Huawei MU709 Series HSPA Mini PCIe Module Hardware Guide (V100R001 04, English)

2015-07-02

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HUAWEI MU709 Series HSPA+ Mini PCIe Module

Hardware Guide

Issue

Date

2015-06-25

Copyright © Huawei Technologies Co., Ltd. 2015. All rights reserved.
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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

About This Document

About This Document
Revision History
Document
Version

Date

2014-09-15

2014-09-18

3.3.2

Updated section 3.3.2: Reset the Module

2015-02-16

All

Added the description of MU709s-6 module

2015-06-25

2.2

Updated Table 2-1: Features

5.3

Updated Table 5-2: Operating and storage
temperatures

7.2

Updated Table 7-1: Product Certifications

Chapter

Descriptions
Creation

Scope
MU709s-2
MU709s-6

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Contents

Contents
1 Introduction.................................................................................................................................... 7
2 Overall Description ...................................................................................................................... 8
2.1 About This Chapter ........................................................................................................................... 8
2.2 Function Overview............................................................................................................................ 8
2.3 Circuit Block Diagram ....................................................................................................................... 9

3 Description of the Application Interfaces .............................................................................. 11
3.1 About This Chapter .......................................................................................................................... 11
3.2 Mini PCIe Interface .......................................................................................................................... 11
3.3 Power Interface .............................................................................................................................. 16
3.3.1 Sources and Grounds............................................................................................................ 16
3.3.2 Power Supply Time Sequence .............................................................................................. 17
3.4 Signal Control Interface .................................................................................................................. 18
3.4.1 Overview ................................................................................................................................ 18
3.4.2 WAKE# Signal ....................................................................................................................... 18
3.4.3 RESIN_N Signal .................................................................................................................... 19
3.4.4 LED_WWAN# Signal ............................................................................................................. 20
3.5 USB Interface ................................................................................................................................. 21
3.5.1 Overview ................................................................................................................................ 21
3.5.2 Circuit Recommended for the USB Interface ........................................................................ 22
3.6 USIM Card Interface ...................................................................................................................... 22
3.6.1 Overview ................................................................................................................................ 22
3.6.2 Circuit Recommended for the USIM Card Interface .............................................................. 23
3.7 Audio Interface ............................................................................................................................... 24
3.7.1 Overview ................................................................................................................................ 24
3.7.2 Circuit Recommended for the Audio Interface ...................................................................... 25
3.8 NC Pins .......................................................................................................................................... 25

4 RF Specifications ......................................................................................................................... 27
4.1 About This Chapter ......................................................................................................................... 27
4.2 Operating Frequencies ................................................................................................................... 27
4.3 Conducted RF Measurement ......................................................................................................... 28
4.3.1 Test Environment ................................................................................................................... 28
4.3.2 Test Standards ....................................................................................................................... 28

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4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 28
4.4.1 Conducted Receive Sensitivity .............................................................................................. 28
4.4.2 Conducted Transmit Power ................................................................................................... 29
4.5 Antenna Design Requirements ...................................................................................................... 30
4.5.1 Antenna Design Indicators..................................................................................................... 30
4.5.2 Interference ........................................................................................................................... 33
4.5.3 GSM/WCDMA Antenna Requirements .................................................................................. 33

5 Electrical and Reliability Features ........................................................................................... 35
5.1 About This Chapter ......................................................................................................................... 35
5.2 Absolute Ratings ............................................................................................................................ 35
5.3 Operating and Storage Temperatures ............................................................................................ 35
5.4 Power Supply Features .................................................................................................................. 36
5.4.1 Input Power Supply ............................................................................................................... 36
5.4.2 Power Consumption .............................................................................................................. 37
5.5 Reliability Features ......................................................................................................................... 41
5.6 EMC and ESD Features ................................................................................................................. 44

6 Mechanical Specifications ......................................................................................................... 46
6.1 About This Chapter ......................................................................................................................... 46
6.2 Dimensions and Interfaces ............................................................................................................. 46
6.3 Dimensions of the Mini PCI Express Connector ............................................................................ 47
6.4 Packaging ....................................................................................................................................... 48
6.5 Specification Selection for Fasteners ............................................................................................. 49
6.5.1 Installing the Mini PCIe Adapter on the Main Board .............................................................. 49
6.5.2 Romoving the Mini PCIe Adapter from the Main Board ........................................................ 51
6.6 Antenna Plug .................................................................................................................................. 52
6.7 Thermal Design Guide ................................................................................................................... 53

7 Certifications ................................................................................................................................ 56
7.1 About This Chapter ......................................................................................................................... 56
7.2 Certifications ................................................................................................................................... 56

8 Safety Information ...................................................................................................................... 57
8.1 Interference .................................................................................................................................... 57
8.2 Medical Device ............................................................................................................................... 57
8.3 Area with Inflammables and Explosives ......................................................................................... 57
8.4 Traffic Security................................................................................................................................ 58
8.5 Airline Security................................................................................................................................ 58
8.6 Safety of Children ........................................................................................................................... 58
8.7 Environment Protection .................................................................................................................. 58
8.8 WEEE Approval .............................................................................................................................. 58
8.9 RoHS Approval ............................................................................................................................... 58
8.10 Laws and Regulations Observance ............................................................................................. 59

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8.11 Care and Maintenance ................................................................................................................. 59
8.12 Emergency Call ............................................................................................................................ 59
8.13 Regulatory Information ................................................................................................................. 59
8.13.1 CE Approval (European Union) ........................................................................................... 59
8.13.2 FCC Statement .................................................................................................................... 60

9 Appendix A Circuit of Typical Interface ................................................................................ 61
10 Appendix B Acronyms and Abbreviations .......................................................................... 62

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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Introduction

This document describes the hardware application interfaces and air interfaces
provided by HUAWEI MU709 series (MU709s-2 and MU709s-6) HSPA+ Mini PCIe
Module (hereinafter referred to as the MU709 module).
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the MU709 module.

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Overall Description

2.1 About This Chapter
This chapter gives a general description of the MU709 module and provides:


Function Overview



Circuit Block Diagram

2.2 Function Overview
Table 2-1 Features
Feature

Description

Physical
Dimensions



Dimensions: (L × W × H): 51 mm × 30.4 mm × 3.27 mm



Weight: about 12 g

Operating
Bands



MU709s-2

WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 8, all bands with
diversity
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz


MU709s-6

WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5, all
bands with diversity
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz
Operating
Temperature

Normal operating temperature: –20°C to +70°C

Storage
Temperature

–40°C to +85°C

Humility

RH5% to RH95%

Power
Voltage

DC 3.0 V to 3.6 V (typical value is 3.3 V)

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Extended operating temperature[1]: –30°C to +75°C

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Overall Description

Feature

Description

AT
Commands

See the HUAWEI MU709 Series HSPA+ Module AT Command
Interface Specification.

Application
Interface
(52-pin Mini
PCIe interface

One standard USIM card (Class B and Class C)
Audio interface: PCM interface
USB 2.0 (High Speed)
RESIN_N: Reset module
WAKE#: Wake up signal
LED_WWAN#: Active-low LED signal indicating the state of the
module

Antenna
connector



WWAN MAIN antenna connector x1



WWAN AUX antenna connector x1

SMS

New message alert
Management of SMS: read SMS, write SMS, send SMS, delete
SMS and list SMS
Supports MO and MT: Point-to-point

Data Services

GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s
EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s
WCDMA PS: UL 384 kbit/s; DL 384 kbit/s
HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s

Operating

Android 2.x/3.x/4.x

Systems

Linux (Kernel 2.6.18 or later)
Windows 7/8/8.1
Windows CE 5.0/6.0/7.0



[1]: When the ME909s LGA module works in the range from –30°C to –20°C or +70°C to
+75°C, NOT all their RF performances comply with 3GPP specifications.



The thermal design must be implemented according to the chapter 6.7 Thermal Design
Guide. If not, the overheat protection mechanism will be triggered due to overheated Mini
PCIe and the network connection will be terminated.

