL 236.8 kbit/s
WCDMA CS: DL 64 kbit/s; UL 64 kbit/s
WCDMA PS: DL 384 kbit/s; UL 384 kbit/s
HSPA+: DL 21.6 Mbit/s; UL 5.76 Mbit/s
DC-HSPA+: DL 42 Mbit/s; UL 5.76 Mbit/s
LTE FDD: DL 150 Mbit/s; UL 50 Mbit/s @20M BW cat3

Operating
System

Windows 7/8/8.1/10, Android 4.0 or later

[1]: When the ME906s module works at –20°C to –10°C or +55°C to +70°C, NOT all its RF
specifications comply with the 3GPP specifications.

2.3 Circuit Block Diagram
The ME906s module is developed based on Huawei's Balong Hi6921M platform.
Figure 2-1 shows the circuit block diagram of the ME906s module. The application
block diagram and major functional units of the ME906s module contain the following
parts:


Baseband controller

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

Power manager



Nand Flash



Radio Frequency (RF) transceiver



RF Front End

Overall Description

Figure 2-1 Circuit block diagram

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Description of the Application Interfaces

3.1 About This Chapter
This chapter mainly describes the application interfaces of the ME906s module,
including:


75-pin Gold Finger



Power Interface



Signal Control Interface



USB Interface



USIM Card Interface



Tunable Antenna Control



Config Pins



Reserved Pins



NC Pins



RF Antenna Interface

3.2 75-pin Gold Finger
The ME906s module uses a 75-pin Gold Finger as its external interface. For details
about the module dimensions, see 6.2 Dimensions.
Figure 3-1 shows the sequence of pins on the 75-pin signal interface of the ME906s
module.

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Description of the Application Interfaces

Figure 3-1 TOP view of gold finger interface pins

Table 3-1 shows the definitions of the 75-pin interface (67 for signals and 8 for notch)
of the ME906s module.
As M.2 Nomenclature, ME906s is Type 3042-S3-B (30 mm × 42 mm, Max.
Component Height on Top is 1.5 mm and single-sided, Key ID is B).

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Description of the Application Interfaces

Table 3-1 Definitions of pins on the M.2 interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

CONFIG_3

Connected to Ground
internally.

The
module is
configured
as WWANSSIC 0.

3.3V

Power supply

3.135

3.3

4.4

Ground

3.3V

Power supply

3.135

3.3

4.4

Ground

VIH

1.26

3.6

VIL

–0.3

0.3

The
module is
pulled
down
inside by a
1 MΩ
resistor.

When it is High, WWAN
function is determined by
software AT command.
Default enabled.

VIH

1.26

3.6

When it is Low, WWAN
function will be turned off.

VIL

–0.3

0.3

A single control to turn
On/Off WWAN.
When it is Low, WWAN is
powered off.
6

Power_On_Off

When it is High, WWAN is
powered on.
It is internally pulled to
Low.
It is 3.3 V tolerant but can
be driven by either 1.8 V or
3.3 V GPIO.

USB_D+

I/O

USB Data + defined in the
USB 2.0 specification
WWAN disable function

W_DISABLE#

USB_D-

I/O

USB Data - defined in the
USB 2.0 specification

VOL

0.48

The
maximum
IOL is 40
mA.

LED#

It is an open drain, active
low signal, used to allow
the M.2 card to provide
status indicators via LED
devices that will be
provided by the host.

Ground

Notch

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Description of the Application Interfaces

Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Notch

Reserved

Reserved for future use,
please keep it not
connected in the host side.

CONFIG_0

Not Connected internally.

The
module is
configured
as WWANSSIC 0.

Reserved

Reserved for future use,
please keep it not
connected in the host side.

Wake_On_W
WAN#

Reserved

It is open drain and active
low.
WWAN to wake up the
host.
Reserved for future use,
please keep it not
connected in the host side.
Hardware pin for BodySAR
detection.

BodySAR_N

VOL

0.48

The
maximum
IOL is 40
mA.

VIH

1.26

3.6

When it is High, No TX
power backoff (default).
When it is Low, TX power
backoff.

VIL

–0.3

0.3

When it is High, GPS
function is determined by
software AT command.

VIH

1.26

3.6

When it is Low, GPS is
turned off.

VIL

–0.3

0.3

GPS disable function

GPS_DISABL
E#

Ground

Reserved

Reserved for future use,
please keep it not
connected in the host side.

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Description of the Application Interfaces

Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Not Connected

VOH

0.7 x
USIM
_PW
R

3.3

USIM_RESET

USIM_CLK

Ground

USIM Reset

Not Connected

VOL

0.2 x
USIM
_PW
R

VOH

0.7 x
USIM
_PW
R

3.3

USIM Clock

Ground

VOL

0.2 x
USIM
_PW
R

VOH

0.7 x
USIM
_PW
R

3.3

0.2 x
USIM
_PW
R

VOL
34

USIM_DATA

I/O

USIM DATA
VIH

USIM_PWR

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Not Connected

0.7 x
USIM
_PW
R

3.3

USIM_PW
R=1.8 V or
3.0 V

USIM_P
WR=1.8 V
or 3.0 V

USIM_PW
R=1.8 V or
3.0 V

VIL

0.2 x
USIM
_PW
R

1.75

1.8

1.98

USIM_PW
R=1.8 V

2.75

3.3

USIM_PW
R=3.0 V

USIM POWER

Not Connected

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Description of the Application Interfaces

Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Not Connected

Ground

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VOH

1.35

1.8

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

The
current
firmware
does not
support
this
function.

Not Connected

Interrupt signal to wake up
the module.

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VOH

1.6

1.8

VOL

0.45

VOH

1.6

1.8

VOL

0.45

I2C_SCL

I2C_SDA

I2C_IRQ

Ground

SYSCLK

TX_BLANKIN
G

I/O

I2C clock, slave.

Not Connected

I2C data, slave.

Ground

System clock output for
external GNSS module.

Not Connected

TX blanking signal for
external GNSS module.

The
current
firmware
does not
support
this
function.

The
current
firmware
does not
support
this
function.
The
current
firmware
does not
support
this
function.
The
current
firmware
does not
support
this
function.

Not Connected

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Description of the Application Interfaces

Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Ground

Not Connected

Ground

Not Connected

VOH

1.37

1.8

2.1

Tunable antenna control
signal, bit 0.
It is a push-pull type GPIO.

VOL

0.45

VOH

1.35

1.8

1.9

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

The
current
firmware
does not
support
this
function.

Tunable antenna control
signal, bit 1.

VOH

1.37

1.8

2.1

It is a push-pull type GPIO.

VOL

0.45

VOH

1.35

1.8

1.9

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

Tunable antenna control
signal, bit 2.

VOH

1.37

1.8

2.1

It is a push-pull type GPIO.

VOL

0.45

VOH

1.35

1.8

1.9

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

Tunable antenna control
signal, bit 3.

VOH

1.37

1.8

2.1

It is a push-pull type GPIO.

VOL

0.45

ANTCTL0

COEX3

ANTCTL1

COEX_UART_
RXD

ANTCTL2

COEX_UART_
TXD

ANTCTL3

Issue 04 (2017-12-11)

I/O

For coexistence.

UART transmit signal from
other wireless coexistence
solution to the module.

UART transmit signal from
the module to other
wireless coexistence
solution.

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Pin
No.

Pad
Type

Pin Name

Description
USIM hot swap detection
pin.

USIM_DET

Rising edge for insertion;
falling edge for removal.

RESET#

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

VIH

1.26

1.8

2.1

VIL

–0.3

0.3

VIH

1.26

2.1

VIL

–0.3

0.3

System reset, active low.

Not Connected

Comments

The
module is
pulled up
inside.

When it is High, USIM is
present.
When it is Low, USIM is
absent.

Description of the Application Interfaces

The
module is
pulled up
inside.

CONFIG_1

Connected to Ground
internally.

The
module is
configured
as WWANSSIC 0.

3.3V

Power supply

3.135

3.3

4.4

Ground

3.3V

Power supply

3.135

3.3

4.4

Ground

3.3V

Power supply

3.135

3.3

4.4

The
module is
configured
as WWANSSIC 0.

CONFIG_2

Connected to Ground
internally.



I indicates pins for digital signal input; O indicates pins for digital signal output; PI indicates
power input pins; PO indicates power output pins.



VIL: Low-level Input voltage; VIH: High-level Input voltage; VOL: Low-level Output voltage; VOH:
High-level Output voltage.



The NC pins are not connected, therefore, before you deal with these pins, please refer to
the corresponding hardware guide.



The Reserved pins are internally connected to the module. Therefore, these pins should
not be used, otherwise they may cause problems. Please contact with us for more details
about this information.

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3.3 Power Interface
3.3.1 Overview
The power supply part of the ME906s module contains:


3.3V pin for the power supply



USIM_PWR pin for USIM card power output

Table 3-2 lists the definitions of the pins on the power supply interface.
Table 3-2 Definitions of the pins on the power supply interface
Pin No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

2, 4, 70, 72, 74

3.3V

Power supply

3.135

3.3

4.4

1.75

1.8

1.98

USIM_PW
R=1.8 V

2.75

3.3

USIM_PW
R=3.0 V

3, 5, 11, 27,
33, 39, 45, 51,
57, 71, 73

USIM_PWR

Ground

USIM POWER

Ground

3.3.2 Power Supply 3.3V Interface
The ME906s module power is supplied through the 3.3V pins and the voltage ranges
from 3.135 V to 4.4 V (typical value is 3.3 V). The ME906s provides 5 power pins and
11 GND pins. To ensure that the ME906s module works normally, all the pins must be
connected. The M.2 connector pin is defined as that should support 500 mA/Pin
continuously.
When the ME906s module works at GSM mode, the module transmits at the
maximum power, the transient peak current may reach 2.5 A@3.3 V. In this case, the
power pin voltage will drop. Make sure that the voltage does not drop below 3.135 V
in any case.
The traces of the power supply should be as short and wide as possible. It is
recommended that at least one 220 μF capacitance is added onto the 3.3V power
rails and as close to the M.2 connector as possible. Customers can reduce the
capacitance if it can be guaranteed that the 3.3V pin does not drop below 3.135 V in
any case.
Figure 3-2 shows the recommended power circuit of ME906s module.

