Jorjin Technologies WG1400-00 Wireless module User Manual WG1400 00 DTS D05 20151125

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a module solution provider
WG1400-00
TI CC3100 IEEE 802.11 b/g/n
Datasheet
Draft 0.5
Nov/25/2015
Prepared By
Reviewed By
Copyright © JORJIN TECHNOLOGIES INC. 2015
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Approved By
Doc No: WG1400-00-DTS-D05
Index
1.
OVERVIEW ............................................................................................................................... 2
1.1.
1.2.
General Features ...............................................................................................2
Applications .......................................................................................................3
2.
MODULE BLOCK DIAGRAM ................................................................................................. 4
3.
PRODUCTION SPECIFICATIONS .......................................................................................... 5
3.1.
3.2.
Absolute Maximum ratings ...............................................................................5
Recommended Operating Conditions ...........................................................5
3.3.
3.4.
3.5.
Electrical characteristics ...................................................................................5
WLAN RF Specifications ....................................................................................6
SPI Interface .......................................................................................................7
3.6.
3.7.
Input Clocks/Oscillators ....................................................................................8
Current Consumption .......................................................................................8
4.
REFERENCE SCHEMATICS ..................................................................................................... 9
5.
PIN OUT (TOP VIEW) ............................................................................................................ 10
5.1.
5.2.
5.3.
Pin Description .................................................................................................11
Package Information ......................................................................................13
RF Connector ...................................................................................................14
6.
MODULE MECHANICAL OUTLINE ..................................................................................... 15
7.
SMT AND BAKING RECOMMENDATION ......................................................................... 16
7.1.
7.2.
8.
Baking Recommendation ..............................................................................16
SMT RECOMMENDATION .......................................................................................16
HISTORY CHANGE ............................................................................................................... 17
Copyright © JORJIN TECHNOLOGIES INC. 2015
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1. OVERVIEW
1.1. General Features
WIFI Network Processor Subsystems
Featuring Wi-Fi Internet-On-a-Chip™
Wi-Fi Driver and Multiple Internet Protocols in ROM
802.11 b/g/n Radio, Baseband, and MAC, Wi-Fi Driver, and Supplicant
Powerful Crypto Engine for Fast, Secure Wi-Fi and Internet Connections with 256-Bit AES
Encryption for TLS and SSL Connections
Station, AP, and Wi-Fi Direct Modes
WPA2 Personal and Enterprise Security
SimpleLink Connection Manager for Autonomous and Fast Wi-Fi Connections
Smart Config™ Technology, AP Mode, and WPS2 for Easy and Flexible Wi-Fi Provisioning
Application Throughput
UDP : 16 Mbps
TCP : 12 Mbps
Host Interface
 Interfaces with 8-, 16-, and 32-bit MCU or ASICs Over SPI or UART Interface
Low External Host Driver Footprint: Less Than 7 KB of Code Memory and 700 B of RAM
Memory Required for TCP Client Application
SimpleLink Advanced Features
 Embedded Wi-Fi Connection Manager with No Host Processor involvement
Smart Config Provisioning Utility to Configure Headless Devices Using a Smart Phone with
a Single Click
BSD Socket APIs for Standard and Easy Internet Applications Development
Powerful HW Crypto Engine for Fast State- of-the-Art Wi-Fi and Internet Security
Programmable Packet Filters in MAC and IP Layer to Optimize Power Consumption
Power Management Subsystem
 Integrated DC-DC Supports a Wide Range of Supply Voltage:
VBAT Wide-Voltage Mode : 2.3 to 3.6 V
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Advanced Low-Power Modes
Hibernate with RTC:
4 μA
Low-Power Deep Sleep (LPDS):
RX Traffic (MCU Active): 53 mA @ 54 OFDM
TX Traffic (MCU Active): 223 mA @ 54 OFDM, Maximum Power
Idle Connected: 690 μA @ DTIM = 1
115 μA
Clock Source
40.0-MHz internal built-in crystal
32.768-kHz external clock source
Package and Operating Temperature
 23.5mm*23.5mm*2.4mm
Ambient Temperature Range: -30°C to 85°C
1.2. Applications
For Internet-of-Things applications, such as:

