Huawei MU736 HSPA M.2 Module Hardware Guide (V100R001 05, English)

HUAWEI MU736 HSPA+ M.2 Module

Hardware Guide

Issue

05

Date

2014-01-14

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HUAWEI MU736 HSPA+ M.2 Module

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About This Document

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About This Document

Revision History

Document

Version

Date

Chapter

Descriptions

01

2013-03-08

Creation

02

2013-05-09

3.7

Updated Tunable Antenna Control

4.4.2

Updated Table 4-4

4.5.1

Updated Antenna Design Indicators

4.5.3

Updated GSM/WCDMA/GPS Antenna

Requirements

5.5.2

Updated Table 5-9, Table 5-10

8.2

Updated Table 8-1

9.8

Updated WEEE Approval

9.9

Updated RoHS Approval

9.11

Updated Care and Maintenance

9.13

Deleted Specific Absorption Rate (SAR)

9.13

Updated Regulatory Information

03

2013-08-22

2.2

Updated Table 2-1 Features

3.2

Updated Table 3-1 Definitions of pins on

the M.2 interface

3.4.5

Added Figure 3-16 Connections of the

W_DISABLE# pin

3.4.6

Added Figure 3-17 Connections of the

GPS_DISABLE# pin

3.4.8

Updated Figure 3-20 Connections of the

BodySAR_N pin

3.4.9

Updated Figure 3-21 Connections of the

SIM_DET pin

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About This Document

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Document

Version

Date

Chapter

Descriptions

3.7

Updated Table 3-11 List of ANTCTL pins

3.9

Updated Table 3-15 List of NC pins

5.2

Updated Table 5-1 Absolute ratings for the

MU736 module

5.5.2

Updated Table 5-12 DC power

consumption (GPS)

5.6

Updated Table 5-13 Test conditions and

results of the reliability of the MU736

module

6.2

Updated Figure 6-1 Dimensions of MU736

6.4

Updated Figure 6-4 Packet system

04

2013-10-21

5.6

Updated Table 5-13 Test conditions and

results of the reliability of the MU736

module

05

2014-01-14

5.5.2

Updated Power Consumption

5.7

Updated EMC and ESD Features

HUAWEI MU736 HSPA+ M.2 Module

Hardware Guide

Contents

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5

Contents

1 Introduction .............................................................................................................................. 8

2 Overall Description .................................................................................................................. 9

2.1 About This Chapter...................................................................................................................... 9

2.2 Function Overview ...................................................................................................................... 9

2.3 Circuit Block Diagram ................................................................................................................. 11

3 Description of the Application Interfaces........................................................................... 12

3.1 About This Chapter.....................................................................................................................12

3.2 75-pin Gold Finger .....................................................................................................................12

3.3 Power Interface ..........................................................................................................................18

3.3.1 Overview ...........................................................................................................................18

3.3.2 Power Supply 3.3V Interface ..............................................................................................18

3.3.3 USIM Power Output UIM_PWR..........................................................................................20

3.4 Signal Control Interface ..............................................................................................................20

3.4.1 Overview ...........................................................................................................................20

3.4.2 Power_On_Off Control Pin .................................................................................................22

3.4.3 RESET# Pins.....................................................................................................................26

3.4.4 LED# Pin ...........................................................................................................................28

3.4.5 W_DISABLE# Pin ..............................................................................................................29

3.4.6 GPS_DISABLE# Pin ..........................................................................................................29

3.4.7 Wake_On_WWAN# Pin .....................................................................................................30

3.4.8 BodySAR_N Pin ................................................................................................................31

3.4.9 SIM_DET Pin .....................................................................................................................32

3.5 USB Interface.............................................................................................................................34

3.6 USIM Card Interface...................................................................................................................35

3.6.1 Overview ...........................................................................................................................35

3.6.2 Circuit Recommended for the USIM Card Interface ............................................................35

3.7 Tunable Antenna Control ............................................................................................................36

3.8 Config Pins ................................................................................................................................37

3.9 NC Pins .....................................................................................................................................38

3.10 RF Antenna Interface ...............................................................................................................38

3.10.1 RF Connector location .....................................................................................................38

3.10.2 Coaxial RF Connector Guidelines ....................................................................................39

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Contents

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4 RF Specifications .................................................................................................................... 43

4.1 About This Chapter.....................................................................................................................43

4.2 Operating Frequencies ...............................................................................................................43

4.3 Conducted RF Measurement ......................................................................................................44

4.3.1 Test Environment ...............................................................................................................44

4.3.2 Test Standards ...................................................................................................................44

4.4 Conducted Rx Sensitivity and Tx Power .....................................................................................44

4.4.1 Conducted Receive Sensitivity ...........................................................................................44

4.4.2 Conducted Transmit Power ................................................................................................45

4.5 Antenna Design Requirements ...................................................................................................46

4.5.1 Antenna Design Indicators .................................................................................................46

4.5.2 Interference .......................................................................................................................49

4.5.3 GSM/WCDMA/GPS Antenna Requirements .......................................................................49

4.5.4 Radio Test Environment .....................................................................................................50

5 Electrical and Reliability Features ....................................................................................... 52

5.1 About This Chapter.....................................................................................................................52

5.2 Absolute Ratings ........................................................................................................................52

5.3 Operating and Storage Temperatures and Humidity ....................................................................53

5.4 Electrical Features of Application Interfaces ................................................................................53

5.5 Power Supply Features ..............................................................................................................54

5.5.1 Input Power Supply ............................................................................................................54

5.5.2 Power Consumption...........................................................................................................55

5.6 Reliability Features .....................................................................................................................60

5.7 EMC and ESD Features .............................................................................................................63

6 Mechanical Specifications .................................................................................................... 65

6.1 About This Chapter.....................................................................................................................65

6.2 Dimensions of MU736 ................................................................................................................65

6.3 Label ..........................................................................................................................................66

6.4 Packing System .........................................................................................................................68

7 Installation .............................................................................................................................. 70

7.1 About This Chapter.....................................................................................................................70

7.2 Connect MU736 to Board ...........................................................................................................70

7.3 Antenna Plug..............................................................................................................................71

8 Certifications ........................................................................................................................... 73

8.1 About This Chapter.....................................................................................................................73

8.2 Certifications ..............................................................................................................................73

9 Safety Information ................................................................................................................. 75

9.1 Interference ................................................................................................................................75

9.2 Medical Device ...........................................................................................................................75

9.3 Area with Inflammables and Explosives ......................................................................................75

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9.4 Traffic Security ...........................................................................................................................76

9.5 Airline Security ...........................................................................................................................76

9.6 Safety of Children.......................................................................................................................76

9.7 Environment Protection ..............................................................................................................76

9.8 WEEE Approval .........................................................................................................................76

9.9 RoHS Approval ..........................................................................................................................76

9.10 Laws and Regulations Observance ..........................................................................................77

9.11 Care and Maintenance .............................................................................................................77

9.12 Emergency Call ........................................................................................................................77

9.13 Regulatory Information .............................................................................................................77

9.13.1 CE Approval (European Union) ........................................................................................77

9.13.2 FCC Statement ................................................................................................................78

10 Appendix A Circuit of Typical Interface ........................................................................... 79

11 Appendix B Acronyms and Abbreviations ....................................................................... 80

HUAWEI MU736 HSPA+ M.2 Module

Hardware Guide

Introduction

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1 Introduction

This document describes the hardware application interfaces and air interfaces that

are provided when HUAWEI MU736 HSPA+ M.2 Module (hereinafter referred to the

MU736 module) is used.

M.2 is the new name for NGFF (Next Generation Form Factor).

This document helps you to understand the interface specifications, electrical features

and related product information of the MU736 module.

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Overall Description

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2 Overall Description

2.1 About This Chapter

This chapter gives a general description of the MU736 module and provides:

- Function Overview

- Circuit Block Diagram

2.2 Function Overview

Table 2-1 Features

Feature

Description

Physical

Features

- Dimensions (L × W × H): 42 mm × 30 mm × 2.3 mm

- Weight: about 6 g

Operating

Bands

WCDMA/HSDPA/HSUPA/HSPA+: 850 MHz/900 MHz/1700 MHz

(AWS)/1900 MHz/2100 MHz

GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz

GPS: L1

Operating

Temperature

Normal operating temperature: –10°C to +55°C

Extended operating temperature[1]: –20°C to +70°C

Storage

Temperature

–40°C to +85°C

Moisture

RH5% to RH95%

Power

Voltage

3.135 V to 4.4 V (3.3 V is typical)

AT

Commands

See the HUAWEI MU736 HSPA+ M.2 Module AT Command

Interface Specification

Application

USIM (3.0 V or 1.8 V)

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Overall Description

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Feature

Description

Interface

(75-pin Gold

Finger)

USIM Hot Swap Detection

USB 2.0 (high speed)

Power_On_Off pin

RESET# pin

LED# pin

W_DISABLE# pin

GPS_DISABLE# pin

Tunable Antenna Control (4 GPIOs)

Wake_On_WWAN# pin

BodySAR_N pin

Power supply (5 pins)

Antenna

Interface

MAIN and AUX (supports Diversity and GPS simultaneously)

MM4829-2702RA4 by MURATA or other equivalent parts

SMS

New message alert

Management of SMS: read SMS, write SMS, send SMS, delete

SMS and SMS list.

Supporting MO and MT. Point-to-point

Data Services

GPRS: UL 85.6 kbps/DL 107 kbps

EDGE: UL 236.8 kbps/DL 296 kbps

WCDMA CS: UL 64 kbps/DL 64 kbps

WCDMA PS: UL 384 kbps/DL 384 kbps

HSPA+: UL 5.76 Mbps/DL 21.6 Mbps

Operating

System

Windows 7/8/8.1, Android 4.0 or later, Chrome OS

[1]: When the MU736 module works at this temperature, NOT all its RF performances comply

with the 3GPP TS 45.005 specifications.

