Laird Connectivity BT900 Bluetooth Dual Mode UART AT featuring smartBASIC User Manual BT900

Laird Technologies Bluetooth Dual Mode UART AT featuring smartBASIC BT900

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User manual

Intelligent BTv4.0 Dual-Mode Module

Part # BT900-SA-0x, BT900-SC-0x

ARDWARE

NTEGRATION

UIDE

ERSION

0.2

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

2 CONN-HIG-BT900

EVISION

ISTORY

Version Revision Date Change History

0.1 TBD Initial Preliminary Version

0.2 19May14 Draft version

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

3 CONN-HIG-BT900

ONTENTS

Revision History ..................................................................................................................... 2

Contents ................................................................................................................................ 3

Overview and Key Features ................................................................................................ 5

1.1

Features & Benefits ..................................................................................................................... 5

1.2

Application Areas ....................................................................................................................... 5

Specification ..................................................................................................................... 7

2.1

Specification Summary .............................................................................................................. 7

Hardware Specifications .................................................................................................... 9

3.1

Block Diagram and Pin-out ....................................................................................................... 9

3.2

Pin Definitions ............................................................................................................................ 10

3.3

Electrical Specifications ........................................................................................................... 12

3.3.1

Absolute Maximum ratings ......................................................................................... 12

3.3.2

Recommended Operating Parameters ................................................................... 13

3.3.3

nAutoRUN pin and Operating Modes ...................................................................... 15

3.3.4

OTA (Over the Air) smart BASIC application download ......................................... 15

Power Consumption ........................................................................................................ 17

4.1

Power Consumption ................................................................................................................. 17

4.2

Measured Peak Current Waveforms During BLE Advertising and Connection .............. 19

4.3

Peripheral block current consumption .................................................................................. 22

Functional Description .................................................................................................... 23

5.1

Power management (includes brown-out and power on reset) ....................................... 23

5.2

Clocks and TIMERS .................................................................................................................... 23

5.2.1

Clocks ........................................................................................................................... 23

5.2.2

TIMERS ........................................................................................................................... 23

5.3

Memory for smart BASIC Application Code ......................................................................... 24

5.4

RF ................................................................................................................................................ 24

5.5

UART Interface .......................................................................................................................... 24

5.6

SPI Bus ......................................................................................................................................... 25

5.7

I2C Interface ............................................................................................................................. 25

5.8

General Purpose I/O, ADC and Quadrature Decoder ....................................................... 27

5.8.1

GPIO .............................................................................................................................. 27

5.8.2

Quadrature Decoder .................................................................................................. 27

5.8.3

ADC ............................................................................................................................... 27

5.8.4

APWM and FREQ signal output on upto xSIO pins .................................................. 27

5.9

nRESET pin .................................................................................................................................. 28

5.10

nAutoRUN pin ............................................................................................................................ 28

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

4 CONN-HIG-BT900

5.11

smartBASIC runtime engine firmware upgrade .................................................................... 28

5.12

BT900-SA on-board chip antenna characteristics ................................................................ 28

Hardware Integration Suggestions ................................................................................... 30

6.1

Circuit ......................................................................................................................................... 30

6.2

PCB Layout on Host PCB - General ........................................................................................ 31

6.3

PCB Layout on Host PCB for BT900-SA .................................................................................... 32

6.3.1

Antenna keep-out on host PCB ................................................................................. 32

6.3.2

Antenna keep-out and Proximity to Metal or Plastic .............................................. 33

6.4

External Antenna Integration with BT900-SC ......................................................................... 33

Mechanical Details .......................................................................................................... 35

7.1

BT900 Mechanical Details ........................................................................................................ 35

7.2

Host PCB Land Pattern and Antenna Keep-out for BT900-SA ............................................. 36

Application Note for Surface Mount Modules ................................................................... 38

8.1

Introduction ............................................................................................................................... 38

8.2

Shipping ..................................................................................................................................... 39

8.3

Reflow Parameters ................................................................................................................... 39

FCC and IC Regulatory Statements ................................................................................... 41

9.1

Power Exposure Information .................................................................................................... 41

9.2

OEM Responsibilities ................................................................................................................. 42

Japan (MIC) Regulatory .................................................................................................... 44

10.1

Antenna Information ................................................................................................................ 44

CE Regulatory ................................................................................................................. 45

11.1

Antenna Information ................................................................................................................ 45

EU Declarations of Conformity ......................................................................................... 46

12.1

BT900-SA / BT900-SC .................................................................................................................. 46

Ordering Information ...................................................................................................... 47

13.1

General Comments ................................................................................................................. 47

Bluetooth SIG Qualification .............................................................................................. 47

Additional Assistance ......................................................................................................................... 48

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

5 CONN-HIG-BT900

VERVIEW AND

EATURES

BT900 Series modules from Laird Technologies make it easy to add Classic BT and Bluetooth Low

Energy (BLE) functionality to small, portable, power-conscious devices, including those powered

by batteries. The fully approved, programmable module feature Laird’s innovative, event-driven

smartBASIC programming language, which significantly reduces OEM development risk and

speeds time to market.

Based on the Cambridge Silicon Radio (CSR) 8811 silicon and a low power Cortex M3

microcontroller, the BT900 modules provide exceptionally low power consumption with

outstanding wireless range, all within a compact footprint of 19 mm x 12.5 mm. The modules

incorporate all the hardware and firmware required to support development of Dual Mode

applications, including:



Complete radio hardware



UART, I2C, SPI, ADC, PCM and GPIO interfaces



Embedded BTv4.0 software stack

 Classic BT profile - SPP

 GATT Client & Peripheral Modes

What makes the modules truly innovative is smartBASIC, an event-driven programming language

that enables standalone operation of the module. Laird has extended the implementation of

smartBASIC from the popular BL6xx series of single mode BLE modules into the BT900 series. This

allows developers the flexibility of utilising the Core and BLE specific smartBASIC functions from

the BL6xx series to create fully interchangeable BLE applications between these product ranges.

Without the need for any external processor, a simple smartBASIC application encapsulates the

complete end-to-end process of reading, writing, and processing of sensor data and then using

Classic Bluetooth or BLE to transfer it to / from any Bluetooth device. Ultimately smartBASIC

accelerates initial development, creation of prototypes, and mass production by providing you

with your own Bluetooth expert within the module.

In addition to carrying FCC modular, IC, CE and MIC approvals, BT900 modules are fully qualified

as a Bluetooth product, enabling designers to integrate the modules in devices without the need

for further Bluetooth testing. A low-cost developer’s kit including simple software tools simplifies

module integration and guarantees the fastest route to market.

1.1 Features & Benefits

1.2 Application Areas



Bluetooth v4.0

Dual

Mode

(Classic Bluetooth and BLE)



External or Internal Antennas



smartBASIC programming language



Full Bluetooth EPL



Compact Footprint



Programmable TX power 8dBm to -20dBm



RX sensitivity: -90dBm



Ultra low power consumption



TX: 85 mA peak (at +8dBm)



Standby Doze: 227 uA (refer to Note4 in Power

Consumption section)



Deep Sleep: 7uA



UART, GPIO, ADC, PWM, FREQ output, TIMERS, I2C, and

SPI interfaces



Medical devices



Wellness devices



Automotive Diagnostic

Equipment



Bar Code Scanners



Industrial Cable

Replacement



Home automation

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

6 CONN-HIG-BT900



Fast T

ime to Market



FCC, CE, IC, and Japan certified; other regulatory

certifications on request



No external components required

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

7 CONN-HIG-BT900

2 S

PECIFICATION

2.1

Specification Summary

Table 1: Specifications

CATEGORIES FEATURE IMPLEMENTATION

Wireless

Specification

Bluetooth®

V4.0

–

Dual

Mode

Frequency

2.402

2.480 GHz

Transmit Power

+ 8dBm

(maximum)

Configurable down to -20dBm

Receive Sensitivity

90 dBm (typical

)

Link Budget

98 dB

Raw Data Rates

(Air)

3 Mbps (Classic BT

–

BR/EDR)

Host Interface

and Peripherals UART Interface

TX, RX, CTS, RTS

DTR, DSR, DCD, RI can be implemented in smartBASIC-

using General Purpose I/O

Default 9600, N, ,8, 1

From 1,200 to 4 Mbps

RX buffer size (TBD)

GPIO

18 (maximum

–

configurable) lines

O/P drive strength (4mA)

Pull-up resistor (33KOhms) control (via smartBASIC)

Read pin-level

I2C Interface

1 (configurable from GPIO total)

. Upto 400kbps.

SPI

(configurable from GPIO total)

Upto 4Mbps.

ADC Interface

2 channels (configured from GPIO total)

Up to 12-bit resolution

Conversion time 2.0uS (at 2.7V to 3.6V)

x.xV internal reference

1/1, 2/3, 1/3 pre-scaling

PWM or FREQ output

Output a PWM or FREQ on upto 2 GPIO output pins.

PWM output duty cycle: 0%-100%

PWM output frequency: TBD

FREQ output frequency: 0MHz to xMHz (50% duty

cycle)

PCM Interface

Wi-Fi-BT coexistence 3 dedicated pins

Profiles

Classic Bluetooth

SPP (Serial Port Profile)

Bluetooth Low Energy

GATT Client & Peripheral

–

Any Custom Services

Programmabilit

smart

BASIC

On-board programming language similar to BASIC

smart

BASIC application

Via UART or Over the Air

Control Protocols

Any that can be implemented using

smart

BASIC

vSP – Virtual Serial Port for BLE

FW upgrade

smart

BASIC

runtime engine FW

upgrade

Via UART

Coexistence

802.11 (Wi

Fi)

2 and 3 wire CSR schemes supported

(Unity-3;Unity-3e, Unity 3e+, Unity 3+ and Unity+)

Operating Modes

Self-contained Run Mode

Selected by nAutoRUN pin status:

LOW(0V). Then runs $autorun$ (smartBASIC

application) if it exists.

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

8 CONN-HIG-BT900

Interactive Development Mode

HIGH(VCC). Then runs via at+run (and “file name” of

smartBASIC application script).

