Laird Connectivity SISEN1 SiFLEX01 Module User Manual

LS Research, LLC SiFLEX01 Module

User Manual

SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 1 of 23 Integrated Transceiver Modules (900 MHz) Development Kit Available FEATURES  250mW output power  Long range  Up to 500 kBaud RF data rate  128 bit AES encryption available  Miniature footprint: 0.9” x 1.63”  Multiple antenna options  Certifiable for FCC and IC acceptance  MSP430 based CPU  Low power operation  RoHS compliant  Streamlined development with LSR design services.  License options available to purchase design or integrate design. APPLICATIONS  Security  Lighting Control  HVAC Control  Sensor Networks  Medical  Industrial Automation DESCRIPTION The SiFLEX01 module is a high performance 900MHz radio based on the Texas Instruments CC430 combined with the CC1190 front-end in a cost effective footprint. Need to get to market quickly? Not an expert in frequency hopping? Need a custom antenna? Would you like to own the design? Would you like a custom design? Not quite sure what you need? Do you need help with your host board? LS Research Design Services will be happy to develop custom hardware or software, integrate the design, or license the design so you can manufacture yourself. Contact us at sales@lsr.com or call us at 262-375-4400.
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 2 of 23 MODULE ACCESSORIES Order Number Description 001-0002 900 MHz Dipole Antenna with Reverse Polarity SMA Connector 080-0001 U.FL to Reverse Polarity SMA Bulkhead Cable 105mm
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 3 of 23 BLOCK DIAGRAM CC430 SOCMSP430 MicrocontrollerAnd900 MHz Radio TransceiverCC1190(PA/LNA)AnalogJTAGTMR/PWM32,768 Hz 26 MHzLPFGPIOSerial I/O Figure 1 SiFLEX01 Module Block Diagram – High-Level
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 4 of 23 TABLE OF CONTENTS FEATURES .......................................................................................................................... 1 APPLICATIONS ................................................................................................................... 1 DESCRIPTION ..................................................................................................................... 1 MODULE ACCESSORIES ................................................................................................... 2 BLOCK DIAGRAM ............................................................................................................... 3 MODULE PINOUT AND PIN DESCRIPTIONS .................................................................... 5 MODULE OVERVIEW .......................................................................................................... 9 Microcontroller .......................................................................................................................................... 10 Radio .......................................................................................................................................................... 11 RF Power Amplifier ................................................................................................................................... 11 Antenna Options ....................................................................................................................................... 12 DEVELOPMENT TOOLS ................................................................................................... 13 TI MSP-FET430UIF .................................................................................................................................... 13 IAR Embedded Workbench for MSP430 ................................................................................................. 13 ELECTRICAL SPECIFICATIONS ...................................................................................... 14 Absolute Maximum Ratings ..................................................................................................................... 14 Recommended Operating Conditions .................................................................................................... 14 General Characteristics ............................................................................................................................ 14 AGENCY CERTIFICATIONS ............................................................................................. 16 AGENCY STATEMENTS ................................................................................................... 16 MECHANICAL DATA......................................................................................................... 21 PCB Footprint ............................................................................................................................................ 21 General Module Dimensions .................................................................................................................... 22 CONTACTING LS RESEARCH ......................................................................................... 23