2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the MU709 adapter. The major
functional unit of the Mini PCIe Adapter contains the following parts:


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Power supply circuit

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

LGA Module



Control signals



Antenna Connectors

Overall Description

Figure 2-1 Circuit block diagram of the MU709 module

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Description of the Application Interfaces

3.1 About This Chapter
This chapter mainly describes the external application interfaces of the MU709
module, including:


Mini PCIe Interface



Power Interface



Signal Control Interface



USB Interface



USIM Card Interface



Audio Interface



NC Pins

3.2 Mini PCIe Interface
The MU709 module uses a Mini PCIe interface as its external interface. For details
about the module and dimensions, see Dimensions and Interfaces.

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Description of the Application Interfaces

Figure 3-1 Sequence of Mini PCIe interface

Table 3-1 Pin definitions of the Mini PCIe Interface
Pin
No.

Pin Name

Pad
Type

Description

Mini PCI
Express
Standard
Description

HUAWEI
Pin
Description

WAKE#

Open
collector
active low
signal. This
signal is
used to wake
up the host.

3.3Vaux

VCC_3V3

COEX1

GND

Min.

Typ.

Max.

(V)

–0.3

0.45

3.3 V DC
supply input.

3.0

3.3

3.6

Not
connected

GND

Ground

COEX2

Not
connected

1.5 V

Not
connected

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Parameter

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Comments

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide
Pin
No.

Pin Name

Pad
Type

Description

Mini PCI
Express
Standard
Description

HUAWEI
Pin
Description

CLKREQ#

Not
connected

UIM_PWR

USIM_PWR

Power
source for
the external
USIM card

Description of the Application Interfaces

Parameter

Min.

Typ.

Max.

Comments

(V)

–0.3

1.8

1.98

USIM_PW
R=1.8 V

–0.3

3.0

3.3

USIM_PW
R=3.0 V

GND

Ground

UIM_DATA

USIM_DATA

I/O

External
USIM data
signal

VOH

0.7 x
USIM
_PW
R

3.3

USIM_PW
R=1.8 V or
3.0 V

VOL

0.2 x
USIM_
PWR

VIH

0.65 x
USIM
_PW
R

3.30

VIL

0.25x
USIM_
PWR

REFCLK-

Not
connected

UIM_CLK

USIM_CLK

External
USIM clock
signal

VOH

0.7 x
USIM
_PW
R

3.3

USIM_PW
R=1.8 V or
3.0 V

VOL

0.2 x
USIM_
PWR

REFCLK+

Not
connected

UIM_RESET

USIM_RESE
T

External
USIM reset
signal

VOH

0.7 x
USIM
_PW
R

3.3

USIM_PW
R=1.8 V or
3.0 V

VOL

0.2 x
USIM_
PWR

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Pin
No.

Pin Name

Pad
Type

Description

Mini PCI
Express
Standard
Description

HUAWEI
Pin
Description

GND

Ground

UIM_Vpp

Reserved

GND

Description of the Application Interfaces
Min.

Typ.

Max.

(V)

Not
connected

GND

Ground

Reserved

Not
connected

W_DISABLE
#

Not
connected

GND

Ground

RERST#

RESIN_N

Reset
module

VIL

–0.3

0.3

VIH

1.17

1.8

3.6

Active-low

Parameter

Comments

PERn0

Not
connected

3.3Vaux

VCC_3V3

3.3 V DC
supply input.

3.0

3.3

3.6

PERp0

Not
connected

GND

Ground

GND

Ground

1.5 V

Not
connected

GND

Ground

SMB_CLK

Not
connected

PETn0

Not
connected

SMB_DATA

Not
connected

PETp0

Not
connected

GND

Ground

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Pin
No.

Pin Name

Pad
Type

Description

Mini PCI
Express
Standard
Description

HUAWEI
Pin
Description

GND

Ground

USB_D-

USB_DM

I/O

GND

USB_D+

Description of the Application Interfaces

Parameter

Min.

Typ.

Max.

Comments

(V)

USB signal
D-

Ground

USB_DP

I/O

USB signal
D+

3.3Vaux

VCC_3V3

3.3 V DC
supply input.

3.0

3.3

3.6

GND

Ground

3.3Vaux

VCC_3V3

3.3 V DC
supply input.

3.0

3.3

3.6

LED_WWAN
#

Active-low
LED signal
indicating the
state of the
card.

VOL

–0.3

0.45

GND

Ground

LED_WLAN
#

Not
connected

Reserved

PCM_CLK

PCM
interface
clock

VOL

–0.3

0.45

VOH

1.35

1.8

2.1

LED_WPAN
#

Not
connected

Reserved

PCM_DOUT

PCM I/F data
output

VOL

–0.3

0.45

VOH

1.35

1.8

2.1

1.5 V

Not
connected

Reserved

PCM_DIN

PCM I/F data
input

VIL

–0.3

0.63

VIH

1.17

1.8

2.1

GND

Ground

Reserved

PCM_SYNC

PCM
interface
sync

VOL

–0.3

0.45

VOH

1.35

1.8

2.1

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Pin
No.

Pin Name
Mini PCI
Express
Standard
Description

HUAWEI
Pin
Description

3.3Vaux

VCC_3V3

Pad
Type

Description

3.3 V DC
supply input

Description of the Application Interfaces

Parameter

Min.

Typ.

Max.

(V)

3.0

3.3

3.6

Comments



P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital
signal output; PO indicates power output pins; PI indicates power input pins.



VIL indicates Low-level Input voltage; VIH indicates High-level Input voltage; VOL indicates
Low-level Output voltage; VOH indicates High-level Output voltage.



The NC pins are floating and there are no signal connected to these pins. Therefore, these
pins should not be used.

3.3 Power Interface
3.3.1 Sources and Grounds
For the Mini PCIe Adapter, +3.3Vaux is the only voltage supply that is available. The
input voltage is 3.3 V±9%, as specified by PCI Express Mini Card Electromechanical
Specification Revision 1.2.
Table 3-2 Power and ground specifications
Pin No.

Pin Name

Pad
Type

Descriptiom

Min.(V)

Typ .(V)

Max.(V)

2, 24, 39, 41 and 52

VCC_3V3

3.3 V DC supply input

3.0

3.3

3.6

4, 9, 15, 18, 21, 26, 27,
29, 34, 35, 37, 40, 43
and 50

GND

Ground

To minimize the RF radiation through the power lines, it is suggested to add ceramic capacitors
of 10 pF and 100 nF in the power lines beside the Mini PCIe connector on the host side.

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3.3.2 Power Supply Time Sequence
Power on Sequence
Figure 3-2 Power on timing sequence

Parameter

Remarks

Time (Nominal value)

Unit

TPD+

Power Valid to USB D+ high

7.0

Do not toggle RESIN_N pin during the power on sequence. Pull-Down RESIN_N pin will extend
time for module startup.

Power off Sequence
Cutting off the VCC_3V3 power supply will power off the module.
Figure 3-3 Power off timing sequence

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3.4 Signal Control Interface
3.4.1 Overview
The signal control part of the interface in the MU709 module consists of the following:


WAKE# Signal



RESIN_N Signal



LED_WWAN# Signal

Table 3-3 Definitions of the pins on the signal control interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

WAKE#

Open collector active low signal.
This signal is used to wake up the
host.

–0.3

0.45

RESIN_N

Reset module

VIL

–0.3

0.3

VIH

1.17

1.8

3.6

VOL

–0.3

0.45

Active-low
42

LED_WWAN#

Active-low LED signal indicating
the state of the card.

3.4.2 WAKE# Signal
WAKE# signal supports software control.
This signal is used for module to wake up the host. It is designed as an OC (Open
Collector) gate, so it should be pulled up by the host and it is active-low.
When the module wakes up the host, the WAKE# pin will output low-level-voltage for
1s to wake up the host.

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Figure 3-4 Connections of the WAKE# pin

3.4.3 RESIN_N Signal
The RESIN_N signal is used to reset the module's system. When the module software
stops responding, the RESIN_N pin can be pulled down to reset the module
hardware.
The RESIN_N signal is internally pulled up to 1.8 V, and it turns on automatically when
the VCC_3V3 is pulled up. The RESIN_N signal is active-low.
Figure 3-5 Connections of the RESIN_N pin

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

As the RESIN_N signal is relatively sensitive, it is recommended that you install a
10 nF–0.1 µF capacitor near the RESIN_N pin of the interface for filtering. In
addition, when you design a circuit on the PCB of the interface board, it is
recommended that the circuit length should not exceed 20 mm and that the circuit
should be kept at a distance of 2.54 mm (100 mil) at least from the PCB edge.
Furthermore, you need to wrap the area adjacent to the signal wire with a ground
wire. Otherwise, the module may be reset due to interference.