 Home Automation and Security

 Cloud Connectivity

 Smart Energy

 Industrial Control

 Access Control

 Smart Plug and Metering

 Wireless Audio

 IP Network Sensor Nodes
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2. MODULE BLOCK DIAGRAM
Fig 2.1 WG1400-00 module block diagram
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3. PRODUCTION SPECIFICATIONS
3.1. Absolute Maximum ratings
Over operating free-air temperature range
PARAMETERS
PINS
MIN
MAX
UNIT
3,4,6
-0.5
3.8
Digital inputs
-0.5
VBAT+0.5
RF pins
-0.5
2.1
Analog pins (Clock input)
-0.5
2.1
Operating temperature range (TA)
-30
+85
°C
VBAT
3.2. Recommended Operating Conditions
Over operating free-air temperature range (1)
PARAMETERS
VBAT
PINS
CONDITIONS(2)
MIN
TYP
MAX
UNIT
3,4,6
Direct battery connection
2.3
3.3
3.6
20
°C /minute
Ambient thermal slew
-20
(1) Operating temperature is limited by crystal frequency variation.
(2) To ensure WLAN performance, ripple on the 2.1- to 3.3-V supply must be less than ±300 mV.
3.3. Electrical characteristics
3.3 V, 25°C
PARAMETER
MIN
NOM
MAX
UNIT
CIN
Pin capacitance
pF
VIH
High-level input voltage
0.65 × VBAT_IN
VBAT_IN + 0.5 V
VIL
Low-level input voltage
-0.5
0.35 × VBAT_IN
IIH
High-level input current
nA
IIL
Low-level input current
nA
VOH
High-level output voltage
2.4
(VBAT_IN = 3.0V)
VOL
Low-level output voltage
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(VBAT_IN = 3.0V)
IOH
High-level source current, VOH = 2.4
mA
IOL
Low-level sink current, VOH = 0.4
mA
Pin internal Pull up and Pull down (25°C))
PARAMETER
IOH
MIN
Pull-Up current, VOH = 2.4
NOM
MAX
UNIT
10
μA
(VBAT_IN = 3.0V)
IOH
Pull-Down current, VOL = 0.4
μA
(VBAT_IN = 3.0V)
3.4. WLAN RF Specifications
WLAN Receiver Characteristics
Parameter
Condition (Mbps)
Sensitivity
(8% PER for 11b rates, 10% PER for
11g/11n rates)(10% PER)
Typ
1 DSSS
-92.5
11 CCK
-86.3
6 OFDM
-86.1
54 OFDM
-71.2
MCS0
-84.1
MCS7
-67.3
802.11b
-4.0
802.11g
-10.0
Maximum input level (10% PER)
Min
Max
Units
dBm
WLAN Transmitter Characteristics
Parameter
Condition
Maximum RMS output power
measured at 1 dB from IEEE spectral
mask or EVM
Min
Typ
1 DSSS
16.0
11 CCK
16.0
6 OFDM
15.5
54 OFDM
12.5
MCS0
15.0
MCS7
11.0
Max
Units
dBm
Output power accuracy
-2
dB
Transmit center frequency accuracy
-25
25
ppm
(1) Channel-to-channel variation is up to 2dB. The edge channels (2412 and 2472MHz) have
reduced TX power to meet FCC emission limits.
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3.5. SPI Interface
Host SPI Interface timing
Fig 3.5.1 Host SPI interface timing
Table 3.5.1 Host SPI interface timing parameter
Parameter
Parameter (1)
Parameter Name
Min
Max
Unit
I1
Clock frequency @ VBAT = 3.3V
20
MHz
I2
tdk
Clock period
I3
tLP
Clock low period
25
ns
I4
tHT
Clock high period
25
ns
I5
Duty cycle
45
55
I6
tIS
RX data setup time
ns
I7
tIH
RX data hold time
ns
I8
tOD
TX data output delay
20
I9
tOH
TX data hold time
24
Number
50
ns
ns
(1) The timing parameter has a maximum load of 20 pF at 3.3 V.
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3.6. Input Clocks/Oscillators
Table 3.6.1 External RTC Digital Clock Requirements
CHARACTERISTICS
CONDITION
SYM
MIN
Frequency
TYP
MAX
32768
UNIT
Hz
Frequency accuracy
±150
ppm
100
ns
80
(Initial + temp + aging)
Input transition time tr/tf (10% to 90%)
tr/tf
Frequency input duty cycle
20
Slow clock input voltage limits
50
Square wave,
Vih
0.65 × VBAT
VBAT
DC coupled
Vil
0.35 × VBAT
Vpeak
Input impedance
MΩ
pF
3.7. Current Consumption
Mode
Active Mode
Low Power Mode
Condition
Typical Current at 3.3V
11 Mbps TX at 16dBm
240mA
54 Mbps TX at 12.5dBm
185mA
RX at 54Mbps
51mA
LPDS (low-power deep sleep)
100μA
Hibernate
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4μA
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4. REFERENCE SCHEMATICS
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5. PIN OUT (TOP VIEW)
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5.1. Pin Description
Pin
No.
Signal Name
State at
Reset
Type
GND
GND
GND
nRESET
HI-Z
Description
Ground.
RESET input for the device. Active low
input. The RC circuit (100K∥0.1μF)
has been built in internal for power
reset.
VBAT_IN
POW
POW
Power supply input, 2.1 to 3.6V.
VBAT_IN
POW
POW
Power supply input, 2.1 to 3.6V.
GND
GND
GND
Ground.
NC_06
HI-Z
NA
GND
GND
GND
EXT_RTC_IN
HI-Z
Analog
UART_RTS
HI-Z
Unused. Leave unconnected.
Ground.
32.768-KHz / External clock input.
UART host interface. Connect to test
point on prototype for flash
programming.
10
UART_TX
HI-Z
UART host interface. Connect to test
point on prototype for flash
programming.
11
UART_RX
HI-Z
UART host interface. Connect to test
point on prototype for flash
programming.
12
UART_CTS
HI-Z
UART host interface. Connect to test
point on prototype for flash
programming.
13
NC_13
HI-Z
NA
Unused. Leave unconnected.
14
NC_14
HI-Z
NA
Unused. Leave unconnected.
15
NC_15
HI-Z
NA
Unused. Leave unconnected.
16
NC_16
HI-Z
NA
Unused. Leave unconnected.
17
NC_17
HI-Z
NA
Unused. Leave unconnected.
18
NC_18
HI-Z
