Jorjin Technologies ZB7 BLE/802.15.4 Module User Manual 1

Jorjin Technologies Inc. BLE/802.15.4 Module 1

Users Manual

-------------------------------------------------------------------------------------------------------------------------------------------------- Copyright © JORJIN TECHNOLOGIES INC. 2016 http://WWW.JORJIN.COM.TW CONFIDENTIAL a module solution provider ZB7 SimpleLinkTM Multistandard Wireless MCU Module TI CC26X0 series BLE & 802.15.4 Solution With optional 4Mbits Serial SPI Flash Memory Datasheet Draft 0.2 Prepared By Reviewed By Approved By
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 1 http://WWW.JORJIN.COM.TW CONFIDENTIAL Index 1. OVERVIEW ....................................................................................................................................... 3 1.1. GENERAL FEATURES ........................................................................................................................ 3 1.2. APPLICATIONS ................................................................................................................................ 4 2. FUNCTIONAL FEATURES .................................................................................................................. 5 2.1. MODULE BLOCK DIAGRAM ............................................................................................................... 5 2.2. BLOCK FUNCTIONAL FEATURE ........................................................................................................... 6 Microcontroller ............................................................................................................................ 6 Ultra-Low Power Sensor Controller ............................................................................................ 6 Peripherals ................................................................................................................................... 6 RF Section .................................................................................................................................... 7 4M bits SPI serial Flash (optional) .............................................................................................. 7 3. MODULE OUTLINE ........................................................................................................................... 8 3.1. SIGNAL LAYOUT (TOP VIEW) ............................................................................................................. 8 3.2. PIN DESCRIPTION ........................................................................................................................... 9 4. MODULE SPECIFICATIONS ............................................................................................................. 11 4.1. ABSOLUTE MAXIMUM RATINGS(1)(2) ................................................................................................. 11 4.2. ESD RATINGS .............................................................................................................................. 12 4.3. RECOMMENDED OPERATING CONDITIONS ......................................................................................... 12 4.4. ELECTRICAL CHARACTERISTICS ......................................................................................................... 13 4.5. GENERAL CHARACTERISTICS ............................................................................................................ 14 4.6. 1-MBPS GFSK (BLUETOOTH LOW ENERGY) – RX ............................................................................... 14 4.7. 1-MBPS GFSK (BLUETOOTH LOW ENERGY) – TX ............................................................................... 15 4.8. IEEE 802.15.4 (OFFSET Q-PSK DSSS, 250 KBPS) – RX .................................................................... 16 4.9. IEEE 802.15.4 (OFFSET Q-PSK DSSS, 250 KBPS) – TX .................................................................... 17 4.10. INTERNAL 24-MHZ CRYSTAL OSCILLATOR (XOSC_HF)(1) .................................................................. 18 4.11. 32.768-KHZ CRYSTAL OSCILLATOR (XOSC_LF) ............................................................................... 18 4.12. 48-MHZ RC OSCILLATOR (RCOSC_HF) ........................................................................................ 18 4.13. 32-KHZ RC OSCILLATOR (RCOSC_LF) ................................................................................ 19 4.14. ADC CHARACTERISTICS(1) ............................................................................................................ 19 4.15. TEMPERATURE SENSOR ................................................................................................................ 21 4.16. BATTERY MONITOR ..................................................................................................................... 21 4.17. CONTINUOUS TIME COMPARATOR ................................................................................................. 21
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 2 http://WWW.JORJIN.COM.TW CONFIDENTIAL 4.18. LOW-POWER CLOCKED COMPARATOR............................................................................................. 22 4.19. PROGRAMMABLE CURRENT SOURCE .............................................................................................. 22 4.20. DC CHARACTERISTICS .................................................................................................................. 23 4.21. TIMING REQUIREMENTS............................................................................................................... 24 4.22. SWITCHING CHARACTERISTICS ....................................................................................................... 24 5.2. REFERENCE SCHEMATIC ........................................................................................................... 29 6. CHIP ANTENNA PERFORMACE SUMMARY ................................................................................... 30 6.1. S-PARAMETER TEST ...................................................................................................................... 