Lg Gsa 4165B Users Manual
GSA-4165B GSA-4165 Manual de Servicio
GSA-4165B to the manual 51c64404-3991-4947-9402-0817f9056704
2015-01-26
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Super Multi DVD Drive SERVICE MANUAL MODEL: GSA-4165B/ GSA-4167B/ GSA-4168B P/NO : 3828HS1047G August 2005 Printed in Korea MODEL : GSA-4165B/GSA-4167B/GSA-4168B TABLE OF CONTENTS INTRODUCTION .......................................................................................................................................................................3 FEATURES............................................................................................................................................................................3~5 SPECIFICATIONS.................................................................................................................................................................6~9 LOCATION OF CUSTOMER CONTROLS .......................................................................................................................10~11 DISASSEMBLY .................................................................................................................................................................12~13 1. CABINET and CIRCUIT BOARD DISASSEMBLY ..........................................................................................................12 1-1. Bottom Chassis ..........................................................................................................................................................12 1-2. Front Bezel Assy ........................................................................................................................................................12 1-3. Cabinet and Main Circuit Board .................................................................................................................................12 2. MECHANISM ASSY DISASSEMBLY..............................................................................................................................12 2-1. Pick-up Unit................................................................................................................................................................12 2-2. Pick-up ......................................................................................................................................................................13 EXPLODED VIEW .............................................................................................................................................................14~15 MECHANICAL REPLACEMENT PARTS LIST ................................................................................................................16~18 GLOSSARY .............................................................................................................................................................................19 THE DIFFERENCES OF CD-R/CD-RW DISCS AND GENERAL CD-ROM.....................................................................20~26 1. Recording Layer ..............................................................................................................................................................20 2. Disc Specification ............................................................................................................................................................20 3. Disc Materials ..................................................................................................................................................................21 4. Reading Process of Optical Disc .....................................................................................................................................22 5. Writing Process of CD-R Disc .........................................................................................................................................23 6. Writing Process of CD-RW Disc ......................................................................................................................................23 7. Organization of the PCA, PMA and Lead-in Area ...........................................................................................................24 8. Function of PCA and PMA area ......................................................................................................................................25 9. OPC and ROPC ..............................................................................................................................................................25 10. Writing Process of DISC................................................................................................................................................26 THE DIFFERENCES OF DVD-R/RW, DVD+R/RW DISCS AND DVD-ROM....................................................................27~35 1. Recording Layer ..............................................................................................................................................................27 2. Disc Specification ............................................................................................................................................................28 3. Disc Materials ..................................................................................................................................................................28 4. Writing Pulse Waveform of DVD+R.................................................................................................................................31 5. Writing Pulse Waveform DVD+RW .................................................................................................................................33 6. Organization of Inner Drive Area, Outer Drive Area, Lead-in Zone and Lead-out Zone .................................................34 LightScribe MEDIA...........................................................................................................................................................36~39 1. LightScribe Media............................................................................................................................................................36 2. Hardware Block Diagram of LightScribe Label Printing...................................................................................................37 3. MD Assy For LightScribe.................................................................................................................................................38 4. Optical Encoder Assy ......................................................................................................................................................39 DVD & CD DATA PROCESSING......................................................................................................................................40~43 1. Data Processing Flow......................................................................................................................................................40 2. Copy Protection and Regional Code Management Block ...............................................................................................41 3. About Prevention the DVD-ROM from to be copy ...........................................................................................................42 4. About the DVD-ROM Regional Code ..............................................................................................................................43 INTERNAL STRUCTURE OF THE PICK-UP....................................................................................................................44~46 1. Block Diagram of the Pick-up(HOP-7632TS) ..................................................................................................................44 2. Pick up Pin Assignment...................................................................................................................................................45 3. Signal detection of the P/U ..............................................................................................................................................46 DESCRIPTION OF CIRCUIT.............................................................................................................................................47~53 1. ALPC Circuit ....................................................................................................................................................................47 2. Focus Circuit....................................................................................................................................................................49 3. Tracking & Sled Circuit ....................................................................................................................................................50 4. Spindle Circuit .................................................................................................................................................................53 MAJOR IC INTERNAL BLOCK DIAGRAM AND PIN DESCRIPTION.............................................................................55~72 TROUBLESHOOTING GUIDE ..........................................................................................................................................73~90 BLOCK DIAGRAM ..................................................................................................................................................................91 PRINTED CIRCUIT BOARD DIAGRAM ...........................................................................................................................92~96 ELECTRICAL REPLACEMENT PARTS LIST ........................................................................................................................97 CAUTION - INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM. INTRODUCTION This service manual provides a variety of service information. It contains the mechanical structure of the Super Multi DVD Drive and the electronic circuits in schematic form. This Super Multi DVD Drive was manufactured and assembled under our strict quality control standards and meets or exceeds industry specifications and standards. This Super Multi DVD drive is an internal drive unit designed for use with IBM PC, HP Vectra, or compatible computer. It can write as much as 700 Mbytes of digital data into CD-R/RW disc, and can read as much as 700 Mbytes of digital data stored in a CD-ROM/R/RW disc. It can write as much as 4.7Gbytes of digital data into DVD-R/RW/RAM/+R/+RW disc, and can read as much as 4.7Gbytes of digital data stored in a DVD-ROM/R/RW/RAM/+R/+RW disc. It can write as much as 8.5Gbytes of digital data into DVD+R DL/DVD-R DL disc, and can read as much as 8.5Gbytes of digital data stored in a DVD-ROM DL/+R DL/-R DL disc. This Super Multi DVD Drive can easily meet the upcoming MPC level 3 specification, and its Enhanced Intelligent Device Electronics (E-IDE) and ATAPI interface allows Plug and play integration in the majority of today’s PCs without the need of an additional interface card. 1. Support feature and writable disc *) Indicated write-in speed is a value at the time of the fastest operation. Light Scribe CD-R CD-RW DVD-R DVD-RW DVD-R DL DVD+R DVD+RW DVD+R DL DVD-RAM GSA x 48x write 32x write 16x write 4x or 6x write 4x write 16x write 8x write 4x or 6x write 5x write GMA x 48x write 32x write 16x write 4x or 6x write 4x write read only read only read only 5x write G*A-4165B GWA x 48x write 32x write 16x write 4x or 6x write 4x write 16x write 8x write 4x or 6x write read only GRA x 48x write 32x write read only read only read only 16x write 8x write 4x or 6x write read only Light Scribe CD-R CD-RW DVD-R DVD-RW DVD-R DL DVD+R DVD+RW DVD+R DL DVD-RAM GSA x 48x write 32x write 16x write 6x write 4x write 16x write 8x write 6x write 5x write GMA x 48x write 32x write 16x write 6x write 4x write read only read only read only 5x write G*A-4167B GWA x 48x write 32x write 16x write 6x write 4x write 16x write 8x write 6x write read only GRA x 48x write 32x write read only read only read only 16x write 8x write 6x write read only GCA x 48x write 32x write 16x write 6x write 4x write read only read only read only read only GDA x read only read only 16x write 6x write 4x write read only read only read only 5x write Light Scribe CD-R CD-RW DVD-R DVD-RW DVD-R DL DVD+R DVD+RW DVD+R DL DVD-RAM GSA O 48x write 32x write 16x write 6x write 4x write 16x write 8x write 6x write 5x write GMA O 48x write 32x write 16x write 6x write 4x write read only read only read only 5x write G*A-4168B GWA O 48x write 32x write 16x write 6x write 4x write 16x write 8x write 6x write read only GRA O 48x write 32x write read only read only read only 16x write 8x write 6x write read only GCA O 48x write 32x write 16x write 6x write 4x write read only read only read only read only GDA O read only read only 16x write 6x write 4x write read only read only read only 5x write GCA GDA x x 48x write read only 32x write read only 16x write 16x write 4x or 6x write 4x or 6x write 4x write 4x write read only read only read only read only read only read only read only 5x write 3 FEATURES 1 General 1) Enhanced IDE (ATAPI) interface. 2) Internal Half-height Drive. 3) CD-R/RW, DVD-R/-R DL(Dual Layer)/-RW/RAM/+R/+R DL(Double Layer)/+RW read and write compatible CD Family and DVD-ROM read compatible. 4) Buffer Under-run prevention function embedded. 5) 2MB buffer memory. 6) Power loading and power eject of a disc. Bare media loading. 7) MTBF : 100,000 POH 8) Vertical and Horizontal installable. 