Jorjin Technologies WG7833B0 Wireless Module User Manual WG7833 B0 DTS R03 20150731

Jorjin Technologies Inc. Wireless Module WG7833 B0 DTS R03 20150731

Contents

User Manual

Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL a module solution provider WG7833-B0 WLAN/BT Module TI WiLink8 IEEE 802.11a/b/g/n BT/BLE Solution Datasheet Revision 0.3
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 1Index 1. OVERVIEW ................................................................................................................................... 4 1.1. MODELS FUNCTIONAL BLOCKS ................................................................................................ 4 1.2. GENERAL FEATURES ................................................................................................................. 4 2. FUNCTIONAL FEATURES ............................................................................................................ 5 2.1. MODULE BLOCK DIAGRAM ..................................................................................................... 5 2.2. BLOCK FUNCTIONAL FEATURE .................................................................................................. 5 2.2.1. WLAN Features .......................................................................................................... 5 2.2.2. Bluetooth Features.................................................................................................... 6 2.2.3. BLE Features ................................................................................................................ 6 2.2.4. ANT Features .............................................................................................................. 7 3. MODULE OUTLINE ....................................................................................................................... 8 3.1. SIGNAL LAYOUT (TOP VIEW).................................................................................................... 8 3.2. PIN DESCRIPTION ..................................................................................................................... 9 4. MODULE SPECIFICATION ....................................................................................................... 13 4.1. GENERAL MODULE REQUIREMENTS AND OPERATION ............................................................ 13 4.1.1. Absolute Maximum Ratings (1) ............................................................................. 13 4.1.2. Recommended Operating Conditions ............................................................ 14 4.1.3. External Slow Clock Input (SLOW_CLK) ............................................................ 15 4.1.4. External Fast Clock Requirements (-40 to +85°C) .......................................... 15 4.2. WLAN RF PERFORMANCE .................................................................................................... 17 4.2.1. WLAN 2.4-GHz Receiver Characteristics .......................................................... 17 4.2.2. WLAN 2.4-GHz Transmitter Power ....................................................................... 18 4.2.4. WLAN 5-GHz Transmitter Power (For WG7833/03 Only) ............................... 20 4.3. BLUETOOTH RF PERFORMANCE (FOR WG7833/31 ONLY) .................................................. 21 4.3.1. BT Receiver Characteristics, In-Band Signals .................................................. 21 4.3.2. BT Receiver Characteristics – General Blocking ............................................ 22 4.3.3. BT Receiver Characteristics –BR, EDR Blocking Per Band ............................ 22 4.3.5. BT Transmitter, EDR .................................................................................................. 23 4.3.6. BT Modulation, BR ................................................................................................... 23 4.3.7. BT Modulation, EDR ................................................................................................ 24 4.3.8. BT BR, EDR Transceiver - Emissions ...................................................................... 24 4.3.9. BT BR Transceiver - Spurs........................................................................................ 25
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 24.3.10. BT EDR Transceiver - Spurs ..................................................................................... 25 4.4. BT LE RF PERFORMANCE ........................................................................................................... 26 4.4.1. BT LE Receiver Characteristics, In-Band Signals ....................................................... 26 4.4.3. BT LE Transmitter Characteristics .............................................................................. 27 4.4.4. BT LE Modulation Characteristics .............................................................................. 27 4.4.6. BT LE Transceiver - Spurs ........................................................................................... 28 4.5. ANT PERFORMANCE .................................................................................................................. 28 4.5.1. ANT Receiver Characteristics, In-Band Signals .......................................................... 28 4.5.2. ANT Transmitter Characteristics ................................................................................. 28 4.6. POWER CONSUMPTION ....................................................................................................... 29 5. HOST INTERFACE TIMING CHARACTERISTICS .................................................................... 32 5.1. WLAN SDIO TRANSPORT LAYER ................................................................................................. 32 5.2. SDIO TIMING SPECIFICATIONS ..................................................................................................... 33 5.3. HCI UART SHARED TRANSPORT LAYERS FOR ALL FUNCTIONAL BLOCKS (EXCEPT WLAN) ....................... 35 5.4. UART TIMING SPECIFICATIONS .................................................................................................... 36 5.5. BLUETOOTH CODEC-PCM(AUDIO) TIMING SPECIFICATIONS .............................................................. 37 6. CLOCK AND POWER MANAGEMENT .................................................................................. 39 6.1. RESET-POWER-UP SYSTEM ......................................................................................................... 39 6.2. WLAN POWER-UP SEQUENCE .................................................................................................... 39 6.3. BLUETOOTH/BLE/ANT POWER-UP SEQUENCE .............................................................................. 