Huawei ME909u 521 LTE Mini PCIe Module Hardware Guide (V100R001 02, English)

HUAWEI ME909u-521 LTE Mini PCIe Module Hardware Guide-(V100R001_02, English)

2015-06-19

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HUAWEI ME909u-521 LTE Mini PCIe Module

Hardware Guide

Issue

Date

2015-05-30

Copyright © Huawei Technologies Co., Ltd. 2015. All rights reserved.
No part of this manual may be reproduced or transmitted in any form or by any means without prior written
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HUAWEI ME909u-521 LTE Mini PCIe Module
Hardware Guide

About This Document

About This Document
Revision History
Document
Version

Date

2014-01-23

2015-05-30

Issue 02 (2015-05-30)

Chapter

Descriptions
Creation

2.2

Updated Table 2-1 Features

2.3

Updated Figure 2-1 Circuit block diagram

Updated Figure 3-1 definitions of pins

3.7

Updated Audio Interface

4.4.2

Updated Table 4-4 Conducted Tx power

4.6

Added Co-exsitence with 5 GHz WIFI
Design Guide

5.4.1

Updated note and Table 5-4 Requirements
for input current of the ME909u-521 Mini
PCIe module

5.4

Deleted 5.4 Electrical Features of USIM

5.5

Deleted 5.5 Electrical Features of
Application Interfaces

6.4

Added Packaging

6.5

Updated Figure 6-3 ME909u-521 Mini PCIe
module label

6.6.1

Updated note in 6.6.1 Installing the Mini
PCIe Adapter on the Main Board

Updated Appendix A Circuit of Typical
Interface

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Contents

Contents
1 Introduction.................................................................................................................................... 7
2 Overall Description ...................................................................................................................... 8
2.1 About This Chapter........................................................................................................................... 8
2.2 Function Overview............................................................................................................................ 8
2.3 Circuit Block Diagram ....................................................................................................................... 9

3 Description of the Application Interfaces .............................................................................. 11
3.1 About This Chapter .......................................................................................................................... 11
3.2 Mini PCIe Interface .......................................................................................................................... 11
3.3 Power Interface .............................................................................................................................. 16
3.3.1 Power Sources and Grounds ................................................................................................ 16
3.3.2 Power Supply Time Sequence .............................................................................................. 16
3.4 Signal Control Interface .................................................................................................................. 17
3.4.1 Overview ................................................................................................................................ 17
3.4.2 WAKE# Signal ....................................................................................................................... 18
3.4.3 RESIN_N Signal .................................................................................................................... 19
3.4.4 W_DISABLE# Signal ............................................................................................................. 21
3.4.5 LED_WWAN# Signal ............................................................................................................. 21
3.5 USB Interface ................................................................................................................................. 21
3.6 USIM Card Interface ...................................................................................................................... 22
3.6.1 Overview ................................................................................................................................ 22
3.6.2 Circuit Recommended for the USIM Card Interface .............................................................. 23
3.7 Audio Interface ............................................................................................................................... 24
3.8 RF Antenna Connector ................................................................................................................... 25
3.9 Reserved Pins ................................................................................................................................ 26
3.10 NC Pins ........................................................................................................................................ 26

4 RF Specifications ......................................................................................................................... 28
4.1 About This Chapter ......................................................................................................................... 28
4.2 Operating Frequencies ................................................................................................................... 28
4.3 Conducted RF Measurement ......................................................................................................... 29
4.3.1 Test Environment ................................................................................................................... 29
4.3.2 Test Standards ....................................................................................................................... 29
4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 29

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4.4.1 Conducted Receive Sensitivity .............................................................................................. 29
4.4.2 Conducted Transmit Power ................................................................................................... 31
4.5 Antenna Design Requirements ...................................................................................................... 32
4.5.1 Antenna Design Indicators..................................................................................................... 32
4.5.2 Interference ........................................................................................................................... 34
4.5.3 Antenna Requirements .......................................................................................................... 35
4.6 Co-exsitence with 5 GHz WIFI Design Guide ................................................................................ 36
4.6.1 Purpose ................................................................................................................................. 36
4.6.2 Co-exsitence Design Main Point ........................................................................................... 36

5 Electrical and Reliability Features ........................................................................................... 38
5.1 About This Chapter ......................................................................................................................... 38
5.2 Absolute Ratings ............................................................................................................................ 38
5.3 Operating and Storage Temperatures ............................................................................................ 39
5.4 Power Supply Features .................................................................................................................. 39
5.4.1 Input Power Supply ............................................................................................................... 39
5.4.2 Power Consumption .............................................................................................................. 40
5.5 Reliability Features ......................................................................................................................... 45
5.6 EMC and ESD Features ................................................................................................................. 48

6 Mechanical Specifications ......................................................................................................... 50
6.1 About This Chapter ......................................................................................................................... 50
6.2 Dimensions and Interfaces ............................................................................................................. 50
6.3 Dimensions of the Mini PCI Express Connector ............................................................................ 51
6.4 Packaging ....................................................................................................................................... 52
6.5 Label ............................................................................................................................................... 53
6.6 Specification Selection for Fasteners ............................................................................................. 54
6.6.1 Installing the Mini PCIe Adapter on the Main Board .............................................................. 54
6.6.2 Removing the Mini PCIe Adapter from the Main Board ........................................................ 56
6.7 Antenna Plug .................................................................................................................................. 57
6.8 Thermal Design Guide ................................................................................................................... 58

7 Certifications ................................................................................................................................ 60
7.1 About This Chapter ......................................................................................................................... 60
7.2 Certifications ................................................................................................................................... 60

8 Safety Information ...................................................................................................................... 61
8.1 Interference .................................................................................................................................... 61
8.2 Medical Device ............................................................................................................................... 61
8.3 Area with Inflammables and Explosives ......................................................................................... 61
8.4 Traffic Security................................................................................................................................ 62
8.5 Airline Security................................................................................................................................ 62
8.6 Safety of Children ........................................................................................................................... 62
8.7 Environment Protection .................................................................................................................. 62

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Contents

8.8 WEEE Approval .............................................................................................................................. 62
8.9 RoHS Approval ............................................................................................................................... 62
8.10 Laws and Regulations Observance ............................................................................................. 63
8.11 Care and Maintenance ................................................................................................................. 63
8.12 Emergency Call ............................................................................................................................ 63
8.13 Regulatory Information ................................................................................................................. 63
8.13.1 CE Approval (European Union) ........................................................................................... 63

9 Appendix A Circuit of Typical Interface ................................................................................ 64
10 Appendix B Acronyms and Abbreviations .......................................................................... 65

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Introduction

This document describes the hardware application interfaces and air interfaces
provided by HUAWEI ME909u-521 Mini PCIe module (hereinafter referred to as the
ME909u-521 Mini PCIe module).
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the ME909u-521 Mini PCIe
module.

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Overall Description

2.1 About This Chapter
This chapter gives a general description of the ME909u-521 Mini PCIe module and
provides:


Function Overview



Circuit Block Diagram

2.2 Function Overview
Table 2-1 Features
Feature

Description

Physical
Dimensions



Dimensions (L × W × H): 51 mm × 30.4 mm × 3.35 mm



Weight: about 12 g

Operating
Bands



LTE: FDD Band 1, Band 2, Band 3, Band 5, Band 7, Band 8,
Band 20, all bands with diversity



WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5,
Band 8, all bands with diversity



GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz



GPS/GLONASS: L1

Operating
Temperature

–20°C to +60°C

Storage
Temperature

–40°C to +85°C

Power
Voltage

DC 3.0 V–3.6 V (typical value is 3.3 V)

AT
Commands

See HUAWEI ME909u-521 LTE LGA Module AT Command
Interface Specification.

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Overall Description

Feature

Description

Application
Interface
(52-pin Mini
PCIe interface

One standard USIM (Universal Subscriber Identity Module) card
(Class B and Class C)
Audio interface: PCM interface
USB 2.0 (High Speed)
RESIN_N: Reset module
WAKE#: Wake up signal
W_DISABLE# signal (the firmware with this feature is in plan)
LED_WWAN#: Active-low LED signal indicating the state of the
module (the software is under development)

Antenna
Connector

WWAN MAIN antenna connector x1
WWAN AUX antenna connector x1
GPS antenna connector x1

Data Services

GPRS: DL 85.6 kbit/s; UL 85.6 kbit/s
EDGE: DL 236.8 kbit/s; UL 236.8 kbit/s
WCDMA CS: DL 64 kbit/s; UL 64 kbit/s
WCDMA PS: DL 384 kbit/s; UL 384 kbit/s
HSPA+: DL 21.6 Mbit/s; UL 5.76 Mbit/s
DC-HSPA+: DL 43.2 Mbit/s; UL 5.76 Mbit/s
LTE FDD: DL 100 Mbit/s; UL 50 Mbit/s @20M BW cat3

2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the ME909u-521 Mini PCIe module. The
major functional unit of the Mini PCIe module contains the following parts:


LGA module



Control signals



Antenna connectors

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Overall Description

Figure 2-1 Circuit block diagram

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Description of the Application Interfaces

3.1 About This Chapter
This chapter mainly describes the external application interfaces of the ME909u-521
Mini PCIe module, including:


Mini PCIe Interface



Power Interface



Signal Control Interface



USB Interface



USIM Card Interface



Audio Interface



RF Antenna Connector



Reserved Pins



NC Pins

3.2 Mini PCIe Interface
The ME909u-521 Mini PCIe module uses a Mini PCIe interface as its external
interface. For details about the module and dimensions, see 6.2 Dimensions and
Interfaces.

