Insight SiP ISP1507 Bluetooth Low Energy Module User Manual

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Document Description	Users Manual
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Date Submitted	2016-11-11 00:00:00
Date Available	2017-05-11 00:00:00
Creation Date	2016-09-05 14:31:11
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Document Lastmod	2016-09-05 14:31:11
Document Title	Users Manual
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Preliminary Data Sheet
ISP1507
High Performance Bluetooth+ANT+NFC
Low Energy Module with MCU and Antenna
This ultra-small LGA module, 8 x 8 x 1 mm, is based on
the nRF52832 Chip. Its powerful Cortex™ M4 CPU,
flash and RAM memory combined with an optimized
antenna offers the perfect solution for Bluetooth
connectivity. The solution is best in class for RF
performance and low power consumption. Multiple
digital and analogue interfaces give optimum flexibility
for sensor integration.
Key Features
Applications
Multi-protocol 2.4GHz Ultra Low Power
RF Transceiver
Connected sensors for medical devices,
healthcare, sport, fitness, industrial …
Single Mode BLE V4.2 stack
ANT/ANT+ stack
2.4 GHz proprietary stack
IoT applications, connected objects
NFC-A Tag for OOB pairing
Fully integrated RF matching and Antenna
Wearable technology
Home automation
Beacons
Integrated 32 MHz & 32kHZ Clock
DC/DC converter with loading circuit
Based on Nordic Semiconductor nRF52
32-bit ARM Cortex M4 CPU
512 kB Flash
64 kB SRAM
Certifications
Configurable 30 GPIOs including 8 ADC
Many interfaces SPI, UART, PDM, I2C
Fully FCC pre-certified module
Single 1.7 to 3.6 V supply
Fully CE pre-certified module
Very small size 8.0 x 8.0 x 1.0 mm
Fully IC pre-certified module
Temperature -40 to +85 °C
Bluetooth SIG certified QDL listing
RoHS compliant
September 5, 2016
Document Ref: isp_ble_DS1507_R2.docx
Page 1/20
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
Contents
1.
2.
2.1.
2.2.
2.3.
2.4.
2.5.
2.6.
3.
4.
4.1.
4.2.
4.3.
5.
5.1.
5.2.
5.3.
6.
6.1.
6.2.
6.3.
6.4.
6.5.
7.
7.1.
7.2.
7.3.
8.
8.1.
8.2.
8.3.
8.4.
8.5.
Block Diagram ............................................................................................................................................................ 3
Specifications ............................................................................................................................................................. 4
Absolute Maximum Ratings........................................................................................................................... 4
Operating Conditions ..................................................................................................................................... 4
Power Consumption ...................................................................................................................................... 5
Clock Sources ............................................................................................................................................... 5
Radio Specifications ...................................................................................................................................... 5
Electrical Schematic ...................................................................................................................................... 8
Pin Description ........................................................................................................................................................... 9
Mechanical Outlines ................................................................................................................................................11
Mechanical Dimensions .............................................................................................................................. 11
SMT Assembly Guidelines .......................................................................................................................... 12
Antenna Keep-Out Zone ............................................................................................................................. 12
Product Development Tools ..................................................................................................................................13
Hardware ..................................................................................................................................................... 13
Firmware...................................................................................................................................................... 13
Development Tools ..................................................................................................................................... 14
Packaging & Ordering information .......................................................................................................................15
Marking ........................................................................................................................................................ 15
Prototype Packaging ................................................................................................................................... 15
Jedec Trays ................................................................................................................................................. 15
Tape and Reel ............................................................................................................................................. 16
Ordering Information ................................................................................................................................... 16
Storage & Soldering information ..........................................................................................................................17
Storage and Handling .................................................................................................................................. 17
Moisture Sensitivity ..................................................................................................................................... 17
Soldering information .................................................................................................................................. 18
Quality & User information.....................................................................................................................................19
Certifications ................................................................................................................................................ 19
USA – User information............................................................................................................................... 19
Canada – User information ......................................................................................................................... 19
Discontinuity ................................................................................................................................................ 20
Disclaimer .................................................................................................................................................... 20
September 5, 2016
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Page 2/20
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
1. Block Diagram
This module is based on nRF52832 Nordic Semiconductor 2.4GHz wireless System on Chip (SoC)
integrating a 2.4 GHz transceiver, a 32-bit ARM Cortex™-M4 CPU, a 512 kB flash memory, a 64 kB
RAM and analog and digital peripherals.
