Laird Connectivity BT900 Bluetooth Dual Mode UART AT featuring smartBASIC User Manual BT900

Laird Technologies Bluetooth Dual Mode UART AT featuring smartBASIC BT900

User manual

Intelligent BTv4.0 Dual-Mode Module Part # BT900-SA-0x, BT900-SC-0x HARDWARE INTEGRATION GUIDE VERSION 0.2 Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 2 CONN-HIG-BT900 REVISION HISTORY Version Revision Date Change History 0.1 TBD Initial Preliminary Version 0.2 19May14 Draft version
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 3 CONN-HIG-BT900 CONTENTS Revision History ..................................................................................................................... 2 Contents ................................................................................................................................ 3 1 Overview and Key Features ................................................................................................ 5 1.1 Features & Benefits ..................................................................................................................... 5 1.2 Application Areas ....................................................................................................................... 5 2 Specification ..................................................................................................................... 7 2.1 Specification Summary .............................................................................................................. 7 3 Hardware Specifications .................................................................................................... 9 3.1 Block Diagram and Pin-out ....................................................................................................... 9 3.2 Pin Definitions ............................................................................................................................ 10 3.3 Electrical Specifications ........................................................................................................... 12 3.3.1 Absolute Maximum ratings ......................................................................................... 12 3.3.2 Recommended Operating Parameters ................................................................... 13 3.3.3 nAutoRUN pin and Operating Modes ...................................................................... 15 3.3.4 OTA (Over the Air) smart BASIC application download ......................................... 15 4 Power Consumption ........................................................................................................ 17 4.1 Power Consumption ................................................................................................................. 17 4.2 Measured Peak Current Waveforms During BLE Advertising and Connection .............. 19 4.3 Peripheral block current consumption .................................................................................. 22 5 Functional Description .................................................................................................... 23 5.1 Power management (includes brown-out and power on reset) ....................................... 23 5.2 Clocks and TIMERS .................................................................................................................... 23 5.2.1 Clocks ........................................................................................................................... 23 5.2.2 TIMERS ........................................................................................................................... 23 5.3 Memory for smart BASIC Application Code ......................................................................... 24 5.4 RF ................................................................................................................................................ 24 5.5 UART Interface .......................................................................................................................... 24 5.6 SPI Bus ......................................................................................................................................... 25 5.7 I2C Interface ............................................................................................................................. 25 5.8 General Purpose I/O, ADC and Quadrature Decoder ....................................................... 27 5.8.1 GPIO .............................................................................................................................. 27 5.8.2 Quadrature Decoder .................................................................................................. 27 5.8.3 ADC ............................................................................................................................... 27 5.8.4 APWM and FREQ signal output on upto xSIO pins .................................................. 27 5.9 nRESET pin .................................................................................................................................. 28 5.10 nAutoRUN pin ............................................................................................................................ 28
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 4 CONN-HIG-BT900 5.11 smartBASIC runtime engine firmware upgrade .................................................................... 28 5.12 BT900-SA on-board chip antenna characteristics ................................................................ 28 6 Hardware Integration Suggestions ................................................................................... 30 6.1 Circuit ......................................................................................................................................... 30 6.2 PCB Layout on Host PCB - General ........................................................................................ 31 6.3 PCB Layout on Host PCB for BT900-SA .................................................................................... 32 6.3.1 Antenna keep-out on host PCB ................................................................................. 32 6.3.2 Antenna keep-out and Proximity to Metal or Plastic .............................................. 33 6.4 External Antenna Integration with BT900-SC ......................................................................... 33 7 Mechanical Details .......................................................................................................... 35 7.1 BT900 Mechanical Details ........................................................................................................ 35 7.2 Host PCB Land Pattern and Antenna Keep-out for BT900-SA ............................................. 36 8 Application Note for Surface Mount Modules ................................................................... 38 8.1 Introduction ............................................................................................................................... 38 8.2 Shipping ..................................................................................................................................... 39 8.3 Reflow Parameters ................................................................................................................... 39 9 FCC and IC Regulatory Statements ................................................................................... 41 9.1 Power Exposure Information .................................................................................................... 41 9.2 OEM Responsibilities ................................................................................................................. 42 10 Japan (MIC) Regulatory .................................................................................................... 44 10.1 Antenna Information ................................................................................................................ 44 11 CE Regulatory ................................................................................................................. 45 11.1 Antenna Information ................................................................................................................ 45 12 EU Declarations of Conformity ......................................................................................... 46 12.1 BT900-SA / BT900-SC .................................................................................................................. 46 13 Ordering Information ...................................................................................................... 47 13.1 General Comments ................................................................................................................. 47 14 Bluetooth SIG Qualification .............................................................................................. 47 Additional Assistance ......................................................................................................................... 48
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 5 CONN-HIG-BT900 1 OVERVIEW AND KEY FEATURES BT900 Series modules from Laird Technologies make it easy to add Classic BT and Bluetooth Low Energy (BLE) functionality to small, portable, power-conscious devices, including those powered by batteries. The fully approved, programmable module feature Laird’s innovative, event-driven smartBASIC programming language, which significantly reduces OEM development risk and speeds time to market. Based on the Cambridge Silicon Radio (CSR) 8811 silicon and a low power Cortex M3 microcontroller, the BT900 modules provide exceptionally low power consumption with outstanding wireless range, all within a compact footprint of 19 mm x 12.5 mm. The modules incorporate all the hardware and firmware required to support development of Dual Mode applications, including:  Complete radio hardware  UART, I2C, SPI, ADC, PCM and GPIO interfaces  Embedded BTv4.0 software stack  Classic BT profile - SPP  GATT Client & Peripheral Modes What makes the modules truly innovative is smartBASIC, an event-driven programming language that enables standalone operation of the module. Laird has extended the implementation of smartBASIC from the popular BL6xx series of single mode BLE modules into the BT900 series. This allows developers the flexibility of utilising the Core and BLE specific smartBASIC functions from the BL6xx series to create fully interchangeable BLE applications between these product ranges. Without the need for any external processor, a simple smartBASIC application encapsulates the complete end-to-end process of reading, writing, and processing of sensor data and then using Classic Bluetooth or BLE to transfer it to / from any Bluetooth device. Ultimately smartBASIC accelerates initial development, creation of prototypes, and mass production by providing you with your own Bluetooth expert within the module. In addition to carrying FCC modular, IC, CE and MIC approvals, BT900 modules are fully qualified as a Bluetooth product, enabling designers to integrate the modules in devices without the need for further Bluetooth testing. A low-cost developer’s kit including simple software tools simplifies module integration and guarantees the fastest route to market. 1.1 Features & Benefits 1.2 Application Areas  Bluetooth v4.0 - Dual Mode (Classic Bluetooth and BLE)  External or Internal Antennas  smartBASIC programming language  Full Bluetooth EPL  Compact Footprint  Programmable TX power 8dBm to -20dBm  RX sensitivity: -90dBm  Ultra low power consumption  TX: 85 mA peak (at +8dBm)  Standby Doze: 227 uA (refer to Note4 in Power Consumption section)  Deep Sleep: 7uA  UART, GPIO, ADC, PWM, FREQ output, TIMERS, I2C, and SPI interfaces  Medical devices  Wellness devices  Automotive Diagnostic Equipment  Bar Code Scanners  Industrial Cable Replacement  Home automation
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 6 CONN-HIG-BT900  Fast Time to Market  FCC, CE, IC, and Japan certified; other regulatory certifications on request  No external components required
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 7 CONN-HIG-BT900 2 SPECIFICATION 2.1 Specification Summary Table 1: Specifications CATEGORIES FEATURE IMPLEMENTATION Wireless Specification Bluetooth® V4.0 – Dual-Mode Frequency 2.402 - 2.480 GHz Transmit Power + 8dBm (maximum) Configurable down to -20dBm Receive Sensitivity -90 dBm (typical) Link Budget 98 dB Raw Data Rates (Air) 3 Mbps (Classic BT – BR/EDR) Host Interface and Peripherals UART Interface TX, RX, CTS, RTS DTR, DSR, DCD, RI can be implemented in smartBASIC- using General Purpose I/O Default 9600, N, ,8, 1 From 1,200 to 4 Mbps RX buffer size (TBD) GPIO 18 (maximum – configurable) lines. O/P drive strength (4mA) Pull-up resistor (33KOhms) control (via smartBASIC) Read pin-level I2C Interface 1 (configurable from GPIO total). Upto 400kbps. SPI 1 (configurable from GPIO total) Upto 4Mbps. ADC Interface 2 channels (configured from GPIO total). Up to 12-bit resolution Conversion time 2.0uS (at 2.7V to 3.6V) x.xV internal reference 1/1, 2/3, 1/3 pre-scaling PWM or FREQ output Output a PWM or FREQ on upto 2 GPIO output pins. PWM output duty cycle: 0%-100% PWM output frequency: TBD FREQ output frequency: 0MHz to xMHz (50% duty cycle) PCM Interface 1 Wi-Fi-BT coexistence 3 dedicated pins Profiles Classic Bluetooth SPP (Serial Port Profile) Bluetooth Low Energy GATT Client & Peripheral – Any Custom Services Programmability smartBASIC On-board programming language similar to BASIC smartBASIC application Via UART or Over the Air Control Protocols Any that can be implemented using smartBASIC vSP – Virtual Serial Port for BLE FW upgrade smartBASIC runtime engine FW upgrade Via UART Coexistence 802.11 (Wi-Fi) 2 and 3 wire CSR schemes supported (Unity-3;Unity-3e, Unity 3e+, Unity 3+ and Unity+) Operating Modes Self-contained Run Mode Selected by nAutoRUN pin status: LOW(0V). Then runs $autorun$ (smartBASIC application) if it exists.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 8 CONN-HIG-BT900 Interactive Development Mode HIGH(VCC). Then runs via at+run (and “file name” of smartBASIC application script). Supply Voltage Supply 1.8V – 3.6V Power Consumption Current Max Peak Current (TX Power @ +8dBm TX): 85mA Standby Doze (waitevent) – 227uA (internal 32.768kHz) Standby Doze (waitevent) – 113uA (external 32.768kHz, Note5) Deep Sleep – 7uA Physical Dimensions 19 mm x 12.5 mm x 2.5 mm; Pad Pitch 0.8 mm Environmental Operating -40°C to +85°C Storage -40°C to +85°C Miscellaneous Lead Free Lead-free and RoHS compliant Warranty 1 Year Development Tools Development Kit Development board and free Software Tools Software Tools Utilities Windows, Android and iOS applications UART Firmware Upgrade Approvals Bluetooth® Complete Declaration ID FCC / IC / CE / MIC All BT900 Series Note 1: DSR, DTR, RI, and DCD can be implemented in the smart BASIC application. Note 2: With I2C interface selected, pull-up resistors on I2C SDA and I2C SCL MUST be connected externally as per I2C standard. Note 3: SPI interface consists of SPI MOSI, SPI MISO and SPI CLK. SPI CS is created by customer using any spare SIO pin within their smartBASIC application script allowing multi-dropping. Note 4: BT900 module comes loaded with smart BASIC runtime engine FW, but does not come loaded with any smart BASIC application script (as that is dependent on customer end application or use). Laird provides many sample smart BASIC application scripts covering the services listed. Additional BLE services being added every quarter. Note 5: 227uA is when the internal radio chip 32.768kHz is used. 113uA is when external 32.768kHz oscillator is connected to BT900 (radio chip) pin34(BT_Ext_DS_CLK).