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Overall Description

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2.3 Circuit Block Diagram

Figure 2-1 shows the circuit block diagram of the MU736 module. The application

block diagram and major functional units of the MU736 module contain the following

parts:

- Baseband controller

- Power manager

- Multi-chip package (MCP) memory

- Radio frequency (RF) transceiver

- RF interface

- RF PA

Figure 2-1 Circuit block diagram of the MU736 module

BASE

BAND

RF TRANSCEIVER

Power

Manager

MCP

EBU

BodySAR_N

Wake_On_WWAN#

W_DISABLE#

LED#

GPS_DISABLE#

RESET#

Power_On_Off

Power

USIM

ANTCTL[0~3]

M.2

Interface

USB

GPS Front End Extractor

GPS/DIV ANT

RF Front End

Diversity

ANT

Switch

Main ANT

MAIN

ANT

Switch

RF Front End

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Description of the Application Interfaces

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3 Description of the Application Interfaces

3.1 About This Chapter

This chapter mainly describes the external application interfaces of the MU736

module, including:

- 75-pin Gold Finger

- Power Interface

- Signal Control Interface

- USB Interface

- USIM Card Interface

- Tunable Antenna Control

- Config Pins

- NC Pins

- RF Antenna Interface

3.2 75-pin Gold Finger

The MU736 module uses a 75-pin Gold Finger as its external interface. For details

about the module and dimensions, see "6.2 Dimensions of MU736".

Figure 3-1 shows the sequence of pins on the 75-pin signal interface of the MU736

module.

HUAWEI MU736 HSPA+ M.2 Module

Hardware Guide

Description of the Application Interfaces

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Figure 3-1 TOP view of sequence of Gold Finger interface pins

Table 3-1 shows the definitions of pins on the 75-pin signal interface (67 for signals

and 8 for notch) of the MU736 module.

As the M.2 naming nomenclature, MU736 is Type 3042-S3-B (30 mm × 42 mm,

Component Max Height on top is 1.5 mm and single-sided, Key ID is B.)

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Table 3-1 Definitions of pins on the M.2 interface

No.

Pin Name

I/O

Description

DC Characteristics (V)

Normal

Min.

Typ.

Max.

1

CONFIG_3

O

Connected to Ground internally.

MU736 is configured as WWAN-SSIC 0.

-

0

-

2

3.3V

PI

Power supply

3.135

3.3

4.4

3

Ground

PI

Ground

-

0

-

4

3.3V

PI

Power supply

3.135

3.3

4.4

5

Ground

PI

Ground

-

0

-

6

Power_On_Off

I

A single control to turn On/Off WWAN.

H: WWAN is powered on.

L: WWAN is powered off.

It is internally pulled to low.

It is 3.3 V tolerant but can be driven by

either 1.8 V or 3.3 V GPIO.

–0.3

1.8

3.6

7

USB_D+

IO

USB Data + defined in the USB 2.0

Specification

-

8

W_DISABLE#

I

WWAN disable function

H: WWAN function is determined by

software AT command. Default enabled.

L: WWAN function is turned off.

–0.3

3.3

3.6

9

USB_D-

IO

USB Data - defined in the USB 2.0

Specification

-

10

LED#

O

It is an open drain, active low signal,

used to allow the M.2 card to provide

status indicators via LED devices that

will be provided by the system.

Open drain and a pull-up

resistor is required on

the host

11

Ground

PI

Ground

-

0

-

12

Notch

-

13

Notch

-

14

Notch

-

15

Notch

-

16

Notch

-

17

Notch

-

18

Notch

-

19

Notch

-

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No.

Pin Name

I/O

Description

DC Characteristics (V)

Normal

Min.

Typ.

Max.

20

Reserved

-

Reserved for Future Use, please keep it

NC in host side.

-

21

CONFIG_0

O

Not Connected internally.

MU736 is configured as WWAN-SSIC 0.

-

22

Reserved

-

Reserved for Future Use, please keep it

NC in host side.

-

23

Wake_On_WWA

N#

O

WWAN to wake up the host.

It is open drain and active low.

Open drain and a pull-up

resistor is required on

the host

24

Reserved

-

Reserved for Future Use, please keep it

NC in host side.

-

25

BodySAR_N

I

Hardware pin for BodySAR Detection,

active low.

H: No TX power backoff (default).

L: TX power backoff.

–0.3

1.8

3.6

26

GPS_DISABLE#

I

GPS disable function

H: GPS function is determined by

software AT command. Default enabled.

L: GPS is turned off.

–0.3

3.3

3.6

27

Ground

PI

Ground

-

0

-

28

NC

-

Not Connected

-

29

NC

-

Not Connected

-

30

UIM_RESET

O

USIM Reset

–0.3

1.8/2.85

1.98

/3.0

31

NC

-

Not Connected

-

32

UIM_CLK

O

USIM Clock

–0.3

1.8/2.85

1.98

/3.0

33

Ground

PI

Ground

-

0

-

34

UIM_DATA

IO

USIM DATA

–0.3

1.8/2.85

1.98

/3.0

35

NC

-

Not Connected

-

36

UIM_PWR

PO

USIM POWER

–0.3

1.8/2.85

1.98

/3.3

37

NC

-

Not Connected

-

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No.

Pin Name

I/O

Description

DC Characteristics (V)

Normal

Min.

Typ.

Max.

38

NC

-

Not Connected

-

39

Ground

PI

Ground

-

0

-

40

I2C_SCL

IO

I2C clock

This function is under development.

–0.3

1.8

2.1

41

NC

-

Not Connected

-

42

I2C_SDA

IO

I2C data

This function is under development.

–0.3

1.8

2.1

43

NC

-

Not Connected

-

44

I2C_IRQ

I

Interrupt signal to wake up the module.

This function is under development.

–0.3

1.8

2.1

45

Ground

PI

Ground

-

0

-

46

SYSCLK

O

System clock output for external GNSS

module. MU736 does not support

GLONASS.

This function is under development.

–0.3

1.8

2.1

47

NC

-

Not Connected

-

48

TX_BLANKING

-

Tx blanking signal for external GNSS

module. MU736 doesn’t support

GLONASS.

This function is under development.

–0.3

1.8

2.1

49

NC

-

Not Connected

-

50

NC

-

Not Connected

-

51

Ground

PI

Ground

-

0

-

52

NC

-

Not Connected

-

53

NC

-

Not Connected

-

54

NC

-

Not Connected

-

55

NC

-

Not Connected

-

56

NC

-

Not Connected

-

57

Ground

PI

Ground

-

0

-

58

NC

-

Not Connected

-

59

ANTCTL0

O

Tunable antenna control signal, bit 0.

It is a push-pull type GPIO.

–0.3

1.8

2.1

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No.

Pin Name

I/O

Description

DC Characteristics (V)

Normal

Min.

Typ.

Max.

60

Reserved

-

Reserved for Future Use, please keep it

NC in host side.

-

61

ANTCTL1

O

Tunable antenna control signal, bit 1.

It is a push-pull type GPIO.

–0.3

1.8

2.1

62

Reserved

-

Reserved for Future Use, please keep it

NC in host side.

-

63

ANTCTL2

O

Tunable antenna control signal, bit 2.

It is a push-pull type GPIO.

–0.3

1.8

2.1

64

Reserved

-

Reserved for Future Use, please keep it

NC in host side.

-

65

ANTCTL3

O

Tunable antenna control signal, bit 3.

It is a push-pull type GPIO.

–0.3

1.8

2.1

66

SIM_DET

I

SIM hot swap detection pin.

Rising edge for insertion; falling edge for

removal.

H: SIM is present.

L: SIM is absent.

–0.3

1.8

2.1

67

RESET#

I

System reset, active low.

–0.3

1.8

3.6

68

NC

-

Not Connected

-

69

CONFIG_1

O

Connected to Ground internally.

MU736 is configured as WWAN-SSIC 0.

-

0

-

70

3.3V

PI

Power supply

3.135

3.3

4.4

71

Ground

PI

Ground

-

0

-

72

3.3V

PI

Power supply

3.135

3.3

4.4

73

Ground

PI

Ground

-

0

-

74

3.3V

PI

Power supply

3.135

3.3

4.4

75

CONFIG_2

O

Connected to Ground internally.

MU736 is configured as WWAN-SSIC 0.

-

0

-

P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital signal

output.

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3.3 Power Interface

3.3.1 Overview

The power supply part of the MU736 module contains:

- 3.3V pins for the power supply

- UIM_PWR pin for USIM card power output

Table 3-2 lists the definitions of the pins on the power supply interface.

Table 3-2 Definitions of the pins on the power supply interface

Pin No.

Signal

Name

I/O

Description

DC Characteristics (V)

Min.

Typ.

Max.

2, 4, 70, 72, 74

3.3V

PI

Power supply for MU736,

3.3 V is recommended

3.135

3.3

4.4

36

UIM_PWR

PO

Power supply for USIM card

–0.3

1.8/2.85

1.98/3.3

3, 5, 11, 27, 33,

39, 45, 51, 57,

71, 73

Ground

PI

Ground

-

0

-

3.3.2 Power Supply 3.3V Interface

When the MU736 module works normally, power is supplied through the 3.3V pins

and the voltage ranges from 3.135 V to 4.4 V (typical value is 3.3 V). The MU736

provides 5 power pins, and 11 Ground pins. To ensure that the MU736 module works

normally, all the pins must be connected. The M.2 connector pin is defined to support

500 mA/Pin continuously.

When the MU736 module works at 2G mode, the module transmits at the maximum

power, the transient peak current may reach 2.5 A. In this case, the power pin voltage

will drop. Make sure that the voltage does not drop below 3.135 V in any case. The

traces of the power supply should be as short and wide as possible. It is

recommended that at least a 220 µF capacitance is added onto the 3.3 V power rails

and as close to the M.2 connector as possible. Customer can reduce the capacitance

if it can be guaranteed that 3.3V pin does not drop below 3.135 V in any case.

Figure 3-2 shows the recommended power circuit of the MU736 module.

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Figure 3-2 Recommended power circuit of the MU736 module

3.3V pin must never be under 3.135 V during the 2G transmitting burst, as shown in Figure 3-3 .

