Ingenico GPRS ELITE 790 GPRS POINT OF SALE TERMINAL User Manual USERS MANUAL 2

Ingenico ELITE 790 GPRS POINT OF SALE TERMINAL USERS MANUAL 2

Contents

USERS MANUAL 2

GSM/GPRSEmbedded Data/Fax/Voice Wireless Modem MTMMC-G-F1 MTMMC-G-F2Developer’s Guide
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 2ModemModule Developer’s GuideMTMMC-G-F1 and MTMMC-G-F2PN S000295A, Version A07/15/03CopyrightThis publication may not be reproduced, in whole or in part, without prior expressed written permission fromMulti-Tech Systems, Inc. All rights reserved.Copyright © 2003, by Multi-Tech Systems, Inc.Multi-Tech Systems, Inc. makes no representations or warranties with respect to the contents hereof andspecifically disclaims any implied warranties of merchantability or fitness for any particular purpose. Furthermore,Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time inthe content hereof without obligation of Multi-Tech Systems, Inc. to notify any person or organization of suchrevisions or changes.RevisionsRevision Level Date DescriptionA07/15/03 First release.PatentsThis device is covered by patent number 5,673,268.TrademarksTrademarks of Multi-Tech Systems, Inc. are ModemModule and the Multi-Tech logo.MNP and Microcom Network Protocol are registered trademarks of Microcom, Inc.Microsoft, Windows, Windows 95, and Windows NT are either registered trademarks or trademarks of MicrosoftCorporation in the United States and/or other countries.World HeadquartersMulti-Tech Systems, Inc.2205 Woodale DriveMounds View, Minnesota 55112Phone: 763-785-3500 or 800-328-9717Fax: 763-785-9874Technical SupportCountry By Email By PhoneFrance: support@multitech.fr (33) 1-64 61 09 81India: support@multitechindia.com 91 (124) 6340778U.K.: support@multitech.co.uk (44) 118 959 7774U.S. and Canada: oemsales@multitech.com (800) 972-2439Rest of the World: oemsales@multitech.com (763) 717-5863Internet Address: http://www.multitech.com
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 3Table of ContentsCHAPTER 1 – PRODUCT DESCRIPTION AND SPECIFICATIONS ................................................................5INTRODUCTION ...........................................................................................................................................................5Scope of the Developer Guide ................................................................................................................................5GENERAL CHARACTERISTICS ......................................................................................................................................6General...................................................................................................................................................................6Electrical ................................................................................................................................................................6Mechanical .............................................................................................................................................................6FEATURE DETAILS ......................................................................................................................................................6Telephony ...............................................................................................................................................................6Short Message Service (GSM and GPRS mode).....................................................................................................6GSM Circuit Data Features ...................................................................................................................................7GPRS Packet Data Features ..................................................................................................................................7GSM Supplementary Services.................................................................................................................................7Other Features .......................................................................................................................................................7Interfaces................................................................................................................................................................7FEATURE DESCRIPTIONS .............................................................................................................................................8APPLICATIONS ............................................................................................................................................................9MECHANICAL DESIGN OVERVIEW ............................................................................................................................10CHAPTER 2 – MECHANICAL SPECIFICATIONS............................................................................................11MECHANICAL DIMENSIONS.......................................................................................................................................11CLIMATIC AND MECHANICAL ENVIRONMENT TESTING COMPLIANCE ......................................................................12CHAPTER 3 – ELECTRICAL CHARACTERISTICS.........................................................................................13INTRODUCTION .........................................................................................................................................................1350-PIN CONNECTOR INTERFACES..............................................................................................................................1450-Pin Connector Description..............................................................................................................................14Power Supply........................................................................................................................................................17Serial Link ............................................................................................................................................................19ON / ~OFF Interface ............................................................................................................................................20BOOT ...................................................................................................................................................................22Reset Signal (~RST)..............................................................................................................................................22Flashing LED .......................................................................................................................................................23General Purpose Input/Output .............................................................................................................................24Analog to Digital Converter.................................................................................................................................24Audio Interface.....................................................................................................................................................25SIM interface ........................................................................................................................................................29SPI Bus .................................................................................................................................................................31Keypad Interface ..................................................................................................................................................31CHAPTER 4 – INTERFACES .................................................................................................................................32FLASHING LED.........................................................................................................................................................32SIM INTERFACE........................................................................................................................................................32RF INTERFACE ..........................................................................................................................................................33RF Connector .......................................................................................................................................................33RF Performances..................................................................................................................................................33DTE/DCE INTERFACE RATES...................................................................................................................................33CHAPTER 5 – TEST BOARD .................................................................................................................................34SERIAL TEST/DEMO BOARD COMPONENTS...............................................................................................................34SERIAL TEST/DEMO BOARD BLOCK DIAGRAM .........................................................................................................35SIM Schematic (5V)..............................................................................................................................................36CHAPTER 6 – APPLICATION CONSIDERATIONS..........................................................................................37
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 4GENERAL GUIDELINES FOR THE USE OF THE MODEMMODULE.................................................................................37Hardware and RF.................................................................................................................................................37The Antenna..........................................................................................................................................................37Firmware Upgrade...............................................................................................................................................37Initial Configuration Using Mobile PhoneTools..................................................................................................37Getting Started .....................................................................................................................................................38REFERENCE DOCUMENTS..........................................................................................................................................39RELATED MANUALS .................................................................................................................................................39ADDITIONAL INFORMATION......................................................................................................................................40APPENDIX A – SAFETY PRECAUTIONS & REGULATORY STANDARDS COMPLIANCE....................41SAFETY PRECAUTIONS..............................................................................................................................................41RF Safety ..............................................................................................................................................................41General Safety ......................................................................................................................................................42Safety Standards...................................................................................................................................................42RF Exposures .......................................................................................................................................................43Instructions to OEMs............................................................................................................................................43REGULATORY STANDARDS COMPLIANCE .................................................................................................................44GSM compliance ..................................................................................................................................................44FTA Compliance...................................................................................................................................................45APPENDIX B – SOURCING GUIDE FOR CONNECTORS AND PERIPHERAL DEVICES........................46WHERE TO FIND SMD CONNECTORS........................................................................................................................46GSM ANTENNA........................................................................................................................................................47SIM CARD HOLDER..................................................................................................................................................47APPENDIX C – AT COMMAND LIST ..................................................................................................................48APPENDIX D – ACRONYMS AND ABBREVIATIONS .....................................................................................53INDEX ........................................................................................................................................................................54LIST OF TABLES...................................................................................................................................................57
Chapter 1 – Product Description & SpecificationWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 5Chapter 1 – Product Description and SpecificationsIntroductionModemModule GSM/GPRS integrated wireless modems provide a quick and easy way to insert GSM and GPRSfunctionality into systems and terminals. Available in dual-band configurations, this fully type approved integratedmodem constitutes a self-contained, fully integrated implementation of the GSM/GPRS standard. Thanks tostandard interfaces, it can be integrated into any system. It is ready for voice, SMS, data and fax. ModemModuleGSM/GPRS is a product with a single connector, which puts together all interface signals in order to facilitate itsintegration. It has an integrated SIM connector as well as a standard RF connector type MMCX. For systemintegrators, ModemModule GSM/GPRS is the fast track to the wireless world.Figure 1-1: MultiTech’s Wireless ModemModule GSM/GPRSProduct Description RegionMTMMC-G-F1 GSM/GPRS Class 10, 900/1800 MHz GlobalMTMMC-G-F2 GSM/GPRS Class 10, 850/1900 MHz GlobalThe MTMMC-G-F1 and MTMMC-G-F2 ModemModules are used to integrate wIreless data and faxcommunications in numerous embedded applications.Scope of the Developer GuideThis document describes the hardware interface and the technical specifications of the ModemModuleGSM/GPRS wireless modems. The integrated modem is referred to as ModemModule GSM/GPRS according tothe GSM/GPRS 900 standard, the GSM/GPRS 1800 standard and the GSM/GPRS 1900 standard. This productis based on a Dual Band RF module: every integrated modem referenced ModemModule GSM/GPRS-G900/1800 includes a GSM 900/1800 MHz module and every integrated modem referenced ModemModuleGSM/GPRS-G850/1900 includes a GSM 850/1900 MHz module. These two dual-band modems have the samespecifications unless otherwise specified.
