Huawei MU709 Series HSPA Mini PCIe Module Hardware Guide (V100R001 04, English)

2015-07-02

User Manual: Huawei

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Page Count: 63

1 Introduction
2 Overall Description
3 Description of the Application Interfaces
4 RF Specifications
5 Electrical and Reliability Features
6 Mechanical Specifications
7 Certifications
- 7.1 About This Chapter
- 7.2 Certifications
8 Safety Information
9 Appendix A Circuit of Typical Interface
10 Appendix B Acronyms and Abbreviations

HUAWEI MU709 Series HSPA+ Mini PCIe Module

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Date 2015-06-25

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HUAWEI MU709 Series HSPA+ Mini PCIe Module

Hardware Guide

About This Document

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About This Document

Revision History

Document

Version

Date Chapter Descriptions

01 2014-09-15 Creation

02 2014-09-18 3.3.2 Updated section 3.3.2: Reset the Module

03 2015-02-16 All Added the description of MU709s-6 module

04 2015-06-25 2.2 Updated Table 2-1: Features

5.3 Updated Table 5-2: Operating and storage

temperatures

7.2 Updated Table 7-1: Product Certifications

Scope

MU709s-2

MU709s-6

HUAWEI MU709 Series HSPA+ Mini PCIe Module

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Contents

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Contents

1 Introduction.................................................................................................................................... 7

2 Overall Description ...................................................................................................................... 8

2.1 About This Chapter ........................................................................................................................... 8

2.2 Function Overview............................................................................................................................ 8

2.3 Circuit Block Diagram ....................................................................................................................... 9

3 Description of the Application Interfaces .............................................................................. 11

3.1 About This Chapter .......................................................................................................................... 11

3.2 Mini PCIe Interface .......................................................................................................................... 11

3.3 Power Interface .............................................................................................................................. 16

3.3.1 Sources and Grounds ............................................................................................................ 16

3.3.2 Power Supply Time Sequence .............................................................................................. 17

3.4 Signal Control Interface .................................................................................................................. 18

3.4.1 Overview ................................................................................................................................ 18

3.4.2 WAKE# Signal ....................................................................................................................... 18

3.4.3 RESIN_N Signal .................................................................................................................... 19

3.4.4 LED_WWAN# Signal ............................................................................................................. 20

3.5 USB Interface ................................................................................................................................. 21

3.5.1 Overview ................................................................................................................................ 21

3.5.2 Circuit Recommended for the USB Interface ........................................................................ 22

3.6 USIM Card Interface ...................................................................................................................... 22

3.6.1 Overview ................................................................................................................................ 22

3.6.2 Circuit Recommended for the USIM Card Interface .............................................................. 23

3.7 Audio Interface ............................................................................................................................... 24

3.7.1 Overview ................................................................................................................................ 24

3.7.2 Circuit Recommended for the Audio Interface ...................................................................... 25

3.8 NC Pins .......................................................................................................................................... 25

4 RF Specifications ......................................................................................................................... 27

4.1 About This Chapter ......................................................................................................................... 27

4.2 Operating Frequencies ................................................................................................................... 27

4.3 Conducted RF Measurement ......................................................................................................... 28

4.3.1 Test Environment ................................................................................................................... 28

4.3.2 Test Standards ....................................................................................................................... 28

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4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 28

4.4.1 Conducted Receive Sensitivity .............................................................................................. 28

4.4.2 Conducted Transmit Power ................................................................................................... 29

4.5 Antenna Design Requirements ...................................................................................................... 30

4.5.1 Antenna Design Indicators..................................................................................................... 30

4.5.2 Interference ........................................................................................................................... 33

4.5.3 GSM/WCDMA Antenna Requirements .................................................................................. 33

5 Electrical and Reliability Features ........................................................................................... 35

5.1 About This Chapter ......................................................................................................................... 35

5.2 Absolute Ratings ............................................................................................................................ 35

5.3 Operating and Storage Temperatures ............................................................................................ 35

5.4 Power Supply Features .................................................................................................................. 36

5.4.1 Input Power Supply ............................................................................................................... 36

5.4.2 Power Consumption .............................................................................................................. 37

5.5 Reliability Features ......................................................................................................................... 41

5.6 EMC and ESD Features ................................................................................................................. 44

6 Mechanical Specifications ......................................................................................................... 46

6.1 About This Chapter ......................................................................................................................... 46

6.2 Dimensions and Interfaces ............................................................................................................. 46

6.3 Dimensions of the Mini PCI Express Connector ............................................................................ 47

6.4 Packaging ....................................................................................................................................... 48

6.5 Specification Selection for Fasteners ............................................................................................. 49

6.5.1 Installing the Mini PCIe Adapter on the Main Board .............................................................. 49

6.5.2 Romoving the Mini PCIe Adapter from the Main Board ........................................................ 51

6.6 Antenna Plug .................................................................................................................................. 52

6.7 Thermal Design Guide ................................................................................................................... 53

7 Certifications ................................................................................................................................ 56

7.1 About This Chapter ......................................................................................................................... 56

7.2 Certifications ................................................................................................................................... 56

8 Safety Information ...................................................................................................................... 57

8.1 Interference .................................................................................................................................... 57

8.2 Medical Device ............................................................................................................................... 57

8.3 Area with Inflammables and Explosives ......................................................................................... 57

8.4 Traffic Security ................................................................................................................................ 58

8.5 Airline Security ................................................................................................................................ 58

8.6 Safety of Children ........................................................................................................................... 58

8.7 Environment Protection .................................................................................................................. 58

8.8 WEEE Approval .............................................................................................................................. 58

8.9 RoHS Approval ............................................................................................................................... 58

8.10 Laws and Regulations Observance ............................................................................................. 59

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8.11 Care and Maintenance ................................................................................................................. 59

8.12 Emergency Call ............................................................................................................................ 59

8.13 Regulatory Information ................................................................................................................. 59

8.13.1 CE Approval (European Union) ........................................................................................... 59

8.13.2 FCC Statement .................................................................................................................... 60

9 Appendix A Circuit of Typical Interface ................................................................................ 61

10 Appendix B Acronyms and Abbreviations .......................................................................... 62

HUAWEI MU709 Series HSPA+ Mini PCIe Module

Hardware Guide

Introduction

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1 Introduction

This document describes the hardware application interfaces and air interfaces

provided by HUAWEI MU709 series (MU709s-2 and MU709s-6) HSPA+ Mini PCIe

Module (hereinafter referred to as the MU709 module).

This document helps hardware engineer to understand the interface specifications,

electrical features and related product information of the MU709 module.

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Overall Description

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2 Overall Description

2.1 About This Chapter

This chapter gives a general description of the MU709 module and provides:

- Function Overview

- Circuit Block Diagram

2.2 Function Overview

Table 2-1 Features

Feature Description

Physical

Dimensions

- Dimensions: (L × W × H): 51 mm × 30.4 mm × 3.27 mm

- Weight: about 12 g

Operating

Bands

- MU709s-2

WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 8, all bands with

diversity

GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz

- MU709s-6

WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5, all

bands with diversity

GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz

Operating

Temperature Normal operating temperature: –20°C to +70°C

Extended operating temperature[1]: –30°C to +75°C

Storage

Temperature –40°C to +85°C

Humility RH5% to RH95%

Power

Voltage DC 3.0 V to 3.6 V (typical value is 3.3 V)

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Overall Description

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Feature Description

Commands See the HUAWEI MU709 Series HSPA+ Module AT Command

Interface Specification.

Application

Interface

(52-pin Mini

PCIe interface

One standard USIM card (Class B and Class C)

Audio interface: PCM interface

USB 2.0 (High Speed)

RESIN_N: Reset module

WAKE#: Wake up signal

LED_WWAN#: Active-low LED signal indicating the state of the

module

Antenna

connector

- WWAN MAIN antenna connector x1

- WWAN AUX antenna connector x1

SMS New message alert

Management of SMS: read SMS, write SMS, send SMS, delete

SMS and list SMS

Supports MO and MT: Point-to-point

Data Services GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s

EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s

WCDMA PS: UL 384 kbit/s; DL 384 kbit/s

HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s

Operating

Systems

Android 2.x/3.x/4.x

Linux (Kernel 2.6.18 or later)

Windows 7/8/8.1

Windows CE 5.0/6.0/7.0

- [1]: When the ME909s LGA module works in the range from –30°C to –20°C or +70°C to

+75°C, NOT all their RF performances comply with 3GPP specifications.

