Laird Connectivity BT1 TiWi-uB2 Bluetooth Module User Manual manual
LS Research, LLC TiWi-uB2 Bluetooth Module manual
manual
TiWi-uB2 / uBleu2 Module
DATASHEET
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TiWi-uB2 uBleu2 Datasheet Copyright © 2012 LS Research, LLC Page 1 of 25
TiWi-uB2 / uBleu2 Bluetooth Module
FEATURES
Built in CC2564 single-chip Bluetooth
fully supports BT 2.1 + EDR, BLE 4.0.
RF Output Power: +10 dBm (Class 1.5)
RF Receive Sensitivity: -94 dBm
Miniature Size: 7 mm x 7 mm x 1.5 mm
Operating Voltage: 2.2V to 4.8V
Operating temperature: -30 to +85o C
Worldwide acceptance: FCC (USA), IC
(Canada), and CE (Europe)
RoHS compliant
Supports maximum Bluetooth data rates
over HCI UART interface.
Supports multiple Bluetooth profiles with
enhanced QoS, both mono and stereo,
assisted A2DP
APPLICATIONS
Medical (ex Heart Rate Monitor, Blood
Pressure Sensor, Blood Glucose Meter)
Thermometer
Flood Alarm
Heating Control
Automatic Key Control
Industrial Sensors
Toys
Entertainment Devices
Mobile Accessories
All Bluetooth Wireless Applications
DESCRIPTION
LSR would like to announce a low-cost and low-
power consumption module which has all of the
Bluetooth functionalities. The highly integrated
TiWi-uB2 module makes the use of Bluetooth
headsets and other applications possible.
The TiWi-uB2 module fully supports the dual
mode Bluetooth and BLE operation, and the
output power can support class 1.5. The SIP
module provides UART interface / audio PCM
interface for Bluetooth.
The SIP module is specifically developed for
Smart phones and Portable devices.
Need to get to market quickly? Not an expert in
Bluetooth? Need a custom antenna? Do you
need help with your host board? LS Research
Design Services will be happy to develop
custom hardware or software, or help integrate
the design. Contact us at sales@lsr.com or call
us at 262-375-4400.
ORDERING INFORMATION
Order Number
Description
450-0104
TiWi-uB2 Module (Tray)
450-0104R
TiWi-uB2 Module (Tape & Reel)
450-0105
TiWi-uB2 EM Board
Table 1 Orderable Model Numbers
TiWi-uB2 / uBleu2 Module
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MODULE ACCESSORIES
Order Number
Description
001-0001
2.4 GHz Dipole Antenna with Reverse
Polarity SMA Connector
080-0001
U.FL to Reverse Polarity SMA Bulkhead
Cable 105mm
Table 2 Module Accessories
TiWi-uB2 / uBleu2 Module
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TiWi-uB2 uBleu2 Datasheet Copyright © 2012 LS Research, LLC Page 3 of 25
TABLE OF CONTENTS
FEATURES .......................................................................................................................... 1
APPLICATIONS ................................................................................................................... 1
DESCRIPTION ..................................................................................................................... 1
ORDERING INFORMATION ................................................................................................ 1
MODULE ACCESSORIES ................................................................................................... 2
FOOTPRINT AND PIN DEFINITIONS.................................................................................. 5
PIN DESCRIPTIONS ............................................................................................................ 6
ELECTRICAL SPECIFICATIONS ........................................................................................ 7
Absolute Maximum Ratings ....................................................................................................................... 7
Recommended Operating Conditions ...................................................................................................... 7
General Characteristics .............................................................................................................................. 8
Bluetooth RF Characteristics .................................................................................................................. 10
BLUETOOTH POWER-UP/ DOWN SEQUENCE .............................................................. 11
nSHUTD Requirements ............................................................................................................................. 11
SLOW CLOCK (32 KHZ) SOURCE REQUIREMENTS ..................................................... 12
BLUETOOTH HCI UART ................................................................................................... 13
BLUETOOTH AUDIO CODEC/PCM .................................................................................. 14