Figure 3-3 VCC drop during 2G transmitting

If customer wants to power cycle MU736, the 3.3V pin must stay below 1.8 V for more

than 100 ms. The sequence is shown as in Figure 3-4 .

3.135 V

3.3 V

4.4 V

Do not drop below 3.135 V, during 2G TX.

The maximum current may be 2.5 A.

Voltage

Time

MU736

3.3V

330pF

100nF

1µF

22µF

220µF

3.3V

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Figure 3-4 MU736 power supply time sequence for power cycling

Parameter

Remarks

Time(Min.)

Unit

Toff

Power off time

100

ms

3.3.3 USIM Power Output UIM_PWR

Output power supply interface is UIM_PWR. Through the UIM_PWR power supply

interface, the MU736 module can supply 1.8 V or 2.85 V power to UIM card. The max

current can reach 200 mA, so special attention on PCB design should be taken at the

host side.

3.4 Signal Control Interface

3.4.1 Overview

The signal control part of the interface in the MU736 module consists of the following:

- Power On/Off (Power_On_Off) pin

- System reset (RESET#) pin

- LED control (LED#) pin

- WWAN disable control (W_DISABLE#) pin

- GPS disable control (GPS_DISABLE#) pin

- Wake signal out from module (Wake_On_WWAN#) pin

1.8 V

3.135 V

4.4 V

Power Off

Voltage

Time

Power On

Undefined State

Power Off

Power On

Toff > 100 ms

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- BodySAR detection (BodySAR_N) pin

- UIM detection (SIM_DET) pin

Table 3-3 lists the pins on the signal control interface.

Table 3-3 Pins on the signal control interface

No.

Pin Name

I/O

Description

DC Characteristics(V)

Min.

Typ.

Max.

6

Power_On_Off

I

A single control to turn On/Off

WWAN. When It is High, WWAN is

powered on.

H: Power on

L: Power off

It is internally pulled to low.

It is 3.3 V tolerant but can be driven

by either 1.8 V or 3.3 V GPIO.

–0.3

1.8

3.6

67

RESET#

I

System reset, active low

–0.3

1.8

3.6

10

LED#

O

It is an open drain, active low signal,

used to allow the M.2 card to provide

status indicators via LED devices that

will be provided by the system.

Open drain and a pull-up

resistor is required on the

host

8

W_DISABLE#

I

WWAN disable function

H: WWAN function is determined by

software AT command. Default

enabled.

L: WWAN function is turned off.

–0.3

3.3

3.6

26

GPS_DISABLE#

I

GPS disable function

H: GPS function is determined by

software AT command. Default

enabled.

L: GPS is turned off.

–0.3

3.3

3.6

23

Wake_On_WWAN#

O

It is open drain, WWAN to wake up

the host, active low.

Open drain and a pull-up

resistor is required on the

host

25

BodySAR_N

I

Hardware pin for BodySAR detection.

H: No TX power backoff (default).

L: TX power backoff.

–0.3

1.8

3.6

66

SIM_DET

I

SIM hot swap detection pin.

Rising edge for insertion; falling edge

for removal.

H: SIM is present.

L: SIM is absent.

–0.3

1.8

2.1

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3.4.2 Power_On_Off Control Pin

The MU736 module can be controlled to be powered on/off by the Power_On_Off pin.

Table 3-4 Two states of Power_On_Off

Item.

Pin state

Description

1

High

MU736 is powered on.

NOTE: If MU736 needs to be powered on automatically, the

Power_On_Off pin must be pulled up to 3.3 V.

2

Low

MU736 is powered off.

It is internally pulled to low.

MU736 is powered by regulated 3.3 V

If MU736 is powered by 3.3 V voltage regulator (such as notebook or Ultrabook),

Power_On_Off pin should be pulled up to 3.3 V through a resistor.

The pull-up resistor should be not larger than 10 kΩ.

The following are the power On/Off sequences:

1. The module gets 3.3 V when power supply for the module is switched on.

2. The module is turned on since Power_On_Off pin is pulled up directly to 3.3 V.

3. Host cuts off 3.3V supply to power off the module.

The recommended circuit is shown as in Figure 3-5 .

Figure 3-5 Recommended connections of Power_On_Off pins (Auto power)

Power on sequence

Do not toggle RESET# pin during the power on sequence. Pulling RESET# pin low

will extend time for module startup.

Recommended power on timing is shown as in Figure 3-6 .

MU736

Pin 2, 4, 70, 72, 74

Pin 6

10 kΩ

Power_On_Off

3.3V

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Figure 3-6 Recommended power on off timing

Power off Sequence

Cutting off 3.3V will power off the module.

Figure 3-7 Recommended power off timing (cut off 3.3V)

MU736 is powered directly to battery

For use case MU736 is connected directly to battery, such as tablet platforms,

Power_On_Off pin should be controlled by a GPIO from host to control MU736 power

On/Off.

It is critical to make sure the module is safely powered off when the Tablet SoC is shut

off. There will be current leakage if the module is not powered off properly. So It is

important to keep Power_On_Off pin logic low for more than 500 ms to power off the

module.

3.3V

RESET#

Power_On_Off

Power off

3.3V

RESET#

Power on

Power_On_Off

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The recommended connections are shown as in Figure 3-8 .

Figure 3-8 Recommended connections of Power_On_Off pins (Control)

Power on sequence

Do not toggle RESET# pin during power on sequence. Pulling RESET# pin low will

extend time for module startup.

Recommended power on timing is shown as in Figure 3-9 .

Figure 3-9 Recommended power on timing

Power off Sequence

Keep Power_On_Off pin logic low for more than 500 ms to power off the module.

3.3V (Vbatt,

always on)

RESET#

Power_On_off

Power on

t0 ≥ 0 ms

t0

MU736

Pin 6

HOST

GPIO

Power_On_Off

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Figure 3-10 Recommended power off timing (connect to battery)

If there is limitation on the controlling GPIO to be programmable 500 ms, the hardware

solution can be used, as shown in Figure 3-11 .

Figure 3-11 Power on off circuit (hardware solution)

MU736

Pin 6

HOST

0 Ω

VCCGPIO2

1MΩ

NMOS

3.3V (battery)

GPIO2

Q1

Q2

Power_On_Off

VCCGPIO2 is the power domain of the GPIO2.

When VCCGPIO2 is ON, Q2 is on and Q1 is off. So the Pin6 is controlled by

GPIO2 of host.

When VCCGPIO2 is Off, Q2 is off and Q1 is on. So the Pin6 is pulled low,

then the module is powered off.

Power off

t1 ≥ 500 ms

t1

Logic low or high-impedance (preferred)

Power_On_Off

RESET#

3.3V (Vbatt,

always on)

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3.4.3 RESET# Pins

The MU736 module can be reset through the RESET# pin asynchronous, active low.

Whenever this pin is active, the module will immediately be placed in a Power On

reset condition. Care should be taken for this pin unless there is a critical failure and

all other methods of regaining control and/or communication with the WWAN

sub-system have failed.

Pulling RESET# pin low for more than 20 ms will reset the module.

RESET# pin is optional, which cannot be connected. Pulling Power_On_Off pin low

for more than 500 ms can work as a reset.

RESET# pin is internally pulled up to 1.8 V, which is automatically on when 3.3 V is

applied even though Power_On_Off pin is low. Cautions should be taken on circuit

design otherwise there may be back driving issue.

Option 1: Hardware circuit for RESET#

In this case, the GPIO is high-impedance when the module is powered off.

Figure 3-12 Hardware circuit for RESET# (Option 1)

Option 2: Hardware circuit for RESET#

In this case, the GPIO is not high-impedance when It is powered off.

Use 2 NMOSFET so that the logic of RESET# pin and GPIO are the same.

MU736

Pin 67

0 Ω

RESET#

HOST

GPIO1

GPIO1 should be high-impedance

when it is powered off.

33 рF

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Figure 3-13 Hardware circuit for RESET# (Option 2)

Option 3: Hardware circuit for RESET#

In this case, the GPIO is not high-impedance when the host is powered off.

Use only one NMOSFET, in this case the logic of RESET# pin and GPIO1 is reversed.

Figure 3-14 Hardware circuit for RESET# (Option 3)

HOST

MU736

0 Ω

RESET#

Pin 67

GPIO1

33 рF

MU736

RESET#

Pin 67

HOST

0 Ω

GPIO1

1MΩ

NMOS

VCCGPIO1

33 рF

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- As the RESET# pin signal is relatively sensitive, it is recommended to install a 33

pF capacitor near to the M.2 pin.

- Triggering the RESET# pin signal will lead to loss of all data in the module

and the removal of system drivers. It will also disconnect the module from

the network resulting in a call drop.

3.4.4 LED# Pin

MU736 provides an open drain signal to indicate the RF status.

Table 3-5 State of the LED# pin

No.

Operating Status

LED#

1

RF function is turned on

Outputs Low

2

RF function is turned off

Outputs High

Figure 3-15 shows the recommended circuits of the LED# pin. The brightness of LED

can be adjusted by adjusting the resistance of the series resistor.

Figure 3-15 Driving circuit

LED# pin output is different from HUAWEI MU733 module, because MU736

integrates a MOSFET inside.

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3.4.5 W_DISABLE# Pin

MU736 provides a hardware pin (W_DISABLE#) to enable/disable the radio function.

This function also can be implemented by AT command.

Table 3-6 Function of the W_DISABLE# pin

No.

W_DISABLE#

Function

1

Low

WWAN function will be turned off.

2

High

WWAN function is determined by software AT

command. Default enabled.

3

Floating

WWAN function is determined by software AT

command. Default enabled.

Figure 3-16 Connections of the W_DISABLE# pin

Module

(Modem)

BB Chip

1.8V

W_DISABLE#

VCC From Host

10 kΩ

Host

It is recommended not to add a diode on the W_DISABLE# pin outside the MU736

module.

3.4.6 GPS_DISABLE# Pin

MU736 provides a hardware pin (GPS_DISABLE#) to enable/disable the GPS

function.

