Johnson WLT2564M BT Module User Manual

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Document Description	Users Manual
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Date Submitted	2016-12-27 00:00:00
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Document Author:	fanwei

JOHNSON INDUSTRIES SHANGHAI CO.,LTD.
WLT2564M module manual
TI CC2564 BR/EDR/LE
MVsilicon BM5064
Spec
V2.0
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JOHNSON INDUSTRIES SHANGHAI CO.,LTD.
Index
Su
a ........................................................................................................................................
. Fu tio s .............................................................................................................................
. Appli atio Field..................................................................................................................
Ele t i al ha a te s .......................................................................................................................4
. Basi ha a te s ............................................................................ .................... .................4
po e suppl ..................................................................................................................................
. Module po e suppl .........................................................................................................
. the use of audio po e suppl ............................................................................................
odule pla e e t a d lea a e a ea ..........................................................................................
o the lea a e a ea i st u tio s ..................................................................................
. o the lea a e a ea i st u tio s ......................................................................................
Use audio p e autio s ....................................................................................................................
. o the su ‐"la d" ................................................................................................................
. Used MIC_IN ...................................................................................................................
. li e out ................................................................................................................................
PCB Desig .....................................................................................................................................
. Label location .....................................................................................................................
. Example Board...................................................................................................................
.3 PCB Layout Guide Layout....................................................................................................
7 FCC Warning ...................................................................................................................................9
8 ISED RSS Warning ...........................................................................................................................9
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JOHNSON INDUSTRIES SHANGHAI CO.,LTD.
Su
WLT
M is a dual ode Bluetooth odule ith e
fo all Bluetooth p ofiles a d BLE p ofiles.
edded Bluetopia™ p oto ol sta k, suppo t
WLT
M is ased o TI CC
. It is a Bluetooth BR/EDR/BLE si gle hip solutio . CC
est‐i ‐ lass RF pe fo a e TX po e , RX se siti it , lo ki g a d ad a ed po e
a age e t fo e lo ‐po e appli atio s.
has
WLT
M has a high effi ie
audio SOC i side. It is BM
f o MVSili o hi h i teg ates
ARM Co te ‐M MCU, Bluetooth sta k, MP /WMA de ode , MP e ode , OTG, SD/MMC a d
o t olle , Audio DAC, Audio ADC, RTC i a si gle hip.
. Fu tio s
Bluetooth BR/EDR/LE
Suppo t all Bluetooth p ofiles, su h as SPP, SPPLE, HFP, MAP, PXP, A DP, ANP, HID, AVRCP…
E edded ARM Co te ‐M , u i g @ MHz
Built‐i
K te SRAM
Suppo t ooti g f o SPI‐flash a d the fi
a e a e updated th ough SD o USB disk
Built‐i MP /MP /WMA/FLAC / / it /WAV IMA‐ADPCM a d a PCM de ode a d
MP e ode
E edded ‐ it Audio DAC a d ‐ it Audio ADC
Built‐i Capless Ea pho e d i e
Built‐i MIC a plif lo k ith AGC
Suppo t audio i put
O oa d . GHz a te a，suppo t e te al a te a optio al
Suppo t AT+Co
a d Set fo Co figu atio
Si gle po e suppl : . V~ . V
S allest size:
Fle i le Soft a e Platfo , usto ized soft a e se i e
. Appli atio Field
Bluetooth Speake
T ue i eless ste eo Audio s ste
Bluetooth ha dsf ee
Fit ess
Wi eless POS
Po ta le p i te
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JOHNSON INDUSTRIES SHANGHAI CO.,LTD.
Ele t i al ha a te s
. Basi
ha a te s
A solute Ma i u
Rati gs
Mi
Ma
U it
Po e suppl Voltage LDOIN
– .
+ .
Voltage of I/O pi s
– .
+ .