40 7. REFERENCE SCHEMATIC ......................................................................................................... 41 7.1. MODULE REFERENCE DESIGN ...................................................................................................... 41 8. DESIGN RECOMMENDATIONS .............................................................................................. 42 8.1. DESIGN NOTE ON DEBUG PORT.................................................................................................... 42 8.2. MODULE LAYOUT RECOMMENDATIONS ......................................................................................... 42 9. PACKAGE INFORMATION ...................................................................................................... 44 9.1. MODULE MECHANICAL OUTLINE .................................................................................................. 44 9.2. ORDERING INFORMATION ........................................................................................................... 45 9.3. PACKAGE MARKING ................................................................................................................... 46 9.4. PACKAGING .............................................................................................................................. 47 10. SMT AND BAKING RECOMMENDATION ......................................................................... 49 10.1. BAKING RECOMMENDATION ............................................................................................. 49 10.2. SMT RECOMMENDATION .................................................................................................. 49
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 311. HISTORY CHANGE ............................................................................................................... 50
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 41. OVERVIEW WG7833/31/03/01-B0, a WiFi, BT, BLE SiP (system in package) module, is the most demanded design for mobile devices, Audio, Computer, PDA and embedded system applications with Wilink8 solution from TI. 1.1. Models Functional Blocks Model WLAN 2.4GHz WLAN 5GHz BT/BLE/ANT WG7833-B0 V V V 1.2. General Features  WLAN, Bluetooth, BLE, ANT with Integrated RF Front-End Module (FEM), Power Amplifier (PA), and Power Management on a Single Module  LGA106 pin package  Dimension 12.8mm(L) x 12.0mm(W) x 1.63mm(H)  Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC).  Seamless Integration with TI Sitara™ and Other Application Processors  WLAN and BT/BLE/ANT cores are software and hardware compatible with prior WL127x and WL128x offerings, for smooth migration to device.  Shared HCI transport for BT/BLE/ANT over UART and SDIO for WLAN.  Temperature detection and compensation mechanism ensures minimal variation in RF performance over the entire temperature range.  BT 4.0, BLE, ANT and all audio processing features work in parallel and include full coexistence with WLAN  Operating temperature: –40°C to 85°C
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 52. FUNCTIONAL FEATURES 2.1. Module Block Diagram Figure 2-1. WG7833-B0 Block Diagram 2.2. Block Functional Feature 2.2.1. WLAN Features  Integrated 2.4 & 5G GHz Power Amplifier (PA) for WLAN solution  WLAN Baseband Processor and RF transceiver Supporting IEEE Std 802.11a/b/g/n  WLAN 2.4/5 GHz SISO (20/40 MHz channels) WLAN BT WiLink8 SW WG7833-B0 VBAT_IN VIO_IN SLOW CLK BT I/F: UART, WLAN I/F: SDIOPCM, I2S GPIO’s, Debug SW WLAN 2.4G WL 5G TX WL 5G RX 32.768KHz OSC BPF BPF BT (5G only for WG7833/03-B0) (BT only for WG7833/31-B0) 26MHz TCXO CLK_REQ_OUT Power Management FAST CLK
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 6 Baseband Processor  IEEE Std 802.11a/b/g/n data rates and IEEE Std 802.11n data rates with 20 or 40 MHz SISO.  Fully calibrated system. Production calibration not required.  Medium Access Controller (MAC)  Embedded ARM™ Central Processing Unit (CPU)  Hardware-Based Encryption/Decryption using 64-, 128-, and 256-Bit WEP, TKIP or AES Keys,  Supports requirements for Wi-Fi Protected Access (WPA and WPA2.0) and IEEE Std 802.11i [includes hardware-accelerated Advanced Encryption Standard (AES)]  Designed to work with IEEE Std 802.1x  IEEE Std 802.11d,e,h,i,k,r PICS compliant.  New advanced co-existence scheme with BT/BLE/ANT.  2.4/5 GHz Radio  Internal LNA and PA  Supports: IEEE Std 802.11a, 802.11b, 802.11g and 802.11n  Supports 4 bit SDIO host interface, including high speed (HS) and V3 modes. 2.2.2. Bluetooth Features  Supports Bluetooth 4.0 as well as CSA2  Includes concurrent operation and built -in coexisting and prioritization handling of Bluetooth, BLE, ANT, audio processing and WLAN  Dedicated Audio processor supporting on chip SBC encoding + A2DP:  Assisted A2DP (A3DP) support - SBC encoding implemented internally  Assisted WB-Speech (AWBS) support - modified SBC codec implemented internally 2.2.3. BLE Features  Fully compliant with BT4.0 BLE dual mode standard  Support for all roles and role-combinations, mandatory as well as optional  Supports up to 10 BLE connections  Independent buffering for LE allows having large number of multiple connections without
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 7affecting BR/EDR performance 2.2.4. ANT Features Fully compliant with all ANT Protocols:  ANT solution optimized for the fitness and health use-cases  Simple to complex network topologies  Supports high-resolution proximity pairing The ANT protocol has been designed to very power-efficient, yet is flexible enough to support various network topologies (point-to-point, star, 1-to-N, N-to-1) and data transfer modes (broadcast, broadcast with acknowledge, mass data transfer). Each logical ANT channel can be independently configured for 1-way or 2-way operation
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 83. MODULE OUTLINE 3.1. Signal Layout (Top View) Figure 3-1 Device pins
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 93.2. Pin Description Table 3-1. Pin Description Pin No. Signal Name Type Shut Down state After Power Up(1) Voltage Level Description A1 GND GND Ground A2 WLAN_SDIO_D3 IO HiZ PU 1.8V WLAN SDIO Data bit 3. Changes state to PU at WL_EN or BT_EN assertion for card detects. Later disabled by software during initialization. (2) A3 WLAN_SDIO_CMD I/O HiZ HiZ 1.8V WLAN SDIO Command (2) A4 WLAN_SDIO_D2 IO HiZ HiZ 1.8V WLAN SDIO Data bit 2 (2) A5 WLAN_SDIO_D0 IO HiZ HiZ 1.8V WLAN SDIO Data bit 02) A6 WLAN_SDIO_D1 IO HiZ HiZ 1.8V WLAN SDIO Data bit 1 (2) A7 WLAN_SDIO_CLK IN HiZ HiZ 1.8V WLAN SDIO Clock. Must be driven by the host. A8 GND GND Ground A9 BT_HCI_CTS IN PU PU 1.8V UART CTS from host. NC if not used. A10 BT_HCI_RTS OUT PU PU 1.8V UART RTS to host. NC if not used. A11 BT_HCI_TX OUT PU PU 1.8V UART TX to host. NC if not used. A12 BT_HCI_RX IN PU PU 1.8V UART RX from host. NC if not used. A13 NC NC A14 NC NC A15 NC NC A16 GND GND Ground A17 NC NC A18 GND GND Ground