Table 3-7 Function of the GPS_DISABLE# pin

No.

GPS_DISABLE#

Function

1

Low

GPS function is disabled.

2

High

GPS function is determined by software AT

command. Default enabled.

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No.

GPS_DISABLE#

Function

3

Floating

GPS function is determined by software AT

command. Default enabled.

Figure 3-17 Connections of the GPS_DISABLE# pin

Module

(Modem)

BB Chip

1.8V

GPS_DISABLE#

VCC From Host

10 kΩ

Host

It is recommended not to add a diode on the GPS_DISABLE# pin outside the MU736

module.

3.4.7 Wake_On_WWAN# Pin

MU736 provides an open drain output Wake_On_WWAN# pin to wake host. It is low

active.

Figure 3-18 Wave form of the Wake_On_WWAN# pin

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Figure 3-19 Connections of the Wake_On_WWAN# pin

3.4.8 BodySAR_N Pin

MU736 provides an input pin BodySAR_N for BodySAR detection.

It is pulled up internally and when it is pulled low by the proximity sensor output or

controlling signal from host systems, the Tx power reduction actions will be triggered.

Table 3-8 Function of the BodySAR_N pin

No.

BodySAR_N

Function

1

Low

MAX TX power will be back off by setting through AT

command

2

High

MAX TX power will NOT be backed off (default)

3

Floating

MAX TX power will NOT be backed off

If BodySAR_N pin is used to monitor the proximity sensor output, there are some

essential preconditions for this hardware solution.

MU736 cannot provide any control signal for the proximity sensor. Any control or

programming required by the proximity sensor should be handled by the host side.

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Figure 3-20 Connections of the BodySAR_N pin

Module

(Modem)

BB Chip

1.8V

BodySAR_N

VCC From Host

10 kΩ

Proximity

sensor

USB Host AP

It is recommended not to add a diode on the BodySAR_N pin outside the MU736

module.

3.4.9 SIM_DET Pin

MU736 supports USIM Hot Swap function.

MU736 provides an input pin (SIM_DET) to detect whether the USIM card is present

or not. This pin is an edge trigger pin.

Table 3-9 Function of the SIM_DET pin

No.

SIM_DET

Function

1

Rising edge

USIM Card insertion.

If the USIM Card is present, SIM_DET pin should be high.

2

Falling edge

USIM Card removal.

If the USIM Card is absent, SIM_DET pin should be low.

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Figure 3-21 Connections of the SIM_DET pin

CD is a pin detecting USIM in the SIM Socket, normally, there will be a detect pin in

the SIM Socket.

- The Normal SHORT SIM connector should be employed. The logic of SIM_DET

pin is shown as Figure 3-22 . High represents that SIM is inserted; Low represents

that SIM is removed.

- When SIM is inserted (hot), SIM_DET pin will change from Low to High;

- When SIM is removed (hot), SIM_DET pin will change from High to Low.

- MU736 will detect the rising or falling edge of SIM_DET to react the hot swap.

Figure 3-22 The logic of SIM_DET

Modem

Processor

SIM Connector Switch

SIM installed=

Not Connected

SIM not

installed=

GND

WWAN Module

SIM_DET

1.8V

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3.5 USB Interface

The MU736 is compliant with USB 2.0 high speed protocol. The USB input/output

lines are following USB 2.0 specifications. Definition of the USB interface:

No.

Pin Name

I/O

Description

DC Characteristics (V)

Min.

Typ.

Max.

7

USB_D+

I/O

USB data signal D+

-

9

USB_D-

I/O

USB data signal D-

-

Figure 3-23 Recommended circuit of USB interface

Figure 3-24 shows the timing sequence between 3.3 V and USB D+.

Figure 3-24 MU736 USB D+ and 3.3 V power on timing

3.3V

Power_On_Off

USB D+

Tpd

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Parameter

Remarks

Time(Nominal value)

Unit

Tpd

Power valid to USB D+ high

8

s

The layout design of this circuit on the host board should comply with the USB 2.0 high speed

protocol, with differential characteristic impedance of 90 Ω.

3.6 USIM Card Interface

3.6.1 Overview

The MU736 module provides a USIM card interface complying with the ISO 7816-3

standard and supports both 1.8 V and 3.0 V USIM cards.

Table 3-10 USIM card interface signals

No.

Pin Name

I/O

Description

DC Characteristics (V)

Min.

Typ.

Max.

30

UIM_RESET

O

USIM Reset

–0.3

1.8/2.85

1.98/3.0

32

UIM_CLK

O

USIM clock

–0.3

1.8/2.85

1.98/3.0

34

UIM_DATA

IO

USIM DATA

–0.3

1.8/2.85

1.98/3.0

36

UIM_PWR

PO

USIM POWER

–0.3

1.8/2.85

1.98/3.0

3.6.2 Circuit Recommended for the USIM Card Interface

As the MU736 module is not equipped with an USIM socket, you need to place an

USIM socket on the user interface board.

Figure 3-25 shows the circuit of the USIM card interface.

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Figure 3-25 Circuit of the USIM card interface

- The ESD protection component should choose low capacitance. The capacitance

of the component should be less than 10 pF.

- To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic

compatibility (EMC) authentication, the USIM socket should be placed near the

M.2 interface (it is recommended that the PCB circuit connects the M.2 interface

and the USIM socket does not exceed 100 mm), because a long circuit may lead to

wave distortion, thus affecting signal quality.

- It is recommended that you wrap the area adjacent to the SIM_CLK and

SIM_DATA signal wires with ground. The Ground pin of the USIM socket and the

Ground pin of the USIM card must be well connected to the power Ground pin

supplying power to the MU736 module.

- A 100 nF capacitor (0402 package is recommended so that larger capacitance

such as 1µF can be employed if necessary) and a 33 pF capacitor are placed

between the SIM_VCC and Ground pins in parallel. Three 33 pF capacitors are

placed between the SIM_DATA and Ground pins, the SIM_RST and Ground pins,

and the SIM_CLK and Ground pins in parallel to filter interference from RF signals.

- It is recommended to take electrostatic discharge (ESD) protection measures near

the USIM card socket. Transient voltage suppressor diode should be placed as

close as possible to the USIM socket, and the Ground pin of the ESD protection

component is well connected to the power Ground pin that supplies power to the

MU736 module.

3.7 Tunable Antenna Control

The module provides 4 tunable antenna control pins.

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Table 3-11 List of ANTCTL pins

No.

Pin Name

I/O

Description

DC Characteristics(V)

Min.

Typ.

Max.

59

ANTCTL0

O

Tunable antenna control signal bit 0.

It is a push-pull type GPIO.

–0.3

1.8

2.1

61

ANTCTL1

O

Tunable antenna control signal bit 1.

It is a push-pull type GPIO.

–0.3

1.8

2.1

63

ANTCTL2

O

Tunable antenna control signal bit 2.

It is a push-pull type GPIO.

–0.3

1.8

2.1

65

ANTCTL3

O

Tunable antenna control signal bit 3.

It is a push-pull type GPIO.

–0.3

1.8

2.1

3.8 Config Pins

The module provides 4 config pins. MU736 is configured as WWAN-SSIC 0.

Table 3-12 List of CONFIG pins

No.

Pin Name

I/O

Description

DC Characteristics(V)

Min.

Typ.

Max.

1

CONFIG_3

O

Connected to GND internally

-

0

-

21

CONFIG_0

O

Not Connected internally

-

69

CONFIG_1

O

Connected to GND internally

-

0

-

75

CONFIG_2

O

Connected to GND internally

-

0

-

In the M.2 specification, the 4 pins are defined as Table 3-13 .

Table 3-13 List of Config pins

Config_0

(Pin 21)

Config_1

(Pin 69)

Config_2

(Pin 75)

Config_3 (Pin

1)

Module type and

Main host interface

Port

Configuration

Ground

SSD-SATA

N/A

Ground

NC

Ground

SSD-PCIe

N/A

NC

Ground

WWAN-SSIC

0

NC

No Module present

N/A

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The GPIO0~7 pins have configurable assignments. There are 4 possible functional

pin out configurations. These 4 configurations are called Port Config0~3. In each Port

Configuration each GPIO is defined as a specific functional pin. The GPIO pin

assignment can see in Table 3-14 . MU736 supports Config0. But the audio function is

not implemented in MU736.

Table 3-14 GPIO Pin Function Assignment per Port Configuration

GPIO Pin

Port Config0 (GNSS+Audio ver1)

GPIO_0 (Pin 40)

GNSS_SCL

GPIO_1 (Pin 42)

GNSS_SDA

GPIO_2 (Pin 44)

GNSS_I2C_IRQ

GPIO_3 (Pin 46)

SYSCLK

GPIO_4 (Pin 48)

TX_Blanking

GPIO_5 (Pin 20)

Audio_0 (not supported )

GPIO_6 (Pin 22)

Audio_1 (not supported)

GPIO_7 (Pin 24)

Audio_2 (not supported)

3.9 NC Pins

The module has some NC pins. All of NC pins are not connected in the module.

Table 3-15 List of NC pins

Pin No.

Pin Name

I/O

Description

DC Characteristics(V)

Min.

Typ.

Max.

28, 29, 31, 35, 37, 38,

41, 43, 47, 49, 50, 52,

53, 54, 55, 56, 58, 68

NC

-

Not Connected

-

3.10 RF Antenna Interface

3.10.1 RF Connector location

MU736 module provides 2 antenna connectors for connecting the external antennas.

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Figure 3-26 RF antenna connectors

3.10.2 Coaxial RF Connector Guidelines

- The antenna interface must be used with coaxial cables with characteristic

impedance of 50 Ω.

- The MU736 module supports the buckled RF connector antenna connection

methods: buckled RF connector MM4829-2702RA4 by MURATA or other

equivalent connectors

Figure 3-27 shows the RF connector dimensions.

