Huawei ME906s LTE M.2 Module Hardware Guide (V100R001 04, English)

HUAWEI ME906s LTE M.2 Module

Hardware Guide

Issue

04

Date

2017-12-11

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HUAWEI ME906s LTE M.2 Module

Hardware Guide

About This Document

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About This Document

Revision History

Document

Version

Date

Chapter

Descriptions

01

2015-06-10

Creation

02

2015-07-23

2.2

Updated dimensions in Table 2-1

Features

3.4.2

Updated the maximum value of the pull-

up resistor

4.3.1

Updated the test instrument

4.4.2

Updated Table 4-4 Conducted Tx power

5.4.1

Updated Table 5-4 Requirements for

input current

5.5

Updated test duration of temperature

cycle in Table 5-10 Test conditions and

results of the reliability

6.2

Updated the dimensions

03

2017-06-23

9.13.1

Updated section 9.13.1 EU

Regulatory Conformance

04

2017-12-11

Deleted privacy policy

HUAWEI ME906s LTE M.2 Module

Hardware Guide

Contents

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Contents

1 Introduction.................................................................................................................................... 7

2 Overall Description ...................................................................................................................... 8

2.1 About This Chapter ........................................................................................................................... 8

2.2 Function Overview............................................................................................................................ 8

2.3 Circuit Block Diagram ....................................................................................................................... 9

3 Description of the Application Interfaces .............................................................................. 11

3.1 About This Chapter .......................................................................................................................... 11

3.2 75-pin Gold Finger........................................................................................................................... 11

3.3 Power Interface .............................................................................................................................. 19

3.3.1 Overview ................................................................................................................................ 19

3.3.2 Power Supply 3.3V Interface ................................................................................................. 19

3.3.3 USIM Power Output USIM_PWR .......................................................................................... 21

3.4 Signal Control Interface .................................................................................................................. 21

3.4.1 Overview ................................................................................................................................ 21

3.4.2 Power_On_Off Control Pin .................................................................................................... 23

3.4.3 RESET# Pin .......................................................................................................................... 28

3.4.4 LED# Pin ............................................................................................................................... 30

3.4.5 W_DISABLE# Pin .................................................................................................................. 30

3.4.6 GPS_DISABLE# Pin .............................................................................................................. 31

3.4.7 Wake_On_WWAN# Pin ......................................................................................................... 32

3.4.8 BodySAR_N Pin .................................................................................................................... 32

3.4.9 USIM_DET Pin ...................................................................................................................... 33

3.5 USB Interface ................................................................................................................................. 35

3.6 USIM Card Interface ...................................................................................................................... 36

3.6.1 Overview ................................................................................................................................ 36

3.6.2 Circuit Recommended for the USIM Card Interface .............................................................. 37

3.7 Tunable Antenna Control ................................................................................................................ 38

3.8 Config Pins ..................................................................................................................................... 39

3.9 Reserved Pins ................................................................................................................................ 40

3.10 NC Pins ........................................................................................................................................ 41

3.11 RF Antenna Interface.................................................................................................................... 41

3.11.1 RF Connector location ......................................................................................................... 41

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Contents

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3.11.2 Coaxial RF Connector Guidelines ....................................................................................... 42

4 RF Specifications ......................................................................................................................... 45

4.1 About This Chapter ......................................................................................................................... 45

4.2 Operating Frequencies ................................................................................................................... 45

4.3 Conducted RF Measurement ......................................................................................................... 46

4.3.1 Test Environment ................................................................................................................... 46

4.3.2 Test Standards ....................................................................................................................... 46

4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 46

4.4.1 Conducted Receive Sensitivity .............................................................................................. 46

4.4.2 Conducted Transmit Power ................................................................................................... 48

4.5 Antenna Design Requirements ...................................................................................................... 49

4.5.1 Antenna Design Indicators..................................................................................................... 49

4.5.2 Interference ........................................................................................................................... 51

4.5.3 Antenna Requirements .......................................................................................................... 51

5 Electrical and Reliability Features ........................................................................................... 53

5.1 About This Chapter ......................................................................................................................... 53

5.2 Absolute Ratings ............................................................................................................................ 53

5.3 Operating and Storage Temperatures ............................................................................................ 53

5.4 Power Supply Features .................................................................................................................. 54

5.4.1 Input Power Supply ............................................................................................................... 54

5.4.2 Power Consumption .............................................................................................................. 55

5.5 Reliability Features ......................................................................................................................... 60

5.6 EMC and ESD Features ................................................................................................................. 63

6 Mechanical Specifications ......................................................................................................... 65

6.1 About This Chapter ......................................................................................................................... 65

6.2 Dimensions ..................................................................................................................................... 65

6.3 Packing System.............................................................................................................................. 66

7 Installation.................................................................................................................................... 67

7.1 About This Chapter ......................................................................................................................... 67

7.2 Connect ME906s to board ............................................................................................................. 67

7.3 Thermal Management .................................................................................................................... 68

7.4 Antenna Plug .................................................................................................................................. 68

8 Certifications ................................................................................................................................ 70

9 Safety Information ...................................................................................................................... 71

9.1 Interference .................................................................................................................................... 71

9.2 Medical Device ............................................................................................................................... 71

9.3 Area with Inflammables and Explosives ......................................................................................... 71

9.4 Traffic Security ................................................................................................................................ 72

9.5 Airline Security ................................................................................................................................ 72

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9.6 Safety of Children ........................................................................................................................... 72

9.7 Environment Protection .................................................................................................................. 72

9.8 WEEE Approval .............................................................................................................................. 72

9.9 RoHS Approval ............................................................................................................................... 72

9.10 Laws and Regulations Observance ............................................................................................. 73

9.11 Care and Maintenance ................................................................................................................. 73

9.12 Emergency Call ............................................................................................................................ 73

9.13 Regulatory Information ................................................................................................................. 73

9.13.1 EU Regulatory Conformance .............................................................................................. 73

9.13.2 FCC Statement .................................................................................................................... 74

10 Appendix A Circuit of Typical Interface .............................................................................. 75

11 Appendix B Acronyms and Abbreviations .......................................................................... 76

HUAWEI ME906s LTE M.2 Module

Hardware Guide

Introduction

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1 Introduction

This document describes the hardware application interfaces and air interfaces that

are provided when HUAWEI ME906s LTE M.2 Module (hereinafter referred to as the

ME906s module) is used.

M.2 is the new name for NGFF (Next Generation Form Factor), which is the

specification of PCI-SIG (Peripheral Component Interconnect Special Interest

Group).

This document helps you to understand the interface specifications, electrical

features and related product information of the ME906s module.

HUAWEI ME906s LTE M.2 Module

Hardware Guide

Overall Description

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2 Overall Description

2.1 About This Chapter

This chapter gives a general description of the ME906s module and provides:

- Function Overview

- Circuit Block Diagram

2.2 Function Overview

Table 2-1 Features

Feature

Description

Physical

Features

Dimensions (L × W × H): 42 mm × 30 mm × 2.22 mm

Weight: about 6 g

Operating

Bands

FDD LTE: Band 1, Band 2, Band 3, Band 5, Band 7, Band 8,

Band 20, Band 28, all bands with diversity

WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5, Band

8, all bands with diversity

GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz

GPS/GLONASS: L1

Operating

Temperature

Normal operating temperature: –10°C to +55°C

Extended operating temperature[1]: –20°C to +70°C

Storage

Temperature

–40°C to +85°C

Power Voltage

3.135 V to 4.4 V (3.3 V is typical)

Application

Interface (75-

pin Gold

Finger)

USIM (3.0 V or 1.8 V)

USIM_DET pin (USIM Hot Swap Detection)

USB 2.0 (High-Speed)

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Overall Description

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Feature

Description

Power_On_Off pin

RESET# pin

LED# pin

W_DISABLE# pin

GPS_DISABLE# pin

Tunable Antenna control (4 GPIOs)

Wake_On_WWAN# pin

BodySAR_N pin

Power supply (5 pins)

Antenna

Connectors

MAIN and AUX (supports Diversity and GPS simultaneously)

SMS

Supports MO and MT

Supports formats of PDU

Point-to-point and cell broadcast

Data Services

GPRS: DL 85.6 kbit/s; UL 85.6 kbit/s

EDGE: DL 236.8 kbit/s; UL 236.8 kbit/s

WCDMA CS: DL 64 kbit/s; UL 64 kbit/s

WCDMA PS: DL 384 kbit/s; UL 384 kbit/s

HSPA+: DL 21.6 Mbit/s; UL 5.76 Mbit/s

DC-HSPA+: DL 42 Mbit/s; UL 5.76 Mbit/s

LTE FDD: DL 150 Mbit/s; UL 50 Mbit/s @20M BW cat3

Operating

System

Windows 7/8/8.1/10, Android 4.0 or later

[1]: When the ME906s module works at –20°C to –10°C or +55°C to +70°C , NOT all its RF

specifications comply with the 3GPP specifications.

2.3 Circuit Block Diagram

The ME906s module is developed based on Huawei's Balong Hi6921M platform.

Figure 2-1 shows the circuit block diagram of the ME906s module. The application

block diagram and major functional units of the ME906s module contain the following

parts:

- Baseband controller

HUAWEI ME906s LTE M.2 Module

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Overall Description

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- Power manager

- Nand Flash

- Radio Frequency (RF) transceiver

- RF Front End

Figure 2-1 Circuit block diagram

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Hardware Guide

Description of the Application Interfaces

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3 Description of the Application Interfaces

3.1 About This Chapter

This chapter mainly describes the application interfaces of the ME906s module,

including:

- 75-pin Gold Finger

- Power Interface

- Signal Control Interface

- USB Interface

- USIM Card Interface

- Tunable Antenna Control

- Config Pins

- Reserved Pins

- NC Pins

- RF Antenna Interface

3.2 75-pin Gold Finger

The ME906s module uses a 75-pin Gold Finger as its external interface. For details

about the module dimensions, see 6.2 Dimensions.

Figure 3-1 shows the sequence of pins on the 75-pin signal interface of the ME906s

module.

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Hardware Guide

Description of the Application Interfaces

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Figure 3-1 TOP view of gold finger interface pins

Table 3-1 shows the definitions of the 75-pin interface (67 for signals and 8 for notch)

of the ME906s module.

As M.2 Nomenclature, ME906s is Type 3042-S3-B (30 mm × 42 mm, Max.

Component Height on Top is 1.5 mm and single-sided, Key ID is B).

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Description of the Application Interfaces

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Table 3-1 Definitions of pins on the M.2 interface

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

1

CONFIG_3

O

Connected to Ground

internally.

-

0

-

The

module is

configured

as WWAN-

SSIC 0.

2

3.3V

PI

Power supply

-

3.135

3.3

4.4

-

3

Ground

PI

Ground

-

0

-

4

3.3V

PI

Power supply

-

3.135

3.3

4.4

-

5

Ground

PI

Ground

-

0

-

6

Power_On_Off

I

A single control to turn

On/Off WWAN.

When it is Low, WWAN is

powered off.

When it is High, WWAN is

powered on.

It is internally pulled to

Low.