2. Supported disc formats 1) Reads data in each DVD-ROM, DVD-R(Ver. 2.0 for Authoring) and DVD-RAM(Ver.1.0) 2) Reads and writes in each DVD-R(Ver. 2.0 for General), DVD-R DL(Dual Layer), DVD-RW, DVDRAM(Ver.2.2), DVD+R, DVD+R DL(Double Layer) and DVD+RW 3) Reads data in each CD-ROM, CD-ROM XA, CD-I, Video CD, CD-Extra and CD-Text 4) Reads data in Photo CD (Single and Multi session) 5) Reads standard CD-DA 6) Support to read Super Audio CD(Compatible layer in Hybrid type) 7) Reads and writes CD-R discs conforming to “Orange Book Part 2” 8) Reads and writes CD-RW discs conforming to “Orange Book Part 3” 9) Reads DVD-RAM with CPRM and DVD-RW with CPRM 3. Supported write method 1) DVD-R: ..................Disc at Once and Incremental Recording 2) DVD-R DL .............Disc at Once, incremental Recording and Layer jump recording 3) DVD-RW:...............Disc at Once, Incremental Recording and Restricted Overwrite 4) DVD-RAM:.............Random Write 5) DVD+R: .................Sequential Recording 6) DVD+R DL: ...........Sequential Recording 7) DVD+RW:..............Random Write 8) CD-R/RW: .............Disc at Once, Session at Once, Track at Once and Packet Write 4 4. Performance 1) Average access time: (1/3 stroke) 2) Write speed: DVD-ROM CD-ROM DVD-R DVD-R DL DVD-RW DVD-RAM DVD+R DVD+R DL DVD+RW CD-R CD-RW 3) Read speed: DVD-R/RW/ROM/ROM-Dual layer DVD-R DL DVD-RAM (Ver.1.0/2.2) DVD-Video(CSS Compliant Disc) DVD+R/+RW DVD+R DL CD-R/RW/ROM CD-DA (DAE) 80mm CD 4) Sustained Transfer rate: DVD-ROM CD-ROM 5) Burst Transfer rate: 145 ms 125 ms 2x, 4x CLV, 8x ZCLV, 16x PCAV 2x, 4x CLV 1x, 2x, 4x, 6x CLV 2x, 3x ZCLV (Ver.2.2), 3x-5x PCAV(Ver.2.2) 2.4x, 4x CLV, 8x ZCLV, 12x, 16x PCAV 2.4x, 4x, 6x CLV 2.4x, 4x CLV, 8x ZCLV 4x, 8x, 16x CLV, 24x, 32x, 40x, 48x ZCLV 4x, 10x, 16x CLV, 24x, 32x ZCLV (High Speed: 10x, Ultra Speed: 16x, 24x, 32x) 10x / 8x / 16x / 12x max. 8x max. 2x / 2x, 3x ZCLV, 3x-5x PCAV 8x max. (Single/Dual layer) 10x / 8x max. 8x max. 48x/40x/48x max. 40x max. 16x max. 22.16 Mbytes/s (16x) max. 7,200 kB/s (48x) max. Ultra DMA Mode2 Multi word DMA Mode2, PIO Mode 4 6) Multimedia MPC-3 compliant 5. Audio 1) 16 bit digital data output through ATA interface 2) Software Volume Control 3) Equipped with audio line output for audio CD playback *Definition Transfer Rate: .........1x (DVD) = 1.385 Mbytes/s ..........1x (CD) = 150 kB/s Mbytes/s = 106 bytes/s, ................kB/s = 210 bytes/s Capacity: .................MB = 220 bytes, .............................kB = 210 bytes 5 SPECIFICATIONS 1. SYSTEM REQUIREMENTS -CPU: IBM Compatible Pentium 4 2.4GHz (or faster) (For High speed, 2.4GHz or faster recommended.) -128MB Memory or greater 2. SUPPORTING OPERATING SYSTEM * Operating System Windows Millennium Edition (Me) Window 2000 Professional Window XP Home Edition, Professional 2.1 Applicable disc formats DVD ............................DVD-ROM: DVD-R DL: DVD-R: DVD-RW: DVD-RAM: DVD+R: DVD+R DL: DVD+RW: * Recording tool (1) Nero(Ahead) (2) In CD(Ahead) (3) Power Producer Gold (Cyber Link) 4.7GB (Single Layer) 8.5GB (Dual Layer) 8.5GB 4.7GB (Ver.2.0 for Authoring : read only) 4.7GB (Ver.2.0 for General: read & write) 4.7GB (Ver.1.2) 2.6GB/side (Ver.1.0) 1.46GB/side, 4.7GB/side (Ver.2.2) 4.7GB 8.5GB 4.7GB CD...............................CD-ROM Mode-1 data disc CD-ROM Mode-2 data disc CD-ROM XA, CD-I, Photo-CD Multi-Session, Video CD CD-Audio Disc Mixed mode CD-ROM disc (data and audio) CD-Extra CD-Text CD-R (Conforming to “Orange Book Part2”: read & write) CD-RW (Conforming to “Orange Book Part3”: read & write) 2.2 Writing method (1) DVD-R/RW ...........................Disc at Once Incremental Recording Restricted Overwrite (DVD-RW only) (2) DVD-R DL ............................Disc at Once Incremental Recording Layer jump Recording (3) DVD-RAM/+RW ...................Random Write (4) DVD+R .................................Sequential Recording (5) DVD+R DL ...........................Sequential Recording (6) CD-R/RW .............................Disc at Once (DAO) Session at Once (SAO) Track at Once (TAO) Packet Write 2.3 Disc diameter ..............................................120mm 80mm (Horizontal only) 6 2.4 Data capacity • User Data/Block DVD-ROM/R/RW/RAM/+R/+RW ......2,048 bytes/block CD (Yellow Book) ..........................................2,048 bytes/block(Mode 1 & Mode 2 Form 1) 2,336 bytes/block (Mode 2) 2,328 bytes/block (Mode 2 Form 2) 2,352 bytes/block (CD-DA) 2.5 RPC (Regional Playback Control) Phase2, No Region 3. DRIVE PERFORMANCE 3.1 Host interface ..................................................................X3T13 ATA/ATAPI5/1321D INF-8090i Rev.5.3 3.2 Read/Write & Rotational speedDVD-R ...............................................................2x, 4x(CLV), 8x(ZCLV), 16x(PCAV) DVD-R DL .........................................................2x, 4x(CLV) DVD-RW............................................................1x, 2x, 4x, 6x(CLV) DVD-RAM ...............................Ver. 2.2 .............2x, 3x(ZCLV), 3x-5x(PCAV) DVD+R ..............................................................2.4x, 4x(CLV), 8x, 12x, 16x(PCAV) DVD+R DL ........................................................2.4x, 4x, 6x(CLV) DVD+RW...........................................................2.4x, 4x(CLV), 8x(ZCLV) CD-R .................................................................4x, 8x, 16x(CLV), 24x, 32x, 40x, 48x(ZCLV) CD-RW ..............................................................4x, 10x,16x(CLV), 24x, 32x (ZCLV) (High Speed: 10x, Ultra Speed: 16x, 24x, 32x) DVD-ROM...............................Single layer .......6.7x - 16x (CAV), Approx. 9,420 r/min ................................................Dual layer .........5.0x - 12x (CAV), Approx. 7,770 r/min DVD-R DL ...............................8.5GB ...............3.3x - 8x (CAV), Approx 5,180r/min DVD-Video (CSS) .............................................3.3x - 8x (CAV), Approx. 5,180 r/min DVD-R.....................................4.7GB ...............4.2x - 10x (CAV), Approx. 5,890 r/min DVD-RW .................................4.7GB ...............3.3x - 8x (CAV), Approx. 4,720 r/min DVD-RAM ...............................Ver. 1.0/ 2.2 ......2x/ 2x, 3x (ZCLV)* 3x-5x (PCAV)* DVD+R....................................4.7GB ...............4.2x - 10x (CAV), Approx. 5,890 r/min DVD+R DL ..............................8.5GB ...............3.3x - 8x (CAV), Approx. 5,180 r/min DVD+RW ................................4.7GB ...............3.3x - 8x (CAV), Approx. 4,720 r/min CD-R/ROM, CD-I / Video ........(1.2m/s) ............20x - 48x (CAV), Approx. 9,540 r/min CD-RW ...................................(1.2m/s) ...........16.7x - 40x (CAV), Approx. 8,100 r/min CD-DA (DAE)..........................(1.2m/s) ...........16.7x - 40x (CAV), Approx. 8,100 r/min CD-DA (Audio out) ..................(1.2m/s) ...........4.0x - 10x (CAV), Approx. 2,030 r/min * Rotational speed (CLV, ZCLV) DVD-R/RW/ROM, +R/RW ...............................1x: Approx. 1,390(Inside) - 580 r/min(Outside) DVD-RAM................................Ver. 1.0 ...........1x: Approx. 2,390(Inside) - 1,010 r/min(Outside) Ver. 2.2 ...........2x: Approx. 3,250(Inside) - 1,380 r/min(Outside) CD-R/RW/ROM ...............................................1x: Approx. 500(Inside) - 210 r/min(Outside) 7 3.3 Data transfer rate 3.3.1 Sustained transfer rate DVD-R.........................2.77, 5.54, 5.44-11.08 Mbytes/s..................................2x, 4xCLV, 8x ZCLV 9.14-22.16 Mbytes/s....................................................................16x PCAV DVD-R DL ...................2.77, 5.54 Mbytes/s....................................................................2x, 4x CLV DVD-RW ...............1.385, 2.77, 5.54, 8.31 Mbytes/s ...................................1x, 2x, 4x, 6x CLV DVD-RAM (Ver.2.2): ...2.77, 4.15, 4.15-6.925 Mbytes/s (w/o Verify) .......2x, 3x ZCLV, 3-5x PCAV DVD+R ........................3.32, 5.54, 8.31-11.08 Mbytes/s..............................2.4x, 4x CLV, 8x ZCLV 8.31-16.62, 9.14-22.16 Mbytes/s ..............................12x ZCLV, 16x PCAV DVD+R DL ..................3.32, 5.54, 8.31 Mbytes/s ..................................................2.4x, 4x, 6x CLV DVD+RW.....................3.32, 5.54, 8.31-11.08 Mbytes/s .............................2.4x, 4x CLV, 8x ZCAV CD-R ...........................600, 1,200, 2,400, 2,400-3,600, 2,400-4,800, 2,400-6,000, 2,400-7,200 kB/s (Mode-1) ..........................................4x, 8x, 16x CLV 24x, 32x, 40x, 48x ZCLV CD-RW........................600, 1500, 2,400, 2,400- 3,600, 2,400-4,800 kB/s (Mode-1) ..........................................4x, 10x, 16x CLV, 24x, 32x ZCLV DVD-ROM ...................Single layer ....9.28 - 22.16 Mbytes/s ...........................................16x max. ....................................Dual layer.......6.86 - 16.62 Mbytes/s ...........................................12x max. DVD-R ................................................5.73 - 13.85 Mbytes/s ............................................10x max. DVD-R DL...........................................4.58 - 11.08 Mbytes/s ..............................................8x max. DVD-RW .............................................4.58 - 11.08 Mbytes/s .............................................8x max. DVD-RAM ...................Ver. 1.0 ..........2.77 Mbytes/s .........................................................2x ZCLV ....................................Ver. 2.2 ..........2.77, 4.155,4.155-6.93 Mbytes/s ..2x, 3x ZCLV, 3-5x PCAV DVD+R ...............................................5.73 - 13.85 Mbytes/s ............................................10x max. DVD+R DL..........................................4.58 - 11.08 Mbytes/s ..............................................8x max. DVD+RW ............................................4.58 - 11.08 Mbytes/s .............................................8x max. CD-R/ROM .........................................3,000 - 7,200 kB/s..................................................48x max. CD-RW........................ ......................2,500 - 6,000 kB/s..................................................40x max. CD-DA (DAE)......................................2,500 - 6,000 kB/s..................................................40x max. 3.3.2 Burst transfer rate Ultra DMA Mode 2 ..............................33.3 Mbytes/s max. Multiword DMA Mode 2 ......................16.6 Mbytes/s max. PIO Mode 4 ........................................16.6 Mbytes/s max. 3.4 Access time (1/3 stroke) DVD-ROM...........................................145 ms Typ.* (Note 1) DVD-RAM (Ver.2.2) ............................165 ms Typ. CD-ROM .............................................125ms Typ. (Note 1) Note : 1) Average random access time is the typcal value of more than 50 times including latency and error correction time. Test Disc : DVD : ALMEDIO TDV-520 / TDR-820 CD : ALMEDIO TCDR-701 / HITACHI HCD-1 *) Typical value defines a measured value in normal temperature (20 deg.C.) and horizontal position. 3.5 Data error rate (Measured with 5 retries maximum) DVD-R/RW/ROM/RAM ..................................<10-12 DVD+R/+RW..................................................<10-12 CD-R/RW/ROM..............................................<10-12 (Mode-1) <10-9 (Mode-2) Condition : It is assumed that the worst case raw error rate of the disc is 10-3 3.6 Data buffer capacity .......................................................2 Mbytes 8 4. Quality and Reliability 4.1 MTBF..................................................100,000 Power On Hours(Consecutive/Cumulative POH) Assumption : ..........................Used in a normall office environment at room temperature. -POH per year.........................3,000 -ON/OFF cycles per year........600 -Operating duty cycle..............20% of power on time (Seek: 5% of operating time) 4.2 Tray cycle test...................................30,000 times No degeneration in the mechanical part after test 4.3 Actuator mechanism ........................1,000,000 full stroke seek 4.4 MTTR (Mean Time To Repair) ...........0.5 h 4.5 Component life .................................5 years or 2,000 h of Laser radiating time Assumption : ..........................Used in a normall office environment. 5. POWER REQUIREMENTS 5.1 Source voltage +5V + 5% tolerance, less than 100 mVp-p Ripple voltage +12V + 10% tolerance, less than 100 mVp-p Ripple voltage 5.2 Current Idle (Hold track state)..............+5V DC .................0.9A typ. .........< 1.0 A max. +12V DC ...............0.5A typ...........< 1.0 A max. Write (Active) ..........................+5V DC .................1.3A typ. .........< 1.5 A max. +12V DC................0.9A typ. .........< 1.5 A max. Read (Active) ..........................+5V DC .................1.0A typ. .........< 1.5 A max. +12V DC................0.9A typ. .........< 1.5 A max. Seek (Acess) ..........................+5V DC .................1.0A typ. .........< 1.5 A max. +12V DC ...............1.2A typ. .........< 2.0 A max. 5.3 Standby Sleep mode (No disc) .............1.1 W typ. 1.3 W max. 6. AUDIO PERFORMANCE Output Level (1kHz, 0dB) ........................................................0.7 Vrms typical Frequency Response ..............................................................+/-3dB (20 to 20,000Hz) Signal to Noise Ratio...............................................................80 dB min. with IHF A and LPF 20 kHz THD (1kHz, 0dB) .....................................................................0.10% max. with LPF 20 kHz Channel separation(10kHz).....................................................65 dB min. Condition: ................................................................................Load inpedance : 10 kohms 7. Acoustic noise Less than 50dB, A scale, at 0.5 m away from the drive Note : 1. Disc : Less than imbalance 0.3 x 10-4 Nm 2. Installation : Horizontal 3. Ambient temperature : Normal temperature 4. Except loading, unloading and seek 8. Dimensions External dimensions (W x H xD) Front bezel (WxHxD) 146 x 41.3 x 165mm(without Bezel) 148 x 42 x 5 mm 9. Mass .................................................Approx. 0.77+/-0.03 kg * 9 Which is not provided with Circuit Diagram of this model. Please Contact the friendly staff of LG Service Care at: Website http: //www.LGEservice.com LOCATION OF CUSTOMER CONTROLS Front Panel Emergency Eject Hole Disc Tray Stop/Eject Button Drive Activity Indicators 1. Disc tray This is the tray for the disc. Place the disc on the ejected disc tray, then lightly push the tray (or push the eject button) and the CD will be loaded. NOTE: Don’t pull out or push in the disc tray forcibly. This might cause damage to the loading section of the drive. 3. Emergency Eject Hole Insert a paper clip here to eject the Disc tray manually or when there is no power. 4. Drive activity indicator Two colored LED is used to indicate the operation of the Drive. 2. Stop/Eject button This button is pressed to open the CD tray. This button works only when power is supplied to the drive. 10 Rear Panel IDE Interface Connector Analog Audio Output Connector Jumper Connector Power Connector Digital Audio Output Connector NOTE: The actual drive may be different from this design. 