Laird Connectivity BT1 TiWi-uB2 Bluetooth Module User Manual manual

LS Research, LLC TiWi-uB2 Bluetooth Module manual

manual

TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 1 of 25 TiWi-uB2 / uBleu2 Bluetooth Module  FEATURES  Built  in  CC2564  single-chip  Bluetooth fully supports BT 2.1 + EDR, BLE 4.0.  RF Output Power: +10 dBm (Class 1.5)  RF Receive Sensitivity: -94 dBm  Miniature Size: 7 mm x 7 mm x 1.5 mm  Operating Voltage: 2.2V to 4.8V  Operating temperature: -30 to +85o C  Worldwide  acceptance:  FCC  (USA),  IC (Canada), and CE (Europe)  RoHS compliant  Supports maximum Bluetooth data rates over HCI UART interface.   Supports multiple Bluetooth profiles with enhanced QoS, both mono and stereo, assisted A2DP  APPLICATIONS  Medical  (ex  Heart  Rate  Monitor,  Blood Pressure Sensor, Blood Glucose Meter)  Thermometer  Flood Alarm  Heating Control  Automatic Key Control  Industrial Sensors  Toys  Entertainment Devices  Mobile Accessories  All Bluetooth Wireless Applications   DESCRIPTION LSR would like to announce a low-cost and low-power consumption module which has all of the Bluetooth  functionalities.  The  highly  integrated TiWi-uB2  module  makes  the  use  of  Bluetooth headsets and other applications possible.  The  TiWi-uB2  module  fully  supports  the  dual mode  Bluetooth  and  BLE  operation,  and  the output  power  can  support  class  1.5.  The  SIP module  provides  UART  interface  /  audio  PCM interface for Bluetooth.  The  SIP  module  is  specifically  developed  for Smart phones and Portable devices. Need to get to market quickly?  Not an expert in Bluetooth?  Need a custom antenna?  Do you need help with your host board?  LS Research Design Services will be happy to develop custom hardware or software, or help integrate the design.  Contact us at sales@lsr.com or call us at 262-375-4400.  ORDERING INFORMATION Order Number Description 450-0104 TiWi-uB2 Module (Tray) 450-0104R TiWi-uB2 Module (Tape & Reel) 450-0105 TiWi-uB2 EM Board Table 1 Orderable Model Numbers
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 2 of 25 MODULE ACCESSORIES  Order Number Description  001-0001 2.4 GHz Dipole Antenna with Reverse Polarity SMA Connector  080-0001 U.FL to Reverse Polarity SMA Bulkhead Cable 105mm Table 2 Module Accessories
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 3 of 25 TABLE OF CONTENTS FEATURES .......................................................................................................................... 1 APPLICATIONS ................................................................................................................... 1 DESCRIPTION ..................................................................................................................... 1 ORDERING INFORMATION ................................................................................................ 1 MODULE ACCESSORIES ................................................................................................... 2 FOOTPRINT AND PIN DEFINITIONS.................................................................................. 5 PIN DESCRIPTIONS ............................................................................................................ 6 ELECTRICAL SPECIFICATIONS ........................................................................................ 7 Absolute Maximum Ratings ....................................................................................................................... 7 Recommended Operating Conditions ...................................................................................................... 7 General Characteristics .............................................................................................................................. 8 Bluetooth RF Characteristics .................................................................................................................. 10 BLUETOOTH POWER-UP/ DOWN SEQUENCE .............................................................. 11 nSHUTD Requirements ............................................................................................................................. 11 SLOW CLOCK (32 KHZ) SOURCE REQUIREMENTS ..................................................... 12 BLUETOOTH HCI UART ................................................................................................... 13 BLUETOOTH AUDIO CODEC/PCM .................................................................................. 14 SOLDERING RECOMMENDATIONS ................................................................................ 