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 5 of 23 MODULE PINOUT AND PIN DESCRIPTIONS MCU# GND 1 Texas Instruments CC430F6137 69 GND MCU# - GND 2 68 GND - - GND 3 67 GND - - NC 4 66 NC - - NC 5 65 NC - - NC 6 64 NC - - NC 7 63 NC - - NC 8 62 NC - 48 JTAG TMS 9 61 P1.3 13 47 JTAG TDI 10 60 P1.2 14 49 JTAG TCK 11 59 P1.4 12 46 JTAG TDO 12 58 P5.4 9 50 TEST 13 57 P1.3 13 51 nRESET 14 56 P1.2 14 59 P2.5 15 55 PJ.3 49 60 P2.4 16 54 PJ.2 48 58 P2.6 17 53 PJ.1 47 57 P2.7 18 52 PJ.0 46 24 P3.0 19 51 P5.3 34 64 P2.0 20 50 P5.7 6 63 P2.1 21 49 P5.6 7 62 P2.2 22 48 P4.7 26 61 P2.3 23 47 P4.6 27 60 P2.4 24 46 P4.5 28 59 P2.5 25 45 P4.4 29 - VCC - 3V3DC 26 44 GND - 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 P3.0 P1.6 P1.5 P5.2 P5.3 P1.7 P4.0 P4.1 P4.2 P4.3 MCU# 23 22 21 20 19 18 17 24 2 3 35 34 1 33 32 31 30 MCU# Figure 2 Module Pinout
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 6 of 23 Module Pin Name MCU Pin Type Description 1 GND N/A GND Ground 2 GND N/A GND Ground 3 GND N/A GND Ground 4 NC N/A NC No Connect 5 NC N/A NC No Connect 6 NC N/A NC No Connect 7 NC N/A NC No Connect 8 NC N/A NC No Connect 9 JTAG TMS 48 I/O General-purpose digital I/O (PJ.2), JTAG TMS 10 JTAG TDI 47 I/O General-purpose digital I/O (PJ.1), JTAG TDI 11 JTAG TCK 49 I/O General-purpose digital I/O (PJ.3), JTAG TCK 12 JTAG TDO 46 I/O General-purpose digital I/O (PJ.0), JTAG TDO 13 TEST/SBWTCK 50 I/O TEST / SBWTCK 14 nRESET 51 Input /RESET / NMI / SBWTDIO 15 VREF+ 59 I/O General-purpose digital I/O (P2.5), ADC5, Analog VREF+ 16 VREF- 60 I/O General-purpose digital I/O (P2.4), ADC4, Analog VREF- 17 CMP+ 58 I/O General-purpose digital I/O (P2.6), CB6, ADC6 18 CMP- 57 I/O General-purpose digital I/O (P2.7), CB7, ADC7 19 CMPOUT 24 I/O General-purpose digital I/O (P3.0), CBOUT 20 ADC1 64 I/O General-purpose digital I/O (P2.0), CB0, ADC0 21 ADC2 63 I/O General-purpose digital I/O (P2.1), CB1, ADC1 22 ADC3 62 I/O General-purpose digital I/O (P2.2), CB2, ADC2 23 ADC4 61 I/O General-purpose digital I/O (P2.3), CB3, ADC3 24 ADC5 60 I/O General-purpose digital I/O (P2.4), CB4, ADC4 25 ADC6 59 I/O General-purpose digital I/O (P2.5), CB5, ADC5 26 VCC - 3V3DC VCC Supply Voltage 27 TMR/PWM1 23 I/O General-purpose digital I/O (P3.1), TA0CCR0A 28 TMR/PWM2 22 I/O General-purpose digital I/O (P3.2), TA0CCR1A 29 TMR/PWM3 21 I/O General-purpose digital I/O (P3.3), TA0CCR2A 30 TMR/PWM4 20 I/O General-purpose digital I/O (P3.4), TA0CCR3A 31 TMR/PWM5 19 I/O General-purpose digital I/O (P3.5), TA0CCR4A 32 TMR/PWM6 18 I/O General-purpose digital I/O (P3.6) 33 TMR/PWM7 17 I/O General-purpose digital I/O (P3.7)
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 7 of 23 Module Pin Name MCU Pin Type Description 34 TMR/PWM8 24 I/O General-purpose digital I/O (P3.0), TA0CLK 35 UART TX 2 I/O General-purpose digital I/O (P1.6), UCA0TXD 36 UART RX 3 I/O General-purpose digital I/O (P1.5), UCA0RXD 37 UART CTS 35 I/O General-purpose digital I/O (P5.2) 38 UART RTS 34 I/O General-purpose digital I/O (P5.3) 39 GPIO1 1 I/O General-purpose digital I/O (P1.7) 40 GPIO2 33 I/O General-purpose digital I/O (P4.0) 41 GPIO3 32 I/O General-purpose digital I/O (P4.1) 42 GPIO4 31 I/O General-purpose digital I/O (P4.2) 43 GPIO5 30 I/O General-purpose digital I/O (P4.3) 44 GND GND Ground 45 GPIO6 29 I/O General-purpose digital I/O (P4.4) 46 GPIO7 28 I/O General-purpose digital I/O (P4.5) 47 GPIO8 27 I/O General-purpose digital I/O (P4.6) 48 GPIO9 26 I/O General-purpose digital I/O (P4.7) 49 GPIO10 7 I/O General-purpose digital I/O (P5.6) 50 GPIO11 6 I/O General-purpose digital I/O (P5.7) 51 GPIO12 34 I/O General-purpose digital I/O (P5.3) 52 GPIO13 46 I/O General-purpose digital I/O (PJ.0/TDO) 53 GPIO14 47 I/O General-purpose digital I/O (PJ.1/TDI) 54 GPIO15 48 I/O General-purpose digital I/O (PJ.2/TMS) 55 GPIO16 49 I/O General-purpose digital I/O (PJ.3/TCK) 56 I2C-SCL 14 I/O General-purpose digital I/O (P1.2), UCB0SCL 57 I2C-SDA 13 I/O General-purpose digital I/O (P1.3), UCB0SDA 58 SPI-SS 9 I/O General-purpose digital I/O (P5.4) 59 SPI-SCK 12 I/O General-purpose digital I/O (P1.4), UCB0CLK 60 SPI-MISO 14 I/O General-purpose digital I/O (P1.2), UCB0SOMI 61 SPI-MOSI 13 I/O General-purpose digital I/O (P1.3), UCB0SIMO 62 NC N/A NC No Connect 63 NC N/A NC No Connect 64 NC N/A NC No Connect 65 NC N/A NC No Connect 66 NC N/A NC No Connect