The maximum Forward Voltage Drop of the diode used in the module is 0.6 V. So
when the host wants to reset the module, the low-level-voltage in the RESIN_N pin
should be below 50 mV.

The MU709 module supports hardware reset function. If the software of the MU709
module stops responding, you can reset the hardware through the RESIN_N signal as
shown in Figure 3-6 . When a low-level pulse is supplied through the RESIN_N pin,
the hardware will be reset. After the hardware is reset, the software starts powering on
the module and reports relevant information according to the actual settings. For
example, the AT command automatically reports ^SYSSTART.
Figure 3-6 Reset pulse timing



The RESIN_N pin must not be pulled down for more than 1s.



The RESIN_N pin is optional, which can not be connected.

3.4.4 LED_WWAN# Signal
MU709 series module provides an LED_WWAN# signal to indicate the work status.
This function is disabled by default, it is controlled by AT^LEDCTRL. For details about
the command, please refer to HUAWEI MU709 Series HSPA+ Module AT Command
Interface Specification.
Table 3-4 State of the LED_WWAN# pin
No.

Operating Status

LED_WWAN#

No service or Restricted service

Outputs: low (0.1s)-high (0.1s)-low
(0.1s)-high (1.7s)
2s cycle

Outputs: low (0.1s)-high (1.9s)
2s cycle

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Dial-up successfully

Outputs: low

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Figure 3-7 shows the recommended circuits of the LED_WWAN# pin. According to
LED feature, you can adjust the LED brightness by adjusting the resistance of resistor
R.
Figure 3-7 Driving circuit

3.5 USB Interface
3.5.1 Overview
The MU709 module is compliant with USB 2.0 protocol. The USB interface is powered
directly from the VBAT supply. The USB input/output lines are compatible with the
USB 2.0 signal specifications. Figure 3-8 shows the circuit of the USB interface.
Table 3-5 Definition of the USB interface
Pin No.

Pin Name

Pad Type

Description

Parameter

Min.(V)

Typ.(V)

Max.(V)

USB_DM

I/O

USB signal D-

USB_DP

I/O

USB signal D+

According to USB protocol, for bus timing or electrical characteristics of MU709 USB
signal, please refer to the chapter 7.3.2 of Universal Serial Bus Specification 2.0.

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3.5.2 Circuit Recommended for the USB Interface
Figure 3-8 Recommended circuit of USB interface

3.6 USIM Card Interface
3.6.1 Overview
The MU709 module provides a USIM card interface complying with the ISO 7816-3
standard and supports both Class B and Class C USIM cards.
Table 3-6 USIM card interface signals
PIN
No.

Pin Name

USIM_RESET

USIM_CLK

USIM_DATA

Pad
Type

I/O

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Description

External USIM
reset signal

External USIM
clock signal

External USIM
data signal

Parameter

Min. (V)

Typ.
(V)

Max. (V)

Comments

VOH

0.7 x
USIM_PWR

3.3

USIM_PWR=1.8
V or 3.0 V

VOL

0.2 x
USIM_PWR

VOH

0.7 x
USIM_PWR

3.3

VOL

0.2 x
USIM_PWR

VIH

0.7 x
USIM_PWR

3.3

VIL

0.2 x
USIM_PWR

VOH

0.65 x
USIM_PWR

3.3

VOL

0.25 x
USIM_PWR

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PIN
No.

Pin Name

Pad
Type

USIM_PWR

Description of the Application Interfaces

Description

Parameter

Min. (V)

Typ.
(V)

Max. (V)

Comments

Power source
for the
external USIM
card

–0.3

1.8

1.98

USIM_PWR=1.8
V

–0.3

3.0

3.3

USIM_PWR=3.0
V

3.6.2 Circuit Recommended for the USIM Card Interface
As the Mini PCIe Adapter is not equipped with a USIM socket, you need to place a
USIM socket on the user interface board. Figure 3-9 shows the circuit of the USIM
card interface.
Figure 3-9 Circuit of the USIM card interface



To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic
compatibility (EMC) authentication, the USIM socket should be placed near the
PCIe interface (it is recommended that the PCB circuit connects the PCIe interface
and the USIM socket does not exceed 100 mm), because a long circuit may lead to
wave distortion, thus affecting signal quality.



It is recommended that you wrap the area adjacent to the USIM_CLK and
USIM_DATA signal wires with ground. The Ground pin of the USIM socket and the
Ground pin of the USIM card must be well connected to the power Ground pin
supplying power to the PCIe Adapter.



A 100 nF capacitor and1 μF capacitor are placed between the USIM_PWR and
Ground pins in a parallel manner (If USIM_PWR circuit is too long, that the larger
capacitance such as 4.7 μF can be employed if necessary). Three 33 pF

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capacitors are placed between the USIM_DATA and Ground pins, the
USIM_RESET and Ground pins, and the USIM_CLK and Ground pins in parallel to
filter interference from RF signals.


It is recommended to take electrostatic discharge (ESD) protection measures near
the USIM card socket. The TVS diode with Vrwm of 5 V and junction capacitance
less than 10 pF must be placed as close as possible to the USIM socket, and the
Ground pin of the ESD protection component is well connected to the power
Ground pin that supplies power to the PCIe Adapter.

3.7 Audio Interface
3.7.1 Overview
The MU709 module provides one PCM digital audio interface. Table 3-7 lists the
signals on the digital audio interface.
Table 3-7 Signals on the digital audio interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

PCM_CLK

PCM clock

PCM_DOUT

PCM_DIN

PCM_SYNC

PCM I/F data output

PCM I/F data input

PCM interface sync

Min.(V)

Typ.(V)

Max.(V)

VOL

–0.3

0.45

VOH

1.35

1.8

2.1

VOL

–0.3

0.45

VOH

1.35

1.8

2.1

VIL

–0.3

0.63

VIH

1.17

1.8

2.1

VOL

–0.3

0.45

VOH

1.35

1.8

2.1

The MU709 module interface enables communication with an external codec to
support linear format.

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3.7.2 Circuit Recommended for the Audio Interface
Figure 3-10 Circuit diagram of the interface of the PCM (MU709 module is used as PCM
master)

Figure 3-11 Circuit diagram of the interface of the PCM (MU709 is used as PCM slave)

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

MU709 module supports both master and slave mode.



PCM_SYNC and PCM_CLK: Output when PCM is in master mode; Input when PCM is in
slave mode.



It is recommended that a TVS be used on the related interface, to prevent electrostatic
discharge and protect integrated circuit (IC) components.

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3.8 NC Pins
The MU709 module has some NC pins. All of NC pins should not be connected.
Please keep these pins open.
Table 3-8 NC pins
Pin No.

Pin
Name

Pad
Type

Description

Parameter

Min.(
V)

Typ.(
V)

Max.(
V)

3, 5–7, 11, 13, 16, 17,
19, 20, 23, 25, 28,
30–33, 44, 46 and 48

Not connected, please
keep open.