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Figure 3-27 RF connector dimensions

Table 3-16 The major specifications of the RF connector

Rated Condition

Environmental Condition

Frequency range

DC to 6 GHz

Temperature range:

–40°C to +85°C

Characteristic impedance

50 Ω

There are two kinds of coaxial cables mating the RF connector in the MU736.

Figure 3-28 shows the specifications of 0.81 mm coaxial cable mating the

recommended RF connector.

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Figure 3-28 Specifications of 0.81 mm coaxial cable mating with the RF connector

Figure 3-29 shows the connection between the RF connector and the 0.81 mm cable.

Figure 3-29 Connection between the RF connector and the 0.81 mm cable

Figure 3-30 shows the specifications of 1.13 mm coaxial cable mating the

recommended RF connector.

Figure 3-30 Specifications of 1.13 mm coaxial cable mating with the RF connector

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Figure 3-31 shows the connection between the RF connector and the 1.13 mm cable.

Figure 3-31 Connection between the RF connector and the 1.13 mm cable

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4 RF Specifications

4.1 About This Chapter

This chapter describes the RF specifications of the MU736 module, including:

- Operating Frequencies

- Conducted RF Measurement

- Conducted Rx Sensitivity and Tx Power

- Antenna Design Requirements

4.2 Operating Frequencies

Table 4-1 shows the RF bands supported by MU736.

Table 4-1 RF bands

Operating Band

Tx

Rx

UMTS Band I

1920 MHz–1980 MHz

2110 MHz–2170 MHz

UMTS Band II

1850 MHz–1910 MHz

1930 MHz–1990 MHz

UMTS Band IV(AWS)

1710 MHz–1755 MHz

2110 MHz–2155 MHz

UMTS Band V

824 MHz–849 MHz

869 MHz–894 MHz

UMTS Band VIII

880 MHz–915 MHz

925 MHz–960 MHz

GSM 850

824 MHz–849 MHz

869 MHz–894 MHz

GSM 900

880 MHz–915 MHz

925 MHz–960 MHz

GSM 1800(DCS)

1710 MHz–1785 MHz

1805 MHz–1880 MHz

GSM 1900(PCS)

1850 MHz–1910 MHz

1930 MHz–1990 MHz

GPS

-

1574.42 MHz–1576.42 MHz

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4.3 Conducted RF Measurement

4.3.1 Test Environment

Test instrument

R&S CMU200, Agilent E5515C, GSS6700

Power supply

Keithley 2303, Agilent 66319

RF cable for testing

Rosenberger Precision Microwave Cable

Murata coaxial cable

MXHP32HP1000

- The compensation for different frequency bands relates to the cable and the test

environment.

- The instrument compensation needs to be set according to the actual cable conditions.

4.3.2 Test Standards

Huawei modules meet 3GPP TS 51.010-1 and 3GPP TS 34.121-1 test standards.

Each module passes strict tests at the factory and thus the quality of the modules is

guaranteed.

4.4 Conducted Rx Sensitivity and Tx Power

4.4.1 Conducted Receive Sensitivity

The conducted receive sensitivity is a key parameter that indicates the receiver

performance of MU736.

The 3GPP Protocol Claim column in Table 4-2 lists the required minimum values,

and the Test Value column lists the tested values of MU736.

Table 4-2 MU736 conducted Rx sensitivity (Unit: dBm)

Item

3GPP Protocol

Claim (dBm)

MU736 Test Value (dBm)

Min.

Typ.

Max.

GSM850

GMSK (CS1, BLER <

10%)

< –102

-

–108

8PSK (MCS5, BLER <

10%)

< –98

-

–101

GSM900

GMSK (CS1, BLER <

10%)

< –102

-

–108

8PSK (MCS5, BLER <

10%)

< –98

-

–101

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Item

3GPP Protocol

Claim (dBm)

MU736 Test Value (dBm)

Min.

Typ.

Max.

GSM1800

GMSK (CS1, BLER <

10%)

< –102

-

–108

8PSK (MCS5, BLER <

10%)

< –98

-

–101

GSM1900

GMSK (CS1, BLER <

10%)

< –102

-

–108

8PSK (MCS5, BLER <

10%)

< –98

-

–101

Band I (BER < 0.1%)

< –106.7

-

–108

Band II (BER < 0.1%)

< –104.7

-

–108

Band IV (BER < 0.1%)

< –106.7

-

–108

Band VIII (BER < 0.1%)

< –103.7

-

–108

Band V (BER < 0.1%)

< –104.7

-

–108

Table 4-3 MU736 GPS specifications

TTFF

Cold start

43s@–130 dBm

Warm start

43s@–130 dBm

Hot Start

3s@–130 dBm

Sensitivity

Cold start

–144 dBm

Tracking

–158 dBm

The test values are the average of some test samples.

4.4.2 Conducted Transmit Power

The conducted transmit power is another indicator that measures the performance of

MU736. The conducted transmit power refers to the maximum power that the module

tested at the antenna port can transmit. According to the 3GPP protocol, the required

transmit power varies with the power class.

Table 4-4 lists the required ranges of the conducted transmit power of MU736. The

tested values listed in the Test Value column must range from the minimum power to

the maximum power.

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Table 4-4 MU736 conducted Tx power (Unit: dBm)

Item

3GPP Protocol

Claim (dBm)

MU736 Test Value (dBm)

Min.

Typ.

Max.

GSM850

GMSK (1Tx Slot)

31 to 35

31.5

32.5

33.5

8PSK (1Tx Slot)

24 to 30

26

27

28

GSM900

GMSK (1Tx Slot)

31 to 35

31.5

32.5

33.5

8PSK (1Tx Slot)

24 to 30

26

27

28

GSM1800

GMSK (1Tx Slot)

28 to 32

28.5

29.5

30.5

8PSK (1Tx Slot)

23 to 29

25

26

27

GSM1900

GMSK (1Tx Slot)

28 to 32

28.5

29.5

30.5

8PSK (1Tx Slot)

23 to 29

25

26

27

Band I

21 to 25

22.5

23.5

24.5

Band II

21 to 25

22.5

23.5

24.5

Band IV

21 to 25

22.5

23.5

24.5

Band VIII

21 to 25

22.5

23.5

24.5

Band V

21 to 25

22.5

23.5

24.5

4.5 Antenna Design Requirements

4.5.1 Antenna Design Indicators

Antenna Efficiency

Antenna efficiency is the ratio of the input power to the radiated or received power of

an antenna. The radiated power of an antenna is always lower than the input power

due to the following antenna losses: return loss, material loss, and coupling loss. The

efficiency of an antenna relates to its electrical dimensions. To be specific, the

antenna efficiency increases with the electrical dimensions. In addition, the

transmission cable from the antenna port of MU736 to the antenna is also part of the

antenna. The cable loss increases with the cable length and the frequency. It is

recommended that the cable loss be as low as possible, for example, U.FL-LP-088

made by HRS.

The following antenna efficiency (free space) is recommended for MU736 to ensure

high radio performance of the module:

- Efficiency of the primary antenna: ≥ 40% (below 960 MHz); ≥ 50% (over 1710

MHz)

- Efficiency of the diversity antenna: ≥ half of the efficiency of the primary antenna

in receiving band

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- Efficiency of the GPS antenna: ≥ 50%

In addition, the efficiency should be tested with the transmission cable.

S11 or VSWR

S11 indicates the degree to which the input impedance of an antenna matches the

reference impedance (50 ohm). S11 shows the resonance feature and impedance

bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression

of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector

analyzer.

The following S11 values are recommended for the antenna of MU736:

- S11 of the primary antenna ≤ –6 dB

- S11 of the diversity antenna ≤ –6 dB

- S11 of the GPS antenna ≤ –10 dB

In addition, S11 is less important than the efficiency, and S11 has weak correlation to

the wireless performance.

Isolation

For a wireless device with multiple antennas, the power of different antennas is

coupled with each other. Antenna isolation is used to measure the power coupling.

The power radiated by an antenna might be received by an adjacent antenna, which

decreases the antenna radiation efficiency and affects the running of other devices. To

avoid this problem, evaluate the antenna isolation as sufficiently as possible at the

early stage of antenna design.

Antenna isolation depends on the following factors:

- Distance between antennas

- Antenna type

- Antenna direction

The primary antenna must be placed as near as possible to the MU736 to minimize

the cable length. The diversity antenna needs to be installed perpendicularly to the

primary antenna. The diversity antenna can be placed farther away from the MU736.

Antenna isolation can be measured with a two-port vector network analyzer.

The following antenna isolation is recommended for the antennas on laptops:

- Isolation between the primary and diversity antennas ≤ –12 dB

- Isolation between the primary antenna and the GPS antenna ≤ –15 dB

- Isolation between the primary antenna and the Wi-Fi antenna ≤ –15 dB

Polarization

The polarization of an antenna is the orientation of the electric field vector that rotates

with time in the direction of maximum radiation.

The linear polarization is recommended for the antenna of MU736.

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Envelope Correlation Coefficient

The envelope correlation coefficient indicates the correlation between different

antennas in a multi-antenna system (primary antenna, diversity antenna, and MIMO

antenna). The correlation coefficient shows the similarity of radiation patterns, that is,

amplitude and phase of the antennas. The ideal correlation coefficient of a diversity

antenna system or a MIMO antenna system is 0. A small value of the envelope

correlation coefficient between the primary antenna and the diversity antenna

indicates a high diversity gain. The envelope correlation coefficient depends on the

following factors:

- Distance between antennas

- Antenna type

- Antenna direction

The antenna correlation coefficient differs from the antenna isolation. Sufficient

antenna isolation does not represent a satisfactory correlation coefficient. For this

reason, the two indicators need to be evaluated separately.

For the antennas on laptops, the recommended envelope correlation coefficient

between the primary antenna and the diversity antenna is smaller than 0.5.

Radiation Pattern

The radiation pattern of an antenna reflects the radiation features of the antenna in the

remote field region. The radiation pattern of an antenna commonly describes the

power or field strength of the radiated electromagnetic waves in various directions

from the antenna. The power or field strength varies with the angular coordinates (θ

and φ), but is independent of the radial coordinates.

