KC Wirefree BTMODULE-CL1 Bluetooth Class I Module User Manual KC11 Datasheetv1 1
KC Wirefree Corporation Bluetooth Class I Module KC11 Datasheetv1 1
Exhibit D Users Manual per 2 1033 b3
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| Document ID | 662869 |
| Application ID | 5l1/4gI4dloUz9rDzdyqvQ== |
| Document Description | Exhibit D Users Manual per 2 1033 b3 |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 12.55kB (156849 bits) |
| Date Submitted | 2006-05-30 00:00:00 |
| Date Available | 2006-05-30 00:00:00 |
| Creation Date | 2004-12-16 01:20:24 |
| Producing Software | Acrobat Distiller 6.0 (Windows) |
| Document Lastmod | 2006-05-11 14:17:27 |
| Document Title | Microsoft Word - KC11_Datasheetv1.1.doc |
| Document Creator | PScript5.dll Version 5.2.2 |
| Document Author: | Zeppelin |
KC11 Bluetooth Class 1 OEM Module Page 1 of 4 Datasheet Features ► Bluetooth v1.2 specification ► Complete RF ready module ► Class 1 radio ► High-speed data rates up to 921K baud ► High-performance ARM7 processor up to 48MHz ► High-security 128-bit encryption ► Amplified range up to 200m ► Miniature solution 15mm by 48mm ► All Bluetooth data rates (57.6 to 723.2 Kb/sec) ► SPI interface, up to 24MHz ► 14 general purpose I/O ► AT command set ► Dynamic configuration ► Low power sniff mode ► Point-to-point and point-to-multipoint capability ► Multiple device bonding Financial transactions ► USB 2.0 compatible Remote sensing ► CPU, radio, antenna, & firmware on module ► Zeevo 4002 and 4301 Bluetooth chip solutions ©2004 KC Wirefree LLC KC11 Bluetooth Module Description The KC11 is a surface mount PCB module that provides ready to use Bluetooth wireless technology. The conveniently pre-programmed flash device contains firmware for serial cable replacement using the Bluetooth SPP profile per the Bluetooth v1.2 specification. Customized firmware is easily pre-loaded into these fully tuned and tested modules so that they are ready to install without any further procedures. The KC11 is a Class 1 Bluetooth Module supplied on a 32 pin surface mount 6 layer PCB with a miniature footprint. Typical Cable Replacement Applications Serial communications Machine diagnostics and control Medical device communications Industrial control www.kcwirefree.com Home automation 06Dec2004 KC11 Bluetooth Class 1 OEM Module Page 2 of 4 Datasheet Upper Layer Stack Software Architecture • SDAP, GAP, SPP, and DUN protocols • RFComm, SDP, and L2CAP supported Lower Layer Stack • Full Bluetooth data rate (723.3kbps maximum) • All ACL (Asynchronous Connection Less) packet types (DM1, DH1, DM3, DH3, DM5, DH5, AUX1) HCI Interface • Bluetooth 1.2 specification compliant • SCO (Synchronous Connection Oriented) packet types (HV1, HV2, HV3) • HCI USB transport layer (H2) • Point to multipoint and scatternet support—3 master and 7 slave links allowed (10 active links simultaneously) • Firmware upgrade over UART • HCI UART transport layer (H4) • Master slave switch—supported during connection and post connection • Authentication and encryption—encryption key length from 8-bits to 128-bits maximum • Park, sniff, and hold modes—fully supported to maximum allowed intervals, approximately 50 parked slaves • Dedicated Inquiry Access Code—for improved inquiry scan performance • Dynamic packet selection—channel quality driven data rate to optimize link performance • Dynamic power control—interference reduction and link performance optimization for all device classes • Bluetooth test modes—per Bluetooth 1.2 specification Upper Layer Stack Host CPU Commands Events TC2001P HCI Internal flash • Device power modes—active, sleep and deep sleep LM • 802.11b co-existence—AWMA and AFH • Persistent FLASH memory—for BD Address and radio parameter storage • Wake on Bluetooth feature—optimized power consumption of host CPU • SCO over UART, PCM, or SPI interface—application flexibility for host CPU • Vendor specific HCI commands—to support device configuration and certification test modes ©2004 KC Wirefree LLC Applications www.kcwirefree.com Baseband RF HCI Stack 06Dec2004 KC11 Bluetooth Class 1 OEM Module Page 3 of 4 Datasheet I/O Operating Characteristics Hardware Specifications Symbol Absolute Maximum Ratings Rating Storage temperature range Supply voltage, VDD RF input power Min Typical Max Unit -40 -0.3 +150 + 3.6 -5 °C Volts dBm Recommended Operating Conditions Rating Min Typical