Huawei MU736 HSPA M.2 Module Hardware Guide (V100R001 05, English)
HUAWEI MU736 HSPA+ M.2 Module Hardware Guide-(V100R001_05, English)
2014-01-21
User Manual: Huawei
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HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Issue 05 Date 2014-01-14 Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. For any assistance, please contact our local office or company headquarters. Huawei Technologies Co., Ltd. Huawei Industrial Base, Bantian, Longgang, Shenzhen 518129, People’s Republic of China Tel: +86-755-28780808 Global Hotline: +86-755-28560808 Website: www.huawei.com E-mail: mobile@huawei.com Please refer color and shape to product. Huawei reserves the right to make changes or improvements to any of the products without prior notice. Copyright © Huawei Technologies Co., Ltd. 2014. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd. The product described in this manual may include copyrighted software of Huawei Technologies Co., Ltd. and possible licensors. Customers shall not in any manner reproduce, distribute, modify, decompile, disassemble, decrypt, extract, reverse engineer, lease, assign, or sublicense the said software, unless such restrictions are prohibited by applicable laws or such actions are approved by respective copyright holders under licenses. Trademarks and Permissions , , and are trademarks or registered trademarks of Huawei Technologies Co., Ltd. Other trademarks, product, service and company names mentioned are the property of their respective owners. Notice Some features of the product and its accessories described herein rely on the software installed, capacities and settings of local network, and may not be activated or may be limited by local network operators or network service providers, thus the descriptions herein may not exactly match the product or its accessories you purchase. Huawei Technologies Co., Ltd. reserves the right to change or modify any information or specifications contained in this manual without prior notice or obligation. NO WARRANTY THE CONTENTS OF THIS MANUAL ARE PROVIDED "AS IS". EXCEPT AS REQUIRED BY APPLICABLE LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO CASE SHALL HUAWEI TECHNOLOGIES CO., LTD. BE LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, OR LOST PROFITS, BUSINESS, REVENUE, DATA, GOODWILL OR ANTICIPATED SAVINGS. Import and Export Regulations Customers shall comply with all applicable export or import laws and regulations and will obtain all necessary governmental permits and licenses in order to export, re-export or import the product mentioned in this manual including the software and technical data therein. HUAWEI MU736 HSPA+ M.2 Module Hardware Guide About This Document About This Document Revision History Document Version Date 01 2013-03-08 02 2013-05-09 03 Issue 05 (2014-01-14) 2013-08-22 Chapter Descriptions Creation 3.7 Updated Tunable Antenna Control 4.4.2 Updated Table 4-4 4.5.1 Updated Antenna Design Indicators 4.5.3 Updated GSM/WCDMA/GPS Antenna Requirements 5.5.2 Updated Table 5-9, Table 5-10 8.2 Updated Table 8-1 9.8 Updated WEEE Approval 9.9 Updated RoHS Approval 9.11 Updated Care and Maintenance 9.13 Deleted Specific Absorption Rate (SAR) 9.13 Updated Regulatory Information 2.2 Updated Table 2-1 Features 3.2 Updated Table 3-1 Definitions of pins on the M.2 interface 3.4.5 Added Figure 3-16 Connections of the W_DISABLE# pin 3.4.6 Added Figure 3-17 Connections of the GPS_DISABLE# pin 3.4.8 Updated Figure 3-20 Connections of the BodySAR_N pin 3.4.9 Updated Figure 3-21 Connections of the SIM_DET pin Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 3 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Document Version Date About This Document Chapter Descriptions 3.7 Updated Table 3-11 List of ANTCTL pins 3.9 Updated Table 3-15 List of NC pins 5.2 Updated Table 5-1 Absolute ratings for the MU736 module 5.5.2 Updated Table 5-12 DC power consumption (GPS) 5.6 Updated Table 5-13 Test conditions and results of the reliability of the MU736 module 6.2 Updated Figure 6-1 Dimensions of MU736 6.4 Updated Figure 6-4 Packet system 04 2013-10-21 5.6 Updated Table 5-13 Test conditions and results of the reliability of the MU736 module 05 2014-01-14 5.5.2 Updated Power Consumption 5.7 Updated EMC and ESD Features Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 4 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Contents Contents 1 Introduction .............................................................................................................................. 8 2 Overall Description.................................................................................................................. 9 2.1 About This Chapter...................................................................................................................... 9 2.2 Function Overview ...................................................................................................................... 9 2.3 Circuit Block Diagram ................................................................................................................. 11 3 Description of the Application Interfaces........................................................................... 12 3.1 About This Chapter.....................................................................................................................12 3.2 75-pin Gold Finger .....................................................................................................................12 3.3 Power Interface ..........................................................................................................................18 3.3.1 Overview ...........................................................................................................................18 3.3.2 Power Supply 3.3V Interface ..............................................................................................18 3.3.3 USIM Power Output UIM_PWR..........................................................................................20 3.4 Signal Control Interface ..............................................................................................................20 3.4.1 Overview ...........................................................................................................................20 3.4.2 Power_On_Off Control Pin.................................................................................................22 3.4.3 RESET# Pins.....................................................................................................................26 3.4.4 LED# Pin ...........................................................................................................................28 3.4.5 W_DISABLE# Pin ..............................................................................................................29 3.4.6 GPS_DISABLE# Pin ..........................................................................................................29 3.4.7 Wake_On_WWAN# Pin .....................................................................................................30 3.4.8 BodySAR_N Pin ................................................................................................................31 3.4.9 SIM_DET Pin .....................................................................................................................32 3.5 USB Interface.............................................................................................................................34 3.6 USIM Card Interface...................................................................................................................35 3.6.1 Overview ...........................................................................................................................35 3.6.2 Circuit Recommended for the USIM Card Interface ............................................................35 3.7 Tunable Antenna Control ............................................................................................................36 3.8 Config Pins ................................................................................................................................37 3.9 NC Pins .....................................................................................................................................38 3.10 RF Antenna Interface ...............................................................................................................38 3.10.1 RF Connector location .....................................................................................................38 3.10.2 Coaxial RF Connector Guidelines ....................................................................................39 Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 5 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Contents 4 RF Specifications .................................................................................................................... 43 4.1 About This Chapter.....................................................................................................................43 4.2 Operating Frequencies ...............................................................................................................43 4.3 Conducted RF Measurement......................................................................................................44 4.3.1 Test Environment ...............................................................................................................44 4.3.2 Test Standards ...................................................................................................................44 4.4 Conducted Rx Sensitivity and Tx Power .....................................................................................44 4.4.1 Conducted Receive Sensitivity ...........................................................................................44 4.4.2 Conducted Transmit Power ................................................................................................45 4.5 Antenna Design Requirements ...................................................................................................46 4.5.1 Antenna Design Indicators .................................................................................................46 4.5.2 Interference .......................................................................................................................49 4.5.3 GSM/WCDMA/GPS Antenna Requirements .......................................................................49 4.5.4 Radio Test Environment .....................................................................................................50 5 Electrical and Reliability Features ....................................................................................... 