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 8 of 23 Module Pin Name MCU Pin Type Description 67 GND N/A GND Ground 68 GND N/A GND Ground 69 GND N/A GND Ground Table 1 SiFLEX01 Module Pin Descriptions
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 9 of 23 MODULE OVERVIEW Figure 3 shows the internal interconnects of the ICs on the SiFLEX01 module. Consult the respective IC datasheets for details, or contact LSR sales to purchase the SiFLEX01 module schematics as part of LSR’s ModFLEX™ design program. For a high-level block diagram of the SiFLEX01 module, see Figure 1. TICC430 TICC1190HGMLNA_ENPA_EN78616158 Figure 3 SiFLEX01 Module Block Diagram – Internal Interconnects
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 10 of 23 Microcontroller The CC430 contains an MSP430 16 bit RISC core with 16 registers. The radio registers allow access to radio functions without the bottleneck of an intermediate interface. There are 5 modes of operation including Active Mode and 4 low power modes with progressively lower power achieved through disabling peripherals and clocks. RAM is organized into 2k sectors which can be powered down to save current when not in use. Data is not retained during power-down. A DMA controller is included to allow direct memory to memory transfers without CPU intervention. DMA can remain active in some sleep modes for increased power savings. A hardware AES encryption engine is included to allow 128 bit Advanced Encryption Standard (AES) (FIPS PUB 197) to be implemented without excessive firmware burden. Figure 4 shows a block diagram of the CC430. Figure 4 CC430F613x Block Diagram
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 11 of 23 Radio The internal radio is based on the TI CC1101. It is a low-IF type with all digital AGC and filtering. Memory mapped registers are used for data access and controlling radio characteristics. Figure 5 CC430 Sub 1 GHz Radio Block Diagram RF Power Amplifier The SiFLEX01 module contains a TI CC1190 front-end chip. It is capable of 250mW output power. When transmitting the PA_EN signal will be high and LNA_EN will be low, which is controlled by the firmware using GPIO pins P1.0 and P1.1. When receiving PA_EN is low and LNA_EN is high. LNA gang is be adjusted to a high or low setting with the HGM signal controlled by P5.5. PA_EN P1.0 LNA_EN P1.1 HGM P5.5 Operation 0 0 X Shutdown 0 1 0 RX low gain 0 1 1 RX high gain 1 0 0 TX low gain 1 0 1 TX high gain Table 2 Front-end control functions
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 12 of 23 Antenna Options The SiFLEX01 module includes multiple antenna options. The module regulatory certification can be completed with the following options: Certified Antenna Options  LSR 001-0002 900 MHz Dipole Antenna with Reverse Polarity SMA Connector and LSR 080-0001 U.FL to Reverse Polarity SMA Bulkhead Cable 105mm.  Antenna Factor ANT-916-CW-HWR-RPS 900 MHz Dipole Antenna with Reverse Polarity SMA Connector and PanguTech JQ-0036-L4 MMCX to Reverse Polarity SMA Cable. Non-certified Antenna Options  Integrated 3.2-inch wire monopole soldered to the board.  Off-board antenna using the castellated edge connection to a 50Ω trace on the host board An adequate ground plane is necessary to provide good efficiency. The ground plane of the host board on which the module is mounted increases the effective antenna ground plane size and improves the antenna performance. The environment the module is placed in will dictate the range performance The non-ideal characteristics of the environment will result in the transmitted signal being reflected, diffracted, and scattered. All of these factors randomly combine to create extremely complex scenarios that will affect the link range in various ways. It is also best to keep some clearance between the antenna and nearby objects. This includes how the module is mounted in the product enclosure. Unless the items on the following list of recommendations are met, the radiation pattern can be heavily distorted. Whichever antenna is used, it is best to keep a few things in mind when determining its location.  Never place ground plane or copper trace routing underneath the antenna.  LSR recommends keeping metal objects as far away from the antenna as possible. At a very minimum keep the antenna at least 5 cm from any metallic objects, components, or wiring. The farther the antenna is placed from these interferers, the less the radiation pattern and gain will be perturbed.  Do not embed the antenna in a metallic or metalized plastic enclosure.  If located within a plastic enclosure, keep the enclosure at least 1 cm from the antenna.