°C
Sto age Te pe atu e
Re o
–
Ta le . A solute Ma i u Rati gs
e ded Ope ati g Co ditio s
Mi
Po e suppl Voltage LDOIN
Voltage of I/O pi s
3.0
Ope ati g Te pe atu e
‐
Ta le . Re o
Wi eless Sta da d
A te
Un it
°C
e d Wo ki g Co ditio
GHz～ .
GHz
9dB
High gai as e te al a te
i te al： e a i a te a
Ta le . Bluetooth featu es
I/O pin s
Te st Condit ion s
Logic input low, VI L
Logic input high, VI H
Logic out put low, VOL
Logic out put high, VOH
/ /
Max
Bluetooth BR/EDR/LE
F e ue
Max TX powe
TYP
6m A
M in
Max
Un it
0.75
2.1
3.6
0.6
3.3
6m A
2.7
Ta le . DC Cha a te isti s of I/O pi s
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JOHNSON INDUSTRIES SHANGHAI CO.,LTD.
powe suppl
odule powe suppl
Po e suppl i put pi
LDO_IN ; pi
POWER_ON to e a le the po e , this featu e
te po a il a ot e used, eed to e pulled high; suppl oltage a ge of . ~ . V,
Re o
e ded pass apa ito
uF, . uF o i atio filte if ou use the audio fu tio ,
po e suppl p og a see the e t se tio . Pi
, , , , , , a e the odule's "g ou d",
he e pi
is a alog audio g ou d, di e tl ith the "g ou d" he ot usi g audio.
WLT
M odule pi
. V,
. V . V output pi fo the odule e te al po e
suppl a ot e ut f o the e te al po e suppl , ou a use this output po e to do
so e si ple pull‐up, D i e LED i di ato . This po e suppl output u e t is o l
A, ot as
a high‐po e de i e po e suppl
. The use of audio powe suppl
WLT
M odule ith audio pla a k, oi e alls a d othe fu tio s;
Due to the o ki g e ha is of Bluetooth, ill ause the suppl u e t flu tuatio s, if ou
eed to use the audio fu tio , the eed to i i ize the i pa t of po e suppl ipple; odule
po e suppl is e o
e ded to do the follo i g.
. The odule po e suppl a d audio a plifi atio i uit sepa ate po e suppl .
. Po e suppl "RC" filte afte the suppl odule, the po e suppl i uit i se ies esista e
of oh esisto , the esista e po e should e g eate tha . W.
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JOHNSON INDUSTRIES SHANGHAI CO.,LTD.
odule pla e e t a d lea a e a ea
WLT
M fo the RF odule, its la out i the PCB la out a d oppe outi g ill affe t its RF
pe fo a e, the follo i g spe ifi details of se e al ases.
. Des iptio of pla e e t
Module pla e e t a
e oughl di ided i to the follo i g th ee ases
"pla ed i the PCB oa d o e , i this ase, the odule a te a o oth sides ithout
o sta les, the est pe fo a e.
"pla ed i the PCB oa d edge, i hi h ase, the odule a te a u ilate al o sta le,
ette pe fo a e.
"pla ed i side the PCB oa d, i hi h ase, the e a e o sta les a ou d the odule
a te a, RF pe fo a e is poo ,
Will affe t its o
u i atio dista e a d o
u i atio speed.
. o the lea a e a ea i st u tio s
WLT
M odule a te a to e do e elo the lea a e a ea, the lea a e a ea should
ot ha e a la e of oppe a d t a es, the e should ot e oppe stud s e s a d othe etal
o je ts.
"Clea a e a ea should ot ha e a
etal o je ts, the odule f o the head oo edge
should e g eate tha
, if the oa d edge of the de i e, the oa d edge all the ette as a
lea a e a ea,
If the lea a e a ea u de the hollo , that is e o ed u de the lea a e a ea FR sheet
pe fo a e ette .
"A o di g to the use of the e i o e t, if the odule a te a pa t of the p o e out of the
PCB oa d, the ette .
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JOHNSON INDUSTRIES SHANGHAI CO.,LTD.
