Johnson WLT2564M BT Module User Manual
Johnson Industries (Shanghai) CO., LTD. BT Module Users Manual
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Users Manual
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JOHNSONINDUSTRIES(SHANGHAI)CO.,LTD.
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WLT2564M module manual
TI CC2564 BR/EDR/LE
MVsilicon BM5064
Spec
V2.0
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Index
1Summary........................................................................................................................................3
1.1Functions.............................................................................................................................3
1.2ApplicationField..................................................................................................................3
2Electricalcharacters.......................................................................................................................4
2.1Basiccharacters................................................................................................ .................4
3powersupply..................................................................................................................................5
3.1Modulepowersupply.........................................................................................................5
3.2theuseofaudiopowersupply............................................................................................5
4moduleplacementandclearancearea..........................................................................................6
4.1 ontheclearanceareainstructions..................................................................................6
4.2ontheclearanceareainstructions......................................................................................6
5Useaudioprecautions....................................................................................................................7
5.1onthesub‐"land"................................................................................................................7
5.2UsedbyMIC_IN...................................................................................................................7
5.2lineout................................................................................................................................7
6PCBDesign.....................................................................................................................................7
7FCC Warning...................................................................................................................................9
8ISED RSS Warning...........................................................................................................................9
6.1Label location.....................................................................................................................7
6.2Example Board...................................................................................................................8
6.3PCB Layout Guide Layout....................................................................................................8
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1Summary
WLT2564MisadualmodeBluetoothmodulewithembeddedBluetopia™protocolstack,support
forallBluetoothprofilesandBLEprofiles.
WLT2564MisbasedonTICC2564.ItisaBluetoothBR/EDR/BLEsinglechipsolution.CC2564has
best‐in‐classRFperformance(TXpower,RXsensitivity,blocking)andadvancedpower
managementforverylow‐powerapplications.
WLT2564MhasahighefficiencyaudioSOCinside.ItisBM5064fromMVSiliconwhichintegrates
ARMCortex‐M3MCU,Bluetoothstack,MP3/WMAdecoder,MP2encoder,OTG,SD/MMCcard
controller,AudioDAC,AudioADC,RTCinasinglechip.
1.1Functions
BluetoothBR/EDR/LE
SupportallBluetoothprofiles,suchasSPP,SPPLE,HFP,MAP,PXP,A2DP,ANP,HID,AVRCP…
EmbeddedARMCortex‐M3,running@96MHz
Built‐in128KbyteSRAM
SupportbootingfromSPI‐flashandthefirmwarecanbeupdatedthroughSDorUSBdisk
Built‐inMP2/MP3/WMA/FLAC(8/16/24bit)/WAV(IMA‐ADPCMandrawPCM)decoderand
MP2encoder
Embedded20‐bitAudioDACand16‐bitAudioADC
Built‐inCaplessEarphonedriver
Built‐inMICamplifyblockwithAGC
Supportaudioinput
Onboard2.4GHzantenna,supportexternalantennaoptional
SupportAT+CommandSetforConfiguration
Singlepowersupply:3.35V~4.2V
Smallestsize:18x35mm
FlexibleSoftwarePlatform,customizedsoftwareservice
1.2ApplicationField
BluetoothSpeaker
TruewirelessstereoAudiosystem
Bluetoothhandsfree
Fitness
WirelessPOS
Portableprinter
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2Electricalcharacters
2.1Basiccharacters
AbsoluteMaximumRatings Min Max Unit
PowersupplyVoltage(LDOIN) –0.5 +5.5 V
VoltageofI/Opins –0.5 +3.6 V
StorageTemperature –55 +125 °C
Table1. AbsoluteMaximumRatings
RecommendedOperatingConditions Min TYP Max Unit
PowersupplyVoltage(LDOIN) 3.35 4.2 V
VoltageofI/Opins 3.03.3 3.6 V
OperatingTemperature ‐30 25 75 °C
Table2. RecommendWorkingCondition
WirelessStandard BluetoothBR/EDR/LE
Frequency2.402GHz~2.480GHz
Max TXpower9dBm
Antennainternal:ceramicantenna Highgainasexternalantenna
Table3.Bluetoothfeatures
I/O pins Test Conditions Min Max Unit
Logic input low, VIL0 0.75V
Logic input high, VIH2.1 3.6V
Logic output low, VOL 6mA 0 0.6V
Logic output high, VOH 6mA 2.7 3.3V
Table4.DCCharacteristicsofI/Opins
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3powersupply
3.1modulepowersupply
Powersupplyinputpin20(LDO_IN);pin21(POWER_ON)toenablethepower,thisfeature
temporarilycannotbeused,needtobepulledhigh;supplyvoltagerangeof3.35~4.2V,
Recommendedbypasscapacitor10uF,0.1uFcombinationfilter(ifyouusetheaudiofunction,
powersupplyprogramseethenextsection).Pin10,18,22,26,40,47,48arethemodule's"ground",
wherepin10isanalogaudioground,directlywiththe"ground"whennotusingaudio.
WLT2564Mmodulepin13(3.3V),45(3.3V)3.3Voutputpinforthemodule(externalpower
supplycannotbecutfromtheexternalpowersupply),youcanusethisoutputpowertodo
somesimplepull‐up,DriveLEDindicator.Thispowersupplyoutputcurrentisonly100mA,notas
ahigh‐powerdevicepowersupply
3.2Theuseofaudiopowersupply
WLT2564Mmodulewithaudioplayback,voicecallsandotherfunctions;
DuetotheworkingmechanismofBluetooth,willcausethesupplycurrentfluctuations,ifyou
needtousetheaudiofunction,theneedtominimizetheimpactofpowersupplyripple;module
powersupplyisrecommendedtodothefollowing.
