Lg Gsa 4165B Users Manual

GSA-4165B GSA-4165 Manual de Servicio

GSA-4165B to the manual 51c64404-3991-4947-9402-0817f9056704

2015-01-26

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Super Multi DVD Drive

SERVICE MANUAL
MODEL: GSA-4165B/
GSA-4167B/
GSA-4168B

P/NO : 3828HS1047G
August 2005
Printed in Korea
MODEL : GSA-4165B/GSA-4167B/GSA-4168B

TABLE OF CONTENTS
INTRODUCTION .......................................................................................................................................................................3
FEATURES............................................................................................................................................................................3~5
SPECIFICATIONS.................................................................................................................................................................6~9
LOCATION OF CUSTOMER CONTROLS .......................................................................................................................10~11
DISASSEMBLY .................................................................................................................................................................12~13
1. CABINET and CIRCUIT BOARD DISASSEMBLY ..........................................................................................................12
1-1. Bottom Chassis ..........................................................................................................................................................12
1-2. Front Bezel Assy ........................................................................................................................................................12
1-3. Cabinet and Main Circuit Board .................................................................................................................................12
2. MECHANISM ASSY DISASSEMBLY..............................................................................................................................12
2-1. Pick-up Unit................................................................................................................................................................12
2-2. Pick-up ......................................................................................................................................................................13
EXPLODED VIEW .............................................................................................................................................................14~15
MECHANICAL REPLACEMENT PARTS LIST ................................................................................................................16~18
GLOSSARY .............................................................................................................................................................................19
THE DIFFERENCES OF CD-R/CD-RW DISCS AND GENERAL CD-ROM.....................................................................20~26
1. Recording Layer ..............................................................................................................................................................20
2. Disc Specification ............................................................................................................................................................20
3. Disc Materials ..................................................................................................................................................................21
4. Reading Process of Optical Disc .....................................................................................................................................22
5. Writing Process of CD-R Disc .........................................................................................................................................23
6. Writing Process of CD-RW Disc ......................................................................................................................................23
7. Organization of the PCA, PMA and Lead-in Area ...........................................................................................................24
8. Function of PCA and PMA area ......................................................................................................................................25
9. OPC and ROPC ..............................................................................................................................................................25
10. Writing Process of DISC................................................................................................................................................26
THE DIFFERENCES OF DVD-R/RW, DVD+R/RW DISCS AND DVD-ROM....................................................................27~35
1. Recording Layer ..............................................................................................................................................................27
2. Disc Specification ............................................................................................................................................................28
3. Disc Materials ..................................................................................................................................................................28
4. Writing Pulse Waveform of DVD+R.................................................................................................................................31
5. Writing Pulse Waveform DVD+RW .................................................................................................................................33
6. Organization of Inner Drive Area, Outer Drive Area, Lead-in Zone and Lead-out Zone .................................................34
LightScribe MEDIA...........................................................................................................................................................36~39
1. LightScribe Media............................................................................................................................................................36
2. Hardware Block Diagram of LightScribe Label Printing...................................................................................................37
3. MD Assy For LightScribe.................................................................................................................................................38
4. Optical Encoder Assy ......................................................................................................................................................39
DVD & CD DATA PROCESSING......................................................................................................................................40~43
1. Data Processing Flow......................................................................................................................................................40
2. Copy Protection and Regional Code Management Block ...............................................................................................41
3. About Prevention the DVD-ROM from to be copy ...........................................................................................................42
4. About the DVD-ROM Regional Code ..............................................................................................................................43
INTERNAL STRUCTURE OF THE PICK-UP....................................................................................................................44~46
1. Block Diagram of the Pick-up(HOP-7632TS) ..................................................................................................................44
2. Pick up Pin Assignment...................................................................................................................................................45
3. Signal detection of the P/U ..............................................................................................................................................46
DESCRIPTION OF CIRCUIT.............................................................................................................................................47~53
1. ALPC Circuit ....................................................................................................................................................................47
2. Focus Circuit....................................................................................................................................................................49
3. Tracking & Sled Circuit ....................................................................................................................................................50
4. Spindle Circuit .................................................................................................................................................................53
MAJOR IC INTERNAL BLOCK DIAGRAM AND PIN DESCRIPTION.............................................................................55~72
TROUBLESHOOTING GUIDE ..........................................................................................................................................73~90
BLOCK DIAGRAM ..................................................................................................................................................................91
PRINTED CIRCUIT BOARD DIAGRAM ...........................................................................................................................92~96
ELECTRICAL REPLACEMENT PARTS LIST ........................................................................................................................97

CAUTION - INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM.

INTRODUCTION
This service manual provides a variety of service
information.
It contains the mechanical structure of the Super
Multi DVD Drive and the electronic circuits in
schematic form. This Super Multi DVD Drive was
manufactured and assembled under our strict quality
control standards and meets or exceeds industry
specifications and standards.
This Super Multi DVD drive is an internal drive unit
designed for use with IBM PC, HP Vectra, or
compatible computer. It can write as much as 700
Mbytes of digital data into CD-R/RW disc, and can
read as much as 700 Mbytes of digital data stored in
a CD-ROM/R/RW disc.

It can write as much as 4.7Gbytes of digital data into
DVD-R/RW/RAM/+R/+RW disc, and can read as
much as 4.7Gbytes of digital data stored in a
DVD-ROM/R/RW/RAM/+R/+RW disc.
It can write as much as 8.5Gbytes of digital data into
DVD+R DL/DVD-R DL disc, and can read as much
as 8.5Gbytes of digital data stored in a DVD-ROM
DL/+R DL/-R DL disc.
This Super Multi DVD Drive can easily meet the
upcoming MPC level 3 specification, and its
Enhanced Intelligent Device Electronics (E-IDE) and
ATAPI interface allows Plug and play integration in
the majority of today’s PCs without the need of an
additional interface card.

1. Support feature and writable disc
*) Indicated write-in speed is a value at the time of the fastest operation.

Light Scribe
CD-R
CD-RW
DVD-R
DVD-RW
DVD-R DL
DVD+R
DVD+RW
DVD+R DL
DVD-RAM

GSA
x
48x write
32x write
16x write
4x or 6x write
4x write
16x write
8x write
4x or 6x write
5x write

GMA
x
48x write
32x write
16x write
4x or 6x write
4x write
read only
read only
read only
5x write

G*A-4165B
GWA
x
48x write
32x write
16x write
4x or 6x write
4x write
16x write
8x write
4x or 6x write
read only

GRA
x
48x write
32x write
read only
read only
read only
16x write
8x write
4x or 6x write
read only

Light Scribe
CD-R
CD-RW
DVD-R
DVD-RW
DVD-R DL
DVD+R
DVD+RW
DVD+R DL
DVD-RAM

GSA
x
48x write
32x write
16x write
6x write
4x write
16x write
8x write
6x write
5x write

GMA
x
48x write
32x write
16x write
6x write
4x write
read only
read only
read only
5x write

G*A-4167B
GWA
x
48x write
32x write
16x write
6x write
4x write
16x write
8x write
6x write
read only

GRA
x
48x write
32x write
read only
read only
read only
16x write
8x write
6x write
read only

GCA
x
48x write
32x write
16x write
6x write
4x write
read only
read only
read only
read only

GDA
x
read only
read only
16x write
6x write
4x write
read only
read only
read only
5x write

Light Scribe
CD-R
CD-RW
DVD-R
DVD-RW
DVD-R DL
DVD+R
DVD+RW
DVD+R DL
DVD-RAM

GSA
O
48x write
32x write
16x write
6x write
4x write
16x write
8x write
6x write
5x write

GMA
O
48x write
32x write
16x write
6x write
4x write
read only
read only
read only
5x write

G*A-4168B
GWA
O
48x write
32x write
16x write
6x write
4x write
16x write
8x write
6x write
read only

GRA
O
48x write
32x write
read only
read only
read only
16x write
8x write
6x write
read only

GCA
O
48x write
32x write
16x write
6x write
4x write
read only
read only
read only
read only

GDA
O
read only
read only
16x write
6x write
4x write
read only
read only
read only
5x write

GCA
GDA
x
x
48x write
read only
32x write
read only
16x write
16x write
4x or 6x write 4x or 6x write
4x write
4x write
read only
read only
read only
read only
read only
read only
read only
5x write

3

FEATURES
1 General
1) Enhanced IDE (ATAPI) interface.
2) Internal Half-height Drive.
3) CD-R/RW, DVD-R/-R DL(Dual Layer)/-RW/RAM/+R/+R DL(Double Layer)/+RW read and write
compatible CD Family and DVD-ROM read compatible.
4) Buffer Under-run prevention function embedded.
5) 2MB buffer memory.
6) Power loading and power eject of a disc. Bare media loading.
7) MTBF : 100,000 POH
8) Vertical and Horizontal installable.

2. Supported disc formats
1) Reads data in each DVD-ROM, DVD-R(Ver. 2.0 for Authoring) and DVD-RAM(Ver.1.0)
2) Reads and writes in each DVD-R(Ver. 2.0 for General), DVD-R DL(Dual Layer), DVD-RW, DVDRAM(Ver.2.2), DVD+R, DVD+R DL(Double Layer) and DVD+RW
3) Reads data in each CD-ROM, CD-ROM XA, CD-I, Video CD, CD-Extra and CD-Text
4) Reads data in Photo CD (Single and Multi session)
5) Reads standard CD-DA
6) Support to read Super Audio CD(Compatible layer in Hybrid type)
7) Reads and writes CD-R discs conforming to “Orange Book Part 2”
8) Reads and writes CD-RW discs conforming to “Orange Book Part 3”
9) Reads DVD-RAM with CPRM and DVD-RW with CPRM

3. Supported write method
1) DVD-R: ..................Disc at Once and Incremental Recording
2) DVD-R DL .............Disc at Once, incremental Recording and Layer jump recording
3) DVD-RW:...............Disc at Once, Incremental Recording and Restricted Overwrite
4) DVD-RAM:.............Random Write
5) DVD+R: .................Sequential Recording
6) DVD+R DL: ...........Sequential Recording
7) DVD+RW:..............Random Write
8) CD-R/RW: .............Disc at Once, Session at Once, Track at Once and Packet Write

4

4. Performance
1) Average access time:
(1/3 stroke)
2) Write speed:

DVD-ROM
CD-ROM
DVD-R
DVD-R DL
DVD-RW
DVD-RAM
DVD+R
DVD+R DL
DVD+RW
CD-R
CD-RW

3) Read speed:

DVD-R/RW/ROM/ROM-Dual layer
DVD-R DL
DVD-RAM (Ver.1.0/2.2)
DVD-Video(CSS Compliant Disc)
DVD+R/+RW
DVD+R DL
CD-R/RW/ROM
CD-DA (DAE)
80mm CD
4) Sustained Transfer rate:
DVD-ROM
CD-ROM
5) Burst Transfer rate:

145 ms
125 ms
2x, 4x CLV, 8x ZCLV, 16x PCAV
2x, 4x CLV
1x, 2x, 4x, 6x CLV
2x, 3x ZCLV (Ver.2.2), 3x-5x PCAV(Ver.2.2)
2.4x, 4x CLV, 8x ZCLV, 12x, 16x PCAV
2.4x, 4x, 6x CLV
2.4x, 4x CLV, 8x ZCLV
4x, 8x, 16x CLV, 24x, 32x, 40x, 48x ZCLV
4x, 10x, 16x CLV, 24x, 32x ZCLV
(High Speed: 10x, Ultra Speed: 16x, 24x, 32x)
10x / 8x / 16x / 12x max.
8x max.
2x / 2x, 3x ZCLV, 3x-5x PCAV
8x max. (Single/Dual layer)
10x / 8x max.
8x max.
48x/40x/48x max.
40x max.
16x max.
22.16 Mbytes/s (16x) max.
7,200 kB/s (48x) max.
Ultra DMA Mode2
Multi word DMA Mode2, PIO Mode 4

6) Multimedia MPC-3 compliant

5. Audio
1) 16 bit digital data output through ATA interface
2) Software Volume Control
3) Equipped with audio line output for audio CD playback
*Definition
Transfer Rate: .........1x (DVD) = 1.385 Mbytes/s ..........1x (CD) = 150 kB/s
Mbytes/s = 106 bytes/s, ................kB/s = 210 bytes/s
Capacity: .................MB = 220 bytes, .............................kB = 210 bytes

5

SPECIFICATIONS
1. SYSTEM REQUIREMENTS
-CPU: IBM Compatible Pentium 4 2.4GHz (or faster)
(For High speed, 2.4GHz or faster recommended.)
-128MB Memory or greater

2. SUPPORTING OPERATING SYSTEM
* Operating System
Windows Millennium Edition (Me)
Window 2000 Professional
Window XP Home Edition, Professional
2.1 Applicable disc formats
DVD ............................DVD-ROM:
DVD-R DL:
DVD-R:
DVD-RW:
DVD-RAM:
DVD+R:
DVD+R DL:
DVD+RW:

* Recording tool
(1) Nero(Ahead)
(2) In CD(Ahead)
(3) Power Producer Gold (Cyber Link)

4.7GB (Single Layer)
8.5GB (Dual Layer)
8.5GB
4.7GB (Ver.2.0 for Authoring : read only)
4.7GB (Ver.2.0 for General: read & write)
4.7GB (Ver.1.2)
2.6GB/side (Ver.1.0)
1.46GB/side, 4.7GB/side (Ver.2.2)
4.7GB
8.5GB
4.7GB

CD...............................CD-ROM Mode-1 data disc
CD-ROM Mode-2 data disc
CD-ROM XA, CD-I, Photo-CD Multi-Session, Video CD
CD-Audio Disc
Mixed mode CD-ROM disc (data and audio)
CD-Extra
CD-Text
CD-R (Conforming to “Orange Book Part2”: read & write)
CD-RW (Conforming to “Orange Book Part3”: read & write)
2.2 Writing method
(1) DVD-R/RW ...........................Disc at Once
Incremental Recording
Restricted Overwrite (DVD-RW only)
(2) DVD-R DL ............................Disc at Once
Incremental Recording
Layer jump Recording
(3) DVD-RAM/+RW ...................Random Write
(4) DVD+R .................................Sequential Recording
(5) DVD+R DL ...........................Sequential Recording
(6) CD-R/RW .............................Disc at Once (DAO)
Session at Once (SAO)
Track at Once (TAO)
Packet Write
2.3 Disc diameter ..............................................120mm
80mm (Horizontal only)

6

2.4 Data capacity
• User Data/Block

DVD-ROM/R/RW/RAM/+R/+RW ......2,048 bytes/block
CD (Yellow Book) ..........................................2,048 bytes/block(Mode 1 & Mode 2 Form 1)
2,336 bytes/block (Mode 2)
2,328 bytes/block (Mode 2 Form 2)
2,352 bytes/block (CD-DA)
2.5 RPC (Regional Playback Control) Phase2, No Region

3. DRIVE PERFORMANCE
3.1 Host interface ..................................................................X3T13 ATA/ATAPI5/1321D
INF-8090i Rev.5.3
3.2 Read/Write & Rotational speed

DVD-R ...............................................................2x, 4x(CLV), 8x(ZCLV), 16x(PCAV)
DVD-R DL .........................................................2x, 4x(CLV)
DVD-RW............................................................1x, 2x, 4x, 6x(CLV)
DVD-RAM ...............................Ver. 2.2 .............2x, 3x(ZCLV), 3x-5x(PCAV)
DVD+R ..............................................................2.4x, 4x(CLV), 8x, 12x, 16x(PCAV)
DVD+R DL ........................................................2.4x, 4x, 6x(CLV)
DVD+RW...........................................................2.4x, 4x(CLV), 8x(ZCLV)
CD-R .................................................................4x, 8x, 16x(CLV), 24x, 32x, 40x, 48x(ZCLV)
CD-RW ..............................................................4x, 10x,16x(CLV), 24x, 32x (ZCLV)
(High Speed: 10x, Ultra Speed: 16x, 24x, 32x)


DVD-ROM...............................Single layer .......6.7x - 16x (CAV), Approx. 9,420 r/min
................................................Dual layer .........5.0x - 12x (CAV), Approx. 7,770 r/min
DVD-R DL ...............................8.5GB ...............3.3x - 8x (CAV), Approx 5,180r/min
DVD-Video (CSS) .............................................3.3x - 8x (CAV), Approx. 5,180 r/min
DVD-R.....................................4.7GB ...............4.2x - 10x (CAV), Approx. 5,890 r/min
DVD-RW .................................4.7GB ...............3.3x - 8x (CAV), Approx. 4,720 r/min
DVD-RAM ...............................Ver. 1.0/ 2.2 ......2x/ 2x, 3x (ZCLV)* 3x-5x (PCAV)*
DVD+R....................................4.7GB ...............4.2x - 10x (CAV), Approx. 5,890 r/min
DVD+R DL ..............................8.5GB ...............3.3x - 8x (CAV), Approx. 5,180 r/min
DVD+RW ................................4.7GB ...............3.3x - 8x (CAV), Approx. 4,720 r/min
CD-R/ROM, CD-I / Video ........(1.2m/s) ............20x - 48x (CAV), Approx. 9,540 r/min
CD-RW ...................................(1.2m/s) ...........16.7x - 40x (CAV), Approx. 8,100 r/min
CD-DA (DAE)..........................(1.2m/s) ...........16.7x - 40x (CAV), Approx. 8,100 r/min
CD-DA (Audio out) ..................(1.2m/s) ...........4.0x - 10x (CAV), Approx. 2,030 r/min

* Rotational speed (CLV, ZCLV)
DVD-R/RW/ROM, +R/RW ...............................1x: Approx. 1,390(Inside) - 580 r/min(Outside)
DVD-RAM................................Ver. 1.0 ...........1x: Approx. 2,390(Inside) - 1,010 r/min(Outside)
Ver. 2.2 ...........2x: Approx. 3,250(Inside) - 1,380 r/min(Outside)
CD-R/RW/ROM ...............................................1x: Approx. 500(Inside) - 210 r/min(Outside)