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RF Specifications

4.1 About This Chapter
This chapter describes the RF specifications of the MU709 module, including:


Operating Frequencies



Conducted RF Measurement



Conducted Rx Sensitivity and Tx Power



Antenna Design Requirements

4.2 Operating Frequencies
Table 4-1 and Table 4-2 show the RF bands supported by the MU709 module.
Table 4-1 RF bands of the MU709s-2 module
Operating Band

UMTS Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

UMTS Band 8

880 MHz–915 MHz

925 MHz–960 MHz

GSM 850

824 MHz–849 MHz

869 MHz–894 MHz

GSM 900

880 MHz–915 MHz

925 MHz–960 MHz

GSM 1800 (DCS)

1710 MHz–1785 MHz

1805 MHz–1880 MHz

GSM 1900 (PCS)

1850 MHz–1910 MHz

1930 MHz–1990 MHz

Table 4-2 RF bands of MU709s-6 module
Operating Band

UMTS Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

UMTS Band 2

1850 MHz–1910 MHz

1930 MHz–1990 MHz

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Operating Band

UMTS Band 5

824 MHz–849 MHz

869 MHz–894 MHz

GSM 850

824 MHz–849 MHz

869 MHz–894 MHz

GSM 900

880 MHz–915 MHz

925 MHz–960 MHz

GSM 1800 (DCS)

1710 MHz–1785 MHz

1805 MHz–1880 MHz

GSM 1900 (PCS)

1850 MHz–1910 MHz

1930 MHz–1990 MHz

4.3 Conducted RF Measurement
4.3.1 Test Environment
Test instrument

R&S CMU200

Power supply

KEITHLEY 2306

RF cable for testing

L08-C014-350 of DRAKA COMTEQ or Rosenberger
Cable length: 29 cm



The compensation for different frequency bands relates to the cable and the test
environment.



The instrument compensation needs to be set according to the actual cable conditions.

4.3.2 Test Standards
Huawei modules meet 3GPP test standards. Each module passes strict tests at the
factory and thus the quality of the modules is guaranteed.

4.4 Conducted Rx Sensitivity and Tx Power
4.4.1 Conducted Receive Sensitivity
The conducted receive sensitivity is a key parameter that indicates the receiver
performance of MU709 module. The conducted receive sensitivity refers to the
weakest signal that the module at the antenna port can receive. Table 4-3 and Table
4-4 list the typical tested values of the MU709 module.
Table 4-3 MU709s-2 module conducted Rx sensitivity
Band

Typical value (Unit:
dBm)

Note

GSM 850

–109.5

BER Class II < 2.44%

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Band

Typical value (Unit:
dBm)

Note

GSM 900

–109

BER Class II < 2.44%

GSM 1800 (DCS)

–108

BER Class II < 2.44%

GSM 1900 (PCS)

–108

BER Class II < 2.44%

WCDMA Band 1

–109

BER < 0.1%

WCDMA Band 8

–110

BER < 0.1%

Table 4-4 MU709s-6 module conducted Rx sensitivity
Band

Test Value (Unit: dBm)

Note

GSM 850

–109.5

BER Class II < 2.44%

GSM 900

–109

BER Class II < 2.44%

GSM 1800 (DCS)

–108

BER Class II < 2.44%

GSM 1900 (PCS)

–108

BER Class II < 2.44%

WCDMA Band 1

–109

BER < 0.1%

WCDMA Band 2

–110.5

BER < 0.1%

WCDMA Band 5

–111.5

BER < 0.1%

The test values are the average of some test samples.

4.4.2 Conducted Transmit Power
The conducted transmit power is another indicator that measures the performance of
MU709 module. The conducted transmit power refers to the maximum power that the
module tested at the antenna connector can transmit. According to the 3GPP protocol,
the required transmit power varies with the power class. Table 4-5 and Table 4-6 list
the typical tested values of the MU709 module.
Table 4-5 MU709s-2 module conducted Tx power
Band
GSM 850

GSM 900

GSM 1800

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Typical Value (Unit: dBm)

Note (Unit: dB)

GMSK(1Tx Slot)

±1.5

8PSK(1Tx Slot)

26.5

±2

GMSK(1Tx Slot)

±1.5

8PSK(1Tx Slot)

26.5

±2

GMSK(1Tx Slot)

±1.5

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Band

RF Specifications

Typical Value (Unit: dBm)

Note (Unit: dB)

(DCS)

8PSK(1Tx Slot)

±2

GSM 1900
(PCS)

GMSK(1Tx Slot)

±1.5

8PSK(1Tx Slot)

±2

WCDMA Band 1

±1

WCDMA Band 8

-1.5/+1

Table 4-6 MU709s-6 module conducted Tx power
Band

Typical Value (Unit: dBm)

Note (Unit: dB)

GMSK(1Tx Slot)

±1.5

8PSK(1Tx Slot)

26.5

±2

GMSK(1Tx Slot)

±1.5

8PSK(1Tx Slot)

26.5

±2

GSM 1800
(DCS)

GMSK(1Tx Slot)

±1.5

8PSK(1Tx Slot)

±2

GSM 1900
(PCS)

GMSK(1Tx Slot)

±1.5

8PSK(1Tx Slot)

±2

WCDMA Band 1

±1

WCDMA Band 2

±1

WCDMA Band 5

-1.5/+1

GSM 850

GSM 900

4.5 Antenna Design Requirements
4.5.1 Antenna Design Indicators
Antenna Efficiency
Antenna efficiency is the ratio of the input power to the radiated or received power of
an antenna. The radiated power of an antenna is always lower than the input power
due to the following antenna losses: return loss, material loss, and coupling loss. The
efficiency of an antenna relates to its electrical dimensions. To be specific, the
antenna efficiency increases with the electrical dimensions. In addition, the
transmission cable from the antenna connector of PCIe Adapter to the antenna is also
part of the antenna. The cable loss increases with the cable length and the frequency.

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It is recommended that the cable loss is as low as possible, for example, U.FL-LP-088
made by HRS.
The following antenna efficiency (free space) is recommended for MU709 module to
ensure high radio performance of the module:


Efficiency of the primary antenna: ≥ 40% (below 960 MHz); ≥ 50% (over 1710
MHz)



Efficiency of the diversity antenna: ≥ half of the efficiency of the primary
antenna in receiving band

In addition, the efficiency should be tested with the transmission cable.

S11 or VSWR
S11 indicates the degree to which the input impedance of an antenna matches the
reference impedance (50 Ω). S11 shows the resonance feature and impedance
bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression
of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector
analyzer.
The following S11 value is recommended for the antenna of MU709 module:


S11 of the primary antenna: ≤ –6 dB



S11 of the diversity antenna: ≤ –6 dB

In addition, S11 is less important than the efficiency, and S11 has weak correlation to
wireless performance.

Isolation
For a wireless device with multiple antennas, the power of different antennas is
coupled with each other. Antenna isolation is used to measure the power coupling.
The power radiated by an antenna might be received by an adjacent antenna, which
decreases the antenna radiation efficiency and affects the running of other devices. To
avoid this problem, evaluate the antenna isolation as sufficiently as possible at the
early stage of antenna design.
Antenna isolation depends on the following factors:


Distance between antennas



Antenna type



Antenna direction

The primary antenna must be placed as near as possible to the MU709 module to
minimize the cable length. The diversity antenna needs to be installed
perpendicularly to the primary antenna. The diversity antenna can be placed farther
away from the MU709 module. Antenna isolation can be measured with a two-port
vector network analyzer.
The following antenna isolation is recommended for the antennas on laptops:


Isolation between the primary and diversity antennas: ≤ –12 dB



Isolation between the primary antenna and the Wi-Fi antenna: ≤ –15 dB

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Polarization
The polarization of an antenna is the orientation of the electric field vector that rotates
with time in the direction of maximum radiation.
The linear polarization is recommended for the antenna of MU709 module.

Radiation Pattern
The radiation pattern of an antenna reflects the radiation features of the antenna in the
remote field region. The radiation pattern of an antenna commonly describes the
power or field strength of the radiated electromagnetic waves in various directions
from the antenna. The power or field strength varies with the angular coordinates (θ
and φ), but is independent of the radial coordinates.
The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal
plane, and the incident waves of base stations are often in the horizontal plane. For
this reason, the receiving performance is optimal.
The following radiation patterns are recommended for the antenna of MU709 module.
Primary/Diversity antenna: omnidirectional
In addition, the diversity antenna's pattern should be complementary with the
primary's.

Envelope Correlation Coefficient
The envelope correlation coefficient indicates the correlation between different
antennas in a multi-antenna system (primary antenna, diversity antenna, and MIMO
antenna). The correlation coefficient shows the similarity of radiation patterns, that is,
amplitude and phase, of the antennas. The ideal correlation coefficient of a diversity
antenna system or a MIMO antenna system is 0. A small value of the envelope
correlation coefficient between the primary antenna and the diversity antenna
indicates a high diversity gain. The envelope correlation coefficient depends on the
following factors:


Distance between antennas



Antenna type



Antenna direction

The antenna correlation coefficient differs from the antenna isolation. Sufficient
antenna isolation does not represent a satisfactory correlation coefficient. For this
reason, the two indicators need to be evaluated separately.
For the antennas on laptops, the recommended envelope correlation coefficient
between the primary antenna and the diversity antenna is smaller than 0.5.

