Hysiry Technology ESP8266-S3 ESP8266-S3 User Manual

Shenzhen Hysiry Technology Co., Ltd. ESP8266-S3

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ESP8266 S3 User Manual HTML Version

User Manual

Version 1.0

2017 / 9

Shenzhen Hysiry Technology Co.,Ltd T：0755-23596457 2 / 13

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THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANYWARRANTY OF

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infringement of any proprietary rights, relating to useof information in this document is disclaimed. No licenses

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The WiFi Alliance Member Logo is a trademark of the WiFi Alliance.

All trade names, trademarks and registered trademarks mentioned in this document are property oftheir

respective owners, and are here by acknowledged.

Note

As the product upgrade or other reasons, this manual may change. Shenzhen Hysiry Technology Co., Ltd has

right to modify the contents of this manual without any notice or warning. This manual is only as a guide,Hysiry

Technology Co., Ltd Spareno effort to provide accurate information in this manual, but the Hysiry can't guarantee

manual there is no problem , all statements in this manual, information and suggestions do not constitute any

guarantee of express or implication.

Amendment record

Time

Version

Specification

2017.09

V1.0

First release

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Contents

1. Overview .......................................................................................................................................................... 4

2. Main Features .................................................................................................................................................. 4

2.1 System Diagram ......................................................................................................................................... 4

2.2 Hardware Specifications ............................................................................................................................ 5

3. Pin description ................................................................................................................................................. 6

4. Functional Description ..................................................................................................................................... 7

4.1 MCU ........................................................................................................................................................... 7

4.2 Memory ..................................................................................................................................................... 7

4.2.1 Internal SRAM and ROM ..................................................................................................................... 7

4.2.2 SPI Flash .............................................................................................................................................. 7

4.3 Interface Description ................................................................................................................................. 8

5. Electrical Characteristic ................................................................................................................................... 9

5.1 Standby Power Consumption .................................................................................................................... 9

5.2 RF Performance ....................................................................................................................................... 10

5.3 Digital Terminal Characteristics ............................................................................................................... 11

5.4 Absolute Maximum Ratings .................................................................................................................... 11

5.5 Reflow Profile .......................................................................................................................................... 11

6. Schematics ..................................................................................................................................................... 12

7. Minimum System Requirements ................................................................................................................... 12

8. Switching noise control ................................................................................................................................. 13

9. Technical Support .......................................................................................................................................... 13

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1. Overview

ESP8266-S3 Wi-Fi module is a low consumption, high performance Wi-Fi network control module designed

by Hysiry. It can meet the IoT application requirements in smart power grids, building automation, security and

protection, smart home, remote health care etc.

The module's core processor ESP8266 integrates an enhanced version of Tensilica's L106 Diamond series 32-

bit processor with smaller package size and 16 bit compact mode, main frequency support 80 MHz and 160 MHz,

support RTOS, integrated Wi-Fi MAC / BB / RF / PA / LNA, on-board PCB antenna.

The module supports standard IEEE802.11 b / g / n protocol, a complete TCP / IP protocol stack.

Users can use the module to add networking capabilities to existing devices, but also to build an independent net

work controller.

Figure -1.ESP8266-S3 Module

2. Main Features

2.1 System Diagram

ESP8266

ESP8266 8Mbit

SPI FLASH

8Mbit

SPI FLASH

26MHz

XTAL

26MHz

XTAL

VDD_MCU

VDD_MCU VDD33

VDD33

ESP8266-S3

2 Χ UART

1 Χ I2S

1 Χ ADC

1 Χ SPI

GPIO

1 Χ I2C

1 Χ IR

Figure -2. System Diagram

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2.2 Hardware Specifications

 Operating Voltage: 3.3V（3.0 ~ 3.6V）

 Operating Temperature：-40 - 85°C

 CPU Tensilica L106

o RAM 50KB（Available）

o Flash 8 Mbit

 System

o 802.11 b/g/n

o Frequency range 2.4 GHz ~ 2.5 GHz（2400 M ~ 2483.5 M）

o IntegratedTensilica L106 ultra-low power 32-bitmicro MCU, with 16-bit RSIC. The CPU clock speed

is 80MHz. It can also reach a maximum value of 160MHz.

o WIFI 2.4 GHz，supportWPA/WPA2

o Supports UART、I2C、GPIO、PWM、SDIO、SPI、ADC、PWM、IR

o Integrated 10 bit high precision ADC

o Supports TCP、UDP、HTTP、FTP

o Integrated TR switch, balun,LNA, Power amplifier and matching network

o Integrated PLL, Regulator and power source management components, +20 dBm output power in

