LG Electronics USA 9QK-DMWB1NP6 Bluetooth Adapter Card User Manual

LG Electronics USA Bluetooth Adapter Card

User Manual

Bluetooth 4.1 Smart Device Module (WB1NP6) Confidential Product Approval Datasheet 1/29 Copyright  2015 MCS LOGIC Limited. All rights reserved V1.0 2015.06.11 Date 2015.06.11 Revision 1.0 Page 30 PRODUCT APPROVAL DATASHEET PRODUCT MCSLogic Bluetooth 4.1 Smart Device Module MODEL NAME WB1NP6 MCSLogic P/N MB8670C0 LG P/N EAT63117501 CUSTOMER LG Electronics Checked By Approved By Company Seal MCSLOGIC
Bluetooth 4.1 Smart Device Module (WB1NP6) Confidential Product Approval Datasheet 2/29 Copyright  2015 MCS LOGIC Limited. All rights reserved V1.0 2015.06.11 Revision History Version Date (YY/MM/DD) Revision Description 0.9 1.0 15/04/30 15/06/11 temporary release Initial release
Bluetooth 4.1 Smart Device Module (WB1NP6) Confidential Product Approval Datasheet 3/29 Copyright  2015 MCS LOGIC Limited. All rights reserved V1.0 2015.06.11 Table of Contents 1. GENERAL DESCRIPTION .......................................................................................................................................... 4 2. QUALITY ........................................................................................................................................................................ 4 3. TEST ................................................................................................................................................................................ 4 4. BLOCK DIAGRAM ....................................................................................................................................................... 5 5. PIN DESCRIPTIONS ..................................................................................................................................................... 6 6. MODULE SCHEMATIC ............................................................................................................................................... 9 7. ELECTRICAL CHARACTERISTICS ....................................................................................................................... 10 8. MODULE’S MARKING INFORMATION ............................................................................................................... 13 9. MECHANICAL DIMENSION .................................................................................................................................... 14 10. PCB SMT GUIDE ......................................................................................................................................................... 17 11. BILL OF MATERIALS ............................................................................................................................................... 19 12. PLANAR FIGURE OF PARTS ................................................................................................................................... 20 13. PACKING INFORMATION ....................................................................................................................................... 21 13.1 TRAY ............................................................................................................................................................................. 21 13.2 INNER BOX .................................................................................................................................................................. 22 13.3 OUTTER BOX .............................................................................................................................................................. 23 13.4 PACKING PROCESS .................................................................................................................................................. 24 14. REFLOW PROFILE .................................................................................................................................................... 25 15. MODULE POSITION GUIDE .................................................................................................................................... 26 16. PCB ANTENNA REPORT .......................................................................................................................................... 27
Bluetooth 4.1 Smart Device Module (WB1NP6) Confidential Product Approval Datasheet 4/29 Copyright  2015 MCS LOGIC Limited. All rights reserved V1.0 2015.06.11 1. General Description WB1NP6 is a fully integrated Bluetooth module. It is based on CSR’s Bluecore 8670 chip with specific interface design to meet LG Electronics’s needs. WB1NP6 is compatible with Bluetooth specification version 4.1. It integrates RF, Baseband controller, etc., a completed Bluetooth subsystem. Features : - Operation Range (Class I) - Fully Compatible with Bluetooth Specification 4.1 - Dual-mode Bluetooth / Bluetooth low energy - Operating Temperature Range : -20℃ ~ 70℃ - Operating VDD Range : 3.0 V ~ 3.6V - Interface : UART/USB - Internal Antenna - RoHS Compliant Applications : - Consumer Products 2. Quality Qaulity should meet each condition which mentioned on this specification. However, the items which are not mentioned on this specification follow the inspection agreements and standards which are agree with both companies. 3. Test Electrical characteristics are tested for every products. However, if there are any objection in judgement, it should be treated with agreements of companies.