- The thermal design must be implemented according to the chapter 6.7 Thermal Design

Guide. If not, the overheat protection mechanism will be triggered due to overheated Mini

PCIe and the network connection will be terminated.

2.3 Circuit Block Diagram

Figure 2-1 shows the circuit block diagram of the MU709 adapter. The major

functional unit of the Mini PCIe Adapter contains the following parts:

- Power supply circuit

HUAWEI MU709 Series HSPA+ Mini PCIe Module

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Overall Description

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- LGA Module

- Control signals

- Antenna Connectors

Figure 2-1 Circuit block diagram of the MU709 module

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Description of the Application Interfaces

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3 Description of the Application Interfaces

3.1 About This Chapter

This chapter mainly describes the external application interfaces of the MU709

module, including:

- Mini PCIe Interface

- Power Interface

- Signal Control Interface

- USB Interface

- USIM Card Interface

- Audio Interface

- NC Pins

3.2 Mini PCIe Interface

The MU709 module uses a Mini PCIe interface as its external interface. For details

about the module and dimensions, see Dimensions and Interfaces.

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Description of the Application Interfaces

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Figure 3-1 Sequence of Mini PCIe interface

Table 3-1 Pin definitions of the Mini PCIe Interface

No.

Pin Name Pad

Type

Description Parameter Min.

(V)

Typ.

(V)

Max.

(V)

Comments

Mini PCI

Express

Standard

Description

HUAWEI

Description

1 WAKE# WAKE# O Open

collector

active low

signal. This

signal is

used to wake

up the host.

- –0.3 - 0.45 -

2 3.3Vaux VCC_3V3 PI 3.3 V DC

supply input.

- 3.0 3.3 3.6 -

3 COEX1 NC - Not

connected

- - - - -

4 GND GND - Ground - - - - -

5 COEX2 NC - Not

connected

- - - - -

6 1.5 V NC - Not

connected

- - - - -

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No.

Pin Name Pad

Type

Description Parameter Min.

(V)

Typ.

(V)

Max.

(V)

Comments

Mini PCI

Express

Standard

Description

HUAWEI

Description

7 CLKREQ# NC - Not

connected

- - - - -

8 UIM_PWR USIM_PWR PO Power

source for

the external

USIM card

- –0.3 1.8 1.98 USIM_PW

R=1.8 V

- –0.3 3.0 3.3 USIM_PW

R=3.0 V

9 GND GND - Ground - - - - -

10 UIM_DATA USIM_DATA I/O External

USIM data

signal

VOH 0.7 x

USIM

_PW

- 3.3 USIM_PW

R=1.8 V or

3.0 V

VOL 0 - 0.2 x

USIM_

PWR

VIH 0.65 x

USIM

_PW

- 3.30

VIL 0 - 0.25x

USIM_

PWR

11 REFCLK- NC - Not

connected

- - - - -

12 UIM_CLK USIM_CLK O External

USIM clock

signal

VOH 0.7 x

USIM

_PW

- 3.3 USIM_PW

R=1.8 V or

3.0 V

VOL 0 - 0.2 x

USIM_

PWR

13 REFCLK+ NC - Not

connected

- - - - -

14 UIM_RESET USIM_RESE

O External

USIM reset

signal

VOH 0.7 x

USIM

_PW

- 3.3 USIM_PW

R=1.8 V or

3.0 V

VOL 0 - 0.2 x

USIM_

PWR

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No.

Pin Name Pad

Type

Description Parameter Min.

(V)

Typ.

(V)

Max.

(V)

Comments

Mini PCI

Express

Standard

Description

HUAWEI

Description

15 GND GND - Ground - - - - -

16 UIM_Vpp NC - Not

connected

- - - - -

17 Reserved NC - Not

connected

- - - - -

18 GND GND - Ground - - - - -

19 Reserved NC - Not

connected

- - - - -

20 W_DISABLE

NC - Not

connected

- - - - -

21 GND GND - Ground - - - - -

22 RERST# RESIN_N I Reset

module

Active-low

VIL –0.3 0 0.3 -

VIH 1.17 1.8 3.6 -

23 PERn0 NC - Not

connected

- - - - -

24 3.3Vaux VCC_3V3 PI 3.3 V DC

supply input.

- 3.0 3.3 3.6 -

25 PERp0 NC - Not

connected

- - - - -

26 GND GND - Ground - - - - -

27 GND GND - Ground - - - - -

28 1.5 V NC - Not

connected

- - - - -

29 GND GND - Ground - - - - -

30 SMB_CLK NC - Not

connected

- - - - -

31 PETn0 NC - Not

connected

- - - - -

32 SMB_DATA NC - Not

connected

- - - - -

33 PETp0 NC - Not

connected

- - - - -

34 GND GND - Ground - - - - -

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No.

Pin Name Pad

Type

Description Parameter Min.

(V)

Typ.

(V)

Max.

(V)

Comments

Mini PCI

Express

Standard

Description

HUAWEI

Description

35 GND GND - Ground - - - - -

36 USB_D- USB_DM I/O USB signal

D-

- - - - -

37 GND GND - Ground - - - - -

38 USB_D+ USB_DP I/O USB signal

D+

- - - - -

39 3.3Vaux VCC_3V3 PI 3.3 V DC

supply input.

- 3.0 3.3 3.6 -

40 GND GND - Ground - - - - -

41 3.3Vaux VCC_3V3 PI 3.3 V DC

supply input.

- 3.0 3.3 3.6 -

42 LED_WWAN

LED_WWAN

O Active-low

LED signal

indicating the

state of the

card.

VOL –0.3 - 0.45 -

43 GND GND - Ground - - - - -

44 LED_WLAN

NC - Not

connected

- - - - -

45 Reserved PCM_CLK O PCM

interface

clock

VOL –0.3 0 0.45 -

VOH 1.35 1.8 2.1 -

46 LED_WPAN

NC - Not

connected

- - - - -

47 Reserved PCM_DOUT O PCM I/F data

output

VOL –0.3 0 0.45 -

VOH 1.35 1.8 2.1 -

48 1.5 V NC - Not

connected

- - - - -

49 Reserved PCM_DIN I PCM I/F data

input

VIL –0.3 0 0.63 -

VIH 1.17 1.8 2.1 -

50 GND GND - Ground - - - - -

51 Reserved PCM_SYNC O PCM

interface

sync

VOL –0.3 0 0.45 -

VOH 1.35 1.8 2.1 -

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No.

Pin Name Pad

Type

Description Parameter Min.

(V)

Typ.

(V)

Max.

(V)

Comments

Mini PCI

Express

Standard

Description

HUAWEI

Description

52 3.3Vaux VCC_3V3 PI 3.3 V DC

supply input

- 3.0 3.3 3.6 -

- P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital

signal output; PO indicates power output pins; PI indicates power input pins.

- VIL indicates Low-level Input voltage; VIH indicates High-level Input voltage; VOL indicates

Low-level Output voltage; VOH indicates High-level Output voltage.

- The NC pins are floating and there are no signal connected to these pins. Therefore, these

pins should not be used.

3.3 Power Interface

3.3.1 Sources and Grounds

For the Mini PCIe Adapter, +3.3Vaux is the only voltage supply that is available. The

input voltage is 3.3 V±9%, as specified by PCI Express Mini Card Electromechanical

Specification Revision 1.2.

Table 3-2 Power and ground specifications

Pin No. Pin Name Pad

Type

Descriptiom Min.(V) Typ .(V) Max.(V)

2, 24, 39, 41 and 52 VCC_3V3 PI 3.3 V DC supply input 3.0 3.3 3.6

4, 9, 15, 18, 21, 26, 27,

29, 34, 35, 37, 40, 43

and 50

GND - Ground - - -

To minimize the RF radiation through the power lines, it is suggested to add ceramic capacitors

of 10 pF and 100 nF in the power lines beside the Mini PCIe connector on the host side.

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3.3.2 Power Supply Time Sequence

Power on Sequence

Figure 3-2 Power on timing sequence

Parameter Remarks Time (Nominal value) Unit

TPD+ Power Valid to USB D+ high 7.0 s

Do not toggle RESIN_N pin during the power on sequence. Pull-Down RESIN_N pin will extend

time for module startup.

Power off Sequence

Cutting off the VCC_3V3 power supply will power off the module.

Figure 3-3 Power off timing sequence

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3.4 Signal Control Interface

3.4.1 Overview

The signal control part of the interface in the MU709 module consists of the following:

- WAKE# Signal

- RESIN_N Signal

- LED_WWAN# Signal

Table 3-3 Definitions of the pins on the signal control interface

No.

