Lg Gsa 4165B Users Manual

GSA-4165B GSA-4165 Manual de Servicio

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Super Multi DVD Drive

S E RVICE MANUAL

MODEL: GSA-4165B/

G S A - 4 1 6 7 B /

G S A - 4 1 6 8 B

P/NO : 3828HS1047G

August 2005

Printed in Korea

MODEL : GSA-4165B/GSA-4167B/GSA-4168B

TABLE OF CONTENTS

INTRODUCTION .......................................................................................................................................................................3

FEATURES............................................................................................................................................................................3~5

SPECIFICATIONS.................................................................................................................................................................6~9

LOCATION OF CUSTOMER CONTROLS .......................................................................................................................10~11

DISASSEMBLY.................................................................................................................................................................12~13

1. CABINET and CIRCUIT BOARD DISASSEMBLY ..........................................................................................................12

1-1. Bottom Chassis..........................................................................................................................................................12

1-2. Front Bezel Assy........................................................................................................................................................12

1-3. Cabinet and Main Circuit Board .................................................................................................................................12

2. MECHANISM ASSY DISASSEMBLY..............................................................................................................................12

2-1. Pick-up Unit................................................................................................................................................................12

2-2. Pick-up ......................................................................................................................................................................13

EXPLODED VIEW.............................................................................................................................................................14~15

MECHANICAL REPLACEMENT PARTS LIST ................................................................................................................16~18

GLOSSARY.............................................................................................................................................................................19

THE DIFFERENCES OF CD-R/CD-RW DISCS AND GENERAL CD-ROM.....................................................................20~26

1. Recording Layer ..............................................................................................................................................................20

2. Disc Specification ............................................................................................................................................................20

3. Disc Materials..................................................................................................................................................................21

4. Reading Process of Optical Disc.....................................................................................................................................22

5. Writing Process of CD-R Disc .........................................................................................................................................23

6. Writing Process of CD-RW Disc......................................................................................................................................23

7. Organization of the PCA, PMA and Lead-in Area ...........................................................................................................24

8. Function of PCA and PMA area ......................................................................................................................................25

9. OPC and ROPC ..............................................................................................................................................................25

10. Writing Process of DISC................................................................................................................................................26

THE DIFFERENCES OF DVD-R/RW, DVD+R/RW DISCS AND DVD-ROM....................................................................27~35

1. Recording Layer ..............................................................................................................................................................27

2. Disc Specification ............................................................................................................................................................28

3. Disc Materials..................................................................................................................................................................28

4. Writing Pulse Waveform of DVD+R.................................................................................................................................31

5. Writing Pulse Waveform DVD+RW .................................................................................................................................33

6. Organization of Inner Drive Area, Outer Drive Area, Lead-in Zone and Lead-out Zone .................................................34

LightScribe MEDIA...........................................................................................................................................................36~39

1. LightScribe Media............................................................................................................................................................36

2. Hardware Block Diagram of LightScribe Label Printing...................................................................................................37

3. MD Assy For LightScribe.................................................................................................................................................38

4. Optical Encoder Assy ......................................................................................................................................................39

DVD & CD DATA PROCESSING......................................................................................................................................40~43

1. Data Processing Flow......................................................................................................................................................40

2. Copy Protection and Regional Code Management Block ...............................................................................................41

3. About Prevention the DVD-ROM from to be copy...........................................................................................................42

4. About the DVD-ROM Regional Code ..............................................................................................................................43

INTERNAL STRUCTURE OF THE PICK-UP....................................................................................................................44~46

1. Block Diagram of the Pick-up(HOP-7632TS) ..................................................................................................................44

2. Pick up Pin Assignment...................................................................................................................................................45

3. Signal detection of the P/U..............................................................................................................................................46

DESCRIPTION OF CIRCUIT.............................................................................................................................................47~53

1. ALPC Circuit....................................................................................................................................................................47

2. Focus Circuit....................................................................................................................................................................49

3. Tracking & Sled Circuit....................................................................................................................................................50

4. Spindle Circuit .................................................................................................................................................................53

MAJOR IC INTERNAL BLOCK DIAGRAM AND PIN DESCRIPTION.............................................................................55~72

TROUBLESHOOTING GUIDE..........................................................................................................................................73~90

BLOCK DIAGRAM..................................................................................................................................................................91

PRINTED CIRCUIT BOARD DIAGRAM ...........................................................................................................................92~96

ELECTRICAL REPLACEMENT PARTS LIST........................................................................................................................97

CAUTION - INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM.

3

This service manual provides a variety of service

information.

It contains the mechanical structure of the Super

Multi DVD Drive and the electronic circuits in

schematic form. This Super Multi DVD Drive was

manufactured and assembled under our strict quality

control standards and meets or exceeds industry

specifications and standards.

This Super Multi DVD drive is an internal drive unit

designed for use with IBM PC, HP Vectra, or

compatible computer. It can write as much as 700

Mbytes of digital data into CD-R/RW disc, and can

read as much as 700 Mbytes of digital data stored in

a CD-ROM/R/RW disc.

It can write as much as 4.7Gbytes of digital data into

DVD-R/RW/RAM/+R/+RW disc, and can read as

much as 4.7Gbytes of digital data stored in a

DVD-ROM/R/RW/RAM/+R/+RW disc.