Chapter 1 – Product Description & SpecificationWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 6General CharacteristicsGeneral· GPRS Class 10· Dual Band GSM/GPRS modem E-GSM 900/1800 or GSM 850/1900· 2W at 850MHz· 1W at 1800/1900 MHz· GSM Class 1 and Class 2 Group 3 FAX· Small size and low power consumption· Voice and Short Message Services (SMS)· Fax and data transmission without extra hardware· Serial interface supports DTE speeds up to 115.2K· MMCX connector and SIM socket· 14.4K GSM circuit-switched data· Tricodec (FR/EFR/HR)· Internal 3V SIM interface· Easy remote control by AT commands for dedicated applications· Fully Type Approved according to GSM Phase 2+ specifications· Board-to-board or board-to-cable mounting· Fully shielded and ready-to-useElectrical· Power supply: 5 VDC +/- 5% 1AMechanical· Absolute maximum dimension: 46 x 64 x 12 mm· Weight: 79 g· Casing: Complete shielding-stainless steel/zinc· Mounting: 4 screw holes· Operating temperature range: -30°C to + 60°C· Storage temperature: -35°C to +85°CFeature DetailsTelephony· Telephony (TCH/FS) & Emergency calls· Full Rate, Enhanced Full Rate and Half Rate· Dual Tone Multi Frequency function (DTMF)Short Message Service (GSM and GPRS mode)· Text and PDU· Point to point MT & MO· SMS Cell Broadcast
Chapter 1 – Product Description & SpecificationWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 7GSM Circuit Data Features· Data circuit asynchronous, transparent and non transparent up to 14,400· bits/s· Automatic fax group 3 (Class 1 & 2)· Alternate speech and fax· MNP2, V.42bis data compressionGPRS Packet Data Features· GPRS Class 10· Coding Schemes: C1S1 to CS4GSM Supplementary Services· Call Forwarding· Call Barring· Multiparty· Call Waiting and Call Hold· Calling Line Identity· Advice of Charge· USSD· Closed User Group· Explicit Call TransferOther Features· ME+SIM phone book management· Fixed Dialing Number· SIM Toolkit Class 2· SIM, network and service provider locks· Real Time Clock· Alarm management· Software upgrade through Xmodem protocol· UCS2 character set managementInterfacesSingle antenna interfaceInternal SIM interface: 3V onlyExternal SIM interface: 3V or 5VFor Data Operation:Serial linkRemote control by AT commands (GSM 07.07 and 07.05)Baud rate from 300 to 115,200 bits/sFrom 300 up to 38400 bits/s with autobaudingThe integrated modem has a sole 50-pin connector, which gathers all the interface signals in order to facilitate itsintegration. It has an integrated SIM card holder as well as a standard RF connector type MMCX. The conceptof the integrated modem has been defined to integrate on a sole device:· a single connector has been used that is standard and easy to find (it is supplied worldwide);this connector includes all of the modem’s analog and digital connections· One standard easy to find RF connector. See RF connector section in Chapter 3: ElectricalCharacteristics;· One SIM card holder. See SIM section in Chapter 3: Electrical Characteristics.
Chapter 1 – Product Description & SpecificationWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 8Feature DescriptionsIntegration Reduces Space, Power and Cost. The ModemModule GSM/GPRS integrates thecontroller, RF transceiver, and antenna interface in one compact unit. This integration requires low power,occupies very little space, and provides an overall reduction in costs.Reduces Development Time. The ModemModule GSM/GPRS can make your existing and nextgeneration device, machine, or system, communication-ready without requiring significant hardwarechanges to its design. It actually provides faster time-to-market because it relieves the burden and expenseof obtaining network and RF approvals. This complete, ready-to-integrate wireless module allows you toenhance your product while you focus on developing its core features.Voice Features. The ModemModule GSM/GPRS provides telephony and Dual Tone Multi Frequency (DTMF)functionality. It also allows for emergency calls as well as full rate, enhanced Full Rate and Half Rate(FR/EFR/HR).Short Message Services. The ModemModule GSM/ GPRS offers SMS features such as text and PDU, point-to-point (MT/MO) and cell broadcast.Compatible Supplementary Services. The ModemModule GSM/GPRS is compatible with supplementaryservices such as call forwarding, call barring, multiparty, call waiting and call hold, calling line identification,advice of charge, USSD, closed user group and explicit call transfer.Management Features. The ModemModule GSM/ GPRS provides advanced management features includingphone book management, fixed dialing number, real time clock and alarm management.Industry-standard Modem Commands. The ModemModule GSM/GPRS provides industry-standardAT-style commands for ease of integration into your existing software application.ModemModule Pin-Out. The ModemModule GSM/ GPRS interfaces easily with existing productsthrough a standard serial communication channel. The complete on-board RF transceiver interfaces withan antenna for direct connection to wireless SMS, circuit-switched dial-up, or packet data networks. TheModemModule is a Data Terminal Equipment (DTE) device with serial asynchronous protocol support. Theserial DTE channel is capable of transfer speeds to 115.2K bps and can be interfaced directly to a UARTor microcontroller. It can be board-to-board or board-to-cable mounted.Network and RF Approved. The ModemModule GSM/ GPRS has been tested and certified withwireless telecom network providers worldwide. In addition, it has successfully completed worldwidecomplianceDeveloper’s Kit. The ModemModule GSM/GPRS Developer’s Kit allows you to plug in theModemModule and use it for testing, programming and resolving application issues.
Chapter 1 – Product Description & SpecificationWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 9ApplicationsWith circuit switched data rates up to 14.4K bps, the MultiModem GSM/GPRS is targeted at applications thatperiodically need to send or receive data over a wireless network. It is an ideal device for:Appliances Remote DiagnosticsATM Terminals Remote MeteringAutomotive Security SystemsData Collection Vending/GamingMachinesGas Pumps Other devices requiringwireless connectivity.Industrial and MedicalRemote MonitoringSystemsNote: The WirelessMultiModem must bemounted with at least 8inches (20 cm) of clearancefrom the human body.
Chapter 1 – Product Description & SpecificationWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 10Mechanical Design OverviewThe ModemModule is encased as shown in the figure below. It includes a RF module, a 50-pin connector, a SIMholder and a RF connector.Interface ConnectorFigure 1-2: Mechanical Description AHoles for MountingScrews (4)Hole dia. = 0.087”SIM ReaderAntenna Connector(MMCX type)SIM ejection buttonFigure 1-3: Mechanical Description BFour screw holes allow the ModemModule to be fixed on the mother PCB. The ModemModule can be mountedindifferently on both sides (top or bottom). For further details see Chapter 2: Mechanical Specifications.
Chapter 2 – Mechanical SpecificationsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 11Chapter 2 – Mechanical SpecificationsMechanical DimensionsFigure 2-1: ModemModule Dimensions
Chapter 2 – Mechanical SpecificationsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 12Climatic and Mechanical Environment Testing ComplianceTable 2-1 : Climatic and Mechanical Environment Testing ComplianceG900/G1800 EnvironmentalType of Test Standards StorageClass 1.2TransportationClass 2.3Operating (Port Use)Class 7.3Cold IEC 68-2.1Ab test-25O C; 72 hours -40O C; 72 hours -20O C (GSM); 16 hours-10O C (DCS) 16 hoursDry Heat IEC 68-2.2Bb test+70O C; 72 hours +70O C; 72 hours +55O C; 16 hoursChange ofTemperatureIEC 68-2.14;Na/Nb test -40O/+30O C; 5 cycles t1 = 3 hours-20O/+30O C (GSM); 3 cycles-10O/+30O C (DCS); 3 cycles t1 = 3 hoursDamp HeatCyclicIEC 68-2.30;Db test +30O C; 2 cycles90% - 100% RHvariant 1+40O C; 2 cycles90% - 100% RHvariant 1+40O C; 2 cycles90% - 100% RHvariant 1Damp Heat IEC 68-2.56Cb test+30O C; 4 days +40O C; 4 days +40O C; 4 daysSinusoidalVibrationIEC 68-2.6Fc test5 - 62 Hz : 5 mm/s62 – 200 Hz: 2 m/s23 x 5 sweep cyclesRandomVibrationIEC 68-3.36Fdb test5 – 20 Hz: 0.96 m2/s320 – 500 Hz: -3 dB/ oct3 x 10 min10 – 12 Hz: 0.96 m2/s312 – 150 Hz: -3 dB/ oct3 x 30 min
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 13Chapter 3 – Electrical CharacteristicsIntroductionThis chapter describes the ModemModule’s electrical interfaces. These are:· interfaces on the 50-pin general purpose connector (power and data/signaling)· RF interface· SIM interface
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 1450-Pin Connector Interfaces50-Pin Connector DescriptionTable 3-1. 50-pin Connector DescriptionPin # Name I/O I/O Type Description Comment1 GND GROUND High current2 GND GROUND High current3 +5V Supply High current4 +5V Supply High current5 CT109/DCD O CMOS/2X Data Carrier Detect6 GND GROUND High current7 GPI04 I/O CMOS/2X General Purpose I/O8 SPK2N O Analog Speaker 2 negative output9 CT125/RI O CMOS/2X Ring Indicator10 SPK2P O Analog Speaker 2 positive output11 Flashing LED I/O CMOS/2X Working mode indicationLEDDriven bymodule12 SPK1P O Analog Speaker 1 positive output13 CT106/CTS O 1X Clear to Send14 SPK1N O Analog Speaker 1 negative output15 ON/~OFF I Power ON/OFF control ON = Vcc16 MIC2P I Analog Microphone 2 positiveinput17 AUXV0 I Analog Auxiliary ADC input18 MIC2N I Analog Microphone 2 negativeinput19 ~RST I Reset active low Open Collector20 MIC1P I Analog Microphone 1 positiveinput21 GND I Ground22 MIC1N I Analog Microphone 1 negativeinput23 BOOT I BOOT Open Collector24 GND GROUND High Current25 CT103/TX I Transmit Data Pull up with100K-ohmwhen not used
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 15Table 3-1. 50-Pin Connector Description (Continued)Pin # Name I/O I/O Type Description Comment26 GPIO0 I/O CMOS/2X General Purpose I/O27 CT107/DSR O 1X Data Set Ready28 CT104/RX O 1X Receive Data29 CT108-2/DTR I Data Terminal Ready Pull up with100K-ohmwhen not used30 CT105/RTS I Request to Send Pull up with100K-ohmwhen not used31 COL3 I/O 1X Keypad column32 COL4 I/O 1X Keypad column33 COL1 I/O 1X Keypad column34 COL2 I/O 1X Keypad column35 ROW4 I/O 1X Keypad row36 COL0 I/O 1X Keypad column37 ROW2 I/O 1X Keypad row38 ROW3 I/O 1X Keypad row39 ROW0 I/O 1X Keypad row40 ROW1 I/O 1X Keypad row41 NC Not Connected42 SPI_EN O 1X SPI enable43 SPI_IO I/O 1X I2C Data or SPI Data44 SPI_CLK O 2X I2C Clock or SPI Clock45 SIMCLK O 2X Clock for SIM interface 3V mode46 SIMRST O 2X Reset for SIM interface 3V mode47 SIMVCC O SIM card supply 3V mode6mA max.48 SIMPRES I SIM card detect Connected toSIM connectorpin 8. Pin 4 ofSIM connectormust be pulleddown to GNDwith 1 K-Ohm*49 SIMDATA I/O 3X I/O for SIM interface 3V mode50 GPO0 General purpose I/O* See SIM socket diagram in SIM interface section** GPO0 is a general purpose output for selection of external SIM, 3V or 5V.