Supply Voltage

Supply

1.8V

–

3.6V

Power

Consumption

Current

Max Peak Current

(

TX Power @ +8dBm TX

85mA

Standby

Doze (waitevent)

–

227uA

(internal 32.768kHz)

Standby Doze (waitevent) – 113uA (external

32.768kHz, Note5)

Deep Sleep

–

7uA

Physical

Dimensions

12.5

2.5

;

Pad Pitch 0.8

Environmental

Operating

40°C to +85°C

Storage

40°C to +85°

Miscellaneous

Lead Free

Lead

free and RoHS compliant

Warranty

1 Year

Development

Tools

Development Kit

Development board and free Software Tools

Software Tools

Utilities

Windows, Android and iOS applications

UART Firmware Upgrade

Approvals

Bluetoot

h®

Complete Declaration ID

FCC / IC / CE

/ MIC

All BT9

00 Series

Note 1: DSR, DTR, RI, and DCD can be implemented in the smart

BASIC application.

Note 2: With I2C interface selected, pull-up resistors on I2C SDA and I2C SCL MUST be

connected externally as per I2C standard.

Note 3: SPI interface consists of SPI MOSI, SPI MISO and SPI CLK. SPI CS is created by customer

using any spare SIO pin within their smartBASIC application script allowing

multi-dropping.

Note 4: BT900 module comes loaded with smart

BASIC runtime engine FW, but does not come

loaded with any smart

BASIC application script (as that is dependent on customer end

application or use). Laird provides many sample smart

BASIC application scripts

covering the services listed. Additional BLE services being added every quarter.

Note 5: 227uA is when the internal radio chip 32.768kHz is used. 113uA is when external

32.768kHz oscillator is connected to BT900 (radio chip) pin34(BT_Ext_DS_CLK).

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

9 CONN-HIG-BT900

3 H

ARDWARE

PECIFICATIONS

3.1

Block Diagram and Pin-out

smartBASIC

run-time engine

(provides safe access to

BT/BLE stack, drivers and

non-vol stores)

Non-Vol

File

System

for

smartBASIC

Apps

Non-Vol

Data

Store

I/O, UART,I2C,SPI Drivers

UART ADC I2C SPI

OR UFL

Internal

Antenna

47 connection pads

RAM

Flash

GPIO/PWM

Blutooth 4.0 Radio

( Classic BT & BLE )

User smartBASIC Application

Example App

PRINT "Laird BT900 Module"

WaitEvent

Bluetooth Classic

Bluetooth Low Energy

Stack

Serial Flash

(SPI)

ARM Cortex M3

running

smartBASIC

32.768Khz

Crystal

Figure 1: Functional HW and SW block Diagram for BT900 series Dual-Mode BT/ BLE smartBASIC module

Figure 2: BT900-Sx module pin-out (top view).

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

10 CONN-HIG-BT900

3.2

Pin Definitions

Table 2: Pin definitions

# Pin Designation Default

Function

Alternate

Function

Default

Direction

Supply

Domain

Pull-up

or pull

down

Notes Comment

1 UART_CTS UART SIO_3 IN VCC TBD

2 SIO_4 DIO ? IN

VCC TBD

1,2,3,4,5

Laird Devkit :

UART_DTR via

CON12

3 nAutoRUN IN

VCC

In ONLY

Laird Devkit:

UART_DSR via

CON12???

4 SIO_5 DIO ? IN

VCC TBD

1,2,3,4,5

Laird Devkit :

UART_DCD via

CON12

5 VCC 1.75V-3.3V

6 GND

7 SIO_6 DIO SPI MISO IN VCC TBD 1,2,3,4,5 SPIOPEN() in

smartBASIC

selects SPI

function, MOSI

and CLK will be

outputs when in

SPI master mode.

See Note 11?.

8 SIO_7 DIO SPI MOSI IN

VCC TBD

1,2,4,5,6

9 SIO_8 DIO IN

VCC TBD

1,2, 12

Laird Devkit :

UART_RI via

CON12

10 SIO_9 DIO SPI CLK IN VCC TBD 1,2,4,5,6

11 SIO_10 DIO I2C SDA IN VCC TBD 1,2,4,5,6

I2COPEN() in

smartBASIC

selects I2C

function

12 SIO_11 DIO I2C SCL IN

VCC TBD

1,2,4,5,6

13 GND

14 SIO_12 DIO IN VCC TBD 1,2,4,5,6 Laird Devkit :

Buzzer output

15 SIO_13 DIO IN VCC TBD 1,2,4,5,6 Laird Devkit :

Button1 input

16 nRESET IN VCC TBD 9,10 System Reset

(Active low)

17 SIO_14 DIO SWDIO IN VCC TBD

18 SIO_15 DIO

IN VCC TBD 1,2

19 SIO_16 DIO SWCLK IN VCC TBD 1,2

20 SIO_17 DIO

IN VCC TBD 1,2

Laird Devkit : LED1

21 SIO_18 DIO

IN VCC TBD 1,2

Laird Devkit : LED2

22 SIO_19 DIO

IN VCC TBD

BT900-Sx Hardware Integration Guide

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Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

11 CONN-HIG-BT900

# Pin Designation Default

Function

Alternate

Function

Default

Direction

Supply

Domain

Pull-up

or pull

down

Notes Comment

23 GND

24 SIO_20 DIO AIN(ADC

01) IN VCC TBD 1,2 Laird Devkit :

Button2 input

25 SIO_21 DIO AIN(ADC

00) IN VCC TBD 1,2

26 AVCC

IN 1.7V-3.6V

1,2

27 NC NC

Reserved for

future use. Do

NOT connect.

28 AVREF

29 GND

30 GND

31 BT_VREG_IN_HV

3.3V TBD

32 BT_VREG_OUT_HV DIO 1.8V TBD 1,2,4,6,7

33 GND DIO

1,2,4,6,7

34 BT_Ext_DS_CLK DIO IN BT_VDD_IO

TBD 1,2,4,6,7

35 BT_PCM_OUT DIO OUT BT_VDD_IO

TBD 1,2,4,6,7

36 BT_PCM_SYNC DIO

? BT_VDD_IO

TBD 1,2

37 BT_PCM_CLK

OUT BT_VDD_IO

TBD

38 BT_PCM_IN NC

IN BT_VDD_IO

TBD

39 BT_ACTIVE NC

? BT_VDD_IO

TBD

40 WLAN_ACTIVE ? BT_VDD_IO

TBD

41 BT_PCM#SEL DIO

IN BT_VDD_IO

TBD 1,2

42 BT_PRIORITY DIO

? BT_VDD_IO

TBD 1,2

43 BT_VDD_IO

3.3V or

1.8V

44 UART_RX DIO SIO_0 IN VCC TBD 1,2,4,6,7

UARTCLOSE()

selects DIO

functionality and

UARTOPEN()

selects uart

comms behaviour

45 UART_TX DIO SIO_1 OUT VCC TBD 1,2,4,6,7

46 UART_RTS DIO SIO_2 OUT

VCC TBD

1,2,4,6,7

47 GND

Note 1: Secondary function is selectable in smartBASIC application.

Note 2: DIO = Digital Input or Output. I/O voltage level tracks VCC.

Note 3: AIN = Analog Input

Note 4: DIO or AIN functionality is selected using the GpioSetFunc() function in smartBASIC.

Note 5: AIN configuration selected using GpioSetFunc() function.

Note 6: I2C, UART, SPI controlled by xxxOPEN() functions in smart

BASIC.

Note 7: SIO_0 to SIO_3 are DIO by default when $autorun$ app runs on power up.

Note 9: Pull the nRESET pin low for minimum 100 mS (TBD) in order for the BT900 to reset.

BT900-Sx Hardware Integration Guide

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Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

12 CONN-HIG-BT900

Note10: SPI CS is created by customer using any spare SIO pin within their smartBASIC

application script allowing multi-dropping.

Note11: SIO_TBD pin has to be pulled high externally to enable OTA (over the Air) smartBASIC

application download. Refer to the latest FW release documentation for details.

The BT900 module is delivered with the integrated smart

BASIC runtime engine FW loaded (but no

onboard smartBASIC application script). Because of this, it starts up in AT command mode by

default.

At reset, all SIO lines are configured as the defaults shown above.

SIO lines can be configured through the smart

BASIC application script to be either inputs or

outputs with pull-ups or none. When an alternative SIO function is selected (such as I2C or SPI),

the firmware does not allow the setup of internal pull-up. Therefore, when I2C interface is

selected, pull-up resistors on I2C SDA and I2C SCL MUST be connected externally as per I2C

standard.

All the SIO pins (with a default function of DIO are inputs – with no internal pull-up apart from

SIO_1 and SIO_3, which are outputs):



SIO_1 (alternative function UART_TX) is an output, set high (in FW).



SIO_2 (alternative function UART_RTS) is an output, set low (in FW).



SIO_0 (alternative function UART_RX) is an input, set with internal weak pull-up (in FW).



SIO_3 (alternative function UART_CTS) is an input, set with internal weak pull-down (in FW).



SIO_7 is an input, set with internal pull-down (in FW). It is used for over the air downloading of

smart

BASIC applications. Refer to the latest FW release documentation for details.

UART_RX, UART_TX, UART_CTS are 3.3 V level logic (if VCC is 3.3 V, i.e. SIO pin I/O levels track VCC).

For example, when RX and TX are idle, they sit at 3.3 V (if VCC is 3.3 V). Conversely, handshaking

pins CTS and RTS at 0 V are treated as assertions.

Pin 3 (nAutoRUN) is an input, with active low logic. In the development kit (DVK-BT900-sx) it is

connected so that the state is driven by the host’s DTR output line. The nAutoRUN pin must be

externally held high or low to select between the following two BT900 operating modes:



Self-contained Run mode (nAutoRUN pin held at 0 V).



Interactive / development mode (nAutoRUN pin held at VCC).

smartBASIC runtime engine firmware checks for the status of nAutoRUN during power-up or reset.

If it is low and if there is a smartBASIC application script named $autorun$, then the smartBASIC

runtime engine FW executes the application script automatically; hence the name

Self-contained Run Mode.

3.3

Electrical Specifications

3.3.1 Absolute Maximum ratings

Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the

module are listed below; exceeding these values causes permanent damage.