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 10 A19 VIO_IN POW PD PD 1.8V Connect to 1.8V external VIO A20 GND GND Ground B1 NC NC B2 NC NC B3 GPIO11 I/O PU PU 1.8V Reserved for future use. NC if not used. B4 GPIO9 I/O PU PU 1.8V Reserved for future use. NC if not used. B5 GPIO10 I/O PU PU 1.8V Reserved for future use. NC if not used. B6 GPIO12 I/O PU PU 1.8V Reserved for future use. NC if not used. B7 NC NC B8 NC NC B9 NC NC B10 NC NC B11 NC NC B12 NC NC B13 NC NC B14 NC NC B15 NC NC B16 NC NC C1 GND GND Ground C2 NC NC C3 NC NC C4 BT_UART_DEBUG OUT PU PU 1.8V Option: Bluetooth logger C5 NC NC C6 WLAN_UART_DBG OUT PU PU 1.8V Option: WLAN logger C7 GPIO1 I/O PD PD 1.8V WL_RS232_TX (when IRQ_WL = 1 at power up) C8 NC NC C9 TCXO_CLK_IN ANA TCXO clock input C10 WLAN_EN IN PD PD 1.8V Mode setting: High = enable C11 WLAN_IRQ OUT PD 0 1.8V SDIO available, interrupt out. Active high. To use WL_RS232_TX and RX lines, need to pull up with 10K resistor. C12 GND GND Ground
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 11 C13 GND GND Ground C14 GND GND Ground C15 GND GND Ground C16 GND GND Ground D1 GND GND Ground D2 VBAT POW VBAT Power supply input, 2.9 to 4.8 V D3 NC NC D4 NC NC D5 NC NC D6 GND GND Ground D7 NC NC D8 GND GND Ground D9 PA_DC2DC_OUT POW Internal DC2DC output D10 GPIO4 I/O PD PD 1.8V Reserved for future use. NC if not used. D11 GPIO2 I/O PD PD 1.8V WL_RS232_RX (when IRQ_WL = 1 at power up) D12 BT_EN In PD PD 1.8V Mode setting: High = enable D13 NC NC D14 NC NC D15 GND GND Ground D16 GND GND Ground D17 GND GND Ground D18 GND GND Ground D19 RF_ANT_WA RF WLAN 5G RF Port D20 GND GND Ground E1 GND GND Ground E2 GND GND Ground E3 GND GND Ground E4 GND GND Ground F1 GND GND Ground F2 GND GND Ground F3 GND GND Ground F4 GND GND Ground J1 GND GND Ground J2 GND GND Ground
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 12 J3 GND GND Ground J4 NC NC J5 NC NC J6 NC NC J7 NC NC J8 NC NC J9 NC NC J10 CLK_REQ_OUT OUT PD PD 1.8V TCXO clock request out J11 GND GND Ground J12 GND GND Ground J13 NC NC K1 GND GND Ground K2 RF_ANT_BG RF WLAN/BT 2.4G RF Port K3 GND GND Ground K4 GND GND Ground K5 GND GND Ground K6 GND GND Ground K7 BT_AUD_OUT OUT PD PD 1.8V Bluetooth PCM/I2S Bus. Data out. NC if not used. K8 GND GND Ground K9 EXT_32K ANA Input Sleep clock: 32.768 KHz K10 GND GND Ground K11 BT_AUD_IN IN PD PD 1.8V Bluetooth PCM/I2S Bus. Data in. NC if not used. K12 BT_AUD_CLK OUT PD PD 1.8V Bluetooth PCM/I2S Bus. Clock. NC if not used. K13 BT_AUD_FSYNC OUT PD PD 1.8V Bluetooth PCM/I2S Bus. Frame sync. NC if not used. (1) PU=pull up; PD=pull down. (2) Host must provide PU for all non-CLK SDIO signals
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 13 4. MODULE SPECIFICATION 4.1. General Module Requirements and Operation 4.1.1. Absolute Maximum Ratings (1) 1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2) 5.5V up to 10s cumulative in 7 years, 5V cumulative to 250s, 4.8V cumulative to 2.33 years - all includes charging dips and peaks. 3) Operating free-air temperature range. The device can be reliably operated for 7 years at ambient of 85°C, assuming 25% active mode and 75% sleep mode (15,400 cumulative active power-on hours). 4) Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into device. 5) Level listed is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process, and manufacturing with less than 500V HBM is possible if necessary precautions are taken. Pins listed as 1000V may actually have higher performance. 6) Level listed is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process, and manufacturing with less than 250V CDM is possible if necessary precautions are taken. Pins listed as 250 V may actually have higher performance Parameter Value Units VBAT -0.5 to 5.5 (2) V VIO -0.5 to 2.1 V Input voltage to Analog pins -0.5 to 2.1 V Input voltage limits (CLK_IN) -0.5 to VDD_IO V Input voltage to all other pins -0.5 to (VDD_IO + 0.5V) V Operating ambient temperature range -40 to +85 (3) °C Storage temperature range -55 to +125 °C ESD Stress Voltage (4) Human Body Model (5) >1000 V Charged Device Model (6) >250 V
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 14 4.1.2. Recommended Operating Conditions Parameter Condition Sym Min Max Units VBAT (1) DC supply range for all modes 2.9 4.8 V 1.8 V IO ring power supply voltage 1.62 1.95 IO high-level input voltage VIH 0.65 x VDD_IO VDD_IO IO low-level input voltage VIL 0 0.35 x VDD_IO Enable inputs high-level input voltage VIH_EN 1.365 VDD_IO Enable inputs low-level input voltage VIL_EN 0 0.4 High-level output voltage @ 4 mA VOH VDD_IO -0.45 VDD_IO @ 1 mA VDD_IO -0.112 VDD_IO @ 0.3 mA VDD_IO -0.033 VDD_IO Low-level output voltage @ 4 mA VOL 0 0.45 @ 1 mA 0 0.112 @ 0.09 mA 0 0.01 Input transitions time Tr/Tf from 10% to 90% (Digital IO) (2) Tr/Tf 1 10 ns Output rise time from 10% to 90% (Digital pins) (2) CL < 25 pF Tr 5.3 ns Output fall time from 10% to 90% (Digital pins) (2) CL < 25 pF Tf 4.9 Ambient operating temperature -40 85 ºC Maximum power dissipation WLAN operation 2.8 W BT operation 0.2 (1) 4.8V is applicable only for 2.3 years (30% of the time). Otherwise, the maximum VBAT should not exceed 4.3V. (2) Applies to all Digital lines except SDIO, UART, I2C, PCM and slow clock lines
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 15 4.1.3. External Slow Clock Input (SLOW_CLK) The supported digital slow clock is 32.768 kHz digital (square wave). Parameter Condition Sym Min. Typ. Max. Units Input slow clock Frequency 32.768 KHz Input slow clock accuracy (Initial + temp + aging) WLAN, BT +/-250 ppm ANT +/- 50 Input Transition time Tr/Tf - 10% to 90% Tr/Tf 100 ns Frequency input duty Cycle 15 50 85 % Input Voltage Limits Square Wave, DC-coupled Vih 0.65x VDD_IO VDD_IO Vpeak Vil 0 0.35x VDD_IO Input Impedance 1 MΩ Input Capacitance 5 pF 4.1.4. External Fast Clock Requirements (-40 to +85°°°°C) Parameter Condition Min. Typ. Max. Unit Frequency 26 MHz Frequency Accuracy Short term (voltage and temp. effect) ± 20 ppm Long term (including aging) ± 20 Input voltage limits (TCXO_CLK_IN) Sine wave/ clipped sine wave, ac-coupled 2.4GHz WLAN 0.2 1.4 Vp-p 5GHz WLAN 0.8 1.4 Input impedance Input resistance 20 KΩ Input capacitance 2.5 pF Power-up time(1) 5 ms Phase noise 2.4GHz for 26MHz, 20MHz SISO Measured at 1 KHz offset -123.4 dBc/Hz Measured at 10 KHz offset -133.4 dBc/Hz Measured at 100 KHz offset -138.4 dBc/Hz Phase noise 2.4GHz for 26MHz, 40MHz SISO Measured at 1 KHz offset -128.4 dBc/Hz Measured at 10 KHz offset -135.4 dBc/Hz Measured at 100 KHz offset -139.9 dBc/Hz
