Laird Connectivity TIWI1-01 TiWi Module User Manual R2 model manual

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Document DescriptionR2 model manual
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Date Submitted2013-07-18 00:00:00
Date Available2013-07-25 00:00:00
Creation Date2013-07-11 16:10:08
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Document TitleR2 model manual
Document CreatorMicrosoft® Word 2010
Document Author: Mike Richter

TiWi-R2 TRANSCEIVER MODULE
DATASHEET
Integrated Transceiver Modules for WLAN 802.11 b/g/n, Bluetooth,
and ANT
FEATURES
DESCRIPTION
IEEE 802.11 b,g,n,d,e,i, compliant
 Typical WLAN Transmit Power:
o 18.3dBm, 11 Mbps, CCK (b)
o 12.6 dBm, 54 Mbps, OFDM (g)
o 9.5 dBm, 65 Mbps, OFDM (n)

Typical WLAN Sensitivity:
o -89 dBm, 8% PER, 11 Mbps
o -76 dBm, 10% PER, 54 Mbps
o -73 dBm, 10% PER, 65 Mbps

Bluetooth 2.1+EDR, Power Class 1.5

Full support for ANT

Miniature footprint: 18 mm x 13 mm

Low height profile: 1.9 mm

U.FL connector for external antenna

Terminal for PCB/Chip antenna feeds

Integrated band-pass filter

Worldwide acceptance: FCC (USA), IC
(Canada), and CE (Europe)

Modular certification allows reuse of LSR
FCC ID and ETSI certification without
repeating the expensive testing on your end
product

Compact design based on Texas
Instruments WL1271 Transceiver

Seamless integration with TI OMAP™
application processors

SDIO Host data path interfaces

Bluetooth Advanced Audio Interfaces

Low power operation mode

RoHS compliant
The TiWi-R2 module is a high performance 2.4
GHz IEEE 802.11 b/g/n and Bluetooth 2.1+EDR
radio in a cost effective, pre-certified footprint.
The module realizes the necessary PHY/MAC
layers to support WLAN applications in
conjunction with a host processor over a SDIO
interface.
The module also provides a Bluetooth platform
through the HCI transport layer. Both WLAN
and Bluetooth share the same antenna port.
Need to get to market quickly? Not an expert in
802.11 or Bluetooth? Need a custom antenna?
Would you like to own the design? Would you
like a custom design? Not quite sure what you
need? Do you need help with your host board?
LS Research Design Services will be happy to
develop custom hardware or software, integrate
the design, or license the design so you can
manufacture yourself. Contact us at
sales@lsr.com or call us at 262-375-4400.
APPLICATIONS