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 13 of 23 DEVELOPMENT TOOLS TI MSP-FET430UIF Custom firmware development can be done on the SiFLEX module using development tools available thought TI. Shown in Figure 6, a MSP-FETUIF USB interface is required. It plugs directly into the SiFLEX Development Board, and can easily be adapted to other hardware. See the Texas Instruments website for more information. Figure 6 MSP-FET430UIF IAR Embedded Workbench for MSP430 Also required is Embedded Workbench for TI MSP430 from IAR Systems. IAR Embedded Workbench for MSP430 is an integrated development environment for building and debugging embedded applications. Visit the IAR Systems website for additional information.
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 14 of 23 ELECTRICAL SPECIFICATIONS The majority of these characteristics are based on the use of developmental test firmware written by LSR. Custom firmware may require these values to be re-characterized by the customer. Absolute Maximum Ratings Rating Min Max Unit Power supply voltage 0 3.6 V Voltage on any pin with respect to ground -0.3 Vcc + 0.3 V RF input power +10 dBm Operating temperature range -40 +85 ºC Storage temperature -50 +150 ºC Table 3 Absolute Maximum Ratings1 Recommended Operating Conditions Characteristic Min Typ Max Unit Power supply voltage (Vdd) 2.2 3.3 3.45 Vdc Ambient temperature range -40 25 85 ºC Table 4 Recommended Operating Conditions Module will NOT transmit, if VCC > 3.5V. General Characteristics Parameter Min Typ Max Unit RF frequency range 906 924 MHz RF data rate 0.8 500 kbps Flash program memory 32 kB RAM 4 kB Flash data memory 512 B Table 5 General Characteristics 1 Under no circumstances should exceeding the maximum ratings specified in the Absolute Maximum Ratings section be allowed. Stressing the module beyond these limits may result permanent damage to the module that is not covered by the warranty.
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 15 of 23 Power Consumption (Ta = 25°C, Vcc = 3.3V, fc = 906-924MHz, Rload = 50Ω) Parameter Test Conditions Min Typ Max Unit Transmit mode 275 mA Receive mode 24 mA Sleep mode 3 µA Table 6 Power Consumption DC Characteristics – General Purpose I/O Parameter Test Conditions Min Typ Max Unit Vit+ Positive-going input threshold voltage VCC = 3.0V 1.50 2.10 V Vit- Negative-going input threshold voltage VCC = 3.0V 0.75 1.65 V Vhys Input voltage hysteresis (Vit+ - Vit-) VCC = 3.0V 0.4 1.0 V VOL Low-Level output voltage, full drive strength Iout = 15mA Vcc = 3.0V VSS VSS + 0.60 V VOH High-Level output voltage, full drive strength Iout = -15mA Vcc = 3.0V VCC – 0.60 VCC V Table 7 DC Characteristics – General Purpose I/O
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 16 of 23 AGENCY CERTIFICATIONS FCC ID: TFB-SISEN1, 15.247 IC ID: 5969A-SISEN1, RSS 210 AGENCY STATEMENTS Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:  Reorient or relocate the receiving antenna.  Increase the separation between the equipment and receiver.  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 17 of 23 Industry Canada Statements Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. This device has been designed to operate with the antennas listed below, and having a maximum gain of 2 dBi (LS Research dipole) and 2 dBi (Antenna Factor dipole). Antennas not included in this list or having a gain greater than 2 dBi and 2 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. List of all Antennas Acceptable for use with the Transmitter 1) LS Research 001-0002 900 MHz Dipole Antenna with Reverse Polarity SMA Connector and LS Research 080-0001 U.FL to Reverse Polarity SMA Cable. 2) Antenna Factor ANT-916-CW-HWR-RPS 900 MHz Dipole Antenna with Reverse Polarity SMA Connector and PanguTech JQ-0036-L4 MMCX to Reverse Polarity SMA Cable. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement du dispositif. Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doivent être choisies de façon que la puissance isotrope rayonnée équivalente (e.i.r.p) ne dépasse pas celle admise pour une communication réussie. Cet appareil a été conçu pour fonctionner avec les antennes énumérées ci-dessous, et d'avoir un gain maximum de 2 dBi (LS Research dipôle) et 2 dBi (Antenna Factor dipôle). Antennes pas inclus dans cette liste ou d'avoir un gain plus grand que 2 et 2 dBi dBi sont strictement interdites pour l'utilisation avec cet appareil. L'impédance d'antenne requise est de 50 ohms. Liste de toutes les antennes acceptables pour une utilisation avec l'émetteur 1) LS Research 900 001-0002 antenne dipôle MHz avec connecteur SMA inversé la polarité et de la LS Research LS 080-0001 U. FL à Reverse SMA à polarité du câble. 2) Antenna Factor ANT-916-CW-HWR-RPS 900 MHz Antenne dipôleavec connecteur SMA inversé la polarité et la PanguTech JQ-0036-L4 MMCX pour câble SMA inversé la polarité.