802.11b mode

o Average working current80mA, <Deep sleep current < 20uA, Power down leakage current < 5uA

o Rich interface on processor: SDIO 2.0, SPI, UARTl

o Wake up ,build the connection and transmit packets in < 2ms

o Standby power consumption < 1.0mW (DTIM3)

o Support AT remote upgrades and cloud OTA upgrade

o Support Station / SoftAP / SoftAP+Station operation modes

o Ultra-Small 20.2mm * 17.6mm * 3.05mm

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3. Pin description

Figure -3. Pin description

Figure -4.Module Size - shieldingcase (Side View)

Table -1. ESP8266-S3 Pin Definitions

No.

Pin Name

Functional Description

Chip enable pin (cannot be floating). Active high.

TOUT

Tests the power-supply voltage of VDD3P3 and the input power voltage of

TOUT.These two functions cannot be used simultaneously.

IO14

GPIO14；HSPI_CLK

IO12

GPIO12；HSPI_MISO

IO13

GPIO13； HSPI_MOSI；UART0_CTS

IO15

GPIO15；MIDO； HSPICS；UART0_RTS

IO0

GPIO0

• UART download: pull down.

• SDIO boot: don’t-care.

IO2

GPIO2；UART1_TXD

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IO4

GPIO4

IO5

GPIO5

URXD

UART0_RXD, receive end in UART download；GPIO3

UTXD

UART0_TXD, transmit end in UART download, floating (internal pull-up) or

pull up；GPIO1

VCC

3.3 V power supply (VDD)

Note:It is recommended the maximum output current a power supply

provides be of 500 mA or above.

GND

Ground

4. Functional Description

4.1 MCU

ESP8266EX contained in the ESP8266-S3 integrates Tensilica L106 32-bit micro controller (MCU) and a 16-bit

RSIC. The CPU clock speed is 80 MHz and can reach a maximum value of 160 MHz. The system can readily run a

Real Time Operating System (RTOS). Currently, the Wi-Fi stack only takes up 20% of CPU time. The remaining CPU

time (80% of total MIPS) can be used for user application. The MCU can work in conjunction with the other parts

of the chip through the following interfaces.

 Programmable RAM/ROM interface (iBus) that connects to memory controller and can access the

external flash.

 Data RAM interface (dBus) that connects to memory controller.

 AHB interface that accesses the register.

4.2 Memory

4.2.1 Internal SRAM and ROM

ESP8266EX Wi-Fi SoC integrates memory controller including SRAM and ROM. MCU can access the memory

controller through iBus, dBus, and AHB interfaces. All these interfaces can access ROM or RAM units. A memory

arbiter determines the running sequence in the arrival order of requests.

According to our current version of SDK, SRAM space available to users is assigned as below.

 RAM size < 50 kB, that is, when ESP8266EX is working in Station mode and connects to the router,

available space in Heap + Data sector is around 50 kB.

 There is no programmable ROM in ESP8266EX, therefore, user program must be stored in the SPI flash

integrated into the ESP8266-S3.

4.2.2 SPI Flash

 ESP8266EX supports SPI flash. Theoretically speaking, ESP8266EX can support up to 16 MB SPI flash.

 ESP8266-S3 currently integrates 8 Mbit SPI flash memory. ESP8266-S3 supports these SPI modes:

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Standard SPI, DIO (Dual I/O), DOUT (Dual Output), QIO (Quad I/O) and QOUT (Quad Output).

4.3 Interface Description

Table -2. Interface Description

Interface

Functional Description

SPI

IO12(MISO),IO13(MOSI),

IO14(CLK),IO15(CS)

S3 can control SPI Slave as a Master or communicate with

Host MCU as a Slave. In overlap mode, S3 can share the SPI

interface with Flash, shifted by different CS signals.

PWM

Any available GPIO

(EXCEPT GPIO16)

Currently the demo provides 4 PWM channels (users can

extend to 6 channels). PWM interface can realize the control

of LED lights, buzzers, relays, electronic machines, etc.

Any available GPIO

(EXCEPT GPIO16)

The functionality of Infrared remote control interface can be

implemented via software programming. NEC coding,

modulation, and demodulation are used by this interface. The

frequency of modulated carrier signal is 38KHz.

ADC

TOUT

ESP8266EX integratesa 10-bit precision SARADC.

ADC_IN interface is used to test the power supply voltage of

VDD3P3(Pin 3 and Pin 4), as well as the input voltage of TOUT

(Pin 6). It can be used in sensors application.

