Huawei MU709 Series HSPA Mini PCIe Module Hardware Guide (V100R001 04, English)
2015-07-02
User Manual: Huawei
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HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Issue 04 Date 2015-06-25 Copyright © Huawei Technologies Co., Ltd. 2015. All rights reserved. No part of this manual may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd. and its affiliates ("Huawei"). The product described in this manual may include copyrighted software of Huawei and possible licensors. Customers shall not in any manner reproduce, distribute, modify, decompile, disassemble, decrypt, extract, reverse engineer, lease, assign, or sublicense the said software, unless such restrictions are prohibited by applicable laws or such actions are approved by respective copyright holders. Trademarks and Permissions , , and are trademarks or registered trademarks of Huawei Technologies Co., Ltd. Other trademarks, product, service and company names mentioned may be the property of their respective owners. Notice Some features of the product and its accessories described herein rely on the software installed, capacities and settings of local network, and therefore may not be activated or may be limited by local network operators or network service providers. Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Huawei reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability. DISCLAIMER ALL CONTENTS OF THIS MANUAL ARE PROVIDED “AS IS”. EXCEPT AS REQUIRED BY APPLICABLE LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO EVENT SHALL HUAWEI BE LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, OR LOSS OF PROFITS, BUSINESS, REVENUE, DATA, GOODWILL SAVINGS OR ANTICIPATED SAVINGS REGARDLESS OF WHETHER SUCH LOSSES ARE FORSEEABLE OR NOT. THE MAXIMUM LIABILITY (THIS LIMITATION SHALL NOT APPLY TO LIABILITY FOR PERSONAL INJURY TO THE EXTENT APPLICABLE LAW PROHIBITS SUCH A LIMITATION) OF HUAWEI ARISING FROM THE USE OF THE PRODUCT DESCRIBED IN THIS MANUAL SHALL BE LIMITED TO THE AMOUNT PAID BY CUSTOMERS FOR THE PURCHASE OF THIS PRODUCT. Import and Export Regulations Customers shall comply with all applicable export or import laws and regulations and be responsible to obtain all necessary governmental permits and licenses in order to export, re-export or import the product mentioned in this manual including the software and technical data therein. Privacy Policy To better understand how we protect your personal information, please see the privacy policy at http://consumer.huawei.com/privacy-policy HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide About This Document About This Document Revision History Document Version Date 01 2014-09-15 02 2014-09-18 3.3.2 Updated section 3.3.2: Reset the Module 03 2015-02-16 All Added the description of MU709s-6 module 04 2015-06-25 2.2 Updated Table 2-1: Features 5.3 Updated Table 5-2: Operating and storage temperatures 7.2 Updated Table 7-1: Product Certifications Chapter Descriptions Creation Scope MU709s-2 MU709s-6 Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 3 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Contents Contents 1 Introduction.................................................................................................................................... 7 2 Overall Description ...................................................................................................................... 8 2.1 About This Chapter ........................................................................................................................... 8 2.2 Function Overview............................................................................................................................ 8 2.3 Circuit Block Diagram ....................................................................................................................... 9 3 Description of the Application Interfaces .............................................................................. 11 3.1 About This Chapter .......................................................................................................................... 11 3.2 Mini PCIe Interface .......................................................................................................................... 11 3.3 Power Interface .............................................................................................................................. 16 3.3.1 Sources and Grounds............................................................................................................ 16 3.3.2 Power Supply Time Sequence .............................................................................................. 17 3.4 Signal Control Interface .................................................................................................................. 18 3.4.1 Overview ................................................................................................................................ 18 3.4.2 WAKE# Signal ....................................................................................................................... 18 3.4.3 RESIN_N Signal .................................................................................................................... 19 3.4.4 LED_WWAN# Signal ............................................................................................................. 20 3.5 USB Interface ................................................................................................................................. 21 3.5.1 Overview ................................................................................................................................ 21 3.5.2 Circuit Recommended for the USB Interface ........................................................................ 22 3.6 USIM Card Interface ...................................................................................................................... 22 3.6.1 Overview ................................................................................................................................ 22 3.6.2 Circuit Recommended for the USIM Card Interface .............................................................. 23 3.7 Audio Interface ............................................................................................................................... 24 3.7.1 Overview ................................................................................................................................ 24 3.7.2 Circuit Recommended for the Audio Interface ...................................................................... 25 3.8 NC Pins .......................................................................................................................................... 25 4 RF Specifications ......................................................................................................................... 27 4.1 About This Chapter ......................................................................................................................... 27 4.2 Operating Frequencies ................................................................................................................... 27 4.3 Conducted RF Measurement ......................................................................................................... 28 4.3.1 Test Environment ................................................................................................................... 28 4.3.2 Test Standards ....................................................................................................................... 28 Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 4 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Contents 4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 28 4.4.1 Conducted Receive Sensitivity .............................................................................................. 28 4.4.2 Conducted Transmit Power ................................................................................................... 29 4.5 Antenna Design Requirements ...................................................................................................... 30 4.5.1 Antenna Design Indicators..................................................................................................... 30 4.5.2 Interference ........................................................................................................................... 33 4.5.3 GSM/WCDMA Antenna Requirements .................................................................................. 33 5 Electrical and Reliability Features ........................................................................................... 35 5.1 About This Chapter ......................................................................................................................... 35 5.2 Absolute Ratings ............................................................................................................................ 35 5.3 Operating and Storage Temperatures ............................................................................................ 35 5.4 Power Supply Features .................................................................................................................. 36 5.4.1 Input Power Supply ............................................................................................................... 36 5.4.2 Power Consumption .............................................................................................................. 37 5.5 Reliability Features ......................................................................................................................... 