Laird Connectivity TIWI501 TiWi5 Transceiver Module User Manual 330 0042 R2 4 Synapse

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TiWi5 TRANSCEIVER MODULE
DATASHEET
Integrated Transceiver Modules for WLAN 802.11 a/b/g/n, Bluetooth,
Bluetooth Low Energy (BLE), and ANT
FEATURES



DESCRIPTION
The TiWi5 module is a high performance 2.4 /5.5
GHz IEEE 802.11 a/b/g/n, Bluetooth 2.1+EDR, and
Bluetooth Low Energy (BLE) 4.0 radio in a cost
effective, pre‐certified footprint.
IEEE 802.11 a,b,g,n,d,e,I compliant
Typical WLAN Transmit Power:
18.3 dBm, 11 Mbps, CCK (b)
14.4 dBm, 54 Mbps, OFDM (g)
12.5 dBm, 65 Mbps, OFDM (n)
Typical WLAN Sensitivity:
‐88 dBm, 8% PER,11 Mbps
‐74 dBm, 10% PER, 54 Mbps
‐72 dBm, 10% PER, 65 Mbps

Bluetooth 2.1+EDR, Power Class 1.5

Full support for BLE 4.0 and ANT

Miniature footprint: 18 mm x 13 mm

Low height profile: 1.9 mm

Terminal for PCB/Chip antenna feeds

Worldwide acceptance: FCC (USA), IC (Canada),
and CE (Europe)

Modular certification allows reuse of LSR FCC ID
and ETSI certification without repeating the
expensive testing on your end product
The module realizes the necessary PHY/MAC layers
to support WLAN applications in conjunction with a
host processor over a SDIO interface.