It can support BLE, ANT/ANT+ and a range of proprietary 2.4 GHz protocols, such as Gazell from
Nordic Semiconductor.
Fully qualified BLE stacks for nRF52832 are implemented in the S132 SoftDevices which can be freely
downloaded. ISP1507 can then be used in Central, Peripheral or both roles for BLE and for both ends
of other proprietary protocols. nRF52832 platform also provides extensive software support for ANT
applications with S212 SoftDevices and dual ANT/BLE stack S332 SoftDevices.
Ultra low power consumption and advanced power management enables battery lifetimes up to several
years on a coin cell battery. Even though its very small size 8 x 8 x 1.0 mm, the module integrates
decoupling capacitors, 32 MHz and 32.768 kHz crystals, load capacitors, DC-DC converter, RF
matching circuit and antenna in addition to the wireless SoC.
Only the addition of a suitable DC power source is necessary for BLE and/or ANT connectivity. Sensor
applications require the further addition of appropriate sensors. The antenna was designed to be
optimized with several standard ground plane sizes. The NFC tag antenna can be connected
externally.
September 5, 2016
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Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
2. Specifications
The specifications of the module follow those of the nRF52832. The following high level parameters are
given for the module.
2.1. Absolute Maximum Ratings
Parameter
Min
Supply Voltage respect to ground - VCC
IO Pin Voltage
Max
Unit
-0.3
3.9
-0.3
3.9
RF Input Level
10
dBm
NFC Antenna pin current
80
mA
+125
°C
Moisture Sensitivity Level
ESD Human Body Model
4000
ESD Charged Device Model
750
10000
cycles
Storage Temperature
Typ
-40
Flash Endurance
ATTENTION
CONSERVE PRECAUTION FOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
Human Body Model Class 3A
2.2. Operating Conditions
Parameter
Min
Typ
Max
Unit
Operating Supply Voltage, internal LDO setup
1.7
3.0
3.6
Operating Supply Voltage, DCDC converter setup
2.1
3.0
3.6
Extended Industrial Operating Temperature Range
-40
+25
+85
°C
September 5, 2016
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Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
2.3. Power Consumption
Parameter
Peak current, Receiver active
Min
(1)
Typ
Max
Unit
6.1
mA
7.9
mA
5.4
mA
System OFF current, no RAM retention
0.4
µA
System ON base current, no RAM retention
1.2
µA
Additional RAM retention current per 4 KB block
40
nA
Typ
Max
Unit
Internal High Frequency Clock for RF Stability:
(1)
32 MHz Crystal Frequency Tolerance
+/- 40
ppm
Internal Low Frequency Clock for BLE Synchronization:
(1)
32.768 kHz Crystal Frequency Tolerance
+/- 40
ppm
Internal Low Frequency Clock for BLE Synchronization:
(2)
RC Oscillator
+/- 250
ppm
RF Frequency tolerance:
For BLE operation Channels 0 to 39
+/- 40
ppm
Max
Unit
2480
Mhz
Peak current, Transmitter active +4 dBm Output Power
Peak current, Transmitter active 0 dBm Output Power
(1)
(2)
(2)
(2)
DCDC enable, Power supply 3V, 1 Msps
DCDC enable, Power supply 3V
2.4. Clock Sources
Parameter
(1)
(2)
Min
including initial tolerance, drift, aging, and frequency pulling
Frequency tolerance after calibration
2.5. Radio Specifications
Parameter
Min
Frequency Range
2402
Channel 0 to 39 Spacing
Output Power Channels 0 to 39
-20
Rx sensitivity Level for BER <0,1% ideal Tx
-96
Antenna Gain
EIRP
Range Open field @1m height
Data Rate
Typ
Mhz
+4
dBm
dBm
0.6
-19.4
dBi
4.6
dBm
100
1000 / 2000
kbps
September 5, 2016
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Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
Typical Antenna Return Loss
Module mounted on a USB dongle ground plane
Radiation Pattern in 3 planes
Module mounted on a USB dongle ground plane
Gain measurement in dBi @ 2.45 GHz.