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 16Table 3-2. Operating ConditionsParameter I/O Type Min Max ConditionVinput low CMOS -0.5V 0.8VVinput high CMOS 2.1V 3.0V1X 0.2V IOL = -1mA2X 0.2V IOL = -2mAVoutput low3X 0.2V IOL = -3mA1X 2.6V IOH = 1mA2X 2.6V IOH = 2mAVoutput high3X 2.6V IOH = 3mAFigure 3-1: 50-Pin Connector
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 1750 4921Figure 3-2: Pin Numbering – Bottom ViewPower SupplyThe main power supply is provided through a double connection. These connections are respectively pins 3 and4 for the +5V and the pins 1 and 2 for the ground (GND). The pins 6, 21, and 24 are also ground connection inorder to produce a proper ground plane.A 5V +/-5% - 1A power is strictly required to supply the modem. Otherwise, serious dysfunctions may appear.However, the modem does not have to constantly deliver 1A current at 5V on this power supply.This power supply is internally regulated to a nominal value VBATT.Table 3-3: Power Supply Pin DescriptionPin Number Name Description Comment1 GND Ground High Current2 GND Ground High Current3 +5V Ground High Current4 +5V Ground High Current6 GND Ground High Current21 GND Ground High Current24 GND Ground High CurrentTable 3-4: Power Consumption in EGSM-only mode @25 degrees CConditions INOM IMAX+5V During TX bursts @2W 810 mA 1 A+5V Average @ 2W 310 mA 370 mA+5V Average @ ).5W 185 mA 200 mA+5V Average idle mode 22 mA 25 mA
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 18Table 3-5: Power Consumption in GSM-only 1800 & 1900 MHz modes @25 degrees CConditions INOM IMAX+5V During TX bursts @1W 635 mA 800 mA+5V Average @1W 260 mA 280 mA+5V Average @ 0.25W 150 mA 170 mA+5V Average idle mode 20 mA 22 mATable 3-6: Power Consumption in EGSM/GPRS 900 MHz and GSM/GRPS 850 MHz ModeClass 10Conditions INOM IMAX+5V During TX bursts @PcI5 1.7 A peak 2.0 A peak+5V During RX bursts 75 mA peak 80 mA peak+5V Average 1Rx/1Tx @PcI5 270 mA 320 mA+5V Average 1Rx/1Tx@PcI8 180 mA 200 mA+5V Average idle mode 100 mA 300 mA+5V Average GPRS CI 10 (3Rx/2Tx) @PcI5540 mA 640 mA+5V Average GPRS CI 10 (3Rx/2Tx) @PcI8360 mA 400 ma+5V Average Idle mode 2,2 mA 3 MaPower Control Level: PcI5=2W typ.; PcI8=0,5W typ.Table 3-7: Power Consumption in GSM/GRPS 1800 MHz and GSM/GRPS 1900 MHzClass 10Conditions INOM IMAX+5V During TX bursts @PcI0 1.3 A peak 1.7 A peak+5V During RX bursts 75 mA peak 80 mA peak+5V Average 1Rx/1Tx @PcI5 240 mA 270 mA+5V Average 1Rx/1Tx@PcI8 150 mA 180 mA+5V Average idle mode 100 mA 300 mA+5V Average GPRS CI 10 (3Rx/2Tx) @PcI5480 mA 540 mA+5V Average GPRS CI 10 (3Rx/2Tx) @PcI8300 mA 360 Ma+5V Average Idle mode 2,2 mA 3 MaPower Control Level: PcI0=1W typ; PcI3=0,25W typ
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 19Serial LinkA serial link interface is available complying with V24 protocol signaling but not with V28 (electrical interface) dueto a 2.8 Volts interface. TX, RTS and DTR can be either 5V or 3V.The signals are Tx data (CT103/TX), Rx data (CT104/RX), Request To Send (CT105/RTS), Clear To Send(CT106/CTS), Data Terminal Ready (CT108-2/DTR) and Data Set Ready (CT107/DSR).The set of RS232 signals can be required for GSM DATA services application. The 2 additional signals are DataCarrier Detect (CT109/DCD) and Ring Indicator (CT125/RI).Table 3-8: Serial Link Pin DescriptionSignal Pin Number I/O I/O Type* DescriptionCT103 / TX 25 I CMOS Transmit serial dataCT104 / RX 28 O 1X Receive serial dataCT105 / RTS 30 I CMOS Ready to sendCT106 / CTS 13 O 1X Clear to sendCT107 / DSR 27 O 1X Data set readyCT108-2 / DTR 29 I CMOS Data terminal readyCT109 / DCD 5 O CMOS / 2X Data carrier detectCT125 / RI 9 O CMOS / 2X Ring indicator* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 20Modem Te rm in a lLevel ShifterVccRIDCDRXCTSDSRDTRTXRTSVcc28251324232219171621201813C1+C1-C2+T1INT2INT3INT4INT5INR1OUTBR2OUTR3OUTR4OUTONC2-T1OUTT2OUTT3OUTT4OUTT5OUTR1INR2INR3INERROROFF272264567101289111514S_RIS_DCDS_RXS_CTSS_DSRS_DTRS_TXS_RTSVccVccGNDVccGNDMAX 3238*Th is appli cation n ote i s valid for Vcc> 3.0 Volt (see MAX 3 238 sp ecification s)Auto shut d own mode is no t used in th is exa mp le.Figure 3-3: Level Shifter Application Diagram for Serial LinkON / ~OFF InterfaceThis input is used to switch ON or OFF the ModemModule. A high level signal has to be provided on theON/~OFF pin to switch on the modem. The level of the voltage of this signal has to be maintained to VCC duringa minimum time of 1 second. When powered off, the shutdown current is roughly 60 microAmperes.Table 3-9: ON / OFF Pin DescriptionSignal Pin Number I/O I/O Type* DescriptionON / ~OFF 15 I CMOS Module Power ON/OFF
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 21Power OFF ProcedureIn order to power OFF the ModemModule, switch it OFF both via software (AT+CPOF; see AT CommandManual for more details) and via hardware line. See the diagrams below.ON/~OFFAT +C P O FSerial Linkto ModemModuleOK res p o nseSerial LinkfromModem ModuleAbout500 msMo de m Mod ul eStat u s ___ONOFF___Figure 3-4: Power-Off Procedure 1ON /~ O FFAT+ CP O FSeria l Li nkto ModemModuleOK responseSeria l Li nkfromModemModule ___ONOF F__ _About500 msModemModuleStat usAbout500 msFigure 3-5: Power-Off Procedure 2
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 22BOOTThis input is used to switch the ModemModule into download mode (backup procedure). The internal bootprocedure is started when this pin is low during the power ON of the module. In normal mode, this pin has to beleft open. If used, this input has to be driven by an open collector or an open drain. See below an example ofapplication diagram. See also the “Firmware Upgrade” section of Chapter 5: Application Considerations.BOOT : Pin 23Switch BOOTFigure 3-6: Boot ProcedureIf Switch Boot = 1, Boot pin 23 = 0, to download modeIf Switch Boot = 0, Boot pin 23 = 1, to normal modeTable 3-10: BOOT Pin DescriptionSignal Pin Number I/O I/O Type* DescriptionBOOT 23 I CMOS SW downloading* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.Reset Signal (~RST)This signal is used to force a reset of the ModemModule. It has to be used by providing low level duringapproximately 2ms. This signal has to be considered as an emergency reset only. A reset procedure is alreadydriven by an internal hardware during the power-up sequence.This signal can also be used to provide a reset to an external device. If no external reset is necessary this inputcan be left open. If used (emergency reset), it has to be driven by an open collector or an open drain. See belowan example of application diagram.Reset : Pin 23Switch ResetFigure 3-7: Reset ProcedureIf switch Reset = 1, Reset pin 19 = 0If switch Reset = 0, Reset pin 19 = 1
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 23Table 3-11: Reset Signal Pin DescriptionSignal Pin Number I/O I/O Type* Description~RST 19 I/O Module reset* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.Table 3-12: Reset Signal Electrical CharacteristicsParameter Min Max UnitInput Impedance ( R ) 4.7 kilo-ohmsInput Impedance ( C ) 10 nanofaradsTable 3-13: Reset Signal Operating ConditionsParameter Min Max Condition*VT- 1.1 V 1.2 V*VT+ 1.7 V 1.9 VVOL 0.4 V IOL = -50 microamperesVOH 2.0 V IOH = -50 microamperesVT-, VT+ hysteresis levelFlashing LEDThe flashing LED signal is used to indicate the working mode of the ModemModule.Table 3-14 : Flashing LED Pin DescriptionSignal Pin Number I/O I/O Type* DescriptionFlashing LED 11 I/O CMOS/2X Working modeindication LED* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.Table 3-15 : LED and ModemModule StatusLED Indication ModemModule StatusOFF Download mode or switched OFF.Permanent Switched ON, not registered on the network.ONFlash Switched ON, registered on the network.