Pin Name Pad

Type

Description Parameter Min.

(V)

Typ.

(V)

Max.

(V)

1 WAKE# O Open collector active low signal.

This signal is used to wake up the

host.

- –0.3 - 0.45

22 RESIN_N I Reset module

Active-low

VIL –0.3 0 0.3

VIH 1.17 1.8 3.6

42 LED_WWAN# O Active-low LED signal indicating

the state of the card.

VOL –0.3 - 0.45

3.4.2 WAKE# Signal

WAKE# signal supports software control.

This signal is used for module to wake up the host. It is designed as an OC (Open

Collector) gate, so it should be pulled up by the host and it is active-low.

When the module wakes up the host, the WAKE# pin will output low-level-voltage for

1s to wake up the host.

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Figure 3-4 Connections of the WAKE# pin

3.4.3 RESIN_N Signal

The RESIN_N signal is used to reset the module's system. When the module software

stops responding, the RESIN_N pin can be pulled down to reset the module

hardware.

The RESIN_N signal is internally pulled up to 1.8 V, and it turns on automatically when

the VCC_3V3 is pulled up. The RESIN_N signal is active-low.

Figure 3-5 Connections of the RESIN_N pin

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- As the RESIN_N signal is relatively sensitive, it is recommended that you install a

10 nF–0.1 µF capacitor near the RESIN_N pin of the interface for filtering. In

addition, when you design a circuit on the PCB of the interface board, it is

recommended that the circuit length should not exceed 20 mm and that the circuit

should be kept at a distance of 2.54 mm (100 mil) at least from the PCB edge.

Furthermore, you need to wrap the area adjacent to the signal wire with a ground

wire. Otherwise, the module may be reset due to interference.

- The maximum Forward Voltage Drop of the diode used in the module is 0.6 V. So

when the host wants to reset the module, the low-level-voltage in the RESIN_N pin

should be below 50 mV.

The MU709 module supports hardware reset function. If the software of the MU709

module stops responding, you can reset the hardware through the RESIN_N signal as

shown in Figure 3-6 . When a low-level pulse is supplied through the RESIN_N pin,

the hardware will be reset. After the hardware is reset, the software starts powering on

the module and reports relevant information according to the actual settings. For

example, the AT command automatically reports ^SYSSTART.

Figure 3-6 Reset pulse timing

- The RESIN_N pin must not be pulled down for more than 1s.

- The RESIN_N pin is optional, which can not be connected.

3.4.4 LED_WWAN# Signal

MU709 series module provides an LED_WWAN# signal to indicate the work status.

This function is disabled by default, it is controlled by AT^LEDCTRL. For details about

the command, please refer to HUAWEI MU709 Series HSPA+ Module AT Command

Interface Specification.

Table 3-4 State of the LED_WWAN# pin

No. Operating Status LED_WWAN#

1 No service or Restricted service Outputs: low (0.1s)-high (0.1s)-low

(0.1s)-high (1.7s)

2s cycle

2 Register to the network Outputs: low (0.1s)-high (1.9s)

2s cycle

3 Dial-up successfully Outputs: low

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Figure 3-7 shows the recommended circuits of the LED_WWAN# pin. According to

LED feature, you can adjust the LED brightness by adjusting the resistance of resistor

Figure 3-7 Driving circuit

3.5 USB Interface

3.5.1 Overview

The MU709 module is compliant with USB 2.0 protocol. The USB interface is powered

directly from the VBAT supply. The USB input/output lines are compatible with the

USB 2.0 signal specifications. Figure 3-8 shows the circuit of the USB interface.

Table 3-5 Definition of the USB interface

Pin No. Pin Name Pad Type Description Parameter Min.(V) Typ.(V) Max.(V)

36 USB_DM I/O USB signal D- - - - -

38 USB_DP I/O USB signal D+ - - - -

According to USB protocol, for bus timing or electrical characteristics of MU709 USB

signal, please refer to the chapter 7.3.2 of Universal Serial Bus Specification 2.0.

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3.5.2 Circuit Recommended for the USB Interface

Figure 3-8 Recommended circuit of USB interface

3.6 USIM Card Interface

3.6.1 Overview

The MU709 module provides a USIM card interface complying with the ISO 7816-3

standard and supports both Class B and Class C USIM cards.

Table 3-6 USIM card interface signals

No.

Pin Name Pad

Type

Description Parameter Min. (V) Typ.

(V)

Max. (V) Comments

14 USIM_RESET O External USIM

reset signal

VOH 0.7 x

USIM_PWR

- 3.3 USIM_PWR=1.8

V or 3.0 V

VOL 0 - 0.2 x

USIM_PWR

12 USIM_CLK O External USIM

clock signal

VOH 0.7 x

USIM_PWR

- 3.3 USIM_PWR=1.8

V or 3.0 V

VOL 0 - 0.2 x

USIM_PWR

10 USIM_DATA I/O External USIM

data signal

VIH 0.7 x

USIM_PWR

- 3.3

USIM_PWR=1.8

V or 3.0 V

VIL 0 - 0.2 x

USIM_PWR

VOH 0.65 x

USIM_PWR

- 3.3

VOL 0 - 0.25 x

USIM_PWR

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No.

Pin Name Pad

Type

Description Parameter Min. (V) Typ.

(V)

Max. (V) Comments

8 USIM_PWR PO

Power source

for the

external USIM

card

- –0.3 1.8 1.98 USIM_PWR=1.8

- –0.3 3.0 3.3 USIM_PWR=3.0

3.6.2 Circuit Recommended for the USIM Card Interface

As the Mini PCIe Adapter is not equipped with a USIM socket, you need to place a

USIM socket on the user interface board. Figure 3-9 shows the circuit of the USIM

card interface.

Figure 3-9 Circuit of the USIM card interface

- To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic

compatibility (EMC) authentication, the USIM socket should be placed near the

PCIe interface (it is recommended that the PCB circuit connects the PCIe interface

and the USIM socket does not exceed 100 mm), because a long circuit may lead to

wave distortion, thus affecting signal quality.

- It is recommended that you wrap the area adjacent to the USIM_CLK and

USIM_DATA signal wires with ground. The Ground pin of the USIM socket and the

Ground pin of the USIM card must be well connected to the power Ground pin

supplying power to the PCIe Adapter.

- A 100 nF capacitor and1 μF capacitor are placed between the USIM_PWR and

Ground pins in a parallel manner (If USIM_PWR circuit is too long, that the larger

capacitance such as 4.7 μF can be employed if necessary). Three 33 pF

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capacitors are placed between the USIM_DATA and Ground pins, the

USIM_RESET and Ground pins, and the USIM_CLK and Ground pins in parallel to

filter interference from RF signals.

- It is recommended to take electrostatic discharge (ESD) protection measures near

the USIM card socket. The TVS diode with Vrwm of 5 V and junction capacitance

less than 10 pF must be placed as close as possible to the USIM socket, and the

Ground pin of the ESD protection component is well connected to the power

Ground pin that supplies power to the PCIe Adapter.

3.7 Audio Interface

3.7.1 Overview

The MU709 module provides one PCM digital audio interface. Table 3-7 lists the

signals on the digital audio interface.

Table 3-7 Signals on the digital audio interface

No.

Pin Name Pad

Type

Description Parameter Min.(V) Typ.(V) Max.(V)

45 PCM_CLK O PCM clock VOL –0.3 0 0.45

VOH 1.35 1.8 2.1

47 PCM_DOUT O PCM I/F data output VOL –0.3 0 0.45

VOH 1.35 1.8 2.1

49 PCM_DIN I PCM I/F data input VIL –0.3 0 0.63

VIH 1.17 1.8 2.1

51 PCM_SYNC O PCM interface sync VOL –0.3 0 0.45

VOH 1.35 1.8 2.1

The MU709 module interface enables communication with an external codec to

support linear format.

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3.7.2 Circuit Recommended for the Audio Interface

Figure 3-10 Circuit diagram of the interface of the PCM (MU709 module is used as PCM

master)

Figure 3-11 Circuit diagram of the interface of the PCM (MU709 is used as PCM slave)

- MU709 module supports both master and slave mode.

- PCM_SYNC and PCM_CLK: Output when PCM is in master mode; Input when PCM is in

slave mode.

- It is recommended that a TVS be used on the related interface, to prevent electrostatic

discharge and protect integrated circuit (IC) components.

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3.8 NC Pins

The MU709 module has some NC pins. All of NC pins should not be connected.

Please keep these pins open.