Compact design based on Texas Instruments
WL1273L Transceiver

Seamless integration with TI OMAP™ application
processors

SDIO Host data path interfaces

Bluetooth Advanced Audio Interfaces

Low power operation modes

RoHS compliant

Streamlined development with LSR Design
Services
APPLICATIONS

Security

HVAC Control, Smart Energy

Sensor Networks

Medical
The module also provides a Bluetooth platform
through the UART or btSPI HCI transport layer. Both
WLAN and Bluetooth share the same antenna port.
TiWi5 is pin for pin compatible with the TiWi‐R2 and
TiWi‐BLE modules. TiWi5 does not include the on
module U.FL connector.
Need to get to market quickly? Not an expert in
802.11 or Bluetooth? Need a custom antenna?
Would you like to own the design? Would you like
a custom design? Not quite sure what you need?
Do you need help with your host board? LS
Research Design Services will be happy to develop
custom hardware or software, integrate the design,
or license the design so you can manufacture
yourself. Contact us at sales@lsr.com or call us at
262‐375‐4400.
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 1 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
ORDERING INFORMATION
Order Number
Description
450‐0053
TiWi5 Module (Tray, SPQ = 100)
450‐0053R
TiWi5 Module (Tape and Reel, SPQ = 1000)
Table 1 Orderable TiWi5 Part Numbers
MODULE ACCESSORIES
Order Number
Description
001‐0009
2.4/5.5 GHz Dual‐Band Dipole Antenna with
Reverse Polarity SMA Connector
080‐0001
U.FL to Reverse Polarity SMA Bulkhead Cable
105mm
Table 2 Module Accessories
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 2 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
BLOCK DIAGRAM
Figure 1 TiWi5 Module Block Diagram – Top‐Level
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 3 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
TABLE OF CONTENTS
FEATURES...................................................................................................................................... 1
APPLICATIONS ............................................................................................................................... 1
DESCRIPTION ................................................................................................................................ 1
ORDERING INFORMATION ............................................................................................................ 2
MODULE ACCESSORIES.................................................................................................................. 2
BLOCK DIAGRAM........................................................................................................................... 3
PIN DESCRIPTIONS ........................................................................................................................ 7
INI FILE RADIO PARAMETERS ........................................................................................................ 9
ELECTRICAL SPECIFICATIONS ....................................................................................................... 10
Absolute Maximum Ratings .............................................................................................................................. 10
Recommended Operating Conditions ................................................................................................................ 10
General Characteristics ..................................................................................................................................... 11
WLAN RF Characteristics ................................................................................................................................... 14
Bluetooth RF Characteristics ............................................................................................................................. 17
Bluetooth Low Energy RF Characteristics ........................................................................................................... 18
WLAN POWER‐UP SEQUENCE...................................................................................................... 19
WLAN POWER‐DOWN SEQUENCE ............................................................................................... 21
BLUETOOTH POWER‐UP SEQUENCE ............................................................................................ 22
BLUETOOTH POWER‐DOWN SEQUENCE ...................................................................................... 23
ENABLE SCHEME ......................................................................................................................... 24
IRQ OPERATION .......................................................................................................................... 24
SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS ......................................................................... 25
BLUETOOTH HCI UART ................................................................................................................ 26
SDIO INTERFACE TIMING ............................................................................................................. 28
SDIO CLOCK TIMING .................................................................................................................... 29
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 4 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
SOLDERING RECOMMENDATIONS ............................................................................................... 30
Recommended Reflow Profile for Lead Free Solder ........................................................................................... 30
CLEANING ................................................................................................................................... 31
OPTICAL INSPECTION .................................................................................................................. 31
REWORK ..................................................................................................................................... 31
SHIPPING, HANDLING, AND STORAGE ......................................................................................... 31
Shipping............................................................................................................................................................ 31