The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal

plane, and the incident waves of base stations are often in the horizontal plane. For

this reason, the receiving performance is optimal.

The following radiation patterns are recommended for the antenna of MU736:

Primary/Diversity/GPS/WIFI antenna: omnidirectional.

In addition, the diversity antenna’s pattern should be complementary with the primary

antenna’s pattern.

Gain and Directivity

The radiation pattern of an antenna represents the field strength of the radiated

electromagnetic waves in all directions, but not the power density that the antenna

radiates in the specific direction. The directivity of an antenna, however, measures the

power density that the antenna radiates.

Gain, as another important parameter of antennas, correlates closely to the directivity.

The gain of an antenna takes both the directivity and the efficiency of the antenna into

account. The appropriate antenna gain prolongs the service life of relevant batteries.

The following antenna gain is recommended for MU736:

- Gain of the primary antenna ≤ 2.5 dBi

- Gain of the diversity antenna ≤ 2.5 dBi

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- The antenna consists of the antenna body and the relevant RF transmission cable. Take the

RF transmission cable into account when measuring any of the preceding antenna

indicators.

- Huawei cooperates with various famous antenna suppliers who are able to make

suggestions on antenna design, for example, Amphenol, Skycross, etc.

4.5.2 Interference

Besides the antenna performance, the interference on the user board also affects the

radio performance (especially the TIS) of the module. To guarantee high performance

of the module, the interference sources on the user board must be properly controlled.

On the user board, there are various interference sources, such as the LCD, CPU,

audio circuits, and power supply. All the interference sources emit interference signals

that affect the normal operation of the module. For example, the module sensitivity

can be decreased due to interference signals. Therefore, during the design, you need

to consider how to reduce the effects of interference sources on the module. You can

take the following measures: Use an LCD with optimized performance; shield the LCD

interference signals; shield the signal cable of the board; or design filter circuits.

Huawei is able to make technical suggestions on radio performance improvement of

the module.

4.5.3 GSM/WCDMA/GPS Antenna Requirements

The antenna for MU736 must fulfill the following requirements:

GSM/WCDMA/GPS Antenna Requirements

Frequency range

Depending on frequency band(s) provided by the network

operator, the customer must use the most suitable

antenna for that/those band(s)

Bandwidth

70 MHz in GSM850

80 MHz in GSM900

170 MHz in DCS

140 MHz in PCS

70 MHZ in WCDMA850 (25 MHz for diversity antenna)

80 MHz in WCDMA900 (35 MHz for diversity antenna)

445 MHz in WCDMA1700 (AWS) (45 MHz for diversity

antenna)

140 MHz in WCDMA1900 (60 MHz for diversity antenna)

250 MHz in WCDMA2100 (60 MHz for diversity antenna)

2 MHz in GPS

Gain

≤ 2.5 dBi

Impedance

50 Ω

VSWR absolute max

≤ 3:1 (≤ 2:1 for GPS antenna)

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GSM/WCDMA/GPS Antenna Requirements

VSWR recommended

≤ 2:1 (≤ 1.5:1 for GPS antenna)

4.5.4 Radio Test Environment

The antenna efficiency, antenna gain, radiation pattern, total radiated power (TRP),

and total isotropic sensitivity (TIS) can be tested in a microwave testing chamber.

Huawei has a complete set of OTA test environments (SATIMO microwave testing

chambers and ETS microwave testing chambers). The testing chambers are certified

by professional organizations and are applicable to testing at frequencies ranging

from 380 MHz to 6 GHz. The test items are described as follows.

Passive Tests

- Antenna efficiency

- Gain

- Pattern shape

- Envelope correlation coefficient

Active Tests

- TRP: GSM, WCDMA systems

- TIS: GSM, WCDMA systems

Figure 4-1 shows the SATIMO microwave testing chamber.

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Figure 4-1 SATIMO microwave testing chamber

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5 Electrical and Reliability Features

5.1 About This Chapter

This chapter describes the electrical and reliability features of the interfaces in the

MU736 module, including:

- Absolute Ratings

- Operating and Storage Temperatures and Humidity

- Electrical Features of Application Interfaces

- Power Supply Features

- Reliability Features

- EMC and ESD Features

5.2 Absolute Ratings

Table 5-1 lists the absolute ratings for the MU736 module. Using the MU736 module

beyond these conditions may result in permanent damage to the module.

Table 5-1 Absolute ratings for the MU736 module

Symbol

Specification

Min.

Max.

Unit

3.3 V

External power voltage

–0.3

5.5

V

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5.3 Operating and Storage Temperatures and Humidity

Table 5-2 lists the operating and storage temperatures and humidity for the MU736

module.

Table 5-2 operating and storage temperatures and humidity for the MU736 module

Specification

Min.

Max.

Unit

Normal working temperatures[1]

–10

+55

°C

Extended temperatures[2]

–20

+70

°C

Ambient temperature for storage

–40

+85

°C

Moisture

5

95

%

[1]: When the MU736 module works at this temperature, all its RF indexes comply with the

3GPP TS 45.005 specifications.

[2]: When the MU736 module works at this temperature, NOT all its RF indexes comply with the

3GPP TS 45.005 specifications.

5.4 Electrical Features of Application Interfaces

Table 5-3 Electrical features of Digital Pins

Parameter

Description

Min.

Max.

Unit

BodySAR_N

VIH

1.26

3.6

V

VIL

–0.2

0.3

V

RESET

VIH

1.26

2.1

V

VIL

–0.2

0.3

V

Power_On_Off

VIH

1.26

3.6

V

VIL

–0.2

0.3

V

W_DISABLE

VIH

1.26

3.6

V

VIL

–0.2

0.3

V

GPS_DISABLE

VIH

1.26

3.6

V

VIL

–0.2

0.3

V

SIM_DET

VIH

1.26

2.1

V

VIL

–0.2

0.3

V

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Table 5-4 Electrical features of Digital Pins in the I/O supply domain of the USIM

Interface

Parameter

Description

Min.

Max.

Note

Unit

VIH

High-level

input voltage

0.7 x

VDDP_USIM

3.3

VDDP_USIM=1.8 V or

2.9 V

V

VIL

Low-level

input voltage

0

0.2 x

VDDP_USIM

VDDP_USIM=1.8 V or

2.9 V

V

VOH

High-level

output

voltage

0.7 x

VDDP_USIM

3.3

VDDP_USIM=1.8 V or

2.9 V, IOL=–1.0 mA

V

VOL

Low-level

output

voltage

0

0.2 x

VDDP_USIM

VDDP_USIM=1.8 V or

2.9 V, IOL=+1.0 mA

V

Ileak

Input/Output

leakage

current

-

±0.7

0.2V < VIN < VIHmax

μA

Table 5-5 Electrical features of Digital Pins of the ANT_TUNER Interface

Parameter

Description

Min.

Max.

Note

Unit

VOH

High-level

output

voltage

1.26

2

-

V

VOL

Low-level

output

voltage

0

0.15

-

V

5.5 Power Supply Features

5.5.1 Input Power Supply

Table 5-6 lists the requirements for input power of the MU736 module.

Table 5-6 Requirements for input power for the MU736 module

Parameter

Min.

Typ.

Max.

Ripple

Unit

3.3 V

3.135

3.3

4.4

0.05

V

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Figure 5-1 Power Supply During Burst Emission

The minimum value of the power supply must be guaranteed during the burst (with 2. 5 A Peak

in GPRS or EGPRS mode).

Table 5-7 Requirements for input current of the MU736 module

Power

Peak (Maximum)

Normal (Maximum)

3.3 V

2500 mA

1100 mA

5.5.2 Power Consumption

The power consumption of MU736 in different scenarios are respectively listed in

Table 5-8 to Table 5-12 .

The power consumption listed in this section is tested when the power supply of

MU736 module is normal voltage (3.3 V), and all of test values are measured at room

temperature.

Table 5-8 Averaged power off DC power consumption of MU736

Description

Test Value (uA)

Notes/Configuration

Typical

Power off

50

Normal voltage (3.3 V) is ON and

Power_On_Off pin is pulled low.

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Table 5-9 Averaged standby DC power consumption of MU736 (WCDMA/HSDPA/GSM)

Description

Bands

Test Value (mA)

Notes/Configuration

Typical

Sleep

HSPA+/WCDMA

(sleep)

UMTS bands

2.3

Module is powered up.

DRX cycle=8 (2.56s)

Module is registered on the

network.

USB is in suspend.

GPRS/EDGE

(sleep)

GSM bands

2.3

Module is powered up.

MFRMS=5 (1.175s)

Module is registered on the

network.

USB is in suspend.

Radio Off

(sleep)

All bands

1.6

Module is powered up.

RF is disabled.

USB is in suspend.

Idle

HSPA+/WCDMA

(idle)

UMTS bands

30

Module is powered up.

DRX cycle=8 (2.56s)

Module is registered on the

network, and no data is

transmitted.

USB is in active.

GPRS/EDGE

(idle)

GSM bands

30

Module is powered up.

MFRMS=5 (1.175s)

Module is registered on the

network.

no data is transmitted.

USB is in active.

Radio Off

(idle)

All bands

30

Module is powered up.

RF is disabled.

USB is in active.