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 9 CONN-HIG-BT900 3 HARDWARE SPECIFICATIONS 3.1 Block Diagram and Pin-out smartBASICrun-time engine(provides safe access to BT/BLE stack, drivers and non-vol stores)Non-VolFileSystemforsmartBASICAppsNon-VolDataStoreI/O, UART,I2C,SPI DriversUART ADC I2C SPIOR UFLInternalAntenna47 connection padsRAMFlashGPIO/PWMBlutooth 4.0 Radio( Classic BT & BLE )User smartBASIC ApplicationExample App PRINT "Laird BT900 Module" WaitEventBluetooth Classic&Bluetooth Low EnergyStackSerial Flash(SPI)ARM Cortex M3runningsmartBASIC32.768KhzCrystal Figure 1: Functional HW and SW block Diagram for BT900 series Dual-Mode BT/ BLE smartBASIC module Figure 2: BT900-Sx module pin-out (top view).
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 10 CONN-HIG-BT900 3.2 Pin Definitions Table 2: Pin definitions Pin # Pin Designation Default Function Alternate Function Default Direction Supply Domain Pull-up or pull down Notes Comment 1 UART_CTS UART SIO_3 IN VCC TBD 2 SIO_4 DIO ? IN VCC TBD 1,2,3,4,5 Laird Devkit : UART_DTR via CON12 3 nAutoRUN IN VCC In ONLY Laird Devkit: UART_DSR via CON12??? 4 SIO_5 DIO ? IN VCC TBD 1,2,3,4,5 Laird Devkit : UART_DCD via CON12 5 VCC 1.75V-3.3V 6 GND 7 SIO_6 DIO SPI MISO IN VCC TBD 1,2,3,4,5 SPIOPEN() in smartBASIC selects SPI function, MOSI and CLK will be outputs when in SPI master mode. See Note 11?.8 SIO_7 DIO SPI MOSI IN VCC TBD 1,2,4,5,6 9 SIO_8 DIO IN VCC TBD 1,2, 12 Laird Devkit : UART_RI via CON12 10 SIO_9 DIO SPI CLK IN VCC TBD 1,2,4,5,6 11 SIO_10 DIO I2C SDA IN VCC TBD 1,2,4,5,6 I2COPEN() in smartBASIC selects I2C function 12 SIO_11 DIO I2C SCL IN VCC TBD 1,2,4,5,6 13 GND 14 SIO_12 DIO IN VCC TBD 1,2,4,5,6 Laird Devkit : Buzzer output 15 SIO_13 DIO IN VCC TBD 1,2,4,5,6 Laird Devkit : Button1 input 16 nRESET IN VCC TBD 9,10 System Reset (Active low) 17 SIO_14 DIO SWDIO IN VCC TBD 18 SIO_15 DIO IN VCC TBD 1,2 19 SIO_16 DIO SWCLK IN VCC TBD 1,2 20 SIO_17 DIO IN VCC TBD 1,2 Laird Devkit : LED121 SIO_18 DIO IN VCC TBD 1,2 Laird Devkit : LED222 SIO_19 DIO IN VCC TBD
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 11 CONN-HIG-BT900 Pin # Pin Designation Default Function Alternate Function Default Direction Supply Domain Pull-up or pull down Notes Comment 23 GND 24 SIO_20 DIO AIN(ADC01) IN VCC TBD 1,2 Laird Devkit : Button2 input 25 SIO_21 DIO AIN(ADC00) IN VCC TBD 1,2 26 AVCC IN 1.7V-3.6V 1,2 27 NC NC Reserved for future use. Do NOT connect.28 AVREF 29 GND 30 GND 8 31 BT_VREG_IN_HV 3.3V TBD 32 BT_VREG_OUT_HV DIO 1.8V TBD 1,2,4,6,7 33 GND DIO 1,2,4,6,7 34 BT_Ext_DS_CLK DIO IN BT_VDD_IO TBD 1,2,4,6,7 35 BT_PCM_OUT DIO OUT BT_VDD_IO TBD 1,2,4,6,7 36 BT_PCM_SYNC DIO ? BT_VDD_IO TBD 1,2 37 BT_PCM_CLK OUT BT_VDD_IO TBD 38 BT_PCM_IN NC IN BT_VDD_IO TBD 39 BT_ACTIVE NC ? BT_VDD_IO TBD 40 WLAN_ACTIVE ? BT_VDD_IO TBD 41 BT_PCM#SEL DIO IN BT_VDD_IO TBD 1,2 42 BT_PRIORITY DIO ? BT_VDD_IO TBD 1,2 43 BT_VDD_IO 3.3V or 1.8V 44 UART_RX DIO SIO_0 IN VCC TBD 1,2,4,6,7 UARTCLOSE() selects DIO functionality and UARTOPEN() selects uart comms behaviour45 UART_TX DIO SIO_1 OUT VCC TBD 1,2,4,6,7 46 UART_RTS DIO SIO_2 OUT VCC TBD 1,2,4,6,7 47 GND Note 1: Secondary function is selectable in smartBASIC application. Note 2: DIO = Digital Input or Output. I/O voltage level tracks VCC. Note 3: AIN = Analog Input Note 4: DIO or AIN functionality is selected using the GpioSetFunc() function in smartBASIC. Note 5: AIN configuration selected using GpioSetFunc() function. Note 6: I2C, UART, SPI controlled by xxxOPEN() functions in smart BASIC. Note 7: SIO_0 to SIO_3 are DIO by default when $autorun$ app runs on power up. Note 9: Pull the nRESET pin low for minimum 100 mS (TBD) in order for the BT900 to reset.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 12 CONN-HIG-BT900 Note10: SPI CS is created by customer using any spare SIO pin within their smartBASIC application script allowing multi-dropping. Note11: SIO_TBD pin has to be pulled high externally to enable OTA (over the Air) smartBASIC application download. Refer to the latest FW release documentation for details. The BT900 module is delivered with the integrated smart BASIC runtime engine FW loaded (but no onboard smartBASIC application script). Because of this, it starts up in AT command mode by default. At reset, all SIO lines are configured as the defaults shown above. SIO lines can be configured through the smart BASIC application script to be either inputs or outputs with pull-ups or none. When an alternative SIO function is selected (such as I2C or SPI), the firmware does not allow the setup of internal pull-up. Therefore, when I2C interface is selected, pull-up resistors on I2C SDA and I2C SCL MUST be connected externally as per I2C standard. All the SIO pins (with a default function of DIO are inputs – with no internal pull-up apart from SIO_1 and SIO_3, which are outputs):  SIO_1 (alternative function UART_TX) is an output, set high (in FW).  SIO_2 (alternative function UART_RTS) is an output, set low (in FW).  SIO_0 (alternative function UART_RX) is an input, set with internal weak pull-up (in FW).  SIO_3 (alternative function UART_CTS) is an input, set with internal weak pull-down (in FW).  SIO_7 is an input, set with internal pull-down (in FW). It is used for over the air downloading of smart BASIC applications. Refer to the latest FW release documentation for details. UART_RX, UART_TX, UART_CTS are 3.3 V level logic (if VCC is 3.3 V, i.e. SIO pin I/O levels track VCC). For example, when RX and TX are idle, they sit at 3.3 V (if VCC is 3.3 V). Conversely, handshaking pins CTS and RTS at 0 V are treated as assertions. Pin 3 (nAutoRUN) is an input, with active low logic. In the development kit (DVK-BT900-sx) it is connected so that the state is driven by the host’s DTR output line. The nAutoRUN pin must be externally held high or low to select between the following two BT900 operating modes:  Self-contained Run mode (nAutoRUN pin held at 0 V).  Interactive / development mode (nAutoRUN pin held at VCC). smartBASIC runtime engine firmware checks for the status of nAutoRUN during power-up or reset. If it is low and if there is a smartBASIC application script named $autorun$, then the smartBASIC runtime engine FW executes the application script automatically; hence the name Self-contained Run Mode. 3.3 Electrical Specifications 3.3.1 Absolute Maximum ratings Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the module are listed below; exceeding these values causes permanent damage. Table 3: Maximum Current Ratings Parameter Min Max Unit Voltage at VCC pin -0.3 +3.6 V AVCC VSS-0.5 VSS+4.6 V AVREF VSS-0.5 VSS+4.6 V BT_VREG_IN_HV 2.3 4.8 V