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Figure 3-1 shows the sequence of pins on the interface of the Mini PCIe Adapter.
Figure 3-1 Sequence of Mini PCIe interface

Top

Bottom

Table 3-1 shows the pin definitions of the Mini PCIe interface.
Table 3-1 Pin definitions of the Mini PCIe interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Mini PCI
Express
Standard
Description

HUAWEI
Pin
Description

WAKE#

Open collector
active low
signal. This
signal is used to
wake up the
host.

–0.3

0.45

3.3Vaux

VCC_3V3

3.3 V DC supply
rails from the
PC side.

3.0

3.3

3.6

COEX1

Not connected

GND

Ground

COEX2

Not connected

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Pin
No.

Pin Name
Mini PCI
Express
Standard
Description

HUAWEI
Pin
Description

1.5 V

Description of the Application Interfaces

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Not connected

CLKREQ#

Not connected

UIM_PWR

USIM_PWR

Power source
for the external
USIM card

1.8/2.
85

GND

Ground

UIM_DATA

USIM_DATA

I/O

External USIM
data signal

1.8/2.
85

REFCLK-

Not connected

UIM_CLK

USIM_CLK

External USIM
clock signal

1.8/2.
85

REFCLK+

Not connected

UIM_RESE
T

USIM_RESE
T

External USIM
reset signal

1.8/2.
85

GND

Ground

UIM_Vpp

Not connected

Reserved

GND

Ground

Reserved

W_DISABL
E#

W_DISABLE
#

The
W_DISABLE#
signal is an
active low signal
that when
asserted (driven
low) by the
system shall
disable radio
operation.

VIL

–0.3

0.2

VIH

1.17

1.8

3.6

The software
version is in
plan.
21

GND

Ground

PERST#

RESIN_N

Reset module

VIL

–0.3

0.2

VIH

1.17

1.8

3.6

Active-low

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Pin
No.

Pin Name
Mini PCI
Express
Standard
Description

HUAWEI
Pin
Description

PERn0

Description of the Application Interfaces

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Not connected

3.3Vaux

VCC_3V3

3.3 V DC supply
rails from the
PC side.

3.0

3.3

3.6

PERp0

Not connected

GND

Ground

GND

Ground

1.5 V

Not connected

GND

Ground

SMB_CLK

Not connected

PETn0

Not connected

SMB_DATA

Not connected

PETp0

Not connected

GND

Ground

GND

Ground

USB_D-

USB_DM

I/O

USB signal D-

GND

Ground

USB_D+

USB_DP

I/O

USB signal D+

3.3Vaux

VCC_3V3

3.3 V DC supply
rails from the
PC side

3.0

3.3

3.6

GND

Ground

3.3Vaux

VCC_3V3

3.3 V DC supply
rails from the
PC side

3.0

3.3

3.6

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Pin
No.

Pin Name
Mini PCI
Express
Standard
Description

HUAWEI
Pin
Description

LED_WWA
N#

LED_WWAN
#

Description of the Application Interfaces

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Active-low LED
signal indicating
the state of the
card

The software
feature is under
development
and do not
support this
function now.
Drive strength:
10 mA
43

GND

Ground

LED_WLAN
#

Not connected

Reserved

PCM_CLK

PCM interface
clock

VOH

1.35

1.8

VOL

0.45

LED_WPAN
#

Not connected

Reserved

PCM_DOUT

PCM I/F data
out

VOH

1.35

1.8

VOL

0.45

1.5 V

Not connected

Reserved

PCM_DIN

PCM I/F data in

VIH

1.17

1.8

2.1

VIL

–0.3

0.63

GND

Ground

Reserved

PCM_SYNC

PCM interface
sync

VOH

1.35

1.8

VOL

0.45

3.0

3.3

3.6

3.3Vaux

VCC_3V3

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3.3 V DC supply
rails from the
PC side

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Description of the Application Interfaces



P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital
signal output. PO indicates power output pins; PI indicates power input pins.



VIL indicates Low-level Input voltage; VIH indicates High-level Input voltage; VOL indicates
Low-level Output voltage; VOH indicates High-level Output voltage.



The Reserved pins are internally connected to the module. Therefore, these pins should not
be used, otherwise they may cause problems. Please contact with us for more details about
this information.



The NC (Not Connected) pins are floating and there are no signal connected to these pins.
Therefore, these pins should not be used.

3.3 Power Interface
3.3.1 Power Sources and Grounds
For the Mini PCIe Adapter, +3.3 Vaux is the only voltage supply that is available. The
input voltage is 3.3 V±9%, as specified by PCI Express Mini CEM Specifications
1.2.
Table 3-2 Power and ground specifications
Pin No.

Pin
Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

2, 24, 39,
41 and 52

VCC_3V3

3.3 V DC supply
rails from the PC
side.

3.0

3.3

3.6

4, 9, 15,
18, 21, 26,
27, 29, 34,
35, 37, 40,
43, and 50

GND

Ground

To minimize the RF radiation through the power lines, it is suggested to add ceramic capacitors
of 10 pF and 100 nF in the power lines beside the Mini PCIe connector on the host side.

3.3.2 Power Supply Time Sequence
Power on sequence
Do not toggle RESIN_N pin during the power on sequence. Pulling RESIN_N pin low
will extend time for module startup.

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Figure 3-2 Power on timing sequence

Parameter

Remarks

Time (Nominal value)

Unit

TPD+

Power Valid to USB D+ high

Power off Sequence
Cutting off 3.3 V will power off the module.
Figure 3-3 Power off timing sequence

3.4 Signal Control Interface
3.4.1 Overview
The signal control part of the interface in the ME909-521 Mini PCIe module consists of
the following:


WAKE# Signal



RESIN_N Signal



W_DISABLE# Signal



LED_WWAN# Signal

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Table 3-3 Definitions of the pins on the signal control interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

WAKE#

Open collector
active low signal.
This signal is
used to wake up
the host.

–0.3

0.45

RESIN_N

Reset module

VIL

–0.3

0.2

VIH

1.17

1.8

3.6

VIL

–0.3

0.2

VIH

1.17

1.8

3.6

Active-low
20

W_DISABLE#

The
W_DISABLE#
signal is an active
low signal that
when asserted
(driven low) by
the system shall
disable radio
operation.
The software
version is in plan.

LED_WWAN#

Active-low LED
signal indicating
the state of the
card
The software
feature is under
development and
do not support
this function now.
Drive strength: 10
mA

3.4.2 WAKE# Signal
WAKE# pin (the signal that the module uses to wake up the PC) supports software
control.
This signal is used for module to wake up the host. It is designed as an OC gate, so it
should be pulled up by the host and it is active-low.
When the module wakes up the host, the WAKE# pin will output low-level-voltage to
wake the host.

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Figure 3-4 Connections of the WAKE# pin

WAKE#

3.4.3 RESIN_N Signal
The RESIN_N pin is used to reset the module's system. When the module software
stops responding, the RESIN_N pin can be pulled down to reset the module
hardware.
The RESIN_N signal is internally pulled up to 1.8 V, which is automatically on when
3.3 V is applied and it is active-low.

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Figure 3-5 Connections of the RESIN_N pin



As the RESIN_N signal is relatively sensitive, it is recommended that you install a
10 nF to 0.1 µF capacitor near the RESIN_N pin of the interface for filtering. In
addition, when you design a circuit on the PCB of the interface board, it is
recommended that the circuit length should not exceed 20 mm and that the circuit
should be kept at a distance of 2.54 mm (100 mil) at least from the PCB edge.
Furthermore, you need to wrap the area adjacent to the signal wire with a ground
wire. Otherwise, the module may be reset due to interference.



The maximum Forward Voltage Drop of the diode used in the module is 0.6 V. So
when the host wants to reset the module, the low-level-voltage in the RESIN_N pin
should below 50 mV.

The ME909u-521 Mini PCIe module supports hardware reset function. If the software
of the ME909u-521 Mini PCIe module stops responding, you can reset the hardware
through the RESIN_N signal as shown in Figure 3-6 . When a low-level pulse is
supplied through the RESIN_N pin, the hardware will be reset. After the hardware is
reset, the software starts powering on the module and reports relevant information
according to the actual settings. For example, the AT command automatically reports
^SYSSTART.
Figure 3-6 Reset pulse timing

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

The RESIN_N pin must not be pulled down for more than 1s.