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Description of the Application Interfaces

Figure 3-2 Recommended power circuit

3.3V
3.3V

Module
(Modem)

330 pF 100 nF 1 μF 22 μF 220 μF

3.135 V is the minimum voltage supplied to ME906s by the host, and 3.3V pin must never be
under 3.135 V in any case, which is shown as the following figure.

Voltage
4.4V
Do not drop below 3.135 V during 2G Tx.
The maximum current may be 2.5 A@3.3 V.

3.3V

3.135V

Time

If the customer wants to power cycle ME906s, the 3.3V pin must stay below 1.8 V for
more than 100 ms. Figure 3-3 shows the power supply timing sequence between
power cycling.

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Figure 3-3 Power supply timing sequence between power cycling

Parameter

Remarks

Time (Min.)

Unit

Toff

Power off time

100

3.3.3 USIM Power Output USIM_PWR
Through the USIM_PWR power supply interface, the ME906s module can supply 1.8
V or 3.0 V power to USIM card. The transient current can reach 200 mA, so special
attention should be taken on PCB design at the host side.

3.4 Signal Control Interface
3.4.1 Overview
The signal control part of the interface in the ME906s module consists of the
following:


Power On/Off (Power_On_Off) pin



Module reset (RESET#) pin



LED control (LED#) pin



WWAN disable control (W_DISABLE#) pin



GPS disable control (GPS_DISABLE#) pin



Wake signal out from module (Wake_On_WWAN#) pin

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

BodySAR detection (BodySAR_N) pin



USIM detection (USIM_DET) pin

Table 3-3 lists the pins on the signal control interface.
Table 3-3 Pins on the signal control interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

VIH

1.26

3.6

VIL

–0.3

0.3

The
module is
pulled
down
inside by a
1MΩ
resistor.

1.26

2.1

–0.3

0.3

A single control to turn
On/Off WWAN.
When it is Low, WWAN is
powered off.
6

Power_On_
Off

When it is High, WWAN is
powered on.
It is internally pulled to Low.
It is 3.3 V tolerant but can be
driven by either 1.8 V or 3.3
V GPIO.

VIH
67

RESET#

System reset, active low.
VIL

LED#

It is an open drain, active low
signal, used to allow the M.2
card to provide status
indicators via LED devices
that will be provided by the
host.

VOL

0.48

When it is High, WWAN
function is determined by
software AT command.
Default enabled.

VIH

1.26

3.6

When it is Low, WWAN
function will be turned off.

VIL

–0.3

0.3

VIH

1.26

3.6

The
module is
pulled up
inside.

The
maximum
IOL is 40
mA.

WWAN disable function

W_DISABLE
#

GPS disable function

GPS_DISAB
LE#

When it is High, GPS
function is determined by
software AT command.
When it is Low, GPS is
turned off.

Wake_On_
WWAN#

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It is open drain and active
low.

VIL

VOL

–0.3

WWAN to wake up the host.

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0.3

0.48

The
maximum
IOL is 40
mA.

HUAWEI ME906s LTE M.2 Module
Hardware Guide
Pin
No.

Pad
Type

Pin Name

Description
Hardware pin for BodySAR
Detection.

BodySAR_N

USIM hot swap detection
pin.

USIM_DET

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

VIH

1.26

3.6

When it is High, No TX
power backoff (default).
When it is Low, TX power
backoff.

Description of the Application Interfaces

VIL

–0.3

0.3

VIH

1.26

1.8

2.1

Rising edge for insertion;
falling edge for removal.
When it is High, USIM is
present.

Comments

VIL

–0.3

0.3

The
module is
pulled up
inside.

When it is Low, USIM is
absent.

3.4.2 Power_On_Off Control Pin
The ME906s module can be controlled to be powered on/off by the Power_On_Off
pin.
Table 3-4 Two States of Power_On_Off
Item.

Pin state

Description

High

The module is powered on.
NOTE: If the module needs to be powered on
automatically, the Power_On_Off pin must be pulled up
to 3.3 V.

Low

The module is powered off.
It is internally pulled low with a weak pull-down resistor.

If the module is powered by the regulator with 3.3 V
If ME906s is powered by 3.3 V voltage regulator (such as notebook or Ultrabook),
Power_On_Off should be pulled up to 3.3 V through a resistor.
The pull-up resistor should be not greater than 47 kΩ.
Following is the power on/off sequence:
1.

The module gets 3.3 V when supply for the module is switched on.

The module is turned on since Power_On_Off is pulled up to 3.3 V by the host.

Host cuts off 3.3 V supply to power off the module.

The recommended circuit is shown as in Figure 3-4 .

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Figure 3-4 Recommended connections of Power_On_Off pin (auto power)

ME906s

3.3V

Pin2, 4, 70, 72, 74

47 kΩ
Power_On_Off
Pin6



Power on sequence

Do not toggle RESET# during power on sequence. Pulling RESET# low will extend
time for module startup. Recommended power on timing sequence is shown as
Figure 3-5 .
Figure 3-5 Recommended power on timing sequence

3.3V

RESET#

Power_On_Off

Power on



Power off sequence

Cutting off 3.3 V will power off the module.

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Figure 3-6 Recommended power off timing sequence (cut off 3.3 V)

3.3V

RESET#

Power_On_Off

Power off

If ME906s is powered directly to battery
For use case ME906s is connected directly to battery, such as tablet platforms,
Power_On_Off should be controlled by a GPIO from the host to control ME906s to be
powered on/off.
It is critical to make sure the module is safely shut off when the tablet SoC is shut off.
There will be current leakage if the module is not shut off properly. So it is important
to keep Power_On_Off logic low for more than 500 ms to shut off the module.
The recommended connection is shown as Figure 3-7 .
Figure 3-7 Recommended connection of Power_On_Off pin (control)

ME906s

HOST

Power_On_Off
Pin6



GPIO

Power on sequence

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Do not toggle RESET# during power on sequence, pulling RESET# low will extend
time for module startup. The recommended power on timing sequence is shown as
Figure 3-8 .
Figure 3-8 Recommended power on timing sequence

3.3V (battery
always on)

RESET#

Power_On_off
t0

Power on

t0 ≥ 0ms



Power off sequence

Keep Power_On_Off logic low for more than 500 ms to shut off the module.
Figure 3-9 Recommended power off timing sequence (connect to battery)

3.3V (battery,
always on)

RESET#

Logic low or high-impedance (preferred)

Power_On_Off

Logic low or high-impedance (preferred)

t1 ≥ 500 ms


Power off

Warm boot (restart) sequence

In the notebook/tablet when using the warm boot, the followed sequence is
recommended.

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Figure 3-10 Recommended warm boot timing in the notebook/tablet

3.3V (battery,
always on)
.

RESET#

Power_On_Off
t2

Warm boot in the notebook/tablet

t2 ≥ 500 ms

If there is a limitation on the controlling GPIO to be programmable 500 ms, the
hardware solution as shown in Figure 3-11 can be used.
Figure 3-11 Power on off circuit (hardware solution)

Module

HOST

Power_On_Off

Pin 6

GPIO2
3.3V (battery)

NMOS

1MΩ

Q1
NMOS
Q2

0Ω
VCCGPIO2

VCCGPIO2 is the power domain of the GPIO2.
When VCCGPIO2 is ON, Q2 is on and Q1 is off. So the Pin 6 is controlled by

GPIO2 of host.
When VCCGPIO2 is Off, Q2 is off and Q1 is on. So the Pin 6 is pulled low,
then the module is powered off.

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3.4.3 RESET# Pin
The ME906s module can be reset through the RESET# pin asynchronous, active low.
Whenever this pin is active, the module will immediately be placed in a Power On
reset condition. Care should be taken for this pin unless there is a critical failure and
all other methods of regaining control and/or communication with the WWAN subsystem have failed.
Pulling low RESET# more than 20 ms and then pulling high will reset the module.
RESET# is optional, which can be not connected. Pulling low Power_On_Off for
more than 500 ms and then pulling high can also work as a reset.
RESET# is internally pulled up to 1.8 V, which is automatically on when 3.3 V is
applied even though Power_On_Off is low. Cautions should be taken on circuit
design or else there may be back driving issue.

Hardware circuit for RESET# (option 1)
GPIO is high-impedance when the host is powered off.

Module
Pin 67

RESET#

0Ω

HOST
GPIO1

33рF

GPIO1 should be high-impedance
when it is powered off.

Hardware circuit for RESET# (option 2)
GPIO is not high-impedance when the host is powered off.
Use 2 N-MOSFET so that the logic of RESET# and GPIO are the same.

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VCCGPIO1

Module

HOST
RESET#

Pin 67
NMOS

1MΩ

33рF

NMOS

0Ω
GPIO1

Hardware circuit for RESET# (option 3)
GPIO is not high-impedance when the host is powered off.
Use only one N-MOSFET, in this case the logic of RESET# and GPIO1 is reversed.

Module

HOST
RESET#

Pin 67

33рF

0Ω
GPIO1



As the RESET# signal is relatively sensitive, it is recommended to install a 33 pF
capacitor near to the M.2 pin.



Triggering the RESET# signal will lead to loss of all data in the module. It
will also disconnect the module from the network resulting in a call drop.

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3.4.4 LED# Pin
ME906s provides an open drain signal to indicate the RF status.
Table 3-5 State of the LED# pin
No.