Bluetooth 4.1 Smart Device Module (WB1NP6) Confidential Product Approval Datasheet 7/29 Copyright  2015 MCS LOGIC Limited. All rights reserved V1.0 2015.06.11 No Pin Name I/O Description 1 GND I CON CONNECTION FOR AUDIO 2 MIC_LP I MIC INPUT POSITIVIE LEFT 3 MIC_LN I MIC INPUT NEGATIVE LEFT 4 MIC_BIAS_A O MIC BIAS A 5 MIC_BIAS_B O MIC BIAS B 6 MIC_RN I MIC INPUT NEGATIVE RIGHT 7 MIC_RP I MIC INPUT POSITIVIE RIGHT 8 GND I GND CONNECTION FOR INTERNAL DIGITAL CIRCUITTRY AND PADS 9 PCM_IN I/O SYNCHRONOUS DATA INPUT, Alternative function PIO[17] 10 PCM_CLK I/O SYNCHRONOUS DATA CLOCK, Alternative function PIO[20] 11 PCM_OUT I/O SYNCHRONOUS DATA OUTPUT, Alternative function PIO[18] 12 PCM_SYNC I/O SYNCHRONOUS DATA SYNC, Alternative function PIO[19] 13 SPI_CLK I SPI CLOCK 14 SPI_MOSI I SPI DATA INPUT 15 SPI_MISO O SPI DATA OUTPUT 16 SPI_CS# I CHIP SELECT FOR SPI, ACTIVE LOW 17 AIO[0] I AIO 18 AIO[1] I AIO 19 VDD_USB I POSITIVE SUPPLY FOR USB PORT 20 USB_N I/O USB DATA MINUS 21 USB_P I/O USB DATA PLUS 22 VDD_PADS_1 I 1.7~3.6V SUPPLY INPUT FOR IO PORTS (RST#, UART, PCM, SPI, PIO[3:0] 23 RST# I RESET IF LOW (>5ms) 24 LED[0] O LED DRIVER 25 LED[2] O LED DRIVER 26 LED[1] O LED DRIVER 27 GND I GND CONNECTION FOR INTERNAL DIGITAL CIRCUITTRY AND PADS 28 UART_RTS I/O UART REQUEST TO SEND, ACTIVE LOW, Alternative function PIO[16] 29 UART_RX I UART DATA IN 30 UART_CTS I/O UART CLEAR TO SEND, ACTIVE LOW 31 UART_TX O UART DATA OUT 32 PIO[0] I/O GPIO 33 PIO[1] I/O GPIO 34 PIO[2] I/O GPIO 35 PIO[15] I/O GPIO 36 PIO[7] I/O GPIO 37 PIO[6] I/O GPIO 38 VDD_PADS_2 I 1.7~3.6V SUPPLY INPUT FOR PIO[15:4] 39 PIO[3] I/O GPIO
Bluetooth 4.1 Smart Device Module (WB1NP6) Confidential Product Approval Datasheet 8/29 Copyright  2015 MCS LOGIC Limited. All rights reserved V1.0 2015.06.11 40 PIO[14] I/O GPIO 41 PIO[5] I/O GPIO 42 PIO[10] I/O GPIO 43 PIO[4] I/O GPIO 44 GND I GND CONNECTION FOR INTERNAL DIGITAL CIRCUITTRY AND PADS 45 PIO[11] I/O GPIO 46 PIO[12] I/O GPIO 47 PIO[13] I/O GPIO 48 QSPI_FLASH_IO3 I/O SERIAL QUAD IO FLASH DATA BIT 3, Alternative function PIO[28] 49 QSPI_FLASH_CS# I/O SPI FLASH CHIP SELECT, , Alternative function PIO[23] 50 QSPI_FLASH_CLK I/O SPI FLASH CLOCK, Alternative function PIO[21] 51 QSPI_FLASH_IO0 I/O SERIAL QUAD IO FLASH DATA BIT 0, Alternative function PIO[25] 52 QSPI_SPAM_CLK I/O SPI RAM CLOCK, Alternative function PIO[22] 53 QSPI_FLASH_IO1 I/O SERIAL QUAD IO FLASH DATA BIT 1, Alternative function PIO[26] 54 QSPI_FLASH_IO2 I/O SERIAL QUAD IO FLASH DATA BIT 2, Alternative function PIO[27] 55 QSPI_SRAM_CS# I/O SPI RAM CHIP SELECT, Alternative function PIO[24] 56 1V8_SMPS O 1.8V REGULATOR OUTPUT 57 VBAT_SENSE I BATTERY CHARGER SENSE INPUT 58 VBATT I BATTERY POSITIVE TERMINAL 59 VBUS I BATTERY CHARGER INPUT 60 3V3_OUT O ALTERMATIVE SUPPLY VIA BYPASS REGULATOR FOR 1.8V AND 1.35V REGULATOR INPUTS. MUSET BE THE SAME POTENTIAL AS VBAT. 61 CHG_EXT I EXTERNAL BATTERY CHARGER CONTROL 62 GND I GND CONNECTION FOR AUDIO DRIVER 63 SPKR_LP O SPEAKER OUTPUT POSITIVE LEFT 64 SPKR_LN O SPEAKER OUTPUT NEGATIVE LEFT 65 SPKR_RP O SPEAKER OUTPUT POSITIVE RIGHT 66 SPKR_RN O SPEAKER OUTPUT NEGATIVE RIGHT 67 GND I 1.35V REGULATOR GND 68 VRGEG_EN I REGULATOR ENABLE INPUT 69 VDD_PADS_3 I 1.7V~3.6V SUPPLY INPUT FOR RERIAL QUAD IO FLASH PORT 70 GND I 1.8V REGULATOR GND