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 13 CONN-HIG-BT900 BT_VREG_OUT_HV 1.7 2.0 V BT_VDD_IO -0.4 3.6 V Voltage at GND pin 0 V Voltage at SIO pin -0.3 VCC+0.3 V Storage temperature -40 +85 ºC 3.3.2 Recommended Operating Parameters Table 4: Power Supply Operating Parameters Parameter Min Typ Max Unit VCC1 (Note1) 1.75 3.3 3.6 V AVCC1 (AVCC=VCC) Note1 1.75 3.3 3.6 V AVREF1 (when AVCC>=2.7V AVREF1 (when AVCC<2.7V) 2.7V AVCC AVCC AVCC V VCC Maximum ripple or noise2 <10%of VCC % VCC rise time (0 to 1.8V)2 VCC shut down time (1.8V to 0V)2 0.1 1 mS mS Operating Temperature Range -40 - +85 ºC BT_VREG_IN_HV4 2.3 3.6 V BT_VREG_OUT_HV4 1.75 1.95 V BT_VDD_IO 1.2 3.6 V Note 1: Notes on power on. Turn on/off in the following order or at same time. Turning on: VCCAVCCAVRH. Turning off: AVRHAVCCVCC. If not using the ADC convertor, connect AVCC=VCC. Note 2: The maximum VCC ripple or noise (at any frequency) should not exceed 10% of VCC. Ensure transient fluctuation rate does not exceed 0.1V/uS. Note 3: nRESET input time is minimum 500nS. The on-board power-on reset circuitry may not work for rise times outside the noted interval. Time reset is active from VCC reaches 1.75 V with x mS rise time is v mS typical. Time reset is active from VCC reaches 1.75 V with y uS rise time is z mS typical. Note4: BT radio chip in the BT900 has two internal regulators, a high voltage (input pin BT_VREG_IN_HV) and low voltage (input pin BT_VREG_OUT_HV) regulator. ONLY one regulator can be used to power radio chip. Method1: If BT900 is required to operate from 3.3V, connect external 3.3V supply to pin31 BT_VREG_IN_HV and MUST leave pin32 BT_VREG_OUT_HV unconnected. Pin5(VCC) and pin43(BT_VDD_IO) should be connected to pin31 BT_VREG_IN_HV. Method2: If BT900 is required to operate from 1.8V, connect external 1.8V supply to pin32 BT_VREG_OUT_HV and MUST leave pin31 BT_VREG_IN_HV unconnected. Pin5(VCC) and pin43(BT_VDD_IO) should be connected to pin32 BT_VREG_OUT_HV. Table 5: Signal Levels for Interface, SIO Parameter Condition Min Typ Max Unit VIH Input high voltage VCC<2.7V VCC>=2.7V 0.7VxCC 0.8VxCC VCC+0.3 VCC+0.3 V
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 14 CONN-HIG-BT900 VIL Input low voltage VCC<2.7V VCC>=2.7V VSS-0.3 0.3xVCC 0.2xVCC V V VOH Output high voltage (std. drive, 4mA) VCC<2.7V VCC>=2.7V VCC-0.45 VCC-0.5 VCC VCC V V VOL Output low voltage (std. drive, 4mA) VCC<2.7V VCC>=2.7V VSS VSS 0.4 0.4 V V Pull up resistance VCC<2.7V VCC>=2.7V - 21 - 33 134 66 kΩ kΩ Input capacitance 5 15 pF Note 1: Maximum number of pins with 4 mA drive is TBD. Table 6: SIO pin alternative function AIN (ADC) specification Parameter Min Typ Max Unit AVCC1 (AVCC=VCC) 1.75 3.3 3.6 V AVCC current draw(ADC 1 unit operation) 1 AVCC current draw (ADC stop) 0.27 0.03 0.42 10 mA uA AVREF1 (when AVCC>=2.7V AVREF1 (when AVCC<2.7V) 2.7V AVCC AVCC AVCC V AVREF current draw (ADC 1 unit operation) AVREF current draw (ADC stop) 0.72 0.02 1.29 2.6 mA uA ADC input pin (AIN) voltage maximum VSS AVREF V ADC input port (AIN) current draw 5 uA Time required to convert single sample 12bit mode 2 10 uS ADC input resistor impedance (during operation)3 AVCC≥2.7V 1.8V≤AVCC<2.7V ADC input capacitance impedance (during operation)3 2.2 5.5-10.5 kOhm kOhm 9.4 pF Note 1: TBD Note 2: Currently, the smartBASIC runtime engine firmware allows 12-bit mode. Note 3: ADC input impedance is estimated mean impedance of the ADC (AIN) pins. The ADC is highly sensitive to the impedance of the source. The ADC (AIN) input impedance is 2.2-10.5k. Normally, when not sampling, the ADC (AIN) impedance will have very high value and can consider it to be an open circuit. The moment ADC is sampling, ADC(AIN) impedance is 2.2-10.5k.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 15 CONN-HIG-BT900 Rext: Output impedance of external circuit (kOhms) Rext: Sampling time (nS) Ts ≥ (RAIN + Rext) x CAIN x 9 RAIN: Input resistor of ADC(kOhms)=2.2kOhms at 2.7V≤AVCC≤3.6V Input resistor of ADC(kOhms)=5.5kOhms at 1.8V≤AVCC≤2.7V CAIN: Input capacity of ADC(pF)=9.4pF at 1.8V≤AVCC≤3.6V 3.3.3 nAutoRUN pin and Operating Modes Operating modes (refer to the smart BASIC manual for details):  Self-contained mode  Interactive / Development mode Table 7: nAutoRUN pin Signal Name Pin No I/O Comments nAutoRUN 3 I Input with active low logic. Operating mode selected by nAutoRun pin status: If Low (0V), runs $autorun$ if it exists; If High (VCC), runs via at+run (and “file name” of application). Pin 3 (nAutoRUN) is an input, with active low logic. In the development board (DVK-BT900-sx) it is connected so that the state is driven by the host’s DTR output line. nAutoRUN pin needs to be externally held high or low to select between the two BT900 operating modes:  Self-contained Run mode (nAutoRUN pin held at 0V).  Interactive / Development mode (nAutoRUN pin held at VCC). smartBASIC runtime engine firmware checks for the status of nAutoRUN during power-up or reset. If it is low and if there is a smartBASIC application named $autorun$ then the smartBASIC runtime engine executes the application automatically; hence the name self-contained run mode. 3.3.4 OTA (Over the Air) smart BASIC application download In future release this feature will be available.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 16 CONN-HIG-BT900 Refer to latest FW release (TBD) documentation (FW release notes and smart BASIC user manual) for initial details.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 17 CONN-HIG-BT900 Table 8: OTA mode Signal Name Pin No I/O Comments (SIO_TBD) 9 I Internal pull down (default). OTA mode selected by externally pulling SIO_7 pin: High (VCC), then OTA smart BASIC application download is possible. The OTA smart BASIC application download feature can be useful for a customer’s production because it allows the module to be soldered into an end product without preconfiguration; the application can then be downloaded over the air once the product has been pre-tested. Note: It is the smart BASIC application that is downloaded over the air and NOT the firmware. Due to this principle reason for use in production, to facilitate multiple programming stations in a locality the transmit power is limited (to lower Tx power), refer to smart BASIC user manual for more details. 4 POWER CONSUMPTION Data taken at VCC 3.3V and 25ºC. 4.1 Power Consumption Table 9: Power consumption Parameter Min Typ Max Unit Active Peak current –Note1 TX only run peak current @TXpwr= +8 dBm TX only run peak current @T pwr= +4 dBm TX only run peak current @TXpwr= 0 dBm TX only run peak current @TXpwr= -4 dBm TX only run peak current @TXpwr= -8 dBm TX only run peak current @TXpwr= -12 dBm TX only run peak current @TXpwr= -16 dBm T X only run peak current @TXpwr= -20 dBm 85 71 61 55 52 49 48 mA mA mA mA mA mA mA Active Mode RX only ‘peak’ current (Note2) TBD mA Ultra Low Power Mode1(Note3) Standby Doze (waitevent) Standby Doze (waitevent)-Note3 227 113 uA uA Ultra Low Power Mode2(Note4) Deep Sleep (no RAM retention) 7 (Note 4) uA BLE Mode Active Mode Average current (Note5) Advertising Average Current draw TBD uA
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 18 CONN-HIG-BT900 Parameter Min Typ Max Unit Max, with advertising interval (min) 20 mS Min, with advertising interval (max) 10240 mS Connection Average Current draw Max, with connection interval (min) 7.5 mS with connection interval 67.5 mS Min, with connection interval (max) 4000 mS TBD TBD TBD uA uA uA uA Note 1: Note 2: Firmware version Note 3: Standby Doze is entered automatically (when waitevent statement is encountered within a smartBASIC application script). In Standby Doze, all peripherals that are enabled stay on and may re-awaken the chip. Depending on active peripherals, current consumption ranges from ~xx µA to > 1 mA. See individual peripherals current consumption in tables in section Peripheral block current consumption 4.3. External supplied Sleep Clock oscillator for BT Radio chip sleep modes (BT900 pin34, BT_Ext_DS_CLK). There is current consumption saving of 114uA when using external 32.768kHz. 227uA is when the internal radio chip 32.768kHz is used. 113uA is when external 32.768kHz oscillator is connected to BT900 (radio chip) pin34(BT_Ext_DS_CLK). PSKey needs to be changed via smartBASIC command. Note 4: In Deep Sleep, everything is disabled and the only wake-up sources are reset and changed on pins on which sense is enabled. The current consumption seen is ~7uA typical. Current smart BASIC runtime engine firmware (v9.x.y.z) requires a hardware reset to come out of deep sleep. Future firmware releases allow coming out from Deep Sleep to Standby Doze through GPIO signal through the reset vector. Deep Sleep mode is entered (with a command in smart BASIC application script). Note 5: BLE radio taken with TX power 8 dBm and all peripherals off (UART OFF after radio event), slave latency of 0 (in a connection). Average current consumption depends on a number of factors [including TX power, VCC accuracy of 26 MHz and 32.768 kHz). With these factors fixed, the largest variable is the advertising or connection interval set. Advertising Interval range: 20 ms to 10240 ms in multiples of 0.625 ms for Advert type=ADV_IND and ADV_DIRECT_IND. 100 ms to 10240 ms in multiples of 0.625 ms for Advert type=ADV_SCAN_IND and ADV_NONCONN_IND. For advertising timeout, if the advert type is ADV_DIRECT_IND, then the timeout is limited to 1.28 seconds (1280 ms). For an advertising event, - the minimum average current consumption is when the advertising interval is large 10240 mS (although this may cause long discover times (for the advertising event) by scanners - the maximum average current consumption is when the advertising interval is small 20 mS
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 19 CONN-HIG-BT900 Other factors that are also related to average current consumption include the advertising payload bytes in each advertising packet and whether continuously advertising or periodically advertising. Connection Interval range - 7.5 ms to 4000 ms in multiples of 1.25 ms. For a connection event, - the minimum average current consumption is when the connection interval is large 4000 mS – the maximum average current consumption is with the shortest connection interval of 7.5 ms; no slave latency. Other factors that are also related to average current consumption include whether transmitting 6 packets per connection interval & each packet contains 20 bytes (which is the maximum for each packet) and an inaccurate 32 kHz master clock accuracy would increase the average current consumption. 4.2 Measured Peak Current Waveforms During BLE Advertising and Connection Error! Reference source not found. illustrates current waveforms observed as the BT900 module performs advertising and connection functionality. Figure 3: Typical peak current consumption profile during advertising in slave mode @ TX PWR +8dBm. UART is OFF. 8 Figure 4: Typical peak current consumption profile during data connection event in slave mode @ TX PWR +8dBm. UART is ON.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 20 CONN-HIG-BT900 4 dBm 0 dBm -4 dBm -8 dBm -12 dBm -16 dBm -20 dBm Figure 5: Typical peak current consumption profile during advertising in slave mode versus TX PWR Note: In the above pictures, UART is ON. X-axis time (1 mS per square), Y-axis current (2 mA per square).
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 21 CONN-HIG-BT900 4dBm 0dBm -4dBm -8dBm -12dBm -16dBm -20dBm Figure 6: Typical peak current consumption profile during connection event in slave mode versus TX PWR. Figure 7: Note: In the above pictures, UART is ON. X-axis time (1 mS per square), Y-axis current (2 mA per square).
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 22 CONN-HIG-BT900 4.3 Peripheral block current consumption The values below are calculated for a typical operating voltage of 3 V. Table 10: UART Power Consumption Parameter Min Typ Max Unit UART Run current @ 115200 bps xxx uA UART Run current @ 1200 bps xxx uA UART Baud rate 1.2 115.2 kbps Table 11: SPI Power Consumption Parameter Min Typ Max Unit SPI Master Run current @ 125 kbps xxx uA SPI Master Run current @ 4 Mbps xxx uA SPI bit rate 0.125 8 Mbps Table 12: I2C Power Consumption Parameter Min Typ Max Unit I2C Run current @ 100 kbps xxx uA I2C Run current @ 400 bps xxx uA I2C Bit rate 100 400 kbps Table 13: ADC Parameter Min Typ Max Unit ADC current during conversion xxx uA The above current consumption is for the particular peripheral only and to operate that peripheral requires some other internal blocks which consume fixed amount of base current (~xxxuA). This base current of ~xxxx uA is consumed when the UART, SPI, I2C, or ADC is opened (operated). For asynchronous interface like the UART (asynchronous as the other end can communicate at any time), the UART (on BT900) must kept open (by a command in smart BASIC application script) resulting in the base current consumption penalty. For synchronous interface like the I2C or SPI (since BT900 side is the master), the interface can be closed and opened only (by a command in smart BASIC application script) when needed, resulting in current saving (no base current consumption penalty). Similar argument for ADC (open ADC when needed).
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 23 CONN-HIG-BT900 5 FUNCTIONAL DESCRIPTION The BT900 Dual Mode (BT/BLE) module is a self-contained Bluetooth Low Energy product and requires only power and a user’s smartBASIC application to implement full BLE functionality. The integrated, high performance antenna combined with the RF and Base-band circuitry provides the Bluetooth Low Energy wireless link, and any of the SIO lines provide the OEM’s chosen interface connection to the sensors. The user’s smartBASIC application binds the sensors to the BLE wireless functionality. The variety of hardware interfaces and the smartBASIC programming language allow the BT900 module to serve a wide range of wireless applications, whilst reducing overall time to market and the learning curve for developing Dual mode BT/ BLE products. To provide the widest scope for integration a variety of physical host interfaces / sensors are provided. The major BT900 series module functional blocks described below. 5.1 Power management (includes brown-out and power on reset) Power management features:  System Standby Doze / Deep Sleep modes.  Brownout Reset.  Open /Close Peripherals (UART, SPI, I2C, SIO’s and ADC). Peripherals consume current when open; each peripheral can be individually closed to save power consumption (with a command in a smartBASIC application script).  2-region RAM retention (No RAM retention in Deep Sleep mode).  smartBASIC command allows the VCC voltage to be read (through the internal ADC).  Power fail comparator.  Pin wake-up system from Deep sleep. Power supply features:  Supervisor HW to manage power on reset, brownout (and power fail).  1.8V to 3.6V supply range using internal LDO regulator. 5.2 Clocks and TIMERS 5.2.1 Clocks The integrated high accuracy (+/-20ppm) 32.768kHz crystal oscillator provides protocol timing and helps with Radio power consumption in the system Standby Doze /Deep sleep modes by reducing the time that the RX window needs to be open. Standard accuracy clocks tend to have lower accuracy +/-250 ppm. The integrated high accuracy 26 MHz (+/-10ppm) crystal oscillator helps with Radio operation and also helps reduce power consumption in the Active modes. 5.2.2 TIMERS In keeping with the event driven paradigm of smart BASIC, the timer subsystem enables smart BASIC applications to be written which allow future events to be generated based on timeouts. Regular Timer: There are x built-in timers (regular timer) derived from a single RTC clock which are controlled solely by smart BASIC functions. The resolution of the regular timer is xyz microseconds. Tick Timer is a xx bit free running counter that increments every x millisecond. The resolution of this counter is xxx microseconds. This counter can be accessed using the functions GetTickCount() and GetTickSince().