NA
Unused. Leave unconnected.
19
HIBERNATE
HI-Z
Hibernate signal input to the NWP
(active low). If the Hibernate function
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Doc No: WG1400-00-DTS-D05
is not used, connect to VBAT using
100K for pulling-up.
20
NC_20
HI-Z
NA
21
FORCE_AP
HI-Z
Unused. Leave unconnected.
For forced AP mode, pull high on the
board using 100K resistor. Otherwise,
pull down to ground using 100K
resistor.
22
GND
GND
GND
23
HOST_SPI_CLK
HI-Z
Host interface SPI clock.
24
HOST_SPI DIN
HI-Z
Host interface SPI data input.
25
HOST_SPI_DOUT
HI-Z
Host interface SPI data output.
26
HOST_SPI_CS
HI-Z
Host interface SPI chip select.
27
HOST_IRQ
HI-Z
Interrupt output.
28
ANT_SEL_1
HI-Z
Antenna selection control. For future
Ground.
use only.
29
ANT_SEL_2
HI-Z
Antenna selection control. For future
use only.
30
TCXO_EN/SOP2
HI-Z
Pull down to ground using 100K
resistor
31
NC_31
HI-Z
NA
Unused. Leave unconnected.
32
NC_32
HI-Z
NA
Unused. Leave unconnected.
33
GND
GND
GND
Ground.
34
GND
GND
GND
Ground.
35
GND
GND
GND
Ground.
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5.2. Package Information
Top view (Unit: mm)
Bottom view (Unit: mm)
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5.3. RF Connector
P/N : U.FL-R-SMT-1 (U.FL Series) from HIROSE.
Fig 5.3.1 RF connector drawing
Table for Filed Antenna
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6. MODULE MECHANICAL OUTLINE
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7. SMT AND BAKING RECOMMENDATION
7.1. Baking Recommendation
Baking condition：
Follow MSL Level 4 to do baking process.
After bag is opened, devices that will be subjected to reflow solder or other high
temperature process must be
a) Mounted within 72 hours of factory conditions <30°C/60% RH, or
b) Stored at <10% RH.
- Devices require bake, before mounting, if Humidity Indicator Card reads >10%
If baking is required, Devices may be baked for 8 hrs. at 125 °C.
7.2. SMT Recommendation
Recommended Reflow profile：
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No.
Item
Temperature (°C)
Time (sec)
Pre-heat
D1: 140 ~ D2: 200
T1: 80 ~ 120
Soldering
D2: = 220
T2: 60 +/- 10
Peak-Temp.
Note:
D3: 250 °C max
(1) Reflow soldering is recommended two times maximum.
(2) Add Nitrogen while Reflow process： SMT solder ability will be better.
Stencil thickness：
： 0.1~ 0.13 mm (Recommended)
Soldering paste (without Pb)：
： Recommended SENJU N705-GRN3360-K2-V can get
better soldering effects.
8. HISTORY CHANGE
Revision
Date
0.1
2014/10/14
Initial Released
0.2
2015/03/13
1. Revise RF Specifications.
Description
2. Redraw reference schematic.
3. Add Recommended Operating Conditions.
4. Add SMT AND BAKING RECOMMENDATION
0.3
2015/04/24
Revise the Ambient Temperature Range
0.4
2015/05/06
1. Add RF connector.
2. Revise the Recommended Operating Conditions.
0.5
2015/11/25
1. Add FCC statement.
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FCC Statement
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment
off and on, the user is encouraged to try to correct the interference by one or more of the following
measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
—Consult the dealer or an experienced radio/TV technician for help.
FCC Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled environment
and it also complies with Part 15 of the FCC RF Rules. This equipment must be installed and
operated in accordance with provided instructions and the antenna(s) used for this transmitter must
be installed to provide a separation distance of at least 20 cm from all persons and must not be
co-located or operating in conjunction with any other antenna or transmitter. End-users and
installers must be provided with antenna installation instructions and consider removing the
no-collocation statement.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause
undesired operation.
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20cm is maintained between the antenna and users,
and
2) The transmitter module may not be co-located with any other transmitter or antenna,
3) For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for
2.4Gband by supplied firmware programming tool. OEM shall not supply any tool or info to the
end-user regarding to Regulatory Domain change.
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As long as 3 conditions above are met, further transmitter test will not be required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed.
IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or
co-location with another transmitter), then the FCC authorization is no longer considered valid and
the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and obtaining a separate
FCC authorization.
End Product Labelling
The final end product must be labelled in a visible area with the following:
“Contains FCC ID:WS2-WG1400-00.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to
install or remove this RF module in the user’s manual of the end product which integrates this