Table 3-8 NC pins

Pin No. Pin

Name

Pad

Type

Description Parameter Min.(

Typ.(

Max.(

3, 5–7, 11, 13, 16, 17,

19, 20, 23, 25, 28,

30–33, 44, 46 and 48

NC - Not connected, please

keep open.

- - - -

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4 RF Specifications

4.1 About This Chapter

This chapter describes the RF specifications of the MU709 module, including:

- Operating Frequencies

- Conducted RF Measurement

- Conducted Rx Sensitivity and Tx Power

- Antenna Design Requirements

4.2 Operating Frequencies

Table 4-1 and Table 4-2 show the RF bands supported by the MU709 module.

Table 4-1 RF bands of the MU709s-2 module

Operating Band Tx Rx

UMTS Band 1 1920 MHz–1980 MHz 2110 MHz–2170 MHz

UMTS Band 8 880 MHz–915 MHz 925 MHz–960 MHz

GSM 850 824 MHz–849 MHz 869 MHz–894 MHz

GSM 900 880 MHz–915 MHz 925 MHz–960 MHz

GSM 1800 (DCS) 1710 MHz–1785 MHz 1805 MHz–1880 MHz

GSM 1900 (PCS) 1850 MHz–1910 MHz 1930 MHz–1990 MHz

Table 4-2 RF bands of MU709s-6 module

Operating Band Tx Rx

UMTS Band 1 1920 MHz–1980 MHz 2110 MHz–2170 MHz

UMTS Band 2 1850 MHz–1910 MHz 1930 MHz–1990 MHz

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Operating Band Tx Rx

UMTS Band 5 824 MHz–849 MHz 869 MHz–894 MHz

GSM 850 824 MHz–849 MHz 869 MHz–894 MHz

GSM 900 880 MHz–915 MHz 925 MHz–960 MHz

GSM 1800 (DCS) 1710 MHz–1785 MHz 1805 MHz–1880 MHz

GSM 1900 (PCS) 1850 MHz–1910 MHz 1930 MHz–1990 MHz

4.3 Conducted RF Measurement

4.3.1 Test Environment

Test instrument R&S CMU200

Power supply KEITHLEY 2306

RF cable for testing L08-C014-350 of DRAKA COMTEQ or Rosenberger

Cable length: 29 cm

- The compensation for different frequency bands relates to the cable and the test

environment.

- The instrument compensation needs to be set according to the actual cable conditions.

4.3.2 Test Standards

Huawei modules meet 3GPP test standards. Each module passes strict tests at the

factory and thus the quality of the modules is guaranteed.

4.4 Conducted Rx Sensitivity and Tx Power

4.4.1 Conducted Receive Sensitivity

The conducted receive sensitivity is a key parameter that indicates the receiver

performance of MU709 module. The conducted receive sensitivity refers to the

weakest signal that the module at the antenna port can receive. Table 4-3 and Table

4-4 list the typical tested values of the MU709 module.

Table 4-3 MU709s-2 module conducted Rx sensitivity

Band Typical value (Unit:

dBm) Note

GSM 850 –109.5 BER Class II < 2.44%

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Band Typical value (Unit:

dBm) Note

GSM 900 –109 BER Class II < 2.44%

GSM 1800 (DCS) –108 BER Class II < 2.44%

GSM 1900 (PCS) –108 BER Class II < 2.44%

WCDMA Band 1 –109 BER < 0.1%

WCDMA Band 8 –110 BER < 0.1%

Table 4-4 MU709s-6 module conducted Rx sensitivity

Band Test Value (Unit: dBm) Note

GSM 850 –109.5 BER Class II < 2.44%

GSM 900 –109 BER Class II < 2.44%

GSM 1800 (DCS) –108 BER Class II < 2.44%

GSM 1900 (PCS) –108 BER Class II < 2.44%

WCDMA Band 1 –109 BER < 0.1%

WCDMA Band 2 –110.5 BER < 0.1%

WCDMA Band 5 –111.5 BER < 0.1%

The test values are the average of some test samples.

4.4.2 Conducted Transmit Power

The conducted transmit power is another indicator that measures the performance of

MU709 module. The conducted transmit power refers to the maximum power that the

module tested at the antenna connector can transmit. According to the 3GPP protocol,

the required transmit power varies with the power class. Table 4-5 and Table 4-6 list

the typical tested values of the MU709 module.

Table 4-5 MU709s-2 module conducted Tx power

Band Typical Value (Unit: dBm) Note (Unit: dB)

GSM 850 GMSK(1Tx Slot) 32 ±1.5

8PSK(1Tx Slot) 26.5 ±2

GSM 900 GMSK(1Tx Slot) 32 ±1.5

8PSK(1Tx Slot) 26.5 ±2

GSM 1800 GMSK(1Tx Slot) 29 ±1.5

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Band Typical Value (Unit: dBm) Note (Unit: dB)

(DCS)

8PSK(1Tx Slot) 25 ±2

GSM 1900

(PCS) GMSK(1Tx Slot) 29 ±1.5

8PSK(1Tx Slot) 25 ±2

WCDMA Band 1 23 ±1

WCDMA Band 8 23 -1.5/+1

Table 4-6 MU709s-6 module conducted Tx power

Band Typical Value (Unit: dBm) Note (Unit: dB)

GSM 850 GMSK(1Tx Slot) 32 ±1.5

8PSK(1Tx Slot) 26.5 ±2

GSM 900 GMSK(1Tx Slot) 32 ±1.5

8PSK(1Tx Slot) 26.5 ±2

GSM 1800

(DCS) GMSK(1Tx Slot) 29 ±1.5

8PSK(1Tx Slot) 25 ±2

GSM 1900

(PCS) GMSK(1Tx Slot) 29 ±1.5

8PSK(1Tx Slot) 25 ±2

WCDMA Band 1 23 ±1

WCDMA Band 2 23 ±1

WCDMA Band 5 23 -1.5/+1

4.5 Antenna Design Requirements

4.5.1 Antenna Design Indicators

Antenna Efficiency

Antenna efficiency is the ratio of the input power to the radiated or received power of

an antenna. The radiated power of an antenna is always lower than the input power

due to the following antenna losses: return loss, material loss, and coupling loss. The

efficiency of an antenna relates to its electrical dimensions. To be specific, the

antenna efficiency increases with the electrical dimensions. In addition, the

transmission cable from the antenna connector of PCIe Adapter to the antenna is also

part of the antenna. The cable loss increases with the cable length and the frequency.

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It is recommended that the cable loss is as low as possible, for example, U.FL-LP-088

made by HRS.

The following antenna efficiency (free space) is recommended for MU709 module to

ensure high radio performance of the module:

- Efficiency of the primary antenna: ≥ 40% (below 960 MHz); ≥ 50% (over 1710

MHz)

- Efficiency of the diversity antenna: ≥ half of the efficiency of the primary

antenna in receiving band

In addition, the efficiency should be tested with the transmission cable.

S11 or VSWR

S11 indicates the degree to which the input impedance of an antenna matches the

reference impedance (50 Ω). S11 shows the resonance feature and impedance

bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression

of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector

analyzer.

The following S11 value is recommended for the antenna of MU709 module:

- S11 of the primary antenna: ≤ –6 dB

- S11 of the diversity antenna: ≤ –6 dB

In addition, S11 is less important than the efficiency, and S11 has weak correlation to

wireless performance.

Isolation

For a wireless device with multiple antennas, the power of different antennas is

coupled with each other. Antenna isolation is used to measure the power coupling.

The power radiated by an antenna might be received by an adjacent antenna, which

decreases the antenna radiation efficiency and affects the running of other devices. To

avoid this problem, evaluate the antenna isolation as sufficiently as possible at the

early stage of antenna design.

Antenna isolation depends on the following factors:

- Distance between antennas

- Antenna type

- Antenna direction

The primary antenna must be placed as near as possible to the MU709 module to

minimize the cable length. The diversity antenna needs to be installed

perpendicularly to the primary antenna. The diversity antenna can be placed farther

away from the MU709 module. Antenna isolation can be measured with a two-port

vector network analyzer.

The following antenna isolation is recommended for the antennas on laptops:

- Isolation between the primary and diversity antennas: ≤ –12 dB

- Isolation between the primary antenna and the Wi-Fi antenna: ≤ –15 dB

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Polarization

The polarization of an antenna is the orientation of the electric field vector that rotates

with time in the direction of maximum radiation.

The linear polarization is recommended for the antenna of MU709 module.