1. Power Connector Connects to the power supply (5-and 12-V DC) of the host computer. NOTE : Be careful to connect with the proper polarity. Connecting the wrong way may damage the system (and is not guaranteed). Usually this connector can only be attached one-way. 2. IDE Interface Connector Connect to the IDE (Integrated Device Electronics) Interface using a 40-pin flat IDE cable. NOTE : Do not connect or disconnect the cable when the power is on, as this could cause a short circuit and damage the system. Always turn the power OFF when connecting or disconnecting the cable. 11 3. Jumper Connector This jumper determines whether the drive is configured as a master or slave. Changing the master-slave configuration takes effect after power-on reset. 4. Analog Audio Output Connector Provides output to a sound card (analog signal). Generally you need this to play a regular audio CD. 5. Digital Audio Output Connector This connector is not supported. DISASSEMBLY 1. CABINET and CIRCUIT BOARD DISASSEMBLY 1-1. Bottom Chassis A. Release 4 screws (A) and remove the Bottom Chassis in the direction of arrow (1). (See Fig.1-1) 1-3. Cabinet and Main Circuit Board A. Remove the Cabinet in the direction of arrow (4). (See Fig. 1-3) B. When the CD tray has been opened completely, lift 2 points (a) and remove the CD tray while drawing out simultaneously. C. Remove the Soldering of the LD- and LD+ (b) for the Loading Motor, and then remove the Main Circuit Board. D. At this time, be careful not to damage the 4 connectors of the Main Circuit Board. Cabinet (1) (4) (a) (A) Bottom Chassis (5) (A) (A) (A) Fig. 1-1 Main Circuit Board 1-2. Front Bezel Assy A. Insert and press a rod in the Emergency Eject Hole and then the CD Tray will open in the direction of arrow (2). B. Remove the Tray Door in the direction of arrow (3) by pushing the stoppers forward. C. Release 3 stoppers and remove the Front Bezel Assy. (b) Fig. 1-3 2. MECHANISM ASSY DISASSEMBLY 2-1. Pick-up Unit A. Release screws (B). B. Separate the Pick-up Unit in the direction of arrow (6). Tray Door (B) (B) (3) Stoppers Pick-up Unit (6) CD Tray (2) Front Bezel Assy Mechanism Assy Emergency Eject Hole Fig. 1-2 Fig. 2-1 12 2-2. Pick-up A. Release 1 screw (C) and remove the Pick-up. Pick-up Unit (C) Pick-up Fig. 2-2 13 5 004 035 005 012 EXPLODED VIEW 008 006 009 015 010 011 PBM00 (MAIN C.B.A) 4 016 PBF00 (FRONT C.B.A) A03 A01 013 453 3 034 033 031 001 027 026 007 024 025 445 2 A02 430 020 028 452 430 028 020 481 482 003 030 021 002 482 032 1 453 014 482 452 050 482 452 036 021 (LightScribe only) A B C D 14 E 15 F G H GLOSSARY ATIP Absolute Time in Pre-groove. With an additional modulation of the “Wobble”, the “Groove” contains a time code information. Wobble The pre-groove in the Disc is not a perfect spiral but is wobbled. With : – A typical amplitude of 30 nm – A spatial peried of 54~64 µm CW Continuous Wave. The laser light output is at a constant level. DOW Direct Over-Write. The action in which new information is recored over previously recorded information in CD-RW disc. Overwrite The action in which new information is recorded over previously recorded information. (Pre-)Groove The guidance track in which clocking and time code information is stored by means of an FM modulated wobble. Land Land is characterized in the following way: When radial signals are concerned,land is defined as the area between the grooves. When HF signal are concerned,land is defined as the area between the marks(pits) in tangential direction. Hybrid Disc A Multisession disc of which the first Session is mastered. On a hybrid disc, recorded and mastered information may co-exist. Mastered Information,stored as pits on the disc during the manufacturing process of the disc. Information (when making the master) OPC Optimum Power Control. Procedure is determined optimum recording power according to CDR/RW Media in recording start step. ROPC Running OPC. The purpose is to continuously adjust the writing power to the optimum power that is required. When the optimum power may change because of changed conditions of disc and change in operating temperature. Jitter The 16 value of the time variation between leading and trailing edges of a specific (I3 … I11) pit or land as measured by Time Interval Analysis. Deviation The difference between a fixed value of Pit length and Land length. TOC Table Of Contents : in the Lead-in Area the subcode Q-channel contains information about the Tracks on the disc. Packet Writing A method of writing data on a CD in small increments. Two kinds of packets can be written : Fixed-length and Variable-length. Write Strategy The shape of the HF write signal used to modulate the power of the laser. The Write Strategy must be used for recordings necessary for disc measurements. Information Wobble, ATIP, Disc Identification, Write Power, Speed Range OPC Parameters, etc are Area recorded in the Information area of CD-RW Disc Finalization The action in which (partially) unrecorded or logically erased tracks are finished and the Lead-in and/or Lead-out areas are recorded or overwritten with the appropriate TOC subcode. Logical Erase A method to remove information from a disc area by overwriting it with an EFM signal containing mode 0 subcode A logically erased area is equivalent to an unrecorded Physical Erase The action in which previously recorded information is erased by overwriting with a CW laser output. After a Physical Erase action, the erased area on the CD-RW disc is in the unrecorded state again. Session An area on the disc consisting of a Lead-in area, a Program area, a lead-out area. Multi session A session that contains or can contain more than one session composed Lead-in and Lead-out 19 The differences of CD-R/CD-RW discs and General CD-ROM 1. Recording Layer Recordable CD has a wobbled pre-groove on the surface of disc for laser beam to follow track. Track pitch(p) Read-only Disc DISC) CD-ROM (READ-ONLY A a=30nm Iw um 1.6 O a T 11 3~ Radial Direction Radial Error Signal 0.4~0.5 um Land CD-R and CD-RW Disc Groove a Average center (Pit)Groove Land Actual center The Groove wobble 2. Disc Specification ITEM CD-ROM CD-R CD-RW Standard Yellow Book Orange Book II Orange Book III Record Not available Write once Re-Writeable Tracking Signal I11/Itop (HF Modulation) > 0.6 > 0.6 0.55 > M11> 0.70 Read Laser Power(mW) < 0.5 mW < 0.7 mW < 1.0 mW Jitter < 35 nsec < 35 nsec < 35 nsec Reflectivity (Rtop) 70 % 65 % 15 % ~ 25 % 14-65 mW 6-45 mW Remark) Write Laser Power(mW) 20 3. Disc Materials 1) CD-ROM disc • • • • It is composed of Silver _ colored aluminum plate and Reflective layer. Groove (Pit) of aluminum plate make a track. Laser wavelength : 780 nm, Laser Power (Read): 0.5mW Signal is detected by the difference of reflective beam intensity between “pit” and “Land” on the disc. Label Printing Protective Layer Reflective Layer Substrate (Polycarbonate) Pit Laser Beam 2) CD-R disc • It is so-called WORM (Write Once Read Many) CD. • It is composed of polycarbonate layer, Organic dye layer, Reflective layer, and Protective layer.Gold/Silver Reflective layer is used to enhance the reflectivity • According to the kinds of Organic dye layer, it is divided by Green CD, Gold CD, Blue CD. • Laser Wavelength : 780 nm, Laser Power (read) : 0.7 mW • Recording Power : 8x(14~20mW), 16x(25~35mW) • When some part of dye layer is exposed to laser heat, it’s color changs black.Therefore, writing and reading is enabled by the difference of reflectivity between changed part and unchanged part. • Polycarbonate layer has Pre_Groove which make a Track. Pigment Reflective Layer Color Phtalocyanine Gold/Silver Yellow/White Cyanine Gold/Silver Dark Green/Bright Green Azo Gold/Silver Dark Blue Label Printing Protective Layer Reflective Layer Organic Dye Layer Substrate (Polycarbonate) Laser Beam 21 Groove 3) CD-RW Disc Label Printing Protective Layer Dielectric Layer(TL) Recording Layer Dielectric Layer(UL) Substrate (Polycarbonate) Groove Laser Beam • It is composed of polycarbonate layer, alloy(silver, arsenic) layer, aluminum reflectivity layer, protective layer. • An crystalized alloy layer is transformed into noncrystalized by the laser heat. Therefore, writing and reading is enabled by the difference of reflectivity. • It is possible to overwrite about 1000 times. • Laser Wavelength : 780 nm, Laser Power (Read) : 1.0mW • Recording Power : Erase (4~18mW), Write (6~45mW) • When disc rewriting, new data is overwritten previously recorded data. • Polycarbonate layer has a Pre-Groove which make a track. 4. Reading process of Optical Disc Lens H D θ Beam Spot Numerical aperture: NA=nsinθ, n: Refractive index Focus depth : H = λ/NA laser spot diameter : D = λ/NA2 Focusing Lens Laser Spot at Constant Read Intensity Previously Recorded Marks Groove Land Mirror Reflected Light Signal I11 I3 IG IL I0 Itop Laser Spot Position (Time) 22 5. Writing Process of CD-R Disc Incident Laser Power (Write) (Read) (Read) a b cd e f Laser Spot Position (Time) g a b Laser Spot Below "ORP"– Mark Too Short Reflected Light Signal c At Optimum Record Power ("ORP") Above "ORP" – Mark Too Long d e f Recorded Mark g Time Reflected Light Signal a b cd e f g Laser Spot Position (Time) 6. Writing process of CD-RW Disc Amorphous Crystal phase Melting/ quenching Erase Power Read Power Heating/ gradual cooling Erased state (higher reflectivity) Write Power Recorded state (lower reflectivity) Groove Crystal 23 Amorphous 7. Organization of the PCA, PMA and Lead-in Area 1) Layout of CD-ROM disc Disc Center Diameter 120 mm Diameter 46 mm Diameter 15 mm Center hole Clamping and Label Area Information Area Read Only Disc Program Area Lead-in Area Lead-out Area 2) Layout of CD-R/RW disc Disc Center Diameter 120 mm Diameter 45 mm Diameter 15 mm Center hole Clamping and Label Area Information Area Unrecorded Disc PCA PMA Program Area Lead-in Area Lead-out Area Test Area : for performing OPC procedures. Count Area : to find the usable area immediately in T.A Test Area Count Area Tsl : start time of the Lead-in Area, as encoded in ATIP out PMA : Program Memory Area in Tsl-00:35:65 Tsl-00:15:05 Tsl-00:13:25 Tsl 99:59:74 00:00:00 24 8. Function of PCA and PMA area 1) PCA (Power Calibration Area) • PCA area is used to determine the correct Laser Power for a disc. – Method 1 : PCA area is divided by a track. – Method 2 : The previous Calibration value is referred. – Method 3 : ROPC is used to determine Laser Power value automatically in data writing. • CD-R Disc can write maximum 99 Tracks but CD-RW Disc can write unlimited tracks because it has a rewritable function. 2) PMA (Program Memory Area) • It has a track information (track No, track Start/End time) of every track before writing completed. – PMA area has the last written point and the next writable point of a disc. – In case of CD to CD copy, some writer may not write PMA area. * When Disc is Finalized, PMA information is transferred to the Lead_In area so that general Driver can read it. * Because PCA and PMA area exist before Lead-In area, General CD Player or CD-ROM Drive can’t read these areas. 9. OPC and ROPC 1) OPC (Optimum Power Control) • This is the first step of writing process, because CD writer has its own laser power value and media have different writing characteristics, – This is determined by the Writing characteristic, speed, temperature, and humidity. – Laser wavelength is determined by the environmental temperature (775~795nm) and Optical Laser Power is determined by the test and retry. HF Signal • Asymmetry and optimum writing Power – EFM signal Asymmetry is determined by the writing power. Therefore, Optical Power which has the same value to the preset power value can be estimated by measuring HF signal Asymmetry on the PCA area. • Measurement of Asymmetry * Parameter setting (Beta) : Using AC coupled HF signal before equalization Beta = (A1+A2)/(A1-A2) A1 0 A2 Time 25 P << Po Time P = Po Time P >> Po 2) ROPC (Running Optimum Power Control) • Variable primary factor of Optimum Power – Change of Power sensitivity on the Disc. (limited to 0.05 *Po) – Wavelength shift of the laser diode due to the operating temperature change. – Change of the Spot aberration due to the Disc skew, Substrate thickness, Defocus. Incident recording pulse – Change of Disc or Optics conditions due to the long term OPC ==> It is necessary to adjust continuously to obtain the Optimum Power. Sampled timing B Sample Disc Reflectivity (Read power) Level B • Principle of Running OPC – To meet the factors mentioned above, a horizontal _ direction movement of a curve is uesd. – Beta = f(B-level) = constant on the Recorded Disc – Procedure of ROPC a. Reference B-level is determined during OPC Procedure. b. During Recording, B-level value is controlled to have a close Reflected recording pulse Reference B-level value. c. Normalization of B-level is used to eliminate the effect of reflectivity fluctuation. ==> The reflected B-level value is normalized by the disc reflectivity itself. Sampled at timing B normalized to recording power 11T Level B with Pwo Sample B-level (Write Power) Pwo decided by OPC Recording Power OPC CD-R/RW Media Program Area Write Strategy Determination PMA Area PCA Test Area Lead-In Area PCA Count Area Lead-out Area ROPC 10. Writing Process of DISC * Recording Capacity of CD-R/RW (74Minute Recording media) • (2048 Byte/Sector) X (75 Sector/Second) X (60 Second/Minute) X 74 Minute = 681,984,000 Bytes = 682 Mbytes • But the actual recording capacity is about 650 Mbytes. (according to the ISO 9660 standard, approximately 30 Mbytes are used to make directory structure and volume names.) 