It can write as much as 8.5Gbytes of digital data into

DVD+R DL/DVD-R DL disc, and can read as much

as 8.5Gbytes of digital data stored in a DVD-ROM

DL/+R DL/-R DL disc.

This Super Multi DVD Drive can easily meet the

upcoming MPC level 3 specification, and its

Enhanced Intelligent Device Electronics (E-IDE) and

ATAPI interface allows Plug and play integration in

the majority of today’s PCs without the need of an

additional interface card.

INTRODUCTION

1. Support feature and writable disc

*) Indicated write-in speed is a value at the time of the fastest operation.

G*A-4165B

GSA GMA GWA GRA GCA GDA

Light Scribe x x x x x x

CD-R 48x write 48x write 48x write 48x write 48x write read only

CD-RW 32x write 32x write 32x write 32x write 32x write read only

DVD-R 16x write 16x write 16x write read only 16x write 16x write

DVD-RW 4x or 6x write 4x or 6x write 4x or 6x write read only 4x or 6x write 4x or 6x write

DVD-R DL 4x write 4x write 4x write read only 4x write 4x write

DVD+R 16x write read only 16x write 16x write read only read only

DVD+RW 8x write read only 8x write 8x write read only read only

DVD+R DL 4x or 6x write read only 4x or 6x write 4x or 6x write read only read only

DVD-RAM 5x write 5x write read only read only read only 5x write

G*A-4167B

GSA GMA GWA GRA GCA GDA

Light Scribe xxx xxx

CD-R 48x write 48x write 48x write 48x write 48x write read only

CD-RW 32x write 32x write 32x write 32x write 32x write read only

DVD-R 16x write 16x write 16x write read only 16x write 16x write

DVD-RW 6x write 6x write 6x write read only 6x write 6x write

DVD-R DL 4x write 4x write 4x write read only 4x write 4x write

DVD+R 16x write read only 16x write 16x write read only read only

DVD+RW 8x write read only 8x write 8x write read only read only

DVD+R DL 6x write read only 6x write 6x write read only read only

DVD-RAM 5x write 5x write read only read only read only 5x write

G*A-4168B

GSA GMA GWA GRA GCA GDA

Light Scribe O O O O O O

CD-R 48x write 48x write 48x write 48x write 48x write read only

CD-RW 32x write 32x write 32x write 32x write 32x write read only

DVD-R 16x write 16x write 16x write read only 16x write 16x write

DVD-RW 6x write 6x write 6x write read only 6x write 6x write

DVD-R DL 4x write 4x write 4x write read only 4x write 4x write

DVD+R 16x write read only 16x write 16x write read only read only

DVD+RW 8x write read only 8x write 8x write read only read only

DVD+R DL 6x write read only 6x write 6x write read only read only

DVD-RAM 5x write 5x write read only read only read only 5x write

4

FEATURES

1 General

1) Enhanced IDE (ATAPI) interface.

2) Internal Half-height Drive.

3) CD-R/RW, DVD-R/-R DL(Dual Layer)/-RW/RAM/+R/+R DL(Double Layer)/+RW read and write

compatible CD Family and DVD-ROM read compatible.

4) Buffer Under-run prevention function embedded.

5) 2MB buffer memory.

6) Power loading and power eject of a disc. Bare media loading.

7) MTBF : 100,000 POH

8) Vertical and Horizontal installable.

2. Supported disc formats

1) Reads data in each DVD-ROM, DVD-R(Ver. 2.0 for Authoring) and DVD-RAM(Ver.1.0)

2) Reads and writes in each DVD-R(Ver. 2.0 for General), DVD-R DL(Dual Layer), DVD-RW, DVD-

RAM(Ver.2.2), DVD+R, DVD+R DL(Double Layer) and DVD+RW

3) Reads data in each CD-ROM, CD-ROM XA, CD-I, Video CD, CD-Extra and CD-Text

4) Reads data in Photo CD (Single and Multi session)

5) Reads standard CD-DA

6) Support to read Super Audio CD(Compatible layer in Hybrid type)

7) Reads and writes CD-R discs conforming to “Orange Book Part 2”

8) Reads and writes CD-RW discs conforming to “Orange Book Part 3”

9) Reads DVD-RAM with CPRM and DVD-RW with CPRM

3. Supported write method

1) DVD-R:..................Disc at Once and Incremental Recording

2) DVD-R DL .............Disc at Once, incremental Recording and Layer jump recording

3) DVD-RW:...............Disc at Once, Incremental Recording and Restricted Overwrite

4) DVD-RAM:.............Random Write

5) DVD+R:.................Sequential Recording

6) DVD+R DL: ...........Sequential Recording

7) DVD+RW:..............Random Write

8) CD-R/RW: .............Disc at Once, Session at Once, Track at Once and Packet Write

4. Performance

1) Average access time: DVD-ROM 145 ms

(1/3 stroke) CD-ROM 125 ms

2) Write speed: DVD-R 2x, 4x CLV, 8x ZCLV, 16x PCAV

DVD-R DL 2x, 4x CLV

DVD-RW 1x, 2x, 4x, 6x CLV

DVD-RAM 2x, 3x ZCLV (Ver.2.2), 3x-5x PCAV(Ver.2.2)

DVD+R 2.4x, 4x CLV, 8x ZCLV, 12x, 16x PCAV

DVD+R DL 2.4x, 4x, 6x CLV

DVD+RW 2.4x, 4x CLV, 8x ZCLV

CD-R 4x, 8x, 16x CLV, 24x, 32x, 40x, 48x ZCLV

CD-RW 4x, 10x, 16x CLV, 24x, 32x ZCLV

(High Speed: 10x, Ultra Speed: 16x, 24x, 32x)

3) Read speed: DVD-R/RW/ROM/ROM-Dual layer 10x / 8x / 16x / 12x max.

