Insight SiP ISP1507 Bluetooth Low Energy Module User Manual
Insight SiP Bluetooth Low Energy Module Users Manual
Users Manual
Preliminary Data Sheet
September 5, 2016
Page 1/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
ISP1507
High Performance Bluetooth+ANT+NFC
Low Energy Module
with MCU and Antenna
This ultra-small LGA module, 8 x 8 x 1 mm, is based on
the nRF52832 Chip. Its powerful Cortex™ M4 CPU,
flash and RAM memory combined with an optimized
antenna offers the perfect solution for Bluetooth
connectivity. The solution is best in class for RF
performance and low power consumption. Multiple
digital and analogue interfaces give optimum flexibility
for sensor integration.
Applications
Connected sensors for medical devices,
healthcare, sport, fitness, industrial …
IoT applications, connected objects
Wearable technology
Home automation
Beacons
Certifications
Fully FCC pre-certified module
Fully CE pre-certified module
Fully IC pre-certified module
Bluetooth SIG certified QDL listing
RoHS compliant
Key Features
Multi-protocol 2.4GHz Ultra Low Power
RF Transceiver
Single Mode BLE V4.2 stack
ANT/ANT+ stack
2.4 GHz proprietary stack
NFC-A Tag for OOB pairing
Fully integrated RF matching and Antenna
Integrated 32 MHz & 32kHZ Clock
DC/DC converter with loading circuit
Based on Nordic Semiconductor nRF52
32-bit ARM Cortex M4 CPU
512 kB Flash
64 kB SRAM
Configurable 30 GPIOs including 8 ADC
Many interfaces SPI, UART, PDM, I2C
Single 1.7 to 3.6 V supply
Very small size 8.0 x 8.0 x 1.0 mm
Temperature -40 to +85 °C
Preliminary Data Sheet
September 5, 2016
Page 2/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Contents
1. Block Diagram ............................................................................................................................................................ 3
2. Specifications ............................................................................................................................................................. 4
2.1. Absolute Maximum Ratings ........................................................................................................................... 4
2.2. Operating Conditions ..................................................................................................................................... 4
2.3. Power Consumption ...................................................................................................................................... 5
2.4. Clock Sources ............................................................................................................................................... 5
2.5. Radio Specifications ...................................................................................................................................... 5
2.6. Electrical Schematic ...................................................................................................................................... 8
3. Pin Description ........................................................................................................................................................... 9
4. Mechanical Outlines ................................................................................................................................................ 11
4.1. Mechanical Dimensions .............................................................................................................................. 11
4.2. SMT Assembly Guidelines .......................................................................................................................... 12
4.3. Antenna Keep-Out Zone ............................................................................................................................. 12
5. Product Development Tools .................................................................................................................................. 13
5.1. Hardware ..................................................................................................................................................... 13
5.2. Firmware ...................................................................................................................................................... 13
5.3. Development Tools ..................................................................................................................................... 14
6. Packaging & Ordering information ....................................................................................................................... 15
6.1. Marking ........................................................................................................................................................ 15
6.2. Prototype Packaging ................................................................................................................................... 15
6.3. Jedec Trays ................................................................................................................................................. 15
6.4. Tape and Reel ............................................................................................................................................. 16
6.5. Ordering Information ................................................................................................................................... 16
7. Storage & Soldering information .......................................................................................................................... 17
7.1. Storage and Handling .................................................................................................................................. 17
7.2. Moisture Sensitivity ..................................................................................................................................... 17
7.3. Soldering information .................................................................................................................................. 18
8. Quality & User information..................................................................................................................................... 19
8.1. Certifications ................................................................................................................................................ 19
8.2. USA – User information ............................................................................................................................... 19
8.3. Canada – User information ......................................................................................................................... 19
8.4. Discontinuity ................................................................................................................................................ 20
8.5. Disclaimer .................................................................................................................................................... 20
Preliminary Data Sheet
September 5, 2016
Page 3/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
1. Block Diagram
This module is based on nRF52832 Nordic Semiconductor 2.4GHz wireless System on Chip (SoC)
integrating a 2.4 GHz transceiver, a 32-bit ARM Cortex™-M4 CPU, a 512 kB flash memory, a 64 kB
RAM and analog and digital peripherals.
It can support BLE, ANT/ANT+ and a range of proprietary 2.4 GHz protocols, such as Gazell from
Nordic Semiconductor.