Operating Status

LED#

RF function is turned on

Output Low, current sink

RF function is turned off

Output High

Figure 3-12 shows the recommended circuits of the LED# pin. The brightness of LED
can be adjusted by adjusting the resistance of the series resistor, and the maximum
sink current is 40 mA.
Figure 3-12 Driving circuit

3.4.5 W_DISABLE# Pin
ME906s provides a hardware pin (W_DISABLE#) to disable or enable the radio. In
addition, the radio can also be enabled or disabled through software AT commands.
Table 3-6 Function of the W_DISABLE# pin
No.

W_DISABLE#

Function

Low

WWAN function will be turned off.

High

WWAN function is determined by software AT
command. Default enabled.

Floating

WWAN function is determined by software AT
command. Default enabled.

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Figure 3-13 Connections of the W_DISABLE# pin

Module
(Modem)

VCC From Host

1.8V
10 kΩ

Host

BB Chip
W_DISABLE#

It is recommended not to add a diode on the W_DISABLE# pin outside the module.

3.4.6 GPS_DISABLE# Pin
ME906s provides a hardware pin (GPS_DISABLE#) to disable or enable the GPS. In
addition, the GPS can also be enabled or disabled through software AT commands.
Table 3-7 Function of the GPS_DISABLE# pin
No.

GPS_DISABLE#

Function

Low

GPS function is disabled.

High

GPS function is determined by software AT
command. Default enabled.

Floating

GPS function is determined by software AT
command. Default enabled.

Figure 3-14 Connections of the GPS_DISABLE# pin

Module
(Modem)

VCC From Host
1.8V

10 kΩ

Host

BB Chip
GPS_DISABLE#

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It is recommended not to add a diode on the GPS_DISABLE# pin outside the
module.

3.4.7 Wake_On_WWAN# Pin
ME906s provides an open drain output Wake_On_WWAN# pin to wake up the host,
which is low active.
Figure 3-15 Wave form of the Wake_On_WWAN# pin

Figure 3-16 Connections of the Wake_On_WWAN# pin

10 kΩ

3.4.8 BodySAR_N Pin
ME906s provides an input pin BodySAR_N for BodySAR detection.
Table 3-8 Function of the BodySAR_N pin
No.

BodySAR_N

Function

Low

Max. TX power will be backed off by setting through AT
command.

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No.

BodySAR_N

Function

High

Max. TX power will NOT be backed off (default).

Floating

Max. TX power will NOT be backed off.

If BodySAR_N pin is used to monitor the proximity sensor output directly, there are
some essential preconditions for this hardware solution.
ME906s cannot provide any control signal for the proximity sensor, and any control or
programming required by the proximity sensor should be handled by the host side.
Figure 3-17 Connections of the BodySAR_N pin

Module
(Modem)

VCC From Host
1.8V
10 kΩ

BB Chip
BodySAR_N

USB

Proximity
sensor

Host AP

It is recommended not to add a diode on the BodySAR_N pin outside the module.

3.4.9 USIM_DET Pin
ME906s supports USIM hot swap function.
ME906s provides an input pin (USIM_DET) to detect whether the USIM card is
present or not. This pin is a level trigger pin.
Table 3-9 Function of the USIM_DET pin
No.

USIM_DET

Function

High level

USIM card insertion.
If the USIM card is present, USIM_DET should be High.

Low level

USIM card removal.
If the USIM card is absent, USIM_DET should be Low.

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Figure 3-18 Connections of the USIM_DET pin

Module
(Modem)

USIM Deck
1.8V

BB Chip
USIM_DET
470 pF

If USIM card is absent, the CD connects to Ground.
If USIM card is present, the CD is open.

CD is a pin detecting of USIM in the USIM socket, in normal, there will be a detect pin
in the USIM socket.



It is recommended not to add a diode on the USIM_DET pin outside the module.



The normal SHORT USIM connector should be employed. The logic of
USIM_DET is shown as Figure 3-19 . High represents that USIM is inserted; Low
represents that USIM is removed.



When USIM is inserted (hot), USIM_DET will change from Low to High;



When USIM is removed (hot), USIM_DET will change from High to Low;



The module will detect the level of USIM_DET to support the hot swap.

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Figure 3-19 Logic of USIM_DET

WWAN Module
1.8V
USIM Connector Switch

USIM installed=
Not Connected

USIM_DET

USIM not
installed=
GND

Modem
Processor

3.5 USB Interface
The ME906s is compliant with USB 2.0 high speed protocol. The USB input/output
lines are following USB 2.0 specifications. Definition of the USB interface:
Pin No.

Pin Name

I/O

Description

USB_D+

I/O

USB data signal D+

USB_D-

I/O

USB data signal D-

Figure 3-20 Recommended circuit of USB interface

Figure 3-21 shows the timing sequence between 3.3V and USB D+.

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Figure 3-21 USB D+ and 3.3V power on timing sequence

3.3V

Power_On_Off

Tpd

USB D+

Parameter

Remarks

Time (Nominal value)

Unit

Tpd

Power valid to USB D+ high

The layout design of this circuit on the host board should comply with the USB 2.0 high speed
protocol, with differential characteristic impedance of 90 Ω.

3.6 USIM Card Interface
3.6.1 Overview
The ME906s module provides a USIM card interface complying with the ISO 7816-3
standard and supports both 1.8 V and 3.0 V USIM cards.
Table 3-10 USIM card interface signals
Pin
No.

Pin Name

USIM_RESET

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

VOH

0.7 x
USIM
_PW
R

3.3

USIM Reset
VOL

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0.2 x
USIM
_PW
R

Comments

USIM_PWR
=1.8 V or 3.0
V

HUAWEI ME906s LTE M.2 Module
Hardware Guide

Pin
No.

Pin Name

USIM_CLK

Pad
Type

Description

Description of the Application Interfaces

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

VOH

0.7 x
USIM
_PW
R

3.3

USIM Clock
VOL

0.2 x
USIM
_PW
R

VOH

0.7 x
USIM
_PW
R

3.3

0.2 x
USIM
_PW
R

VOL
34

USIM_DATA

USIM DATA
VIH

USIM_PWR

0.7 x
USIM
_PW
R

3.3

Comments

USIM_P
WR=1.8 V or
3.0 V

USIM_PWR
=1.8 V or 3.0
V

VIL

0.2 x
USIM
_PW
R

1.75

1.8

1.98

USIM_PWR
=1.8 V

2.75

3.3

USIM_PWR
=3.0 V

VIH

1.26

1.8

2.1

USIM POWER

USIM hot swap
detection pin.

USIM_DET

Rising edge for
insertion; falling
edge for removal.
When it is High,
USIM is present.

The module
is pulled up
inside.
VIL

–0.3

0.3

When it is Low,
USIM is absent.

3.6.2 Circuit Recommended for the USIM Card Interface
As the ME906s module is not equipped with a USIM socket, you need to place a
USIM socket on the user interface board. Figure 3-22 shows the circuit of the USIM
card interface.

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Figure 3-22 Circuit of the USIM card interface



The ESD protection component should choose low capacitance. The capacitance
of the component should be lower than 10 pF.



To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic
compatibility (EMC) authentication, the USIM socket should be placed near the
M.2 interface (it is recommended that the PCB circuit connects the M.2 interface
and the USIM socket does not exceed 100 mm), because a long circuit may lead
to wave distortion, thus affecting signal quality.



It is recommended that you wrap the area adjacent to the USIM_CLK and
USIM_DATA signal wires with ground. The Ground pin of the USIM socket and the
Ground pin of the USIM card must be well connected to the power Ground pin
supplying power to the ME906s module.



A 100 nF capacitor (0402 package is recommended so that greater capacitance
such as 1 uF can be employed if necessary) and a 33 pF capacitor are placed
between the USIM_PWR and Ground pins in parallel. Three 33 pF capacitors are
placed between the USIM_DATA and Ground pins, the USIM_RESET and Ground
pins, and the USIM_CLK and Ground pins in parallel to filter interference from RF
signals.



It is recommended to take electrostatic discharge (ESD) protection measures near
the USIM card socket. Transient voltage suppressor diode should be placed as
close as possible to the USIM socket, and the Ground pin of the ESD protection
component is well connected to the power Ground pin that supplies power to the
ME906s module.

3.7 Tunable Antenna Control
The module provides 4 tunable antenna control pins.

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Table 3-11 List of ANTCTL pins
Pin
No.

Pin Name

ANTCTL0

Pad
Type

ANTCTL1

ANTCTL2

ANTCTL3

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Tunable antenna
control signal, bit 0.

VOH

1.37

1.8

2.1

It is a push-pull type
GPIO.

VOL

0.45

Tunable antenna
control signal, bit 1.

VOH

1.37

1.8

2.1

It is a push-pull type
GPIO.

VOL

0.45

Tunable antenna
control signal, bit 2.

VOH

1.37

1.8

2.1

It is a push-pull type
GPIO.

VOL

0.45

Tunable antenna
control signal, bit 3.

VOH

1.37

1.8

2.1

It is a push-pull type
GPIO.

VOL

0.45

The mapping of each band to ANTCTL outputs is configurable, and the default output
is 0 V.

3.8 Config Pins
The module provides 4 config pins.
Table 3-12 List of CONFIG pins
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

CONFIG_3

Connected to
Ground internally.

The module is
configured as
WWAN-SSIC 0.

CONFIG_0

Not Connected
internally.

The module is
configured as
WWAN-SSIC 0.

CONFIG_1

Connected to
Ground internally.

The module is
configured as
WWAN-SSIC 0.

CONFIG_2

Connected to
Ground internally.

The module is
configured as
WWAN-SSIC 0.