30 6.2. DUT 3D PATTERN ........................................................................................................................ 31 6.3. TOTAL EFFICIENCY ......................................................................................................................... 31 7. PACKAGE INFORMATION ............................................................................................................... 32 7.1. MODULE MECHANICAL OUTLINE ..................................................................................................... 32 7.2. ORDERING INFORMATION............................................................................................................... 34 7.3. PACKAGE MARKING ...................................................................................................................... 34 7.4. TEST GRADES ........................................................................................................................... 35 8. SMT AND BAKING RECOMMENDATION ....................................................................................... 36 8.1. BAKING RECOMMENDATION ........................................................................................................... 36 8.2. SMT RECOMMENDATION .............................................................................................................. 36 9. TAPE REEL INFROMATION ............................................................................................................. 38 9.1. COVER / CARRIER TAPE DIMENSION ................................................................................................. 38 10. REGULATORY INFORMATION ...................................................................................................... 39 10.1. UNITED STATES .......................................................................................................................... 39 10.2. CANADA................................................................................................................................. 40 10.3. EUROPE .................................................................................................................................. 41 10.4. JAPAN ..................................................................................................................................... 41 10.5. TAIWAN .................................................................................................................................. 42 11. HISTORY CHANGE ........................................................................................................................ 43
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 3 http://WWW.JORJIN.COM.TW CONFIDENTIAL 1. OVERVIEW The certified ZB7 module from JORJIN is a wireless MCU module targeting Bluetooth Smart, ZigBee®, 6LoWPAN, and ZigBee® RF4CE remote control applications. This module is based on TI CC26X0 wireless MCU QFN-32 package chip. The module is a cost-effective, ultralow power, 2.4-GHz RF devices. Very low active RF and MCU current and low-power mode current consumption provide excellent battery lifetime and allow for operation on small coin cell batteries and in energy-harvesting applications. The ZB7 module offers six footprint-compatible, function variants by embedded software. Test Grade Code BLE 802.15.4 - Zigbee (6LoWPAN) 802.15.4 (RF4CE) Addition 4Mbs SPI Flash 500-00 V V V 500-04 V V V V 410-00 V 410-04 V V 320-00 V 320-04 V V 1.1. General Features  TI CC26X0, 24MHz & 32.768KHz crystals, DC2DC, 4M bits SPI serial flash memory (optional), and chip antenna on a single module.  Built-in TI CC26X0 5x5mm RHB VQFN32 (15 GPIOs)  LGA 25pins package.  Dimension 16.9mm(L) x 11mm(W) x 2.45mm(H)  Powerful ARM® Cortex®-M3 Microcontroller  Ultra-Low Power Sensor Controller  Efficient Code Size Architecture, Placing Drivers, Bluetooth® Low Energy Controller, IEEE 802.15.4 MAC, and Bootloader in ROM  No external component required.  Low Power and Wide Supply Voltage Range: 1.8 to 3.8V - Internal DC-DC converter built-in
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 4 http://WWW.JORJIN.COM.TW CONFIDENTIAL  2.4-GHz RF Transceiver Compatible With Bluetooth Low Energy (BLE) 4.2 Specification and IEEE 802.15.4 PHY and MAC - Excellent Receiver Sensitivity (–96 dBm for BLE and –99 dBm for 802.15.4), Selectivity, and Blocking Performance - Programmable Output Power up to +5 dBm - Integrated Antenna  Tools and Development Environment from TI - Full-Feature and Low-Cost Development Kits - Packet Sniffer PC Software - Sensor Controller Studio - SmartRF™ Studio - SmartRF Flash Programmer 2 - IAR Embedded Workbench® for ARM - Code Composer Studio™ 1.2. Applications  Consumer Electronics  Mobile Phone Accessories  Sports and Fitness Equipment  HID Applications  Home and Building Automation  Lighting Control  Alarm and Security  Electronic Shelf Labeling  Proximity Tags  Medical  Remote Controls  Wireless Sensor Networks
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 5 http://WWW.JORJIN.COM.TW CONFIDENTIAL 2. FUNCTIONAL FEATURES 2.1. Module Block Diagram VDD GPIOs ZB7 module GPIOs 4M bits SPI Flash Memory (Optional)
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 6 http://WWW.JORJIN.COM.TW CONFIDENTIAL 2.2. Block Functional Feature Microcontroller  Powerful ARM® Cortex®-M3  EEMBC CoreMark® score: 142  Up to 48-MHz Clock Speed  128KB of In-System Programmable Flash  8-KB SRAM for Cache  20-KB Ultra-Low Leakage SRAM  2-Pin cJTAG and JTAG Debugging  Supports Over-The-Air Upgrade (OTA) Ultra-Low Power Sensor Controller  Can run autonomous from the rest of the system  16-Bit Architecture  2-KB Ultra-Low Leakage SRAM for Code and Data Peripherals  All Digital Peripheral Pins can be routed to any GPIO.  15 GPIOs  4 General-Purpose Timer Modules (8 × 16-Bit or 4 × 32-Bit Timer, PWM Each)  12-Bit ADC, 200-ksamples/s, 8-Channel Analog MUX  Continuous Time Comparator  Ultra-Low Power Analog Comparator  Programmable Current Source  UART  2x SSI (SPI, MICROWIRE, TI)  I2C  I2S  Real-Time Clock (RTC)