Security

HVAC Control, Smart Energy

Sensor Networks

Medical
The information in this document is subject to change without notice.
330-0045-R4.2
Copyright © 2011-2013 LS Research, LLC
Page 1 of 40
TiWi-R2 TRANSCEIVER MODULE
DATASHEET
ORDERING INFORMATION
Order Number
Description
450-0037
TiWi-R2 Module with U.FL connector for external antenna
(Tray, SPQ = 100)
450-0037R
TiWi-R2 Module with U.FL connector for external antenna
(Tape and Reel, SPQ = 1000)
Table 1 Orderable TiWi-R2 Part Numbers
MODULE ACCESSORIES
Order Number
Description
001-0001
2.4 GHz Dipole Antenna with Reverse
Polarity SMA Connector
080-0001
U.FL to Reverse Polarity SMA Bulkhead
Cable 105mm
Table 2 Module Accessories
The information in this document is subject to change without notice.
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
BLOCK DIAGRAM
TPS73028
TPS62611
VBAT
FAST_CLK
VIO
FEM_CONTROL
PA_DETECTOR
SLOW_CLK
PA_BIAS
WLAN
WL_TX
WL_RX
2.4
GHZ
RF
PA
HOST_SIGNALLING
BPF
BT_TX_RX
HOST_INTERFACE
FEM
HOST_DEBUG
BT
MATCHING
FM
MATCHING
WL1271
Figure 1 TiWi-R2 Module Block Diagram – Top-Level
The information in this document is subject to change without notice.
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
TABLE OF CONTENTS
FEATURES .......................................................................................................................... 1
APPLICATIONS ................................................................................................................... 1
DESCRIPTION ..................................................................................................................... 1
ORDERING INFORMATION ................................................................................................ 2
MODULE ACCESSORIES ................................................................................................... 2
BLOCK DIAGRAM ............................................................................................................... 3
PIN DESCRIPTIONS ............................................................................................................ 7
ELECTRICAL SPECIFICATIONS ........................................................................................ 9
Absolute Maximum Ratings ....................................................................................................................... 9
Recommended Operating Conditions ...................................................................................................... 9
General Characteristics ............................................................................................................................ 10
WLAN RF Characteristics......................................................................................................................... 12
Bluetooth RF Characteristics .................................................................................................................. 14
WLAN POWER-UP SEQUENCE ....................................................................................... 15
WLAN POWER-DOWN SEQUENCE ................................................................................. 16
BLUETOOTH POWER-UP SEQUENCE............................................................................ 17
BLUETOOTH POWER-DOWN SEQUENCE ..................................................................... 18
ENABLE SCHEME ............................................................................................................ 19
IRQ OPERATION ............................................................................................................... 19
SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS ..................................................... 20
BLUETOOTH HCI UART ................................................................................................... 21
SDIO INTERFACE TIMING ................................................................................................ 23
SDIO CLOCK TIMING........................................................................................................ 24
SOLDERING RECOMMENDATIONS ................................................................................ 25
Recommended Reflow Profile for Lead Free Solder ............................................................................. 25
CLEANING ......................................................................................................................... 26
The information in this document is subject to change without notice.
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
OPTICAL INSPECTION ..................................................................................................... 26
REWORK ........................................................................................................................... 26
SHIPPING, HANDLING, AND STORAGE ......................................................................... 26
Shipping ..................................................................................................................................................... 26
Handling ..................................................................................................................................................... 26
Moisture Sensitivity Level (MSL) ............................................................................................................. 26
Storage ....................................................................................................................................................... 26
Repeating Reflow Soldering .................................................................................................................... 27
AGENCY CERTIFICATIONS ............................................................................................. 28
AGENCY STATEMENTS ................................................................................................... 28
Federal Communication Commission Interference Statement ............................................................ 28
Industry Canada Statements.................................................................................................................... 29
OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA
REGULATIONS ....................................................................................................... 30
OEM LABELING REQUIREMENTS FOR END-PRODUCT .............................................. 31