Fully qualified BLE stacks for nRF52832 are implemented in the S132 SoftDevices which can be freely
downloaded. ISP1507 can then be used in Central, Peripheral or both roles for BLE and for both ends
of other proprietary protocols. nRF52832 platform also provides extensive software support for ANT
applications with S212 SoftDevices and dual ANT/BLE stack S332 SoftDevices.
Ultra low power consumption and advanced power management enables battery lifetimes up to several
years on a coin cell battery. Even though its very small size 8 x 8 x 1.0 mm, the module integrates
decoupling capacitors, 32 MHz and 32.768 kHz crystals, load capacitors, DC-DC converter, RF
matching circuit and antenna in addition to the wireless SoC.
Only the addition of a suitable DC power source is necessary for BLE and/or ANT connectivity. Sensor
applications require the further addition of appropriate sensors. The antenna was designed to be
optimized with several standard ground plane sizes. The NFC tag antenna can be connected
externally.
Preliminary Data Sheet
September 5, 2016
Page 4/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
2. Specifications
The specifications of the module follow those of the nRF52832. The following high level parameters are
given for the module.
2.1. Absolute Maximum Ratings
Parameter
Min
Typ
Max
Unit
Supply Voltage respect to ground - VCC
-0.3
3.9
V
IO Pin Voltage
-0.3
3.9
V
RF Input Level
10
dBm
NFC Antenna pin current
80
mA
Storage Temperature
-40
+125
°C
Moisture Sensitivity Level
5
-
ESD Human Body Model
4000
V
ESD Charged Device Model
750
V
Flash Endurance
10000
cycles
ATTENTION
CONSERVE PRECAUTION FOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
Human Body Model Class 3A
2.2. Operating Conditions
Parameter
Min
Typ
Max
Unit
Operating Supply Voltage, internal LDO setup
1.7
3.0
3.6
V
Operating Supply Voltage, DCDC converter setup
2.1
3.0
3.6
V
Extended Industrial Operating Temperature Range
-40
+25
+85
°C
Preliminary Data Sheet
September 5, 2016
Page 5/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
2.3. Power Consumption
Parameter
Min
Typ
Max
Unit
Peak current, Receiver active (1)
6.1
mA
Peak current, Transmitter active +4 dBm Output Power (2)
7.9
mA
Peak current, Transmitter active 0 dBm Output Power (2)
5.4
mA
System OFF current, no RAM retention
0.4
µA
System ON base current, no RAM retention
1.2
µA
Additional RAM retention current per 4 KB block
40
N
nA
(1) DCDC enable, Power supply 3V, 1 Msps
(2) DCDC enable, Power supply 3V
2.4. Clock Sources
Parameter
Min
Typ
Max
Unit
Internal High Frequency Clock for RF Stability:
32 MHz Crystal Frequency Tolerance (1)
+/- 40
ppm
Internal Low Frequency Clock for BLE Synchronization:
32.768 kHz Crystal Frequency Tolerance (1)
+/- 40
ppm
Internal Low Frequency Clock for BLE Synchronization:
RC Oscillator (2)
+/- 250
ppm
RF Frequency tolerance:
For BLE operation Channels 0 to 39
+/- 40
ppm
(1) including initial tolerance, drift, aging, and frequency pulling
(2) Frequency tolerance after calibration
2.5. Radio Specifications
Parameter
Min
Typ
Max
Unit
Frequency Range
2402
2480
Mhz
Channel 0 to 39 Spacing
2
Mhz
Output Power Channels 0 to 39
-20
+4
dBm
Rx sensitivity Level for BER <0,1% ideal Tx
-96
dBm
Antenna Gain
0.6
dBi
EIRP
-19.4
4.6
dBm
Range Open field @1m height
100
m
Data Rate
1000 / 2000
kbps
Preliminary Data Sheet
September 5, 2016
Page 6/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Typical Antenna Return Loss
Module mounted on a USB dongle ground plane
Radiation Pattern in 3 planes
Module mounted on a USB dongle ground plane
Gain measurement in dBi @ 2.45 GHz.