7

3.3 Data transfer rate
3.3.1 Sustained transfer rate
 DVD-R.........................2.77, 5.54, 5.44-11.08 Mbytes/s..................................2x, 4xCLV, 8x ZCLV
9.14-22.16 Mbytes/s....................................................................16x PCAV
DVD-R DL ...................2.77, 5.54 Mbytes/s....................................................................2x, 4x CLV
DVD-RW
...............1.385, 2.77, 5.54, 8.31 Mbytes/s ...................................1x, 2x, 4x, 6x CLV
DVD-RAM (Ver.2.2): ...2.77, 4.15, 4.15-6.925 Mbytes/s (w/o Verify) .......2x, 3x ZCLV, 3-5x PCAV
DVD+R ........................3.32, 5.54, 8.31-11.08 Mbytes/s..............................2.4x, 4x CLV, 8x ZCLV
8.31-16.62, 9.14-22.16 Mbytes/s ..............................12x ZCLV, 16x PCAV
DVD+R DL ..................3.32, 5.54, 8.31 Mbytes/s ..................................................2.4x, 4x, 6x CLV
DVD+RW.....................3.32, 5.54, 8.31-11.08 Mbytes/s .............................2.4x, 4x CLV, 8x ZCAV
CD-R ...........................600, 1,200, 2,400, 2,400-3,600, 2,400-4,800, 2,400-6,000, 2,400-7,200 kB/s (Mode-1)
..........................................4x, 8x, 16x CLV 24x, 32x, 40x, 48x ZCLV
CD-RW........................600, 1500, 2,400, 2,400- 3,600, 2,400-4,800 kB/s (Mode-1)
..........................................4x, 10x, 16x CLV, 24x, 32x ZCLV
 DVD-ROM ...................Single layer ....9.28 - 22.16 Mbytes/s ...........................................16x max.
....................................Dual layer.......6.86 - 16.62 Mbytes/s ...........................................12x max.
DVD-R ................................................5.73 - 13.85 Mbytes/s ............................................10x max.
DVD-R DL...........................................4.58 - 11.08 Mbytes/s ..............................................8x max.
DVD-RW .............................................4.58 - 11.08 Mbytes/s .............................................8x max.
DVD-RAM ...................Ver. 1.0 ..........2.77 Mbytes/s .........................................................2x ZCLV
....................................Ver. 2.2 ..........2.77, 4.155,4.155-6.93 Mbytes/s ..2x, 3x ZCLV, 3-5x PCAV
DVD+R ...............................................5.73 - 13.85 Mbytes/s ............................................10x max.
DVD+R DL..........................................4.58 - 11.08 Mbytes/s ..............................................8x max.
DVD+RW ............................................4.58 - 11.08 Mbytes/s .............................................8x max.
CD-R/ROM .........................................3,000 - 7,200 kB/s..................................................48x max.
CD-RW........................ ......................2,500 - 6,000 kB/s..................................................40x max.
CD-DA (DAE)......................................2,500 - 6,000 kB/s..................................................40x max.
3.3.2 Burst transfer rate
Ultra DMA Mode 2 ..............................33.3 Mbytes/s max.
Multiword DMA Mode 2 ......................16.6 Mbytes/s max.
PIO Mode 4 ........................................16.6 Mbytes/s max.
3.4 Access time (1/3 stroke)
DVD-ROM...........................................145 ms Typ.* (Note 1)
DVD-RAM (Ver.2.2) ............................165 ms Typ.
CD-ROM .............................................125ms Typ. (Note 1)
Note :
1) Average random access time is the typcal value of more than 50 times including latency and error correction time.
Test Disc : DVD : ALMEDIO TDV-520 / TDR-820
CD : ALMEDIO TCDR-701 / HITACHI HCD-1
*) Typical value defines a measured value in normal temperature (20 deg.C.) and horizontal position.

3.5 Data error rate (Measured with 5 retries maximum)
DVD-R/RW/ROM/RAM ..................................<10-12
DVD+R/+RW..................................................<10-12
CD-R/RW/ROM..............................................<10-12 (Mode-1)
<10-9 (Mode-2)
Condition : It is assumed that the worst case raw error rate of the disc is 10-3
3.6 Data buffer capacity .......................................................2 Mbytes

8

4. Quality and Reliability
4.1 MTBF..................................................100,000 Power On Hours(Consecutive/Cumulative POH)
Assumption : ..........................Used in a normall office environment at room temperature.
-POH per year.........................3,000
-ON/OFF cycles per year........600
-Operating duty cycle..............20% of power on time (Seek: 5% of operating time)
4.2 Tray cycle test...................................30,000 times
No degeneration in the mechanical part after test
4.3 Actuator mechanism ........................1,000,000 full stroke seek
4.4 MTTR (Mean Time To Repair) ...........0.5 h
4.5 Component life .................................5 years or 2,000 h of Laser radiating time
Assumption : ..........................Used in a normall office environment.

5. POWER REQUIREMENTS
5.1 Source voltage
+5V + 5% tolerance, less than 100 mVp-p Ripple voltage
+12V + 10% tolerance, less than 100 mVp-p Ripple voltage
5.2 Current
Idle (Hold track state)..............+5V DC .................0.9A typ. .........< 1.0 A max.
+12V DC ...............0.5A typ...........< 1.0 A max.
Write (Active) ..........................+5V DC .................1.3A typ. .........< 1.5 A max.
+12V DC................0.9A typ. .........< 1.5 A max.
Read (Active) ..........................+5V DC .................1.0A typ. .........< 1.5 A max.
+12V DC................0.9A typ. .........< 1.5 A max.
Seek (Acess) ..........................+5V DC .................1.0A typ. .........< 1.5 A max.
+12V DC ...............1.2A typ. .........< 2.0 A max.
5.3 Standby
Sleep mode (No disc) .............1.1 W typ.
1.3 W max.

6. AUDIO PERFORMANCE
Output Level (1kHz, 0dB) ........................................................0.7 Vrms typical
Frequency Response ..............................................................+/-3dB (20 to 20,000Hz)
Signal to Noise Ratio...............................................................80 dB min. with IHF A and LPF 20 kHz
THD (1kHz, 0dB) .....................................................................0.10% max. with LPF 20 kHz
Channel separation(10kHz).....................................................65 dB min.
Condition: ................................................................................Load inpedance : 10 kohms

7. Acoustic noise
Less than 50dB, A scale, at 0.5 m away from the drive
Note : 1. Disc : Less than imbalance 0.3 x 10-4 Nm
2. Installation : Horizontal
3. Ambient temperature : Normal temperature
4. Except loading, unloading and seek

8. Dimensions
External dimensions (W x H xD)
Front bezel (WxHxD)

146 x 41.3 x 165mm(without Bezel)
148 x 42 x 5 mm

9. Mass .................................................Approx. 0.77+/-0.03 kg
*

9

Which is not provided with Circuit Diagram of this model. Please Contact the friendly staff of LG
Service Care at: Website http: //www.LGEservice.com

LOCATION OF CUSTOMER CONTROLS
Front Panel
Emergency Eject Hole

Disc Tray

Stop/Eject Button

Drive Activity Indicators

1. Disc tray
This is the tray for the disc. Place the disc on the
ejected disc tray, then lightly push the tray (or
push the eject button) and the CD will be loaded.
NOTE: Don’t pull out or push in the disc tray
forcibly. This might cause damage to the loading
section of the drive.

3. Emergency Eject Hole
Insert a paper clip here to eject the Disc tray
manually or when there is no power.
4. Drive activity indicator
Two colored LED is used to indicate the operation
of the Drive.

2. Stop/Eject button
This button is pressed to open the CD tray.
This button works only when power is supplied to
the drive.

10

Rear Panel
IDE Interface Connector

Analog Audio Output Connector

Jumper Connector

Power Connector

Digital Audio Output
Connector
NOTE: The actual drive may be different from this design.

1. Power Connector
Connects to the power supply (5-and 12-V DC) of
the host computer.
NOTE : Be careful to connect with the proper
polarity. Connecting the wrong way may damage
the system (and is not guaranteed). Usually this
connector can only be attached one-way.
2. IDE Interface Connector
Connect to the IDE (Integrated Device
Electronics) Interface using a 40-pin flat IDE
cable.
NOTE : Do not connect or disconnect the cable
when the power is on, as this could cause a short
circuit and damage the system. Always turn the
power OFF when connecting or disconnecting the
cable.

11

3. Jumper Connector
This jumper determines whether the drive is
configured as a master or slave. Changing the
master-slave configuration takes effect after
power-on reset.
4. Analog Audio Output Connector
Provides output to a sound card (analog signal).
Generally you need this to play a regular audio
CD.
5. Digital Audio Output Connector
This connector is not supported.

DISASSEMBLY
1. CABINET and CIRCUIT BOARD
DISASSEMBLY
1-1. Bottom Chassis
A. Release 4 screws (A) and remove the Bottom Chassis
in the direction of arrow (1). (See Fig.1-1)

1-3. Cabinet and Main Circuit Board
A. Remove the Cabinet in the direction of arrow (4).
(See Fig. 1-3)
B. When the CD tray has been opened completely, lift
2 points (a) and remove the CD tray while drawing
out simultaneously.
C. Remove the Soldering of the LD- and LD+ (b) for
the Loading Motor, and then remove the Main
Circuit Board.
D. At this time, be careful not to damage the 4
connectors of the Main Circuit Board.

Cabinet
(1)
(4)

(a)

(A)
Bottom Chassis

(5)

(A)
(A)

(A)

Fig. 1-1

Main
Circuit Board

1-2. Front Bezel Assy
A. Insert and press a rod in the Emergency Eject
Hole and then the CD Tray will open in the direction
of arrow (2).
B. Remove the Tray Door in the direction of arrow
(3) by pushing the stoppers forward.
C. Release 3 stoppers and remove the Front Bezel Assy.

(b)
Fig. 1-3

2. MECHANISM ASSY DISASSEMBLY
2-1. Pick-up Unit
A. Release screws (B).
B. Separate the Pick-up Unit in the direction of arrow (6).

Tray Door

(B)

(B)

(3)

Stoppers

Pick-up Unit
(6)
CD Tray

(2)

Front Bezel Assy
Mechanism Assy

Emergency Eject Hole
Fig. 1-2

Fig. 2-1

12

2-2. Pick-up
A. Release 1 screw (C) and remove the Pick-up.

Pick-up Unit

(C)

Pick-up
Fig. 2-2

13

5

004

035

005
012

EXPLODED VIEW

008

006

009
015

010
011

PBM00 (MAIN C.B.A)

4
016

PBF00 (FRONT C.B.A)

A03

A01

013

453

3
034
033
031
001
027

026

007

024

025
445

2

A02

430
020

028

452
430

028

020

481

482

003
030

021

002

482

032

1

453

014

482

452

050

482

452
036

021

(LightScribe only)

A

B

C

D
14

E
15

F

G

H

GLOSSARY
ATIP

Absolute Time in Pre-groove. With an additional modulation of the “Wobble”, the “Groove” contains a time
code information.

Wobble

The pre-groove in the Disc is not a perfect spiral but is wobbled.
With : – A typical amplitude of 30 nm
– A spatial peried of 54~64 µm

CW

Continuous Wave. The laser light output is at a constant level.

DOW

Direct Over-Write. The action in which new information is recored over previously recorded information in
CD-RW disc.

Overwrite

The action in which new information is recorded over previously recorded information.

(Pre-)Groove The guidance track in which clocking and time code information is stored by means of an FM
modulated wobble.
Land

Land is characterized in the following way:
When radial signals are concerned,land is defined as the area between the grooves.
When HF signal are concerned,land is defined as the area between the marks(pits) in tangential
direction.

Hybrid Disc A Multisession disc of which the first Session is mastered. On a hybrid disc, recorded and
mastered information may co-exist.
Mastered
Information,stored as pits on the disc during the manufacturing process of the disc.
Information (when making the master)
OPC

Optimum Power Control. Procedure is determined optimum recording power according to CDR/RW Media in recording start step.

ROPC

Running OPC. The purpose is to continuously adjust the writing power to the optimum power
that is required.
When the optimum power may change because of changed conditions of disc and change in
operating temperature.

Jitter

The 16 value of the time variation between leading and trailing edges of a specific (I3 … I11) pit
or land as measured by Time Interval Analysis.

Deviation

The difference between a fixed value of Pit length and Land length.

TOC

Table Of Contents : in the Lead-in Area the subcode Q-channel contains information about the
Tracks on the disc.

Packet
Writing

A method of writing data on a CD in small increments.
Two kinds of packets can be written : Fixed-length and Variable-length.

Write
Strategy

The shape of the HF write signal used to modulate the power of the laser.
The Write Strategy must be used for recordings necessary for disc measurements.

Information Wobble, ATIP, Disc Identification, Write Power, Speed Range OPC Parameters, etc are
Area
recorded in the Information area of CD-RW Disc
Finalization The action in which (partially) unrecorded or logically erased tracks are finished and the Lead-in
and/or Lead-out areas are recorded or overwritten with the appropriate TOC subcode.
Logical Erase A method to remove information from a disc area by overwriting it with an EFM signal containing
mode 0 subcode
A logically erased area is equivalent to an unrecorded
Physical Erase The action in which previously recorded information is erased by overwriting with a CW laser
output.
After a Physical Erase action, the erased area on the CD-RW disc is in the unrecorded state
again.
Session

An area on the disc consisting of a Lead-in area, a Program area, a lead-out area.

Multi session A session that contains or can contain more than one session composed Lead-in and Lead-out

19

The differences of CD-R/CD-RW discs and General CD-ROM
1. Recording Layer
Recordable CD has a wobbled pre-groove on the surface of disc for laser beam to follow track.

Track pitch(p)

Read-only
Disc DISC)
CD-ROM
(READ-ONLY

A

a=30nm

Iw

um
1.6

O
a

T
11
3~

Radial Direction

Radial Error Signal

0.4~0.5 um
Land

CD-R and CD-RW Disc

Groove

a
Average center

(Pit)Groove
Land

Actual center

The Groove wobble

2. Disc Specification
ITEM

CD-ROM

CD-R

CD-RW

Standard

Yellow Book

Orange Book II

Orange Book III

Record

Not available

Write once

Re-Writeable

Tracking Signal I11/Itop
(HF Modulation)

> 0.6

> 0.6

0.55 > M11> 0.70

Read Laser Power(mW)

< 0.5 mW

< 0.7 mW

< 1.0 mW

Jitter

< 35 nsec

< 35 nsec

< 35 nsec

Reflectivity (Rtop)

70 %

65 %

15 % ~ 25 %

14-65 mW

6-45 mW

Remark)

Write Laser Power(mW)

20

3. Disc Materials
1) CD-ROM disc
•
•
•
•

It is composed of Silver _ colored aluminum plate and Reflective layer.
Groove (Pit) of aluminum plate make a track.
Laser wavelength : 780 nm, Laser Power (Read): 0.5mW
Signal is detected by the
difference of reflective beam
intensity between “pit” and
“Land” on the disc.

Label Printing
Protective Layer
Reflective Layer

Substrate
(Polycarbonate)

Pit
Laser Beam

2) CD-R disc
• It is so-called WORM (Write Once Read Many) CD.
• It is composed of polycarbonate layer, Organic dye layer, Reflective layer, and Protective
layer.Gold/Silver Reflective layer is used to enhance the reflectivity
• According to the kinds of Organic dye layer, it is divided by Green CD, Gold CD, Blue CD.
• Laser Wavelength : 780 nm, Laser Power (read) : 0.7 mW
• Recording Power : 8x(14~20mW), 16x(25~35mW)
• When some part of dye layer is exposed to laser heat, it’s color changs black.Therefore, writing and
reading is enabled by the difference of reflectivity between changed part and unchanged part.
• Polycarbonate layer has Pre_Groove which make a Track.

Pigment

Reflective Layer

Color

Phtalocyanine

Gold/Silver

Yellow/White

Cyanine

Gold/Silver

Dark Green/Bright Green

Azo

Gold/Silver

Dark Blue

Label Printing
Protective Layer
Reflective Layer
Organic Dye Layer

Substrate
(Polycarbonate)

Laser Beam

21

Groove

3) CD-RW Disc

Label Printing
Protective Layer
Dielectric Layer(TL)
Recording Layer
Dielectric Layer(UL)
Substrate
(Polycarbonate)

Groove

Laser Beam

• It is composed of polycarbonate layer, alloy(silver, arsenic) layer, aluminum reflectivity layer, protective layer.
• An crystalized alloy layer is transformed into noncrystalized by the laser heat. Therefore, writing and reading
is enabled by the difference of reflectivity.
• It is possible to overwrite about 1000 times.
• Laser Wavelength : 780 nm, Laser Power (Read) : 1.0mW
• Recording Power : Erase (4~18mW), Write (6~45mW)
• When disc rewriting, new data is overwritten previously recorded data.
• Polycarbonate layer has a Pre-Groove which make a track.