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 16 Phase noise 5GHz for 26MHz, 20/40 MHz SISO Measured at 1 KHz offset -128.4 dBc/Hz Measured at 10 KHz offset -145.4 dBc/Hz Measured at 100 KHz offset -148.4 dBc/Hz (1) Power-up time is calculated from the time CLK_REQ_OUT asserted till the time the TCXO_CLK amplitude is within voltage limit specified above and TCXO_CLK frequency is within 0.1 ppm of final steady state frequency.
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 17 4.2. WLAN RF Performance 4.2.1. WLAN 2.4-GHz Receiver Characteristics Parameter Condition Min Typ Max Units Operation frequency range 2412 2484 MHz Sensitivity 20MHz Bandwidth At < 10% PER limit 1 Mbps DSSS -96.3 -93.4 dBm 2 Mbps DSSS -93.2 -90.5 5.5 Mbps CCK -90.6 -87.9 11 Mbps CCK -87.9 -85.7 6 Mbps OFDM -92 -89.2 9 Mbps OFDM -90.4 -87.7 12 Mbps OFDM -89.5 -86.8 18 Mbps OFDM -87.2 -84.5 24 Mbps OFDM -84.1 -81.4 36 Mbps OFDM -80.7 -78 48 Mbps OFDM -76.5 -73.8 54 Mbps OFDM -74.9 -72.4 MCS0 MM 4K -90.4 -87.4 MCS1 MM 4K -87.6 -84.9 MCS2 MM 4K -85.9 -83.2 MCS3 MM 4K -82.8 -80.1 MCS4 MM 4K -79.4 -76.7 MCS5 MM 4K -75.2 -72.5 MCS6 MM 4K -73.5 -70.8 MCS7 MM 4K -72.4 -69.7 MCS0 MM 4K 40MHz -87.4 -82.7 MCS7 MM 4K 40MHz -69 -65.5 Max Input Level At < 10% PER limit OFDM(11g/n) -19 -9 dBm CCK -4 0 Adjacent channel rejection Sensitivity level +3dB for OFDM, Sensitivity level +6dB for 11b 2Mbps DSSS 42.7 dBm 11Mbps CCK 37.9 54Mbps OFDM 2.0 LO Leakage -80 dBm PER Floor 1.0 2.0 %
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 18 4.2.2. WLAN 2.4-GHz Transmitter Power Parameter Condition Min Typ Max Output Power - Maximum RMS output power measured at 1dB from IEEE spectral mask or EVM 1 Mbps DSSS 15 17 – dBm 2 Mbps DSSS 15 17 – 5.5 Mbps CCK 15 17 – 11 Mbps CCK 15 17 – 6 Mbps OFDM 15 17 – 9 Mbps OFDM 15 17 – 12 Mbps OFDM 15 17 – 18 Mbps OFDM 15 17 – 24 MbpS OFDM 14 16.2 – 36 Mbps OFDM 13.1 15.3 – 48 Mbps OFDM 12.4 14.6 – 54 Mbps OFDM 11.8 13.8 – MCS0 MM 13.9 16.1 MCS1 MM 13.9 16.1 MCS2 MM 13.9 16.1 MCS3 MM 13.9 16.1 MCS4 MM 13.3 15.3 MCS5 MM 12.4 14.6 MCS6 MM 11.8 13.8 MCS7 MM 10.6 12.6 MCS0 MM 40MHz 12.3 14.8 MCS7 MM 40MHz 10.2 12.2 Output power accuracy -1.5 +1.5 dB Output power resolution 0.125 dB Operation frequency range 2412 2484 MHz Return loss -10 dB Reference input impedance 50 Ω
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 19 4.2.3. WLAN 5-GHz Receiver Characteristics (For WG7833/03 Only) Parameter Condition Min Typ Max Units Operation frequency range 4910 5825 MHz Sensitivity - 20MHz bandwidth. - At < 10% PER limit 6 Mbps OFDM – -91.5 -87.6 dBm 9 Mbps OFDM – -89.7 -85.7 12 Mbps OFDM – -88.9 -84.9 18 Mbps OFDM – -86.4 -82.4 24 Mbps OFDM – -83.3 -79.3 36 Mbps OFDM – -79.9 -75.9 48 Mbps OFDM – -75.6 -71.6 54 Mbps OFDM – -74.0 -70.5 MCS0 MM 4K – -89.8 -85.4 MCS1 MM 4K – -87.0 -83.0 MCS2 MM 4K – -85.2 -81.2 MCS3 MM 4K – -82.1 -78.1 MCS4 MM 4K – -78.7 -74.7 MCS5 MM 4K – -74.4 -70.4 MCS6 MM 4K – -72.8 -68.8 MCS7 MM 4K – -71.5 -67.9 MCS0 MM 4K 40MHz – -87.0 -81.8 MCS7 MM 4K 40MHz – -68.3 -64.4 Max Input Level, At < 10% PER limit OFDM(11a/n) -27 -9 dBm Adjacent channel rejection Sensitivity level +3dB for OFDM 54Mbps OFDM 2 dBm LO Leakage -53 dBm PER Floor 1.0 2.0 %
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 20 4.2.4. WLAN 5-GHz Transmitter Power (For WG7833/03 Only) Parameter Condition Min Typ Max Output Power - Maximum RMS output power measured at 1dB from IEEE spectral mask or EVM 6 Mbps OFDM 14.7 16.8 – dBm 9 Mbps OFDM 14.7 16.8 – 12 Mbps OFDM 14.7 16.8 – 18 Mbps OFDM 14.7 16.8 – 24 MbpS OFDM 14.1 15.7 – 36 Mbps OFDM 13.4 15.0 – 48 Mbps OFDM 12.6 14.2 – 54 Mbps OFDM 11.6 13.4 – MCS0 MM 14.4 16.4 MCS1 MM 14.4 16.4 MCS2 MM 14.4 16.4 MCS3 MM 14.4 16.4 MCS4 MM 13.2 15.0 MCS5 MM 12.6 14.2 MCS6 MM 11.6 13.4 MCS7 MM 10.7 12.4 MCS0 MM 40MHz 13.0 15.9 MCS7 MM 40MHz 9.7 11.6 Output power accuracy -1.5 +1.5 dB Output power resolution 0.125 dB Operation frequency range 4910 5825 MHz Return loss -10 dB Reference input impedance 50 Ω
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 21 4.3. Bluetooth RF Performance (For WG7833/31 Only) 4.3.1. BT Receiver Characteristics, In-Band Signals Parameter Condition Min Typ Max BT Spec Units BT BR, EDR operation frequency range 2402 2480 MHz BT BR, EDR channel spacing 1 MHz BT BR, EDR input impedance 50 Ω BT BR, EDR sensitivity (1) Dirty TX on BR, BER = 0.1% -92.0 -70 dBm EDR2, BER = 0.01% -91.5 -70 EDR3, BER = 0.01% -84.5 -70 BT EDR BER floor at sensitivity + 10 dB, dirty TX off (for 1,600,000 bits) EDR2 1e-6 1e-5 EDR3 1e-6 1e-5 BT BR, EDR maximum useable input power BR, BER = 0.1% -5.0 -20 dBm EDR2, BER = 0.1% -10.0 -20 EDR3, BER = 0.1% -10.0 -20 BT BR intermodulation Level of interferers For n = 3, 4, and 5 -36.0 -30.0 -39 dBm BT BR, EDR C/I performance Numbers show wanted-signal to interfering-signal ratio. Smaller numbers indicate better C/I performances (Image frequency = -1MHz) BR, Co-channel 8.0 11 dB EDR, Co-channel EDR2 9.5 13 EDR3 16.5 21 BR, adjacent ±1 MHz -10.0 0 EDR, adjacent ±1 MHz, (image) EDR2 -10.0 0 EDR3 -5.0 5 BR, adjacent +2 MHz -38.0 -30 EDR, adjacent +2 MHz, EDR2 -38.0 -30 EDR3 -38.0 -25 BR, adjacent -2 MHz -28.0 -20 EDR, adjacent -2 MHz EDR2 -28.0 -20 EDR3 -22.0 -13
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 22 BR, adjacent ≥Ι±3Ι MHz -45.0 -40 EDR, adjacent ≥Ι±3Ι MHz EDR2 -45.0 -40 EDR3 -44.0 -33 BT BR, EDR RF return loss -10.0 dB (1) Sensitivity degradation up to -3dB may occur due to fast clock harmonics with dirty TX on. 4.3.2. BT Receiver Characteristics – General Blocking Parameter Condition Min Typ BT spec Units Blocking performance over full range, according to BT specification (1) 30-2000 MHz -6 -10 dBm 2000-2399 MHz -6 -27 2484-3000 MHz -6 -27 3-12.75 GHz -6 -10 1) Exceptions taken out of the total 24 allowed in the BT spec. 4.3.3. BT Receiver Characteristics –BR, EDR Blocking Per Band Parameter Band Min Typ Units Blocking performance for various cellular bands Hopping on. Wanted signal: -3dB from sensitivity, with modulated continuous blocking signal. BER = 0.1% for BT BR, 0.01% for BT EDR. PER = 1% 776-794 MHz (CDMA) -12 dBm 824-849 MHz (GMSK) (1) -3 824-849 MHz (EDGE) (1) -11 824-849 MHz (CDMA, QPSK) (1) -12 880-915 MHz (GMSK) -14 880-915 MHz (EDGE) -15 1710-1785 MHz (GMSK) -4 1710-1785 MHz (EDGE) -18 1850-1910 MHz (GMSK) -18 1850-1910 MHz (EDGE) -20 1850-1910 MHz (CDMA, QPSK) -20 1850-1910 MHz (WCDMA, QPSK) -16 1920-1980 MHz (WCDMA, QPSK) -17 1) Except for frequencies where [3 * F_BLOCKER] falls within the BT band (2400-2483.5 MHz)