Gain and Directivity
The radiation pattern of an antenna represents the field strength of the radiated
electromagnetic waves in all directions, but not the power density that the antenna
radiates in the specific direction. The directivity of an antenna, however, measures the
power density that the antenna radiates.

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Gain, as another important parameter of antennas, correlates closely to the directivity.
The gain of an antenna takes both the directivity and the efficiency of the antenna into
account. The appropriate antenna gain prolongs the service life of relevant batteries.
The following antenna gain is recommended for MU709 module. Gain of the
primary/diversity antenna ≤ 2.5 dBi


The antenna consists of the antenna body and the relevant RF transmission cable. Take the
RF transmission cable into account when measuring any of the preceding antenna
indicators.



Huawei cooperates with various famous antenna suppliers who are able to make
suggestions on antenna design, for example, Amphenol, Skycross, etc.

4.5.2 Interference
Besides the antenna performance, the interference on the user board also affects the
radio performance (especially the TIS) of the module. To guarantee high performance
of the module, the interference sources on the user board must be properly controlled.
On the user board, there are various interference sources, such as the LCD, CPU,
audio circuits, and power supply. All the interference sources emit interference signals
that affect the normal operation of the module. For example, the module sensitivity
can be decreased due to interference signals. Therefore, during the design, you need
to consider how to reduce the effects of interference sources on the module. You can
take the following measures: Use a LCD with optimized performance; shield the LCD
interference signals; shield the signal cable of the board; or design filter circuits.
Huawei is able to make technical suggestions on radio performance improvement of
the module.

4.5.3 Antenna Requirements
The antenna for MU709 module must fulfill the following requirements:
Table 4-7 MU709s-2 module antenna requirements
Antenna Requirements
Frequency range

Depending on frequency band(s) provided by the network
operator, the customer must use the most suitable
antenna for that/those band(s)

Bandwidth of primary
antenna

70 MHz in GSM 850
80 MHz in GSM 900
170 MHz in GSM 1800
140 MHz in GSM 1900
80 MHz in WCDMA Band 8
250 MHz in WCDMA Band 1

Bandwidth of
secondary antenna

35 MHz in WCDMA Band 8

Gain

≤ 2.5 dBi

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60 MHz in WCDMA Band 1

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Antenna Requirements
Impedance

50 Ω

VSWR absolute max

≤ 3:1

VSWR recommended

≤ 2:1

Table 4-8 MU709s-6 module antenna requirements
Antenna Requirements
Frequency range

Depending on frequency band(s) provided by the network
operator, the customer must use the most suitable
antenna for that/those band(s)

Bandwidth of primary
antenna

70 MHz in GSM 850
80 MHz in GSM 900
170 MHz in GSM 1800
140 MHz in GSM 1900
70 MHZ in WCDMA Band 5
140 MHz in WCDMA Band 2
250 MHz in WCDMA Band 1

Bandwidth of
secondary antenna

25 MHz in WCDMA Band 5
60 MHz in WCDMA Band 2
60 MHz in WCDMA Band 1

Gain

≤ 2.5 dBi

Impedance

50 Ω

VSWR absolute max

≤ 3:1

VSWR recommended

≤ 2:1

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Electrical and Reliability Features

5.1 About This Chapter
This chapter describes the electrical and reliability features of the interfaces in the
MU709 module, including:


Absolute Ratings



Operating and Storage Temperatures



Power Supply Features



Reliability Features



EMC and ESD Features

5.2 Absolute Ratings

Table 5-1 lists the absolute ratings for the MU709 module. Using the module beyond
these conditions may result in permanent damage to the module.
Table 5-1 Absolute ratings for the MU709 module
Symbol

Specification

Min.

Max.

Unit

VCC_3V3

External power voltage

–0.3

4.0

Digital input voltage

–0.3

2.1

5.3 Operating and Storage Temperatures
Table 5-2 lists the operating and storage temperatures for the MU709 module.

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Table 5-2 Operating and storage temperatures for the MU709 module
Specification

Min.

Max.

Unit

Normal working temperatures

–20

+70

°C

Extended temperatures

–30

+75

°C

Ambient temperature for storage

–40

+85

°C



[1]: When the ME909s LGA module works in the range from –30°C to –20°C or +70°C to
+75°C, NOT all their RF performances comply with 3GPP specifications.



5.4 Power Supply Features
5.4.1 Input Power Supply
Table 5-3 Requirements for input power for the MU709 module
Parameter

Min.

Typ.

Max.

Ripple

Unit

VCC_3V3

3.0

3.3

3.6

0.05

Figure 5-1 Power Supply During Burst Emission

The VCC_3V3 minimum value must be guaranteed during the burst (with 2.7 A Peak in GSM 2
slot mode). So a low-dropout (LDO) regulator or switch power with current output of more than
3.5 A is strongly recommended for external power supply.

Table 5-4 Requirements for input current of the MU709 module
Power

Module

Peak (GSM 2 slot)

Normal (WCDMA)

VCC_3V3

MU709

2750 mA

1100 mA

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5.4.2 Power Consumption
The power consumptions of MU709 module in different scenarios are respectively
listed in Table 5-5 to Table 5-8 .
The power consumption listed in this section is tested when the power supply of the
MU709 module is 3.3 V, and all of test values are measured at room temperature.
Table 5-5 Averaged standby DC power consumption of MU709 module
Description

Bands

Test Value (Unit: mA)

Notes/Configuration

Typical
Sleep

HSPA+/WCDMA

UMTS bands

3.1

Module is powered up.
DRX cycle=7 (1.28s)
Module is registered on the
network.
USB is in suspend.

GPRS/EDGE

GSM bands

2.8

Module is powered up.
MFRMS=5 (1.175s)
Module is registered on the
network.
USB is in suspend.

Radio Off

All bands

1.6

Module is powered up.
RF is disabled
USB is in suspend.

Idle

HSPA+/WCDMA

UMTS bands

Module is powered up.
DRX cycle=7 (1.28s)
Module is registered on the
network, no data is transmitted.
USB is in active.

GPRS/EDGE

GSM bands

Module is powered up.
MFRMS=5 (1.175s)
Module is registered on the
network, no data is transmitted.
USB is in active.

Radio Off

All bands

Module is powered up.
RF is disabled.
USB is in active.

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Table 5-6 Averaged data transmission DC power consumption of MU709s-2 module
(HSPA/WCDMA)
Description

Band

Test Value (Unit: mA)

Power

Typical
WCDMA

HSPA

Band 1

250

0 dBm Tx Power

(IMT2100)

320

10 dBm Tx Power

720

23.5 dBm Tx Power

Band 8

250

0 dBm Tx Power

(900 MHz)

320

10 dBm Tx Power

720

23.5dBm Tx Power

Band 1

270

0 dBm Tx Power

(IMT2100)

340

10 dBm Tx Power

720

23.5 dBm Tx Power

Band 8

270

0 dBm Tx Power

(900 MHz)

360

10 dBm Tx Power

740

23.5 dBm Tx Power

Table 5-7 Averaged data transmission DC power consumption of MU709s-6 module
(HSPA/WCDMA)
Description

Band

Test Value (Unit: mA)

Power (dBm)

WCDMA

Band 1

192

0 dBm Tx Power

(IMT 2100)

237

10 dBm Tx Power

652

23.5 dBm Tx Power

Band 2

191

0 dBm Tx Power

(1900 MHz)

245

10 dBm Tx Power

688

23.5 dBm Tx Power

Band 5

182

0 dBm Tx Power

(850 MHz)

219

10 dBm Tx Power

562

23.5 dBm Tx Power

Band 1

202

0 dBm Tx Power

(IMT 2100)

255

10 dBm Tx Power

629

23.5 dBm Tx Power

HSPA

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Electrical and Reliability Features

Band

Test Value (Unit: mA)

Power (dBm)

Band 2

210

0 dBm Tx Power

(1900 MHz)

274

10 dBm Tx Power

703

23.5 dBm Tx Power

Band 5

197

0 dBm Tx Power

(850 MHz)

234

10 dBm Tx Power

552

23.5 dBm Tx Power

Table 5-8 Averaged data transmission DC power consumption of MU709 module
(GPRS/EDGE)
Description

Test Value (Unit: mA)

PCL

Configuration

1 Up/1 Down

Typical
GPRS 850

250
370

2 Up/1 Down

510

4 Up/1 Down

120

GPRS 900

2 Up/1 Down

330

4 Up/1 Down

250

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1 Up/1 Down

370

2 Up/1 Down

520

4 Up/1 Down
10

1 Up/1 Down

200

2 Up/1 Down

330

4 Up/1 Down

200

1 Up/1 Down

280

2 Up/1 Down

400

4 Up/1 Down

GPRS 1900

1 Up/1 Down

200

120

GPRS 1800

1 Up/1 Down

115

2 Up/1 Down

160

4 Up/1 Down

190

Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.