OEM END PRODUCT USER MANUAL STATEMENTS.................................................... 32
EUROPE ............................................................................................................................ 33
CE Notice ................................................................................................................................................... 33
Declaration of Conformity (DOC) ............................................................................................................ 33
MECHANICAL DATA......................................................................................................... 34
TAPE AND REEL SPECIFICATION .................................................................................. 36
DEVICE MARKINGS .......................................................................................................... 37
Rev 0 Devices ............................................................................................................................................ 37
Rev 1 Devices ............................................................................................................................................ 37
Rev 2 Devices ............................................................................................................................................ 38
Rev 3 Devices ............................................................................................................................................ 38
Rev 4 Devices ............................................................................................................................................ 39
CONTACTING LS RESEARCH ......................................................................................... 40
TIWI-R2 MODULE FOOTPRINT AND PIN DEFINITIONS
The information in this document is subject to change without notice.
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
To apply the TiWi-R2 module, it is important to use the module pins in your application as they are
designated in below and in the corresponding pin definition table found on pages 7 and 8. Not all the
pins on the TiWi-R2 module may be used, as some are reserved for future functionality.
Figure 2 TiWi-R2 Pinout (Top View)
The information in this document is subject to change without notice.
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
PIN DESCRIPTIONS
Module
Pin
Name
I/O
Type
Buffer
Type
Logic
Level
VBAT
PI
BT_FUNC5
DO
4 mA
1.8 VDC HOST_WU (*)
WL_UART_DBG
DIO
4 mA
1.8 VDC WL_UART_DBG
WLAN_IRQ
DO
4 mA
1.8 VDC WLAN Interrupt Request
BT_EN
DI
1.8 VDC Bluetooth Enable
FM_EN
DI
1.8 VDC NOT SUPPORTED, CONNECT TO GND
WL_RS232_RX
DI
1.8 VDC WLAN TEST UART RX (*)
WL_RS232_TX
DO
4 mA
1.8 VDC WLAN TEST UART TX (*)
FM_I2S_FSYNC
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
10
WL_EN
DI
11
VIO
PI
POWER SUPPLY FOR 1.8 VDC DIGITAL
DOMAIN
12
GND
GND
Ground
13
SDIO_D3
DIO
8 mA
1.8 VDC SDIO INTERFACE, HOST PULL UP
14
SDIO_D2
DIO
8 mA
1.8 VDC SDIO INTERFACE, HOST PULL UP
15
SDIO_D1
DIO
8 mA
1.8 VDC SDIO INTERFACE, HOST PULL UP
16
SDIO_D0
DIO
8 mA
1.8 VDC SDIO INTERFACE, HOST PULL UP
17
SDIO_CMD
DIO
8 mA
1.8 VDC HOST PULL UP
18
SDIO_CLK
DI
1.8 VDC HOST PULL UP
19
SLOW_CLK
DI
1.8 VDC SLEEP CLOCK (32 kHz)
20
FM_IRQ
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
21
FM_SDA
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
22
FM_SCL
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
23
FM_I2S_CLK
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
24
FM_I2S_DI
DI
4 mA
1.8 VDC NOT SUPPORTED, CONNECT TO GND
25
FM_I2S_DO
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
26
FM_AUD_RIN
AI
NOT SUPPORTED, CONNECT TO GND
27
FM_AUD_LIN
AI
NOT SUPPORTED, CONNECT TO GND
28
FMRFOUT
AO
NOT SUPPORTED, NO CONNECT
29
FMRFIN
AI
NOT SUPPORTED, CONNECT TO GND
30
GND
GND
Ground
31
FM_AUD_ROUT
AO
NOT SUPPORTED, NO CONNECT
Description
Battery Voltage 3.6 VDC Nominal (3.0-4.8 VDC)
1.8 VDC WLAN Enable
The information in this document is subject to change without notice.
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
Module
Pin
Name
I/O
Type
Buffer
Type
Logic
Level
32
FM_AUD_LOUT
AO
33
AUD_FSYNC
DIO
4 mA
1.8 VDC PCM I/F
34
HCI_RX
DI
8 mA
1.8 VDC Bluetooth HCI UART RX (*)
35
HCI_RTS
DO
4 mA
1.8 VDC Bluetooth HCI UART RTS (*)
36
HCI_TX
DIO
8 mA
1.8 VDC Bluetooth HCI UART TX
37
AUD_CLK
DO
4 mA
1.8 VDC PCM I/F (*)
38
AUD_OUT
DO
4 mA
1.8 VDC PCM I/F (*)
39
HCI_CTS
DI
4 mA
1.8 VDC Bluetooth HCI UART CTS (*)
40
AUD_IN
DI
4 mA
1.8 VDC PCM I/F (*)
41
BT_FUNC2
DI
4 mA
1.8 VDC Bluetooth Wakeup[DI] / DC2DC mode[DO](*)
42
BT_FUNC4
DO
4 mA
1.8 VDC BT_UARTD (DEBUG) (*)
43
VDD_LDO_CLASS_1P5
NC
VBAT VOLTAGE PRESENT, NO CONNECT
44
GND
GND
Ground
45
GND
GND
Ground
46
GND
GND
Ground
47
GND
GND
Ground
48
ANT
RF
Antenna terminal for WLAN and Bluetooth (Note
[1])
49
GND
GND
Ground
50
GND
GND
Ground
51
GND
GND
Ground
52
GND
GND
Ground
Description
NOT SUPPORTED, NO CONNECT
PI = Power Input
PO = Power Output
DI = Digital Input (1.8 VDC Logic Level)
AI = Analog Input
AO = Analog Output
AIO = Analog Input/Output
DO=Digital Output (1.8 VDC Logic Level)
RF = RF Port
GND = Ground
Note[1]: Antenna terminal presents d.c. short circuit to ground.
(*) indicates that pin is capable of bidirectional operation, but is used as the type shown.
Table 3 TiWi-R2 Module Pin Descriptions
All digital I/O signals use 1.8V logic. If the host microcontroller does not support 1.8V
logic, then level shifters MUST be used.
The information in this document is subject to change without notice.
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
ELECTRICAL SPECIFICATIONS
The majority of these characteristics are based on controlling and conditioning the tests using the TiWiR2 control software application. Other control conditions may require these values to be recharacterized by the customer.
Absolute Maximum Ratings
Parameter
Power supply voltage (VBAT)
(4)(5)
Digital supply voltage (VIO)
Voltage on any GPIO
Voltage on any Analog Pins
(3)
Min
Max
Unit
-0.5
+5.5
-0.5
2.1
-0.5
VIO + 0.5
-0.5
2.1
+10
dBm
-40
+85
ºC
-55
+125
ºC
RF input power, antenna port
Operating temperature
(6)
Storage temperature
1.
2.
3.
4.
5.
6.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device and are not
covered by the warranty. These are stress ratings only and functional operation of the device at these or any other
conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolutemaximum-rated conditions for extended periods may affect device reliability.
All parameters are measured as follows unless stated otherwise: VDD_IN=1.8V, VDDIO_1.8V=1.8V,