Max Unit Operating Temperature Range Supply Voltage VDD Signal Pin Voltage RF Frequency -20 2.7 2400 3.3 3.3 85 3.6 2483.5 °C Volts Volts MHz VIL VIH VOL VOH IOL IOH II VT+ VTRPU RPD CI (VDD = 3.3 V, unless otherwise specified) Parameter Low-Level Input Voltage High-Level Input Voltage Low-Level Output Voltage High-Level Output Voltage Low -Level Output Current High-Level Output Current Input Leakage Current Schmitt Trigger Low-High Schmitt Trigger High-Low Pull-up Resistor Pull-down Resistor Input Capacitance USB I/O Operating Characteristics Current Consumption General Conditions: VDD= 3.3V, temperature = 25 °C, frequency = 2.402 - 2.480 GHz, 50 Ω antenna, 12 MHz ext crystal, and 32 KHz ext sleep crystal. Modes Avg Unit Typical Power Consumption ACL data 115K Baud UART at max throughput (Master) 98.0 mA ACL data 115K Baud UART at max throughput (Slave) 95.0 mA Connection, no data traffic, master 18.0 mA Connection, no data traffic, slave 28.0 mA Connection in sniff (Tsniff=100ms), no data traffic, master 10.2 mA Connection in sniff (Tsniff=100ms), no data traffic, slave 10.8 mA Connection in sniff (Tsniff=375ms), no data traffic, master 2.75 mA Connection in sniff (Tsniff=375ms), no data traffic, slave 3.50 mA Standby, without deep sleep 16.5 mA Standby, with deep sleep 1.2 mA Page/Inquiry scan, deep sleep 6.1 mA Peak current 210 mA * All current consumption numbers include on-die regulators and flash memory ©2004 KC Wirefree LLC Min Max Unit 2.0 2.4 -1 1.47 0.89 53 43 0.8 0.4 2.2 3.1 +1 1.50 0.95 113 118 7.5 Volts Volts Volts Volts mA mA uA Volts Volts KΩ KΩ pF Conditions IOL = 2mA IOH = 2mA VOL = 0.4 V VOH = 2.4 V @VI = 3.3V or 0V Resistor Turned On Resistor Turned On (VDD = 3.3 V) Symbol Parameter Min Max Unit Conditions VIL VIH VOL VOH Cin Low-Level Input Voltage High-Level Input Voltage Low-Level Output Voltage High-Level Output Voltage Input Capacitance 2.0 2.8 0.8 0.3 25 Volts Volts Volts Volts pF DP or DM to GND Selected RF Characteristics General Conditions: VDD= 3.3V, temperature = 25 °C, frequency = 2.402 - 2.480 GHz, 50 Ω antenna, 12 MHz ext crystal, and 32 KHz ext sleep crystal. Parameters Conditions Antenna load Radio Receiver Sensitivity level BER < .001 with DH5 Maximum usable level BER < .001 with DH1 Input VSWR Radio Transmitter Maximum output power 50 Ω load Power control range Power control resolution Initial Carrier Frequency Tolerance 20 dB Bandwidth for modulated carrier www.kcwirefree.com BT Spec Typical Unit 50 Ω ≤ -70 ≥ -20 -88 -5 2.5:1 dBm dBm +4 to +20 ≥ 16 2 to 8 ± 75 ≤ 1000 +18 30 18 930 dBm dB dB kHz kHz 06Dec2004 KC11 Bluetooth Class 1 OEM Module Page 4 of 4 Datasheet 600 mil Pin Assignments by Functional Grouping Name Type Pin # Description 65 mil Reset RESET# 1 GPIO[3] GPIO GPIO [0] I/O GPIO [1] I/O GPIO [2] I/O GPIO [3] I/O GPIO [4] I/O GPIO [5] I/O GPIO [6] I/O GPIO [7] I/O GPIO [8] I/O GPIO [9] I/O GPIO [10] I/O GPIO [13] I/O GPIO [14] I/O GPIO [15] I/O UART Interface RXD TXD CTS# RTS# USB Interface DM I/O DP I/O Reserved MODE Power and Ground VDD GND Reset input (active low for 5 ms); Schmidt triggered 25 26 28 27 29 10 23 22 24 30 General Purpose Input/Output General Purpose Input/Output General Purpose Input/Output General Purpose Input/Output General Purpose Input/Output General Purpose Input/Output General Purpose Input/Output General Purpose Input/Output General Purpose Input/Output General Purpose Input/Output General Purpose Input/Output General Purpose Input/Output General Purpose Input/Output General Purpose Input/Output 11 Receive data Transmit data Clear to send (active low) Request to send (active low) 13 12 USB data minus USB data plus Reserved 32 14-19,31 VDD GND +3.3V 32 2 MODE 40 mil GND 31 GPIO[15] 30 3 RESET 4 GPIO[13] GPIO[5] 29 5 GPIO[7] GPIO[2] 28 6 GPIO[14] GPIO[4] 27 7 TXD GPIO[1] 26 8 RXD GPIO[0] 25 9 CTS GPIO[10] 24 10 GPIO[6] GPIO[8] 23 11 RTS GPIO[9] 22 12 USB DP NC 21 13 USB DM NC 20 60 mil 1870 mil 570 mil 14 GND GND 19 15 GND GND 18 16 GND GND 17 55 mil 315 mil No Ground Area 395 mil 520 mil KC11 Class 1 Bluetooth OEM Module Footprint Layout Guidelines The area around the KC11 module should be free of any ground planes, trace routings, or metal for at least 250 mil from the antenna in all directions. Traces should not be routed underneath the module. ©2004 KC Wirefree LLC www.kcwirefree.com 06Dec2004
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