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 7 http://WWW.JORJIN.COM.TW CONFIDENTIAL  AES-128 Security Module  True Random Number Generator (TRNG)  Support for 8 Capacitive Sensing Buttons  Integrated Temperature Sensor RF Section  2.4 GHz RF Transceiver Compatible With Bluetooth Low Energy (BLE) 4.1 specification and IEEE 802.15.4 PHY and MAC  Excellent Receiver Sensitivity (–96 dBm for BLE and –99 dBm for 802.15.4), Selectivity, and Blocking Performance  Link budget of 101 dB/104 dB (BLE/802.15.4)  Programmable Output Power up to +5 dBm  Integrated Antenna  Suitable for Systems Targeting Compliance With Worldwide Radio Frequency Regulations - ETSI EN 300 328 (Europe) - EN 300 440 Class 2 (Europe) - FCC CFR47 Part 15 (US) - ARIB STD-T66 (Japan) 4M bits SPI serial Flash (optional)  AT25DF041B SPI serial Flash from Adesto technologies.  128-byte, One-Time Programmable (OTP) Security Register - 64 bytes factory programmed with a unique identifier - 64 bytes user programmable  Flexible Programming - Byte/Page Program (1 to 256 Bytes) - Sequential Program Mode Capability
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 8 http://WWW.JORJIN.COM.TW CONFIDENTIAL 3. MODULE OUTLINE 3.1. Signal Layout (Top View)
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 9 http://WWW.JORJIN.COM.TW CONFIDENTIAL 3.2. Pin Description Table 3-1. Pin Description Pin No. Pin Name Type Description 1 GND GND GND 2 NC NC No connection. For internal test only. 3 GND GND GND 4 DIO_0 Digital I/O GPIO, Sensor Controller 5 DIO_1 Digital I/O GPIO, Sensor Controller 6 DIO_2 Digital I/O GPIO, Sensor Controller, High drive capability 7 DIO_3 Digital I/O GPIO, Sensor Controller, High drive capability 8 DIO_4 Digital I/O GPIO, Sensor Controller, High drive capability 9 JTAG_TMSC Digital I/O JTAG_TMSC, High drive capability 10 JTAG_TCKC Digital I/O JTAG_TCKC 11 DIO_5 Digital I/O GPIO, High drive capability, JTAG_TDO 12 DIO_6 Digital I/O GPIO, High drive capability, JTAG_TDI 13 RESET_N Digital Input Reset, active-low. No internal pullup. Built-in 0.1uF capacitor to GND. 14 DIO_7 Digital/Analog I/O GPIO, Sensor Controller, Analog 15 DIO_8 Digital/Analog I/O GPIO, Sensor Controller, Analog 16 DIO_9 Digital/Analog I/O GPIO, Sensor Controller, Analog. In -04 module, DIO_9 pin is connected to CS# pin of internal serial SPI Flash. 17 DIO_10 Digital/Analog I/O GPIO, Sensor Controller, Analog. In -04 module, DIO_10 pin is connected to SCLK pin of internal serial SPI Flash. 18 DIO_11 Digital/Analog I/O GPIO, Sensor Controller, Analog. In -04 module, DIO_11 pin is connected to SI pin of internal serial SPI Flash. 19 DIO_12 Digital/Analog I/O GPIO, Sensor Controller, Analog. In -04 module, DIO_12 pin is connected to SO pin of internal Serial SPI Flash. 20 DIO_13 Digital/Analog I/O GPIO, Sensor Controller, Analog
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 10 http://WWW.JORJIN.COM.TW CONFIDENTIAL 21 DIO_14 Digital/Analog I/O GPIO, Sensor Controller, Analog 22 VDDS (1) Power 1.8 V to 3.8 V main chip and DC/DC supply 23 VDDS2 (1) Power 1.8 V to 3.8 V GPIO supply 24 NC NC No connection. 25 GND GND Ground G1~G4 GND GND Ground (1) The power range is 1.8V to 3.6V for -04 module.
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 11 http://WWW.JORJIN.COM.TW CONFIDENTIAL 4. MODULE SPECIFICATIONS 4.1. Absolute Maximum Ratings(1)(2) over operating free-air temperature range (unless otherwise noted) (1) All voltage values are with respect to VDDS, unless otherwise noted. (2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (3) VDDS2 must be at the same potential as VDDS. (4) Including analog capable DIO. Parameter Conditions MIN MAX Unit Supply voltage, VDDS(3) -0.3 4.1 V Voltage on any digital pin(4) -0.3 VDDS+0.3 Max 4.1 V Voltage on ADC input (Vin) Voltage scaling enabled -0.3 VDDS V Internal reference, voltage scaling disabled -0.3 1.49 V VDDS as reference, voltage scaling disabled -0.3 VDDS/2.9 V Input RF level +5 dBm Storage temperature range -40 +85 °C
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 12 http://WWW.JORJIN.COM.TW CONFIDENTIAL 4.2. ESD Ratings (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 4.3. Recommended Operating Conditions Parameter Value Unit Electrostatic discharge performance (VESD) Human Body Model (HBM), per ANSI/ESDA/JEDEC JS001(1) All pins ±2500 V Charged Device Model (CDM), per JESD22-C101(2) RF pins ±750 V Non-RF pins ±750 V Parameter Conditions MIN MAX Unit Ambient temperature range -40 85 °C Operating supply voltage (VDDS) For -00 module For operation in battery-powered and 3.3 V systems 1.8 3.8 V Operating supply voltage (VDDS) For -04 module For operation in battery-powered and 3.3 V systems 1.8 3.6 V
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 13 http://WWW.JORJIN.COM.TW CONFIDENTIAL 4.4. Electrical Characteristics Tc = 25°C, VDDS = 3.0 V with internal DC-DC converter, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Icore Core current consumption Reset. RESET_N pin asserted or VDDS below Power-on-Reset threshold 100 nA Shutdown. No clocks running, no retention 150 nA Standby. With RTC, CPU, RAM and (partial) register retention. RCOSC_LF 1 μA Standby. With RTC, CPU, RAM and (partial) register retention. XOSC_LF 1.2 μA Standby. With Cache, RTC, CPU, RAM and (partial) register retention. RCOSC_LF 2.5 μA Standby. With Cache, RTC, CPU, RAM and (partial) register retention. XOSC_LF 2.7 μA Idle. Supply Systems and RAM powered. 550 μA Active. Core running CoreMark 1.45mA + 31uA/MHz Radio RX 6.1 mA Radio TX, 5 dBm output power 9.1 mA Iperi Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated)(1) Peripheral power domain Delta current with domain enabled 20 μA Serial power domain Delta current with domain enabled 13 μA RF Core Delta current with power domain enabled, clock enabled, RF Core Idle 237 μA μDMA Delta current with clock enabled, module idle 130 μA Timers Delta current with clock enabled, module idle 113 μA I2C Delta current with clock enabled, module idle 12 μA I2S Delta current with clock enabled, module idle 36 μA SSI Delta current with clock enabled, module idle 93 μA UART Delta current with clock enabled, module idle 164 μA (1) Iperi is not supported in standby or shutdown modes.