4. Reading process of Optical Disc
Lens

H
D

θ

Beam
Spot
Numerical aperture: NA=nsinθ,
n: Refractive index
Focus depth : H = λ/NA
laser spot diameter : D = λ/NA2

Focusing
Lens
Laser Spot
at Constant
Read Intensity

Previously Recorded Marks

Groove

Land

Mirror

Reflected
Light
Signal

I11
I3

IG

IL

I0

Itop Laser Spot
Position
(Time)

22

5. Writing Process of CD-R Disc
Incident
Laser
Power

(Write)
(Read)

(Read)

a b cd e f

Laser Spot
Position
(Time)

g

a
b

Laser
Spot

Below "ORP"– Mark Too Short
Reflected
Light
Signal

c

At Optimum Record Power ("ORP")
Above "ORP" – Mark Too Long

d
e
f
Recorded
Mark

g
Time

Reflected
Light
Signal

a b cd e f

g

Laser Spot
Position
(Time)

6. Writing process of CD-RW Disc

Amorphous

Crystal phase

Melting/
quenching

Erase Power
Read Power

Heating/
gradual cooling

Erased state
(higher reflectivity)

Write Power

Recorded state
(lower reflectivity)

Groove
Crystal

23

Amorphous

7. Organization of the PCA, PMA and Lead-in Area
1) Layout of CD-ROM disc
Disc Center

Diameter 120 mm
Diameter 46 mm

Diameter 15 mm

Center hole Clamping and Label Area

Information Area

Read Only Disc
Program Area

Lead-in Area

Lead-out Area

2) Layout of CD-R/RW disc
Disc Center

Diameter 120 mm
Diameter 45 mm

Diameter 15 mm

Center hole Clamping and Label Area

Information Area

Unrecorded Disc
PCA PMA

Program Area

Lead-in Area

Lead-out Area

Test Area : for performing OPC procedures.
Count Area : to find the usable area immediately in T.A
Test Area

Count Area

Tsl : start time of the Lead-in Area, as encoded in ATIP
out PMA : Program Memory Area

in
Tsl-00:35:65 Tsl-00:15:05 Tsl-00:13:25

Tsl

99:59:74
00:00:00

24

8. Function of PCA and PMA area
1) PCA (Power Calibration Area)
• PCA area is used to determine the correct Laser Power for a disc.
– Method 1 : PCA area is divided by a track.
– Method 2 : The previous Calibration value is referred.
– Method 3 : ROPC is used to determine Laser Power value automatically in data writing.
• CD-R Disc can write maximum 99 Tracks but CD-RW Disc can write unlimited tracks because it has a rewritable
function.

2) PMA (Program Memory Area)
• It has a track information (track No, track Start/End time) of every track before writing completed.
– PMA area has the last written point and the next writable point of a disc.
– In case of CD to CD copy, some writer may not write PMA area.
* When Disc is Finalized,
PMA information is transferred to the Lead_In area so that general Driver can read it.
* Because PCA and PMA area exist before Lead-In area, General CD Player or CD-ROM Drive can’t read
these areas.

9. OPC and ROPC
1) OPC (Optimum Power Control)
• This is the first step of writing process, because CD writer has its own laser power value and media have different
writing characteristics,
– This is determined by the Writing characteristic, speed, temperature, and humidity.
– Laser wavelength is determined by the environmental temperature (775~795nm) and Optical Laser Power is
determined by the test and retry.

HF Signal

• Asymmetry and optimum writing Power
– EFM signal Asymmetry is determined by the writing power.
Therefore, Optical Power which has the same value to the preset power value can be estimated by measuring
HF signal Asymmetry on the PCA area.
• Measurement of Asymmetry
* Parameter setting (Beta) : Using AC coupled HF signal before equalization
Beta = (A1+A2)/(A1-A2)

A1
0
A2
Time

25

P << Po

Time

P = Po

Time

P >> Po

2) ROPC (Running Optimum Power Control)
• Variable primary factor of Optimum Power
– Change of Power sensitivity on the Disc. (limited to 0.05 *Po)
– Wavelength shift of the laser diode due to the operating temperature change.
– Change of the Spot aberration due to the Disc skew,
Substrate thickness, Defocus.
Incident recording pulse
– Change of Disc or Optics conditions due to the long term OPC
==> It is necessary to adjust continuously to obtain the Optimum Power.
Sampled timing B

Sample Disc Reflectivity
(Read power)

Level B

• Principle of Running OPC
– To meet the factors mentioned above,
a horizontal _ direction movement of a curve is uesd.
– Beta = f(B-level) = constant on the Recorded Disc
– Procedure of ROPC
a. Reference B-level is determined during OPC Procedure.
b. During Recording, B-level value is controlled to have a close
Reflected recording pulse
Reference B-level value.
c. Normalization of B-level is used to eliminate the effect of reflectivity fluctuation.
==> The reflected B-level value is normalized by the disc reflectivity itself.
Sampled at timing B

normalized to recording power

11T

Level B with Pwo
Sample B-level (Write Power)

Pwo decided by OPC
Recording Power

OPC

CD-R/RW Media

Program Area

Write Strategy
Determination

PMA Area

PCA Test Area

Lead-In Area

PCA Count Area

Lead-out Area

ROPC

10. Writing Process of DISC

* Recording Capacity of CD-R/RW (74Minute Recording media)
• (2048 Byte/Sector) X (75 Sector/Second) X (60 Second/Minute) X 74 Minute
= 681,984,000 Bytes = 682 Mbytes
• But the actual recording capacity is about 650 Mbytes. (according to the ISO 9660 standard, approximately
30 Mbytes are used to make directory structure and volume names.)

26

The differences of DVD-R/RW, DVD+R/RW discs and DVD-ROM
1. Recording Layer
DVD-ROM (Read Only Disc)

4
0.7

um

3T

0.4 um

DVD-R/RW Disc

LPP
(Land Pre-Pit)

DVD+R/RW Disc

27

2. Disc Specification
DVD-ROM

DVD-R

DVD-RW

DVD+R

DVD+RW

Read Only

Dye

Phase change

Dye

Phase change

4.7GB

8.54GB

4.7GB

4.7GB

4.7GB

4.7GB

Wavelength

650nm

650nm

650nm

650nm

650nm

650nm

Reflectivity

45~85%

18~30nm

45~85%

18~30%

45~85%

18~30nm

Single-Layer

Dual-Layer

Media Type

Read Only

User data capacity

Track pitch
Minimum pit length

0.74

0.74

0.74

0.74

0.74

0.74

0.4

0.44

0.4

0.4

0.4

0.4

Modulation

>0.6

>0.6

>0.6

>0.6

>0.6

>0.6

Channel bit- rate

26.16MHz

26.16MHz

26.16MHz

26.16MHz

26.16MHz

26.16MHz

Wobble Frequency

-

-

140KHz

140KHz

817.4KHz

817.4KHz

Addressing

26.16MHz

26.16MHz

Wobble & LPP Wobble & LPP Wobble(ADIP) Wobble(ADIP)

Read Power (mW)
Write Power (mW)

-

-

JItter

<8%

<8%

<8%

<8%

0.7 + 0.1

0.7 + 0.1

<9%

<9%

3. Disc Materials
1) DVD-ROM

Label
Polycarbonate
Bonding layer
Reflective layer
Polycarbonate


Label
Polycarbonate
Reflective layer
Bonding layer
Semi-reflective
Polycarbonate

28

2) Recording format using organic dye material (DVD-R/DVD+R)
* The format that records data through the creation of recorded marks by changing the organic dye material
with a laser beam.
> Disc structure
DVD-R

DVD+R
Adhesive layer
Protective layer
Reflective layer
Recording layer(dye)

Adhesive layer
Protective layer
Reflective layer
Recording layer(dye)

Disc substrate

Disc substrate

> Disc structure
[Recording]
Recording is done by changing the organic dye layer and the substrate with a laser when a strong is
applied to a disc, the temperature of the ortanic dye material goes up, the dye is decomposed and the
substrate changes at the same time. At this time, a durable bit is created as is the case with a CD-ROM.

[Playback]
Signals are read with the differences of the reflection of a laser from pits.

Adhesive layer
Protective layer
Reflective layer
Dye layer

Substrate

Laser beam

29

3) Recording format using phase-change recording material (DVD-RW/DVD+RW)
* Data is recorded by changing the recording layer from the amorphous status to the crystalline status, and
played back by reading the difference of the reflection coefficient.
[ Amorphous : Non-crystalline ]
> Disc structure
DVD-RW

DVD+RW
Adhesive layer
Protective layer
Reflective layer
Dielectric layer
Recording layer
(Phase change material)
Dielectric layer
Disc substrate

Adhesive layer
Protective layer
Reflective layer
Dielectric layer
Recording layer
(Phase change material)
Dielectric layer
Disc substrate

> Recording principles
[Recording]
When a high-power laser is applied to the recording material, it melts and then becomes amorphous with
a low reflection coefficient when it quickly cools off. When a mid-power laser is applied to heat gradually
the recording material and then gradually cools it off, it becomes crystal with a high reflection coefficient.
[Playback]
A low-power laser is used for playback. The amount of reflected light depends on the status (amorphous
or crystalline) of the recording material. This is detected by an optical sensor.

Substrate
Laser beam

Amorphous status

Crystalline status
Recording data
(Melting/Quick cooling)

Erasing data
(Heating/Gradual cooling)

Data erased state
(High reflection coefficient)

Recorded state
(Low reflection coefficient)

30

4. Writing Pulse Wave Form of DVD+R
For different speed ranges, different write strategies can be used. This document specifies 2 options:
- a pulsed write strategy, where each single mark is created by a number of subsequent separated short
pulses.
- a blocked write strategy, where each single mark is created by one continuous pulse.

1) 1st Method : Using Pulsed Write Strategy
* 3T :

T=3
NRZI

2Tw

Channel bits

Ttop
dTtop
Pp

dTle

Pb

N = 3 : only the top pulse(Ttop ),
first pulse lead-time dT top , dTle
* > 4T :

T>4
NRZI

2Tw

Channel bits

Ttop
dTtop
Pp

Tw
Tmp

Tmp

Tlp

dTle

Pb

N > 4 : the top pulse (T top ), multi-pulse (Tmp ) and last pulse (Tlp ),
first pulse lead-time dT top, dT le
Pp : Actual write power
Pb : Bias Power

31

2) 2st Method : Using Blocked Write Strategy

NRZI
Channel bits

Tw

2Tw
dTtop

T lp
Tmp

Ttop
dPp

1.25Tw

dTle

Pp

Pc

Pb

0mW

dTtop,3

dPp3
1.25Tw

3T mark
dTle

Ttop,3

dTtop,4

dPp4
1.25Tw

Ttop,4

Etc.

Pb

Pc

4T mark

5T mark

Pb

Tlp

1.25Tw
Ttop,4

Tmp

Tlp

1.25Tw
Ttop,4

Tmp

Tmp Tlp

N = 3 : Ttop (cm = 3) can be optimized individually.
N > 4 : Ttop (cm > 4) + (N-3) x Tw + Tlp , T w = T mp
Pc shall be < 0.1mW
Pp : Actual write power
Pb : Bias Power
dPp : Additional power ( Only be applied for the 3T and 4T marks)
Pc : Cooling power (Especially at higher recording speeds, optimum cooling down of the
recording layer after writing a mark may be needed.)

32

5. Writing Pulse Wave Form of DVD+RW

NRZI
Channel bits

Ttop
dTtop

Pp

Pe
Pb
0mW

Pp : Actual write power
Pe : Erase Power
Pb : Bias Power

33

Tw

2Tw
Tmp

Tmp

Tmp

dTera

6. Organization of the Inner Drive Area, Outer Drive Area, Lead-in Zone and
Lead-out Zone
1) Layout of DVD-ROM disc
Disc Center

Diameter 120 mm
Diameter 44 mm
Diameter 33 mm

Diameter 22 mm
Diameter 16 mm
Diameter 15 mm
Clamping
Zone

Center
hole

3rd transtion
area

Information Zone

1st transition area
2nd transition area

Rim area

Read Only Disc
Lead-in Zone

Data Zone

Lead-out Zone

2) Layout of DVD+R disc
Disc Center

Diameter 120 mm
Diameter 44 mm
Diameter 33 mm

Diameter 22 mm
Diameter 16 mm
Diameter 15 mm
Clamping
Zone

Center
hole

3rd transtion
area

Information Zone
Rim area

1st transition area
2nd transition area

Unrecorded Disc
Inner Drive
Area

Inner Disc
Test Zone

Lead-in
Zone

Inner Disc
Count Zone

Data Zone

Outer Drive
Area

Lead -out
Zone

Outer Disc
Test Zone

Outer Disc
Count Zone

in
PSN: 23080H 27080H 27480H 28480H 2A480H 30000H 260540H 261940H 262940H

OUT
263940H

267940H

> Inner Disc Test Zone : for performing OPC procedures.
> Inner Disc Count Zone : for counting the number of OPC algorithm performed in IDT Zone.
> Outer Disc Test Zone : for performing OPC procedures.
> Outer Disc Count Zone : for counting the mumger of OPC algorithm performed in IDT Zone.

34

3) Layout of DVD+RW disc
Disc Center

Diameter 120 mm
Diameter 44 mm
Diameter 33 mm

Diameter 22 mm
Diameter 16 mm
Diameter 15 mm
Clamping
Zone

Center
hole

3rd transtion
area

Information Zone
Rim area

1st transition area
2nd transition area

Unrecorded Disc

Inner Disc
Test Zone

Lead -out Zone

Data Zone

Lead-in Zone

Inner Disc
Count Zone

Outer Disc
Test Zone

Outer Disc
Count Zone

in
PSN: 2A480H

OUT
2A7C80H

2DC80H

30000H

260540H

262940H

265940H

> Inner Disc Test Zone : for performing OPC procedures.
> Inner Disc Count Zone : for counting the number of OPC algorithm performed in IDT Zone.
> Outer Disc Test Zone : for performing OPC procedures.
> Outer Disc Count Zone : for counting the number of OPC algorithm performed in IDT Zone.

35

266140H

LightScribe Media
1. LightScribe Media

DiscOD

Label Zone
Control Feature Zone
Clamping/Logo Zone
Center Hole

Screen Printed Imaging Layer
Clear Protective Coating
Reflective/Thermal Layer
Dye Data Layer
Polycarbonate
Substrate

36

37

Buffer
Memory

Host
PC

uP
(DSP)

Power
Drive

Optical FG

SERVO Signals

CIrcuit

RFOUT
Analog
Signal
Processor

Write Strategy Control

Laser Power Monitor Signal

RF Cell Signals

Focus Actuator

(Focus)
Laser Power Reference

Tilt Actuator

(Tilt)

Track Actuator

Step Motor

(Sled)
(Track)

Spindle Motor

(Spindle)

Optical
Encoder

Optical
Pick-up

MECHANISM

2. Hardware Block Diagram of LightScribe Label Printing

OPU ID Movement Range : L=21um

3. MD Assy For LightScribe

Optical Encoder Unit

38

4. Optical Encoder Assy

Codewheel

Direction of
radial play

Encoder PCB

Optical Encoder IC

PIN 6
VCC

PIN 1
CH B

PIN 5
CH A

PIN 4
GND

PIN 2
GND

PIN 6
VCC

PIN 1
CH B

PIN 5
CH A

PIN 2
GND

PIN 4
GND

PIN 3
VLED

PIN 3
VLED

Schematic of Enc PCB
V LED

R

GND
GND
Vcc
VCC
CH A

FFC
3PIN
OFG

CH B

CH B

39

SIGNAL
PROCESSING
CIRCUITRY

CODEWHEEL
OR
CODESTRIP

P-up
Unit
(HOP-7632TS)

IC302
Flash ROM

FE GEN

TE/CSO GEN

RF EQ & AGC

IC101
RF AMP
(R2S35002)

DVD

CD

SRAM

RF data slice
Data PLL
Servo ADC
Focus/tracking
control output
Sled control output
CAV Spindle control

SERVO
DSP

IC301
(R8J32007)

U-COM

DRAM

EFM demodulator
CiRC error correction
Audio DAC
Buffer/Memory controller
CSS controller
Atapi interface control

Encoder & Decoder & CSS

Data
Status

Command

DVD & CD DATA PROCESSING

1. Data Processing Flow

40

2. Copy Protection and Regional Code Management Block
Block Diagram

Change the "KEY"

HOST DVD
PLAYER
(EMPEG2 B/D)

R8J32007
Scrambled MPEG Data

KEY Management Control

Brief Process
1. Regional Code for DVD Disc
– DVD-ROM drive transfers the regional code of the control data to host by the command of host, the DVD
player of host reads the regional code, and plays title in the case of allowed regional code only.
2. Management of DVD Disc for the scrambled of data
(1) DVD-ROM and DVD player of host generate the “KEY 1” respectively, transfer to opposite part, the
“KEY 2” is received, recognizes the data transfer or not with this value, and generates the bus key
encoded the data.
(2) Encoded “Disc Key” and “Title Key” host is transfer with the bus Key.
(3) DVD player of host reads the key value, and uses the value to restore the scrambled data.
* Refer to the next page for the details.

41

3. About Prevention the DVD-ROM from to be copy
A data is able to encode and record in the disc, if a copyright holder wants to prevent the disc from copying.
In case of a disc enhanced movie of 3 titles......
DISC KEY (2048 Bytes) is used to encode the whole contents in the disc and TITLE
KEY (5 Bytes) is used to encode the title respectively.
So, the data is encoded and stored in a disc through the unknown algorithms
with a disc key and title key. (At this time, the disc key and title key are stored
in a disc.)
…As above, the disc is able to copy when the disc key and title key are
opened.
Then, ROM-DRIVE encodes the disc key and title key and transfers to MPEG2 board.
If you want to play the disc prevented from the copy......
First of all, ROM-DRIVE and MPEG-2 board identify with each other through the procedure as described
below.

AGID

HOST

ROM-DRIVE

Challenge key

MPEG-2
BOARD

encoded disc key, title key

1. Drive and host gives and takes the ID of 2bit. This ID is AGID (Authentication Grant ID).
The various decoder boards are attached to the host, in these, AGID sets the MPEG-2 board and drive.
2. After the AGID is set, MPEG-2 board generates the challenge key (10 Byte) and transfers to drive. The
board and drive generate key 1 (5Byte) with the challenge key respectively. (Of course, the Algorithm
generating the key 1 is not known.)
3. Compare with the generated key 1, if it corresponds each other, the first step of authentication is
completed. This is a course to identify the MPEG-2 board with a drive.
4. The second step of authentication is a course to identify a drive with the MPEG-2 board.
The dirve generates a challenge key and transfers it to the MPEG-2 board. The dirve and MPEG-2 board
generate the key 2 (5Byte) with the challenge key, compare with each other, and if it corresponds and the
secondary step of authentication is completed.
5. As above, the identification is completed.
6. The dirve and MPEG-2 board generate the Bus key with the key 1 and key 2 and own it.
7. Dirve encodes the disc key and title key with this Bus key and transfers to the MPEG-2 board.
8. The MPEG-2 board reads the encoded disc key and title key with the Bus key only.
9. MPEG-2 board lets data read from the drive to decode with the read disc key and title key and makes into
the video signal by decoding.