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In the M.2 spec, the 4 pins are defined as shown in Table 3-13 .
Table 3-13 List of Config pins
Config_0
(Pin 21)

Config_1
(Pin 69)

Config_2
(Pin 75)

Config_3
(Pin 1)

Module type and
Main host interface

Port
Configuration

Ground

WWAN-SSIC

The GPIO0–7 pins have configurable assignments. There are 4 possible functional
pin out configurations. These 4 configurations are called Port Config 0–3. In each
Port Configuration each GPIO is defined as a specific functional pin. The GPIO pin
assignment can be seen in Table 3-14 . ME906s supports Config 0. But the audio
function is not implemented in ME906s.
Table 3-14 GPIO pin function assignment per port configuration (not supported by
default)
GPIO Pin

Port Config 0 (GNSS+Audio ver1)

GPIO_0 (Pin40)

GNSS_SCL

GPIO_1 (Pin 42)

GNSS_SDA

GPIO_2 (Pin 44)

GNSS_IRQ

GPIO_3 (Pin 46)

SYSCLK

GPIO_4 (Pin 48)

TX_Blanking

GPIO_5 (Pin 20)

Audio_0 (not supported)

GPIO_6 (Pin 22)

Audio_1 (not supported)

GPIO_7 (Pin 24)

Audio_2 (not supported)

3.9 Reserved Pins
The module provides some reserved pins. All of reserved pins cannot be used by the
customer. All of them should be Not Connected (NC). If the customer wants to
have other special functions, please contact us.
Table 3-15 List of reserved pins
Pin
No.
20, 22,
24, 28

Pin Name

Reserved

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Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Reserved for future
use, please keep it not
connected in the host
side.

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3.10 NC Pins
The module has some NC pins. All of NC pins are not connected in the module.
Table 3-16 List of NC pins
Pin No.

Pin
Name

Pad Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

29, 31, 35, 37,
38, 41, 43, 47,
49, 50,52, 53,
54, 55, 56, 58,
68

Not
Connected

3.11 RF Antenna Interface
3.11.1 RF Connector location
ME906s module provides 2 antenna connectors for connecting the external
antennas.
Figure 3-23 RF antenna connectors

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3.11.2 Coaxial RF Connector Guidelines


The antenna interface must be used with coaxial cables with characteristic
impedance of 50 Ω.



The ME906s module supports the buckled RF connector antenna connection
methods: buckled RF connector 818000500 by ECT, RFC43-1K2600 by ACON
or other equivalent connectors.

Figure 3-24 shows the RF connector dimensions.
Figure 3-24 RF connector dimensions

Table 3-17 The major specifications of the RF connector
Rated Condition

Environmental Condition

Frequency range

DC to 6 GHz

Temperature range:

Characteristic impedance

50 Ω

–40°C to +85°C

There are two kinds of coaxial cables (0.81 mm and 1.13 mm) mating the RF
connector in the ME906s. 1.13 mm cable is recommended.

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Figure 3-25 Specifications of 0.81 mm coaxial cable mating with the RF connector

Figure 3-26 Connection between the RF connector and the 0.81 mm cable

Figure 3-27 Specifications of 1.13 mm coaxial cable mating with the RF connector

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Figure 3-28 Connection between the RF connector and the 1.13 mm cable

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4.1 About This Chapter
This chapter describes the RF specifications of the ME906s module, including:


Operating Frequencies



Conducted RF Measurement



Conducted Rx Sensitivity and Tx Power



Antenna Design Requirements

4.2 Operating Frequencies
Table 4-1 shows the RF bands supported by ME906s.
Table 4-1 RF bands
Operating Band

UMTS Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

UMTS Band 2

1850 MHz–1910 MHz

1930 MHz–1990 MHz

UMTS Band 5

824 MHz–849 MHz

869 MHz–894 MHz

UMTS Band 8

880 MHz–915 MHz

925 MHz–960 MHz

GSM 850

824 MHz–849 MHz

869 MHz–894 MHz

GSM 900

880 MHz–915 MHz

925 MHz–960 MHz

GSM 1800

1710 MHz–1785 MHz

1805 MHz–1880 MHz

GSM 1900

1850 MHz–1910 MHz

1930 MHz–1990 MHz

LTE Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

LTE Band 2

1850 MHz–1910 MHz

1930 MHz–1990 MHz

LTE Band 3

1710 MHz–1785 MHz

1805 MHz–1880 MHz

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Operating Band

LTE Band 5

824 MHz–849 MHz

869 MHz–894 MHz

LTE Band 7

2500 MHz–2570 MHz

2620 MHz–2690 MHz

LTE Band 8

880 MHz–915 MHz

925 MHz–960 MHz

LTE Band 20

832 MHz–862 MHz

791 MHz–821 MHz

LTE Band 28

703 MHz–748 MHz

758 MHz–803 MHz

GPS L1

1574.42 MHz–1576.42 MHz

GLONASS L1

1597.55 MHz–1605.89 MHz

4.3 Conducted RF Measurement
4.3.1 Test Environment
Test instrument

R&S CMU200, R&S CMW500, Agilent 8960, Anritsu
MT8820C

Power supply

Keithley 2303, Agilent 66319

RF cable for testing

Rosenberger Precision Microwave Cable

Murata coaxial
cable

MXHP32HP1000



The compensation for different frequency bands relates to the cable and the test
environment.



The instrument compensation needs to be set according to the actual cable conditions.

4.3.2 Test Standards
Huawei modules meet 3GPP test standards. Each module passes strict tests at the
factory and thus the quality of the modules is guaranteed.

4.4 Conducted Rx Sensitivity and Tx Power
4.4.1 Conducted Receive Sensitivity
The conducted receive sensitivity is a key parameter that indicates the receiver
performance of ME906s.

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Table 4-2 Conducted Rx sensitivity
Band

Typical Value
(Unit: dBm)

Note

GSM 850

–109

BER Class II < 2.44%

GSM 900

–109

BER Class II < 2.44%

GSM 1800

–109

BER Class II < 2.44%

GSM 1900

–109

BER Class II < 2.44%

UMTS Band 1

–111

BER < 0.1%

UMTS Band 2

–111

BER < 0.1%

UMTS Band 5

–111.5

BER < 0.1%

UMTS Band 8

–111.5

BER < 0.1%

LTE Band 1

–102

Throughput ≥ 95%, 10 MHz
Bandwidth

LTE Band 2

–101

Throughput ≥ 95%, 10 MHz
Bandwidth

LTE Band 3

–101

Throughput ≥ 95%, 10 MHz
Bandwidth

LTE Band 5

–101

Throughput ≥ 95%, 10 MHz
Bandwidth

LTE Band 7

–100

Throughput ≥ 95%, 10 MHz
Bandwidth

LTE Band 8

–101

Throughput ≥ 95%, 10 MHz
Bandwidth

LTE Band 20

–101

LTE Band 28

–102

Throughput ≥ 95%, 10 MHz
Bandwidth
Throughput ≥ 95%, 10 MHz
Bandwidth

Table 4-3 GPS specifications
TTFF@–130 dBm

Sensitivity

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Cold start

36s

Warm start

35s

Hot Start

Cold start

–148 dBm

Tracking

–159 dBm

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

The test values are the average of some test samples.



LTE sensitivity is tested in SIMO (Main + AUX).



The circular error probability for GPS value is 50%.

4.4.2 Conducted Transmit Power
The conducted transmit power is another indicator that measures the performance of
ME906s. The conducted transmit power refers to the maximum power that the
module tested at the antenna port can transmit. According to the 3GPP protocol, the
required transmit power varies with the power class.
Table 4-4 lists the required ranges of the conducted transmit power of ME906s.
Table 4-4 Conducted Tx power
Typical Value
(Unit: dBm)

Note (Unit: dB)

GMSK(1Tx Slot)

32.5

±1

8PSK(1Tx Slot)

±1

GMSK(1Tx Slot)

32.5

±1

8PSK(1Tx Slot)

±1

GMSK(1Tx Slot)

29.5

±1

8PSK(1Tx Slot)

±1

GMSK(1Tx Slot)

29.5

±1

8PSK(1Tx Slot)

±1

UMTS Band 1

23.5

±1

UMTS Band 2

23.5

±1

UMTS Band 5

23.5

±1

UMTS Band 8

23.5

±1

LTE Band 1

±1

LTE Band 2

±1

LTE Band 3

±1

LTE Band 5

±1

LTE Band 7

±1

LTE Band 8

±1

LTE Band 20

±1

LTE Band 28

±1

Band
GSM 850

GSM 900

GSM 1800

GSM 1900

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Maximum Power Reduction (MPR and AMPR) of LTE is according to 3GPP TS 36.521-1.

4.5 Antenna Design Requirements
4.5.1 Antenna Design Indicators
Antenna Efficiency
Antenna efficiency is the ratio of the input power to the radiated or received power of
an antenna. The radiated power of an antenna is always lower than the input power
due to the following antenna losses: return loss, material loss, and coupling loss. The
efficiency of an antenna relates to its electrical dimensions. To be specific, the
antenna efficiency increases with the electrical dimensions. In addition, the
transmission cable from the antenna port of ME906s to the antenna is also part of the
antenna. The cable loss increases with the cable length and the frequency. It is
recommended that the cable loss is as low as possible, for example,
MXHP32HP1000 made by Murata or equivalent.
The following antenna efficiency (free space) is recommended for ME906s to ensure
high radio performance of the module:


Efficiency of the primary antenna: ≥ 40% (working frequency below 960 MHz); ≥
50% (working frequency above 1420 MHz)



Efficiency of the secondary antenna: ≥ half of the efficiency of the primary
antenna in receiving band (≥ 50% @ 1574.42 MHz–1605.89 MHz)

In addition, the efficiency should be tested with the transmission cable.

S11(VSWR) and S21
S11 indicates the degree to which the input impedance of an antenna matches the
reference impedance (50 Ω). S11 shows the resonance feature and impedance
bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression
of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector
analyzer.
The following S11 values are recommended for the antenna of ME906s:


S11 of the primary antenna ≤ –6 dB



S11 of the secondary antenna ≤ –6 dB (≤ –10 dB @ 1574.42 MHz–1605.89
MHz)

In addition, S11 is less important than the efficiency, and S11 has not strong
correlation to wireless performance.
S21 indicates the isolation between two antennas.