26 The differences of DVD-R/RW, DVD+R/RW discs and DVD-ROM 1. Recording Layer DVD-ROM (Read Only Disc) 4 0.7 um 3T 0.4 um DVD-R/RW Disc LPP (Land Pre-Pit) DVD+R/RW Disc 27 2. Disc Specification DVD-ROM DVD-R DVD-RW DVD+R DVD+RW Read Only Dye Phase change Dye Phase change 4.7GB 8.54GB 4.7GB 4.7GB 4.7GB 4.7GB Wavelength 650nm 650nm 650nm 650nm 650nm 650nm Reflectivity 45~85% 18~30nm 45~85% 18~30% 45~85% 18~30nm Single-Layer Dual-Layer Media Type Read Only User data capacity Track pitch Minimum pit length 0.74 0.74 0.74 0.74 0.74 0.74 0.4 0.44 0.4 0.4 0.4 0.4 Modulation >0.6 >0.6 >0.6 >0.6 >0.6 >0.6 Channel bit- rate 26.16MHz 26.16MHz 26.16MHz 26.16MHz 26.16MHz 26.16MHz Wobble Frequency - - 140KHz 140KHz 817.4KHz 817.4KHz Addressing 26.16MHz 26.16MHz Wobble & LPP Wobble & LPP Wobble(ADIP) Wobble(ADIP) Read Power (mW) Write Power (mW) - - JItter <8% <8% <8% <8% 0.7 + 0.1 0.7 + 0.1 <9% <9% 3. Disc Materials 1) DVD-ROM Label Polycarbonate Bonding layer Reflective layer Polycarbonate Label Polycarbonate Reflective layer Bonding layer Semi-reflective Polycarbonate 28 2) Recording format using organic dye material (DVD-R/DVD+R) * The format that records data through the creation of recorded marks by changing the organic dye material with a laser beam. > Disc structure DVD-R DVD+R Adhesive layer Protective layer Reflective layer Recording layer(dye) Adhesive layer Protective layer Reflective layer Recording layer(dye) Disc substrate Disc substrate > Disc structure [Recording] Recording is done by changing the organic dye layer and the substrate with a laser when a strong is applied to a disc, the temperature of the ortanic dye material goes up, the dye is decomposed and the substrate changes at the same time. At this time, a durable bit is created as is the case with a CD-ROM. [Playback] Signals are read with the differences of the reflection of a laser from pits. Adhesive layer Protective layer Reflective layer Dye layer Substrate Laser beam 29 3) Recording format using phase-change recording material (DVD-RW/DVD+RW) * Data is recorded by changing the recording layer from the amorphous status to the crystalline status, and played back by reading the difference of the reflection coefficient. [ Amorphous : Non-crystalline ] > Disc structure DVD-RW DVD+RW Adhesive layer Protective layer Reflective layer Dielectric layer Recording layer (Phase change material) Dielectric layer Disc substrate Adhesive layer Protective layer Reflective layer Dielectric layer Recording layer (Phase change material) Dielectric layer Disc substrate > Recording principles [Recording] When a high-power laser is applied to the recording material, it melts and then becomes amorphous with a low reflection coefficient when it quickly cools off. When a mid-power laser is applied to heat gradually the recording material and then gradually cools it off, it becomes crystal with a high reflection coefficient. [Playback] A low-power laser is used for playback. The amount of reflected light depends on the status (amorphous or crystalline) of the recording material. This is detected by an optical sensor. Substrate Laser beam Amorphous status Crystalline status Recording data (Melting/Quick cooling) Erasing data (Heating/Gradual cooling) Data erased state (High reflection coefficient) Recorded state (Low reflection coefficient) 30 4. Writing Pulse Wave Form of DVD+R For different speed ranges, different write strategies can be used. This document specifies 2 options: - a pulsed write strategy, where each single mark is created by a number of subsequent separated short pulses. - a blocked write strategy, where each single mark is created by one continuous pulse. 1) 1st Method : Using Pulsed Write Strategy * 3T : T=3 NRZI 2Tw Channel bits Ttop dTtop Pp dTle Pb N = 3 : only the top pulse(Ttop ), first pulse lead-time dT top , dTle * > 4T : T>4 NRZI 2Tw Channel bits Ttop dTtop Pp Tw Tmp Tmp Tlp dTle Pb N > 4 : the top pulse (T top ), multi-pulse (Tmp ) and last pulse (Tlp ), first pulse lead-time dT top, dT le Pp : Actual write power Pb : Bias Power 31 2) 2st Method : Using Blocked Write Strategy NRZI Channel bits Tw 2Tw dTtop T lp Tmp Ttop dPp 1.25Tw dTle Pp Pc Pb 0mW dTtop,3 dPp3 1.25Tw 3T mark dTle Ttop,3 dTtop,4 dPp4 1.25Tw Ttop,4 Etc. Pb Pc 4T mark 5T mark Pb Tlp 1.25Tw Ttop,4 Tmp Tlp 1.25Tw Ttop,4 Tmp Tmp Tlp N = 3 : Ttop (cm = 3) can be optimized individually. N > 4 : Ttop (cm > 4) + (N-3) x Tw + Tlp , T w = T mp Pc shall be < 0.1mW Pp : Actual write power Pb : Bias Power dPp : Additional power ( Only be applied for the 3T and 4T marks) Pc : Cooling power (Especially at higher recording speeds, optimum cooling down of the recording layer after writing a mark may be needed.) 32 5. Writing Pulse Wave Form of DVD+RW NRZI Channel bits Ttop dTtop Pp Pe Pb 0mW Pp : Actual write power Pe : Erase Power Pb : Bias Power 33 Tw 2Tw Tmp Tmp Tmp dTera 6. Organization of the Inner Drive Area, Outer Drive Area, Lead-in Zone and Lead-out Zone 1) Layout of DVD-ROM disc Disc Center Diameter 120 mm Diameter 44 mm Diameter 33 mm Diameter 22 mm Diameter 16 mm Diameter 15 mm Clamping Zone Center hole 3rd transtion area Information Zone 1st transition area 2nd transition area Rim area Read Only Disc Lead-in Zone Data Zone Lead-out Zone 2) Layout of DVD+R disc Disc Center Diameter 120 mm Diameter 44 mm Diameter 33 mm Diameter 22 mm Diameter 16 mm Diameter 15 mm Clamping Zone Center hole 3rd transtion area Information Zone Rim area 1st transition area 2nd transition area Unrecorded Disc Inner Drive Area Inner Disc Test Zone Lead-in Zone Inner Disc Count Zone Data Zone Outer Drive Area Lead -out Zone Outer Disc Test Zone Outer Disc Count Zone in PSN: 23080H 27080H 27480H 28480H 2A480H 30000H 260540H 261940H 262940H OUT 263940H 267940H > Inner Disc Test Zone : for performing OPC procedures. > Inner Disc Count Zone : for counting the number of OPC algorithm performed in IDT Zone. > Outer Disc Test Zone : for performing OPC procedures. > Outer Disc Count Zone : for counting the mumger of OPC algorithm performed in IDT Zone. 34 3) Layout of DVD+RW disc Disc Center Diameter 120 mm Diameter 44 mm Diameter 33 mm Diameter 22 mm Diameter 16 mm Diameter 15 mm Clamping Zone Center hole 3rd transtion area Information Zone Rim area 1st transition area 2nd transition area Unrecorded Disc Inner Disc Test Zone Lead -out Zone Data Zone Lead-in Zone Inner Disc Count Zone Outer Disc Test Zone Outer Disc Count Zone in PSN: 2A480H OUT 2A7C80H 2DC80H 30000H 260540H 262940H 265940H > Inner Disc Test Zone : for performing OPC procedures. > Inner Disc Count Zone : for counting the number of OPC algorithm performed in IDT Zone. > Outer Disc Test Zone : for performing OPC procedures. > Outer Disc Count Zone : for counting the number of OPC algorithm performed in IDT Zone. 35 266140H LightScribe Media 1. LightScribe Media DiscOD Label Zone Control Feature Zone Clamping/Logo Zone Center Hole Screen Printed Imaging Layer Clear Protective Coating Reflective/Thermal Layer Dye Data Layer Polycarbonate Substrate 36 37 Buffer Memory Host PC uP (DSP) Power Drive Optical FG SERVO Signals CIrcuit RFOUT Analog Signal Processor Write Strategy Control Laser Power Monitor Signal RF Cell Signals Focus Actuator (Focus) Laser Power Reference Tilt Actuator (Tilt) Track Actuator Step Motor (Sled) (Track) Spindle Motor (Spindle) Optical Encoder Optical Pick-up MECHANISM 2. Hardware Block Diagram of LightScribe Label Printing OPU ID Movement Range : L=21um 3. MD Assy For LightScribe Optical Encoder Unit 38 4. Optical Encoder Assy Codewheel Direction of radial play Encoder PCB Optical Encoder IC PIN 6 VCC PIN 1 CH B PIN 5 CH A PIN 4 GND PIN 2 GND PIN 6 VCC PIN 1 CH B PIN 5 CH A PIN 2 GND PIN 4 GND PIN 3 VLED PIN 3 VLED Schematic of Enc PCB V LED R GND GND Vcc VCC CH A FFC 3PIN OFG CH B CH B 39 SIGNAL PROCESSING CIRCUITRY CODEWHEEL OR CODESTRIP P-up Unit (HOP-7632TS) IC302 Flash ROM FE GEN TE/CSO GEN RF EQ & AGC IC101 RF AMP (R2S35002) DVD CD SRAM RF data slice Data PLL Servo ADC Focus/tracking control output Sled control output CAV Spindle control SERVO DSP IC301 (R8J32007) U-COM DRAM EFM demodulator CiRC error correction Audio DAC Buffer/Memory controller CSS controller Atapi interface control Encoder & Decoder & CSS Data Status Command DVD & CD DATA PROCESSING 1. Data Processing Flow 40 2. Copy Protection and Regional Code Management Block Block Diagram Change the "KEY" HOST DVD PLAYER (EMPEG2 B/D) R8J32007 Scrambled MPEG Data KEY Management Control Brief Process 1. Regional Code for DVD Disc – DVD-ROM drive transfers the regional code of the control data to host by the command of host, the DVD player of host reads the regional code, and plays title in the case of allowed regional code only. 2. Management of DVD Disc for the scrambled of data (1) DVD-ROM and DVD player of host generate the “KEY 1” respectively, transfer to opposite part, the “KEY 2” is received, recognizes the data transfer or not with this value, and generates the bus key encoded the data. (2) Encoded “Disc Key” and “Title Key” host is transfer with the bus Key. (3) DVD player of host reads the key value, and uses the value to restore the scrambled data. * Refer to the next page for the details. 41 3. About Prevention the DVD-ROM from to be copy A data is able to encode and record in the disc, if a copyright holder wants to prevent the disc from copying. In case of a disc enhanced movie of 3 titles...... DISC KEY (2048 Bytes) is used to encode the whole contents in the disc and TITLE KEY (5 Bytes) is used to encode the title respectively. So, the data is encoded and stored in a disc through the unknown algorithms with a disc key and title key. (At this time, the disc key and title key are stored in a disc.) …As above, the disc is able to copy when the disc key and title key are opened. Then, ROM-DRIVE encodes the disc key and title key and transfers to MPEG2 board. If you want to play the disc prevented from the copy...... First of all, ROM-DRIVE and MPEG-2 board identify with each other through the procedure as described below. AGID HOST ROM-DRIVE Challenge key MPEG-2 BOARD encoded disc key, title key 1. Drive and host gives and takes the ID of 2bit. This ID is AGID (Authentication Grant ID). The various decoder boards are attached to the host, in these, AGID sets the MPEG-2 board and drive. 2. After the AGID is set, MPEG-2 board generates the challenge key (10 Byte) and transfers to drive. The board and drive generate key 1 (5Byte) with the challenge key respectively. (Of course, the Algorithm generating the key 1 is not known.) 3. Compare with the generated key 1, if it corresponds each other, the first step of authentication is completed. This is a course to identify the MPEG-2 board with a drive. 4. The second step of authentication is a course to identify a drive with the MPEG-2 board. The dirve generates a challenge key and transfers it to the MPEG-2 board. The dirve and MPEG-2 board generate the key 2 (5Byte) with the challenge key, compare with each other, and if it corresponds and the secondary step of authentication is completed. 5. As above, the identification is completed. 6. The dirve and MPEG-2 board generate the Bus key with the key 1 and key 2 and own it. 7. Dirve encodes the disc key and title key with this Bus key and transfers to the MPEG-2 board. 8. The MPEG-2 board reads the encoded disc key and title key with the Bus key only. 9. MPEG-2 board lets data read from the drive to decode with the read disc key and title key and makes into the video signal by decoding. 42 4. About the DVD-ROM Regional Code Regional code 5 1 GRL RUS FIN CAN FST LTU 2 BIR POI UKR MNG U.S.A TUR TKM CHN JRN BHS CUB 1 FGY KOR 6 BMG MIX AFG PAK MMR PRI. VIR JPN 2 HKG TWN MAC PHL 3 1 MNP GUM MDI PLW PNG 1 5 2 4 AUS ZAF ISO SWZ NZL 4 DISC The disc has the regional code of 8 bit. Example) The disc manufactured in the U.S.A, has the number one. 43 ROM - DRIVE Transfer to MPEG-2 board reading the regional code. MPEG-2 BOARD VGA CARD If the board is setting to the regional code 1 for the U.S.A. ... Check the received regional code to number 1, all or not, transfer the data to VGA card in accordance with only a case among the three case. MONITOR Receiving data from the MPEG-2 board and output through the monitor INTERNAL STRUCTURE OF THE PICK-UP 1. Block Diagram of the PICK-UP(HOP-7632TS) 45 Tilt44 Tilt+ IC2(FM) 43 TR- CD-VR 42 TR+ R14 5 4 6 3 7 2 8 1 41 AF40 AF+ Rd 38 FM C12 DVD-VR 39 GND(FM) 37 VREF 36 SEL C13 35 VCC(FM) 34 ENA R2 C3 33 IAPC 32 SLG 31 VSA5 R1 R4 30 VSL25 16 15 14 13 12 11 10 SLG Rfreq IAPC 17 VSO ISLOP AGND EN RSET DVD-LD 19 OUT2 20 VSO GND 5 GND 4 NRZB 3 NRZ 2 RWB 1 21 VSO 22 GND NC NC BUSY SEN 28 CLKB 27 GND(LDD) C2 C1 FB1 26 NRZB 25 NRZ R7 24 GND(LDD) R8 23 MONITOR 22 RWB 21 SDIO SDIO SCLK MON1 23 OUT1 29 CLK FB2 VSA 9 VSL 8 CLK 7 CLKB 6 18 OUT2 CD-LD 24 OUT1 25 VSO IC2(LDD) 20 SCLK 19 BUSY 26 27 28 29 30 31 32 18 SEN 17 VSO C6 C5 FB3 16 Vcc(FM) C9 15 GND(OEIC,TEMP) C10 Rth IC3(OEIC) C14 7 GND F4 F1 6 VD F3 F2 EF4 8 4 VS 3 VC2 VA 10 D A C B 13 RF+ 12 E2+F2 EF1 9 5 VCC C15 14 RF- 11 C 10 A 9 E1+F1 VB 11 8 E4+F4 VEF2 12 7 D 6 B 5 E3+F3 2 VEF3 E4 E1 VREP 13 1 SW E3 E2 VRFN 14 4 GAINSW 3 Vc(OEIC) 2 Vcc(OEIC) 1 GND(OEIC,TEMP) Behind View DVD-LD : 1st Vendor : Rd = 82k DVD-LD : 2nd Vendor : Rd = 5.6k 44 2. Pick up Pin Assignment 45 No. Signal Name I/O Signal Description 1 GND(OEIC,TEMP) 2 Vcc(OEIC) I Power supply for OEIC 3 Vc(OEIC) I Reference voltage input for OEIC 4 GAINSW I OEIC output gain control (High:Low gain, Middle:Middle gain, Low:High gain) 5 E3+F3 O Single OEIC output EF3 6 B O Single OEIC output B 7 D O Single OEIC output D 8 E4+F4 O Single OEIC output EF4 9 E1+F1 O Single OEIC output EF1 Ground for OEIC 10 A O Single OEIC output A 11 C O Single OEIC output C 12 E2+F2 O Single OEIC output EF2 13 RF+ O Single OEIC RF positive differential output 14 RF- O Single OEIC RF negative differential output 15 GND(OEIC.TEMP) O Ground for OEIC and TEMP 16 TEMP O Output voltage for controlling temperature 17 VSO I Supply voltage for the output drivers only 18 SEN I Serial control enable (H=enable, L=disable) 19 BUSY O Goes high when serial transfer to timing menory is active 20 SCLK I Serial control clock 21 SDIO I/O Serial data for parameters and control ; in/out 22 RWB I Write enable for NRZ laser data (L=write, H=read) 23 MONITOR O Monitor output 24 GND(LDD) 25 NRZ I NRZ laser data (H=mark, L=space) (LVDS+) 26 NRZB I NRZ laser data (H=mark, L=space) (LVDS-) 27 GND(LDD) 28 CLKB I CLOCK for NRZ code input (LVDS-) 29 CLK I CLOCK for NRZ code input(LVDS+) 30 VSL25 I Supply voltage for 2.5V logic 31 VSA5 I Supply voltage for PLL only 32 SLG I Land/groove input serects the power register set (H=land, L=groove) 33 IAPC I A low inpedance current input ; 100xIAPC frow to the output 34 ENA I Fast chip enable input 35 VCC(FM) I Power supply for FM 36 SEL I Low: selects DVDFMOUT High: selects CDFMOUT Ground connection for LD Driver-IC Ground connection for LD Driver-IC 37 VREF I APC amplifier reference voltage input 38 FM O APC amplifier output 39 GND(FM) 40 AF+ I Focusing Actuator drive signal+ 41 AF- I Focusing Actuator drive signal- 42 TR+ I Tracking Actuator drive signal+ Ground connection for FM 43 TR- I Tracking Actuator drive signal- 44 Tilt+ I Tilting Actuator drive signal+ 45 Tilt- I Tilting Actuator drive signal- 3. Signal detection