KC Wirefree BTMODULE-CL1 Bluetooth Class I Module User Manual KC11 Datasheetv1 1
KC Wirefree Corporation Bluetooth Class I Module KC11 Datasheetv1 1
Exhibit D Users Manual per 2 1033 b3
KC11 Bluetooth Class 1 OEM Module Page 1 of 4
Datasheet
©2004 KC Wirefree LL
C
www.kcwirefree.com 06Dec2004
Features
► Bluetooth v1.2 specification
► Complete RF ready module
► Class 1 radio
► High-speed data rates up to 921K baud
► High-performance ARM7 processor up to 48MHz
► High-security 128-bit encryption
► Amplified range up to 200m
► Miniature solution 15mm by 48mm
► All Bluetooth data rates (57.6 to 723.2 Kb/sec)
► SPI interface, up to 24MHz
► 14 general purpose I/O
► AT command set
► Dynamic configuration
► Low power sniff mode
► Point-to-point and point-to-multipoint capability
► Multiple device bonding
► USB 2.0 compatible
► CPU, radio, antenna, & firmware on module
► Zeevo 4002 and 4301 Bluetooth chip solutions
Description
The KC11 is a surface mount PCB module that provides
ready to use Bluetooth wireless technology. The
conveniently pre-programmed flash device contains
firmware for serial cable replacement using the Bluetooth
SPP profile per the Bluetooth v1.2 specification.
Customized firmware is easily pre-loaded into these fully
tuned and tested modules so that they are ready to install
without any further procedures. The KC11 is a Class 1
Bluetooth Module supplied on a 32 pin surface mount 6
layer PCB with a miniature footprint.
KC11
Bluetooth Module
Typical Cable Replacement Applications
Serial communications
Machine diagnostics and control
Financial transactions
Remote sensing
Medical device communications
Industrial control
Home automation
KC11 Bluetooth Class 1 OEM Module Page 2 of 4
Datasheet
©2004 KC Wirefree LL
C
www.kcwirefree.com 06Dec2004
A
pplications
Events
RF
Baseband
LM
HCI
Upper Layer Stack
TC2001
P
Commands
HCI Stac
k
Host
CPU
Internal flash
Software Architecture
Lower Layer Stack
• Full Bluetooth data rate (723.3kbps maximum)
• All ACL (Asynchronous Connection Less) packet types (DM1, DH1, DM3, DH3,
DM5, DH5, AUX1)
• SCO (Synchronous Connection Oriented) packet types (HV1, HV2, HV3)
• Point to multipoint and scatternet support—3 master and 7 slave links allowed
(10 active links simultaneously)
• Master slave switch—supported during connection and post connection
• Authentication and encryption—encryption key length from 8-bits to 128-bits
maximum
• Park, sniff, and hold modes—fully supported to maximum allowed intervals,
approximately 50 parked slaves
• Dedicated Inquiry Access Code—for improved inquiry scan performance
• Dynamic packet selection—channel quality driven data rate to optimize link
performance
• Dynamic power control—interference reduction and link performance
optimization for all device classes
• Bluetooth test modes—per Bluetooth 1.2 specification
• Device power modes—active, sleep and deep sleep
• 802.11b co-existence—AWMA and AFH
• Persistent FLASH memory—for BD Address and radio parameter storage
• Wake on Bluetooth feature—optimized power consumption of host CPU
• SCO over UART, PCM, or SPI interface—application flexibility for host CPU
• Vendor specific HCI commands—to support device configuration and
certification test modes
Upper Layer Stack
• SDAP, GAP, SPP, and DUN protocols
• RFComm, SDP, and L2CAP supported
HCI Interface
• Bluetooth 1.2 specification compliant
• HCI USB transport layer (H2)
• HCI UART transport layer (H4)
• Firmware upgrade over UART
KC11 Bluetooth Class 1 OEM Module Page 3 of 4
Datasheet
©2004 KC Wirefree LL
C
www.kcwirefree.com 06Dec2004
Hardware Specifications
Absolute Maximum Ratings
Rating Min Typical Max Unit
Storage temperature range -40 - +150 °C
Supply voltage, VDD -0.3 - + 3.6 Volts
RF input power - - -5 dBm
Recommended Operating Conditions
Rating Min Typical Max Unit
Operating Temperature Range -20 - 85 °C
Supply Voltage VDD 2.7 3.3 3.6 Volts
Signal Pin Voltage - 3.3 - Volts
RF Frequency 2400 - 2483.5 MHz
Current Consumption
General Conditions: VDD= 3.3V, temperature = 25 °C, frequency = 2.402 - 2.480
GHz, 50 Ω antenna, 12 MHz ext crystal, and 32 KHz ext sleep crystal.