Isolation
For a wireless device with multiple antennas, the power of different antennas is
coupled with each other. Antenna isolation is used to measure the power coupling.
The power radiated by an antenna might be received by an adjacent antenna, which
decreases the antenna radiation efficiency and affects the running of other devices.

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To avoid this problem, evaluate the antenna isolation as sufficiently as possible at the
early stage of antenna design.
Antenna isolation depends on the following factors:


Distance between antennas



Antenna type



Antenna direction

The primary antenna must be placed as near as possible to the ME906s to minimize
the cable length. The secondary antenna needs to be installed perpendicularly to the
primary antenna. The secondary antenna can be placed farther away from the
ME906s. Antenna isolation can be measured with a two-port vector network analyzer.
The following S21 values are recommended for the antenna on laptops:


Isolation between the primary and secondary antennas ≤ –12 dB(≤ –15 dB @
1574.42 MHz–1605.89 MHz)



Isolation between the primary (secondary) antenna and the Wi-Fi antenna ≤ –15
dB

Polarization
The polarization of an antenna is the orientation of the electric field vector that rotates
with time in the direction of maximum radiation.
The linear polarization is recommended for the antenna of ME906s.

Radiation Pattern
The radiation pattern of an antenna reflects the radiation features of the antenna in
the remote field region. The radiation pattern of an antenna commonly describes the
power or field strength of the radiated electromagnetic waves in various directions
from the antenna. The power or field strength varies with the angular coordinates (θ
and φ), but is independent of the radial coordinates.
The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal
plane, and the incident waves of base stations are often in the horizontal plane. For
this reason, the receiving performance is optimal.
The following radiation patterns are recommended for the antenna of ME906s.
Primary antenna: omnidirectional.

Secondary antenna: omnidirectional (Upper Hem Partial Radiated Power ≥ 40% @
1574.42 MHz–1605.89 MHz)
In addition, the secondary antenna’s pattern should be complementary with the
primary antenna’s pattern.

Gain and Directivity
The radiation pattern of an antenna represents the field strength of the radiated
electromagnetic waves in all directions, but not the power density that the antenna
radiates in the specific direction. The directivity of an antenna, however, measures
the power density that the antenna radiates.
Gain, as another important parameter of antennas, correlates closely to the
directivity. The gain of an antenna takes both the directivity and the efficiency of the

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antenna into account. The appropriate antenna gain prolongs the service life of
relevant batteries.
The following antenna gain is recommended for ME906s.


Gain of the primary antenna ≤ 2.5 dBi



Gain of the secondary antenna ≤ 2.5 dBi

ECC of the antenna
ECC is short for Envelope Correlation Coefficient. It is the cross-correlation value of
the complex patterns of the master and diversity antenna. It indicates how similar the
magnitude and the phase patterns of the two antennas are. If two antennas have no
similarity, the ECC should be zero. Actually, the less ECC, the better diversity
performance.
The following ECC is recommended for ME906s.


ECC ≤ 0.5 (working frequency below 0.96 GHz)



ECC ≤ 0.3 (working frequency above 1.4 GHz)



The antenna consists of the antenna body and the relevant RF transmission cable. Take
the RF transmission cable into account when measuring any of the preceding antenna
indicators.



Huawei cooperates with various famous antenna suppliers who are able to make
suggestions on antenna design, for example, Amphenol, Skycross, etc.

4.5.2 Interference
Besides the antenna performance, the interference on the user board also affects the
radio performance (especially the TIS) of the module. To guarantee high performance
of the module, the interference sources on the user board must be properly
controlled.
On the user board, there are various interference sources, such as the LCD, CPU,
audio circuits, and power supply. All the interference sources emit interference
signals that affect the normal operation of the module. For example, the module
sensitivity can be decreased due to interference signals. Therefore, during the
design, need to consider how to reduce the effects of interference sources on the
module. You can take the following measures: Use an LCD with optimized
performance; shield the LCD interference signals; shield the signal cable of the
board; or design filter circuits.
Huawei is able to make technical suggestions on radio performance improvement of
the module.

4.5.3 Antenna Requirements
The antenna for ME906s must fulfill the following requirements:

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Table 4-5 Antenna Requirements
Antenna Requirements
Frequency range

Depending on frequency band(s) provided by the
network operator, the customer must use the most
suitable antenna for that/those band(s)

Bandwidth of primary
antenna

70 MHz in GSM 850
80 MHz in GSM 900
170 MHz in GSM 1800
140 MHz in GSM 1900
250 MHz in UMTS Band 1/LTE Band 1
140 MHz in UMTS Band 2/LTE Band 2
70 MHz in UMTS Band 5/LTE Band 5
80 MHz in UMTS Band 8/LTE Band 8
170 MHz in LTE Band 3
190 MHz in LTE Band 7
71 MHz in LTE Band 20
55 MHz in LTE Band 28

Bandwidth of
secondary antenna

25 MHz in GSM 850
35 MHz in GSM 900
75 MHz in GSM 1800
60 MHz in GSM 1900
60 MHz in UMTS Band 1/LTE Band 1
60 MHz in UMTS Band 2/LTE Band 2
25 MHz in UMTS Band 5/LTE Band 5
35 MHz in UMTS Band 8/LTE Band 8
75 MHz in LTE Band 3
70 MHz in LTE Band 7
30 MHz in LTE Band 20
55 MHz in LTE Band 28
35 MHz in GNSS

Gain

≤ 2.5 dBi

Impedance

50 Ω

VSWR absolute max.

≤ 3:1 (≤ 2:1 @ 1574.42 MHz–1605.89 MHz)

VSWR recommended

≤ 2:1 (≤ 1.5:1 @ 1574.42 MHz–1605.89 MHz)

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Electrical and Reliability Features

5.1 About This Chapter
This chapter describes the electrical and reliability features of the interfaces in the
ME906s module, including:


Absolute Ratings



Operating and Storage Temperatures



Power Supply Features



Reliability Features



EMC and ESD Features

5.2 Absolute Ratings

Table 5-1 lists the absolute ratings for the ME906s module. Using the ME906s
module beyond these conditions may result in permanent damage to the module.
Table 5-1 Absolute ratings
Symbol

Specification

Min.

Max.

Unit

3.3V

External power voltage

–0.5

4.5

5.3 Operating and Storage Temperatures
Table 5-2 lists the operating and storage temperatures for the ME906s module.

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Table 5-2 Operating and storage temperatures
Specification

Min.

Max.

Unit

Normal operating temperature

–10

+55

°C

Extended operating temperature[1]

–20

+70

°C

Ambient storage temperature

–40

+85

°C

[1]: When the ME906s module works at –20°C to –10°C or +55°C to +70°C, NOT all its RF
specifications comply with the 3GPP specifications.

5.4 Power Supply Features
5.4.1 Input Power Supply
Table 5-3 lists the requirements for input power of the ME906s module.
Table 5-3 Requirements for input power
Parameter

Min.

Typ.

Max.

Ripple

Unit

3.3V

3.135

3.3

4.4

0.05

Figure 5-1 Power supply during burst emission

The minimum value of the power supply must be guaranteed during the burst (with 2.5 A@3.3
V peak in GSM, GPRS or EGPRS mode).

Table 5-4 Requirements for input current
Power

Peak (GSM 1 slot)

Normal (WCDMA)

Normal (LTE 23 dBm)

3.3 V

2.5 A

1.1 A

1.25 A

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5.4.2 Power Consumption
The power consumption of ME906s in different scenarios are respectively listed in
Table 5-5 to Table 5-9 .
The power consumption listed in this section are tested when the power supply of
ME906s module is normal voltage (3.3 V), and all of test values are measured at
room temperature.
Table 5-5 Averaged power off DC power consumption
Description

Test Value (Unit: uA)

Notes/Configuration

Typical
Power off

Normal voltage (3.3 V) is ON and
Power_On_Off pin is pulled low.

Table 5-6 Averaged standby DC power consumption (WCDMA/HSDPA/LTE/GSM)
Description

Bands

Test Value (Unit: mA)

Notes/Configuration

Typical
Sleep

LTE

LTE bands

2.08

Module is powered up.
DRX cycle=8 (2.56s)
Module is registered on the
network.
USB is in suspend.

HSPA+/WCDMA

UMTS bands

1.46

Module is powered up.
DRX cycle=8 (2.56s)
Module is registered on the
network.
USB is in suspend.

GPRS/EDGE

GSM bands

1.94

Module is powered up.
MFRMS=5 (1.175s)
Module is registered on the
network.
USB is in suspend.

Radio Off

All bands

1.07

Module is powered up.
RF is disabled.
USB is in suspend.

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Bands

Electrical and Reliability Features

Test Value (Unit: mA)

Notes/Configuration

Typical
Idle

LTE

LTE bands

Module is powered up.
DRX cycle=8 (2.56s)
Module is registered on the
network, and no data is
transmitted.
USB is in active.

HSPA+/WCDMA

UMTS bands

Module is powered up.
DRX cycle=8 (2.56s)
Module is registered on the
network, and no data is
transmitted.
USB is in active.

GPRS/EDGE

GSM bands

Module is powered up.
MFRMS=5 (1.175s)
Module is registered on the
network, and no data is
transmitted.
USB is in active.

Radio Off

All bands

Module is powered up.
RF is disabled.
USB is in active.