DVD-R DL 8x max.

DVD-RAM (Ver.1.0/2.2) 2x / 2x, 3x ZCLV, 3x-5x PCAV

DVD-Video(CSS Compliant Disc) 8x max. (Single/Dual layer)

DVD+R/+RW 10x / 8x max.

DVD+R DL 8x max.

CD-R/RW/ROM 48x/40x/48x max.

CD-DA (DAE) 40x max.

80mm CD 16x max.

4) Sustained Transfer rate: DVD-ROM 22.16 Mbytes/s (16x) max.

CD-ROM 7,200 kB/s (48x) max.

5) Burst Transfer rate: Ultra DMA Mode2

Multi word DMA Mode2, PIO Mode 4

6) Multimedia MPC-3 compliant

5. Audio

1) 16 bit digital data output through ATA interface

2) Software Volume Control

3) Equipped with audio line output for audio CD playback

*Definition

Transfer Rate: .........1x (DVD) = 1.385 Mbytes/s..........1x (CD) = 150 kB/s

Mbytes/s = 106bytes/s, ................kB/s = 210 bytes/s

Capacity: .................MB = 220 bytes,.............................kB = 210 bytes

5

6

SPECIFICATIONS

1. SYSTEM REQUIREMENTS

-CPU: IBM Compatible Pentium 4 2.4GHz (or faster)

(For High speed, 2.4GHz or faster recommended.)

-128MB Memory or greater

2. SUPPORTING OPERATING SYSTEM

2.1 Applicable disc formats

DVD ............................DVD-ROM: 4.7GB (Single Layer)

8.5GB (Dual Layer)

DVD-R DL: 8.5GB

DVD-R: 4.7GB (Ver.2.0 for Authoring : read only)

4.7GB (Ver.2.0 for General: read & write)

DVD-RW: 4.7GB (Ver.1.2)

DVD-RAM: 2.6GB/side (Ver.1.0)

1.46GB/side, 4.7GB/side (Ver.2.2)

DVD+R: 4.7GB

DVD+R DL: 8.5GB

DVD+RW: 4.7GB

CD...............................CD-ROM Mode-1 data disc

CD-ROM Mode-2 data disc

CD-ROM XA, CD-I, Photo-CD Multi-Session, Video CD

CD-Audio Disc

Mixed mode CD-ROM disc (data and audio)

CD-Extra

CD-Text

CD-R (Conforming to “Orange Book Part2”: read & write)

CD-RW (Conforming to “Orange Book Part3”: read & write)

2.2 Writing method

(1) DVD-R/RW...........................Disc at Once

Incremental Recording

Restricted Overwrite (DVD-RW only)

(2) DVD-R DL ............................Disc at Once

Incremental Recording

Layer jump Recording

(3) DVD-RAM/+RW ...................Random Write

(4) DVD+R.................................Sequential Recording

(5) DVD+R DL ...........................Sequential Recording

(6) CD-R/RW .............................Disc at Once (DAO)

Session at Once (SAO)

Track at Once (TAO)

Packet Write

2.3 Disc diameter..............................................120mm

80mm (Horizontal only)

* Operating System

Windows Millennium Edition (Me)

Window 2000 Professional

Window XP Home Edition, Professional

* Recording tool

(1) Nero(Ahead)

(2) In CD(Ahead)

(3) Power Producer Gold (Cyber Link)

7

2.4 Data capacity

• User Data/Block DVD-ROM/R/RW/RAM/+R/+RW ......2,048 bytes/block

CD (Yellow Book) ..........................................2,048 bytes/block(Mode 1 & Mode 2 Form 1)

2,336 bytes/block (Mode 2)

2,328 bytes/block (Mode 2 Form 2)

2,352 bytes/block (CD-DA)

2.5 RPC (Regional Playback Control) Phase2, No Region

3. DRIVE PERFORMANCE

3.1 Host interface ..................................................................X3T13 ATA/ATAPI5/1321D

INF-8090i Rev.5.3

3.2 Read/Write & Rotational speed

<Write> DVD-R...............................................................2x, 4x(CLV), 8x(ZCLV), 16x(PCAV)

DVD-R DL .........................................................2x, 4x(CLV)

DVD-RW............................................................1x, 2x, 4x, 6x(CLV)

DVD-RAM ...............................Ver. 2.2.............2x, 3x(ZCLV), 3x-5x(PCAV)

DVD+R ..............................................................2.4x, 4x(CLV), 8x, 12x, 16x(PCAV)

DVD+R DL ........................................................2.4x, 4x, 6x(CLV)

DVD+RW...........................................................2.4x, 4x(CLV), 8x(ZCLV)

CD-R .................................................................4x, 8x, 16x(CLV), 24x, 32x, 40x, 48x(ZCLV)

CD-RW..............................................................4x, 10x,16x(CLV), 24x, 32x (ZCLV)

(High Speed: 10x, Ultra Speed: 16x, 24x, 32x)