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 24General Purpose Input/OutputThe ModemModule provides two General Purpose I/O connections. They can be used to control any externaldevice.Table 3-16 : General Purpose I/O Pin DescriptionSignal Pin Number I/O I/O Type* Description Default ValueGPIO0 26 I/O CMOS / 2X General Purpose I/O 0GPIO4 7 I/O CMOS / 2X General Purpose I/O 0* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.All digital I/O complies with 3Volts CMOS.You can access (write or read) the GPIO value via AT+WIOW and AT+WIOR. See AT Command manual formore details.Analog to Digital ConverterThe ModemModule has an Analog to Digital converter (ADC) input. This converter is a 10 bits one, ranging from0 to 2.5V. You can see the measurements via AT+ADC. See AT Command manual for more details.Table 3-17: A/D Converter Pin DescriptionSignal Pin Number I/O I/O Type* DescriptionAUXV0 17 I Analog A/D converter* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.Table 3-18: A/D Converter Electrical CharacteristicsParameter Min Max UnitResolution 10 bitsSampling Rate 90.3 KspsInput Signal Range 0 2.5V VoltsADC Reference Accuracy 0.5 %Integral Accuracy +/- 1 LSBDifferential Accuracy +/- 1 LSBInput Impedance ( R ) 10 mega-OhmsInput Impedance ( C ) 50 pico-Farads
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 25Audio InterfaceTwo different microphone inputs and two different speaker outputs are supported. The connection can be eitherdifferential or single-ended but using a differential connection in order to reject common mode noise and TDMAnoise is recommended.Microphone 2 InputsThe MIC2 inputs are differential ones. They already include the convenient biasing for an electret microphone(0,5 mA and 2 Volts). This electret microphone can be directly connected on these inputs. The impedance of themicrophone 2 has to be around 2K. These inputs are the standard ones for a handset design while MIC1 inputscan be connected to an external headset or a hands-free kit.The gain of MIC2 inputs is internally adjusted. The gain can be tuned from 30dB to 51dB. The connection to themicrophone is direct. The gain can be tuned using the AT+VGR command. See Appendix B: Sourcing Guide forConnectors and Peripheral Devices.MIC2NMIC2PC1C1 = 22pF to 100 pF33 pF recommendedFigure 3-8: Microphone 2 InputC1 has to be the nearest as possible to the microphone. Microphone manufacturers provide this capacitordirectly soldered on the microphone.Table 3-19: Microphone 2 Input Pin DescriptionSignal Pin Number I/O I/O Type* DescriptionMIC2P 16 I Analog Microphone 2 positive inputMIC2N 18 I Analog Microphone 2 negative input* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 26Microphone 1 InputsThe MIC1 inputs are differential and do not include internal bias. To use these inputs with an electretmicrophone, bias has to be generated outside the ModemModule according to the characteristic of this electretmicrophone. These inputs are the standard ones used for an external headset or a hands-free kit. When using asingle-ended connection, be sure to have a very good ground plane, a very good filtering as well as shielding inorder to avoid any disturbance on the audio path. The gain of MIC1 inputs is internally adjusted. The gain can betuned from 30dB to 51dB.The gain can be tuned using the AT+VGR command.C1C2R1R2R3R4Vcc analog power supply2.8 VMIC1PMIC1NDifferential ConnectionFigure 3-9: Microphone 1 InputR1 = R4 = from 100 to 330 .R2 = R3 = usually between 1K and 3.3K as per themicrophone characteristicsC1 = 22pF to 100pFC2 = 47µFR1 and R4 are used as a voltage supply filter with C2.C1 has to be the nearest possible to the microphone. Microphone manufacturers provide this capacitor directlysoldered on the microphone.Table 3-20: Microphone 1 Input Pin DescriptionSignal Pin Number I/O I/O Type* DescriptionMIC1P 20 I Analog Microphone 1 positive inputMIC1N 22 I Analog Microphone 1 negative input* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 27Speaker 2 OutputsSpeaker outputs SPK2 are push-pull amplifiers and can be loaded down to 50 Ohms and up to 1nF. Theseoutputs are differential and the output power can be adjusted by step of 2dB. The output can be directlyconnected to a speaker. When using a single-ended connection, be sure to have a very good ground plane, avery good filtering as well as shielding in order to avoid any disturbance on the audio path.SPK2P+C1Differential ConnectionSPK2PSPK2NSingle-Ended ConnectionFigure 3-10: Speaker 2 OutputC1 = from 100nF to 47µF as per the speaker characteristics and the output power.Using a single-ended connection also includes losing half of the output power compared to a differentialconnection.Table 3-21: Speaker 2 Output Pin DescriptionSignal Pin Number I/O I/O Type* DescriptionSPK2P 10 O Analog Speaker 2 positive outputSPK2N 8 O Analog Speaker 2 negative output* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 28Speaker 1 OutputsSpeaker outputs SPK1 are push-pull amplifiers and can be loaded down to 50 Ohms and up to 1nF. Theseoutputs are differential and the output power can be adjusted by step of 2dB. The output can be directlyconnected to a speaker. When using a single-ended connection, be sure to have a very good ground plane, avery good filtering as well as a shielding in order to avoid any disturbance on the audio path.SPK1P+C1Differential ConnectionSPK1PSPK1NSingle-Ended ConnectionFigure 3-11: Speaker 1 OutputC1 = from 100nF to 47µF as per the speaker characteristics.Using a single-ended connection also includes losing half of the output power compared to a differentialconnection.Table 3-22: Speaker 1 Output Pin DescriptionSignal Pin Number I/O I/O Type* DescriptionSPK1P 12 O Analog Speaker 1 positive outputSPK1N 13 O Analog Speaker 1 negative output* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 29SIM interfaceThe external SIM interface is available through the 50-pin connector in order to use a stand-alone SIMcardholder. 5V SIMs can be driven using an external level shifter.SIM line must not exceed 15 cm. See also the “Hardware and RF” section of Chapter 5: ApplicationConsiderations.Five signals are available:SIMVCC: SIM power supply.SIMRST: reset.SIMCLK: clock.SIMDATA: I/O port.SIMPRES1 SIM card detect. This signal is connected to the external SIM connector on pin 8. Pin 4 of SIMconnector must be pulled down to GND with 1 K.This interface is fully compliant with GSM 11.11 recommendations concerning the SIM functionality.Transient Voltage Suppressor diodes are internally added on the signals connected to the SIM socket in order toprevent any Electro-Static Discharge. TVS diodes with low capacitance (less than 10pF) are connected onSIMCLK and SIMDATA to avoid any disturbance of the rising and falling edge.Table 3-23: SIM Interface Pin DescriptionSignal Pin Number I/O I/O Type* DescriptionSIMCLK 45 O 2X SIM ClockSIMRST 46 O 2X SIM ResetSIMDATA 49 I/O CMOS/2X SIM DataSIMVCC 47 O SIM Power SupplySIMPRES1 48 I CMOS SIM Card DetectGPO0 50 O 2X SIM 3V or 5V* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.The SIM schematic appears later in this chapter.
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 30Table 3-24: SIM Interface Electrical CharacteristicsParameter Conditions Min Typ Max UnitSIMDATA VIH IIH = +/- 20mA0.7xSIMVCC VSIMDATA VIL IIL = 1 mA 0.3xSIMVCC VSIMRST,SIMDATASIMCLK VOHSource current= 20mASIMVCC – 0.1V VSIMRST,SIMDATASIMCLK VOLSink current= -200mA0.1SIMVCC OutputVoltageISIMVCC <= 6mA 2.70 2.80 2.85 VSIMCLK Rise/FallTimeLoaded with30pF50 nsSIMRST,SIMDATARise/Fall TimeLoaded with30pF1msSIMCLKFrequencyLoaded with30pF3.25 MHzTable 3-25: SIM Socket Pin DescriptionSignal Pin Number DescriptionVcc 1 SIMVCCRST 2 SIMRSTCLK 3 SIMCLKCC4 4 R10 to GroundGND 5 GroundVPP 6 not connectedI/O 7 SIMDATACC8 8 SIMPRES1
Chapter 3 – Electrical CharacteristicsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 31GNDSIMVCCIK1SIMRSTSIMCLKSIMDATASIMPRES1 8732VCCRSTCLKCC4GNDVPPI/OCC8Figure 3-12: SIM SocketSPI BusThe SPI bus includes a CLK signal, an I/O signal and an EN signal complying with SPI bus standard. Themaximum speed transfer is 3.25Mb/s.Table 3-26 : SPI Bus Pin DescriptionSignal Pin Number I/O I/O Type* DescriptionSPI_CLK 44 O 1X SPI Serial ClockSPI_IO 43 I/O CMOS/1X SPI DataSPI_EO 42 O 1X SPI Enable* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.Keypad InterfaceThis interface provides 10 connections: 5 rows (R0 to R4) and 5 columns (C0 to C4).The scanning is a digital one, and the de-bouncing is done in the integrated modem. No discrete componentslike R, C (Resistor, Capacitor) are needed. It is possible to scan the column and rows using the AT+CMERcommand. See AT Command manual for more details.Table 3-27: Keypad Interface Pin DescriptionSignal Pin Number I/O I/O Type* DescriptionROW0 39 I/O CMOS / 1X Row scanROW1 40 I/O CMOS / 1X Row scanROW2 37 I/O CMOS / 1X Row scanROW3 38 I/O CMOS / 1X Row scanROW4 35 I/O CMOS / 1X Row scanCOL0 36 I/O CMOS / 1X Column scanCOL1 33 I/O CMOS / 1X Column scanCOL2 34 I/O CMOS / 1X Column scanCOL3 31 I/O CMOS / 1X Column scanCOL4 32 I/O CMOS / 1X Column scan* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Chapter 4 – InterfacesWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 32Chapter 4 – InterfacesThis chapter describes the ModemModule interfaces.· Flashing LED· SIM Interface· RF Interface· DTE/DCE Interface RatesFlashing LEDThe flashing LED signal is used to indicate the working mode of the ModemModule.LED and ModemModule StatusSignal ModemModule StatusOFF Download mode or switched OFF>Continuously lit Switched ON (not registered on the network)ONFlashing Switched ON (registered on the network)SIM InterfaceThe internal SIM interface of the SocketModule supports 3V SIMs only.Note: This interface is fully compliant with GSM 11.11 recommendations concerning the SIM functionality.Five Signals Are AvailableSIMVCC: SIM power supply.SIMRST: reset.SIMCLK: clock.SIMDATA: I/O port.SIMPRES1 SIM card detect.