Preliminary Data Sheet
September 5, 2016
Page 7/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Ground Plane Effect Simulation
USB dongle
ground plane
(size : 18 x 30 mm²)
Cell phone config 1
ground plane
(size : 40 x 100 mm²)
Cell phone config 1 with
side ground plane
(size : 40 x 100 mm²)
Cell phone config 2 with
side ground plane
(size : 40 x 100 mm²)
Cell phone config 3 with
side ground plane
(size : 40 x 100 mm²)
Preliminary Data Sheet
September 5, 2016
Page 8/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
2.6. Electrical Schematic
Electrical schematic showing
ISP1507 module connections
Preliminary Data Sheet
September 5, 2016
Page 9/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
3. Pin Description
The module uses an LGA format with a double row of pads on a 0.65 mm pitch. The pad layout follows
the QFN Jedec standard for 2 row LGA parts. The NC pads are to be connected to isolated metal pads
on the application PCB for mechanical stability and reliability (drop test).
Pin
Name
Pin function
Description
1
NC
Not Connected
Isolated pad on application PCB for mechanical stability
2
P0_09
NFC1
Digital I/O
NFC Input
General purpose I/O pin
NFC antenna connection
3
P0_12
Digital I/O
General purpose I/O pin
4
P0_10
NFC2
Digital I/O
NFC Input
General purpose I/O pin
NFC antenna connection
5
P0_14
TRACEDATA3
Digital I/O
General purpose I/O pin
Trace port output
6
P0_26
Digital I/O
General purpose I/O pin
7
NC
Not Connected
Isolated pad on application PCB for mechanical stability
8
VSS
Ground
Should be connected to ground plane on application PCB
9
P0_16
TRACEDATA1
Digital I/O
General purpose I/O pin
Trace port output
10
VSS
Ground
Should be connected to ground plane on application PCB
11
P0_18
TRACEDATA0
Digital I/O
General purpose I/O pin
Trace port output
12
VSS
Ground
Should be connected to ground plane on application PCB
13
P0_21
RESET
Digital I/O
General purpose I/O pin
Configurable as system RESET pin
14
VSS
Ground
Should be connected to ground plane on application PCB
15
P0_20
TRACECLK
Digital I/O
General purpose I/O pin
Trace port clock output
16
VSS
Ground
Should be connected to ground plane on application PCB
17
P0_22
Digital I/O
General purpose I/O pin
18
VSS
Ground
Should be connected to ground plane on application PCB
19
P0_24
Digital I/O
General purpose I/O pin
20
OUT_MOD
Antenna I/O
This pin is the RF I/O pin of the BLE module
It should be connected to Pin 22 OUT_ANT for normal operation
21
VSS
Ground
Should be connected to ground plane on application PCB
22
OUT_ANT
Antenna I/O
This pin is connected to the internal antenna
It should be connected to Pin 20 OUT_MOD for normal operation
23
VSS
Ground
Should be connected to ground plane on application PCB
24
VSS
Ground
Should be connected to ground plane on application PCB
25
NC
Not Connected
Isolated pad on application PCB for mechanical stability
26
VCC
Power
Power supply (1.7 – 3.6V)
27
P0_17
Digital I/O
General purpose I/O pin
28
SWDIO
Digital I/O
Serial Wire Debug I/O for debug and programming
29
P0_13
Digital I/O
General purpose I/O pin
30
SWDCLK
Digital Input
Serial Wire Debug clock input for debug and programming
31
NC
Not Connected
Isolated pad on application PCB for mechanical stability
32
P0_08
Digital I/O
General purpose I/O pin
33
P0_07
Digital I/O
General purpose I/O pin
Preliminary Data Sheet
September 5, 2016
Page 10/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Pin
Name
Pin function
Description
34
P0_06
Digital I/O
General purpose I/O pin
35
P0_04
AIN2
Digital I/O
Analog Input
General purpose I/O pin
SAADC/COMP/LPCOMP input
36
P0_05
AIN3
Digital I/O
Analog Input
General purpose I/O pin
SAADC/COMP/LPCOMP input
37
P0_15
TRACEDATA2
Digital I/O
General purpose I/O pin
Trace port output
38
P0_03
AIN1
Digital I/O
Analog Input
General purpose I/O pin
SAADC/COMP/LPCOMP input
39
P0_27
Digital I/O
General purpose I/O pin
40
P0_02
AIN0
Digital I/O
Analog Input
General purpose I/O pin
SAADC/COMP/LPCOMP input
41
P0_25
Digital I/O
General purpose I/O pin
42
P0_31
AIN7
Digital I/O
Analog Input