Handling ........................................................................................................................................................... 31
Moisture Sensitivity Level (MSL)........................................................................................................................ 31
Storage ............................................................................................................................................................. 31
Repeating Reflow Soldering .............................................................................................................................. 32
AGENCY CERTIFICATIONS ............................................................................................................ 33
AGENCY STATEMENTS ................................................................................................................. 33
Federal Communication Commission Interference Statement ............................................................................ 33
Industry Canada Statements ............................................................................................................................. 35
OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS ............. 37
OEM LABELING REQUIREMENTS FOR END‐PRODUCT .................................................................. 37
OEM END PRODUCT USER MANUAL STATEMENTS ...................................................................... 39
EUROPE ....................................................................................................................................... 40
CE Notice .......................................................................................................................................................... 40
Declaration of Conformity (DOC) ....................................................................................................................... 40
MECHANICAL DATA ..................................................................................................................... 41
PCB FOOTPRINT .......................................................................................................................... 42
TAPE AND REEL SPECIFICATION ................................................................................................... 43
DEVICE MARKINGS ...................................................................................................................... 44
Rev 1 Devices .................................................................................................................................................... 44
Rev 2 Devices .................................................................................................................................................... 44
Rev 3 Devices .................................................................................................................................................... 45
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 5 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
CONTACTING LS RESEARCH ......................................................................................................... 46
TIWI5 MODULE FOOTPRINT AND PIN DEFINITIONS
To apply the TiWi5 module, it is important to use the module pins in your application as they are designated in
below and in the corresponding pin definition table found on pages 7 and 8. Not all the pins on the TiWi5
module may be used, as some are reserved for future functionality.
Figure 2 TiWi5 Pinout (Top View)
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 6 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
PIN DESCRIPTIONS
Module
Pin
Name
I/O
Type
Buffer
Type
Logic
Level
VBAT
PI
‐
‐
BT_FUNC5
DO
4 mA
1.8 VDC HOST_WU (*)
WL_UART_DBG
DIO
4 mA
1.8 VDC WL_UART_DBG
WLAN_IRQ
DO
4 mA
1.8 VDC WLAN Interrupt Request
BT_EN
DI
‐
1.8 VDC Bluetooth Enable
FM_EN
DI
‐
1.8 VDC NOT SUPPORTED, CONNECT TO GND
WL_RS232_RX
DI
‐
1.8 VDC WLAN TEST UART RX (*)
WL_RS232_TX
DO
4 mA
1.8 VDC WLAN TEST UART TX (*)
FM_I2S_FSYNC
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
10
WL_EN
DI
‐
11
VIO
PI
‐
‐
POWER SUPPLY FOR 1.8 VDC DIGITAL DOMAIN
12
GND
GND
‐
‐
Ground
13
SDIO_D3
DIO
8 mA
1.8 VDC SDIO INTERFACE, HOST PULL UP
14
SDIO_D2
DIO
8 mA
1.8 VDC SDIO INTERFACE, HOST PULL UP
15
SDIO_D1
DIO
8 mA
1.8 VDC SDIO INTERFACE, HOST PULL UP
16
SDIO_D0
DIO
8 mA
1.8 VDC SDIO INTERFACE, HOST PULL UP
17
SDIO_CMD
DIO
8 mA
1.8 VDC HOST PULL UP
18
SDIO_CLK
DI
‐
1.8 VDC HOST PULL UP
19
SLOW_CLK
DI
‐
1.8 VDC SLEEP CLOCK (32 kHz)
20
FM_IRQ
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
21
FM_SDA
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
22
FM_SCL
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
23
FM_I2S_CLK
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
24
FM_I2S_DI
DI
4 mA
1.8 VDC NOT SUPPORTED, CONNECT TO GND
25
FM_I2S_DO
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
26
FM_AUD_RIN
AI
‐
‐
NOT SUPPORTED, CONNECT TO GND
27
FM_AUD_LIN
AI
‐
‐
NOT SUPPORTED, CONNECT TO GND
28
FMRFOUT
AO
‐
‐
NOT SUPPORTED, NO CONNECT
29
FMRFIN
AI
‐
‐
NOT SUPPORTED, CONNECT TO GND
30
GND
GND
‐
‐
Ground
Description
Battery Voltage 3.6 VDC Nominal (3.0‐4.8 VDC)
1.8 VDC WLAN Enable
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 7 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
Module
Pin
Name
I/O
Type
Buffer
Type
Logic
Level
31
FM_AUD_ROUT
AO
‐
‐
NOT SUPPORTED, NO CONNECT
32
FM_AUD_LOUT
AO
‐
‐
NOT SUPPORTED, NO CONNECT
33
AUD_FSYNC
DIO
4 mA
1.8 VDC PCM I/F
34
HCI_RX
DI
8 mA
1.8 VDC Bluetooth HCI UART RX (*)
35
HCI_RTS
DO
4 mA
1.8 VDC Bluetooth HCI UART RTS (*)
36
HCI_TX
DIO
8 mA
1.8 VDC Bluetooth HCI UART TX
37
AUD_CLK
DO
4 mA
1.8 VDC PCM I/F (*)
38
AUD_OUT
DO
4 mA
1.8 VDC PCM I/F (*)
39
HCI_CTS
DI
4 mA
1.8 VDC Bluetooth HCI UART CTS (*)
40
AUD_IN
DI
4 mA
1.8 VDC PCM I/F (*)
41
BT_FUNC2
DI
4 mA
1.8 VDC Bluetooth Wakeup[DI] / DC2DC mode[DO](*)
42
BT_FUNC4
DO
4 mA
1.8 VDC BT_UARTD (DEBUG) (*)
43
VDD_LDO_CLASS_1P5
NC
‐
‐
VBAT VOLTAGE PRESENT, NO CONNECT
44
GND
GND
‐
‐
Ground
45
GND
GND
‐
‐
Ground
46
GND
GND
‐
‐
Ground
47
GND
GND
‐
‐
Ground
48
ANT
RF
‐
Antenna terminal for WLAN and Bluetooth (note [1])
49
GND
GND
‐
‐
Ground
50
GND
GND
‐
‐
Ground
51
GND
GND
‐
‐
Ground
52
GND
GND
‐
‐