Chapter 4 – InterfacesWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 33RF InterfaceThe impedance is 50 Ohms nominal.RF ConnectorThe RF connector is MMCX standard type. An antenna can be directly connected through the matting connectoror using a small adapter.RF PerformancesRF performances are compliant with the ETSI recommendation 05.05 and 11.10.The main parameters are:Receiver:· EGSM Sensitivity : < -104 dBm· GSM 1800/GSM 1900 Sensitivity : < -102 dBm· Selectivity @ 200 kHz : > +9 dBc· Selectivity @ 400 kHz : > +41 dBc· Dynamic range : 62 dB· Intermodulation : > -43 dBm· Co-channel rejection : + 9 dBcTransmitter:· Maximum output power (EGSM) : 33 dBm +/- 2 dB· Maximum output power (DCS/PCS) : 30 dBm +/- 2 dB· Minimum output power (EGSM): 5 dBm +/- 5 dB· Minimum output power (DCS/PCS): 0 dBm +/- 5 dB· H2 level : < -30 dBm· H3 level : < -30 dBm· Noise in 925 - 935 MHz : < -67 dBm· Noise in 935 - 960 MHz : < -79 dBm· Noise in 1805 - 1880 MHz : < -71 dBm· Phase error at peak power : < 5 ° RMS· Frequency error : +/- 0.1 ppm maxDTE/DCE Interface RatesThe table below indicates the anticipated modem-to-computer interface rates for both the 7.2 bits-per-samplerate and the 8 bits-per-sample rate. Projected DTE/DCE Interface Rates for 7.2/8K Hz Sample RatesBits per SampleProjected DTE/DCE I/FRate @ 7.2K HzProjected DTE/DCE I/FRate @ 8K Hz Sample Rate0.50 4800 96001 9600 192002 19200 192003 38400 384004 38400 576005 57600 576006 57600 1152007 115200 1152008 115200 1152009 115200 11520010 115200 11520011 115200 11520012 115200 Fast13 Fast Fast
Chapter 5 – Test BoardWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 34Chapter 5 – Test BoardSerial Test/Demo Board Components
Chapter 5 – Test BoardWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 35Serial Test/Demo Board Block DiagramBlock Diagram for the ModemModule GSM/GPRS
Chapter 5 – Test BoardWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 36SIM Schematic (5V)SIM SchematicGNDVIN = 5VGNDLTC1555 SIM 3V/5V Level shifter.GNDVCC = 2.8VGNDR12 100KR22 0U6LTC155581256711109161132151443M0VINDV CCSSM1C1+C1-GNDCLKCINVCCRIN RSTI/ODDRVDA TAPlace C30near pin13 of U6.GNDC17 2.2uFSIMCLKR21 0C_GPO0C43 2.2uFR13 100KVCCVINGND GNDC28 .1uFR20, R21, R22 and R23are used to shuntLTC1555.SIM interface fromModem Module.+C30 33uFR20 0SIMV CC R23 0SIMPRES1GND4.7K10K47K47KU4UMC5NT114532SIMDA TAJ2SIM_6 P12345678VCCRSTCLKCC4GNDVPPI/0CC8R15 1KGNDSIMRSTR14 100K
Chapter 6 – Application ConsiderationsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 37Chapter 6 – Application ConsiderationsGeneral Guidelines for the Use of the ModemModuleHardware and RF· Ground plane: MultiTech recommends having a common ground plane for analog, digital and RF grounds.· Length of the SIM interface lines (15 cm maximum)· Bias of the Microphone inputs must be properly adjusted when using audio connectors (mic + speaker) 1.· EMC protection on audio input/output (filters against 900 MHz)· ESD protection on serial link, …· Possible spurious emission radiated by the application to the RF receiver in the receiver bandThe AntennaThe antenna sub-system and integration in the application is a major issue. It is a major issue in the choice of theantenna cable (type, length, performances, thermal resistance, etc.)These elements could affect GSM performances such as sensitivity and emitted power.The antenna should be isolated as much as possible from the digital circuitry including the interface signals.MultiTech recommends shielding the terminal. On terminals including the antenna, a poor shielding coulddramatically affect the sensitivity of the terminal. Subsequently, the power emitted through the antenna couldaffect the application.Firmware UpgradeThe ModemModule firmware is stored in flash memory, and it can easily be upgraded. Contact the factory fordetails.Initial Configuration Using Mobile PhoneToolsFor Initial configuration of your wireless device, Multi-Tech offers a Windows-based mobile PhoneToolsapplication.To load Mobile PhoneTools, click on the Mobile PhoneTools icon on the system CD and follow the on-screenprompts.
Chapter 6 – Application ConsiderationsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 38Getting StartedMinimum Hardware Interface Required To Get StartedAt a minimum, it is necessary to connect the following signals too properly operate the ModemModule:Table 5-1: Minimum Signals to Operate the ModemModulePin Number Name Description1 GND Ground2 GND Ground3 +5V Power Supply4 +5V Power Supply6 GND Ground13 CT106/CTS Clear to Send15 ON/OFF Power On/Off *21 GND Ground24 GND Ground25 CT103/TX Transmit28 CT104/RX Receive30 CT105/RTS Request to Send* Connected to +5V for exampleThe serial link signals must be used through the implementation of the serial link level shifter. See “Figure 3-3:Level Shifter Application Diagram for Serial Link.”Terminal Emulator SetupHere below is an example based on the Windows TM Hyperterminal application(terminal emulator program).Setup:1. Go to START – PROGRAMS – ACCESSORIES – HYPERTERMINAL.2. Start the Hyperterminal software.3. Give the name of your choice, click on the icon of your choice, and click “OK.”4. Choose these operating parameter values:Connect using: direct to COM1Properties: 115200 bps; 8 bits data; no parity; 1 stop bit; hardware flow control.5. Click “OK.”Once Hyperterminal is open and configured, it can be used to send AT commands to the ModemModule.For assistance in testing your ModemModule, see the examples in the AT Command manual for MultiTech’sGSM/GPRS wireless modem products (GSM/GPRS AT Commands Reference Guide).
Chapter 6 – Application ConsiderationsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 39Reference DocumentsTable 5-2: GSM ETSI Recommendations for Phase I and Phase IISpecification Reference TitleGSM ph2 Radio ETSI GSM 05.05 and GT 01 v4.2.1DCS ph2 Radio ETSI GSM05.05 and GT01 v4.2.1GSM ph2 Link-Management ETSI GSM 03.06, 04.08, 05.05, 05.08, 05.10, 07.01 anGT 01 v4.2.1GSM ph2 Link-Management ETSI GSM 03.06, 04.08, 05.05, 05.08, 05.10, 07.01 anGT 01 v4.2.1GSM ph2 Layer 2 ETSI GSM 04.06 and GT 01 v4.2.1GSM ph2 Layer 3 ETSI GSM 04.08 and GT 01 v4.2.1DCS ph2 Layer 3 ETSI GSM 04.08 and GT 01 v4.2.1GSM/DCS Multiband ETSI GSM 02.07, 03.22, 04.08, 04.13, 05.05, 05.08 anGT 01 v4.2.1GSM ph2 SIM ETSI GSM 11.11 and GT 01 v4.2.1GSM ph2 Teleservices ETSI GSM 03.50 and GT 01 v4.2.1GSM ph2 Miscellaneous ETSI GSM 02.07, 03.40, 03.41, 04.08, 04.10, 04.11,06.10, 06.11, 06.12, 06.31, 06.32, 07.01, 09.07 andG 01 v4.2.1DCS ph2 Miscellaneous ETSI GSM 02.07, 03.40, 03.41, 04.08, 04.10, 04.11,06.10, 06.11, 06.12, 06.31, 06.32, 07.01, 09.07 andG 01 v4.2.1You can find the documents onETSI Contacts: ETSI SecretariatF-06921 Sophia Antipolis cedex, France 06921 Sophia Antipolis cedex, France 06921 Sophia Antipolis cedex,France 06921 Sophia Antipolis cedex, Francee-mail: secretariat@etsi.frhttp://www.etsi.orgRelated ManualsFor information on Multi-Tech modem installation, AT commands, S-Registers, and testing; refer to theapplicable user manual that came with your Multi-Tech modem. Multi-Tech manuals and other resources are onthe Multi-Tech web page at http://www.multitech.com.For additional Multi-Tech information, contact:http://www.multitech.com for News, Products, Solutions, Support, Documents and more.ftp://ftp.multitech.com/ for Modem Firmware, Modem INFs, Manuals, Utilities, etc.email oemsales@multitech.com for email technical support.
Chapter 6 – Application ConsiderationsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 40Additional InformationEuropean Telecommunications Standards Institute (ETSI) - Contact the ETSI at:650, route des Lucioles06921 Sophia-Antipolis CedexFranceTel: +33 (0)4 92 94 42 00Fax: +33 (0)4 93 65 47 16Global Engineering Documents manages a collection of more than one million documents from over 460organizations worldwide:http://global.ihs.comPhone: 800-854-7179Fax: 303-792-2192The ITU is the leading publisher of telecommunication technology, regulatory and standard information, with over4,000 titles in printed form, on CD-ROM and Online athttp://www.itu.int/publications/ .