General purpose I/O pin
SAADC/COMP/LPCOMP input
43
P0_11
Digital I/O
General purpose I/O pin
44
P0_30
AIN6
Digital I/O
Analog Input
General purpose I/O pin
SAADC/COMP/LPCOMP input
45
P0_19
Digital I/O
General purpose I/O pin
46
P0_29
AIN5
Digital I/O
Analog Input
General purpose I/O pin
SAADC/COMP/LPCOMP input
47
P0_23
Digital I/O
General purpose I/O pin
48
P0_28
AIN4
Digital I/O
Analog Input
General purpose I/O pin
SAADC/COMP/LPCOMP input
49
to 62
NC
Not Connected
Isolated pad on application PCB for mechanical stability
ISP1507
pad placement and pin assignment
for the LGA QFN package
TOP VIEW
48 46 44 42
47 45 43 41 39 37
40 38 36 34 32
35 33
29
30
27
28
26
31
25
24
22
20
18
1614
12
13 15 17 19 21 23
108
911
7
6
4
2
3
5
1
49
50
51
52 53 54 55 56 57 58 59
60
61
62
Preliminary Data Sheet
September 5, 2016
Page 11/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
4. Mechanical Outlines
4.1. Mechanical Dimensions
Dimensional drawing for 8 x 8 x 1 mm, 62-Pad LGA Package
1
0.10
0.30
0.50
0.25
0.30
8.00
0.95
1.50
2.50
0.60
0.40
1.40
1.725
2.05
2.375
0.30
0.50
1.725
1.40
2.05
2.375
2.70
3.15
3.60
3.80
8.00
0.95
0.35 0.60
7.50
6.55
5.55
4.55
0.30 0.25
7.70
0.40
0.40
0.80
0.80
Preliminary Data Sheet
September 5, 2016
Page 12/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
4.2. SMT Assembly Guidelines
For PCB Land Patterns and Solder Mask layout, Insight SiP recommends to use the same dimensions
as module pads, ie 0.4 x 0.4 mm for standard pads and 0.8 x 0.8 mm for corner pads.
Please contact Insight SiP for more detailed information.
4.3. Antenna Keep-Out Zone
For optimal antenna performance, it is recommended to respect a metal exclusion zone to the edge of
the board: no metal, no traces and no components on any application PCB layer except mechanical LGA
pads.
Application PCB
Keep
Out
Zone
18.0 mm min
4.0
mm
1
Preliminary Data Sheet
September 5, 2016
Page 13/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
5. Product Development Tools
5.1. Hardware
In order to assist clients in developing their Bluetooth Smart solutions based on the ISP1507, Insight SIP
offers a Development Kit containing:
- One Interface Board
- J-Link Lite CortexM-9 JTAG/SWD Emulator
- One Test Board
- A Development Dongle
- 5 ISP1507 module samples
- Cables, power supply and coin battery holder
Using this development kit, product developers can use a working solution as starting point to develop
their own products. Time to market is saved by avoiding starting from a blank sheet of paper. In addition,
there may be some applications that use the hardware as is.
Please refer to the documentation for more information:
http://www.insightsip.com/fichiers_insightsip/pdf/ble/isp_ble_DS1507_DK.pdf
5.2. Firmware
1507 supports Bluetooth Low Energy protocol stacks, ANT protocol stacks as well as 2.4 GHz protocol
stacks, including Gazell. All are available as downloads at www.nordicsemi.com.
The S132 SoftDevice is a Bluetooth® low energy (BLE) Central and Peripheral protocol stack solution
supporting up to three Central and one Peripheral simultaneous connections and concurrent Observer
and Broadcaster roles. It integrates a low energy Controller and Host, and provides a full and flexible
API for building Bluetooth low energy System on Chip (SoC) solutions.
The S212 SoftDevice is an ANT protocol stack solution that provides a full and flexible Application
Programming Interface (API) for building ANT System on Chip (SoC) solutions for the nRF52832 chip.
The S212 SoftDevice simplifies combining the ANT protocol stack and an application on the same
CPU.
The S332 SoftDevice is a concurrent ANT/Bluetooth® Low Energy (BLE) SoftDevice
Preliminary Data Sheet
September 5, 2016
Page 14/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
5.3. Development Tools
The following development tools and software are recommended for using and testing ISP1507 module:
Nordic Semiconductor nRFgo Studio:
Downloadable after registering at www.nordicsemi.com.
Nordic Semiconductor Master Control Panel:
Downloadable after registering at www.nordicsemi.com.