It is 3.3 V tolerant but can

be driven by either 1.8 V or

3.3 V GPIO.

VIH

1.26

-

3.6

The

module is

pulled

down

inside by a

1 MΩ

resistor.

VIL

–0.3

-

0.3

7

USB_D+

I/O

USB Data + defined in the

USB 2.0 specification

-

8

W_DISABLE#

I

WWAN disable function

When it is High, WWAN

function is determined by

software AT command.

Default enabled.

When it is Low, WWAN

function will be turned off.

VIH

1.26

-

3.6

-

VIL

–0.3

-

0.3

9

USB_D-

I/O

USB Data - defined in the

USB 2.0 specification

-

10

LED#

O

It is an open drain, active

low signal, used to allow

the M.2 card to provide

status indicators via LED

devices that will be

provided by the host.

VOL

0

-

0.48

The

maximum

IOL is 40

mA.

11

Ground

PI

Ground

-

0

-

12

Notch

-

13

Notch

-

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

14

Notch

-

15

Notch

-

16

Notch

-

17

Notch

-

18

Notch

-

19

Notch

-

20

Reserved

-

Reserved for future use,

please keep it not

connected in the host side.

-

21

CONFIG_0

O

Not Connected internally.

-

The

module is

configured

as WWAN-

SSIC 0.

22

Reserved

-

Reserved for future use,

please keep it not

connected in the host side.

-

23

Wake_On_W

WAN#

O

It is open drain and active

low.

WWAN to wake up the

host.

VOL

0

-

0.48

The

maximum

IOL is 40

mA.

24

Reserved

-

Reserved for future use,

please keep it not

connected in the host side.

-

25

BodySAR_N

I

Hardware pin for BodySAR

detection.

When it is High, No TX

power backoff (default).

When it is Low, TX power

backoff.

VIH

1.26

-

3.6

-

VIL

–0.3

-

0.3

26

GPS_DISABL

E#

I

GPS disable function

When it is High, GPS

function is determined by

software AT command.

When it is Low, GPS is

turned off.

VIH

1.26

-

3.6

-

VIL

–0.3

-

0.3

27

Ground

PI

Ground

-

0

-

28

Reserved

-

Reserved for future use,

please keep it not

connected in the host side.

-

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Description of the Application Interfaces

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

29

NC

-

Not Connected

-

30

USIM_RESET

O

USIM Reset

VOH

0.7 x

USIM

_PW

R

-

3.3

USIM_PW

R=1.8 V or

3.0 V

VOL

0

-

0.2 x

USIM

_PW

R

31

NC

-

Not Connected

-

32

USIM_CLK

O

USIM Clock

VOH

0.7 x

USIM

_PW

R

-

3.3

USIM_P

WR=1.8 V

or 3.0 V

VOL

0

-

0.2 x

USIM

_PW

R

33

Ground

PI

Ground

-

0

-

34

USIM_DATA

I/O

USIM DATA

VOH

0.7 x

USIM

_PW

R

-

3.3

USIM_PW

R=1.8 V or

3.0 V

VOL

0

-

0.2 x

USIM

_PW

R

VIH

0.7 x

USIM

_PW

R

-

3.3

VIL

0

-

0.2 x

USIM

_PW

R

35

NC

-

Not Connected

-

36

USIM_PWR

PO

USIM POWER

-

1.75

1.8

1.98

USIM_PW

R=1.8 V

-

2.75

3

3.3

USIM_PW

R=3.0 V

37

NC

-

Not Connected

-

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Description of the Application Interfaces

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

38

NC

-

Not Connected

-

39

Ground

PI

Ground

-

0

-

40

I2C_SCL

I/O

I2C clock, slave.

VIH

1.26

1.8

2.1

The

current

firmware

does not

support

this

function.

VIL

–0.3

-

0.63

41

NC

-

Not Connected

-

42

I2C_SDA

I/O

I2C data, slave.

VOH

1.35

1.8

-

The

current

firmware

does not

support

this

function.

VOL

0

-

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

43

NC

-

Not Connected

-

44

I2C_IRQ

I

Interrupt signal to wake up

the module.

VIH

1.26

1.8

2.1

The

current

firmware

does not

support

this

function.

VIL

–0.3

-

0.63

45

Ground

PI

Ground

-

0

-

46

SYSCLK

O

System clock output for

external GNSS module.

VOH

1.6

1.8

-

The

current

firmware

does not

support

this

function.

VOL

0

-

0.45

47

NC

-

Not Connected

-

48

TX_BLANKIN

G

O

TX blanking signal for

external GNSS module.

VOH

1.6

1.8

-

The

current

firmware

does not

support

this

function.

VOL

0

-

0.45

49

NC

-

Not Connected

-

50

NC

-

Not Connected

-

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Description of the Application Interfaces

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

51

Ground

PI

Ground

-

0

-

52

NC

-

Not Connected

-

53

NC

-

Not Connected

-

54

NC

-

Not Connected

-

55

NC

-

Not Connected

-

56

NC

-

Not Connected

-

57

Ground

PI

Ground

-

0

-

58

NC

-

Not Connected

-

59

ANTCTL0

O

Tunable antenna control

signal, bit 0.

It is a push-pull type GPIO.

VOH

1.37

1.8

2.1

-

VOL

0

-

0.45

-

60

COEX3

I/O

For coexistence.

VOH

1.35

1.8

1.9

The

current

firmware

does not

support

this

function.

VOL

0

-

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

61

ANTCTL1

O

Tunable antenna control

signal, bit 1.

It is a push-pull type GPIO.

VOH

1.37

1.8

2.1

-

VOL

0

-

0.45

-

62

COEX_UART_

RXD

I/O

UART transmit signal from

other wireless coexistence

solution to the module.

VOH

1.35

1.8

1.9

-

VOL

0

-

0.45

-

VIH

1.26

1.8

2.1

-

VIL

–0.3

-

0.63

-

63

ANTCTL2

O

Tunable antenna control

signal, bit 2.

It is a push-pull type GPIO.

VOH

1.37

1.8

2.1

-

VOL

0

-

0.45

-

64

COEX_UART_

TXD

I/O

UART transmit signal from

the module to other

wireless coexistence

solution.

VOH

1.35

1.8

1.9

-

VOL

0

-

0.45

-

VIH

1.26

1.8

2.1

-

VIL

–0.3

-

0.63

-

65

ANTCTL3

O

Tunable antenna control

signal, bit 3.

It is a push-pull type GPIO.

VOH

1.37

1.8

2.1

-

VOL

0

-

0.45

-

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Description of the Application Interfaces

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

66

USIM_DET

I

USIM hot swap detection

pin.

Rising edge for insertion;

falling edge for removal.

When it is High, USIM is

present.

When it is Low, USIM is

absent.

VIH

1.26

1.8

2.1

The

module is

pulled up

inside.

VIL

–0.3

-

0.3

67

RESET#

I

System reset, active low.

VIH

1.26

-

2.1

The

module is

pulled up

inside.

VIL

–0.3

-

0.3

68

NC

-

Not Connected

-

69

CONFIG_1

O

Connected to Ground

internally.

-

0

-

The

module is

configured

as WWAN-

SSIC 0.

70

3.3V

PI

Power supply

-

3.135

3.3

4.4

-

71

Ground

PI

Ground

-

0

-

72

3.3V

PI

Power supply

-

3.135

3.3

4.4

-

73

Ground

PI

Ground

-

0

-

74

3.3V

PI

Power supply

-

3.135

3.3

4.4

-

75

CONFIG_2

O

Connected to Ground

internally.

-

0

-

The

module is

configured

as WWAN-

SSIC 0.

- I indicates pins for digital signal input; O indicates pins for digital signal output; PI indicates

power input pins; PO indicates power output pins.

- VIL: Low-level Input voltage; VIH: High-level Input voltage; VOL: Low-level Output voltage; VOH:

High-level Output voltage.

- The NC pins are not connected, therefore, before you deal with these pins, please refer to

the corresponding hardware guide.

- The Reserved pins are internally connected to the module. Therefore, these pins should

not be used, otherwise they may cause problems. Please contact with us for more details

about this information.

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3.3 Power Interface

3.3.1 Overview

The power supply part of the ME906s module contains:

- 3.3V pin for the power supply

- USIM_PWR pin for USIM card power output

Table 3-2 lists the definitions of the pins on the power supply interface.

Table 3-2 Definitions of the pins on the power supply interface

Pin No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

2, 4, 70, 72, 74

3.3V

PI

Power supply

-

3.135

3.3

4.4

-

36

USIM_PWR

PO

USIM POWER

-

1.75

1.8

1.98

USIM_PW

R=1.8 V

-

2.75

3

3.3

USIM_PW

R=3.0 V

3, 5, 11, 27,

33, 39, 45, 51,

57, 71, 73

Ground

PI

Ground

-

0

-

3.3.2 Power Supply 3.3V Interface

The ME906s module power is supplied through the 3.3V pins and the voltage ranges

from 3.135 V to 4.4 V (typical value is 3.3 V). The ME906s provides 5 power pins and

11 GND pins. To ensure that the ME906s module works normally, all the pins must be

connected. The M.2 connector pin is defined as that should support 500 mA/Pin

continuously.

When the ME906s module works at GSM mode, the module transmits at the

maximum power, the transient peak current may reach 2.5 A@3.3 V. In this case, the

power pin voltage will drop. Make sure that the voltage does not drop below 3.135 V

in any case.

The traces of the power supply should be as short and wide as possible. It is

recommended that at least one 220 μF capacitance is added onto the 3.3V power

rails and as close to the M.2 connector as possible. Customers can reduce the

capacitance if it can be guaranteed that the 3.3V pin does not drop below 3.135 V in

any case.

Figure 3-2 shows the recommended power circuit of ME906s module.

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Figure 3-2 Recommended power circuit

3.135 V is the minimum voltage supplied to ME906s by the host, and 3.3V pin must never be

under 3.135 V in any case, which is shown as the following figure.

If the customer wants to power cycle ME906s, the 3.3V pin must stay below 1.8 V for

more than 100 ms. Figure 3-3 shows the power supply timing sequence between

power cycling.

Module

(Modem)

3.3V

+

3.3V

330 pF 100 nF 1 μF 22 μF 220 μF

Time

3.135V

3.3V

4.4V

Voltage

Do not drop below 3.135 V during 2G Tx.

The maximum current may be 2.5 A@3.3 V.

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Figure 3-3 Power supply timing sequence between power cycling

Parameter

Remarks

Time (Min.)

Unit

Toff

Power off time

100

ms

3.3.3 USIM Power Output USIM_PWR

Through the USIM_PWR power supply interface, the ME906s module can supply 1.8

V or 3.0 V power to USIM card. The transient current can reach 200 mA, so special

attention should be taken on PCB design at the host side.

3.4 Signal Control Interface

3.4.1 Overview

The signal control part of the interface in the ME906s module consists of the

following:

- Power On/Off (Power_On_Off) pin

- Module reset (RESET#) pin

- LED control (LED#) pin

- WWAN disable control (W_DISABLE#) pin

- GPS disable control (GPS_DISABLE#) pin

- Wake signal out from module (Wake_On_WWAN#) pin

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- BodySAR detection (BodySAR_N) pin

- USIM detection (USIM_DET) pin

Table 3-3 lists the pins on the signal control interface.

