Johnson WLT2564M BT Module User Manual
Johnson Industries (Shanghai) CO., LTD. BT Module Users Manual
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Users Manual
JOHNSON INDUSTRIES SHANGHAI CO.,LTD. WLT2564M module manual TI CC2564 BR/EDR/LE MVsilicon BM5064 Spec V2.0 / / /9 . JOHNSON INDUSTRIES SHANGHAI CO.,LTD. Index Su a ........................................................................................................................................ . Fu tio s ............................................................................................................................. . Appli atio Field.................................................................................................................. Ele t i al ha a te s .......................................................................................................................4 . Basi ha a te s ............................................................................ .................... .................4 po e suppl .................................................................................................................................. . Module po e suppl ......................................................................................................... . the use of audio po e suppl ............................................................................................ odule pla e e t a d lea a e a ea .......................................................................................... o the lea a e a ea i st u tio s .................................................................................. . o the lea a e a ea i st u tio s ...................................................................................... Use audio p e autio s .................................................................................................................... . o the su ‐"la d" ................................................................................................................ . Used MIC_IN ................................................................................................................... . li e out ................................................................................................................................ PCB Desig ..................................................................................................................................... . Label location ..................................................................................................................... . Example Board................................................................................................................... .3 PCB Layout Guide Layout.................................................................................................... 7 FCC Warning ...................................................................................................................................9 8 ISED RSS Warning ...........................................................................................................................9 / / /9 . JOHNSON INDUSTRIES SHANGHAI CO.,LTD. Su WLT M is a dual ode Bluetooth odule ith e fo all Bluetooth p ofiles a d BLE p ofiles. edded Bluetopia™ p oto ol sta k, suppo t WLT M is ased o TI CC . It is a Bluetooth BR/EDR/BLE si gle hip solutio . CC est‐i ‐ lass RF pe fo a e TX po e , RX se siti it , lo ki g a d ad a ed po e a age e t fo e lo ‐po e appli atio s. has WLT M has a high effi ie audio SOC i side. It is BM f o MVSili o hi h i teg ates ARM Co te ‐M MCU, Bluetooth sta k, MP /WMA de ode , MP e ode , OTG, SD/MMC a d o t olle , Audio DAC, Audio ADC, RTC i a si gle hip. . Fu tio s Bluetooth BR/EDR/LE Suppo t all Bluetooth p ofiles, su h as SPP, SPPLE, HFP, MAP, PXP, A DP, ANP, HID, AVRCP… E edded ARM Co te ‐M , u i g @ MHz Built‐i K te SRAM Suppo t ooti g f o SPI‐flash a d the fi a e a e updated th ough SD o USB disk Built‐i MP /MP /WMA/FLAC / / it /WAV IMA‐ADPCM a d a PCM de ode a d MP e ode E edded ‐ it Audio DAC a d ‐ it Audio ADC Built‐i Capless Ea pho e d i e Built‐i MIC a plif lo k ith AGC Suppo t audio i put O oa d . GHz a te a,suppo t e te al a te a optio al Suppo t AT+Co a d Set fo Co figu atio Si gle po e suppl : . V~ . V S allest size: Fle i le Soft a e Platfo , usto ized soft a e se i e . Appli atio Field Bluetooth Speake T ue i eless ste eo Audio s ste Bluetooth ha dsf ee Fit ess Wi eless POS Po ta le p i te / / /9 . JOHNSON INDUSTRIES SHANGHAI CO.,LTD. Ele t i al ha a te s . Basi ha a te s A solute Ma i u Rati gs Mi Ma U it Po e suppl Voltage LDOIN – . + . Voltage of I/O pi s – . + . °C Sto age Te pe atu e Re o – Ta le . A solute Ma i u Rati gs e ded Ope ati g Co ditio s Mi Po e suppl Voltage LDOIN Voltage of I/O pi s 3.0 Ope ati g Te pe atu e ‐ Ta le . Re o Wi eless Sta da d A te Un it °C e d Wo ki g Co ditio GHz~ . GHz 9dB High gai as e te al a te i te al: e a i a te a Ta le . Bluetooth featu es I/O pin s Te st Condit ion s Logic input low, VI L Logic input high, VI H Logic out put low, VOL Logic out put high, VOH / / Max Bluetooth BR/EDR/LE F e ue Max TX powe TYP 6m A M in Max Un it 0.75 2.1 3.6 0.6 3.3 6m A 2.7 Ta le . DC Cha a te isti s of I/O pi s /9 . JOHNSON INDUSTRIES SHANGHAI CO.,LTD. powe suppl odule powe suppl Po e suppl i put pi LDO_IN ; pi POWER_ON to e a le the po e , this featu e te po a il a ot e used, eed