Table 5-7 Averaged Data Transmission DC power consumption (WCDMA/HSDPA/LTE)
Description

Band

Test Value (Unit: mA)

Notes/Configuration

Typical
WCDMA

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Band 1

198

1 dBm Tx Power

(IMT2100)

247

10 dBm Tx Power

682

23.5 dBm Tx Power

Band 2

204

1 dBm Tx Power

(PCS
1900)

246

10 dBm Tx Power

714

23.5 dBm Tx Power

Band 5

198

1 dBm Tx Power

(850
MHz)

231

10 dBm Tx Power

672

23.5 dBm Tx Power

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Band

Electrical and Reliability Features

Test Value (Unit: mA)

Notes/Configuration

Typical

HSDPA

LTE

Band 8

200

1 dBm Tx Power

(900
MHz)

260

10 dBm Tx Power

679

23.5 dBm Tx Power

Band 1

212

1 dBm Tx Power

(IMT2100)

260

10 dBm Tx Power

695

23.5 dBm Tx Power

Band 2

214

1 dBm Tx Power

(PCS
1900)

261

10 dBm Tx Power

730

23.5 dBm Tx Power

Band 5

212

1 dBm Tx Power

(850
MHz)

243

10 dBm Tx Power

685

23.5 dBm Tx Power

Band 8

214

1 dBm Tx Power

(900
MHz)

243

10 dBm Tx Power

701

23.5 dBm Tx Power

350

1 dBm Tx Power

422

10 dBm Tx Power

864

23dBm Tx Power

339

1 dBm Tx Power

422

10 dBm Tx Power

822

23 dBm Tx Power

335

1 dBm Tx Power

410

10 dBm Tx Power

789

23 dBm Tx Power

333

1 dBm Tx Power

419

10 dBm Tx Power

771

23 dBm Tx Power

349

1 dBm Tx Power

Band 1

Band 2

Band 3

Band 5

Band 7

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Band

Electrical and Reliability Features

Test Value (Unit: mA)

Notes/Configuration

Typical

Band 8

Band 20

Band 28

433

10 dBm Tx Power

830

23 dBm Tx Power

333

1 dBm Tx Power

411

10 dBm Tx Power

739

23 dBm Tx Power

342

1 dBm Tx Power

420

10 dBm Tx Power

846

23 dBm Tx Power

327

1 dBm Tx Power

396

10 dBm Tx Power

790

23 dBm Tx Power

Table 5-8 Averaged DC power consumption (GSM/GPRS/EDGE)
Description

Test Value (Unit: mA)

PCL

Notes/Configuration

1 Up/1 Down

Typical
GPRS 850

349
530

2 Up/1 Down

714

4 Up/1 Down

185

GPRS 900

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1 Up/1 Down

288

2 Up/1 Down

491

4 Up/1 Down

352

1 Up/1 Down

503

2 Up/1 Down

679

4 Up/1 Down

181

GPRS 1800

1 Up/1 Down

273

2 Up/1 Down

460

4 Up/1 Down

230

1 Up/1 Down

HUAWEI ME906s LTE M.2 Module
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Description

Test Value (Unit: mA)

Electrical and Reliability Features

PCL

Notes/Configuration

Typical
313

2 Up/1 Down

418

4 Up/1 Down

119

GPRS 1900

2 Up/1 Down

205

4 Up/1 Down

271

520

4 Up/1 Down

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1 Up/1 Down

151

2 Up/1 Down

224

4 Up/1 Down

230

1 Up/1 Down

312

2 Up/1 Down

430

4 Up/1 Down
15

1 Up/1 Down

174

2 Up/1 Down

258

4 Up/1 Down

222

1 Up/1 Down

301

2 Up/1 Down

409

4 Up/1 Down
15

1 Up/1 Down

171

2 Up/1 Down

256

4 Up/1 Down

178

1 Up/1 Down

245

2 Up/1 Down

317

4 Up/1 Down

118

EDGE 1900

1 Up/1 Down
2 Up/1 Down

131

EDGE 1800

384

133

EDGE 900

1 Up/1 Down

147

121

EDGE 850

1 Up/1 Down

146

2 Up/1 Down

203

4 Up/1 Down

207

1 Up/1 Down

HUAWEI ME906s LTE M.2 Module
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Electrical and Reliability Features

Test Value (Unit: mA)

PCL

Notes/Configuration

Typical
275

2 Up/1 Down

373

4 Up/1 Down

120

1 Up/1 Down

151

2 Up/1 Down

218

4 Up/1 Down

All power consumption test configuration can be referenced by GSM Association Official
Document TS.09: Battery Life Measurement and Current Consumption Technique.


LTE test condition: 10/20 MHz bandwidth, QPSK, 1 RB when testing max. Tx power and
full RB when testing 0 dBm or 10 dBm;



Test condition: for max. Tx. power, see 4.4.2 Conducted Transmit Power, which is listed in
Table 4-4 ; for max. data throughput, see 2.2 Function Overview, which are listed in Table
2-1 Features.

Table 5-9 Averaged GPS operation DC power consumption
Description

Test Value (Unit: mA)

Notes/Configuration

Typical
GPS fixing

100

GPS tracking

100

RF is disabled;
USB is in active;
The Rx power of GPS is –130 dBm.

5.5 Reliability Features
Table 5-10 lists the test conditions and results of the reliability of the ME906s module.
Table 5-10 Test conditions and results of the reliability
Item
Stress

Test Condition
Low-temperature
storage

Issue 04 (2017-12-11)



Temperature: –40ºC



Operation mode: no
power, no package



Test duration: 24 h

Standard
JESD22A119-C

Sample
size
3
pcs/group

Results
Visual inspection: ok
Function test: ok
RF specification: ok

HUAWEI ME906s LTE M.2 Module
Hardware Guide
Item
High-temperature
storage

Low-temperature
operating

High-temperature
operating

Damp heat
cycling

Thermal shock

Salty fog test

Electrical and Reliability Features

Test Condition

Standard

Sample
size

Results



Temperature: 85ºC
Operation mode: no
power, no package

JESD22A103-C

3
pcs/group

Visual inspection: ok



Test duration: 24 h



Temperature: –20ºC



Operation mode: working
with service connected



Test duration: 24 h



Temperature: 70ºC



Operation mode: working
with service connected



Test duration: 24 h



High temperature: 55ºC



Low temperature: 25ºC



Humidity: 95%±3%



Operation mode: working
with service connected



Test duration: 6 cycles;
12 h+12 h/cycle



Low temperature: –40º



High temperature: 85ºC



Temperature change
interval: < 20s



Operation mode: no
power



Test duration: 100 cycles;
15 min+15 min/cycle



Temperature: 35°C



Density of the NaCl
solution: 5%±1%



Operation mode: no
power, no package



Test duration:

Function test: ok
RF specification: ok

IEC6006
8-2-1

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A108-C

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A101-B

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A106-B

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A107-B

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

Spraying interval: 8 h
Exposing period after
removing the salty fog
environment: 16 h

Issue 04 (2017-12-11)

HUAWEI ME906s LTE M.2 Module
Hardware Guide
Item
Sine vibration

Shock test

Drop test

Life

High temperature
operating life

High temperature
& high humidity

Issue 04 (2017-12-11)

Electrical and Reliability Features

Test Condition

Standard

Sample
size

Results



Frequency range: 5 Hz to
200 Hz

JESD22B103-B

3
pcs/group

Visual inspection: ok



Acceleration: 1 Grms



Frequency scan rate: 0.5
oct/min



Test duration: 3 axial
directions. 2 h for each
axial direction.



Operation mode: working
with service connected



Half-sine wave shock



Peak acceleration: 30
Grms



Shock duration: 11 ms



Test duration: 6 axial
directions. 3 shocks for
each axial direction.



Operation mode: working
with service connected



0.8 m in height. Drop the
module on the marble
terrace with one surface
facing downwards, six
surfaces should be
tested.



Operation mode: no
power, no package



Temperature: 70ºC



Operation mode: working
with service connected



Test duration: 168 h, 336
h, 500 h, 1000 h for
inspection point



High temperature: 85ºC



Humidity: 85%



Operation mode:
powered on and no
working



Test duration: 168 h, 336
h, 500 h, 1000 h for
inspection point

Function test: ok
RF specification: ok

JESDB104-C

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

IEC6006
8-2-32

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A108-B

50
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A110-B

50
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok
Cross section: ok

HUAWEI ME906s LTE M.2 Module
Hardware Guide
Item
Temperature
cycle

Electrical and Reliability Features

Test Condition

Standard

Sample
size

Results



High temperature: 85ºC
Low temperature: –40ºC

JESD22A104-C

50
pcs/group

Visual inspection: ok




Temperature change
slope: 6ºC/min



Operation mode: no
power



Test duration: 168 h,

Function test: ok
RF specification: ok
Cross section: ok

336 h, 500 h, 668 h for
inspection point
ESD

HBM (Human
Body Model)

ESD with DVK
(or embedded in
the host)



1 kV (Class 1 B)



Operation mode: no
power



Contact Voltage: ±2 kV,
±4 kV



Air Voltage : ±2 kV, ±4
kV, ±8 kV



Operation mode: working
with service connected

JESD22A114-D

3
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

IEC6100
0-4-2

2 pcs

Visual inspection: ok
Function test: ok
RF specification: ok

Groups ≥ 2

5.6 EMC and ESD Features
The following are the EMC design comments:


Attention should be paid to static control in the manufacture, assembly,
packaging, handling, and storage process to reduce electrostatic damage to
HUAWEI module.



RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if
the antenna port is protected by TVS (Transient Voltage Suppressor), which is
resolved by making some adjustments on RF match circuit.



TVS should be added on the USB port for ESD protection, and the parasitic
capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode
inductor should be added in parallel on D+/D- signal.



TVS should be added on the USIM interface for ESD protection. The parasitic
capacitance of TVS on USIM signal should be less than 10 pF.



Resistors in parallel and a 10 nF capacitor should be added on RESET# and
Power_On_Off signal to avoid shaking, and the distance between the capacitor
and the related pin should be less than 100 mil.



PCB routing should be V-type rather than T-type for TVS.



An integrated ground plane is necessary for EMC design.