Table 3-3 Pins on the signal control interface

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

6

Power_On_

Off

I

A single control to turn

On/Off WWAN.

When it is Low, WWAN is

powered off.

When it is High, WWAN is

powered on.

It is internally pulled to Low.

It is 3.3 V tolerant but can be

driven by either 1.8 V or 3.3

V GPIO.

VIH

1.26

-

3.6

The

module is

pulled

down

inside by a

1MΩ

resistor.

VIL

–0.3

-

0.3

67

RESET#

I

System reset, active low.

VIH

1.26

-

2.1

The

module is

pulled up

inside.

VIL

–0.3

-

0.3

10

LED#

O

It is an open drain, active low

signal, used to allow the M.2

card to provide status

indicators via LED devices

that will be provided by the

host.

VOL

0

-

0.48

The

maximum

IOL is 40

mA.

8

W_DISABLE

#

I

WWAN disable function

When it is High, WWAN

function is determined by

software AT command.

Default enabled.

When it is Low, WWAN

function will be turned off.

VIH

1.26

-

3.6

-

VIL

–0.3

-

0.3

26

GPS_DISAB

LE#

I

GPS disable function

When it is High, GPS

function is determined by

software AT command.

When it is Low, GPS is

turned off.

VIH

1.26

-

3.6

-

VIL

–0.3

-

0.3

23

Wake_On_

WWAN#

O

It is open drain and active

low.

WWAN to wake up the host.

VOL

0

-

0.48

The

maximum

IOL is 40

mA.

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

25

BodySAR_N

I

Hardware pin for BodySAR

Detection.

When it is High, No TX

power backoff (default).

When it is Low, TX power

backoff.

VIH

1.26

-

3.6

-

VIL

–0.3

-

0.3

66

USIM_DET

I

USIM hot swap detection

pin.

Rising edge for insertion;

falling edge for removal.

When it is High, USIM is

present.

When it is Low, USIM is

absent.

VIH

1.26

1.8

2.1

The

module is

pulled up

inside.

VIL

–0.3

-

0.3

3.4.2 Power_On_Off Control Pin

The ME906s module can be controlled to be powered on/off by the Power_On_Off

pin.

Table 3-4 Two States of Power_On_Off

Item.

Pin state

Description

1

High

The module is powered on.

NOTE: If the module needs to be powered on

automatically, the Power_On_Off pin must be pulled up

to 3.3 V.

2

Low

The module is powered off.

It is internally pulled low with a weak pull-down resistor.

If the module is powered by the regulator with 3.3 V

If ME906s is powered by 3.3 V voltage regulator (such as notebook or Ultrabook),

Power_On_Off should be pulled up to 3.3 V through a resistor.

The pull-up resistor should be not greater than 47 kΩ.

Following is the power on/off sequence:

1. The module gets 3.3 V when supply for the module is switched on.

2. The module is turned on since Power_On_Off is pulled up to 3.3 V by the host.

3. Host cuts off 3.3 V supply to power off the module.

The recommended circuit is shown as in Figure 3-4 .

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Figure 3-4 Recommended connections of Power_On_Off pin (auto power)

- Power on sequence

Do not toggle RESET# during power on sequence. Pulling RESET# low will extend

time for module startup. Recommended power on timing sequence is shown as

Figure 3-5 .

Figure 3-5 Recommended power on timing sequence

- Power off sequence

Cutting off 3.3 V will power off the module.

ME906s

Pin2, 4, 70, 72, 74

Pin6

47 kΩ

Power_On_Off

3.3V

RESET#

Power on

Power_On_Off

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Figure 3-6 Recommended power off timing sequence (cut off 3.3 V)

If ME906s is powered directly to battery

For use case ME906s is connected directly to battery, such as tablet platforms,

Power_On_Off should be controlled by a GPIO from the host to control ME906s to be

powered on/off.

It is critical to make sure the module is safely shut off when the tablet SoC is shut off.

There will be current leakage if the module is not shut off properly. So it is important

to keep Power_On_Off logic low for more than 500 ms to shut off the module.

The recommended connection is shown as Figure 3-7 .

Figure 3-7 Recommended connection of Power_On_Off pin (control)

- Power on sequence

3.3V

RESET#

Power_On_Off

Power off

ME906s

Pin6

HOST

GPIO

Power_On_Off

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Do not toggle RESET# during power on sequence, pulling RESET# low will extend

time for module startup. The recommended power on timing sequence is shown as

Figure 3-8 .

Figure 3-8 Recommended power on timing sequence

- Power off sequence

Keep Power_On_Off logic low for more than 500 ms to shut off the module.

Figure 3-9 Recommended power off timing sequence (connect to battery)

- Warm boot (restart) sequence

In the notebook/tablet when using the warm boot, the followed sequence is

recommended.

3.3V (battery

always on)

RESET#

Power_On_off

Power on

t0 ≥ 0ms

t0

Power off

t1 ≥ 500 ms

t1

Logic low or high-impedance (preferred)

RESET#

3.3V (battery,

always on)

Power_On_Off

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Figure 3-10 Recommended warm boot timing in the notebook/tablet

If there is a limitation on the controlling GPIO to be programmable 500 ms, the

hardware solution as shown in Figure 3-11 can be used.

Figure 3-11 Power on off circuit (hardware solution)

3.3V (battery,

always on)

.

RESET#

Power_On_Off

Warm boot in the notebook/tablet

t2 ≥ 500 ms

t2

Module

Pin 6

HOST

0Ω

VCC

GPIO2

1MΩ

NMOS

3.3V (battery)

GPIO2

Q1

Q2

Power_On_Off

VCC

GPIO2

is the power domain of the GPIO2.

When VCCGPIO2 is ON, Q2 is on and Q1 is off. So the Pin 6 is controlled by

GPIO2 of host.

When VCCGPIO2 is Off, Q2 is off and Q1 is on. So the Pin 6 is pulled low,

then the module is powered off.

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3.4.3 RESET# Pin

The ME906s module can be reset through the RESET# pin asynchronous, active low.

Whenever this pin is active, the module will immediately be placed in a Power On

reset condition. Care should be taken for this pin unless there is a critical failure and

all other methods of regaining control and/or communication with the WWAN sub-

system have failed.

Pulling low RESET# more than 20 ms and then pulling high will reset the module.

RESET# is optional, which can be not connected. Pulling low Power_On_Off for

more than 500 ms and then pulling high can also work as a reset.

RESET# is internally pulled up to 1.8 V, which is automatically on when 3.3 V is

applied even though Power_On_Off is low. Cautions should be taken on circuit

design or else there may be back driving issue.

Hardware circuit for RESET# (option 1)

GPIO is high-impedance when the host is powered off.

Hardware circuit for RESET# (option 2)

GPIO is not high-impedance when the host is powered off.

Use 2 N-MOSFET so that the logic of RESET# and GPIO are the same.

Module

Pin 67

0Ω

RESET#

HOST

GPIO1

GPIO1 should be high-impedance

when it is powered off.

33рF

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Hardware circuit for RESET# (option 3)

GPIO is not high-impedance when the host is powered off.

Use only one N-MOSFET, in this case the logic of RESET# and GPIO1 is reversed.

- As the RESET# signal is relatively sensitive, it is recommended to install a 33 pF

capacitor near to the M.2 pin.

- Triggering the RESET# signal will lead to loss of all data in the module. It

will also disconnect the module from the network resulting in a call drop.

Module

RESET#

Pin 67

HOST

0Ω

GPIO1

1MΩ

NMOS

VCC

GPIO1

33рF

HOST Module

0Ω

RESET#

Pin 67

GPIO1

33рF

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3.4.4 LED# Pin

ME906s provides an open drain signal to indicate the RF status.

Table 3-5 State of the LED# pin

No.

Operating Status

LED#

1

RF function is turned on

Output Low, current sink

2

RF function is turned off

Output High

Figure 3-12 shows the recommended circuits of the LED# pin. The brightness of LED

can be adjusted by adjusting the resistance of the series resistor, and the maximum

sink current is 40 mA.

Figure 3-12 Driving circuit

3.4.5 W_DISABLE# Pin

ME906s provides a hardware pin (W_DISABLE#) to disable or enable the radio. In

addition, the radio can also be enabled or disabled through software AT commands.

Table 3-6 Function of the W_DISABLE# pin

No.

W_DISABLE#

Function

1

Low

WWAN function will be turned off.

2

High

WWAN function is determined by software AT

command. Default enabled.

3

Floating

WWAN function is determined by software AT

command. Default enabled.

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Figure 3-13 Connections of the W_DISABLE# pin

It is recommended not to add a diode on the W_DISABLE# pin outside the module.

3.4.6 GPS_DISABLE# Pin

ME906s provides a hardware pin (GPS_DISABLE#) to disable or enable the GPS. In

addition, the GPS can also be enabled or disabled through software AT commands.

Table 3-7 Function of the GPS_DISABLE# pin

No.

GPS_DISABLE#

Function

1

Low

GPS function is disabled.

2

High

GPS function is determined by software AT

command. Default enabled.

3

Floating

GPS function is determined by software AT

command. Default enabled.

Figure 3-14 Connections of the GPS_DISABLE# pin

Module

(Modem)

BB Chip

1.8V

W_DISABLE#

VCC From Host

10 kΩ

Host

Module

(Modem)

BB Chip

1.8V

GPS_DISABLE#

VCC From Host

10 kΩ

Host

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It is recommended not to add a diode on the GPS_DISABLE# pin outside the

module.

3.4.7 Wake_On_WWAN# Pin

ME906s provides an open drain output Wake_On_WWAN# pin to wake up the host,

which is low active.

Figure 3-15 Wave form of the Wake_On_WWAN# pin

Figure 3-16 Connections of the Wake_On_WWAN# pin

3.4.8 BodySAR_N Pin

ME906s provides an input pin BodySAR_N for BodySAR detection.

Table 3-8 Function of the BodySAR_N pin

No.

BodySAR_N

Function

1

Low

Max. TX power will be backed off by setting through AT

command.

10 kΩ

1s

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No.

BodySAR_N

Function

2

High

Max. TX power will NOT be backed off (default).

3

Floating

Max. TX power will NOT be backed off.

If BodySAR_N pin is used to monitor the proximity sensor output directly, there are

some essential preconditions for this hardware solution.

ME906s cannot provide any control signal for the proximity sensor, and any control or

programming required by the proximity sensor should be handled by the host side.

Figure 3-17 Connections of the BodySAR_N pin

It is recommended not to add a diode on the BodySAR_N pin outside the module.

3.4.9 USIM_DET Pin

ME906s supports USIM hot swap function.

ME906s provides an input pin (USIM_DET) to detect whether the USIM card is

present or not. This pin is a level trigger pin.

Table 3-9 Function of the USIM_DET pin

No.

USIM_DET

Function

1

High level

USIM card insertion.

If the USIM card is present, USIM_DET should be High.

2

Low level

USIM card removal.

If the USIM card is absent, USIM_DET should be Low.

Module

(Modem)

BB Chip

1.8V

BodySAR_N

VCC From Host

10 kΩ

Proximity

sensor

USB Host AP

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Figure 3-18 Connections of the USIM_DET pin

CD is a pin detecting of USIM in the USIM socket, in normal, there will be a detect pin

in the USIM socket.