VDD_LDO_CLASS1P5=3.6V
Analog pins: XTALP, XTALM, RFIOBT, DRPWRXBM, DRPWRXBP, DRPWTXB, and also FMRFINP, FMRFINM,
FMRFINM, FMAUDLIN, FMAUDRIN, FMAUDLOUT, FMAUDROUT
The following signals are from the VBAT group, PMS_VBAT and VDD_LDO_CLASS1P5 (if BT class 1.5 direct VBAT is
used).
Maximum allowed depends on accumulated time at that voltage; 4.8V for 7 years lifetime, 5.5V for 6 hours cumulative.
The device can be reliably operated for 5,000 active-WLAN cumulative hours at TA of 85oC.
Table 4 Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Min
Typ
Max
Unit
VBAT
3.0
3.6
4.8
VIO
1.62
1.8
1.92
VIH
0.65 x VIO
VIO
VIL
0.35 x VIO
VOH @ 4, 8 mA
VIO - 0.45
VIO
VOL @ 4, 8 mA
0.45
-40
25
85
ºC
Ambient temperature range
Table 5 Recommended Operating Conditions
The information in this document is subject to change without notice.
330-0045-R4.2
Copyright © 2010-2013 LS Research, LLC
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
General Characteristics
Parameter
Min
WLAN RF frequency range
WLAN RF data rate
2412
BT RF frequency Range
Typ
Max
Unit
2472
MHz
65
Mbps
2480
MHz
802.11 b/g/n
rates
supported
2402
Table 6 General Characteristics
Power Consumption - WLAN
Parameter
Test Conditions
Min
Typ
Max
Unit
CCK (802.11b)
TX Current
2437 MHz, VBAT =3.6V, Tamb=+25°C
Po=18.3 dBm, 11 Mbps CCK
L=1200 bytes, tdelay (idle)=4 S
270
mA
OFDM (802.11g)
TX Current
2437 MHz, VBAT =3.6V, Tamb=+25°C
Po=12.6 dBm, 54 Mbps OFDM
L=1200 bytes, tdelay (idle)=4 S
171
mA
OFDM (802.11n)
TX Current
2437 MHz, VBAT =3.6V, Tamb=+25°C
Po=9.5 dBm, 65 Mbps OFDM
L=1200 bytes, tdelay (idle)=4 S
152
mA
CCK (802.11b)
RX Current
100
mA
OFDM (802.11g)
RX Current
100
mA
OFDM (802.11n)
RX Current
100
mA
Dynamic Mode [1]
<1.2
mA
[1] Total Current from VBAT for reception of Beacons with DTIM=1 TBTT=100 mS, Beacon duration 1.6ms, 1 Mbps beacon
reception in Listen Mode.
Table 7 WLAN Power Consumption
The information in this document is subject to change without notice.
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
Power Consumption - Bluetooth
Parameter
Test Conditions
Min
Typ
Max
Unit
GFSK TX Current
Constant Transmit, DH5, PRBS9
45
mA
EDR TX Current
Constant Transmit, 2DH5,3DH5,
PRBS9
43
mA
GFSK RX Current
Constant Receive, DH1
35
mA
EDR RX Current
Constant Receive, 2DH5, 3DH5
41
mA
Deep Sleep Current
Deep Sleep Mode
70
µA
Typ
Max
Unit
16
mA
Table 8 Bluetooth Power Consumption
DC Characteristics – General Purpose I/O
Parameter
Test Conditions
Min
VIO Current
Logic input low, VIL
0.35 x VIO
Logic input high, VIH
0.65 x VIO
VIO
Logic output low, VOL
(Full Drive)
Iout = 8 mA
0.45
Iout = 4 mA
0.45
Logic output low, VOL
(Reduced Drive)
Iout = 1 mA
0.112
Iout = 0.09 mA
0.01
Logic output high, VOH
(Full Drive)
Iout = -8 mA
VIO - 0.45
VIO
Iout = -4 mA
VIO - 0.45
VIO
Logic output high, VOH
(Reduced Drive)
Iout = -1 mA
VIO - 0.112
VIO
Iout = -0.3 mA
VIO - 0.033
VIO
Table 9 DC Characteristics General Purpose I/O
The information in this document is subject to change without notice.
330-0045-R4.2
Copyright © 2010-2013 LS Research, LLC
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
WLAN RF Characteristics
WLAN Transmitter Characteristics
(TA=25°C, VBAT=3.6 V)
Parameter
Test Conditions
Min
Typ
Max
Unit
11 Mbps CCK (802.11b)
TX Output Power
11 Mbps CCK , 802.11(b) Mask
Compliance, 35% EVM
RMS power over TX packet
18.3
dBm
9 Mbps OFDM (802.11g)
TX Output Power
9 Mbps OFDM , 802.11(g) Mask
Compliance, -8 dB EVM
RMS power over TX packet
17.6
dBm
54 Mbps OFDM (802.11g)
TX Output Power
54 Mbps OFDM, 802.11(g) Mask
Compliance, -25 dB EVM
RMS power over TX packet
12.6
dBm
6.5 Mbps OFDM (802.11n)
TX Output Power
6.5 Mbps OFDM, 802.11(n) Mask
Compliance, -5 dB EVM
RMS power over TX packet
17.7
dBm
65 Mbps OFDM (802.11n)
TX Output Power
65 Mbps OFDM, 802.11(n) Mask
Compliance, -28 dB EVM
RMS power over TX packet
9.5
dBm
Table 10 WLAN Transmitter RF Characteristics
The information in this document is subject to change without notice.
330-0045-R4.2
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
WLAN Receiver Characteristics
(TA=25°C, VBAT=3.6 V) [1]
Parameter
Test Conditions
Min
Typ
Max
Unit
1 Mbps CCK (802.11b)
RX Sensitivity
8% PER
-97
dBm
11 Mbps CCK (802.11b)
RX Sensitivity
8% PER
-89
dBm
9 Mbps OFDM (802.11g)
RX Sensitivity
10% PER
-90
dBm
54 Mbps OFDM (802.11g)
RX Sensitivity
10% PER
-76
dBm
6.5 Mbps OFDM (802.11n)
RX Sensitivity
10% PER
-91
dBm
65 Mbps OFDM (802.11n)
RX Sensitivity
10% PER
-73
--
dBm
11 Mbps CCK (802.11b)
RX Overload Level
8% PER
-10
dBm
6 Mbps OFDM (802.11g)
RX Overload Level
10% PER
-20
dBm
54 Mbps OFDM (802.11g)
RX Overload Level
10% PER
-20
dBm
65 Mbps OFDM (802.11n)
RX Overload Level
10% PER
-20
dBm
[1] Up to 2 dB degradation at Channel 13 for 11g/n modes and up to 2 dB degradation at Channel 14 for 11b/g/n modes.
Table 11 WLAN Receiver RF Characteristics
The information in this document is subject to change without notice.
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
Bluetooth RF Characteristics
Bluetooth Transmitter GFSK and EDR Characteristics, Class 1.5
(TA=25°C, VBAT=3.6 V)
Parameter
Test
Conditions
Min
Typ
Max
Bluetooth Spec
Unit
GFSK RF Output Power
9.5
dBm
EDR RF Output Power
Power Control Step Size
2-8
dB
EDR Relative Power
-2
-4/+1
dB
dBm
Table 12 Bluetooth Transmitter RF Characteristics
Bluetooth Receiver Characteristics
(TA=25°C, VBAT=3.6 V)
Test
Conditions
Min
Typ
Max
Bluetooth Spec
Unit
GFSK Sensitivity
BER=0.1%
-92
-70
dBm
EDR 2 Mbps Sensitivity
BER=0.01%
-91
-70
dBm
EDR 3 Mbps Sensitivity
BER=0.01%
-82
-70
dBm
GFSK Maximum Input Level
BER=0.1%
-5
-20
dBm
EDR 2 Maximum Input Level
BER=0.1%
-10
dBm
EDR 3 Maximum Input Level
BER=0.1%
-10
Parameter
Table 13 Bluetooth Receiver RF Characteristics
The information in this document is subject to change without notice.
330-0045-R4.2
Copyright © 2010-2013 LS Research, LLC
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
WLAN POWER-UP SEQUENCE
The following sequence describes device power-up from shutdown. Only the WLAN Core is enabled; the
Bluetooth and FM cores are disabled.
Figure 3 TiWi-R2 Power-up Sequence Requirements
1. No signals are allowed on the IO pins if no IO power is supplied, because the IOs are not 'fail safe’.
Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can
tolerate external voltages with no VDDS and DC2DC".
2. VBAT, VIO, and SLOWCLK must be available before WL_EN.
3. Twakeup = T1 + T2
The duration of T1 is defined as the time from WL_EN=high until F REF is valid for the SoC. T1=~55ms
The duration of T2 depends on:
– Operating system
– Host enumeration for the SDIO/WSPI
– PLL configuration