SOLDERING RECOMMENDATIONS ................................................................................ 15
Recommended Reflow Profile for Lead Free Solder ............................................................................. 15
CLEANING ......................................................................................................................... 16
OPTICAL INSPECTION ..................................................................................................... 16
REWORK ........................................................................................................................... 16
SHIPPING, HANDLING, AND STORAGE ......................................................................... 16
Shipping ..................................................................................................................................................... 16
Handling ..................................................................................................................................................... 16
Moisture Sensitivity Level (MSL) ............................................................................................................. 16
Storage ....................................................................................................................................................... 16
TiWi-uB2 / uBleu2 Module
DATASHEET
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Repeating Reflow Soldering .................................................................................................................... 17
AGENCY CERTIFICATIONS ............................................................................................. 18
AGENCY STATEMENTS ................................................................................................... 18
Federal Communication Commission Interference Statement ............................................................ 18
Industry Canada Statements.................................................................................................................... 19
OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA
REGULATIONS ....................................................................................................... 20
OEM LABELING REQUIREMENTS FOR END-PRODUCT .............................................. 21
OEM END PRODUCT USER MANUAL STATEMENTS.................................................... 22
MECHANICAL DATA......................................................................................................... 23
CONTACTING LS RESEARCH ......................................................................................... 25
TiWi-uB2 / uBleu2 Module
DATASHEET
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FOOTPRINT AND PIN DEFINITIONS
Figure 1 TiWi-uB2 Module Schematic View
Figure 2 TiWi-uB2 Module Footprint View
TiWi-uB2 / uBleu2 Module
DATASHEET
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PIN DESCRIPTIONS
Module
Pin
Name
I/O Type
Description
1
HCI_CTS
I
HCI UART CLEAR-TO-SEND
2
HCI_TX
O
HCI UART DATA TRANSMIT
3
HCI_RX
I
HCI UART DATA RECEIVE
4
HCI_RTS
O
HCI UART REQUEST-TO-SEND
5
GND
GND
GROUND
6
GND
GND
GROUND
7
GND
GND
GROUND
8
SLOW_CLK_IN
I
32.768 kHz CLOCK IN
9
GND
GND
GROUND
10
NC1
O
NO CONNECT 1 (DO NOT CONNECT)
11
NC2
O
NO CONNECT 2 (DO NOT CONNECT)
12
VBAT
PI
POWER TO MODULE (2.2V - 4.8V)
13
GND
GND
GROUND
14
BT_ANT
RF
ANTENNA, 50 OHMS
15
GND
GND
GROUND
16
nSHUTD
I
SHUTDOWN INPUT (ACTIVE LOW)
17
GND
GND
GROUND
18
VDD_IO
PI
I/O POWER SUPPLY (1.8V NOMINAL)
19
AUD_IN
I
PCM DATA INPUT (IF NOT USED, DO NOT CONNECT)
20
AUD_OUT
O
PCM DATA OUTPUT (IF NOT USED, DO NOT CONNECT)
21
AUD_CLK
IO
PCM CLOCK (IF NOT USED, DO NOT CONNECT)
22
AUD_FSYNC
IO
PCM FRAME SYNCH (IF NOT USED, DO NOT CONNECT)
23
NC3
O
NO CONNECT 3 (DO NOT CONNECT)
24
TX_DBG
O
LOGGER OUTPUT
25-33
GND
GND
GROUND
PI = Power Input
I = Input
O = Output
IO = Bi-directional Input Output Port
RF = Bi-directional RF Port
GND=Ground
Table 3 TiWi-uB2 Pin Descriptions
TiWi-uB2 / uBleu2 Module
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ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
Symbol
Description
Min
Max
Unit
VBAT
Input supply Voltage
-0.5
5.5
V
VDD_IO
Digital Bluetooth I/O Voltage
-0.5
2.145
V
Table 4 Absolute Maximum Ratings
1
Recommended Operating Conditions
Test conditions: Ambient Temp = 25°C
Symbol
Min
Typ
Max
Unit
VBAT
2.2
3.3
4.8
V
VDD_IO
1.62
1.8
1.92
V
Table 5 Recommended Operating Conditions
1
Under no circumstances should exceeding the ratings specified in the Absolute Maximum Ratings section be
allowed. Stressing the module beyond these limits may result permanent damage to the module that is not
covered by the warranty.