September 5, 2016
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Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
Ground Plane Effect Simulation
USB dongle
ground plane
(size : 18 x 30 mm²)
Cell phone config 2 with
side ground plane
(size : 40 x 100 mm²)
Cell phone config 1
ground plane
(size : 40 x 100 mm²)
Cell phone config 1 with
side ground plane
(size : 40 x 100 mm²)
Cell phone config 3 with
side ground plane
(size : 40 x 100 mm²)
September 5, 2016
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Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
2.6. Electrical Schematic
Electrical schematic showing
ISP1507 module connections
September 5, 2016
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Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
3. Pin Description
The module uses an LGA format with a double row of pads on a 0.65 mm pitch. The pad layout follows
the QFN Jedec standard for 2 row LGA parts. The NC pads are to be connected to isolated metal pads
on the application PCB for mechanical stability and reliability (drop test).
Pin
Name
Pin function
Description
Not Connected
Digital I/O
NFC Input
Digital I/O
Digital I/O
NFC Input
Digital I/O
16
17
18
19
20
NC
P0_09
NFC1
P0_12
P0_10
NFC2
P0_14
TRACEDATA3
P0_26
NC
VSS
P0_16
TRACEDATA1
VSS
P0_18
TRACEDATA0
VSS
P0_21
RESET
VSS
P0_20
TRACECLK
VSS
P0_22
VSS
P0_24
OUT_MOD
21
22
VSS
OUT_ANT
Ground
Antenna I/O
23
24
25
26
27
28
29
30
31
32
33
VSS
VSS
NC
VCC
P0_17
SWDIO
P0_13
SWDCLK
NC
P0_08
P0_07
Ground
Ground
Not Connected
Power
Digital I/O
Digital I/O
Digital I/O
Digital Input
Not Connected
Digital I/O
Digital I/O
Isolated pad on application PCB for mechanical stability
General purpose I/O pin
NFC antenna connection
General purpose I/O pin
General purpose I/O pin
NFC antenna connection
General purpose I/O pin
Trace port output
General purpose I/O pin
Isolated pad on application PCB for mechanical stability
Should be connected to ground plane on application PCB
General purpose I/O pin
Trace port output
Should be connected to ground plane on application PCB
General purpose I/O pin
Trace port output
Should be connected to ground plane on application PCB
General purpose I/O pin
Configurable as system RESET pin
Should be connected to ground plane on application PCB
General purpose I/O pin
Trace port clock output
Should be connected to ground plane on application PCB
General purpose I/O pin
Should be connected to ground plane on application PCB
General purpose I/O pin
This pin is the RF I/O pin of the BLE module
It should be connected to Pin 22 OUT_ANT for normal operation
Should be connected to ground plane on application PCB
This pin is connected to the internal antenna
It should be connected to Pin 20 OUT_MOD for normal operation
Should be connected to ground plane on application PCB
Should be connected to ground plane on application PCB
Isolated pad on application PCB for mechanical stability
Power supply (1.7 – 3.6V)
General purpose I/O pin
Serial Wire Debug I/O for debug and programming
General purpose I/O pin
Serial Wire Debug clock input for debug and programming
Isolated pad on application PCB for mechanical stability
General purpose I/O pin
General purpose I/O pin
10
11
12
13
14
15
Digital I/O
Not Connected
Ground
Digital I/O
Ground
Digital I/O
Ground
Digital I/O
Ground
Digital I/O
Ground
Digital I/O
Ground
Digital I/O
Antenna I/O
September 5, 2016
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Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
Pin
Name
Pin function
Description
34
35
P0_06
P0_04
AIN2
P0_05
AIN3
P0_15
TRACEDATA2
P0_03
AIN1
P0_27
P0_02
AIN0
P0_25
P0_31
AIN7
P0_11
P0_30
AIN6
P0_19
P0_29
AIN5
P0_23
P0_28
AIN4
NC
Digital I/O
Digital I/O
Analog Input
Digital I/O
Analog Input
Digital I/O
General purpose I/O pin
General purpose I/O pin
SAADC/COMP/LPCOMP input
General purpose I/O pin
SAADC/COMP/LPCOMP input
General purpose I/O pin
Trace port output
General purpose I/O pin
SAADC/COMP/LPCOMP input
General purpose I/O pin
General purpose I/O pin
SAADC/COMP/LPCOMP input
General purpose I/O pin
General purpose I/O pin
SAADC/COMP/LPCOMP input
General purpose I/O pin
General purpose I/O pin