Table 3: Maximum Current Ratings

Parameter Min Max Unit

Voltage at

VCC

0.3

+3.6

AVCC

VSS

0.5

VSS+4.6

AVREF

VSS

0.5

VSS+4.6

BT_VREG_IN_HV

2.3

4.8

BT900-Sx Hardware Integration Guide

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Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

13 CONN-HIG-BT900

BT_VREG_OUT_HV

1.7

2.0

BT_VDD_IO

0.4

3.6

Voltage at GND pin

Voltage at SIO pin

0.3

VCC+0.3

Storage temperature

+85

ºC

3.3.2 Recommended Operating Parameters

Table 4: Power Supply Operating Parameters

Parameter Min Typ Max Unit

VCC

(Note1)

3.6

AVCC

(AVCC=VCC)

Note

1.7

3.3

3.6

AVREF

(when AVCC>=2.7V

AVREF

(when AVCC<2.7V)

2.7V

AVCC

VCC Maximum ripple or noise

%of VCC

VCC rise time (0 to 1.8V

)

VCC shut down time (1.8V to 0V)

0.1

Operating Temperature Range

-40 -

+85 ºC

BT_VREG_IN_HV

2.3

3.6

BT_VREG_OUT_HV

1.75

1.95

BT_VDD_IO

1.2

3.6

Note 1: Notes on power on. Turn on/off in the following order or at same time.

Turning on: VCCAVCCAVRH. Turning off: AVRHAVCCVCC. If not using

the ADC convertor, connect AVCC=VCC.

Note 2: The maximum VCC ripple or noise (at any frequency) should not exceed 10% of VCC.

Ensure transient fluctuation rate does not exceed 0.1V/uS.

Note 3: nRESET input time is minimum 500nS. The on-board power-on reset circuitry may not

work for rise times outside the noted interval.

Time reset is active from VCC reaches 1.75 V with x mS rise time is v mS typical.

Time reset is active from VCC reaches 1.75 V with y uS rise time is z mS typical.

Note4: BT radio chip in the BT900 has two internal regulators, a high voltage (input pin

BT_VREG_IN_HV) and low voltage (input pin BT_VREG_OUT_HV) regulator. ONLY one

regulator can be used to power radio chip.

Method1: If BT900 is required to operate from 3.3V, connect external 3.3V supply to

pin31 BT_VREG_IN_HV and MUST leave pin32 BT_VREG_OUT_HV unconnected.

Pin5(VCC) and pin43(BT_VDD_IO) should be connected to pin31 BT_VREG_IN_HV.

Method2: If BT900 is required to operate from 1.8V, connect external 1.8V supply to

pin32 BT_VREG_OUT_HV and MUST leave pin31 BT_VREG_IN_HV unconnected.

Pin5(VCC) and pin43(BT_VDD_IO) should be connected to pin32 BT_VREG_OUT_HV.

Table 5: Signal Levels for Interface, SIO

Parameter Condition Min Typ Max Unit

VIH Input high voltage

VCC<2.7V

VCC>=2.7V

0.7VxCC

0.8VxCC

VCC+0.3

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14 CONN-HIG-BT900

VIL Input low voltage

VCC<2.7V

VCC>=2.7V

VSS

0.3

0.3xVCC

0.2xVCC

VOH Output high voltage

(std. drive, 4mA)

VCC<2.7V

VCC>=2.7V

VCC-0.45

VCC-0.5

VCC

VOL Output low voltage

(std. drive, 4mA)

VCC<2.7V

VCC>=2.7V

VSS

0.4

Pull up resistance

VCC<2.7V

VCC>=2.7V

134

Ω

kΩ

Input capacitance

Note 1: Maximum number of pins with 4 mA drive is TBD.

Table 6: SIO pin alternative function AIN (ADC) specification

Parameter

Min

Typ

Max

Unit

AVCC

(AVCC=VCC)

1.75

3.3

3.6

AVCC current draw(ADC 1 unit

operation)

AVCC current draw (ADC stop)

0.27

0.03

0.42

AVREF

(when AVCC

>=2.7V

AVREF

(when AVCC<2.7V)

2.7V

AVCC

AVREF current draw (ADC 1 unit

operation)

AVREF current draw (ADC stop)

0.72

0.02

1.29

2.6

ADC input pin (AIN) voltage maximum VSS

AVREF V

ADC input port (AIN) current draw

Time required to convert single sample

12bit mode 2

10 uS

ADC input resistor impedance (during

operation)

AVCC≥2.7V

1.8V≤AVCC<2.7V

ADC input capacitance impedance

(during operation)

2.2

5.5-10.5

kOhm

9.4 pF

Note 1: TBD

Note 2: Currently, the smartBASIC runtime engine firmware allows 12-bit mode.

Note 3: ADC input impedance is estimated mean impedance of the ADC (AIN) pins. The ADC

is highly sensitive to the impedance of the source. The ADC (AIN) input impedance is

2.2-10.5k. Normally, when not sampling, the ADC (AIN) impedance will have very high

value and can consider it to be an open circuit. The moment ADC is sampling,

ADC(AIN) impedance is 2.2-10.5k.

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15 CONN-HIG-BT900

ext

: Output impedance of external circuit (kOhms)

ext

: Sampling time (nS)

≥ (R

AIN

+ R

ext

) x C

AIN

x 9

AIN

: Input resistor of ADC(kOhms)=2.2kOhms at 2.7V≤AVCC≤3.6V

Input resistor of ADC(kOhms)=5.5kOhms at 1.8V≤AVCC≤2.7V

AIN

: Input capacity of ADC(pF)=9.4pF at 1.8V≤AVCC≤3.6V

3.3.3 nAutoRUN pin and Operating Modes

Operating modes (refer to the smart

BASIC manual for details):



Self-contained mode



Interactive / Development mode

Table 7: nAutoRUN pin

Signal Name Pin No

Comments

nAutoRUN 3 I

Input with active low logic.

Operating mode selected by nAutoRun pin status:

If Low (0V), runs $autorun$ if it exists;

If High (VCC), runs via at+run (and “file name” of application).

Pin 3 (nAutoRUN) is an input, with active low logic. In the development board (DVK-BT900-sx) it is

connected so that the state is driven by the host’s DTR output line. nAutoRUN pin needs to be

externally held high or low to select between the two BT900 operating modes:



Self-contained Run mode (nAutoRUN pin held at 0V).



Interactive / Development mode (nAutoRUN pin held at VCC).

smartBASIC runtime engine firmware checks for the status of nAutoRUN during power-up or reset.

If it is low and if there is a smartBASIC application named $autorun$ then the smartBASIC runtime

engine executes the application automatically; hence the name self-contained run mode.

3.3.4 OTA (Over the Air)

smart

BASIC application download

In future release this feature will be available.

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16 CONN-HIG-BT900

Refer to latest FW release (TBD) documentation (FW release notes and smart

BASIC user manual)

for initial details.

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17 CONN-HIG-BT900

Table 8: OTA mode

Signal Name Pin No I/

Comments

(SIO_TBD) 9 I Internal pull down (default).

OTA mode selected by externally pulling SIO_7 pin:

High (VCC), then OTA smart

BASIC application download is

possible.

The OTA smart

BASIC application download feature can be useful for a customer’s production

because it allows the module to be soldered into an end product without preconfiguration; the

application can then be downloaded over the air once the product has been pre-tested.

Note: It is the smart

BASIC application that is downloaded over the air and NOT the firmware.

Due to this principle reason for use in production, to facilitate multiple programming

stations in a locality the transmit power is limited (to lower Tx power), refer to smart

BASIC

user manual for more details.

4 P

OWER

ONSUMPTION

Data taken at VCC 3.3V and 25ºC.

4.1

Power Consumption

Table 9: Power consumption

Parameter Min Typ Max Unit

Active Peak current –Note1

TX only run peak current @TXpwr= +8 dBm

TX only run peak current @T pwr= +4 dBm

TX only run peak current @TXpwr= 0 dBm

TX only run peak current @TXpwr= -4 dBm

TX only run peak current @TXpwr= -8 dBm

TX only run peak current @TXpwr= -12 dBm

TX only run peak current @TXpwr= -16 dBm

T X only run peak current @TXpwr= -20 dBm

Active Mode

RX only ‘peak’ current (Note2)

TBD

Ultra Low Power Mode1(Note3)

Standby Doze (waitevent)

Standby Doze (waitevent)-Note3

227

113

Ultra Low Power Mode2(Note4)

Deep Sleep (no RAM retention)

7 (Note 4)

BLE Mode

Active Mode Average current (Note5)

Advertising Average Current draw

TBD

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18 CONN-HIG-BT900

Parameter Min Typ Max Unit

Max

with advertising inter

al (min) 20 mS

Min, with advertising interval (max) 10240 mS

Connection Average Current draw

Max, with connection interval (min) 7.5 mS

with connection interval 67.5 mS

Min, with connection interval (max) 4000 mS

TBD

Note 1:

Note 2: Firmware version

Note 3: Standby Doze is entered automatically (when waitevent statement is encountered

within a smartBASIC application script). In Standby Doze, all peripherals that are

enabled stay on and may re-awaken the chip. Depending on active peripherals,

current consumption ranges from ~xx µA to > 1 mA. See individual peripherals current

consumption in tables in section Peripheral block current consumption 4.3.

External supplied Sleep Clock oscillator for BT Radio chip sleep modes (BT900 pin34,

BT_Ext_DS_CLK). There is current consumption saving of 114uA when using external

32.768kHz.

227uA is when the internal radio chip 32.768kHz is used.

113uA is when external 32.768kHz oscillator is connected to BT900 (radio chip)

pin34(BT_Ext_DS_CLK). PSKey needs to be changed via smartBASIC command.

Note 4: In Deep Sleep, everything is disabled and the only wake-up sources are reset and

changed on pins on which sense is enabled. The current consumption seen is ~7uA

typical. Current smart

BASIC runtime engine firmware (v9.x.y.z) requires a hardware reset

to come out of deep sleep. Future firmware releases allow coming out from Deep Sleep

to Standby Doze through GPIO signal through the reset vector. Deep Sleep mode is

entered (with a command in smart

BASIC application script).