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 24 CONN-HIG-BT900 Refer to the smart BASIC user manual. 5.3 Memory for smart BASIC Application Code User has up to 4Kbytes (TBD) of data memory available for smart BASIC application script. 5.4 RF  2402–2480 MHz Bluetooth4.0 Dual Mode (BT and BLE) (1Mbps to 3Mbps over the air data rate).  TX output power of +8 dBm programmable (via smartBASIC command) to -20 dBm in steps of 4 dB.  Receiver (with integrated channel filters) to achieve maximum sensitivity -90dBm @ 1 Mbps BLE or Classic BT 2Mbps, 3Mbps).  RF conducted interface available in 3-ways: - BT900-SA -RF connected to on-board antenna on BT900-SA - BT900-SC -RF connected to on-board uFL RF connector on BT900-SC  Antenna options: - Integrated monopole chip antenna on BT900-SA - External dipole antenna connected with to uFL RF connector on BT900-SC. 5.5 UART Interface The Universal Asynchronous Receiver/Transmitter offers fast, full-duplex, asynchronous serial communication with built-in flow control support (UART_CTS, UART_RTS) in HW up to 1 Mbps baud. Parity checking and generation for the 9th data bit are supported. UART_TX, UART_RX, UART_RTS, and UART_CTS form a conventional asynchronous serial data port with handshaking. The interface is designed to operate correctly when connected to other UART devices such as the 16550A. The signalling levels are nominal 0 V and 3.3 V (tracks VCC) and are inverted with respect to the signalling on an RS232 cable. Two-way hardware flow control is implemented by UART_RTS and UART_CTS. UART_RTS is an output and UART_CTS is an input. Both are active low. These signals operate according to normal industry convention. UART_RX, UART_TX, UART_CTS, UART_RTS are all 3.3 V level logic (tracks VCC). For example, when RX and TX are idle they sit at 3.3 V. Conversely for handshaking pins CTS, RTS at 0 V is treated as an assertion. The module communicates with the customer application using the following signals:  Port /TXD of the application sends data to the module’s UART_RX signal line  Port /RXD of the application receives data from the module’s UART_TX signal line BT900 UART_TX UART_RX UART_CTS UART_RTS Application - Host /RXD /TXD /RTS /CTS
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 25 CONN-HIG-BT900 Note: The BT900 serial module output is at 3.3V CMOS logic levels (tracks VCC). Level conversion must be added to interface with an RS-232 level compliant interface. Some serial implementations link CTS and RTS to remove the need for handshaking. Laird does not recommend linking CTS and RTS other than for testing and prototyping. If these pins are linked and the host sends data at the point that the BT900 deasserts its RTS signal, then there is significant risk that internal receive buffers will overflow, which could lead to an internal processor crash. This will drop the connection and may require a power cycle to reset the module. Laird recommends that the correct CTS/RTS handshaking protocol be adhered to for proper operation. Table 14: UART Interface Signal Name Pin No I/O Comments SIO_1 / UART_TX 45 O SIO_1 (alternative function UART_TX) is an output, set high (in FW). SIO_0 / UART_RX 44 I SIO_0 (alternative function UART_RX) is an input, set with internal pull-up (in FW). SIO_2 / UART_RTS 46 O SIO_2 (alternative function UART_RTS) is an output, set low (in FW). SIO_3 / UART_CTS 35 I SIO_3 (alternative function UART_CTS) is an input, set with internal pull-down (in FW). The UART interface is also used to load customer developed smart BASIC application script. 5.6 SPI Bus The SPI interface is an alternate function on SIO pins, configurable by smart BASIC. The Module is a master device that uses terminals SPI_MOSI, SPI_MISO, and SPI_CLK. SPI_CSB is implemented using any spare SIO digital output pins to allow for multi-dropping. The SPI interface enables full duplex synchronous communication between devices. It supports a 3-wire (SPI_MOSI, SPI_MISO, SPI_SCK,) bidirectional bus with fast data transfers to and from multiple slaves. Individual chip select signals will be necessary for each of the slave devices attached to a bus, but control of these is left to the application through use of SIO signals. I/O data is double buffered. The SPI peripheral supports SPI mode 0, 1, 2, and 3. Table 15: Peripheral supports Signal Name Pin No I/O Comments SPI_MOSI 8 O This interface is an alternate function configurable by smart BASIC. Default in the FW pin 8 and 10 are inputs. SPIOPEN() in smart BASIC selects SPI function and changes pin8and 10 to outputs (when in SPI master mode). SPI_MISO 7 I SPI_CLK 10 O 5.7 I2C Interface The I2C interface is an alternate function on SIO pins, configurable by smart BASIC command. The Two-wire interface can interface a bi-directional wired-OR bus with two lines (SCL, SDA) and has master /slave topology. The interface is capable of clock stretching. Data rates of 100 kbps and 400 kbps are supported.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 26 CONN-HIG-BT900 An I2C interface allows multiple masters and slaves to communicate over a shared wired-OR type bus consisting two lines which normally sit at VCC. The BT900 module can only be configured as an I2C master with additional constraint that it be the only master on the bus. The SCL is the clock line which is always sourced by the master and SDA is a bi-directional data line which can be driven by any device on the bus. IMPORTANT: It is essential to remember that pull-up resistors on both SCL and SDA lines are not provided in the module and MUST be provided external to the module.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 27 CONN-HIG-BT900 Table 16: I2C Interface Signal Name Pin No I/O Comments I2C_SDA 11 I/O This interface is an alternate function on each pin, configurable by smartBASIC. I2COPEN() in smartBASIC selects I2C function. I2C_SCL 12 I/O 5.8 General Purpose I/O, ADC and Quadrature Decoder 5.8.1 GPIO The 18 SIO pins are configurable by smartBASIC. They can be accessed individually. Each has the following user configured features:  Input/output direction  Output drive strength (4mA)  Internal pull up resistors (33K typical) or no pull-up.  Wake-up from high or low level triggers on all pins.  GPIO pins (pinswhose names begin with “BT” 5.8.2 Quadrature Decoder The following feature exists in hardware but cannot be configured in the firmware currently:  The quadrature decoder provides buffered decoding of quadrature-encoded sensor signals. It is suitable for mechanical and optical sensors with an optional LED output signal and input debounce filters. The sample period and accumulation are configurable to match application requirements. All pins individually can be configured to carry quadrature demodulator signals. 5.8.3 ADC The ADC is an alternate function on SIO pins, configurable by smart BASIC. The BT900 provides access to six-channel 12-bit incremental ADC. This enables sampling multiple external signals through a front end MUX. The ADC has configurable input and TBD. Note: Current smartBASIC runtime engine firmware (v9.x.y.z) provides access to 12-bit mode resolution only. 5.8.3.1 Analog Interface (ADC) Table 17: Analog interface Signal Name Pin No I/O Comments AIN – Analog Input 24 I This interface is an alternate function on each pin, configurable by smartBASIC. AIN configuration selected using GpioSetFunc() function. Up to 12bit resolution. AIN – Analog Input 45 I 5.8.4 APWM and FREQ signal output on upto xSIO pins The PWM and FREQ output is an alternate function on SIO pins, configurable by smart BASIC. The ability to output a PWM (Pulse Width Modulated) signal or FREQ output signal on up to x GPIO (SIO) output pins has been added since smartBASIC runtime engine firmware v9.x.y.z and can be selected using GpioSetFunc() function. PWM output signal has a frequency and duty cycle property. PWM output is generated using xx-bit hardware timers. The timers are clocked by a xMHz clock source. Frequency is adjustable
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 28 CONN-HIG-BT900 (upto xMHz )and the Duty cycle can be set over range from 0% to 100% (both configurable by smart BASIC command). Note, the frequency driving each of the x SIO pins is the same but the duty cycle can be independently set for each pin. FREQ output signal frequency can be set over a range of 0Hz to xMHz (with 50% mark-space ratio). 5.9 nRESET pin Table 18: nRESET pin Signal Name Pin No I/O Comments nRESET 16 I BT900 HW reset (active low). Pull the nRESET pin low for minimum 100mS in order for the BT900 to reset. 5.10 nAutoRUN pin Refer to section nAutoRUN pin and Operating Modes regarding operating modes and the nAutoRUN pin.  Self-contained Run mode  Interactive / Development mode 5.11 smartBASIC runtime engine firmware upgrade The BT900 SW consists of:  BT900 smartBASIC runtime engine FW (loaded at production, may be upgraded customer).  BT900 smartBASIC application script developed by customer (loaded through UART by customer). To allow customer the capability to upgrade the BT900 smartBASIC runtime engine FW, to the latest version released from Laird), the current smartBASIC runtime engine firmware (v9.x.y.z) only allows this upgrade via the UART. Figure 8: 5.12 BT900-SA on-board chip antenna characteristics The BT900-SA on-board chip monopole antenna radiated performance depends on the host PCB layout. BT900 development board was used for BT900 development and antenna performance evaluation. To obtain similar performance follow guidelines in section PCB Layout on Host PCB for BT900-SA to allow the on-board antenna to radiate and reduce proximity effects due to nearby host PCB GND copper or metal covers.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 29 CONN-HIG-BT900 BT900-SA on-board antenna datasheet: http://www.acxc.com.tw/product/at/at3216/AT3216-B2R7HAA_S-R00-N198_2.pdf Antenna performance on DVK-BT900-V01 devboard shown below. Peak gain Avg. gain XY-plane -2.6 -7.4 Peak gain Avg. gain XZ-plane -2.8 -5.9 Peak gain Avg. gain YZ-plane -1.6 -4.7