1 Up/1 Down

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Description

Test Value (Unit: mA)

Electrical and Reliability Features

PCL

Configuration

Typical
260

2 Up/1 Down

370

4 Up/1 Down

EDGE 850

2 Up/1 Down

160

4 Up/1 Down

190

490

4 Up/1 Down
15

1 Up/1 Down

145

2 Up/1 Down

235

4 Up/1 Down

190

1 Up/1 Down

290

2 Up/1 Down

490

4 Up/1 Down
15

1 Up/1 Down

150

2 Up/1 Down

240

4 Up/1 Down

160

1 Up/1 Down

255

2 Up/1 Down

415

4 Up/1 Down
10

1 Up/1 Down

140

2 Up/1 Down

220

4 Up/1 Down

160

1 Up/1 Down

255

2 Up/1 Down

415

4 Up/1 Down

100

Issue 04 (2015-06-25)

1 Up/1 Down
2 Up/1 Down

100

EDGE 1900

290

100

EDGE 1800

1 Up/1 Down

110

100

EDGE 900

1 Up/1 Down

140

2 Up/1 Down

220

4 Up/1 Down

Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Electrical and Reliability Features



All power consumption test configuration can be referenced by GSM Association Official
Document TS.09: Battery Life Measurement and Current Consumption Technique.



Test condition: For Max. Tx. power, see 4.4.2 Conducted Transmit Power, which are listed in
Table 4-5 ; for Max. data throughput, see 2.2 Function Overview, which are listed in Table
2-1 .

5.5 Reliability Features
Table 5-9 lists the test conditions and results of the reliability of the MU709 module.
Table 5-9 Test conditions and results of the reliability of the MU709 module
Item
Stress

Low-temperature
storage

High-temperature
storage

Low-temperature
operating

High-temperature
operating

Damp heat
cycling

Issue 04 (2015-06-25)

Test Condition

Standard

Sample size

Results



Temperature: –40ºC

3 pcs/group

Visual inspection: ok



Operation mode: no
power, no package

JESD22A119-C



Test duration: 24 h



Temperature: 85ºC



Operation mode: no
power, no package



Test duration: 24 h



Temperature: –30ºC



Operation mode:
working with service
connected



Test duration: 24 h



Temperature: 70ºC



Operation mode:
working with service
connected



Test duration: 24 h



High temperature:
55ºC



Low temperature:
25ºC



Humidity: 95%±3%



Operation mode:
working with service
connected



Test duration: 6
cycles; 12 h+12
h/cycle

Function test: ok
RF specification: ok

JESD22A103-C

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

IEC60068
-2-1

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A108-C

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A101-B

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide
Item
Thermal shock

Salty fog test

Electrical and Reliability Features

Test Condition

Standard

Sample size

Results



Low temperature:
–40ºC

JESD22A106-B

3 pcs/group

Visual inspection: ok



High temperature:
85ºC



Temperature change
interval: < 20s



Operation mode: no
power



Test duration: 100
cycles; 15 Min+15
Min/cycle



Temperature: 35°C



Density of the NaCl
solution: 5%±1%



Operation mode: no
power, no package



Test duration:

Function test: ok
RF specification: ok

JESD22A107-B

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

Spraying interval: 8 h
Exposing period after
removing the salty fog
environment: 16 h
Sine vibration

Shock test

Issue 04 (2015-06-25)



Frequency range: 5 Hz
to 200 Hz



Acceleration: 1 Grms



Frequency scan rate:
0.5oct/min



Operation mode:
working with service
connected



Test duration: 3 axial
directions. 2 h for each
axial direction



Half-sine wave shock



Peak acceleration: 30
Grms



Shock duration: 11 ms



Operation mode:
working with service
connected



Test duration: 6 axial
directions. 3 shocks
for each axial
direction.

JESD22B103-B

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD-B1
04-C

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide
Item
Drop test

Life

High temperature
operating life

High temperature
& high humidity

Temperature
cycle

ESD

HBM (Human
Body Model)

Issue 04 (2015-06-25)

Electrical and Reliability Features

Test Condition

Standard

Sample size

Results



IEC60068
-2-32

3 pcs/group

Visual inspection: ok

0.8 m in height. Drop
the module on the
marble terrace with
one surface facing
downwards. Six
surfaces should be
tested.



Operation mode: no
power, no package



Temperature: 70ºC



Operation mode:
working with service
connected

Function test: ok
RF specification: ok

JESD22A108-B

50 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok



Test duration: 168 h,
336 h, 500 h for
inspection point



High temperature:
85ºC



Humidity: 85%

RF specification: ok



Operation mode:
powered on and no
working

Cross section: ok



Test duration: 168 h,
336 h, 500 h for
inspection point



High temperature:
85ºC



Low temperature:
–40ºC

RF specification:
ok



Temperature change
slope: 6ºC/min

Cross section: ok



Operation mode: no
power



Test duration: 168 h,
336 h, 500 h for
inspection point



2 kV (Class 1B)



Operation mode: no
power

JESD22A110-B

JESD22A104-C

JESD22A114-D

50 pcs/group

Visual inspection: ok
Function test: ok

50 pcs/group

Visual inspection: ok
Function test: ok

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide
Item
ESD with DVK (or
embedded in the
host)

Electrical and Reliability Features

Test Condition

Standard

Sample size

Results



IEC61000
-4-2

2 pcs

Visual inspection: ok

Contact and Air
discharges: 10
positive and 10
negative applied



Contact Voltage: ±2
kV, ±4 kV



Air Voltage : ±2 kV, ±4
kV, ±8 kV



Operation mode:
working with service
connected

Function test: ok
RF specification: ok

Groups ≥ 2

5.6 EMC and ESD Features
The following are the EMC design comments:


Attention should be paid to static control in the manufacture, assembly, packaging,
handling, storage process to reduce electrostatic damage to HUAWEI module.



RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if
the antenna port is protected by TVS (Transient Voltage Suppressor), which is
resolved by making some adjustment on RF match circuit.



TVS should be added on the USB port for ESD protection, and the parasitic
capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode
inductor should be added in parallel on D+/D- signal.



TVS should be added on the USIM interface for ESD protection. The parasitic
capacitance of TVS on USIM signal should be less than 10 pF.



Resistors in parallel and a 10 nF capacitor should be added on RESIN_N signal
to avoid shaking, and the distance between the capacitor and the related pin
should be less than 100 mil.



PCB routing should be V-type rather than T-type for TVS.



An integrated ground plane is necessary for EMC design.

The following are the requirements of ESD environment control:


The electrostatic discharge protected area (EPA) must have an ESD floor whose
surface resistance and system resistance are greater than 1 x 104 Ω while less
than 1 x 109 Ω.



The EPA must have a sound ground system without loose ground wires, and the
ground resistance must be less than 4 Ω.



The workbench for handling ESD sensitive components must be equipped with
common ground points, the wrist strap jack, and ESD pad. The resistance
between the jack and common ground point must be less than 4 Ω. The surface
resistance and system resistance of the ESD pad must be less than 1 x 109 Ω.

Issue 04 (2015-06-25)

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Electrical and Reliability Features



The EPA must use the ESD two-circuit wrist strap, and the wrist strap must be
connected to the dedicated jack. The crocodile clip must not be connected to the
ground.