Appendix A – Safety Precautions & Regulatory Standards ComplianceWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 41Appendix A – Safety Precautions & RegulatoryStandards ComplianceSafety PrecautionsIMPORTANT!FOR THE EFFICIENT AND SAFE OPERATIONOF YOUR GSM INTEGRATED MODEM READTHIS INFORMATION BEFORE USE.RF SafetyGeneralYour ModemModule is based on the GSM standard for cellular technology. The GSM standard is spread all overthe world. It covers Europe, Asia and some parts of America and Africa. This is the most usedtelecommunication standard. Your modem is actually a low power radio transmitter and receiver. It sends outand receives radio frequency energy. When you use your ModemModule integrated modem, the cellular systemthat handles your calls controls both the radio frequency and the power level of your cellular modem.Exposure to RF EnergyThere has been some public concern about possible health effects of using GSM modems. Although research onhealth effects from RF energy has focused on the current RF technology for many years, scientists have begunresearch regarding newer radio technologies, such as GSM. After existing research had been reviewed, andafter compliance to all applicable safety standards had been tested, it has been concluded that the product wasfitted for use. If you are concerned about exposure to RF energy there are things you can do to minimizeexposure. Obviously, limiting the duration of your calls will reduce your exposure to RF energy. In addition, youcan reduce RF exposure by operating your cellular modem efficiently by following the below guidelines.Efficient Modem OperationFor your modem to operate at the lowest power level, consistent with satisfactory call quality:· If your modem has an extendible antenna, extend it fully. Some models allow you to place a call withthe antenna retracted. However your modem operates more efficiently with the antenna fully extended.· Do not hold the antenna when the modem is « IN USE ». Holding the antenna affects call quality andmay cause the modem to operate at a higher power level than needed.Antenna Care and ReplacementDo not use the modem with a damaged antenna. If a damaged antenna comes into contact with the skin, a minorburn may result. Replace a damaged antenna immediately. Consult your manual to see if you may change theantenna yourself. If so, use only a manufacturer-approved antenna. Otherwise, have your antenna repaired by aqualified technician. Use only the supplied or approved antenna. Unauthorized antennas, modifications orattachments could damage the modem and may contravene local RF emission regulations or invalidate typeapproval.
Appendix A – Safety Precautions & Regulatory Standards ComplianceWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 42General SafetyDrivingCheck the laws and the regulations regarding the use of cellular devices in the area where you have to drive asyou always have to comply with them. When using your modem while driving, please: give full attention todriving, pull off the road and park before making or answering a call if driving conditions so require.Electronic DevicesMost electronic equipment, for example in hospitals and motor vehicles is shielded from RF energy. However RFenergy may affect some improperly shielded electronic equipment.Vehicle Electronic EquipmentCheck your vehicle manufacturer representative to determine if any on-board electronic equipment is adequatelyshielded from RF energy.Medical Electronic EquipmentConsult the manufacturer of any personal medical devices (such as pacemakers, hearing aids, etc...) todetermine if they are adequately shielded from external RF energy. Turn your modem OFF in health carefacilities when any regulations posted in the area instruct you to do so. Hospitals or health care facilities may beusing RF monitoring equipment.AircraftTurn your modem OFF before boarding any aircraft.· Use it on the ground only with crew permission.· Do not use it in the air.To prevent possible interference with aircraft systems, Federal Aviation Administration (FAA) regulations requireyou to have permission from a crewmember to use your modem while the aircraft is on the ground. To preventinterference with cellular systems, local RF regulations prohibit using your modem while airborne.ChildrenDo not allow children to play with your modem. It is not a toy. Children could hurt themselves or others (bypoking themselves or others in the eye with the antenna, for example). Children could damage the modem, ormake calls that increase your modem bills.Blasting AreasTo avoid interfering with blasting operations, turn your unit OFF when in a « blasting area » or in areas posted: «turn off two-way radio ». Construction crews often use remote control RF devices to set off explosives.Potentially Explosive AtmospheresTurn your modem OFF when in any area with a potentially explosive atmosphere. It is rare, but your modem orits accessories could generate sparks. Sparks in such areas could cause an explosion or fire resulting in bodilyinjuries or even death. Areas with a potentially explosive atmosphere are often, but not always, clearly marked.They include fueling areas such as petrol stations; below decks on boats; fuel or chemical transfer or storagefacilities; and areas where the air contains chemicals or particles, such as grain, dust, or metal powders. Do nottransport or store flammable gas, liquid, or explosives, in the compartment of your vehicle that contains yourmodem or accessories. Before using your modem in a vehicle powered by liquefied petroleum gas (such aspropane or butane) ensure that the vehicle complies with the relevant fire and safety regulations of the country inwhich the vehicle is to be used.Safety StandardsTHIS WIRELESS MODEMMODULE COMPLIES WITH ALL APPLICABLE RF SAFETY STANDARDS. Thiscellular modem meets the standards and recommendations for the protection of public exposure to RFelectromagnetic energy established by governmental bodies and other qualified organizations, such as thefollowing:· Directives of the European Community,· Directorate General V in Matters of Radio Frequency Electromagnetic Energy
Appendix A – Safety Precautions & Regulatory Standards ComplianceWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 43RF ExposuresPursuant to 47 CFR § 24.52 of the FCC Rules and Regulations, personal communications services (PCS)equipment is subject to the radio frequency radiation exposure requirements specified in § 1.1307(b), § 2.1091and § 2.1093 as appropriate.The MultiTech ModemModule is a GSM (PCS 1900) terminal which operates in the US licensed PCS frequencyspectrum. The device transmits over the 1850-1910 MHz band and receives over the 1930-1990 MHz Band.Mult-Tech Systems, Inc. certifies that it has determined that the Modem complies with the RF hazardrequirements applicable to broadband PCS equipment operating under the authority of 47 CFR Part 24, SubpartE of the FCC Rules and Regulations. This determination is dependent upon installation, operation and use of theequipment in accordance with all instructions provided.The Modem is designed for and intends to be used in fixed and mobile applications. "Fixed" means that thedevice is physically secured at one location and is not able to be easily moved to another location. "Mobile"means that the device is designed to be used in other than fixed locations and generally in such a way that aseparation distance of at least 20cm is normally maintained between the transmitter's antenna and the body ofthe user or nearby persons. The Modem is not designed for or intends to be used in portable applications (within20 cm of the body of the user) and such uses are strictly prohibited. To ensure that the unit complies with currentFCC regulations limiting both maximum RF output power and human exposure to radio frequency radiation, aseparation distance of at least 20cm must be maintained between the unit's antenna and the body of the userand any nearby persons at all times and in all applications and uses. Additionally, in mobile applications,maximum antenna gain must not exceed 3 dBi (to comply with Section 24.232(b) and is limited to 7 dBi for fixedapplications. Finally, the tune-up procedure for the O9EM2113 ensures that the maximum RF output power ofthe device does not exceed 30.0 dBm within the variations that can be expected due to quantity production andtesting on a statistical basis.Instructions to OEMsThe MultiTech product manual includes specific warnings and cautions in order to ensure that OEMs are awareof their responsibilities, with regards to RF exposure compliance, for products into which the modem isintegrated. With this guidance, the OEM will be able to incorporate into their documentation the necessaryoperating conditions and warnings.OEMs need to provide a manual with the ‘’final’’ product that clearly states the operating requirements andconditions and that these must be observed to ensure compliance with current FCC RF exposure requirements /MPE limits (see the “RF Exposures” section above). This will enable the OEM to generate (and provide the end-user with) the appropriate operating instructions, warnings and cautions, and/or markings for their product.
Appendix A – Safety Precautions & Regulatory Standards ComplianceWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 44Regulatory Standards ComplianceGSM complianceReference regulations: TBR 19, TBR 20, TBR 31, TBR 32.Table B-1: ModemModule Acceptance TestTests Applied Standard Acceptance CriteriaPerformanceTestETSI recommendationfor GSM/DCScommunicationFull conformity to the recommendation regarding themain RF parameters.Cooking Test The test continues even after the Cooking Testmilestone has been reached.Stress Test Thermal shocks,IEC 68-2-14.Full conformity to the recommendation regarding themain parameters.Vibration Test Sinusoidal vibration,IEC 68-2-6.No performance degradation or mechanicaldegradation is allowed after test.Vibration Test Random vibration,IEC 68-2-36.No performance degradation or mechanicaldegradation is allowed after test.Shock Test IEC 68-2-27. No performance degradation or mechanicaldegradation is allowed after test.Bump Test IEC 68-2-29. No performance degradation or mechanicaldegradation is allowed after test.Humidity Test Corrosion test,IEC68-2-3.No visible degradation of the product, both visual andfunctional.The unit is tested at room temperature and must befully operative for the main RF parameters.WarehouseTestLow temperatureIEC 68-2-1.Under normal conditions (room temperature) after thetest, the unit must behave in full conformity with themain RF parameters.WarehouseTestHigh temperatureIEC 68-2-2.Under normal conditions (room temperature) after thetest, the unit must behave in full conformity with themain RF parameters.Dust Test MIL-STD-810D,method 510-3.No visible dust in the visible areas. No more than 50dust particles in the cabinet of the product. The unit,tested at room temperature, must be fully operative.Light Test UV radiation andtemperature EDFHN60E03.Visual inspection on the discoloration and otherdegradation effects such as cracks I the material ofthe unit after test.Fall Test IEC 68-2-32. Only minor casing degradation is allowed, with amaximum dimension change of 1mm. The unit mustremain fully operative and fully meet specifications forthe main RF parameters.Electro StaticDischargeTestIEC 100-4-2. No performance degradation allowed after the test.Salt MistTestIEC 68-2-11. After the test, visual inspection on the unit.AtmosphereTestFlowing mixed gascorrosion. IEC 68-2-60.After the test, visual inspection on the unit and inside.Marking Test EN 60 950 After the test, visual inspection on the unit. Nodegradation is allowed on the marking.