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 30 CONN-HIG-BT900 6 HARDWARE INTEGRATION SUGGESTIONS 6.1 Circuit The BT900-series module is easy to integrate requiring no external components on the customer’s board apart from those required by customer for development and in customers end application. Checklist (for Schematic):  VCC External power source within the operating range, rise time and noise/ripple specification of BT900. Add decoupling capacitors for filtering the external source. Power-on reset circuitry within BT900 series module incorporates brown-out detector, thus simplifying power supply design. Upon application of power, the internal power-on reset ensures module starts correctly.  Decide if BT900 is to be powered by 3.3V or 1.8V external Power Supply BT radio chip in the BT900 has two internal regulators, a high voltage (input pin BT_VREG_IN_HV) and low voltage (input pin BT_VREG_OUT_HV) regulator. ONLY one regulator can be used to power radio chip. Method1: If BT900 is required to operate from 3.3V, connect external 3.3V supply to pin31 BT_VREG_IN_HV and MUST leave pin32 BT_VREG_OUT_HV unconnected. Pin5(VCC) and pin43(BT_VDD_IO) should be connected to pin31 BT_VREG_IN_HV. Method2: If BT900 is required to operate from 1.8V, connect external 1.8V supply to pin32 BT_VREG_OUT_HV and MUST leave pin31 BT_VREG_IN_HV unconnected. Pin5(VCC) and pin43(BT_VDD_IO) should be connected to pin32 BT_VREG_OUT_HV.  Place decoupling capacitor on pin41 BT_VDD_IO. Value 0.1uF or value suitable to filter the noise present.  AIN (ADC) and SIO pin IO voltage levels BT900 SIO voltage levels are at VCC. Ensure input voltage levels into SIO pins are at VCC also (if VCC source is a battery whose voltage will drop). Ensure ADC pin maximum input voltage for damage is not violated.  External supplied Sleep Clock oscillator for BT Radio chip sleep modes (BT900 pin34, BT_Ext_DS_CLK). There is current consumption saving of 114uA when using external 32.768kHz. 227uA is when the internal radio chip 32.768kHz is used. 113uA is when external 32.768kHz oscillator is connected to BT900 (radio chip) pin34(BT_Ext_DS_CLK). PSKey needs to be changed via smartBASIC command. Refer to DK-BT900-V01 for schematic and recommended part, Siward OSC863100-SCO-B660 (description: OSC,32.768KHz,+/-25ppm,3.2*2.5*1.2mm,SMD,-40~+85dC).  UART Is required for loading customer smartBASIC application script during development (or for subsequent upgrade). Add connector to allow UART to be interfaced to PC (via UART –RS232 or UART- USB).  UART_RX and UART_CTS SIO_0 (alternative function UART_RX) is an input, set with internal pull-up (in FW). The pull-up prevents the module from going into deep sleep when UART_RX line is idling. SIO_3 (alternative function UART_CTS) is an input, set with external pull-down. This pull-down ensures the default state of the UART_CTS will be asserted which means can send data out of the UART_TX line. In the case when UART_CTS is not connected (which we do not recommend).
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 31 CONN-HIG-BT900  nAutoRUN pin and operating mode selection nAutoRUN pin needs to be externally held high or low to select between the two BT900 operating modes at power-up: - Self-contained Run mode (nAutoRUN pin held at 0V). - Interactive / development mode (nAutoRUN pin held at VCC). Make provision to allow operation in the required mode. Add jumper to allow nAutoRUN pin to be held high or low (via 10K resistor) OR driven by host GPIO.  I2C It is essential to remember that pull-up resistors on both I2C_SCL and I2C_SDA lines are not provided in the BT900 module and MUST be provided external to the module as per I2C standard.  SPI Implement SPI chip select using any unused SIO pin within your smartBASIC application script then SPI_CS is controlled from smartBASIC application allowing multi-dropping.  SIO pin direction BT900 modules shipped from production with smart BASIC runtime engine FW, all SIO pins (with “default function” of “DIO”) are mostly digital inputs (see Pin Definitions Table2). Remember to change the direction SIO pin (in your smart BASIC application script) if that particular pin is wired to a device that expects to be driven by the BT900 SIO pin configured as an output. Also these SIO pins that are inputs have by default (in FW) no internal pull-up (TBD) resistor-enabled, and therefore are floating (TBD). You are free to configure in your smartBASIC application script. Note: Internal pull-up, pull down will take current from VCC.  SIO_TBD pin and Over the Air smartBASIC application download feature SIO_TBD is an input, set with internal pull-down (in FW). Refer to latest FW release documentation on how SIO_TBD is used for Over the Air smartBASIC application download feature. SIO_TBD pin has to be pulled high externally to enable the feature. Decide if this feature is required in production.  nRESET pin (active low) Hardware reset. Wire out to push button or drive by host. By default module is out of reset when power applied to VCC pin. 6.2 PCB Layout on Host PCB - General Checklist (for PCB):  MUST locate BT900-Sx module close to the edge of PCB (mandatory for BT900-SA for on-board chips antenna to radiate properly).  Use solid GND plane on inner layer (for best EMC and RF performance).  All module GND pins MUST be connected to host PCB GND.  Place GND vias close to module GND pads as possible  Unused PCB area on surface layer can flooded with copper but place GND vias regularly to connect copper flood to inner GND plane. If GND flood copper underside the module then connect with GND vias to inner GND plane.  Route traces to avoid noise being picked up on VCC supply and AIN(analogue) and SIO (digital) traces.  Do NOT run any track near pin34 of BT900-Sx. Pin34 is BT_Ext_DS_CLK which the external supplied 32.768kHz oscillator is connected to. MUST ensure the 32.768kHz is shield by GND on either side, see devboard PCB layout DVK-BT900-V01.  Ensure no exposed copper underside of the module (refer to land pattern of BT900 development board).
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 32 CONN-HIG-BT900 6.3 PCB Layout on Host PCB for BT900-SA 6.3.1 Antenna keep-out on host PCB The BT900-SA has an integrated chip antenna and its performance is sensitive to host PCB. It is critical to locate the BT900-SA on the edge of the host PCB (or corner) to allow the antenna to radiate properly. Refer to guidelines in section PCB land pattern and antenna keep-out area for BT900-SA. Some of those guidelines repeated below.  Ensure there is no copper in the antenna keep-out area on any layers of the host PCB. Keep all mounting hardware and metal clear of the area to allow proper antenna radiation.  For best antenna performance, place the BT900-SA module on the edge of the host PCB, preferably in the corner with the antenna facing the corner.  The BT900 development board has the BT900-SA module on the edge of the board (not in the corner). The antenna keep-out area is defined by the BT900 development board which was used for module development and antenna performance evaluation is shown in Figure 9, where the antenna keep-out area is ~4.2 mm wide, 34.2 mm long; with PCB dielectric (no copper) height 1.0 mm sitting under the BT900-SA antenna.  A different host PCB thickness dielectric will have small effect on antenna.  The antenna-keep-out defined in Host PCB Land Pattern and Antenna Keep-out for BT900-SA applies when the BT900-SA is placed in the corner of the host PCB. When BT900-SA cannot be placed as such, it must be placed on the edge of the host PCB and the antenna keep out must be observed. An example is shown in Figure 9. Figure 9: Antenna keep-out area (shown in red), corner of the BT900 development board for BT900-SA module. Antenna Keepout BT900-SA module
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 33 CONN-HIG-BT900 Note: 1. BT900 module placed on edge of host PCB. 2. Copper cut-away on all layers in “antenna Keep-out” area under BT900 on host PCB. 6.3.2 Antenna keep-out and Proximity to Metal or Plastic Checklist (for metal /plastic enclosure):  Minimum safe distance for metals without seriously compromising the antenna (tuning) is 40mm top/bottom and 30mm left or right.  Metal close to the BT900-SA chip monopole antenna (bottom, top, left, right, any direction) will have degradation on the antenna performance. How much; that is entirely system dependent which means some testing by customer required (in their host application).  Anything metal closer than 20mm will start to significantly degrade performance (S11, gain, radiation efficiency).  It is best that the customer tests the Range with mock-up (or actual prototype) of the product to assess effects of enclosure height (and material whether metal or plastic). 6.4 External Antenna Integration with BT900-SC Please refer to the regulatory sections for FCC, IC, CE, and Japan for details of use of BT900-Sx with external antennas in each regulatory region. The BT900 family has been designed to operate with the below external antennas (with a maximum gain of 2.0 dBi). The required antenna impedance is 50 ohms. See Table 19. External antennas improve radiation efficiency. Table 19: External antennas for the BT900 External Antenna Part Number Mfg. Type Gain (dBi) Connector Type BT900 Part number S181FL-L-RMM-2450S Nearson Dipole 2.0 uFL Note1 BT900-SC EBL2449A1-15UFL Laird PCB Dipole 2.0 uFL Note1 BT900-SC MAF94190 Laird Dipole 2.0 uFL BT900-SC MAF94019 Laird Dipole 1.5 uFL BT900-SC Note 1: Antenna manufacturer Laird contact information: Sales: Tel: Email:
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 34 CONN-HIG-BT900
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 35 CONN-HIG-BT900 7 MECHANICAL DETAILS 7.1 BT900 Mechanical Details Figure 10: BT900 Mechanical drawings Development Kit Schematics can be found at: http://lairdtech.com/Products/Embedded-Wireless-Solutions/Bluetooth-Radio-Modules/BL900-Series/#productGroupTabs-2147488080
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 36 CONN-HIG-BT900 7.2 Host PCB Land Pattern and Antenna Keep-out for BT900-SA Dimensions in mm. APPLICATION NOTES 1. Ensure there is no copper in the antenna ‘keep out area’ on any layers of the host PCB. Also keep all mounting hardware or any metal clear (Refer to 6.3.2) on of the area to reduce effects of proximity detuning the antenna and to help antenna radiate properly. 3. For BT900-SA (has on-board chip antenna) best antenna performance, the module BT900-SA MUST be placed on the edge of the host PCB and preferably in the corner with the antenna facing the corner. Above “Keep Out Area” is the module placed in corner of
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 37 CONN-HIG-BT900 PCB. If BT900-SA is not placed in corner but on edge of host PCB, the antenna “Keep Out Area” is extended (see Note4). 4. BT900 development board has BT900-SA placed on the edge of the PCB board (and not in corner) for that the Antenna keep out area is extended down to the corner of the development board, see section PCB Layout on Host PCB for BL900-SA, Figure10. This was used for module development and antenna performance evaluation. 5. Ensure no exposed copper under module on host PCB. 6. The user may modify the PCB land pattern dimensions based on their experience and / or process capability.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 38 CONN-HIG-BT900 8 APPLICATION NOTE FOR SURFACE MOUNT MODULES 8.1 Introduction Laird Technologies surface mount modules are designed to conform to all major manufacturing guidelines. This application note is intended to provide additional guidance beyond the information that is presented in the User Manual. This Application Note is considered a living document and will be updated as new information is presented. The modules are designed to meet the needs of a number of commercial and industrial applications. They are easy to manufacture and conform to current automated manufacturing processes.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 39 CONN-HIG-BT900 8.2 Shipping Figure 8-1: BT900 Shipping Tray Details 8.3 Reflow Parameters Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and shipment. If directed to bake units on the card, see Table 20 and follow instructions specified by IPC/JEDEC J-STD-033. A copy of this standard is available from the JEDEC website: http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf Note: The shipping tray cannot be heated above 65°C. If baking is required at the higher temperatures displayed in in Table 20, the modules must be removed from the shipping tray. Modules are shipped in ESD (Electrostatic Discharge) safe trays that can be loaded into most manufacturers pick and place machines. Layouts of the trays are provided in Figure 8-1.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 40 CONN-HIG-BT900 Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient environment ≤30°C/60%RH. Table 20: Recommended baking times and temperatures MSL 125°C Baking Temp. 90°C/≤ 5%RH Baking Temp. 40°C/ ≤ 5%RH Baking Temp. Saturated @ 30°C/85% Floor Life Limit + 72 hours @ 30°C/60% Saturated @ 30°C/85% Floor Life Limit + 72 hours @ 30°C/60% Saturated @ 30°C/85% Floor Life Limit + 72 hours @ 30°C/60% 3 9 hours 7 hours 33 hours 23 hours 13 days 9 days Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Laird surface mount modules conform to J-STD-020D1 standards for reflow temperatures. Important: During reflow, modules should not be above 260° and not for more than 30 seconds. Figure 8-2: Recommended Reflow Temperature Temperatures should not exceed the minimums or maximums presented in Table 21. Table 21: Recommended Maximum and minimum temperatures Specification Value Unit Temperature Inc./Dec. Rate (max) 1~3 °C / Sec Temperature Decrease rate (goal) 2-4 °C / Sec Soak Temp Increase rate (goal) .5 - 1 °C / Sec Flux Soak Period (Min) 70 Sec Flux Soak Period (Max) 120 Sec Flux Soak Temp (Min) 150 °C Flux Soak Temp (max) 190 °C
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 41 CONN-HIG-BT900 Specification Value Unit Time Above Liquidous (max) 70 Sec Time Above Liquidous (min) 50 Sec Time In Target Reflow Range (goal) 30 Sec Time At Absolute Peak (max) 5 Sec Liquidous Temperature (SAC305) 218 °C Lower Target Reflow Temperature 240 °C Upper Target Reflow Temperature 250 °C Absolute Peak Temperature 260 °C 9 FCC AND IC REGULATORY STATEMENTS Model US/FCC CANADA/IC BT900-SA TBC TBC BT900-SC TBC TBC The BT900-SA and BT900-SC hold full modular approvals. The OEM must follow the regulatory guidelines and warnings listed below to inherit the modular approval. PART # FORM FACTOR TX OUTPUT ANTENNA BT900-SA-0X Surface Mount 8dBm Ceramic BT900-SC-0X Surface Mount 8dBm u.FL *Last two slots "0X" in Part # are used for production firmware release changes. Can be values 01-99, aa-zz The BT900 family has been designed to operate with the antennas listed below with a maximum gain of 2.0 dBi. The required antenna impedance is 50 ohms. Item Part Number Mfg. Type Gain (dBi) Model 1 AT3216-B2R7HAA ACX Ceramic 0.5 BT900-SA 2 S181FL-L-RMM-2450S Nearson Dipole 2.0 BT900-SC 3 MAF94045 Laird PCB Dipole 2.0 BT900-SC 4 MAF94017 Laird Dipole 2.0 BT900-SC 5 MAF94019 Laird Dipole 1.5 BT900-SC Note: The OEM is free to choose another vendor’s antenna of like type and equal or lesser gain as an antenna appearing in the table and still maintain compliance. Reference FCC Part 15.204(c)(4) for further information on this topic. To reduce potential radio interference to other users, the antenna type and gain should be chosen so that the equivalent isotropic radiated power (EIRP) is not more than that permitted for successful communication. 9.1 Power Exposure Information Federal Communication Commission (FCC) Radiation Exposure Statement: This EUT is in compliance with SAR for general population/uncontrolled exposure limits in ANSI/IEEE C95.1-1999 and had been tested in accordance with the measurement methods and procedures specified in OET Bulletin 65 Supplement C.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 42 CONN-HIG-BT900 This transceiver must not be co-located or operating in conjunction with any other antenna, transmitter, or external amplifiers. Further testing / evaluation of the end product will be required if the OEM’s device violates any of these requirements. The BT900 is fully approved for mobile and portable applications. 9.2 OEM Responsibilities WARNING: The OEM must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Laird Technology FCC identifier for this product. Contains FCC ID: PI4xxxxx IC: 1931B-xxxxx If the size of the end product is larger than 8x10cm, then the following FCC part 15.19 statement has to also be available on visible on outside of device: The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation Label and text information should be in a size of type large enough to be readily legible, consistent with the dimensions of the equipment and the label. However, the type size for the text is not required to be larger than eight point. CAUTION: The OEM should have their device which incorporates the BT900 tested by a qualified test house to verify compliance with FCC Part 15 Subpart B limits for unintentional radiators. CAUTION: Any changes or modifications not expressly approved by Laird Technology could void the user’s authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does not cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to correct the interference by one or more of the following measures:  Re-orient or relocate the receiving antenna  Increase the separation between the equipment and the receiver  Connect the equipment to an outlet on a circuit that is different from that to which the receiver is connected.  Consult the dealer or an experienced radio/TV technician for help. FCC Warning: “THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES AND INDUSTRY CANADA LICENSE-EXEMPT RSS STANDARD(S). OPERATION IS SUBJECT TO THE FOLLOWING TWO CONDITIONS: (1) THIS DEVICE
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 43 CONN-HIG-BT900 MAY NOT CAUSE HARMFUL INTERFERENCE, AND (2) THIS DEVICE MUST ACCEPT ANY INTERFERENCE RECEIVED, INCLUDING INTERFERENCE THAT MAY CAUSE UNDESIRED OPERATION. Industry Canada (IC) Warning: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. French equivalent is: Le présent appareil est conforme aux CNR d'Industrie Canada applicable aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. IC Radiation Exposure Statement This EUT is compliance with SAR for general population/uncontrolled exposure limits in IC RSS-102 and had been tested in accordance with the measurement methods and procedures specified in IEEE 1528. REMARQUE IMPORTANTE Déclaration IC d'exposition aux radiations Ce EUT est conforme avec SAR pour la population générale / limites d'exposition non contrôlée à IC RSS-102 et a été testé en conformité avec les méthodes de mesure et procédures spécifiées dans la norme IEEE 1528. Modular Approval OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Approbation modulaire OEM intégrateur est toujours responsable de tester leur produit final pour les exigences de conformité supplémentaires nécessaires à ce module installé (par exemple, les émissions de périphériques numériques, les exigences de périphériques PC, etc.)