SAADC/COMP/LPCOMP input
General purpose I/O pin
General purpose I/O pin
SAADC/COMP/LPCOMP input
General purpose I/O pin
General purpose I/O pin
SAADC/COMP/LPCOMP input
Isolated pad on application PCB for mechanical stability
36
37
38
39
40
41
42
43
44
45
46
47
48
49
to 62
48
46
47
44
42
43
45
Digital I/O
Analog Input
Digital I/O
Digital I/O
Analog Input
Digital I/O
Digital I/O
Analog Input
Digital I/O
Digital I/O
Analog Input
Digital I/O
Digital I/O
Analog Input
Digital I/O
Digital I/O
Analog Input
Not Connected
38
40
41
39
36
37
34
32
31
33
35
30
29
27
28
13
11
10
12
17
15
14
16
19
18
21
20
23
22
24
25
49
62
50
61
51
60
52
TOP VIEW
26
ISP1507
pad placement and pin assignment
for the LGA QFN package
53
54
55
56
57
58
59
September 5, 2016
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Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
4. Mechanical Outlines
4.1. Mechanical Dimensions
Dimensional drawing for 8 x 8 x 1 mm, 62-Pad LGA Package
8.00
2.375
2.05
1.725
1.40
0.25
0.50
0.30
0.30
7.50
7.70
0.35
0.60
8.00
0.30
6.55
5.55
4.55
0.25
1.40
2.375
2.05
1.725
3.15
2.70
3.80
3.60
0.95
0.95
0.50
0.30
0.10
0.60
1.50
0.40
2.50
0.80
0.40
0.40
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Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
0.80
BLE MODULE
ISP1507
Preliminary Data Sheet
4.2. SMT Assembly Guidelines
For PCB Land Patterns and Solder Mask layout, Insight SiP recommends to use the same dimensions
as module pads, ie 0.4 x 0.4 mm for standard pads and 0.8 x 0.8 mm for corner pads.
Please contact Insight SiP for more detailed information.
4.3. Antenna Keep-Out Zone
For optimal antenna performance, it is recommended to respect a metal exclusion zone to the edge of
the board: no metal, no traces and no components on any application PCB layer except mechanical LGA
pads.
Application PCB
4.0
mm
Keep
Out
Zone
18.0 mm min
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Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
5. Product Development Tools
5.1. Hardware
In order to assist clients in developing their Bluetooth Smart solutions based on the ISP1507, Insight SIP
offers a Development Kit containing:
One Interface Board
J-Link Lite CortexM-9 JTAG/SWD Emulator
One Test Board
A Development Dongle
5 ISP1507 module samples
Cables, power supply and coin battery holder
Using this development kit, product developers can use a working solution as starting point to develop
their own products. Time to market is saved by avoiding starting from a blank sheet of paper. In addition,
there may be some applications that use the hardware as is.
Please refer to the documentation for more information:
http://www.insightsip.com/fichiers_insightsip/pdf/ble/isp_ble_DS1507_DK.pdf
5.2. Firmware
1507 supports Bluetooth Low Energy protocol stacks, ANT protocol stacks as well as 2.4 GHz protocol
stacks, including Gazell. All are available as downloads at www.nordicsemi.com.
The S132 SoftDevice is a Bluetooth® low energy (BLE) Central and Peripheral protocol stack solution
supporting up to three Central and one Peripheral simultaneous connections and concurrent Observer
and Broadcaster roles. It integrates a low energy Controller and Host, and provides a full and flexible
API for building Bluetooth low energy System on Chip (SoC) solutions.
The S212 SoftDevice is an ANT protocol stack solution that provides a full and flexible Application
Programming Interface (API) for building ANT System on Chip (SoC) solutions for the nRF52832 chip.
The S212 SoftDevice simplifies combining the ANT protocol stack and an application on the same
CPU.
The S332 SoftDevice is a concurrent ANT/Bluetooth® Low Energy (BLE) SoftDevice
September 5, 2016
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Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
5.3. Development Tools
The following development tools and software are recommended for using and testing ISP1507 module:
Nordic Semiconductor nRFgo Studio:
Downloadable after registering at www.nordicsemi.com.
Nordic Semiconductor Master Control Panel:
Downloadable after registering at www.nordicsemi.com.
Keil MDK-ARM Lite:
Downloadable from https://www.keil.com/demo/eval/arm.htm.
