LG Electronics USA 9QK-DMWB1NP6 Bluetooth Adapter Card User Manual
LG Electronics USA Bluetooth Adapter Card
User Manual
Bluetooth 4.1 Smart Device Module (WB1NP6)
Confidential Product Approval Datasheet 1/29
Copyright 2015 MCS LOGIC Limited. All rights reserved
V1.0 2015.06.11
Date 2015.06.11
Revision 1.0
Page 30
PRODUCT APPROVAL DATASHEET
PRODUCT MCSLogic Bluetooth 4.1 Smart Device Module
MODEL NAME WB1NP6
MCSLogic P/N MB8670C0
LG P/N EAT63117501
CUSTOMER LG Electronics
Checked By Approved By Company Seal
MCSLOGIC
Bluetooth 4.1 Smart Device Module (WB1NP6)
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Copyright 2015 MCS LOGIC Limited. All rights reserved
V1.0 2015.06.11
Revision History
Version Date
(YY/MM/DD)
Revision Description
0.9
1.0
15/04/30
15/06/11
temporary release
Initial release
Bluetooth 4.1 Smart Device Module (WB1NP6)
Confidential Product Approval Datasheet 3/29
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Table of Contents
1. GENERAL DESCRIPTION .......................................................................................................................................... 4
2. QUALITY ........................................................................................................................................................................ 4
3. TEST ................................................................................................................................................................................ 4
4. BLOCK DIAGRAM ....................................................................................................................................................... 5
5. PIN DESCRIPTIONS ..................................................................................................................................................... 6
6. MODULE SCHEMATIC ............................................................................................................................................... 9
7. ELECTRICAL CHARACTERISTICS ....................................................................................................................... 10
8. MODULE’S MARKING INFORMATION ............................................................................................................... 13
9. MECHANICAL DIMENSION .................................................................................................................................... 14
10. PCB SMT GUIDE ......................................................................................................................................................... 17
11. BILL OF MATERIALS ............................................................................................................................................... 19
12. PLANAR FIGURE OF PARTS ................................................................................................................................... 20
13. PACKING INFORMATION ....................................................................................................................................... 21
13.1 TRAY ............................................................................................................................................................................. 21
13.2 INNER BOX .................................................................................................................................................................. 22
13.3 OUTTER BOX .............................................................................................................................................................. 23
13.4 PACKING PROCESS .................................................................................................................................................. 24
14. REFLOW PROFILE .................................................................................................................................................... 25
15. MODULE POSITION GUIDE .................................................................................................................................... 26
16. PCB ANTENNA REPORT .......................................................................................................................................... 27
Bluetooth 4.1 Smart Device Module (WB1NP6)
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1. General Description
WB1NP6 is a fully integrated Bluetooth module. It is based on CSR’s Bluecore 8670 chip with
specific interface design to meet LG Electronics’s needs.
WB1NP6 is compatible with Bluetooth specification version 4.1. It integrates RF, Baseband
controller, etc., a completed Bluetooth subsystem.
Features :
- Operation Range (Class I)
- Fully Compatible with Bluetooth Specification 4.1
- Dual-mode Bluetooth / Bluetooth low energy
- Operating Temperature Range : -20℃ ~ 70℃
- Operating VDD Range : 3.0 V ~ 3.6V
- Interface : UART/USB
- Internal Antenna
- RoHS Compliant
Applications :
- Consumer Products
2. Quality
Qaulity should meet each condition which mentioned on this specification. However, the items
which are not mentioned on this specification follow the inspection agreements and standards
which are agree with both companies.
3. Test
Electrical characteristics are tested for every products. However, if there are any objection in
judgement, it should be treated with agreements of companies.