Note 5: BLE radio taken with TX power 8 dBm and all peripherals off (UART OFF after radio event),

slave latency of 0 (in a connection). Average current consumption depends on a

number of factors [including TX power, VCC accuracy of 26 MHz and 32.768 kHz). With

these factors fixed, the largest variable is the advertising or connection interval set.

Advertising Interval range:

20 ms to 10240 ms in multiples of 0.625 ms for Advert type=ADV_IND and

ADV_DIRECT_IND.

100 ms to 10240 ms in multiples of 0.625 ms for Advert type=ADV_SCAN_IND and

ADV_NONCONN_IND.

For advertising timeout, if the advert type is ADV_DIRECT_IND, then the timeout is limited

to 1.28 seconds (1280 ms).

For an advertising event,

- the minimum average current consumption is when the advertising interval is large

10240 mS (although this may cause long discover times (for the advertising event) by

scanners

- the maximum average current consumption is when the advertising interval is small 20

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19 CONN-HIG-BT900

Other factors that are also related to average current consumption include the

advertising payload bytes in each advertising packet and whether continuously

advertising or periodically advertising.

Connection Interval range -

7.5 ms to 4000 ms in multiples of 1.25 ms.

For a connection event,

- the minimum average current consumption is when the connection interval is large

4000 mS

– the maximum average current consumption is with the shortest connection interval of

7.5 ms; no slave latency.

Other factors that are also related to average current consumption include whether

transmitting 6 packets per connection interval & each packet contains 20 bytes (which

is the maximum for each packet) and an inaccurate 32 kHz master clock accuracy

would increase the average current consumption.

4.2

Measured Peak Current Waveforms During BLE Advertising and Connection

Error! Reference source not found. illustrates current waveforms observed as the BT900 module

performs advertising and connection functionality.

Figure 3: Typical peak current

consumption profile during advertising

in slave mode @ TX PWR +8dBm. UART is

OFF. 8

Figure 4: Typical peak current consumption profile during data

connection event in slave mode @ TX PWR +8dBm. UART is ON.

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20 CONN-HIG-BT900

dBm

Figure 5: Typical peak current consumption profile during advertising in slave mode versus TX PWR

Note: In the above pictures, UART is ON. X-axis time (1 mS per square), Y-axis current (2 mA per

square).

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21 CONN-HIG-BT900

4dBm

0dBm

4dBm

8dBm

12dBm

16dBm

20dBm

Figure 6: Typical peak current consumption profile during connection event in slave mode versus TX PWR.

Figure 7:

Note: In the above pictures, UART is ON. X-axis time (1 mS per square), Y-axis current (2 mA per

square).

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22 CONN-HIG-BT900

4.3

Peripheral block current consumption

The values below are calculated for a typical operating voltage of 3 V.

Table 10: UART Power Consumption

Parameter Min Typ Max Unit

UART Run current @ 115200 bps xxx uA

UART Run current @ 1200 bps xxx uA

UART Baud rate 1.2 115.2 kbps

Table 11: SPI Power Consumption

Parameter Min Typ Max Unit

SPI Master Run current @ 125 kbps xxx uA

SPI Master Run current @ 4 Mbps xxx uA

SPI bit rate 0.125 8 Mbps

Table 12: I2C Power Consumption

Parameter Min Typ Max Unit

I2C Run current @ 100 kbps xxx uA

I2C Run current @ 400 bps xxx uA

I2C Bit rate 100 400 kbps

Table 13: ADC

Parameter Min Typ Max Unit

ADC current during conversion xxx uA

The above current consumption is for the particular peripheral only and to operate that

peripheral requires some other internal blocks which consume fixed amount of base current

(~xxxuA).

This base current of ~xxxx uA is consumed when the UART, SPI, I2C, or ADC is opened (operated).

For asynchronous interface like the UART (asynchronous as the other end can communicate at

any time), the UART (on BT900) must kept open (by a command in smart

BASIC application script)

resulting in the base current consumption penalty.

For synchronous interface like the I2C or SPI (since BT900 side is the master), the interface can be

closed and opened only (by a command in smart

BASIC application script) when needed,

resulting in current saving (no base current consumption penalty). Similar argument for ADC

(open ADC when needed).

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23 CONN-HIG-BT900

5 F

UNCTIONAL

ESCRIPTION

The BT900 Dual Mode (BT/BLE) module is a self-contained Bluetooth Low Energy product and

requires only power and a user’s smartBASIC application to implement full BLE functionality. The

integrated, high performance antenna combined with the RF and Base-band circuitry provides

the Bluetooth Low Energy wireless link, and any of the SIO lines provide the OEM’s chosen

interface connection to the sensors. The user’s smartBASIC application binds the sensors to the

BLE wireless functionality.

The variety of hardware interfaces and the smartBASIC programming language allow the BT900

module to serve a wide range of wireless applications, whilst reducing overall time to market and

the learning curve for developing Dual mode BT/ BLE products.

To provide the widest scope for integration a variety of physical host interfaces / sensors are

provided. The major BT900 series module functional blocks described below.

5.1

Power management (includes brown-out and power on reset)

Power management features:



System Standby Doze / Deep Sleep modes.



Brownout Reset.



Open /Close Peripherals (UART, SPI, I2C, SIO’s and ADC). Peripherals consume current when

open; each peripheral can be individually closed to save power consumption (with a

command in a smartBASIC application script).



2-region RAM retention (No RAM retention in Deep Sleep mode).



smartBASIC command allows the VCC voltage to be read (through the internal ADC).



Power fail comparator.



Pin wake-up system from Deep sleep.

Power supply features:



Supervisor HW to manage power on reset, brownout (and power fail).



1.8V to 3.6V supply range using internal LDO regulator.

5.2

Clocks and TIMERS

5.2.1 Clocks

The integrated high accuracy (+/-20ppm) 32.768kHz crystal oscillator provides protocol timing

and helps with Radio power consumption in the system Standby Doze /Deep sleep modes by

reducing the time that the RX window needs to be open. Standard accuracy clocks tend to

have lower accuracy +/-250 ppm.

The integrated high accuracy 26 MHz (+/-10ppm) crystal oscillator helps with Radio operation

and also helps reduce power consumption in the Active modes.

5.2.2 TIMERS

In keeping with the event driven paradigm of smart BASIC, the timer subsystem enables smart

BASIC applications to be written which allow future events to be generated based on timeouts.

Regular Timer: There are x built-in timers (regular timer) derived from a single RTC clock which are

controlled solely by smart

BASIC functions. The resolution of the regular timer is xyz microseconds.

Tick Timer is a xx bit free running counter that increments every x millisecond. The resolution of this

counter is xxx microseconds. This counter can be accessed using the functions GetTickCount()

and GetTickSince().

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24 CONN-HIG-BT900

Refer to the smart

BASIC user manual.

5.3

Memory for

smart

BASIC Application Code

User has up to 4Kbytes (TBD) of data memory available for smart

BASIC application script.

5.4



2402–2480 MHz Bluetooth4.0 Dual Mode (BT and BLE) (1Mbps to 3Mbps over the air data

rate).



TX output power of +8 dBm programmable (via smartBASIC command) to -20 dBm in steps

of 4 dB.



Receiver (with integrated channel filters) to achieve maximum sensitivity -90dBm @ 1 Mbps

BLE or Classic BT 2Mbps, 3Mbps).



RF conducted interface available in 3-ways:

- BT900-SA -RF connected to on-board antenna on BT900-SA

- BT900-SC -RF connected to on-board uFL RF connector on BT900-SC



Antenna options:

- Integrated monopole chip antenna on BT900-SA

- External dipole antenna connected with to uFL RF connector on BT900-SC.

5.5

UART Interface

The Universal Asynchronous Receiver/Transmitter offers fast, full-duplex, asynchronous serial

communication with built-in flow control support (UART_CTS, UART_RTS) in HW up to 1 Mbps baud.

Parity checking and generation for the 9th data bit are supported.

UART_TX, UART_RX, UART_RTS, and UART_CTS form a conventional asynchronous serial data port

with handshaking. The interface is designed to operate correctly when connected to other UART

devices such as the 16550A. The signalling levels are nominal 0 V and 3.3 V (tracks VCC) and are

inverted with respect to the signalling on an RS232 cable.

Two-way hardware flow control is implemented by UART_RTS and UART_CTS. UART_RTS is an

output and UART_CTS is an input. Both are active low.

These signals operate according to normal industry convention. UART_RX, UART_TX, UART_CTS,

UART_RTS are all 3.3 V level logic (tracks VCC). For example, when RX and TX are idle they sit at

3.3 V. Conversely for handshaking pins CTS, RTS at 0 V is treated as an assertion.

The module communicates with the customer application using the following signals:



Port /TXD of the application sends data to the module’s UART_RX signal line



Port /RXD of the application receives data from the module’s UART_TX signal line

BT900

UART_TX

UART_RX

UART_CTS

UART_RTS

Application - Host

/RXD

/TXD

/RTS

/CTS

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25 CONN-HIG-BT900

Note: The BT900 serial module output is at 3.3V CMOS logic levels (tracks VCC). Level

conversion must be added to interface with an RS-232 level compliant interface.

Some serial implementations link CTS and RTS to remove the need for handshaking. Laird does

not recommend linking CTS and RTS other than for testing and prototyping. If these pins are linked

and the host sends data at the point that the BT900 deasserts its RTS signal, then there is significant

risk that internal receive buffers will overflow, which could lead to an internal processor crash. This

will drop the connection and may require a power cycle to reset the module. Laird recommends

that the correct CTS/RTS handshaking protocol be adhered to for proper operation.

Table 14: UART Interface

Signal Name Pin

I/O Comments

SIO_1 / UART_TX 45 O SIO_1 (alternative function UART_TX) is an output, set high (in

FW).

SIO_0 / UART_RX 44 I SIO_0 (alternative function UART_RX) is an input, set with

internal pull-up (in FW).

SIO_2 / UART_RTS 46 O SIO_2 (alternative function UART_RTS) is an output, set low (in

FW).

SIO_3 / UART_CTS 35 I SIO_3 (alternative function UART_CTS) is an input, set with

internal pull-down (in FW).

The UART interface is also used to load customer developed smart

BASIC application script.

5.6

SPI Bus

The SPI interface is an alternate function on SIO pins, configurable by smart

BASIC.