Segger J-Link Lite:
Downloadable from http://www.segger.com/jlink-software.html.
nRF52 Software Development Kit (SDK):
nRF52 SDK can be downloaded after registering at www.nordicsemi.com. It contains example of
source codes applications (C language):
- Precompiled HEX files
- Source code
- Keil ARM project files
- IAR project files
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Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
6. Packaging & Ordering information
6.1. Marking
M /N :
S P 1 5 0 7
T T
Y Y W W R
ISP1507
YY
Part Number
2 letters Module Type (see
section 6.5)
2 digits year number
WW
2 digits week number
1 letter Hardware revision
TT
6.2. Prototype Packaging
For engineering samples and prototype quantities
up to 99 units, deliveries are provided in thermoformed
trays. Please order with “ST” code packaging suffix.
These parts must be backed prior to assembly
(see section 7.2).
CAUTION
LEVEL
MOISTURE
SENSITIVE DEVICES
6.3. Jedec Trays
For higher quantities and volume production, ISP1507 are available in Jedec trays. They are delivered in
sealed pack with desiccant pack and humidity sensors. These Jedec trays are also suitable for further
baking. Please see section 7.2 for more information on moisture sensitivity.
Jedec trays are proposed in standard quantities of 100 units, 200 units and multiples of 200 units only.
Please order with “J1” code packaging suffix for 100-unit tray and “J2” for 200 and multiple unit trays.
Complete information on Jedec trays is available on request.
September 5, 2016
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Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
6.4. Tape and Reel
ISP1507 are also available in Tape & Reel. They are delivered in sealed pack with desiccant pack and
humidity sensors. Reels are proposed in standard quantities of 500 units (180mm / 7” reel) or 2000 units
(330mm / 13” reel) only. Please order with “RS” code packaging suffix for 500-unit reels and “R2” for
2000-unit reels.
Complete information is available on request.
6.5. Ordering Information
I S P 1 5 0 7 - T
▼
▼
▼
I S P 1 5 0 7
T - Z Z
▼
▼ ▼
▼
▼ ▼
▼
▼ ▼
Part Number
- A
ANT & BLE protocol type
512 kB Flash / 64 kB RAM memory type
- D K
Development kit (1)
- T B
Test board (1)
- S T
Unsealed Tray Packaging
J 1
Jedec Tray with less than 100 units
J 2
Jedec Tray with multiple of 200 units
- R S
Reel of 500 units
- R 2
Reel of 2000 units
(1) Please see section 5.1 and refer to the following documentation for more information on
development kit and test board:
http://www.insightsip.com/fichiers_insightsip/pdf/ble/isp_ble_DS1507_DK.pdf
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Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
7. Storage & Soldering information
7.1. Storage and Handling
Keep this product away from other high frequency devices which may interfere with operation such as
other transmitters and devices generating high frequencies.
Do not expose the module to the following conditions:
- Corrosive gasses such as Cl2, H2S, NH3, SO2, or NOX
- Extreme humidity or salty air
- Prolonged exposure to direct Sunlight
- Temperatures beyond those specified for storage
Do not apply mechanical stress
Do not drop or shock the module
Avoid static electricity, ESD and high voltage as these may damage the module
ATTENTION
CONSERVE PRECAUTION FOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
7.2. Moisture Sensitivity
All plastic packages absorb moisture. During typical solder reflow operations when SMDs are mounted
onto a PCB, the entire PCB and device population are exposed to a rapid change in ambient
temperature. Any absorbed moisture is quickly turned into superheated steam. This sudden change in
vapor pressure can cause the package to swell. If the pressure exerted exceeds the flexural strength of
the plastic mold compound, then it is possible to crack the package. Even if the package does not crack,
interfacial delamination can occur.
Since the device package is sensitive to moisture absorption, it is recommended to bake the product
before assembly. The baking process for dry packing is 24 hours at 125°C.
ISP1507 has been tested MSL-5 according to standards. After baking, modules can be exposed to
ambient room conditions (approximately 30 °C/60%RH) during 48 hours before assembly on the PCB.
CAUTION
MOISTURE
SENSITIVE DEVICES
LEVEL
September 5, 2016
Document Ref: isp_ble_DS1507_R2.docx
Page 17/20
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
7.3. Soldering information
Recommendation for RoHS reflow process is according to Jedec J–STD-020 and 033 standard profiles.