Bluetooth 4.1 Smart Device Module (WB1NP6) Confidential Product Approval Datasheet 10/29 Copyright  2015 MCS LOGIC Limited. All rights reserved V1.0 2015.06.11 7. Electrical Characteristics Conditions : VDD = 3.3V, Ta = 25 ℃, unless otherwise noted. Absolute Maximum Ratings Parameter Min Max Unit Power Supply Voltage : VDD -0.4V 3.6V DCV Storage Temperature -40 85 ℃ Recommended Operating Conditions Parameter Min Max Unit Power Supply Voltage 3.0V 3.6V DCV Operation Temperature -20 70 ℃ Current consumption Parameter Connection Type Avg Peak Unit Page scan, Time interval = 1.28s - <1 1 mA Inquiry and Page scan, Time interval = 1.28s - <1 1 mA ACL No data transfer Master 7 8 mA ACL data transfer Master 20 22 mA Input/Output Characteristics Parameter Min Max Unit VIL Input Voltage Low -0.4 0.8 V VIH Input Voltage High 0.7*VDD VDD+0.4 V VOL Output Voltage Low - 0.2 V VOH Output Voltage High VDD-0.2 - V
Bluetooth 4.1 Smart Device Module (WB1NP6) Confidential Product Approval Datasheet 11/29 Copyright  2015 MCS LOGIC Limited. All rights reserved V1.0 2015.06.11 General Performance Parameter Condition Min Typ Max Unit Frequency Range Normal 2402 - 2480 MHz Transmitter Performance Parameter Condition Min Avg Max Unit Transmit Power Normal 2 - 8 dBm Parameter Condition Min Typ Max Unit Power density Normal - - 8 dBm 20dB bandwidth Normal 1000 KHz Adjacent channel power (F0 = 2441MHz) F=F0 ±2MHz - - -20 dBm F=F0 ±3MHz - - -40 dBm F=F0 ±4MHz - - -40 dBm Out-band Spurious Emission 30MHz ~ 1GHz - - -36 dBm 1GHz ~ 12.75GHz - - -30 dBm 1.8GHz ~ 1.9GHz - - -47 dBm 5.1GHz ~ 5.3GHz - - -47 dBm Modulation Characteristic ∆F1avg 140 - 175 KHz ∆F2max 115 - - KHz ∆F2avg / ∆F1avg 80 - - % Initial Carrier Frequency Tolerance DH1 packet -75 - 75 KHz Carrier Frequency Drift DH5 packet -25 25 KHz Receiver Performance Parameter Condition Min Type Max Unit Sensitivity at 0.1% BER Single slot (DH1 packet) -70 - - dBm Sensitivity at 0.1% BER Multi slot (DH5 packet) -70 - - dBm Maximum received signal at 0.1% BER -20 - - dBm Maximum level of intermodulation interferers f1-f2 = 5 MHz, Pwanted= -64 dBm -39 - - dBm
Bluetooth 4.1 Smart Device Module (WB1NP6) Confidential Product Approval Datasheet 14/29 Copyright  2015 MCS LOGIC Limited. All rights reserved V1.0 2015.06.11 9. Mechanical Dimension TOP VIEW Mark Dimension Mark Dimension Mark Dimension Mark Dimension A 33.0±0.3 D 19.0±0.3 G 1.5±0.2 J 0.4±0.1 B 20.0±0.6 E 7.2±0.2 H 0.6±0.2 K 3±0.3 C 24.0±0.3 F 1.0±0.3 I 0.5±0.1 (Unit : mm)
Bluetooth 4.1 Smart Device Module (WB1NP6) Confidential Product Approval Datasheet 17/29 Copyright  2015 MCS LOGIC Limited. All rights reserved V1.0 2015.06.11 10. PCB SMT Guide LAYOUT DIMENSION(TOP VIEW) Mark Dimension Mark Dimension Mark Dimension Mark Dimension Mark Dimension A 33.0 D 25.15 G 7.0 J 0.72 M 0.28 B 20.0 E 21.6 H 1.6 K 1.0 N 0.14 C 18.4 F 7.15 I 0.8 L 0.29 (Unit : mm)
Bluetooth 4.1 Smart Device Module (WB1NP6) Confidential Product Approval Datasheet 18/29 Copyright  2015 MCS LOGIC Limited. All rights reserved V1.0 2015.06.11 SMT Module Position [TOP VIEW] [BOTTOM VIEW]
Bluetooth 4.1 Smart Device Module (WB1NP6) Confidential Product Approval Datasheet 21/29 Copyright  2015 MCS LOGIC Limited. All rights reserved V1.0 2015.06.11 13. Packing Information 13.1 Tray  Each tray has 40 units of products.