- It is recommended not to add a diode on the USIM_DET pin outside the module.

- The normal SHORT USIM connector should be employed. The logic of

USIM_DET is shown as Figure 3-19 . High represents that USIM is inserted; Low

represents that USIM is removed.

- When USIM is inserted (hot), USIM_DET will change from Low to High;

- When USIM is removed (hot), USIM_DET will change from High to Low;

- The module will detect the level of USIM_DET to support the hot swap.

Module

(Modem)

BB Chip

1.8V

USIM_DET

470 pF

USIM Deck

CD

If USIM card is absent, the CD connects to Ground.

If USIM card is present, the CD is open.

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Figure 3-19 Logic of USIM_DET

3.5 USB Interface

The ME906s is compliant with USB 2.0 high speed protocol. The USB input/output

lines are following USB 2.0 specifications. Definition of the USB interface:

Pin No.

Pin Name

I/O

Description

7

USB_D+

I/O

USB data signal D+

9

USB_D-

I/O

USB data signal D-

Figure 3-20 Recommended circuit of USB interface

Figure 3-21 shows the timing sequence between 3.3V and USB D+.

Modem

Processor

USIM Connector Switch

USIM installed=

Not Connected

USIM not

installed=

GND

WWAN Module

USIM_DET

1.8V

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Figure 3-21 USB D+ and 3.3V power on timing sequence

Parameter

Remarks

Time (Nominal value)

Unit

Tpd

Power valid to USB D+ high

6

s

The layout design of this circuit on the host board should comply with the USB 2.0 high speed

protocol, with differential characteristic impedance of 90 Ω.

3.6 USIM Card Interface

3.6.1 Overview

The ME906s module provides a USIM card interface complying with the ISO 7816-3

standard and supports both 1.8 V and 3.0 V USIM cards.

Table 3-10 USIM card interface signals

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

30

USIM_RESET

O

USIM Reset

VOH

0.7 x

USIM

_PW

R

-

3.3

USIM_PWR

=1.8 V or 3.0

V

VOL

0

-

0.2 x

USIM

_PW

R

3.3V

Power_On_Off

USB D+

Tpd

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

32

USIM_CLK

O

USIM Clock

VOH

0.7 x

USIM

_PW

R

-

3.3

USIM_P

WR=1.8 V or

3.0 V

VOL

0

-

0.2 x

USIM

_PW

R

34

USIM_DATA

IO

USIM DATA

VOH

0.7 x

USIM

_PW

R

-

3.3

USIM_PWR

=1.8 V or 3.0

V

VOL

0

-

0.2 x

USIM

_PW

R

VIH

0.7 x

USIM

_PW

R

-

3.3

VIL

0

-

0.2 x

USIM

_PW

R

36

USIM_PWR

P

USIM POWER

-

1.75

1.8

1.98

USIM_PWR

=1.8 V

-

2.75

3

3.3

USIM_PWR

=3.0 V

66

USIM_DET

I

USIM hot swap

detection pin.

Rising edge for

insertion; falling

edge for removal.

When it is High,

USIM is present.

When it is Low,

USIM is absent.

VIH

1.26

1.8

2.1

The module

is pulled up

inside.

VIL

–0.3

-

0.3

3.6.2 Circuit Recommended for the USIM Card Interface

As the ME906s module is not equipped with a USIM socket, you need to place a

USIM socket on the user interface board. Figure 3-22 shows the circuit of the USIM

card interface.

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Figure 3-22 Circuit of the USIM card interface

- The ESD protection component should choose low capacitance. The capacitance

of the component should be lower than 10 pF.

- To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic

compatibility (EMC) authentication, the USIM socket should be placed near the

M.2 interface (it is recommended that the PCB circuit connects the M.2 interface

and the USIM socket does not exceed 100 mm), because a long circuit may lead

to wave distortion, thus affecting signal quality.

- It is recommended that you wrap the area adjacent to the USIM_CLK and

USIM_DATA signal wires with ground. The Ground pin of the USIM socket and the

Ground pin of the USIM card must be well connected to the power Ground pin

supplying power to the ME906s module.

- A 100 nF capacitor (0402 package is recommended so that greater capacitance

such as 1 uF can be employed if necessary) and a 33 pF capacitor are placed

between the USIM_PWR and Ground pins in parallel. Three 33 pF capacitors are

placed between the USIM_DATA and Ground pins, the USIM_RESET and Ground

pins, and the USIM_CLK and Ground pins in parallel to filter interference from RF

signals.

- It is recommended to take electrostatic discharge (ESD) protection measures near

the USIM card socket. Transient voltage suppressor diode should be placed as

close as possible to the USIM socket, and the Ground pin of the ESD protection

component is well connected to the power Ground pin that supplies power to the

ME906s module.

3.7 Tunable Antenna Control

The module provides 4 tunable antenna control pins.

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Table 3-11 List of ANTCTL pins

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

59

ANTCTL0

O

Tunable antenna

control signal, bit 0.

It is a push-pull type

GPIO.

VOH

1.37

1.8

2.1

-

VOL

0

-

0.45

-

61

ANTCTL1

O

Tunable antenna

control signal, bit 1.

It is a push-pull type

GPIO.

VOH

1.37

1.8

2.1

-

VOL

0

-

0.45

-

63

ANTCTL2

O

Tunable antenna

control signal, bit 2.

It is a push-pull type

GPIO.

VOH

1.37

1.8

2.1

-

VOL

0

-

0.45

-

65

ANTCTL3

O

Tunable antenna

control signal, bit 3.

It is a push-pull type

GPIO.

VOH

1.37

1.8

2.1

-

VOL

0

-

0.45

-

The mapping of each band to ANTCTL outputs is configurable, and the default output

is 0 V.

3.8 Config Pins

The module provides 4 config pins.

Table 3-12 List of CONFIG pins

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

1

CONFIG_3

O

Connected to

Ground internally.

-

0

-

The module is

configured as

WWAN-SSIC 0.

21

CONFIG_0

O

Not Connected

internally.

-

The module is

configured as

WWAN-SSIC 0.

69

CONFIG_1

O

Connected to

Ground internally.

-

0

-

The module is

configured as

WWAN-SSIC 0.

75

CONFIG_2

O

Connected to

Ground internally.

-

0

-

The module is

configured as

WWAN-SSIC 0.

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In the M.2 spec, the 4 pins are defined as shown in Table 3-13 .

Table 3-13 List of Config pins

Config_0

(Pin 21)

Config_1

(Pin 69)

Config_2

(Pin 75)

Config_3

(Pin 1)

Module type and

Main host interface

Port

Configuration

NC

Ground

WWAN-SSIC

0

The GPIO0–7 pins have configurable assignments. There are 4 possible functional

pin out configurations. These 4 configurations are called Port Config 0–3. In each

Port Configuration each GPIO is defined as a specific functional pin. The GPIO pin

assignment can be seen in Table 3-14 . ME906s supports Config 0. But the audio

function is not implemented in ME906s.

Table 3-14 GPIO pin function assignment per port configuration (not supported by

default)

GPIO Pin

Port Config 0 (GNSS+Audio ver1)

GPIO_0 (Pin40)

GNSS_SCL

GPIO_1 (Pin 42)

GNSS_SDA

GPIO_2 (Pin 44)

GNSS_IRQ

GPIO_3 (Pin 46)

SYSCLK

GPIO_4 (Pin 48)

TX_Blanking

GPIO_5 (Pin 20)

Audio_0 (not supported)

GPIO_6 (Pin 22)

Audio_1 (not supported)

GPIO_7 (Pin 24)

Audio_2 (not supported)

3.9 Reserved Pins

The module provides some reserved pins. All of reserved pins cannot be used by the

customer. All of them should be Not Connected (NC). If the customer wants to

have other special functions, please contact us.

Table 3-15 List of reserved pins

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

20, 22,

24, 28

Reserved

-

Reserved for future

use, please keep it not

connected in the host

side.

-

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3.10 NC Pins

The module has some NC pins. All of NC pins are not connected in the module.

Table 3-16 List of NC pins

Pin No.

Name

Pad Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

29, 31, 35, 37,

38, 41, 43, 47,

49, 50,52, 53,

54, 55, 56, 58,

68

-

Not

Connected

-

3.11 RF Antenna Interface

3.11.1 RF Connector location

ME906s module provides 2 antenna connectors for connecting the external

antennas.

Figure 3-23 RF antenna connectors

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3.11.2 Coaxial RF Connector Guidelines

- The antenna interface must be used with coaxial cables with characteristic

impedance of 50 Ω.

- The ME906s module supports the buckled RF connector antenna connection

methods: buckled RF connector 818000500 by ECT, RFC43-1K2600 by ACON

or other equivalent connectors.

Figure 3-24 shows the RF connector dimensions.

Figure 3-24 RF connector dimensions

Table 3-17 The major specifications of the RF connector

Rated Condition

Environmental Condition

Frequency range

DC to 6 GHz

Temperature range:

–40°C to +85°C

Characteristic impedance

50 Ω

There are two kinds of coaxial cables (0.81 mm and 1.13 mm) mating the RF

connector in the ME906s. 1.13 mm cable is recommended.

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Figure 3-25 Specifications of 0.81 mm coaxial cable mating with the RF connector

Figure 3-26 Connection between the RF connector and the 0.81 mm cable

Figure 3-27 Specifications of 1.13 mm coaxial cable mating with the RF connector

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Figure 3-28 Connection between the RF connector and the 1.13 mm cable

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4 RF Specifications

4.1 About This Chapter

This chapter describes the RF specifications of the ME906s module, including:

- Operating Frequencies

- Conducted RF Measurement

- Conducted Rx Sensitivity and Tx Power

- Antenna Design Requirements

4.2 Operating Frequencies

Table 4-1 shows the RF bands supported by ME906s.

Table 4-1 RF bands

Operating Band

Tx

Rx

UMTS Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

UMTS Band 2

1850 MHz–1910 MHz

1930 MHz–1990 MHz

UMTS Band 5

824 MHz–849 MHz

869 MHz–894 MHz

UMTS Band 8

880 MHz–915 MHz

925 MHz–960 MHz

GSM 850

824 MHz–849 MHz

869 MHz–894 MHz

GSM 900

880 MHz–915 MHz

925 MHz–960 MHz

GSM 1800

1710 MHz–1785 MHz

1805 MHz–1880 MHz

GSM 1900

1850 MHz–1910 MHz

1930 MHz–1990 MHz

LTE Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

LTE Band 2

1850 MHz–1910 MHz

1930 MHz–1990 MHz

LTE Band 3

1710 MHz–1785 MHz

1805 MHz–1880 MHz

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Operating Band

Tx

Rx

LTE Band 5

824 MHz–849 MHz

869 MHz–894 MHz

LTE Band 7

2500 MHz–2570 MHz

2620 MHz–2690 MHz

LTE Band 8

880 MHz–915 MHz

925 MHz–960 MHz

LTE Band 20

832 MHz–862 MHz

791 MHz–821 MHz

LTE Band 28

703 MHz–748 MHz

758 MHz–803 MHz

GPS L1

-

1574.42 MHz–1576.42 MHz

GLONASS L1

-

1597.55 MHz–1605.89 MHz

4.3 Conducted RF Measurement

4.3.1 Test Environment

Test instrument

R&S CMU200, R&S CMW500, Agilent 8960, Anritsu

MT8820C

Power supply

Keithley 2303, Agilent 66319

RF cable for testing

Rosenberger Precision Microwave Cable

Murata coaxial

cable

MXHP32HP1000

- The compensation for different frequency bands relates to the cable and the test

environment.