of the P/U Infrared Iaser Pick-Up module Focusing Tracking Photo Diode 1) Focus Error Signal ==> (A+C)-(B+D) This signal is generated in RF IC (IC101 : R2S35002) and controls the pick-up’s up and down to focus on Disc. 2) Tracking Error Signal (DPP Method) ==> {(A+D)-(B+C)}- k x {(EF1+EF4)-(EF2+EF3)} This signal is generated in RF IC (IC101 : R2S35002) and controls the pick-up’s left and right shift to find to track on Disc. 3) RF Signal ==> (A+B+C+D) This signal is converted to DATA signal in DSP IC (IC301 : R8J32007). Track Center Tp/2 Sub1 F,E D,C A,B Main Sub2 H,G Tp k[(F+H) - (E+G)] Offset (A+D) - (B+C) TE (A+D) - (B+C) - k[(F+H) - (E+G)] 46 DESCRIPTION OF CIRCUIT 1. ALPC (Automatic Laser Power Control) Circuit 1-1. Block Diagram CN101 Optical Pick-up LD Driver Write Strategy FsDAC WDAC 25,26,28 13 9 8 IAPC 2.5VREF R160 FMON 12 9 10 buffer LPF & Gain S/H IC101 (R2S35002)) + - APCDAC (REDA/WRDA) SCLK, SDATA, WDEN MUX RWAPC AMP Buffer S/H B/H 28 29 32 6 5 RFPDSH WFPDSH WGATE TCPH BCNT R106 R105 126 127 134 175 108 120,121,123 IC301 (R8J32007) C106 C105 47 1-2. ALPC (Automatic Laser Power Control) Circuit ALPC function DVD/CD anlaog front-end IC(IC101 R2S35002) is for constant power control purpose. Based on the accurate power sensor(FMON) in P/U, ALPC feedback loop maintains constant power level against laser diode’s temperature variation. The ALPC loop amplifies(10x) the FMON signal to enhance the accuracy of read power level control. Swithching of amplification is made by combination of a logical WGATE signal and a logical RWAPC signal. There are two set of APCDAC, which are used at different term to monitor different power level. Generally, the one is used at reading and the other one is used at writing. The logical WGATE signal which is switched between reading and writing changes the two APCDAC. The ALPC loop supplies same currency (IAPC) to Laser Diode Driver(LDD) during reading and writing. There is another ALPC which controls Full-Scale-DAC (FsDAC). FsDAC determines scale of WDAC of Laser Diode Driver. MPU monitors write-power level of FMON signal and changes FsDAC directly to maintain constant write-power level. There are two write power signal. The one is based on S/H signal and the other one is based on B/H(Bottom-Hold) signal. The write power levels are monitored as digital levlels which are converted by built-in Anlog-Digital Converter in DSP. The MPU monitors each write power level and calculates proper setting of FsDAC, and changes value through serial interface between LDD and DSP. 48 2. Focus Circuit 2-1. Block Diagram A+B+C+D LPF G HAVC LS to 0.8V 3 G HAVC LS to V14 2 A,B,C,D IC101 R2S35002 A,B,C,D LPF (EF1~EF4) Disc Motor unit (A+C)-(B+D) (A+C)-(B+D)+K[(EF1+EF3)-(EF2+EF4)] Optical Pick-up HOP-7632TS FOD 180 IC301 R8J32007 FACT- FACT+ FACT+ FACT- DAC Focusing Compensator 35 FE FE R102 C405 R103 FE ADC 169 GND PE 42 R2S30202FP GND R329 FOD 40 IC601 C406 170 FOIN 34 PE C335 REF 1.65V EN1 20 CTL1 EN2 21 CTL2 2-2. Focus Servo The aim of Focus Servo is to maintain the distance between object lens of P/U and disc surface, so that the detected RF signal(A, B, C, D, EF1, EF2, EF3, EF4) can be maximized. Focus Error Signal(FE) generates from focus error detection block in RF IC(R2S35002) using Conventional Astigmatism Detection method, Differential Astigmatism Detection method. Focus Gain and path can be changed at the RF IC(R2S35002) according to the disc, and the resulting output FE(R2S35002 2pin) is input to DSP IC(R2S35002 169pin). The Focus Search operation is using FE, PE Signal, therefore check FE, PE signals when Focusing is failed. The role of DSP IC(R8J32007) is Focus Digital Controller. The operation path is as follows; FE Signal is input to DSP IC(R8J32007 169pin), and after A/D Conversion, Digital Equalizer Block and D/A Conversion in R8J32006FP, the output signal FOD(R8J32007 180pin) is input to Drive IC(R2S30202FP 40pin). The drive output signal FACT+/FACT- generated according FOIN(R2S30202FP 40pin), and drives focus actuator in the P/U unit. 49 3. Tracking & Sled Circuit 3-1-1. Block Diagram (Tracking Following) IC101 R2S35002 MPPO (A+D)-(B+C) L P F SPPO A,B,C,D (EF1~EF4) Disc Motor unit HAVC LS to V14 L P F G TE 1 TE R101 Optical Pick-up HOP-7632TS (A+D)-(B+C)-K[(EF1+EF4)-(EF2+EF3)] C101 TRD Tracking Compensator DAC 181 ADC GND 173 TE TACT- TACT+ SL2 183 Sled Compensator DAC 182 A+ IC301 R8J32007 SL1 AB+ B- SLED MOTOR Unit (CN601) TACT+ 37 TACT- 39 BA+ SL2N EN1 20 8 SL1N TRD IC601 R2S30202FP A- CTL1 R372 1.65V 1.65V CTL2 21 10 SL2P R331 SL1IN 6 SL1P C336 EN2 SL2 2 SL2IN B+ R330 TOIN 36 C337 R373 R332 3 9 SL1 C338 42 R374 REF 1.65V C604 50 3-1-2. Block Diagram (Seek) IC101 R2S35002 MPPO (A+D)-(B+C) A,B,C,D Disc Motor unit - SPPO (EF1~EF4) [(EF1+EF4)-(EF2+EF3)] Optical Pick-up HOP-7632TS + L P F HAVC LS to V14 L P F G 1 TE1 38 MIRR VREF1 A+B+C+D L P F TACT- TACT+ L P F A+ G + - VREF1 HAVC LS to V14 MIRR DET AB+ SUMF 79 EQ RFIP 80 AGC B- SLED MOTOR Unit BOTTOM HOLD TOP HOLD RFIN 81 63 62 MIRRTOPH GND MIRRBOTH C128 C127 GND GND C101 TE IC301 R8J32007 173 R101 Track Counter and Timer TE1 IP2MIRR MIRR 149 M U X A D C Short Seek Algorithm Tracking Compensator D A C Loog Seek Algorithm Sled Compensator D A C TRD 181 SL2 183 182 SL1 51 3-2-1. Tracking Servo The aim of tracking servo is to make laser beam trace the data track on disc. Tracking Error(TE) Signal is generated from tracking error detected block in R2S35002 using DPP(Differential Push-Pull) Method and DPD (Differential Phase Detection) Method. DPP Method uses not only main beam(A, B, C, D) but also side beam(EF1~EF4) for correcting DC offset generated in Push-Pull Method. The remaining procedure of TE signal processing in R8J32007 is similar to Focus Servo. The role of DSP IC(R8J32007) is Tracking Digital Controller. TE Signal is input to DSP IC(R8J32007 173pin), and after A/D Conversion, Digital Equalizer Block and D/A Conversion in R8J32007, the output signal TRD(R8J32007 181pin) is input to Drive IC(39pin). The drive output signal TACT+/TACT- generated according TOIN(R2S30202FP 39pin), and drives tracking actuator in the P/U unit. 3-2-2. Sled Servo The working distance of tracking actuator is too short to cover whole disc radius. Sled Servo make P/U move by little and little so that the laser beam keep tracing the data track on disc continuously when tracking actuator reaches the working limit. TE Signal is input to DSP IC(R8J32007 173pin), and after A/D Conversion, Digital Tracking Equalizer Block, Digital Sled Compensator Block and D/A Conversion in R8J32007, the output signal SL1, SL2(R8J32007 182, 183pin) is input to Drive IC (R2S30202FP SL1:3 pin, SL2:2pin) after Low-Pass filtering. 52 4. Spindle Circuit 4-1-1. Block Diagram(FGCAV Servo) Optical Pick-up HOP-7632TS Disc Motor unit IC301 R8J32007 X301 33.8688MHz XCO VCK4M 106 Control Clock Generator 107 XCI SFG SPD SPD 211 R349 P W M M U X CAV FD + CAV PD 213 VCK4M R361 R375 Motor Kick REG C349 3.3V 1.65V SPIN U 12 V 13 IC601 SPD 1 DAVC 42 1.65 R2S30202FP W 14 CTL1 20 CTL1 CTL2 21 CTL2 19 SFG FG 4-1-2. FG CAV Servo 1) CD 48x CAV : CD-ROM, CD-R 2) CD 40x CAV : CD-RW 3) DVD 8x CAV : DVD+RW 4) DVD 10x CAV : DVD+R 5) DVD 12x CAV : DVD-ROM DL 6) DVD 16x CAV : DVD-ROM 7) DVD 16x PCAV : DVD+R When drive read PRESS CD, Closed Session CD-R/RW, the spindle motor is controlled using FG CAV Spindle Servo. FG signal(R2S30202FP 19pin) input to SFG in DSP IC(R8J32007 213pin). The spindle controller in DSP IC uses SFG as spindle rotation frequency feedback, therefore the FG CAV Spindle Servo doesn't work well if FG generation is abnormal. The spindle controller PWM output signal SPD(R8J32007 211pin) input to SPIN in Drive IC(R2S30202FP 1pin) after Low-Pass Filtering. The PWM output signal U, V, W signal(R2S30202FP 12, 13, 14pin) drives Spindle Motor without using a sensor, and FG pulse output is generated as 18 pulses/rotation. 53 4-2-1. Block Diagram (Wobble CLV Servo) C116 C117 WAG1 C118 WAG2 WAG3 18 19 SA 87 ADO SB Disc Motor unit SD Optical Pick-up HOP-7632TS HPF S / H 88 SC 20 89 AGC1 HPF HPF + AGC2 BCO 90 MA 92 C171 MB BPF HPF AGC3 93 C172 MC C173 94 HPF WOBSIG + 37 MD VREF 95 - C174 GND IC101 R2S35002 WBLSH 31 WBLS H IC301 R8J32007 1.65V 154 R375 SPD SPD 211 R349 C349 1.65V P W M M U X SP Motor Kick REG PH 4-2-2. Wobble CLV Servo CD-R : 4x, 8x, 16x, 24x, 32x, 40x, 48x /CD-RW : 4x, 10x, 16x, 24x, 32x /DVD-R : 2x, 4x, 8x, 16x(PCAV) /DVD-R DL : 2x, 4x /DVD-RW : 1x, 2x, 4x, 6x /DVD+R : 2.4x, 4x, 8x, 12x, 16x(PCAV) /DVD+R DL : 2.4x, 4x, 6x /DVD-RAM : 2x, 3x, 3-5x(PCAV) /DVD+RW : 2.4x, 4x, 8x When drive write DVD-RAM/R/RW/+R/+RW/CD-R/CD-RW, the spindle motor is controlled using Wobble CLV Spindle Servo. The WOBSIG signal(R2S35002 37pin) input to DSP IC(R8J32007 154pin). The DSP Controller in R8J32007 uses WOBSIG as linear velocity feed back, therefore the Wobble CLV Spindle Servo doesn’t work well when WOBSIG signal is abnormal. The spindle controller PWM output signal SPD (R8J32007 211pin) input to SPIN in Drive IC(R2S30202FP 1pin) after Low-Pass Filtering. The PWM output signal U,V, W signal(R2S30202FP 12, 13, 14pin) drives Spindle Motor without using a sensor. 54 MAJOR IC INTERNAL BLOCK DIAGRAM AND PIN DESCRIPTION IC101 (R2S35002) : RF AMP Analog Signal Processor VDD1(3.3V) EQON EQOP GND1 TOPH BOTH MIRRTOPH MIRRBOTH MIRRHPF BHC VDD4(3.3V) MRSTB SDEN 70 69 68 67 66 65 64 63 62 61 60 59 58 57 PORT10 SUBI/LPPSIG 71 PORT11 SUBO/LPPMON 72 PORT12 EQFCF 73 PORT13 IREFE 74 SDATA AGHPF2 75 SCLK AGHPF1 Pin Assignment 56 55 54 53 52 51 AGFU 76 50 MCLK AGFR 77 49 PORT07 (5V)VCC1 78 48 PORT06 SUMF/SUMF2 79 47 PORT05 RFIP 80 46 PORT04 45 PORT03 44 PORT02 RFIN SRVREF 81 82 FVREFO 83 43 PORT01 IREFT 84 42 PORT00 VREF1 85 41 GND4 HAVC 86 SA 87 SB 88 SC 89 SD R2S35002 (TOP VIEW) DFT 39 IP1/LPPOUT 38 IP2/MIRR 98 28 RFPDSH AIN3 99 27 SPBLVL/TISH2 100 26 LNDTRK TE GND5 AIN2 AWOBSIG WFPDSH (3.3V)VDD5 MPDSH/SPDSH 29 (EQOS/RRF/WRF/LPPMON/)ATEST 30 97 WOBFCF 96 AIN1 WAG3 GND2 WAG2 WBLSH WAG1 31 GND3 WGATE 95 VRDC 32 MD VRDCN 94 VRDC2N/PWRMON MC LDOUT RFHLD/TISH1 VRDC3N 33 FMD IDGATE 93 (3.3V)VDD3 34 MB FVREF LO_ZB/SPDSH (5V)VCC2 35 92 BHBETA/TIE 91 MA PHBETA/TCE (3.3V)VDD2 LE BLANK BCENT 36 FE WOBSIG 90 PE 37 SIGM 55 40 Block Diagram 3300p 0.1u RF SLIM/SUB (RGA) SUMF2 to WRF AGHPF1 IREFE AGHPF2 AGFR AGFU RFHLD/ TISH1 RF AGC HP2 mclk to MIRR.DEFECT EQOP RF EQ HP3 EQON EQAUTO EQOS M U X IP1/LPPOUT IP2/MIRR D VREF1 4700p D SUBP.N RFIN D LO_ZB/ SPDSH RFIP 0.068u D IDGATE D SUMF/ SUMF2 0.068u 12k (*2) 0.47u *3300P/0.068u EQFCF *3300p Lo-Z function by IDGATE. . . 3.3us fast mode Lo-Z function by IDGATE. M U X MIRR SUBO/LPPMON ATEST LPPMON/EQOS/RRF/WRF SUBI/LPPSIG mclk ID DET M U X BHC 15,000p LPP SUBW mclk 2200p VREF1 MA MB MC 2 Pick I/F WOBFCF F0-CNT Wobble 0.47u S/H WOB AWOBSIG AGC1 MD BPF COMP AGC3 D *HPF fc=1kHz AGC2 WAG3 4 BPO WAG1 S/H main SA to A/D 0.1u WOBSIG SUB VREF1 WAG2 0.1U SB 0.12U SC 0.12U LNDTRK 4 SD TE sub D BALANCE TE S/H to LPF,A/D DPD to LE MPP SPP FE FE BALANCE toLPF,A/D HAVC pick-up I/F reference level PE PE toLPF,A/D MPP SHPE D D WBLSH HFSUM RRF SPP HFPE FE MPDSH/ SPDSH MUX LE LO_ZB/SPDSH pin toLPF,A/D SUMF2 M WRF WRF U X mclk MCLK D/A SRVREF 20k(*1) IREFT BLANK D MIRRTOPH MIRRBOTH VREF1(=2.1V) FVREFO(=2.5V) VFREFO 0.01u D D D D SDEN SCLK SDATA TOPH MIRR DFT 0.068u D RFHLD/TISH1 pin 12 PORT00~07.10~13 SPBLVL/TISH2 TIE D D 0.033u BOTH Programm able I/O port Power Cont. Serial Cont. Reg. 0.033u 0.1u IP2/MIRR pin MRSTB 0.033u MIRRHPF MIRR DEFECT EQOP/N D WGATE SPBLVL APC GCAOUT PWWMON BHOUT FVREF GND2 VDD1 0.1u vCC1 GND3 VDD2 0.1u vCC2 GND4 VDD3 0.1u VDD5 VRDC PHBETA/TCE BHBETA/TIE BCENT toLPF,A/D toLPF,A/D toLPF,A/D RFHLD/TISH1 pin each blocks LDOUT VRDCN VRDC3N FMD R-OPC OPC BPO GND1 RFPDSH GND5 VDD4 D LO_ZB/SPDSH WGATE 0.1u D VRDC2N/ PWRMON 3 SIGM AIN1~3 SIGM toLPF,A/D D 0.1u 0.1u 8200p 3.3u power 3.3V(VDD) 0.1u ...Combined pin In the case of analog APC 680k 0.01u RECD VHALH(=VDD/2) VREF VREF1 10u RECD SAV 0.1u power 3.3V (*1), (*2)...1% Resistor D ...digital pin D/A...digital/analog pin power 5V 56 • Pin Functions pin Name pin No. Type max. voltage Function TE 1 Analog-Output Tracking error output terminal FE 2 Analog-Output Focus error output terimnal PE 3 Analog-Output PE output terminal LE 4 Analog-Output Lens error output terminal BCENT 5 Analog-Output OPC center signal output terminal PHBETA/TCE 6 Analog-Output OPC top hold level signal and APC write sampleing BHBETA/TIE 7 Analog-Output VCC2 8 Power FVREF 9 Analog-Input VDD Reference voltage for APC input terminal FMD 10 Analog-Input VDD APC monitor diode input terminal signal output terminal/tilt servo detecting output terminal OPC bottom hold level signal and R-OPC sampleing signal output terminal/tilt servo detecting output terminal Power supply connected terminal(5V) VDD3 11 Power Power supply connected terminal(3.3V) LDOUT 12 Analog-Output Terminal to control laser drivers for APC read system VRDC3N 13 External-components required Terminal to connect laser driver control filters for APC read VRDC2N/PWRMON 14 External-components required Terminal to connect laser driver control filters for APC read/ SH monitor output terminal VRDCN 15 External-components required Terminal to connect laser driver control filters for APC read VRDC 16 External-components required Terminal to connect laser driver control filters for APC read GND3 17 Ground Ground connected terminal WAG1 18 External-capacitor required Terminal to connect WOBBLE AGC detector capacitor WAG2 19 External-capacitor required WAG3 20 External-capacitor required WOBFCF 21 External-capacitor required WOB-BPF f0 auto-adjustment external capacitor connected terminal VDD5 22 Power Power supply connected terminal(3.3V) ATEST 23 Analog-Output Renesas analog test signal output terminal AWOBSIG 24 Analog-Output Analog-level WOBBLE signal output terminal GND5 25 Ground Ground connected terminal LNDTRK 26 Digital-Inputpull-up VDD Balans adjustment mode selection SPBLVL/TISH2 27 Digital-Inputpull-up VDD R-OPC WRF signal sampling pulse input terminal RFPDSH 28 Digital-Input VDD APC read system sampling pulse input terminal /Tilt servo detecting sampling pulse input terminal putpull-up WFPDSH 29 Digital-Input putpull-up VDD APC write system sampling pulse input terminal MPDSH/SPDSH 30 Digital-Input putpull-up VDD Pickup input sampling pulse input terminal WBLSH 31 Digital-Input putpull-up VDD WOBBLE sampling pulse input terminal WGATE 32 Digital-Input putpull-up VDD Read/write control input terminal RFHLD/TISH1 33 Digital-Input putpull-up VDD RF hold