Appendix A – Safety Precautions & Regulatory Standards ComplianceWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 45FTA ComplianceThe ModemModule has received a Full-Type Approval (according to normal MS requirements) in theconfiguration using the internal SIM interface.IMEI NumberGSM 900/1800:TAC: 5 000 64FAC: 11Serial Numbers: 000000 to 999999GSM 900/1900:TAC: 500 100FAC: 11Serial Number: 000000 to 999999GSM/GPRS 900/1800:TAC: 500161FAC: 11Serial Numbers: 000000 to 999999GSM/GPRS 900/1900:TAC: 500167FAC: 11Serial Number: 000000 to 999999CE LabelThe Wireless ModemModule is CE compliant which implies that the modem is in conformity with the EuropeanCommunity directives and it bears the CE label.Carrying out tests:Electro-magnetic field immunityEN 61000-4-3ETS 300-342—1Radiated emissionEN 55022ETS 300-342ESD immunityEN 61000-4-2ETS 300-342-1
Appendix B – Sourcing Guide for Connectors/PeripheralsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 46Appendix B – Sourcing Guide for Connectors andPeripheral DevicesWhere to Find SMD ConnectorsThe ModemModule matting interface connector is made by SAMTEC France (http://www.samtec.com/).Many SAMTEC products are available via SAMTEC dealers throughout the world.Connector data sheets are presented later in this appendix.Figure B-1: High- and Low-Profile ConnectorsSAMTEC Reference Number forHigh-Profile Connector:FLE-125-01-G-DVSAMTEC Reference Number forLow-Profile Connector:CLP-125-02-L-DFigure B-2: Flexible Flat CableReference Number for Flexible Flat Cable: SD 25 01 NFigure B-3: Flexible Cable ReceptacleSAMTEC Reference Number for Flex Cable Connector: FTS-125-01-L-DV-A
Appendix B – Sourcing Guide for Connectors/PeripheralsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 47GSM AntennaThe integrated modem antenna connector is a MMCX connector. The MMCX connector incorporates a 'Snap On'latching action in order to make the connection easier with an excellent RF performance. An additionaladvantage is its small physical size which is 50% of the standard MCX connector.This type of connector is suitable for the standard ranges of flexible and semi-rigid cables. The characteristicimpedance of the MMCX coaxial connector is 50 ohm. The antenna manufacturer must guarantee that theantenna will be working according to the radio characteristics presented in the table below.Table B-1: Radio CharacteristicsGSM 850 EGSM 900 DCS 1800 PCS 1900FrequencyRX869 to 894 MHz 925 to 960 MHz 1805 to 1880 MHz 1930 to 990 MHzFrequencyTX824 to 849 MHz 880 to 915 MHz 1710 to 1875 MHz 1850 to 910 MHzRF PowerStand2W at 12.5%duty cycle2W at 12.5%duty cycle1W at 12.5% dutycycle1W at 12.5% dutycycleImpedance 50 ohmsVSWR <2TypicalRadiatedGain 0 dBi on azimuth planeThe ModemModule requires an MMCX plug to connect to an antenna.Figure B-6: MMCX Connector Example (right angle type)An antenna with matting connector can be ordered, for example, from :IMS Connectors Systems GMBHhttp://www.imscs.com/A small MMCX / SMA adapter can be ordered, for example, from :Amphenolhttp://www.amphenol.com/Order No: 908-31100SIM Card HolderThe SIM card holder used in the integrated modem is a MOLEX connector.Part number connector: 99228.Part number holder : 91236.For more information about this connector:http://www.molex.com/It is possible to use a stand-alone SIM cardholder through the 50-pin connector but the length of the SIM linemust not exceed 15 cm.
Appendix C – AT Command ListWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 48Appendix C – AT Command ListFor comprehensive information about AT Commands, please read the AT Command Manual.Table C-1a : AT Command ListGeneral Commands+CGMI Manufacturer Identification+CGMM Request Model Identification+CGMR Request Revision Identification+CGSN Product Serial Number+CSCS Select TE Character Set+CIMI Request IMSI+CCID Card Identification+GCAP Capabilities ListA/ Repeat Last Command+CPOF Power Off+CFUN Set Phone Functionality+CPAS Phone Activity Status+CMEE Report Mobile Equipment Errors+CKPD Keypad Control+CCLK Clock management+CALA Alarm management
Appendix C – AT Command ListWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 49Table C-1b : AT Command List (cont’d)Call Control CommandsD Dial commandH Hang-up CommandA Answer a Call+CEER Extended Error Report+VTD, +VTS DTMF SignalsATDL Redial Last Telephone NumberAT%Dn Automatic Dialing (or SMS send) with DTRATSO Automatic Answer+CICB Incoming Call Bearer+VGR, +VGT Gain Control+CMUT Microphone Mute Control+SPEAKER Speaker and Microphone Selection+ECHO Echo Cancellation+SIDET Side Tone Modification+VIP Initialize Voice Parameters+CSNS Single Numbering SchemeNetwork Service Commands+CSQ Signal Quality+COPS Operator Selection+CREG Network Registration+WOPN Read Operator Name+CPOL Preferred Operator ListSecurity Commands+CPIN Enter PIN+CPIN2 Enter PIN2+CPINC PIN Remaining Attempt Number+CLCK Facility Lock+CPWD Change PasswordPhone Book Commands+CPBS Select Phone Book Memory Storage+CPBR Read Phone Book Entries+CPBF Find Phone Book Entries+CPBW White Phone Book Entry+CPBP Phone Book Phone Search+CPBN Move Action in Phone Book+CNUM Subscriber Number+WAIP Avoid Phone Book Init
Appendix C – AT Command ListWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 50Table C-1c: AT Command List (cont’d)Short Message Commands+CSMS Select Message Service+CNMA New Message Acknowledgement+CPMS Preferred Message Storage+CMGF Preferred Message Format+CSAS Save Settings+CRES Restore Settings+CSDH Show Text Mode parameters+CNMI New Message Indication+CMGR Read Message+CMGL List Message+CMGS Send Message+CMGW Write Message to Memory+CMSS Send Message from Storage+CSMP Set Text Mode Parameters+CMGD Delete Message+CSCA Service Center Address+CSCB Select Cell Broadcast Message Types+WCBM Cell Broadcast Message Identifiers+WMSC Message Status Modification+WMGO Message OverwritingSupplementary Services Commands+CCFC Call Forwarding+CLCK Call Barring+CPWD Modify SS Password+CCWA Call Waiting+CLIR Calling Line Identification Restriction+CLIP Calling Line Identification Presentation+COLP Connected Line Identification Presentation+CAOC Advice Of Charge+CACM Accumulated Call Meter+CAMM Accumulated Call Meter Maximum+CPUC Price Per Unit and Currency Table+CHLD Call Related Supplementary Services+CLCC List Current Calls+CSSN Supplementary Service Notifications+CUSD Unstructured Supplementary Service Data+CCUG Closed User GroupData Commands+CBST Bearer Type Selection+FCLASS Select Mode+CR Service Reporting Control+CRC Cellular Result Codes+ILRR DTE-DCE Local Rate Reporting+CRLP Radio Link Protocol Parameters+DOPT Others Radio Link Parameters%C Select Data Compression+DS V42 bis Data Compression+DR V42 bis Data Compression Report\N Select Data Error Correcting Mode
Appendix C – AT Command ListWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 51Table C-1d: AT Command List (cont’d)Fax Commands+FTM Transmit Speed+FRM Receive Speed+FTH HDLC Transmit Speed+FRH HDLC Receive Speed+FTS Stop Transmission and Wait+FRS Receive SilenceFax Class 2 Commands+FDT Transmit Data+FDR Receive Data+FET Transmit Page Punctuation+FPTS Page Transfer Status Parameters+FK Terminate Session+FBOR Page Transfer Bit Order+FBUF Buffer Size Report+FCQ Copy Quality Checking+FCR Capability to Receive+FDIS Current Sessions Parameters+FDCC DCE Capabilities Parameters+FLID Local ID String+FPHCTO Page Transfer Timeout ParameterV24 - V25 Commands+IPR Fixed DTE Rate+ICF DTE-DCE Character Framing+IFC DTE-DCE Local Flow Control&C Set DCD Signal&D Set DTR Signal&S Set DSR SignalO Back to Online ModeQ Result Code SuppressionV DCE Response FormatZ Default Configuration&W Save Configuration&T Auto-TestsEEcho&F Restore Factory Settings&V Display ConfigurationI Request Identification InformationSIM Toolkit Commands+STSF SIM Toolkit Set Facilities+STIN SIM Toolkit Indication+STGI SIM Toolkit Get Information+STCR SIM Toolkit Control Response+STGR SIM Toolkit Give Response
Appendix C – AT Command ListWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 52Table C-1e: AT Command List (cont’d)Specific AT Commands+CCED Cell Environment Description+CCED Automatic RxLev Indication+WIND General Indications+ADC Analog Digital Converters Measurements+CMER Mobile Equipment Event Reporting+WLPR Read Language Preference+WLPW Write Language Preference+WIOR Read GPIO Value+WIOW Write GPIO Value+WAC Abort Command+WTONE Play Tone+WDTMF Play DTMF Tone+WDWL MultiTech Downloading+WVR MultiTech Voice Rate+WDR Data Rate+WHWV Hardware Version+WDOP Date Of Production+WSVG MultiTech Select Voice Gain+WSTR MultiTech Status Request+WSCAN MultiTech Scan+WRIM Ring Indicator Mode+W32K Power saving mode
Appendix D – Acronyms and AbbreviationsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 53Appendix D – Acronyms and AbbreviationsADC : Analog Digital ConverterASIC : Application Specific Integrated CircuitBCCH : Broadcast Control ChannelCE : Communauté EuropéenneCLK : ClockCTS : Clear To senddB : decibelDCD : Data Carrier DetectDCE : Data Circuit Terminating EquipmentDSR : Data Set ReadyDTE : Data Terminal EquipmentDTR : Data Terminated ReadyEFR : Enhanced Full RateE-GSM : Extended- GSMEMC : Electromagnetic ConformityEN : EnableETSI : European Telecommunications Standards InstituteFAC : Final Assembly CodeFR : Full-RateFTA : Full Type ApprovalGND : GroundGPIO : General Purpose Input OutputGPRS : General Packet Radio ServiceGSM : Global System for Mobile CommunicationHR : Half-RateIMEI : International Mobile Equipment IdentityMO : Mobile OriginatedMT : Mobile TerminatedOEM : Original Equipment ManufacturerPDA : Personal Digital AssistantPCB : Printed Circuit BoardPRES : PresenceRI : Ring IndicatorRTS : Request To SendSIM : Subscriber Identity ModuleSMD : Surface Mounted DesignSMS : Short Message ServiceTAC : Type Approval CodeTDMA : Time Code Multiple AccessTE : Terminal EquipmentVSWR : Voltage Standing Wave RatioWAP : Wireless Application Protoc