Keil MDK-ARM Lite:
Downloadable from https://www.keil.com/demo/eval/arm.htm.
Segger J-Link Lite:
Downloadable from http://www.segger.com/jlink-software.html.
nRF52 Software Development Kit (SDK):
nRF52 SDK can be downloaded after registering at www.nordicsemi.com. It contains example of
source codes applications (C language):
- Precompiled HEX files
- Source code
- Keil ARM project files
- IAR project files
Preliminary Data Sheet
September 5, 2016
Page 15/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
6. Packaging & Ordering information
6.1. Marking
ISP1507
Part Number
TT
2 letters Module Type (see
section 6.5)
YY
2 digits year number
WW
2 digits week number
R
1 letter Hardware revision
6.2. Prototype Packaging
For engineering samples and prototype quantities
up to 99 units, deliveries are provided in thermoformed
trays. Please order with “ST” code packaging suffix.
These parts must be backed prior to assembly
(see section 7.2).
CAUTION
MOISTURE
SENSITIVE DEVICES
6.3. Jedec Trays
For higher quantities and volume production, ISP1507 are available in Jedec trays. They are delivered in
sealed pack with desiccant pack and humidity sensors. These Jedec trays are also suitable for further
baking. Please see section 7.2 for more information on moisture sensitivity.
Jedec trays are proposed in standard quantities of 100 units, 200 units and multiples of 200 units only.
Please order with “J1” code packaging suffix for 100-unit tray and “J2” for 200 and multiple unit trays.
Complete information on Jedec trays is available on request.
M
/N
:
I
S
P
1
5
0
7
T
T
Y
Y
W
W
R
LEVEL
5
Preliminary Data Sheet
September 5, 2016
Page 16/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
6.4. Tape and Reel
ISP1507 are also available in Tape & Reel. They are delivered in sealed pack with desiccant pack and
humidity sensors. Reels are proposed in standard quantities of 500 units (180mm / 7” reel) or 2000 units
(330mm / 13” reel) only. Please order with “RS” code packaging suffix for 500-unit reels and “R2” for
2000-unit reels.
Complete information is available on request.
6.5. Ordering Information
I
S
P
1
5
0
7
-
T
T
-
Z
Z
▼
▼
▼
▼
▼
▼
▼
▼
▼
▼
▼
▼
I
S
P
1
5
0
7
Part Number
-
A
ANT & BLE protocol type
-
X
512 kB Flash / 64 kB RAM memory type
-
D
K
Development kit (1)
-
T
B
Test board (1)
-
S
T
Unsealed Tray Packaging
-
J
1
Jedec Tray with less than 100 units
-
J
2
Jedec Tray with multiple of 200 units
-
R
S
Reel of 500 units
-
R
2
Reel of 2000 units
(1) Please see section 5.1 and refer to the following documentation for more information on
development kit and test board:
http://www.insightsip.com/fichiers_insightsip/pdf/ble/isp_ble_DS1507_DK.pdf
Preliminary Data Sheet
September 5, 2016
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Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
7. Storage & Soldering information
7.1. Storage and Handling
Keep this product away from other high frequency devices which may interfere with operation such as
other transmitters and devices generating high frequencies.
Do not expose the module to the following conditions:
- Corrosive gasses such as Cl2, H2S, NH3, SO2, or NOX
- Extreme humidity or salty air
- Prolonged exposure to direct Sunlight
- Temperatures beyond those specified for storage
Do not apply mechanical stress
Do not drop or shock the module
Avoid static electricity, ESD and high voltage as these may damage the module
ATTENTION
CONSERVE PRECAUTION FOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
7.2. Moisture Sensitivity
All plastic packages absorb moisture. During typical solder reflow operations when SMDs are mounted
onto a PCB, the entire PCB and device population are exposed to a rapid change in ambient
temperature. Any absorbed moisture is quickly turned into superheated steam. This sudden change in
vapor pressure can cause the package to swell. If the pressure exerted exceeds the flexural strength of
the plastic mold compound, then it is possible to crack the package. Even if the package does not crack,
interfacial delamination can occur.
Since the device package is sensitive to moisture absorption, it is recommended to bake the product
before assembly. The baking process for dry packing is 24 hours at 125°C.
ISP1507 has been tested MSL-5 according to standards. After baking, modules can be exposed to
ambient room conditions (approximately 30 °C/60%RH) during 48 hours before assembly on the PCB.