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 23 4.3.4. BT Transmitter, BR Parameter Min Typ Max BT Spec Units BR RF output power (1) VBAT >= 3V 12.5 dBm VBAT < 3V 7.0 BR Gain Control Range 30 dB BR Power Control Step 2 5 8 2 to 8 BR Adjacent Channel Power |M-N| = 2 (2) -43.0 ≤ -20 dBm BR Adjacent Channel Power |M-N| > 2 (2) -48.0 ≤ -40 1) Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command. 2) Assumes 3dB insertion loss on external filter and traces 4.3.5. BT Transmitter, EDR Parameter Min Typ Max BT Spec Units EDR output power (1) VBAT >= 3V 7 dBm VBAT < 3V 5 EDR relative power -2 1 -4 to +1 dB EDR Gain Control Range 30 dB EDR Power Control Step 2 5 8 2 to 8 dB EDR Adjacent Channel Power |M-N| = 1 (2) -36 ≤ -26 dBc EDR Adjacent Channel Power |M-N| = 2 (2) -30 ≤ -20 dBm EDR Adjacent Channel Power |M-N| > 2 (2) -42 ≤ -40 1) Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command. 2) Assumes 3dB insertion loss on external filter and traces. 4.3.6. BT Modulation, BR Parameter Condition(1) Performances BT spec Units Min Typ Max BR -20dB Bandwidth 925 995 ≤1000 kHz BR modulation characteristics ∆f1avg Mod data = 4-ones, 4-zeros: 111100001111... 160 140 to 175 kHz ∆f2max ≥ limit for at least 99.9% of all Δf2max Mod data = 1010101... 130 > 115 kHz ∆f2avg / ∆f1avg 88 > 80 %
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 24 BR carrier frequency drift One slot packet -25 +25 < ±25 kHz Three and five slot packet -35 35 < ±40 kHz BR drift rate lfk+5 – fkl , k = 0 …. max 15 < 20 kHz/ 50μs BR initial carrier frequency tolerance (2) f0 – fTX -25 25 < ±75 kHz 1) Performance figures at maximum power 2) This number is added on top of the reference clock frequency accuracy 4.3.7. BT Modulation, EDR Parameter (1) Condition Min Typ. Max BT spec Units EDR Carrier frequency stability -5 5 ≤10 kHz EDR Initial Carrier Frequency Tolerance (2) -25 25 ±75 kHz EDR RMS DEVM EDR2 4 20 % EDR3 4 13 % EDR 99% DEVM EDR2 30 30 % EDR3 20 20 % EDR Peak DEVM EDR2 9 35 % EDR3 9 25 % 1) Performance figures at maximum power 2) This number is added on top of the reference clock frequency accuracy 4.3.8. BT BR, EDR Transceiver - Emissions Parameter (1) Condition (2) Performances Units Min Typ Max BT out-of-band emission 746-768 MHz (CDMA) BR, EDR -151 dBm/Hz 869-894 MHz (WCDMA, GSM) -149 dBm/Hz 925-960 MHz (E-GSM) -148 dBm/Hz 1570-1580 MHz (GPS) -145 dBm/Hz 1598-1607 MHz (GLONASS) (3) -145 dBm/Hz 1805-1880 MHz (DCS, WCDMA) -141 dBm/Hz 1930-1990 MHz (PCS) -139 dBm/Hz
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 25 2110-2170 MHz (WCDMA) BR -134 dBm/Hz EDR -129 dBm/Hz BT harmonics 2nd harmonic 1.5 dBm 3rd harmonic -4 dBm 4th harmonic -10 dBm 1) Meets FCC and ETSI requirements with suitable external filter 2) Performance figures at maximum power 3) Except for frequencies that corresponds to 2*RF_FREQ/3 4.3.9. BT BR Transceiver - Spurs Parameter (1) Condition (2) Performances Units Min Typ Max BT out-of-band spurs 76-108 MHz (FM) BR -77 dBm 746-768 MHz (WCDMA) -79 dBm 869-894 MHz (WCDMA, GSM) -77 dBm 925-960 MHz (E-GSM) -77 dBm 1570-1580 MHz (GPS) -72 dBm 1598-1607 MHz (GLONASS) (3) -74 dBm 1805-1880 MHz (DCS, WCDMA) -72 dBm 1930-1990 MHz (PCS) -70 dBm 2110-2170 MHz (WCDMA) -59 dBm 1) Meets FCC and ETSI requirements with suitable external filter 2) Performance figures at maximum power 3) Except for frequencies that corresponds to 2*RF_FREQ/3 4.3.10. BT EDR Transceiver - Spurs Parameter(1) Condition (2) Performances Units Min Typ Max BT out-of-band spurs 76-108 MHz (FM) EDR -82 dBm 746-768 MHz (WCDMA) -87 dBm 869-894 MHz (WCDMA, GSM) -85 dBm 925-960 MHz (E-GSM) -84 dBm 1570-1580 MHz (GPS) -79 dBm
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 26 1598-1607 MHz (GLONASS) (3) -78 dBm 1805-1880 MHz (DCS, WCDMA) -76 dBm 1930-1990 MHz (PCS) -74 dBm 2110-2170 MHz (WCDMA) -63 dBm 1) Meets FCC and ETSI requirements with suitable external filter 2) Performance figures at maximum power 3) Except for frequencies that corresponds to 2*RF_FREQ/3 4.4. BT LE RF Performance 4.4.1. BT LE Receiver Characteristics, In-Band Signals Parameter Condition (2) Min Typ Max BLE spec Units BT LE Operation frequency range 2402 2480 MHz BT LE Channel spacing 2 MHz BT LE Input impedance 50 Ω BT LE Sensitivity (1), Dirty Tx on -93 ≤ -70 dBm BT LE Maximum useable input power -5 ≥ -10 dBm BT LE Intermodulation characteristics Level of interferers. For n = 3, 4, 5 -36 -30 ≥ -50 dBm BT LE C/I performance Note: Numbers show wanted signal-to-interfering signal ratio. Smaller numbers indicate better C/I performance. Image = -1MHz LE, co-channel 8 12 ≤ 21 dB LE, adjacent ±1MHz -5 0 ≤ 15 LE, adjacent +2MHz -45 -38 ≤ -17 LE, adjacent –2MHz -22 -15 ≤ -15 LE, adjacent ≥ |±3|MHz -47 -40 ≤ -27 1) Sensitivity degradation up to -3dB may occur due to fast clock harmonics. 2) BER of 0.1% corresponds to PER of 30.8% for a minimum of 1500 transmitted packets, according to BT LE test spec 4.4.2. BT LE Receiver Characteristics – General Blocking Parameter Condition Min Typ Max BLE spec Unit BT LE Blocking performance over full range, according to LE specification (1) 30–2000MHz -15 ≥ –30 dBm 2000–2399MHz -15 ≥ –35 2484–3000MHz -15 ≥ –35
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 27 3–12.75GHz -15 ≥ –30 1) Exceptions taken out of the total 10 allowed for fbf_1, according to the BT LE Spec 4.4.3. BT LE Transmitter Characteristics Parameter Min Typ Max BT LE Spec Unit BT LE RF output power (1) Vbat >= 3V 12.5 ≤10 dBm Vbat < 3V 870 ≤10 dBm BT LE Adjacent Channel Power |M-N| = 2 (2) -51.0 ≤ –20 dBm BT LE Adjacent Channel Power |M-N| > 2 (2) -54.0 ≤ –30 1) To reduce the maximum BLE power, use a VS command. The optional extra margin is offered to compensate for design losses, such as trace and filter losses, and to achieve the maximum allowed output power at system level. 2) Assumes 3dB insertion loss on external filter and traces 4.4.4. BT LE Modulation Characteristics Parameter Condition (1) Performances BT Spec Units Min Typ Max BT LE modulation characteristics ∆f1avg Mod data = 4-ones, 4-zeros: 111100001111... 250 225 to 275 kHz ∆f2max ≥ limit for at least 99.9% of all Δf2max Mod data = 1010101... 215 ≥185 kHz ∆f2avg / ∆f1avg 90 ≥80 % BT LE carrier frequency drift lf0 – fnl , n = 2,3 …. K -25 25 ≤±50 kHz BT LE drift rate lf1 – f0l and lfn – fn-5l ,n = 6,7…. K 15 ≤20 kHz/ 50μs LE initial carrier frequency tolerance (2) fn – fTX -25 25 ≤±100 kHz 1) Performance figures at maximum power 2) This number is added on top of the reference clock frequency accuracy
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 28 4.4.5. BT LE Transceiver – Emissions See Section 4.3.8, BT BR, EDR Transceiver – Emissions. 4.4.6. BT LE Transceiver - Spurs See Section 4.3.9, BT BR Transceiver – Spurs. 4.5. ANT Performance 4.5.1. ANT Receiver Characteristics, In-Band Signals Parameter Condition Min Typ Max Units ANT Operation frequency range 2402 2480 MHz ANT Channel spacing 1 MHz ANT Sensitivity 12.72% PER (1) -85 dBm 1) Translation from BER=0.1%, assuming packet is 136 bits ( not including preamble ) 4.5.2. ANT Transmitter Characteristics Same as Bluetooth BR Transmitter Characteristics