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 14 http://WWW.JORJIN.COM.TW CONFIDENTIAL 4.5. General Characteristics Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units FLASH MEMORY Supported flash erase cycles before failure 100 K Cycles Flash page/sector erase current Average delta current 12.6 mA Flash page/sector erase time(1) 8 ms Flash page/sector size 4 KB Flash write current Average delta current, 4 bytes at a time 8.15 mA Flash write time(1) 4 bytes at a time 8 μs (1) This number is dependent on Flash aging and will increase over time and erase cycles 4.6. 1-Mbps GFSK (Bluetooth Low Energy) – RX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Receiver sensitivity BER = 10–3 -96 dBm Receiver saturation BER = 10–3 4 dBm Frequency error tolerance Difference between center frequency of the received RF signal and local oscillator frequency. -350 350 kHz Data rate error tolerance Difference between incoming data rate and the internally generated data rate -750 750 ppm Co-channel rejection(1) Wanted signal at –67 dBm, modulated interferer in channel, BER = 10–3 -6 dB Selectivity, ±1 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±1 MHz, BER = 10–3 7 / 3(2) dB Selectivity, ±2 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±2 MHz, BER = 10–3 34/25(2) dB Selectivity, ±3 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±3 MHz, BER = 10–3 38/26(2) dB Selectivity, ±4 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10–3 42/29(2) dB
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 15 http://WWW.JORJIN.COM.TW CONFIDENTIAL Selectivity, ±5 MHz or more(1) Wanted signal at –67 dBm, modulated interferer at ≥ ±5 MHz, BER = 10–3 32 dB Selectivity, Image frequency(1) Wanted signal at –67 dBm, modulated interferer at image frequency, BER = 10–3 25 dB Selectivity, Image frequency ±1 MHz (1) Wanted signal at –67 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 3/26(2) dB Out-of-band blocking(3) 30 MHz to 2000 MHz -20 dBm Out-of-band blocking 2003 MHz to 2399 MHz -5 dBm Out-of-band blocking 2484 MHz to 2997 MHz -8 dBm Out-of-band blocking 3000 MHz to 12.75 GHz -8 dBm Intermodulation Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level -34 dBm Spurious emissions, 30 to 1000 MHz Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 -71 dBm Spurious emissions, 1 to 12.75 GHz Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 -62 dBm RSSI dynamic range 70 dB RSSI accuracy ±4 dB (1) Numbers given as I/C dB (2) X / Y, where X is +N MHz and Y is –N MHz (3) Excluding one exception at Fwanted / 2, per Bluetooth Specification 4.7. 1-Mbps GFSK (Bluetooth Low Energy) – TX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Output power, highest setting Delivered to a single-ended 50-Ω load 5 dBm Output power, lowest setting Delivered to a single-ended 50-Ω load -21 dBm
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 16 http://WWW.JORJIN.COM.TW CONFIDENTIAL Spurious emission conducted measurement(1) f < 1 GHz, outside restricted bands -43 dBm f < 1 GHz, restricted bands ETSI -65 dBm f < 1 GHz, restricted bands FCC -76 dBm f > 1 GHz, including harmonics -46 dBm (1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan). 4.8. IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Receiver sensitivity PER = 1% -99 dBm Receiver saturation PER = 1% +4 dBm Adjacent channel rejection Wanted signal at –82 dBm, modulated interferer at ±5 MHz, PER=1% 39 dB Alternate channel rejection Wanted signal at –82 dBm, modulated interferer at ±10 MHz, PER=1% 52 dB Channel rejection, ±15 MHz or more Wanted signal at –82 dBm, undesired signal is IEEE 802.15.4 modulated channel, stepped through all channels 2405 to 2480 MHz, PER = 1% 57 dB Blocking and desensitization, 5MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 64 dB Blocking and desensitization, 10MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 64 dB Blocking and desensitization, 20MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 65 dB Blocking and desensitization, 50MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 68 dB Blocking and desensitization, -5MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 63 dB Blocking and desensitization, -10MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 63 dB Blocking and desensitization, -20MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 65 dB
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 17 http://WWW.JORJIN.COM.TW CONFIDENTIAL Blocking and desensitization, -50MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 67 dB Spurious emissions, 30 MHz to 1000 MHz Conducted measurement in a 50 Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 -71 dBm Spurious emissions, 1 GHz to 12.75 GHz Conducted measurement in a 50 Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 -62 dBm Frequency error tolerance Difference between center frequency of the received RF signal and local oscillator frequency >200 ppm Symbol rate error tolerance Difference between incoming symbol rate and the internally generated symbol rate >1000 ppm RSSI dynamic range 100 dB RSSI accuracy ±4 dB 4.9. IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX RF performance is specified in a single ended 50 ohm reference plane