Table 5-10 Averaged Data Transmission DC power consumption of MU736

(WCDMA/HSDPA)

Description

Band

Test Value (mA)

Notes/Configuration

Typical

WCDMA

Band I

(IMT2100)

190

0 dBm Tx Power

245

10 dBm Tx Power

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Description

Band

Test Value (mA)

Notes/Configuration

Typical

710

23.5 dBm Tx Power

Band II

(PCS 1900)

180

0 dBm Tx Power

245

10 dBm Tx Power

790

23.5 dBm Tx Power

Band IV

(AWS)

180

0 dBm Tx Power

220

10 dBm Tx Power

690

23.5 dBm Tx Power

Band V

(850 MHz)

180

0 dBm Tx Power

220

10 dBm Tx Power

680

23.5 dBm Tx Power

Band VIII

(900 MHz)

180

0 dBm Tx Power

240

10 dBm Tx Power

760

23.5 dBm Tx Power

HSDPA

Band I

(IMT2100)

195

0 dBm Tx Power

260

10 dBm Tx Power

740

23.5 dBm Tx Power

Band II

(PCS 1900)

195

0 dBm Tx Power

255

10 dBm Tx Power

790

23.5 dBm Tx Power

Band IV

(AWS)

190

0 dBm Tx Power

250

10 dBm Tx Power

690

23.5 dBm Tx Power

Band V

(850 MHz)

195

0 dBm Tx Power

245

10 dBm Tx Power

690

23.5 dBm Tx Power

Band VIII

(900 MHz)

195

0 dBm Tx Power

255

10 dBm Tx Power

730

23.5 dBm Tx Power

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Table 5-11 Averaged DC power consumption of MU736 (GPRS/EDGE)

Description

Test Value (mA)

PCL

Notes/Configuration

Typical

GPRS850

265

5

1 Up/1 Down

385

2 Up/1 Down

535

4 Up/1 Down

145

10

1 Up/1 Down

230

2 Up/1 Down

380

4 Up/1 Down

GPRS900

270

5

1 Up/1 Down

390

2 Up/1 Down

550

4 Up/1 Down

145

10

1 Up/1 Down

230

2 Up/1 Down

395

4 Up/1 Down

GPRS1800

175

0

1 Up/1 Down

225

2 Up/1 Down

265

4 Up/1 Down

80

10

1 Up/1 Down

105

2 Up/1 Down

140

4 Up/1 Down

GPRS1900

185

0

1 Up/1 Down

240

2 Up/1 Down

280

4 Up/1 Down

80

10

1 Up/1 Down

105

2 Up/1 Down

145

4 Up/1 Down

EDGE850

185

8

1 Up/1 Down

280

2 Up/1 Down

430

4 Up/1 Down

100

15

1 Up/1 Down

145

2 Up/1 Down

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Description

Test Value (mA)

PCL

Notes/Configuration

Typical

220

4 Up/1 Down

EDGE900

190

8

1 Up/1 Down

295

2 Up/1 Down

455

4 Up/1 Down

100

15

1 Up/1 Down

150

2 Up/1 Down

230

4 Up/1 Down

EDGE1800

150

2

1 Up/1 Down

240

2 Up/1 Down

360

4 Up/1 Down

100

10

1 Up/1 Down

150

2 Up/1 Down

230

4 Up/1 Down

EDGE1900

150

2

1 Up/1 Down

230

2 Up/1 Down

360

4 Up/1 Down

100

10

1 Up/1 Down

150

2 Up/1 Down

230

4 Up/1 Down

All power consumption test configuration can be referenced by GSM Association Official

Document TS.09: Battery Life Measurement and Current Consumption Technique.

- Test condition: For Max Tx power ,see 4.4.2 Conducted Transmit Power, they are listed in

Table 4-4 ; for Max data throughput, see 2.2 Function Overview, they are listed in Table 2-1

Features.

Table 5-12 Averaged GPS operation DC power consumption of MU736

Description

Test Value (mA)

Notes/Configuration

Typical

GPS fixing

100

RF is disabled;

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Description

Test Value (mA)

Notes/Configuration

Typical

GPS tracking

100

USB is in active;

The Rx power of GPS is –130 dBm.

5.6 Reliability Features

Table 5-13 lists the test conditions and results of the reliability of the MU736 module.

Table 5-13 Test conditions and results of the reliability of the MU736 module

Item

Test Condition

Standard

Sample size

Results

Stress

Low-temperature

storage

Temperature: –40ºC

Operation mode: no

power, no package

Test duration: 24 h

JESD22-

A119-C

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

High-temperature

storage

Temperature: 85ºC

Operation mode: no

power, no package

Test duration: 24 h

JESD22-

A103-C

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

Low-temperature

operating

Temperature: –20ºC

Operation mode:

working with service

connected

Test duration: 24 h

IEC6006

8-2-1

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

High-temperature

operating

Temperature: 70ºC

Operation mode:

working with service

connected

Test duration: 24 h

JESD22-

A108-C

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

Damp heat cycling

High temperature:

55ºC

Low temperature:

25ºC

Humidity: 95%±3%

Operation mode:

working with service

connected

Test duration: 6

cycles; 12 h+12

h/cycle

JESD22-

A101-B

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

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Item

Test Condition

Standard

Sample size

Results

Thermal shock

Low temperature:

–40º

High temperature:

85ºC

Temperature change

interval: < 20s

Operation mode:

working with service

connected

Test duration: 100

cycles; 15 min+15

min/cycle

JESD22-

A106-B

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

Stress

Salty fog test

Temperature: 35°C

Density of the NaCl

solution: 5%±1%

Operation mode: no

power, no package

Test duration:

Spraying period: 8 h

Exposing period after

removing the salty fog

environment: 16 h

JESD22-

A107-B

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

Sine vibration

Frequency range: 5

Hz to 200 Hz

Acceleration: 1 Grms

Frequency scan rate:

0.5 oct/min

Operation mode:

working with service

connected

Test duration: 3 axial

directions. 2 h for

each axial direction.

Operation mode:

working with service

connected

JESD22-

B103-B

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

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Item

Test Condition

Standard

Sample size

Results

Shock test

Half-sine wave shock

Peak acceleration: 30

Grms

Shock duration: 11 ms

Operation mode:

working with service

connected

Test duration: 6 axial

directions. 3 shocks

for each axial

direction.

Operation mode:

working with service

connected

JESD-B1

04-C

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

Stress

Drop test

0.8 m in height. Drop

the module on the

marble terrace with

one surface facing

downwards, six

surfaces should be

tested.

Operation mode: no

power, no package

IEC6006

8-2-32

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

Life

High temperature

operating life

Temperature: 70ºC

Operation mode:

working with service

connected

Test duration: 168 h,

336 h, 500 h, 1000 h

for inspection point

JESD22-

A108-B

50

pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

High temperature

& high humidity

High temperature:

85ºC

Humidity: 85%

Operation mode:

powered on and no

working

Test duration: 168 h,

336 h, 500 h, 1000 h

for inspection point

JESD22-

A110-B

50

pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

Cross section: ok

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Item

Test Condition

Standard

Sample size

Results

Temperature cycle

High temperature:

85ºC

Low temperature:

–40ºC

Temperature change

slope: 6ºC/min

Operation mode: no

power

Test duration: 168 h,

336 h, 500 h, 1000 h

for inspection point

JESD22-

A104-C

50

pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

Cross section: ok

ESD

HBM (Human

Body Model)

1 kV (Class 1 B)

Operation mode: no

power

JESD22-

A114-D

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

ESD with DVK (or

embedded in the

host)

Contact Voltage: ±2

kV, ±4 kV

Air Voltage: ±2 kV, ±4

kV, ±8 kV

Operation mode:

working with service

connected

IEC6100

0-4-2

2 pcs

Visual inspection:

ok

Function test: ok

RF specification: ok

Groups ≥ 2

5.7 EMC and ESD Features

The following are the EMC design comments:

- Attention should be paid to static control in the manufacture, assembly, packaging,

handling, and storage process to reduce electrostatic damage to HUAWEI

module.

- RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if

the antenna port is protected by TVS (Transient Voltage Suppressor), which is

resolved by making some adjustments on RF match circuit.

- TVS should be added on the USB port for ESD protection, and the parasitic

capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode

inductor should be added in parallel on D+/D- signal.

- TVS should be added on the SIM interface for ESD protection. The parasitic

capacitance of TVS on SIM signal should be less than 10 pF.

- Resistors in parallel and a 10 nF capacitor should be added on RESET# and

Power_On_Off signal to avoid shaking, and the distance between the capacitor

and the related pin should be less than 100 mil.

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- PCB routing should be V-type rather than T-type for TVS.

- An integrated ground plane is necessary for EMC design.

The following are the requirements of ESD environment control:

- The electrostatic discharge protected area (EPA) must have an ESD floor whose

surface resistance and system resistance are greater than 1 x 104 Ω while less

than 1 x 109 Ω.

- The EPA must have a sound ground system without loose ground wires, and the

ground resistance must be less than 4 Ω.

- The workbench for handling ESD sensitive components must be equipped with

common ground points, the wrist strap jack, and ESD pad. The resistance

between the jack and common ground point must be less than 4 Ω. The surface

resistance and system resistance of the ESD pad must be less than 1 x 109 Ω.

- The EPA must use the ESD two-circuit wrist strap, and the wrist strap must be

connected to the dedicated jack. The crocodile clip must not be connected to the

ground.

- The ESD sensitive components, the processing equipment, test equipment, tools,

and devices must be connected to the ground properly. The indexes are as

follows:

− Hard ground resistance < 4 Ω

− 1 x 105 Ω ≤ Soft ground resistance < 1 x 109 Ω

− 1 x 105 Ω ≤ ICT fixture soft ground resistance < 1 x 1011 Ω

− The electronic screwdriver and electronic soldering iron can be easily oxidized.

Their ground resistance must be less than 20 Ω.

- The parts of the equipment, devices, and tools that touch the ESD sensitive

components and moving parts that are close to the ESD sensitive components

must be made of ESD materials and have sound ground connection. The parts

that are not made of ESD materials must be handled with ESD treatment, such

as painting the ESD coating or ionization treatment (check that the friction voltage

is less than 100 V).

- Key parts in the production equipment (parts that touch the ESD sensitive

components or parts that are within 30 cm away from the ESD sensitive

components), including the conveyor belt, conveyor chain, guide wheel, and SMT

nozzle, must all be made of ESD materials and be connected to the ground

properly (check that the friction voltage is less than 100 V).

- Engineers that touch IC chips, boards, modules, and other ESD sensitive

components and assemblies must wear ESD wrist straps, ESD gloves, or ESD

finger cots properly. Engineers that sit when handling the components must all

wear ESD wrist straps.

- Noticeable ESD warning signs must be attached to the packages and placement

areas of ESD sensitive components and assemblies.