TiWi-uB2 / uBleu2 Module
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General Characteristics
Characteristic
Description
Model Name
TiWi-uB2
Product Description
Bluetooth Wireless Module
Dimension
7.0 mm x 7.0 mm x 1.5 mm (W*L*T)
BT Interface
HCI UART, Audio PCM
Operating temperature
-30°C to 85°C
Storage temperature
-40°C to 85°C
Humidity
Operating Humidity 10% to 95% Non-Condensing
Storage Humidity 5% to 95% Non-Condensing
Weight
0.18 g +/- 0.01g
Table 6 General Characteristics
Current Consumption – for Different Bluetooth BR/EDR Scenarios
Conditions: VBAT = 3.6 V, VDDIO = 1.8V 25°C, 26-MHz fast clock, nominal unit, 4 dBm output power
Mode Description
Master/Slave
Average Current
Unit
Idle current (ARM off)
Master/slave
2.5
mA
SCO link HV3
Master/slave
12
mA
eSCO link EV3 64 kbps, no retransmission
Master/slave
11.5
mA
eSCO link 2-EV3 64 kbps, no retransmission
Master/slave
8.3
mA
GFSK full throughput: TX = DH1, RX = DH5
Master/slave
38.5
mA
EDR full throughput: TX = 2-DH1, RX = 2-DH5
Master/slave
39.2
mA
EDR full throughput: TX = 3-DH1, RX = 3-DH5
Master/slave
39.2
mA
Sniff, one attempt, 1.28 s
Master/slave
76/100
µA
Page or inquiry scan 1.28 s, 11.25 ms
Master/slave
300
µA
Page (1.28 s) and inquiry (2.56 s) scans, 11.25 ms
Master/slave
430
µA
Low power scan, 1.28-s interval, quiet environment
Master/slave
135
µA
Table 7 Bluetooth Power Consumption
TiWi-uB2 / uBleu2 Module
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Current Consumption – for Different Bluetooth LE Scenarios
Conditions: VBAT = 3.6 V, VDDIO = 1.8V, 25°C, 26-MHz fast clock, nominal unit, 10 dBm output power
Mode
Description
Average Current
Unit
Advertising, non-
connectable
Advertising in all 3 channels
1.28msec advertising interval
15Bytes advertise data
104
µA
Advertising,
discoverable
Advertising in all 3 channels
1.28msec advertising interval
15Bytes advertise data
121
µA
Scanning
Listening to a single frequency per window
1.28msec scan interval
11.25msec scan window
302
µA
Connected (master role)
500msec connection interval
0msec Slave connection latency
Empty Tx/Rx LL packets
169
µA
Table 8 Bluetooth Power Consumption
Power Consumption – Bluetooth
Conditions: VBAT = 3.3V, VDDIO = 1.8V, Ambient Temp = 25°C
Packet type
Typ
Max
Unit
DM1
47.1
mA
DH1
30.2
mA
DM3
21.3
mA
DH3
17.4
mA
DM5
15.6
mA
DH5
13.0
mA
Deep Sleep Mode
0.033
mA
Constant RX
44.5
mA
BER Mode
38.8
mA
Table 9 Bluetooth VBAT Power Consumption
Packet type
Typ
Max
Unit
DM1
0.069
mA
DH1
0.069
mA
DM3
0.069
mA
DH3
0.069
mA
DM5
0.069
mA
DH5
0.069
mA
Deep Sleep mode
0.032
mA
Constant RX
0.069
mA
BER Mode
0.069
mA
Table 10 Bluetooth VDDIO Power Consumption
TiWi-uB2 / uBleu2 Module
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Bluetooth RF Characteristics
General Specifications
Feature
Description
Bluetooth Standard
Bluetooth 4.0 (with EDR)
Host Interface
HCI UART, PCM
Antenna Reference
Small antennas with 0~2 dBi peak gain
Frequency Band
2.402 GHz ~ 2.480 GHz
Number of Channels
79 channels
Modulation
FHSS, GFSK, DPSK, DQPSK
Table 11 Bluetooth General Specifications
RF Characteristics
Test Conditions : VBAT = 3.3V, VDDIO = 1.8V
Characteristic
Condition
-30°C Typ
25°C Typ
85°C Typ
BT Spec
Unit
Output Power
Class 1.5
9.5
10
10.8
dBm
Modulation
GFSK
dF1 avg
158
158
158
140~ 175
KHz
dF2 max
138
137
136
>115
KHz
dF2avg / dF1avg
90
90
90
80
%
Modulation
EDR at
8DPSK
RMS DEVM
5
5
5
13
%
99% DEVM
10
10
10
20
%
Peak DEVM
13
13
13
25
%
Sensitivity at
Dirty Tx On
GFSK at BER = 0.1%
-95
-94
-93
-70
dBm
π/4-DQPSK at BER = 0.01%
-93
-92
-91
-70
dBm
8DPSK at BER = 0.01%
-86
-85
-84
-70
dBm
Maximum
Input Level
GFSK at BER = 0.1%
-5
-5
-5
-20
dBm
π/4-DQPSK at BER = 0.1%
-10
-10
-10
-20
dBm
8DPSK at BER = 0.1%
-10
-10
-10
-20
dBm
Table 12 Bluetooth RF Characteristics
TiWi-uB2 / uBleu2 Module
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BLUETOOTH POWER-UP/ DOWN SEQUENCE
Figure 3 Bluetooth Power-Up/Down Sequence
nSHUTD Requirements
Parameter
Symbol
Min
Max
Unit
Operation mode level (1)
VIH
1.42
1.98
V
Shutdown mode level (1)
VIL
0
0.4
V
Minimum time for nSHUT_DOWN low to reset the device
5
Rise/fall times
Tr/Tf
20
us
(1) Internal pull-down retains shutdown mode when no external signal is applied to this pin.