at the antenna feeding point with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Output power, highest setting Delivered to a single-ended 50-Ω load 5 dBm Output power, lowest setting Delivered to a single-ended 50-Ω load -21 dBm Error vector magnitude At maximum output power 2 % Spurious emission conducted measurement f < 1 GHz, outside restricted bands -43 dBm f < 1 GHz, restricted bands ETSI -65 dBm f < 1 GHz, restricted bands FCC -76 dBm f > 1 GHz, including harmonics -46 dBm Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 18 http://WWW.JORJIN.COM.TW CONFIDENTIAL 4.10. Internal 24-MHz Crystal Oscillator (XOSC_HF)(1) Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Crystal frequency 24 MHz Crystal frequency tolerance(2) -40 +40 ppm Start-up time(3) 150 μs (1) Probing or otherwise stopping the XTAL while the DC-DC converter is enabled may cause permanent damage to the device. (2) Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance. As per Bluetooth and IEEE 802.15.4 specification (3) Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection 4.11. 32.768-kHz Crystal Oscillator (XOSC_LF) Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Crystal frequency 32.768 KHz Crystal frequency tolerance, Bluetooth low energy applications(1) -500 500 ppm (1) Includes initial tolerance of the crystal, drift over temperature, ageing and frequency pulling due to incorrect load capacitance. As per Bluetooth and IEEE 802.15.4 specification. 4.12. 48-MHz RC Oscillator (RCOSC_HF) Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Frequency 48 MHz Uncalibrated frequency accuracy ±1 % Calibrated frequency accuracy(1) ±0.25 % Start-up time 5 μs (1) Accuracy relatively to the calibration source (XOSC_HF).
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 19 http://WWW.JORJIN.COM.TW CONFIDENTIAL 4.13. 32-kHz RC Oscillator (RCOSC_LF) Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Calibrated frequency 32.8 KHz Temperature coefficient 50 ppm/°C 4.14. ADC Characteristics(1) Tc = 25°C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Input voltage range 0 VDDS V Resolution 12 Bits Sample rate 200 ksps Offset Internal 4.3-V equivalent reference(2) 2 LSB Gain error Internal 4.3-V equivalent reference(2) 2.4 LSB DNL(3) Differential nonlinearity >-1 LSB INL Integral nonlinearity ±3 LSB ENOB Effective number of bits Internal 4.3-V equivalent reference(2), 200 ksps, 9.6-kHz input tone 9.8 Bits VDDS as reference, 200 ksps, 9.6-kHz input tone 10 Bits Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone 11.1 Bits THD - Total harmonic distortion Internal 4.3-V equivalent reference(2), 200 ksps, 9.6-kHz input tone -65 dB VDDS as reference, 200 ksps, 9.6-kHz input tone -69 dB Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone -71 dB SINAD / SNDR - Signal-to-noise and distortion ratio Internal 4.3-V equivalent reference(2), 200 ksps, 9.6-kHz input tone 60 dB VDDS as reference, 200 ksps, 9.6-kHz 63 dB
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 20 http://WWW.JORJIN.COM.TW CONFIDENTIAL input tone Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone 69 dB SFDR – Spurious-free dynamic range Internal 4.3-V equivalent reference(2), 200 ksps, 9.6-kHz input tone 67 dB VDDS as reference, 200 ksps, 9.6-kHz input tone 72 dB Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone 73 dB Conversion time Serial conversion, time-to-output, 24-MHz clock 50 Clock cycles Current consumption Internal 4.3-V equivalent reference(2) 0.66 mA Current consumption VDDS as reference 0.75 mA Reference voltage Equivalent fixed internal reference (input voltage scaling enabled) 4.3 (2)(4) V Reference voltage Fixed internal reference (input voltage scaling disabled) 1.44 ±1% V Reference voltage VDDS as reference (Also known as RELATIVE) (input voltage scaling enabled) VDDS V Reference voltage VDDS as reference (Also known as RELATIVE) (input voltage scaling disabled) VDDS/ 2.82(4) V Input Impedance 200 ksps, voltage scaling enabled. Capacitive input, Input impedance depends on sampling frequency and sampling time >1 MΩ (1) Using IEEE Std 1241™-2010 for terminology and test methods. (2) Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V. (3) No missing codes. Positive DNL typically varies from +0.3 to +3.5, depending on device (4) Applied voltage must be within absolute maximum ratings (Section 4.1) at all times.
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 21 http://WWW.JORJIN.COM.TW CONFIDENTIAL 4.15. Temperature Sensor Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Resolution 4 °C Range -40 +85 °C Accuracy ±5 °C Supply voltage coefficient(1) 3.2 °C /V (1) Automatically compensated when using supplied driver libraries. 4.16. Battery Monitor Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Resolution 50 mV Range 1.8 3.8 V Accuracy 13 mV 4.17. Continuous Time Comparator Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Input voltage range 0 VDDS V External reference voltage 0 VDDS V Internal reference voltage DCOUPL as reference 1.27 V Offset 3 mV Hysteresis <2 mV Decision time Step from –10 mV to +10 mV 0.72 μs Current consumption when enabled(1) 8.6 μA (1) Additionally the bias module needs to be enabled when running in standby mode.