Ground
Description
PI = Power Input
PO = Power Output
DI = Digital Input (1.8 VDC Logic Level)
AI = Analog Input
AO = Analog Output
AIO = Analog Input/Output
DO = Digital Output (1.8 VDC Logic Level)
RF = RF Port
GND = Ground
Note[1]: Antenna terminal presents DC short circuit to ground.
(*) indicates that pin is capable of bidirectional operation, but is used as the type shown.
Table 3 TiWi5 Module Pin Descriptions
All digital I/O signals use 1.8V logic. If the host microcontroller does not support 1.8V logic, then
level shifters MUST be used.
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 8 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
INI FILE RADIO PARAMETERS
There is an ini file that contains WLAN radio parameters which are critical to both the RF performance and EMC
compliance of the module.
The ini file available on the LSR wiki is only intended to be used with the LSR WLAN Eval Tool. Note that this ini
file will not work when using the TiWi5 module in normal operation which typically involves an operating
system. To use the TiWi5 module in normal operation, refer to specifics contained in the TiWi Family INI File
Radio Parameter User Guide which is also available for download on the LSR website.
The settings specified in the appropriate ini file must be used to operate the module in compliance with the
modular certification for FCC or ETSI. There is a unique ini file for operating the module in compliance with FCC
regulations, and a different ini file for operating the module in compliance with the ETSI regulations.
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 9 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
ELECTRICAL SPECIFICATIONS
The majority of these characteristics are based on controlling and conditioning the tests using the TiWi5 control
software application. Other control conditions may require these values to be re‐characterized by the customer.
Absolute Maximum Ratings
Parameter
Min
Max
Unit
Power supply voltage (VBAT)(4)(5)
‐0.5
+5.5
Digital supply voltage (VIO)
‐0.5
2.1
Voltage on any GPIO
‐0.5
VIO + 0.5
Voltage on any Analog Pins(3)
‐0.5
2.1
+10
dBm
RF input power, antenna port
Operating temperature(6)
‐40
+85
ºC
Storage temperature
‐55
+125
ºC
1.
2.
3.
4.
5.
6.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device and are not covered by
the warranty. These are stress ratings only and functional operation of the device at these or any other conditions beyond those
indicated under “recommended operating conditions” is not implied. Exposure to absolute‐maximum‐rated conditions for extended
periods may affect device reliability.
All parameters are measured as follows unless stated otherwise: VDD_IN=1.8V, VDDIO_1.8V=1.8V, VDD_LDO_CLASS1P5=3.6V
Analog pins: XTALP, XTALM, RFIOBT, DRPWRXBM, DRPWRXBP, DRPWTXB, and also FMRFINP, FMRFINM, FMRFINM, FMAUDLIN,
FMAUDRIN, FMAUDLOUT, FMAUDROUT
The following signals are from the VBAT group, PMS_VBAT and VDD_LDO_CLASS1P5 (if BT class 1.5 direct VBAT is used).
Maximum allowed depends on accumulated time at that voltage; 4.8V for 7 years lifetime, 5.5V for 6 hours cumulative.
The device can be reliably operated for 5,000 active‐WLAN cumulative hours at TA of 85oC.
Table 4 Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Min
Typ
Max
Unit
VBAT
3.0
3.6
4.8
VIO
1.62
1.8
1.92
VIH
0.65 x VIO
‐
VIO
VIL
‐
0.35 x VIO
VOH @ 4, 8 mA
VIO ‐ 0.45
‐
VIO
VOL @ 4, 8 mA
‐
0.45
‐40
25
85
ºC
Ambient temperature range
Table 5 Recommended Operating Conditions
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 10 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
General Characteristics
Parameter
Min
Typ
Max
Unit
WLAN RF frequency range 1
2412
2472
MHz
WLAN RF frequency range 2
4910
5835
MHz
65
Mbps
2480
MHz
WLAN RF data rate
BT RF frequency Range
802.11 a/b/g/n
rates supported
2402
Table 6 General Characteristics
Power Consumption – WLAN 2.4 GHz
Parameter
Test Conditions
Min
Typ
Max
Unit
CCK (802.11b)
TX Current
2437 MHz, VBAT =3.6V, Tamb=+25°C
Po=18.3 dBm, 11 Mbps CCK
L=1200 bytes, tdelay (idle)=4 S
‐
247
‐
mA
OFDM (802.11g)
TX Current
2437 MHz, VBAT =3.6V, Tamb=+25°C
Po=14.4 dBm, 54 Mbps OFDM
L=1200 bytes, tdelay (idle)=4 S
‐
180
‐
mA
OFDM (802.11n)
TX Current
2437 MHz, VBAT =3.6V, Tamb=+25°C
Po=12.5 dBm, 65 Mbps OFDM
L=1200 bytes, tdelay (idle)=4 S
‐
166
‐
mA
CCK (802.11b)
RX Current
‐
93
‐
mA
OFDM (802.11g)
RX Current
‐
93
‐
mA
OFDM (802.11n)
RX Current
‐
93
‐
mA
Dynamic Mode [1]
‐
<1.2
‐
mA
[1] Total Current from VBAT for reception of Beacons with DTIM=1 TBTT=100 mS, Beacon duration 1.6ms, 1 Mbps beacon reception in
Listen Mode.
Table 7 2.4 GHz WLAN Power Consumption
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 11 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
Power Consumption – WLAN 5 GHz
Parameter
Test Conditions
Min
Typ
Max
Unit
OFDM 9 Mbps (802.11a)
TX Current
5745 MHz, VBAT =3.6V, Tamb=+25°C
Po=17.6 dBm, 9 Mbps OFDM
L=1200 bytes, tdelay (idle)=4 S
‐
296
‐
mA
OFDM 54 Mbps (802.11a)
TX Current
5745 MHz, VBAT =3.6V, Tamb=+25°C
Po=15.0 dBm, 54 Mbps OFDM
L=1200 bytes, tdelay (idle)=4 S
‐
235
‐
mA
MCS0 6.5 Mbps (802.11a)
TX Current
5745 MHz, VBAT =3.6V, Tamb=+25°C
Po=18.0 dBm, MCS0 OFDM
L=1200 bytes, tdelay (idle)=4 S
‐
298
‐
mA
MCS7 65 Mbps (802.11a)
TX Current
5745 MHz, VBAT =3.6V, Tamb=+25°C
Po=13.2 dBm, MCS7 OFDM
L=1200 bytes, tdelay (idle)=4 S
‐
219
‐
mA
54/65 Mbps (802.11a/n) RX
Current
‐
100
‐
mA
Dynamic Mode [1]
‐
<1.2
‐
mA
[1] Total Current from VBAT for reception of Beacons with DTIM=1 TBTT=100 mS, Beacon duration 1.6ms, 1 Mbps beacon reception in
Listen Mode.
Table 8 5 GHz WLAN Power Consumption
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 12 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
Power Consumption ‐ Bluetooth
Parameter
Test Conditions
Min
Typ
Max
Unit
GFSK TX Current
Constant Transmit, 1DH5, PRBS9
‐
45
‐
mA
EDR TX Current
Constant Transmit, 2DH5,3DH5, PRBS9
‐
43
‐
mA
GFSK RX Current
Constant Receive, 1DH1
‐
35
‐
mA
EDR RX Current
Constant Receive, 2DH5, 3DH5
‐
41
‐
mA
Deep Sleep Current
Deep Sleep Mode
‐
70
‐
µA
Typ
Max
Unit
‐
16
mA
Table 9 Bluetooth Power Consumption
DC Characteristics – General Purpose I/O
Parameter
Test Conditions
Min
VIO Current
Logic input low, VIL
‐
0.35 x VIO
Logic input high, VIH
0.65 x VIO
‐
VIO
Logic output low, VOL
(Full Drive)
Iout = 8 mA
‐
0.45
Iout = 4 mA
‐
0.45
Logic output low, VOL
(Reduced Drive)
Iout = 1 mA
‐
0.112