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 18 of 23 OEM Responsibilities to comply with FCC and Industry Canada Regulations The SiFLEX01 Module has been certified for integration into products only by OEM integrators under the following conditions: This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and Industry Canada authorization. Le module SiFLEX01 a été certifiée pour l'intégration dans les produits que par les intégrateurs OEM dans les conditions suivantes: Ce dispositif est accordé pour une utilisation dans des configurations mobiles seule dans laquelle les antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au moins 20cm de toute personne et ne pas être co-localisés avec les autres émetteurs, sauf en conformité avec FCC et Industrie Canada, multi-émetteur procédures produit. Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne seront pas tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour toutes les exigences de conformité supplémentaires requis avec ce module installé (par exemple, les émissions appareil numérique, les exigences de périphériques PC, etc.) NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou de co-implantation avec un autre émetteur), puis la FCC et Industrie autorisations Canada ne sont plus considérés comme valides et l'ID de la FCC et IC numéro de certification ne peut pas être utilisé sur la produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation.
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 19 of 23 End Product Labelling The SiFLEX01 Module is labeled with its own FCC ID and IC Certification Number. If the FCC ID and IC Certification Number are not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: TFB-SISEN1” “Contains Transmitter Module IC: 5969A-SISEN1” or “Contains FCC ID: TFB-SISEN1” “Contains IC: 5969A-SISEN1” The OEM of the SiFLEX01 Module must only use the approved antenna(s) listed above, which have been certified with this module. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. The user manual for the end product must include the following information in a prominent location: This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures.
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 20 of 23 Le SiFLEX01 Module est étiqueté avec sa propre ID de la FCC et IC numéro de certification. Si l'ID de la FCC et IC numéro de certification ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre appareil, puis l'extérieur de l'appareil dans lequel le module est installé doit également afficher une étiquette mentionnant le module ci-joint. Dans ce cas, le produit final doivent être étiquetés dans un endroit visible de ce qui suit: Module émetteur Contient FCC ID: TFB-SISEN1 Module émetteur Contient IC: 5969A-SISEN1 ou Contient FCC ID: TFB-SISEN1 Contient IC: 5969A-SISEN1 Le constructeur d'équipements de l’ SiFLEX01 module ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec ce module. L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF ou RF changer les paramètres liés au mode d'emploi du produit final. Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans un endroit bien en vue: Ce dispositif est accordé pour une utilisation dans des configurations mobiles seule dans laquelle les antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au moins 20cm de toute personne et ne pas être co-localisés avec les autres émetteurs, sauf en conformité avec FCC et Industrie Canada, multi-émetteur procedures produit.
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 21 of 23 MECHANICAL DATA PCB Footprint Figure 7 PCB Footprint
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 22 of 23 General Module Dimensions Figure 8 Basic dimensions
SiFLEX01 TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. 330-0026-R0.4 Copyright © 2010-2012 LS Research, LLC Page 23 of 23 CONTACTING LS RESEARCH Headquarters LS Research, LLC W66 N220 Commerce Court Cedarburg, WI 53012-2636 USA Tel: 1(262) 375-4400 Fax: 1(262) 375-4248 Website www.lsr.com Technical Support forum.lsr.com Sales Contact sales@lsr.com The information in this document is provided in connection with LS Research (hereafter referred to as “LSR”) products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of LSR products. EXCEPT AS SET FORTH IN LSR’S TERMS AND CONDITIONS OF SALE LOCATED ON LSR’S WEB SITE, LSR ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL LSR BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF LSR HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. LSR makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. LSR does not make any commitment to update the information contained herein. Unless specifically provided otherwise, LSR products are not suitable for, and shall not be used in, automotive applications. LSR’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.

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