Bluetooth 4.1 Smart Device Module (WB1NP6)
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No
Pin Name
I/O
Description
1 GND I CON CONNECTION FOR AUDIO
2 MIC_LP I MIC INPUT POSITIVIE LEFT
3 MIC_LN I MIC INPUT NEGATIVE LEFT
4 MIC_BIAS_A O MIC BIAS A
5 MIC_BIAS_B O MIC BIAS B
6 MIC_RN I MIC INPUT NEGATIVE RIGHT
7 MIC_RP I MIC INPUT POSITIVIE RIGHT
8 GND I GND CONNECTION FOR INTERNAL DIGITAL CIRCUITTRY AND PADS
9 PCM_IN I/O SYNCHRONOUS DATA INPUT, Alternative function PIO[17]
10 PCM_CLK I/O SYNCHRONOUS DATA CLOCK, Alternative function PIO[20]
11 PCM_OUT I/O SYNCHRONOUS DATA OUTPUT, Alternative function PIO[18]
12 PCM_SYNC I/O SYNCHRONOUS DATA SYNC, Alternative function PIO[19]
13 SPI_CLK I SPI CLOCK
14 SPI_MOSI I SPI DATA INPUT
15 SPI_MISO O SPI DATA OUTPUT
16 SPI_CS# I CHIP SELECT FOR SPI, ACTIVE LOW
17 AIO[0] I AIO
18 AIO[1] I AIO
19 VDD_USB I POSITIVE SUPPLY FOR USB PORT
20 USB_N I/O USB DATA MINUS
21 USB_P I/O USB DATA PLUS
22 VDD_PADS_1 I 1.7~3.6V SUPPLY INPUT FOR IO PORTS
(RST#, UART, PCM, SPI, PIO[3:0]
23 RST# I RESET IF LOW (>5ms)
24 LED[0] O LED DRIVER
25 LED[2] O LED DRIVER
26 LED[1] O LED DRIVER
27 GND I GND CONNECTION FOR INTERNAL DIGITAL CIRCUITTRY AND PADS
28 UART_RTS I/O UART REQUEST TO SEND, ACTIVE LOW, Alternative function PIO[16]
29 UART_RX I UART DATA IN
30 UART_CTS I/O UART CLEAR TO SEND, ACTIVE LOW
31 UART_TX O UART DATA OUT
32 PIO[0] I/O GPIO
33 PIO[1] I/O GPIO
34 PIO[2] I/O GPIO
35 PIO[15] I/O GPIO
36 PIO[7] I/O GPIO
37 PIO[6] I/O GPIO
38 VDD_PADS_2 I 1.7~3.6V SUPPLY INPUT FOR PIO[15:4]
39 PIO[3] I/O GPIO
Bluetooth 4.1 Smart Device Module (WB1NP6)
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40 PIO[14] I/O GPIO
41 PIO[5] I/O GPIO
42 PIO[10] I/O GPIO
43 PIO[4] I/O GPIO
44 GND I GND CONNECTION FOR INTERNAL DIGITAL CIRCUITTRY AND PADS
45 PIO[11] I/O GPIO
46 PIO[12] I/O GPIO
47 PIO[13] I/O GPIO
48 QSPI_FLASH_IO3 I/O SERIAL QUAD IO FLASH DATA BIT 3, Alternative function PIO[28]
49 QSPI_FLASH_CS# I/O SPI FLASH CHIP SELECT, , Alternative function PIO[23]
50 QSPI_FLASH_CLK I/O SPI FLASH CLOCK, Alternative function PIO[21]
51 QSPI_FLASH_IO0 I/O SERIAL QUAD IO FLASH DATA BIT 0, Alternative function PIO[25]
52 QSPI_SPAM_CLK I/O SPI RAM CLOCK, Alternative function PIO[22]
53 QSPI_FLASH_IO1 I/O SERIAL QUAD IO FLASH DATA BIT 1, Alternative function PIO[26]
54 QSPI_FLASH_IO2 I/O SERIAL QUAD IO FLASH DATA BIT 2, Alternative function PIO[27]
55 QSPI_SRAM_CS# I/O SPI RAM CHIP SELECT, Alternative function PIO[24]
56 1V8_SMPS O 1.8V REGULATOR OUTPUT
57 VBAT_SENSE I BATTERY CHARGER SENSE INPUT
58 VBATT I BATTERY POSITIVE TERMINAL
59 VBUS I BATTERY CHARGER INPUT
60 3V3_OUT O ALTERMATIVE SUPPLY VIA BYPASS REGULATOR FOR 1.8V AND 1.35V
REGULATOR INPUTS. MUSET BE THE SAME POTENTIAL AS VBAT.