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 22 http://WWW.JORJIN.COM.TW CONFIDENTIAL 4.18. Low-Power Clocked Comparator Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Input voltage range 0 VDDS V Clock frequency 32 kHz Internal reference voltage, VDDS / 2 1.49-1.51 V Internal reference voltage, VDDS / 3 1.01-1.03 V Internal reference voltage, VDDS / 4 0.78-0.79 V Internal reference voltage, DCOUPL / 1 1.25-1.28 V Internal reference voltage, DCOUPL / 2 0.63-0.65 V Internal reference voltage, DCOUPL / 3 0.42-0.44 V Internal reference voltage, DCOUPL / 4 0.33-0.34 V Offset <2 mV Hysteresis <5 mV Decision time Step from –50 mV to +50 mV <1 clock cycle Current consumption when enabled 362 nA 4.19. Programmable Current Source Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units Current source programmable output range 0.25-20 μA Resolution 0.25 μA Current consumption(1) Including current source at maximum programmable output 23 μA (1) Additionally, the bias module must be enabled when running in standby mode.
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 23 http://WWW.JORJIN.COM.TW CONFIDENTIAL 4.20. DC Characteristics Parameter Test Conditions Min Typ Max Units TA = 25°C, VDDS = 1.8 V GPIO VOH at 8-mA load IOCURR = 2, high drive GPIOs only 1.32 1.54 V GPIO VOL at 8-mA load IOCURR = 2, high drive GPIOs only 0.26 0.32 V GPIO VOH at 4-mA load IOCURR = 1 1.32 1.58 V GPIO VOL at 4-mA load IOCURR = 1 0.21 0.32 V GPIO pullup current Input mode, pullup enabled, Vpad=0V 71.7 μA GPIO pulldown current Input mode, pulldown enabled, Vpad=VDDS 21.1 μA GPIO high/low input transition, no hysteresis IH = 0, transition between reading 0 and reading 1 0.88 V GPIO low-to-high input transition, with hysteresis IH = 1, transition voltage for input read as 0→1 1.07 V GPIO high-to-low input transition, with hysteresis IH = 1, transition voltage for input read as 1→0 0.74 V GPIO input hysteresis IH = 1, difference between 0→1 and 1→0 points 0.33 V TA = 25°C, VDDS = 3.0 V GPIO VOH at 8-mA load IOCURR = 2, high drive GPIOs only 2.68 V GPIO VOL at 8-mA load IOCURR = 2, high drive GPIOs only 0.33 V GPIO VOH at 4-mA load IOCURR = 1 2.72 V GPIO VOL at 4-mA load IOCURR = 1 0.28 V TA = 25°C, VDDS = 3.8 V GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 277 μA GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 113 μA GPIO high/low input transition, no hysteresis IH = 0, transition between reading 0 and reading 1 1.67 V GPIO low-to-high input transition, with hysteresis IH = 1, transition voltage for input read as 0→1 1.94 V GPIO high-to-low input transition, with hysteresis IH = 1, transition voltage for input read as 1→0 1.54 V GPIO input hysteresis IH = 1, difference between 0→1 and 1→0 points 0.4 V TA = 25°C VIH Lowest GPIO input voltage reliably interpreted as a ”High” 0.8 VDDS (1)
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 24 http://WWW.JORJIN.COM.TW CONFIDENTIAL VIL Highest GPIO input voltage reliably interpreted as a ”Low” 0.2 VDDS (1) (1) Each GPIO is referenced to a specific VDDS pin. See the CC2650 technical reference manual listed in Section 8.2 for more details. 4.21. Timing Requirements Min Typ Max Units Rising supply-voltage slew rate 0 100 mV/μs Falling supply-voltage slew rate 0 20 mV/μs Positive temperature gradient in standby(1) No limitation for negative temperature gradient, or outside standby mode 5 °C/s CONTROL INPUT AC CHARACTERISTICS(2) RESET_N low duration 1 μs SYNCHRONOUS SERIAL INTERFACE (SSI) (3) S1 (SLAVE) (4) Tclk_per SSIClk period 12 65024 system clock S2 (4) tclk_high SSIClk high time 0.5 Tclk_per S3(4) tclk_low SSIClk low time 0.5 Tclk_per (1) Applications using RCOSC_LF as sleep timer must also consider the drift in frequency caused by a change in temperature. (2) TA = –40°C to 85°C, VDDS = 1.8 V to 3.8 V, unless otherwise noted. (3) Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Device operating as SLAVE. For SSI MASTER operation, see Section 4.22. (4) Refer to SSI timing diagrams Figure 4-1, Figure 4-2, and Figure 4-3. 4.22. Switching Characteristics Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. Parameter Test Conditions Min Typ Max Units WAKEUP AND TIMING Idle → Active 14 μs Standby → Active 151 μs Shutdown → Active 1015 μs SYNCHRONOUS SERIAL INTERFACE (SSI) (1) S1 (TX only)(2) tclk_per (SSIClk period) One-way communication to SLAVE 4 65024 system