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 29 4.6. POWER CONSUMPTION 4.6.1. Shutdown and Sleep Currents Parameter Power Supply Current Typ Unit Shutdown mode All functions shut down. VBAT 10 uA VIO 2 WLAN sleep mode VBAT 154 BT sleep mode VBAT 110 4.6.2. WLAN Power Currents Parameter Conditions Typ (avg) - 25C Units LPM 2.4GHz RX LPM 43 mA Receiver 2.4GHz RX search SISO20 48 mA 2.4GHz RX search SISO40 53 mA 5GHz RX search SISO20 54 mA 5GHz RX search SISO40 58 mA 2.4GHz RX 20M SISO 11CCK 50 mA 2.4GHz RX 20M SISO 6OFDM 55 mA 2.4GHz RX 20M SISO MCS7 59 mA 2.4GHz RX 40MHz MCS7 71 mA 5GHz RX 20MHz 6OFDM 62 mA 5GHz RX 20MHz MCS7 67 mA 5GHz RX 40MHz MCS7 79 mA Transmitter 2.4GHz TX 20M SISO 6OFDM 16.4dBm 285 mA 2.4GHz TX 20M SISO 11CCK 16.5dBm 273 mA 2.4GHz TX 20M SISO 54OFDM 13.1dBm 247 mA 2.4GHz TX 20M SISO MCS7 12.2dBm 238 mA 2.4GHz TX 40M SISO MCS7 11.8dBm 243 mA 5GHz TX 20M SISO 6OFDM 16.8dBm 366 mA 5GHz TX 20M SISO 54OFDM 13.4dBm 329 mA 5GHz TX 20M SISO MCS7 12.7dBm 324 mA 5GHz TX 40M SISO MCS7 11.9dBm 332 mA
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 30 4.6.3. Bluetooth Currents Current measurements are done at the following output power: BR at 12.5dBm, EDR at 7dBm. Use Case (1) Typ Units BR Voice HV3 + sniff 11.6 mA EDR Voice 2-EV3 no retrans. + sniff 5.9 mA Sniff 1 attempt 1.28s 178 uA EDR A2DP EDR2 (master). SBC high quality – 345Kbs 10.4 mA EDR A2DP EDR2 (master). MP3 high quality – 192Kbs 7.5 mA Full throughput ACL RX: RX-2DH5 (2) (3) 18 mA Full throughput BR ACL TX: TX-DH5 (3) 50 mA Full throughput EDR ACL TX: TX-2DH5 (3) 33 mA Page or inquiry 1.28s/11.25ms 253 uA P&I Scan (P=1.28/I=2.56) 332 uA 1) BT role in all scenarios is Slave, except for A2DP 2) ACL RX has same current in all modulations 3) Full throughput assumed data transfer in one direction 4.6.4. Bluetooth LE Currents All current measurements are done at output power of 8dBm Use Case Typ Units Advertising, non-connectable (1) 131 uA Advertising, discoverable (1) 143 uA Scanning (2) 266 uA Connected, master role, 1.28sec conn. Interval (3) 124 uA Connected, slave role, 1.28sec conn. Interval (3) 132 uA 1) Advertising in all 3 channels, 1.28sec advertising interval, 15 Bytes advertise data. 2) Listening to a single frequency per window, 1.28sec scan interval, 11.25msec scan window. 3) Zero Slave connection latency Empty Tx/Rx LL packets.
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 31 4.6.5. ANT Currents Use Case Conditions Typ Units ANT Rx message mode 250ms interval 360 uA ANT Rx message mode 500ms interval 220 uA ANT Rx message mode 1000ms interval 150 uA
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 32 5. HOST INTERFACE TIMING CHARACTERISTICS The following table summarizes the Host Controller interface options. All interfaces operate independently. WLAN Shared HCI for all functional blocks except WLAN BT Voice/Audio WLAN HS SDIO Over UART BT PCM The device incorporates UART module dedicated to the BT shared-transport Host Controller Interface (HCI) transport layer. The HCI interface is used to transport commands, events and ACL between the Bluetooth device and its host using HCI data packets. This acts as a shared transport for all functional blocks except WLAN. 5.1. WLAN SDIO Transport Layer The SDIO is the host interface for WLAN. The interface between the host and the WG7835-T0 uses an SDIO interface and supports a maximum clock rate of 50MHz. The Device SDIO also supports the following features of the SDIO V3 specification:  4 bit data bus  Synchronous and Asynchronous In-Band-Interrupt  Default and High-Speed (50MHz) timing  Sleep/wake commands
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 33 5.2. SDIO Timing Specifications 5.2.1. SDIO Switching Characteristics – Default Rate Figure 5-1. SDIO default input timing Figure 5-2. SDIO default output timing Table 5-1. SDIO Default Timing Characteristics(1) PARAMETER(2) MIN MAX UNIT Fclock Clock frequency, CLK 0 26 MHz DC Low/high duty cycle 40 60 % tTLH Rise time, CLK 10 ns tTHL Fall time, CLK 10 ns tISU Setup Ɵme, input valid before CLK↑ 3 ns
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 34 tIH Hold Ɵme, input valid aŌer CLK↑ 2 ns tODLY Delay Ɵme, CLK↓ to output valid 2.5 14.8 ns CI Capacitive load on outputs 15 pF (1) To change the data out clock edge from the falling edge (default) to the rising edge, set the configuration bit. (2) Parameter values reflect maximum clock frequency. 5.2.2. SDIO Switching Characteristics – High Rate Figure 5-3. SDIO HS input timing Figure 5-4. SDIO HS output timing
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 35 Table 5-2. SDIO HS Timing Characteristics PARAMETER MIN MAX UNIT Fclock Clock frequency, CLK 0 50 MHz DC Low/high duty cycle 40 60 % tTLH Rise time, CLK 3 ns tTHL Fall time, CLK 3 ns tISU Setup Ɵme, input valid before CLK↑ 3 ns tIH Hold Ɵme, input valid aŌer CLK↑ 2 ns tODLY Delay Ɵme, CLK↓ to output valid 2.5 14 ns CI Capacitive load on outputs 10 pF 5.3. HCI UART Shared Transport Layers for All Functional Blocks (Except WLAN) The HCI UART supports most baud rates (including all PC rates) for all fast clock frequencies - up to a maximum of 4 Mbps. After power up the baud rate is set for 115.2 kbps, regardless of fast clock frequency. The baud rate can then be changed by using a VS command. The Device responds with a Command Complete Event (still at 115.2 kbps), after which the baud rate change occurs. HCI hardware includes the following features:  Receiver detection of break, idle, framing, FIFO overflow and parity error conditions.  Receiver Transmitter underflow detection.  CTS/RTS hardware flow control.  4 wires (H4) The below table lists the UART default settings Table 5-3. UART Default Setting Parameter Value Bit Rate 115.2 kbps Data Length 8 bits Stop Bit 1 Parity None
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 36 5.3.1. UART 4-Wires Interface – H4 The interface includes four signals: TXD, RXD, CTS and RTS. Flow control between the host and the Device is byte-wise by hardware. ( See Figure 5-5 ) Figure 5-5. HCI UART Connection When the UART RX buffer of the device passes the flow-control threshold, the buffer sets the UART_RTS signal high to stop transmission from the host. When the UART_CTS signal is set high, the device stops transmitting on the interface. If HCI_CTS is set high in the middle of transmitting a byte, the device finishes transmitting the byte and stops the transmission. 5.4. UART Timing Specifications Figure 5-6. UART Timing Diagram Table 5-4. UART Timing Characteristics Characteristic Condition Symbol Min Typ Max Unit Baud rate 37.5 4364 Kbps Baud rate accuracy per byte RX/TX -2.5 +1.5 % Baud rate accuracy per bit RX/TX -12.5 +12.5 % CTS low to TX_DATA on t3 0 2 us