The RESIN_N pin is optional, which can be not connected.



The maximum forward voltage drop of the diode used in the module is 0.6 V.

3.4.4 W_DISABLE# Signal
The W_DISABLE# signal is provided to allow users to disable wireless
communications of the module.
The software version is in plan.

3.4.5 LED_WWAN# Signal
The software feature is under development and do not support this function now.
If you need the LED function, you need reserve circuit and refer to the following figure
till the relative firmware is ready.
Figure 3-7 shows the recommended circuits of the LED_WWAN# pin. According to
LED feature, you can adjust the LED brightness by adjusting the resistance of resistor
R.
Figure 3-7 Driving circuit

3.5 USB Interface
The ME909u-521 Mini PCIe module is compliant with USB 2.0 protocol. The USB
interface is powered directly from the VBAT supply. The USB input/output lines are
compatible with the USB 2.0 signal specifications. Figure 3-8 shows the circuit of the
USB interface.

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Table 3-4 Definition of the USB interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

USB_DM

I/O

USB signal D-

USB_DP

I/O

USB signal D+

According to USB protocol, for bus timing or electrical characteristics of ME909u-521
USB signal, please refer to the chapter 7.3.2 of Universal Serial Bus Specification 2.0.
Figure 3-8 Recommended circuit of USB interface

3.6 USIM Card Interface
3.6.1 Overview
The ME909u-521 Mini PCIe module provides a USIM card interface complying with
the ISO 7816-3 standard and supports both Class B and Class C USIM cards.
Table 3-5 USIM card interface signals
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.(V)

Typ.(V)

Max.(V)

USIM_PWR

Power source for
the external USIM
card

1.8/2.85

USIM_DATA

I/O

External USIM data
signal

1.8/2.85

USIM_CLK

External USIM
clock signal

1.8/2.85

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Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.(V)

Typ.(V)

Max.(V)

USIM_RESET

External USIM
reset signal

1.8/2.85

3.6.2 Circuit Recommended for the USIM Card Interface
As the Mini PCIe Adapter is not equipped with a USIM socket, you need to place a
USIM socket on the user interface board.
Figure 3-9 shows the circuit of the USIM card interface.
Figure 3-9 Circuit of the USIM card interface

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

To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic
compatibility (EMC) authentication, the USIM socket should be placed near the
PCIe interface (it is recommended that the PCB circuit connects the PCIe interface
and the USIM socket does not exceed 100 mm), because a long circuit may lead to
wave distortion, thus affecting signal quality.



It is recommended that you wrap the area adjacent to the USIM_CLK and
USIM_DATA signal wires with ground. The Ground pin of the USIM socket and the
Ground pin of the USIM card must be well connected to the power Ground pin
supplying power to the PCIe Adapter.



A 100 nF capacitor and1 μF capacitor are placed between the USIM_PWR and
GND pins in a parallel manner (If USIM_PWR circuit is too long, that the larger
capacitance such as 4.7 μF can be employed if necessary). Three 33 pF
capacitors are placed between the USIM_DATA and Ground pins, the
USIM_RESET and Ground pins, and the USIM_CLK and Ground pins in parallel to
filter interference from RF signals.



It is recommended to take electrostatic discharge (ESD) protection measures near
the USIM card socket. The TVS diode with Vrwm of 5 V and junction capacitance
less than 10 pF must be placed as close as possible to the USIM socket, and the
Ground pin of the ESD protection component is well connected to the power
Ground pin that supplies power to the PCIe Adapter.



It is not recommended that pull the USIM_DATA pin up during design as a
10000-ohm resistor is used to connect the USIM_DATA pin to the USIM_PWR.

3.7 Audio Interface
The ME909u-521 Mini PCIe module provides one PCM digital audio interface. Table
3-6 lists the signals on the digital audio interface.
Table 3-6 Signals on the digital audio interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

PCM_CLK

PCM interface clock

VOH

1.35

1.8

VOL

0.45

VOH

1.35

1.8

VOL

0.45

VIH

1.17

1.8

2.1

VIL

–0.3

0.63

VOH

1.35

1.8

VOL

0.45

PCM_DOUT

PCM_DIN

PCM_SYNC

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PCM I/F data out

PCM I/F data in

PCM interface sync

Min.(V)

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Typ.(V)

Max.(V)

HUAWEI ME909u-521 LTE Mini PCIe Module
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Description of the Application Interfaces

The ME909u-521 Mini PCIe module interface enables communication with an external
codec to support linear format.
Figure 3-10 Circuit diagram of the interface of the PCM (ME909u-521 Mini PCIe module
is used as PCM master)



The ME909u-521 Mini PCIe module only supports master mode;



PCM_SYNC: Output when PCM is in master mode;



PCM_CLK: Output when PCM is in master mode;



It is recommended that a TVS be used on the related interface, to prevent electrostatic
discharge and protect integrated circuit (IC) components.

3.8 RF Antenna Connector
The ME909u-521 Mini PCIe module provides three antenna connectors (MAIN, GPS
and AUX) for connecting the external antennas.

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Figure 3-11 RF antenna connectors
AUX

GPS

MAIN

The antenna connectors must be used with coaxial cables with characteristic
impedance of 50 Ω.

3.9 Reserved Pins
The ME909u-521 Mini PCIe module provides 2 reserved pins. All of reserved pins
cannot be used by the customer.
Table 3-7 Reserved pins
Pin No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

17 and 19

Reserved

3.10 NC Pins
The ME909u-521 Mini PCIe module has some NC pins. All of NC pins should not be
connected. Please keep these pins open.

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Table 3-8 NC pins
Pin No.

Pin
Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

3, 5–7, 11, 13, 16, 23,
25, 28, 30–33, 44, 46
and 48

Not connected, please
keep open.

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4.1 About This Chapter
This chapter describes the RF specifications of the ME909u-521 Mini PCIe module,
including:


Operating Frequencies



Conducted RF Measurement



Conducted Rx Sensitivity and Tx Power



Antenna Design Requirements



Co-exsitence with 5 GHz WIFI Design Guide

4.2 Operating Frequencies
Table 4-1 shows the RF bands supported by the ME909u-521 Mini PCIe module.
Table 4-1 RF bands
Operating Band

UMTS Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

UMTS Band 2

1850 MHz–1910 MHz

1930 MHz–1990 MHz

UMTS Band 5

824 MHz–849 MHz

869 MHz–894 MHz

UMTS Band 8

880 MHz–915 MHz

925 MHz–960 MHz

GSM 850

824 MHz–849 MHz

869 MHz–894 MHz

GSM 900

880 MHz–915 MHz

925 MHz–960 MHz

GSM 1800

1710 MHz–1785 MHz

1805 MHz–1880 MHz

GSM 1900

1850 MHz–1910 MHz

1930 MHz–1990 MHz

LTE Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

LTE Band 2

1850 MHz–1910 MHz

1930 MHz–1990 MHz

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Operating Band

LTE Band 3

1710 MHz–1785 MHz

1805 MHz–1880 MHz

LTE Band 5

824 MHz–849 MHz

869 MHz–894 MHz

LTE Band 8

880 MHz–915 MHz

925 MHz–960 MHz

LTE Band 7

2500 MHz–2570 MHz

2620 MHz–2690 MHz

LTE Band 20

832 MHz–862 MHz

791 MHz–821 MHz

GPS L1

1574.42 MHz–1576.42 MHz

GLONASS L1

1597.55 MHz–1605.89 MHz

4.3 Conducted RF Measurement
4.3.1 Test Environment
Test instrument

R&S CMU200, R&S CMW500, Agilent E5515C

Power supply

Keithley 2303, Agilent 66319

RF cable for testing

L08-C014-350 of DRAKA COMTEQ or Rosenberger
Cable length: 29 cm



The compensation for different frequency bands relates to the cable and the test
environment.



The instrument compensation needs to be set according to the actual cable conditions.

4.3.2 Test Standards
Huawei modules meet 3GPP test standards. Each module passes strict tests at the
factory and thus the quality of the modules is guaranteed.

4.4 Conducted Rx Sensitivity and Tx Power
4.4.1 Conducted Receive Sensitivity
The conducted receive sensitivity is a key parameter that indicates the receiver
performance of ME909u-521 Mini PCIe module.
Table 4-2 lists the typical Rx sensitivity values of the ME909u-521 Mini PCIe module.