module.
Caution!
Any changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate the equipment.
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Canada Statement
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the
following two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio
exempts de licence. L’exploitation est autorisée aux deux conditions suivantes :
(1) l’appareil ne doit pas produire de brouillage;
(2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d’en compromettre le fonctionnement.
The device meets the exemption from the routine evaluation limits in section 2.5 of RSS 102 and
compliance with RSS-102 RF exposure, users can obtain Canadian information on RF exposure and
compliance.
Le dispositif rencontre l'exemption des limites courantes d'évaluation dans la section 2.5 de RSS 102
et la conformité à l'exposition de RSS-102 rf, utilisateurs peut obtenir l'information canadienne sur
l'exposition et la conformité de rf.
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter. This equipment should be installed and operated with a minimum distance of 20
centimeters between the radiator and your body.
Cet émetteur ne doit pas être Co-placé ou ne fonctionnant en même temps qu'aucune autre
antenne ou émetteur. Cet équipement devrait être installé et actionné avec une distance minimum
de 20 centimètres entre le radiateur et votre corps.
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20cm is maintained between the antenna and users,
and
2) The transmitter module may not be co-located with any other transmitter or antenna,
3) For all products market in Industry Canada, OEM has to limit the operation channels in CH1 to
CH11 for 2.4Gband by supplied firmware programming tool. OEM shall not supply any tool or
info to the end-user regarding to Regulatory Domain change.
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Doc No: WG1400-00-DTS-D05
As long as 3 conditions above are met, further transmitter test will not be required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:
1) L'antenne doit être installé de telle sorte que 20 cm est maintenue entre l'antenne et les
utilisateurs, et
2) Le module émetteur peut pas être co-localisé avec un autre émetteur ou antenne,
3) Pour tout marché des produits d'Industrie Canada, OEM doit limiter les canaux de coopération
dans CH1 à CH11 pour 2.4Gband par l'outil de programmation du firmware fourni. OEM ne doit pas
fournir un outil ou d'information à l'utilisateur final en ce qui concerne le changement de domaine
réglementaire.
Tant que 3 conditions ci-dessus sont remplies, autre test de l'émetteur ne sera pas nécessaire.
Cependant, l'intégrateur OEM est toujours responsable de tester leur produit final pour toutes les
exigences de conformité supplémentaires nécessaires avec ce module installé.
IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or
co-location with another transmitter), then the IC authorization is no longer considered valid and
the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and obtaining a separate IC
authorization.
Dans le cas où ces conditions ne peuvent être remplies (par exemple certaines configurations
d'ordinateurs portables ou de co-localisation avec un autre émetteur), puis l'autorisation IC est plus
considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances,
l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention
d'une autorisation IC séparée.
End Product Labelling
This transmitter module is authorized only for use in device where the antenna may be installed
such that 20cm may be maintained between the antenna and users. The final end product must be
labelled in a visible area with the following:
“Contains IC: 10462A-WG140000"
Ce module émetteur est autorisé uniquement pour une utilisation dans le dispositif où l'antenne
peut être installé de telle sorte que 20cm peut être maintenue entre l'antenne et les utilisateurs. Le
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Doc No: WG1400-00-DTS-D05
produit final doit être étiqueté dans un endroit visible par le texte suivant:
"Contient IC: 10462A-WG140000"
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to
install or remove this RF module in the user’s manual of the end product which integrates this
module.
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final sur la
façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui
intègre ce module.
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Modify Date                     : 2015:11:25 14:41:26+08:00
Create Date                     : 2015:11:25 14:41:26+08:00
Creator Tool                    : PScript5.dll Version 5.2.2
Document ID                     : 0cc44cf0-959b-11e5-0000-0e2889e41e85
Format                          : application/pdf
Title                           : Microsoft Word - WG1400-00-DTS-D05_20151125
Creator                         : NOC028
Author                          : NOC028

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