Table 13 nSHUTD Requirements
TiWi-uB2 / uBleu2 Module
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SLOW CLOCK (32 KHZ) SOURCE REQUIREMENTS
External Slow Clock signal characteristics
Characteristic
Condition
Sym
Min
Typ
Max
Unit
Input slow clock frequency
32768
Hz
Input slow clock accuracy
(Initial + temp + aging)
-250
250
ppm
Input transition time
tr/tf - 10% to 90%
tr/tf
100
ns
Frequency input duty cycle
15
50
85
%
Phase noise
At 1 kHz
-125
dBc/Hz
Jitter
Integrated over
300 to 15000 Hz
1
Hz
Slow clock input voltage limits
Square wave,
DC coupled
VIH
0.65 x
VDD_IO
VDD_IO
V peak
VIL
0
0.35 x
VDD_IO
V peak
Input impedance
1
MΩ
Input capacitance
5
pF
Table 14 32 kHz Clock Requirements
TiWi-uB2 / uBleu2 Module
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BLUETOOTH HCI UART
Figure 4 Bluetooth HCI UART Timing
Symbol
Characteristic
Condition
Min
Typ
Max
Unit
Baud rate
37.5
4000
kbps
Baud rate accuracy
-2.5
1.5
%
t3
CTS low to TX_DATA on
0
2
us
t4
CTS high to TX_DATA off
Hardware flow control
1
byte
t6
CTS high pulse width
1
Bit
t1
RTS low to RX_DATA on
0
2
us
t2
RTS high to RX_DATA off
Interrupt set to ¼ FIFI
16
byte
Table 15 Bluetooth HCI UART Timing
TiWi-uB2 / uBleu2 Module
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BLUETOOTH AUDIO CODEC/PCM
Figure 5 Bluetooth PCM Timing
PCM Master
Symbol
Parameter
Condition
Min
Max
Unit
Tclk
Cycle time
166.67 (6 MHz)
15625 (64 kHz)
ns
TW
High or low pulse width
50% of Tclk min
ns
tis
AUD_IN setup time
25
ns
tih
AUD_IN hold time
0
ns
top
AUD_OUT propagation time
40pF load
0
10
ns
top
FSYNC_OUT propagation time
40pF load
0
10
ns
Table 16 Bluetooth PCM Master Timing
PCM Slave
Symbol
Parameter
Condition
Min
Max
Unit
Tclk
Cycle time
62.5 (16 MHz)
ns
TW
High or low pulse width
40% of Tclk
ns
tis
AUD_IN setup time
8
ns
tih
AUD_IN hold time
0
ns
tis
AUD_FSYNC setup time
8
ns
tih
AUD_FSYNC hold time
0
ns
top
AUD_OUT propagation time
40pF load
0
21
ns
Table 17 Bluetooth PCM Slave Timing
TiWi-uB2 / uBleu2 Module
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SOLDERING RECOMMENDATIONS
Recommended Reflow Profile for Lead Free Solder
Figure 6 Recommended Soldering Profile
Note: The quality of solder joints on the surface mount pads where they contact the host
board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability of
Electronic Assemblies, section 8.2.1 “Bottom Only Terminations.”
TiWi-uB2 / uBleu2 Module
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CLEANING
In general, cleaning the populated modules is
strongly discouraged. Residuals under the
module cannot be easily removed with any
cleaning process.
Cleaning with water can lead to capillary
effects where water is absorbed into the gap
between the host board and the module.
The combination of soldering flux residuals
and encapsulated water could lead to short
circuits between neighboring pads. Water
could also damage any stickers or labels.
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux
residuals into the RF shield, which is not
accessible for post-washing inspection. The
solvent could also damage any stickers or
labels.