52 5.1 About This Chapter.....................................................................................................................52 5.2 Absolute Ratings ........................................................................................................................52 5.3 Operating and Storage Temperatures and Humidity ....................................................................53 5.4 Electrical Features of Application Interfaces................................................................................53 5.5 Power Supply Features ..............................................................................................................54 5.5.1 Input Power Supply............................................................................................................54 5.5.2 Power Consumption...........................................................................................................55 5.6 Reliability Features.....................................................................................................................60 5.7 EMC and ESD Features .............................................................................................................63 6 Mechanical Specifications .................................................................................................... 65 6.1 About This Chapter.....................................................................................................................65 6.2 Dimensions of MU736 ................................................................................................................65 6.3 Label ..........................................................................................................................................66 6.4 Packing System .........................................................................................................................68 7 Installation .............................................................................................................................. 70 7.1 About This Chapter.....................................................................................................................70 7.2 Connect MU736 to Board ...........................................................................................................70 7.3 Antenna Plug..............................................................................................................................71 8 Certifications........................................................................................................................... 73 8.1 About This Chapter.....................................................................................................................73 8.2 Certifications ..............................................................................................................................73 9 Safety Information ................................................................................................................. 75 9.1 Interference................................................................................................................................75 9.2 Medical Device...........................................................................................................................75 9.3 Area with Inflammables and Explosives ......................................................................................75 Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 6 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Contents 9.4 Traffic Security ...........................................................................................................................76 9.5 Airline Security ...........................................................................................................................76 9.6 Safety of Children.......................................................................................................................76 9.7 Environment Protection ..............................................................................................................76 9.8 WEEE Approval .........................................................................................................................76 9.9 RoHS Approval ..........................................................................................................................76 9.10 Laws and Regulations Observance ..........................................................................................77 9.11 Care and Maintenance .............................................................................................................77 9.12 Emergency Call ........................................................................................................................77 9.13 Regulatory Information .............................................................................................................77 9.13.1 CE Approval (European Union) ........................................................................................77 9.13.2 FCC Statement ................................................................................................................78 10 Appendix A Circuit of Typical Interface ........................................................................... 79 11 Appendix B Acronyms and Abbreviations ....................................................................... 80 Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 7 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Introduction 1 Introduction This document describes the hardware application interfaces and air interfaces that are provided when HUAWEI MU736 HSPA+ M.2 Module (hereinafter referred to the MU736 module) is used. M.2 is the new name for NGFF (Next Generation Form Factor). This document helps you to understand the interface specifications, electrical features and related product information of the MU736 module. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 8 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Overall Description 2 Overall Description 2.1 About This Chapter This chapter gives a general description of the MU736 module and provides: Function Overview Circuit Block Diagram 2.2 Function Overview Table 2-1 Features Feature Description Physical Features Dimensions (L × W × H): 42 mm × 30 mm × 2.3 mm Weight: about 6 g Operating Bands WCDMA/HSDPA/HSUPA/HSPA+: 850 MHz/900 MHz/1700 MHz (AWS)/1900 MHz/2100 MHz GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz GPS: L1 Operating Temperature Normal operating temperature: –10°C to +55°C Storage Temperature –40°C to +85°C Moisture RH5% to RH95% Power Voltage 3.135 V to 4.4 V (3.3 V is typical) AT Commands See the HUAWEI MU736 HSPA+ M.2 Module AT Command Interface Specification Application USIM (3.0 V or 1.8 V) Issue 05 (2014-01-14) Extended operating temperature[1]: –20°C to +70°C Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 9 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Feature Description Interface (75-pin Gold Finger) USIM Hot Swap Detection Overall Description USB 2.0 (high speed) Power_On_Off pin RESET# pin LED# pin W_DISABLE# pin GPS_DISABLE# pin Tunable Antenna Control (4 GPIOs) Wake_On_WWAN# pin BodySAR_N pin Power supply (5 pins) Antenna Interface MAIN and AUX (supports Diversity and GPS simultaneously) SMS New message alert MM4829-2702RA4 by MURATA or other equivalent parts Management of SMS: read SMS, write SMS, send SMS, delete SMS and SMS list. Supporting MO and MT. Point-to-point Data Services GPRS: UL 85.6 kbps/DL 107 kbps EDGE: UL 236.8 kbps/DL 296 kbps WCDMA CS: UL 64 kbps/DL 64 kbps WCDMA PS: UL 384 kbps/DL 384 kbps HSPA+: UL 5.76 Mbps/DL 21.6 Mbps Operating Windows 7/8/8.1, Android 4.0 or later, Chrome OS System [1]: When the MU736 module works at this temperature, NOT all its RF performances comply with the 3GPP TS 45.005 specifications. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 10 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Overall Description 2.3 Circuit Block Diagram Figure 2-1 shows the circuit block diagram of the MU736 module. The application block diagram and major functional units of the MU736 module contain the following parts: Baseband controller Power manager Multi-chip package (MCP) memory Radio frequency (RF) transceiver RF interface RF PA Figure 2-1 Circuit block diagram of the MU736 module ANTCTL[0~3] GPS/DIV ANT BodySAR_N EBU MCP Wake_On_WWAN# GPS Front End Extractor LED# W_DISABLE# GPS_DISABLE# RESET# USIM USB Power_On_Off RF TRANSCEIVER M.2 Interface BASE BAND RF Front End Diversity ANT Switch Main ANT RF Front End MAIN ANT Switch Power Manager Power Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 11 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide 3 Description of the Application Interfaces Description of the Application Interfaces 3.1 About This Chapter This chapter mainly describes the external application interfaces of the MU736 module, including: 75-pin Gold Finger Power Interface Signal Control Interface USB Interface USIM Card Interface Tunable Antenna Control Config Pins NC Pins RF Antenna Interface 3.2 75-pin Gold Finger The MU736 module uses a 75-pin Gold Finger as its external interface. For details about the module and dimensions, see "6.2 Dimensions of MU736". Figure 3-1 shows the sequence of pins on the 75-pin signal interface of the MU736 module. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 12 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-1 TOP view of sequence of Gold Finger interface pins Table 3-1 shows the definitions of pins on the 75-pin signal interface (67 for signals and 8 for notch) of the MU736 module. As the M.2 naming nomenclature, MU736 is Type 3042-S3-B (30 mm × 42 mm, Component Max Height on top is 1.5 mm and single-sided, Key ID is B.) Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 13 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Table 3-1 Definitions of pins on the M.2 interface Pin No. Pin Name 1 CONFIG_3 O 2 3.3V PI 3 Ground 4 5 Normal I/O Description DC Characteristics (V) Min. Typ. Max. - 0 - Power supply 3.135 3.3 4.4 PI Ground - 0 - 3.3V PI Power supply 3.135 3.3 4.4 Ground PI Ground - 0 - –0.3 1.8 3.6 - - - –0.3 3.3 3.6 - - Connected to Ground internally. MU736 is configured as WWAN-SSIC 0. A single control to turn On/Off WWAN. H: WWAN is powered on. 6 Power_On_Off I L: WWAN is powered off. It is internally pulled to low. It is 3.3 V tolerant but can be driven by either 1.8 V or 3.3 V GPIO. 7 USB_D+ IO USB Data + defined in the USB 2.0 Specification WWAN disable function 8 W_DISABLE# I H: WWAN function is determined by software AT command. Default enabled. L: WWAN function is turned off. 9 USB_D- IO USB Data - defined in the USB 2.0 Specification - Open drain and a pull-up resistor is required on the host 10 LED# O It is an open drain, active low signal, used to allow the M.2 card to provide status indicators via LED devices that will be provided by the system. 11 Ground PI Ground - 0 - 12 Notch - - - - - 13 Notch - - - - - 14 Notch - - - - - 15 Notch - - - - - 16 Notch - - - - - 17 Notch - - - - - 18 Notch - - - - - 19 Notch - - - - - Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 14 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Pin No. Pin Name 20 Reserved - 21 CONFIG_0 O Not Connected internally. MU736 is configured as WWAN-SSIC 0. 