42

4. About the DVD-ROM Regional Code
Regional code

5

1
GRL

RUS

FIN
CAN

FST
LTU

2

BIR
POI
UKR
MNG

U.S.A

TUR

TKM

CHN

JRN
BHS
CUB

1

FGY

KOR

6

BMG
MIX

AFG
PAK
MMR

PRI. VIR

JPN

2
HKG TWN
MAC
PHL

3

1

MNP
GUM

MDI

PLW
PNG

1

5
2

4

AUS

ZAF
ISO
SWZ

NZL

4

DISC

The disc has
the regional
code of 8 bit.

Example)
The disc
manufactured
in the U.S.A,
has the
number one.

43

ROM - DRIVE

Transfer to
MPEG-2 board
reading the
regional code.

MPEG-2 BOARD

VGA CARD

If the board is setting to the regional
code 1 for the U.S.A. ...
Check the received regional code to
number 1, all or not, transfer the
data to VGA card in accordance with
only a case among the three case.

MONITOR

Receiving
data from the
MPEG-2
board and
output
through the
monitor

INTERNAL STRUCTURE OF THE PICK-UP
1. Block Diagram of the PICK-UP(HOP-7632TS)

45 Tilt44 Tilt+

IC2(FM)

43 TR-

CD-VR

42 TR+

R14

5

4

6

3

7

2

8

1

41 AF40 AF+
Rd

38 FM

C12

DVD-VR

39 GND(FM)
37 VREF
36 SEL

C13

35 VCC(FM)
34 ENA
R2

C3

33 IAPC
32 SLG
31 VSA5

R1
R4

30 VSL25
16 15 14 13 12 11 10
SLG
Rfreq

IAPC

17 VSO

ISLOP

AGND

EN
RSET

DVD-LD

19 OUT2
20 VSO

GND 5
GND 4
NRZB 3
NRZ 2
RWB 1

21 VSO
22 GND

NC
NC
BUSY
SEN

28 CLKB
27 GND(LDD)

C2
C1

FB1

26 NRZB
25 NRZ

R7

24 GND(LDD)

R8

23 MONITOR
22 RWB
21 SDIO

SDIO
SCLK
MON1

23 OUT1

29 CLK
FB2

VSA 9
VSL 8
CLK 7
CLKB 6

18 OUT2

CD-LD 24 OUT1
25 VSO

IC2(LDD)

20 SCLK
19 BUSY

26 27 28 29 30 31 32

18 SEN
17 VSO

C6

C5 FB3

16 Vcc(FM)

C9

15 GND(OEIC,TEMP)

C10
Rth

IC3(OEIC)

C14

7 GND

F4

F1

6 VD

F3

F2

EF4 8

4 VS
3 VC2

VA 10

D

A

C

B

13 RF+
12 E2+F2

EF1 9

5 VCC
C15

14 RF-

11 C
10 A
9 E1+F1

VB 11

8 E4+F4

VEF2 12

7 D
6 B
5 E3+F3

2 VEF3

E4

E1

VREP 13

1 SW

E3

E2

VRFN

14

4 GAINSW
3 Vc(OEIC)
2 Vcc(OEIC)
1 GND(OEIC,TEMP)

Behind View

DVD-LD : 1st Vendor : Rd = 82k
DVD-LD : 2nd Vendor : Rd = 5.6k

44

2. Pick up Pin Assignment

45

No.

Signal Name

I/O

Signal Description

1

GND(OEIC,TEMP)

2

Vcc(OEIC)

I

Power supply for OEIC

3

Vc(OEIC)

I

Reference voltage input for OEIC

4

GAINSW

I

OEIC output gain control (High:Low gain, Middle:Middle gain, Low:High gain)

5

E3+F3

O

Single OEIC output EF3

6

B

O

Single OEIC output B

7

D

O

Single OEIC output D

8

E4+F4

O

Single OEIC output EF4

9

E1+F1

O

Single OEIC output EF1

Ground for OEIC

10

A

O

Single OEIC output A

11

C

O

Single OEIC output C

12

E2+F2

O

Single OEIC output EF2

13

RF+

O

Single OEIC RF positive differential output

14

RF-

O

Single OEIC RF negative differential output

15

GND(OEIC.TEMP)

O

Ground for OEIC and TEMP

16

TEMP

O

Output voltage for controlling temperature

17

VSO

I

Supply voltage for the output drivers only

18

SEN

I

Serial control enable (H=enable, L=disable)

19

BUSY

O

Goes high when serial transfer to timing menory is active

20

SCLK

I

Serial control clock

21

SDIO

I/O

Serial data for parameters and control ; in/out

22

RWB

I

Write enable for NRZ laser data (L=write, H=read)

23

MONITOR

O

Monitor output

24

GND(LDD)

25

NRZ

I

NRZ laser data (H=mark, L=space) (LVDS+)

26

NRZB

I

NRZ laser data (H=mark, L=space) (LVDS-)

27

GND(LDD)

28

CLKB

I

CLOCK for NRZ code input (LVDS-)

29

CLK

I

CLOCK for NRZ code input(LVDS+)

30

VSL25

I

Supply voltage for 2.5V logic

31

VSA5

I

Supply voltage for PLL only

32

SLG

I

Land/groove input serects the power register set (H=land, L=groove)

33

IAPC

I

A low inpedance current input ; 100xIAPC frow to the output

34

ENA

I

Fast chip enable input

35

VCC(FM)

I

Power supply for FM

36

SEL

I

Low: selects

DVDFMOUT

High: selects

CDFMOUT

Ground connection for LD Driver-IC

Ground connection for LD Driver-IC

37

VREF

I

APC amplifier reference voltage input

38

FM

O

APC amplifier output

39

GND(FM)

40

AF+

I

Focusing Actuator drive signal+

41

AF-

I

Focusing Actuator drive signal-

42

TR+

I

Tracking Actuator drive signal+

Ground connection for FM

43

TR-

I

Tracking Actuator drive signal-

44

Tilt+

I

Tilting Actuator drive signal+

45

Tilt-

I

Tilting Actuator drive signal-

3. Signal detection of the P/U

Infrared Iaser
Pick-Up module

Focusing
Tracking

Photo Diode

1) Focus Error Signal ==> (A+C)-(B+D)
This signal is generated in RF IC (IC101 : R2S35002) and controls the pick-up’s up and down to focus on
Disc.
2) Tracking Error Signal (DPP Method) ==> {(A+D)-(B+C)}- k x {(EF1+EF4)-(EF2+EF3)}
This signal is generated in RF IC (IC101 : R2S35002) and controls the pick-up’s left and right shift to find
to track on Disc.
3) RF Signal ==> (A+B+C+D)
This signal is converted to DATA signal in DSP IC (IC301 : R8J32007).

Track Center

Tp/2

Sub1
F,E

D,C
A,B

Main

Sub2

H,G

Tp
k[(F+H) - (E+G)]
Offset
(A+D) - (B+C)

TE

(A+D) - (B+C) - k[(F+H) - (E+G)]

46

DESCRIPTION OF CIRCUIT
1. ALPC (Automatic Laser Power Control) Circuit
1-1. Block Diagram

CN101
Optical
Pick-up

LD
Driver
Write
Strategy
FsDAC
WDAC

25,26,28

13

9
8

IAPC

2.5VREF
R160
FMON

12

9
10

buffer

LPF
&
Gain

S/H

IC101 (R2S35002))

+
-

APCDAC
(REDA/WRDA)

SCLK, SDATA, WDEN

MUX

RWAPC

AMP

Buffer

S/H

B/H

28
29

32

6

5

RFPDSH

WFPDSH

WGATE

TCPH

BCNT

R106

R105

126

127

134

175

108

120,121,123

IC301 (R8J32007)

C106

C105

47

1-2. ALPC (Automatic Laser Power Control) Circuit
ALPC function DVD/CD anlaog front-end IC(IC101 R2S35002) is for constant power control purpose. Based on the
accurate power sensor(FMON) in P/U, ALPC feedback loop maintains constant power level against laser diode’s
temperature variation.
The ALPC loop amplifies(10x) the FMON signal to enhance the accuracy of read power level control. Swithching of
amplification is made by combination of a logical WGATE signal and a logical RWAPC signal.
There are two set of APCDAC, which are used at different term to monitor different power level. Generally, the one is used
at reading and the other one is used at writing. The logical WGATE signal which is switched between reading and writing
changes the two APCDAC.
The ALPC loop supplies same currency (IAPC) to Laser Diode Driver(LDD) during reading and writing.
There is another ALPC which controls Full-Scale-DAC (FsDAC). FsDAC determines scale of WDAC of Laser Diode Driver.
MPU monitors write-power level of FMON signal and changes FsDAC directly to maintain constant write-power level. There
are two write power signal. The one is based on S/H signal and the other one is based on B/H(Bottom-Hold) signal. The
write power levels are monitored as digital levlels which are converted by built-in Anlog-Digital Converter in DSP. The MPU
monitors each write power level and calculates proper setting of FsDAC, and changes value through serial interface
between LDD and DSP.

48

2. Focus Circuit
2-1. Block Diagram
A+B+C+D

LPF

G

HAVC
LS
to
0.8V

3

G

HAVC
LS
to
V14

2

A,B,C,D

IC101
R2S35002
A,B,C,D

LPF

(EF1~EF4)

Disc
Motor unit

(A+C)-(B+D)
(A+C)-(B+D)+K[(EF1+EF3)-(EF2+EF4)]

Optical
Pick-up
HOP-7632TS

FOD
180

IC301
R8J32007

FACT- FACT+

FACT+
FACT-

DAC

Focusing
Compensator

35

FE

FE
R102
C405

R103

FE
ADC

169

GND

PE

42

R2S30202FP

GND

R329
FOD

40

IC601

C406

170

FOIN

34

PE

C335

REF

1.65V
EN1

20

CTL1
EN2

21

CTL2

2-2. Focus Servo
The aim of Focus Servo is to maintain the distance between object lens of P/U and disc surface, so that the
detected RF signal(A, B, C, D, EF1, EF2, EF3, EF4) can be maximized.
Focus Error Signal(FE) generates from focus error detection block in RF IC(R2S35002) using Conventional
Astigmatism Detection method, Differential Astigmatism Detection method.
Focus Gain and path can be changed at the RF IC(R2S35002) according to the disc, and the resulting output
FE(R2S35002 2pin) is input to DSP IC(R2S35002 169pin).
The Focus Search operation is using FE, PE Signal, therefore check FE, PE signals when Focusing is failed.
The role of DSP IC(R8J32007) is Focus Digital Controller. The operation path is as follows;
FE Signal is input to DSP IC(R8J32007 169pin), and after A/D Conversion, Digital Equalizer Block and D/A
Conversion in R8J32006FP, the output signal FOD(R8J32007 180pin) is input to Drive IC(R2S30202FP 40pin).
The drive output signal FACT+/FACT- generated according FOIN(R2S30202FP 40pin), and drives focus
actuator in the P/U unit.

49

3. Tracking & Sled Circuit
3-1-1. Block Diagram (Tracking Following)

IC101
R2S35002

MPPO
(A+D)-(B+C)
L
P
F

SPPO

A,B,C,D
(EF1~EF4)

Disc
Motor unit

HAVC
LS
to
V14

L
P
F

G

TE

1
TE

R101

Optical
Pick-up
HOP-7632TS

(A+D)-(B+C)-K[(EF1+EF4)-(EF2+EF3)]
C101
TRD

Tracking
Compensator

DAC

181

ADC

GND

173
TE

TACT- TACT+

SL2
183

Sled
Compensator

DAC
182
A+

IC301
R8J32007

SL1

AB+
B-

SLED MOTOR
Unit
(CN601)
TACT+

37

TACT-

39

BA+

SL2N

EN1

20

8
SL1N

TRD

IC601
R2S30202FP

A-

CTL1

R372

1.65V

1.65V

CTL2

21

10

SL2P

R331

SL1IN
6

SL1P

C336

EN2

SL2

2
SL2IN

B+

R330

TOIN

36

C337

R373
R332

3

9

SL1
C338

42

R374

REF
1.65V
C604

50

3-1-2. Block Diagram (Seek)

IC101
R2S35002

MPPO
(A+D)-(B+C)

A,B,C,D

Disc
Motor unit

-

SPPO

(EF1~EF4)

[(EF1+EF4)-(EF2+EF3)]

Optical
Pick-up
HOP-7632TS

+

L
P
F

HAVC
LS
to
V14

L
P
F

G

1

TE1

38

MIRR

VREF1
A+B+C+D

L
P
F
TACT- TACT+
L
P
F

A+

G

+

-

VREF1

HAVC
LS
to
V14

MIRR
DET

AB+

SUMF

79

EQ

RFIP

80

AGC

B-

SLED MOTOR
Unit

BOTTOM
HOLD

TOP
HOLD

RFIN 81
63

62

MIRRTOPH

GND

MIRRBOTH

C128

C127

GND

GND

C101
TE

IC301
R8J32007

173
R101
Track Counter
and Timer

TE1
IP2MIRR
MIRR

149

M
U
X

A
D
C

Short
Seek
Algorithm

Tracking
Compensator

D
A
C

Loog
Seek
Algorithm

Sled
Compensator

D
A
C

TRD
181

SL2
183
182
SL1

51

3-2-1. Tracking Servo
The aim of tracking servo is to make laser beam trace the data track on disc.
Tracking Error(TE) Signal is generated from tracking error detected block in R2S35002 using DPP(Differential
Push-Pull) Method and DPD (Differential Phase Detection) Method.
DPP Method uses not only main beam(A, B, C, D) but also side beam(EF1~EF4) for correcting DC offset
generated in Push-Pull Method.
The remaining procedure of TE signal processing in R8J32007 is similar to Focus Servo.
The role of DSP IC(R8J32007) is Tracking Digital Controller.
TE Signal is input to DSP IC(R8J32007 173pin), and after A/D Conversion, Digital Equalizer Block and D/A
Conversion in R8J32007, the output signal TRD(R8J32007 181pin) is input to Drive IC(39pin).
The drive output signal TACT+/TACT- generated according TOIN(R2S30202FP 39pin), and drives tracking
actuator in the P/U unit.

3-2-2. Sled Servo
The working distance of tracking actuator is too short to cover whole disc radius.
Sled Servo make P/U move by little and little so that the laser beam keep tracing the data track on disc
continuously when tracking actuator reaches the working limit.
TE Signal is input to DSP IC(R8J32007 173pin), and after A/D Conversion, Digital Tracking Equalizer Block,
Digital Sled Compensator Block and D/A Conversion in R8J32007, the output signal SL1, SL2(R8J32007 182,
183pin) is input to Drive IC (R2S30202FP SL1:3 pin, SL2:2pin) after Low-Pass filtering.

52

4. Spindle Circuit
4-1-1. Block Diagram(FGCAV Servo)

Optical
Pick-up
HOP-7632TS
Disc
Motor unit
IC301
R8J32007

X301
33.8688MHz

XCO

VCK4M

106

Control Clock
Generator

107
XCI
SFG

SPD

SPD

211
R349

P
W
M

M
U
X

CAV FD
+
CAV PD

213
VCK4M
R361

R375
Motor Kick
REG

C349

3.3V

1.65V

SPIN
U

12

V

13

IC601

SPD

1
DAVC
42

1.65

R2S30202FP
W

14

CTL1 20

CTL1

CTL2 21

CTL2

19

SFG
FG

4-1-2. FG CAV Servo
1) CD 48x CAV : CD-ROM, CD-R
2) CD 40x CAV : CD-RW
3) DVD 8x CAV : DVD+RW
4) DVD 10x CAV : DVD+R
5) DVD 12x CAV : DVD-ROM DL
6) DVD 16x CAV : DVD-ROM
7) DVD 16x PCAV : DVD+R
When drive read PRESS CD, Closed Session CD-R/RW, the spindle motor is controlled using FG CAV Spindle
Servo. FG signal(R2S30202FP 19pin) input to SFG in DSP IC(R8J32007 213pin).
The spindle controller in DSP IC uses SFG as spindle rotation frequency feedback, therefore the FG CAV
Spindle Servo doesn't work well if FG generation is abnormal.
The spindle controller PWM output signal SPD(R8J32007 211pin) input to SPIN in Drive IC(R2S30202FP 1pin)
after Low-Pass Filtering.
The PWM output signal U, V, W signal(R2S30202FP 12, 13, 14pin) drives Spindle Motor without using a
sensor, and FG pulse output is generated as 18 pulses/rotation.

53

4-2-1. Block Diagram (Wobble CLV Servo)
C116

C117

WAG1

C118

WAG2

WAG3

18 19
SA

87

ADO

SB

Disc
Motor unit

SD

Optical
Pick-up
HOP-7632TS

HPF

S
/
H

88
SC

20

89

AGC1

HPF

HPF

+

AGC2

BCO

90

MA
92
C171 MB

BPF

HPF

AGC3

93
C172
MC
C173

94

HPF

WOBSIG

+
37

MD

VREF

95

-

C174
GND

IC101
R2S35002

WBLSH
31

WBLS H

IC301
R8J32007

1.65V

154

R375
SPD

SPD

211
R349

C349

1.65V

P
W
M

M
U
X

SP

Motor Kick
REG

PH

4-2-2. Wobble CLV Servo
CD-R : 4x, 8x, 16x, 24x, 32x, 40x, 48x
/CD-RW : 4x, 10x, 16x, 24x, 32x
/DVD-R : 2x, 4x, 8x, 16x(PCAV)
/DVD-R DL : 2x, 4x
/DVD-RW : 1x, 2x, 4x, 6x
/DVD+R : 2.4x, 4x, 8x, 12x, 16x(PCAV)
/DVD+R DL : 2.4x, 4x, 6x
/DVD-RAM : 2x, 3x, 3-5x(PCAV)
/DVD+RW : 2.4x, 4x, 8x
When drive write DVD-RAM/R/RW/+R/+RW/CD-R/CD-RW, the spindle motor is controlled using Wobble CLV
Spindle Servo.
The WOBSIG signal(R2S35002 37pin) input to DSP IC(R8J32007 154pin). The DSP Controller in R8J32007
uses WOBSIG as linear velocity feed back, therefore the Wobble CLV Spindle Servo doesn’t work well when
WOBSIG signal is abnormal.
The spindle controller PWM output signal SPD (R8J32007 211pin) input to SPIN in Drive IC(R2S30202FP 1pin)
after Low-Pass Filtering.
The PWM output signal U,V, W signal(R2S30202FP 12, 13, 14pin) drives Spindle Motor without using a sensor.