- The instrument compensation needs to be set according to the actual cable conditions.

4.3.2 Test Standards

Huawei modules meet 3GPP test standards. Each module passes strict tests at the

factory and thus the quality of the modules is guaranteed.

4.4 Conducted Rx Sensitivity and Tx Power

4.4.1 Conducted Receive Sensitivity

The conducted receive sensitivity is a key parameter that indicates the receiver

performance of ME906s.

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Table 4-2 Conducted Rx sensitivity

Band

Typical Value

(Unit: dBm)

Note

GSM 850

–109

BER Class II < 2.44%

GSM 900

–109

BER Class II < 2.44%

GSM 1800

–109

BER Class II < 2.44%

GSM 1900

–109

BER Class II < 2.44%

UMTS Band 1

–111

BER < 0.1%

UMTS Band 2

–111

BER < 0.1%

UMTS Band 5

–111.5

BER < 0.1%

UMTS Band 8

–111.5

BER < 0.1%

LTE Band 1

–102

Throughput ≥ 95%, 10 MHz

Bandwidth

LTE Band 2

–101

Throughput ≥ 95%, 10 MHz

Bandwidth

LTE Band 3

–101

Throughput ≥ 95%, 10 MHz

Bandwidth

LTE Band 5

–101

Throughput ≥ 95%, 10 MHz

Bandwidth

LTE Band 7

–100

Throughput ≥ 95%, 10 MHz

Bandwidth

LTE Band 8

–101

Throughput ≥ 95%, 10 MHz

Bandwidth

LTE Band 20

–101

Throughput ≥ 95%, 10 MHz

Bandwidth

LTE Band 28

–102

Throughput ≥ 95%, 10 MHz

Bandwidth

Table 4-3 GPS specifications

TTFF@–130 dBm

Cold start

36s

Warm start

35s

Hot Start

3s

Sensitivity

Cold start

–148 dBm

Tracking

–159 dBm

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- The test values are the average of some test samples.

- LTE sensitivity is tested in SIMO (Main + AUX).

- The circular error probability for GPS value is 50%.

4.4.2 Conducted Transmit Power

The conducted transmit power is another indicator that measures the performance of

ME906s. The conducted transmit power refers to the maximum power that the

module tested at the antenna port can transmit. According to the 3GPP protocol, the

required transmit power varies with the power class.

Table 4-4 lists the required ranges of the conducted transmit power of ME906s.

Table 4-4 Conducted Tx power

Band

Typical Value

(Unit: dBm)

Note (Unit: dB)

GSM 850

GMSK(1Tx Slot)

32.5

±1

8PSK(1Tx Slot)

27

±1

GSM 900

GMSK(1Tx Slot)

32.5

±1

8PSK(1Tx Slot)

27

±1

GSM 1800

GMSK(1Tx Slot)

29.5

±1

8PSK(1Tx Slot)

26

±1

GSM 1900

GMSK(1Tx Slot)

29.5

±1

8PSK(1Tx Slot)

26

±1

UMTS Band 1

23.5

±1

UMTS Band 2

23.5

±1

UMTS Band 5

23.5

±1

UMTS Band 8

23.5

±1

LTE Band 1

23

±1

LTE Band 2

23

±1

LTE Band 3

23

±1

LTE Band 5

23

±1

LTE Band 7

23

±1

LTE Band 8

23

±1

LTE Band 20

23

±1

LTE Band 28

23

±1

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Maximum Power Reduction (MPR and AMPR) of LTE is according to 3GPP TS 36.521-1.

4.5 Antenna Design Requirements

4.5.1 Antenna Design Indicators

Antenna Efficiency

Antenna efficiency is the ratio of the input power to the radiated or received power of

an antenna. The radiated power of an antenna is always lower than the input power

due to the following antenna losses: return loss, material loss, and coupling loss. The

efficiency of an antenna relates to its electrical dimensions. To be specific, the

antenna efficiency increases with the electrical dimensions. In addition, the

transmission cable from the antenna port of ME906s to the antenna is also part of the

antenna. The cable loss increases with the cable length and the frequency. It is

recommended that the cable loss is as low as possible, for example,

MXHP32HP1000 made by Murata or equivalent.

The following antenna efficiency (free space) is recommended for ME906s to ensure

high radio performance of the module:

- Efficiency of the primary antenna: ≥ 40% (working frequency below 960 MHz); ≥

50% (working frequency above 1420 MHz)

- Efficiency of the secondary antenna: ≥ half of the efficiency of the primary

antenna in receiving band (≥ 50% @ 1574.42 MHz–1605.89 MHz)

In addition, the efficiency should be tested with the transmission cable.

S11(VSWR) and S21

S11 indicates the degree to which the input impedance of an antenna matches the

reference impedance (50 Ω). S11 shows the resonance feature and impedance

bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression

of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector

analyzer.

The following S11 values are recommended for the antenna of ME906s:

- S11 of the primary antenna ≤ –6 dB

- S11 of the secondary antenna ≤ –6 dB (≤ –10 dB @ 1574.42 MHz–1605.89

MHz)

In addition, S11 is less important than the efficiency, and S11 has not strong

correlation to wireless performance.

S21 indicates the isolation between two antennas.

Isolation

For a wireless device with multiple antennas, the power of different antennas is

coupled with each other. Antenna isolation is used to measure the power coupling.

The power radiated by an antenna might be received by an adjacent antenna, which

decreases the antenna radiation efficiency and affects the running of other devices.

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To avoid this problem, evaluate the antenna isolation as sufficiently as possible at the

early stage of antenna design.

Antenna isolation depends on the following factors:

- Distance between antennas

- Antenna type

- Antenna direction

The primary antenna must be placed as near as possible to the ME906s to minimize

the cable length. The secondary antenna needs to be installed perpendicularly to the

primary antenna. The secondary antenna can be placed farther away from the

ME906s. Antenna isolation can be measured with a two-port vector network analyzer.

The following S21 values are recommended for the antenna on laptops:

- Isolation between the primary and secondary antennas ≤ –12 dB(≤ –15 dB @

1574.42 MHz–1605.89 MHz)

- Isolation between the primary (secondary) antenna and the Wi-Fi antenna ≤ –15

dB

Polarization

The polarization of an antenna is the orientation of the electric field vector that rotates

with time in the direction of maximum radiation.

The linear polarization is recommended for the antenna of ME906s.

Radiation Pattern

The radiation pattern of an antenna reflects the radiation features of the antenna in

the remote field region. The radiation pattern of an antenna commonly describes the

power or field strength of the radiated electromagnetic waves in various directions

from the antenna. The power or field strength varies with the angular coordinates (θ

and φ), but is independent of the radial coordinates.

The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal

plane, and the incident waves of base stations are often in the horizontal plane. For

this reason, the receiving performance is optimal.

The following radiation patterns are recommended for the antenna of ME906s.

Primary antenna: omnidirectional.

Secondary antenna: omnidirectional (Upper Hem Partial Radiated Power ≥ 40% @

1574.42 MHz–1605.89 MHz)

In addition, the secondary antenna’s pattern should be complementary with the

primary antenna’s pattern.

Gain and Directivity

The radiation pattern of an antenna represents the field strength of the radiated

electromagnetic waves in all directions, but not the power density that the antenna

radiates in the specific direction. The directivity of an antenna, however, measures

the power density that the antenna radiates.

Gain, as another important parameter of antennas, correlates closely to the

directivity. The gain of an antenna takes both the directivity and the efficiency of the

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antenna into account. The appropriate antenna gain prolongs the service life of

relevant batteries.

The following antenna gain is recommended for ME906s.

- Gain of the primary antenna ≤ 2.5 dBi

- Gain of the secondary antenna ≤ 2.5 dBi

ECC of the antenna

ECC is short for Envelope Correlation Coefficient. It is the cross-correlation value of

the complex patterns of the master and diversity antenna. It indicates how similar the

magnitude and the phase patterns of the two antennas are. If two antennas have no

similarity, the ECC should be zero. Actually, the less ECC, the better diversity

performance.

The following ECC is recommended for ME906s.

- ECC ≤ 0.5 (working frequency below 0.96 GHz)

- ECC ≤ 0.3 (working frequency above 1.4 GHz)

- The antenna consists of the antenna body and the relevant RF transmission cable. Take

the RF transmission cable into account when measuring any of the preceding antenna

indicators.

- Huawei cooperates with various famous antenna suppliers who are able to make

suggestions on antenna design, for example, Amphenol, Skycross, etc.

4.5.2 Interference

Besides the antenna performance, the interference on the user board also affects the

radio performance (especially the TIS) of the module. To guarantee high performance

of the module, the interference sources on the user board must be properly

controlled.

On the user board, there are various interference sources, such as the LCD, CPU,

audio circuits, and power supply. All the interference sources emit interference

signals that affect the normal operation of the module. For example, the module

sensitivity can be decreased due to interference signals. Therefore, during the

design, need to consider how to reduce the effects of interference sources on the

module. You can take the following measures: Use an LCD with optimized

performance; shield the LCD interference signals; shield the signal cable of the

board; or design filter circuits.

Huawei is able to make technical suggestions on radio performance improvement of

the module.

4.5.3 Antenna Requirements

The antenna for ME906s must fulfill the following requirements:

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Table 4-5 Antenna Requirements

Antenna Requirements

Frequency range

Depending on frequency band(s) provided by the

network operator, the customer must use the most

suitable antenna for that/those band(s)

Bandwidth of primary

antenna

70 MHz in GSM 850

80 MHz in GSM 900

170 MHz in GSM 1800

140 MHz in GSM 1900

250 MHz in UMTS Band 1/LTE Band 1

140 MHz in UMTS Band 2/LTE Band 2

70 MHz in UMTS Band 5/LTE Band 5

80 MHz in UMTS Band 8/LTE Band 8

170 MHz in LTE Band 3

190 MHz in LTE Band 7

71 MHz in LTE Band 20

55 MHz in LTE Band 28

Bandwidth of

secondary antenna

25 MHz in GSM 850

35 MHz in GSM 900

75 MHz in GSM 1800

60 MHz in GSM 1900

60 MHz in UMTS Band 1/LTE Band 1

60 MHz in UMTS Band 2/LTE Band 2

25 MHz in UMTS Band 5/LTE Band 5

35 MHz in UMTS Band 8/LTE Band 8

75 MHz in LTE Band 3

70 MHz in LTE Band 7

30 MHz in LTE Band 20

55 MHz in LTE Band 28

35 MHz in GNSS

Gain

≤ 2.5 dBi

Impedance

50 Ω

VSWR absolute max.