Radiation Pattern

The radiation pattern of an antenna reflects the radiation features of the antenna in the

remote field region. The radiation pattern of an antenna commonly describes the

power or field strength of the radiated electromagnetic waves in various directions

from the antenna. The power or field strength varies with the angular coordinates (θ

and φ), but is independent of the radial coordinates.

The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal

plane, and the incident waves of base stations are often in the horizontal plane. For

this reason, the receiving performance is optimal.

The following radiation patterns are recommended for the antenna of MU709 module.

Primary/Diversity antenna: omnidirectional

In addition, the diversity antenna's pattern should be complementary with the

primary's.

Envelope Correlation Coefficient

The envelope correlation coefficient indicates the correlation between different

antennas in a multi-antenna system (primary antenna, diversity antenna, and MIMO

antenna). The correlation coefficient shows the similarity of radiation patterns, that is,

amplitude and phase, of the antennas. The ideal correlation coefficient of a diversity

antenna system or a MIMO antenna system is 0. A small value of the envelope

correlation coefficient between the primary antenna and the diversity antenna

indicates a high diversity gain. The envelope correlation coefficient depends on the

following factors:

- Distance between antennas

- Antenna type

- Antenna direction

The antenna correlation coefficient differs from the antenna isolation. Sufficient

antenna isolation does not represent a satisfactory correlation coefficient. For this

reason, the two indicators need to be evaluated separately.

For the antennas on laptops, the recommended envelope correlation coefficient

between the primary antenna and the diversity antenna is smaller than 0.5.

Gain and Directivity

The radiation pattern of an antenna represents the field strength of the radiated

electromagnetic waves in all directions, but not the power density that the antenna

radiates in the specific direction. The directivity of an antenna, however, measures the

power density that the antenna radiates.

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Gain, as another important parameter of antennas, correlates closely to the directivity.

The gain of an antenna takes both the directivity and the efficiency of the antenna into

account. The appropriate antenna gain prolongs the service life of relevant batteries.

The following antenna gain is recommended for MU709 module. Gain of the

primary/diversity antenna ≤ 2.5 dBi

- The antenna consists of the antenna body and the relevant RF transmission cable. Take the

RF transmission cable into account when measuring any of the preceding antenna

indicators.

- Huawei cooperates with various famous antenna suppliers who are able to make

suggestions on antenna design, for example, Amphenol, Skycross, etc.

4.5.2 Interference

Besides the antenna performance, the interference on the user board also affects the

radio performance (especially the TIS) of the module. To guarantee high performance

of the module, the interference sources on the user board must be properly controlled.

On the user board, there are various interference sources, such as the LCD, CPU,

audio circuits, and power supply. All the interference sources emit interference signals

that affect the normal operation of the module. For example, the module sensitivity

can be decreased due to interference signals. Therefore, during the design, you need

to consider how to reduce the effects of interference sources on the module. You can

take the following measures: Use a LCD with optimized performance; shield the LCD

interference signals; shield the signal cable of the board; or design filter circuits.

Huawei is able to make technical suggestions on radio performance improvement of

the module.

4.5.3 Antenna Requirements

The antenna for MU709 module must fulfill the following requirements:

Table 4-7 MU709s-2 module antenna requirements

Antenna Requirements

Frequency range Depending on frequency band(s) provided by the network

operator, the customer must use the most suitable

antenna for that/those band(s)

Bandwidth of primary

antenna 70 MHz in GSM 850

80 MHz in GSM 900

170 MHz in GSM 1800

140 MHz in GSM 1900

80 MHz in WCDMA Band 8

250 MHz in WCDMA Band 1

Bandwidth of

secondary antenna 35 MHz in WCDMA Band 8

60 MHz in WCDMA Band 1

Gain ≤ 2.5 dBi

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Antenna Requirements

Impedance 50 Ω

VSWR absolute max ≤ 3:1

VSWR recommended ≤ 2:1

Table 4-8 MU709s-6 module antenna requirements

Antenna Requirements

Frequency range Depending on frequency band(s) provided by the network

operator, the customer must use the most suitable

antenna for that/those band(s)

Bandwidth of primary

antenna 70 MHz in GSM 850

80 MHz in GSM 900

170 MHz in GSM 1800

140 MHz in GSM 1900

70 MHZ in WCDMA Band 5

140 MHz in WCDMA Band 2

250 MHz in WCDMA Band 1

Bandwidth of

secondary antenna 25 MHz in WCDMA Band 5

60 MHz in WCDMA Band 2

60 MHz in WCDMA Band 1

Gain ≤ 2.5 dBi

Impedance 50 Ω

VSWR absolute max ≤ 3:1

VSWR recommended ≤ 2:1

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5 Electrical and Reliability Features

5.1 About This Chapter

This chapter describes the electrical and reliability features of the interfaces in the

MU709 module, including:

- Absolute Ratings

- Operating and Storage Temperatures

- Power Supply Features

- Reliability Features

- EMC and ESD Features

5.2 Absolute Ratings

Table 5-1 lists the absolute ratings for the MU709 module. Using the module beyond

these conditions may result in permanent damage to the module.

Table 5-1 Absolute ratings for the MU709 module

Symbol Specification Min. Max. Unit

VCC_3V3 External power voltage –0.3 4.0 V

VI Digital input voltage –0.3 2.1 V

5.3 Operating and Storage Temperatures

Table 5-2 lists the operating and storage temperatures for the MU709 module.

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Table 5-2 Operating and storage temperatures for the MU709 module

Specification Min. Max. Unit

Normal working temperatures –20 +70 °C

Extended temperatures –30 +75 °C

Ambient temperature for storage –40 +85 °C

- [1]: When the ME909s LGA module works in the range from –30°C to –20°C or +70°C to

+75°C, NOT all their RF performances comply with 3GPP specifications.

- The thermal design must be implemented according to the chapter 6.7 Thermal Design

Guide. If not, the overheat protection mechanism will be triggered due to overheated Mini

PCIe and the network connection will be terminated.

5.4 Power Supply Features

5.4.1 Input Power Supply

Table 5-3 Requirements for input power for the MU709 module

Parameter Min. Typ. Max. Ripple Unit

VCC_3V3 3.0 3.3 3.6 0.05 V

Figure 5-1 Power Supply During Burst Emission

The VCC_3V3 minimum value must be guaranteed during the burst (with 2.7 A Peak in GSM 2

slot mode). So a low-dropout (LDO) regulator or switch power with current output of more than

3.5 A is strongly recommended for external power supply.

Table 5-4 Requirements for input current of the MU709 module

Power Module Peak (GSM 2 slot) Normal (WCDMA)

VCC_3V3 MU709 2750 mA 1100 mA

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5.4.2 Power Consumption

The power consumptions of MU709 module in different scenarios are respectively

listed in Table 5-5 to Table 5-8 .

The power consumption listed in this section is tested when the power supply of the

MU709 module is 3.3 V, and all of test values are measured at room temperature.

Table 5-5 Averaged standby DC power consumption of MU709 module

Description Bands Test Value (Unit: mA) Notes/Configuration

Typical

Sleep HSPA+/WCDMA UMTS bands 3.1 Module is powered up.

DRX cycle=7 (1.28s)

Module is registered on the

network.

USB is in suspend.

GPRS/EDGE GSM bands 2.8 Module is powered up.

MFRMS=5 (1.175s)

Module is registered on the

network.

USB is in suspend.

Radio Off All bands 1.6 Module is powered up.

RF is disabled

USB is in suspend.

Idle HSPA+/WCDMA UMTS bands 50 Module is powered up.

DRX cycle=7 (1.28s)

Module is registered on the

network, no data is transmitted.

USB is in active.

GPRS/EDGE GSM bands 50 Module is powered up.

MFRMS=5 (1.175s)

Module is registered on the

network, no data is transmitted.

USB is in active.

Radio Off All bands 50 Module is powered up.

RF is disabled.

USB is in active.