- Boards and IC chips must not be stacked randomly or be placed with other ESD

components.

- Effective shielding measures must be taken on the ESD sensitive materials that

are transported or stored outside the EPA.

The HUAWEI MU736 module does not include any protection against overvoltage.

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6 Mechanical Specifications

6.1 About This Chapter

This chapter describes the following aspects of the MU736 module:

- Dimensions of MU736

- Label

- Packing System

6.2 Dimensions of MU736

Figure 6-1 shows the dimensions of MU736 in details.

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Figure 6-1 Dimensions of MU736

TOP VIEW

BOTTOM VIEW

6.3 Label

There are two labels on the MU736.

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Figure 6-2 Dimensions of label (front label)

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Figure 6-3 Dimensions of label (back label)

6.4 Packing System

HUAWEI M.2 module uses five layers ESD pallet, anti-vibration foam and vacuum

packing into cartons.

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Figure 6-4 Packet system

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7 Installation

7.1 About This Chapter

This chapter describes the assembly of MU736, including:

- Connect MU736 to Board

- Antenna Plug

7.2 Connect MU736 to Board

Figure 7-1 Install MU736

It refers to M.2 specification.

The module will need a mechanical retention at the end of the board. The module

specifies a 5.5 mm Dia. keep out zone at the end for attaching a screw.

The module Stand-off and mounting screw also serve as part of the module Electrical

Ground path. The Stand-off should be connected directly to the ground plane on the

platform. So that when the module is mounted and the mounting screw is screwed on

to hold the module in place, this will make the electrical ground connection from the

module to the platform ground plane.

The stand-off must provide a Thermal Ground Path. The design requirements for

thermal are a material with a minimum conductivity of 50 watts per meter Kelvin and

surface area of 22 Sq mm.

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7.3 Antenna Plug

Figure 7-2 Mating the plug

1. Align the mating tool or the mating end of the tool over the plug end of the cable

assembly.

2. Firmly place the tool over the plug until it is secured in the tool.

3. Place the plug cable assembly (held in the tool) over the corresponding

receptacle.

4. Assure that the plug and receptacle are aligned press-down perpendicular to the

mounting surface until both connectors are fully mated.

5. Remove the mating tool by pulling it up carefully.

Figure 7-3 Unmating the plug

- The extraction tool is recommended.

- Any attempt of unmating by pulling on the cable may result in damage and influence the

mechanical / electrical performance.

It is recommended that not to apply any pull forces after the bending of the cable, as

described in Figure 7-4 .

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Figure 7-4 Do not apply any pull forces after the bending of the cable

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8 Certifications

8.1 About This Chapter

This chapter gives a general description of certifications of MU736.

8.2 Certifications

The certification of MU736 is testing now. Table 8-1 shows certifications the MU736 will be

implemented. For more demands, please contact us for more details about this information.

Table 8-1 Product Certifications

Certification

Model name

MU736

CE



FCC



CCC



NCC



A-TICK



Jate & Telec



IC



EU RoHS



JGPSSI

-

SGS RoHS

-

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Certification

Model name

MU736

PVC-Free

-

GCF



PTCRB



Halogen-free



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9 Safety Information

Read the safety information carefully to ensure the correct and safe use of your

wireless device. Applicable safety information must be observed.

9.1 Interference

Power off your wireless device if using the device is prohibited. Do not use the

wireless device when it causes danger or interference with electric devices.

9.2 Medical Device

- Power off your wireless device and follow the rules and regulations set forth by

the hospitals and health care facilities.

- Some wireless devices may affect the performance of the hearing aids. For any

such problems, consult your service provider.

- Pacemaker manufacturers recommend that a minimum distance of 15 cm be

maintained between the wireless device and a pacemaker to prevent potential

interference with the pacemaker. If you are using an electronic medical device,

consult the doctor or device manufacturer to confirm whether the radio wave

affects the operation of this device.

9.3 Area with Inflammables and Explosives

To prevent explosions and fires in areas that are stored with inflammable and

explosive devices, power off your wireless device and observe the rules. Areas stored

with inflammables and explosives include but are not limited to the following:

- Gas station

- Fuel depot (such as the bunk below the deck of a ship)

- Container/Vehicle for storing or transporting fuels or chemical products

- Area where the air contains chemical substances and particles (such as granule,

dust, or metal powder)

- Area indicated with the "Explosives" sign

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- Area indicated with the "Power off bi-direction wireless equipment" sign

- Area where you are generally suggested to stop the engine of a vehicle

9.4 Traffic Security

- Observe local laws and regulations while using the wireless device. To prevent

accidents, do not use your wireless device while driving.

- RF signals may affect electronic systems of motor vehicles. For more information,

consult the vehicle manufacturer.

- In a motor vehicle, do not place the wireless device over the air bag or in the air

bag deployment area. Otherwise, the wireless device may hurt you owing to the

strong force when the air bag inflates.

9.5 Airline Security

Observe the rules and regulations of airline companies. When boarding or

approaching a plane, power off your wireless device. Otherwise, the radio signal of

the wireless device may interfere with the plane control signals.

9.6 Safety of Children

Do not allow children to use the wireless device without guidance. Small and sharp

components of the wireless device may cause danger to children or cause suffocation

if children swallow the components.

9.7 Environment Protection

Observe the local regulations regarding the disposal of your packaging materials,

used wireless device and accessories, and promote their recycling.

9.8 WEEE Approval

The wireless device is in compliance with the essential requirements and other

relevant provisions of the Waste Electrical and Electronic Equipment Directive

2012/19/EU (WEEE Directive).

9.9 RoHS Approval

The wireless device is in compliance with the restriction of the use of certain

hazardous substances in electrical and electronic equipment Directive 2011/65/EU

(RoHS Directive).

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9.10 Laws and Regulations Observance

Observe laws and regulations when using your wireless device. Respect the privacy

and legal rights of the others.

9.11 Care and Maintenance

It is normal that your wireless device gets hot when you use or charge it. Before you

clean or maintain the wireless device, stop all applications and power off the wireless

device.

- Use your wireless device and accessories with care and in clean environment.

Keep the wireless device from a fire or a lit cigarette.

- Protect your wireless device and accessories from water and vapour and keep

them dry.

- Do not drop, throw or bend your wireless device.

- Clean your wireless device with a piece of damp and soft antistatic cloth. Do not

use any chemical agents (such as alcohol and benzene), chemical detergent, or

powder to clean it.

- Do not leave your wireless device and accessories in a place with a considerably

low or high temperature.

- Use only accessories of the wireless device approved by the manufacture.

Contact the authorized service center for any abnormity of the wireless device or

accessories.

- Do not dismantle the wireless device or accessories. Otherwise, the wireless

device and accessories are not covered by the warranty.

- The device should be installed and operated with a minimum distance of 20 cm

between the radiator and your body.

9.12 Emergency Call

This wireless device functions through receiving and transmitting radio signals.

Therefore, the connection cannot be guaranteed in all conditions. In an emergency,

you should not rely solely on the wireless device for essential communications.

9.13 Regulatory Information

The following approvals and notices apply in specific regions as noted.

9.13.1 CE Approval (European Union)

The wireless device is approved to be used in the member states of the EU. The

wireless device is in compliance with the essential requirements and other relevant

provisions of the Radio and Telecommunications Terminal Equipment Directive

1999/5/EC (R&TTE Directive).

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9.13.2 FCC Statement

Federal Communications Commission Notice (United States): Before a wireless

device model is available for sale to the public, it must be tested and certified to the

FCC that it does not exceed the limit established by the government-adopted

requirement for safe exposure.

This device complies with Part 15 of the FCC Rules. Operation is subject to the

following two conditions: (1) this device may not cause harmful interference, and (2)

this device must accept any interference received, including interference that may

cause undesired operation.

Warning: Changes or modifications made to this equipment not expressly approved

by HUAWEI may void the FCC authorization to operate this equipment.

HUAWEI MU736 HSPA+ M.2 Module

ecafretnI lacipyT fo tiucriC A xidneppA ediuG erawdraH

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10 Appendix A Circuit of Typical

Interface

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11 Appendix B Acronyms and

Abbreviations

Acronym or Abbreviation

Expansion

AP

Application Process

CCC

China Compulsory Certification

CE

European Conformity

CS

Coding Scheme

CSD

Circuit Switched Data

DC

Direct Current

DMA

Direct Memory Access

DVK

Development Kit

EBU

External Bus Unit

EIA

Electronic Industries Association

EMC

Electromagnetic Compatibility

ESD

Electrostatic Discharge

EU

European Union

FCC

Federal Communications Commission

GMSK

Gaussian Minimum Shift Keying

GPIO

General-purpose I/O

GPRS

General Packet Radio Service

GSM

Global System for Mobile Communication

HBM

Human Body Model

HSIC

High Speed Inter-Chip Interface

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Acronym or Abbreviation

Expansion

HSDPA

High-Speed Downlink Packet Access

HSPA+

Enhanced High Speed Packet Access

HSUPA

High Speed Up-link Packet Access

ISO

International Standards Organization

LCP

Liquid Crystal Polyester

LDO

Low-Dropout

LED

Light-Emitting Diode

M.2

New Name for NGFF

MCP

Multi-chip Package

NGFF

Next Generation Form Factor

NTC

Negative Temperature Coefficient

PA

Power Amplifier

PBCCH

Packet Broadcast Control Channel

PCB

Printed Circuit Board

PDU

Protocol Data Unit

PMU

Power Management Unit

RF

Radio Frequency

RoHS

Restriction of the Use of Certain Hazardous

Substances

TVS

Transient Voltage Suppressor

UMTS

Universal Mobile Telecommunications System

USB

Universal Serial Bus

USIM

Universal Subscriber Identity Module

VSWR

Voltage Standing Wave Ratio

WCDMA

Wideband Code Division Multiple Access

Huawei MU736 HSPA M.2 Module Hardware Guide (V100R001 05, English)

HUAWEI MU736 HSPA+ M.2 Module Hardware Guide-(V100R001_05, English)

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