≤ 3:1 (≤ 2:1 @ 1574.42 MHz–1605.89 MHz)

VSWR recommended

≤ 2:1 (≤ 1.5:1 @ 1574.42 MHz–1605.89 MHz)

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5 Electrical and Reliability Features

5.1 About This Chapter

This chapter describes the electrical and reliability features of the interfaces in the

ME906s module, including:

- Absolute Ratings

- Operating and Storage Temperatures

- Power Supply Features

- Reliability Features

- EMC and ESD Features

5.2 Absolute Ratings

Table 5-1 lists the absolute ratings for the ME906s module. Using the ME906s

module beyond these conditions may result in permanent damage to the module.

Table 5-1 Absolute ratings

Symbol

Specification

Min.

Max.

Unit

3.3V

External power voltage

–0.5

4.5

V

5.3 Operating and Storage Temperatures

Table 5-2 lists the operating and storage temperatures for the ME906s module.

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Table 5-2 Operating and storage temperatures

Specification

Min.

Max.

Unit

Normal operating temperature

–10

+55

°C

Extended operating temperature[1]

–20

+70

°C

Ambient storage temperature

–40

+85

°C

[1]: When the ME906s module works at –20°C to –10°C or +55°C to +70°C , NOT all its RF

specifications comply with the 3GPP specifications.

5.4 Power Supply Features

5.4.1 Input Power Supply

Table 5-3 lists the requirements for input power of the ME906s module.

Table 5-3 Requirements for input power

Parameter

Min.

Typ.

Max.

Ripple

Unit

3.3V

3.135

3.3

4.4

0.05

V

Figure 5-1 Power supply during burst emission

The minimum value of the power supply must be guaranteed during the burst (with 2.5 A@3.3

V peak in GSM, GPRS or EGPRS mode).

Table 5-4 Requirements for input current

Power

Peak (GSM 1 slot)

Normal (WCDMA)

Normal (LTE 23 dBm)

3.3 V

2.5 A

1.1 A

1.25 A

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5.4.2 Power Consumption

The power consumption of ME906s in different scenarios are respectively listed in

Table 5-5 to Table 5-9 .

The power consumption listed in this section are tested when the power supply of

ME906s module is normal voltage (3.3 V), and all of test values are measured at

room temperature.

Table 5-5 Averaged power off DC power consumption

Description

Test Value (Unit: uA)

Notes/Configuration

Typical

Power off

70

Normal voltage (3.3 V) is ON and

Power_On_Off pin is pulled low.

Table 5-6 Averaged standby DC power consumption (WCDMA/HSDPA/LTE/GSM)

Description

Bands

Test Value (Unit: mA)

Notes/Configuration

Typical

Sleep

LTE

LTE bands

2.08

Module is powered up.

DRX cycle=8 (2.56s)

Module is registered on the

network.

USB is in suspend.

HSPA+/WCDMA

UMTS bands

1.46

Module is powered up.

DRX cycle=8 (2.56s)

Module is registered on the

network.

USB is in suspend.

GPRS/EDGE

GSM bands

1.94

Module is powered up.

MFRMS=5 (1.175s)

Module is registered on the

network.

USB is in suspend.

Radio Off

All bands

1.07

Module is powered up.

RF is disabled.

USB is in suspend.

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Description

Bands

Test Value (Unit: mA)

Notes/Configuration

Typical

Idle

LTE

LTE bands

55

Module is powered up.

DRX cycle=8 (2.56s)

Module is registered on the

network, and no data is

transmitted.

USB is in active.

HSPA+/WCDMA

UMTS bands

60

Module is powered up.

DRX cycle=8 (2.56s)

Module is registered on the

network, and no data is

transmitted.

USB is in active.

GPRS/EDGE

GSM bands

60

Module is powered up.

MFRMS=5 (1.175s)

Module is registered on the

network, and no data is

transmitted.

USB is in active.

Radio Off

All bands

55

Module is powered up.

RF is disabled.

USB is in active.

Table 5-7 Averaged Data Transmission DC power consumption (WCDMA/HSDPA/LTE)

Description

Band

Test Value (Unit: mA)

Notes/Configuration

Typical

WCDMA

Band 1

(IMT2100)

198

1 dBm Tx Power

247

10 dBm Tx Power

682

23.5 dBm Tx Power

Band 2

(PCS

1900)

204

1 dBm Tx Power

246

10 dBm Tx Power

714

23.5 dBm Tx Power

Band 5

(850

MHz)

198

1 dBm Tx Power

231

10 dBm Tx Power

672

23.5 dBm Tx Power

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Description

Band

Test Value (Unit: mA)

Notes/Configuration

Typical

Band 8

(900

MHz)

200

1 dBm Tx Power

260

10 dBm Tx Power

679

23.5 dBm Tx Power

HSDPA

Band 1

(IMT2100)

212

1 dBm Tx Power

260

10 dBm Tx Power

695

23.5 dBm Tx Power

Band 2

(PCS

1900)

214

1 dBm Tx Power

261

10 dBm Tx Power

730

23.5 dBm Tx Power

Band 5

(850

MHz)

212

1 dBm Tx Power

243

10 dBm Tx Power

685

23.5 dBm Tx Power

Band 8

(900

MHz)

214

1 dBm Tx Power

243

10 dBm Tx Power

701

23.5 dBm Tx Power

LTE

Band 1

350

1 dBm Tx Power

422

10 dBm Tx Power

864

23dBm Tx Power

Band 2

339

1 dBm Tx Power

422

10 dBm Tx Power

822

23 dBm Tx Power

Band 3

335

1 dBm Tx Power

410

10 dBm Tx Power

789

23 dBm Tx Power

Band 5

333

1 dBm Tx Power

419

10 dBm Tx Power

771

23 dBm Tx Power

Band 7

349

1 dBm Tx Power

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Description

Band

Test Value (Unit: mA)

Notes/Configuration

Typical

433

10 dBm Tx Power

830

23 dBm Tx Power

Band 8

333

1 dBm Tx Power

411

10 dBm Tx Power

739

23 dBm Tx Power

Band 20

342

1 dBm Tx Power

420

10 dBm Tx Power

846

23 dBm Tx Power

Band 28

327

1 dBm Tx Power

396

10 dBm Tx Power

790

23 dBm Tx Power

Table 5-8 Averaged DC power consumption (GSM/GPRS/EDGE)

Description

Test Value (Unit: mA)

PCL

Notes/Configuration

Typical

GPRS 850

349

5

1 Up/1 Down

530

2 Up/1 Down

714

4 Up/1 Down

185

10

1 Up/1 Down

288

2 Up/1 Down

491

4 Up/1 Down

GPRS 900

352

5

1 Up/1 Down

503

2 Up/1 Down

679

4 Up/1 Down

181

10

1 Up/1 Down

273

2 Up/1 Down

460

4 Up/1 Down

GPRS 1800

230

0

1 Up/1 Down

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Description

Test Value (Unit: mA)

PCL

Notes/Configuration

Typical

313

2 Up/1 Down

418

4 Up/1 Down

119

10

1 Up/1 Down

147

2 Up/1 Down

205

4 Up/1 Down

GPRS 1900

271

0

1 Up/1 Down

384

2 Up/1 Down

520

4 Up/1 Down

121

10

1 Up/1 Down

151

2 Up/1 Down

224

4 Up/1 Down

EDGE 850

230

8

1 Up/1 Down

312

2 Up/1 Down

430

4 Up/1 Down

133

15

1 Up/1 Down

174

2 Up/1 Down

258

4 Up/1 Down

EDGE 900

222

8

1 Up/1 Down

301

2 Up/1 Down

409

4 Up/1 Down

131

15

1 Up/1 Down

171

2 Up/1 Down

256

4 Up/1 Down

EDGE 1800

178

2

1 Up/1 Down

245

2 Up/1 Down

317

4 Up/1 Down

118

10

1 Up/1 Down

146

2 Up/1 Down

203

4 Up/1 Down

EDGE 1900

207

2

1 Up/1 Down

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Description

Test Value (Unit: mA)

PCL

Notes/Configuration

Typical

275

2 Up/1 Down

373

4 Up/1 Down

120

10

1 Up/1 Down

151

2 Up/1 Down

218

4 Up/1 Down

All power consumption test configuration can be referenced by GSM Association Official

Document TS.09: Battery Life Measurement and Current Consumption Technique.

- LTE test condition: 10/20 MHz bandwidth, QPSK, 1 RB when testing max. Tx power and

full RB when testing 0 dBm or 10 dBm;

- Test condition: for max. Tx. power, see 4.4.2 Conducted Transmit Power, which is listed in

Table 4-4 ; for max. data throughput, see 2.2 Function Overview, which are listed in Table

2-1 Features.

Table 5-9 Averaged GPS operation DC power consumption

Description

Test Value (Unit: mA)

Notes/Configuration

Typical

GPS fixing

100

RF is disabled;

USB is in active;

The Rx power of GPS is –130 dBm.

GPS tracking

100

5.5 Reliability Features

Table 5-10 lists the test conditions and results of the reliability of the ME906s module.

Table 5-10 Test conditions and results of the reliability

Item

Test Condition

Standard

Sample

size

Results

Stress

Low-temperature

storage

- Temperature: –40ºC

- Operation mode: no

power, no package

- Test duration: 24 h

JESD22-

A119-C

3

pcs/group

Visual inspection: ok

Function test: ok

RF specification: ok

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Item

Test Condition

Standard

Sample

size

Results

High-temperature

storage

- Temperature: 85ºC

- Operation mode: no

power, no package

- Test duration: 24 h

JESD22-

A103-C

3

pcs/group

Visual inspection: ok

Function test: ok

RF specification: ok

Low-temperature

operating

- Temperature: –20ºC

- Operation mode: working

with service connected

- Test duration: 24 h

IEC6006

8-2-1

3

pcs/group

Visual inspection: ok

Function test: ok

RF specification: ok

High-temperature

operating

- Temperature: 70ºC

- Operation mode: working

with service connected

- Test duration: 24 h

JESD22-

A108-C

3

pcs/group

Visual inspection: ok

Function test: ok

RF specification: ok

Damp heat

cycling

- High temperature: 55ºC

- Low temperature: 25ºC

- Humidity: 95%±3%

- Operation mode: working

with service connected

- Test duration: 6 cycles;

12 h+12 h/cycle

JESD22-

A101-B

3

pcs/group

Visual inspection: ok

Function test: ok

RF specification: ok

Thermal shock

- Low temperature: –40º

- High temperature: 85ºC

- Temperature change

interval: < 20s

- Operation mode: no

power

- Test duration: 100 cycles;

15 min+15 min/cycle

JESD22-

A106-B

3

pcs/group

Visual inspection: ok

Function test: ok

RF specification: ok

Salty fog test

- Temperature: 35°C

- Density of the NaCl

solution: 5%±1%

- Operation mode: no

power, no package

- Test duration:

Spraying interval: 8 h

Exposing period after

removing the salty fog

environment: 16 h

JESD22-

A107-B

3

pcs/group

Visual inspection: ok

Function test: ok

RF specification: ok

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Item

Test Condition

Standard

Sample

size

Results

Sine vibration

- Frequency range: 5 Hz to

200 Hz

- Acceleration: 1 Grms

- Frequency scan rate: 0.5

oct/min

- Test duration: 3 axial

directions. 2 h for each

axial direction.