– Firmware download
– Releasing the core from reset
– Firmware initialization
The information in this document is subject to change without notice.
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
WLAN POWER-DOWN SEQUENCE
Notes:
1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
2. DC_REQ and CLK_REQ are internal signals shown for reference only
Figure 4 TiWi-R2 Module Power-down Sequence Requirements
1. DC_REQ will go low only if WLAN is the only core working. Otherwise if another core is working (e.g
BT) it will stay high.
2. CLK_REQ will go low only if WLAN is the only core working. Otherwise if another core is working and
using the FREF (e.g BT) it will stay high.
3. If WLAN is the only core that is operating, WL_EN must remain de-asserted for at least 64sec
before it is re-asserted.
The information in this document is subject to change without notice.
330-0045-R4.2
Copyright © 2010-2013 LS Research, LLC
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
BLUETOOTH POWER-UP SEQUENCE
The following sequence describes device power up from shutdown. Only the Bluetooth core is enabled;
the WLAN core is disabled.
Notes:
1. (A) After this sequence is completed, the device is in the low VIO-leakage state while in shutdown
2. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
3. DC_REQ, CLK_REQ, and FREF are internal signals shown for reference only
Figure 5 Bluetooth Power-up Sequence
Power up requirements:
1. No signals are allowed on the IO pins if no IO power supplied, because the IOs are not 'failsafe'.
Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can
tolerate external voltages with no VDDS and DC2DC.
2. VDDS and SLOWCLK must be stable before releasing BT_EN.
3. Fast clock must be stable maximum 55 ms after BT_EN goes HIGH.
The information in this document is subject to change without notice.
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DATASHEET
BLUETOOTH POWER-DOWN SEQUENCE
Notes:
1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
2. DC_REQ and CLK_REQ are internal signals shown for reference only
Figure 6 Bluetooth Power-down Sequence
The TiWi-R2 module indicates completion of Bluetooth power up sequence by asserting HCI_RTS low.
This occurs up to 100 ms after BT_EN goes high.
The information in this document is subject to change without notice.
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DATASHEET
ENABLE SCHEME
The module has 3 enable pins, one for each core: WL_EN, and BT_EN and FM_EN. Presently, there are 2
modes of active operation now supported: WLAN and Bluetooth. It is recommended that the FM_EN pin be
grounded to disable the FM section. It is also recommended that the FM section be disabled by Bluetooth HCI
commands.
1. Each core is operated independently by asserting each signal EN to Logic '1’. In this mode it is possible to
control each core asynchronously and independently.
2. Bluetooth mode operation. WLAN will be operated through WL_EN asynchronously and independently of
Bluetooth.
IRQ OPERATION
1. The default state of the WLAN_IRQ prior to firmware initialization is 0.
2. During firmware initialization, the WLAN_IRQ is configured by the SDIO module; a WLAN_IRQ changes
its state to 1.
3. A WLAN firmware interrupt is handled as follows:
a. The WLAN firmware creates an Interrupt-to-Host, indicated by a 1-to-0 transition on the
WLAN_IRQ line (host must be configured as active-low or falling-edge detect).
b. After the host is available, depending on the interrupt priority and other host tasks, it masks the
firmware interrupt. The WLAN_IRQ line returns to 1 (0-to-1 transition on the WLAN_IRQ line).
c.
The host reads the internal register status to determine the interrupt sources - the register is
cleared after the read.
d. The host processes in sequence all the interrupts read from this register
e. The host unmasks the firmware interrupts.
4. The host is ready to receive another interrupt from the WLAN device.
The information in this document is subject to change without notice.
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DATASHEET
SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS
The slow clock is always supplied from an external source. It is input on the SLOW_CLK pin, and can be a digital
signal in the range of VIO only. For slow clock frequency and accuracy refer to Table 14. The external slow clock
must be stable before the system exits from shut down mode.
Parameter [1]
Condition
Symbol
Min
Input slow clock frequency
WLAN, BT
Input transition time Tr/Tf – 10% to 90%
Tr/Tf
Frequency input duty cycle
VIL
Max
32768
Input slow clock accuracy
Input voltage limits
Typ
30
Square wave,
DC coupled
VIH
Input impedance
50
0.65 x VDDS
Unit
Hz
+/-250
ppm
100
ns
70
VDDS
Vpeak
0.35 x VDDS
MW
Input capacitance
pF
Rise and fall time
100
ns
Phase noise
1 kHz
-125
dBc/Hz
[1] Slow clock is a fail safe input
Table 14 Slow Clock Source Requirements
The information in this document is subject to change without notice.
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DATASHEET
BLUETOOTH HCI UART
Figure 7 Bluetooth UART Timing
Table 15 Bluetooth UART Timing
The information in this document is subject to change without notice.
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DATASHEET
Figure 8 Bluetooth UART Data Frame
Table 16 Bluetooth UART Data Frame
The information in this document is subject to change without notice.
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DATASHEET
SDIO INTERFACE TIMING
Table 17 SDIO Interface Read (see Figure 9)
Figure 9 SDIO Single Block Read
Table 18 SDIO Interface Write (see Figure 10)
Figure 10 SDIO Single Block Write
The information in this document is subject to change without notice.
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DATASHEET
SDIO CLOCK TIMING
Table 19 SDIO Clock Timing
Figure 11 SDIO Clock Timing
The information in this document is subject to change without notice.
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DATASHEET
SOLDERING RECOMMENDATIONS
Recommended Reflow Profile for Lead Free Solder
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the
host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability
of Electronic Assemblies, section 8.2.4 Castellated Terminations.”
Figure 12 Reflow Profile
The information in this document is subject to change without notice.
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DATASHEET
CLEANING
SHIPPING, HANDLING, AND STORAGE
In general, cleaning populated modules is
strongly discouraged. Residuals under the
module cannot be easily removed with any
cleaning process.
Shipping