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 37 CTS low to TX_DATA off Hardware flow control t4 1 Byte CTS High Pulse Width t6 1 bit RTS low to RX_DATA on t1 0 2 us RTS high to RX_DATA off Interrupt set to 1/4 FIFO t2 16 Bytes STR-Start bit; D0..Dn - Data bits (LSB first); PAR - Parity bit (if used); STP - Stop bit Figure 5-7. UART Data Frame 5.5. Bluetooth Codec-PCM(Audio) Timing Specifications Figure 5-8 shows the Bluetooth codec-PCM (audio) timing diagram. Table 5-5 lists the Bluetooth codec-PCM master timing characteristics. Table 5-6 lists the Bluetooth codec-PCM slave timing characteristics. Figure 5-8. PCM Interface Timing Table 5-5. Bluetooth Codec-PCM Master Timing Characteristics Parameter Symbol Min Max Unit Cycle time Tclk 166.67 (6.144MHz) 15625 (64 kHz) ns High or low pulse width Tw 35% of Tclk min AUD_IN setup time tis 10.6 AUD_IN hold time tih 0 AUD_OUT propagation time top 0 15 AUD_FSYNC_OUT propagation time top 0 15 Capacitive loading on outputs Cl 40 pF
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 38 Table 5-6. Bluetooth Codec-PCM Slave Timing Characteristics Parameter Symbol Min Max Unit Cycle time Tclk 81 (12.288MHz) ns High or low pulse width Tw 35% of Tclk min AUD_IN setup time tis 5 AUD_IN hold time tih 0 AUD_OUT propagation time top 5 AUD_FSYNC_OUT propagation time top 0 19 Capacitive loading on outputs Cl 40 pF
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 39 6. CLOCK AND POWER MANAGEMENT The slow clock is a free-running, 32.768 kHz clock supplied from an external clock source. The clock is connected to the RTC_CLK pin and is a digital square-wave signal in the range of 0 to 1.8V nominal 6.1. Reset-Power-Up System After VBAT and VIO are fed to the device and while BT_EN and WL_EN are deasserted (low), the device is in SHUTDOWN state, during which functional blocks, internal DC-DCs, and LDOs are disabled. The power supplied to the functional blocks is cut off. When one of the signals (BT_EN or WL_EN) are asserted (high), a power-on reset (POR) is performed. Stable slow clock, VIO, and VBAT are prerequisites for a successful POR. 6.2. WLAN Power-Up Sequence Figure 6-1 shows the WLAN power-up sequence. Figure 6-1. WLAN Power-Up Sequence
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 40 6.3. Bluetooth/BLE/ANT Power-Up Sequence Figure 6-2 shows the Bluetooth/BLE/ANT power-up sequence. Figure 6-2 Bluetooth/BLE/ANT power-up sequence
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 41 7. REFERENCE SCHEMATIC 7.1. Module Reference Design BT_EN_1V8R3 0R RES1005VIO_INWLAN_I RQ_1V8R1NL_10KRES1005TC XO_CLK_INC41uFCAP1005For RTTT testVBAT_INEXT_32KTCXO1TCXO/2016/26MHzTCXO-2.0X1.6GND1VCC4OUT 3GND 2C133pFCAP1005U1WG7833_03_31_01-B0 D01 ModuleE-12X12.8-0.6-TOPGND C13GND C14GND C15GND C16NLB16NLB15NLB14NLB13NLB12NLB11NLB10NLB9NLB8NLB7GP1O12B6GPIO10B5GPIO9B4GPIO11B3NLJ9NLJ8NLB2NLB1CLK_REQ_OUTJ10NLJ13NLJ7NLJ6NLJ5NLJ4GNDJ11GNDJ12GNDJ3VBAT_IN D2GNDJ1GNDA1WL_SDI O_D3A2WL_SDI O_CMDA3WL_SDI O_D2A4WL_SDI O_D0A5WL_SDI O_D1A6WL_SDI O_CLKA7GNDA8BT_HCI _RXA12BT_HCI _RT SA10BT_HCI _CT SA9NLA15GNDA16NLA17GNDA18BT_AUD_FSY NC K13BT_AUD_CLK K12BT_AUD_IN K11GND K10SLOW_CLK K9GND K8GND K3GND K6BT_AUD_OUT K7GND K4GND K5RF _ANT_BG K2GND K1GND D20GND D15NL D5GND D6PA_DC2 DC_OU T D9GND D8NL D14GPIO_4 D10BT_EN D12GNDJ2RF_ANT _A D19GND D16GND D17GND D18GND C12WLAN _IRQ C11WLAN_EN C10TCXO_CLK_IN C9NL C8GPIO3_WL_U ART_D BG C6NL D7NL C5BT_UART_DEBUG C4NL C3NL C2GND C1GNDE1GNDE2GNDE3GNDE4 GND F4GND F 3NLA13NLA14NL D13GPIO_2/ WL_RS232_RX D11NL D4NL D3GPIO1/WL_232_TX C7GND D1GND F 2GND F 1VIO_INA19GNDA20BT_HCI _TXA11WL/BT_2.4G ANTL3NLIND 1005C1110pFCAP1005C10NL_10pFCAP1005C1210pFCAP1005Reserved for RF test. Closed to Module.L4NLIND 1005Pi-Circuit for Antenna matching.ANT212CLK_REQ_OUT_1833TP9 1WL_RS232_TXVDD _TCXO_OUTU2SOT-23-5TPS73618DBVIN1GND2EN3NR/ FB 4OUT 5C180.1uFCAP1005C1910uFCAP2012C200.1uFCAP1005C2210nFCAP1005VBAT_INWL_5G ANT (For WG7833/03 Only)L1NLIND 1005C5NL_10pFCAP1005 C310pFCAP1005Reserved for RF test. Closed to Module.C610pFCAP1005L2NLIND 1005VDD_TCXO_OUTANT112Pi-Circuit for Antenna matching.CLK_REQ_OUT_1833R22 0R RES1005R19 0R RES1005For BT (WG7833/31)BD_HC I_TX_1V8BD_HC I_RX_1V8BD_HC I_CTS_1V8R21 0R RES1005R20 0R RES1005R7 0R RES1005 BT_PCM_AUD_I NBT_PCM_AUD _CLKR8 0R RES1005R10 0R RES1005 BT_PCM_AUD_FSYN CMust reserve PU cricuit for Debug.C20.1uFCAP1005BT_PCM_AUD _OUTR4 0R RES1005C160.1uFCAP1005OSC1OSC/3 225/32.768kHzEN 1VCC 4OUT3GND2R90RRES100532.768KHz source selectVIO_INTP3150 ohms single endedANTENNA CIRCUITSTP41WL_RS232_R XJ2U. FL-R-SMT-1(10)U. FL12 3HOST_SLOWCLK_1V8R50RRES1005C170.1uFCAP1005VIO_INWL_EN_1V8 R2 0RRES1005For BT (WG7833/31)R11 0R RES1005R15 0R RES1005R12 0R RES1005R18 0R RES1005R14 0R RES1005SDIO_D 3_1V8R16 0R RES1005SDIO_C LK_1V8SDIO_D 0_1V8SDIO_D 2_1V8SDIO_C MD_1V8SDIO_D 1_1V8For BT (WG7833/31)TP1 1TP2 1For LoggerJ1U.F L-R-SMT-1(10)U.F L12 3BD_HC I_RTS_1V8 C9NLCAP1005C13NLCAP1005C7NLCAP1005C8NLCAP1005C15NLCAP1005C14NLCAP1005** The six traces from Module to Host must be treated like a bus. The bus length shall be as short as possible and every trace length must be the same as the others. Enough space above 2 time trace width or ground shielding between trace and trace will be benefit to make sure signal quality, especially for SDIO_CLK trace. Besides, please remember to keep them away from the other digital or analog signal traces. To add ground shielding to around the buses will be helpful.** It's recommended to reserve SDID matching circuits and keep them close to module for signal optimization WiFi SDIO Matching CircuitSDIO_D1_1V8SDIO_CLK_1V8SDIO_D3_1V8SDIO_D2_1V8** All test point must reserved for testSDIO_CMD_1V8SDIO_D0_1V8In green circle is a necessary part ** SDIO lines should be held high by the host Boot ConditionsScheme BriefWiFi Interface: SDIOSlow Clock: 32.768KHz for module boot and deep sleepVIO_IN: 1.62~1.95V => 1.8V TYPVBAT_IN: 2.9~4.8V => 3.7V TYPFast Clock: External TCXO 26MHz Slow Clock: 32.768KHz Figure 7-1 Module Reference Schematic
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 42 8. DESIGN RECOMMENDATIONS 8.1. Design Note on Debug Port  Pin# C6, C4 serve as WLAN and BT debug port, respectively. So test points for these two signals should be reserved for debugging purpose.  Pin# C11 (WLAN_IRQ) needs to be pulled high via 10Kohm and use Pin# D11, C7 (WL_RS232_RX, WL_RS232_TX) as hardware interface to communicate with system platform and TI RTTT test utility for WLAN RF performance test, debug and manufacturing application. 8.2. Module Layout Recommendations Follow these module layout recommendations:  Digital Signals Layout  SDIO signals traces (CMD, D0, D1, D2 and D3) should be routed in parallel to each other and as short as possible. (Less than 12cm) Besides, every trace length must be the same as the others.  Enough space above 1.5 time trace width or ground shielding between trace and trace will be benefit to make sure signal quality, especially for SDIO_CLK trace. Remember to keep them away from the other digital or analog signal traces. Adding ground shielding around these bus is recommended.  Route trace of SDIO_CLK at Top layer without vias.  SDIO Clock, Audio Clock (PCM_AUD_CLK), these digital clock signals are a source of noise. Keep the traces of these signals as short as possible. Whenever possible, maintain a clearance around them.  BT_AUD signals should be rounted in the same group and it’s better to rout them at the same layer or confirm them referring to the same reference plane.  RF Trace & Antenna  Keep 50ohm trace impedance.  Move all the high-speed traces and components far away from the antenna.  Check antenna vendor for the layout guideline and clearance.  Power Trace  Power trace for VBAT should be 20mil wide. 1.8V trace should be 15mil wide, at least.