Bluetooth 4.1 Smart Device Module (WB1NP6) Confidential Product Approval Datasheet 23/29 Copyright  2015 MCS LOGIC Limited. All rights reserved V1.0 2015.06.11 13.3 Outter Box (Unit : mm) No. Label Description ① Company ② Company Address ③ Customer ④ Model No & Part No. ⑤ Quantity ⑥ Gross Weight(Kg) ⑦ Carton No. ⑧ Rohs
Bluetooth 4.1 Smart Device Module (WB1NP6) Confidential Product Approval Datasheet 24/29 Copyright  2015 MCS LOGIC Limited. All rights reserved V1.0 2015.06.11 13.4 Packing process
Bluetooth 4.1 Smart Device Module (WB1NP6) Confidential Product Approval Datasheet 25/29 Copyright  2015 MCS LOGIC Limited. All rights reserved V1.0 2015.06.11 14. Reflow Profile Reflow Conditions : Pb-Free Allowable reflow soldering times : 2times based on the below profile
Bluetooth 4.1 Smart Device Module (WB1NP6) Confidential Product Approval Datasheet 26/29 Copyright  2015 MCS LOGIC Limited. All rights reserved V1.0 2015.06.11 15. Module Position Guide Ground & Shield CAN must not exist around Antenna area.
Approval Statements CE approval Hereby, we declare that this device is in compliance with the essential requirements and other relevant provisions of directive 1999/5/EC. Restrictions of use: In France, this device must not be used outdoors. FCC approval This device complies with Part 15 of the FCC`s Rules. Operation is subject to the following two Conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesirable operation. To satisfy FCC exterior labeling requirements, the following text must be placed on the exterior of the end product. Contains Transmitter module FCC ID: BEJ9QK-DMWB1NP6 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna.　 Increase the separation between the equipment and receiver.　 Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.　 Consult the 　dealer or an experienced radio/ TV technician for help. IC approval This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil est conforme avec Industrie Canada exempts de licence standard RSS (s). L'opération est soumise aux deux conditions suivantes: (1) cet appareil ne peut causer d'interférences, et (2) cet appareil doit accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de l'appareil. The host device must be labeled to display the Industry Canada certification number of the module. Contains transmitter module IC: 2703H-DMWB1NP6 Le dispositif d'accueil doivent être étiquetés pour afficher le numéro de certification d'Industrie Canada du module. Contient module émetteur IC : 2703H-DMWB1NP6
User information Caution: Any changed or modifications not expressly approved by the party responsible for compliance could void the user`s authority to operate this equipment. Attention: Toute changé ou modifications non expressément approuvés par la partie responsable de la conformité pourraient annuler l'utilisateur `autorité de faire fonctionner cet équipement. IMPORTANT NOTE This device complies with FCC & IC radiation exposure limits set forth for an uncontrolled environment. This device should be installed andoperated with minimum distance 20cm between the radiating element of this device and the user.This device must not be co-located or operating in conjunction with any other antenna or transmitter. This device is intended only for OEM integrators under the following conditions: 1) This module may not be co-located with any other transmitters or antennas. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements with this module installed. In the event that these conditions cannot be met, then the FCC & IC authorizations are no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product including this module and obtaining separate FCC & IC authorizations. NOTE IMPORTANTE Cet appareil est conforme aux limites de la FCC et IC exposition aux radiations dans un environnement non contrôlé. Cet appareil doit êtreinstallé et utilisé à distance minimum de 20cm entre l'élément rayonnant de cet appareil et l'utilisateur.Cet appareil doit être installé et ne doit pas être co-localisées ou opérant en conjonction avec une autre antenne ou un autre émetteur.Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes : 1) Ce module ne peut pas être co-localisés avec les autres émetteurs ou les antennes. Aussi longtemps que deux conditions précitées sont remplies, le test du transmetteur supplémentaires ne seront pas tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leurs produits finis pour toutes les exigences de conformité supplémentaires avec ce module installé. Dans le cas où ces conditions ne peuvent pas être remplies, alors la FCC et IC autorisations ne sont plus considérés comme valides et l'ID de la FCC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera responsable de réévaluer le produit final, y compris l'obtention de ce module et séparée de la FCC et IC autorisations Label and manual requirements for the End Product For an end product using the WB1NP6 there must be a label containing, at least, the following information: For FCC ID This device contains FCC ID : BEJ9QK-DMWB1NP6 For IC Certification No This device contains IC ID : 2703H-DMWB1NP6

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