41 5.6 EMC and ESD Features ................................................................................................................. 44 6 Mechanical Specifications ......................................................................................................... 46 6.1 About This Chapter ......................................................................................................................... 46 6.2 Dimensions and Interfaces ............................................................................................................. 46 6.3 Dimensions of the Mini PCI Express Connector ............................................................................ 47 6.4 Packaging ....................................................................................................................................... 48 6.5 Specification Selection for Fasteners ............................................................................................. 49 6.5.1 Installing the Mini PCIe Adapter on the Main Board .............................................................. 49 6.5.2 Romoving the Mini PCIe Adapter from the Main Board ........................................................ 51 6.6 Antenna Plug .................................................................................................................................. 52 6.7 Thermal Design Guide ................................................................................................................... 53 7 Certifications ................................................................................................................................ 56 7.1 About This Chapter ......................................................................................................................... 56 7.2 Certifications ................................................................................................................................... 56 8 Safety Information ...................................................................................................................... 57 8.1 Interference .................................................................................................................................... 57 8.2 Medical Device ............................................................................................................................... 57 8.3 Area with Inflammables and Explosives ......................................................................................... 57 8.4 Traffic Security................................................................................................................................ 58 8.5 Airline Security................................................................................................................................ 58 8.6 Safety of Children ........................................................................................................................... 58 8.7 Environment Protection .................................................................................................................. 58 8.8 WEEE Approval .............................................................................................................................. 58 8.9 RoHS Approval ............................................................................................................................... 58 8.10 Laws and Regulations Observance ............................................................................................. 59 Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 5 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Contents 8.11 Care and Maintenance ................................................................................................................. 59 8.12 Emergency Call ............................................................................................................................ 59 8.13 Regulatory Information ................................................................................................................. 59 8.13.1 CE Approval (European Union) ........................................................................................... 59 8.13.2 FCC Statement .................................................................................................................... 60 9 Appendix A Circuit of Typical Interface ................................................................................ 61 10 Appendix B Acronyms and Abbreviations .......................................................................... 62 Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 6 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Introduction 1 Introduction This document describes the hardware application interfaces and air interfaces provided by HUAWEI MU709 series (MU709s-2 and MU709s-6) HSPA+ Mini PCIe Module (hereinafter referred to as the MU709 module). This document helps hardware engineer to understand the interface specifications, electrical features and related product information of the MU709 module. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 7 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide 2 Overall Description Overall Description 2.1 About This Chapter This chapter gives a general description of the MU709 module and provides: Function Overview Circuit Block Diagram 2.2 Function Overview Table 2-1 Features Feature Description Physical Dimensions Dimensions: (L × W × H): 51 mm × 30.4 mm × 3.27 mm Weight: about 12 g Operating Bands MU709s-2 WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 8, all bands with diversity GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz MU709s-6 WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5, all bands with diversity GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz Operating Temperature Normal operating temperature: –20°C to +70°C Storage Temperature –40°C to +85°C Humility RH5% to RH95% Power Voltage DC 3.0 V to 3.6 V (typical value is 3.3 V) Issue 04 (2015-06-25) Extended operating temperature[1]: –30°C to +75°C Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 8 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Overall Description Feature Description AT Commands See the HUAWEI MU709 Series HSPA+ Module AT Command Interface Specification. Application Interface (52-pin Mini PCIe interface One standard USIM card (Class B and Class C) Audio interface: PCM interface USB 2.0 (High Speed) RESIN_N: Reset module WAKE#: Wake up signal LED_WWAN#: Active-low LED signal indicating the state of the module Antenna connector WWAN MAIN antenna connector x1 WWAN AUX antenna connector x1 SMS New message alert Management of SMS: read SMS, write SMS, send SMS, delete SMS and list SMS Supports MO and MT: Point-to-point Data Services GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s WCDMA PS: UL 384 kbit/s; DL 384 kbit/s HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s Operating Android 2.x/3.x/4.x Systems Linux (Kernel 2.6.18 or later) Windows 7/8/8.1 Windows CE 5.0/6.0/7.0 [1]: When the ME909s LGA module works in the range from –30°C to –20°C or +70°C to +75°C, NOT all their RF performances comply with 3GPP specifications. The thermal design must be implemented according to the chapter 6.7 Thermal Design Guide. If not, the overheat protection mechanism will be triggered due to overheated Mini PCIe and the network connection will be terminated. 2.3 Circuit Block Diagram Figure 2-1 shows the circuit block diagram of the MU709 adapter. The major functional unit of the Mini PCIe Adapter contains the following parts: Issue 04 (2015-06-25) Power supply circuit Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 9 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide LGA Module Control signals Antenna Connectors Overall Description Figure 2-1 Circuit block diagram of the MU709 module Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 10 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide 3 Description of the Application Interfaces Description of the Application Interfaces 3.1 About This Chapter This chapter mainly describes the external application interfaces of the MU709 module, including: Mini PCIe Interface Power Interface Signal Control Interface USB Interface USIM Card Interface Audio Interface NC Pins 3.2 Mini PCIe Interface The MU709 module uses a Mini PCIe interface as its external interface. For details about the module and dimensions, see Dimensions and Interfaces. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 11 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Figure 3-1 Sequence of Mini PCIe interface Table 3-1 Pin definitions of the Mini PCIe Interface Pin No. Pin Name Pad Type Description Mini PCI Express Standard Description HUAWEI Pin Description 1 WAKE# WAKE# O Open collector active low signal. This signal is used to wake up the host. 2 3.3Vaux VCC_3V3 PI 3 COEX1 NC 4 GND 5 6 Min. Typ. Max. (V) (V) (V) - –0.3 - 0.45 - 3.3 V DC supply input. - 3.0 3.3 3.6 - - Not connected - - - - - GND - Ground - - - - - COEX2 NC - Not connected - - - - - 1.5 V NC - Not connected - - - - - Issue 04 (2015-06-25) Parameter Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. Comments 12 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Pin No. Pin Name Pad Type Description Mini PCI Express Standard Description HUAWEI Pin Description 7 CLKREQ# NC - Not connected - 8 UIM_PWR USIM_PWR PO Power source for the external USIM card - - Description of the Application Interfaces Parameter Min. Typ. Max. Comments (V) (V) (V) - - - - –0.3 1.8 1.98 USIM_PW R=1.8 V –0.3 3.0 3.3 USIM_PW R=3.0 V 9 GND GND - Ground - - - - - 10 UIM_DATA USIM_DATA I/O External USIM data signal VOH 0.7 x USIM _PW R - 3.3 USIM_PW R=1.8 V or 3.0 V VOL 0 - 0.2 x USIM_ PWR VIH 0.65 x USIM _PW R - 3.30 VIL 0 - 0.25x USIM_ PWR 11 REFCLK- NC - Not connected - - - - - 12 UIM_CLK USIM_CLK O External USIM clock signal VOH 0.7 x USIM _PW R - 3.3 USIM_PW R=1.8 V or 3.0 V VOL 0 - 0.2 x USIM_ PWR 13 REFCLK+ NC - Not connected - - - - - 14 UIM_RESET USIM_RESE T O External USIM reset signal VOH 0.7 x USIM _PW R - 3.3 USIM_PW R=1.8 V or 3.0 V VOL 0 - 0.2 x USIM_ PWR Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 13 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Pin No. Pin Name Pad Type Description Mini PCI Express Standard Description HUAWEI Pin Description 15 GND GND - Ground 16 UIM_Vpp NC - 17 Reserved NC 18 GND 19 Description of the Application Interfaces Min. Typ. Max. (V) (V) (V) - - - - - Not connected - - - - - - Not connected - - - - - GND - Ground - - - - - Reserved NC - Not connected - - - - - 20 W_DISABLE # NC - Not connected - - - - - 21 GND GND - Ground - - - - - 22 RERST# RESIN_N I Reset module VIL –0.3 0 0.3 - VIH 1.17 1.8 3.6 - Active-low Parameter Comments 23 PERn0 NC - Not connected - - - - - 24 3.3Vaux VCC_3V3 PI 3.3 V DC supply input. - 3.0 3.3 3.6 - 25 PERp0 NC - Not connected - - - - - 26 GND GND - Ground - - - - - 27 GND GND - Ground - - - - - 28 1.5 V NC - Not connected - - - - - 29 GND GND - Ground - - - - - 30 SMB_CLK NC - Not connected - - - - - 31 PETn0 NC - Not connected - - - - - 32 SMB_DATA NC - Not connected - - - - - 33 PETp0 NC - Not connected - - - - - 34 GND GND - Ground - - - - - Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 14 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Pin No. Pin Name Pad Type Description Mini PCI Express Standard Description HUAWEI Pin Description 35 GND GND - Ground 36 USB_D- USB_DM I/O 37 GND GND 38 USB_D+ 39 Description of the Application Interfaces Parameter Min. Typ. Max. Comments (V) (V) (V) - - - - - USB signal D- - - - - - - Ground - - - - - USB_DP I/O USB signal D+ - - - - - 3.3Vaux VCC_3V3 PI 3.3 V DC supply input. - 3.0 3.3 3.6 - 40 GND GND - Ground - - - - - 41 3.3Vaux VCC_3V3 PI 3.3 V DC supply input. - 3.0 3.3 3.6 - 42 LED_WWAN # LED_WWAN # O Active-low LED signal indicating the state of the card. VOL –0.3 - 0.45 - 43 GND GND - Ground - - - - - 44 LED_WLAN # NC - Not connected - - - - - 45 Reserved PCM_CLK O PCM interface clock VOL –0.3 0 0.45 - VOH 1.35 1.8 2.1 - 46 LED_WPAN # NC - Not connected - - - - - 47 Reserved PCM_DOUT O PCM I/F data output VOL –0.3 0 0.45 - VOH 1.35 1.8 2.1 - 48 1.5 V NC - Not connected - - - - - 49 Reserved PCM_DIN I PCM I/F data input VIL –0.3 0 0.63 - VIH 1.17 1.8 2.1 - 50 GND GND - Ground - - - - - 51 Reserved PCM_SYNC O PCM interface sync VOL –0.3 0 0.45 - VOH 1.35 1.8 2.1 - Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 15 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Pin No. Pin Name Mini PCI Express Standard Description HUAWEI Pin Description 52 3.3Vaux VCC_3V3 Pad Type Description PI 3.3 V DC supply input Description of the Application Interfaces Parameter - Min. Typ. Max. (V) (V) (V) 3.0 3.3 3.6 Comments - P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital signal output; PO indicates power output pins; PI indicates power input pins. VIL indicates Low-level Input voltage; VIH indicates High-level Input voltage; VOL indicates Low-level Output voltage; VOH indicates High-level Output voltage. The NC pins are floating and there are no signal connected to these pins. Therefore, these pins should not be used. 3.3 Power Interface 3.3.1 Sources and Grounds For the Mini PCIe Adapter, +3.3Vaux is the only voltage supply that is available. The input voltage is 3.3 V±9%, as specified by PCI Express Mini Card Electromechanical Specification Revision 1.2. Table 3-2 Power and ground specifications Pin No. Pin Name Pad Type Descriptiom Min.(V) Typ .(V) Max.(V) 2, 24, 39, 41 and 52 VCC_3V3 PI 3.3 V DC supply input 3.0 3.3 3.6 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43 and 50 GND - Ground - - - To minimize the RF radiation through the power lines, it is suggested to add ceramic capacitors of 10 pF and 100 nF in the power lines beside the Mini PCIe connector on the host side. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 16 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces 3.3.2 Power Supply Time Sequence Power on Sequence Figure 3-2 Power on timing sequence Parameter Remarks Time (Nominal value) Unit TPD+ Power Valid to USB D+ high 7.0 s Do not toggle RESIN_N pin during the power on sequence. Pull-Down RESIN_N pin will extend time for module startup. Power off Sequence Cutting off the VCC_3V3 power supply will power off the module. Figure 3-3 Power off timing sequence Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 17 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces 3.4 Signal Control Interface 3.4.1 Overview The signal control part of the interface in the MU709 module consists of the following: WAKE# Signal RESIN_N Signal LED_WWAN# Signal Table 3-3 Definitions of the pins on the signal control interface Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) 1 WAKE# O Open collector active low signal. This signal is used to wake up the host. - –0.3 - 0.45 22 RESIN_N I Reset module VIL –0.3 0 0.3 VIH 1.17 1.8 3.6 VOL –0.3 - 0.45 Active-low 42 LED_WWAN# O Active-low LED signal indicating the state of the card. 3.4.2 WAKE# Signal WAKE# signal supports software control. This signal is used for module to wake up the host. It is designed as an OC (Open Collector) gate, so it should be pulled up by the host and it is active-low. When the module wakes up the host, the WAKE# pin will output low-level-voltage for 1s to wake up the host. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 18 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Figure 3-4 Connections of the WAKE# pin 3.4.3 RESIN_N Signal The RESIN_N signal is used to reset the module's system. When the module software stops responding, the RESIN_N pin can be pulled down to reset the module hardware. The RESIN_N signal is internally pulled up to 1.8 V, and it turns on automatically when the VCC_3V3 is pulled up. The RESIN_N signal is active-low. Figure 3-5 Connections of the RESIN_N pin Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 19 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces As the RESIN_N signal is relatively sensitive, it is recommended that you install a 10 nF–0.1 µF capacitor near the RESIN_N pin of the interface for filtering. In addition, when you design a circuit on the PCB of the interface board, it is recommended that the circuit length should not exceed 20 mm and that the circuit should be kept at a distance of 2.54 mm (100 mil) at least from the PCB edge. Furthermore, you need to wrap the area adjacent to the signal wire with a ground wire. Otherwise, the module may be reset due to interference. The maximum Forward Voltage Drop of the diode used in the module is 0.6 V. So when the host wants to reset the module, the low-level-voltage in the RESIN_N pin should be below 50 mV. The MU709 module supports hardware reset function. If the software of the MU709 module stops responding, you can reset the hardware through the RESIN_N signal as shown in Figure 3-6 . When a low-level pulse is supplied through the RESIN_N pin, the hardware will be reset. After the hardware is reset, the software starts powering on the module and reports relevant information according to the actual settings. For example, the AT command automatically reports ^SYSSTART. Figure 3-6 Reset pulse timing The RESIN_N pin must not be pulled down for more than 1s. The RESIN_N pin is optional, which can not be connected. 3.4.4 LED_WWAN# Signal MU709 series module provides an LED_WWAN# signal to indicate the work status. This function is disabled by default, it is controlled by AT^LEDCTRL. For details about the command, please refer to HUAWEI MU709 Series HSPA+ Module AT Command Interface Specification. Table 3-4 State of the LED_WWAN# pin No. Operating Status LED_WWAN# 1 No service or Restricted service Outputs: low (0.1s)-high (0.1s)-low (0.1s)-high (1.7s) 2s cycle 2 Register to the network Outputs: low (0.1s)-high (1.9s) 2s cycle 3 Issue 04 (2015-06-25) Dial-up successfully Outputs: low Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 20 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces Figure 3-7 shows the recommended circuits of the LED_WWAN# pin. According to LED feature, you can adjust the LED brightness by adjusting the resistance of resistor R. Figure 3-7 Driving circuit 3.5 USB Interface 3.5.1 Overview The MU709 module is compliant with USB 2.0 protocol. The USB interface is powered directly from the VBAT supply. The USB input/output lines are compatible with the USB 2.0 signal specifications. Figure 3-8 shows the circuit of the USB interface. Table 3-5 Definition of the USB interface Pin No. Pin Name Pad Type Description Parameter Min.(V) Typ.(V) Max.(V) 36 USB_DM I/O USB signal D- - - - - 38 USB_DP I/O USB signal D+ - - - - According to USB protocol, for bus timing or electrical characteristics of MU709 USB signal, please refer to the chapter 7.3.2 of Universal Serial Bus Specification 2.0. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 21 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces 3.5.2 Circuit Recommended for the USB Interface Figure 3-8 Recommended circuit of USB interface 3.6 USIM Card Interface 3.6.1 Overview The MU709 module provides a USIM card interface complying with the ISO 7816-3 standard and supports both Class B and Class C USIM cards. Table 3-6 USIM card interface signals PIN No. 14 12 10 Pin Name USIM_RESET USIM_CLK USIM_DATA Pad Type O O I/O Issue 04 (2015-06-25) Description External USIM reset signal External USIM clock signal External USIM data signal Parameter Min. (V) Typ. (V) Max. (V) Comments VOH 0.7 x USIM_PWR - 3.3 USIM_PWR=1.8 V or 3.0 V VOL 0 - 0.2 x USIM_PWR VOH 0.7 x USIM_PWR - 3.3 VOL 0 - 0.2 x USIM_PWR VIH 0.7 x USIM_PWR - 3.3 VIL 0 - 0.2 x USIM_PWR VOH 0.65 x USIM_PWR - 3.3 VOL 0 - 0.25 x USIM_PWR Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. USIM_PWR=1.8 V or 3.0 V USIM_PWR=1.8 V or 3.0 V 22 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide PIN No. 8 Pin Name Pad Type USIM_PWR PO Description of the Application Interfaces Description Parameter Min. (V) Typ. (V) Max. (V) Comments Power source for the external USIM card - –0.3 1.8 1.98 USIM_PWR=1.8 V - –0.3 3.0 3.3 USIM_PWR=3.0 V 3.6.2 Circuit Recommended for the USIM Card Interface As the Mini PCIe Adapter is not equipped with a USIM socket, you need to place a USIM socket on the user interface board. Figure 3-9 shows the circuit of the USIM card interface. Figure 3-9 Circuit of the USIM card interface To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic compatibility (EMC) authentication, the USIM socket should be placed near the PCIe interface (it is recommended that the PCB circuit connects the PCIe interface and the USIM socket does not exceed 100 mm), because a long circuit may lead to wave distortion, thus affecting signal quality. It is recommended that you wrap the area adjacent to the USIM_CLK and USIM_DATA signal wires with ground. The Ground pin of the USIM socket and the Ground pin of the USIM card must be well connected to the power Ground pin supplying power to the PCIe Adapter. A 100 nF capacitor and1 μF capacitor are placed between the USIM_PWR and Ground pins in a parallel manner (If USIM_PWR circuit is too long, that the larger capacitance such as 4.7 μF can be employed if necessary). Three 33 pF Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 23 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces capacitors are placed between the USIM_DATA and Ground pins, the USIM_RESET and Ground pins, and the USIM_CLK and Ground pins in parallel to filter interference from RF signals. It is recommended to take electrostatic discharge (ESD) protection measures near the USIM card socket. The TVS diode with Vrwm of 5 V and junction capacitance less than 10 pF must be placed as close as possible to the USIM socket, and the Ground pin of the ESD protection component is well connected to the power Ground pin that supplies power to the PCIe Adapter. 3.7 Audio Interface 3.7.1 Overview The MU709 module provides one PCM digital audio interface. Table 3-7 lists the signals on the digital audio interface. Table 3-7 Signals on the digital audio interface Pin No. Pin Name Pad Type Description Parameter 45 PCM_CLK O PCM clock 47 49 51 PCM_DOUT PCM_DIN O I PCM_SYNC O PCM I/F data output PCM I/F data input PCM interface sync Min.(V) Typ.(V) Max.(V) VOL –0.3 0 0.45 VOH 1.35 1.8 2.1 VOL –0.3 0 0.45 VOH 1.35 1.8 2.1 VIL –0.3 0 0.63 VIH 1.17 1.8 2.1 VOL –0.3 0 0.45 VOH 1.35 1.8 2.1 The MU709 module interface enables communication with an external codec to support linear format. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 24 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces 3.7.2 Circuit Recommended for the Audio Interface Figure 3-10 Circuit diagram of the interface of the PCM (MU709 module is used as PCM master) Figure 3-11 Circuit diagram of the interface of the PCM (MU709 is used as PCM slave) Issue 04 (2015-06-25) MU709 module supports both master and slave mode. PCM_SYNC and PCM_CLK: Output when PCM is in master mode; Input when PCM is in slave mode. It is recommended that a TVS be used on the related interface, to prevent electrostatic discharge and protect integrated circuit (IC) components. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 25 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description of the Application Interfaces 3.8 NC Pins The MU709 module has some NC pins. All of NC pins should not be connected. Please keep these pins open. Table 3-8 NC pins Pin No. Pin Name Pad Type Description Parameter Min.( V) Typ.( V) Max.( V) 3, 5–7, 11, 13, 16, 17, 19, 20, 23, 25, 28, 30–33, 44, 46 and 48 NC - Not connected, please keep open. - - - - Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 26 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide 4 RF Specifications RF Specifications 4.1 About This Chapter This chapter describes the RF specifications of the MU709 module, including: Operating Frequencies Conducted RF Measurement Conducted Rx Sensitivity and Tx Power Antenna Design Requirements 4.2 Operating Frequencies Table 4-1 and Table 4-2 show the RF bands supported by the MU709 module. Table 4-1 RF bands of the MU709s-2 module Operating Band Tx Rx UMTS Band 1 1920 MHz–1980 MHz 2110 MHz–2170 MHz UMTS Band 8 880 MHz–915 MHz 925 MHz–960 MHz GSM 850 824 MHz–849 MHz 869 MHz–894 MHz GSM 900 880 MHz–915 MHz 925 MHz–960 MHz GSM 1800 (DCS) 1710 MHz–1785 MHz 1805 MHz–1880 MHz GSM 1900 (PCS) 1850 MHz–1910 MHz 1930 MHz–1990 MHz Table 4-2 RF bands of MU709s-6 module Operating Band Tx Rx UMTS Band 1 1920 MHz–1980 MHz 2110 MHz–2170 MHz UMTS Band 2 1850 MHz–1910 MHz 1930 MHz–1990 MHz Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 27 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide RF Specifications Operating Band Tx Rx UMTS Band 5 824 MHz–849 MHz 869 MHz–894 MHz GSM 850 824 MHz–849 MHz 869 MHz–894 MHz GSM 900 880 MHz–915 MHz 925 MHz–960 MHz GSM 1800 (DCS) 1710 MHz–1785 MHz 1805 MHz–1880 MHz GSM 1900 (PCS) 1850 MHz–1910 MHz 1930 MHz–1990 MHz 4.3 Conducted RF Measurement 4.3.1 Test Environment Test instrument R&S CMU200 Power supply KEITHLEY 2306 RF cable for testing L08-C014-350 of DRAKA COMTEQ or Rosenberger Cable length: 29 cm The compensation for different frequency bands relates to the cable and the test environment. The instrument compensation needs to be set according to the actual cable conditions. 4.3.2 Test Standards Huawei modules meet 3GPP test standards. Each module passes strict tests at the factory and thus the quality of the modules is guaranteed. 4.4 Conducted Rx Sensitivity and Tx Power 4.4.1 Conducted Receive Sensitivity The conducted receive sensitivity is a key parameter that indicates the receiver performance of MU709 module. The conducted receive sensitivity refers to the weakest signal that the module at the antenna port can receive. Table 4-3 and Table 4-4 list the typical tested values of the MU709 module. Table 4-3 MU709s-2 module conducted Rx sensitivity Band Typical value (Unit: dBm) Note GSM 850 –109.5 BER Class II < 2.44% Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 28 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide RF Specifications Band Typical value (Unit: dBm) Note GSM 900 –109 BER Class II < 2.44% GSM 1800 (DCS) –108 BER Class II < 2.44% GSM 1900 (PCS) –108 BER Class II < 2.44% WCDMA Band 1 –109 BER < 0.1% WCDMA Band 8 –110 BER < 0.1% Table 4-4 MU709s-6 module conducted Rx sensitivity Band Test Value (Unit: dBm) Note GSM 850 –109.5 BER Class II < 2.44% GSM 900 –109 BER Class II < 2.44% GSM 1800 (DCS) –108 BER Class II < 2.44% GSM 1900 (PCS) –108 BER Class II < 2.44% WCDMA Band 1 –109 BER < 0.1% WCDMA Band 2 –110.5 BER < 0.1% WCDMA Band 5 –111.5 BER < 0.1% The test values are the average of some test samples. 4.4.2 Conducted Transmit Power The conducted transmit power is another indicator that measures the performance of MU709 module. The conducted transmit power refers to the maximum power that the module tested at the antenna connector can transmit. According to the 3GPP protocol, the required transmit power varies with the power class. Table 4-5 and Table 4-6 list the typical tested values of the MU709 module. Table 4-5 MU709s-2 module conducted Tx power Band GSM 850 GSM 900 GSM 1800 Issue 04 (2015-06-25) Typical Value (Unit: dBm) Note (Unit: dB) GMSK(1Tx Slot) 32 ±1.5 8PSK(1Tx Slot) 26.5 ±2 GMSK(1Tx Slot) 32 ±1.5 8PSK(1Tx Slot) 26.5 ±2 GMSK(1Tx Slot) 29 ±1.5 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 29 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Band RF Specifications Typical Value (Unit: dBm) Note (Unit: dB) (DCS) 8PSK(1Tx Slot) 25 ±2 GSM 1900 (PCS) GMSK(1Tx Slot) 29 ±1.5 8PSK(1Tx Slot) 25 ±2 WCDMA Band 1 23 ±1 WCDMA Band 8 23 -1.5/+1 Table 4-6 MU709s-6 module conducted Tx power Band Typical Value (Unit: dBm) Note (Unit: dB) GMSK(1Tx Slot) 32 ±1.5 8PSK(1Tx Slot) 26.5 ±2 GMSK(1Tx Slot) 32 ±1.5 8PSK(1Tx Slot) 26.5 ±2 GSM 1800 (DCS) GMSK(1Tx Slot) 29 ±1.5 8PSK(1Tx Slot) 25 ±2 GSM 1900 (PCS) GMSK(1Tx Slot) 29 ±1.5 8PSK(1Tx Slot) 25 ±2 WCDMA Band 1 23 ±1 WCDMA Band 2 23 ±1 WCDMA Band 5 23 -1.5/+1 GSM 850 GSM 900 4.5 Antenna Design Requirements 4.5.1 Antenna Design Indicators Antenna Efficiency Antenna efficiency is the ratio of the input power to the radiated or received power of an antenna. The radiated power of an antenna is always lower than the input power due to the following antenna losses: return loss, material loss, and coupling loss. The efficiency of an antenna relates to its electrical dimensions. To be specific, the antenna efficiency increases with the electrical dimensions. In addition, the transmission cable from the antenna connector of PCIe Adapter to the antenna is also part of the antenna. The cable loss increases with the cable length and the frequency. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 30 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide RF Specifications It is recommended that the cable loss is as low as possible, for example, U.FL-LP-088 made by HRS. The following antenna efficiency (free space) is recommended for MU709 module to ensure high radio performance of the module: Efficiency of the primary antenna: ≥ 40% (below 960 MHz); ≥ 50% (over 1710 MHz) Efficiency of the diversity antenna: ≥ half of the efficiency of the primary antenna in receiving band In addition, the efficiency should be tested with the transmission cable. S11 or VSWR S11 indicates the degree to which the input impedance of an antenna matches the reference impedance (50 Ω). S11 shows the resonance feature and impedance bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector analyzer. The following S11 value is recommended for the antenna of MU709 module: S11 of the primary antenna: ≤ –6 dB S11 of the diversity antenna: ≤ –6 dB In addition, S11 is less important than the efficiency, and S11 has weak correlation to wireless performance. Isolation For a wireless device with multiple antennas, the power of different antennas is coupled with each other. Antenna isolation is used to measure the power coupling. The power radiated by an antenna might be received by an adjacent antenna, which decreases the antenna radiation efficiency and affects the running of other devices. To avoid this problem, evaluate the antenna isolation as sufficiently as possible at the early stage of antenna design. Antenna isolation depends on the following factors: Distance between antennas Antenna type Antenna direction The primary antenna must be placed as near as possible to the MU709 module to minimize the cable length. The diversity antenna needs to be installed perpendicularly to the primary antenna. The diversity antenna can be placed farther away from the MU709 module. Antenna isolation can be measured with a two-port vector network analyzer. The following antenna isolation is recommended for the antennas on laptops: Isolation between the primary and diversity antennas: ≤ –12 dB Isolation between the primary antenna and the Wi-Fi antenna: ≤ –15 dB Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 31 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide RF Specifications Polarization The polarization of an antenna is the orientation of the electric field vector that rotates with time in the direction of maximum radiation. The linear polarization is recommended for the antenna of MU709 module. Radiation Pattern The radiation pattern of an antenna reflects the radiation features of the antenna in the remote field region. The radiation pattern of an antenna commonly describes the power or field strength of the radiated electromagnetic waves in various directions from the antenna. The power or field strength varies with the angular coordinates (θ and φ), but is independent of the radial coordinates. The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal plane, and the incident waves of base stations are often in the horizontal plane. For this reason, the receiving performance is optimal. The following radiation patterns are recommended for the antenna of MU709 module. Primary/Diversity antenna: omnidirectional In addition, the diversity antenna's pattern should be complementary with the primary's. Envelope Correlation Coefficient The envelope correlation coefficient indicates the correlation between different antennas in a multi-antenna system (primary antenna, diversity antenna, and MIMO antenna). The correlation coefficient shows the similarity of radiation patterns, that is, amplitude and phase, of the antennas. The ideal correlation coefficient of a diversity antenna system or a MIMO antenna system is 0. A small value of the envelope correlation coefficient between the primary antenna and the diversity antenna indicates a high diversity gain. The envelope correlation coefficient depends on the following factors: Distance between antennas Antenna type Antenna direction The antenna correlation coefficient differs from the antenna isolation. Sufficient antenna isolation does not represent a satisfactory correlation coefficient. For this reason, the two indicators need to be evaluated separately. For the antennas on laptops, the recommended envelope correlation coefficient between the primary antenna and the diversity antenna is smaller than 0.5. Gain and Directivity The radiation pattern of an antenna represents the field strength of the radiated electromagnetic waves in all directions, but not the power density that the antenna radiates in the specific direction. The directivity of an antenna, however, measures the power density that the antenna radiates. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 32 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide RF Specifications Gain, as another important parameter of antennas, correlates closely to the directivity. The gain of an antenna takes both the directivity and the efficiency of the antenna into account. The appropriate antenna gain prolongs the service life of relevant batteries. The following antenna gain is recommended for MU709 module. Gain of the primary/diversity antenna ≤ 2.5 dBi The antenna consists of the antenna body and the relevant RF transmission cable. Take the RF transmission cable into account when measuring any of the preceding antenna indicators. Huawei cooperates with various famous antenna suppliers who are able to make suggestions on antenna design, for example, Amphenol, Skycross, etc. 4.5.2 Interference Besides the antenna performance, the interference on the user board also affects the radio performance (especially the TIS) of the module. To guarantee high performance of the module, the interference sources on the user board must be properly controlled. On the user board, there are various interference sources, such as the LCD, CPU, audio circuits, and power supply. All the interference sources emit interference signals that affect the normal operation of the module. For example, the module sensitivity can be decreased due to interference signals. Therefore, during the design, you need to consider how to reduce the effects of interference sources on the module. You can take the following measures: Use a LCD with optimized performance; shield the LCD interference signals; shield the signal cable of the board; or design filter circuits. Huawei is able to make technical suggestions on radio performance improvement of the module. 4.5.3 Antenna Requirements The antenna for MU709 module must fulfill the following requirements: Table 4-7 MU709s-2 module antenna requirements Antenna Requirements Frequency range Depending on frequency band(s) provided by the network operator, the customer must use the most suitable antenna for that/those band(s) Bandwidth of primary antenna 70 MHz in GSM 850 80 MHz in GSM 900 170 MHz in GSM 1800 140 MHz in GSM 1900 80 MHz in WCDMA Band 8 250 MHz in WCDMA Band 1 Bandwidth of secondary antenna 35 MHz in WCDMA Band 8 Gain ≤ 2.5 dBi Issue 04 (2015-06-25) 60 MHz in WCDMA Band 1 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 33 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide RF Specifications Antenna Requirements Impedance 50 Ω VSWR absolute max ≤ 3:1 VSWR recommended ≤ 2:1 Table 4-8 MU709s-6 module antenna requirements Antenna Requirements Frequency range Depending on frequency band(s) provided by the network operator, the customer must use the most suitable antenna for that/those band(s) Bandwidth of primary antenna 70 MHz in GSM 850 80 MHz in GSM 900 170 MHz in GSM 1800 140 MHz in GSM 1900 70 MHZ in WCDMA Band 5 140 MHz in WCDMA Band 2 250 MHz in WCDMA Band 1 Bandwidth of secondary antenna 25 MHz in WCDMA Band 5 60 MHz in WCDMA Band 2 60 MHz in WCDMA Band 1 Gain ≤ 2.5 dBi Impedance 50 Ω VSWR absolute max ≤ 3:1 VSWR recommended ≤ 2:1 Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 34 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide 5 Electrical and Reliability Features Electrical and Reliability Features 5.1 About This Chapter This chapter describes the electrical and reliability features of the interfaces in the MU709 module, including: Absolute Ratings Operating and Storage Temperatures Power Supply Features Reliability Features EMC and ESD Features 5.2 Absolute Ratings Table 5-1 lists the absolute ratings for the MU709 module. Using the module beyond these conditions may result in permanent damage to the module. Table 5-1 Absolute ratings for the MU709 module Symbol Specification Min. Max. Unit VCC_3V3 External power voltage –0.3 4.0 V VI Digital input voltage –0.3 2.1 V 5.3 Operating and Storage Temperatures Table 5-2 lists the operating and storage temperatures for the MU709 module. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 35 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features Table 5-2 Operating and storage temperatures for the MU709 module Specification Min. Max. Unit Normal working temperatures –20 +70 °C Extended temperatures –30 +75 °C Ambient temperature for storage –40 +85 °C [1]: When the ME909s LGA module works in the range from –30°C to –20°C or +70°C to +75°C, NOT all their RF performances comply with 3GPP specifications. The thermal design must be implemented according to the chapter 6.7 Thermal Design Guide. If not, the overheat protection mechanism will be triggered due to overheated Mini PCIe and the network connection will be terminated. 