15 Recommended Reflow Profile for Lead Free Solder ............................................................................. 15 CLEANING ......................................................................................................................... 16 OPTICAL INSPECTION ..................................................................................................... 16 REWORK ........................................................................................................................... 16 SHIPPING, HANDLING, AND STORAGE ......................................................................... 16 Shipping ..................................................................................................................................................... 16 Handling ..................................................................................................................................................... 16 Moisture Sensitivity Level (MSL) ............................................................................................................. 16 Storage ....................................................................................................................................................... 16
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 4 of 25 Repeating Reflow Soldering .................................................................................................................... 17 AGENCY CERTIFICATIONS ............................................................................................. 18 AGENCY STATEMENTS ................................................................................................... 18 Federal Communication Commission Interference Statement ............................................................ 18 Industry Canada Statements.................................................................................................................... 19 OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS ....................................................................................................... 20 OEM LABELING REQUIREMENTS FOR END-PRODUCT .............................................. 21 OEM END PRODUCT USER MANUAL STATEMENTS.................................................... 22 MECHANICAL DATA......................................................................................................... 23 CONTACTING LS RESEARCH ......................................................................................... 25
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 5 of 25 FOOTPRINT AND PIN DEFINITIONS  Figure 1 TiWi-uB2 Module Schematic View   Figure 2 TiWi-uB2 Module Footprint View
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 6 of 25 PIN DESCRIPTIONS Module Pin Name I/O Type Description  1 HCI_CTS I HCI UART CLEAR-TO-SEND 2 HCI_TX O HCI UART DATA TRANSMIT 3 HCI_RX I HCI UART DATA RECEIVE 4 HCI_RTS O HCI UART REQUEST-TO-SEND 5 GND GND GROUND 6 GND GND GROUND 7 GND GND GROUND 8 SLOW_CLK_IN I 32.768 kHz CLOCK IN 9 GND GND GROUND 10 NC1 O NO CONNECT 1 (DO NOT CONNECT) 11 NC2 O NO CONNECT 2 (DO NOT CONNECT) 12 VBAT PI POWER TO MODULE (2.2V - 4.8V) 13 GND GND GROUND 14 BT_ANT RF ANTENNA, 50 OHMS 15 GND GND GROUND 16 nSHUTD I SHUTDOWN INPUT (ACTIVE LOW) 17 GND GND GROUND 18 VDD_IO PI I/O POWER SUPPLY (1.8V NOMINAL) 19 AUD_IN I PCM DATA INPUT (IF NOT USED, DO NOT CONNECT) 20 AUD_OUT O PCM DATA OUTPUT (IF NOT USED, DO NOT CONNECT) 21 AUD_CLK IO PCM CLOCK (IF NOT USED, DO NOT CONNECT) 22 AUD_FSYNC IO PCM FRAME SYNCH (IF NOT USED, DO NOT CONNECT) 23 NC3 O NO CONNECT 3 (DO NOT CONNECT) 24 TX_DBG O LOGGER OUTPUT 25-33 GND GND GROUND  PI = Power Input I = Input  O = Output IO = Bi-directional Input Output Port RF = Bi-directional RF Port GND=Ground  Table 3 TiWi-uB2 Pin Descriptions
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 7 of 25 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings Symbol Description Min Max Unit VBAT Input supply Voltage -0.5 5.5 V VDD_IO Digital Bluetooth I/O Voltage -0.5 2.145 V Table 4 Absolute Maximum Ratings1  Recommended Operating Conditions Test conditions: Ambient Temp = 25°C Symbol Min Typ Max Unit VBAT 2.2 3.3 4.8 V VDD_IO 1.62 1.8 1.92 V Table 5 Recommended Operating Conditions     1 Under no circumstances should exceeding the ratings specified in the Absolute Maximum Ratings section be allowed.  Stressing the module beyond these limits may result permanent damage to the module that is not covered by the warranty.