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 44 CONN-HIG-BT900 IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada. Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: " BT900-SA and BT900-SC Contient des IC: TBC". 10 JAPAN (MIC) REGULATORY The BT900 is approved for use in the Japanese market. The part numbers listed below hold WW type certification. Refer to ARIB-STD-T66 for further guidance on OEM’s responsibilities. Model Certificate Number Antenna BT900-SA TBC Ceramic BT900-SC TBC uFL 10.1 Antenna Information The BT900 was tested with antennas listed below. The OEM can choose a different manufacturers antenna but must make sure it is of same type and that the gain is lesser than or equal to the antenna that is approved for use. Item Part Number Mfg. Type Gain (dBi) Model 1 AT3216-B2R7HAA ACX Ceramic 0.5 BT900-SA 2 S181FL-L-RMM-2450S Nearson Dipole 2.0 BT900-SC 3 MAF94045 Laird PCB Dipole 2.0 BT900-SC 4 MAF94017 Laird Dipole 2.0 BT900-SC 5 MAF94019 Laird Dipole 1.5 BT900-SC
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 45 CONN-HIG-BT900 11 CE REGULATORY The BT900-SA / BT900-SC have been tested for compliance with relevant standards for the EU market. The BT900-SC module was tested with a 2.21 dBi antenna. The OEM can operate the BT900-SC module with any other type of antenna but must ensure that the gain does not exceed 2.21 dBi to maintain the Laird approval. The OEM should consult with a qualified test house before entering their device into an EU member country to make sure all regulatory requirements have been met for their complete device. Reference the Declaration of Conformities listed below for a full list of the standards that the modules were tested to. Test reports are available upon request. 11.1 Antenna Information The antennas listed below were tested for use with the BT900. For CE mark countries, the OEM is free to use any manufacturer’s antenna and type of antenna as long as the gain is less than or equal to the highest gain approved for use (2.21dBi) Contact a Laird representative for more information regarding adding antennas. Item Part Number Mfg. Type Gain (dBi) Model 1 AT3216-B2R7HAA ACX Ceramic 0.5 BT900-SA 2 S181FL-L-RMM-2450S Nearson Dipole 2.0 BT900-SC 3 MAF94045 Laird PCB Dipole 2.0 BT900-SC 4 MAF94017 Laird Dipole 2.0 BT900-SC 5 MAF94019 Laird Dipole 1.5 BT900-SC
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 46 CONN-HIG-BT900 12 EU DECLARATIONS OF CONFORMITY 12.1 BT900-SA / BT900-SC Manufacturer: Laird Product: BT900-SA, BT900-SC EU Directive: RTTE 1995/5/EC Conformity Assessment: Annex IV Reference standards used for presumption of conformity: Article Number Requirement Reference standard(s) 3.1a Health and Safety EN60950-1:2006+A11:2009+A1:2010+A12:2011 3.1b Protection requirements with respect to electromagnetic compatibility EN 301 489-1 V1.9.2 (2011-09) EN 301 489-17 V2.2.1 (2012-09) Emissions: EN55022:2006/A1:2007 (Class B) Immunity: EN61000-4-2:2009 EN61000-4-3:2006/A1:2008/A2:2010 3.2 Means of the efficient use of the radio frequency spectrum EN 300 328 V1.8.1 (2012-06) Declaration: We, Laird, declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1999/5/EC, when used for its intended purpose. Place of Issue: Laird Saturn House, Mercury Park Wooburn Green HP100HH, United Kingdom tel: +44 (0)1628 858 940 fax: +44 (0)1628 528 382 Date of Issue: Junel2014 Name of Authorized Person: Andrew Dobbing, Engineering Manager Signature:
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 47 CONN-HIG-BT900 13 ORDERING INFORMATION Part Number DESCRIPTION BT900-SA-0x Single Mode BLE Module featuring smart BASIC – integrated antenna BT900-SC-0x Single Mode BLE Module featuring smart BASIC – IPEX MHF4 connector DVK – BT900-SA-0x Development board with BT900-SA module soldered in place DVK – BT900-SC-0x Development board with BT900-SC module soldered in place 13.1 General Comments This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If in doubt, ask. 14 BLUETOOTH SIG QUALIFICATION The BT900 module is listed on the Bluetooth SIG website as qualified End Products. Design Name Owner Declaration ID Link to listing on the SIG website BT900 Laird Technologies TBC https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=20700 It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product implementing Bluetooth technology has a Declaration ID. Every Bluetooth design is required to go through the qualification process, even when referencing a Bluetooth Design that already has its own Declaration ID. The Qualification Process requires each company to registered as a member of the Bluetooth SIG – www.bluetooth.org The following link provides a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/ For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on your membership status, please refer to the following webpage: https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG document: https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486 To start the listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm In step 1, select the option, Reference a Qualified Design and enter 20700 in the End Product table entry. You can then select your pre-paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page, (please note that unless the Declaration ID is pre-paid or purchased with a credit card, it will not be possible to proceed until the SIG invoice is paid.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 48 CONN-HIG-BT900 Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help document. Your new Design will be listed on the SIG website and you can print your Certificate and DoC. For further information please refer to the following training material: https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates Additional Assistance Please contact your local sales representative or our support team for further assistance: Laird Technologies Connectivity Products Business Unit Support Centre: http://ews-support.lairdtech.com Email: wireless.support@lairdtech.com Phone: Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Web: http://www.lairdtech.com/bluetooth
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 49 CONN-HIG-BT900 Laird is the world leader in the design and manufacture of customized, performance-critical products for wireless and other advanced electronics applications. Laird Technologies partners with its customers to find solutions for applications in various industries such as:  Network Equipment  Telecommunications  Data Communications  Automotive Electronics  Computers  Aerospace  Military  Medical Equipment  Consumer Electronics Laird offers its customers unique product solutions, dedication to research and development, as well as a seamless network of manufacturing and customer support facilities across the globe. CONN-HIG- BT900 Copyright © 2014 Laird. All rights reserved. The information contained in this manual and the accompanying software programs are copyrighted and all rights are reserved by Laird Technologies, Inc. Laird Technologies, Inc. reserves the right to make periodic modifications of this product without obligation to notify any person or entity of such revision. Copying, duplicating, selling, or otherwise distributing any part of this product or accompanying documentation/software without the prior consent of an authorized representative of Laird Technologies, Inc. is strictly prohibited. All brands and product names in this publication are registered trademarks or trademarks of their respective holders. This material is preliminary Information furnished by Laird Technologies in this specification is believed to be accurate. Devices sold by Laird Technologies are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Laird Technologies makes no warranty, express, statutory, and implied or by description, regarding the information set forth herein. Laird Technologies reserves the right to change specifications at any time and without notice. Laird Technologies’ products are intended for use in normal commercial and industrial applications. Applications requiring unusual environmental requirements such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional testing for such application. Limited Warranty, Disclaimer, Limitation of Liability USA: +1.800.492.2320 Europe: +44.1628.858.940 Asia: +852.2923-0610 wirelessinfo@lairdtech.com www.lairdtech.com/wireless
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 50 CONN-HIG-BT900 FEDERAL COMMUNICATION COMMISSION INTERFERENCE STATEMENT This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. IMPORTANT NOTE: FCC Radiation Exposure Statement: The product comply with the US portable RF exposure limit set forth for an uncontrolled environment and are safe for intended operation as described in this manual. The further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such function is available. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 51 CONN-HIG-BT900 This device is intended only for OEM integrators under the following conditions: 1) The transmitter module may not be co-located with any other transmitter or antenna, As long as 1 condition above is met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The final end product must be labeled in a visible area with the following: “Contains FCC ID: SQGBT900 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 52 CONN-HIG-BT900 INDUSTRY CANADA STATEMENT: This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Radiation Exposure Statement: The product comply with the Canada portable RF exposure limit set forth for an uncontrolled environment and are safe for intended operation as described in this manual. The further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such function is available. Déclaration d'exposition aux radiations: Le produit est conforme aux limites d'exposition pour les appareils portables RF pour les Etats-Unis et le Canada établies pour un environnement non contrôlé. Le produit est sûr pour un fonctionnement tel que décrit dans ce manuel. La réduction aux expositions RF peut être augmentée si l'appareil peut être conservé aussi loin que possible du corps de l'utilisateur ou que le dispositif est réglé sur la puissance de sortie la plus faible si une telle fonction est disponible.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 53 CONN-HIG-BT900 THIS DEVICE IS INTENDED ONLY FOR OEM INTEGRATORS UNDER THE FOLLOWING CONDITIONS: 1) The transmitter module may not be co-located with any other transmitter or antenna. As long as 1 condition above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. CET APPAREIL EST CONÇU UNIQUEMENT POUR LES INTÉGRATEURS OEM DANS LES CONDITIONS SUIVANTES: 1) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne. Tant que les 1 condition ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé. IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling The final end product must be labeled in a visible area with the following: “Contains IC: 3147A-BT900”.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 54 CONN-HIG-BT900 Plaque signalétique du produit final Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: 3147A-BT900". Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information à l'utilisateur final L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel.
BT900-Sx Hardware Integration Guide Intelligent BTv4.0 Dual Mode Module Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth 55 CONN-HIG-BT900 (For transmitters equipped with detachable antennas) This radio transmitter (identify the device by certification number, or model number if Category II) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Le présent émetteur radio (IC: 3147A-BT900) a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. Type Manufacture Gain Connector Chip ACX (Advanced Ceramic X Corp.) 0.5dBi N/A Dipole Nearson 2.0 dBi IPEX u.FL PCB Dipole Laird Technologies 2.0 dBi IPEX u.FL Dipole Laird Technologies 2.0 dBi IPEX u.FL Dipole Laird Technologies 1.5 dBi IPEX u.FL

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