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Table 5-6 Averaged data transmission DC power consumption of MU709s-2 module

(HSPA/WCDMA)

Description Band Test Value (Unit: mA) Power

Typical

WCDMA Band 1

(IMT2100)

250 0 dBm Tx Power

320 10 dBm Tx Power

720 23.5 dBm Tx Power

Band 8

(900 MHz)

250 0 dBm Tx Power

320 10 dBm Tx Power

720 23.5dBm Tx Power

HSPA Band 1

(IMT2100)

270 0 dBm Tx Power

340 10 dBm Tx Power

720 23.5 dBm Tx Power

Band 8

(900 MHz)

270 0 dBm Tx Power

360 10 dBm Tx Power

740 23.5 dBm Tx Power

Table 5-7 Averaged data transmission DC power consumption of MU709s-6 module

(HSPA/WCDMA)

Description Band Test Value (Unit: mA) Power (dBm)

WCDMA Band 1

(IMT 2100)

192 0 dBm Tx Power

237 10 dBm Tx Power

652 23.5 dBm Tx Power

Band 2

(1900 MHz)

191 0 dBm Tx Power

245 10 dBm Tx Power

688 23.5 dBm Tx Power

Band 5

(850 MHz)

182 0 dBm Tx Power

219 10 dBm Tx Power

562 23.5 dBm Tx Power

HSPA Band 1

(IMT 2100)

202 0 dBm Tx Power

255 10 dBm Tx Power

629 23.5 dBm Tx Power

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Description Band Test Value (Unit: mA) Power (dBm)

Band 2

(1900 MHz)

210 0 dBm Tx Power

274 10 dBm Tx Power

703 23.5 dBm Tx Power

Band 5

(850 MHz)

197 0 dBm Tx Power

234 10 dBm Tx Power

552 23.5 dBm Tx Power

Table 5-8 Averaged data transmission DC power consumption of MU709 module

(GPRS/EDGE)

Description Test Value (Unit: mA) PCL Configuration

Typical

GPRS 850 250 5 1 Up/1 Down

370 2 Up/1 Down

510 4 Up/1 Down

120 10 1 Up/1 Down

200 2 Up/1 Down

330 4 Up/1 Down

GPRS 900 250 5 1 Up/1 Down

370 2 Up/1 Down

520 4 Up/1 Down

120 10 1 Up/1 Down

200 2 Up/1 Down

330 4 Up/1 Down

GPRS 1800 200 0 1 Up/1 Down

280 2 Up/1 Down

400 4 Up/1 Down

80 10 1 Up/1 Down

115 2 Up/1 Down

160 4 Up/1 Down

GPRS 1900 190 0 1 Up/1 Down

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Description Test Value (Unit: mA) PCL Configuration

Typical

260 2 Up/1 Down

370 4 Up/1 Down

80 10 1 Up/1 Down

110 2 Up/1 Down

160 4 Up/1 Down

EDGE 850 190 8 1 Up/1 Down

290 2 Up/1 Down

490 4 Up/1 Down

100 15 1 Up/1 Down

145 2 Up/1 Down

235 4 Up/1 Down

EDGE 900 190 8 1 Up/1 Down

290 2 Up/1 Down

490 4 Up/1 Down

100 15 1 Up/1 Down

150 2 Up/1 Down

240 4 Up/1 Down

EDGE 1800 160 2 1 Up/1 Down

255 2 Up/1 Down

415 4 Up/1 Down

100 10 1 Up/1 Down

140 2 Up/1 Down

220 4 Up/1 Down

EDGE 1900 160 2 1 Up/1 Down

255 2 Up/1 Down

415 4 Up/1 Down

100 10 1 Up/1 Down

140 2 Up/1 Down

220 4 Up/1 Down

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- All power consumption test configuration can be referenced by GSM Association Official

Document TS.09: Battery Life Measurement and Current Consumption Technique.

- Test condition: For Max. Tx. power, see 4.4.2 Conducted Transmit Power, which are listed in

Table 4-5 ; for Max. data throughput, see 2.2 Function Overview, which are listed in Table

2-1 .

5.5 Reliability Features

Table 5-9 lists the test conditions and results of the reliability of the MU709 module.

Table 5-9 Test conditions and results of the reliability of the MU709 module

Item Test Condition Standard Sample size Results

Stress Low-temperature

storage

- Temperature: –40ºC

- Operation mode: no

power, no package

- Test duration: 24 h

JESD22-

A119-C 3 pcs/group Visual inspection: ok

Function test: ok

RF specification: ok

High-temperature

storage

- Temperature: 85ºC

- Operation mode: no

power, no package

- Test duration: 24 h

JESD22-

A103-C 3 pcs/group Visual inspection: ok

Function test: ok

RF specification: ok

Low-temperature

operating

- Temperature: –30ºC

- Operation mode:

working with service

connected

- Test duration: 24 h

IEC60068

-2-1

3 pcs/group Visual inspection: ok

Function test: ok

RF specification: ok

High-temperature

operating

- Temperature: 70ºC

- Operation mode:

working with service

connected

- Test duration: 24 h

JESD22-

A108-C 3 pcs/group Visual inspection: ok

Function test: ok

RF specification: ok

Damp heat

cycling

- High temperature:

55ºC

- Low temperature:

25ºC

- Humidity: 95%±3%

- Operation mode:

working with service

connected

- Test duration: 6

cycles; 12 h+12

h/cycle

JESD22-

A101-B

3 pcs/group Visual inspection: ok

Function test: ok

RF specification: ok

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Item Test Condition Standard Sample size Results

Thermal shock - Low temperature:

–40ºC

- High temperature:

85ºC

- Temperature change

interval: < 20s

- Operation mode: no

power

- Test duration: 100

cycles; 15 Min+15

Min/cycle

JESD22-

A106-B

3 pcs/group Visual inspection: ok

Function test: ok

RF specification: ok

Salty fog test - Temperature: 35°C

- Density of the NaCl

solution: 5%±1%

- Operation mode: no

power, no package

- Test duration:

Spraying interval: 8 h

Exposing period after

removing the salty fog

environment: 16 h

JESD22-

A107-B 3 pcs/group Visual inspection: ok

Function test: ok

RF specification: ok

Sine vibration - Frequency range: 5 Hz

to 200 Hz

- Acceleration: 1 Grms

- Frequency scan rate:

0.5oct/min

- Operation mode:

working with service

connected

- Test duration: 3 axial

directions. 2 h for each

axial direction

JESD22-

B103-B

3 pcs/group Visual inspection: ok

Function test: ok

RF specification: ok

Shock test - Half-sine wave shock

- Peak acceleration: 30

Grms

- Shock duration: 11 ms

- Operation mode:

working with service

connected

- Test duration: 6 axial

directions. 3 shocks

for each axial

direction.

JESD-B1

04-C

3 pcs/group Visual inspection: ok

Function test: ok

RF specification: ok

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Item Test Condition Standard Sample size Results

Drop test - 0.8 m in height. Drop

the module on the

marble terrace with

one surface facing

downwards. Six

surfaces should be

tested.

- Operation mode: no

power, no package

IEC60068

-2-32

3 pcs/group Visual inspection: ok

Function test: ok

RF specification: ok

Life High temperature

operating life

- Temperature: 70ºC

- Operation mode:

working with service

connected

- Test duration: 168 h,

336 h, 500 h for

inspection point

JESD22-

A108-B 50 pcs/group Visual inspection: ok

Function test: ok

RF specification: ok

High temperature

& high humidity

- High temperature:

85ºC

- Humidity: 85%

- Operation mode:

powered on and no

working

- Test duration: 168 h,

336 h, 500 h for

inspection point

JESD22-

A110-B

50 pcs/group Visual inspection: ok

Function test: ok

RF specification: ok

Cross section: ok

Temperature

cycle

- High temperature:

85ºC

- Low temperature:

–40ºC

- Temperature change

slope: 6ºC/min

- Operation mode: no

power

- Test duration: 168 h,

336 h, 500 h for

inspection point

JESD22-

A104-C 50 pcs/group Visual inspection: ok

Function test: ok

RF specification:

Cross section: ok

ESD HBM (Human

Body Model)

- 2 kV (Class 1B)

- Operation mode: no

power

JESD22-

A114-D

3 pcs/group Visual inspection: ok

Function test: ok

RF specification: ok

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Item Test Condition Standard Sample size Results

ESD with DVK (or

embedded in the

host)

- Contact and Air

discharges: 10

positive and 10

negative applied

- Contact Voltage: ±2

kV, ±4 kV

- Air Voltage : ±2 kV, ±4

kV, ±8 kV

- Operation mode:

working with service

connected

IEC61000

-4-2

2 pcs Visual inspection: ok

Function test: ok

RF specification: ok

Groups ≥ 2

5.6 EMC and ESD Features

The following are the EMC design comments:

- Attention should be paid to static control in the manufacture, assembly, packaging,

handling, storage process to reduce electrostatic damage to HUAWEI module.

- RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if

the antenna port is protected by TVS (Transient Voltage Suppressor), which is

resolved by making some adjustment on RF match circuit.

- TVS should be added on the USB port for ESD protection, and the parasitic

capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode

inductor should be added in parallel on D+/D- signal.