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Table 4-2 Conducted Rx sensitivity
Band

Typical Value (dBm)

Note

GSM 850

–111

BER Class II < 2.44%

GSM 900

–109.5

BER Class II < 2.44%

GSM 1800

–109

BER Class II < 2.44%

GSM 1900

–109

BER Class II < 2.44%

WCDMA Band 1

–110.5

BER < 0.1%

WCDMA Band 2

–109

BER < 0.1%

WCDMA Band 5

–111

BER < 0.1%

WCDMA Band 8

–111

BER < 0.1%

LTE Band 1

–102

Throughput ≥ 95%, 10 MHz
Bandwidth

LTE Band 2

–100

Throughput ≥ 95%, 10 MHz
Bandwidth

LTE Band 3

–101

Throughput ≥ 95%, 10 MHz
Bandwidth

LTE Band 5

–101

Throughput ≥ 95%, 10 MHz
Bandwidth

LTE Band 7

–101

Throughput ≥ 95%, 10 MHz
Bandwidth

LTE Band 8

–100

Throughput ≥ 95%, 10 MHz
Bandwidth

LTE Band 20

–101

Throughput ≥ 95%, 10 MHz
Bandwidth

Table 4-3 ME909u-521 Mini PCIe module GPS main characteristics
Item

Typical Value

Receive Sensitivity (Cold start)

–147 dBm

Receive Sensitivity (Hot start)

–157 dBm

Receive Sensitivity (Tracking mode)

–157 dBm

TTFF@–130 dBm (Cold start)

38s

TTFF@–130 dBm (Hot start)

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

The test values are the average of some test samples.



Sensitivity of WCDMA and GSM are tested in the main port.



LTE sensitivity is tested in SIMO (Main+AUX).

4.4.2 Conducted Transmit Power
The conducted transmit power is another indicator that measures the performance of
ME909u-521 Mini PCIe module. The conducted transmit power refers to the
maximum power that the module tested at the antenna connector can transmit.
According to the 3GPP protocol, the required transmit power varies with the power
class.
Table 4-4 lists the typical tested values of the ME909u-521 Mini PCIe module.
Table 4-4 Conducted Tx power
Band

Typical Value (Unit:dBm)

Note (Unit: dB)

GSM 850

+1.5/–1

GSM 900

+1.5/–1

DCS1800

+1.5/–1

PCS 1900

+1.5/–1

WCDMA Band 1

+1.5/–1

WCDMA Band 2

+1.5/–1

WCDMA Band 5

+1.5/–1

WCDMA Band 8

+1.5/–1

LTE Band 1

22.5

+1.5/–1

LTE Band 2

22.5

+1.5/–1

LTE Band 3

22.5

+1.5/–1

LTE Band 5

22.5

+1.5/–1

LTE Band 7

22.5

+1.5/–1

LTE Band 8

22.5

+1.5/–1

LTE Band 20

22.5

+1.5/–1

Maximum Power Reduction (MPR) of LTE is according to 3GPP TS 36.521-1 as below.

Modulation

RB Allocation

MPR(dB)

QPSK

≥ 1 RB; ≤ Partial RB

QPSK

> Partial RB

≤1

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Modulation

RB Allocation

MPR(dB)

16QAM

≥ 1 RB; ≤ Partial RB

≤1

16QAM

> Partial RB

≤2

4.5 Antenna Design Requirements
4.5.1 Antenna Design Indicators
Antenna Efficiency
Antenna efficiency is the ratio of the input power to the radiated or received power of
an antenna. The radiated power of an antenna is always lower than the input power
due to the following antenna losses: return loss, material loss, and coupling loss. The
efficiency of an antenna relates to its electrical dimensions. To be specific, the
antenna efficiency increases with the electrical dimensions. In addition, the
transmission cable from the antenna connector of PCIe Adapter to the antenna is also
part of the antenna. The cable loss increases with the cable length and the frequency.
It is recommended that the cable loss is as low as possible, for example, U.FL-LP-088
made by HRS.
The following antenna efficiency (free space) is recommended for ME909u-521 Mini
PCIe module to ensure high radio performance of the module:


Efficiency of the primary antenna: ≥ 40% (below 960 MHz); ≥ 50% (over 1710
MHz)



Efficiency of the diversity antenna: ≥ half of the efficiency of the primary antenna
in receiving band



Efficiency of the GPS antenna: ≥ 50%

In addition, the efficiency should be tested with the transmission cable.

S11 or VSWR
S11 indicates the degree to which the input impedance of an antenna matches the
reference impedance (50 Ω). S11 shows the resonance feature and impedance
bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression
of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector
analyzer.
The following S11 value is recommended for the antenna of ME909u-521 Mini PCIe
module:


S11 of the primary antenna: ≤ –6 dB



S11 of the diversity antenna: ≤ –6 dB



S11 of the GPS antenna: ≤ –10 dB

In addition, S11 is less important than the efficiency, and S11 has weak correlation to
wireless performance.

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Isolation
For a wireless device with multiple antennas, the power of different antennas is
coupled with each other. Antenna isolation is used to measure the power coupling.
The power radiated by an antenna might be received by an adjacent antenna, which
decreases the antenna radiation efficiency and affects the running of other devices. To
avoid this problem, evaluate the antenna isolation as sufficiently as possible at the
early stage of antenna design.
Antenna isolation depends on the following factors:


Distance between antennas



Antenna type



Antenna direction

The primary antenna must be placed as near as possible to the ME909u-521 Mini
PCIe module to minimize the cable length. The diversity antenna needs to be
installed perpendicularly to the primary antenna. The diversity antenna can be placed
farther away from the ME909u-521 Mini PCIe module. Antenna isolation can be
measured with a two-port vector network analyzer.
The following antenna isolation is recommended for the antennas on laptops:


Isolation between the primary and diversity antennas: ≤ –12 dB



Isolation between the primary (diversity) antenna and the GPS antenna: ≤ –15 dB



Isolation between the primary antenna and the Wi-Fi antenna: ≤ –15 dB

Polarization
The polarization of an antenna is the orientation of the electric field vector that rotates
with time in the direction of maximum radiation.
The linear polarization is recommended for the antenna of ME909u-521 Mini PCIe
module.

Radiation Pattern
The radiation pattern of an antenna reflects the radiation features of the antenna in
the remote field region. The radiation pattern of an antenna commonly describes the
power or field strength of the radiated electromagnetic waves in various directions
from the antenna. The power or field strength varies with the angular coordinates (θ
and φ), but is independent of the radial coordinates.
The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal
plane, and the incident waves of base stations are often in the horizontal plane. For
this reason, the receiving performance is optimal.
The following radiation patterns are recommended for the antenna of ME909u-521
Mini PCIe module.
Primary/Diversity/GPS antenna: omnidirectional
In addition, the diversity antenna's pattern should be complementary with the
primary's.

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Envelope Correlation Coefficient
The envelope correlation coefficient indicates the correlation between different
antennas in a multi-antenna system (primary antenna, diversity antenna, and MIMO
antenna). The correlation coefficient shows the similarity of radiation patterns, that is,
amplitude and phase, of the antennas. The ideal correlation coefficient of a diversity
antenna system or a MIMO antenna system is 0. A small value of the envelope
correlation coefficient between the primary antenna and the diversity antenna
indicates a high diversity gain. The envelope correlation coefficient depends on the
following factors:


Distance between antennas



Antenna type



Antenna direction

The antenna correlation coefficient differs from the antenna isolation. Sufficient
antenna isolation does not represent a satisfactory correlation coefficient. For this
reason, the two indicators need to be evaluated separately.
For the antennas on laptops, the recommended envelope correlation coefficient
between the primary antenna and the diversity antenna is smaller than 0.5.

Gain and Directivity
The radiation pattern of an antenna represents the field strength of the radiated
electromagnetic waves in all directions, but not the power density that the antenna
radiates in the specific direction. The directivity of an antenna, however, measures the
power density that the antenna radiates.
Gain, as another important parameter of antennas, correlates closely to the directivity.
The gain of an antenna takes both the directivity and the efficiency of the antenna into
account. The appropriate antenna gain prolongs the service life of relevant batteries.
The following antenna gain is recommended for ME909u-521 Mini PCIe module.


Gain of the primary/diversity antenna ≤ 2.5 dBi



Gain of the GPS antenna ≥ 3 dBi


The antenna consists of the antenna body and the relevant RF transmission cable. Take the
RF transmission cable into account when measuring any of the preceding antenna
indicators.



Huawei cooperates with various famous antenna suppliers who are able to make
suggestions on antenna design, for example, Amphenol, Skycross, etc.

4.5.2 Interference
Besides the antenna performance, the interference on the user board also affects the
radio performance (especially the TIS) of the module. To guarantee high performance
of the module, the interference sources on the user board must be properly controlled.
On the user board, there are various interference sources, such as the LCD, CPU,
audio circuits, and power supply. All the interference sources emit interference signals
that affect the normal operation of the module. For example, the module sensitivity
can be decreased due to interference signals. Therefore, during the design, you need
to consider how to reduce the effects of interference sources on the module. You can

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take the following measures: Use an LCD with optimized performance; shield the LCD
interference signals; shield the signal cable of the board; or design filter circuits.
Huawei is able to make technical suggestions on radio performance improvement of
the module.