to e pulled high; suppl oltage a ge of . ~ . V, Re o e ded pass apa ito uF, . uF o i atio filte if ou use the audio fu tio , po e suppl p og a see the e t se tio . Pi , , , , , , a e the odule's "g ou d", he e pi is a alog audio g ou d, di e tl ith the "g ou d" he ot usi g audio. WLT M odule pi . V, . V . V output pi fo the odule e te al po e suppl a ot e ut f o the e te al po e suppl , ou a use this output po e to do so e si ple pull‐up, D i e LED i di ato . This po e suppl output u e t is o l A, ot as a high‐po e de i e po e suppl . The use of audio powe suppl WLT M odule ith audio pla a k, oi e alls a d othe fu tio s; Due to the o ki g e ha is of Bluetooth, ill ause the suppl u e t flu tuatio s, if ou eed to use the audio fu tio , the eed to i i ize the i pa t of po e suppl ipple; odule po e suppl is e o e ded to do the follo i g. . The odule po e suppl a d audio a plifi atio i uit sepa ate po e suppl . . Po e suppl "RC" filte afte the suppl odule, the po e suppl i uit i se ies esista e of oh esisto , the esista e po e should e g eate tha . W. / / /9 . JOHNSON INDUSTRIES SHANGHAI CO.,LTD. odule pla e e t a d lea a e a ea WLT M fo the RF odule, its la out i the PCB la out a d oppe outi g ill affe t its RF pe fo a e, the follo i g spe ifi details of se e al ases. . Des iptio of pla e e t Module pla e e t a e oughl di ided i to the follo i g th ee ases "pla ed i the PCB oa d o e , i this ase, the odule a te a o oth sides ithout o sta les, the est pe fo a e. "pla ed i the PCB oa d edge, i hi h ase, the odule a te a u ilate al o sta le, ette pe fo a e. "pla ed i side the PCB oa d, i hi h ase, the e a e o sta les a ou d the odule a te a, RF pe fo a e is poo , Will affe t its o u i atio dista e a d o u i atio speed. . o the lea a e a ea i st u tio s WLT M odule a te a to e do e elo the lea a e a ea, the lea a e a ea should ot ha e a la e of oppe a d t a es, the e should ot e oppe stud s e s a d othe etal o je ts. "Clea a e a ea should ot ha e a etal o je ts, the odule f o the head oo edge should e g eate tha , if the oa d edge of the de i e, the oa d edge all the ette as a lea a e a ea, If the lea a e a ea u de the hollo , that is e o ed u de the lea a e a ea FR sheet pe fo a e ette . "A o di g to the use of the e i o e t, if the odule a te a pa t of the p o e out of the PCB oa d, the ette . / / /9 . JOHNSON INDUSTRIES SHANGHAI CO.,LTD. Use audio p ecautio s Use of audio featu es i ludi g usi pla a k a d oi e alls o the odule pe fo a e e ui e e ts a e highe . Use the follo i g issues eed atte tio . Po e suppl o the se o d hapte has ee i t odu ed, ot to e phasize he e. . o the su ‐"la d" WLT M a alog odule ill e sepa ated out, the use should t sepa ate a alog to help i p o e sou d ualit . Used to use the audio fu tio to MIC_IN WLT M odule suppo ts MIC IN, fo oi e alls a d audio pi kup, the use of MIC_IN he the i opho e o the i opho e to the g ou d a d the a alog odule AGND o e ted. MIC_IN pi kup a plitude is V, he used di e tl to the i opho e output a d MIC_IN o e ted, ust ot e a plified i opho e sig al i put to the MIC_IN. . LINE_OUT WLT M odule LIN OUT i te fa e a d i e headpho es o e te al po e a plifie to suppl speake s. Ca d i e Eu opea headpho es, the a i u output po e of W. Audio sig al li es eed to "la d" pa kage, to p e e t e te al i te fe e e, a oid pa allel i i g ith the po e o d. PCB Desig . Label WLT2564M module FCC ID:2AKDB-WLT2564M ,please refer the below : PRODUCT: Buletooth module MODEL: WLT2564M FCC ID:2AKDB-WLT2564M IC :22145-WLT2564M Figu e 4. Label / / 7/9 . JOHNSON INDUSTRIES SHANGHAI CO.,LTD. 6.2 E a ple Boa d La out Figu e 5. Footp i t di e sio s 6.3 PCB La out Guide Bluetooth o ks i a f e ue of . GHz, the desig of PCB a d Me ha i al should e a eful to a oid the i pa t of a ious fa to s o the RF pe fo a e. Please ote the follo i g: . Oute asi g su ou di g WLT M odule should a oid usi g etal ate ials. If the asi g is etal, it is e o e ded to use a e te al . GHz a te a. . Metal s e s should e fa a a f o RF pa t of odule. . Module should e pla ed o the edge of othe oa d, e su e the a te a to a ds outside. Please ake su e that all la e s ha e o t a e o oppe u de the A te a egio . / / 8/9 . JOHNSON INDUSTRIES SHANGHAI CO.,LTD. 7 FCC Warning: Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number: If using a permanently affixed label, the modular transmitter must be labeled with its own FCC identification number. and, if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID:2AKDB-WLT2564M.” Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. FCC Radiation Exposure Statement: To satisfy FCC RF Exposure requirements for this transmission devices, a separation distance of 20cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 8 ISED RSS Warning: This device complies with Innovation,Science and Economic Development Canada licenceexempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'ISED applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. ISED RF exposure statement : This equipment complies with ISED RF radiation exposure limits set forth for an uncontrolled environment .This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Cet équipement est conforme aux ISED RF limites d'exposition aux radiations dans un environnement non contrôlé. Cet émetteur ne doit pas être situé ou opérant en conjonction avec une autre antenne ou émetteur. / / 9/9
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