<Read> DVD-ROM...............................Single layer.......6.7x - 16x (CAV), Approx. 9,420 r/min

................................................Dual layer .........5.0x - 12x (CAV), Approx. 7,770 r/min

DVD-R DL...............................8.5GB ...............3.3x - 8x (CAV), Approx 5,180r/min

DVD-Video (CSS) .............................................3.3x - 8x (CAV), Approx. 5,180 r/min

DVD-R.....................................4.7GB ...............4.2x - 10x (CAV), Approx. 5,890 r/min

DVD-RW .................................4.7GB ...............3.3x - 8x (CAV), Approx. 4,720 r/min

DVD-RAM ...............................Ver. 1.0/ 2.2......2x/ 2x, 3x (ZCLV)* 3x-5x (PCAV)*

DVD+R....................................4.7GB ...............4.2x - 10x (CAV), Approx. 5,890 r/min

DVD+R DL ..............................8.5GB ...............3.3x - 8x (CAV), Approx. 5,180 r/min

DVD+RW ................................4.7GB ...............3.3x - 8x (CAV), Approx. 4,720 r/min

CD-R/ROM, CD-I / Video........(1.2m/s) ............20x - 48x (CAV), Approx. 9,540 r/min

CD-RW ...................................(1.2m/s) ...........16.7x - 40x (CAV), Approx. 8,100 r/min

CD-DA (DAE)..........................(1.2m/s) ...........16.7x - 40x (CAV), Approx. 8,100 r/min

CD-DA (Audio out)..................(1.2m/s) ...........4.0x - 10x (CAV), Approx. 2,030 r/min

* Rotational speed (CLV, ZCLV)

DVD-R/RW/ROM, +R/RW ...............................1x: Approx. 1,390(Inside) - 580 r/min(Outside)

DVD-RAM................................Ver. 1.0 ...........1x: Approx. 2,390(Inside) - 1,010 r/min(Outside)

Ver. 2.2 ...........2x: Approx. 3,250(Inside) - 1,380 r/min(Outside)

CD-R/RW/ROM ...............................................1x: Approx. 500(Inside) - 210 r/min(Outside)

3.3 Data transfer rate

3.3.1 Sustained transfer rate

<Write> DVD-R.........................2.77, 5.54, 5.44-11.08 Mbytes/s..................................2x, 4xCLV, 8x ZCLV

9.14-22.16 Mbytes/s....................................................................16x PCAV

DVD-R DL ...................2.77, 5.54 Mbytes/s....................................................................2x, 4x CLV

DVD-RW ...............1.385, 2.77, 5.54, 8.31 Mbytes/s ...................................1x, 2x, 4x, 6x CLV

DVD-RAM (Ver.2.2): ...2.77, 4.15, 4.15-6.925 Mbytes/s (w/o Verify) .......2x, 3x ZCLV, 3-5x PCAV

DVD+R........................3.32, 5.54, 8.31-11.08 Mbytes/s..............................2.4x, 4x CLV, 8x ZCLV

8.31-16.62, 9.14-22.16 Mbytes/s ..............................12x ZCLV, 16x PCAV

DVD+R DL ..................3.32, 5.54, 8.31 Mbytes/s ..................................................2.4x, 4x, 6x CLV

DVD+RW.....................3.32, 5.54, 8.31-11.08 Mbytes/s .............................2.4x, 4x CLV, 8x ZCAV

CD-R ...........................

600, 1,200, 2,400, 2,400-3,600, 2,400-4,800, 2,400-6,000, 2,400-7,200 kB/s (Mode-1)

..........................................4x, 8x, 16x CLV 24x, 32x, 40x, 48x ZCLV

CD-RW........................600, 1500, 2,400, 2,400- 3,600, 2,400-4,800 kB/s (Mode-1)

..........................................4x, 10x, 16x CLV, 24x, 32x ZCLV

<Read> DVD-ROM ...................Single layer ....9.28 - 22.16 Mbytes/s ...........................................16x max.

....................................Dual layer.......6.86 - 16.62 Mbytes/s ...........................................12x max.

DVD-R ................................................5.73 - 13.85 Mbytes/s ............................................10x max.

DVD-R DL...........................................4.58 - 11.08 Mbytes/s ..............................................8x max.

DVD-RW.............................................4.58 - 11.08 Mbytes/s .............................................8x max.

DVD-RAM ...................Ver. 1.0 ..........2.77 Mbytes/s.........................................................2x ZCLV

....................................Ver. 2.2 ..........2.77, 4.155,4.155-6.93 Mbytes/s ..2x, 3x ZCLV, 3-5x PCAV

DVD+R ...............................................5.73 - 13.85 Mbytes/s ............................................10x max.

DVD+R DL..........................................4.58 - 11.08 Mbytes/s ..............................................8x max.

DVD+RW............................................4.58 - 11.08 Mbytes/s .............................................8x max.

CD-R/ROM .........................................3,000 - 7,200 kB/s..................................................48x max.

CD-RW........................ ......................2,500 - 6,000 kB/s..................................................40x max.

CD-DA (DAE)......................................2,500 - 6,000 kB/s..................................................40x max.

3.3.2 Burst transfer rate

Ultra DMA Mode 2 ..............................33.3 Mbytes/s max.

Multiword DMA Mode 2 ......................16.6 Mbytes/s max.

PIO Mode 4 ........................................16.6 Mbytes/s max.