Ultrasonic cleaning could damage the
module permanently.
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the
following:
Proper alignment and centering of the
module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring
pads, or vias.
REWORK
The module can be unsoldered from the host
board if the Moisture Sensitivity Level (MSL)
requirements are met as described in this
datasheet.
Never attempt a rework on the
module itself, e.g. replacing
individual components. Such actions
will terminate warranty coverage.
SHIPPING, HANDLING, AND STORAGE
Shipping
Bulk orders of the TiWi-uB2 modules are
delivered in trays of 416 (13 x 32) or reels of
2,000.
Handling
The TiWi-uB2 modules contain a highly
sensitive electronic circuitry. Handling without
proper ESD protection may damage the module
permanently.
Moisture Sensitivity Level (MSL)
Per J-STD-020, devices rated as MSL 4 and
not stored in a sealed bag with desiccant pack
should be baked prior to use.
After opening packaging, devices that will be
subjected to reflow must be mounted within 72
hours of factory conditions (<30°C and 60%
RH) or stored at <10% RH.
Bake devices for 48 hours at 125°C.
Storage
Please use this product within 6 months after
receipt. Any product used after 6 months of
receipt needs to have solderability confirmed
before use.
The product shall be stored without opening the
packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be
deformed at the temperatures above this range.)
Do not store in salty air or in an environment
with a high concentration of corrosive gas, such
as Cl2, H2S, NH3, SO2, or NOX.
Do not store in direct sunlight.
The product should not be subject to excessive
mechanical shock.
TiWi-uB2 / uBleu2 Module
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Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
TiWi-uB2 / uBleu2 Module
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TiWi-uB2 uBleu2 Datasheet Copyright © 2012 LS Research, LLC Page 18 of 25
AGENCY CERTIFICATIONS
FCC ID: TFB-BT1, 15.247
IC ID: 5969A-BT1, RSS 210
CE: Compliant to standards EN 60950-1, EN 300 328, and EN 301 489
AGENCY STATEMENTS
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates uses and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
This portable transmitter with its antenna complies with FCC/IC RF exposure limits for general
population / uncontrolled exposure.
FCC CAUTION: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate this equipment.
TiWi-uB2 / uBleu2 Module
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Industry Canada Statements
This device complies with Industry Canada License-exempt RSS standard(s). Operation is subject to
the following two conditions: (1) this device may not cause interference, and (2) this device must accept
any interference, including interference that may cause undesired operation of the device.
To reduce potential radio interference to other users, the antenna type and its gain should be so
chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for
successful communication.
This device has been designed to operate with the antenna(s) listed below, and having a maximum
gain of 2.0 dBi (LSR Dipole) and 1.3dBi (Johanson Chip). Antennas not included in this list or having a
gain greater than 2.0 dBi and 1.3dBi are strictly prohibited for use with this device. The required
antenna impedance is 50 ohms.
List of all Antennas Acceptable for use with the Transmitter
1) LS Research 001-0001 center-fed dipole antenna and LS Research 080-0001 U.FL to Reverse
Polarity SMA connector cable.
2) Johanson 2450AT43B100 chip antenna.
Cet appareil est conforme aux normes d'Industrie Canada exempts de licence RSS (s). L'opération
est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences
et (2) cet appareil doit accepter toute interférence, y compris les interférences qui peuvent causer un
mauvais fonctionnement de l'appareil.
Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre
choisis de manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle
permise pour une communication réussie.
Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximum de
2,0 dBi (LSR dipôle) et1.3dBi (Chip Johanson). Antennes pas inclus danscette liste ou d'avoir un gain
supérieur à 2,0 dBi et-1.3dBi sont strictement interdites pour l'utilisation avec cet appareil. L'impédance
d'antenne requise est de 50 ohms.
Liste de toutes les antennes acceptables pour une utilisation avec l'émetteur
1) LS Research 001-0001 alimenté par le centre antenne dipôle et LS Research 080-0001
U.FL d'inversion de polarité du câble connecteur SMA.
2) Antenne Johanson puce 2450AT43B100.
TiWi-uB2 / uBleu2 Module
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OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA
REGULATIONS
The TiWi-uB2 Module has been certified for integration into products only by OEM integrators under the
following conditions:
The antennas for this transmitter must not be co-located with any other transmitters except in
accordance with FCC and Industry Canda multi-transmitter procedures. Co-location means having a
separation distance of less than 20 cm between transmitting antennas.
As long as the two conditions above are met, further transmitter testing will not be required.