control signal input terminal /Tilt servo detecting sampling pulse input terminal IDGATE 34 Digital-Input putpull-up VDD ID select pulse input terminal LO_ZB/SPDSH 35 Digital-Input putpull-up VDD Low-z (reversal) pulse input terminal /Pickup input sampling pulse input terminal 57 pin Name BLANK pin No. Type 36 max. voltage Function Digital-Output Record/non-record detecting/BD detecting output terminal WOBSIG 37 Digital-Output WOBBLE signal output terminal IP2/MIRR 38 Digital-Output ID detection/Mirror detection output terminal IP1/LPPOUT 39 Digital-Output ID detection/LPP detection output terminal DFT 40 Digital-Output Defect detection output terminal GND4 41 Ground PORT00 42 Digital-Input/Output PORT01 43 PORT02 44 PORT03 45 PORT04 46 PORT05 47 PORT06 48 PORT07 49 MCLK 50 Ground connected terminal (Digital) VDD I/O Port VDD Main clock input terminal default input mode No pull-up Digital/Analog-Input No pull-up Equalizer fc auto-adjustment control clock input terminal. LPP output pulse width control clock input terminal. WOB-BPF f0 auto-tracking clock input terminal. PORT10 51 Digital-Input/Output PORT11 52 default input mode PORT12 53 PORT13 54 SCLK 55 VDD I/O Port VDD Serial I/F clock input terminal No pull-up Digital-Input pull-up SDATA 56 Digital-Input/Output pull-up VDD Serial I/F data input/output terminal SDEN 57 Digital-Input pull-up VDD Serial I/F enable input terminal MRSTB 58 Digital-Input pull-up VDD VDD4 59 Power Power supply connected terminal(3.3V)(digital) BHC 60 External-capacitor required External capacitor for LPP bottom hold terminal MIRRHPF 61 External-capacitor required Master reset (reversal) input terminal Terminal to connect Mirror envelope detector HPF capacitor MIRRBOTH 62 External-capacitor required Terminal to connect Mirror envelope detector bottom hold capacitor MIRRTOPH 63 External-capacitor required Terminal to connect Mirror envelope detector top hold capacitor BOTH 64 External-capacitor required Terminal to connect envelope bottom hold capacitor TOPH 65 External-capacitor required Terminal to connect envelope top hold capacitor GND1 66 Ground Ground connected terminal EQOP 67 Differential-Output RF equalizer differential output terminal Power supply connected terminal(3.3V) EQON 68 VDD1 69 Power SUBI/LPPSIG 70 Analog-Input VDD ID detecting HPF input terminal/LPP detecting HPF input terminal 58 pin Name pin No. Type max. voltage Function SUBO/LPPMON 71 Analog-Output ID detecting HPF output terminal/LPP detecting HPF EQFCF 72 External-capacitor required Terminal to connect RF-equalizer fc auto-adjustment IREFE 73 External-resistor required AGHPF2 74 External-capacitor required Terminal to connect AGC high pass filter capacitor AGC filter connecting terminal output terminal external capacitor Terminal to connect RF-equalizer fc setting external resistor AGHPF1 75 AGFU 76 External-capacitor required AGFR 77 External-capacitor required VCC1 78 Power SUMF/SUMF2 79 Analog-Input/ /External-capacitor required Power supply connected terminal(5V) VDD SUM RF input/SUM differential amp. DC filter connected terminal RFIP 80 RFIN 81 Differential-Input VDD RF differential input terminal SRVREF FVREFO 82 Analog-Input VDD DSP supply voltage (3.3V) input terminal 83 Analog-Output 2.5V reference bias voltage output terminal IREFT 84 External-resistor required Terminal to connect reference current setting external resistor VREF1 85 Analog-Output HAVC 86 Analog-Input VCC Pickup reference voltage input terminal SA 87 Analog-Input VCC Sub beam 4D input terminal SB 88 Analog-Input SC 89 Analog-Input SD 90 Analog-Input VCC Main beam 4D input terminal VDD2 91 Power MA 92 Analog-Input MB 93 Analog-Input MC 94 Analog-Input MD 95 Analog-Input GND2 96 Ground AIN1 97 Analog-Input AIN2 98 Analog-Input AIN3 99 Analog-Input SIGM 100 Analog-Output 59 2.1V reference bias voltage output terminal Power supply connected terminal(3.3V) Ground connected terminal VDD Analog input terminal Analog signal monitoring output terminal IC301 (R8J32007FPV) : Encoder, Decoder & DSP Singal Processor 216 215 214 213 212 211 210 209 208 207 206 205 204 203 202 201 200 199 198 197 196 195 194 193 192 191 190 189 188 187 186 185 184 183 182 181 180 179 178 177 176 175 174 173 172 171 170 169 168 167 166 165 164 163 CPU15 A17 EF G SFG TLD SPD LDD LE D GPIO04 ICUIN8 ICUIN6 ICUIN7 TE STB1 TE STB2 MRSTB VSSIO VCCIO VCC PTE ST3 VDDAA PTE ST2 VSSA REXT VDDAA PTE ST1 VSSA VINP VDDAA VINN VSSA VCCA VCCA DAVC TV DN TV DP TRD FOD GAD1 GAD0 BCENT TIB H TCPH LPSA TE AT ZC SIGM PE FE VSSA VSSA VCCA W1LPF0 W1LPF1 W1LPF2 1.1 Pin Layout R8J32007 Top View 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 W2LPF0 W2LPF1 W2LPF2 VDD AA VSSAA DE FECT BL AN K LN DTRK WOBSIG L OWZB ID GATE RFH L D IP1LP PIN IP2M IRR VCCI O VSSIO VDD VSS VSSA NRZI NRZIB DCL K B DCL K VCCA WRGATEB SRFH SRFL WRSTOP WRGATE2 VCCI O VSSIO VSS VDD WBL SH MPDS H WFPDSH RFPDSH TCSHSPBLV LDB USY WDEN RFDEN SDAT A SCL K FE MCK TRST TDO TDI TCK TMS TE ST3 TE ST2 TE ST1 TE ST0 DOUT 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 A2 GPIO05 VSSIO VCCIO HR STB DATA7 DATA8 DATA6 DATA9 DATA5 DAT A10 DATA4 DAT A11 DATA3 DAT A12 DATA2 DAT A13 VDD VSS VSSIO VCCIO DATA1 DAT A14 DATA0 DAT A15 DREQ ZIOWB ZIORB IORDY DACKB HIN TRQ IOCS16B VSSIO VCCIO DA1 PDIA GB DA0 DA2 CS1FXB CS3FXB DASPB GPIO07 GPIO06 ROUT VCCA LOU T ADIP VR1 ADIP VRT ADIPINP VSSA VSSA XCO XCI VCCA VSSR VCCR CPU14 CPU13 CPU12 VSSIO VCCIO VCCRQ CPU11 CPU10 VSSRQ CPU9 CPU8 CPRDB UCS0B A1 CPU0 CPU1 CPU2 CPU3 CPU4 VSSRQ CPU5 CPU6 CPU7 VCCRQ VSS VDD A16 A15 VSSIO VCCIO A14 A13 A12 A11 A10 A9 A20 CPWRB VDD VSS A19 A18 A8 A7 A6 A5 A4 A3 VSSIO VCCIO VCCR VSSR 60 1.2 Block Diagram CAV AUDIO VINP VINN Data PLL ADC WPLL DVD Scramble LPP Detector Wobble Generator ADC CD-DSP Jitter Counter W2LPF[2:0] ADIPVR1 ADIPVRT ADIPINP DVD PI-ECU ADIP Detector DVD PO-ECU IP1LPPIN IP2MIRR LOWZB IDGATE RFHLD NRZI,NRZIB DCLK,DCLKB WGATEB WRGATE2 SRFH SRFL WRSTOP WBLSH MPDSH WFPDSH RFPDSH TCSHSPBLV ATAPI DREQ DACKB DASPB CS3FXB CS1FXB PDIAGB DA2 DA1 DA0 IOCS16B HINTRQ IORDY ZIORB ZIOWB HRSTB DATA [15:0] PRML W1LPF[2:0] WOBSIG LOUT ROUT DOUT DVD Descramble CD-ROM Decoder REXT PTEST [2:0] AUDIO DRAM Interface Demodulate LVDS Modulator SDRAM 16Mbit XCI XCO Clock Generator FEMCK CD CD-ROM Encoder MRSTB Test Control TESTB[1:2] TEST[3:0] Sample SCLK SDATA RFDEN WDEN LDBUSY DRAM Hold Serial I/F TLD LDD LED SPD LNDTRK SFG EFG DERECT ATZC BLANK FE PE SIGM ZCS RD[15:0] RA[12.10:0] RAMCL DWE DRAS DCAS DQMU DQML DCKE CPWRB CPRDB A[20:0] MCIF Cmp UCS0B GPIO05(UCS1B) CPRDB CPWRB A[20:1] GPIO04(A[0]) CPU[15:0] CPU[15:0] UCS2B UCS3B ADC Servo MSEQ GPIO06(CSEL) TE LPSA WAIT ADGATEB INT0B INT1B INT2B FOK INT3B ADC GPIO07(HEATRUN) H8S ICUIN6(EJECTSW) ICUIN7(ACTFLG) CPU ICUIN8(LOADIN) SSEQ FOD DAVC TRD TVDP TVDN TCPH TIBH BCENT FAD0(VRDC2N) GAD1 61 TRST(NMI) DAC BCA DAC Auth ADC TCK(SCK) TDI(SCI) TDO(SCO) TMS 1.3 Pin Table Pin no 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 Pin Name VSSR VCCR CPU14 CPU13 CPU12 VSSIO VCCIO VCCRQ CPU11 CPU10 VSSRQ CPU9 CPU8 CPRDB USC0B A1 CPU0 CPU1 CPU2 CPU3 CPU4 VSSRQ CPU5 CPU6 CPU7 VCCRQ VSS VDD A16 A15 VSSIO VCCIO A14 A13 A12 A11 A10 A9 A20 CPWRB VDD VSS A19 A18 A8 A7 A6 A5 A4 A3 VSSIO VCCIO VCCR VSSR Pin no 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 Pin Name A2 GPIO05 VSSIO VCCIO HRSTB DATA7 DATA8 DATA6 DATA9 DATA5 DATA10 DATA4 DATA11 DATA3 DATA12 DATA2 DATA13 VDD VSS VSSIO VCCIO DATA1 DATA14 DATA0 DATA15 DREQ ZIOWB ZIORB IORDY DACKB HINTRQ IOCS16B VSSIO VCCIO DA1 PDIAGB DA0 DA2 CS1FXB CS3FXB DASPB CPIO07 CPIO06 ROUT VCCA LOUT ADIPVR1 ADIPVRT ADIPINP VSSA VSSA XCO XCI VCCA Pin no 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 Pin Name DOUT TEST0 TEST1 TEST2 TEST3 TMS TCK TDI TDO TRST FEMCK SCLK SDATA RFDEN WDEN LDBUSY TCSHSPBLV RFPDSH WFPDSH MPDSH WBLSH VDD VSS VSSIO VCCIO WRGATE2 WRSTOP SRFL SRFH WRGATEB VCCA DCLK DCLKB NRZIB NRZI VSSA VSS VDD VSSIO VCCIO IP2MIRR IP1LPPIN RFHLD IDGATE LOWZB WOBSIG LNDTRK BLANK DEFECT VSSAA VDDAA W2LPF2 W2LPF1 W2LPF0 Pin no 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208 209 210 211 212 213 214 215 216 Pin Name W1LPF2 W1LPF1 W1LPF0 VCCA VSSA VSSA FE PE SIGM ATZC TE LPSA TCPH TIBH BCENT GAD0 GAD1 FOD TRD TVDP TVDN DAVC VCCA VCCA VSSA VINN VDDAA VINP VSSA PTEST1 VDDAA REXT VSSA PTEST2 VDDAA PTEST3 VCC VCCIO VSSIO MRSTB TESTB2 TESTB1 ICUIN7 ICUIN6 ICUIN8 GPIO04 LED LDD SPD TLD SFG EFG A17 CPU15 62 1.4 Pin Functions It corresponds to the following signs as a pin I/O specification. AI : AO : AIO : I: IU : O: TO : IO : Analog Input Analog Output Analog Input/Output Standard Input Standard Input with Pull Up Standard Output Standard Three State Output Standard Input/Output IOU : 5I : 5O : 5TO : 5IO : PW : GND : Standard Input/Output with Pull Up 5V Tolerant Input 5V Tolerant Output 5V Tolerant Three State Output 5V Tolerant Input/Output Power Supply Pin Earth Pin Data PLL/PRML Pin List Pin Name Pin No. I/O destination Function VINP VINN 190 188 AI AFE RF signal normal phase input pin RF signal counter phase input pin REXT 194 AO External Resistance Resistor connect pin for reference current generation PTEST1 PTEST2 PTEST3 192 196 198 AO External Resistance PRML/Data PLL moniter D/A output pin PRML/Data PLL moniter D/A output pin Data PLL VCO control voltage monitor pin Wpll Pin List Pin Name Pin No. W1LPF0 165 W1LPF1 164 W1LPF2 163 W2LPF0 W2LPF1 W2LPF2 63 162 161 160 I/O destination Function AO External Components Write PLL1 filter connect pin (0) Write PLL1 filter connect pin (1) Write PLL1 filter connect pin (2) AO External Components Write PLL2 filter connect pin (0) Write PLL2 filter connect pin (1) Write PLL2 filter connect pin (2) Servo Pin List Pin Name Pin No. I/O destination Function BLANK 156 I AFE Blank signal input (also connected to the H8S interrupt port INT5) DEFECT 157 I AFE Defect (scratch detect) signal SFG 213 IU DRVR EFG 214 I PU Spindle FG pulse (also input to the H8S interrupt port INT4) Spindle FG pulse for Light Scribe (also input to the H8S interrupt port INT4) TLD 212 TO DRVR Tilt drive signal (PWM output) SPD 211 TO DRVR Spindle drive signal (PWM output) LDD 210 TO DRVR Loading drive signal (PWM output) LED 209 TO PU LPS_LED control signal (PWM output) ATZC 172 AI AFE Tracking Zero Cross input signal FE 169 AI AFE Focus error: sampled at 352.8 kHz PE 170 AI AFE Laser power error: sampled at 352.8 kHz SIGM 171 AI AFE Signal monitor: sampled at 88.2/176.4 kHz TE 173 AI AFE Tracking error: sampled at 352.8 kHz LPSA 174 AI AFE Lens positioning/lens error: sampled at 88.2 kHz TCPH 175 AI AFE Tracking center/BETA top hold: sampled at 44.1/176.4 kHz TIBH 176 AI AFE Tilt error/BETA bottom hold: sampled at 44.1/176.4 kHz BCENT 177 AI AFE BETA center: sampled at 176.4 kHz GAD1 179 AI General AD input: sampled at 88.2 kHz GAD0(VRDC2N) 178 AI General AD input: sampled at 176.4 kHz FOD 180 AO DRVR Focus control signal TRD 181 AO DRVR Tracking control signal TVDP TVDN 182 183 AO DRVR Sled drive signal (normal phase) Sled drive signal (counter phase) DAVC 184 AO DRVR Servo system Vcc/2 voltage output pin 64 ATAPI Interface Pin List Pin Name Pin No. I/O HRSTB DA2 DA1 DA0 59 92 89 91 5I 5I ATAPI ATAPI ATAPI-IF control signal (host reset signal) ATAPI-IF register address signal DATA[15:0] 79,77,71, 69,67,65, 63,61,60, 62,64,66, 68,70,76, 78 5IO ATAPI ATAPI- IF data bus DREQ 80 5TO ATAPI ATAPI-IF DMA request signal ZIOWB 81 5I ATAPI ATAPI-IF write strobe pulse ZIORB 82 5I ATAPI ATAPI-IF read strobe pulse IORDY 83 5TO ATAPI ATAPI-IF control signal (drive Ready) DACKB 84 5I ATAPI ATAPI-IF DMA acknowledge HINTRQ 85 5TO ATAPI ATAPI-IF drive interrupt signal IOCS16B 86 5TO ATAPI ATAPI-IF control signal (16-bit transfer) PDIAGB 90 5IO ATAPI ATAPI-IF control signal CS1FXB CS3FXB 93 94 5I ATAPI ATAPI-IF register chip select signal DASPB 95 5IO ATAPI ATAPI-IF control signal 65 destination Function Encoder Interface Pin List Pin Name Pin No. I/O destination Function IP1LPPIN 150 I AFE PID area identification signal/LPP input signal IP2MIRR 149 I AFE PID area identification signal/MIRR signal WOBSIG LOWZB 154 153 I O AFE AFE Wobble signal input Input impedance switch control signal/SPDSH; running OPC sampling pulse (Pit top) IDGATE 152 O AFE ID/data switch signal RFHLD 151 O AFE VFO3 holding signal and track center signal sample & hold signal WRGATE2 134 O AFE Write gate signal output WBLSH 129 O AFE Wobble signal sampling pulse MPDSH 128 O AFE Main beam sampling pulse WFPDSH 127 O AFE Laser control sampling pulse (Front monitor write/erase block) RFPDSH 126 O AFE Laser control sampling pulse (Front monitor read block) TCSHSPBLV 125 O AFE VFO1 track center signal sample & hold pulse; /SPBLVL running OPC sampling pulse (Pit end) WRGATEB 138 O PU Write gate signal SRFH 137 O PU I- V amplifier gain switch (HI side) /I- V amplifier gain switch (for binary) SRFL 136 WRSTOP 135 I PU LNDTRK 155 O AFE/PU NRZI 143 AO PU NRZIB 142 DCLK 140 DCLKB 141 ADIPVR1 101 AO External Cpmponents AD related pin for ADIP detection ADIPVRT 102 AO External Cpmponents AD related pin for ADIP detection ADIPINP 103 AI ADIP detect input pin I- V amplifier gain switch (Low side) Write stop gate signal Land/groove switch NRZI output after modulation (normal phase) NRZI output after modulation (counter phase) AO PU NRZI sync clock (counter phase) NRZI sync clock (normal phase) AFE Serial Communication Interface Pin List Pin Name Pin No. I/O destination Function LDBUSY 124 IO LDD LDD serial IF busy also functions as the CPU general port 1-0 WDEN 123 O LDD LDD microcomputer I/F (transfer enable signal) RFDEN 122 O AFE AFE microcomputer I/F (transfer enablesignal) SDATA 121 IO AFE/LDD AFE/LDD microcomputer I/F (transfer data signal 3Vsystem) SCLK 120 O AFE/LDD AFE/LDD microcomputer I/F (transfer clock signal) 66 Audio Interface Pin List Pin Name Pin No. I/O destination Function DOUT 109 IO ATAPI Digital output pin,also functions as the CPU general port 1-2 ROUT 98 AO ATAPI Audio Lch & Rch output LOUT 100 Clock Generator Pin List Pin Name Pin No. I/O destination Function FEMCK 119 O AFE Front End LSI clock XCO 106 O X’tal Crystal oscillation 33.8688MHz XCI 107 I X’tal Crystal oscillation 33.8688MHz H8S Micro-Processor Pin List CPU Pin Name ICUIN7(ACTFLG) Pin No. I/O destination Function 205 IU DRVR CPU interrupt port INT7: Pick up protect flag ICUIN6(EJECTSW) 206 I Eject Switch CPU interrupt port INT6: EJECTSW interrupt request ICUIN8(LOADIN) 207 IO GPIO07(HEATRUN) 96 5IO ATAPI CPU general port 0-7 :Off heat run test input GPIO06(CSEL) 97 5IO ATAPI CPU general port 0-6 ATAPI CSEL GPIO04(A0) 208 IO SRAM CPU general port 0-4, also functions as H8S / A0 GPIO05(UCS1B) 56 IO SRAM CPU general port 0-5, also functions as H8S / CS1 Load Switch CPU general port1-1 also connected to the CPU interrupt port INT8: Loader in sensor Flash/SRAM Pin List Pin Name UCS0B Pin No. 15 I/O O destination Flash Function H8S / CS0 CPWRB 40 O Flash / SRAM H8S / WRB CPRDB 14 O Flash / SRAM H8S / RDB A[20:1] 39,43,44, 215,29,30, 33,34,35, 36,37,38, 45,46,47, 48,49,50, 55,16 O Flash / SRAM H8S / A[20:1] CPU[15:1] 216,3,4, 5,9,10, IO Flash / SRAM H8S / D[15:0] CPU[0] can also function as the CPU general port 0-4 (multiplexed). 