Preheat/Soak
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (ts) from (Tsmin to Tsmax)
Ramp-up rate (TL to Tp)
Liquidous temperature (TL)
Time (tL) maintained above TL
150 °C
200 °C
60-120 sec
3 °C/sec max
217 °C
60-150 sec
260°C
(+0/-5°C)
260 °C
30 sec
Peak package body temperature (Tp)
Classification Temperature (T c)
Time (tp) maintained above TC-5 °C
Ramp-down rate (Tp to TL)
Time 25 °C to peak temperature
6 °C/sec max
8 mn max
September 5, 2016
Document Ref: isp_ble_DS1507_R2.docx
Page 18/20
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
8. Quality & User information
8.1. Certifications
FCC – Certification pending
CE – Certification pending
IC – Certification pending
Bluetooth SIG – Certification pending
RoHS compliant
8.2. USA – User information
This intends to inform how to specify the FCC ID of our module “ISP1507” on the product. Based on the
Public Notice from FCC, the host device should have a label which indicates that it contains our module.
The label should use wording such as:
“Contains FCC ID: 2AAQS-ISP1507”
Any similar wording that expresses the same meaning may be used.
The label of the host device should also include the below FCC Statement. When it is not possible, this
information should be included in the User Manual of the host device:
“This device complies with part 15 of the FCC rules. Operation is subject to the following two
conditions.
(1) This device may not cause harmful interference
(2) This device must accept any interference received, including interference that may cause
undesired operation.
Caution: Any Changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.”
8.3. Canada – User information
This intends to inform how to specify the IC ID of our module “ISP1507” on the product. According to
Canadian standards “RSS-210” and “RSS-Gen”, the host device should have a label which indicates that
it contains our module. The label should use wording such as:
“Contains IC: 11306A-ISP1507”
Any similar wording that expresses the same meaning may be used.
The label of the host device should also include the below IC Statement. When it is not possible, this
information should be included in the User Manual of the host device:
September 5, 2016
Document Ref: isp_ble_DS1507_R2.docx
Page 19/20
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
BLE MODULE
ISP1507
Preliminary Data Sheet
“This device complies with Industry Canada licence-exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1)
l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.”
8.4. Discontinuity
Normally a product will continue to be manufactured as long as all of the following are true:
- The manufacturing method is still available.
- There are no replacement products.
- There is demand for it in the market.
In case of obsolescence, Insight SiP will follow Jedec Standard JSD-48. A Product Discontinuation
Notice (PDN) will be sent to all distributors and made available on our website. After this, the procedure
goes as follows:
- Last Order Date will be 6 months after the PDN was published.
- Last Shipment Date will be 6 months after Last Order Date, i.e. 12 months after PDN.
8.5. Disclaimer
Insight SiP’s products are designed and manufactured for general consumer applications, so testing and
use of the product shall be conducted at customer’s own risk and responsibility. Please conduct
validation and verification and sufficient reliability evaluation of the products in actual condition of
mounting and operating environment before commercial shipment of the equipment. Please also pay
attention (i) to apply soldering method that don’t deteriorate reliability, (ii) to minimize any mechanical
vibration, shock, exposure to any static electricity, (iii) not to overstress the product during and after the
soldering process.
The products are not designed for use in any application which requires especially high reliability where
malfunction of these products can reasonably be expected to result in personal injury or damage to the
third party's life, body or property, including and not limited to (i) aircraft equipment, (ii) aerospace
equipment, (iii) undersea equipment, (iv) power plant control equipment, (v) medical equipment,
(vi) transportation equipment, (vii) traffic signal equipment, (viii) disaster prevention / crime prevention
equipment.
The only warranty that Insight SiP provides regarding the products is its conformance to specifications
provided in datasheets. Insight SiP hereby disclaims all other warranties regarding the products, express
or implied, including without limitation any warranty of fitness for a particular purpose, that they are
defect-free, or against infringement of intellectual property rights. Insight SiP customers agree to
indemnify and defend Insight SiP against all claims, damages, costs and expenses that may be incurred,
including without any limitation, attorney fees and costs, due to the use of products.
September 5, 2016
Document Ref: isp_ble_DS1507_R2.docx
Page 20/20
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.

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Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.5
Linearized                      : No
Page Count                      : 20
Language                        : fr-FR
Tagged PDF                      : Yes
Author                          : Gen
Creator                         : Microsoft® Office Word 2007
Create Date                     : 2016:09:05 14:31:11+02:00
Modify Date                     : 2016:09:05 14:31:11+02:00
Producer                        : Microsoft® Office Word 2007

EXIF Metadata provided by EXIF.tools