CAUTION
MOISTURE
SENSITIVE DEVICES
LEVEL
5
Preliminary Data Sheet
September 5, 2016
Page 18/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
7.3. Soldering information
Recommendation for RoHS reflow process is according to Jedec J–STD-020 and 033 standard profiles.
Preheat/Soak
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (ts) from (Tsmin to Tsmax)
150 °C
200 °C
60-120 sec
Peak package body temperature (Tp)
260°C
(+0/-5°C)
Classification Temperature (Tc)
Time (tp) maintained above TC-5 °C
260 °C
30 sec
Ramp-up rate (TL to Tp)
3 °C/sec max
Ramp-down rate (Tp to TL)
6 °C/sec max
Liquidous temperature (TL)
Time (tL) maintained above TL
217 °C
60-150 sec
Time 25 °C to peak temperature
8 mn max
Preliminary Data Sheet
September 5, 2016
Page 19/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
8. Quality & User information
8.1. Certifications
FCC – Certification pending
CE – Certification pending
IC – Certification pending
Bluetooth SIG – Certification pending
RoHS compliant
8.2. USA – User information
This intends to inform how to specify the FCC ID of our module “ISP1507” on the product. Based on the
Public Notice from FCC, the host device should have a label which indicates that it contains our module.
The label should use wording such as:
“Contains FCC ID: 2AAQS-ISP1507”
Any similar wording that expresses the same meaning may be used.
The label of the host device should also include the below FCC Statement. When it is not possible, this
information should be included in the User Manual of the host device:
“This device complies with part 15 of the FCC rules. Operation is subject to the following two
conditions.
(1) This device may not cause harmful interference
(2) This device must accept any interference received, including interference that may cause
undesired operation.
Caution: Any Changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.”
8.3. Canada – User information
This intends to inform how to specify the IC ID of our module “ISP1507” on the product. According to
Canadian standards “RSS-210” and “RSS-Gen”, the host device should have a label which indicates that
it contains our module. The label should use wording such as:
“Contains IC: 11306A-ISP1507”
Any similar wording that expresses the same meaning may be used.
The label of the host device should also include the below IC Statement. When it is not possible, this
information should be included in the User Manual of the host device:
Preliminary Data Sheet
September 5, 2016
Page 20/20
Document Ref: isp_ble_DS1507_R2.docx
Insight SiP
– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –
www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
“This device complies with Industry Canada licence-exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1)
l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.”
8.4. Discontinuity
Normally a product will continue to be manufactured as long as all of the following are true:
- The manufacturing method is still available.
- There are no replacement products.
- There is demand for it in the market.
In case of obsolescence, Insight SiP will follow Jedec Standard JSD-48. A Product Discontinuation
Notice (PDN) will be sent to all distributors and made available on our website. After this, the procedure
goes as follows:
- Last Order Date will be 6 months after the PDN was published.
- Last Shipment Date will be 6 months after Last Order Date, i.e. 12 months after PDN.
8.5. Disclaimer
Insight SiP’s products are designed and manufactured for general consumer applications, so testing and
use of the product shall be conducted at customer’s own risk and responsibility. Please conduct
validation and verification and sufficient reliability evaluation of the products in actual condition of
mounting and operating environment before commercial shipment of the equipment. Please also pay
attention (i) to apply soldering method that don’t deteriorate reliability, (ii) to minimize any mechanical
vibration, shock, exposure to any static electricity, (iii) not to overstress the product during and after the
soldering process.
The products are not designed for use in any application which requires especially high reliability where
malfunction of these products can reasonably be expected to result in personal injury or damage to the
third party's life, body or property, including and not limited to (i) aircraft equipment, (ii) aerospace
equipment, (iii) undersea equipment, (iv) power plant control equipment, (v) medical equipment,
(vi) transportation equipment, (vii) traffic signal equipment, (viii) disaster prevention / crime prevention
equipment.
The only warranty that Insight SiP provides regarding the products is its conformance to specifications
provided in datasheets. Insight SiP hereby disclaims all other warranties regarding the products, express
or implied, including without limitation any warranty of fitness for a particular purpose, that they are
defect-free, or against infringement of intellectual property rights. Insight SiP customers agree to
indemnify and defend Insight SiP against all claims, damages, costs and expenses that may be incurred,
including without any limitation, attorney fees and costs, due to the use of products.