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 25 http://WWW.JORJIN.COM.TW CONFIDENTIAL S1(TX and RX)(2) tclk_per (SSIClk period) Normal duplex operation 8 65024 clocks S2 (2) tclk_high (SSIClk high time) 0.5 tclk_per S3 (2) tclk_low(SSIClk low time) 0.5 tclk_per (1) Device operating as MASTER. For SSI SLAVE operation, see Section 4.21. (2) (4) Refer to SSI timing diagrams Figure 4-1, Figure 4-2, and Figure 4-3. Figure 4-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement Figure 4-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 26 http://WWW.JORJIN.COM.TW CONFIDENTIAL Figure 4-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 27 http://WWW.JORJIN.COM.TW CONFIDENTIAL 5. DESIGN RECOMMENDATIONS 5.1. Module Layout Recommendations Follow these module layout recommendations:  Antenna For a module with on board chip antenna, to eliminate the influence from other components or ground, recommended that the module is placed in the corner of main PCB, and define a clearance area around the antenna, where no grounding or signal trace are contained. The clearance area applies to all layers of the main PCB. The recommended dimensions of the main PCB keep out area are shown in bellow. 11 mm 5.5 mm
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 28 http://WWW.JORJIN.COM.TW CONFIDENTIAL  RF test point There are RF test points in the bottom side of this module. It is only for module production used. Do not connect any signal to these test points (leave no connection). Please reserve a keep out area. Do not route any signal or place via in this keep out area.  Device and Documentation Support For a complete device and tool documents for the CC2650 platform, visit the Texas Instruments website at http://www.ti.com. RF test points keep out area
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 29 http://WWW.JORJIN.COM.TW CONFIDENTIAL 5.2. Reference Schematic J1HEADER 5x2/SM24681013579nRESETJTAG_TCKJTAG_TMSVDDSDIO_2DIO_1DIO_0JTAG_TCKJTAG_TMSDIO_4DIO_3DIO_6/DIO_5DIO_7nRESETDIO_9DIO_8DIO_13DIO_12DIO_11DIO_10DIO_14cJTAG InterfaceVDDSR6100KRES0402VDDSG1 G2G3 G4U1ZB7DIO_04DIO_15JTAG_TMSC9JTAG_TCKC10DIO_511DIO_612RESET_N13DIO_714DIO_815DIO_916DIO_10 17DIO_11 18DIO_12 19DIO_13 20DIO_14 21VDDS 22GND1G1 GND2 G2GND3G3 GND4 G4DIO_48DIO_37DIO_26GND3GND51NC2VDDS2 23NC 24GND6 25 * All Digital Peripheral Pins can be routed to any GPIO.
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 30 http://WWW.JORJIN.COM.TW CONFIDENTIAL 6. CHIP ANTENNA PERFORMACE SUMMARY Measured on the Jorjin ZB7500E00 EM board with TA = 25°C 6.1. S-Parameter Test
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 31 http://WWW.JORJIN.COM.TW CONFIDENTIAL 6.2. DUT 3D Pattern 6.3. Total Efficiency Parameter 2400MHz 2450MHz 2483MHz S11 -10.780 dB -17.338 dB -16.020 dB Efficiency% 53.97 % 56.87 % 53.64 % Peak Gain 1.080 dBi 1.256 dBi 1.034 dBi X Z Y
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 32 http://WWW.JORJIN.COM.TW CONFIDENTIAL 7. PACKAGE INFORMATION 7.1. Module Mechanical Outline Top View Note: 1> Pad tolerance as ±30um 2> Unit: mm
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 33 http://WWW.JORJIN.COM.TW CONFIDENTIAL Top and Side View Note: A: Typical: 2.45mm, Maximum: 2.69mm B: Typical: 2.00mm, Maximum: 2.20mm Unit: mm Shielding case Opening
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 34 http://WWW.JORJIN.COM.TW CONFIDENTIAL 7.2. Ordering Information Order Number Package Test Grade ZB7500-00 LGA-25 500-00 ZB7500-04 LGA-25 500-04 ZB7410-00 LGA-25 410-00 ZB7410-04 LGA-25 410-04 ZB7320-00 LGA-25 320-00 ZB7320-04 LGA-25 320-04 7.3. Package Marking Marking Description JORJIN Brand name ZB7 Model name XX0-0X Test grade (for more information, see Section 7.4, Test Grades) R XXX-XXXXXX JORJIN Model:ZB7 Grade:XX0-0X LTC:YYWWSSF IC:10462A-ZB7 FCC ID:WS2-ZB7 CCXXxxYYyyyZzW
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 35 http://WWW.JORJIN.COM.TW CONFIDENTIAL YYWWSSF Lot Trace Code: YYWWSSF YY= Digit of the year, ex: 2016=16 WW= Week (01~52) SS= Serial number from 01~98 match to MFG’s lot number, or 99 to repair control code F= Reverse for internal use TELEC compliance mark, and ID 10462A-ZB7 Canada IC ID WS2-ZB7 FCC ID NCC compliance mark, and ID 7.4. Test Grades The ZB7 module offers six footprint-compatible, function variants by embedded software. Test Grade BLE 802.15.4 Addition 4Mbs SPI Flash 500-00 Tested Tested 500-04 Tested Tested Installed 410-00 Tested 410-04 Tested Installed 320-00 Tested 320-04 Tested Installed
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 36 http://WWW.JORJIN.COM.TW CONFIDENTIAL 8. SMT AND BAKING RECOMMENDATION 8.1. Baking Recommendation  Baking condition： - Follow MSL Level 4 to do baking process. - After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be a) Mounted within 72 hours of factory conditions <30°C/60% RH, or b) Stored at <10% RH. - Devices require bake, before mounting, if Humidity Indicator Card reads >10% - If baking is required, Devices may be baked for 8 hrs. at 125 °C. 8.2. SMT Recommendation  Recommended Reflow profile： H
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 37 http://WWW.JORJIN.COM.TW CONFIDENTIAL No. Item Temperature (°C) Time (sec) 1 Pre-heat D1: 140 ~ D2: 200 T1: 80 ~ 120 2 Soldering D2: = 220 T2: 60 +/- 10 3 Peak-Temp. D3: 250 °C max Note: (1) Reflow soldering is recommended two times maximum. (2) Add Nitrogen while Reflow process： SMT solder ability will be better.  Stencil thickness： 0.1~ 0.13 mm (Recommended)  Soldering paste (without Pb)： Recommended SENJU N705-GRN3360-K2-V can get better soldering effects.