54

MAJOR IC INTERNAL BLOCK DIAGRAM AND PIN DESCRIPTION
IC101 (R2S35002) : RF AMP Analog Signal Processor

VDD1(3.3V)

EQON

EQOP

GND1

TOPH

BOTH

MIRRTOPH

MIRRBOTH

MIRRHPF

BHC

VDD4(3.3V)

MRSTB

SDEN

70

69

68

67

66

65

64

63

62

61

60

59

58

57

PORT10

SUBI/LPPSIG

71

PORT11

SUBO/LPPMON

72

PORT12

EQFCF

73

PORT13

IREFE

74

SDATA

AGHPF2

75

SCLK

AGHPF1

Pin Assignment

56

55

54

53

52

51

AGFU

76

50

MCLK

AGFR

77

49

PORT07

(5V)VCC1

78

48

PORT06

SUMF/SUMF2

79

47

PORT05

RFIP

80

46

PORT04

45

PORT03

44

PORT02

RFIN
SRVREF

81
82

FVREFO

83

43

PORT01

IREFT

84

42

PORT00

VREF1

85

41

GND4

HAVC

86

SA

87

SB

88

SC

89

SD

R2S35002
(TOP VIEW)

DFT

39

IP1/LPPOUT

38

IP2/MIRR

98

28

RFPDSH

AIN3

99

27

SPBLVL/TISH2

100

26

LNDTRK

TE

GND5

AIN2

AWOBSIG

WFPDSH

(3.3V)VDD5

MPDSH/SPDSH

29

(EQOS/RRF/WRF/LPPMON/)ATEST

30

97

WOBFCF

96

AIN1

WAG3

GND2

WAG2

WBLSH

WAG1

31

GND3

WGATE

95

VRDC

32

MD

VRDCN

94

VRDC2N/PWRMON

MC

LDOUT

RFHLD/TISH1

VRDC3N

33

FMD

IDGATE

93

(3.3V)VDD3

34

MB

FVREF

LO_ZB/SPDSH

(5V)VCC2

35

92

BHBETA/TIE

91

MA

PHBETA/TCE

(3.3V)VDD2

LE

BLANK

BCENT

36

FE

WOBSIG

90

PE

37

SIGM

55

40

Block Diagram
3300p 0.1u

RF SLIM/SUB
(RGA)

SUMF2
to WRF

AGHPF1

IREFE

AGHPF2

AGFR

AGFU

RFHLD/
TISH1

RF
AGC

HP2

mclk
to MIRR.DEFECT
EQOP

RF
EQ

HP3

EQON

EQAUTO

EQOS
M
U
X

IP1/LPPOUT
IP2/MIRR

D

VREF1
4700p

D

SUBP.N

RFIN

D

LO_ZB/
SPDSH

RFIP

0.068u

D

IDGATE

D

SUMF/
SUMF2
0.068u

12k
(*2)

0.47u

*3300P/0.068u

EQFCF

*3300p
Lo-Z function by IDGATE.
.
. 3.3us
fast mode
Lo-Z function by IDGATE.

M
U
X

MIRR

SUBO/LPPMON

ATEST
LPPMON/EQOS/RRF/WRF

SUBI/LPPSIG

mclk

ID
DET

M
U
X

BHC

15,000p

LPP

SUBW

mclk

2200p

VREF1
MA
MB
MC

2

Pick
I/F

WOBFCF

F0-CNT

Wobble

0.47u

S/H

WOB

AWOBSIG

AGC1

MD

BPF

COMP

AGC3

D

*HPF fc=1kHz

AGC2

WAG3

4

BPO

WAG1

S/H

main

SA

to A/D
0.1u

WOBSIG

SUB

VREF1

WAG2
0.1U

SB

0.12U

SC

0.12U

LNDTRK

4

SD

TE
sub

D

BALANCE

TE

S/H

to LPF,A/D

DPD
to LE
MPP SPP

FE

FE

BALANCE

toLPF,A/D

HAVC

pick-up I/F
reference level

PE

PE

toLPF,A/D

MPP
SHPE

D

D

WBLSH

HFSUM

RRF
SPP
HFPE

FE

MPDSH/
SPDSH

MUX

LE

LO_ZB/SPDSH
pin

toLPF,A/D

SUMF2
M

WRF

WRF U
X

mclk

MCLK
D/A

SRVREF

20k(*1)

IREFT

BLANK
D

MIRRTOPH
MIRRBOTH

VREF1(=2.1V)
FVREFO(=2.5V)

VFREFO
0.01u
D
D
D
D

SDEN
SCLK
SDATA

TOPH

MIRR

DFT

0.068u

D

RFHLD/TISH1 pin

12

PORT00~07.10~13

SPBLVL/TISH2

TIE

D
D

0.033u

BOTH

Programm
able I/O
port

Power
Cont.

Serial
Cont.
Reg.

0.033u

0.1u

IP2/MIRR pin

MRSTB

0.033u

MIRRHPF

MIRR
DEFECT

EQOP/N

D

WGATE
SPBLVL

APC
GCAOUT
PWWMON
BHOUT

FVREF

GND2
VDD1
0.1u

vCC1

GND3
VDD2
0.1u

vCC2

GND4
VDD3
0.1u

VDD5

VRDC

PHBETA/TCE
BHBETA/TIE
BCENT

toLPF,A/D
toLPF,A/D
toLPF,A/D

RFHLD/TISH1 pin

each blocks

LDOUT

VRDCN

VRDC3N

FMD

R-OPC
OPC

BPO

GND1

RFPDSH

GND5
VDD4

D

LO_ZB/SPDSH

WGATE

0.1u

D

VRDC2N/
PWRMON

3

SIGM

AIN1~3

SIGM

toLPF,A/D

D

0.1u

0.1u
8200p

3.3u

power 3.3V(VDD)

0.1u

...Combined pin

In the case of
analog APC
680k

0.01u

RECD

VHALH(=VDD/2)

VREF

VREF1
10u

RECD

SAV

0.1u

power 3.3V

(*1), (*2)...1% Resistor

D ...digital pin
D/A...digital/analog pin

power 5V

56

• Pin Functions
pin Name

pin No. Type

max. voltage

Function

TE

1

Analog-Output

Tracking error output terminal

FE

2

Analog-Output

Focus error output terimnal

PE

3

Analog-Output

PE output terminal

LE

4

Analog-Output

Lens error output terminal

BCENT

5

Analog-Output

OPC center signal output terminal

PHBETA/TCE

6

Analog-Output

OPC top hold level signal and APC write sampleing

BHBETA/TIE

7

Analog-Output

VCC2

8

Power

FVREF

9

Analog-Input

VDD

Reference voltage for APC input terminal

FMD

10

Analog-Input

VDD

APC monitor diode input terminal

signal output terminal/tilt servo detecting output terminal
OPC bottom hold level signal and R-OPC sampleing
signal output terminal/tilt servo detecting output terminal
Power supply connected terminal(5V)

VDD3

11

Power

Power supply connected terminal(3.3V)

LDOUT

12

Analog-Output

Terminal to control laser drivers for APC read system

VRDC3N

13

External-components required

Terminal to connect laser driver control filters for APC
read

VRDC2N/PWRMON

14

External-components required

Terminal to connect laser driver control filters for APC
read/ SH monitor output terminal

VRDCN

15

External-components required

Terminal to connect laser driver control filters for APC
read

VRDC

16

External-components required

Terminal to connect laser driver control filters for APC
read

GND3

17

Ground

Ground connected terminal

WAG1

18

External-capacitor required

Terminal to connect WOBBLE AGC detector capacitor

WAG2

19

External-capacitor required

WAG3

20

External-capacitor required

WOBFCF

21

External-capacitor required

WOB-BPF f0 auto-adjustment external capacitor
connected terminal

VDD5

22

Power

Power supply connected terminal(3.3V)

ATEST

23

Analog-Output

Renesas analog test signal output terminal

AWOBSIG

24

Analog-Output

Analog-level WOBBLE signal output terminal

GND5

25

Ground

Ground connected terminal

LNDTRK

26

Digital-Inputpull-up

VDD

Balans adjustment mode selection

SPBLVL/TISH2

27

Digital-Inputpull-up

VDD

R-OPC WRF signal sampling pulse input terminal

RFPDSH

28

Digital-Input

VDD

APC read system sampling pulse input terminal

/Tilt servo detecting sampling pulse input terminal
putpull-up

WFPDSH

29

Digital-Input

putpull-up

VDD

APC write system sampling pulse input terminal

MPDSH/SPDSH

30

Digital-Input

putpull-up

VDD

Pickup input sampling pulse input terminal

WBLSH

31

Digital-Input

putpull-up

VDD

WOBBLE sampling pulse input terminal

WGATE

32

Digital-Input

putpull-up

VDD

Read/write control input terminal

RFHLD/TISH1

33

Digital-Input

putpull-up

VDD

RF hold control signal input terminal /Tilt servo detecting
sampling pulse input terminal

IDGATE

34

Digital-Input

putpull-up

VDD

ID select pulse input terminal

LO_ZB/SPDSH

35

Digital-Input

putpull-up

VDD

Low-z (reversal) pulse input terminal
/Pickup input sampling pulse input terminal

57

pin Name
BLANK

pin No. Type
36

max. voltage

Function

Digital-Output

Record/non-record detecting/BD detecting output
terminal

WOBSIG

37

Digital-Output

WOBBLE signal output terminal

IP2/MIRR

38

Digital-Output

ID detection/Mirror detection output terminal

IP1/LPPOUT

39

Digital-Output

ID detection/LPP detection output terminal

DFT

40

Digital-Output

Defect detection output terminal

GND4

41

Ground

PORT00

42

Digital-Input/Output

PORT01

43

PORT02

44

PORT03

45

PORT04

46

PORT05

47

PORT06

48

PORT07

49

MCLK

50

Ground connected terminal (Digital)
VDD

I/O Port

VDD

Main clock input terminal

default input mode
No pull-up

Digital/Analog-Input
No pull-up

Equalizer fc auto-adjustment control clock input terminal.
LPP output pulse width control clock input terminal.
WOB-BPF f0 auto-tracking clock input terminal.

PORT10

51

Digital-Input/Output

PORT11

52

default input mode

PORT12

53

PORT13

54

SCLK

55

VDD

I/O Port

VDD

Serial I/F clock input terminal

No pull-up
Digital-Input

pull-up

SDATA

56

Digital-Input/Output

pull-up

VDD

Serial I/F data input/output terminal

SDEN

57

Digital-Input

pull-up

VDD

Serial I/F enable input terminal

MRSTB

58

Digital-Input

pull-up

VDD

VDD4

59

Power

Power supply connected terminal(3.3V)(digital)

BHC

60

External-capacitor required

External capacitor for LPP bottom hold terminal

MIRRHPF

61

External-capacitor required

Master reset (reversal) input terminal

Terminal to connect Mirror envelope detector HPF
capacitor

MIRRBOTH

62

External-capacitor required

Terminal to connect Mirror envelope detector bottom
hold capacitor

MIRRTOPH

63

External-capacitor required

Terminal to connect Mirror envelope detector top hold
capacitor

BOTH

64

External-capacitor required

Terminal to connect envelope bottom hold capacitor

TOPH

65

External-capacitor required

Terminal to connect envelope top hold capacitor

GND1

66

Ground

Ground connected terminal

EQOP

67

Differential-Output

RF equalizer differential output terminal
Power supply connected terminal(3.3V)

EQON

68

VDD1

69

Power

SUBI/LPPSIG

70

Analog-Input

VDD

ID detecting HPF input terminal/LPP detecting HPF input
terminal

58

pin Name

pin No. Type

max. voltage

Function

SUBO/LPPMON

71

Analog-Output

ID detecting HPF output terminal/LPP detecting HPF

EQFCF

72

External-capacitor required

Terminal to connect RF-equalizer fc auto-adjustment

IREFE

73

External-resistor required

AGHPF2

74

External-capacitor required

Terminal to connect AGC high pass filter capacitor
AGC filter connecting terminal

output terminal
external capacitor
Terminal to connect RF-equalizer fc setting external
resistor
AGHPF1

75

AGFU

76

External-capacitor required

AGFR

77

External-capacitor required

VCC1

78

Power

SUMF/SUMF2

79

Analog-Input/ /External-capacitor required

Power supply connected terminal(5V)
VDD

SUM RF input/SUM differential amp. DC filter
connected terminal

RFIP

80

RFIN

81

Differential-Input

VDD

RF differential input terminal

SRVREF
FVREFO

82

Analog-Input

VDD

DSP supply voltage (3.3V) input terminal

83

Analog-Output

2.5V reference bias voltage output terminal

IREFT

84

External-resistor required

Terminal to connect reference current setting external
resistor

VREF1

85

Analog-Output

HAVC

86

Analog-Input

VCC

Pickup reference voltage input terminal

SA

87

Analog-Input

VCC

Sub beam 4D input terminal

SB

88

Analog-Input

SC

89

Analog-Input

SD

90

Analog-Input
VCC

Main beam 4D input terminal

VDD2

91

Power

MA

92

Analog-Input

MB

93

Analog-Input

MC

94

Analog-Input

MD

95

Analog-Input

GND2

96

Ground

AIN1

97

Analog-Input

AIN2

98

Analog-Input

AIN3

99

Analog-Input

SIGM

100

Analog-Output

59

2.1V reference bias voltage output terminal

Power supply connected terminal(3.3V)

Ground connected terminal
VDD

Analog input terminal

Analog signal monitoring output terminal

IC301 (R8J32007FPV) : Encoder, Decoder & DSP Singal Processor

216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
192
191
190
189
188
187
186
185
184
183
182
181
180
179
178
177
176
175
174
173
172
171
170
169
168
167
166
165
164
163

CPU15
A17
EF G
SFG
TLD
SPD
LDD
LE D
GPIO04
ICUIN8
ICUIN6
ICUIN7
TE STB1
TE STB2
MRSTB
VSSIO
VCCIO
VCC
PTE ST3
VDDAA
PTE ST2
VSSA
REXT
VDDAA
PTE ST1
VSSA
VINP
VDDAA
VINN
VSSA
VCCA
VCCA
DAVC
TV DN
TV DP
TRD
FOD
GAD1
GAD0
BCENT
TIB H
TCPH
LPSA
TE
AT ZC
SIGM
PE
FE
VSSA
VSSA
VCCA
W1LPF0
W1LPF1
W1LPF2

1.1 Pin Layout

R8J32007
Top View

162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109

W2LPF0
W2LPF1
W2LPF2
VDD AA
VSSAA
DE FECT
BL AN K
LN DTRK
WOBSIG
L OWZB
ID GATE
RFH L D
IP1LP PIN
IP2M IRR
VCCI O
VSSIO
VDD
VSS
VSSA
NRZI
NRZIB
DCL K B
DCL K
VCCA
WRGATEB
SRFH
SRFL
WRSTOP
WRGATE2
VCCI O
VSSIO
VSS
VDD
WBL SH
MPDS H
WFPDSH
RFPDSH
TCSHSPBLV
LDB USY
WDEN
RFDEN
SDAT A
SCL K
FE MCK
TRST
TDO
TDI
TCK
TMS
TE ST3
TE ST2
TE ST1
TE ST0
DOUT

55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54

A2
GPIO05
VSSIO
VCCIO
HR STB
DATA7
DATA8
DATA6
DATA9
DATA5
DAT A10
DATA4
DAT A11
DATA3
DAT A12
DATA2
DAT A13
VDD
VSS
VSSIO
VCCIO
DATA1
DAT A14
DATA0
DAT A15
DREQ
ZIOWB
ZIORB
IORDY
DACKB
HIN TRQ
IOCS16B
VSSIO
VCCIO
DA1
PDIA GB
DA0
DA2
CS1FXB
CS3FXB
DASPB
GPIO07
GPIO06
ROUT
VCCA
LOU T
ADIP VR1
ADIP VRT
ADIPINP
VSSA
VSSA
XCO
XCI
VCCA

VSSR
VCCR
CPU14
CPU13
CPU12
VSSIO
VCCIO
VCCRQ
CPU11
CPU10
VSSRQ
CPU9
CPU8
CPRDB
UCS0B
A1
CPU0
CPU1
CPU2
CPU3
CPU4
VSSRQ
CPU5
CPU6
CPU7
VCCRQ
VSS
VDD
A16
A15
VSSIO
VCCIO
A14
A13
A12
A11
A10
A9
A20
CPWRB
VDD
VSS
A19
A18
A8
A7
A6
A5
A4
A3
VSSIO
VCCIO
VCCR
VSSR

60

1.2 Block Diagram

CAV
AUDIO
VINP
VINN

Data
PLL

ADC

WPLL

DVD
Scramble

LPP
Detector

Wobble
Generator

ADC

CD-DSP

Jitter
Counter

W2LPF[2:0]

ADIPVR1
ADIPVRT
ADIPINP

DVD
PI-ECU

ADIP
Detector
DVD
PO-ECU

IP1LPPIN
IP2MIRR
LOWZB
IDGATE
RFHLD
NRZI,NRZIB
DCLK,DCLKB
WGATEB
WRGATE2
SRFH
SRFL
WRSTOP
WBLSH
MPDSH
WFPDSH
RFPDSH
TCSHSPBLV

ATAPI

DREQ
DACKB
DASPB
CS3FXB
CS1FXB
PDIAGB
DA2
DA1
DA0
IOCS16B
HINTRQ
IORDY
ZIORB
ZIOWB
HRSTB
DATA [15:0]

PRML

W1LPF[2:0]