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 43  Isolate different power traces with Ground plane  Ground  Having a complete Ground and more GND vias under module in layer1 for system stable and thermal dissipation.  Have a complete Ground pour in layer 2 for thermal dissipation.  Increase the GND pour in the 1st layer, move all the traces from the 1st layer to the inner layers if possible.  Move GND vias close to the pad.  Clocks  To avoid adding noise to the clock signal, keep the primary clock away from fast digital switching lines and power traces.  It is preferable to keep all clocks between the ground/power layers.  Primary TCXO placement - To reduce clock drift, place the TCXO far from a heat source on the board. - For better thermal mass, ensure good grounding for the TCXO. - If the TCXO cannot be placed far from a heat source, add a scratch in the ground layers to isolate the heat spreading toward the TCXO Primary TCXO placement:  To reduce clock drift, place the TCXO far from a heat source on the board.  For better thermal mass, ensure good grounding for the TCXO.  If the TCXO cannot be placed far from a heat source, add a scratch in the ground layers to isolate the heat spreading toward the TCXO
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 44 9. PACKAGE INFORMATION 9.1. Module Mechanical Outline Figure 9-1. Module mechanical outline 12.0±0.1 mm 12.8±0.1 mm 1.63±0.1 mm
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 45 Figure 9-2. Module pad dimensions *We recommend adopting the same dimensions listed above for building PCB footprint. ** Pad tolerance as +/- 30um 9.2. Ordering Information Part number: WG7833-B0
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 46 9.3. Package Marking Figure 9-3. Package Marking Date Code: YYWWSSFAX YY = Digit of the year, ex: 2011=11 WW = Week (01~52) SS = Serial number from 01 ~99 match to manufacture’s lot number F = Reserve for internal use A = Module version from A to Z X = Chip version PIN-1 Marking
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 47 9.4. Packaging 9.4.1. Tape Specification <Reel : 1.8K pcs per reel> <Pizza box : 1 reel per pizza box>
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 48 <Carton : 5 pizza boxes per carton> Product label
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 49 10. SMT AND BAKING RECOMMENDATION 10.1. Baking Recommendation  Baking condition： - Follow MSL Level 4 to do baking process. - After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be a) Mounted within 72 hours of factory conditions <30°C/60% RH, or b) Stored at <10% RH. - Devices require bake, before mounting, if Humidity Indicator Card reads >10% If baking is required, Devices may be baked for 8 hrs. at 125 °C. 10.2. SMT Recommendation  Recommended Reflow profile： No. Item Temperature (°C) Time (sec) 1 Pre-heat D1: 140 ~ D2: 200 T1: 80 ~ 120 2 Soldering D2: = 220 T2: 60 +/- 10 3 Peak-Temp. D3: 250 °C max H
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 50 Note: (1) Reflow soldering is recommended two times maximum. (2) Add Nitrogen while Reflow process： SMT solder ability will be better.  Stencil thickness：：：： 0.1~ 0.13 mm (Recommended)  Soldering paste (without Pb)：：：： Recommended SENJU N705-GRN3360-K2-V can get better soldering effects. 11. HISTORY CHANGE Revision Date Description R 0.1 2014/08/28 New Released R 0.2 2014/09/29 Modify the module thickness from 1.7±0.05 mm to 1.63±0.1 mm Modify the package marking. R 0.3 2015/07/30 Add FCC/NCC WARING STATEMENT
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 51 FCC WARING STATEMENT This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. You are cautioned that changes or modifications not expressly approved by the party responsible for compliance could void your authority to operate the equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC RF Radiation Exposure Statement: 1. This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 2. This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body. According to FCC 15.407(e), the device is intended to operate in the frequency band of 5.15GHz to 5.25GHz under all conditions of normal operation. Normal operation of this device is restricted to indoor used only to reduce any potential for harmful interference to co-channel MSS operations. Information to OEM integrator The OEM integrator has to be aware not to provide information to the end user regarding how to
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 52 install or remove this RF module in the user manual of the end product. The user manual which is provided by OEM integrators for end users must include the following information in a prominent location. 1. To comply with FCC RF exposure compliance requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co- located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter product transmitter product procedures. 2. Only those antennas with same type and lesser gain filed under this FCC ID number can be used with this device. 3. The regulatory label on the final system must include the statement: “Contains FCC ID: WS2-WG7833B0 “. 4. The final system integrator must ensure there is no instruction provided in the user manual or customer documentation indicating how to install or remove the transmitter module except such device has implemented two-ways authentication between module and the host system. 5. If the end product integrating this module is going to be operated in 5.15 ~5.25GHz frequency range, the warning statement in the user manual of the end product should include the restriction of operating this device in indoor could void the user’s authority to operate the equipment.
Doc No: WG7833-B0-DTS-R03 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 53 NCC WARING STATEMENT Article 12 Without permission, any company, firm or user shall not alter the frequency, increase the power, or change the characteristics and functions of the original design of the certified lower power frequency electric machinery. Article 14 The application of low power frequency electric machineries shall not affect the navigation safety nor interfere a legal communication, if an interference is found, the service will be suspended until improvement is made and the interference no longer exists.

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