3.4 Access time (1/3 stroke)

DVD-ROM...........................................145 ms Typ.*(Note 1)

DVD-RAM (Ver.2.2)............................165 ms Typ.

CD-ROM.............................................125ms Typ. (Note 1)

Note :

1) Average random access time is the typcal value of more than 50 times including latency and error correction time.

Test Disc : DVD : ALMEDIO TDV-520 / TDR-820

CD : ALMEDIO TCDR-701 / HITACHI HCD-1

*) Typical value defines a measured value in normal temperature (20 deg.C.) and horizontal position.

3.5 Data error rate (Measured with 5 retries maximum)

DVD-R/RW/ROM/RAM ..................................<10-12

DVD+R/+RW..................................................<10-12

CD-R/RW/ROM..............................................<10-12 (Mode-1)

<10-9 (Mode-2)

Condition : It is assumed that the worst case raw error rate of the disc is 10-3

3.6 Data buffer capacity .......................................................2 Mbytes

8

9

4. Quality and Reliability

4.1 MTBF..................................................100,000 Power On Hours(Consecutive/Cumulative POH)

Assumption : ..........................Used in a normall office environment at room temperature.

-POH per year.........................3,000

-ON/OFF cycles per year........600

-Operating duty cycle..............20% of power on time (Seek: 5% of operating time)

4.2 Tray cycle test...................................30,000 times

No degeneration in the mechanical part after test

4.3 Actuator mechanism........................1,000,000 full stroke seek

4.4 MTTR (Mean Time To Repair) ...........0.5 h

4.5 Component life .................................5 years or 2,000 h of Laser radiating time

Assumption : ..........................Used in a normall office environment.

5. POWER REQUIREMENTS

5.1 Source voltage

+5V +5% tolerance, less than 100 mVp-p Ripple voltage

+12V +10% tolerance, less than 100 mVp-p Ripple voltage

5.2 Current

Idle (Hold track state)..............+5V DC .................0.9A typ. .........< 1.0 A max.

+12V DC ...............0.5A typ...........< 1.0 A max.

Write (Active) ..........................+5V DC .................1.3A typ. .........< 1.5 A max.

+12V DC................0.9A typ. .........< 1.5 A max.

Read (Active)..........................+5V DC .................1.0A typ. .........< 1.5 A max.

+12V DC................0.9A typ. .........< 1.5 A max.

Seek (Acess) ..........................+5V DC .................1.0A typ. .........< 1.5 A max.

+12V DC ...............1.2A typ. .........< 2.0 A max.

5.3 Standby

Sleep mode (No disc) .............1.1 W typ. 1.3 W max.

6. AUDIO PERFORMANCE

Output Level (1kHz, 0dB)........................................................0.7 Vrms typical

Frequency Response ..............................................................+/-3dB (20 to 20,000Hz)

Signal to Noise Ratio...............................................................80 dB min. with IHF A and LPF 20 kHz

THD (1kHz, 0dB).....................................................................0.10% max. with LPF 20 kHz

Channel separation(10kHz).....................................................65 dB min.

Condition: ................................................................................Load inpedance : 10 kohms

7. Acoustic noise

Less than 50dB, A scale, at 0.5 m away from the drive

Note : 1. Disc : Less than imbalance 0.3 x 10-4 Nm

2. Installation : Horizontal

3. Ambient temperature : Normal temperature

4. Except loading, unloading and seek

8. Dimensions

External dimensions (W x H xD) 146 x 41.3 x 165mm(without Bezel)

Front bezel (WxHxD) 148 x 42 x 5 mm

9. Mass .................................................Approx. 0.77+/-0.03 kg

* Which is not provided with Circuit Diagram of this model. Please Contact the friendly staff of LG

Service Care at: Website http: //www.LGEservice.com

LOCATION OF CUSTOMER CONTROLS

10

1. Disc tray

This is the tray for the disc. Place the disc on the

ejected disc tray, then lightly push the tray (or

push the eject button) and the CD will be loaded.

NOTE: Don’t pull out or push in the disc tray

forcibly. This might cause damage to the loading

section of the drive.

2. Stop/Eject button

This button is pressed to open the CD tray.

This button works only when power is supplied to

the drive.

3. Emergency Eject Hole

Insert a paper clip here to eject the Disc tray

manually or when there is no power.

4. Drive activity indicator

Two colored LED is used to indicate the operation

of the Drive.

Drive Activity Indicators

Stop/Eject Button

Disc Tray

Emergency Eject Hole

Front Panel

11

1. Power Connector

Connects to the power supply (5-and 12-V DC) of

the host computer.

NOTE : Be careful to connect with the proper

polarity. Connecting the wrong way may damage

the system (and is not guaranteed). Usually this

connector can only be attached one-way.

2. IDE Interface Connector

Connect to the IDE (Integrated Device

Electronics) Interface using a 40-pin flat IDE

cable.

NOTE : Do not connect or disconnect the cable

when the power is on, as this could cause a short

circuit and damage the system. Always turn the

power OFF when connecting or disconnecting the

cable.

3. Jumper Connector

This jumper determines whether the drive is

configured as a master or slave. Changing the

master-slave configuration takes effect after

power-on reset.

4. Analog Audio Output Connector

Provides output to a sound card (analog signal).

Generally you need this to play a regular audio

CD.

5. Digital Audio Output Connector

This connector is not supported.