22 Reserved - 23 Wake_On_WWA N# O 24 Reserved - Normal I/O Description Min. Typ. Max. - - - - - - Reserved for Future Use, please keep it NC in host side. - - - WWAN to wake up the host. Open drain and a pull-up resistor is required on the host Reserved for Future Use, please keep it NC in host side. It is open drain and active low. Reserved for Future Use, please keep it NC in host side. Hardware pin for BodySAR Detection, active low. 25 BodySAR_N I DC Characteristics (V) H: No TX power backoff (default). - - - –0.3 1.8 3.6 –0.3 3.3 3.6 L: TX power backoff. GPS disable function 26 GPS_DISABLE# I H: GPS function is determined by software AT command. Default enabled. L: GPS is turned off. 27 Ground PI Ground - 0 - 28 NC - Not Connected - - - 29 NC - Not Connected - - - 30 UIM_RESET O USIM Reset –0.3 1.8/2.85 31 NC - Not Connected - - 32 UIM_CLK O USIM Clock –0.3 1.8/2.85 33 Ground PI Ground - 0 34 UIM_DATA IO USIM DATA –0.3 1.8/2.85 35 NC - Not Connected - - - 36 UIM_PWR PO USIM POWER –0.3 1.8/2.85 1.98 /3.3 37 NC - Not Connected - - - Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 1.98 /3.0 1.98 /3.0 1.98 /3.0 15 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Pin No. Pin Name 38 I/O Description NC - 39 Ground PI 40 I2C_SCL IO 41 NC - 42 I2C_SDA IO 43 NC - 44 I2C_IRQ I 45 Ground PI O 46 Normal SYSCLK Description of the Application Interfaces DC Characteristics (V) Min. Typ. Max. Not Connected - - - Ground - 0 - –0.3 1.8 2.1 - - - –0.3 1.8 2.1 - - - –0.3 1.8 2.1 Ground - 0 - System clock output for external GNSS module. MU736 does not support GLONASS. –0.3 1.8 2.1 I2C clock This function is under development. Not Connected I2C data This function is under development. Not Connected Interrupt signal to wake up the module. This function is under development. This function is under development. 47 48 NC TX_BLANKING - Not Connected - - - - Tx blanking signal for external GNSS module. MU736 doesn’t support GLONASS. –0.3 1.8 2.1 This function is under development. 49 NC - Not Connected - - - 50 NC - Not Connected - - - 51 Ground PI Ground - 0 - 52 NC - Not Connected - - - 53 NC - Not Connected - - - 54 NC - Not Connected - - - 55 NC - Not Connected - - - 56 NC - Not Connected - - - 57 Ground PI Ground - 0 - 58 NC - Not Connected - - - 59 ANTCTL0 O Tunable antenna control signal, bit 0. –0.3 1.8 2.1 Issue 05 (2014-01-14) It is a push-pull type GPIO. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 16 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Pin No. Pin Name 60 I/O Description Reserved - 61 ANTCTL1 O 62 Reserved - 63 ANTCTL2 64 65 Normal Description of the Application Interfaces Min. Typ. Max. Reserved for Future Use, please keep it NC in host side. - - - Tunable antenna control signal, bit 1. –0.3 1.8 2.1 Reserved for Future Use, please keep it NC in host side. - - - O Tunable antenna control signal, bit 2. It is a push-pull type GPIO. –0.3 1.8 2.1 Reserved - Reserved for Future Use, please keep it NC in host side. - - - ANTCTL3 O Tunable antenna control signal, bit 3. –0.3 1.8 2.1 –0.3 1.8 2.1 It is a push-pull type GPIO. It is a push-pull type GPIO. SIM hot swap detection pin. 66 DC Characteristics (V) SIM_DET I Rising edge for insertion; falling edge for removal. H: SIM is present. L: SIM is absent. 67 RESET# I System reset, active low. –0.3 1.8 3.6 68 NC - Not Connected - - - 69 CONFIG_1 O - 0 - 70 3.3V PI Power supply 3.135 3.3 4.4 71 Ground PI Ground - 0 - 72 3.3V PI Power supply 3.135 3.3 4.4 73 Ground PI Ground - 0 - 74 3.3V PI Power supply 3.135 3.3 4.4 75 CONFIG_2 O - 0 - Connected to Ground internally. MU736 is configured as WWAN-SSIC 0. Connected to Ground internally. MU736 is configured as WWAN-SSIC 0. P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital signal output. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 17 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces 3.3 Power Interface 3.3.1 Overview The power supply part of the MU736 module contains: 3.3V pins for the power supply UIM_PWR pin for USIM card power output Table 3-2 lists the definitions of the pins on the power supply interface. Table 3-2 Definitions of the pins on the power supply interface Pin No. Signal Name I/O 2, 4, 70, 72, 74 3.3V PI 36 UIM_PWR 3, 5, 11, 27, 33, 39, 45, 51, 57, 71, 73 Ground Description DC Characteristics (V) Min. Typ. Max. Power supply for MU736, 3.3 V is recommended 3.135 3.3 4.4 PO Power supply for USIM card –0.3 1.8/2.85 1.98/3.3 PI Ground - 0 - 3.3.2 Power Supply 3.3V Interface When the MU736 module works normally, power is supplied through the 3.3V pins and the voltage ranges from 3.135 V to 4.4 V (typical value is 3.3 V). The MU736 provides 5 power pins, and 11 Ground pins. To ensure that the MU736 module works normally, all the pins must be connected. The M.2 connector pin is defined to support 500 mA/Pin continuously. When the MU736 module works at 2G mode, the module transmits at the maximum power, the transient peak current may reach 2.5 A. In this case, the power pin voltage will drop. Make sure that the voltage does not drop below 3.135 V in any case. The traces of the power supply should be as short and wide as possible. It is recommended that at least a 220 µF capacitance is added onto the 3.3 V power rails and as close to the M.2 connector as possible. Customer can reduce the capacitance if it can be guaranteed that 3.3V pin does not drop below 3.135 V in any case. Figure 3-2 shows the recommended power circuit of the MU736 module. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 18 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-2 Recommended power circuit of the MU736 module MU736 3.3V 3.3V 330pF 100nF 1µF 22µF 220µF 3.3V pin must never be under 3.135 V during the 2G transmitting burst, as shown in Figure 3-3 . Figure 3-3 VCC drop during 2G transmitting Voltage Do not drop below 3.135 V, during 2G TX. 4.4 V The maximum current may be 2.5 A. 3.3 V 3.135 V Time If customer wants to power cycle MU736, the 3.3V pin must stay below 1.8 V for more than 100 ms. The sequence is shown as in Figure 3-4 . Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 19 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-4 MU736 power supply time sequence for power cycling Voltage Power On Power Off 4.4 V Power On 3.135 V Undefined State 1.8 V Power Off Toff > 100 ms Time Parameter Remarks Time(Min.) Unit Toff Power off time 100 ms 3.3.3 USIM Power Output UIM_PWR Output power supply interface is UIM_PWR. Through the UIM_PWR power supply interface, the MU736 module can supply 1.8 V or 2.85 V power to UIM card. The max current can reach 200 mA, so special attention on PCB design should be taken at the host side. 3.4 Signal Control Interface 3.4.1 Overview The signal control part of the interface in the MU736 module consists of the following: Power On/Off (Power_On_Off) pin System reset (RESET#) pin LED control (LED#) pin WWAN disable control (W_DISABLE#) pin GPS disable control (GPS_DISABLE#) pin Wake signal out from module (Wake_On_WWAN#) pin Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 20 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide BodySAR detection (BodySAR_N) pin UIM detection (SIM_DET) pin Description of the Application Interfaces Table 3-3 lists the pins on the signal control interface. Table 3-3 Pins on the signal control interface Pin No. Pin Name I/O Description DC Characteristics(V) Min. Typ. Max. –0.3 1.8 3.6 1.8 3.6 A single control to turn On/Off WWAN. When It is High, WWAN is powered on. H: Power on 6 Power_On_Off I L: Power off It is internally pulled to low. It is 3.3 V tolerant but can be driven by either 1.8 V or 3.3 V GPIO. 67 10 RESET# LED# I System reset, active low –0.3 O It is an open drain, active low signal, used to allow the M.2 card to provide status indicators via LED devices that will be provided by the system. Open drain and a pull-up resistor is required on the host WWAN disable function 8 W_DISABLE# I H: WWAN function is determined by software AT command. Default enabled. –0.3 3.3 3.6 –0.3 3.3 3.6 L: WWAN function is turned off. GPS disable function 26 GPS_DISABLE# I H: GPS function is determined by software AT command. Default enabled. L: GPS is turned off. 23 25 Wake_On_WWAN# BodySAR_N O It is open drain, WWAN to wake up the host, active low. I Hardware pin for BodySAR detection. H: No TX power backoff (default). Open drain and a pull-up resistor is required on the host –0.3 1.8 3.6 –0.3 1.8 2.1 L: TX power backoff. SIM hot swap detection pin. 66 SIM_DET I Rising edge for insertion; falling edge for removal. H: SIM is present. L: SIM is absent. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 21 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces 3.4.2 Power_On_Off Control Pin The MU736 module can be controlled to be powered on/off by the Power_On_Off pin. Table 3-4 Two states of Power_On_Off Item. Pin state Description 1 High MU736 is powered on. NOTE: If MU736 needs to be powered on automatically, the Power_On_Off pin must be pulled up to 3.3 V. 2 Low MU736 is powered off. It is internally pulled to low. MU736 is powered by regulated 3.3 V If MU736 is powered by 3.3 V voltage regulator (such as notebook or Ultrabook), Power_On_Off pin should be pulled up to 3.3 V through a resistor. The pull-up resistor should be not larger than 10 kΩ. The following are the power On/Off sequences: 1. The module gets 3.3 V when power supply for the module is switched on. 2. The module is turned on since Power_On_Off pin is pulled up directly to 3.3 V. 3. Host cuts off 3.3V supply to power off the module. The recommended circuit is shown as in Figure 3-5 . Figure 3-5 Recommended connections of Power_On_Off pins (Auto power) MU736 3.3V Pin 2, 4, 70, 72, 74 10 kΩ Power_On_Off Pin 6 Power on sequence Do not toggle RESET# pin during the power on sequence. Pulling RESET# pin low will extend time for module startup. Recommended power on timing is shown as in Figure 3-6 . Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 22 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-6 Recommended power on off timing 3.3V RESET# Power_On_Off Power on Power off Sequence Cutting off 3.3V will power off the module. Figure 3-7 Recommended power off timing (cut off 3.3V) 3.3V RESET# Power_On_Off Power off MU736 is powered directly to battery For use case MU736 is connected directly to battery, such as tablet platforms, Power_On_Off pin should be controlled by a GPIO from host to control MU736 power On/Off. It is critical to make sure the module is safely powered off when the Tablet SoC is shut off. There will be current leakage if the module is not powered off properly. So It is important to keep Power_On_Off pin logic low for more than 500 ms to power off the module. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 23 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces The recommended connections are shown as in Figure 3-8 . Figure 3-8 Recommended connections of Power_On_Off pins (Control) MU736 HOST Power_On_Off GPIO Pin 6 Power on sequence Do not toggle RESET# pin during power on sequence. Pulling RESET# pin low will extend time for module startup. Recommended power on timing is shown as in Figure 3-9 . Figure 3-9 Recommended power on timing 3.3V (Vbatt, always on) RESET# Power_On_off t0 t0 ≥ 0 ms Power on Power off Sequence Keep Power_On_Off pin logic low for more than 500 ms to power off the module. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 24 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-10 Recommended power off timing (connect to battery) 3.3V (Vbatt, always on) RESET# Logic low or high-impedance (preferred) Power_On_Off Logic low or high-impedance (preferred) t1 t1 ≥ 500 ms Power off If there is limitation on the controlling GPIO to be programmable 500 ms, the hardware solution can be used, as shown in Figure 3-11 . Figure 3-11 Power on off circuit (hardware solution) MU736 HOST Power_On_Off Pin 6 GPIO2 3.3V (battery) NMOS 1MΩ Q1 NMOS Q2 0Ω VCCGPIO2 VCCGPIO2 is the power domain of the GPIO2. When VCCGPIO2 is ON, Q2 is on and Q1 is off. So the Pin6 is controlled by GPIO2 of host. When VCCGPIO2 is Off, Q2 is off and Q1 is on. So the Pin6 is pulled low, then the module is powered off. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 25 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces 3.4.3 RESET# Pins The MU736 module can be reset through the RESET# pin asynchronous, active low. Whenever this pin is active, the module will immediately be placed in a Power On reset condition. Care should be taken for this pin unless there is a critical failure and all other methods of regaining control and/or communication with the WWAN sub-system have failed. Pulling RESET# pin low for more than 20 ms will reset the module. RESET# pin is optional, which cannot be connected. Pulling Power_On_Off pin low for more than 500 ms can work as a reset. RESET# pin is internally pulled up to 1.8 V, which is automatically on when 3.3 V is applied even though Power_On_Off pin is low. Cautions should be taken on circuit design otherwise there may be back driving issue. Option 1: Hardware circuit for RESET# In this case, the GPIO is high-impedance when the module is powered off. Figure 3-12 Hardware circuit for RESET# (Option 1) MU736 Pin 67 RESET# 0Ω HOST GPIO1 33 рF GPIO1 should be high-impedance when it is powered off. Option 2: Hardware circuit for RESET# In this case, the GPIO is not high-impedance when It is powered off. Use 2 NMOSFET so that the logic of RESET# pin and GPIO are the same. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 26 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-13 Hardware circuit for RESET# (Option 2) VCCGPIO1 MU736 HOST RESET# Pin 67 NMOS 1MΩ 33 рF NMOS 0Ω GPIO1 Option 3: Hardware circuit for RESET# In this case, the GPIO is not high-impedance when the host is powered off. Use only one NMOSFET, in this case the logic of RESET# pin and GPIO1 is reversed. Figure 3-14 Hardware circuit for RESET# (Option 3) MU736 HOST RESET# Pin 67 33 рF 0Ω GPIO1 Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 27 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces As the RESET# pin signal is relatively sensitive, it is recommended to install a 33 pF capacitor near to the M.2 pin. Triggering the RESET# pin signal will lead to loss of all data in the module and the removal of system drivers. It will also disconnect the module from the network resulting in a call drop. 3.4.4 LED# Pin MU736 provides an open drain signal to indicate the RF status. Table 3-5 State of the LED# pin No. Operating Status LED# 1 RF function is turned on Outputs Low 2 RF function is turned off Outputs High Figure 3-15 shows the recommended circuits of the LED# pin. The brightness of LED can be adjusted by adjusting the resistance of the series resistor. Figure 3-15 Driving circuit LED# pin output is different from HUAWEI MU733 module, because MU736 integrates a MOSFET inside. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 28 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces 3.4.5 W_DISABLE# Pin MU736 provides a hardware pin (W_DISABLE#) to enable/disable the radio function. This function also can be implemented by AT command. Table 3-6 Function of the W_DISABLE# pin No. W_DISABLE# Function 1 Low WWAN function will be turned off. 2 High WWAN function is determined by software AT command. Default enabled. 3 Floating WWAN function is determined by software AT command. Default enabled. Figure 3-16 Connections of the W_DISABLE# pin Module (Modem) VCC From Host 1.8V 10 kΩ Host BB Chip W_DISABLE# It is recommended not to add a diode on the W_DISABLE# pin outside the MU736 module. 3.4.6 GPS_DISABLE# Pin MU736 provides a hardware pin (GPS_DISABLE#) to enable/disable the GPS function. Table 3-7 Function of the GPS_DISABLE# pin No. GPS_DISABLE# Function 1 Low GPS function is disabled. 2 High GPS function is determined by software AT command. Default enabled. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 29 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces No. GPS_DISABLE# Function 3 Floating GPS function is determined by software AT command. Default enabled. Figure 3-17 Connections of the GPS_DISABLE# pin Module (Modem) VCC From Host 1.8V 10 kΩ Host BB Chip GPS_DISABLE# It is recommended not to add a diode on the GPS_DISABLE# pin outside the MU736 module. 3.4.7 Wake_On_WWAN# Pin MU736 provides an open drain output Wake_On_WWAN# pin to wake host. It is low active. Figure 3-18 Wave form of the Wake_On_WWAN# pin Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 30 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-19 Connections of the Wake_On_WWAN# pin 3.4.8 BodySAR_N Pin MU736 provides an input pin BodySAR_N for BodySAR detection. It is pulled up internally and when it is pulled low by the proximity sensor output or controlling signal from host systems, the Tx power reduction actions will be triggered. Table 3-8 Function of the BodySAR_N pin No. BodySAR_N Function 1 Low MAX TX power will be back off by setting through AT command 2 High MAX TX power will NOT be backed off (default) 3 Floating MAX TX power will NOT be backed off If BodySAR_N pin is used to monitor the proximity sensor output, there are some essential preconditions for this hardware solution. MU736 cannot provide any control signal for the proximity sensor. Any control or programming required by the proximity sensor should be handled by the host side. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 31 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-20 Connections of the BodySAR_N pin Module (Modem) VCC From Host 1.8V 10 kΩ BB Chip BodySAR_N USB Proximity sensor Host AP It is recommended not to add a diode on the BodySAR_N pin outside the MU736 module. 3.4.9 SIM_DET Pin MU736 supports USIM Hot Swap function. MU736 provides an input pin (SIM_DET) to detect whether the USIM card is present or not. This pin is an edge trigger pin. Table 3-9 Function of the SIM_DET pin No. SIM_DET Function 1 Rising edge USIM Card insertion. If the USIM Card is present, SIM_DET pin should be high. 2 Falling edge USIM Card removal. If the USIM Card is absent, SIM_DET pin should be low. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 32 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-21 Connections of the SIM_DET pin CD is a pin detecting USIM in the SIM Socket, normally, there will be a detect pin in the SIM Socket. The Normal SHORT SIM connector should be employed. The logic of SIM_DET pin is shown as Figure 3-22 . High represents that SIM is inserted; Low represents that SIM is removed. When SIM is inserted (hot), SIM_DET pin will change from Low to High; When SIM is removed (hot), SIM_DET pin will change from High to Low. MU736 will detect the rising or falling edge of SIM_DET to react the hot swap. Figure 3-22 The logic of SIM_DET WWAN Module 1.8V SIM Connector Switch SIM installed= Not Connected SIM_DET SIM not installed= GND Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. Modem Processor 33 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces 3.5 USB Interface The MU736 is compliant with USB 2.0 high speed protocol. The USB input/output lines are following USB 2.0 specifications. Definition of the USB interface: Pin No. Pin Name I/O 7 USB_D+ I/O 9 USB_D- I/O Description DC Characteristics (V) Min. Typ. Max. USB data signal D+ - - - USB data signal D- - - - Figure 3-23 Recommended circuit of USB interface Figure 3-24 shows the timing sequence between 3.3 V and USB D+. Figure 3-24 MU736 USB D+ and 3.3 V power on timing 3.3V Power_On_Off Tpd USB D+ Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 34 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Parameter Remarks Time(Nominal value) Unit Tpd Power valid to USB D+ high 8 s The layout design of this circuit on the host board should comply with the USB 2.0 high speed protocol, with differential characteristic impedance of 90 Ω. 3.6 USIM Card Interface 3.6.1 Overview The MU736 module provides a USIM card interface complying with the ISO 7816-3 standard and supports both 1.8 V and 3.0 V USIM cards. Table 3-10 USIM card interface signals Pin No. Pin Name I/O 30 UIM_RESET O 32 UIM_CLK 34 36 Description DC Characteristics (V) Min. Typ. Max. USIM Reset –0.3 1.8/2.85 1.98/3.0 O USIM clock –0.3 1.8/2.85 1.98/3.0 UIM_DATA IO USIM DATA –0.3 1.8/2.85 1.98/3.0 UIM_PWR PO USIM POWER –0.3 1.8/2.85 1.98/3.0 3.6.2 Circuit Recommended for the USIM Card Interface As the MU736 module is not equipped with an USIM socket, you need to place an USIM socket on the user interface board. Figure 3-25 shows the circuit of the USIM card interface. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 35 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-25 Circuit of the USIM card interface The ESD protection component should choose low capacitance. The capacitance of the component should be less than 10 pF. To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic compatibility (EMC) authentication, the USIM socket should be placed near the M.2 interface (it is recommended that the PCB circuit connects the M.2 interface and the USIM socket does not exceed 100 mm), because a long circuit may lead to wave distortion, thus affecting signal quality. It is recommended that you wrap the area adjacent to the SIM_CLK and SIM_DATA signal wires with ground. The Ground pin of the USIM socket and the Ground pin of the USIM card must be well connected to the power Ground pin supplying power to the MU736 module. A 100 nF capacitor (0402 package is recommended so that larger capacitance such as 1µF can be employed if necessary) and a 33 pF capacitor are placed between the SIM_VCC and Ground pins in parallel. Three 33 pF capacitors are placed between the SIM_DATA and Ground pins, the SIM_RST and Ground pins, and the SIM_CLK and Ground pins in parallel to filter interference from RF signals. It is recommended to take electrostatic discharge (ESD) protection measures near the USIM card socket. Transient voltage suppressor diode should be placed as close as possible to the USIM socket, and the Ground pin of the ESD protection component is well connected to the power Ground pin that supplies power to the MU736 module. 3.7 Tunable Antenna Control The module provides 4 tunable antenna control pins. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 36 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Table 3-11 List of ANTCTL pins Pin No. Pin Name 59 ANTCTL0 I/O Description O DC Characteristics(V) Tunable antenna control signal bit 0. Min. Typ. Max. –0.3 1.8 2.1 –0.3 1.8 2.1 –0.3 1.8 2.1 –0.3 1.8 2.1 It is a push-pull type GPIO. 61 ANTCTL1 O Tunable antenna control signal bit 1. It is a push-pull type GPIO. 63 ANTCTL2 O Tunable antenna control signal bit 2. It is a push-pull type GPIO. 65 ANTCTL3 O Tunable antenna control signal bit 3. It is a push-pull type GPIO. 3.8 Config Pins The module provides 4 config pins. MU736 is configured as WWAN-SSIC 0. Table 3-12 List of CONFIG pins Pin No. Pin Name I/O 1 CONFIG_3 O 21 CONFIG_0 69 75 Description DC Characteristics(V) Min. Typ. Max. Connected to GND internally - 0 - O Not Connected internally - - - CONFIG_1 O Connected to GND internally - 0 - CONFIG_2 O Connected to GND internally - 0 - In the M.2 specification, the 4 pins are defined as Table 3-13 . Table 3-13 List of Config pins Config_0 (Pin 21) Config_1 (Pin 69) Config_2 (Pin 75) Config_3 (Pin 1) Module type and Main host interface Port Configuration Ground Ground Ground Ground SSD-SATA N/A Ground NC Ground Ground SSD-PCIe N/A NC Ground Ground Ground WWAN-SSIC 0 NC NC NC NC No Module present N/A Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 37 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces The GPIO0~7 pins have configurable assignments. There are 4 possible functional pin out configurations. These 4 configurations are called Port Config0~3. In each Port Configuration each GPIO is defined as a specific functional pin. The GPIO pin assignment can see in Table 3-14 . MU736 supports Config0. But the audio function is not implemented in MU736. Table 3-14 GPIO Pin Function Assignment per Port Configuration GPIO Pin Port Config0 (GNSS+Audio ver1) GPIO_0 (Pin 40) GNSS_SCL GPIO_1 (Pin 42) GNSS_SDA GPIO_2 (Pin 44) GNSS_I2C_IRQ GPIO_3 (Pin 46) SYSCLK GPIO_4 (Pin 48) TX_Blanking GPIO_5 (Pin 20) Audio_0 (not supported ) GPIO_6 (Pin 22) Audio_1 (not supported) GPIO_7 (Pin 24) Audio_2 (not supported) 3.9 NC Pins The module has some NC pins. All of NC pins are not connected in the module. Table 3-15 List of NC pins Pin No. Pin Name 28, 29, 31, 35, 37, 38, 41, 43, 47, 49, 50, 52, 53, 54, 55, 56, 58, 68 NC I/O - Description Not Connected DC Characteristics(V) Min. Typ. Max. - - - 3.10 RF Antenna Interface 3.10.1 RF Connector location MU736 module provides 2 antenna connectors for connecting the external antennas. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 38 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-26 RF antenna connectors 3.10.2 Coaxial RF Connector Guidelines The antenna interface must be used with coaxial cables with characteristic impedance of 50 Ω. The MU736 module supports the buckled RF connector antenna connection methods: buckled RF connector MM4829-2702RA4 by MURATA or other equivalent connectors Figure 3-27 shows the RF connector dimensions. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 39 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-27 RF connector dimensions Table 3-16 The major specifications of the RF connector Rated Condition Environmental Condition Frequency range DC to 6 GHz Temperature range: Characteristic impedance 50 Ω –40°C to +85°C There are two kinds of coaxial cables mating the RF connector in the MU736. Figure 3-28 shows the specifications of 0.81 mm coaxial cable mating the recommended RF connector. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 40 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-28 Specifications of 0.81 mm coaxial cable mating with the RF connector Figure 3-29 shows the connection between the RF connector and the 0.81 mm cable. Figure 3-29 Connection between the RF connector and the 0.81 mm cable Figure 3-30 shows the specifications of 1.13 mm coaxial cable mating the recommended RF connector. Figure 3-30 Specifications of 1.13 mm coaxial cable mating with the RF connector Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 41 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description of the Application Interfaces Figure 3-31 shows the connection between the RF connector and the 1.13 mm cable. Figure 3-31 Connection between the RF connector and the 1.13 mm cable Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 42 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide RF Specifications 4 RF Specifications 4.1 About This Chapter This chapter describes the RF specifications of the MU736 module, including: Operating Frequencies Conducted RF Measurement Conducted Rx Sensitivity and Tx Power Antenna Design Requirements 4.2 Operating Frequencies Table 4-1 shows the RF bands supported by MU736. Table 4-1 RF bands Operating Band Tx Rx UMTS Band I 1920 MHz–1980 MHz 2110 MHz–2170 MHz UMTS Band II 1850 MHz–1910 MHz 1930 MHz–1990 MHz UMTS Band IV(AWS) 1710 MHz–1755 MHz 2110 MHz–2155 MHz UMTS Band V 824 MHz–849 MHz 869 MHz–894 MHz UMTS Band VIII 880 MHz–915 MHz 925 MHz–960 MHz GSM 850 824 MHz–849 MHz 869 MHz–894 MHz GSM 900 880 MHz–915 MHz 925 MHz–960 MHz GSM 1800(DCS) 1710 MHz–1785 MHz 1805 MHz–1880 MHz GSM 1900(PCS) 1850 MHz–1910 MHz 1930 MHz–1990 MHz GPS - 1574.42 MHz–1576.42 MHz Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 43 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide RF Specifications 4.3 Conducted RF Measurement 4.3.1 Test Environment Test instrument R&S CMU200, Agilent E5515C, GSS6700 Power supply Keithley 2303, Agilent 66319 RF cable for testing Rosenberger Precision Microwave Cable Murata coaxial cable MXHP32HP1000 The compensation for different frequency bands relates to the cable and the test environment. The instrument compensation needs to be set according to the actual cable conditions. 4.3.2 Test Standards Huawei modules meet 3GPP TS 51.010-1 and 3GPP TS 34.121-1 test standards. Each module passes strict tests at the factory and thus the quality of the modules is guaranteed. 4.4 Conducted Rx Sensitivity and Tx Power 4.4.1 Conducted Receive Sensitivity The conducted receive sensitivity is a key parameter that indicates the receiver performance of MU736. The 3GPP Protocol Claim column in Table 4-2 lists the required minimum values, and the Test Value column lists the tested values of MU736. Table 4-2 MU736 conducted Rx sensitivity (Unit: dBm) Item GSM850 GSM900 Issue 05 (2014-01-14) 3GPP Protocol Claim (dBm) MU736 Test Value (dBm) Min. Typ. Max. GMSK (CS1, BLER < 10%) < –102 - - –108 8PSK (MCS5, BLER < 10%) < –98 - - –101 GMSK (CS1, BLER < 10%) < –102 - - –108 8PSK (MCS5, BLER < 10%) < –98 - - –101 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 44 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Item RF Specifications 3GPP Protocol Claim (dBm) MU736 Test Value (dBm) Min. Typ. Max. GMSK (CS1, BLER < 10%) < –102 - - –108 8PSK (MCS5, BLER < 10%) < –98 - - –101 GMSK (CS1, BLER < 10%) < –102 - - –108 8PSK (MCS5, BLER < 10%) < –98 - - –101 Band I (BER < 0.1%) < –106.7 - - –108 Band II (BER < 0.1%) < –104.7 - - –108 Band IV (BER < 0.1%) < –106.7 - - –108 Band VIII (BER < 0.1%) < –103.7 - - –108 Band V (BER < 0.1%) < –104.7 - - –108 GSM1800 GSM1900 Table 4-3 MU736 GPS specifications TTFF Sensitivity Cold start 43s@–130 dBm Warm start 43s@–130 dBm Hot Start 3s@–130 dBm Cold start –144 dBm Tracking –158 dBm The test values are the average of some test samples. 4.4.2 Conducted Transmit Power The conducted transmit power is another indicator that measures the performance of MU736. The conducted transmit power refers to the maximum power that the module tested at the antenna port can transmit. According to the 3GPP protocol, the required transmit power varies with the power class. Table 4-4 lists the required ranges of the conducted transmit power of MU736. The tested values listed in the Test Value column must range from the minimum power to the maximum power. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 45 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide RF Specifications Table 4-4 MU736 conducted Tx power (Unit: dBm) Item 3GPP Protocol Claim (dBm) MU736 Test Value (dBm) Min. Typ. Max. GMSK (1Tx Slot) 31 to 35 31.5 32.5 33.5 8PSK (1Tx Slot) 24 to 30 26 27 28 GMSK (1Tx Slot) 31 to 35 31.5 32.5 33.5 8PSK (1Tx Slot) 24 to 30 26 27 28 GMSK (1Tx Slot) 28 to 32 28.5 29.5 30.5 8PSK (1Tx Slot) 23 to 29 25 26 27 GMSK (1Tx Slot) 28 to 32 28.5 29.5 30.5 8PSK (1Tx Slot) 23 to 29 25 26 27 Band I 21 to 25 22.5 23.5 24.5 Band II 21 to 25 22.5 23.5 24.5 Band IV 21 to 25 22.5 23.5 24.5 Band VIII 21 to 25 22.5 23.5 24.5 Band V 21 to 25 22.5 23.5 24.5 GSM850 GSM900 GSM1800 GSM1900 4.5 Antenna Design Requirements 4.5.1 Antenna Design Indicators Antenna Efficiency Antenna efficiency is the ratio of the input power to the radiated or received power of an antenna. The radiated power of an antenna is always lower than the input power due to the following antenna losses: return loss, material loss, and coupling loss. The efficiency of an antenna relates to its electrical dimensions. To be specific, the antenna efficiency increases with the electrical dimensions. In addition, the transmission cable from the antenna port of MU736 to the antenna is also part of the antenna. The cable loss increases with the cable length and the frequency. It is recommended that the cable loss be as low as possible, for example, U.FL-LP-088 made by HRS. The following antenna efficiency (free space) is recommended for MU736 to ensure high radio performance of the module: Efficiency of the primary antenna: ≥ 40% (below 960 MHz); ≥ 50% (over 1710 MHz) Efficiency of the diversity antenna: ≥ half of the efficiency of the primary antenna in receiving band Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 46 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide RF Specifications Efficiency of the GPS antenna: ≥ 50% In addition, the efficiency should be tested with the transmission cable. S11 or VSWR S11 indicates the degree to which the input impedance of an antenna matches the reference impedance (50 ohm). S11 shows the resonance feature and impedance bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector analyzer. The following S11 values are recommended for the antenna of MU736: S11 of the primary antenna ≤ –6 dB S11 of the diversity antenna ≤ –6 dB S11 of the GPS antenna ≤ –10 dB In addition, S11 is less important than the efficiency, and S11 has weak correlation to the wireless performance. Isolation For a wireless device with multiple antennas, the power of different antennas is coupled with each other. Antenna isolation is used to measure the power coupling. The power radiated by an antenna might be received by an adjacent antenna, which decreases the antenna radiation efficiency and affects the running of other devices. To avoid this problem, evaluate the antenna isolation as sufficiently as possible at the early stage of antenna design. Antenna isolation depends on the following factors: Distance between antennas Antenna type Antenna direction The primary antenna must be placed as near as possible to the MU736 to minimize the cable length. The diversity antenna needs to be installed perpendicularly to the primary antenna. The diversity antenna can be placed farther away from the MU736. Antenna isolation can be measured with a two-port vector network analyzer. The following antenna isolation is recommended for the antennas on laptops: Isolation between the primary and diversity antennas ≤ –12 dB Isolation between the primary antenna and the GPS antenna ≤ –15 dB Isolation between the primary antenna and the Wi-Fi antenna ≤ –15 dB Polarization The polarization of an antenna is the orientation of the electric field vector that rotates with time in the direction of maximum radiation. The linear polarization is recommended for the antenna of MU736. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 47 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide RF Specifications Envelope Correlation Coefficient The envelope correlation coefficient indicates the correlation between different antennas in a multi-antenna system (primary antenna, diversity antenna, and MIMO antenna). The correlation coefficient shows the similarity of radiation patterns, that is, amplitude and phase of the antennas. The ideal correlation coefficient of a diversity antenna system or a MIMO antenna system is 0. A small value of the envelope correlation coefficient between the primary antenna and the diversity antenna indicates a high diversity gain. The envelope correlation coefficient depends on the following factors: Distance between antennas Antenna type Antenna direction The antenna correlation coefficient differs from the antenna isolation. Sufficient antenna isolation does not represent a satisfactory correlation coefficient. For this reason, the two indicators need to be evaluated separately. For the antennas on laptops, the recommended envelope correlation coefficient between the primary antenna and the diversity antenna is smaller than 0.5. Radiation Pattern The radiation pattern of an antenna reflects the radiation features of the antenna in the remote field region. The radiation pattern of an antenna commonly describes the power or field strength of the radiated electromagnetic waves in various directions from the antenna. The power or field strength varies with the angular coordinates (θ and φ), but is independent of the radial coordinates. The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal plane, and the incident waves of base stations are often in the horizontal plane. For this reason, the receiving performance is optimal. The following radiation patterns are recommended for the antenna of MU736: Primary/Diversity/GPS/WIFI antenna: omnidirectional. In addition, the diversity antenna’s pattern should be complementary with the primary antenna’s pattern. Gain and Directivity The radiation pattern of an antenna represents the field strength of the radiated electromagnetic waves in all directions, but not the power density that the antenna radiates in the specific direction. The directivity of an antenna, however, measures the power density that the antenna radiates. Gain, as another important parameter of antennas, correlates closely to the directivity. The gain of an antenna takes both the directivity and the efficiency of the antenna into account. The appropriate antenna gain prolongs the service life of relevant batteries. The following antenna gain is recommended for MU736: Gain of the primary antenna ≤ 2.5 dBi Gain of the diversity antenna ≤ 2.5 dBi Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 48 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide RF Specifications The antenna consists of the antenna body and the relevant RF transmission cable. Take the RF transmission cable into account when measuring any of the preceding antenna indicators. Huawei cooperates with various famous antenna suppliers who are able to make suggestions on antenna design, for example, Amphenol, Skycross, etc. 4.5.2 Interference Besides the antenna performance, the interference on the user board also affects the radio performance (especially the TIS) of the module. To guarantee high performance of the module, the interference sources on the user board must be properly controlled. On the user board, there are various interference sources, such as the LCD, CPU, audio circuits, and power supply. All the interference sources emit interference signals that affect the normal operation of the module. For example, the module sensitivity can be decreased due to interference signals. Therefore, during the design, you need to consider how to reduce the effects of interference sources on the module. You can take the following measures: Use an LCD with optimized performance; shield the LCD interference signals; shield the signal cable of the board; or design filter circuits. Huawei is able to make technical suggestions on radio performance improvement of the module. 4.5.3 GSM/WCDMA/GPS Antenna Requirements The antenna for MU736 must fulfill the following requirements: GSM/WCDMA/GPS Antenna Requirements Frequency range Depending on frequency band(s) provided by the network operator, the customer must use the most suitable antenna for that/those band(s) Bandwidth 70 MHz in GSM850 80 MHz in GSM900 170 MHz in DCS 140 MHz in PCS 70 MHZ in WCDMA850 (25 MHz for diversity antenna) 80 MHz in WCDMA900 (35 MHz for diversity antenna) 445 MHz in WCDMA1700 (AWS) (45 MHz for diversity antenna) 140 MHz in WCDMA1900 (60 MHz for diversity antenna) 250 MHz in WCDMA2100 (60 MHz for diversity antenna) 2 MHz in GPS Gain ≤ 2.5 dBi Impedance 50 Ω VSWR absolute max ≤ 3:1 (≤ 2:1 for GPS antenna) Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 49 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide RF Specifications GSM/WCDMA/GPS Antenna Requirements VSWR recommended ≤ 2:1 (≤ 1.5:1 for GPS antenna) 4.5.4 Radio Test Environment The antenna efficiency, antenna gain, radiation pattern, total radiated power (TRP), and total isotropic sensitivity (TIS) can be tested in a microwave testing chamber. Huawei has a complete set of OTA test environments (SATIMO microwave testing chambers and ETS microwave testing chambers). The testing chambers are certified by professional organizations and are applicable to testing at frequencies ranging from 380 MHz to 6 GHz. The test items are described as follows. Passive Tests Antenna efficiency Gain Pattern shape Envelope correlation coefficient TRP: GSM, WCDMA systems TIS: GSM, WCDMA systems Active Tests Figure 4-1 shows the SATIMO microwave testing chamber. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 50 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide RF Specifications Figure 4-1 SATIMO microwave testing chamber Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 51 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide 5 Electrical and Reliability Features Electrical and Reliability Features 5.1 About This Chapter This chapter describes the electrical and reliability features of the interfaces in the MU736 module, including: Absolute Ratings Operating and Storage Temperatures and Humidity Electrical Features of Application Interfaces Power Supply Features Reliability Features EMC and ESD Features 5.2 Absolute Ratings Table 5-1 lists the absolute ratings for the MU736 module. Using the MU736 module beyond these conditions may result in permanent damage to the module. Table 5-1 Absolute ratings for the MU736 module Symbol Specification Min. Max. Unit 3.3 V External power voltage –0.3 5.5 V Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 52 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Electrical and Reliability Features 5.3 Operating and Storage Temperatures and Humidity Table 5-2 lists the operating and storage temperatures and humidity for the MU736 module. Table 5-2 operating and storage temperatures and humidity for the MU736 module Specification Min. Max. Unit Normal working temperatures[1] –10 +55 °C Extended temperatures[2] –20 +70 °C Ambient temperature for storage –40 +85 °C Moisture 5 95 % [1]: When the MU736 module works at this temperature, all its RF indexes comply with the 3GPP TS 45.005 specifications. [2]: When the MU736 module works at this temperature, NOT all its RF indexes comply with the 3GPP TS 45.005 specifications. 5.4 Electrical Features of Application Interfaces Table 5-3 Electrical features of Digital Pins Parameter Description Min. Max. Unit VIH 1.26 3.6 V VIL –0.2 0.3 V VIH 1.26 2.1 V VIL –0.2 0.3 V VIH 1.26 3.6 V VIL –0.2 0.3 V VIH 1.26 3.6 V VIL –0.2 0.3 V VIH 1.26 3.6 V VIL –0.2 0.3 V VIH 1.26 2.1 V VIL –0.2 0.3 V BodySAR_N RESET Power_On_Off W_DISABLE GPS_DISABLE SIM_DET Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 53 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Electrical and Reliability Features Table 5-4 Electrical features of Digital Pins in the I/O supply domain of the USIM Interface Parameter Description Min. Max. Note Unit VIH High-level input voltage 0.7 x VDDP_USIM 3.3 VDDP_USIM=1.8 V or 2.9 V V VIL Low-level input voltage 0 0.2 x VDDP_USIM VDDP_USIM=1.8 V or 2.9 V V VOH High-level output voltage 0.7 x VDDP_USIM 3.3 VDDP_USIM=1.8 V or 2.9 V, IOL=–1.0 mA V VOL Low-level output voltage 0 0.2 x VDDP_USIM VDDP_USIM=1.8 V or 2.9 V, IOL=+1.0 mA V Ileak Input/Output leakage current - ±0.7 0.2V < VIN < VIHmax μA Table 5-5 Electrical features of Digital Pins of the ANT_TUNER Interface Parameter Description Min. Max. Note Unit VOH High-level output voltage 1.26 2 - V VOL Low-level output voltage 0 0.15 - V 5.5 Power Supply Features 5.5.1 Input Power Supply Table 5-6 lists the requirements for input power of the MU736 module. Table 5-6 Requirements for input power for the MU736 module Parameter Min. Typ. Max. Ripple Unit 3.3 V 3.135 3.3 4.4 0.05 V Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 54 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Electrical and Reliability Features Figure 5-1 Power Supply During Burst Emission The minimum value of the power supply must be guaranteed during the burst (with 2. 5 A Peak in GPRS or EGPRS mode). Table 5-7 Requirements for input current of the MU736 module Power Peak (Maximum) Normal (Maximum) 3.3 V 2500 mA 1100 mA 5.5.2 Power Consumption The power consumption of MU736 in different scenarios are respectively listed in Table 5-8 to Table 5-12 . The power consumption listed in this section is tested when the power supply of MU736 module is normal voltage (3.3 V), and all of test values are measured at room temperature. Table 5-8 Averaged power off DC power consumption of MU736 Description Test Value (uA) Notes/Configuration Typical Power off Issue 05 (2014-01-14) 50 Normal voltage (3.3 V) is ON and Power_On_Off pin is pulled low. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 55 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Electrical and Reliability Features Table 5-9 Averaged standby DC power consumption of MU736 (WCDMA/HSDPA/GSM) Description Bands Test Value (mA) Notes/Configuration Typical Sleep HSPA+/WCDMA UMTS bands 2.3 Module is powered up. (sleep) DRX cycle=8 (2.56s) Module is registered on the network. USB is in suspend. GPRS/EDGE GSM bands 2.3 Module is powered up. (sleep) MFRMS=5 (1.175s) Module is registered on the network. USB is in suspend. Radio Off All bands 1.6 Module is powered up. (sleep) RF is disabled. USB is in suspend. Idle HSPA+/WCDMA (idle) UMTS bands 30 Module is powered up. DRX cycle=8 (2.56s) Module is registered on the network, and no data is transmitted. USB is in active. GPRS/EDGE GSM bands 30 Module is powered up. (idle) MFRMS=5 (1.175s) Module is registered on the network. no data is transmitted. USB is in active. Radio Off All bands 30 Module is powered up. (idle) RF is disabled. USB is in active. Table 5-10 Averaged Data Transmission DC power consumption of MU736 (WCDMA/HSDPA) Description Band Test Value (mA) Notes/Configuration Typical WCDMA Issue 05 (2014-01-14) Band I (IMT2100) 190 0 dBm Tx Power 245 10 dBm Tx Power Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 56 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description Band Electrical and Reliability Features Test Value (mA) Notes/Configuration Typical 710 23.5 dBm Tx Power 180 0 dBm Tx Power 245 10 dBm Tx Power 790 23.5 dBm Tx Power Band IV 180 0 dBm Tx Power (AWS) 220 10 dBm Tx Power 690 23.5 dBm Tx Power 180 0 dBm Tx Power 220 10 dBm Tx Power 680 23.5 dBm Tx Power Band VIII 180 0 dBm Tx Power (900 MHz) 240 10 dBm Tx Power 760 23.5 dBm Tx Power Band I 195 0 dBm Tx Power (IMT2100) 260 10 dBm Tx Power 740 23.5 dBm Tx Power Band II 195 0 dBm Tx Power (PCS 1900) 255 10 dBm Tx Power 790 23.5 dBm Tx Power Band IV 190 0 dBm Tx Power (AWS) 250 10 dBm Tx Power 690 23.5 dBm Tx Power Band V 195 0 dBm Tx Power (850 MHz) 245 10 dBm Tx Power 690 23.5 dBm Tx Power Band VIII 195 0 dBm Tx Power (900 MHz) 255 10 dBm Tx Power 730 23.5 dBm Tx Power Band II (PCS 1900) Band V (850 MHz) HSDPA Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 57 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Electrical and Reliability Features Table 5-11 Averaged DC power consumption of MU736 (GPRS/EDGE) Description Test Value (mA) PCL Notes/Configuration 5 1 Up/1 Down Typical GPRS850 265 385 2 Up/1 Down 535 4 Up/1 Down 145 GPRS900 2 Up/1 Down 380 4 Up/1 Down 270 550 4 