However, the OEM integrator is still responsible for testing their end-product for any additional
compliance requirements required with this module installed (for example, digital device
emissions, PC peripheral requirements, etc.).
IMPORTANT NOTE: In the event that these conditions cannot be met (for certain
configurations or co-location with another transmitter), then the FCC and Industry
Canada authorizations are no longer considered valid and the FCC ID and IC Certification
Number cannot be used on the final product. In these circumstances, the OEM integrator
will be responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate FCC and Industry Canada authorization.
Le module de TiWi-uB2 a été certifié pour l'intégration dans des produits uniquement par des
intégrateurs OEM dans les conditions suivantes:
Les antennes pour ce transmetteur ne doit pas être co-localisés avec les autres émetteurs sauf en
conformité avec la FCC et Industrie Canada multi-émetteur procédures. Co-localisation des moyens
ayant une distance de séparation inférieure à 20 cm entre les antennes d'émission.
Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne
seront pas tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour
toutes les exigences de conformité supplémentaires requis avec ce module installé (par exemple, les
émissions appareil numérique, les exigences de périphériques PC, etc.)
NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour
certaines configurations ou de co-implantation avec un autre émetteur), puis la FCC et
Industrie autorisations Canada ne sont plus considérés comme valides et l'ID de la FCC
et IC numéro de certification ne peut pas être utilisé sur la produit final. Dans ces
circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris
l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation.
TiWi-uB2 / uBleu2 Module
DATASHEET
The information in this document is subject to change without notice.
TiWi-uB2 uBleu2 Datasheet Copyright © 2012 LS Research, LLC Page 21 of 25
OEM LABELING REQUIREMENTS FOR END-PRODUCT
The TiWi-uB2 module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC
certification numbers are not visible when the module is installed inside another device, as such the
end device into which the module is installed must display a label referring to the enclosed module.
The final end product must be labeled in a visible area with the following:
“Contains Transmitter Module FCC ID: TFB-BT1”
“Contains Transmitter Module IC: 5969A-BT1”
or
“Contains FCC ID: TFB-BT1”
“Contains IC: 5969A-BT1”
The OEM of the TiWi-uB2 Module must only use the approved antenna(s) listed above, which have
been certified with this module.
Le module de TiWi-uB2 est étiqueté avec son propre ID de la FCC et IC numéro de
certification. L'ID de la FCC et IC numéros de certification ne sont pas visibles lorsque le module
est installé à l'intérieur d'un autre appareil, comme par exemple le terminal dans lequel le module est
installé doit afficher une etiquette faisant référence au module ci-joint. Le produit final doit être
étiqueté dans un endroit visible par le suivant:
“Contient Module émetteur FCC ID: TFB-BT1"
“Contient Module émetteur IC: 5969A-BT1"
ou
“Contient FCC ID: TFB-BT1"
“Contient IC: 5969A-BT1"
Les OEM du module TiWi-uB2 ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été
certifiés avec ce module.
TiWi-uB2 / uBleu2 Module
DATASHEET
The information in this document is subject to change without notice.
TiWi-uB2 uBleu2 Datasheet Copyright © 2012 LS Research, LLC Page 22 of 25
OEM END PRODUCT USER MANUAL STATEMENTS
The OEM integrator should not provide information to the end user regarding how to install or remove
this RF module or change RF related parameters in the user manual of the end product.
Other user manual statements may apply.
L'intégrateur OEM ne devraient pas fournir des informations à l'utilisateur final sur la façon d'installer ou
de supprimer ce module RF ou modifier les paramètres liés RF dans le manuel utilisateur du produit
final.
Autres déclarations manuel de l'utilisateur peuvent s'appliquer.
TiWi-uB2 / uBleu2 Module
DATASHEET
The information in this document is subject to change without notice.
TiWi-uB2 uBleu2 Datasheet Copyright © 2012 LS Research, LLC Page 23 of 25
MECHANICAL DATA
Figure 7 Module Mechanical Dimensions
TiWi-uB2 / uBleu2 Module
DATASHEET
The information in this document is subject to change without notice.
TiWi-uB2 uBleu2 Datasheet Copyright © 2012 LS Research, LLC Page 24 of 25
Figure 8 Soldering Footprint for Host Board and Module Placement
TiWi-uB2 / uBleu2 Module
DATASHEET
The information in this document is subject to change without notice.
TiWi-uB2 uBleu2 Datasheet Copyright © 2012 LS Research, LLC Page 25 of 25
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