The ESD sensitive components, the processing equipment, test equipment, tools,
and devices must be connected to the ground properly. The indexes are as
follows:
−

Hard ground resistance < 4 Ω

−

1 x 105 Ω ≤ Soft ground resistance < 1 x 109 Ω

−

1 x 105 Ω ≤ ICT fixture soft ground resistance < 1 x 1011 Ω

−

The electronic screwdriver and electronic soldering iron can be easily oxidized.
Their ground resistance must be less than 20 Ω.



The parts of the equipment, devices, and tools that touch the ESD sensitive
components and moving parts that are close to the ESD sensitive components
must be made of ESD materials and have sound ground connection. The parts
that are not made of ESD materials must be handled with ESD treatment, such
as painting the ESD coating or ionization treatment (check that the friction voltage
is less than 100 V).



Key parts in the production equipment (parts that touch the ESD sensitive
components or parts that are within 30 cm away from the ESD sensitive
components), including the conveyor belt, conveyor chain, guide wheel, and SMT
nozzle, must all be made of ESD materials and be connected to the ground
properly (check that the friction voltage is less than 100 V).



Engineers that touch IC chips, boards, modules, and other ESD sensitive
components and assemblies must wear ESD wrist straps, ESD gloves, or ESD
finger cots properly. Engineers that sit when handling the components must all
wear ESD wrist straps.



Noticeable ESD warning signs must be attached to the packages and placement
areas of ESD sensitive components and assemblies.



Boards and IC chips must not be stacked randomly or be placed with other ESD
components.



Effective shielding measures must be taken on the ESD sensitive materials that
are transported or stored outside the EPA.
HUAWEI MU709 module does not include any protection against overvoltage.

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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Mechanical Specifications

6.1 About This Chapter
This chapter mainly describes mechanical specifications of MU709 module, including:


Dimensions and Interfaces



Dimensions of the Mini PCI Express Connector



Packaging



Specification Selection for Fasteners



Antenna Plug



Thermal Design Guide

6.2 Dimensions and Interfaces
The dimensions (L × W × H) of the MU709 module is 51 mm × 30.4 mm × 3.27 mm.
Figure 6-1 shows the dimensions of MU709 module in detail.

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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Mechanical Specifications

Figure 6-1 Dimensions of the MU709 module (Unit: mm)

6.3 Dimensions of the Mini PCI Express Connector
The Mini PCIe Adapter adopts a standard Mini PCI Express connector that has 52
pins and complies with the PCI Express Mini Card Electromechanical Specification
Revision 2.0.
Figure 6-2 shows a 52-pin Mini PCI Express connector (take the Molex 67910002 as
an example).

Issue 04 (2015-06-25)

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Mechanical Specifications

Figure 6-2 Dimensions of the Mini PCI Express connector (Unit: mm)

6.4 Packaging
HUAWEI Mini PCIe module uses anti-vibration foam and ESD bag into cartons.

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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Mechanical Specifications

6.5 Specification Selection for Fasteners
6.5.1 Installing the Mini PCIe Adapter on the Main Board
To install the Mini PCIe Adapter on the main board, do the following:
Step 1 Insert the Mini PCIe Adapter into the Mini PCI Express connector on the main board.

Issue 04 (2015-06-25)

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Mechanical Specifications

Step 2 Press downwards to fix the Mini PCIe Adapter in the module slot.

Step 3 Use a screwdriver to fix the Mini PCIe Adapter on the main board with two screws
provided in the Mini PCIe Adapter packing box.

Step 4 Insert the connector of the main antenna into the MAIN antenna interface (M) of the
Mini PCIe Adapter according to the indication on the label of the Mini PCIe Adapter.
Insert the connector of the auxiliary antenna into the AUX antenna interface (A) of the
Mini PCIe Adapter of the Mini PCIe Adapter in the same way.

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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Mechanical Specifications



Insert the antenna connectors vertically into the antenna interfaces of the Mini PCIe
Adapter.



Do not press or squeeze the antenna cable or damage the connectors. Otherwise, the
wireless performance of the Mini PCIe Adapter may be reduced or the Mini PCIe Adapter
cannot work normally.



Ensure that the antenna cables are routed through the channel in the frame of the PC and
do not lay the cables across the raised edges of the frame.



The module could not be installed or removed when the host is powered on. Otherwise, it
may result in permanent damage to the module.

6.5.2 Romoving the Mini PCIe Adapter from the Main Board
Step 1 Disconnect the antenna cables from the Mini PCIe Adapter. You can lift the
connectors using a small screwdriver.

Step 2 Remove the two screws with the screwdriver.

Issue 04 (2015-06-25)

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Mechanical Specifications

Step 3 Slide backwards the two clips to release the Mini PCIe Adapter from the slot. Then, lift
up the Mini PCIe Adapter.

6.6 Antenna Plug
Figure 6-3 Mating the plug

Align the mating tool or the mating end of the tool over the plug end of the cable
assembly.

Firmly place the tool over the plug until it is secured in the tool.

Issue 04 (2015-06-25)

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Mechanical Specifications

Place the plug cable assembly (held in the tool) over the corresponding
receptacle.

Assure that the plug and receptacle are aligned press-down perpendicular to the
mounting surface until both connectors are fully mated.

Remove the mating tool by pulling it up carefully.

Figure 6-4 Unmating the plug



The extraction tool is recommended.



Any attempt of unmating by pulling on the cable may result in damage and influence the
mechanical/electrical performance.

It is recommended not to apply any pull forces after the bending of the cable, as
described in Figure 6-5 .
Figure 6-5 Do not apply any pull forces after the bending of the cable

6.7 Thermal Design Guide
When using in the network, the MU709 module (Mini PCIe) have high power
consumption. To improve the module reliability and stability, focus on the thermal
design of the device to speed up heat dissipation.
Take the following heat dissipation measures:


Do not hollow out the customer PCB.



Attach the thermal conductive material between the Mini PCIe and the customer
PCB. The recommended thermal conductivity of the thermal conductive material
is 1.0 W/m-k or higher (recommended manufacturers: Laird and Bergquist). The

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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Mechanical Specifications

dimensions (W x D) of the thermal conductive material are 38 mm x 28 mm (1.50
in. x 1.10 in.), and its height depends on the height of the Mini PCIe connector
you use and the method for installing the Mini PCIe. When deciding the height of
the thermal conductive material, you are advised to obey the following rule: After
the Mini PCIe is fastened to the customer PCB, the compression amount of the
thermal conductive material accounts for 15% to 30% of the thermal conductive
material size. For example, if you use a connector shown in the following figure
and install the Mini PCIe like this, the recommended height of the thermal
conductive material is 1.8 mm (0.07 in.).

Mini PCIe

Thermal Conductive Material

Customer PCB



On the customer PCB, reserve two metal screw holes, which are connected to
the PCB ground plane. When installing the Mini PCIe, use two metal screws to
fasten the Mini PCIe to the customer PCB. See the following figure.
Screw

Mini PCIe

Thermal Conductive Material
Customer PCB



Ensure that the air flow around the Mini PCIe is sufficient.



Try not to place any component in the Mini PCIe's projection region on the
customer PCB. Do not place components with 1.5 W or higher power
consumption or heat sensitive components (such as crystals) near the Mini PCIe.



Use a large customer PCB. The recommended size (W x D) is 70 mm x 70 mm
(2.76 in. x 2.76 in.).



If the thermal conductive material is attached between the Mini PCIe and the
customer PCB, then the heat dissipation performance will be better for multilayer
PCB.



Apply copper to the region for attaching the thermal conductive material to the
customer PCB. Try to use the continuous ground plane design on the customer
PCB, and each ground plane must be connected through holes. Therefore,
reserve holes as many as possible.

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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Mechanical Specifications

If you do not take the preceding heat dissipation measures, the overheat protection mechanism
is triggered due to overheated Mini PCIe and the network connection is terminated when the
Mini PCIe keeps working in enclosed space with a 70ºC temperature and a big current for a
period of time. You can resume the network connection only after the temperature drops.

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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Certifications

7.1 About This Chapter
This chapter gives a general description of certifications of MU709 module.

7.2 Certifications
Table 7-1 shows certifications of the MU709 module have been implemented. For more
demands, please contact us for more details about this information.