Issue 04 (2017-12-11)

HUAWEI ME906s LTE M.2 Module
Hardware Guide

Electrical and Reliability Features

The following are the requirements of ESD environment control:


The electrostatic discharge protected area (EPA) must have an ESD floor whose
surface resistance and system resistance are greater than 1 x 104 Ω while less
than 1 x 109 Ω.



The EPA must have a sound ground system without loose ground wires, and the
ground resistance must be less than 4 Ω.



The workbench for handling ESD sensitive components must be equipped with
common ground points, the wrist strap jack, and ESD pad. The resistance
between the jack and common ground point must be less than 4 Ω. The surface
resistance and system resistance of the ESD pad must be less than 1 x 109 Ω.



The EPA must use the ESD two-circuit wrist strap, and the wrist strap must be
connected to the dedicated jack. The crocodile clip must not be connected to the
ground.



The ESD sensitive components, the processing equipment, test equipment,
tools, and devices must be connected to the ground properly. The indexes are as
follows:
−

Hard ground resistance < 4 Ω

−

1 x 105 Ω ≤ Soft ground resistance < 1 x 109 Ω

−

1 x 105 Ω ≤ ICT fixture soft ground resistance < 1 x 1011 Ω

−

The electronic screwdriver and electronic soldering iron can be easily
oxidized. Their ground resistance must be less than 20 Ω.



The parts of the equipment, devices, and tools that touch the ESD sensitive
components and moving parts that are close to the ESD sensitive components
must be made of ESD materials and have sound ground connection. The parts
that are not made of ESD materials must be handled with ESD treatment, such
as painting the ESD coating or ionization treatment (check that the friction
voltage is less than 100 V).



Key parts in the production equipment (parts that touch the ESD sensitive
components or parts that are within 30 cm away from the ESD sensitive
components), including the conveyor belt, conveyor chain, guide wheel, and
SMT nozzle, must all be made of ESD materials and be connected to the ground
properly (check that the friction voltage is less than 100 V).



Engineers that touch IC chips, boards, modules, and other ESD sensitive
components and assemblies must wear ESD wrist straps, ESD gloves, or ESD
finger cots properly. Engineers that sit when handling the components must all
wear ESD wrist straps.



Noticeable ESD warning signs must be attached to the packages and placement
areas of ESD sensitive components and assemblies.



Boards and IC chips must not be stacked randomly or be placed with other ESD
components.



Effective shielding measures must be taken on the ESD sensitive materials that
are transported or stored outside the EPA.
HUAWEI ME906s module does not include any protection against overvoltage.

Issue 04 (2017-12-11)

HUAWEI ME906s LTE M.2 Module
Hardware Guide

Mechanical Specifications

6.1 About This Chapter
This chapter describes the following aspects of the ME906s module:


Dimensions



Packing System

6.2 Dimensions
Figure 6-1 shows the dimensions of ME906s in details.
Figure 6-1 Dimensions (Unit: mm)

Issue 04 (2017-12-11)

HUAWEI ME906s LTE M.2 Module
Hardware Guide

Mechanical Specifications

6.3 Packing System
ME906s package includes the blister tray, the blister tray cover, and the carton (with
bottom and top clapboard).
The blister tray of the ME906s module package is as shown in the following figure.
There are 75 pcs modules for every tray, 6 pcs trays in one carton, and 450 pcs
modules for every carton. And the blister tray cover covers the top tray.
Figure 6-2 Package assembly

Issue 04 (2017-12-11)

HUAWEI ME906s LTE M.2 Module
Hardware Guide

Installation

7.1 About This Chapter
This chapter describes the assembly of ME906s, including:


Connect ME906s to board



Thermal Management



Antenna Plug

7.2 Connect ME906s to board
Figure 7-1 Install the module
HUAWEI M.2 Module

It refers to M.2 specification.
The module will need a mechanical retention at the end of the board. The module
specifies a 5.5 mm Dia. keep out zone at the end for attaching a screw.
The module Stand-off and mounting screw also serve as part of the module Electrical
Ground path. The Stand-off should be connected directly to the ground plane on the
platform. So that when the module is mounted and the mounting screw is screwed on
to hold the module in place, this will make the electrical ground connection from the
module to the platform ground plane.

The module could not be installed or removed when the host is powered on.
Otherwise, it may result in permanent damage to the module.

Issue 04 (2017-12-11)

HUAWEI ME906s LTE M.2 Module
Hardware Guide

Installation

7.3 Thermal Management
Because ME906s is very small, the dissipating heat is very important to it.
It has to take several means to ensure ME906s to meet the specification.
The methods described as follow:


The mounting screw is to hold the module in place, and connect the heat source
to the platform ground plane of the custom board.



About the custom board, it can afford larger and much more area of grounding
layers to enhance cooling of the PCB and ensure that the heat spreads evenly in
the PCB.



The stand-off provides a thermal ground path. The design requirements for
thermal are a material with a minimum conductivity of 50 watts per meter Kelvin
and surface area of 22 Sq mm.



The customer can add a heat sink on the model top surface, and this method
can bring out much heat source of the module.

7.4 Antenna Plug
Figure 7-2 Mating the plug

Align the mating tool or the mating end of the tool over the plug end of the cable
assembly.

Firmly place the tool over the plug until it is secured in the tool.

Place the plug cable assembly (held in the tool) over the corresponding receptacle.

Assure that the plug and receptacle are aligned press-down perpendicular to the
mounting surface until both connectors are fully mated.

Remove the mating tool by pulling it up carefully.

Issue 04 (2017-12-11)

HUAWEI ME906s LTE M.2 Module
Hardware Guide

Installation

Figure 7-3 Unmating the plug



The extraction tool is recommended.



Any attempt of unmating by pulling on the cable may result in damage and influence the
mechanical / electrical performance.

It is recommended not to apply any pull forces after the bending of the cable, as
described in Figure 7-4 .
Figure 7-4 Do not apply any pull forces after the bending of the cable

Issue 04 (2017-12-11)

HUAWEI ME906s LTE M.2 Module
Hardware Guide

Certifications

This chapter gives a general description of certifications of ME906s.
Table 8-1 Product certifications
Certification

ME906s-158



FCC



NCC



RCM



EU RoHS



PVC-Free



GCF



Halogen-free



Table 8-1 shows certifications the module has been implemented. For more demands, please
contact us for more details about this information.

Issue 04 (2017-12-11)

HUAWEI ME906s LTE M.2 Module
Hardware Guide

Safety Information

Read the safety information carefully to ensure the correct and safe use of your
wireless device. Applicable safety information must be observed.

9.1 Interference
Power off your wireless device if using the device is prohibited. Do not use the
wireless device when it causes danger or interference with electric devices.

9.2 Medical Device


Power off your wireless device and follow the rules and regulations set forth by
the hospitals and health care facilities.



Some wireless devices may affect the performance of the hearing aids. For any
such problems, consult your service provider.



Pacemaker manufacturers recommend that a minimum distance of 15 cm be
maintained between the wireless device and a pacemaker to prevent potential
interference with the pacemaker. If you are using an electronic medical device,
consult the doctor or device manufacturer to confirm whether the radio wave
affects the operation of this device.

9.3 Area with Inflammables and Explosives
To prevent explosions and fires in areas that are stored with inflammable and
explosive devices, power off your wireless device and observe the rules. Areas
stored with inflammables and explosives include but are not limited to the following:


Gas station



Fuel depot (such as the bunk below the deck of a ship)



Container/Vehicle for storing or transporting fuels or chemical products



Area where the air contains chemical substances and particles (such as granule,
dust, or metal powder)



Area indicated with the "Explosives" sign

Issue 04 (2017-12-11)

HUAWEI ME906s LTE M.2 Module
Hardware Guide

Safety Information



Area indicated with the "Power off bi-direction wireless equipment" sign



Area where you are generally suggested to stop the engine of a vehicle

9.4 Traffic Security


Observe local laws and regulations while using the wireless device. To prevent
accidents, do not use your wireless device while driving.



RF signals may affect electronic systems of motor vehicles. For more
information, consult the vehicle manufacturer.



In a motor vehicle, do not place the wireless device over the air bag or in the air
bag deployment area. Otherwise, the wireless device may hurt you owing to the
strong force when the air bag inflates.

9.5 Airline Security
Observe the rules and regulations of airline companies. When boarding or
approaching a plane, power off your wireless device. Otherwise, the radio signal of
the wireless device may interfere with the plane control signals.

9.6 Safety of Children
Do not allow children to use the wireless device without guidance. Small and sharp
components of the wireless device may cause danger to children or cause
suffocation if children swallow the components.

9.7 Environment Protection
Observe the local regulations regarding the disposal of your packaging materials,
used wireless device and accessories, and promote their recycling.

9.8 WEEE Approval
The wireless device is in compliance with the essential requirements and other
relevant provisions of the Waste Electrical and Electronic Equipment Directive
2012/19/EU (WEEE Directive).

9.9 RoHS Approval
The wireless device is in compliance with the restriction of the use of certain
hazardous substances in electrical and electronic equipment Directive 2011/65/EU
(RoHS Directive).

Issue 04 (2017-12-11)

HUAWEI ME906s LTE M.2 Module
Hardware Guide

Safety Information

9.10 Laws and Regulations Observance
Observe laws and regulations when using your wireless device. Respect the privacy
and legal rights of the others.

9.11 Care and Maintenance
It is normal that your wireless device gets hot when you use or charge it. Before you
clean or maintain the wireless device, stop all applications and power off the wireless
device.


Use your wireless device and accessories with care and in clean environment.
Keep the wireless device from a fire or a lit cigarette.



Protect your wireless device and accessories from water and vapour and keep
them dry.



Do not drop, throw or bend your wireless device.



Clean your wireless device with a piece of damp and soft antistatic cloth. Do not
use any chemical agents (such as alcohol and benzene), chemical detergent, or
powder to clean it.