4.5.3 Antenna Requirements
The antenna for ME909u-521 Mini PCIe module must fulfill the following
requirements:
Antenna Requirements
Frequency range

Depending on frequency band(s) provided by the network
operator, the customer must use the most suitable
antenna for that/those band(s)

Bandwidth of main
antenna

70 MHz in GSM 850
80 MHz in GSM 900
170 MHz in GSM 1800
140 MHz in GSM 1900
250 MHz in WCDMA/LTE Band 1
140 MHz in WCDMA/LTE Band 2
70 MHz in WCDMA/LTE Band 5
80 MHz in WCDMA/LTE Band 8
170 MHz in LTE Band 3
190 MHz in LTE Band 7
71 MHz in LTE Band 20

Bandwidth of diversity
antenna

60 MHz in WCDMA/LTE Band 1
60 MHz in WCDMA/LTE Band 2
25 MHz in WCDMA/LTE Band 5
35 MHz in WCDMA/LTE Band 8
75 MHz in LTE Band 3
70 MHz in LTE Band 7
30 MHz in LTE Band 20

Bandwidth of GPS

35 MHz in GNSS

antenna
Gain

≤ 2.5 dBi

Impedance

50 Ω

VSWR absolute max

≤ 3:1 (≤ 2:1 for GPS antenna)

VSWR recommended

≤ 2:1 (≤ 1.5:1 for GPS antenna)

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4.6 Co-exsitence with 5 GHz WIFI Design Guide
4.6.1 Purpose
ME909u-521 Mini PCIe module supports LTE Band 1/Band 2/Band 3, GSM 1800 and
GSM 1900, and each of that band can generate the 2nd or 3rd harmonic with the
frequency about 5 GHz, so that will deteriorate 5 GHz WIFI receiver performance.
That is why Co-exsitence design needed.
Operating Band

Tx
Frequency
range (MHz)

2nd order
harmonic
Fre. Range
(MHz)

3nd order
harmonic Fre.
Range (MHz)

5GHz WIFI
Operating Range
(MHz)

Band 1 (UMTS, LTE)

1920–1980

3840–3960

5760–5940

4910–5056; 5170–5835

Band 2 (UMTS, LTE), GSM1900

1850–1910

3700–3820

5550–5730

4910–5056; 5170–5835

Band 3 (LTE), GSM1800

1710–1785

3420–3570

5130–5355

4910–5056; 5170–5835

4.6.2 Co-exsitence Design Main Point
DC Power for ME909u-521 Mini PCIe module and WIFI Circuit
The suggest DC power tree is shown as below, use LC filter circuit for each branch.

3.8 V
LC

ME909u-521

5G WIFI

Other circuit

RF Front End Design Circuit for ME909u-521 Mini PCIe module
There are low pass filter between module MAIN_ANT pad and main antenna
connector for harmonic filtering. The recommend key electrical specification for LPF
and RF front end circuit are respectively listed in Table 4-5 and Figure 4-1

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Table 4-5 The recommend key electrical specification for LPF
Parameter

Frequency (Unit: MHz)

Typical Value (Unit: dB)

Insert loss

300–2690

0.4

Attenuation

4900–5950

Figure 4-1 The recommend RF front end circuit
MAIN_ ANT

ME909u-521

Matching
Network

LPF

Matching
Network

PCB Placement Suggestion
For PCB placement, we recommend to keep 5 GHz WIFI antenna away from
ME909u-521 Mini PCIe module and its main antenna as far as possible.


The recommend isolation between ME909u-521 Mini PCIe module and WIFI
antenna is above 30 dB.



The recommend isolation between ME909u-521 Mini PCIe antenna and WIFI
antenna is above 30 dB.

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Electrical and Reliability Features

5.1 About This Chapter
This chapter describes the electrical and reliability features of the interfaces in the
ME909u-521 Mini PCIe module, including:


Absolute Ratings



Operating and Storage Temperatures



Power Supply Features



Reliability Features



EMC and ESD Features

5.2 Absolute Ratings

Table 5-1 lists the absolute ratings for the ME909u-521 Mini PCIe module. Using the
module beyond these conditions may result in permanent damage to the module.
Table 5-1 Absolute ratings for the ME909u-521 Mini PCIe module
Symbol

Specification

Min.

Max.

Unit

VCC_3V3

External power voltage

–0.3

4.0

Digital input voltage

–0.3

2.16

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5.3 Operating and Storage Temperatures
Table 5-2 lists the operating and storage temperatures for the ME909u-521 Mini PCIe
module.
Table 5-2 Operating and storage temperatures for the ME909u-521 Mini PCIe module
Specification

Min.

Max.

Unit

Normal working temperature[1]

–20

+60

°C

Ambient temperature for storage

–40

+85

°C

[1]: When the ME909u-521 module works at this temperature, all its RF indexes comply with the
3GPP TS 45.005 and 3GPP TS 34.121-1 specifications.

5.4 Power Supply Features
5.4.1 Input Power Supply
Table 5-3 lists the requirements for input power of the ME909u-521 Mini PCIe module.
Table 5-3 Requirements for input power for the ME909u-521 Mini PCIe module
Parameter

Min.

Typ.

Max.

Ripple

Unit

VCC_3V3

3.0

3.3

3.6

0.05

Figure 5-1 Power Supply During Burst Emission

The VCC_3V3 minimum value must be guaranteed during the burst (with 3.75 A Peak in GSM 1
slot mode). So A low-dropout (LDO) regulator or switch power with current output of more than
4 A is strongly recommended for external power supply.

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Table 5-4 Requirements for input current of the ME909u-521 Mini PCIe module
Power

Peak (GSM 1 slot)

Normal (WCDMA)

Normal (LTE 23 dbm)

VCC_3V3

3.75 A

1000 mA

1250 mA

5.4.2 Power Consumption
The power consumption of ME909u-521 Mini PCIe module in different scenarios are
respectively listed in Table 5-5 toTable 5-8 .
The power consumption listed in this section are tested when the power supply of
ME909u-521 Mini PCIe module is normal voltage (3.3 V), and all of test values are
measured at room temperature.
Table 5-5 Averaged standby DC power consumption (WCDMA/HSDPA/LTE/GSM)
Description

Bands

Test Value (mA)

Notes/Configuration

Typical
Sleep

LTE

LTE bands

5.2

Module is powered up.
DRX cycle=8 (2.56s)
Module is registered on the
network.
USB is in suspend.

HSPA+/WCDMA

UMTS bands

5.3

Module is powered up.
DRX cycle=8 (2.56s)
Module is registered on the
network.
USB is in suspend.

GPRS/EDGE

GSM bands

5.5

Module is powered up.
MFRMS=5 (1.175s)
Module is registered on the
network.
USB is in suspend.

Idle

LTE

LTE bands

100

Module is powered up.
DRX cycle=8 (2.56s)
Module is registered on the
network, and no data is
transmitted.
USB is in active.

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Bands

Test Value (mA)

Electrical and Reliability Features

Notes/Configuration

Typical
HSPA+/WCDMA

UMTS bands

110

Module is powered up.
DRX cycle=8 (2.56s)
Module is registered on the
network, and no data is
transmitted.
USB is in active.

GPRS/EDGE

GSM bands

Module is powered up.
MFRMS=5 (1.175s)
Module is registered on the
network, and no data is
transmitted.
USB is in active.

Table 5-6 Averaged data transmission DC power consumption (WCDMA/HSDPA/LTE)
Description

Band

Test Value (mA)

Notes/Configuration

Typical
WCDMA

HSDPA

Band 1

185

0 dBm Tx Power

(IMT2100)

257

10 dBm Tx Power

975

23.5 dBm Tx Power

Band 2

188

0 dBm Tx Power

(PCS 1900)

260

10 dBm Tx Power

915

23.5 dBm Tx Power

Band 5

160

0 dBm Tx Power

(850 MHz)

210

10 dBm Tx Power

684

23.5 dBm Tx Power

Band 8

155

0 dBm Tx Power

(900 MHz)

210

10 dBm Tx Power

658

23.5 dBm Tx Power

Band 1

310

0 dBm Tx Power

(IMT2100)

385

10 dBm Tx Power

985

23.5 dBm Tx Power

303

0 dBm Tx Power

Band 2

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Band

Test Value (mA)

Electrical and Reliability Features

Notes/Configuration

Typical
(PCS 1900)

LTE

405

10 dBm Tx Power

868

23.5 dBm Tx Power

Band 5

258

0 dBm Tx Power

(850 MHz)

315

10 dBm Tx Power

710

23.5 dBm Tx Power

Band 8

365

0 dBm Tx Power

(900 MHz)

320

10 dBm Tx Power

705

23.5 dBm Tx Power

440

0 dBm Tx Power

493

10 dBm Tx Power

1240

23 dBm Tx Power

426

0 dBm Tx Power

490

10 dBm Tx Power

1105

23 dBm Tx Power

423

0 dBm Tx Power

483

10 dBm Tx Power

1079

23 dBm Tx Power

348

0 dBm Tx Power

390

10 dBm Tx Power

755

23 dBm Tx Power

453

0 dBm Tx Power

480

10 dBm Tx Power

835

23 dBm Tx Power

357

0 dBm Tx Power

400

10 dBm Tx Power

795

23 dBm Tx Power

418

0 dBm Tx Power

590

10 dBm Tx Power

890

23 dBm Tx Power

Band 1

Band 2

Band 3

Band 5

Band 7

Band 8

Band 20

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Electrical and Reliability Features