Iout = 0.09 mA
‐
0.01
Logic output high, VOH
(Full Drive)
Iout = ‐8 mA
VIO ‐ 0.45
‐
VIO
Iout = ‐4 mA
VIO ‐ 0.45
‐
VIO
Logic output high, VOH
(Reduced Drive)
Iout = ‐1 mA
VIO ‐ 0.112
‐
VIO
Iout = ‐0.3 mA
VIO ‐ 0.033
‐
VIO
Table 10 DC Characteristics General Purpose I/O
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 13 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
WLAN RF Characteristics
WLAN Transmitter Characteristics 2.4 GHz
(TA=25°C, VBAT=3.6 V)
Test Conditions
Typ
EVM
Min
Typ
Max
Unit
11 Mbps CCK (802.11b) TX
Output Power
11 Mbps CCK , 802.11(b) Mask
Compliance, 35% EVM
RMS power over TX packet
1.1
‐
18.3
‐
dBm
9 Mbps OFDM (802.11g) TX
Output Power
9 Mbps OFDM , 802.11(g) Mask
Compliance, ‐8 dB EVM
RMS power over TX packet
‐24
‐
18.0
‐
dBm
54 Mbps OFDM (802.11g) TX
Output Power
54 Mbps OFDM, 802.11(g) Mask
Compliance, ‐25 dB EVM
RMS power over TX packet
‐34
‐
14.4
‐
dBm
‐24
‐
18.2
‐
dBm
‐35
‐
12.5
‐
dBm
End
Freq
Unit
Parameter
6.5 Mbps OFDM (802.11n) TX
Output Power
65 Mbps OFDM (802.11n) TX
Output Power
6.5 Mbps OFDM, 802.11(n) Mask
Compliance, ‐5 dB EVM
RMS power over TX packet
65 Mbps OFDM, 802.11(n) Mask
Compliance, ‐28 dB EVM
RMS power over TX packet
Table 11 WLAN 2.4 GHz Transmitter RF Characteristics
WLAN Transmitter Characteristics 5 GHz
(TA=25°C, VBAT=3.6 V)
Parameter
9 Mbps
TX Output Power
54 Mbps
TX Output Power
MCS0 6.5 Mbps
TX Output Power
MCS7 65 Mbps
TX Output Power
Test Conditions
9 Mbps OFDM , 802.11(a) Mask
Compliance, ‐8 dB EVM RMS power
over TX packet
54 Mbps OFDM , 802.11(a) Mask
Compliance, ‐25 dB EVM RMS
power over TX packet
MCS0 OFDM , 802.11(a) Mask
Compliance, ‐5 dB EVM RMS power
over TX packet
MCS7 OFDM , 802.11(a) Mask
Compliance, ‐27 dB EVM RMS
power over TX packet
Typ
EVM
Start
Freq
‐31
5170
‐28
5260
‐21
5745
17.8
5825
‐31
5170
13.0
5240
‐30
5260
‐28
5745
15.2
5825
‐31
5170
13.1
5240
‐28
5260
‐21
5745
18.2
5825
‐31
5170
12.5
5240
‐31
5260
‐29
5745
Min
Typ
Max
13.0
‐
‐
‐
‐
15.6
14.6
15.7
12.8
13.5
5240
‐
‐
‐
‐
5700
5700
5700
5700
dBm
dBm
dBm
dBm
5825
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 14 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
Table 12 WLAN 5 GHz Transmitter RF Characteristics
WLAN Receiver Characteristics 2.4 GHz
(TA=25°C, VBAT=3.6 V) [1]
Parameter
Test Conditions
Min
Typ
Max
Unit
1 Mbps CCK (802.11b)
RX Sensitivity
8% PER
‐
‐97
‐
dBm
11 Mbps CCK (802.11b)
RX Sensitivity
8% PER
‐
‐88
‐
dBm
9 Mbps OFDM (802.11g)
RX Sensitivity
10% PER
‐
‐89
‐
dBm
54 Mbps OFDM (802.11g) RX
Sensitivity
10% PER
‐
‐74
‐
dBm
6.5 Mbps OFDM (802.11n) RX
Sensitivity
10% PER
‐
‐89
‐
dBm
65 Mbps OFDM (802.11n) RX
Sensitivity
10% PER
‐
‐72
‐
dBm
11 Mbps CCK (802.11b)
RX Overload Level
8% PER
‐
‐
‐10
dBm
9 Mbps OFDM (802.11g)
RX Overload Level
10% PER
‐
‐
‐17
dBm
54 Mbps OFDM (802.11g) RX
Overload Level
10% PER
‐
‐
‐17
dBm
65 Mbps OFDM (802.11n) RX
Overload Level
10% PER
‐
‐
‐17
dBm
[1] Up to 2 dB degradation at Channel 13 for 11g/n modes and up to 2 dB degradation at Channel 14 for 11b/g/n modes.
Table 13 2.4 GHz WLAN Receiver RF Characteristics
WLAN Receiver Characteristics 5 GHz
(TA=25°C, VBAT=3.6 V) [1]
Parameter
Test Conditions
Min
Typ
Max
Unit
9 Mbps (802.11a)
RX Sensitivity
10% PER
‐
‐87
‐
dBm
54 Mbps (802.11a)
RX Sensitivity
10% PER
‐
‐72
‐
dBm
MCS0 6.5 Mbps (802.11a)
RX Sensitivity
10% PER
‐
‐88
‐
dBm
The information in this document is subject to change without notice.
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MCS7 65 Mbps (802.11a)
RX Sensitivity
10% PER
‐
‐70
‐
dBm
Max Input Level (3)
OFDM (11a or 11n)
<10% PER
‐
‐
‐17
dBm
Table 14 5 GHz WLAN Receiver RF Characteristics
The information in this document is subject to change without notice.
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Bluetooth RF Characteristics
Bluetooth Transmitter GFSK and EDR Characteristics, Class 1.5
(TA=25°C, VBAT=3.6 V)
Test
Conditions
Parameter
Min
Typ
Max
Bluetooth Spec
Unit
GFSK RF Output Power
‐
9.5
‐
‐
dBm
EDR RF Output Power
‐
7.3
‐
Power Control Step Size
2‐8
dB
EDR Relative Power
‐2
‐4/+1
dB
dBm
Table 15 Bluetooth Transmitter RF Characteristics
Bluetooth Receiver Characteristics
(TA=25°C, VBAT=3.6 V)
Test
Conditions
Min
Typ
Max
Bluetooth Spec
Unit
GFSK Sensitivity
BER=0.1%
‐
‐91
‐
‐70
dBm
EDR 2 Mbps Sensitivity
BER=0.01%
‐
‐90
‐
‐70
dBm
EDR 3 Mbps Sensitivity
BER=0.01%
‐
‐83
‐
‐70
dBm
GFSK Maximum Input Level
BER=0.1%
‐
‐
‐5
‐20
dBm
EDR 2 Maximum Input Level
BER=0.1%
‐
‐
‐10
‐
dBm
EDR 3 Maximum Input Level
BER=0.1%
‐
‐
‐10
‐
dBm
Parameter
Table 16 Bluetooth Receiver RF Characteristics
The information in this document is subject to change without notice.
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Bluetooth Low Energy RF Characteristics
Bluetooth BLE Transmitter GMSK and EDR Characteristics, Class 1.5
(TA=25°C, VBAT=3.6 V)
Parameter
Test
Conditions
Min
Typ
Max
Bluetooth Spec
Unit
GMSK RF Output Power
‐
10
‐
‐
dBm
Power Control Step Size
2‐8
dB
(1) BLE spec = 10dBm max can be achieved using normal system losses due to filters etc, or by reducing value through VS
command.
Table 17 Bluetooth Low Energy Transmitter RF Characteristics
Bluetooth BLE Receiver Characteristics
(TA=25°C, VBAT=3.6 V)
Test
Conditions
Min
Typ
Max
Bluetooth Spec
Unit
GMSK Sensitivity
PER = 30.8%
‐
‐90
‐
‐70
dBm
GMSK Maximum Input Level
PER = 30.8%
‐
‐5
‐
‐20
dBm
Parameter
Table 18 Bluetooth Low Energy Receiver RF Characteristics
The information in this document is subject to change without notice.
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WLAN POWER‐UP SEQUENCE
The following sequence describes device power‐up from shutdown. Only the WLAN Core is enabled; the
Bluetooth and FM cores are disabled.
Figure 3 TiWi5 Power‐up Sequence Requirements
1.
No signals are allowed on the IO pins if no IO power is supplied, because the IOs are not 'failsafe’. Exceptions
are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can tolerate external voltages with
no VDDS and DC2DC.
2.
VBAT, VIO, and SLOWCLK must be available before WL_EN.
3.
Twakeup = T1 + T2
The duration of T1 is defined as the time from WL_EN=high until Fref is valid for the SoC. T1=~55ms
The duration of T2 depends on:
– Operating system
– Host enumeration for the SDIO/WSPI
– PLL configuration
– Firmware download
– Releasing the core from reset
The information in this document is subject to change without notice.
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– Firmware initialization