Table 7-1 Product Certifications
Certification

Model name
MU709s-2

MU709s-6

√

CCC

√

FCC

√

Anetel

√

RoHS

√

WEEE

√

NAL

√

SRRC

√

REACH

√

RCM

√

NCC

√

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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Safety Information

Read the safety information carefully to ensure the correct and safe use of your
wireless device. Applicable safety information must be observed.

8.1 Interference
Power off your wireless device if using the device is prohibited. Do not use the
wireless device when it causes danger or interference with electric devices.

8.2 Medical Device


Power off your wireless device and follow the rules and regulations set forth by
the hospitals and health care facilities.



Some wireless devices may affect the performance of the hearing aids. For any
such problems, consult your service provider.



Pacemaker manufacturers recommend that a minimum distance of 15 cm be
maintained between the wireless device and a pacemaker to prevent potential
interference with the pacemaker. If you are using an electronic medical device,
consult the doctor or device manufacturer to confirm whether the radio wave
affects the operation of this device.

8.3 Area with Inflammables and Explosives
To prevent explosions and fires in areas that are stored with inflammable and
explosive devices, power off your wireless device and observe the rules. Areas stored
with inflammables and explosives include but are not limited to the following:


Gas station



Fuel depot (such as the bunk below the deck of a ship)



Container/Vehicle for storing or transporting fuels or chemical products



Area where the air contains chemical substances and particles (such as granule,
dust, or metal powder)



Area indicated with the "Explosives" sign

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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Safety Information



Area indicated with the "Power off bi-direction wireless equipment" sign



Area where you are generally suggested to stop the engine of a vehicle

8.4 Traffic Security


Observe local laws and regulations while using the wireless device. To prevent
accidents, do not use your wireless device while driving.



RF signals may affect electronic systems of motor vehicles. For more information,
consult the vehicle manufacturer.



In a motor vehicle, do not place the wireless device over the air bag or in the air
bag deployment area. Otherwise, the wireless device may hurt you owing to the
strong force when the air bag inflates.

8.5 Airline Security
Observe the rules and regulations of airline companies. When boarding or
approaching a plane, power off your wireless device. Otherwise, the radio signal of
the wireless device may interfere with the plane control signals.

8.6 Safety of Children
Do not allow children to use the wireless device without guidance. Small and sharp
components of the wireless device may cause danger to children or cause suffocation
if children swallow the components.

8.7 Environment Protection
Observe the local regulations regarding the disposal of your packaging materials,
used wireless device and accessories, and promote their recycling.

8.8 WEEE Approval
The wireless device is in compliance with the essential requirements and other
relevant provisions of the Waste Electrical and Electronic Equipment Directive
2012/19/EU (WEEE Directive).

8.9 RoHS Approval
The wireless device is in compliance with the restriction of the use of certain
hazardous substances in electrical and electronic equipment Directive 2011/65/EU
(RoHS Directive).

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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Safety Information

8.10 Laws and Regulations Observance
Observe laws and regulations when using your wireless device. Respect the privacy
and legal rights of the others.

8.11 Care and Maintenance
It is normal that your wireless device gets hot when you use or charge it. Before you
clean or maintain the wireless device, stop all applications and power off the wireless
device.


Use your wireless device and accessories with care and in clean environment.
Keep the wireless device from a fire or a lit cigarette.



Protect your wireless device and accessories from water and vapour and keep
them dry.



Do not drop, throw or bend your wireless device.



Clean your wireless device with a piece of damp and soft antistatic cloth. Do not
use any chemical agents (such as alcohol and benzene), chemical detergent, or
powder to clean it.



Do not leave your wireless device and accessories in a place with a considerably
low or high temperature.



Use only accessories of the wireless device approved by the manufacture.
Contact the authorized service center for any abnormity of the wireless device or
accessories.



Do not dismantle the wireless device or accessories. Otherwise, the wireless
device and accessories are not covered by the warranty.



The device should be installed and operated with a minimum distance of 20 cm
between the radiator and your body.

8.12 Emergency Call
This wireless device functions through receiving and transmitting radio signals.
Therefore, the connection cannot be guaranteed in all conditions. In an emergency,
you should not rely solely on the wireless device for essential communications.

8.13 Regulatory Information
The following approvals and notices apply in specific regions as noted.

8.13.1 CE Approval (European Union)
The wireless device is approved to be used in the member states of the EU. The
wireless device is in compliance with the essential requirements and other relevant
provisions of the Radio and Telecommunications Terminal Equipment Directive
1999/5/EC (R&TTE Directive).

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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Safety Information

8.13.2 FCC Statement
Federal Communications Commission Notice (United States): Before a wireless
device model is available for sale to the public, it must be tested and certified to the
FCC that it does not exceed the limit established by the government-adopted
requirement for safe exposure.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
Warning: Changes or modifications made to this equipment not expressly approved
by HUAWEI may void the FCC authorization to operate this equipment.

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HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

Appendix A Circuit of Typical Interface

C3
150uF

C5
150uF

150uF

10K

VCC From Host

VCC _3 V3

P C M _C LK
P C M _DOU T
P C M _DIN
P C M _S YN C

VCC_3V3
G ND 1
NC
USIM_PW R
USIM_DATA
USIM_CLK
USIM_RESE T
NC
G ND 4
NC
NC
VCC_3V3
G ND 6
NC
NC
NC
G ND 9
USB _DM
USB _DP
G ND 12
LED_WW AN#
NC
NC
NC
G ND 14
VCC_3V3

W AK E#
NC
NC
NC
G ND 2
NC
NC
G ND 3
NC
NC
G ND 5
NC
NC
G ND 7
G ND 8
NC
NC
G ND 10
GND11
VCC_3V3
VCC_3V3
GND13
P C M _C LK
P C M _DOU T
P C M _DIN
P C M _S YN C

VCC _3 V3

2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52

USB _DM
USIM _P W R
USIM _DA TA
USIM _C LK
USIM _R ES ET

DN I,R eserve for
US B eye d ebug

1.8pF

1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51

to US B 2.0 interfac e
DN I

Wake the host
Open drain,active low

USB _DP

VCC _3 V3

USB _DM
USB _DP
LE D_WW AN
D1

Note the sign al d irec ti on o f P C M _DOU T,P C M _DIN

470

VCC _3 V3

100nF

10pF

J2
10

Don't support Hot Plug.
USIM _P W R

USIM _R ES ET

USIM _C LK
USIM _DA TA

R5
R6

0
0

GN D

33pF

Issue 04 (2015-06-25)

C 12

C 11

C 10

GN D

1uF

S2
CD

6
VP P
3
CLK
7
I/ O
11

1
VCC
5
G ND
2
RST

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

9BAppendix B Acronyms and
Abbreviations

Appendix B Acronyms and
Abbreviations

Acronym or Abbreviation

Expansion

3GPP

Third Generation Partnership Project

AUX

Auxiliary

CCC

China Compulsory Certification

European Conformity

Direct Current

EDGE

Enhanced Data Rate for GSM Evolution

EMC

Electromagnetic Compatibility

ESD

Electrostatic Discharge

European Union

FCC

Federal Communications Commission

GPIO

General-purpose I/O

GPRS

General Packet Radio Service

GSM

Global System for Mobile Communication

HSDPA

High-Speed Downlink Packet Access

HSPA

High Speed Packet Access

HSUPA

High Speed Up-link Packet Access

ISO

International Standards Organization

LDO

Low-Dropout

LED

Light-Emitting Diode

Open Collector

Issue 04 (2015-06-25)

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide

9BAppendix B Acronyms and
Abbreviations

Acronym or Abbreviation

Expansion

PCB

Printed Circuit Board

Radio Frequency

RoHS

Restriction of the Use of Certain Hazardous
Substances

TVS

Transient Voltage Suppressor

UMTS

Universal Mobile Telecommunications System

USB

Universal Serial Bus

USIM

Universal Subscriber Identity Module

VSWR

Voltage Standing Wave Ratio

WCDMA

Wideband Code Division Multiple Access

WEEE

Waste Electrical and Electronic Equipment

Issue 04 (2015-06-25)

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