The Module is a master device that uses terminals SPI_MOSI, SPI_MISO, and SPI_CLK. SPI_CSB is

implemented using any spare SIO digital output pins to allow for multi-dropping.

The SPI interface enables full duplex synchronous communication between devices. It supports a

3-wire (SPI_MOSI, SPI_MISO, SPI_SCK,) bidirectional bus with fast data transfers to and from

multiple slaves. Individual chip select signals will be necessary for each of the slave devices

attached to a bus, but control of these is left to the application through use of SIO signals. I/O

data is double buffered.

The SPI peripheral supports SPI mode 0, 1, 2, and 3.

Table 15: Peripheral supports

Signal Name Pin No I/O Comments

SPI_MOSI 8 O This interface is an alternate function configurable by

smart

BASIC. Default in the FW pin 8 and 10 are inputs.

SPIOPEN() in smart

BASIC selects SPI function and

changes pin8and 10 to outputs (when in SPI master

mode).

SPI_MISO 7 I

SPI_CLK 10 O

5.7

I2C Interface

The I2C interface is an alternate function on SIO pins, configurable by smart

BASIC command.

The Two-wire interface can interface a bi-directional wired-OR bus with two lines (SCL, SDA) and

has master /slave topology. The interface is capable of clock stretching. Data rates of 100 kbps

and 400 kbps are supported.

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26 CONN-HIG-BT900

An I2C interface allows multiple masters and slaves to communicate over a shared wired-OR

type bus consisting two lines which normally sit at VCC. The BT900 module can only be configured

as an I2C master with additional constraint that it be the only master on the bus. The SCL is the

clock line which is always sourced by the master and SDA is a bi-directional data line which can

be driven by any device on the bus.

IMPORTANT: It is essential to remember that pull-up resistors on both SCL and SDA lines are not

provided in the module and MUST be provided external to the module.

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Table 16: I2C Interface

Signal Name Pin No I/O Comments

I2C_SDA 11 I/O This interface is an alternate function on each pin,

configurable by smartBASIC. I2COPEN() in smartBASIC

selects I2C function.

I2C_SCL 12 I/O

5.8

General Purpose I/O, ADC and Quadrature Decoder

5.8.1 GPIO

The 18 SIO pins are configurable by smartBASIC. They can be accessed individually. Each has the

following user configured features:



Input/output direction



Output drive strength (4mA)



Internal pull up resistors (33K typical) or no pull-up.



Wake-up from high or low level triggers on all pins.



GPIO pins (pinswhose names begin with “BT”

5.8.2 Quadrature Decoder

The following feature exists in hardware but cannot be configured in the firmware currently:



The quadrature decoder provides buffered decoding of quadrature-encoded sensor

signals. It is suitable for mechanical and optical sensors with an optional LED output signal

and input debounce filters. The sample period and accumulation are configurable to

match application requirements. All pins individually can be configured to carry

quadrature demodulator signals.

5.8.3 ADC

The ADC is an alternate function on SIO pins, configurable by smart

BASIC.

The BT900 provides access to six-channel 12-bit incremental ADC. This enables sampling multiple

external signals through a front end MUX. The ADC has configurable input and TBD.

Note: Current smartBASIC runtime engine firmware (v9.x.y.z) provides access to 12-bit mode

resolution only.

5.8.3.1

Analog Interface (ADC)

Table 17: Analog interface

Signal Name Pin No

I/O Comments

AIN

–

Analog Input

This interface is an alternate function on each pin,

configurable by smartBASIC. AIN configuration

selected using GpioSetFunc() function.

Up to 12bit resolution.

AIN

–

Analog Input

5.8.4 APWM and FREQ signal output on upto xSIO pins

The PWM and FREQ output is an alternate function on SIO pins, configurable by smart

BASIC.

The ability to output a PWM (Pulse Width Modulated) signal or FREQ output signal on up to x GPIO

(SIO) output pins has been added since smartBASIC runtime engine firmware v9.x.y.z and can be

selected using GpioSetFunc() function.

PWM output signal has a frequency and duty cycle property. PWM output is generated using

xx-bit hardware timers. The timers are clocked by a xMHz clock source. Frequency is adjustable

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28 CONN-HIG-BT900

(upto xMHz )and the Duty cycle can be set over range from 0% to 100% (both configurable by

smart

BASIC command). Note, the frequency driving each of the x SIO pins is the same but the

duty cycle can be independently set for each pin.

FREQ output signal frequency can be set over a range of 0Hz to xMHz (with 50% mark-space

ratio).

5.9

nRESET pin

Table 18: nRESET pin

Signal Name

Pin No

I/O

Comments

nRESET

BT900

HW reset (active low

)

Pull the nRESET pin low for

minimum 100mS in order for the BT900 to reset.

5.10

nAutoRUN pin

Refer to section nAutoRUN pin and Operating Modes regarding operating modes and the

nAutoRUN pin.



Self-contained Run mode



Interactive / Development mode

5.11

smart

BASIC runtime engine firmware upgrade

The BT900 SW consists of:



BT900 smartBASIC runtime engine FW (loaded at production, may be upgraded customer).



BT900 smartBASIC application script developed by customer (loaded through UART by

customer).

To allow customer the capability to upgrade the BT900 smartBASIC runtime engine FW, to the

latest version released from Laird), the current smartBASIC runtime engine firmware (v9.x.y.z) only

allows this upgrade via the UART.

Figure 8:

5.12

BT900-SA on-board chip antenna characteristics

The BT900-SA on-board chip monopole antenna radiated performance depends on the host PCB

layout.

BT900 development board was used for BT900 development and antenna performance

evaluation. To obtain similar performance follow guidelines in section PCB Layout on Host PCB for

BT900-SA to allow the on-board antenna to radiate and reduce proximity effects due to nearby

host PCB GND copper or metal covers.

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Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

29 CONN-HIG-BT900

BT900-SA on-board antenna datasheet:

http://www.acxc.com.tw/product/at/at3216/AT3216-B2R7HAA_S-R00-N198_2.pdf

Antenna performance on DVK-BT900-V01 devboard shown below.

Peak gain Avg. gain

XY-plane -2.6 -7.4

Peak gain Avg. gain

XZ-plane -2.8 -5.9

Peak gain Avg. gain

YZ-plane -1.6 -4.7

BT900-Sx Hardware Integration Guide

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Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

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30 CONN-HIG-BT900

6 H

ARDWARE

NTEGRATION

UGGESTIONS

6.1

Circuit

The BT900-series module is easy to integrate requiring no external components on the customer’s

board apart from those required by customer for development and in customers end

application.

Checklist (for Schematic):



VCC

External power source within the operating range, rise time and noise/ripple specification of

BT900. Add decoupling capacitors for filtering the external source. Power-on reset circuitry

within BT900 series module incorporates brown-out detector, thus simplifying power supply

design. Upon application of power, the internal power-on reset ensures module starts

correctly.



Decide if BT900 is to be powered by 3.3V or 1.8V external Power Supply

BT radio chip in the BT900 has two internal regulators, a high voltage (input pin

BT_VREG_IN_HV) and low voltage (input pin BT_VREG_OUT_HV) regulator. ONLY one

regulator can be used to power radio chip.

Method1: If BT900 is required to operate from 3.3V, connect external 3.3V supply to pin31

BT_VREG_IN_HV and MUST leave pin32 BT_VREG_OUT_HV unconnected.

Pin5(VCC) and pin43(BT_VDD_IO) should be connected to pin31 BT_VREG_IN_HV.

Method2: If BT900 is required to operate from 1.8V, connect external 1.8V supply to pin32

BT_VREG_OUT_HV and MUST leave pin31 BT_VREG_IN_HV unconnected.

Pin5(VCC) and pin43(BT_VDD_IO) should be connected to pin32 BT_VREG_OUT_HV.



Place decoupling capacitor on pin41 BT_VDD_IO. Value 0.1uF or value suitable to filter the

noise present.



AIN (ADC) and SIO pin IO voltage levels

BT900 SIO voltage levels are at VCC. Ensure input voltage levels into SIO pins are at VCC

also (if VCC source is a battery whose voltage will drop). Ensure ADC pin maximum input

voltage for damage is not violated.



External supplied Sleep Clock oscillator for BT Radio chip sleep modes (BT900 pin34,

BT_Ext_DS_CLK).

There is current consumption saving of 114uA when using external 32.768kHz.

227uA is when the internal radio chip 32.768kHz is used.

113uA is when external 32.768kHz oscillator is connected to BT900 (radio chip)

pin34(BT_Ext_DS_CLK). PSKey needs to be changed via smartBASIC command.

Refer to DK-BT900-V01 for schematic and recommended part, Siward OSC863100-SCO-B660

(description: OSC,32.768KHz,+/-25ppm,3.2*2.5*1.2mm,SMD,-40~+85dC).



UART

Is required for loading customer smartBASIC application script during development (or for

subsequent upgrade). Add connector to allow UART to be interfaced to PC (via UART –

RS232 or UART- USB).



UART_RX and UART_CTS

SIO_0 (alternative function UART_RX) is an input, set with internal pull-up (in FW). The

pull-up prevents the module from going into deep sleep when UART_RX line is idling.

SIO_3 (alternative function UART_CTS) is an input, set with external pull-down. This pull-down

ensures the default state of the UART_CTS will be asserted which means can send data out

of the UART_TX line. In the case when UART_CTS is not connected (which we do not

recommend).

BT900-Sx Hardware Integration Guide

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Europe: +44-1628-858-940

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31 CONN-HIG-BT900



nAutoRUN pin and operating mode selection

nAutoRUN pin needs to be externally held high or low to select between the two BT900

operating modes at power-up:

- Self-contained Run mode (nAutoRUN pin held at 0V).

- Interactive / development mode (nAutoRUN pin held at VCC).

Make provision to allow operation in the required mode. Add jumper to allow nAutoRUN pin

to be held high or low (via 10K resistor) OR driven by host GPIO.



I2C

It is essential to remember that pull-up resistors on both I2C_SCL and I2C_SDA lines are not

provided in the BT900 module and MUST be provided external to the module as per I2C

standard.