5.4 Power Supply Features 5.4.1 Input Power Supply Table 5-3 Requirements for input power for the MU709 module Parameter Min. Typ. Max. Ripple Unit VCC_3V3 3.0 3.3 3.6 0.05 V Figure 5-1 Power Supply During Burst Emission The VCC_3V3 minimum value must be guaranteed during the burst (with 2.7 A Peak in GSM 2 slot mode). So a low-dropout (LDO) regulator or switch power with current output of more than 3.5 A is strongly recommended for external power supply. Table 5-4 Requirements for input current of the MU709 module Power Module Peak (GSM 2 slot) Normal (WCDMA) VCC_3V3 MU709 2750 mA 1100 mA Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 36 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features 5.4.2 Power Consumption The power consumptions of MU709 module in different scenarios are respectively listed in Table 5-5 to Table 5-8 . The power consumption listed in this section is tested when the power supply of the MU709 module is 3.3 V, and all of test values are measured at room temperature. Table 5-5 Averaged standby DC power consumption of MU709 module Description Bands Test Value (Unit: mA) Notes/Configuration Typical Sleep HSPA+/WCDMA UMTS bands 3.1 Module is powered up. DRX cycle=7 (1.28s) Module is registered on the network. USB is in suspend. GPRS/EDGE GSM bands 2.8 Module is powered up. MFRMS=5 (1.175s) Module is registered on the network. USB is in suspend. Radio Off All bands 1.6 Module is powered up. RF is disabled USB is in suspend. Idle HSPA+/WCDMA UMTS bands 50 Module is powered up. DRX cycle=7 (1.28s) Module is registered on the network, no data is transmitted. USB is in active. GPRS/EDGE GSM bands 50 Module is powered up. MFRMS=5 (1.175s) Module is registered on the network, no data is transmitted. USB is in active. Radio Off All bands 50 Module is powered up. RF is disabled. USB is in active. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 37 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features Table 5-6 Averaged data transmission DC power consumption of MU709s-2 module (HSPA/WCDMA) Description Band Test Value (Unit: mA) Power Typical WCDMA HSPA Band 1 250 0 dBm Tx Power (IMT2100) 320 10 dBm Tx Power 720 23.5 dBm Tx Power Band 8 250 0 dBm Tx Power (900 MHz) 320 10 dBm Tx Power 720 23.5dBm Tx Power Band 1 270 0 dBm Tx Power (IMT2100) 340 10 dBm Tx Power 720 23.5 dBm Tx Power Band 8 270 0 dBm Tx Power (900 MHz) 360 10 dBm Tx Power 740 23.5 dBm Tx Power Table 5-7 Averaged data transmission DC power consumption of MU709s-6 module (HSPA/WCDMA) Description Band Test Value (Unit: mA) Power (dBm) WCDMA Band 1 192 0 dBm Tx Power (IMT 2100) 237 10 dBm Tx Power 652 23.5 dBm Tx Power Band 2 191 0 dBm Tx Power (1900 MHz) 245 10 dBm Tx Power 688 23.5 dBm Tx Power Band 5 182 0 dBm Tx Power (850 MHz) 219 10 dBm Tx Power 562 23.5 dBm Tx Power Band 1 202 0 dBm Tx Power (IMT 2100) 255 10 dBm Tx Power 629 23.5 dBm Tx Power HSPA Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 38 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description Electrical and Reliability Features Band Test Value (Unit: mA) Power (dBm) Band 2 210 0 dBm Tx Power (1900 MHz) 274 10 dBm Tx Power 703 23.5 dBm Tx Power Band 5 197 0 dBm Tx Power (850 MHz) 234 10 dBm Tx Power 552 23.5 dBm Tx Power Table 5-8 Averaged data transmission DC power consumption of MU709 module (GPRS/EDGE) Description Test Value (Unit: mA) PCL Configuration 5 1 Up/1 Down Typical GPRS 850 250 370 2 Up/1 Down 510 4 Up/1 Down 120 GPRS 900 2 Up/1 Down 330 4 Up/1 Down 250 Issue 04 (2015-06-25) 5 1 Up/1 Down 370 2 Up/1 Down 520 4 Up/1 Down 10 1 Up/1 Down 200 2 Up/1 Down 330 4 Up/1 Down 200 0 1 Up/1 Down 280 2 Up/1 Down 400 4 Up/1 Down 80 GPRS 1900 1 Up/1 Down 200 120 GPRS 1800 10 10 1 Up/1 Down 115 2 Up/1 Down 160 4 Up/1 Down 190 0 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 1 Up/1 Down 39 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Description Test Value (Unit: mA) Electrical and Reliability Features PCL Configuration Typical 260 2 Up/1 Down 370 4 Up/1 Down 80 EDGE 850 2 Up/1 Down 160 4 Up/1 Down 190 490 4 Up/1 Down 15 1 Up/1 Down 145 2 Up/1 Down 235 4 Up/1 Down 190 8 1 Up/1 Down 290 2 Up/1 Down 490 4 Up/1 Down 15 1 Up/1 Down 150 2 Up/1 Down 240 4 Up/1 Down 160 2 1 Up/1 Down 255 2 Up/1 Down 415 4 Up/1 Down 10 1 Up/1 Down 140 2 Up/1 Down 220 4 Up/1 Down 160 2 1 Up/1 Down 255 2 Up/1 Down 415 4 Up/1 Down 100 Issue 04 (2015-06-25) 1 Up/1 Down 2 Up/1 Down 100 EDGE 1900 8 290 100 EDGE 1800 1 Up/1 Down 110 100 EDGE 900 10 10 1 Up/1 Down 140 2 Up/1 Down 220 4 Up/1 Down Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 40 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features All power consumption test configuration can be referenced by GSM Association Official Document TS.09: Battery Life Measurement and Current Consumption Technique. Test condition: For Max. Tx. power, see 4.4.2 Conducted Transmit Power, which are listed in Table 4-5 ; for Max. data throughput, see 2.2 Function Overview, which are listed in Table 2-1 . 5.5 Reliability Features Table 5-9 lists the test conditions and results of the reliability of the MU709 module. Table 5-9 Test conditions and results of the reliability of the MU709 module Item Stress Low-temperature storage High-temperature storage Low-temperature operating High-temperature operating Damp heat cycling Issue 04 (2015-06-25) Test Condition Standard Sample size Results Temperature: –40ºC 3 pcs/group Visual inspection: ok Operation mode: no power, no package JESD22A119-C Test duration: 24 h Temperature: 85ºC Operation mode: no power, no package Test duration: 24 h Temperature: –30ºC Operation mode: working with service connected Test duration: 24 h Temperature: 70ºC Operation mode: working with service connected Test duration: 24 h High temperature: 55ºC Low temperature: 25ºC Humidity: 95%±3% Operation mode: working with service connected Test duration: 6 cycles; 12 h+12 h/cycle Function test: ok RF specification: ok JESD22A103-C 3 pcs/group Visual inspection: ok Function test: ok RF specification: ok IEC60068 -2-1 3 pcs/group Visual inspection: ok Function test: ok RF specification: ok JESD22A108-C 3 pcs/group Visual inspection: ok Function test: ok RF specification: ok JESD22A101-B 3 pcs/group Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. Visual inspection: ok Function test: ok RF specification: ok 41 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Item Thermal shock Salty fog test Electrical and Reliability Features Test Condition Standard Sample size Results Low temperature: –40ºC JESD22A106-B 3 pcs/group Visual inspection: ok High temperature: 85ºC Temperature change interval: < 20s Operation mode: no power Test duration: 100 cycles; 15 Min+15 Min/cycle Temperature: 35°C Density of the NaCl solution: 5%±1% Operation mode: no power, no package Test duration: Function test: ok RF specification: ok JESD22A107-B 3 pcs/group Visual inspection: ok Function test: ok RF specification: ok Spraying interval: 8 h Exposing period after removing the salty fog environment: 16 h Sine vibration Shock test Issue 04 (2015-06-25) Frequency range: 5 Hz to 200 Hz Acceleration: 1 Grms Frequency scan rate: 0.5oct/min Operation mode: working with service connected Test duration: 3 axial directions. 2 h for each axial direction Half-sine wave shock Peak acceleration: 30 Grms Shock duration: 11 ms Operation mode: working with service connected Test duration: 6 axial directions. 3 shocks for each axial direction. JESD22B103-B 3 pcs/group Visual inspection: ok Function test: ok RF specification: ok JESD-B1 04-C 3 pcs/group Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. Visual inspection: ok Function test: ok RF specification: ok 42 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Item Drop test Life High temperature operating life High temperature & high humidity Temperature cycle ESD HBM (Human Body Model) Issue 04 (2015-06-25) Electrical and Reliability Features Test Condition Standard Sample size Results IEC60068 -2-32 3 pcs/group Visual inspection: ok 0.8 m in height. Drop the module on the marble terrace with one surface facing downwards. Six surfaces should be tested. Operation mode: no power, no package Temperature: 70ºC Operation mode: working with service connected Function test: ok RF specification: ok JESD22A108-B 50 pcs/group Visual inspection: ok Function test: ok RF specification: ok Test duration: 168 h, 336 h, 500 h for inspection point High temperature: 85ºC Humidity: 85% RF specification: ok Operation mode: powered on and no working Cross section: ok Test duration: 168 h, 336 h, 500 h for inspection point High temperature: 85ºC Low temperature: –40ºC RF specification: ok Temperature change slope: 6ºC/min Cross section: ok Operation mode: no power Test duration: 168 h, 336 h, 500 h for inspection point 2 kV (Class 1B) Operation mode: no power JESD22A110-B JESD22A104-C JESD22A114-D 50 pcs/group Visual inspection: ok Function test: ok 50 pcs/group Visual inspection: ok Function test: ok 3 pcs/group Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. Visual inspection: ok Function test: ok RF specification: ok 43 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Item ESD with DVK (or embedded in the host) Electrical and Reliability Features Test Condition Standard Sample size Results IEC61000 -4-2 2 pcs Visual inspection: ok Contact and Air discharges: 10 positive and 10 negative applied Contact Voltage: ±2 kV, ±4 kV Air Voltage : ±2 kV, ±4 kV, ±8 kV Operation mode: working with service connected Function test: ok RF specification: ok Groups ≥ 2 5.6 EMC and ESD Features The following are the EMC design comments: Attention should be paid to static control in the manufacture, assembly, packaging, handling, storage process to reduce electrostatic damage to HUAWEI module. RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if the antenna port is protected by TVS (Transient Voltage Suppressor), which is resolved by making some adjustment on RF match circuit. TVS should be added on the USB port for ESD protection, and the parasitic capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode inductor should be added in parallel on D+/D- signal. TVS should be added on the USIM interface for ESD protection. The parasitic capacitance of TVS on USIM signal should be less than 10 pF. Resistors in parallel and a 10 nF capacitor should be added on RESIN_N signal to avoid shaking, and the distance between the capacitor and the related pin should be less than 100 mil. PCB routing should be V-type rather than T-type for TVS. An integrated ground plane is necessary for EMC design. The following are the requirements of ESD environment control: The electrostatic discharge protected area (EPA) must have an ESD floor whose surface resistance and system resistance are greater than 1 x 104 Ω while less than 1 x 109 Ω. The EPA must have a sound ground system without loose ground wires, and the ground resistance must be less than 4 Ω. The workbench for handling ESD sensitive components must be equipped with common ground points, the wrist strap jack, and ESD pad. The resistance between the jack and common ground point must be less than 4 Ω. The surface resistance and system resistance of the ESD pad must be less than 1 x 109 Ω. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 44 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Electrical and Reliability Features The EPA must use the ESD two-circuit wrist strap, and the wrist strap must be connected to the dedicated jack. The crocodile clip must not be connected to the ground. The ESD sensitive components, the processing equipment, test equipment, tools, and devices must be connected to the ground properly. The indexes are as follows: − Hard ground resistance < 4 Ω − 1 x 105 Ω ≤ Soft ground resistance < 1 x 109 Ω − 1 x 105 Ω ≤ ICT fixture soft ground resistance < 1 x 1011 Ω − The electronic screwdriver and electronic soldering iron can be easily oxidized. Their ground resistance must be less than 20 Ω. The parts of the equipment, devices, and tools that touch the ESD sensitive components and moving parts that are close to the ESD sensitive components must be made of ESD materials and have sound ground connection. The parts that are not made of ESD materials must be handled with ESD treatment, such as painting the ESD coating or ionization treatment (check that the friction voltage is less than 100 V). Key parts in the production equipment (parts that touch the ESD sensitive components or parts that are within 30 cm away from the ESD sensitive components), including the conveyor belt, conveyor chain, guide wheel, and SMT nozzle, must all be made of ESD materials and be connected to the ground properly (check that the friction voltage is less than 100 V). Engineers that touch IC chips, boards, modules, and other ESD sensitive components and assemblies must wear ESD wrist straps, ESD gloves, or ESD finger cots properly. Engineers that sit when handling the components must all wear ESD wrist straps. Noticeable ESD warning signs must be attached to the packages and placement areas of ESD sensitive components and assemblies. Boards and IC chips must not be stacked randomly or be placed with other ESD components. Effective shielding measures must be taken on the ESD sensitive materials that are transported or stored outside the EPA. HUAWEI MU709 module does not include any protection against overvoltage. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 45 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide 6 Mechanical Specifications Mechanical Specifications 6.1 About This Chapter This chapter mainly describes mechanical specifications of MU709 module, including: Dimensions and Interfaces Dimensions of the Mini PCI Express Connector Packaging Specification Selection for Fasteners Antenna Plug Thermal Design Guide 6.2 Dimensions and Interfaces The dimensions (L × W × H) of the MU709 module is 51 mm × 30.4 mm × 3.27 mm. Figure 6-1 shows the dimensions of MU709 module in detail. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 46 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications Figure 6-1 Dimensions of the MU709 module (Unit: mm) 6.3 Dimensions of the Mini PCI Express Connector The Mini PCIe Adapter adopts a standard Mini PCI Express connector that has 52 pins and complies with the PCI Express Mini Card Electromechanical Specification Revision 2.0. Figure 6-2 shows a 52-pin Mini PCI Express connector (take the Molex 67910002 as an example). Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 47 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications Figure 6-2 Dimensions of the Mini PCI Express connector (Unit: mm) 6.4 Packaging HUAWEI Mini PCIe module uses anti-vibration foam and ESD bag into cartons. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 48 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications 6.5 Specification Selection for Fasteners 6.5.1 Installing the Mini PCIe Adapter on the Main Board To install the Mini PCIe Adapter on the main board, do the following: Step 1 Insert the Mini PCIe Adapter into the Mini PCI Express connector on the main board. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 49 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications Step 2 Press downwards to fix the Mini PCIe Adapter in the module slot. Step 3 Use a screwdriver to fix the Mini PCIe Adapter on the main board with two screws provided in the Mini PCIe Adapter packing box. Step 4 Insert the connector of the main antenna into the MAIN antenna interface (M) of the Mini PCIe Adapter according to the indication on the label of the Mini PCIe Adapter. Insert the connector of the auxiliary antenna into the AUX antenna interface (A) of the Mini PCIe Adapter of the Mini PCIe Adapter in the same way. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 50 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications Insert the antenna connectors vertically into the antenna interfaces of the Mini PCIe Adapter. Do not press or squeeze the antenna cable or damage the connectors. Otherwise, the wireless performance of the Mini PCIe Adapter may be reduced or the Mini PCIe Adapter cannot work normally. Ensure that the antenna cables are routed through the channel in the frame of the PC and do not lay the cables across the raised edges of the frame. The module could not be installed or removed when the host is powered on. Otherwise, it may result in permanent damage to the module. 6.5.2 Romoving the Mini PCIe Adapter from the Main Board Step 1 Disconnect the antenna cables from the Mini PCIe Adapter. You can lift the connectors using a small screwdriver. Step 2 Remove the two screws with the screwdriver. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 51 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications Step 3 Slide backwards the two clips to release the Mini PCIe Adapter from the slot. Then, lift up the Mini PCIe Adapter. 6.6 Antenna Plug Figure 6-3 Mating the plug 1. Align the mating tool or the mating end of the tool over the plug end of the cable assembly. 2. Firmly place the tool over the plug until it is secured in the tool. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 52 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications 3. Place the plug cable assembly (held in the tool) over the corresponding receptacle. 4. Assure that the plug and receptacle are aligned press-down perpendicular to the mounting surface until both connectors are fully mated. 5. Remove the mating tool by pulling it up carefully. Figure 6-4 Unmating the plug The extraction tool is recommended. Any attempt of unmating by pulling on the cable may result in damage and influence the mechanical/electrical performance. It is recommended not to apply any pull forces after the bending of the cable, as described in Figure 6-5 . Figure 6-5 Do not apply any pull forces after the bending of the cable 6.7 Thermal Design Guide When using in the network, the MU709 module (Mini PCIe) have high power consumption. To improve the module reliability and stability, focus on the thermal design of the device to speed up heat dissipation. Take the following heat dissipation measures: Do not hollow out the customer PCB. Attach the thermal conductive material between the Mini PCIe and the customer PCB. The recommended thermal conductivity of the thermal conductive material is 1.0 W/m-k or higher (recommended manufacturers: Laird and Bergquist). The Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 53 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications dimensions (W x D) of the thermal conductive material are 38 mm x 28 mm (1.50 in. x 1.10 in.), and its height depends on the height of the Mini PCIe connector you use and the method for installing the Mini PCIe. When deciding the height of the thermal conductive material, you are advised to obey the following rule: After the Mini PCIe is fastened to the customer PCB, the compression amount of the thermal conductive material accounts for 15% to 30% of the thermal conductive material size. For example, if you use a connector shown in the following figure and install the Mini PCIe like this, the recommended height of the thermal conductive material is 1.8 mm (0.07 in.). Mini PCIe Thermal Conductive Material Customer PCB On the customer PCB, reserve two metal screw holes, which are connected to the PCB ground plane. When installing the Mini PCIe, use two metal screws to fasten the Mini PCIe to the customer PCB. See the following figure. Screw Mini PCIe Thermal Conductive Material Customer PCB Ensure that the air flow around the Mini PCIe is sufficient. Try not to place any component in the Mini PCIe's projection region on the customer PCB. Do not place components with 1.5 W or higher power consumption or heat sensitive components (such as crystals) near the Mini PCIe. Use a large customer PCB. The recommended size (W x D) is 70 mm x 70 mm (2.76 in. x 2.76 in.). If the thermal conductive material is attached between the Mini PCIe and the customer PCB, then the heat dissipation performance will be better for multilayer PCB. Apply copper to the region for attaching the thermal conductive material to the customer PCB. Try to use the continuous ground plane design on the customer PCB, and each ground plane must be connected through holes. Therefore, reserve holes as many as possible. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 54 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Mechanical Specifications If you do not take the preceding heat dissipation measures, the overheat protection mechanism is triggered due to overheated Mini PCIe and the network connection is terminated when the Mini PCIe keeps working in enclosed space with a 70ºC temperature and a big current for a period of time. You can resume the network connection only after the temperature drops. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 55 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Certifications 7 Certifications 7.1 About This Chapter This chapter gives a general description of certifications of MU709 module. 7.2 Certifications Table 7-1 shows certifications of the MU709 module have been implemented. For more demands, please contact us for more details about this information. Table 7-1 Product Certifications Certification Model name MU709s-2 MU709s-6 CE √ √ CCC √ - FCC - √ Anetel - √ RoHS √ √ WEEE √ √ NAL √ - SRRC √ - REACH √ √ RCM - √ NCC √ √ Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 56 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide 8 Safety Information Safety Information Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed. 8.1 Interference Power off your wireless device if using the device is prohibited. Do not use the wireless device when it causes danger or interference with electric devices. 8.2 Medical Device Power off your wireless device and follow the rules and regulations set forth by the hospitals and health care facilities. Some wireless devices may affect the performance of the hearing aids. For any such problems, consult your service provider. Pacemaker manufacturers recommend that a minimum distance of 15 cm be maintained between the wireless device and a pacemaker to prevent potential interference with the pacemaker. If you are using an electronic medical device, consult the doctor or device manufacturer to confirm whether the radio wave affects the operation of this device. 8.3 Area with Inflammables and Explosives To prevent explosions and fires in areas that are stored with inflammable and explosive devices, power off your wireless device and observe the rules. Areas stored with inflammables and explosives include but are not limited to the following: Gas station Fuel depot (such as the bunk below the deck of a ship) Container/Vehicle for storing or transporting fuels or chemical products Area where the air contains chemical substances and particles (such as granule, dust, or metal powder) Area indicated with the "Explosives" sign Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 57 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Safety Information Area indicated with the "Power off bi-direction wireless equipment" sign Area where you are generally suggested to stop the engine of a vehicle 8.4 Traffic Security Observe local laws and regulations while using the wireless device. To prevent accidents, do not use your wireless device while driving. RF signals may affect electronic systems of motor vehicles. For more information, consult the vehicle manufacturer. In a motor vehicle, do not place the wireless device over the air bag or in the air bag deployment area. Otherwise, the wireless device may hurt you owing to the strong force when the air bag inflates. 8.5 Airline Security Observe the rules and regulations of airline companies. When boarding or approaching a plane, power off your wireless device. Otherwise, the radio signal of the wireless device may interfere with the plane control signals. 8.6 Safety of Children Do not allow children to use the wireless device without guidance. Small and sharp components of the wireless device may cause danger to children or cause suffocation if children swallow the components. 8.7 Environment Protection Observe the local regulations regarding the disposal of your packaging materials, used wireless device and accessories, and promote their recycling. 8.8 WEEE Approval The wireless device is in compliance with the essential requirements and other relevant provisions of the Waste Electrical and Electronic Equipment Directive 2012/19/EU (WEEE Directive). 8.9 RoHS Approval The wireless device is in compliance with the restriction of the use of certain hazardous substances in electrical and electronic equipment Directive 2011/65/EU (RoHS Directive). Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 58 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Safety Information 8.10 Laws and Regulations Observance Observe laws and regulations when using your wireless device. Respect the privacy and legal rights of the others. 8.11 Care and Maintenance It is normal that your wireless device gets hot when you use or charge it. Before you clean or maintain the wireless device, stop all applications and power off the wireless device. Use your wireless device and accessories with care and in clean environment. Keep the wireless device from a fire or a lit cigarette. Protect your wireless device and accessories from water and vapour and keep them dry. Do not drop, throw or bend your wireless device. Clean your wireless device with a piece of damp and soft antistatic cloth. Do not use any chemical agents (such as alcohol and benzene), chemical detergent, or powder to clean it. Do not leave your wireless device and accessories in a place with a considerably low or high temperature. Use only accessories of the wireless device approved by the manufacture. Contact the authorized service center for any abnormity of the wireless device or accessories. Do not dismantle the wireless device or accessories. Otherwise, the wireless device and accessories are not covered by the warranty. The device should be installed and operated with a minimum distance of 20 cm between the radiator and your body. 8.12 Emergency Call This wireless device functions through receiving and transmitting radio signals. Therefore, the connection cannot be guaranteed in all conditions. In an emergency, you should not rely solely on the wireless device for essential communications. 8.13 Regulatory Information The following approvals and notices apply in specific regions as noted. 8.13.1 CE Approval (European Union) The wireless device is approved to be used in the member states of the EU. The wireless device is in compliance with the essential requirements and other relevant provisions of the Radio and Telecommunications Terminal Equipment Directive 1999/5/EC (R&TTE Directive). Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 59 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide Safety Information 8.13.2 FCC Statement Federal Communications Commission Notice (United States): Before a wireless device model is available for sale to the public, it must be tested and certified to the FCC that it does not exceed the limit established by the government-adopted requirement for safe exposure. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Warning: Changes or modifications made to this equipment not expressly approved by HUAWEI may void the FCC authorization to operate this equipment. Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 60 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide 9 Appendix A Circuit of Typical Interface Appendix A Circuit of Typical Interface C3 150uF C4 C5 150uF 150uF R1 10K VCC From Host J1 VCC _3 V3 P C M _C LK P C M _DOU T P C M _DIN P C M _S YN C VCC_3V3 G ND 1 NC USIM_PW R USIM_DATA USIM_CLK USIM_RESE T NC G ND 4 NC NC VCC_3V3 G ND 6 NC NC NC G ND 9 USB _DM USB _DP G ND 12 LED_WW AN# NC NC NC G ND 14 VCC_3V3 W AK E# NC NC NC G ND 2 NC NC G ND 3 NC NC G ND 5 NC NC G ND 7 G ND 8 NC NC G ND 10 GND11 VCC_3V3 VCC_3V3 GND13 P C M _C LK P C M _DOU T P C M _DIN P C M _S YN C VCC _3 V3 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 USB _DM USIM _P W R USIM _DA TA USIM _C LK USIM _R ES ET DN I,R eserve for US B eye d ebug 1.8pF 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 to US B 2.0 interfac e DN I C7 Wake the host Open drain,active low USB _DP VCC _3 V3 USB _DM USB _DP LE D_WW AN D1 Note the sign al d irec ti on o f P C M _DOU T,P C M _DIN R2 470 VCC _3 V3 VCC _3 V3 C1 C2 100nF 10pF J2 10 Don't support Hot Plug. USIM _P W R R3 4 0 USIM _R ES ET R4 0 USIM _C LK USIM _DA TA R5 R6 0 0 GN D 4 33pF 5 33pF 6 33pF 33pF Issue 04 (2015-06-25) 3 C 12 2 C 11 1 C 10 8 GN D S3 9 M2 D2 C9 1uF S2 CD 6 VP P 3 CLK 7 I/ O 11 C8 M1 1 VCC 5 G ND 2 RST Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 61 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide 10 9BAppendix B Acronyms and Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion 3GPP Third Generation Partnership Project AUX Auxiliary CCC China Compulsory Certification CE European Conformity DC Direct Current EDGE Enhanced Data Rate for GSM Evolution EMC Electromagnetic Compatibility ESD Electrostatic Discharge EU European Union FCC Federal Communications Commission GPIO General-purpose I/O GPRS General Packet Radio Service GSM Global System for Mobile Communication HSDPA High-Speed Downlink Packet Access HSPA High Speed Packet Access HSUPA High Speed Up-link Packet Access ISO International Standards Organization LDO Low-Dropout LED Light-Emitting Diode OC Open Collector Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 62 HUAWEI MU709 Series HSPA+ Mini PCIe Module Hardware Guide 9BAppendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion PCB Printed Circuit Board RF Radio Frequency RoHS Restriction of the Use of Certain Hazardous Substances TVS Transient Voltage Suppressor UMTS Universal Mobile Telecommunications System USB Universal Serial Bus USIM Universal Subscriber Identity Module VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access WEEE Waste Electrical and Electronic Equipment Issue 04 (2015-06-25) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 63
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