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 8 of 25 General Characteristics Characteristic Description Model Name TiWi-uB2 Product Description Bluetooth Wireless Module Dimension 7.0 mm x 7.0 mm x 1.5 mm (W*L*T)  BT Interface HCI UART, Audio PCM Operating temperature -30°C to 85°C Storage temperature -40°C to 85°C Humidity Operating Humidity 10% to 95% Non-Condensing Storage Humidity 5% to 95% Non-Condensing Weight 0.18 g  +/- 0.01g Table 6 General Characteristics   Current Consumption – for Different Bluetooth BR/EDR Scenarios   Conditions: VBAT = 3.6 V, VDDIO = 1.8V 25°C, 26-MHz fast clock, nominal unit, 4 dBm output power Mode Description Master/Slave Average Current Unit Idle current (ARM off) Master/slave 2.5 mA SCO link HV3 Master/slave 12 mA eSCO link EV3 64 kbps, no retransmission Master/slave 11.5 mA eSCO link 2-EV3 64 kbps, no retransmission Master/slave 8.3 mA GFSK full throughput: TX = DH1, RX = DH5 Master/slave 38.5 mA EDR full throughput: TX = 2-DH1, RX = 2-DH5 Master/slave 39.2 mA EDR full throughput: TX = 3-DH1, RX = 3-DH5 Master/slave 39.2 mA Sniff, one attempt, 1.28 s Master/slave 76/100 µA Page or inquiry scan 1.28 s, 11.25 ms Master/slave 300 µA Page (1.28 s) and inquiry (2.56 s) scans, 11.25 ms Master/slave 430 µA Low power scan, 1.28-s interval, quiet environment Master/slave 135 µA Table 7 Bluetooth Power Consumption
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 9 of 25 Current Consumption – for Different Bluetooth LE Scenarios  Conditions: VBAT = 3.6 V, VDDIO = 1.8V, 25°C, 26-MHz fast clock, nominal unit, 10 dBm output power Mode Description Average Current Unit Advertising, non-connectable Advertising in all 3 channels 1.28msec advertising interval 15Bytes advertise data 104 µA Advertising, discoverable Advertising in all 3 channels 1.28msec advertising interval 15Bytes advertise data 121 µA Scanning Listening to a single frequency per window 1.28msec scan interval 11.25msec scan window 302 µA Connected (master role) 500msec connection interval 0msec Slave connection latency Empty Tx/Rx LL packets 169 µA Table 8 Bluetooth Power Consumption Power Consumption – Bluetooth Conditions: VBAT = 3.3V, VDDIO = 1.8V, Ambient Temp = 25°C Packet type Typ Max Unit DM1 47.1  mA DH1 30.2  mA DM3 21.3  mA DH3 17.4  mA DM5 15.6  mA DH5 13.0  mA Deep Sleep Mode 0.033  mA Constant RX 44.5  mA BER Mode 38.8  mA Table 9 Bluetooth VBAT Power Consumption Packet type Typ Max Unit DM1 0.069  mA DH1 0.069  mA DM3 0.069  mA DH3 0.069  mA DM5 0.069  mA DH5 0.069  mA Deep Sleep mode 0.032  mA Constant RX 0.069  mA BER Mode 0.069  mA Table 10 Bluetooth VDDIO Power Consumption
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 10 of 25 Bluetooth RF Characteristics General Specifications Feature Description Bluetooth Standard Bluetooth 4.0 (with EDR) Host Interface HCI UART, PCM Antenna Reference Small antennas with 0~2 dBi peak gain  Frequency Band 2.402 GHz ~ 2.480 GHz Number of Channels 79 channels Modulation FHSS, GFSK, DPSK, DQPSK Table 11 Bluetooth General Specifications  RF Characteristics Test Conditions : VBAT = 3.3V, VDDIO = 1.8V Characteristic Condition -30°C Typ 25°C Typ 85°C Typ BT Spec Unit Output Power Class 1.5 9.5 10 10.8  dBm Modulation GFSK dF1 avg 158 158 158 140~ 175 KHz dF2 max 138 137 136 >115 KHz dF2avg / dF1avg 90 90 90 80 % Modulation EDR at 8DPSK RMS DEVM 5 5 5 13 % 99% DEVM 10 10 10 20 % Peak DEVM 13 13 13 25 % Sensitivity at Dirty Tx On GFSK at BER = 0.1% -95 -94 -93 -70 dBm π/4-DQPSK at BER = 0.01% -93 -92 -91 -70 dBm 8DPSK at BER = 0.01% -86 -85 -84 -70 dBm Maximum Input Level GFSK at BER = 0.1% -5 -5 -5 -20 dBm π/4-DQPSK at BER = 0.1% -10 -10 -10 -20 dBm 8DPSK at BER = 0.1% -10 -10 -10 -20 dBm Table 12 Bluetooth RF Characteristics
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 11 of 25 BLUETOOTH POWER-UP/ DOWN SEQUENCE   Figure 3 Bluetooth Power-Up/Down Sequence  nSHUTD Requirements Parameter Symbol Min Max Unit Operation mode level (1) VIH 1.42 1.98 V Shutdown mode level (1) VIL 0 0.4 V Minimum time for nSHUT_DOWN low to reset the device  5   Rise/fall times Tr/Tf  20 us (1) Internal pull-down retains shutdown mode when no external signal is applied to this pin. Table 13 nSHUTD Requirements