The information in this document is subject to change without notice.
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WLAN POWER‐DOWN SEQUENCE
Notes:
1.
The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
2.
DC_REQ and CLK_REQ are internal signals shown for reference only
Figure 4 TiWi5 Module Power‐down Sequence Requirements
1.
DC_REQ will go low only if WLAN is the only core working. Otherwise if another core is working (e.g BT) it will
stay high.
2.
CLK_REQ will go low only if WLAN is the only core working. Otherwise if another core is working and using the
FREF (e.g BT) it will stay high.
3.
If WLAN is the only core that is operating, WL_EN must remain de‐asserted for at least 64 sec before it is re‐
asserted.
The information in this document is subject to change without notice.
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BLUETOOTH POWER‐UP SEQUENCE
The following sequence describes device power up from shutdown. Only the Bluetooth core is enabled; the WLAN
core is disabled.
Notes:
1.
(A) After this sequence is completed, the device is in the low VIO‐leakage state while in shutdown
2.
The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
3.
DC_REQ, CLK_REQ, and FREF are internal signals shown for reference only
Figure 5 Bluetooth Power‐up Sequence
Power up requirements:
1.
No signals are allowed on the IO pins if no IO power supplied, because the IOs are not 'failsafe'. Exceptions
are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can tolerate external voltages with
no VDDS and DC2DC.
2.
VDDS and SLOWCLK must be stable before releasing BT_EN.
3.
Fast clock must be stable maximum 55 ms after BT_EN goes HIGH.
The information in this document is subject to change without notice.
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BLUETOOTH POWER‐DOWN SEQUENCE
Notes:
1.
The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
2.
DC_REQ and CLK_REQ are internal signals shown for reference only
Figure 6 Bluetooth Power‐down Sequence
The TiWi5 module indicates completion of Bluetooth power‐up sequence by asserting HCI_RTS low. This occurs up
to 100 ms after BT_EN goes high.
The information in this document is subject to change without notice.
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ENABLE SCHEME
The module has 3 enable pins, one for each core: WL_EN, and BT_EN and FM_EN. Presently, there are 2 modes of active
operation now supported: WLAN and Bluetooth. It is recommended that the FM_EN pin be grounded to disable the FM
section. It is also recommended that the FM section be disabled by Bluetooth HCI commands.
1.
Each core is operated independently by asserting each EN signal to Logic '1'. In this mode it is possible to control each
core asynchronously and independently.
2.
Bluetooth mode operation. WLAN will be operated through WL_EN asynchronously and independently of Bluetooth.
IRQ OPERATION
1.
The default state of the WLAN_IRQ prior to firmware initialization is 0.
2.
During firmware initialization, the WLAN_IRQ is configured by the SDIO module; a WLAN_IRQ changes its state to
1.
3.
A WLAN firmware interrupt is handled as follows:
a.
The WLAN firmware creates an Interrupt‐to‐Host, indicated by a 1‐to‐0 transition on the
WLAN_IRQ line (host must be configured as active‐low or falling‐edge detect).
b.
After the host is available, depending on the interrupt priority and other host tasks, it masks the firmware
interrupt. The WLAN_IRQ line returns to 1 (0‐to‐1 transition on the WLAN_IRQ line).
c.
The host reads the internal register status to determine the interrupt sources ‐ the register is cleared after
the read.
d.
The host processes in sequence all the interrupts read from this register
e.
The host unmasks the firmware interrupts.
4. The host is ready to receive another interrupt from the WLAN device.
The information in this document is subject to change without notice.
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SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS
The slow clock is always supplied from an external source. It is input on the SLOW_CLK pin, and can be a digital signal in the
range of VIO only. For slow clock frequency and accuracy refer to Table 19. The external slow clock must be stable before
the system exits from shut down mode.
Parameter [1]
Condition
Symbol
Min
Input slow clock frequency
Input slow clock accuracy
WLAN, BT
Tr/Tf
Frequency input duty cycle
VIL
Max
32768
Input transition time Tr/Tf – 10% to 90%
Input voltage limits
Typ
30
Square wave,
DC coupled
VIH
Input impedance
50
0.65 x VDDS
Unit
Hz
+/‐250
ppm
100
ns
70
VDDS
Vpeak
0.35 x VDDS
MW
Input capacitance
pF
Rise and fall time
100
ns
Phase noise
1 kHz
‐125
dBc/Hz
[1] Slow clock is a fail safe input
Table 19 Slow Clock Source Requirements
The information in this document is subject to change without notice.
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BLUETOOTH HCI UART
Figure 7 Bluetooth UART Timing
Table 20 Bluetooth UART Timing
The information in this document is subject to change without notice.
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Figure 8 Bluetooth UART Data Frame
Table 21 Bluetooth UART Data Frame
The information in this document is subject to change without notice.
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SDIO INTERFACE TIMING
Table 22 SDIO Interface Read (see Figure 9)
Figure 9 SDIO Single Block Read
Table 23 SDIO Interface Write (see Figure 10)
Figure 10 SDIO Single Block Write
The information in this document is subject to change without notice.
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SDIO CLOCK TIMING
Table 24 SDIO Timing
Figure 11 SDIO Timing
The information in this document is subject to change without notice.
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SOLDERING RECOMMENDATIONS
Recommended Reflow Profile for Lead Free Solder
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board
should meet the appropriate IPC Specification. See IPC‐A‐610‐D Acceptability of Electronic Assemblies,
section 8.2.4 Castellated Terminations.”
Figure 12 Reflow Profile
The information in this document is subject to change without notice.
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CLEANING
SHIPPING, HANDLING, AND STORAGE
In general, cleaning the populated modules is
strongly discouraged. Residuals under the module
cannot be easily removed with any cleaning
process.
Shipping