Do not leave your wireless device and accessories in a place with a considerably
low or high temperature.



Use only accessories of the wireless device approved by the manufacture.
Contact the authorized service center for any abnormity of the wireless device or
accessories.



Do not dismantle the wireless device or accessories. Otherwise, the wireless
device and accessories are not covered by the warranty.



The device should be installed and operated with a minimum distance of 20 cm
between the radiator and your body.

9.12 Emergency Call
This wireless device functions through receiving and transmitting radio signals.
Therefore, the connection cannot be guaranteed in all conditions. In an emergency,
you should not rely solely on the wireless device for essential communications.

9.13 Regulatory Information
The following approvals and notices apply in specific regions as noted.

9.13.1 EU Regulatory Conformance
Statement
Hereby, Huawei Technologies Co., Ltd. declares that this device is in compliance with
the essential requirements and other relevant provisions of Directive 2014/53/EU.

Issue 04 (2017-12-11)

HUAWEI ME906s LTE M.2 Module
Hardware Guide

Safety Information

The most recent, effective version of the DoC (Declaration of Conformity) can be
viewed at http://consumer.huawei.com/certification.
This device may be operated in all member states of the EU.
Observe national and local regulations where the device is used.
This device may be restricted for use, depending on the local network.

Frequency Bands and Power
(a) Frequency bands in which the radio equipment operates: Some bands may not be
available in all countries or all areas. Please contact the local carrier for more details.
(b) Maximum radio-frequency power transmitted in the frequency bands in which the
radio equipment operates: The maximum power for all bands is less than the highest
limit value specified in the related Harmonized Standard.
The frequency bands and transmitting power (radiated and/or conducted) nominal
limits applicable to this radio equipment are as follows: GSM 900: 37 dBm, GSM
1800: 34 dBm, WCDMA 900/2100: 25.7 dBm, LTE Band 1/3/7/8/20/28: 25.7 dBm.

Software Information
Software updates will be released by the manufacturer to fix bugs or enhance
functions after the product has been released. All software versions released by the
manufacturer have been verified and are still compliant with the related rules.
All RF parameters (for example, frequency range and output power) are not
accessible to the user, and cannot be changed by the user.
For the most recent information about accessories and software, please see the DoC
(Declaration of Conformity) at http://consumer.huawei.com/certification.

9.13.2 FCC Statement
Federal Communications Commission Notice (United States): Before a wireless
device model is available for sale to the public, it must be tested and certified to the
FCC that it does not exceed the limit established by the government-adopted
requirement for safe exposure.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
Warning: Changes or modifications made to this equipment not expressly approved
by HUAWEI may void the FCC authorization to operate this equipment.

Issue 04 (2017-12-11)

HUAWEI ME906s LTE M.2 Module
Hardware Guide

Appendix A Circuit of Typical Interface

Appendix A Circuit of Typical
Interface

DNI: Do Not Install initially.
M.2: new name of NGFF.

1
3
5
7
9
11

USB_DP
USB_DM

21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75

1.8V (3.3V), active low
from proximity sensor

USB SCH

2.2pF

USB_DP

DNI,Reserve for
USB eye debug.

C10
DNI
USB_DM

33pF

1.8V, Active Low

ANT_TUNE_0
ANT_TUNE_1
ANT_TUNE_2
ANT_TUNE_3
RESET #
CONFIG1
CONFIG2

Cap close to pin67
Tunable antenna SCH
R14

ANT_TUNE_0

R15

ANT_TUNE_1

R16

ANT_TUNE_2

ANT_TUNE_3

33pF

C14
DNI

C13
DNI

C12
DNI

C11
DNI

R17

P2
P4
P6
P8
P10

2
4
6
8
10

R23
POWER_ON_OFF
W_DISABLE #
LED #

GPIO2

1.8V(3.3V).high:on,low:off
VBAT

1.8V(3.3V),active low
R8

D1
CONFIG0
WAKE_On_WWAN #
BODYSAR_N

CONFIG[3:0] to PC

to PC USB2.0 interface

P1
P3
P5
P7
P9
P11

P21
P23
P25
P27
P29
P31
P33
P35
P37
P39
P41
P43
P45
P47
P49
P51
P53
P55
P57
P59
P61
P63
P65
P67
P69
P71
P73
P75

P20
P22
P24
P26
P28
P30
P32
P34
P36
P38
P40
P42
P44
P46
P48
P50
P52
P54
P56
P58
P60
P62
P64
P66
P68
P70
P72
P74

76 M1

20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74

200

RF on: light on
RF off: light off

GPS_DISABLE #

1.8V(3.3V),active low

USIM_RESET
USIM_CLK
USIM_IO
USIM_PWR

M.2: 3.135V-4.4V,typical 3.3V
current: 2.5A max
One 220uF Tantalum Capacitor is needed to
make sure that the voltage does not drop
below 3.135 V in any case.
USIM_DET

VBAT

M2 77

100K
R2

1.8V (3.3V),open drain ,active low
CONFIG3
CONFIG2
CONFIG1
CONFIG0

CONFIG3

100K
R3

10K

100K
R4

100K
R5

Module output: 0V or NC

1V8(3V3)

ME906s is configed as WWAN-SSIC0 internally

CONFIG[3:0] is for card type indication and present detection

1V8

Config pin SCH

330pF

100nF

1uF

22uF

220uF

1.8V tolerence
RC is reserved for RF debug
Power_on_off control option 1
When module on/off is controlled only by VBAT, must use this design
R24 should not be larger than 10K
When use option 1 , R23 must be DNI

USIM SCH

VBAT

1
5VCC
2GND
RST

0
0

6
3VPP
7CLK
I/O

C18:to avoid twitter
other devices: for GCF or PTCRB debug.

Issue 04 (2017-12-11)

R21

G 1

VBAT
GPIO2

When Vgpio2 is ON
Q1 is on and Q2 is off
Power_On_Off is controlled by GPIO2

3 D

2 S

When Vgpio2 is off
Q1 is off and Q2 is on
Power_On_Off is is pulled LOW
Module is shut off safely
Vgpio2

G 1

3 D

R19

G 1

Q2
2 S

POWER_ON_OFF

2 S
GPIO1 is from SOC
V-gpio1 is power supply of GPIO1 domain

USIM absent: CD-->GND;
USIM present: CD Open
USIM_PWR: 1.8V or 3.0V

GPIO1

2 S

C15

C16

C17

C18

C19

0402

G 1

3 D

9
S3

33pF

3 D

33pF

11
M2

33pF

R12
R13

1uF

USIM_CLK
USIM_IO

10K

Power_on_off control option 2
When VBAT is always on, must use this design
When use option 2 , R24 must be DNI
GPIO2 is from SOC

470pF

33pF

R20

USIM_RESET R11

RESET #

USIM_PWR

R24

V-gpio1

RESET control SCH
8
S2

4
CD

R22

10
M1
USIM_DET USIM_DET Must Be Used.

V-gpio2 is power supply of GPIO2 domain

Capacitor of D2 should be less than 10pF
GND of socket should be well connected to module GND
Note: If M1 and M2 pin is metal,you can connect it to GND

HUAWEI ME906s LTE M.2 Module
Hardware Guide

Appendix B Acronyms and Abbreviations

Appendix B Acronyms and
Abbreviations

Acronym or Abbreviation

Expansion

3GPP

3rd Generation Partnership Project

CCC

China Compulsory Certification

CPU

Central Processing Unit

Coding Scheme

CSD

Circuit Switched Data

Direct Current

DMA

Direct Memory Access

DVK

Development Kit

EBU

External Bus Unit

EDGE

Enhanced Data for GSM Evolution

EIA

Electronic Industries Association

EMC

Electromagnetic Compatibility

EPA

Electrostatic Discharge Protected Area

ESD

Electrostatic Discharge

European Union

FCC

Federal Communications Commission

FDD-TDMA

Frequency Division Duplexing-Time Division
Multiple Access

GMSK

Gaussian Minimum Shift Keying

GPIO

General-purpose I/O

GPRS

General Packet Radio Service

Issue 04 (2017-12-11)

HUAWEI ME906s LTE M.2 Module
Hardware Guide

Appendix B Acronyms and Abbreviations

Acronym or Abbreviation

Expansion

GSM

Global System for Mobile communication

HBM

Human Body Model

HSIC

High Speed Inter-Chip Interface

HSDPA

High-Speed Downlink Packet Access

HSPA+

Enhanced High Speed Packet Access

HSUPA

High Speed Up-link Packet Access

IPC

Inter Processor Communications

ISO

International Standards Organization

I2S

I2C Sound

LCD

Liquid Crystal Display

LCP

Liquid Crystal Polyester

LDO

Low-Dropout

LED

Light-Emitting Diode

LTE

Long Term Evolution

MCP

Multi-chip Package

MIPI

Mobile Industry Processor Interface

NGFF

Next Generation Form Factor

NTC

Negative Temperature Coefficient

Power Amplifier

PBCCH

Packet Broadcast Control Channel

PCB

Printed Circuit Board

PDU

Protocol Data Unit

PMU

Power Management Unit

Radio Frequency

RoHS

Restriction of the Use of Certain Hazardous
Substances

RSE

Radiated Spurious Emission

RTC

Real-time Clock

SIMO

Single Input Multiple Output

TTL

Transistor-transistor Logic

TVS

Transient Voltage Suppressor

Issue 04 (2017-12-11)

HUAWEI ME906s LTE M.2 Module
Hardware Guide

Appendix B Acronyms and Abbreviations

Acronym or Abbreviation

Expansion

UMTS

Universal Mobile Telecommunications System

USB

Universal Serial Bus

USIM

Universal Subscriber Identity Module

VSWR

Voltage Standing Wave Ratio

WCDMA

Wideband Code Division Multiple Access

Issue 04 (2017-12-11)

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Huawei ME906s LTE M.2 Module Hardware Guide (V100R001 04, English)

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