SPI

Implement SPI chip select using any unused SIO pin within your smartBASIC application

script then SPI_CS is controlled from smartBASIC application allowing multi-dropping.



SIO pin direction

BT900 modules shipped from production with smart

BASIC runtime engine FW, all SIO pins

(with “default function” of “DIO”) are mostly digital inputs (see Pin Definitions Table2).

Remember to change the direction SIO pin (in your smart

BASIC application script) if that

particular pin is wired to a device that expects to be driven by the BT900 SIO pin configured

as an output. Also these SIO pins that are inputs have by default (in FW) no internal pull-up

(TBD) resistor-enabled, and therefore are floating (TBD). You are free to configure in your

smartBASIC application script.

Note: Internal pull-up, pull down will take current from VCC.



SIO_TBD pin and Over the Air smartBASIC application download feature

SIO_TBD is an input, set with internal pull-down (in FW). Refer to latest FW release

documentation on how SIO_TBD is used for Over the Air smartBASIC application download

feature. SIO_TBD pin has to be pulled high externally to enable the feature. Decide if this

feature is required in production.



nRESET pin (active low)

Hardware reset. Wire out to push button or drive by host.

By default module is out of reset when power applied to VCC pin.

6.2

PCB Layout on Host PCB - General

Checklist (for PCB):



MUST locate BT900-Sx module close to the edge of PCB (mandatory for BT900-SA for

on-board chips antenna to radiate properly).



Use solid GND plane on inner layer (for best EMC and RF performance).



All module GND pins MUST be connected to host PCB GND.



Place GND vias close to module GND pads as possible



Unused PCB area on surface layer can flooded with copper but place GND vias regularly

to connect copper flood to inner GND plane. If GND flood copper underside the module

then connect with GND vias to inner GND plane.



Route traces to avoid noise being picked up on VCC supply and AIN(analogue) and SIO

(digital) traces.



Do NOT run any track near pin34 of BT900-Sx. Pin34 is BT_Ext_DS_CLK which the external

supplied 32.768kHz oscillator is connected to. MUST ensure the 32.768kHz is shield by GND

on either side, see devboard PCB layout DVK-BT900-V01.



Ensure no exposed copper underside of the module (refer to land pattern of BT900

development board).

BT900-Sx Hardware Integration Guide

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Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

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32 CONN-HIG-BT900

6.3

PCB Layout on Host PCB for BT900-SA

6.3.1 Antenna keep-out on host PCB

The BT900-SA has an integrated chip antenna and its performance is sensitive to host PCB. It is

critical to locate the BT900-SA on the edge of the host PCB (or corner) to allow the antenna to

radiate properly. Refer to guidelines in section PCB land pattern and antenna keep-out area for

BT900-SA. Some of those guidelines repeated below.



Ensure there is no copper in the antenna keep-out area on any layers of the host PCB. Keep

all mounting hardware and metal clear of the area to allow proper antenna radiation.



For best antenna performance, place the BT900-SA module on the edge of the host PCB,

preferably in the corner with the antenna facing the corner.



The BT900 development board has the BT900-SA module on the edge of the board (not in

the corner). The antenna keep-out area is defined by the BT900 development board

which was used for module development and antenna performance evaluation is shown in

Figure 9, where the antenna keep-out area is ~4.2 mm wide, 34.2 mm long; with PCB

dielectric (no copper) height 1.0 mm sitting under the BT900-SA antenna.



A different host PCB thickness dielectric will have small effect on antenna.



The antenna-keep-out defined in Host PCB Land Pattern and Antenna Keep-out for

BT900-SA applies when the BT900-SA is placed in the corner of the host PCB. When BT900-SA

cannot be placed as such, it must be placed on the edge of the host PCB and the antenna

keep out must be observed. An example is shown in Figure 9.

Figure 9: Antenna keep-out area (shown in red), corner of the BT900 development board for BT900-SA

module.

Antenna Keepout

BT900-SA module

BT900-Sx Hardware Integration Guide

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33 CONN-HIG-BT900

Note: 1. BT900 module placed on edge of host PCB.

2. Copper cut-away on all layers in “antenna Keep-out” area under BT900 on host PCB.

6.3.2 Antenna keep-out and Proximity to Metal or Plastic

Checklist (for metal /plastic enclosure):



Minimum safe distance for metals without seriously compromising the antenna (tuning) is

40mm top/bottom and 30mm left or right.



Metal close to the BT900-SA chip monopole antenna (bottom, top, left, right, any direction)

will have degradation on the antenna performance. How much; that is entirely system

dependent which means some testing by customer required (in their host application).



Anything metal closer than 20mm will start to significantly degrade performance (S11, gain,

radiation efficiency).



It is best that the customer tests the Range with mock-up (or actual prototype) of the

product to assess effects of enclosure height (and material whether metal or plastic).

6.4

External Antenna Integration with BT900-SC

Please refer to the regulatory sections for FCC, IC, CE, and Japan for details of use of BT900-Sx

with external antennas in each regulatory region.

The BT900 family has been designed to operate with the below external antennas (with a

maximum gain of 2.0 dBi). The required antenna impedance is 50 ohms. See Table 19.

External antennas improve radiation efficiency.

Table 19: External antennas for the BT900

External Antenna Part

Number

Mfg. Type Gain (dBi)

Connector

Type

BT900 Part

number

S181FL

RMM

2450S

Nearson

Dipole

2.0

uFL

Note1

BT900

EBL2449A1

15UFL

Laird

PCB

Dipole

uFL

Note1

BT900

MAF94

190

Laird

Dipole

2.0

uFL

BT900

MAF94019

Laird

Dipole

1.5

uFL

BT900

Note 1:

Antenna manufacturer Laird contact information:

Sales:

Tel:

Email:

BT900-Sx Hardware Integration Guide

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Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

34 CONN-HIG-BT900

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

35 CONN-HIG-BT900

7 M

ECHANICAL

ETAILS

7.1

BT900 Mechanical Details

Figure 10: BT900 Mechanical drawings

Development Kit Schematics can be found at:

http://lairdtech.com/Products/Embedded-Wireless-Solutions/Bluetooth-Radio-Modules/BL900-Ser

ies/#productGroupTabs-2147488080

BT900-Sx Hardware Integration Guide

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Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

36 CONN-HIG-BT900

7.2

Host PCB Land Pattern and Antenna Keep-out for BT900-SA

Dimensions in mm.

APPLICATION NOTES

1. Ensure there is no copper in the antenna ‘keep out area’ on any layers of the host PCB.

Also keep all mounting hardware or any metal clear (Refer to 6.3.2) on of the area to

reduce effects of proximity detuning the antenna and to help antenna radiate properly.

3. For BT900-SA (has on-board chip antenna) best antenna performance, the module

BT900-SA MUST be placed on the edge of the host PCB and preferably in the corner with

the antenna facing the corner. Above “Keep Out Area” is the module placed in corner of

BT900-Sx Hardware Integration Guide

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37 CONN-HIG-BT900

PCB. If BT900-SA is not placed in corner but on edge of host PCB, the antenna “Keep Out

Area” is extended (see Note4).

4. BT900 development board has BT900-SA placed on the edge of the PCB board (and not in

corner) for that the Antenna keep out area is extended down to the corner of the

development board, see section PCB Layout on Host PCB for BL900-SA, Figure10. This was

used for module development and antenna performance evaluation.

5. Ensure no exposed copper under module on host PCB.

6. The user may modify the PCB land pattern dimensions based on their experience and / or

process capability.

BT900-Sx Hardware Integration Guide

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Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

38 CONN-HIG-BT900

8 A

PPLICATION

OTE FOR

URFACE

OUNT

ODULES

8.1

Introduction

Laird Technologies surface mount modules are designed to conform to all major manufacturing

guidelines. This application note is intended to provide additional guidance beyond the

information that is presented in the User Manual. This Application Note is considered a living

document and will be updated as new information is presented.

The modules are designed to meet the needs of a number of commercial and industrial

applications. They are easy to manufacture and conform to current automated manufacturing

processes.

BT900-Sx Hardware Integration Guide

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Europe: +44-1628-858-940

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39 CONN-HIG-BT900

8.2

Shipping

Figure 8-1: BT900 Shipping Tray Details

8.3

Reflow Parameters

Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture

absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator

card to display the level maintained during storage and shipment. If directed to bake units on the

card, see Table 20 and follow instructions specified by IPC/JEDEC J-STD-033. A copy of this

standard is available from the JEDEC website:

http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf

Note: The shipping tray cannot be heated above 65°C. If baking is required at the higher

temperatures displayed in in Table 20, the modules must be removed from the shipping

tray.

Modules are shipped in ESD

(Electrostatic Discharge) safe trays that

can be loaded into most

manufacturers pick and place

machines. Layouts of the trays are

provided in Figure 8-1.

BT900-Sx Hardware Integration Guide

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40 CONN-HIG-BT900

Any modules not manufactured before exceeding their floor life should be re-packaged with

fresh desiccate and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3

devices is 168 hours in ambient environment

≤

30°C/60%RH.

Table 20: Recommended baking times and temperatures

MSL

125°C

Baking Temp.

90°C/≤ 5%RH

Baking Temp.

40°C/ ≤ 5%RH

Baking Temp.

Saturated

@ 30°C/85%

Floor Life Limit

+ 72 hours

@ 30°C/60%

Saturated

@ 30°C/85%

Floor Life Limit

+ 72 hours

@ 30°C/60%

Saturated

@ 30°C/85%

Floor Life Limit

+ 72 hours @

30°C/60%

3 9 hours 7 hours 33 hours 23 hours 13 days 9 days

Laird surface mount modules are designed to be easily manufactured, including reflow soldering

to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste

and to ensure oven temperatures during reflow meet the requirements of the solder paste. Laird

surface mount modules conform to J-STD-020D1 standards for reflow temperatures.

Important: During reflow, modules should not be above 260° and not for more than 30 seconds.

Figure 8-2: Recommended Reflow Temperature

Temperatures should not exceed the minimums or maximums presented in Table 21.