Appendix D – Acronyms and AbbreviationsWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 54Index11X ....................................................14, 15, 16, 19, 3122X ........................................ 14, 15, 16, 19, 23, 24, 2933X ......................................................................15, 16Aadvice of charge.........................................................8Advice of Charge.......................................................7Advice Of Charge....................................................50analog ............................................................7, 37, 53antenna...............................7, 8, 33, 37, 41, 42, 43, 47antenna cable ...........................................................37asynchronous .........................................................7, 8AT command ...................................................6, 7, 39autobauding ...............................................................7AUXV0..............................................................14, 24Bbaud rate ....................................................................7BOOT ................................................................14, 22bursts..................................................................17, 18CCall Barring .........................................................7, 50Call Forwarding...................................................7, 50Call Hold ...................................................................7Call Waiting.........................................................7, 50Calling Line Identity..................................................7casing.......................................................................44CE......................................................................45, 53Cell Broadcast .....................................................6, 50Class 1 .........................................................5, 6, 7, 12Class 10 .................................................................5, 6Closed User Group ..............................................7, 50CMOS................ 14, 15, 16, 19, 20, 22, 23, 24, 29, 31column ...............................................................15, 31connector .................5, 6, 7, 10, 13, 15, 29, 33, 46, 47converter ..................................................................24Ddata ....................................5, 6, 7, 8, 9, 13, 19, 38, 46Data Carrier Detect............................................19, 53dB ................................................................12, 33, 53DCS .......................................................12, 33, 39, 44digital.......................................................7, 24, 31, 37DTE/DCE Interface Rates .......................................33dual-band ...................................................................5EEFR..................................................................6, 8, 53Electrical Characteristics .........................................13EMC protection .......................................................37emergency calls .........................................................8ESD protection ........................................................37ETSI.......................................................33, 39, 44, 53Explicit Call Transfer ................................................7Ffax..........................................................................5, 7fixed dialing number..................................................8FR ....................................................................6, 8, 53Ggain ..............................................................25, 26, 43general purpose..................................................13, 15GND ....................................14, 15, 17, 29, 30, 38, 53GPIO............................................................24, 52, 53GPRS ...................................1, 5, 6, 7, 8, 9, 18, 45, 53ground plane ....................................17, 26, 27, 28, 37GSM1, 5, 6, 7, 8, 9, 12, 19, 29, 32, 33, 37, 39, 41, 43,44, 45, 47, 53Hhandset.....................................................................25hardware ..........................................5, 6, 8, 21, 22, 38HR ...................................................................6, 8, 53II/O14, 15, 16, 19, 20, 22, 23, 24, 25, 26, 27, 28, 29,30, 31, 32idle .....................................................................17, 18idle mode ...........................................................17, 18interface ... 5, 6, 7, 8, 13, 15, 19, 29, 31, 32, 37, 45, 46MMIC1N...............................................................14, 26MIC1P ...............................................................14, 26MIC2N...............................................................14, 25MIC2P ...............................................................14, 25microphone ........................................................25, 26MMCX (Miniature Micro Connector) .......6, 7, 33, 47MNP2 ........................................................................7MO.............................................................6, 8, 42, 53modem ......... 5, 6, 7, 17, 20, 31, 39, 41, 42, 43, 45, 47module .................................................5, 8, 10, 14, 22mounting....................................................................6MT ...................................................................6, 8, 53multiparty ..................................................................8
IndexWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 55Nnominal value ..........................................................17OOFF............................................14, 20, 21, 23, 38, 42ON/~OFF...........................................................14, 20operating conditions ................................................43PPCB ...................................................................10, 53PCS....................................................................33, 43phone book ............................................................7, 8power6, 8, 13, 17, 21, 22, 27, 28, 29, 32, 33, 37, 41,43power supply................................................17, 29, 32Rradio.......................................................41, 42, 43, 47real time clock ...........................................................8RF ................ 5, 7, 8, 10, 13, 33, 37, 41, 42, 43, 44, 47RST........................................................14, 22, 23, 30Sserial link .................................................7, 19, 37, 38signal..........................................20, 22, 23, 29, 31, 32SIM5, 6, 7, 10, 13, 15, 29, 30, 31, 32, 36, 37, 39, 45,47, 51, 53SIM Toolkit .........................................................7, 51SIMCLK................................................15, 29, 30, 32SIMDATA.............................................15, 29, 30, 32SIMPRES ................................................................15SIMRST.................................................15, 29, 30, 32SIMVCC................................................15, 29, 30, 32SMS .......................................................5, 6, 8, 49, 53socket.............................................................6, 15, 29speaker...................................................25, 27, 28, 37Specificationstechnical ...............................................................10SPI .....................................................................15, 31SPK1N...............................................................14, 28SPK1P ...............................................................14, 28TTechnical specifications...........................................10telephony ...................................................................8terminal..................................................19, 37, 38, 43UUCS2 .........................................................................7USSD.....................................................................7, 8VV.42bis ......................................................................7Vcc.....................................................................14, 30voice ..........................................................................5WWAP ........................................................................53XXmodem ....................................................................7
IndexWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 56LIST OF FIGURESFigure 1-1: MultiTech’s Wireless ModemModule GSM/GPRS 5Figure 1-2: Mechanical Description A 10Figure 1-3: Mechanical Description B 10Figure 2-1: ModemModule Dimensions 11Figure 3-1: 50-Pin Connector 16Figure 3-2: Pin Numbering – Bottom View 17Figure 3-3: Level Shifter Application Diagram for Serial Link 20Figure 3-4: Power-Off Procedure 1 21Figure 3-5: Power-Off Procedure 2 21Figure 3-6: Boot Procedure 22Figure 3-7: Reset Procedure 22Figure 3-8: Microphone 2 Input 25Figure 3-9: Microphone 1 Input 26Figure 3-10: Speaker 2 Output 27Figure 3-11: Speaker 1 Output 28Figure 3-12: SIM Socket 31Figure 3-13: SIM Schematic 36Figure 4-1: ModemModule Test SM Card Layout Error! Bookmark not defined.Figure 4-2: ModemModule Test SM Board Block Diagram Error! Bookmark not defined.Figure B-1: High- and Low-Profile Connectors 46Figure B-2: Flexible Flat Cable 46Figure B-3: Flexible Cable Receptacle 46Figure B-4: Samtec Low-Profile Sockets Error! Bookmark not defined.Figure B-5: Samtec Cable Strips Error! Bookmark not defined.Figure B-6: MMCX Connector Example (right angle type) 47
IndexWireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 57LIST OF TABLESTable 2-1 : Climatic and Mechanical Environment Testing Compliance 12Table 3-1a. 50-pin Connector Description 14Table 3-1b. 50-Pin Connector Description 15Table 3-2. Operating Conditions 16Table 3-3: Power Supply Pin Description 17Table 3-4: Power Consumption in EGSM-only mode @25 degrees C 17Table 3-5: Power Consumption in GSM-only 1800 & 1900 MHz modes @25 degrees C 18Table 3-6: Power Consumption in EGSM/GPRS cl2 mode @25 degrees C 18Table 3-7: Power Consumption in EGSM-only mode @25 degrees C 18Table 3-8: Serial Link Pin Description 19Table 3-9: ON / OFF Pin Description 20Table 3-10: BOOT Pin Description 22Table 3-11: Reset Signal Pin Description 23Table 3-12: Reset Signal Electrical Characteristics 23Table 3-13: Reset Signal Operating Conditions 23Table 3-14 : Flashing LED Pin Description 23Table 3-15 : LED and ModemModule Status 23Table 3-16 : General Purpose I/O Pin Description 24Table 3-17: A/D Converter Pin Description 24Table 3-18: A/D Converter Electrical Characteristics 24Table 3-19 : Microphone 2 Input Pin Description 25Table 3-20 : Microphone 1 Input Pin Description 26Table 3-21 : Speaker 2 Output Pin Description 27Table 3-22 : Speaker 1 Output Pin Description 28Table 3-23: SIM Interface Pin Description 29Table 3-24: SIM Interface Electrical Characteristics 30Table 3-25: SIM Socket Pin Description 30Table 3-26 : SPI Bus Pin Description 31Table 3-27 : Keypad Interface Pin Description 31Table 5-1: Minimum Signals to Operate the ModemModule 38Table 5-2: GSM ETSI Recommendations for Phase I and Phase II 39Table B-1 : ModemModule Acceptance Test 44Table B-1: Radio Characteristics 47Table C-1a : AT Command List 48Table C-1b : AT Command List (cont’d) 49Table C-1c: AT Command List (cont’d) 50Table C-1d: AT Command List (cont’d) 51Table C-1e: AT Command List (cont’d) 52

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