- Operation mode: working

with service connected

JESD22-

B103-B

3

pcs/group

Visual inspection: ok

Function test: ok

RF specification: ok

Shock test

- Half-sine wave shock

- Peak acceleration: 30

Grms

- Shock duration: 11 ms

- Test duration: 6 axial

directions. 3 shocks for

each axial direction.

- Operation mode: working

with service connected

JESD-

B104-C

3

pcs/group

Visual inspection: ok

Function test: ok

RF specification: ok

Drop test

- 0.8 m in height. Drop the

module on the marble

terrace with one surface

facing downwards, six

surfaces should be

tested.

- Operation mode: no

power, no package

IEC6006

8-2-32

3

pcs/group

Visual inspection: ok

Function test: ok

RF specification: ok

Life

High temperature

operating life

- Temperature: 70ºC

- Operation mode: working

with service connected

- Test duration: 168 h, 336

h, 500 h, 1000 h for

inspection point

JESD22-

A108-B

50

pcs/group

Visual inspection: ok

Function test: ok

RF specification: ok

High temperature

& high humidity

- High temperature: 85ºC

- Humidity: 85%

- Operation mode:

powered on and no

working

- Test duration: 168 h, 336

h, 500 h, 1000 h for

inspection point

JESD22-

A110-B

50

pcs/group

Visual inspection: ok

Function test: ok

RF specification: ok

Cross section: ok

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Electrical and Reliability Features

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Item

Test Condition

Standard

Sample

size

Results

Temperature

cycle

- High temperature: 85ºC

- Low temperature: –40ºC

- Temperature change

slope: 6ºC/min

- Operation mode: no

power

- Test duration: 168 h,

336 h, 500 h, 668 h for

inspection point

JESD22-

A104-C

50

pcs/group

Visual inspection: ok

Function test: ok

RF specification: ok

Cross section: ok

ESD

HBM (Human

Body Model)

- 1 kV (Class 1 B)

- Operation mode: no

power

JESD22-

A114-D

3

pcs/group

Visual inspection: ok

Function test: ok

RF specification: ok

ESD with DVK

(or embedded in

the host)

- Contact Voltage: ±2 kV,

±4 kV

- Air Voltage : ±2 kV, ±4

kV, ±8 kV

- Operation mode: working

with service connected

IEC6100

0-4-2

2 pcs

Visual inspection: ok

Function test: ok

RF specification: ok

Groups ≥ 2

5.6 EMC and ESD Features

The following are the EMC design comments:

- Attention should be paid to static control in the manufacture, assembly,

packaging, handling, and storage process to reduce electrostatic damage to

HUAWEI module.

- RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if

the antenna port is protected by TVS (Transient Voltage Suppressor), which is

resolved by making some adjustments on RF match circuit.

- TVS should be added on the USB port for ESD protection, and the parasitic

capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode

inductor should be added in parallel on D+/D- signal.

- TVS should be added on the USIM interface for ESD protection. The parasitic

capacitance of TVS on USIM signal should be less than 10 pF.

- Resistors in parallel and a 10 nF capacitor should be added on RESET# and

Power_On_Off signal to avoid shaking, and the distance between the capacitor

and the related pin should be less than 100 mil.

- PCB routing should be V-type rather than T-type for TVS.

- An integrated ground plane is necessary for EMC design.

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The following are the requirements of ESD environment control:

- The electrostatic discharge protected area (EPA) must have an ESD floor whose

surface resistance and system resistance are greater than 1 x 104 Ω while less

than 1 x 109 Ω.

- The EPA must have a sound ground system without loose ground wires, and the

ground resistance must be less than 4 Ω.

- The workbench for handling ESD sensitive components must be equipped with

common ground points, the wrist strap jack, and ESD pad. The resistance

between the jack and common ground point must be less than 4 Ω. The surface

resistance and system resistance of the ESD pad must be less than 1 x 109 Ω.

- The EPA must use the ESD two-circuit wrist strap, and the wrist strap must be

connected to the dedicated jack. The crocodile clip must not be connected to the

ground.

- The ESD sensitive components, the processing equipment, test equipment,

tools, and devices must be connected to the ground properly. The indexes are as

follows:

− Hard ground resistance < 4 Ω

− 1 x 105 Ω ≤ Soft ground resistance < 1 x 109 Ω

− 1 x 105 Ω ≤ ICT fixture soft ground resistance < 1 x 1011 Ω

− The electronic screwdriver and electronic soldering iron can be easily

oxidized. Their ground resistance must be less than 20 Ω.

- The parts of the equipment, devices, and tools that touch the ESD sensitive

components and moving parts that are close to the ESD sensitive components

must be made of ESD materials and have sound ground connection. The parts

that are not made of ESD materials must be handled with ESD treatment, such

as painting the ESD coating or ionization treatment (check that the friction

voltage is less than 100 V).

- Key parts in the production equipment (parts that touch the ESD sensitive

components or parts that are within 30 cm away from the ESD sensitive

components), including the conveyor belt, conveyor chain, guide wheel, and

SMT nozzle, must all be made of ESD materials and be connected to the ground

properly (check that the friction voltage is less than 100 V).

- Engineers that touch IC chips, boards, modules, and other ESD sensitive

components and assemblies must wear ESD wrist straps, ESD gloves, or ESD

finger cots properly. Engineers that sit when handling the components must all

wear ESD wrist straps.

- Noticeable ESD warning signs must be attached to the packages and placement

areas of ESD sensitive components and assemblies.

- Boards and IC chips must not be stacked randomly or be placed with other ESD

components.

- Effective shielding measures must be taken on the ESD sensitive materials that

are transported or stored outside the EPA.

HUAWEI ME906s module does not include any protection against overvoltage.

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Hardware Guide

Mechanical Specifications

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6 Mechanical Specifications

6.1 About This Chapter

This chapter describes the following aspects of the ME906s module:

- Dimensions

- Packing System

6.2 Dimensions

Figure 6-1 shows the dimensions of ME906s in details.

Figure 6-1 Dimensions (Unit: mm)

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Mechanical Specifications

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6.3 Packing System

ME906s package includes the blister tray, the blister tray cover, and the carton (with

bottom and top clapboard).

The blister tray of the ME906s module package is as shown in the following figure.

There are 75 pcs modules for every tray, 6 pcs trays in one carton, and 450 pcs

modules for every carton. And the blister tray cover covers the top tray.

Figure 6-2 Package assembly

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Installation

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7 Installation

7.1 About This Chapter

This chapter describes the assembly of ME906s, including:

- Connect ME906s to board

- Thermal Management

- Antenna Plug

7.2 Connect ME906s to board

Figure 7-1 Install the module

It refers to M.2 specification.

The module will need a mechanical retention at the end of the board. The module

specifies a 5.5 mm Dia. keep out zone at the end for attaching a screw.

The module Stand-off and mounting screw also serve as part of the module Electrical

Ground path. The Stand-off should be connected directly to the ground plane on the

platform. So that when the module is mounted and the mounting screw is screwed on

to hold the module in place, this will make the electrical ground connection from the

module to the platform ground plane.

The module could not be installed or removed when the host is powered on.

Otherwise, it may result in permanent damage to the module.

HUAWEI M.2 Module

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7.3 Thermal Management

Because ME906s is very small, the dissipating heat is very important to it.

It has to take several means to ensure ME906s to meet the specification.

The methods described as follow:

- The mounting screw is to hold the module in place, and connect the heat source

to the platform ground plane of the custom board.

- About the custom board, it can afford larger and much more area of grounding

layers to enhance cooling of the PCB and ensure that the heat spreads evenly in

the PCB.

- The stand-off provides a thermal ground path. The design requirements for

thermal are a material with a minimum conductivity of 50 watts per meter Kelvin

and surface area of 22 Sq mm.

- The customer can add a heat sink on the model top surface, and this method

can bring out much heat source of the module.

7.4 Antenna Plug

Figure 7-2 Mating the plug

1. Align the mating tool or the mating end of the tool over the plug end of the cable

assembly.

2. Firmly place the tool over the plug until it is secured in the tool.

3. Place the plug cable assembly (held in the tool) over the corresponding receptacle.

4. Assure that the plug and receptacle are aligned press-down perpendicular to the

mounting surface until both connectors are fully mated.

5. Remove the mating tool by pulling it up carefully.

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Figure 7-3 Unmating the plug

- The extraction tool is recommended.

- Any attempt of unmating by pulling on the cable may result in damage and influence the

mechanical / electrical performance.

It is recommended not to apply any pull forces after the bending of the cable, as

described in Figure 7-4 .

Figure 7-4 Do not apply any pull forces after the bending of the cable

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Certifications

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8 Certifications

This chapter gives a general description of certifications of ME906s.

Table 8-1 Product certifications

Certification

ME906s-158

CE



FCC



NCC



RCM



EU RoHS



PVC-Free



GCF



Halogen-free



Table 8-1 shows certifications the module has been implemented. For more demands, please

contact us for more details about this information.

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Safety Information

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9 Safety Information

Read the safety information carefully to ensure the correct and safe use of your

wireless device. Applicable safety information must be observed.

9.1 Interference

Power off your wireless device if using the device is prohibited. Do not use the

wireless device when it causes danger or interference with electric devices.

9.2 Medical Device

- Power off your wireless device and follow the rules and regulations set forth by

the hospitals and health care facilities.

- Some wireless devices may affect the performance of the hearing aids. For any

such problems, consult your service provider.

- Pacemaker manufacturers recommend that a minimum distance of 15 cm be

maintained between the wireless device and a pacemaker to prevent potential

interference with the pacemaker. If you are using an electronic medical device,

consult the doctor or device manufacturer to confirm whether the radio wave

affects the operation of this device.

9.3 Area with Inflammables and Explosives

To prevent explosions and fires in areas that are stored with inflammable and

explosive devices, power off your wireless device and observe the rules. Areas

stored with inflammables and explosives include but are not limited to the following:

- Gas station

- Fuel depot (such as the bunk below the deck of a ship)

- Container/Vehicle for storing or transporting fuels or chemical products

- Area where the air contains chemical substances and particles (such as granule,

dust, or metal powder)

- Area indicated with the "Explosives" sign

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- Area indicated with the "Power off bi-direction wireless equipment" sign

- Area where you are generally suggested to stop the engine of a vehicle

9.4 Traffic Security

- Observe local laws and regulations while using the wireless device. To prevent

accidents, do not use your wireless device while driving.

- RF signals may affect electronic systems of motor vehicles. For more

information, consult the vehicle manufacturer.

- In a motor vehicle, do not place the wireless device over the air bag or in the air

bag deployment area. Otherwise, the wireless device may hurt you owing to the

strong force when the air bag inflates.

9.5 Airline Security

Observe the rules and regulations of airline companies. When boarding or

approaching a plane, power off your wireless device. Otherwise, the radio signal of

the wireless device may interfere with the plane control signals.

9.6 Safety of Children

Do not allow children to use the wireless device without guidance. Small and sharp

components of the wireless device may cause danger to children or cause

suffocation if children swallow the components.

9.7 Environment Protection

Observe the local regulations regarding the disposal of your packaging materials,

used wireless device and accessories, and promote their recycling.