- TVS should be added on the USIM interface for ESD protection. The parasitic

capacitance of TVS on USIM signal should be less than 10 pF.

- Resistors in parallel and a 10 nF capacitor should be added on RESIN_N signal

to avoid shaking, and the distance between the capacitor and the related pin

should be less than 100 mil.

- PCB routing should be V-type rather than T-type for TVS.

- An integrated ground plane is necessary for EMC design.

The following are the requirements of ESD environment control:

- The electrostatic discharge protected area (EPA) must have an ESD floor whose

surface resistance and system resistance are greater than 1 x 104 Ω while less

than 1 x 109 Ω.

- The EPA must have a sound ground system without loose ground wires, and the

ground resistance must be less than 4 Ω.

- The workbench for handling ESD sensitive components must be equipped with

common ground points, the wrist strap jack, and ESD pad. The resistance

between the jack and common ground point must be less than 4 Ω. The surface

resistance and system resistance of the ESD pad must be less than 1 x 109 Ω.

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- The EPA must use the ESD two-circuit wrist strap, and the wrist strap must be

connected to the dedicated jack. The crocodile clip must not be connected to the

ground.

- The ESD sensitive components, the processing equipment, test equipment, tools,

and devices must be connected to the ground properly. The indexes are as

follows:

− Hard ground resistance < 4 Ω

− 1 x 105 Ω ≤ Soft ground resistance < 1 x 109 Ω

− 1 x 105 Ω ≤ ICT fixture soft ground resistance < 1 x 1011 Ω

− The electronic screwdriver and electronic soldering iron can be easily oxidized.

Their ground resistance must be less than 20 Ω.

- The parts of the equipment, devices, and tools that touch the ESD sensitive

components and moving parts that are close to the ESD sensitive components

must be made of ESD materials and have sound ground connection. The parts

that are not made of ESD materials must be handled with ESD treatment, such

as painting the ESD coating or ionization treatment (check that the friction voltage

is less than 100 V).

- Key parts in the production equipment (parts that touch the ESD sensitive

components or parts that are within 30 cm away from the ESD sensitive

components), including the conveyor belt, conveyor chain, guide wheel, and SMT

nozzle, must all be made of ESD materials and be connected to the ground

properly (check that the friction voltage is less than 100 V).

- Engineers that touch IC chips, boards, modules, and other ESD sensitive

components and assemblies must wear ESD wrist straps, ESD gloves, or ESD

finger cots properly. Engineers that sit when handling the components must all

wear ESD wrist straps.

- Noticeable ESD warning signs must be attached to the packages and placement

areas of ESD sensitive components and assemblies.

- Boards and IC chips must not be stacked randomly or be placed with other ESD

components.

- Effective shielding measures must be taken on the ESD sensitive materials that

are transported or stored outside the EPA.

HUAWEI MU709 module does not include any protection against overvoltage.

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Mechanical Specifications

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6 Mechanical Specifications

6.1 About This Chapter

This chapter mainly describes mechanical specifications of MU709 module, including:

- Dimensions and Interfaces

- Dimensions of the Mini PCI Express Connector

- Packaging

- Specification Selection for Fasteners

- Antenna Plug

- Thermal Design Guide

6.2 Dimensions and Interfaces

The dimensions (L × W × H) of the MU709 module is 51 mm × 30.4 mm × 3.27 mm.

Figure 6-1 shows the dimensions of MU709 module in detail.

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Figure 6-1 Dimensions of the MU709 module (Unit: mm)

6.3 Dimensions of the Mini PCI Express Connector

The Mini PCIe Adapter adopts a standard Mini PCI Express connector that has 52

pins and complies with the PCI Express Mini Card Electromechanical Specification

Revision 2.0.

Figure 6-2 shows a 52-pin Mini PCI Express connector (take the Molex 67910002 as

an example).

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Figure 6-2 Dimensions of the Mini PCI Express connector (Unit: mm)

6.4 Packaging

HUAWEI Mini PCIe module uses anti-vibration foam and ESD bag into cartons.

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6.5 Specification Selection for Fasteners

6.5.1 Installing the Mini PCIe Adapter on the Main Board

To install the Mini PCIe Adapter on the main board, do the following:

Step 1 Insert the Mini PCIe Adapter into the Mini PCI Express connector on the main board.

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Step 2 Press downwards to fix the Mini PCIe Adapter in the module slot.

Step 3 Use a screwdriver to fix the Mini PCIe Adapter on the main board with two screws

provided in the Mini PCIe Adapter packing box.

Step 4 Insert the connector of the main antenna into the MAIN antenna interface (M) of the

Mini PCIe Adapter according to the indication on the label of the Mini PCIe Adapter.

Insert the connector of the auxiliary antenna into the AUX antenna interface (A) of the

Mini PCIe Adapter of the Mini PCIe Adapter in the same way.

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- Insert the antenna connectors vertically into the antenna interfaces of the Mini PCIe

Adapter.

- Do not press or squeeze the antenna cable or damage the connectors. Otherwise, the

wireless performance of the Mini PCIe Adapter may be reduced or the Mini PCIe Adapter

cannot work normally.

- Ensure that the antenna cables are routed through the channel in the frame of the PC and

do not lay the cables across the raised edges of the frame.

- The module could not be installed or removed when the host is powered on. Otherwise, it

may result in permanent damage to the module.

6.5.2 Romoving the Mini PCIe Adapter from the Main Board

Step 1 Disconnect the antenna cables from the Mini PCIe Adapter. You can lift the

connectors using a small screwdriver.

Step 2 Remove the two screws with the screwdriver.

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Step 3 Slide backwards the two clips to release the Mini PCIe Adapter from the slot. Then, lift

up the Mini PCIe Adapter.

6.6 Antenna Plug

Figure 6-3 Mating the plug

1. Align the mating tool or the mating end of the tool over the plug end of the cable

assembly.

2. Firmly place the tool over the plug until it is secured in the tool.

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3. Place the plug cable assembly (held in the tool) over the corresponding

receptacle.

4. Assure that the plug and receptacle are aligned press-down perpendicular to the

mounting surface until both connectors are fully mated.

5. Remove the mating tool by pulling it up carefully.

Figure 6-4 Unmating the plug

- The extraction tool is recommended.

- Any attempt of unmating by pulling on the cable may result in damage and influence the

mechanical/electrical performance.

It is recommended not to apply any pull forces after the bending of the cable, as

described in Figure 6-5 .

Figure 6-5 Do not apply any pull forces after the bending of the cable

6.7 Thermal Design Guide

When using in the network, the MU709 module (Mini PCIe) have high power

consumption. To improve the module reliability and stability, focus on the thermal

design of the device to speed up heat dissipation.

Take the following heat dissipation measures:

- Do not hollow out the customer PCB.

- Attach the thermal conductive material between the Mini PCIe and the customer

PCB. The recommended thermal conductivity of the thermal conductive material

is 1.0 W/m-k or higher (recommended manufacturers: Laird and Bergquist). The

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dimensions (W x D) of the thermal conductive material are 38 mm x 28 mm (1.50

in. x 1.10 in.), and its height depends on the height of the Mini PCIe connector

you use and the method for installing the Mini PCIe. When deciding the height of

the thermal conductive material, you are advised to obey the following rule: After

the Mini PCIe is fastened to the customer PCB, the compression amount of the

thermal conductive material accounts for 15% to 30% of the thermal conductive

material size. For example, if you use a connector shown in the following figure

and install the Mini PCIe like this, the recommended height of the thermal

conductive material is 1.8 mm (0.07 in.).

- On the customer PCB, reserve two metal screw holes, which are connected to

the PCB ground plane. When installing the Mini PCIe, use two metal screws to

fasten the Mini PCIe to the customer PCB. See the following figure.

- Ensure that the air flow around the Mini PCIe is sufficient.

- Try not to place any component in the Mini PCIe's projection region on the

customer PCB. Do not place components with 1.5 W or higher power

consumption or heat sensitive components (such as crystals) near the Mini PCIe.

- Use a large customer PCB. The recommended size (W x D) is 70 mm x 70 mm

(2.76 in. x 2.76 in.).

- If the thermal conductive material is attached between the Mini PCIe and the

customer PCB, then the heat dissipation performance will be better for multilayer

PCB.

- Apply copper to the region for attaching the thermal conductive material to the

customer PCB. Try to use the continuous ground plane design on the customer

PCB, and each ground plane must be connected through holes. Therefore,

reserve holes as many as possible.