I2C

IO14(SCL), IO2(SDA)

Any available

GPIO(EXCEPT GPIO16)

Can connect to external sensor and display, etc.

UART

UART0:

TXD(U0TXD),RXD(U0RXD)

,IO15(RTS),IO13(CTS)

Devices with UART interfaces can be connected

Download：U0TXD+U0RXD or GPIO2+U0RXD

Communication：

(UART0):U0TXD,U0RXD,MTDO(U0RTS),MTCK(U0CTS)

Debug：UART1_TXD(GPIO2)Can be used to print debugging

information

UART1: IO2(TXD)

By default, UART0 will output some printed information when

the device is powered on and is booting up. If this issue exerts

influence on some specific applications, users can exchange

the inner pins of UART when initializing, that is to say,

exchange U0TXD, U0RXD with U0RTS, U0CTS.

I2S

I2S input：

IO12 (I2SI_DATA);

IO13 (I2SI_BCK );

IO14 (I2SI_WS);

Mainly used for audio capturing, processing and transmission

I2S output:

IO15 (I2SO_BCK );

IO3 (I2SO_DATA);

IO2 (I2SO_WS );

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5. Electrical Characteristic

5.1 Standby Power Consumption

Table -3. Standby Power Consumption

Mode

Status

Typical Value

Standby

Modem Sleep

15mA

Light Sleep

0.9mA

Deep Sleep

20uA

Off

0.5uA

Working（Average）

80mA

Tx 801.11b，CCK 11Mbps，P OUT=+17 dBm

170mA

Tx 801.11g，OFDM 54Mbps，P OUT =+15 dBm

140mA

Tx 801.11n，MCS7，P OUT =+13 dBm

120mA

Rx 801.11b，1024 bytes packet length，-80 dBm

50mA

Rx 801.11g，1024 bytes packet length，-70 dBm

56mA

Rx 801.11n，1024 bytes packet length，-65 dBm

56mA

The following current consumption is based on 3.3V supply and 25°C ambient with internalregulators.Values

are measured at antenna port without SAW filter. All the transmissionmeasurements valuesare based on 90%

duty cycle, continuous transmission mode.

Table -4.Standby Power Consumption

Mode

Status

Typical Value

Standby

Modem Sleep

15mA

Light Sleep

0.9mA

Deep Sleep

20uA

Off

0.5uA

Power Save Mode

(2.4G)

(Low Power Listen

disabled) ¹

DTIM period

Current Cons. (mA)

T1 (ms)

T2 (ms)

Tbeacon (ms)

(ms)

DTIM 1

1.2

2.01

0.36

0.99

0.39

DTIM 3

0.9

1.99

0.32

1.06

0.41

①: Modem-Sleep requires the CPU to be working, as in PWM or I2S applications. According to802.11

standards (like U-APSD), it saves power to shut down the Wi-Fi Modem circuit whilemaintaining a Wi-Fi

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connection with no data transmission. E.g. in DTIM3, to maintain a sleep 300mswake 3ms cycle to receive AP’s

Beacon packages, the current is about 15mA.

②: During Light-Sleep, the CPU may be suspended in applications like Wi-Fi switch. Without

datatransmission, the Wi-Fi Modem circuit can be turned off and CPU suspended to save poweraccording to the

802.11 standard (U-APSD). E.g. in DTIM3, to maintain a sleep 300ms-wake 3mscycle to receive AP’s Beacon

packages, the current is about 0.9mA.

③: Deep-Sleep does not require Wi-Fi connection to be maintained. For application with long timelags

between data transmission, e.g. a temperature sensor that checks the temperature every 100s,sleep 300s and

waking up to connect to the AP (taking about 0.3~1s), the overall average current isless than 1mA.

5.2 RF Performance

Table -5. RF Performance

Description

Min

Typ

Max

Unit

Input frequency

2400

2483.5

MHz

Input impedance

ohm

Input reflection

-10

PA output power at 72.2

Mbps

15.5

16.5

17.5

dBm

PA output power in 11b

mode

19.5

20.5

21.5

dBm

Sensitivity

CCK，1Mbps

-98

dBm

CCK，11Mbps

-91

dBm

6Mbps（1/2 BPSK）

-93

dBm

54Mbps（3/4 64-QAM）

-75

dBm

HT20，MCS7（65Mbps，

72.2Mbps）

-72

dBm

Adjacent channel rejection

OFDM，6Mbps

OFDM，54Mbps

HT20，MCS0

HT20，MCS7

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5.3 Digital Terminal Characteristics