9.8 WEEE Approval

The wireless device is in compliance with the essential requirements and other

relevant provisions of the Waste Electrical and Electronic Equipment Directive

2012/19/EU (WEEE Directive).

9.9 RoHS Approval

The wireless device is in compliance with the restriction of the use of certain

hazardous substances in electrical and electronic equipment Directive 2011/65/EU

(RoHS Directive).

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9.10 Laws and Regulations Observance

Observe laws and regulations when using your wireless device. Respect the privacy

and legal rights of the others.

9.11 Care and Maintenance

It is normal that your wireless device gets hot when you use or charge it. Before you

clean or maintain the wireless device, stop all applications and power off the wireless

device.

- Use your wireless device and accessories with care and in clean environment.

Keep the wireless device from a fire or a lit cigarette.

- Protect your wireless device and accessories from water and vapour and keep

them dry.

- Do not drop, throw or bend your wireless device.

- Clean your wireless device with a piece of damp and soft antistatic cloth. Do not

use any chemical agents (such as alcohol and benzene), chemical detergent, or

powder to clean it.

- Do not leave your wireless device and accessories in a place with a considerably

low or high temperature.

- Use only accessories of the wireless device approved by the manufacture.

Contact the authorized service center for any abnormity of the wireless device or

accessories.

- Do not dismantle the wireless device or accessories. Otherwise, the wireless

device and accessories are not covered by the warranty.

- The device should be installed and operated with a minimum distance of 20 cm

between the radiator and your body.

9.12 Emergency Call

This wireless device functions through receiving and transmitting radio signals.

Therefore, the connection cannot be guaranteed in all conditions. In an emergency,

you should not rely solely on the wireless device for essential communications.

9.13 Regulatory Information

The following approvals and notices apply in specific regions as noted.

9.13.1 EU Regulatory Conformance

Statement

Hereby, Huawei Technologies Co., Ltd. declares that this device is in compliance with

the essential requirements and other relevant provisions of Directive 2014/53/EU.

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The most recent, effective version of the DoC (Declaration of Conformity) can be

viewed at http://consumer.huawei.com/certification.

This device may be operated in all member states of the EU.

Observe national and local regulations where the device is used.

This device may be restricted for use, depending on the local network.

Frequency Bands and Power

(a) Frequency bands in which the radio equipment operates: Some bands may not be

available in all countries or all areas. Please contact the local carrier for more details.

(b) Maximum radio-frequency power transmitted in the frequency bands in which the

radio equipment operates: The maximum power for all bands is less than the highest

limit value specified in the related Harmonized Standard.

The frequency bands and transmitting power (radiated and/or conducted) nominal

limits applicable to this radio equipment are as follows: GSM 900: 37 dBm, GSM

1800: 34 dBm, WCDMA 900/2100: 25.7 dBm, LTE Band 1/3/7/8/20/28: 25.7 dBm.

Software Information

Software updates will be released by the manufacturer to fix bugs or enhance

functions after the product has been released. All software versions released by the

manufacturer have been verified and are still compliant with the related rules.

All RF parameters (for example, frequency range and output power) are not

accessible to the user, and cannot be changed by the user.

For the most recent information about accessories and software, please see the DoC

(Declaration of Conformity) at http://consumer.huawei.com/certification.

9.13.2 FCC Statement

Federal Communications Commission Notice (United States): Before a wireless

device model is available for sale to the public, it must be tested and certified to the

FCC that it does not exceed the limit established by the government-adopted

requirement for safe exposure.

This device complies with Part 15 of the FCC Rules. Operation is subject to the

following two conditions: (1) this device may not cause harmful interference, and (2)

this device must accept any interference received, including interference that may

cause undesired operation.

Warning: Changes or modifications made to this equipment not expressly approved

by HUAWEI may void the FCC authorization to operate this equipment.

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Appendix A Circuit of Typical Interface

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10 Appendix A Circuit of Typical

Interface

Q1

2

3

1G

D

S

33pFC14

C13 33pF

C11 33pF

R16 0

0R17

R15 0

D1

R23 0

1V8(3V3)

100KR4

R3 100K

R13 0

1uFC8

Q3

2

3

1G

D

S

C1

1uF

C3

22uF

J1

7776

74

72

70

68

66

64

62

60

58

56

54

52

50

48

46

44

42

40

38

36

34

32

30

28

26

24

22

20

10

8

6

4

2

75

73

71

69

67

65

63

61

59

57

55

53

51

49

47

45

43

41

39

37

35

33

31

29

27

25

23

21

11

9

7

5

3

1P1

P3

P5

P7

P9

P11

P21

P23

P25

P27

P29

P31

P33

P35

P37

P39

P41

P43

P45

P47

P49

P51

P53

P55

P57

P59

P61

P63

P65

P67

P69

P71

P73

P75

P2

P4

P6

P8

P10

P20

P22

P24

P26

P28

P30

P32

P34

P36

P38

P40

P42

P44

P46

P48

P50

P52

P54

P56

P58

P60

P62

P64

P66

P68

P70

P72

P74

M1 M2

C4

220uF

C2

100nF

D2 61

3 4

2 5

C15 33pF

C17 33pF

470pFC18

C19 33pF

0R12

33pFC16

100KR2

10KR24

R5 100K

33pFC9

1V8

R6 10K

200R8

VBAT

R11 0

0R14

33pFC12

J2

11

7

3

6

2

5

1

4

10

9

8

S2

S3

M1

CD

VCC

GND

RST

VPP

CLK

I/O

M2

Q2

2

3

1G

D

S

VBAT

R9 1M

R19 0

C7

330pF

C10 2.2pF

R20 0

1M

R22

V-gpio1

Q4

2

3

1G

D

S

R21 0

Vgpio2

ANT_TUNE_2

ANT_TUNE_3

ANT_TUNE_1

ANT_TUNE_0

GPS_DISABLE

USIM_RESET

USIM_CLK

USIM_IO

USIM_DET

CONFIG3

CONFIG2

CONFIG1

CONFIG0

USB_DP

WAKE_On_WWAN

W_DISABLE

LEDUSB_DM

USB_DM

USIM_PWR

GPIO1

GPIO2

VBAT

POWER_ON_OFF

RESET

BODYSAR_N

Capacitor of D2 should be less than 10pF

V-gpio2 ispower supply of GPIO2domain

DNI

1.8V (3.3V), active low

1.8V, Active Low

Cap close to pin67

When VBAT is always on, must use this design

1.8V tolerence

ME906s is configed as WWAN-SSIC0 internally

CONFIG[3:0] t o PC

USB eye debug.

to PC USB2.0 interface

When module on/off is controlled only by VBAT, must use this design

Power_on_off control option 1

RF on:light on

R24 should not be larger than 10K

RF off: light off

1.8V(3.3V),active low

V-gpio1 ispower supply of GPIO1domain

DNI

DNI,Reserve for

RC is reserved for RF debug

When use option 1 , R23 must be DNI

USIM absent: CD-->GND;

otherdevices: for GCF or PTCRBdebug.

USIM present: CD Open

C18:to avoid twitter

Tunable antenna SCH

When use option 2 , R24 must be DNI

USB SCH

Config pin SCH

GPIO2 is from SOC

Power_on_off control option 2

GPIO1 is from SOC

#

0402

When Vgpio2 is ON

Q1 ison and Q2 is off

1.8V (3.3V),open drain ,active low

from proximity sensor

Power_On_Off is controlled by GPIO2

1.8V(3.3V),active low

CONFIG[3:0] is for card type indication and present detection 1.8V(3.3V).high:on,low:off

Power_On_Off is ispulled LOW

DNI: Do Not Install initially.

M.2: newname of NGFF.

Note: If M1 and M2 pin is metal,you can connect it to GND

GND of socket should be well connected to module GND

#

Q1 is off and Q2 is on

When Vgpio2 is off

Module is shut off safely

RESET control SCH

USIM SCH

#

1.8V or 3.0V

#

USIM_PWR:

#

Module output: 0V or NC

#

current: 2.5A max

M.2: 3.135V-4.4V,typical 3.3V

One 220uF Tantalum Capacitor is needed to

below 3.135 V in any case.

make sure that the voltage doesnot drop

USIM_DET Must Be Used.

HUAWEI ME906s LTE M.2 Module

Hardware Guide

Appendix B Acronyms and Abbreviations

Issue 04 (2017-12-11)

Huawei Proprietary and Confidential

76

11 Appendix B Acronyms and

Abbreviations

Acronym or Abbreviation

Expansion

3GPP

3rd Generation Partnership Project

CCC

China Compulsory Certification

CPU

Central Processing Unit

CS

Coding Scheme

CSD

Circuit Switched Data

DC

Direct Current

DMA

Direct Memory Access

DVK

Development Kit

EBU

External Bus Unit

EDGE

Enhanced Data for GSM Evolution

EIA

Electronic Industries Association

EMC

Electromagnetic Compatibility

EPA

Electrostatic Discharge Protected Area

ESD

Electrostatic Discharge

EU

European Union

FCC

Federal Communications Commission

FDD-TDMA

Frequency Division Duplexing-Time Division

Multiple Access

GMSK

Gaussian Minimum Shift Keying

GPIO

General-purpose I/O

GPRS

General Packet Radio Service

HUAWEI ME906s LTE M.2 Module

Hardware Guide

Appendix B Acronyms and Abbreviations

Issue 04 (2017-12-11)

Huawei Proprietary and Confidential

77

Acronym or Abbreviation

Expansion

GSM

Global System for Mobile communication

HBM

Human Body Model

HSIC

High Speed Inter-Chip Interface

HSDPA

High-Speed Downlink Packet Access

HSPA+

Enhanced High Speed Packet Access

HSUPA

High Speed Up-link Packet Access

IPC

Inter Processor Communications

ISO

International Standards Organization

I2S

I2C Sound

LCD

Liquid Crystal Display

LCP

Liquid Crystal Polyester

LDO

Low-Dropout

LED

Light-Emitting Diode

LTE

Long Term Evolution

MCP

Multi-chip Package

MIPI

Mobile Industry Processor Interface

NGFF

Next Generation Form Factor

NTC

Negative Temperature Coefficient

PA

Power Amplifier

PBCCH

Packet Broadcast Control Channel

PCB

Printed Circuit Board

PDU

Protocol Data Unit

PMU

Power Management Unit

RF

Radio Frequency

RoHS

Restriction of the Use of Certain Hazardous

Substances

RSE

Radiated Spurious Emission

RTC

Real-time Clock

SIMO

Single Input Multiple Output

TTL

Transistor-transistor Logic

TVS

Transient Voltage Suppressor

HUAWEI ME906s LTE M.2 Module

Hardware Guide

Appendix B Acronyms and Abbreviations

Issue 04 (2017-12-11)

Huawei Proprietary and Confidential

78

Acronym or Abbreviation

Expansion

UMTS

Universal Mobile Telecommunications System

USB

Universal Serial Bus

USIM

Universal Subscriber Identity Module

VSWR

Voltage Standing Wave Ratio

WCDMA

Wideband Code Division Multiple Access

Huawei ME906s LTE M.2 Module Hardware Guide (V100R001 04, English)

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