Table 21: Recommended Maximum and minimum temperatures

Specification

Value

Unit

Temperature Inc./Dec. Rate (max)

1~3 °C / Sec

Temperature Decrease rate (goal)

2-4 °C / Sec

Soak Temp Increase rate (goal)

.5 - 1 °C / Sec

Flux Soak Period (Min)

70 Sec

Flux Soak Period (Max)

120 Sec

Flux Soak Temp (Min)

150 °C

Flux Soak Temp (max)

190 °C

BT900-Sx Hardware Integration Guide

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41 CONN-HIG-BT900

Specification

Value

Unit

Time Above Liquidous (max)

70 Sec

Time Above Liquidous (min)

50 Sec

Time In Target Reflow Range (goal)

30 Sec

Time At Absolute Peak (max)

5 Sec

Liquidous Temperature (SAC305)

218 °C

Lower Target Reflow Temperature

240 °C

Upper Target Reflow Temperature

250 °C

Absolute Peak Temperature

260 °C

9 FCC

AND

EGULATORY

TATEMENTS

Model US/FCC CANADA/IC

BT900

TBC

BT900

TBC

The BT900-SA and BT900-SC hold full modular approvals. The OEM must follow the regulatory

guidelines and warnings listed below to inherit the modular approval.

PART # FORM FACTOR TX OUTPUT ANTENNA

BT900-SA-0X Surface Mount 8dBm Ceramic

BT900-SC-0X Surface Mount 8dBm u.FL

*Last two slots "0X" in Part # are used for production firmware release changes. Can be values

01-99, aa-zz

The BT900 family has been designed to operate with the antennas listed below with a maximum

gain of 2.0 dBi. The required antenna impedance is 50 ohms.

Item

Part Number

Mfg.

Type

Gain (dBi)

Model

AT3216

B2R7HAA

ACX

Ceramic

BT900

S181FL

RMM

2450S

Nearson

Dipole

2.0

BT900

MAF94045

Laird

PCB

Dipole

2.0

BT900

MAF94017

Laird

Dipole

2.0

BT900

MAF94019

Laird

Dipole

1.5

BT900

Note: The OEM is free to choose another vendor’s antenna of like type and equal or lesser

gain as an antenna appearing in the table and still maintain compliance. Reference

FCC Part 15.204(c)(4) for further information on this topic.

To reduce potential radio interference to other users, the antenna type and gain should

be chosen so that the equivalent isotropic radiated power (EIRP) is not more than that

permitted for successful communication.

9.1 Power Exposure Information

Federal Communication Commission (FCC) Radiation Exposure Statement:

This EUT is in compliance with SAR for general population/uncontrolled exposure limits in ANSI/IEEE

C95.1-1999 and had been tested in accordance with the measurement methods and

procedures specified in OET Bulletin 65 Supplement C.

BT900-Sx Hardware Integration Guide

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42 CONN-HIG-BT900

This transceiver must not be co-located or operating in conjunction with any other antenna,

transmitter, or external amplifiers. Further testing / evaluation of the end product will be required if

the OEM’s device violates any of these requirements.

The BT900 is fully approved for mobile and portable applications.

9.2 OEM Responsibilities

WARNING: The OEM must ensure that FCC labelling requirements are met. This includes a clearly

visible label on the outside of the OEM enclosure specifying the appropriate Laird

Technology FCC identifier for this product.

Contains FCC ID: PI4xxxxx IC: 1931B-xxxxx

If the size of the end product is larger than 8x10cm, then the following FCC part 15.19

statement has to also be available on visible on outside of device:

The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the

following two conditions: (1) This device may not cause harmful interference, and (2)

This device must accept any interference received, including interference that may

cause undesired operation

Label and text information should be in a size of type large enough to be readily legible,

consistent with the dimensions of the equipment and the label. However, the type size for the text

is not required to be larger than eight point.

CAUTION: The OEM should have their device which incorporates the BT900 tested by a qualified

test house to verify compliance with FCC Part 15 Subpart B limits for unintentional

radiators.

CAUTION: Any changes or modifications not expressly approved by Laird Technology could void

the user’s authority to operate the equipment.

Note: This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to

provide reasonable protection against harmful interference in a residential installation.

This equipment generates, uses, and can radiate radio frequency energy and, if not

installed and used in accordance with the instructions, may cause harmful

interference to radio communications. However, there is no guarantee that

interference will not occur in a particular installation. If this equipment does not cause

harmful interference to radio or television reception, which can be determined by

turning the equipment off and on, the user is encouraged to correct the interference

by one or more of the following measures:



Re-orient or relocate the receiving antenna



Increase the separation between the equipment and the receiver



Connect the equipment to an outlet on a circuit that is different from that to which

the receiver is connected.



Consult the dealer or an experienced radio/TV technician for help.

FCC Warning:

“THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES AND INDUSTRY CANADA LICENSE-EXEMPT

RSS STANDARD(S). OPERATION IS SUBJECT TO THE FOLLOWING TWO CONDITIONS: (1) THIS DEVICE

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43 CONN-HIG-BT900

MAY NOT CAUSE HARMFUL INTERFERENCE, AND (2) THIS DEVICE MUST ACCEPT ANY INTERFERENCE

RECEIVED, INCLUDING INTERFERENCE THAT MAY CAUSE UNDESIRED OPERATION.

Industry Canada (IC) Warning:

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject

to the following two conditions: (1) this device may not cause interference, and (2) this device

must accept any interference, including interference that may cause undesired operation of the

device.

French equivalent is:

Le présent appareil est conforme aux CNR d'Industrie Canada applicable aux appareils radio

exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne

doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage

radioélectrique subi, même si le brouillage est susceptible d'en compromettre le

fonctionnement.

IC Radiation Exposure Statement

This EUT is compliance with SAR for general population/uncontrolled exposure limits in IC RSS-102

and had been tested in accordance with the measurement methods and procedures specified

in IEEE 1528.

REMARQUE IMPORTANTE

Déclaration IC d'exposition aux radiations

Ce EUT est conforme avec SAR pour la population générale / limites d'exposition non contrôlée à

IC RSS-102 et a été testé en conformité avec les méthodes de mesure et procédures spécifiées

dans la norme IEEE 1528.

Modular Approval

OEM integrator is still responsible for testing their end product for any additional compliance

requirements required with this module installed (for example, digital device emissions, PC

peripheral requirements, etc.).

Approbation modulaire

OEM intégrateur est toujours responsable de tester leur produit final pour les exigences de

conformité supplémentaires nécessaires à ce module installé (par exemple, les émissions de

périphériques numériques, les exigences de périphériques PC, etc.)

BT900-Sx Hardware Integration Guide

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44 CONN-HIG-BT900

IMPORTANT NOTE:

In the event that these conditions cannot be met (for example certain laptop configurations or

co-location with another transmitter), then the Canada authorization is no longer considered

valid and the IC ID cannot be used on the final product. In these circumstances, the OEM

integrator will be responsible for re-evaluating the end product (including the transmitter) and

obtaining a separate Canada authorization.

NOTE IMPORTANTE:

Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines

configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur),

l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le

produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final

(y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada.

Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: " BT900-SA and

BT900-SC Contient des IC: TBC".

10 J

APAN

(MIC)

EGULATORY

The BT900 is approved for use in the Japanese market. The part numbers listed below hold WW

type certification. Refer to ARIB-STD-T66 for further guidance on OEM’s responsibilities.

Model Certificate Number

Antenna

BT900-SA TBC Ceramic

BT900-SC TBC uFL

10.1 Antenna Information

The BT900 was tested with antennas listed below. The OEM can choose a different manufacturers

antenna but must make sure it is of same type and that the gain is lesser than or equal to the

antenna that is approved for use.

Item

Part Number

Mfg.

Type

Gain (dBi)

Model

AT3216

B2R7HAA

ACX

Ceramic

BT900

S181FL

RMM

2450S

Nearson

Dipole

BT900

MAF94045

Laird

PCB

Dipole

2.0

BT900

MAF94017

Laird

Dipole

2.0

BT900

MAF94019

Laird

Dipole

1.5

BT900

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

45 CONN-HIG-BT900

11 CE

EGULATORY

The BT900-SA / BT900-SC have been tested for compliance with relevant standards for the EU

market. The BT900-SC module was tested with a 2.21 dBi antenna. The OEM can operate the

BT900-SC module with any other type of antenna but must ensure that the gain does not exceed

2.21 dBi to maintain the Laird approval.

The OEM should consult with a qualified test house before entering their device into an EU

member country to make sure all regulatory requirements have been met for their complete

device.

Reference the Declaration of Conformities listed below for a full list of the standards that the

modules were tested to. Test reports are available upon request.

11.1 Antenna Information

The antennas listed below were tested for use with the BT900. For CE mark countries, the OEM is

free to use any manufacturer’s antenna and type of antenna as long as the gain is less than or

equal to the highest gain approved for use (2.21dBi) Contact a Laird representative for more

information regarding adding antennas.

Item

Part Number

Mfg.

Type

Gain (dBi)

Model

AT3216

B2R7HAA

ACX

Ceramic

BT900

S181FL

RMM

2450S

Nearson

ipole

2.0

BT900

MAF94045

Laird

PCB

Dipole

2.0

BT900

MAF94017

Laird

Dipole

2.0

BT900

MAF94019

Laird

Dipole

1.5

BT900

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

46 CONN-HIG-BT900

12 EU

ECLARATIONS OF

ONFORMITY

12.1 BT900-SA / BT900-SC

Manufacturer:

Laird

Product:

BT900

EU Directive:

RTTE 1995/5/EC

Conformity Assessment:

Annex IV

Reference standards used for presumption of conformity:

Article

Number Requirement Reference standard(s)

3.1a Health and Safety EN60950-1:2006+A11:2009+A1:2010+A12:2011

3.1b

Protection requirements

with respect to

electromagnetic

compatibility

EN 301 489-1 V1.9.2 (2011-09)

EN 301 489-17 V2.2.1 (2012-09)

Emissions:

EN55022:2006/A1:2007 (Class B)

Immunity:

EN61000-4-2:2009

EN61000-4-3:2006/A1:2008/A2:2010

3.2

Means of the efficient use of

the radio frequency

spectrum

EN 300 328 V1.8.1 (2012-06)

Declaration:

We, Laird, declare under our sole responsibility that the essential radio test suites have been

carried out and that the above product to which this declaration relates is in conformity with all

the applicable essential requirements of Article 3 of the EU Directive 1999/5/EC, when used for its

intended purpose.