WOBSIG

LOUT
ROUT
DOUT

DVD
Descramble

CD-ROM
Decoder

REXT
PTEST [2:0]

AUDIO

DRAM
Interface

Demodulate

LVDS
Modulator

SDRAM
16Mbit

XCI
XCO

Clock
Generator

FEMCK
CD
CD-ROM
Encoder

MRSTB

Test
Control

TESTB[1:2]
TEST[3:0]

Sample

SCLK
SDATA
RFDEN
WDEN
LDBUSY

DRAM
Hold

Serial I/F

TLD
LDD
LED
SPD
LNDTRK
SFG
EFG
DERECT
ATZC
BLANK
FE
PE
SIGM

ZCS
RD[15:0]
RA[12.10:0]
RAMCL
DWE
DRAS
DCAS
DQMU
DQML
DCKE

CPWRB
CPRDB
A[20:0]
MCIF

Cmp

UCS0B
GPIO05(UCS1B)
CPRDB
CPWRB
A[20:1]
GPIO04(A[0])
CPU[15:0]

CPU[15:0]

UCS2B
UCS3B
ADC

Servo

MSEQ

GPIO06(CSEL)

TE
LPSA

WAIT
ADGATEB
INT0B
INT1B
INT2B
FOK
INT3B

ADC

GPIO07(HEATRUN)
H8S

ICUIN6(EJECTSW)
ICUIN7(ACTFLG)

CPU

ICUIN8(LOADIN)

SSEQ
FOD
DAVC
TRD
TVDP
TVDN
TCPH
TIBH
BCENT
FAD0(VRDC2N)
GAD1

61

TRST(NMI)
DAC
BCA
DAC

Auth
ADC

TCK(SCK)
TDI(SCI)
TDO(SCO)
TMS

1.3 Pin Table
Pin no
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54

Pin Name
VSSR
VCCR
CPU14
CPU13
CPU12
VSSIO
VCCIO
VCCRQ
CPU11
CPU10
VSSRQ
CPU9
CPU8
CPRDB
USC0B
A1
CPU0
CPU1
CPU2
CPU3
CPU4
VSSRQ
CPU5
CPU6
CPU7
VCCRQ
VSS
VDD
A16
A15
VSSIO
VCCIO
A14
A13
A12
A11
A10
A9
A20
CPWRB
VDD
VSS
A19
A18
A8
A7
A6
A5
A4
A3
VSSIO
VCCIO
VCCR
VSSR

Pin no
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108

Pin Name
A2
GPIO05
VSSIO
VCCIO
HRSTB
DATA7
DATA8
DATA6
DATA9
DATA5
DATA10
DATA4
DATA11
DATA3
DATA12
DATA2
DATA13
VDD
VSS
VSSIO
VCCIO
DATA1
DATA14
DATA0
DATA15
DREQ
ZIOWB
ZIORB
IORDY
DACKB
HINTRQ
IOCS16B
VSSIO
VCCIO
DA1
PDIAGB
DA0
DA2
CS1FXB
CS3FXB
DASPB
CPIO07
CPIO06
ROUT
VCCA
LOUT
ADIPVR1
ADIPVRT
ADIPINP
VSSA
VSSA
XCO
XCI
VCCA

Pin no
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162

Pin Name
DOUT
TEST0
TEST1
TEST2
TEST3
TMS
TCK
TDI
TDO
TRST
FEMCK
SCLK
SDATA
RFDEN
WDEN
LDBUSY
TCSHSPBLV
RFPDSH
WFPDSH
MPDSH
WBLSH
VDD
VSS
VSSIO
VCCIO
WRGATE2
WRSTOP
SRFL
SRFH
WRGATEB
VCCA
DCLK
DCLKB
NRZIB
NRZI
VSSA
VSS
VDD
VSSIO
VCCIO
IP2MIRR
IP1LPPIN
RFHLD
IDGATE
LOWZB
WOBSIG
LNDTRK
BLANK
DEFECT
VSSAA
VDDAA
W2LPF2
W2LPF1
W2LPF0

Pin no
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
209
210
211
212
213
214
215
216

Pin Name
W1LPF2
W1LPF1
W1LPF0
VCCA
VSSA
VSSA
FE
PE
SIGM
ATZC
TE
LPSA
TCPH
TIBH
BCENT
GAD0
GAD1
FOD
TRD
TVDP
TVDN
DAVC
VCCA
VCCA
VSSA
VINN
VDDAA
VINP
VSSA
PTEST1
VDDAA
REXT
VSSA
PTEST2
VDDAA
PTEST3
VCC
VCCIO
VSSIO
MRSTB
TESTB2
TESTB1
ICUIN7
ICUIN6
ICUIN8
GPIO04
LED
LDD
SPD
TLD
SFG
EFG
A17
CPU15

62

1.4 Pin Functions
It corresponds to the following signs as a pin I/O specification.
AI :
AO :
AIO :
I:
IU :
O:
TO :
IO :

Analog Input
Analog Output
Analog Input/Output
Standard Input
Standard Input with Pull Up
Standard Output
Standard Three State Output
Standard Input/Output

IOU :
5I :
5O :
5TO :
5IO :
PW :
GND :

Standard Input/Output with Pull Up
5V Tolerant Input
5V Tolerant Output
5V Tolerant Three State Output
5V Tolerant Input/Output
Power Supply Pin
Earth Pin

Data PLL/PRML Pin List
Pin Name Pin No.

I/O

destination

Function

VINP
VINN

190
188

AI

AFE

RF signal normal phase input pin
RF signal counter phase input pin

REXT

194

AO

External Resistance

Resistor connect pin for reference current generation

PTEST1
PTEST2
PTEST3

192
196
198

AO

External Resistance

PRML/Data PLL moniter D/A output pin
PRML/Data PLL moniter D/A output pin
Data PLL VCO control voltage monitor pin

Wpll Pin List
Pin Name Pin No.
W1LPF0
165
W1LPF1
164
W1LPF2
163
W2LPF0
W2LPF1
W2LPF2

63

162
161
160

I/O
destination
Function
AO External Components Write PLL1 filter connect pin (0)
Write PLL1 filter connect pin (1)
Write PLL1 filter connect pin (2)
AO External Components Write PLL2 filter connect pin (0)
Write PLL2 filter connect pin (1)
Write PLL2 filter connect pin (2)

Servo Pin List
Pin Name

Pin No.

I/O destination Function

BLANK

156

I

AFE

Blank signal input
(also connected to the H8S interrupt port INT5)

DEFECT

157

I

AFE

Defect (scratch detect) signal

SFG

213

IU

DRVR

EFG

214

I

PU

Spindle FG pulse
(also input to the H8S interrupt port INT4)
Spindle FG pulse for Light Scribe
(also input to the H8S interrupt port INT4)

TLD

212

TO

DRVR

Tilt drive signal (PWM output)

SPD

211

TO

DRVR

Spindle drive signal (PWM output)

LDD

210

TO

DRVR

Loading drive signal (PWM output)

LED

209

TO

PU

LPS_LED control signal (PWM output)

ATZC

172

AI

AFE

Tracking Zero Cross input signal

FE

169

AI

AFE

Focus error: sampled at 352.8 kHz

PE

170

AI

AFE

Laser power error: sampled at 352.8 kHz

SIGM

171

AI

AFE

Signal monitor: sampled at 88.2/176.4 kHz

TE

173

AI

AFE

Tracking error: sampled at 352.8 kHz

LPSA

174

AI

AFE

Lens positioning/lens error: sampled at 88.2 kHz

TCPH

175

AI

AFE

Tracking center/BETA top hold: sampled at 44.1/176.4 kHz

TIBH

176

AI

AFE

Tilt error/BETA bottom hold: sampled at 44.1/176.4 kHz

BCENT

177

AI

AFE

BETA center: sampled at 176.4 kHz

GAD1

179

AI

General AD input: sampled at 88.2 kHz

GAD0(VRDC2N)

178

AI

General AD input: sampled at 176.4 kHz

FOD

180

AO

DRVR

Focus control signal

TRD

181

AO

DRVR

Tracking control signal

TVDP
TVDN

182
183

AO

DRVR

Sled drive signal (normal phase)
Sled drive signal (counter phase)

DAVC

184

AO

DRVR

Servo system Vcc/2 voltage output pin

64

ATAPI Interface Pin List
Pin Name

Pin No.

I/O

HRSTB
DA2
DA1
DA0

59
92
89
91

5I
5I

ATAPI
ATAPI

ATAPI-IF control signal (host reset signal)
ATAPI-IF register address signal

DATA[15:0]

79,77,71,
69,67,65,
63,61,60,
62,64,66,
68,70,76,
78

5IO

ATAPI

ATAPI- IF data bus

DREQ

80

5TO

ATAPI

ATAPI-IF DMA request signal

ZIOWB

81

5I

ATAPI

ATAPI-IF write strobe pulse

ZIORB

82

5I

ATAPI

ATAPI-IF read strobe pulse

IORDY

83

5TO

ATAPI

ATAPI-IF control signal (drive Ready)

DACKB

84

5I

ATAPI

ATAPI-IF DMA acknowledge

HINTRQ

85

5TO

ATAPI

ATAPI-IF drive interrupt signal

IOCS16B

86

5TO

ATAPI

ATAPI-IF control signal (16-bit transfer)

PDIAGB

90

5IO

ATAPI

ATAPI-IF control signal

CS1FXB
CS3FXB

93
94

5I

ATAPI

ATAPI-IF register chip select signal

DASPB

95

5IO

ATAPI

ATAPI-IF control signal

65

destination Function

Encoder Interface Pin List
Pin Name

Pin No. I/O

destination

Function

IP1LPPIN

150

I

AFE

PID area identification signal/LPP input signal

IP2MIRR

149

I

AFE

PID area identification signal/MIRR signal

WOBSIG
LOWZB

154
153

I
O

AFE
AFE

Wobble signal input
Input impedance switch control signal/SPDSH; running
OPC sampling pulse (Pit top)

IDGATE

152

O

AFE

ID/data switch signal

RFHLD

151

O

AFE

VFO3 holding signal and track center signal sample &
hold signal

WRGATE2

134

O

AFE

Write gate signal output

WBLSH

129

O

AFE

Wobble signal sampling pulse

MPDSH

128

O

AFE

Main beam sampling pulse

WFPDSH

127

O

AFE

Laser control sampling pulse
(Front monitor write/erase block)

RFPDSH

126

O

AFE

Laser control sampling pulse
(Front monitor read block)

TCSHSPBLV

125

O

AFE

VFO1 track center signal sample & hold pulse;
/SPBLVL running OPC sampling pulse (Pit end)

WRGATEB

138

O

PU

Write gate signal

SRFH

137

O

PU

I- V amplifier gain switch (HI side)
/I- V amplifier gain switch (for binary)

SRFL

136

WRSTOP

135

I

PU

LNDTRK

155

O

AFE/PU

NRZI

143

AO

PU

NRZIB

142

DCLK

140

DCLKB

141

ADIPVR1

101

AO External Cpmponents

AD related pin for ADIP detection

ADIPVRT

102

AO External Cpmponents

AD related pin for ADIP detection

ADIPINP

103

AI

ADIP detect input pin

I- V amplifier gain switch (Low side)
Write stop gate signal
Land/groove switch
NRZI output after modulation (normal phase)
NRZI output after modulation (counter phase)
AO

PU

NRZI sync clock (counter phase)
NRZI sync clock (normal phase)

AFE

Serial Communication Interface Pin List
Pin Name Pin No.

I/O

destination

Function

LDBUSY

124

IO

LDD

LDD serial IF busy also functions as the CPU general port 1-0

WDEN

123

O

LDD

LDD microcomputer I/F (transfer enable signal)

RFDEN

122

O

AFE

AFE microcomputer I/F (transfer enablesignal)

SDATA

121

IO

AFE/LDD

AFE/LDD microcomputer I/F (transfer data signal 3Vsystem)

SCLK

120

O

AFE/LDD

AFE/LDD microcomputer I/F (transfer clock signal)

66

Audio Interface Pin List
Pin Name Pin No.

I/O

destination

Function

DOUT

109

IO

ATAPI

Digital output pin,also functions as the CPU general port 1-2

ROUT

98

AO

ATAPI

Audio Lch & Rch output

LOUT

100

Clock Generator Pin List
Pin Name Pin No.

I/O

destination

Function

FEMCK

119

O

AFE

Front End LSI clock

XCO

106

O

X’tal

Crystal oscillation 33.8688MHz

XCI

107

I

X’tal

Crystal oscillation 33.8688MHz

H8S Micro-Processor Pin List
CPU
Pin Name
ICUIN7(ACTFLG)

Pin No. I/O destination Function
205
IU
DRVR
CPU interrupt port INT7: Pick up protect flag

ICUIN6(EJECTSW)

206

I

Eject Switch CPU interrupt port INT6: EJECTSW interrupt request

ICUIN8(LOADIN)

207

IO

GPIO07(HEATRUN)

96

5IO

ATAPI

CPU general port 0-7 :Off heat run test input

GPIO06(CSEL)

97

5IO

ATAPI

CPU general port 0-6 ATAPI CSEL

GPIO04(A0)

208

IO

SRAM

CPU general port 0-4, also functions as H8S / A0

GPIO05(UCS1B)

56

IO

SRAM

CPU general port 0-5, also functions as H8S / CS1

Load Switch CPU general port1-1 also connected to the CPU interrupt
port INT8: Loader in sensor

Flash/SRAM Pin List
Pin Name
UCS0B

Pin No.
15

I/O
O

destination
Flash

Function
H8S / CS0

CPWRB

40

O

Flash / SRAM

H8S / WRB

CPRDB

14

O

Flash / SRAM

H8S / RDB

A[20:1]

39,43,44,
215,29,30,
33,34,35,
36,37,38,
45,46,47,
48,49,50,
55,16

O

Flash / SRAM

H8S / A[20:1]

CPU[15:1]

216,3,4,
5,9,10,

IO

Flash / SRAM

H8S / D[15:0]
CPU[0] can also function as the CPU general port 0-4
(multiplexed).

12,13,25,
24,23,21,
20,19,18
17

67

LSI/TEST Control Pin List
Pin Name
MRSTB

Pin No.
202

I/O
I

destination
RESET IC

Function
Master reset input

TESTB2
TESTB1

203
204

I

TMS

114

IU

E10emulator

Test data switch for E10emulator

TCK

115

IOU

E10emulator

Test clock for E10 emulator
It can function as a SCI serial clock output port when E10
emulator is not used (multiplexed).

TDI

116

IU

E10emulator

Test data input for E10 emulator
It can function as a SCI serial data input port when E10
emulator is not used (multiplexed).

TDO

117

O

E10emulator

Test data output for E10 emulator
It can function as a SCI serial data output port when E10
emulator is not used (multiplexed).

TRST

118

I

E10emulator

Test reset for E10 emulator
/Non-mask CPU interrupt port(falling edge sense)

TEST0
TEST1
TEST2
TEST3

110
111
112
113

IO

Test select

User test/CPU general port2
Test monitor can be set as the following table by a register

T*SEL[3:0]

TEST0

TEST1

TEST2

TEST3

0

Servo monitor 0

Servo monitor 1

Servo monitor 2

Servo monitor 3

1

WPLL monitor 0

WPLL monitor 1

WPLL monitor 2

WPLL monitor 3

2

Audio 0

Audio 1

Audio 2

Audio 3

3

DVD modulation 0

DVD modulation 1

DVD modulation 2

DVD modulation 0

4

DVD-R/CD-R
monitor 0

DVD-R/CD-R
monitor1

DVD-R/CD-R
monitor 2

DVD-R/CD-R
monitor 3

5

DVD+RW monitor 0

DVD+RW monitor1

DVD+RW monitor 2

DVD+RW monitor 3

6

PI/C1

PI/C1

PI/C1

PI/C1

7

PO/C2

PO/C2

PO/C2

PO/C2

8

DEMO 0

DEMO 1

DEMO 2

DEMO 3

9

-

-

-

-

10

CLVCK

CLVCK

CLVCK

CLVCK

11

BLEND

BLEND

BLEND

BLEND

12

PRML monitor 0

PRML monitor 1

PRML monitor 2

PRML monitor 3

13

Data PLL monitor 0

Data PLL monitor 1

Data PLL monitor 2

Data PLL monitor 3

14

RAMCON monitor 0

RAMCON monitor 1

RAMCOM monitor 2

RAMCON monitor 3

15

MIF monitor 0

MIF monitor 1

MIF monitor 2

MIF monitor 3

16

WOBREF monitor 0

WOBREF monitor 1

WOBREF monitor 2

WOBREF monitor 3

T*SEL can be set for each of pins TEST3, TEST2, TEST1, and TEST0, respectively.