Modes Avg Unit
Typical Power Consumption
ACL data 115K Baud UART at max throughput (Master) 98.0 mA
ACL data 115K Baud UART at max throughput (Slave) 95.0 mA
Connection, no data traffic, master 18.0 mA
Connection, no data traffic, slave 28.0 mA
Connection in sniff (Tsniff=100ms), no data traffic, master 10.2 mA
Connection in sniff (Tsniff=100ms), no data traffic, slave 10.8 mA
Connection in sniff (Tsniff=375ms), no data traffic, master 2.75 mA
Connection in sniff (Tsniff=375ms), no data traffic, slave 3.50 mA
Standby, without deep sleep 16.5 mA
Standby, with deep sleep 1.2 mA
Page/Inquiry scan, deep sleep 6.1 mA
Peak current 210 mA
* All current consumption numbers include on-die regulators and flash memory
I/O Operating Characteristics (VDD = 3.3 V, unless otherwise specified)
Symbol Parameter Min Max Unit Conditions
VIL Low-Level Input Voltage - 0.8 Volts
VIH High-Level Input Voltage 2.0 - Volts
VOL Low-Level Output Voltage - 0.4 Volts IOL = 2mA
VOH High-Level Output Voltage 2.4 - Volts IOH = 2mA
IOL Low -Level Output Current - 2.2 mA VOL = 0.4 V
IOH High-Level Output Current - 3.1 mA VOH = 2.4 V
II Input Leakage Current -1 +1 uA @VI = 3.3V or 0V
VT+ Schmitt Trigger Low-High 1.47 1.50 Volts
VT- Schmitt Trigger High-Low 0.89 0.95 Volts
RPU Pull-up Resistor 53 113 KΩ Resistor Turned On
RPD Pull-down Resistor 43 118 KΩ Resistor Turned On
CI Input Capacitance 7.5 pF
USB I/O Operating Characteristics (VDD = 3.3 V)
Symbol Parameter Min Max Unit Conditions
VIL Low-Level Input Voltage - 0.8 Volts
VIH High-Level Input Voltage 2.0 - Volts
VOL Low-Level Output Voltage - 0.3 Volts
VOH High-Level Output Voltage 2.8 - Volts
Cin Input Capacitance - 25 pF DP or DM to GND
Selected RF Characteristics
General Conditions: VDD= 3.3V, temperature = 25 °C, frequency = 2.402 - 2.480 GHz, 50 Ω
antenna, 12 MHz ext crystal, and 32 KHz ext sleep crystal.
Parameters Conditions BT Spec Typical Unit
Antenna load 50 Ω
Radio Receiver
Sensitivity level BER < .001 with DH5 ≤ -70 -88 dBm
Maximum usable level BER < .001 with DH1 ≥ -20 -5 dBm
Input VSWR 2.5:1
Radio Transmitter
Maximum output power 50 Ω load +4 to +20 +18 dBm
Power control range ≥ 16 30 dB
Power control resolution 2 to 8 4 dB
Initial Carrier Frequency Tolerance ± 75 18 kHz
20 dB Bandwidth for modulated carrier ≤ 1000 930 kHz
KC11 Bluetooth Class 1 OEM Module Page 4 of 4
Datasheet
©2004 KC Wirefree LL
C
www.kcwirefree.com 06Dec2004
55 mil
520 mil
600 mil
1870
mil
40 mil
60 mil
65 mil
395
mil
570
mil
1 GPIO[3] +3.3V 32
GND 31
GPIO[15] 30
GPIO[5] 29
GPIO[2] 28
GPIO[4] 27
GPIO[1] 26
GPIO[0] 25
GPIO[10] 24
GPIO[8] 23
GPIO[9] 22
NC 21
NC 20
GND 19
GND 18
GND 1716 GND
15 GND
14 GND
13 USB DM
12 USB DP
11 RTS
10 GPIO[6]
9 CTS
8 RXD
7 TXD
6 GPIO[14]
5 GPIO[7]
4 GPIO[13]
3 RESET
2 MODE
No
Ground
Area
A
n
t
315
mil
KC11 Class 1 Bluetooth OEM Module Footprint
Pin Assignments by Functional Grouping
Name Type Pin # Description
Reset
RESET# I 3 Reset input (active low for 5 ms);
Schmidt triggered
GPIO
GPIO [0] I/O 25 General Purpose Input/Output
GPIO [1] I/O 26 General Purpose Input/Output
GPIO [2] I/O 28 General Purpose Input/Output
GPIO [3] I/O 1 General Purpose Input/Output
GPIO [4] I/O 27 General Purpose Input/Output
GPIO [5] I/O 29 General Purpose Input/Output
GPIO [6] I/O 10 General Purpose Input/Output
GPIO [7] I/O 5 General Purpose Input/Output
GPIO [8] I/O 23 General Purpose Input/Output
GPIO [9] I/O 22 General Purpose Input/Output
GPIO [10] I/O 24 General Purpose Input/Output
GPIO [13] I/O 3 General Purpose Input/Output
GPIO [14] I/O 6 General Purpose Input/Output
GPIO [15] I/O 30 General Purpose Input/Output
UART Interface
RXD I 8 Receive data
TXD O 7 Transmit data
CTS# I 9 Clear to send (active low)
RTS# O 11 Request to send (active low)
USB Interface
DM I/O 13 USB data minus
DP I/O 12 USB data plus
Reserved
MODE I 2 Reserved
Power and Ground
VDD 32 VDD
GND 14-19,31 GND
Layout Guidelines
The area around the KC11 module should be free of any ground planes, trace routings, or metal for at least 250 mil from the antenna in all
directions. Traces should not be routed underneath the module.