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 38 http://WWW.JORJIN.COM.TW CONFIDENTIAL 9. TAPE REEL INFROMATION 9.1. Cover / Carrier Tape Dimension Packing Qty Dry Bag Inner Box Outer Box 1200 EA / Reel 1 Reel (1200 EA) 1 Dry Bag (1200 EA) 4 Inner Box (4800 EA) Inner Box Size : 352mm x 352mm x 56mm Outer Box Size : 354mm x 362mm x 250mm
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 39 http://WWW.JORJIN.COM.TW CONFIDENTIAL 10. REGULATORY INFORMATION This section outlines the regulatory information for the following countries:  United States  Canada  Europe  Japan  Taiwan 10.1. United States Federal Communications Commission Statement 15.21. You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the user’s authority to operate the equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference and (2) This device must accept any interference received, including interference that may cause undesired operation of the device. FCC RF Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure limits. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. End Product Labeling: This module is designed to comply with the FCC statement, FCC ID: WS2-ZB7. The host system using this module must display a visible label indicating the following text: "Contains FCC ID: WS2-ZB7" Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 40 http://WWW.JORJIN.COM.TW CONFIDENTIAL module. The end user manual shall include all required regulatory information/warning as shown in this manual. 10.2. Canada This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. IC RF Radiation Exposure Statement: To comply with IC RF exposure requirements, this device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter. Pour se conformer aux exigences de conformité RF canadienne l'exposition, cet appareil et son antenne ne doivent pas étre co-localisés ou fonctionnant en conjonction avec une autre antenne ou transmetteur. End Product Labeling: This module is designed to comply with the IC statement, IC: 10462A-ZB7. The host system using this module must display a visible label indicating the following text: "Contains IC: 10462A-ZB7" Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 41 http://WWW.JORJIN.COM.TW CONFIDENTIAL module. The end user manual shall include all required regulatory information/warning as shown in this manual. 10.3. Europe This module is an R&TTE Directive assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. This module is conformity with the following standards  EN300328 v1.9.1 (Bluetooth Low Energy)  EN300328 v1.9.1 (802.15.4)  IEC/EN62479:Ver 2010 (MPE) (replacing EN50371)  EN301489-1 v1.9.2:2011  EN301489-3 v1.6.1:2013  EN301489-17 v2.2.1:2012 (EMC)  EN55022:2010+AC:2011  EN55024:2011  EN60950-1: A2/2013 Labeling and User Information Requirements As a result of the conformity assessment procedure described in Annex III of the Directive 1999/5/EC, the end-customer equipment should be labeled as follows: 10.4. Japan The ZB7 is certified as a module with type certification number XXX-XXXXXX. End products that integrate this module do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module.
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 42 http://WWW.JORJIN.COM.TW CONFIDENTIAL 10.5. Taiwan The ZB7 is certified as a module with type certification number XXXXXXXXXXXXXX. End products that integrate this module do not need additional NCC Taiwan certification for the end product. End product can display the certification label of the embedded module. The user's manual should contain following warning (for RF device) in traditional Chinese: 注意 本產品符合低功率電波輻射性電機管理辦法： 第十二條 經形式認證合格之低功率射頻電機，非經許可，公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計之特性及功能。 第十四條 低功率射頻電機之使用不得影響飛航安全及干擾合法通信；經發現有干擾現象時，應立即停用，並改善至無干擾時方的繼續使用。 前項合法通信，指依電信規定作業之無線電信。低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性電機設備之干擾。 系統廠商應於平台上標示「本產品內含射頻模組: CCXXxxYYyyyZzW」字樣
DOC No: ZB7-DTS-D02 ____________________________________________________________________________________ Copyright © JORJIN TECHNOLOGIES INC. 2016 43 http://WWW.JORJIN.COM.TW CONFIDENTIAL 11. HISTORY CHANGE Revision Date Description Revision A Design D 0.1 2015/06/22 Initial Released Revision B Design D 0.1 2016/01/21 1. Upgrade the design to Revision B 2. Module size extended to 16.9mm x 11mm 3. Change antenna D 0.2 2016/08/02 1. Update part number 2. Modify sensitivity characteristics 3. Add reference schematic 4. Add antenna characteristics 5. Add marking information 6. Add Tape Reel information 7. Add Regulatory Information

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