Thermal Conductive Material

Screw

Mini PCIe

Customer PCB

Thermal Conductive Material

Mini PCIe

Customer PCB

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If you do not take the preceding heat dissipation measures, the overheat protection mechanism

is triggered due to overheated Mini PCIe and the network connection is terminated when the

Mini PCIe keeps working in enclosed space with a 70ºC temperature and a big current for a

period of time. You can resume the network connection only after the temperature drops.

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Certifications

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7 Certifications

7.1 About This Chapter

This chapter gives a general description of certifications of MU709 module.

7.2 Certifications

Table 7-1 shows certifications of the MU709 module have been implemented. For more

demands, please contact us for more details about this information.

Table 7-1 Product Certifications

Certification Model name

MU709s-2 MU709s-6

CE √ √

CCC √ -

FCC - √

Anetel - √

RoHS √ √

WEEE √ √

NAL √ -

SRRC √ -

REACH √ √

RCM - √

NCC √ √

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Safety Information

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8 Safety Information

Read the safety information carefully to ensure the correct and safe use of your

wireless device. Applicable safety information must be observed.

8.1 Interference

Power off your wireless device if using the device is prohibited. Do not use the

wireless device when it causes danger or interference with electric devices.

8.2 Medical Device

- Power off your wireless device and follow the rules and regulations set forth by

the hospitals and health care facilities.

- Some wireless devices may affect the performance of the hearing aids. For any

such problems, consult your service provider.

- Pacemaker manufacturers recommend that a minimum distance of 15 cm be

maintained between the wireless device and a pacemaker to prevent potential

interference with the pacemaker. If you are using an electronic medical device,

consult the doctor or device manufacturer to confirm whether the radio wave

affects the operation of this device.

8.3 Area with Inflammables and Explosives

To prevent explosions and fires in areas that are stored with inflammable and

explosive devices, power off your wireless device and observe the rules. Areas stored

with inflammables and explosives include but are not limited to the following:

- Gas station

- Fuel depot (such as the bunk below the deck of a ship)

- Container/Vehicle for storing or transporting fuels or chemical products

- Area where the air contains chemical substances and particles (such as granule,

dust, or metal powder)

- Area indicated with the "Explosives" sign

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- Area indicated with the "Power off bi-direction wireless equipment" sign

- Area where you are generally suggested to stop the engine of a vehicle

8.4 Traffic Security

- Observe local laws and regulations while using the wireless device. To prevent

accidents, do not use your wireless device while driving.

- RF signals may affect electronic systems of motor vehicles. For more information,

consult the vehicle manufacturer.

- In a motor vehicle, do not place the wireless device over the air bag or in the air

bag deployment area. Otherwise, the wireless device may hurt you owing to the

strong force when the air bag inflates.

8.5 Airline Security

Observe the rules and regulations of airline companies. When boarding or

approaching a plane, power off your wireless device. Otherwise, the radio signal of

the wireless device may interfere with the plane control signals.

8.6 Safety of Children

Do not allow children to use the wireless device without guidance. Small and sharp

components of the wireless device may cause danger to children or cause suffocation

if children swallow the components.

8.7 Environment Protection

Observe the local regulations regarding the disposal of your packaging materials,

used wireless device and accessories, and promote their recycling.

8.8 WEEE Approval

The wireless device is in compliance with the essential requirements and other

relevant provisions of the Waste Electrical and Electronic Equipment Directive

2012/19/EU (WEEE Directive).

8.9 RoHS Approval

The wireless device is in compliance with the restriction of the use of certain

hazardous substances in electrical and electronic equipment Directive 2011/65/EU

(RoHS Directive).

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8.10 Laws and Regulations Observance

Observe laws and regulations when using your wireless device. Respect the privacy

and legal rights of the others.

8.11 Care and Maintenance

It is normal that your wireless device gets hot when you use or charge it. Before you

clean or maintain the wireless device, stop all applications and power off the wireless

device.

- Use your wireless device and accessories with care and in clean environment.

Keep the wireless device from a fire or a lit cigarette.

- Protect your wireless device and accessories from water and vapour and keep

them dry.

- Do not drop, throw or bend your wireless device.

- Clean your wireless device with a piece of damp and soft antistatic cloth. Do not

use any chemical agents (such as alcohol and benzene), chemical detergent, or

powder to clean it.

- Do not leave your wireless device and accessories in a place with a considerably

low or high temperature.

- Use only accessories of the wireless device approved by the manufacture.

Contact the authorized service center for any abnormity of the wireless device or

accessories.

- Do not dismantle the wireless device or accessories. Otherwise, the wireless

device and accessories are not covered by the warranty.

- The device should be installed and operated with a minimum distance of 20 cm

between the radiator and your body.

8.12 Emergency Call

This wireless device functions through receiving and transmitting radio signals.

Therefore, the connection cannot be guaranteed in all conditions. In an emergency,

you should not rely solely on the wireless device for essential communications.

8.13 Regulatory Information

The following approvals and notices apply in specific regions as noted.

8.13.1 CE Approval (European Union)

The wireless device is approved to be used in the member states of the EU. The

wireless device is in compliance with the essential requirements and other relevant

provisions of the Radio and Telecommunications Terminal Equipment Directive

1999/5/EC (R&TTE Directive).

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8.13.2 FCC Statement

Federal Communications Commission Notice (United States): Before a wireless

device model is available for sale to the public, it must be tested and certified to the

FCC that it does not exceed the limit established by the government-adopted

requirement for safe exposure.

This device complies with Part 15 of the FCC Rules. Operation is subject to the

following two conditions: (1) this device may not cause harmful interference, and (2)

this device must accept any interference received, including interference that may

cause undesired operation.

Warning: Changes or modifications made to this equipment not expressly approved

by HUAWEI may void the FCC authorization to operate this equipment.

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Appendix A Circuit of Typical Interface

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9 Appendix A Circuit of Typical Interface

150uF C5

R1 10K

D1 R2 470

VCC

GND

RS T

VP P

CL K

I/O

R3 0

R4 0

R5 0

R6 0

3 4

2 5

1uF

33pF

150uF C3

33pF

C10

33pF

C11

33pF

C12

100nF

GND14

LED_WW AN#

GND12

USB _D P USB _D P

USB _ DP

USB _ DM USB _ DM

USB _ DM

GND9

GND6

GND4

US IM_RESE T

USIM_CLK

USIM_DATA

US IM_PWR

GND1

VCC_3V3

GND13

GND11

GND10

GND8

GND7

GND5

GND3

GND2

WAK E#

VCC_3V3

10pF

150uF

C7 1.8pF

GN D

US IM_DATA

US IM_CLK

US IM_RESET

US IM_PWR

LED_WW AN

PCM_CLK PCM_CLK

PCM_DOU TP CM_DOU T

PCM_DIN PCM _DIN

P CM _S YN C PC M _S YN C

VCC_3V3

VCC _3V3

VCC_3V3

VCC _3V3

Wake the host

VCC From Host

DNI

DNI,R eserve for

USB eye d ebug

to USB 2.0 interfac e

Open drain,active low

No te the signal d irec tion o f PC M_DOU T,P C M_DIN

Don't support Hot Plug.

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9BAppendix B Acronyms and

Abbreviations

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10 Appendix B Acronyms and

Abbreviations

Acronym or Abbreviation Expansion

3GPP Third Generation Partnership Project

AUX Auxiliary

CCC China Compulsory Certification

CE European Conformity

DC Direct Current

EDGE Enhanced Data Rate for GSM Evolution

EMC Electromagnetic Compatibility

ESD Electrostatic Discharge

EU European Union

FCC Federal Communications Commission

GPIO General-purpose I/O

GPRS General Packet Radio Service

GSM Global System for Mobile Communication

HSDPA High-Speed Downlink Packet Access

HSPA High Speed Packet Access

HSUPA High Speed Up-link Packet Access

ISO International Standards Organization

LDO Low-Dropout

LED Light-Emitting Diode

OC Open Collector

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9BAppendix B Acronyms and

Abbreviations

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Acronym or Abbreviation Expansion

PCB Printed Circuit Board

RF Radio Frequency

RoHS Restriction of the Use of Certain Hazardous

Substances

TVS Transient Voltage Suppressor

UMTS Universal Mobile Telecommunications System

USB Universal Serial Bus

USIM Universal Subscriber Identity Module

VSWR Voltage Standing Wave Ratio

WCDMA Wideband Code Division Multiple Access

WEEE Waste Electrical and Electronic Equipment

Huawei MU709 Series HSPA Mini PCIe Module Hardware Guide (V100R001 04, English)

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