12,13,25, 24,23,21, 20,19,18 17 67 LSI/TEST Control Pin List Pin Name MRSTB Pin No. 202 I/O I destination RESET IC Function Master reset input TESTB2 TESTB1 203 204 I TMS 114 IU E10emulator Test data switch for E10emulator TCK 115 IOU E10emulator Test clock for E10 emulator It can function as a SCI serial clock output port when E10 emulator is not used (multiplexed). TDI 116 IU E10emulator Test data input for E10 emulator It can function as a SCI serial data input port when E10 emulator is not used (multiplexed). TDO 117 O E10emulator Test data output for E10 emulator It can function as a SCI serial data output port when E10 emulator is not used (multiplexed). TRST 118 I E10emulator Test reset for E10 emulator /Non-mask CPU interrupt port(falling edge sense) TEST0 TEST1 TEST2 TEST3 110 111 112 113 IO Test select User test/CPU general port2 Test monitor can be set as the following table by a register T*SEL[3:0] TEST0 TEST1 TEST2 TEST3 0 Servo monitor 0 Servo monitor 1 Servo monitor 2 Servo monitor 3 1 WPLL monitor 0 WPLL monitor 1 WPLL monitor 2 WPLL monitor 3 2 Audio 0 Audio 1 Audio 2 Audio 3 3 DVD modulation 0 DVD modulation 1 DVD modulation 2 DVD modulation 0 4 DVD-R/CD-R monitor 0 DVD-R/CD-R monitor1 DVD-R/CD-R monitor 2 DVD-R/CD-R monitor 3 5 DVD+RW monitor 0 DVD+RW monitor1 DVD+RW monitor 2 DVD+RW monitor 3 6 PI/C1 PI/C1 PI/C1 PI/C1 7 PO/C2 PO/C2 PO/C2 PO/C2 8 DEMO 0 DEMO 1 DEMO 2 DEMO 3 9 - - - - 10 CLVCK CLVCK CLVCK CLVCK 11 BLEND BLEND BLEND BLEND 12 PRML monitor 0 PRML monitor 1 PRML monitor 2 PRML monitor 3 13 Data PLL monitor 0 Data PLL monitor 1 Data PLL monitor 2 Data PLL monitor 3 14 RAMCON monitor 0 RAMCON monitor 1 RAMCOM monitor 2 RAMCON monitor 3 15 MIF monitor 0 MIF monitor 1 MIF monitor 2 MIF monitor 3 16 WOBREF monitor 0 WOBREF monitor 1 WOBREF monitor 2 WOBREF monitor 3 T*SEL can be set for each of pins TEST3, TEST2, TEST1, and TEST0, respectively. 68 Power Supply/GND Pin List Pin Name VDD Pin No. 28,41,72, I/O PW Function DSP core power supply (1.5V) PW SDRAM power supply (3.3V) 130,146 VCCR 2,53 VCCRQ 8,26 VDDAA 159 SDRAM I/O power supply (3.3V) PW 189,193,197 VCCA 99 1.5V system analog power supply (1.5V) WPLL1,2 1.5V system analog power supply (1.5V) PRML A/D Data PLL PW Analog power supply (3.3V):AUDIO / ADIP 108 Analog power supply (3.3V):PLL multiplication 139 Analog power supply (3.3V):LVDS 166 Analog power supply (3.3V):WPLL1,2 185 Analog power supply (3.3V):Servo A/D D/A 186 Analog power supply (3.3V):PRML A/D Data PLL VCC 199 PW Digital power supply (3.3V):PRML A/D Data PLL VCCIO 7,32,52, PW DSP I/O power supply (3.3V) 58,75,88, 133,148,200 VSS 27,42,73, GND DSP core GND 131,145 VSSR 1,54 GND SDRAM GND VSSRQ 11,22 GND SDRAM I/O GND VSSA 104 GND Analog GND:AUDIO / ADIP 105 Analog GND:PLL multiplication 144 Analog GND:LVDS 167 Analog GND:WPLL1,2 168 Analog GND:Servo A/D D/A 187,191,195 VSSAA 158 GND 1.5V system analog GND:WPLL1,2 VSSIO 6,31,51, GND DSP I/O GND 57,74,87, 132,147,201 69 Analog GND:PRML A/D Data PLL Connected SDRAM I/O GND through 6,31pin IC601 (R2S30202FP) : SPINDLE MOTOR AND 6CH ACTUATOR DRIVER VM1 22 STTH SPGS 23 24 ACTRST 25 LO+ 27 VM3 LO28 26 TO- GND FO+ 34 29 FO35 30 TL+ 36 TO+ TL37 31 TLIN 38 GND TOIN 39 5VCC FOIN 40 32 LOIN 41 33 REF 42 Pin Layout 18 19 20 21 FG EN1 EN2 16 COMMON SLLIM 15 ACTFLG 17 14 TEST 13 9 SL1+ V 8 SL2- W 7 GND 12 6 SL2+ U 5 VM2 11 4 SPLIM 10 3 SL2IN SL1- 2 GND 1 SPIN SL1IN R2S3 0202FP Package outline : 42 PIN POWER SSOP (42P9R-K) Pin Function No Pin name 1 SPIN 2 SL1IN 3 SL2IN 4 SPLIM 5 VM2 6 SL2+ 7 GND 8 SL29 SL1+ 10 SL111 GND 12 U 13 V 14 W 15 ACTFLG 16 COMMON 17 TEST 18 SLLIM 19 FG 20 EN1 21 EN2 Function Spindle control voltage input Slide control voltage input1 Slide control voltage input2 Input terminal for spindle current limit Motor Power Supply 2(for Slide) Slide non-inverted output2 GND Slide inverted output2 Slide non-inverted output1 Slide inverted outptut1 GND Motor drive output U Motor drive output V Motor drive output W Pickup protect flag output Motor common Test terminal (*1) Input terminal for slide current limit Frequency generator output Input terminal for enable 1 Input terminal for enable 2 No Pin name 42 REF 41 LOIN 40 FOIN 39 TOIN 38 TLIN 37 TL36 TL+ 35 FO34 FO+ 33 GND 32 5VCC 31 TO+ 30 TO29 GND 28 LO27 LO+ 26 VM3 25 ACTRST 24 STTH 23 SPGS 22 VM1 Function Reference voltage input Loading control input Focus control voltage input Tracking control voltage input Tilt control voltage input Tilt inverted output Tilt non-inverted output Focus inverted output Focus non-inverted output GND 5V Power Supply (for FS,TS,TL) Tracking non-inverted output Tracking inverted output GND Loading inverted outptut Loading non-inverted output Power Supply3(for Loading) Pickup protect Reset (*2) Reference voltage for spindle start up Input terminal for gain select SPM Motor Power Supply 1(for Spindle) *1) Please connect 17terninal (TEST) to GND or open, for TEST. *2) Please connect 25terminal(ACTRST) to 5VCC, When the Pick-up protection circuit is not used. 70 7-13.2V STTH V OUTPUT Ron 1ohm U CLK STARTER + SPLIM TSD Frequenc y 150KHz PWM CIRCUIT FG(x3) Reverse detect 6.4MHz commutation Commutation p cho nt urre C SWICHING SIN W M PW p er - For SLIDE SPIN COMMON VM1 CTL DSP GND Current sense FG BACK EMF DETECTER Current gain 3A/V 0.6A/V DSP For SPINDLE SPM V/V converter REF DSP FOIN DSP VM2 7-13.2V A MP FO- 4.5-5.5V GND re Cu r nt ch PWM CIRCUIT er opp Current gain 0.88 A/V CTL Frequenc y 75KHz Volt age gain x 12 B TL + M SL2IN DSP M PW A MP TR- DSP re Cu r nt ch er opp Frequenc y 75KHz PWM CIRCUIT CTL Current gain 0.88 A/V Volt age gain x 12 B TL TLIN A MP M PW Volt age gain x 12 B TL 7-13.2V 4.5-5.5V M LO+ - H Bridge ENABLE Gain Select (SPM) TEST mode VM3 For /FO/TR/TILT ACTRST OUTPUT Ron 1.5ohm FO+ DSP 5VCC SL2- SLIDE1 V/V converter Current sense TRIN SL1IN TLDSP OUTPUT Ron 1.5ohm TR+ Current sense GND + SL1+ SL2+ OUTPUT Ron 1.8 ohm DSP DSP OUTPUT Ron 1.5ohm TL+ SLLIM SLIDE2 V/V converter DSP STM SL1OUTPUT Ron 1.8 ohm Pickup Protect ACTFLG LO+ For LOADING OUTPUT Ron 1.5ohm TEST GND EN 1 EN 2 SPGS DSP DSP Block Diagram 71 Input/Output circuit diagram SPIN, SL1IN, SL2IN LOIN FOIN, TOIN,TLIN TEST 5VCC 5VCC REF EN1, EN2 5VCC 5VCC 100 100 100 100 17k 35k SPGS ACTFLG,FG ACTRST (Temperature monitor) COMMON 5VCC VM1 5VCC 5VCC 5VCC 5VCC 10k 100 100 COMMON 25k VM1, U, V, W VM2, SL1+, SL1-, SL2+, SL2VM2 VM1 U V W SL1+ 5VCC, FO+, FO-, TO+, TO-, TL+, TL- SL1- SL2+ VM3, LO+, LO- 5VCC FO+ 72 FO- TO+ TO- SL2- VM3 TL+ TL- LO+ LO- 100 TROUBLESHOOTING GUIDE (01) Laser Power Adjust (using RD Power/WR Power/Erase Power) MPU & DSP IC301 Pickup Setting FFC Pin#175 AFE IC101 #12 Front Monitor LD Driver FFC #6 #10 IC102 pin#98 (02) High Frequency/NRZI skew Adjust Pickup FFC 17,18,20,21 MPU & DSP IC301 LD Driver FFC (03) Data Slice/Equalizer Boost/Raw Slice/ Equalizer Frequency Adjust MPU & DSP IC301 Pin#79 Pin#110 AFE IC101 C137 Pin#203 Pin#21 (04) Circuit Offset Adjust Pin# 87-90 Setting FE:R102,C405 MPU & DSP IC301 Pickup FFC #2 AFE IC101 TE:R101,C101 #1 PE:R103,C406 #3 (05) Focus Amp. Adjust for DVD-Dual DVD-Dual Disc Setting AFE IC101 FE:R102,C405 Pin# 87-90 Pickup FFC #2 MPU & DSP IC301 Focus:#34-35 R329,C335 #40 Driver IC601 Slider FPC Slider, #6,8-10 73 (06) Focus Amp. and Total Amp. Adjust Setting AFE IC101 FE:R102,C405 MPU & DSP IC301 All Disc Pin# 87-90 Pickup FFC #2 PE:R103,C406 #3 Focus:#34-35 R329, C335 Driver IC601 #40 (07) Tracking Amp. Adjust All Disc Setting AFE IC101 TE:R101,C101 Pin# 87-90 Pickup FFC #1 MPU & DSP IC301 R330 C336 Tracking #30-31 Driver IC601 #39 Slider FPC Slider:#6,8-10 All Disc (08) Servo Loop Gain Adjust Setting FE:R102,C405 MPU & DSP IC301 #2 TE:R101,C101 R329,C335 R330,C336 74 AFE IC101 #1 Pin# 87-90 FFC Pickup Focus:#34-35 Tracking:#30-31 #40 #39 Driver IC601 Slider FPC Slider:#6,8-10 (09) Unwritten Slice Level Adjust for DVD-RAM DVD-RAM Disc Setting AFE IC101 MPU & DSP IC301 Pin# 80-81 FFC Pickup SIGM:R148, C151 #100 #171 Slider FPC Slider:#6, 8-10 Driver IC601 (10) Focus Offset Adjust for DVD-ROM, CD-R/RW DVD-ROM Disc MPU & DSP IC301 Pin# 87-90,80-81 AFE IC101 Setting FFC Pickup FE:R102,C405 #2 Slider FPC Slider:#6, 8-10 Driver IC601 (11) Focus Offset Adjust for DVD-RAM (PID Amp) DVD-RAM Disc AFE IC101 Setting MPU & DSP IC301 SIGM:R148,C151 Pin# 87-90,80-81 FFC Pickup #100 Driver IC601 Slider FPC Slider:#6, 8-10 (12) Focus Offset Adjust for DVD-RAM (Data Error pulse) Setting MPU & DSP IC301 AFE IC101 C341,343 DVD-RAM Disc Pin# 87-90,80-81 FFC Pickup #67,68 Driver IC601 Slider FPC Slider:#6, 8-10 75 (13) Tilt Adjust for DVD-RAM MPU & DSP IC301 DVD-RAM Disc Pin# Setting AFE 87-90,80-81 Pickup IC101 TCE:R106, C106 FFC #6 TIE:R107,C107 #7 Driver IC601 Slider FPC Slider:#6, 8-10 (14) Tilt Adjust for DVD-R/RW, DVD+R/RW, CD-R/RW Setting MPU & DSP IC301 TE:R101, C101 AFE IC101 DVD-R/RW Disc Pin# 87-90, 80-81 FFC #1 Pickup TILT: #36-37 #181 TRD:R330,C336 Driver IC601 #39 Tracking: #30-31 Slider FPC Slider:#6,8-10 (15) Focus Deviation Adjust Pin# 87-90,80-81 Pickup Setting AFE IC101 FE:R102, C405 MPU & DSP IC301 DVD-R/RW Disc FFC #2 FE:#34-35 FE R329, C335 #40 Driver IC601 (16) Focus Offset Adjust for DVD-R/RW, DVD+R/RW, CD-R/RW Setting MPU & DSP IC301 TE:R101, C101 AFE IC101 DVD-R/RW Disc Pin# 87-90,80-81 FFC Pickup #1 #181 TRD: R330, C336 76 Tracking:#30-31 Driver #39 IC601 Slider FPC Slider:#6, 8-10 (17) Lens Sensitivity Adjust Pickup MPU & DSP IC301 #178 (Temp.Information) FFC putemp (18) Spindle Offset Adjust #211 MPU & DSP IC301 Pin# 12-14 #1 Driver IC601 SPD:R349, C349 #213 FG Spindle FFC #19 (19) ADIP BPF/Read Timing Adjust for DVD+R/RW Setting MPU & DSP WobSIG IC301 #154 AFE IC101 DVD+R Disc Pin# 87-90,80-81 FFC Pickup #37 Driver IC601 Slider FPC Slider:#6, 8-10 (20) Focus Offset Adjust for DVD-R/RW, DVD+R/RW(DID) Setting MPU & DSP IC301 DVD-R/RW Disc AFE IC101 C341, 343 #67,68 Pin# 87-90,80-81 FFC Pickup #39 Driver IC601 Slider FPC Slider:#6,8-10 77 (21) RTZ TimeOut Fail AFE IC101 Driver IC601 Slider FPC Slider:#6,8-10 Slider/ Spindle #43 Spindle FFC (22) Focus Servo/Tracking Servo Fail Setting AFE IC101 FE:R102,C405 #2 MPU & DSP IC301 All Disc Pin# 87-90 FFC Pickup TE:R101,C101 #1 Focus:#34-35 Tracking:#30-31 PE:R103,C406 #3 R329,C335 R330, C336 78 FOD #40 Driver IC601 TRD #39 Slider FPC Slider:#6,8-10 Detail Error Code & Fail Analysis 1. Laser Power Initial Adjust No. Error Code SSB Byte8,9 Contents of fail Fail Analysis Block Diagram 1 28xx (Exchange low/high byte) LP Adjust NG. 1) Check Pickup FFC Connection. 2) Check solder of IC101circumference. (pin#6, 10, 12, L150, L151) 3) Check solder of IC102. 4) Exchange Pickup(LDD, Front Monitor). 5) Exchange IC101(AFE). 6) Exchange IC301(MPU & DSP). No.01 Byte8: xxh Byte9: 28h 2 48xx High Frequency Adjust NG. 1) Check Pickup FFC Connection. 2) Exchange Pickup (LDD part). 3) Exchange IC301(DSP). No.02 3 5Exx NRZi Skew Adjust NG. 1) Check Pickup FFC Connection 2) Exchange Pickup (LDD part). 3) Exchange IC301(MPU & DSP). No.02 4 4C0x to 4C4x Data Slice Adjust NG. 1) Check solder of IC101circumference. (pin# 79, L150, L151) 2) Exchange IC101(AFE). 3) Exchange IC301(MPU & DSP). No.03 5 4C5x to 4C7x EQ Boost Adjust NG. 1) Check solder of IC101circumference. (pin# 79, L150, L151) 2) Exchange IC101(AFE). 3) Exchange IC301(MPU & DSP). 6 4C80 RAW Slice Level Adjust NG. 1) Check solder of IC101circumference. (pin# 79, L150, L151) 2) Exchange IC101(AFE). 3) Exchange IC301(MPU & DSP). 7 4CAx EQ Auto Frequency Adjust NG. 1) Check solder of IC101circumference. (pin# 79, L150, L151) 2) Exchange IC101(AFE). 3) Exchange IC301(MPU & DSP). 79 2. Adjusting Error during Disc Load Sequence (Lead in Error) No. Error Code SSB Byte21,22 Contents of fail Fail Analysis Block Diagram 1 42xx Circuit Offset Adjust NG. 1) Check Pickup FFC Connection. 2) Check solder of IC101circumference . (pin#,1,2,3 pin#87-90, FE_Servo: R102, C405 TE_Servo: R101, C101 PE_Servo: R103, C406) 3) Exchange IC101(AFE). 4) Exchange Pickup. 5) Exchange IC301(MPU & DSP). No.04 2 452x Focus Amp Adjust NG. (DVD-DL Only) 1) Check DVD-Dual Disc. 2) Check Pickup FCC Connection. 3) Check solder of IC101circumference. (pin#1,2,3 pin#87-90, FE_Servo: R102, C405) 4) Check Slider FPC Connection. 5) Exchange IC101(AFE). 6) Exchange IC601(Driver). 7) Exchange IC301(MPU & DSP). No.05 3 450x 451x 454x Focus Amp Adjust NG. Total Amp Adjust NG. 1) Check Pickup FFC Connection. 2) Check solder of IC101circumference. (pin#1,2,3 pin#87-90, FE_Servo: R102, C405 PE_Servo: R103, C406) 3) Exchange Pickup. 4) Exchange IC101(AFE). 5) Exchange IC301(MPU & DSP). No.06 4 458x Tracking Amp Adjust NG. 1) Check Pickup FFC Connection. 2) Exchange Pickup. 3) Check solder of IC101circumference. (pin#1,2,3 pin#87-90, TE_Servo: R101, C101) 4) Exchange IC101(AFE). 5) Exchange IC301(MPU & DSP). No.07 5 47xx Servo Loop Gain Adjust NG. 47XA: Disc Unmatch(Exchange Disc). 1) Check Pickup FFC Connection. 2) Exchange Pickup (Signal Noisy). 3) Check solder of IC101circumference. (pin#1,2,3 pin#87-90, FE_Servo: R102, C405 TE_Servo: R101, C101) 4) Exchange IC101(AFE). 5) Exchange IC301(MPU & DSP). No.08 6 49xx Unwritten Slice Level Adjust NG. 4906: RAM Disc NG (Exchange Disc). (RAM Only) 1) Check solder of IC101circumference. (pin#1,2,3 pin#87-90) 2) Exchange IC101(AFE). 3) Exchange IC301(MPU & DSP). N0.09 80 No. Error Code Contents of fail SSB Byte21,22 Fail Analysis Block Diagram 7 4Axx Focus Offset Adjust NG. (DVD-ROM,CD-R/RW) 4A08: Disc Unmatch(Exchange Disc). 1) Check Pickup FFC Connection. 2) Exchange Pickup. 3) Exchange IC301(MPU & DSP). No.10 8 4A5x 4A6x Focus Offset Adjust NG. (RAM Only for PID) 1) RAM Disc NG (Exchange RAM Disc) 2) Exchange Pickup 3) Exchange IC101(AFE) 4) Exchange IC301(MPU & DSP) No.11 9 4A8x Focus Offset Adjust NG. (RAM Only for Data) 4A88: RAM Disc NG (Exchange RAM Disc). 1) Exchange Pickup. 2) Exchange IC101(AFE). 3) Exchange IC301(MPU & DSP) No.12 10 4B0x Tilt Adjust NG(RAM Only). 