1. Themodulepowersupplyandaudioamplificationcircuitseparatepowersupply.
2. Powersupply"RC"filterafterthesupplymodule,thepowersupplycircuitinseriesresistance
of10ohmresistor,theresistancepowershouldbegreaterthan0.1W.
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4moduleplacementandclearancearea
WLT2564MfortheRFmodule,itslayoutinthePCBlayoutandcopperroutingwillaffectitsRF
performance,thefollowingspecificdetailsofseveralcases.
4.1Descriptionofplacement
Moduleplacementcanberoughlydividedintothefollowingthreecases
1"placedinthePCBboardcorner,inthiscase,themoduleantennaonbothsideswithout
obstacles,thebestperformance.
2"placedinthePCBboardedge,inwhichcase,themoduleantennaunilateralobstacle,
betterperformance.
3"placedinsidethePCBboard,inwhichcase,thereareobstaclesaroundthemodule
antenna,RFperformanceispoor,
Willaffectitscommunicationdistanceandcommunicationspeed.
4.2ontheclearanceareainstructions
WLT2564Mmoduleantennatobedonebelowtheclearancearea,theclearanceareashould
nothaveanylayerofcopperandtraces,thereshouldnotbecopperstudscrewsandothermetal
objects.
1"Clearanceareashouldnothaveanymetalobjects,themodulefromtheheadroomedge
shouldbegreaterthan10mm,iftheboardedgeofthedevice,theboardedgeallthebetterasa
clearancearea,
Iftheclearanceareaunderthehollow,thatisremovedundertheclearanceareaFR4sheet
performancebetter.
2"Accordingtotheuseoftheenvironment,ifthemoduleantennapartoftheprobeoutofthe
PCBboard,thebetter.
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5Useaudioprecautions
Useofaudiofeatures(includingmusicplaybackandvoicecalls)onthemoduleperformance
requirementsarehigher.Usethefollowingissuesneedattention.Powersupplyonthesecond
chapterhasbeenintroduced,nottoemphasizehere.
5.1onthesub‐"land"
WLT2564Manalogmodulewillbeseparatedout,theusershouldtrytousetheaudiofunctionto
separateanalogtohelpimprovesoundquality
5.2UsedbyMIC_IN
WLT2564MmodulesupportsMICIN,forvoicecallsandaudiopickup,theuseofMIC_IN
whenthemicrophoneorthemicrophonetothegroundandtheanalogmodule(AGND)
connected.
MIC_INpickupamplitudeis50mV,whenuseddirectlytothemicrophoneoutputandMIC_IN
connected,mustnotbeamplifiedmicrophonesignalinputtotheMIC_IN.
5.3LINE_OUT
WLT2564MmoduleLINOUTinterfacecandriveheadphonesorexternalpoweramplifierto
supplyspeakers.Candrive32Europeanheadphones,themaximumoutputpowerof20mW.
Audiosignallinesneedto"land"package,topreventexternalinterference,avoidparallel
wiringwiththepowercord.
6PCBDesign
6.1Label
WLT2564M module FCC ID:2AKDB-WLT2564M ,please refer the below :
PRODUCT: Buletooth module
MODEL: WLT2564M
FCC ID:2AKDB-WLT2564M
IC :22145-WLT2564M
Figure4.Label
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Figure5.Footprintdimensions
6.3PCBLayoutGuide
Bluetoothworksinafrequencyof2.4GHz,thedesignofPCBandMechanicalshouldbecarefulto
avoidtheimpactofvariousfactorsontheRFperformance.Pleasenotethefollowing:
1. OutercasingsurroundingWLT2564Mmoduleshouldavoidusingmetalmaterials.Ifthe
casingismetal,itisrecommendedtouseanexternal2.4GHzantenna.
2. MetalscrewsshouldbefarawayfromRFpartofmodule.
3. Moduleshouldbeplacedontheedgeofmotherboard,ensuretheantennatowardsoutside.
PleasemakesurethatalllayershavenotraceorcopperundertheAntennaregion.
6.2ExampleBoardLayout
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7FCC Warning:
Any Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
FCC Radiation Exposure Statement:
To satisfy FCC RF Exposure requirements for this transmission devices, a separation distance
of 20cm or more should be maintained between the antenna of this device and persons during
operation. To ensure compliance, operation at closer than this distance is not recommended.
The antenna(s) used for this transmitter must not be co-located or operating in conjunction
with any other antenna or transmitter.
This device complies with Innovation,Science and Economic Development Canada licence-
exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may
not cause interference, and (2) this device must accept any interference, including interference
that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'ISED applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.
8ISED RSS Warning:
ISED RF exposure statement :
This equipment complies with ISED RF radiation exposure limits set forth for an uncontrolled
environment .This transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter.
Cet équipement est conforme aux ISED RF limites d'exposition aux radiations dans un
environnement non contrôlé. Cet émetteur ne doit pas être situé ou opérant en conjonction avec
une autre antenne ou émetteur.
The modular transmitter must be equipped with either a permanently affixed label or must
be capable of electronically displaying its FCC identification number:
If using a permanently affixed label, the modular transmitter must be labeled with its own FCC
identification number. and, if the FCC identification number is not visible when the module is
installed inside another device, then the outside of the device into which the module is installed
must also display a label referring to the enclosed module. This exterior label can use wording
such as the following: “Contains Transmitter Module FCC ID:2AKDB-WLT2564M.” Any similar
wording that expresses the same meaning may be used. The Grantee may either provide such a
label, an example of which must be included in the application for equipment authorization, or,
must provide adequate instructions along with the module which explain this requirement. In
the latter case, a copy of these instructions must be included in the application for equipment
authorization.