Digital Audio Output

Connector

Jumper Connector

Analog Audio Output Connector IDE Interface Connector

Power Connector

Rear Panel

NOTE: The actual drive may be different from this design.

1. CABINET and CIRCUIT BOARD

DISASSEMBLY

1-1. Bottom Chassis

A. Release 4 screws (A) and remove the Bottom Chassis

in the direction of arrow (1). (See Fig.1-1)

1-2. Front Bezel Assy

A. Insert and press a rod in the Emergency Eject

Hole and then the CD Tray will open in the direction

of arrow (2).

B. Remove the Tray Door in the direction of arrow

(3) by pushing the stoppers forward.

C. Release 3 stoppers and remove the Front Bezel Assy.

1-3. Cabinet and Main Circuit Board

A. Remove the Cabinet in the direction of arrow (4).

(See Fig. 1-3)

B. When the CD tray has been opened completely, lift

2 points (a) and remove the CD tray while drawing

out simultaneously.

C. Remove the Soldering of the LD- and LD+ (b) for

the Loading Motor, and then remove the Main

Circuit Board.

D. At this time, be careful not to damage the 4

connectors of the Main Circuit Board.

2. MECHANISM ASSY DISASSEMBLY

2-1. Pick-up Unit

A. Release screws (B).

B. Separate the Pick-up Unit in the direction of arrow (6).

Main

Circuit Board

Cabinet

(4)

(5)

(a)

(b)

(A)

(A) (A)

(A)

(1)

Bottom Chassis

(2)

(3)

Tray Door

CD Tray

Front Bezel Assy

Emergency Eject Hole

Stoppers

Fig. 1-1

Fig. 1-2

DISASSEMBLY

12

Fig. 1-3

Mechanism Assy

Pick-up Unit

(6)

(B) (B)

Fig. 2-1

2-2. Pick-up

A. Release 1 screw (C) and remove the Pick-up.

Pick-up Unit

Pick-up

(C)

Fig. 2-2

13

030

014

007

A02

A01 A03

021

028

028

452

032

452

020

021

050

430

005 035 004

006

A B C D E F GH

1

2

3

4

5

452

024

481

034

027

026

033

025

430

445

020

453

031

036

453

010

011

009

008 012

016

015

013

PBM00 (MAIN C.B.A)

PBF00 (FRONT C.B.A)

482 482

482

001

482

003

002

(LightScribe only)

14 15

EXPLODED VIEW

ATIP Absolute Time in Pre-groove. With an additional modulation of the “Wobble”, the “Groove” contains a time

code information.

Wobble The pre-groove in the Disc is not a perfect spiral but is wobbled.

With : – A typical amplitude of 30 nm

– A spatial peried of 54~64 µm

CW Continuous Wave. The laser light output is at a constant level.

DOW Direct Over-Write. The action in which new information is recored over previously recorded information in

CD-RW disc.

Overwrite

The action in which new information is recorded over previously recorded information.

(Pre-)Groove

The guidance track in which clocking and time code information is stored by means of an FM

modulated wobble.

Land Land is characterized in the following way:

When radial signals are concerned,land is defined as the area between the grooves.

When HF signal are concerned,land is defined as the area between the marks(pits) in tangential

direction.

Hybrid Disc A Multisession disc of which the first Session is mastered. On a hybrid disc, recorded and

mastered information may co-exist.

Mastered Information,stored as pits on the disc during the manufacturing process of the disc.

Information (when making the master)

OPC Optimum Power Control. Procedure is determined optimum recording power according to CD-

R/RW Media in recording start step.

ROPC Running OPC. The purpose is to continuously adjust the writing power to the optimum power

that is required.

When the optimum power may change because of changed conditions of disc and change in

operating temperature.

Jitter The 16 value of the time variation between leading and trailing edges of a specific (I3 … I11) pit

or land as measured by Time Interval Analysis.

Deviation The difference between a fixed value of Pit length and Land length.

TOC Table Of Contents : in the Lead-in Area the subcode Q-channel contains information about the

Tracks on the disc.

Packet A method of writing data on a CD in small increments.

Writing Two kinds of packets can be written : Fixed-length and Variable-length.

Write The shape of the HF write signal used to modulate the power of the laser.

Strategy The Write Strategy must be used for recordings necessary for disc measurements.

Information Wobble, ATIP, Disc Identification, Write Power, Speed Range OPC Parameters, etc are

Area recorded in the Information area of CD-RW Disc

Finalization The action in which (partially) unrecorded or logically erased tracks are finished and the Lead-in

and/or Lead-out areas are recorded or overwritten with the appropriate TOC subcode.

Logical Erase

A method to remove information from a disc area by overwriting it with an EFM signal containing

mode 0 subcode

A logically erased area is equivalent to an unrecorded

Physical Erase

The action in which previously recorded information is erased by overwriting with a CW laser

output.

After a Physical Erase action, the erased area on the CD-RW disc is in the unrecorded state

again.

Session

An area on the disc consisting of a Lead-in area, a Program area, a lead-out area.

Multi session

A session that contains or can contain more than one session composed Lead-in and Lead-out

GLOSSARY

19

20

The differences of CD-R/CD-RW discs and General CD-ROM

1. Recording Layer

Recordable CD has a wobbled pre-groove on the surface of disc for laser beam to follow track.