61 CHG_EXT I EXTERNAL BATTERY CHARGER CONTROL
62 GND I GND CONNECTION FOR AUDIO DRIVER
63 SPKR_LP O SPEAKER OUTPUT POSITIVE LEFT
64 SPKR_LN O SPEAKER OUTPUT NEGATIVE LEFT
65 SPKR_RP O SPEAKER OUTPUT POSITIVE RIGHT
66 SPKR_RN O SPEAKER OUTPUT NEGATIVE RIGHT
67 GND I 1.35V REGULATOR GND
68 VRGEG_EN I REGULATOR ENABLE INPUT
69 VDD_PADS_3 I 1.7V~3.6V SUPPLY INPUT FOR RERIAL QUAD IO FLASH PORT
70 GND I 1.8V REGULATOR GND
Bluetooth 4.1 Smart Device Module (WB1NP6)
Confidential Product Approval Datasheet 10/29
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7. Electrical Characteristics
Conditions : VDD = 3.3V, Ta = 25 ℃, unless otherwise noted.
Absolute Maximum Ratings
Parameter Min Max Unit
Power Supply Voltage : VDD -0.4V 3.6V DCV
Storage Temperature -40 85 ℃
Recommended Operating Conditions
Parameter Min Max Unit
Power Supply Voltage 3.0V 3.6V DCV
Operation Temperature -20 70 ℃
Current consumption
Parameter Connection Type Avg Peak Unit
Page scan, Time interval = 1.28s - <1 1 mA
Inquiry and Page scan, Time interval = 1.28s - <1 1 mA
ACL No data transfer Master 7 8 mA
ACL data transfer Master 20 22 mA
Input/Output Characteristics
Parameter Min Max Unit
VIL Input Voltage Low -0.4 0.8 V
VIH Input Voltage High 0.7*VDD VDD+0.4 V
VOL Output Voltage Low - 0.2 V
VOH Output Voltage High VDD-0.2 - V
Bluetooth 4.1 Smart Device Module (WB1NP6)
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General Performance
Parameter Condition Min Typ Max Unit
Frequency Range Normal 2402 - 2480 MHz
Transmitter Performance
Parameter Condition Min Avg Max Unit
Transmit Power Normal 2 - 8 dBm
Parameter Condition Min Typ Max Unit
Power density Normal - - 8 dBm
20dB bandwidth Normal 1000 KHz
Adjacent channel power
(F0 = 2441MHz)
F=F0 ±2MHz - - -20 dBm
F=F0 ±3MHz - - -40 dBm
F=F0 ±4MHz - - -40 dBm
Out-band Spurious Emission
30MHz ~ 1GHz - - -36 dBm
1GHz ~ 12.75GHz - - -30 dBm
1.8GHz ~ 1.9GHz - - -47 dBm
5.1GHz ~ 5.3GHz - - -47 dBm
Modulation Characteristic
∆F1avg 140 - 175 KHz
∆F2max 115 - - KHz
∆F2avg / ∆F1avg 80 - - %
Initial Carrier Frequency
Tolerance DH1 packet -75 - 75 KHz
Carrier Frequency Drift DH5 packet -25 25 KHz
Receiver Performance
Parameter Condition Min Type Max Unit
Sensitivity at 0.1% BER Single slot (DH1 packet) -70 - - dBm
Sensitivity at 0.1% BER Multi slot (DH5 packet) -70 - - dBm
Maximum received signal at 0.1% BER -20 - - dBm
Maximum level of intermodulation
interferers
f1-f2 = 5 MHz,
Pwanted= -64 dBm -39 - - dBm
Bluetooth 4.1 Smart Device Module (WB1NP6)
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9. Mechanical Dimension
TOP VIEW
Mark
Dimension
Mark
Dimension
Mark
Dimension
Mark
Dimension
A
33.0±0.3
D
19.0±0.3
G
1.5±0.2
J
0.4±0.1
B
20.0±0.6
E
7.2±0.2
H
0.6±0.2
K
3±0.3
C
24.0±0.3
F
1.0±0.3
I
0.5±0.1
(Unit : mm)
Bluetooth 4.1 Smart Device Module (WB1NP6)
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10. PCB SMT Guide
LAYOUT DIMENSION(TOP VIEW)
Mark
Dimension
Mark
Dimension
Mark
Dimension
Mark
Dimension
Mark
Dimension
A
33.0
D
25.15
G
7.0
J
0.72
M
0.28
B
20.0
E
21.6
H
1.6
K
1.0
N
0.14
C
18.4
F
7.15
I
0.8
L
0.29
(Unit : mm)
Bluetooth 4.1 Smart Device Module (WB1NP6)
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SMT Module Position
[TOP VIEW] [BOTTOM VIEW]
Bluetooth 4.1 Smart Device Module (WB1NP6)
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13. Packing Information
13.1 Tray
Each tray has 40 units of products.