1) Check Pickup FFC Connection. 2) Exchange Pickup. 3) Check solder of IC101circumference. (pin#6,7 R106, C106, R107, C107) 4) Exchange IC101(AFE). 5) Exchange IC301(MPU & DSP). No.13 11 4B8x Tilt Adjust NG(DVD-/+ R/RW). 1) Check Pickup FFC Connection. 2) Exchange Pickup. 3) Check solder of IC601 circumference. 4) Exchange IC601. 5) Check solder of IC301 circumference. 6) Exchange IC301 7) Exchange Slider Motor. 12 4CCx Data Slice Adjust NG. (RAM Only) 1) Exchange Pickup. 2) Exchange IC101(AFE). 3) Exchange IC301(MPU & DSP). No.12 13 4Dxx Focus Deviation Adjust NG. 1) Check Pickup FFC Connection. 2) Exchange Pickup. 3) Check solder of IC301circumference. 4) Exchange IC301(MPU & DSP). No.15 14 182x 01xx Home Position Adjust NG. (DVD-SL Only) 1) Check FFC Connection. 2) Check Slider FPC Connection. 3) Exchange Slider Motor. 4) Check solder of IC101circumference. 5) Exchange IC101(AFE). No.21 15 52xx Focus Offset Adjust NG. (DVD-R/RW, +R/RW) 1) Check Pickup FFC Connection. 2) Exchange Pickup. 3) Check solder of IC101circumference. (pin#1,2,3 pin#87-90, TE_Servo: R101, C101) 4) Exchange IC101(AFE). No.16 No.14 81 No. Error Code SSB Byte21,22 Contents of fail Fail Analysis Block Diagram 16 54xx DPP Amp Adjust NG. (CD Disc Only) 1) Check Pickup FFC Connection. 2) Exchange Pickup. 3) Check solder of IC101circumference. (pin#1,2,3 pin#87-90, TE_Servo: R101, C101) 4) Exchange IC101(AFE). 5) Exchange IC301(MPU & DSP). No.07 17 55xx Lens Shift/ Tilt Adjust NG. (CD Disc Only) 1) Check Pickup FFC Connection. 2) Exchange Pickup. 3) Check solder of IC601 circumference. 4) Exchange IC601. 5) Check solder of IC301 circumference. 6) Exchange IC301 7) Excahange Slider Motor No.14 18 56xx Focus Level Adjust NG. 1) Check Pickup FFC Connection. 2) Exchange Pickup. 3) Check solder of IC101circumference. (pin#1,2,3 pin#87-90, PE_Servo: R103, C406) 4) Exchange IC101(AFE). 5) Exchange IC301(MPU & DSP). No.06 19 57xx HFPE Amp/Gain Adjust NG. 1) Check Pickup FFC Connection. 2) Exchange Pickup. 3) Check solder of IC101circumference. (pin#6,7 R106, C106, R107, C107) 4) Exchange IC101(AFE). 5) Exchange IC301(MPU & DSP). No.13 20 58xx Lens Sensitivity Adjust NG. 1) Check Pickup FFC Connection. 2) Exchange Pickup. 3) Check solder of IC301circumference. 4) Exchange IC301(MPU & DSP). No.17 21 59xx Spindle Offset Adjust NG. 1) Check Spindle FFC Connection. 2) Check solder of IC601circumference. (pin#12-14) 3) Exchange IC601(Driver). 4) Exchange Spindle Motor. 5) Check solder of IC301circumference. 6) Exchange IC301(MPU & DSP). No.18 82 No. Error Code SSB Byte21,22 Contents of fail Fail Analysis Block Diagram 22 5Axx ADIP read timing Adjust NG. 5A01: Check DVD+R Disc (Exchange Disc) . No.19 1) Check Pickup FFC Connection. 2) Exchange Pickup. 3) Exchange IC101(AFE). 4) Exchange IC301(MPU & DSP). 5) Exchange IC601(Driver) 23 5Cxx Signal Amp Error. 1) Check Pickup FFC Connection. 2) Exchange Pickup. 3) Check solder of IC101circumference. (pin#1,2,3 pin#87-90, PE_Servo: R103, C406) 4) Exchange IC101(AFE). 5) Exchange IC301(MPU & DSP). No.06 24 5Dxx Focus Offset Adjust NG. (DVD-R/RW,+R/RW in Data) 1) Check Pickup FFC Connection. 2) Exchange Pickup. 3) Check solder of IC101circumference. 4) Exchange IC101. 5) Check solder of IC701circumference. 6) Exchange IC301(MPU & DSP). 7) Exchange Slider Motor. No.20 83 3. Loading Sequence Error (Lead in Error) No. Error Code SSB Byte21,22 Contents of fail Fail Analysis Block Diagram 1 2503,2504 RTZ Timeout(Sled Timeout). 1) Check Slider FPC Connection. 2) Check solder of IC601 circumference . (pin#2-3, 6, 8-10) 3) Exchange IC601. 4) Exchange Slider Motor. No.21 2 2020,2021 Focus Fail. 1) Check Pickup FFC Connection. 2) Exchange Pickup. 3) Check solder of IC601circumference. 4) Exchange IC601(Driver) 5) Check solder of IC101circumference. (pin#1,2,3pin#87-90, FE_Servo: R102, C405) 6) Exchange IC101(AFE). No.22 3 2101,2102 Tracking Fail. 1) Check Pickup FFC Connection. 2) Exchange Pickup. 3) Check solder of IC601circumference. 4) Exchange IC601(Driver). 5) Check solder of IC101circumference. (pin#1,2,3 pin#87-90, TE_Servo: R101, C101). 6) Exchange IC101(AFE). No.22 4 2000~2010 Spindle Fail. 1) Check Spindle FFC Connection. 2) Check solder of IC601circumference. (pin#12-14) 3) Exchange IC601(Driver). 4) Exchange Spindle Motor. 5) Check solder of IC301circumference. 6) Exchange IC301(MPU & DSP). No.18 84 JR6 Power Supply System Diagram * Ver1.0 It created based on the PLT circuit diagram. L601 Poly SW 12V 12V SW701 miniSMDC150F/24 (Raychem) DRV IC601 R2S30202FP VM1 #22 Motor power supply 1(Spindle) VM2 #05 Motor power supply 2(Slide) S705 OPEN Vso CN101 P/U (LDD) Vso5V #29 S704 OPEN L151 IC101 AFE(R2S35002) VCC1 #08 Power (5.0V) VCC2 #78 Power (5.0V) 5VR IC102 LM258-D VCC #08 (ON SEMIconductor) OP-amp CN101 P/U OEIC(Vcc) #44 & FM(Vcc) #11 Poly SW 5V in SW702 miniSMDC150F/24 (Raychem) CN101 P/U Vsa5(Vcc) #15 S713 OPEN Tr Q631 Light Scribe Encoder Module Vcc 5V UMC5N Front PWB Led Control Vcc 5V UMC5N Tr Q651 5V Audio Output Q901 Tr(UMC5N)/Q902 Tr(UMG4N) S714 OPEN 5VP L602 Torex Regurator IC703 XCM403AA03SR Vin=5.00 V V0=2.80 V IC601 DRV 5VCC(#32)/VM3(#26) CN101 P/U LDD Vsl2.8(Vcc) #16 S708 OPEN IC703 2.8V REG 2.5(2.8) S709 OPEN IC703 3.3V REG IC101 AFE (R2S35002) VDD1 #69 Power VDD2 #91 Power VDD3 #11 Power VDD4 #59 Power VDD5 #22 Power SRVREF #82 Power L150 3.3A Pc= W Vin=5.00 V V0=3.30 V IC301 DSP (R8J32007) VCCA #186 3.3V VCCA #166 3.3V 3.3A S715 OPEN 3.3A-2 R354 IC301 DSP (R8J32007) Audio VCCA #99 3.3V 0 L710 3.3D IC302 Flash Memory Fujitsu/Mcronics IC301 DSP (R8J32007) L305 Torex Regurator IC701 XCM403AA02SR Vin=2.80 V V0=1.50 V S706 OPEN IC701 1.5V REG #58 VCCIO [DSP I/O] #75 VCCIO [DSP I/O] #88 VCCIO [DSP I/O] #108 VCCA [Analog] #133 VCCIO [DSP I/O] #139 VCCA [Analog] #148 VCCIO [DSP I/O] #185 VCCA [Analog] #200 VCCIO [DSP I/O] #53 VCCR [SDRAM] #52 VCCIO [DSP I/O] #32 VCCIO [DSP I/O] #26 VCCRQ [SDRAM I/O] #08 VCCRQ [SDRAM I/O] #07 VCCIO [DSP I/O] #02 VCCR [SDRAM] IC301 DSP (R8J32007) #028 VCC Core Power] #041 VDD [Core Power] #072 VDD [Core Power] #130 VDD [Core Power] #146 VDD [Core Power] L301 L304 IC301 DSP (R8J32007) 1.5D #159 VDDAA [Analog Power] S707 OPEN 1.5A IC701 2.8V REG IC301 DSP (R8J32007) #189 VDDAA [Analog Power] #193 VDDAA [Analog Power] #197 VDDAA [Analog Power] Pc= W Vin=5.00 V V0=2.80 V 85 86 PCB Poor Analysis - Check list No Circuit/IC 1 Power supply 2 3 (IC701) 4 5 (IC703) 6 Flash-ROM 7 (IC302) 8 9 DSP 10 (IC301) Signal Signal/Level mesurement-point (IC-pin or Device) Line-12V 12V CN801-41 Line-5V 5V CN801-44 reg-1.5V 1.5V IC701-2 reg-2.8V 2.8V IC703-5 reg-3.3V 3.3V IC703-2 VDD : 3.3V 3.3V 37 CS Active-Low 26 XRD read-CK 28 VDD : 1.5V 1.5V 41, 28, 72, 130, 146, 159, 189, 193, 197 VCC(D) : 3.3V 3.3V 7, 32, 52, 58, 75, 88, 133, 148, 200, 199, 2, 53, 185, 11 VCC(A) : 3.3V 3.3V 186, 166, 99 12 Clock-34MHz 33.8688MHz 106, 107 13 MRSTB (3.3V)High 202 139, 108, 8, 26 14 AFE VCC : 5.0V 5.0V 8, 78 15 (IC101) VDD : 3.3V 3.3V 22, 11, 91, 59, 69, 82 16 OP-amp VCC : 5.0V 5.0V 8 5VCC : 5V 5V 32 VM3 : 5V 5V 26 19 VM1, 2 : 12V 12V 5, 22 20 REF : 1.65V 1.65V 42 (IC102) 17 7ch-DRV 18 (IC601) 21 VCC(FM) : 5.0V 5.0V 11 22 Pick-up VCC(OEIC) : 5.0V 5.0V 44 23 VC(OEIC) : 2.1V 2.1V 43 24 VREF : 2.5V 2.5V 9 25 VSL25 : 2.8V 2.8V 16 26 VSA5 : 5.0V 5.0V 15 27 VSO : 5.0V 5.0V 29 * When there are twe or more power supply pins of LSI, it checks by one ramdom pin first. 87 HW Self- Diagnostic function 1. Self-Diagnostic Function by LED Blink. • Basic operation: At JR6, MPU is included in DSP, MPU accesses each peripheral (inside, exterior) device, and discover a defect by the ability of a read/write of data to be performed correctly. Since MPU operates by the program with a built-in Flash-ROM, when abnormalities are in MPU, Flash-ROM, and these Data-Bus & control signals, this self-diagnostic function cannot be used. In such a case, the case where LED does not light up at all at the time of a power supply injection is almost the case. • MPU: In DSP Flash-ROM (16Mb) is connected to the exterior Bus of MPU. Even if the MPU-Bus terminal of Flash-ROM short-circuits, it becomes impossible for MPU to read the right program data from Flash-ROM, and stops for this reason, turning on LED at all. On the other hand, the own poor device of DSP, and the open state of IC-pin, when a defect does not influencing Bas of MPU, it can detect correctly and becomes blink of LED according to those defects. • DSP: DSP has ATAPI-IF, LDD-serial-IF, AFE-serial-IF, and an AFE control signal as Digital-IF. As AnalogIF, it has the slice circuit of RF signal from AFE, PLL, the objects ADC and DAC for SERVO, and ADC for ADIP detection. Among these, own poor Digital of DSP, and AFE-serial-IF can detect by this self-diagnostic function. • AFE: Poor detection of AFE is restricted to detection of a limitation-item. Since the greater part of the function is analog signal processing, AFE serves as a register in AFE, and a check, which accepts it, serial IF in the logical digital examination from MPU. In addition, serial-IF for AFE control is performed via DSP. This is writing in the Write command and setting data, and is automatically transmitted to the predetermined register of DSP. Conversely, when it leads the register information on AFE, the read command can be written in the predetermined register of DSP, and the value of an AFE register can be read by reading the read register of DSP after that. Therefore, serial [between the poor register of AFE, and AFE and DSP], when there is LED blink with poor AFE — the defect of IF or the defect of the register for AFE of DSP is considered. • Refer to the contrast table of the number of times of blink of LED, and a poor part. • The self-diagnostic function by this LED blink is carried out in the state of a set without a PCB independent or loading Disc. 88 2. LED does not blink at all at the time of a power supply injection. Eject-SW does not react. (1) Is it normal to the exterior Bus (Data-Bus, Address-Bus, control signal system) of MPU? Viewing — check: -- a short circuit, opening, etc. • The device connected to the exterior Bus of MPU in DSP, and its signal list Peripheral device Flash -ROM [Bus/Signal] (IC302) Address A1~A20 Data D0~D15 CS* CS0B WCK WR RCK RD => It repairs, when abnormalities are discovered. (2) Does the power supply circuit operate normally? External input 12V, external input 5V, regulator 3.3V, regulator 2.8V, and regulator 1.5V =>When the abnormalities are discovered, an external power supply, a power supply cable, and Regulator IC are exchanged. => Since a problem is in a load side when not improving, even if it exchanges the above, and attached sheet JR6 power-supply system figure is made reference, and poor portions, such as a short circuit of a power supply part, are found out and fixed. (3) Is the clock of MPU in DSP oscillated correctly? Checked the ceramic oscillation element’s X301 both-ends and DSP(106)(107) 33.87MHz oscillating. => When 3.3V power supply is correctly supplied to DSP and the clock is not oscillating correctly, it is the defect of MPU, or an oscillation element defect, and part exchange is performed in order of DSP and X301. (4) The defect of Flash-ROM Although the clock of DSP is oscillating correctly and the power supply circuit is also outputting normal voltage, when LED does not blink at all at the time of a power supply injection and Eject-SW does not react, either, poor Flash-ROM is the most doubtful. => Flash-ROM (IC302) are exchanged. Note: Before Flash-ROM exchange, the CS signals of the external device of MPU in DSP connection, an Address signal, and a Data signal are observed on a waveform level, and since the but most amount of work and the special knowledge which can raise the discovery accuracy of a poor part are necessities, recommendation is impossible. (5) Even if it performs the above-mentioned repair, when not improving, the disconnection and the short circuit which cannot be discovered, can be considered in viewing of PCB. Moreover, partial breakage (although a clock is oscillated, somewhere in insides do not operate.) of DSP can be considered. => When not improving above, the possibility that a PCB pattern is faulty is high, and judges repair to be difficult. 89 3. Motor, Abnormalities in Actuator System The drive circuit of a motor & actuator consists of the three ICs IC601(R2S30202FP). The work of each IC is as follows. (1) IC601(R2S30202FP) : 7ch driver Spindle motor driver: 180° audio drive Type, an analog input, a PWM drive, a Vm=12V. Stepping motor driver X2: analog input, a PWM drive (differential), a Vm=12V Loading motor driver: Input/Output PWM drive, Vm=5V. Focus actuator driver: analog input / output (differential), a Vm=5V Tracking actuator driver: analog input / output (differential), Vm=5V Tilt actuator driver : analog input/output (differential), Vm=5V. A motor & actuator and its correspondence pin Signal/CH SPDL-MT STEP-MT Load-MT Focus-ACT Track-ACT Tilt-ACT Input (1)SPIN (2)SL1IN (3)SL2IN (41)LOIN (40)FOIN (39)TOIN (38)TLIN (34)FO+ (35)FO- (31)TO+ (30)TO- (36)TL+ (37)TL- Reference Output (42)REF 1.65V (12)U (13)V (14)W (6)SL2+ (8)SL2(9)SL1+ (10)SL1- (27)LO+ (28)LO- A control mode setup by the control terminal EN1(20) Low Low High High 90 EN2(21) Low High Low High SPDL off off on on SLED off on on on Load off on off off Focus/Track/Tilt off off on on BLOCK DIAGRAM Flash-ROM (2MByte) MBM29LV160BE or Equivalent (FUJITSU) OPU:HOP-7632TS (HITACHI ME) Disc Interface connector Loading motor Analog Front End R2S35002 PU Disc motor Unit mechanism Slide motor 100pin-TQTF (RENESAS) DVD/CD DSP (DVD/CD/Servo/ATAPI) R8J32007FP 256pin LQFP (RENESAS) DVD-codec CD-codec LPP/ADIP decorder Servo DSP ATAPI-IF Microprocessor 7ch-Driver R2S30202FP SPDL/SLED/Fo/Tr/Ti/LD (RENESAS) Analog audio Host IDE Tray Detect SW Device configuration jumper MASTER SLAVE CSEL Eject SW Limit SW LED 3.3V 2.8V 3.3V/2.8V Reg.IC XCM403AA03SR (TOREX) RST 1.5V 12V GND 5V 2.8V/1.5V Reg.IC XCM403AA02SR (TOREX) RST 91
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File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.3 Linearized : Yes Page Count : 86 XMP Toolkit : XMP toolkit 2.9.1-13, framework 1.6 About : uuid:3c33f1bf-190d-4a54-8aa5-f849d4afc051 Producer : Acrobat Distiller 4.0 for Macintosh Modify Date : 2006:01:27 08:26:07-06:00 Create Date : 1979:09:07 16:44:50Z Metadata Date : 2006:01:27 08:26:07-06:00 Document ID : uuid:bdc972d5-60ee-4152-b901-db49ab215e1d Format : application/pdfEXIF Metadata provided by EXIF.tools