Use audio p ecautio s
Use of audio featu es i ludi g usi pla a k a d oi e alls o the odule pe fo a e
e ui e e ts a e highe . Use the follo i g issues eed atte tio . Po e suppl o the se o d
hapte has ee i t odu ed, ot to e phasize he e.
. o the su ‐"la d"
WLT
M a alog odule ill e sepa ated out, the use should t
sepa ate a alog to help i p o e sou d ualit
. Used
to use the audio fu tio to
MIC_IN
WLT
M odule suppo ts MIC IN, fo oi e alls a d audio pi kup, the use of MIC_IN
he the i opho e o the i opho e to the g ou d a d the a alog odule AGND
o e ted.
MIC_IN pi kup a plitude is
V, he used di e tl to the i opho e output a d MIC_IN
o e ted, ust ot e a plified i opho e sig al i put to the MIC_IN.
. LINE_OUT
WLT
M odule LIN OUT i te fa e a d i e headpho es o e te al po e a plifie to
suppl speake s. Ca d i e Eu opea headpho es, the a i u output po e of
W.
Audio sig al li es eed to "la d" pa kage, to p e e t e te al i te fe e e, a oid pa allel
i i g ith the po e o d.
PCB Desig
. Label
WLT2564M module FCC ID:2AKDB-WLT2564M ,please refer the below :
PRODUCT: Buletooth module
MODEL: WLT2564M
FCC ID:2AKDB-WLT2564M
IC :22145-WLT2564M
Figu e 4. Label
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JOHNSON INDUSTRIES SHANGHAI CO.,LTD.
6.2 E a ple Boa d La out
Figu e 5. Footp i t di e sio s
6.3 PCB La out Guide
Bluetooth o ks i a f e ue
of . GHz, the desig of PCB a d Me ha i al should e a eful to
a oid the i pa t of a ious fa to s o the RF pe fo a e. Please ote the follo i g:
. Oute asi g su ou di g WLT
M odule should a oid usi g etal ate ials. If the
asi g is etal, it is e o
e ded to use a e te al . GHz a te a.
. Metal s e s should e fa a a f o RF pa t of odule.
. Module should e pla ed o the edge of othe oa d, e su e the a te a to a ds outside.
Please ake su e that all la e s ha e o t a e o oppe u de the A te a egio .
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JOHNSON INDUSTRIES SHANGHAI CO.,LTD.
7 FCC Warning:
Any Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
The modular transmitter must be equipped with either a permanently affixed label or must
be capable of electronically displaying its FCC identification number：
If using a permanently affixed label, the modular transmitter must be labeled with its own FCC
identification number. and, if the FCC identification number is not visible when the module is
installed inside another device, then the outside of the device into which the module is installed
must also display a label referring to the enclosed module. This exterior label can use wording
such as the following: “Contains Transmitter Module FCC ID:2AKDB-WLT2564M.” Any similar
wording that expresses the same meaning may be used. The Grantee may either provide such a
label, an example of which must be included in the application for equipment authorization, or,
must provide adequate instructions along with the module which explain this requirement. In
the latter case, a copy of these instructions must be included in the application for equipment
authorization.
FCC Radiation Exposure Statement:
To satisfy FCC RF Exposure requirements for this transmission devices, a separation distance
of 20cm or more should be maintained between the antenna of this device and persons during
operation. To ensure compliance, operation at closer than this distance is not recommended.
The antenna(s) used for this transmitter must not be co-located or operating in conjunction
with any other antenna or transmitter.
8 ISED RSS Warning:
This device complies with Innovation,Science and Economic Development Canada licenceexempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may
not cause interference, and (2) this device must accept any interference, including interference
that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'ISED applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.
ISED RF exposure statement :
This equipment complies with ISED RF radiation exposure limits set forth for an uncontrolled
environment .This transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter.
Cet équipement est conforme aux ISED RF limites d'exposition aux radiations dans un
environnement non contrôlé. Cet émetteur ne doit pas être situé ou opérant en conjonction avec
une autre antenne ou émetteur.
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