Cleaning with water can lead to capillary
effects where water is absorbed into the gap
between the host board and the module.
The combination of soldering flux residuals
and encapsulated water could lead to short
circuits between neighboring pads. Water
could also damage any stickers or labels.
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux
residuals into the RF shield, which is not
accessible for post-washing inspection. The
solvent could also damage any stickers or
labels.
Ultrasonic cleaning could damage the
module permanently.
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the
following:

Proper alignment and centering of the
module over the pads.

Proper solder joints on all pads.

Excessive solder or contacts to neighboring
pads or vias.
REWORK
The module can be unsoldered from the host
board if the Moisture Sensitivity Level (MSL)
requirements are met as described in this
datasheet.
Never attempt rework on the module
itself, e.g., replacing individual
components.
Such actions will
terminate warranty coverage.
TiWi-R2 modules are delivered in trays of 100
or reels of 1,000.
Handling
The TiWi-R2 modules contain a highly sensitive
electronic circuitry. Handling without proper
ESD protection may damage the module
permanently.
Moisture Sensitivity Level (MSL)
Per J-STD-020, devices rated as MSL 4 and
not stored in a sealed bag with desiccant pack
should be baked prior to use.
After opening packaging, devices that will be
subjected to reflow must be mounted within 72
hours of factory conditions (<30°C and 60%
RH) or stored at <10% RH.
Bake devices for 48 hours at 125°C.
Storage
Please use this product within 6 months after
receipt. Any product used after 6 months of
receipt needs to have solderability confirmed
before use.
The product shall be stored without opening the
packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be
deformed at the temperatures above this range.)
Do not store in salty air or in an environment
with a high concentration of corrosive gas, such
as Cl2, H2S, NH3, SO2, or NOX.
Do not store in direct sunlight.
The product should not be subject to excessive
mechanical shock.
The information in this document is subject to change without notice.
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DATASHEET
Repeating Reflow Soldering
Only a single reflow soldering process is recommended for host boards.
The information in this document is subject to change without notice.
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DATASHEET
AGENCY CERTIFICATIONS
FCC ID: TFB-TIWI1-01, 15.247
IC ID: 5969A-TIWI101, RSS 210
CE: Compliant to standards EN 60950-1, EN 300 328, and EN 301 489
AGENCY STATEMENTS
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates uses and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.

Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
FCC CAUTION: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate this equipment.
The information in this document is subject to change without notice.
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DATASHEET
Industry Canada Statements
Operation is subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired operation of
the device.
To reduce potential radio interference to other users, the antenna type and its gain should be so
chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for
successful communication.
This device has been designed to operate with the antenna(s) listed below, and having a maximum
gain of 4.3 dBi (LSR Dipole), -0.6dBi (Ethertronics Presetta), and 3.0dBi (Taoglas Flexible Dipole).
Antennas not included in this list or having a gain greater than 4.3 dBi, -0.6dBi, and 3.0dBi are strictly
prohibited for use with this device. The required antenna impedance is 50 ohms.
List of all Antennas Acceptable for use with the Transmitter
1) LS Research 001-0001 center-fed dipole antenna and LS Research 080-0001 U.FL to Reverse
Polarity SMA connector cable.
2) Ethertronics Presetta 1000423 and Johnson Emerson U.FL to U.FL coaxial cable 415-0088-150.
3) Taoglas FXP831.07.0100C flexible dipole antenna with integrated cable and U.FL connector.
L'opération est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer
d'interférences et (2) cet appareil doit accepter toute interférence, y compris les interférences qui
peuvent causer un mauvais fonctionnement de l'appareil.
Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre
choisis de manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle
permise pour une communication réussie.
Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximum de
4,3 dBi (LSR dipôle),-0.6dBi (Ethertronics Presetta), et 3.0dBi (Taoglas Flexibles Dipôle). Antennes
pas inclus dans cette liste ou ayant un gain supérieur à 4,3 dBi, 0.6dBi, et 3.0dBi sont strictement
interdits pour une utilisation avec cet appareil. L'impédance d'antenne requise est de 50 ohms.
Liste de toutes les antennes acceptables pour une utilisation avec l'émetteur
1) LS Research 001-0001 alimenté par le centre antenne dipôle et LS Research 080-0001
U.FL d'inversion de polarité du câble connecteur SMA.
2) Ethertronics Presetta 1000423 et Johnson Emerson U.FL d'un câble coaxial U.FL 415-0088-150.
3) Taoglas FXP831.07.0100C antenne dipôle flexible avec câble intégré et un connecteur U.FL.
The information in this document is subject to change without notice.
330-0045-R4.2
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA
REGULATIONS
The TiWi-R2 Module has been certified for integration into products only by OEM integrators under the
following conditions:
This device is granted for use in Mobile only configurations in which the antennas used for this
transmitter must be installed to provide a separation distance of at least 20cm from all person and not
be co-located with any other transmitters except in accordance with FCC and Industry Canada multitransmitter product procedures.
As long as the two conditions above are met, further transmitter testing will not be required.
However, the OEM integrator is still responsible for testing their end-product for any additional
compliance requirements required with this module installed (for example, digital device emissions, PC
peripheral requirements, etc.).
IMPORTANT NOTE: In the event that these conditions cannot be met (for certain
configurations or co-location with another transmitter), then the FCC and Industry
Canada authorizations are no longer considered valid and the FCC ID and IC Certification
Number cannot be used on the final product. In these circumstances, the OEM integrator
will be responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate FCC and Industry Canada authorization.
Le module de TiWi-R2 a été certifié pour l'intégration dans des produits uniquement par des
intégrateurs OEM dans les conditions suivantes:
Ce dispositif est accordé pour une utilisation dans des configurations mobiles seul dans lequel les
antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toute personne et ne pas être colocalisés avec les autres émetteurs, sauf en conformité
avec la FCC et de l'Industrie Canada, multi-émetteur procédures produit.
Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne
seront pas tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour
toutes les exigences de conformité supplémentaires requis avec ce module installé (par exemple, les
émissions appareil numérique, les exigences de périphériques PC, etc.)
NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour
certaines configurations ou de co-implantation avec un autre émetteur), puis la FCC et
Industrie autorisations Canada ne sont plus considérés comme valides et l'ID de la FCC
et IC numéro de certification ne peut pas être utilisé sur la produit final. Dans ces
circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris
l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation.
The information in this document is subject to change without notice.
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
OEM LABELING REQUIREMENTS FOR END-PRODUCT
The TiWi-R2 module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC
certification numbers are not visible when the module is installed inside another device, as such the
end device into which the module is installed must display a label referring to the enclosed module.
The final end product must be labeled in a visible area with the following:
“Contains Transmitter Module FCC ID: TFB-TIWI1-01”
“Contains Transmitter Module IC: 5969A-TIWI101”
or
“Contains FCC ID: TFB-TIWI1-01”
“Contains IC: 5969A-TIWI101”
The OEM of the TiWi-R2 Module must only use the approved antenna(s) listed above, which have been
certified with this module.
Le module de TiWi-R2 est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de
la FCC et IC numéros de certification ne sont pas visibles lorsque le module est installé à
l'intérieur d'un autre appareil, comme par exemple le terminal dans lequel le module est installé
doit afficher une etiquette faisant référence au module ci-joint. Le produit final doit être étiqueté dans un
endroit visible par le suivant:
“Contient Module émetteur FCC ID: TFB-TIWI1-01"
“Contient Module émetteur IC: 5969A-TIWI101"
ou
“Contient FCC ID: TFB-TIWI1-01"
“Contient IC: 5969A-TIWI101"
L’OEM du module TiWi-R2 ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec
ce module.
The information in this document is subject to change without notice.
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DATASHEET
OEM END PRODUCT USER MANUAL STATEMENTS
The OEM integrator should not provide information to the end user regarding how to install or remove
this RF module or change RF related parameters in the user manual of the end product.
The user manual for the end product must include the following information in a prominent
location:
This device is granted for use in Mobile only configurations in which the antennas used for this
transmitter must be installed to provide a separation distance of at least 20cm from all person and not
be co-located with any other transmitters except in accordance with FCC and Industry Canada multitransmitter product procedures.
Other user manual statements may apply.
L'intégrateur OEM ne devrait pas fournir des informations à l'utilisateur final en ce qui concerne la façon
d'installer ou de retirer ce module RF ou modifier les paramètres RF connexes dans le manuel
utilisateur du produit final.
Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans
unendroit bien en vue:
Ce dispositif est accordé pour une utilisation dans des configurations mobiles seule dans laquelle les
antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toute personne et ne pas être co-localisés avec les autres émetteurs, sauf en
conformité avec FCC et Industrie Canada, multi-émetteur procédures produit.
Autres déclarations manuel de l'utilisateur peuvent s'appliquer.
The information in this document is subject to change without notice.
330-0045-R4.2
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DATASHEET
EUROPE
CE Notice
This device has been tested and certified for use in the European Union. See the Declaration of
Conformity (DOC) for specifics.
If this device is used in a product, the OEM has responsibility to verify compliance of the final product to
the EU standards. A Declaration of Conformity must be issued and kept on file as described in the
Radio and Telecommunications Terminal Equipment (R&TTE) Directive.
The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive.
Declaration of Conformity (DOC)
This DOC can be downloaded from the LSR Wiki.
The information in this document is subject to change without notice.
330-0045-R4.2
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
MECHANICAL DATA
Figure 13 Module Mechanical Dimensions (Maximum Module Height = 1.9 mm)
The information in this document is subject to change without notice.
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
Figure 14 TiWi-R2 Recommended PCB Footprint (Top View)
The information in this document is subject to change without notice.
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DATASHEET
TAPE AND REEL SPECIFICATION
Figure 15 TiWi-R2 Tape and Reel Specification
The information in this document is subject to change without notice.
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
DEVICE MARKINGS
Rev 0 Devices
WL1271: WL1271A1YFVR PG2.1
Front End: TQM679002A
LS Research
TiWi01-R2
2D Bar
Code
00-XXXXXX
Where 00 = revision
XXXXXX = incremental serial number
2D Barcode Format is Data Matrix Standard
Rev 1 Devices
WL1271: WL1271BYFVR PG3.1
Front End: TQM679002A