Table 5-7 Averaged DC power consumption (GPRS/EDGE)
Description

Test Value (mA)

PCL

Configuration

1 Up/1 Down

Typical
GPRS 850

385
550

2 Up/1 Down

716

4 Up/1 Down

168

GPRS 900

2 Up/1 Down

468

4 Up/1 Down

446

860

4 Up/1 Down
10

1 Up/1 Down

325

2 Up/1 Down

560

4 Up/1 Down

233

1 Up/1 Down

338

2 Up/1 Down

460

4 Up/1 Down
10

1 Up/1 Down

115

2 Up/1 Down

165

4 Up/1 Down

247

1 Up/1 Down

385

2 Up/1 Down

510

4 Up/1 Down
10

1 Up/1 Down

120

2 Up/1 Down

170

4 Up/1 Down

235

1 Up/1 Down

355

2 Up/1 Down

470

4 Up/1 Down

110

170

Issue 02 (2015-05-30)

1 Up/1 Down
2 Up/1 Down

EDGE 850

651

GPRS 1900

1 Up/1 Down

275

197

GPRS 1800

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2 Up/1 Down

HUAWEI ME909u-521 LTE Mini PCIe Module
Hardware Guide

Description

Test Value (mA)

Electrical and Reliability Features

PCL

Configuration

Typical
260
EDGE 900

256

1 Up/1 Down
2 Up/1 Down

505

4 Up/1 Down
15

1 Up/1 Down

175

2 Up/1 Down

275

4 Up/1 Down

172

1 Up/1 Down

245

2 Up/1 Down

340

4 Up/1 Down

EDGE 1900

375

118

EDGE 1800

4 Up/1 Down

1 Up/1 Down

115

2 Up/1 Down

165

4 Up/1 Down

188

1 Up/1 Down

270

2 Up/1 Down

375

4 Up/1 Down

1 Up/1 Down

120

2 Up/1 Down

175

4 Up/1 Down



All the power consumption test configuration can be referenced by GSM Association Official
Document TS.09: Battery Life Measurement and Current Consumption Technique.



LTE test condition: 10/20 MHz bandwidth; QPSK: 1 RB when testing Max. Tx power and full
RB when testing 0 dBm or 10 dBm.



Test condition: for Max. Tx power ,see 4.4.2 Conducted Transmit Power, which are listed in
Table 4-4 . data throughput, see 2.2 Function Overview, which are listed in Table 2-1 .

Table 5-8 Averaged GPS operation DC power consumption
Description

Test Value (mA)

Notes/Configuration

Typical
GPS fixing

Issue 02 (2015-05-30)

100

RF is disabled;

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Test Value (mA)

Electrical and Reliability Features

Notes/Configuration

Typical
USB is in active;
GPS tracking

100

The Rx power of GPS is –130 dBm.

5.5 Reliability Features
Table 5-9 lists the test conditions and results of the reliability of the ME909u-521 Mini
PCIe module.
Table 5-9 Test conditions and results of the reliability
Item
Stress

Low-temperature
storage

High-temperature
storage

Low-temperature
operating

High-temperature
operating

Temperature
cycle operating

Issue 02 (2015-05-30)

Test Condition

Standard

Sample
size

Results



Temperature: –40ºC

Visual inspection: ok

Operation mode: no
power, no package

JESD22A119-C

3 pcs/group



Test duration: 24 h



Temperature: 85ºC



Operation mode: no
power, no package



Test duration: 24 h



Temperature: –20ºC



Operation mode: working
with service connected



Test duration: 24 h



Temperature: 60ºC



Operation mode: working
with service connected



Test duration: 24 h



High temperature: 60ºC



Low temperature: –20ºC



Operation mode: working
with service connected



Test duration: 30 cycles;1
h+1 h/cycle

Function test: ok
RF specification: ok

JESD22A103-C

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

IEC6006
8-2-1

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A108-C

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A105-B

3pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

HUAWEI ME909u-521 LTE Mini PCIe Module
Hardware Guide
Item
Damp heat
cycling

Thermal shock

Salty fog test

Electrical and Reliability Features

Test Condition

Standard

Sample
size

Results



High temperature: 55ºC

Visual inspection: ok

Low temperature: 25ºC

JESD22A101-B

3 pcs/group




Humidity: 95%±3%



Operation mode: working
with service connected



Test duration: 6 cycles;
12 h+12 h/cycle



Low temperature: –40º



High temperature: 85ºC



Temperature change
interval: < 20s



Operation mode: no
power



Test duration: 100 cycles;
15 min+15 min/cycle



Temperature: 35°C



Density of the NaCl
solution: 5%±1%



Operation mode: no
power, no package



Test duration:

Function test: ok
RF specification: ok

JESD22A106-B

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A107-B

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

Spraying interval: 8 h
Exposing period after
removing the salty fog
environment: 16 h
Sine vibration

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

Frequency range: 5 Hz to
200 Hz



Acceleration: 1 Grms



Frequency scan rate: 0.5
oct/min



Operation mode: working
with service connected



Test duration: 3 axial
directions. 2 h for each
axial direction.

JESD22B103-B

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

HUAWEI ME909u-521 LTE Mini PCIe Module
Hardware Guide
Item
Shock test

Drop test

Life

High temperature
operating life

High temperature
& high humidity

Temperature
cycle-Non
operating

Electrical and Reliability Features

Test Condition

Standard

Sample
size

Results



Half-sine wave shock

Visual inspection: ok

Peak acceleration: 30
Grms

JESD-B1
04-C

3 pcs/group



Shock duration: 11 ms



Operation mode: working
with service connected



Test duration: 6 axial
directions. 3 shocks for
each axial direction.



0.8 m in height. Drop the
module on the marble
terrace with one surface
facing downwards, six
surfaces should be
tested.



Operation mode: no
power, no package



Temperature: 60ºC



Operation mode: working
with service connected



Test duration: 168 h, 336
h, 500 h, 1000 h for
inspection point



High temperature: 85ºC



Humidity: 85%



Operation mode: powered
on and no working



Test duration: 168 h, 336
h, 500 h, 1000 h for
inspection point



High temperature: 85ºC



Low temperature: –40ºC



Temperature change
slope: 6ºC/min



Operation mode: no
power



Test duration: 168 h,

Function test: ok
RF specification: ok

IEC6006
8-2-32

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A108-B

50
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A110-B

50
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok
Cross section: ok

JESD22A104-C

50
pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok
Cross section: ok

336 h, 500 h, 1000 h for
inspection point
ESD

HBM (Human
Body Model)

Issue 02 (2015-05-30)



1 kV (Class 1 B)



Operation mode: no
power

JESD22A114-D

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

HUAWEI ME909u-521 LTE Mini PCIe Module
Hardware Guide
Item
ESD with DVK (or
embedded in the
host)

Electrical and Reliability Features

Test Condition

Standard

Sample
size

Results



Contact Voltage: ±2 kV,
±4 kV

IEC6100
0-4-2

2 pcs

Visual inspection: ok



Air Voltage : ±2 kV, ±4 kV,
±8 kV



Operation mode: working
with service connected

Function test: ok
RF specification: ok

Groups ≥ 2

5.6 EMC and ESD Features
The following are the EMC design comments:


Attention should be paid to static control in the manufacture, assembly,
packaging, handling and storage process to reduce electrostatic damage to
HUAWEI module.



RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if
the antenna port is protected by TVS (Transient Voltage Suppressor), which is
resolved by making some adjustment on RF match circuit.



TVS should be added on the USB port for ESD protection, and the parasitic
capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode
inductor should be added in parallel on D+/D- signal.



TVS should be added on the SIM interface for ESD protection. The parasitic
capacitance of TVS on USIM signal should be less than 10 pF;



Resistors in parallel and a 10nF capacitance should be added on RESIN_N
signal to avoid shaking, and the distance between the capacitor and the related
pins should be less than 100 mil.



PCB routing should be V-type rather than T-type for TVS.



An integrated ground plane is necessary for EMC design.

The following are the requirements of ESD environment control:


The electrostatic discharge protected area (EPA) must have an ESD floor whose
surface resistance and system resistance are greater than 1 x 104 Ω while less
than 1 x 109 Ω.



The EPA must have a sound ground system without loose ground wires, and the
ground resistance must be less than 4 Ω.



The workbench for handling ESD sensitive components must be equipped with
common ground points, the wrist strap jack, and ESD pad. The resistance
between the jack and common ground point must be less than 4 Ω. The surface
resistance and system resistance of the ESD pad must be less than 1 x 109 Ω.