Cleaning with water can lead to capillary effects
where water is absorbed into the gap between
the host board and the module. The
combination of soldering flux residuals and
encapsulated water could lead to short circuits
between neighboring pads. Water could also
damage any stickers or labels.
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux residuals
into the RF shield, which is not accessible for
post‐washing inspection. The solvent could also
damage any stickers or labels.
Ultrasonic cleaning could damage the module
permanently.
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the following:

Proper alignment and centering of the module
over the pads.

Proper solder joints on all pads.

Excessive solder or contacts to neighboring
pads, or vias.
REWORK
The module can be unsoldered from the host board
if the Moisture Sensitivity Level (MSL) requirements
are met as described in this datasheet.
Never attempt a rework on the module
itself, e.g. replacing individual components.
Such actions will terminate warranty
coverage.
Bulk orders of the TiWi5 modules are delivered in
trays of 100 or reels of 1,000.
Handling
The TiWi5 modules contain a highly sensitive
electronic circuitry. Handling without proper ESD
protection may destroy or damage the module
permanently.
Moisture Sensitivity Level (MSL)
Per J‐STD‐020, devices rated as MSL 4 and not
stored in a sealed bag with desiccant pack should be
baked prior to use.
After opening packaging, devices that will be
subjected to reflow must be mounted within 72
hours of factory conditions (<30°C and 60% RH) or
stored at <10% RH.
Bake devices for 48 hours at 125°C.
Storage
Please use this product within 6 months after receipt.
Any product used after 6 months of receipt needs to
have solderability confirmed before use.
The product shall be stored without opening the
packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH. (Packing
materials, in particular, may be deformed at the
temperatures above this range.)
Do not store in salty air or in an environment with a
high concentration of corrosive gas, such as Cl2,
H2S, NH3, SO2, or NOX.
Do not store in direct sunlight.
The product should not be subject to excessive
mechanical shock.
The information in this document is subject to change without notice.
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Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
The information in this document is subject to change without notice.
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AGENCY CERTIFICATIONS
FCC ID: TFB‐TIWI501
IC ID: 5969A‐TIWI501
CE: Compliant to standards EN 60950‐1, EN 300 328, EN 301 489, and EN 301 893
AGENCY STATEMENTS
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by
turning the equipment off and on, the user is encouraged to try to correct the interference by one of the
following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
FCC 15.407(c) states: The device shall automatically discontinue transmission in case of either absence of
information to transmit or operational failure. These provisions are not intended to preclude transmission of
control or signaling information or the use of repetitive codes used by certain digital technologies to complete
frame or burst intervals. Applicants shall include in their application for equipment authorization a description
of how this requirement is met.
Description to meet FCC 15.407(c):
Data transmission is always initiated by software, which is then passed down through the MAC, through the
digital and analog baseband, and finally to the RF transceiver. Several special packets (ACKs, CTS, PSPoll, etc) are
initiated by the MAC. These are the only ways the digital baseband portion will turn on the RF transmitter,
which it then turns off at the end of the packet. Therefore, the transmitter will be on only while one of the
aforementioned packets are being transmitted.
The information in this document is subject to change without notice.
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FCC CAUTION: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this equipment.
The following device approved under 15.407(b)(4)(ii) may be marketed, sold and imported until March
2, 2020. After this date these devices must comply with the emission limits of 15.407.
The information in this document is subject to change without notice.
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Industry Canada Statements
Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this
device must accept any interference, including interference that may cause undesired operation of the device.
To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the
equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.
This device has been designed to operate with the antenna(s) listed below, and having a maximum gain of 2.0
dBi (LSR Dipole), 1.0dBi (Johanson Chip), and .3dBi (Synapse Antenna Configuration). Antennas not included in
this list or having a gain greater than 2.0 dBi, 1.0dBi, and .3dBi are strictly prohibited for use with this device.
The required antenna impedance is 50 ohms.
List of all Antennas Acceptable for use with the Transmitter
1) LS Research 001‐0009 dipole antenna and LS Research 080‐0001 U.FL to Reverse Polarity SMA cable.
2) Johanson 2450AD46A5400E chip antenna.
3) Synapse Antenna Configuation.
UNII devices operating within 5.15‐5.25 GHz are to be restricted to indoor operations to reduce any potential for
harmful interference to co‐channel MSS operations.
IC RSS‐210 A9.4 (4) states: The device shall automatically discontinue transmission in case of absence of
information to transmit, or operational failure. A description of how this is done shall accompany the
application for equipment certification. Note that this is not intended to prohibit transmission of control or
signaling information or the use of repetitive codes where required by the technology.
Description to meet IC RSS‐210 A9.4(4):
Data transmission is always initiated by software, which is then passed down through the MAC, through the
digital and analog baseband, and finally to the RF transceiver. Several special packets (ACKs, CTS, PSPoll, etc) are
initiated by the MAC. These are the only ways the digital baseband portion will turn on the RF transmitter,
which it then turns off at the end of the packet. Therefore, the transmitter will be on only while one of the
aforementioned packets are being transmitted.
The information in this document is subject to change without notice.
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L'opération est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences
et (2) cet appareil doit accepter toute interférence, y compris les interférences qui peuvent causer un mauvais
fonctionnement de l'appareil.
Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre choisis de
manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle permise pour une
communication réussie.
Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci‐dessous, et ayant un gain maximum de 2.0 dBi
(LSR Dipole), 1,0 dBi (Johanson Chip), et 0,3 dBi (Configuration Antenne Synapse). Antennes pas inclus dans
cette liste ou présentant un gain supérieur à 2.0 dBi, 1,0 dBi et 0,3 dBi sont strictement interdits pour une
utilisation avec cet appareil. L'impédance d'antenne requise est de 50 ohms.
Liste de toutes les antennes acceptables pour une utilization avec l'émetteur
1) LS Research 001‐0009 antenne dipôle et LS Research 080‐0001 U. FL à Reverse SMA à polarité du câble.
2) Antenne Johanson puce 2450AD46A5400E.
3) Synapse Antenne Configuration.
Dispositifs UNII opérant dans 5.15‐5.25 GHz doivent être limitées à des opérations à l'intérieur afin de réduire tout risque
d'interférences nuisibles à la co‐canal exploitation du MSS.
IC RSS‐210 A9.4 (4): le dispositif doit automatiquement cesser d'émettre en cas d'absence d'informations à
transmettre, ou l'échec opérationnel. Une description de la façon dont cela est fait doit accompagner la
demande d'homologation du matériel. Notez que ce n'est pas pour objet d'interdire la transmission de contrôle
ou de signalisation d'informations ou l'utilisation de codes répétitifs requis par la technologie.
Description de rencontrer IC RSS‐210 A9.4 (4):
La transmission de données est toujours initiée par le logiciel, qui est ensuite transmis à travers la MAC, à
travers la bande de base numérique et analogique et, enfin, à l'émetteur‐récepteur RF. Plusieurs paquets
spéciaux (ACK, CTS, PSPoll, etc) sont initiées par le MAC. Ce sont les seuls moyens de la partie bande de base
numérique se met en marche l'émetteur RF, ce qui lui puis s'éteint à la fin du paquet. Par conséquent,
l'émetteur sera sur que lorsque l'un des paquets ci‐dessus sont transmises.
The information in this document is subject to change without notice.
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OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS
The TiWi5 Module has been certified for integration into products only by OEM integrators under the following
conditions:
This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must
be installed to provide a separation distance of at least 20cm from all person and not be co‐located with any
other transmitters except in accordance with FCC and Industry Canada multi‐transmitter product procedures.
As long as the two conditions above are met, further transmitter testing will not be required.
However, the OEM integrator is still responsible for testing their end‐product for any additional
compliance requirements required with this module installed (for example, digital device
emissions, PC peripheral requirements, etc.).
IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co‐
location with another transmitter), then the FCC and Industry Canada authorizations are no longer
considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In
these circumstances, the OEM integrator will be responsible for re‐evaluating the end product
(including the transmitter) and obtaining a separate FCC and Industry Canada authorization.
Le module de TiWi5 a été certifié pour l'intégration dans des produits uniquement par des
intégrateurs OEM dans les conditions suivantes:
Ce dispositif est accordé pour une utilisation dans des configurations mobiles seul dans lequel les
antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toute personne et ne pas être colocalisés avec les autres émetteurs, sauf en conformité avec la
FCC et de l'Industrie Canada, multi‐émetteur procédures produit.
Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne seront pas
tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour toutes les
exigences de conformité supplémentaires requis avec ce module installé (par exemple, les émissions appareil
numérique, les exigences de périphériques PC, etc.)
NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines
configurations ou de co‐implantation avec un autre émetteur), puis la FCC et Industrie autorisations
Canada ne sont plus considérés comme valides et l'ID de la FCC et IC numéro de certification ne peut
pas être utilisé sur la produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer
le produit final (y compris l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada
l'autorisation.
OEM LABELING REQUIREMENTS FOR END‐PRODUCT
The TiWi5 module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC certification
numbers are not visible when the module is installed inside another device, as such the end device into which
The information in this document is subject to change without notice.
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the module is installed must display a label referring to the enclosed module. The final end product must be
labeled in a visible area with the following:
“Contains Transmitter Module FCC ID: TFB‐TIWI501”
“Contains Transmitter Module IC: 5969A‐TIWI501”
or
“Contains FCC ID: TFB‐TIWI501”
“Contains IC: 5969A‐TIWI501”
The OEM of the TiWi5 Module must only use the approved antenna(s) listed above, which have been certified
with this module.
Le module de TiWi5 est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de la FCC
et IC numéros de certification ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre appareil,
comme par exemple le terminal dans lequel le module est installé doit afficher une etiquette faisant référence
au module ci‐joint. Le produit final doit être étiqueté dans un endroit visible par le suivant:
“Contient Module émetteur FCC ID: TFB‐TIWI501"
“Contient Module émetteur IC: 5969A‐TIWI501"
ou
“Contient FCC ID: TFB‐TIWI501"
“Contient IC: 5969A‐TIWI501"
Les OEM du module TiWi5 ne doit utiliser l'antenne approuvée (s) ci‐dessus, qui ont été certifiés avec ce
module.
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 38 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
OEM END PRODUCT USER MANUAL STATEMENTS
The OEM integrator should not to provide information to the end user regarding how to install or remove this RF
module or change RF related parameters in the user manual of the end product.
The user manual for the end product must include the following information in a prominent location:
This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must
be installed to provide a separation distance of at least 20cm from all person and not be co‐located with any
other transmitters except in accordance with FCC and Industry Canada multi‐transmitter product procedures.
Other user manual statements may apply.
L'intégrateur OEM ne devraient pas fournir des informations à l'utilisateur final sur la façon d'installer ou de
supprimer ce module RF ou modifier les paramètres liés RF dans le manuel utilisateur du produit final.
Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans unendroit bien en
vue:
Ce dispositif est accordé pour une utilisation dans des configurations mobiles seule dans laquelle les
antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toute personne et ne pas être co‐localisés avec les autres émetteurs, sauf en conformité
avec FCC et Industrie Canada, multi‐émetteur procédures produit.
Autres déclarations manuel de l'utilisateur peuvent s'appliquer.
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 39 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
EUROPE
CE Notice
This device has been tested and certified for use in the European Union. See the Declaration of Conformity
(DOC) for specifics.
If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU
standards. A Declaration of Conformity must be issued and kept on file as described in the Radio and
Telecommunications Terminal Equipment (R&TTE) Directive.
The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive.
Declaration of Conformity (DOC)
This DOC can be downloaded from the LSR Wiki.
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 40 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
MECHANICAL DATA
Figure 13 Module Mechanical Dimensions (Maximum Module Height = 1.9mm)
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 41 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
PCB FOOTPRINT
Figure 14 TiWi5 Recommended PCB Footprint (Top View)
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 42 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
TAPE AND REEL SPECIFICATION
Figure 15 TiWi5 Tape and Reel Specification
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 43 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
DEVICE MARKINGS
Rev 1 Devices
WL1273L: WL1273LYFVR PG3.32
Front End: TQP6M9002