Up/1 Down 10 1 Up/1 Down 230 2 Up/1 Down 395 4 Up/1 Down 175 0 1 Up/1 Down 225 2 Up/1 Down 265 4 Up/1 Down 10 1 Up/1 Down 105 2 Up/1 Down 140 4 Up/1 Down 185 0 1 Up/1 Down 240 2 Up/1 Down 280 4 Up/1 Down 10 1 Up/1 Down 105 2 Up/1 Down 145 4 Up/1 Down 185 8 1 Up/1 Down 280 2 Up/1 Down 430 4 Up/1 Down 100 15 145 Issue 05 (2014-01-14) 1 Up/1 Down 2 Up/1 Down 80 EDGE850 5 390 80 GPRS1900 1 Up/1 Down 230 145 GPRS1800 10 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 1 Up/1 Down 2 Up/1 Down 58 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description Test Value (mA) Electrical and Reliability Features PCL Notes/Configuration Typical 220 EDGE900 4 Up/1 Down 190 8 295 2 Up/1 Down 455 4 Up/1 Down 100 EDGE1800 15 1 Up/1 Down 150 2 Up/1 Down 230 4 Up/1 Down 150 2 1 Up/1 Down 240 2 Up/1 Down 360 4 Up/1 Down 100 EDGE1900 1 Up/1 Down 10 1 Up/1 Down 150 2 Up/1 Down 230 4 Up/1 Down 150 2 1 Up/1 Down 230 2 Up/1 Down 360 4 Up/1 Down 100 10 1 Up/1 Down 150 2 Up/1 Down 230 4 Up/1 Down All power consumption test configuration can be referenced by GSM Association Official Document TS.09: Battery Life Measurement and Current Consumption Technique. Test condition: For Max Tx power ,see 4.4.2 Conducted Transmit Power, they are listed in Table 4-4 ; for Max data throughput, see 2.2 Function Overview, they are listed in Table 2-1 Features. Table 5-12 Averaged GPS operation DC power consumption of MU736 Description Test Value (mA) Notes/Configuration Typical GPS fixing Issue 05 (2014-01-14) 100 RF is disabled; Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 59 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Description Electrical and Reliability Features Test Value (mA) Notes/Configuration Typical 100 GPS tracking USB is in active; The Rx power of GPS is –130 dBm. 5.6 Reliability Features Table 5-13 lists the test conditions and results of the reliability of the MU736 module. Table 5-13 Test conditions and results of the reliability of the MU736 module Item Low-temperature storage Test Condition Standard Sample size Results Temperature: –40ºC JESD22A119-C 3 pcs/group Visual inspection: ok Operation mode: no power, no package Function test: ok Test duration: 24 h High-temperature storage Temperature: 85ºC Operation mode: no power, no package RF specification: ok JESD22A103-C 3 pcs/group Function test: ok Test duration: 24 h Low-temperature operating Temperature: –20ºC Operation mode: working with service connected Visual inspection: ok RF specification: ok IEC6006 8-2-1 3 pcs/group Visual inspection: ok Function test: ok RF specification: ok Test duration: 24 h Stress High-temperature operating Temperature: 70ºC Operation mode: working with service connected JESD22A108-C 3 pcs/group Visual inspection: ok Function test: ok RF specification: ok Test duration: 24 h Damp heat cycling High temperature: 55ºC JESD22A101-B 3 pcs/group Low temperature: 25ºC Visual inspection: ok Function test: ok RF specification: ok Humidity: 95%±3% Operation mode: working with service connected Test duration: 6 cycles; 12 h+12 h/cycle Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 60 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Item Thermal shock Electrical and Reliability Features Test Condition Standard Sample size Results Low temperature: –40º JESD22A106-B 3 pcs/group Visual inspection: ok Function test: ok High temperature: 85ºC RF specification: ok Temperature change interval: < 20s Operation mode: working with service connected Test duration: 100 cycles; 15 min+15 min/cycle Salty fog test Temperature: 35°C Density of the NaCl solution: 5%±1% JESD22A107-B 3 pcs/group Visual inspection: ok Function test: ok RF specification: ok Operation mode: no power, no package Test duration: Spraying period: 8 h Exposing period after removing the salty fog environment: 16 h Sine vibration Stress Frequency range: 5 Hz to 200 Hz JESD22B103-B 3 pcs/group Visual inspection: ok Acceleration: 1 Grms Function test: ok Frequency scan rate: 0.5 oct/min RF specification: ok Operation mode: working with service connected Test duration: 3 axial directions. 2 h for each axial direction. Operation mode: working with service connected Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 61 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Item Shock test Electrical and Reliability Features Test Condition Standard Sample size Results Half-sine wave shock JESD-B1 04-C 3 pcs/group Visual inspection: ok Peak acceleration: 30 Grms Function test: ok Shock duration: 11 ms RF specification: ok Operation mode: working with service connected Test duration: 6 axial directions. 3 shocks for each axial direction. Operation mode: working with service connected Drop test Stress 0.8 m in height. Drop the module on the marble terrace with one surface facing downwards, six surfaces should be tested. IEC6006 8-2-32 3 pcs/group Visual inspection: ok Function test: ok RF specification: ok Operation mode: no power, no package High temperature operating life Temperature: 70ºC Operation mode: working with service connected JESD22A108-B 50 pcs/group Visual inspection: ok Function test: ok RF specification: ok Test duration: 168 h, 336 h, 500 h, 1000 h for inspection point Life High temperature & high humidity High temperature: 85ºC JESD22A110-B 50 pcs/group Visual inspection: ok Humidity: 85% Function test: ok Operation mode: powered on and no working RF specification: ok Cross section: ok Test duration: 168 h, 336 h, 500 h, 1000 h for inspection point Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 62 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Item Temperature cycle Electrical and Reliability Features Test Condition Standard Sample size Results High temperature: 85ºC JESD22A104-C 50 pcs/group Visual inspection: ok Low temperature: –40ºC Function test: ok Temperature change slope: 6ºC/min Cross section: ok RF specification: ok Operation mode: no power Test duration: 168 h, 336 h, 500 h, 1000 h for inspection point HBM (Human Body Model) 1 kV (Class 1 B) Operation mode: no power JESD22A114-D 3 pcs/group Visual inspection: ok Function test: ok RF specification: ok ESD ESD with DVK (or embedded in the host) Contact Voltage: ±2 kV, ±4 kV IEC6100 0-4-2 2 pcs Air Voltage: ±2 kV, ±4 kV, ±8 kV Visual inspection: ok Function test: ok RF specification: ok Operation mode: working with service connected Groups ≥ 2 5.7 EMC and ESD Features The following are the EMC design comments: Attention should be paid to static control in the manufacture, assembly, packaging, handling, and storage process to reduce electrostatic damage to HUAWEI module. RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if the antenna port is protected by TVS (Transient Voltage Suppressor), which is resolved by making some adjustments on RF match circuit. TVS should be added on the USB port for ESD protection, and the parasitic capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode inductor should be added in parallel on D+/D- signal. TVS should be added on the SIM interface for ESD protection. The parasitic capacitance of TVS on SIM signal should be less than 10 pF. Resistors in parallel and a 10 nF capacitor should be added on RESET# and Power_On_Off signal to avoid shaking, and the distance between the capacitor and the related pin should be less than 100 mil. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 63 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Electrical and Reliability Features PCB routing should be V-type rather than T-type for TVS. An integrated ground plane is necessary for EMC design. The following are the requirements of ESD environment control: The electrostatic discharge protected area (EPA) must have an ESD floor whose surface resistance and system resistance are greater than 1 x 104 Ω while less than 1 x 109 Ω. The EPA must have a sound ground system without loose ground wires, and the ground resistance must be less than 4 Ω. The workbench for handling ESD sensitive components must be equipped with common ground points, the wrist strap jack, and ESD pad. The resistance between the jack and common ground point must be less than 4 Ω. The surface resistance and system resistance of the ESD pad must be less than 1 x 109 Ω. The EPA must use the ESD two-circuit wrist strap, and the wrist strap must be connected to the dedicated jack. The crocodile clip must not be connected to the ground. The ESD sensitive components, the processing equipment, test equipment, tools, and devices must be connected to the ground properly. The indexes are as follows: − Hard ground resistance < 4 Ω − 1 x 105 Ω ≤ Soft ground resistance < 1 x 109 Ω − 1 x 105 Ω ≤ ICT fixture soft ground resistance < 1 x 1011 Ω − The electronic screwdriver and electronic soldering iron can be easily oxidized. Their ground resistance must be less than 20 Ω. The parts of the equipment, devices, and tools that touch the ESD sensitive components and moving parts that are close to the ESD sensitive components must be made of ESD materials and have sound ground connection. The parts that are not made of ESD materials must be handled with ESD treatment, such as painting the ESD coating or ionization treatment (check that the friction voltage is less than 100 V). Key parts in the production equipment (parts that touch the ESD sensitive components or parts that are within 30 cm away from the ESD sensitive components), including the conveyor belt, conveyor chain, guide wheel, and SMT nozzle, must all be made of ESD materials and be connected to the ground properly (check that the friction voltage is less than 100 V). Engineers that touch IC chips, boards, modules, and other ESD sensitive components and assemblies must wear ESD wrist straps, ESD gloves, or ESD finger cots properly. Engineers that sit when handling the components must all wear ESD wrist straps. Noticeable ESD warning signs must be attached to the packages and placement areas of ESD sensitive components and assemblies. Boards and IC chips must not be stacked randomly or be placed with other ESD components. Effective shielding measures must be taken on the ESD sensitive materials that are transported or stored outside the EPA. The HUAWEI MU736 module does not include any protection against overvoltage. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 64 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide 6 Mechanical Specifications Mechanical Specifications 6.1 About This Chapter This chapter describes the following aspects of the MU736 module: Dimensions of MU736 Label Packing System 6.2 Dimensions of MU736 Figure 6-1 shows the dimensions of MU736 in details. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 65 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Mechanical Specifications Figure 6-1 Dimensions of MU736 TOP VIEW BOTTOM VIEW 6.3 Label There are two labels on the MU736. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 66 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Mechanical Specifications Figure 6-2 Dimensions of label (front label) Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 67 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Mechanical Specifications Figure 6-3 Dimensions of label (back label) 6.4 Packing System HUAWEI M.2 module uses five layers ESD pallet, anti-vibration foam and vacuum packing into cartons. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 68 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Mechanical Specifications Figure 6-4 Packet system Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 69 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Installation 7 Installation 7.1 About This Chapter This chapter describes the assembly of MU736, including: Connect MU736 to Board Antenna Plug 7.2 Connect MU736 to Board Figure 7-1 Install MU736 It refers to M.2 specification. The module will need a mechanical retention at the end of the board. The module specifies a 5.5 mm Dia. keep out zone at the end for attaching a screw. The module Stand-off and mounting screw also serve as part of the module Electrical Ground path. The Stand-off should be connected directly to the ground plane on the platform. So that when the module is mounted and the mounting screw is screwed on to hold the module in place, this will make the electrical ground connection from the module to the platform ground plane. The stand-off must provide a Thermal Ground Path. The design requirements for thermal are a material with a minimum conductivity of 50 watts per meter Kelvin and surface area of 22 Sq mm. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 70 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Installation 7.3 Antenna Plug Figure 7-2 Mating the plug 1. Align the mating tool or the mating end of the tool over the plug end of the cable assembly. 2. Firmly place the tool over the plug until it is secured in the tool. 3. Place the plug cable assembly (held in the tool) over the corresponding receptacle. 4. Assure that the plug and receptacle are aligned press-down perpendicular to the mounting surface until both connectors are fully mated. 5. Remove the mating tool by pulling it up carefully. Figure 7-3 Unmating the plug The extraction tool is recommended. Any attempt of unmating by pulling on the cable may result in damage and influence the mechanical / electrical performance. It is recommended that not to apply any pull forces after the bending of the cable, as described in Figure 7-4 . Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 71 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Installation Figure 7-4 Do not apply any pull forces after the bending of the cable Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 72 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Certifications 8 Certifications 8.1 About This Chapter This chapter gives a general description of certifications of MU736. 8.2 Certifications The certification of MU736 is testing now. Table 8-1 shows certifications the MU736 will be implemented. For more demands, please contact us for more details about this information. Table 8-1 Product Certifications Certification Model name MU736 CE FCC CCC NCC A-TICK Jate & Telec IC EU RoHS JGPSSI - SGS RoHS - Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 73 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Certification Certifications Model name MU736 PVC-Free - GCF PTCRB Halogen-free Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 74 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Safety Information 9 Safety Information Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed. 9.1 Interference Power off your wireless device if using the device is prohibited. Do not use the wireless device when it causes danger or interference with electric devices. 9.2 Medical Device Power off your wireless device and follow the rules and regulations set forth by the hospitals and health care facilities. Some wireless devices may affect the performance of the hearing aids. For any such problems, consult your service provider. Pacemaker manufacturers recommend that a minimum distance of 15 cm be maintained between the wireless device and a pacemaker to prevent potential interference with the pacemaker. If you are using an electronic medical device, consult the doctor or device manufacturer to confirm whether the radio wave affects the operation of this device. 9.3 Area with Inflammables and Explosives To prevent explosions and fires in areas that are stored with inflammable and explosive devices, power off your wireless device and observe the rules. Areas stored with inflammables and explosives include but are not limited to the following: Gas station Fuel depot (such as the bunk below the deck of a ship) Container/Vehicle for storing or transporting fuels or chemical products Area where the air contains chemical substances and particles (such as granule, dust, or metal powder) Area indicated with the "Explosives" sign Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 75 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Safety Information Area indicated with the "Power off bi-direction wireless equipment" sign Area where you are generally suggested to stop the engine of a vehicle 9.4 Traffic Security Observe local laws and regulations while using the wireless device. To prevent accidents, do not use your wireless device while driving. RF signals may affect electronic systems of motor vehicles. For more information, consult the vehicle manufacturer. In a motor vehicle, do not place the wireless device over the air bag or in the air bag deployment area. Otherwise, the wireless device may hurt you owing to the strong force when the air bag inflates. 9.5 Airline Security Observe the rules and regulations of airline companies. When boarding or approaching a plane, power off your wireless device. Otherwise, the radio signal of the wireless device may interfere with the plane control signals. 9.6 Safety of Children Do not allow children to use the wireless device without guidance. Small and sharp components of the wireless device may cause danger to children or cause suffocation if children swallow the components. 9.7 Environment Protection Observe the local regulations regarding the disposal of your packaging materials, used wireless device and accessories, and promote their recycling. 9.8 WEEE Approval The wireless device is in compliance with the essential requirements and other relevant provisions of the Waste Electrical and Electronic Equipment Directive 2012/19/EU (WEEE Directive). 9.9 RoHS Approval The wireless device is in compliance with the restriction of the use of certain hazardous substances in electrical and electronic equipment Directive 2011/65/EU (RoHS Directive). Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 76 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Safety Information 9.10 Laws and Regulations Observance Observe laws and regulations when using your wireless device. Respect the privacy and legal rights of the others. 9.11 Care and Maintenance It is normal that your wireless device gets hot when you use or charge it. Before you clean or maintain the wireless device, stop all applications and power off the wireless device. Use your wireless device and accessories with care and in clean environment. Keep the wireless device from a fire or a lit cigarette. Protect your wireless device and accessories from water and vapour and keep them dry. Do not drop, throw or bend your wireless device. Clean your wireless device with a piece of damp and soft antistatic cloth. Do not use any chemical agents (such as alcohol and benzene), chemical detergent, or powder to clean it. Do not leave your wireless device and accessories in a place with a considerably low or high temperature. Use only accessories of the wireless device approved by the manufacture. Contact the authorized service center for any abnormity of the wireless device or accessories. Do not dismantle the wireless device or accessories. Otherwise, the wireless device and accessories are not covered by the warranty. The device should be installed and operated with a minimum distance of 20 cm between the radiator and your body. 9.12 Emergency Call This wireless device functions through receiving and transmitting radio signals. Therefore, the connection cannot be guaranteed in all conditions. In an emergency, you should not rely solely on the wireless device for essential communications. 9.13 Regulatory Information The following approvals and notices apply in specific regions as noted. 9.13.1 CE Approval (European Union) The wireless device is approved to be used in the member states of the EU. The wireless device is in compliance with the essential requirements and other relevant provisions of the Radio and Telecommunications Terminal Equipment Directive 1999/5/EC (R&TTE Directive). Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 77 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Safety Information 9.13.2 FCC Statement Federal Communications Commission Notice (United States): Before a wireless device model is available for sale to the public, it must be tested and certified to the FCC that it does not exceed the limit established by the government-adopted requirement for safe exposure. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Warning: Changes or modifications made to this equipment not expressly approved by HUAWEI may void the FCC authorization to operate this equipment. Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 78 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide 10 Issue 05 (2014-01-14) Appendix A Circuit of Typical Interface Appendix A Circuit of Typical Interface Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 78 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide 11 Appendix B Acronyms and Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion AP Application Process CCC China Compulsory Certification CE European Conformity CS Coding Scheme CSD Circuit Switched Data DC Direct Current DMA Direct Memory Access DVK Development Kit EBU External Bus Unit EIA Electronic Industries Association EMC Electromagnetic Compatibility ESD Electrostatic Discharge EU European Union FCC Federal Communications Commission GMSK Gaussian Minimum Shift Keying GPIO General-purpose I/O GPRS General Packet Radio Service GSM Global System for Mobile Communication HBM Human Body Model HSIC High Speed Inter-Chip Interface Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 80 HUAWEI MU736 HSPA+ M.2 Module Hardware Guide Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion HSDPA High-Speed Downlink Packet Access HSPA+ Enhanced High Speed Packet Access HSUPA High Speed Up-link Packet Access ISO International Standards Organization LCP Liquid Crystal Polyester LDO Low-Dropout LED Light-Emitting Diode M.2 New Name for NGFF MCP Multi-chip Package NGFF Next Generation Form Factor NTC Negative Temperature Coefficient PA Power Amplifier PBCCH Packet Broadcast Control Channel PCB Printed Circuit Board PDU Protocol Data Unit PMU Power Management Unit RF Radio Frequency RoHS Restriction of the Use of Certain Hazardous Substances TVS Transient Voltage Suppressor UMTS Universal Mobile Telecommunications System USB Universal Serial Bus USIM Universal Subscriber Identity Module VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access Issue 05 (2014-01-14) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 81
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.6 Linearized : No Author : huawei Create Date : 2014:01:21 09:26:50+08:00 Modify Date : 2014:01:21 09:31:19+08:00 Language : zh-CN Tagged PDF : Yes XMP Toolkit : Adobe XMP Core 5.2-c001 63.139439, 2010/09/27-13:37:26 Format : application/pdf Creator : huawei Creator Tool : Microsoft® Office Word 2007 Metadata Date : 2014:01:21 09:31:19+08:00 Producer : Microsoft® Office Word 2007 Document ID : uuid:98a31cd3-7663-4729-b73e-eb44c9125735 Instance ID : uuid:a5ac5f98-40bb-45cb-980f-56234594504e Page Count : 81EXIF Metadata provided by EXIF.tools