68

Power Supply/GND Pin List
Pin Name
VDD

Pin No.
28,41,72,

I/O
PW

Function
DSP core power supply (1.5V)

PW

SDRAM power supply (3.3V)

130,146
VCCR

2,53

VCCRQ

8,26

VDDAA

159

SDRAM I/O power supply (3.3V)
PW

189,193,197
VCCA

99

1.5V system analog power supply (1.5V) WPLL1,2
1.5V system analog power supply (1.5V) PRML A/D Data PLL

PW

Analog power supply (3.3V):AUDIO / ADIP

108

Analog power supply (3.3V):PLL multiplication

139

Analog power supply (3.3V):LVDS

166

Analog power supply (3.3V):WPLL1,2

185

Analog power supply (3.3V):Servo A/D D/A

186

Analog power supply (3.3V):PRML A/D Data PLL

VCC

199

PW

Digital power supply (3.3V):PRML A/D Data PLL

VCCIO

7,32,52,

PW

DSP I/O power supply (3.3V)

58,75,88,
133,148,200
VSS

27,42,73,

GND

DSP core GND

131,145
VSSR

1,54

GND

SDRAM GND

VSSRQ

11,22

GND

SDRAM I/O GND

VSSA

104

GND

Analog GND:AUDIO / ADIP

105

Analog GND:PLL multiplication

144

Analog GND:LVDS

167

Analog GND:WPLL1,2

168

Analog GND:Servo A/D D/A

187,191,195
VSSAA

158

GND

1.5V system analog GND:WPLL1,2

VSSIO

6,31,51,

GND

DSP I/O GND

57,74,87,
132,147,201

69

Analog GND:PRML A/D Data PLL

Connected SDRAM I/O GND through 6,31pin

IC601 (R2S30202FP) : SPINDLE MOTOR AND 6CH ACTUATOR DRIVER

VM1
22

STTH

SPGS
23

24

ACTRST
25

LO+
27

VM3

LO28

26

TO-

GND

FO+
34

29

FO35

30

TL+
36

TO+

TL37

31

TLIN
38

GND

TOIN
39

5VCC

FOIN
40

32

LOIN
41

33

REF
42

Pin Layout

18

19

20

21

FG

EN1

EN2

16
COMMON

SLLIM

15
ACTFLG

17

14

TEST

13

9
SL1+

V

8
SL2-

W

7
GND

12

6
SL2+

U

5
VM2

11

4
SPLIM

10

3
SL2IN

SL1-

2

GND

1
SPIN

SL1IN

R2S3
0202FP

Package outline : 42 PIN POWER SSOP (42P9R-K)

Pin Function
No Pin name
1
SPIN
2
SL1IN
3
SL2IN
4
SPLIM
5
VM2
6
SL2+
7
GND
8
SL29
SL1+
10
SL111
GND
12
U
13
V
14
W
15 ACTFLG
16 COMMON
17
TEST
18
SLLIM
19
FG
20
EN1
21
EN2

Function
Spindle control voltage input
Slide control voltage input1
Slide control voltage input2
Input terminal for spindle current limit
Motor Power Supply 2(for Slide)
Slide non-inverted output2
GND
Slide inverted output2
Slide non-inverted output1
Slide inverted outptut1
GND
Motor drive output U
Motor drive output V
Motor drive output W
Pickup protect flag output
Motor common
Test terminal (*1)
Input terminal for slide current limit
Frequency generator output
Input terminal for enable 1
Input terminal for enable 2

No Pin name
42
REF
41
LOIN
40
FOIN
39
TOIN
38
TLIN
37
TL36
TL+
35
FO34
FO+
33
GND
32
5VCC
31
TO+
30
TO29
GND
28
LO27
LO+
26
VM3
25 ACTRST
24
STTH
23 SPGS
22
VM1

Function
Reference voltage input
Loading control input
Focus control voltage input
Tracking control voltage input
Tilt control voltage input
Tilt inverted output
Tilt non-inverted output
Focus inverted output
Focus non-inverted output
GND
5V Power Supply (for FS,TS,TL)
Tracking non-inverted output
Tracking inverted output
GND
Loading inverted outptut
Loading non-inverted output
Power Supply3(for Loading)
Pickup protect Reset (*2)
Reference voltage for spindle start up
Input terminal for gain select SPM
Motor Power Supply 1(for Spindle)

*1) Please connect 17terninal (TEST) to GND or open, for TEST.
*2) Please connect 25terminal(ACTRST) to 5VCC, When the Pick-up protection circuit is not used.

70

7-13.2V

STTH

V

OUTPUT Ron
1ohm

U
CLK

STARTER

+

SPLIM

TSD

Frequenc y
150KHz

PWM
CIRCUIT

FG(x3)
Reverse detect

6.4MHz

commutation

Commutation

p
cho
nt
urre
C
SWICHING
SIN

W

M
PW
p er

-

For SLIDE

SPIN

COMMON

VM1
CTL
DSP

GND

Current
sense
FG

BACK EMF
DETECTER

Current gain
3A/V
0.6A/V

DSP

For SPINDLE

SPM
V/V converter
REF
DSP

FOIN

DSP
VM2
7-13.2V

A MP

FO-

4.5-5.5V

GND

re
Cu r

nt

ch

PWM
CIRCUIT

er
opp

Current gain
0.88 A/V
CTL
Frequenc y
75KHz

Volt age gain
x 12

B TL

+

M

SL2IN

DSP

M
PW

A MP

TR-

DSP

re
Cu r

nt

ch

er
opp

Frequenc y
75KHz
PWM
CIRCUIT

CTL

Current gain
0.88 A/V

Volt age gain
x 12

B TL

TLIN

A MP

M
PW

Volt age gain
x 12

B TL

7-13.2V

4.5-5.5V

M

LO+ -

H Bridge

ENABLE

Gain Select
(SPM)

TEST mode

VM3

For /FO/TR/TILT

ACTRST

OUTPUT Ron
1.5ohm
FO+
DSP

5VCC
SL2-

SLIDE1
V/V converter
Current
sense

TRIN
SL1IN

TLDSP

OUTPUT Ron
1.5ohm
TR+
Current
sense
GND

+
SL1+

SL2+
OUTPUT Ron
1.8 ohm

DSP
DSP

OUTPUT Ron
1.5ohm
TL+
SLLIM

SLIDE2
V/V converter
DSP
STM

SL1OUTPUT Ron
1.8 ohm

Pickup Protect
ACTFLG

LO+

For LOADING

OUTPUT Ron
1.5ohm
TEST

GND
EN 1

EN 2

SPGS

DSP

DSP

Block Diagram

71

Input/Output circuit diagram

SPIN, SL1IN, SL2IN
LOIN

FOIN, TOIN,TLIN
TEST

5VCC

5VCC

REF

EN1, EN2

5VCC

5VCC

100

100

100

100

17k

35k

SPGS

ACTFLG,FG

ACTRST

(Temperature monitor)

COMMON
5VCC
VM1

5VCC

5VCC

5VCC

5VCC

10k

100

100

COMMON

25k

VM1, U, V, W

VM2, SL1+, SL1-, SL2+, SL2VM2

VM1

U

V

W

SL1+

5VCC, FO+, FO-, TO+, TO-, TL+, TL-

SL1-

SL2+

VM3, LO+, LO-

5VCC

FO+

72

FO-

TO+

TO-

SL2-

VM3

TL+

TL-

LO+

LO-

100

TROUBLESHOOTING GUIDE
(01) Laser Power Adjust (using RD Power/WR Power/Erase Power)
MPU & DSP
IC301

Pickup
Setting
FFC

Pin#175

AFE
IC101

#12

Front
Monitor

LD
Driver

FFC

#6 #10

IC102
pin#98

(02) High Frequency/NRZI skew Adjust
Pickup
FFC
17,18,20,21

MPU & DSP
IC301

LD
Driver

FFC

(03) Data Slice/Equalizer Boost/Raw Slice/ Equalizer Frequency Adjust

MPU & DSP
IC301

Pin#79

Pin#110

AFE
IC101

C137

Pin#203

Pin#21

(04) Circuit Offset Adjust
Pin#
87-90

Setting

FE:R102,C405

MPU & DSP
IC301

Pickup
FFC

#2

AFE
IC101

TE:R101,C101

#1
PE:R103,C406
#3

(05) Focus Amp. Adjust for DVD-Dual

DVD-Dual Disc

Setting

AFE
IC101
FE:R102,C405

Pin#
87-90

Pickup

FFC

#2

MPU & DSP
IC301

Focus:#34-35
R329,C335 #40

Driver
IC601

Slider FPC
Slider, #6,8-10

73

(06) Focus Amp. and Total Amp. Adjust
Setting

AFE
IC101

FE:R102,C405

MPU & DSP
IC301

All Disc
Pin#
87-90

Pickup

FFC

#2
PE:R103,C406
#3

Focus:#34-35
R329,
C335

Driver
IC601

#40

(07) Tracking Amp. Adjust
All Disc
Setting

AFE
IC101
TE:R101,C101

Pin#
87-90

Pickup

FFC

#1

MPU & DSP
IC301
R330
C336

Tracking
#30-31

Driver
IC601

#39

Slider FPC
Slider:#6,8-10

All Disc

(08) Servo Loop Gain Adjust
Setting
FE:R102,C405

MPU & DSP
IC301

#2
TE:R101,C101

R329,C335

R330,C336

74

AFE
IC101

#1

Pin#
87-90
FFC

Pickup

Focus:#34-35
Tracking:#30-31

#40

#39

Driver
IC601

Slider FPC
Slider:#6,8-10

(09) Unwritten Slice Level Adjust for DVD-RAM
DVD-RAM Disc
Setting

AFE
IC101

MPU & DSP
IC301

Pin#
80-81
FFC Pickup

SIGM:R148, C151
#100

#171

Slider FPC
Slider:#6, 8-10

Driver
IC601

(10) Focus Offset Adjust for DVD-ROM, CD-R/RW
DVD-ROM Disc

MPU & DSP
IC301

Pin#
87-90,80-81

AFE
IC101

Setting

FFC Pickup

FE:R102,C405
#2

Slider FPC
Slider:#6, 8-10

Driver
IC601

(11) Focus Offset Adjust for DVD-RAM (PID Amp)
DVD-RAM Disc

AFE
IC101

Setting

MPU & DSP
IC301

SIGM:R148,C151

Pin#
87-90,80-81
FFC Pickup

#100

Driver
IC601

Slider FPC
Slider:#6, 8-10

(12) Focus Offset Adjust for DVD-RAM (Data Error pulse)

Setting

MPU & DSP
IC301

AFE
IC101

C341,343

DVD-RAM Disc

Pin#
87-90,80-81
FFC Pickup

#67,68

Driver
IC601

Slider FPC
Slider:#6, 8-10

75

(13) Tilt Adjust for DVD-RAM

MPU & DSP
IC301

DVD-RAM Disc

Pin#

Setting

AFE 87-90,80-81 Pickup
IC101

TCE:R106, C106

FFC

#6
TIE:R107,C107

#7

Driver
IC601

Slider FPC
Slider:#6, 8-10

(14) Tilt Adjust for DVD-R/RW, DVD+R/RW, CD-R/RW
Setting

MPU & DSP
IC301

TE:R101, C101

AFE
IC101

DVD-R/RW Disc

Pin#
87-90, 80-81
FFC

#1

Pickup
TILT: #36-37

#181
TRD:R330,C336

Driver
IC601

#39

Tracking: #30-31
Slider FPC
Slider:#6,8-10

(15) Focus Deviation Adjust
Pin#
87-90,80-81 Pickup

Setting

AFE
IC101

FE:R102, C405

MPU & DSP
IC301

DVD-R/RW Disc

FFC

#2
FE:#34-35
FE
R329, C335

#40 Driver

IC601

(16) Focus Offset Adjust for DVD-R/RW, DVD+R/RW, CD-R/RW
Setting

MPU & DSP
IC301

TE:R101, C101

AFE
IC101

DVD-R/RW Disc

Pin#
87-90,80-81
FFC

Pickup

#1
#181
TRD:
R330, C336

76

Tracking:#30-31

Driver
#39
IC601

Slider FPC
Slider:#6, 8-10

(17) Lens Sensitivity Adjust

Pickup

MPU & DSP
IC301

#178

(Temp.Information)

FFC

putemp

(18) Spindle Offset Adjust
#211

MPU & DSP
IC301

Pin#
12-14

#1

Driver
IC601

SPD:R349, C349
#213

FG

Spindle

FFC

#19

(19) ADIP BPF/Read Timing Adjust for DVD+R/RW
Setting

MPU & DSP
WobSIG
IC301
#154

AFE
IC101

DVD+R Disc

Pin#
87-90,80-81
FFC

Pickup

#37

Driver
IC601

Slider FPC
Slider:#6, 8-10

(20) Focus Offset Adjust for DVD-R/RW, DVD+R/RW(DID)
Setting

MPU & DSP
IC301

DVD-R/RW Disc

AFE
IC101

C341, 343
#67,68

Pin#
87-90,80-81
FFC

Pickup

#39

Driver
IC601

Slider FPC
Slider:#6,8-10

77

(21) RTZ TimeOut Fail

AFE
IC101
Driver
IC601

Slider FPC
Slider:#6,8-10

Slider/
Spindle

#43
Spindle FFC

(22) Focus Servo/Tracking Servo Fail
Setting

AFE
IC101

FE:R102,C405

#2

MPU & DSP
IC301

All Disc

Pin#
87-90
FFC

Pickup

TE:R101,C101
#1
Focus:#34-35
Tracking:#30-31
PE:R103,C406
#3
R329,C335

R330, C336

78

FOD

#40

Driver
IC601
TRD

#39

Slider FPC
Slider:#6,8-10

Detail Error Code & Fail Analysis
1. Laser Power Initial Adjust
No.

Error Code
SSB Byte8,9

Contents of fail

Fail Analysis

Block Diagram

1

28xx
(Exchange
low/high byte)

LP Adjust NG.

1) Check Pickup FFC Connection.
2) Check solder of IC101circumference.
(pin#6, 10, 12, L150, L151)
3) Check solder of IC102.
4) Exchange Pickup(LDD, Front Monitor).
5) Exchange IC101(AFE).
6) Exchange IC301(MPU & DSP).

No.01

Byte8: xxh
Byte9: 28h

2

48xx

High Frequency Adjust NG.

1) Check Pickup FFC Connection.
2) Exchange Pickup (LDD part).
3) Exchange IC301(DSP).

No.02

3

5Exx

NRZi Skew Adjust NG.

1) Check Pickup FFC Connection
2) Exchange Pickup (LDD part).
3) Exchange IC301(MPU & DSP).

No.02

4

4C0x to 4C4x

Data Slice Adjust NG.

1) Check solder of IC101circumference.
(pin# 79, L150, L151)
2) Exchange IC101(AFE).
3) Exchange IC301(MPU & DSP).

No.03

5

4C5x to 4C7x

EQ Boost Adjust NG.

1) Check solder of IC101circumference.
(pin# 79, L150, L151)
2) Exchange IC101(AFE).
3) Exchange IC301(MPU & DSP).

6

4C80

RAW Slice Level Adjust NG.

1) Check solder of IC101circumference.
(pin# 79, L150, L151)
2) Exchange IC101(AFE).
3) Exchange IC301(MPU & DSP).

7

4CAx

EQ Auto Frequency Adjust NG. 1) Check solder of IC101circumference.
(pin# 79, L150, L151)
2) Exchange IC101(AFE).
3) Exchange IC301(MPU & DSP).

79

2. Adjusting Error during Disc Load Sequence (Lead in Error)
No.

Error Code
SSB Byte21,22

Contents of fail

Fail Analysis

Block Diagram

1

42xx

Circuit Offset Adjust NG.

1) Check Pickup FFC Connection.
2) Check solder of IC101circumference .
(pin#,1,2,3 pin#87-90,
FE_Servo: R102, C405
TE_Servo: R101, C101
PE_Servo: R103, C406)
3) Exchange IC101(AFE).
4) Exchange Pickup.
5) Exchange IC301(MPU & DSP).

No.04

2

452x

Focus Amp Adjust NG.
(DVD-DL Only)

1) Check DVD-Dual Disc.
2) Check Pickup FCC Connection.
3) Check solder of IC101circumference.
(pin#1,2,3 pin#87-90,
FE_Servo: R102, C405)
4) Check Slider FPC Connection.
5) Exchange IC101(AFE).
6) Exchange IC601(Driver).
7) Exchange IC301(MPU & DSP).

No.05

3

450x
451x
454x

Focus Amp Adjust NG.
Total Amp Adjust NG.

1) Check Pickup FFC Connection.
2) Check solder of IC101circumference.
(pin#1,2,3 pin#87-90,
FE_Servo: R102, C405
PE_Servo: R103, C406)
3) Exchange Pickup.
4) Exchange IC101(AFE).
5) Exchange IC301(MPU & DSP).

No.06

4

458x

Tracking Amp Adjust NG.

1) Check Pickup FFC Connection.
2) Exchange Pickup.
3) Check solder of IC101circumference.
(pin#1,2,3 pin#87-90,
TE_Servo: R101, C101)
4) Exchange IC101(AFE).
5) Exchange IC301(MPU & DSP).

No.07

5

47xx

Servo Loop Gain Adjust NG.

47XA: Disc Unmatch(Exchange Disc).
1) Check Pickup FFC Connection.
2) Exchange Pickup (Signal Noisy).
3) Check solder of IC101circumference.
(pin#1,2,3 pin#87-90,
FE_Servo: R102, C405
TE_Servo: R101, C101)
4) Exchange IC101(AFE).
5) Exchange IC301(MPU & DSP).

No.08

6

49xx

Unwritten Slice Level Adjust NG. 4906: RAM Disc NG (Exchange Disc).
(RAM Only)
1) Check solder of IC101circumference.
(pin#1,2,3 pin#87-90)
2) Exchange IC101(AFE).
3) Exchange IC301(MPU & DSP).

N0.09

80

No.

Error Code
Contents of fail
SSB Byte21,22

Fail Analysis

Block Diagram

7

4Axx

Focus Offset Adjust NG.
(DVD-ROM,CD-R/RW)

4A08: Disc Unmatch(Exchange Disc).
1) Check Pickup FFC Connection.
2) Exchange Pickup.
3) Exchange IC301(MPU & DSP).

No.10

8

4A5x
4A6x

Focus Offset Adjust NG.
(RAM Only for PID)

1) RAM Disc NG (Exchange RAM Disc)
2) Exchange Pickup
3) Exchange IC101(AFE)
4) Exchange IC301(MPU & DSP)

No.11

9

4A8x

Focus Offset Adjust NG.
(RAM Only for Data)

4A88: RAM Disc NG (Exchange RAM Disc).
1) Exchange Pickup.
2) Exchange IC101(AFE).
3) Exchange IC301(MPU & DSP)

No.12

10

4B0x

Tilt Adjust NG(RAM Only).

1) Check Pickup FFC Connection.
2) Exchange Pickup.
3) Check solder of IC101circumference.
(pin#6,7 R106, C106, R107, C107)
4) Exchange IC101(AFE).
5) Exchange IC301(MPU & DSP).

No.13

11

4B8x

Tilt Adjust NG(DVD-/+ R/RW).

1) Check Pickup FFC Connection.
2) Exchange Pickup.
3) Check solder of IC601 circumference.
4) Exchange IC601.
5) Check solder of IC301 circumference.
6) Exchange IC301
7) Exchange Slider Motor.