2. Disc Specification

Read-only Disc

CD-R and CD-RW Disc

3~11T

1.6um

0.4~0.5 um

(Pit)Groove

Land

Track pitch(p)

Radial Direction

Iw

A

O

a

a

Groove

Land

Radial Error Signal

The Groove wobble

Average center

Actual center

CD-ROM (READ-ONLY DISC) a=30nm

ITEM CD-ROM CD-R CD-RW

Standard Yellow Book Orange Book II Orange Book III

Record Not available Write once Re-Writeable

Tracking Signal I11/Itop > 0.6 > 0.6 0.55 > M11> 0.70

(HF Modulation)

Read Laser Power(mW) < 0.5 mW < 0.7 mW < 1.0 mW

Jitter < 35 nsec < 35 nsec < 35 nsec

Reflectivity (Rtop) 70 % 65 % 15 % ~ 25 %

Remark) Write Laser Power(mW) 14-65 mW 6-45 mW

21

3. Disc Materials

1) CD-ROM disc

Laser Beam Groove

Substrate

(Polycarbonate)

Organic Dye Layer

Reflective Layer

Protective Layer

Label Printing

2) CD-R disc

Pigment Reflective Layer Color

Phtalocyanine Gold/Silver Yellow/White

Cyanine Gold/Silver Dark Green/Bright Green

Azo Gold/Silver Dark Blue

•It is composed of Silver _ colored aluminum plate and Reflective layer.

•Groove (Pit) of aluminum plate make a track.

•Laser wavelength : 780 nm, Laser Power (Read): 0.5mW

•Signal is detected by the

difference of reflective beam

intensity between “pit” and

“Land” on the disc.

•It is so-called WORM (Write Once Read Many) CD.

•It is composed of polycarbonate layer, Organic dye layer, Reflective layer, and Protective

layer.Gold/Silver Reflective layer is used to enhance the reflectivity

•According to the kinds of Organic dye layer, it is divided by Green CD, Gold CD, Blue CD.

•Laser Wavelength : 780 nm, Laser Power (read) : 0.7 mW

•Recording Power : 8x(14~20mW), 16x(25~35mW)

•When some part of dye layer is exposed to laser heat, it’s color changs black.Therefore, writing and

reading is enabled by the difference of reflectivity between changed part and unchanged part.

•Polycarbonate layer has Pre_Groove which make a Track.

Laser Beam

Pit

Substrate

(Polycarbonate)

Reflective Layer

Protective Layer

Label Printing

22

3) CD-RW Disc

4.

Reading process of Optical Disc

Laser Beam Groove

Substrate

(Polycarbonate)

Recording Layer

Dielectric Layer(TL)

Dielectric Layer(UL)

Protective Layer

Label Printing

•It is composed of polycarbonate layer, alloy(silver, arsenic) layer, aluminum reflectivity layer, protective layer.

•An crystalized alloy layer is transformed into noncrystalized by the laser heat. Therefore, writing and reading

is enabled by the difference of reflectivity.

•It is possible to overwrite about 1000 times.

•Laser Wavelength : 780 nm, Laser Power (Read) : 1.0mW

•Recording Power : Erase (4~18mW), Write (6~45mW)

•When disc rewriting, new data is overwritten previously recorded data.

•Polycarbonate layer has a Pre-Groove which make a track.

Lens HD

Beam

Spot

Focusing

Lens

Laser Spot

at Constant

Read Intensity

Reflected

Light

Signal

Laser Spot

Position

(Time)

Previously Recorded Marks

Groove Land Mirror

I3Itop

I11 IGILI0

Numerical aperture: NA=nsin

θ

,

n: Refractive index

Focus depth : H=

λ

/NA

laser spot diameter : D=

λ

/NA

2

θ

23

5. Writing Process of CD-R Disc

a b c d e f g

a

b

c

d

e

f

g

Incident

Laser

Power (Read) (Read)

(Write)

Laser Spot

Position

(Time)

a b c d e f g Laser Spot

Position

(Time)

Laser

Spot

Recorded

Mark

Reflected

Light

Signal

Reflected

Light

Signal

Below "ORP"– Mark Too Short

At Optimum Record Power ("ORP")

Above "ORP" – Mark Too Long

Time

6. Writing process of CD-RW Disc

Write Power

Erase Power

Read Power

Groove

Crystal Amorphous

Amorphous

Recorded state

(lower reflectivity)

Melting/

quenching

Heating/

gradual cooling

Crystal phase

Erased state

(higher reflectivity)

24

7. Organization of the PCA, PMA and Lead-in Area

1) Layout of CD-ROM disc

Center hole Clamping and Label Area Information Area

Lead-in Area

Lead-in Area

Diameter 15 mm

Diameter 46 mm

Diameter 120 mm

Program Area

Read Only Disc

Lead-out Area

Program Area Lead-out Area

Center hole Clamping and Label Area Information Area

PCA PMA

Test Area Count Area

Diameter 15 mm

Diameter 45 mm

Diameter 120 mm

Unrecorded Disc

Tsl-00:35:65 Tsl-00:15:05 Tsl-00:13:25 Tsl 99:59:74

00:00:00

in out

Test Area : for performing OPC procedures.

Count Area : to find the usable area immediately in T.A

Tsl : start time of the Lead-in Area, as encoded in ATIP

PMA : Program Memory Area

Disc Center

Disc Center

2) Layout of CD-R/RW disc

25

8. Function of PCA and PMA area

1) PCA (Power Calibration Area)

• PCA area is used to determine the correct Laser Power for a disc.