Changed the WL1271 IC to WL1271BYFVR PG3.1.
LS Research
TiWi01-R2
2D Bar
Code
01-XXXXXX
Where 01 = revision
XXXXXX = incremental serial number
2D Barcode Format is Data Matrix Standard
The information in this document is subject to change without notice.
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
Rev 2 Devices
WL1271: WL1271BYFVR PG3.1
Front End: TQM679002A

Changed PCB supplier.
LS Research
TiWi-R2
2D Bar
Code
2-XXXXXX
Where 2 = revision
XXXXXX = incremental serial number
2D Barcode Format is Data Matrix Standard
Rev 3 Devices
WL1271: WL1271BYFVR PG3.1
Front End: TQM679002A

Incorporated PCB DFM improvements.
LS Research
TiWi-R2
2D Bar
Code
3-XXXXXX
Where 3 = revision
XXXXXX = incremental serial number
2D Barcode Format is Data Matrix Standard
The information in this document is subject to change without notice.
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
Rev 4 Devices
WL1271: WL1271BYFVR PG3.1
Front End: TQM679002A



LSR logo changed from red to black.
Improvements to prevent solder from wicking to bottom pad on module pin 48.
Switched the locations of the serial number and model name on the label.
LS RESEARCH
4-XXXXXX
2D Bar
Code
Model: TiWi-R2
Where 4 = Revision
XXXXXX = incremental serial number
2D Barcode Format is Data Matrix Standard
The information in this document is subject to change without notice.
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TiWi-R2 TRANSCEIVER MODULE
DATASHEET
CONTACTING LS RESEARCH
Headquarters
LS Research, LLC
W66 N220 Commerce Court
Cedarburg, WI 53012-2636
USA
Tel: (262) 375-4400
Fax: (262) 375-4248
Website
www.lsr.com
Wiki
wiki.lsr.com
Technical Support
forum.lsr.com
Sales Contact
sales@lsr.com
The information in this document is provided in connection with LS Research (hereafter referred to as “LSR”)
products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by
this document or in connection with the sale of LSR products. EXCEPT AS SET FORTH IN LSR’S TERMS AND
CONDITIONS OF SALE LOCATED ON LSR’S WEB SITE, LSR ASSUMES NO LIABILITY WHATSOEVER AND
DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A
PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL LSR BE LIABLE FOR ANY
DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING,
WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF
INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF LSR HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. LSR makes no representations or warranties with
respect to the accuracy or completeness of the contents of this document and reserves the right to make changes
to specifications and product descriptions at any time without notice. LSR does not make any commitment to
update the information contained herein. Unless specifically provided otherwise, LSR products are not suitable
for, and shall not be used in, automotive applications. LSR’s products are not intended, authorized, or warranted
for use as components in applications intended to support or sustain life.
The information in this document is subject to change without notice.
330-0045-R4.2
Copyright © 2010-2013 LS Research, LLC
Page 40 of 40
Source Exif Data: 
File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.5
Linearized                      : No
Page Count                      : 40
Language                        : en-US
Author                          : Mike Richter
Creator                         : Microsoft® Word 2010
Create Date                     : 2013:07:11 16:10:08-05:00
Modify Date                     : 2013:07:11 16:10:08-05:00
Producer                        : Microsoft® Word 2010
EXIF Metadata provided by EXIF.tools
FCC ID Filing: TFB-TIWI1-01

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