Table -6. Digital Terminal Characteristics

Terminals

Symbol

Min

Max

Unit

Input logic level low

VIL

-0.3

0.25 VDD

Input logic level high

VIH

0.75 VDD

VDD + 0.3

Output logic level low

VOL

0.1 VDD

Output logic level high

VOL

0.8 VDD

5.4 Absolute Maximum Ratings

Table -7. Absolute Maximum Ratings

Rating

Condition

Value

Unit

Storage temperatue

-40 to 125

°C

Maximum soldering

temperature

260

°C

Supply voltage

IPC/JEDEC J-STD-020

+3.0 to +3.6

5.5 Reflow Profile

Table -8. Reflow Profile

Indicator

Value

Ramp-up Rate (TS Max to TL)

3 °C /second max.

Prehea

Temperature Min. (TS Min.)

Temperature Typ. (TS Typ.)

Temperature Min. (TS Max.)

Time (TS)

150°C

175°C

200°C

60 ~ 180 seconds

Ramp-up Rate (TL to TP)

3°C /second max

Time maintained above: Temperature

(TL)/Time (TL)

270°C / 60 ~ 150 seconds

Peak temperature (TP)

260 °C max, for 10 seconds

Target Peak Temperature (TP Target)

260 °C + 0 / -5°C

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Time within 5°C of actual Peak Temperature

(TP)

20 ~ 40 seconds

TS max to TL (Ramp-down Rate)

6°C / second max.

Time 25°C to Peak Temperature (t)

8 minutes max.

6. Minimum System Requirements

Figure -6. ESP8266-S3 minimum system

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7. Switching noise control

ESP8266-S3 has high speed GPIO and peripheral interfaces which can create severe switching noise. In

applications where power consumption and EMI profile are important, it is recommended that a series resistor of

10-100 ohms be placed with digital I/O. This limits overshoot during switching and results in smoother transitions.

A series resistor may also protect from ESD to some extents.

8. Technical Support

E-mail:technical@hysiry.com

FCC Caution: Any changes or modifications not expressly

approved by the party responsible for compliance could void the user's authority to operate this equipment.

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired operation. This

device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter.

15.105 Information to the user.

(b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or

similar statement, placed in a prominent location in the text of the manual:

Note: This equipment has been tested and found to comply

with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.

These limits are designed to provide reasonable protection against harmful

interference in a residential installation. This equipment generates, uses and

can radiate radio frequency energy and, if not installed and used in

accordance with the instructions, may cause harmful interference to radio

communications. However, there is no guarantee that interference will not

occur in a particular installation. If this equipment does cause harmful

interference to radio or television reception, which can be determined by

turning the equipment off and on, the user is encouraged to try to correct the

interference by one or more of the following measures:

—Reorient or relocate the receiving antenna.

—Increase the separation between the equipment and receiver.

—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

—Consult the dealer or an experienced radio/TV technician for help.

The availability of some specific channels and/or operational frequency bands are country dependent and

are firmware programmed at the factory to match the intended destination.

The firmware setting is not accessible by the end user.

The final end product must be labelled in a visible area with the following:

Contains Transmitter Module FCC ID:2AKBPESP8266-S3. .

FCCRadiationExposureStatement:

ThisequipmentcomplieswithFCCradiationexposurelimitssetforthforanuncontrolledenvironment.

Thisequipmentshouldbeinstalledandoperatedwithminimumdistance20cmbetweentheradiator&

yourbody.

OEMINTEGRATIONINSTRUCTIONS:

ThisdeviceisintendedonlyforOEMintegratorsunderthefollowingconditions:

Themodulemustbeinstalledinthehostequipmentsuchthat20cmismaintainedbetweenthe

antennaandusers,andthetransmittermodulemaynotbeco‐locatedwithanyothertransmitteror

antenna.Themoduleshallbeonlyusedwiththeinternalon‐boardantennathathasbeenoriginally

testedandcertifiedwiththismodule.Externalantennasarenotsupported.Aslongasthese3

conditionsabovearemet,furthertransmittertestwillnotberequired.

However,theOEMintegratorisstillresponsiblefortestingtheirend‐productforanyadditional

compliancerequirementsrequiredwiththismoduleinstalled(forexample,digitaldeviceemissions,PC

peripheralrequirements,etc.).Theend‐productmayneedVerificationtesting,Declarationof

Conformitytesting,aPermissiveClassIIChangeornewCertification.PleaseinvolveaFCCcertification

specialistinordertodeterminewhatwillbeexactlyapplicablefortheend‐product.

Hysiry Technology ESP8266-S3 ESP8266-S3 User Manual

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