The EPA must use the ESD two-circuit wrist strap, and the wrist strap must be
connected to the dedicated jack. The crocodile clip must not be connected to the
ground.

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HUAWEI ME909u-521 LTE Mini PCIe Module
Hardware Guide


Electrical and Reliability Features

The ESD sensitive components, the processing equipment, test equipment, tools,
and devices must be connected to the ground properly. The indexes are as
follows:
−

Hard ground resistance < 4 Ω

−

1 x 105 Ω ≤ Soft ground resistance < 1 x 109 Ω

−

1 x 105 Ω ≤ ICT fixture soft ground resistance < 1 x 1011 Ω

−

The electronic screwdriver and electronic soldering iron can be easily oxidized.
Their ground resistance must be less than 20 Ω.



The parts of the equipment, devices, and tools that touch the ESD sensitive
components and moving parts that are close to the ESD sensitive components
must be made of ESD materials and have sound ground connection. The parts
that are not made of ESD materials must be handled with ESD treatment, such
as painting the ESD coating or ionization treatment (check that the friction voltage
is less than 100 V).



Key parts in the production equipment (parts that touch the ESD sensitive
components or parts that are within 30 cm away from the ESD sensitive
components), including the conveyor belt, conveyor chain, guide wheel, and SMT
nozzle, must all be made of ESD materials and be connected to the ground
properly (check that the friction voltage is less than 100 V).



Engineers that touch IC chips, boards, modules, and other ESD sensitive
components and assemblies must wear ESD wrist straps, ESD gloves, or ESD
finger cots properly. Engineers that sit when handling the components must all
wear ESD wrist straps.



Noticeable ESD warning signs must be attached to the packages and placement
areas of ESD sensitive components and assemblies.



Boards and IC chips must not be stacked randomly or be placed with other ESD
components.



Effective shielding measures must be taken on the ESD sensitive materials that
are transported or stored outside the EPA.
ME909u-521 Mini PCIe module does not include any protection against overvoltage.

Issue 02 (2015-05-30)

HUAWEI ME909u-521 LTE Mini PCIe Module
Hardware Guide

Mechanical Specifications

6.1 About This Chapter
This chapter mainly describes mechanical specifications of ME909u-521 Mini PCIe
module, including:


Dimensions and Interfaces



Dimensions of the Mini PCI Express Connector



Packaging



Label



Specification Selection for Fasteners



Antenna Plug



Thermal Design Guide

6.2 Dimensions and Interfaces
The dimensions (L × W × H) of the ME909u-521 Mini PCIe module are 51 mm × 30.4
mm ×3.35 mm. Figure 6-1 shows the dimensions of ME909u-521 Mini PCIe module in
detail.

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HUAWEI ME909u-521 LTE Mini PCIe Module
Hardware Guide

Mechanical Specifications

Figure 6-1 Dimensions of the ME909u-521 Mini PCIe module (Unit: mm)

6.3 Dimensions of the Mini PCI Express Connector
The Mini PCIe Adapter adopts a standard Mini PCI Express connector that has 52
pins and complies with the PCI Express Mini Card Electromechanical Specification
Revision 1.2.
Figure 6-2 shows a 52-pin Mini PCI Express connector (take the Molex 67910002 as
an example).

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Mechanical Specifications

Figure 6-2 Dimensions of the Mini PCI Express connector (Unit: mm)

6.4 Packaging
HUAWEI Mini PCIe module uses anti-vibration foam and ESD bag into cartons.

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Hardware Guide

Mechanical Specifications

6.5 Label
The label is made from fade-resistant material.

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Hardware Guide

Mechanical Specifications

Figure 6-3 ME909u-521 Mini PCIe module label

The picture mentioned above is only for reference.

6.6 Specification Selection for Fasteners
6.6.1 Installing the Mini PCIe Adapter on the Main Board
To install the Mini PCIe Adapter on the main board, do the following:
Step 1 Insert the Mini PCIe Adapter into the Mini PCI Express connector on the main board.

Step 2 Press downwards to fix the Mini PCIe Adapter in the module slot.

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Hardware Guide

Mechanical Specifications

Step 3 Use a screwdriver to fix the Mini PCIe Adapter on the main board with two screws
provided in the Mini PCIe Adapter packing box.

Step 4 Insert the connector of the main antenna into the MAIN antenna interface (M) of the
Mini PCIe Adapter according to the indication on the label of the Mini PCIe Adapter.
Insert the connector of the auxiliary antenna into the AUX antenna interface (A) of the
Mini PCIe Adapter and the GPS antenna into the GPS antenna interface (G) of the
Mini PCIe Adapter in the same way.

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Mechanical Specifications



Insert the antenna connectors vertically into the antenna interfaces of the Mini PCIe
Adapter.



Do not press or squeeze the antenna cable or damage the connectors. Otherwise, the
wireless performance of the Mini PCIe Adapter may be reduced or the Mini PCIe Adapter
cannot work normally.



Ensure that the antenna cables are routed through the channel in the frame of the PC and
do not lay the cables across the raised edges of the frame.



The module could not be installed or removed when the host is powered on. Otherwise, it
may result in permanent damage to the module.

6.6.2 Removing the Mini PCIe Adapter from the Main Board
Step 1 Disconnect the antenna cables from the Mini PCIe Adapter. You can lift the
connectors using a small screwdriver.

Step 2 Remove the two screws with the screwdriver.

Step 3 Slide backwards the two clips to release the Mini PCIe Adapter from the slot. Then, lift
up the Mini PCIe Adapter.

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Mechanical Specifications

6.7 Antenna Plug
Figure 6-4 Mating the plug

Align the mating tool or the mating end of the tool over the plug end of the cable
assembly.

Firmly place the tool over the plug until it is secured in the tool.

Place the plug cable assembly (held in the tool) over the corresponding
receptacle.

Assure that the plug and receptacle are aligned press-down perpendicular to the
mounting surface until both connectors are fully mated.

Remove the mating tool by pulling it up carefully.

Figure 6-5 Unmating the plug

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HUAWEI ME909u-521 LTE Mini PCIe Module
Hardware Guide

Mechanical Specifications



The extraction tool is recommended.



Any attempt of unmating by pulling on the cable may result in damage and influence the
mechanical/electrical performance.

It is recommended not to apply any pull forces after the bending of the cable, as
described in Figure 6-6 .
Figure 6-6 Do not apply any pull forces after the bending of the cable

6.8 Thermal Design Guide
When using in the LTE network, the Mini PCIe has high power consumption (for
details, see Table 5-6 ). To improve the module reliability and stability, focus on the
thermal design of the device to speed up heat dissipation.
Take the following heat dissipation measures:


Do not hollow out the customer PCB.



Attach the thermal conductive material between the Mini PCIe and the customer
PCB. The recommended thermal conductivity of the thermal conductive material
is 1.0 W/m-k or higher (recommended manufacturers: Laird and Bergquist). The
dimensions (W x D) of the thermal conductive material are 38 mm x 28 mm (1.50
in. x 1.10 in.), and its height depends on the height of the Mini PCIe connector
you use and the method for installing the Mini PCIe. When deciding the height of
the thermal conductive material, you are advised to obey the following rule: After
the Mini PCIe is fastened to the customer PCB, the compression amount of the
thermal conductive material accounts for 15% to 30% of the thermal conductive
material size. For example, if you use a connector shown in the following figure
and install the Mini PCIe like this, the recommended height of the thermal
conductive material is 1.8 mm (0.07 in.).

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Hardware Guide

Mechanical Specifications

Mini PCIe

Thermal Conductive Material

Customer PCB



On the customer PCB, reserve two metal screw holes, which are connected to
the PCB ground plane. When installing the Mini PCIe, use two metal screws to
fasten the Mini PCIe to the customer PCB. See the following figure.
Screw

Mini PCIe

Thermal Conductive Material

Customer PCB



Ensure that the air flow around the Mini PCIe is sufficient.



Try not to place any component in the Mini PCIe's projection region on the
customer PCB. Do not place components with 1.5 W or higher power
consumption or heat sensitive components (such as crystals) near the Mini PCIe.



Use a large customer PCB. The recommended size (W x D) is 80 mm x 80 mm
(3.15 in. x 3.15 in.).



Apply copper to the region for attaching the thermal conductive material to the
customer PCB. Try to use the continuous ground plane design on the customer
PCB, and each ground plane must be connected through holes. Therefore,
reserve holes as many as possible.
If you do not take the preceding heat dissipation measures, the overheat protection mechanism
is triggered due to overheated Mini PCIe and the network connection is terminated when the
Mini PCIe keeps working in enclosed space with a 60ºC temperature and a current of more
than 820 mA for a period of time. You can resume the network connection only after the
temperature drops.

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HUAWEI ME909u-521 LTE Mini PCIe Module
Hardware Guide

Certifications

7.1 About This Chapter
This chapter gives a general description of certifications of ME909u-521 Mini PCIe
module.

7.2 Certifications
Table 7-1 shows certifications the ME909u-521 Mini PCIe module has been implemented. For
more demands, please contact us for more details about this information.