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 12 of 25 SLOW CLOCK (32 KHZ) SOURCE REQUIREMENTS External Slow Clock signal characteristics Characteristic Condition Sym Min Typ Max Unit Input slow clock frequency    32768  Hz Input slow clock accuracy (Initial + temp + aging)   -250  250 ppm Input transition time tr/tf  - 10% to 90%   tr/tf  100 ns Frequency input duty cycle   15 50 85 % Phase noise At 1 kHz    -125 dBc/Hz Jitter Integrated over 300 to 15000 Hz    1 Hz Slow clock input voltage limits Square wave, DC coupled VIH 0.65 x VDD_IO  VDD_IO V peak VIL 0  0.35 x VDD_IO V peak Input impedance   1   MΩ Input capacitance     5 pF Table 14 32 kHz Clock Requirements
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 13 of 25 BLUETOOTH HCI UART    Figure 4 Bluetooth HCI UART Timing  Symbol Characteristic Condition Min Typ Max Unit  Baud rate  37.5  4000 kbps  Baud rate accuracy  -2.5  1.5 % t3 CTS low to TX_DATA on  0 2  us t4 CTS high to TX_DATA off Hardware flow control   1 byte t6 CTS high pulse width  1   Bit t1 RTS low to RX_DATA on  0 2  us t2 RTS high to RX_DATA off Interrupt set to ¼ FIFI   16 byte Table 15 Bluetooth HCI UART Timing
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 14 of 25 BLUETOOTH AUDIO CODEC/PCM  Figure 5 Bluetooth PCM Timing  PCM Master  Symbol Parameter Condition Min Max Unit Tclk Cycle time  166.67 (6 MHz) 15625 (64 kHz) ns TW High or low pulse width  50% of Tclk min  ns tis AUD_IN setup time  25  ns tih AUD_IN hold time  0  ns top AUD_OUT propagation time 40pF load 0 10 ns top FSYNC_OUT propagation time 40pF load 0 10 ns Table 16 Bluetooth PCM Master Timing  PCM Slave  Symbol Parameter Condition Min Max Unit Tclk Cycle time  62.5 (16 MHz)  ns TW High or low pulse width  40% of Tclk  ns tis AUD_IN setup time  8  ns tih AUD_IN hold time  0  ns tis AUD_FSYNC setup time  8  ns tih AUD_FSYNC hold time  0  ns top AUD_OUT propagation time 40pF load 0 21 ns Table 17 Bluetooth PCM Slave Timing
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 15 of 25 SOLDERING RECOMMENDATIONS  Recommended Reflow Profile for Lead Free Solder  Figure 6 Recommended Soldering Profile Note: The quality of solder joints on the surface mount pads where they contact the host board should meet the appropriate IPC Specification.  See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.1 “Bottom Only Terminations.”
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 16 of 25 CLEANING In general, cleaning the populated modules is strongly discouraged.  Residuals under the module cannot be easily removed with any cleaning process.   Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module.  The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads.  Water could also damage any stickers or labels.   Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection.  The solvent could also damage any stickers or labels.   Ultrasonic cleaning could damage the module permanently. OPTICAL INSPECTION After soldering the Module to the host board, consider optical inspection to check the following:   Proper alignment and centering of the module over the pads.   Proper solder joints on all pads.   Excessive solder or contacts to neighboring pads, or vias. REWORK The module can be unsoldered from the host board if the Moisture Sensitivity Level (MSL) requirements are met as described in this datasheet. Never attempt a rework on the module itself, e.g. replacing individual components.  Such actions will terminate warranty coverage. SHIPPING, HANDLING, AND STORAGE Shipping Bulk orders of the TiWi-uB2 modules are delivered in trays of 416 (13 x 32) or reels of 2,000. Handling The TiWi-uB2 modules contain a highly sensitive electronic circuitry.  Handling without proper ESD protection may damage the module permanently. Moisture Sensitivity Level (MSL) Per J-STD-020, devices rated as MSL 4 and not stored in a sealed bag with desiccant pack should be baked prior to use. After opening packaging, devices that will be subjected to reflow must be mounted within 72 hours of factory conditions (<30°C and 60% RH) or stored at <10% RH. Bake devices for 48 hours at 125°C.  Storage Please use this product within 6 months after receipt.  Any product used after 6 months of receipt needs to have solderability confirmed before use. The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH.  (Packing materials, in particular, may be deformed at the temperatures above this range.) Do not store in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX. Do not store in direct sunlight. The product should not be subject to excessive mechanical shock.