Pre‐production devices.
L S RESEARCH
T iWi5 450 -0053
2D
Bar
Code
1- XXXXXX
Where 1 = Revision
X X X X X X= incremental serial number
2D B arc ode Format is Data Matrix S tandard
Rev 2 Devices
WL1273L: WL1273LYFVR PG3.32
Front End: TQP6M9002




LSR logo changed from red to black.
Added FCC and IC numbers to the label.
Revision number is no longer part of the serial number.
Minor label format changes.
L S RESEARCH
XXXXXX
Model: TiWi 5
P/N: 450-0053
FCC: TFB- TIWI501
IC: 5969A-TIWI 501
REV 2
2D
Bar
Code
Where 2 = Revision
X X X X X X= incremental serial number
2D B arc ode Format is Data Matrix S tandard
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 44 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
Rev 3 Devices
WL1273L: WL1273LYFVR PG3.32
Front End: TQP6M9002

Incorporated PCB DFM improvements.
L S RESEARCH
XXXXXX
Model: TiWi 5
P/N: 450-0053
FCC: TFB- TIWI501
IC: 5969A-TIWI 501
REV 3
2D
Bar
Code
Where 3 = Revision
X X X X X X= incremental serial number
2D B arc ode Format is Data Matrix S tandard
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 45 of 46
TiWi5 TRANSCEIVER MODULE
DATASHEET
CONTACTING LS RESEARCH
Headquarters
LS Research, LLC
W66 N220 Commerce Court
Cedarburg, WI 53012‐2636
USA
Tel: (262) 375‐4400
Fax: (262) 375‐4248
Website
www.lsr.com
Wiki
http://www.lsr.com/products‐wiki
Technical Support
http://www.lsr.com/products‐forum
Sales Contact
sales@lsr.com
© Copyright 2016 Laird. All Rights Reserved. Patent pending. Any information furnished by Laird and its agents is believed
to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and
application of Laird materials or products rests with the end user since Laird and its agents cannot be aware of all potential
uses. Laird makes no warranties as to non‐infringement nor as to the fitness, merchantability, or sustainability of any Laird
materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or any of its affiliates or agents shall
not be liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Terms
and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. When used as a
tradename herein, Laird means Laird PLC or one or more subsidiaries of Laird PLC. Laird™, Laird Technologies™,
corresponding logos, and other marks are trademarks or registered trademarks of Laird. Other marks may be the property
of third parties. Nothing herein provides a license under any Laird or any third party intellectual property right.
The information in this document is subject to change without notice.
330‐0042‐R2.3
Copyright © 2011‐2016
Page 46 of 46

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