Table 7-1 Product Certifications
Certification

Model name
ME909u-521

√

RoHS

√

WEEE

√

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HUAWEI ME909u-521 LTE Mini PCIe Module
Hardware Guide

Safety Information

Read the safety information carefully to ensure the correct and safe use of your
wireless device. Applicable safety information must be observed.

8.1 Interference
Power off your wireless device if using the device is prohibited. Do not use the
wireless device when it causes danger or interference with electric devices.

8.2 Medical Device


Power off your wireless device and follow the rules and regulations set forth by
the hospitals and health care facilities.



Some wireless devices may affect the performance of the hearing aids. For any
such problems, consult your service provider.



Pacemaker manufacturers recommend that a minimum distance of 15 cm be
maintained between the wireless device and a pacemaker to prevent potential
interference with the pacemaker. If you are using an electronic medical device,
consult the doctor or device manufacturer to confirm whether the radio wave
affects the operation of this device.

8.3 Area with Inflammables and Explosives
To prevent explosions and fires in areas that are stored with inflammable and
explosive devices, power off your wireless device and observe the rules. Areas stored
with inflammables and explosives include but are not limited to the following:


Gas station



Fuel depot (such as the bunk below the deck of a ship)



Container/Vehicle for storing or transporting fuels or chemical products



Area where the air contains chemical substances and particles (such as granule,
dust, or metal powder)



Area indicated with the "Explosives" sign

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HUAWEI ME909u-521 LTE Mini PCIe Module
Hardware Guide

Safety Information



Area indicated with the "Power off bi-direction wireless equipment" sign



Area where you are generally suggested to stop the engine of a vehicle

8.4 Traffic Security


Observe local laws and regulations while using the wireless device. To prevent
accidents, do not use your wireless device while driving.



RF signals may affect electronic systems of motor vehicles. For more information,
consult the vehicle manufacturer.



In a motor vehicle, do not place the wireless device over the air bag or in the air
bag deployment area. Otherwise, the wireless device may hurt you owing to the
strong force when the air bag inflates.

8.5 Airline Security
Observe the rules and regulations of airline companies. When boarding or
approaching a plane, power off your wireless device. Otherwise, the radio signal of
the wireless device may interfere with the plane control signals.

8.6 Safety of Children
Do not allow children to use the wireless device without guidance. Small and sharp
components of the wireless device may cause danger to children or cause suffocation
if children swallow the components.

8.7 Environment Protection
Observe the local regulations regarding the disposal of your packaging materials,
used wireless device and accessories, and promote their recycling.

8.8 WEEE Approval
The wireless device is in compliance with the essential requirements and other
relevant provisions of the Waste Electrical and Electronic Equipment Directive
2012/19/EU (WEEE Directive).

8.9 RoHS Approval
The wireless device is in compliance with the restriction of the use of certain
hazardous substances in electrical and electronic equipment Directive 2011/65/EU
(RoHS Directive).

Issue 02 (2015-05-30)

HUAWEI ME909u-521 LTE Mini PCIe Module
Hardware Guide

Safety Information

8.10 Laws and Regulations Observance
Observe laws and regulations when using your wireless device. Respect the privacy
and legal rights of the others.

8.11 Care and Maintenance
It is normal that your wireless device gets hot when you use or charge it. Before you
clean or maintain the wireless device, stop all applications and power off the wireless
device.


Use your wireless device and accessories with care and in clean environment.
Keep the wireless device from a fire or a lit cigarette.



Protect your wireless device and accessories from water and vapour and keep
them dry.



Do not drop, throw or bend your wireless device.



Clean your wireless device with a piece of damp and soft antistatic cloth. Do not
use any chemical agents (such as alcohol and benzene), chemical detergent, or
powder to clean it.



Do not leave your wireless device and accessories in a place with a considerably
low or high temperature.



Use only accessories of the wireless device approved by the manufacture.
Contact the authorized service center for any abnormity of the wireless device or
accessories.



Do not dismantle the wireless device or accessories. Otherwise, the wireless
device and accessories are not covered by the warranty.



The device should be installed and operated with a minimum distance of 20 cm
between the radiator and your body.

8.12 Emergency Call
This wireless device functions through receiving and transmitting radio signals.
Therefore, the connection cannot be guaranteed in all conditions. In an emergency,
you should not rely solely on the wireless device for essential communications.

8.13 Regulatory Information
The following approvals and notices apply in specific regions as noted.

8.13.1 CE Approval (European Union)
The wireless device is approved to be used in the member states of the EU. The
wireless device is in compliance with the essential requirements and other relevant
provisions of the Radio and Telecommunications Terminal Equipment Directive
1999/5/EC (R&TTE Directive).

Issue 02 (2015-05-30)

HUAWEI ME909u-521 LTE Mini PCIe Module
Hardware Guide

Appendix A Circuit of Typical Interface

C3
150uF

C5
150uF

150uF

10K

VCC From Host

VCC_3V3
PCM_CLK
PCM_DOUT
PCM_DIN
PCM_SYNC
Note the signal direction of PCM_DOUT,PCM_DIN

VCC_3V3

2
4
6
8
10
12
14
16
18

USB_D+

USIM_PWR
USIM_DATA
USIM_CLK
UISM_RESET
W_DISABLE#

20
22
24

DNI,Reserve for
USB eye debug

Active low(Don't connect a diode to this pin)
The W_DISABLE function is under development.

1.8pF

VCC_3V3
GND1
NC
USIM_PWR
USIM_DATA
USIM_CLK
USIM_RESET
NC
GND4
W_DISABLE#
RESIN_N
VCC_3V3
GND6
NC
NC
NC
GND9
USB_DM
USB_DP
GND12
LED_WWAN#
NC
NC
NC
GND13
VCC_3V3

to USB 2.0 interface
DNI

WAKE#
NC
NC
NC
GND2
NC
NC
GND3
RESERVED1
RESERVED2
GND5
NC
NC
GND7
GND8
NC
NC
GND10
GND11
VCC_3V3
VCC_3V3
GND12
PCM_CLK
PCM_DOUT
PCM_DIN
PCM_SYNC

RESIN_N
VCC_3V3

26
28
30
32
34
36
38
40

1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51

Active low
Cap close to the pin22 of module

USB_D-

33pF

Wake the host
Open drain,active low

USB_DUSB_D+
LED_WWAN#

42
44
46
48

470

VCC_3V3

50
52
VCC_3V3

100nF

10pF

100K

VCC_3V3

10
M1

Don't support Hot Plug.
USIM_PWR

USIM_RESET

USIM_CLK
USIM_DATA

R5
R6

0
0

GND

33pF

Issue 02 (2015-05-30)

C12

C11

1uF

C10

GND

RESIN_N

1
5VCC
2GND
RST
6
3VPP
7CLK
I/O
11
M2

8
S2

Q1
GPIO1
9
S3

GPIO1 is from SOC
Leave RESIN_N pin open if donot use it.

3 D

G 1
2 S

HUAWEI ME909u-521 LTE Mini PCIe Module
Hardware Guide

Appendix B Acronyms and Abbreviations

Appendix B Acronyms and
Abbreviations

Acronym or Abbreviation

Expansion

3GPP

Third Generation Partnership Project

8PSK

8 Phase Shift Keying

AUX

Auxiliary

BER

Bit Error Rate

BIOS

Basic Input Output System

BLER

Block Error Rate

CCC

China Compulsory Certification

European Conformity

Coding Scheme

CSD

Circuit Switched Data

Direct Current

DCE

Data Communication Equipment

EMC

Electromagnetic Compatibility

ESD

Electrostatic Discharge

European Union

FCC

Federal Communications Commission

GPIO

General-purpose I/O

GPRS

General Packet Radio Service

GSM

Global System for Mobile Communication

HBM

Human Body Model

Issue 02 (2015-05-30)

HUAWEI ME909u-521 LTE Mini PCIe Module
Hardware Guide

Appendix B Acronyms and Abbreviations

Acronym or Abbreviation

Expansion

HSDPA

High-Speed Downlink Packet Access

HSPA+

Enhanced High Speed Packet Access

HSUPA

High Speed Up-link Packet Access

ISO

International Standards Organization

LCP

Liquid Crystal Polyester

LDO

Low-Dropout

LED

Light-Emitting Diode

LGA

Land Grid Array

LTE

Long Term Evolution

MCP

Multi-chip Package

PCB

Printed Circuit Board

Radio Frequency

RoHS

Restriction of the Use of Certain Hazardous
Substances

TBD

To Be Determined

TTFF

Time to First Fix

TVS

Transient Voltage Suppressor

UMTS

Universal Mobile Telecommunications System

USB

Universal Serial Bus

USIM

Universal Subscriber Identity Module

VSWR

Voltage Standing Wave Ratio

WCDMA

Wideband Code Division Multiple Access

WEEE

Waste Electrical and Electronic Equipment

Issue 02 (2015-05-30)

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