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 17 of 25 Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards.
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 18 of 25 AGENCY CERTIFICATIONS FCC ID: TFB-BT1, 15.247 IC ID: 5969A-BT1, RSS 210 CE: Compliant to standards EN 60950-1, EN 300 328, and EN 301 489   AGENCY STATEMENTS Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:   Reorient or relocate the receiving antenna.   Increase the separation between the equipment and receiver.   Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.   Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This portable transmitter with its antenna complies with FCC/IC RF exposure limits for general population / uncontrolled exposure. FCC  CAUTION:  Any  changes  or  modifications  not  expressly  approved  by  the  party responsible for compliance could void the user's authority to operate this equipment.
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 19 of 25 Industry Canada Statements This device complies with Industry Canada License-exempt RSS standard(s).  Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. This device has been designed to operate with the antenna(s) listed below, and having a maximum gain of 2.0 dBi (LSR Dipole) and 1.3dBi (Johanson Chip).  Antennas not included in this list or having a gain greater than 2.0 dBi and 1.3dBi are strictly prohibited for use with this device.  The required antenna impedance is 50 ohms. List of all Antennas Acceptable for use with the Transmitter  1) LS Research 001-0001 center-fed dipole antenna and LS Research 080-0001 U.FL to Reverse Polarity SMA connector cable.  2) Johanson 2450AT43B100 chip antenna.  Cet appareil est conforme aux normes d'Industrie Canada exempts de licence RSS (s).  L'opération est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de l'appareil. Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre choisis de manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle permise pour une communication réussie. Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximum de 2,0 dBi (LSR dipôle) et1.3dBi (Chip Johanson).  Antennes pas inclus danscette liste ou d'avoir un gain supérieur à 2,0 dBi et-1.3dBi sont strictement interdites pour l'utilisation avec cet appareil.  L'impédance d'antenne requise est de 50 ohms. Liste de toutes les antennes acceptables pour une utilisation avec l'émetteur 1) LS Research 001-0001 alimenté par le centre antenne dipôle et LS Research 080-0001 U.FL d'inversion de polarité du câble connecteur SMA. 2) Antenne Johanson puce 2450AT43B100.
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 20 of 25 OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS The TiWi-uB2 Module has been certified for integration into products only by OEM integrators under the following conditions: The antennas for this transmitter must not be co-located with any other transmitters except in accordance with FCC and Industry Canda multi-transmitter procedures.  Co-location means having a separation distance of less than 20 cm between transmitting antennas. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT  NOTE:  In  the  event  that  these  conditions  cannot  be  met  (for  certain configurations  or  co-location  with  another  transmitter),  then  the  FCC  and  Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM integrator will  be  responsible  for  re-evaluating  the  end  product  (including  the  transmitter)  and obtaining a separate FCC and Industry Canada authorization. Le module de TiWi-uB2 a été certifié pour l'intégration dans des produits uniquement par des intégrateurs OEM dans les conditions suivantes: Les antennes pour ce transmetteur ne doit pas être co-localisés avec les autres émetteurs sauf en conformité avec la FCC et Industrie Canada multi-émetteur procédures.  Co-localisation des moyens ayant une distance de séparation inférieure à 20 cm entre les antennes d'émission. Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne seront pas tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour toutes les exigences de conformité supplémentaires requis avec ce module installé (par exemple, les émissions appareil numérique, les exigences de périphériques PC, etc.) NOTE  IMPORTANTE:  Dans  le  cas  où  ces  conditions  ne  peuvent  être  satisfaites  (pour certaines configurations ou de co-implantation avec un autre émetteur), puis la FCC et Industrie autorisations Canada ne sont plus considérés comme valides et l'ID de la FCC et  IC  numéro  de  certification  ne  peut  pas  être  utilisé  sur  la  produit  final.  Dans  ces circonstances,  l'intégrateur  OEM  sera  chargé  de  réévaluer  le  produit  final  (y  compris l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation.