Bluetooth 4.1 Smart Device Module (WB1NP6)
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13.3 Outter Box
(Unit : mm)
No. Label Description
① Company
② Company Address
③ Customer
④ Model No & Part No.
⑤ Quantity
⑥ Gross Weight(Kg)
⑦ Carton No.
⑧ Rohs
Bluetooth 4.1 Smart Device Module (WB1NP6)
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13.4 Packing process
Bluetooth 4.1 Smart Device Module (WB1NP6)
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14. Reflow Profile
Reflow Conditions : Pb-Free
Allowable reflow soldering times : 2times based on the below profile
Bluetooth 4.1 Smart Device Module (WB1NP6)
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15. Module Position Guide
Ground & Shield CAN must not exist around Antenna area.
Approval Statements
CE approval
Hereby, we declare that this device is in compliance with the essential requirements and other relevant provisions of directive 1999/5/EC.
Restrictions of use: In France, this device must not be used outdoors.
FCC approval
This device complies with Part 15 of the FCC`s Rules. Operation is subject to the following two Conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesirable operation.
To satisfy FCC exterior labeling requirements, the following text must be placed on the exterior of the end product.
Contains Transmitter module FCC ID: BEJ9QK-DMWB1NP6
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/ TV technician for help.
IC approval
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Cet appareil est conforme avec Industrie Canada exempts de licence standard RSS (s). L'opération est soumise aux deux conditions
suivantes: (1) cet appareil ne peut causer d'interférences, et (2) cet appareil doit accepter toute interférence, y compris les interférences qui
peuvent causer un mauvais fonctionnement de l'appareil.
The host device must be labeled to display the Industry Canada certification number of the module.
Contains transmitter module IC: 2703H-DMWB1NP6
Le dispositif d'accueil doivent être étiquetés pour afficher le numéro de certification d'Industrie Canada du module.
Contient module émetteur IC : 2703H-DMWB1NP6
User information
Caution: Any changed or modifications not expressly approved by the party responsible for compliance could void the user`s
authority to operate this equipment.
Attention: Toute changé ou modifications non expressément approuvés par la partie responsable de la conformité pourraient
annuler l'utilisateur `autorité de faire fonctionner cet équipement.
IMPORTANT NOTE
This device complies with FCC & IC radiation exposure limits set forth for an uncontrolled environment. This device should be installed and
operated with minimum distance 20cm between the radiating element of this device and the user.
This device must not be co-located or operating in conjunction with any other antenna or transmitter.
This device is intended only for OEM integrators under the following conditions:
1) This module may not be co-located with any other transmitters or antennas.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for
testing their end-product for any additional compliance requirements with this module installed.
In the event that these conditions cannot be met, then the FCC & IC authorizations are no longer considered valid and the FCC ID cannot
be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product including this
module and obtaining separate FCC & IC authorizations.
NOTE IMPORTANTE
Cet appareil est conforme aux limites de la FCC et IC exposition aux radiations dans un environnement non contrôlé. Cet appareil doit être
installé et utilisé à distance minimum de 20cm entre l'élément rayonnant de cet appareil et l'utilisateur.
Cet appareil doit être installé et ne doit pas être co-localisées ou opérant en conjonction avec une autre antenne ou un autre émetteur.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes :
1) Ce module ne peut pas être co-localisés avec les autres émetteurs ou les antennes.
Aussi longtemps que deux conditions précitées sont remplies, le test du transmetteur supplémentaires ne seront pas tenus. Toutefois,
l'intégrateur OEM est toujours responsable de tester leurs produits finis pour toutes les exigences de conformité supplémentaires avec ce
module installé.
Dans le cas où ces conditions ne peuvent pas être remplies, alors la FCC et IC autorisations ne sont plus considérés comme valides et l'ID
de la FCC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera responsable de réévaluer le produit
final, y compris l'obtention de ce module et séparée de la FCC et IC autorisations
Label and manual requirements for the End Product
For an end product using the WB1NP6 there must be a label containing, at least, the following information:
For FCC ID
This device contains
FCC ID : BEJ9QK-DMWB1NP6
For IC Certification No
This device contains
IC ID : 2703H-DMWB1NP6