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| Document ID | 3594791 |
| Application ID | cF6vEI/UfQ5vPhNLNH9PlQ== |
| Document Description | User Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 101.23kB (1265428 bits) |
| Date Submitted | 2017-10-06 00:00:00 |
| Date Available | 2017-10-06 00:00:00 |
| Creation Date | 2017-09-15 10:59:20 |
| Producing Software | Microsoft® Office Word 2007 |
| Document Lastmod | 2017-09-29 11:32:21 |
| Document Title | User Manual |
| Document Creator | Microsoft® Office Word 2007 |
| Document Author: | Wang Beiduo-B42756 |
Version 1.0
2017 / 9
Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANYWARRANTY OF
MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULARPURPOSE, OR ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATIONOR SAMPLE. All liability, including liability for
infringement of any proprietary rights, relating to useof information in this document is disclaimed. No licenses
express or implied, by estoppel orotherwise, to any intellectual property rights are granted herein.
The WiFi Alliance Member Logo is a trademark of the WiFi Alliance.
All trade names, trademarks and registered trademarks mentioned in this document are property oftheir
respective owners, and are here by acknowledged.
Note
As the product upgrade or other reasons, this manual may change. Shenzhen Hysiry Technology Co., Ltd has
right to modify the contents of this manual without any notice or warning. This manual is only as a guide,Hysiry
Technology Co., Ltd Spareno effort to provide accurate information in this manual, but the Hysiry can't guarantee
manual there is no problem , all statements in this manual, information and suggestions do not constitute any
guarantee of express or implication.
Amendment record
Time
Version
Specification
2017.09
V1.0
First release
Shenzhen Hysiry Technology Co.,Ltd
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Contents
1. Overview.......................................................................................................................................................... 4
2. Main Features .................................................................................................................................................. 4
2.1 System Diagram ......................................................................................................................................... 4
2.2 Hardware Specifications ............................................................................................................................ 5
3. Pin description ................................................................................................................................................. 6
4. Functional Description..................................................................................................................................... 7
4.1 MCU ........................................................................................................................................................... 7
4.2 Memory ..................................................................................................................................................... 7
4.2.1 Internal SRAM and ROM..................................................................................................................... 7
4.2.2 SPI Flash .............................................................................................................................................. 7
4.3 Interface Description ................................................................................................................................. 8
5. Electrical Characteristic ................................................................................................................................... 9
5.1 Standby Power Consumption .................................................................................................................... 9
5.2 RF Performance ....................................................................................................................................... 10
5.3 Digital Terminal Characteristics ............................................................................................................... 11
5.4 Absolute Maximum Ratings .................................................................................................................... 11
5.5 Reflow Profile .......................................................................................................................................... 11
6. Schematics ..................................................................................................................................................... 12
7. Minimum System Requirements ................................................................................................................... 12
8. Switching noise control ................................................................................................................................. 13
9. Technical Support .......................................................................................................................................... 13
Shenzhen Hysiry Technology Co.,Ltd
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1. Overview
ESP8266-S3 Wi-Fi module is a low consumption, high performance Wi-Fi network control module designed
by Hysiry. It can meet the IoT application requirements in smart power grids, building automation, security and
protection, smart home, remote health care etc.
The module's core processor ESP8266 integrates an enhanced version of Tensilica's L106 Diamond series 32bit processor with smaller package size and 16 bit compact mode, main frequency support 80 MHz and 160 MHz,
support RTOS, integrated Wi-Fi MAC / BB / RF / PA / LNA, on-board PCB antenna.
The module supports standard IEEE802.11 b / g / n protocol, a complete TCP / IP protocol stack.
Users can use the module to add networking capabilities to existing devices, but also to build an independent net
work controller.
Figure -1.ESP8266-S3 Module
2. Main Features
2.1 System Diagram
VDD_MCU
VDD_MCU
VDD33
VDD33
26MHz
26MHz
XTAL
XTAL
22 ΧΧ UART
UART
11 ΧΧ I2S
I2S
11 ΧΧ I2C
I2C
11 ΧΧ ADC
ADC
8Mbit
8Mbit
SPI
SPI FLASH
FLASH
ESP8266
ESP8266
11 ΧΧ SPI
SPI
11 ΧΧ IR
IR
GPIO
GPIO
ESP8266-S3
Figure -2. System Diagram
Shenzhen Hysiry Technology Co.,Ltd
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2.2 Hardware Specifications
Operating Voltage: 3.3V（3.0 ~ 3.6V）
Operating Temperature：-40 - 85°C
CPU Tensilica L106
RAM
50KB（Available）
Flash
8 Mbit
System
802.11 b/g/n
Frequency range 2.4 GHz ~ 2.5 GHz（2400 M ~ 2483.5 M）
IntegratedTensilica L106 ultra-low power 32-bitmicro MCU, with 16-bit RSIC. The CPU clock speed
is 80MHz. It can also reach a maximum value of 160MHz.
WIFI 2.4 GHz，supportWPA/WPA2
Supports UART、I2C、GPIO、PWM、SDIO、SPI、ADC、PWM、IR
Integrated 10 bit high precision ADC
Supports TCP、UDP、HTTP、FTP
Integrated TR switch, balun,LNA, Power amplifier and matching network
Integrated PLL, Regulator and power source management components, +20 dBm output power in
802.11b mode
Average working current80mA,
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