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 21 of 25 OEM LABELING REQUIREMENTS FOR END-PRODUCT The TiWi-uB2 module is labeled with its own FCC ID and IC Certification Number.  The FCC ID and IC certification numbers are not visible when the module is installed inside another device, as such the end device into which the module is installed must display a label referring to the enclosed module.  The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: TFB-BT1” “Contains Transmitter Module IC: 5969A-BT1” or “Contains FCC ID: TFB-BT1” “Contains IC: 5969A-BT1” The OEM of the TiWi-uB2 Module must only use the approved antenna(s) listed above, which have been certified with this module.  Le module de TiWi-uB2 est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de la FCC et IC numéros de certification ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre appareil, comme par exemple le terminal dans lequel le module est installé doit afficher une etiquette faisant référence au module ci-joint. Le produit final doit être étiqueté dans un endroit visible par le suivant:  “Contient Module émetteur FCC ID: TFB-BT1" “Contient Module émetteur IC: 5969A-BT1"  ou  “Contient FCC ID: TFB-BT1" “Contient IC: 5969A-BT1"  Les OEM du module TiWi-uB2 ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec ce module.
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 22 of 25 OEM END PRODUCT USER MANUAL STATEMENTS The OEM integrator should not provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. Other user manual statements may apply.  L'intégrateur OEM ne devraient pas fournir des informations à l'utilisateur final sur la façon d'installer ou de supprimer ce module RF ou modifier les paramètres liés RF dans le manuel utilisateur du produit final.  Autres déclarations manuel de l'utilisateur peuvent s'appliquer.
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 23 of 25 MECHANICAL DATA  Figure 7 Module Mechanical Dimensions
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 24 of 25                   Figure 8 Soldering Footprint for Host Board and Module Placement
TiWi-uB2 / uBleu2 Module DATASHEET  The information in this document is subject to change without notice.  TiWi-uB2 uBleu2 Datasheet  Copyright © 2012 LS Research, LLC  Page 25 of 25 CONTACTING LS RESEARCH Headquarters  LS Research, LLC   W66 N220 Commerce Court   Cedarburg, WI 53012-2636  USA   Tel: 1(262) 375-4400   Fax: 1(262) 375-4248 Website www.lsr.com Wiki wiki.lsr.com Technical Support forum.lsr.com Sales Contact sales@lsr.com                      The  information  in  this  document  is  provided  in  connection  with  LS  Research  (hereafter  referred  to  as  “LSR”) products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of LSR products. EXCEPT AS SET FORTH IN LSR’S TERMS AND CONDITIONS OF SALE LOCATED ON LSR’S WEB SITE, LSR ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS  ANY  EXPRESS,  IMPLIED  OR  STATUTORY  WARRANTY  RELATING  TO  ITS  PRODUCTS INCLUDING,  BUT  NOT  LIMITED TO, THE IMPLIED WARRANTY  OF  MERCHANTABILITY, FITNESS  FOR  A PARTICULAR  PURPOSE,  OR  NON-INFRINGEMENT.  IN  NO  EVENT  SHALL  LSR  BE  LIABLE  FOR  ANY DIRECT,  INDIRECT,  CONSEQUENTIAL,  PUNITIVE,  SPECIAL  OR  INCIDENTAL  DAMAGES  (INCLUDING, WITHOUT  LIMITATION,  DAMAGES  FOR  LOSS  OF  PROFITS,  BUSINESS  INTERRUPTION,  OR  LOSS  OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF LSR HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. LSR makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications  and  product descriptions  at  any time  without notice.  LSR  does  not  make  any commitment to update the information contained herein. Unless specifically provided otherwise, LSR products are not suitable for, and shall not be used in, automotive applications. LSR’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.

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