12

4CCx

Data Slice Adjust NG.
(RAM Only)

1) Exchange Pickup.
2) Exchange IC101(AFE).
3) Exchange IC301(MPU & DSP).

No.12

13

4Dxx

Focus Deviation Adjust NG.

1) Check Pickup FFC Connection.
2) Exchange Pickup.
3) Check solder of IC301circumference.
4) Exchange IC301(MPU & DSP).

No.15

14

182x
01xx

Home Position Adjust NG.
(DVD-SL Only)

1) Check FFC Connection.
2) Check Slider FPC Connection.
3) Exchange Slider Motor.
4) Check solder of IC101circumference.
5) Exchange IC101(AFE).

No.21

15

52xx

Focus Offset Adjust NG.
(DVD-R/RW, +R/RW)

1) Check Pickup FFC Connection.
2) Exchange Pickup.
3) Check solder of IC101circumference.
(pin#1,2,3 pin#87-90,
TE_Servo: R101, C101)
4) Exchange IC101(AFE).

No.16

No.14

81

No.

Error Code
SSB Byte21,22

Contents of fail

Fail Analysis

Block Diagram

16

54xx

DPP Amp Adjust NG.
(CD Disc Only)

1) Check Pickup FFC Connection.
2) Exchange Pickup.
3) Check solder of IC101circumference.
(pin#1,2,3 pin#87-90,
TE_Servo: R101, C101)
4) Exchange IC101(AFE).
5) Exchange IC301(MPU & DSP).

No.07

17

55xx

Lens Shift/ Tilt Adjust NG.
(CD Disc Only)

1) Check Pickup FFC Connection.
2) Exchange Pickup.
3) Check solder of IC601 circumference.
4) Exchange IC601.
5) Check solder of IC301 circumference.
6) Exchange IC301
7) Excahange Slider Motor

No.14

18

56xx

Focus Level Adjust NG.

1) Check Pickup FFC Connection.
2) Exchange Pickup.
3) Check solder of IC101circumference.
(pin#1,2,3 pin#87-90,
PE_Servo: R103, C406)
4) Exchange IC101(AFE).
5) Exchange IC301(MPU & DSP).

No.06

19

57xx

HFPE Amp/Gain Adjust NG.

1) Check Pickup FFC Connection.
2) Exchange Pickup.
3) Check solder of IC101circumference.
(pin#6,7 R106, C106, R107, C107)
4) Exchange IC101(AFE).
5) Exchange IC301(MPU & DSP).

No.13

20

58xx

Lens Sensitivity Adjust NG.

1) Check Pickup FFC Connection.
2) Exchange Pickup.
3) Check solder of IC301circumference.
4) Exchange IC301(MPU & DSP).

No.17

21

59xx

Spindle Offset Adjust NG.

1) Check Spindle FFC Connection.
2) Check solder of IC601circumference.
(pin#12-14)
3) Exchange IC601(Driver).
4) Exchange Spindle Motor.
5) Check solder of IC301circumference.
6) Exchange IC301(MPU & DSP).

No.18

82

No.

Error Code
SSB Byte21,22

Contents of fail

Fail Analysis

Block Diagram

22

5Axx

ADIP read timing Adjust NG.

5A01: Check DVD+R Disc (Exchange Disc) . No.19
1) Check Pickup FFC Connection.
2) Exchange Pickup.
3) Exchange IC101(AFE).
4) Exchange IC301(MPU & DSP).
5) Exchange IC601(Driver)

23

5Cxx

Signal Amp Error.

1) Check Pickup FFC Connection.
2) Exchange Pickup.
3) Check solder of IC101circumference.
(pin#1,2,3 pin#87-90,
PE_Servo: R103, C406)
4) Exchange IC101(AFE).
5) Exchange IC301(MPU & DSP).

No.06

24

5Dxx

Focus Offset Adjust NG.
(DVD-R/RW,+R/RW in Data)

1) Check Pickup FFC Connection.
2) Exchange Pickup.
3) Check solder of IC101circumference.
4) Exchange IC101.
5) Check solder of IC701circumference.
6) Exchange IC301(MPU & DSP).
7) Exchange Slider Motor.

No.20

83

3. Loading Sequence Error (Lead in Error)
No.

Error Code
SSB Byte21,22

Contents of fail

Fail Analysis

Block Diagram

1

2503,2504

RTZ Timeout(Sled Timeout).

1) Check Slider FPC Connection.
2) Check solder of IC601 circumference .
(pin#2-3, 6, 8-10)
3) Exchange IC601.
4) Exchange Slider Motor.

No.21

2

2020,2021

Focus Fail.

1) Check Pickup FFC Connection.
2) Exchange Pickup.
3) Check solder of IC601circumference.
4) Exchange IC601(Driver)
5) Check solder of IC101circumference.
(pin#1,2,3pin#87-90,
FE_Servo: R102, C405)
6) Exchange IC101(AFE).

No.22

3

2101,2102

Tracking Fail.

1) Check Pickup FFC Connection.
2) Exchange Pickup.
3) Check solder of IC601circumference.
4) Exchange IC601(Driver).
5) Check solder of IC101circumference.
(pin#1,2,3 pin#87-90,
TE_Servo: R101, C101).
6) Exchange IC101(AFE).

No.22

4

2000~2010

Spindle Fail.

1) Check Spindle FFC Connection.
2) Check solder of IC601circumference.
(pin#12-14)
3) Exchange IC601(Driver).
4) Exchange Spindle Motor.
5) Check solder of IC301circumference.
6) Exchange IC301(MPU & DSP).

No.18

84

JR6 Power Supply System Diagram

* Ver1.0 It created based on the PLT circuit diagram.
L601

Poly SW

12V

12V

SW701
miniSMDC150F/24
(Raychem)

DRV IC601 R2S30202FP
VM1 #22 Motor power supply 1(Spindle)
VM2 #05 Motor power supply 2(Slide)

S705 OPEN
Vso

CN101 P/U (LDD) Vso5V #29

S704 OPEN

L151

IC101 AFE(R2S35002)
VCC1 #08 Power (5.0V)
VCC2 #78 Power (5.0V)

5VR

IC102 LM258-D VCC #08
(ON SEMIconductor) OP-amp

CN101 P/U
OEIC(Vcc) #44 & FM(Vcc) #11

Poly SW

5V in

SW702
miniSMDC150F/24
(Raychem)

CN101 P/U Vsa5(Vcc) #15
S713 OPEN

Tr
Q631

Light Scribe Encoder Module Vcc 5V

UMC5N

Front PWB Led Control Vcc 5V

UMC5N

Tr
Q651

5V

Audio Output
Q901 Tr(UMC5N)/Q902 Tr(UMG4N)

S714 OPEN
5VP
L602
Torex Regurator
IC703 XCM403AA03SR
Vin=5.00 V
V0=2.80 V

IC601 DRV 5VCC(#32)/VM3(#26)

CN101 P/U LDD Vsl2.8(Vcc) #16

S708 OPEN

IC703
2.8V
REG

2.5(2.8)

S709 OPEN

IC703
3.3V
REG

IC101 AFE (R2S35002)
VDD1 #69 Power
VDD2 #91 Power
VDD3 #11 Power
VDD4 #59 Power
VDD5 #22 Power
SRVREF #82 Power

L150
3.3A

Pc=
W
Vin=5.00 V
V0=3.30 V

IC301 DSP (R8J32007)
VCCA #186 3.3V
VCCA #166 3.3V

3.3A

S715 OPEN
3.3A-2

R354

IC301 DSP (R8J32007)
Audio VCCA #99 3.3V

0
L710
3.3D

IC302 Flash Memory Fujitsu/Mcronics

IC301 DSP (R8J32007)

L305

Torex Regurator
IC701 XCM403AA02SR
Vin=2.80 V
V0=1.50 V
S706 OPEN

IC701
1.5V
REG

#58 VCCIO [DSP I/O]
#75 VCCIO [DSP I/O]
#88 VCCIO [DSP I/O]
#108 VCCA [Analog]
#133 VCCIO [DSP I/O]
#139 VCCA [Analog]
#148 VCCIO [DSP I/O]
#185 VCCA [Analog]
#200 VCCIO [DSP I/O]
#53 VCCR [SDRAM]
#52 VCCIO [DSP I/O]
#32 VCCIO [DSP I/O]
#26 VCCRQ [SDRAM I/O]
#08 VCCRQ [SDRAM I/O]
#07 VCCIO [DSP I/O]
#02 VCCR [SDRAM]

IC301 DSP (R8J32007)
#028 VCC Core Power]
#041 VDD [Core Power]
#072 VDD [Core Power]
#130 VDD [Core Power]
#146 VDD [Core Power]

L301

L304

IC301 DSP (R8J32007)

1.5D

#159 VDDAA [Analog Power]
S707 OPEN
1.5A

IC701
2.8V
REG

IC301 DSP (R8J32007)
#189 VDDAA [Analog Power]
#193 VDDAA [Analog Power]
#197 VDDAA [Analog Power]

Pc=
W
Vin=5.00 V
V0=2.80 V

85

86

PCB Poor Analysis - Check list
No

Circuit/IC

1

Power supply

2
3

(IC701)

4
5

(IC703)

6

Flash-ROM

7

(IC302)

8
9

DSP

10

(IC301)

Signal

Signal/Level

mesurement-point (IC-pin or Device)

Line-12V

12V

CN801-41

Line-5V

5V

CN801-44

reg-1.5V

1.5V

IC701-2

reg-2.8V

2.8V

IC703-5

reg-3.3V

3.3V

IC703-2

VDD : 3.3V

3.3V

37

CS

Active-Low

26

XRD

read-CK

28

VDD : 1.5V

1.5V

41, 28, 72, 130, 146, 159, 189, 193, 197

VCC(D) : 3.3V

3.3V

7, 32, 52, 58, 75, 88, 133, 148, 200, 199, 2, 53, 185,

11

VCC(A) : 3.3V

3.3V

186, 166, 99

12

Clock-34MHz

33.8688MHz

106, 107

13

MRSTB

(3.3V)High

202

139, 108, 8, 26

14

AFE

VCC : 5.0V

5.0V

8, 78

15

(IC101)

VDD : 3.3V

3.3V

22, 11, 91, 59, 69, 82

16

OP-amp

VCC : 5.0V

5.0V

8

5VCC : 5V

5V

32

VM3 : 5V

5V

26

19

VM1, 2 : 12V

12V

5, 22

20

REF : 1.65V

1.65V

42

(IC102)
17

7ch-DRV

18

(IC601)

21

VCC(FM) : 5.0V

5.0V

11

22

Pick-up

VCC(OEIC) : 5.0V

5.0V

44

23

VC(OEIC) : 2.1V

2.1V

43

24

VREF : 2.5V

2.5V

9

25

VSL25 : 2.8V

2.8V

16

26

VSA5 : 5.0V

5.0V

15

27

VSO : 5.0V

5.0V

29

* When there are twe or more power supply pins of LSI, it checks by one ramdom pin first.

87

HW Self- Diagnostic function
1. Self-Diagnostic Function by LED Blink.
• Basic operation: At JR6, MPU is included in DSP, MPU accesses each peripheral (inside, exterior) device,
and discover a defect by the ability of a read/write of data to be performed correctly. Since MPU operates by
the program with a built-in Flash-ROM, when abnormalities are in MPU, Flash-ROM, and these Data-Bus &
control signals, this self-diagnostic function cannot be used. In such a case, the case where LED does not
light up at all at the time of a power supply injection is almost the case.
• MPU: In DSP Flash-ROM (16Mb) is connected to the exterior Bus of MPU. Even if the MPU-Bus terminal of
Flash-ROM short-circuits, it becomes impossible for MPU to read the right program data from Flash-ROM,
and stops for this reason, turning on LED at all. On the other hand, the own poor device of DSP, and the
open state of IC-pin, when a defect does not influencing Bas of MPU, it can detect correctly and becomes
blink of LED according to those defects.
• DSP: DSP has ATAPI-IF, LDD-serial-IF, AFE-serial-IF, and an AFE control signal as Digital-IF. As AnalogIF, it has the slice circuit of RF signal from AFE, PLL, the objects ADC and DAC for SERVO, and ADC for
ADIP detection. Among these, own poor Digital of DSP, and AFE-serial-IF can detect by this self-diagnostic
function.
• AFE: Poor detection of AFE is restricted to detection of a limitation-item. Since the greater part of the
function is analog signal processing, AFE serves as a register in AFE, and a check, which accepts it, serial
IF in the logical digital examination from MPU. In addition, serial-IF for AFE control is performed via DSP.
This is writing in the Write command and setting data, and is automatically transmitted to the predetermined
register of DSP. Conversely, when it leads the register information on AFE, the read command can be
written in the predetermined register of DSP, and the value of an AFE register can be read by reading the
read register of DSP after that. Therefore, serial [between the poor register of AFE, and AFE and DSP],
when there is LED blink with poor AFE — the defect of IF or the defect of the register for AFE of DSP is
considered.
• Refer to the contrast table of the number of times of blink of LED, and a poor part.
• The self-diagnostic function by this LED blink is carried out in the state of a set without a PCB independent
or loading Disc.

88

2. LED does not blink at all at the time of a power supply injection. Eject-SW does not react.
(1) Is it normal to the exterior Bus (Data-Bus, Address-Bus, control signal system) of MPU?
Viewing — check: -- a short circuit, opening, etc.
• The device connected to the exterior Bus of MPU in DSP, and its signal list
Peripheral device

Flash -ROM

[Bus/Signal]

(IC302)

Address

A1~A20

Data

D0~D15

CS*

CS0B

WCK

WR

RCK

RD

=> It repairs, when abnormalities are discovered.
(2) Does the power supply circuit operate normally?
External input 12V, external input 5V, regulator 3.3V, regulator 2.8V, and regulator 1.5V
=>When the abnormalities are discovered, an external power supply, a power supply cable, and Regulator
IC are exchanged.
=> Since a problem is in a load side when not improving, even if it exchanges the above, and attached sheet
JR6 power-supply system figure is made reference, and poor portions, such as a short circuit of a power
supply part, are found out and fixed.
(3) Is the clock of MPU in DSP oscillated correctly?
Checked the ceramic oscillation element’s X301 both-ends and DSP(106)(107) 33.87MHz oscillating.
=> When 3.3V power supply is correctly supplied to DSP and the clock is not oscillating correctly, it is the
defect of MPU, or an oscillation element defect, and part exchange is performed in order of DSP and
X301.
(4) The defect of Flash-ROM
Although the clock of DSP is oscillating correctly and the power supply circuit is also outputting normal
voltage, when LED does not blink at all at the time of a power supply injection and Eject-SW does not react,
either, poor Flash-ROM is the most doubtful.
=> Flash-ROM (IC302) are exchanged.
Note: Before Flash-ROM exchange, the CS signals of the external device of MPU in DSP connection, an
Address signal, and a Data signal are observed on a waveform level, and since the but most amount of work
and the special knowledge which can raise the discovery accuracy of a poor part are necessities,
recommendation is impossible.
(5) Even if it performs the above-mentioned repair, when not improving, the disconnection and the short circuit
which cannot be discovered, can be considered in viewing of PCB. Moreover, partial breakage (although a
clock is oscillated, somewhere in insides do not operate.) of DSP can be considered.
=> When not improving above, the possibility that a PCB pattern is faulty is high, and judges repair to be
difficult.

89

3. Motor, Abnormalities in Actuator System
The drive circuit of a motor & actuator consists of the three ICs IC601(R2S30202FP). The work of each IC is
as follows.
(1) IC601(R2S30202FP) : 7ch driver
Spindle motor driver: 180° audio drive Type, an analog input, a PWM drive, a Vm=12V.
Stepping motor driver X2: analog input, a PWM drive (differential), a Vm=12V
Loading motor driver: Input/Output PWM drive, Vm=5V.
Focus actuator driver: analog input / output (differential), a Vm=5V
Tracking actuator driver: analog input / output (differential), Vm=5V
Tilt actuator driver : analog input/output (differential), Vm=5V.
A motor & actuator and its correspondence pin
Signal/CH

SPDL-MT

STEP-MT

Load-MT

Focus-ACT

Track-ACT

Tilt-ACT

Input

(1)SPIN

(2)SL1IN
(3)SL2IN

(41)LOIN

(40)FOIN

(39)TOIN

(38)TLIN

(34)FO+
(35)FO-

(31)TO+
(30)TO-

(36)TL+
(37)TL-

Reference
Output

(42)REF 1.65V
(12)U
(13)V
(14)W

(6)SL2+
(8)SL2(9)SL1+
(10)SL1-

(27)LO+
(28)LO-

A control mode setup by the control terminal
EN1(20)
Low
Low
High
High

90

EN2(21)
Low
High
Low
High

SPDL
off
off
on
on

SLED
off
on
on
on

Load
off
on
off
off

Focus/Track/Tilt
off
off
on
on

BLOCK DIAGRAM

Flash-ROM
(2MByte)
MBM29LV160BE
or Equivalent
(FUJITSU)

OPU:HOP-7632TS
(HITACHI ME)
Disc

Interface
connector

Loading
motor

Analog Front End
R2S35002

PU
Disc
motor
Unit
mechanism

Slide
motor

100pin-TQTF
(RENESAS)

DVD/CD DSP
(DVD/CD/Servo/ATAPI)
R8J32007FP
256pin LQFP
(RENESAS)
DVD-codec
CD-codec
LPP/ADIP decorder
Servo DSP
ATAPI-IF
Microprocessor

7ch-Driver
R2S30202FP
SPDL/SLED/Fo/Tr/Ti/LD
(RENESAS)

Analog
audio

Host IDE

Tray Detect
SW

Device
configuration
jumper
MASTER
SLAVE
CSEL

Eject
SW

Limit
SW
LED

3.3V
2.8V

3.3V/2.8V Reg.IC
XCM403AA03SR
(TOREX)
RST

1.5V

12V
GND
5V

2.8V/1.5V Reg.IC
XCM403AA02SR
(TOREX)
RST

91



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