Place of Issue:

Laird

Saturn House, Mercury Park

Wooburn Green

HP100HH, United Kingdom

tel: +44 (0)1628 858 940

fax: +44 (0)1628 528 382

Date of Issue: Junel2014

Name of Authorized Person: Andrew Dobbing, Engineering Manager

Signature:

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

47 CONN-HIG-BT900

13 O

RDERING

NFORMATION

Part Number DESCRIPTION

BT900

Single Mode BLE Module featuring

smart

BASIC

–

integrated antenna

BT900

Single Mode BLE Module featuring

smart

BASIC

–

IPEX MHF4 connector

DVK

–

BT900

Development board with

BT900

module soldered in place

DVK

–

BT900

Development board with

BT900

module soldered in place

13.1 General Comments

This is a preliminary datasheet. Please check with Laird for the latest information before

commencing a design. If in doubt, ask.

14 B

LUETOOTH

SIG

UALIFICATION

The BT900 module is listed on the Bluetooth SIG website as qualified End Products.

Design

Name Owner Declaratio

n ID Link to listing on the SIG website

BT900 Laird

Technologie

TBC https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=

20700

It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product

implementing Bluetooth technology has a Declaration ID. Every Bluetooth design is required to

go through the qualification process, even when referencing a Bluetooth Design that already has

its own Declaration ID. The Qualification Process requires each company to registered as a

member of the Bluetooth SIG – www.bluetooth.org

The following link provides a link to the Bluetooth Registration page:

https://www.bluetooth.org/login/register/

For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before

starting the new qualification, either through invoicing or credit card payment. The fees for the

Declaration ID will depend on your membership status, please refer to the following webpage:

https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees

For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to

the following SIG document:

https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486

To start the listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm

In step 1, select the option, Reference a Qualified Design and enter 20700 in the End Product

table entry. You can then select your pre-paid Declaration ID from the drop down menu or go

to the Purchase Declaration ID page, (please note that unless the Declaration ID is pre-paid or

purchased with a credit card, it will not be possible to proceed until the SIG invoice is paid.

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

48 CONN-HIG-BT900

Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in

the help document. Your new Design will be listed on the SIG website and you can print your

Certificate and DoC.

For further information please refer to the following training material:

https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-update

Additional Assistance

Please contact your local sales representative or our support team for further assistance:

Laird Technologies Connectivity Products Business Unit

Support Centre: http://ews-support.lairdtech.com

Email: wireless.support@lairdtech.com

Phone: Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Web: http://www.lairdtech.com/bluetooth

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

49 CONN-HIG-BT900

Laird is the world leader in the design and manufacture of customized,

performance-critical products for wireless and other advanced electronics

applications.

Laird Technologies partners with its customers to find solutions for applications in

various industries such as:

 Network Equipment

 Telecommunications

 Data Communications

 Automotive Electronics

 Computers

 Aerospace

 Military

 Medical Equipment

 Consumer Electronics

Laird offers its customers unique product solutions, dedication

to research and development, as well as a seamless network of

manufacturing and customer support facilities across the globe.

CONN-HIG-

BT900

The information contained in this manual and the accompanying software programs are copyrighted and all rights

are reserved by Laird Technologies, Inc. Laird Technologies, Inc. reserves the right to make periodic modifications of

this product without obligation to notify any person or entity of such revision. Copying, duplicating, selling, or otherwise

distributing any part of this product or accompanying documentation/software without the prior consent of an

authorized representative of Laird Technologies, Inc. is strictly prohibited.

All brands and product names in this publication are registered trademarks or trademarks of their respective holders.

This material is preliminary

Information furnished by Laird Technologies in this specification is believed to be accurate. Devices sold by Laird

Technologies are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only.

Laird Technologies makes no warranty, express, statutory, and implied or by description, regarding the information set

forth herein. Laird Technologies reserves the right to change specifications at any time and without notice. Laird

Technologies’ products are intended for use in normal commercial and industrial applications. Applications requiring

unusual environmental requirements such as military, medical life-support or life-sustaining equipment are specifically

not recommended without additional testing for such application.

Limited Warranty, Disclaimer, Limitation of Liability

USA: +1.800.492.2320

Europe: +44.1628.858.940

Asia: +852.2923-0610

wirelessinfo@lairdtech.com

www.lairdtech.com/wireless

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

50 CONN-HIG-BT900

EDERAL

OMMUNICATION

OMMISSION

NTERFERENCE

TATEMENT

This equipment has been tested and found to comply with the limits for a Class B digital device,

pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection

against harmful interference in a residential installation. This equipment generates, uses and can

radiate radio frequency energy and, if not installed and used in accordance with the instructions, may

cause harmful interference to radio communications. However, there is no guarantee that interference

will not occur in a particular installation. If this equipment does cause harmful interference to radio or

television reception, which can be determined by turning the equipment off and on, the user is

encouraged to try to correct the interference by one of the following measures:

-Reorient or relocate the receiving antenna.

-Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

-Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for

compliance could void the user's authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the

following two conditions: (1) This device may not cause harmful interference, and (2)

this device must accept any interference received, including interference that may

cause undesired operation.

IMPORTANT NOTE:

FCC Radiation Exposure Statement:

The product comply with the US portable RF exposure limit set forth for an uncontrolled environment

and are safe for intended operation as described in this manual. The further RF exposure reduction

can be achieved if the product can be kept as far as possible from the user body or set the device to

lower output power if such function is available.

This transmitter must not be co-located or operating in conjunction with any other antenna or

transmitter.

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

51 CONN-HIG-BT900

This device is intended only for OEM integrators under the following conditions:

1) The transmitter module may not be co-located with any other transmitter or antenna,

As long as 1 condition above is met, further transmitter test will not be required. However, the

OEM integrator is still responsible for testing their end-product for any additional compliance

requirements required with this module installed

IMPORTANT NOTE

In the event that these conditions can not be met (for example certain laptop configurations or

co-location with another transmitter), then the FCC authorization is no longer considered valid and

the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will

be responsible for re-evaluating the end product (including the transmitter) and obtaining a

separate FCC authorization.

End Product Labeling

The final end product must be labeled in a visible area with the following: “Contains FCC ID:

SQGBT900

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to

install or remove this RF module in the user’s manual of the end product which integrates this

module.

The end user manual shall include all required regulatory information/warning as show in this

manual.

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

52 CONN-HIG-BT900

INDUSTRY CANADA STATEMENT:

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the

following two conditions:

(1) this device may not cause interference, and

(2) this device must accept any interference, including interference that may cause undesired operation of

the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de

licence. L'exploitation est autorisée aux deux conditions suivantes :

(1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est

susceptible d'en compromettre le fonctionnement.

Radiation Exposure Statement:

The product comply with the Canada portable RF exposure limit set forth for an uncontrolled environment

and are safe for intended operation as described in this manual. The further RF exposure reduction can be

achieved if the product can be kept as far as possible from the user body or set the device to lower output

power if such function is available.

Déclaration d'exposition aux radiations:

Le produit est conforme aux limites d'exposition pour les appareils portables RF pour les Etats-Unis et le

Canada établies pour un environnement non contrôlé. Le produit est sûr pour un fonctionnement tel que

décrit dans ce manuel. La réduction aux expositions RF peut être augmentée si l'appareil peut être

conservé aussi loin que possible du corps de l'utilisateur ou que le dispositif est réglé sur la puissance de

sortie la plus faible si une telle fonction est disponible.

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

53 CONN-HIG-BT900

HIS DEVICE IS INTENDED ONLY FOR

OEM

INTEGRATORS UNDER THE FOLLOWING CONDITIONS

1) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 1 condition above are met, further transmitter test will not be required. However, the OEM

integrator is still responsible for testing their end-product for any additional compliance requirements

required with this module installed.

ET APPAREIL EST CONÇU UNIQUEMENT POUR LES INTÉGRATEURS

OEM

DANS LES CONDITIONS

SUIVANTES

1) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.

Tant que les 1 condition ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas

nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour

toutes exigences de conformité supplémentaires requis pour ce module installé.

IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or co-location

with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can

not be used on the final product. In these circumstances, the OEM integrator will be responsible for

re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.

NOTE IMPORTANTE:

Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations

d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada

n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces

circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et

l'obtention d'une autorisation distincte au Canada.

End Product Labeling

The final end product must be labeled in a visible area with the following: “Contains IC: 3147A-BT900”.

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

54 CONN-HIG-BT900

Plaque signalétique du produit final

Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC:

3147A-BT900".

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module.

The end user manual shall include all required regulatory information/warning as show in this manual.

Manuel d'information à l'utilisateur final

L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon

d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce

module.

Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et

avertissements comme indiqué dans ce manuel.

BT900-Sx Hardware Integration Guide

Intelligent BTv4.0 Dual Mode Module

Americas: +1-800-492-2320 Option 2

Europe: +44-1628-858-940

Hong Kong: +852-2923-0610

www.lairdtech.com/bluetooth

55 CONN-HIG-BT900

(For transmitters equipped with detachable antennas)

This radio transmitter (identify the device by certification number, or model number if Category II) has been

approved by Industry Canada to operate with the antenna types listed below with the maximum

permissible gain and required antenna impedance for each antenna type indicated. Antenna types not

included in this list, having a gain greater than the maximum gain indicated for that type, are strictly

prohibited for use with this device.

Le présent émetteur radio (IC: 3147A-BT900) a été approuvé par Industrie Canada pour fonctionner avec

les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal et l'impédance requise

pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur

au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

Type Manufacture Gain Connector

Chip ACX (Advanced Ceramic X

Corp.) 0.5dBi N/A

Dipole Nearson 2.0 dBi IPEX u.FL

PCB Dipole Laird Technologies 2.0 dBi IPEX u.FL

Dipole Laird Technologies 2.0 dBi IPEX u.FL

Dipole Laird Technologies 1.5 dBi IPEX u.FL

Laird Connectivity BT900 Bluetooth Dual Mode UART AT featuring smartBASIC User Manual BT900

Laird Technologies Bluetooth Dual Mode UART AT featuring smartBASIC BT900

User manual

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