– Method 1 : PCA area is divided by a track.

– Method 2 : The previous Calibration value is referred.

– Method 3 : ROPC is used to determine Laser Power value automatically in data writing.

• CD-R Disc can write maximum 99 Tracks but CD-RW Disc can write unlimited tracks because it has a rewritable

function.

2) PMA (Program Memory Area)

• It has a track information (track No, track Start/End time) of every track before writing completed.

– PMA area has the last written point and the next writable point of a disc.

– In case of CD to CD copy, some writer may not write PMA area.

* When Disc is Finalized,

PMA information is transferred to the Lead_In area so that general Driver can read it.

* Because PCA and PMA area exist before Lead-In area, General CD Player or CD-ROM Drive can’t read

these areas.

9. OPC and ROPC

1) OPC (Optimum Power Control)

• This is the first step of writing process, because CD writer has its own laser power value and media have different

writing characteristics,

– This is determined by the Writing characteristic, speed, temperature, and humidity.

– Laser wavelength is determined by the environmental temperature (775~795nm) and Optical Laser Power is

determined by the test and retry.

• Asymmetry and optimum writing Power

– EFM signal Asymmetry is determined by the writing power.

Therefore, Optical Power which has the same value to the preset power value can be estimated by measuring

HF signal Asymmetry on the PCA area.

• Measurement of Asymmetry

* Parameter setting (Beta) : Using AC coupled HF signal before equalization

Beta = (A1+A2)/(A1-A2)

Time P << Po Time P = Po

HF Signal

A1

0

A2

Time P >> Po

26

2) ROPC (Running Optimum Power Control)

• Variable primary factor of Optimum Power

– Change of Power sensitivity on the Disc. (limited to 0.05 *Po)

– Wavelength shift of the laser diode due to the operating temperature change.

– Change of the Spot aberration due to the Disc skew,

Substrate thickness, Defocus.

– Change of Disc or Optics conditions due to the long term OPC

==> It is necessary to adjust continuously to obtain the Optimum Power.

• Principle of Running OPC

– To meet the factors mentioned above,

a horizontal _ direction movement of a curve is uesd.

– Beta = f(B-level) = constant on the Recorded Disc

– Procedure of ROPC

a. Reference B-level is determined during OPC Procedure.

b. During Recording, B-level value is controlled to have a close

Reference B-level value.

c. Normalization of B-level is used to eliminate the effect of reflectivity fluctuation.

==> The reflected B-level value is normalized by the disc reflectivity itself.

CD-R/RW Media

Write Strategy

Determination

PCA Test Area

Program Area

PMA Area

Lead-In Area

Lead-out Area

OPC

PCA Count Area

ROPC

* Recording Capacity of CD-R/RW (74Minute Recording media)

•(2048 Byte/Sector) X (75 Sector/Second) X (60 Second/Minute) X 74 Minute

= 681,984,000 Bytes = 682 Mbytes

•But the actual recording capacity is about 650 Mbytes. (according to the ISO 9660 standard, approximately

30 Mbytes are used to make directory structure and volume names.)

Incident recording pulse

Reflected recording pulse

Sampled timing B

11T

Sample B-level (Write Power)

Level B

Sampled at timing B

Pwo decided by OPC

Recording Power

Level B with Pwo

normalized to recording power

Sample Disc Reflectivity

(Read power)

10. Writing Process of DISC

27

The differences of DVD-R/RW, DVD+R/RW discs and DVD-ROM

1. Recording Layer

LPP

(Land Pre-Pit)

DVD+R/RW Disc

DVD-R/RW Disc

0.74 um

3T

0.4 um

DVD-ROM (Read Only Disc)

28

2. Disc Specification

3. Disc Materials

1) DVD-ROM

DVD-ROM

Media Type

User data capacity

Single-Layer

Read Only

4.7GB

Dual-Layer

Read Only

8.54GB

DVD-R DVD-RW DVD+R DVD+RW

Dye Phase change Dye Phase change

4.7GB 4.7GB 4.7GB 4.7GB

Wavelength 650nm 650nm 650nm 650nm 650nm 650nm

Reflectivity 45~85% 18~30nm 45~85% 18~30% 45~85% 18~30nm

Track pitch 0.74 0.74 0.74 0.74 0.74 0.74

Minimum pit length 0.4 0.44 0.4 0.4 0.4 0.4

Modulation >0.6 >0.6 >0.6 >0.6 >0.6 >0.6

Channel bit- rate 26.16MHz 26.16MHz 26.16MHz 26.16MHz 26.16MHz 26.16MHz

Wobble Frequency - - 140KHz 140KHz 817.4KHz 817.4KHz

Addressing 26.16MHz 26.16MHz Wobble & LPP Wobble & LPP Wobble(ADIP) Wobble(ADIP)

Read Power (mW) 0.7 0.1 0.7 0.1

Write Power (mW) - -

JItter <8% <8% <8% <8% <9% <9%

++

Bonding layer

Polycarbonate

Semi-reflective

Polycarbonate

Reflective layer

Label

Polycarbonate

Label

Bonding layer

Reflective layer

Polycarbonate

<Single Layer >

<Dual Layer >

29

2) Recording format using organic dye material (DVD-R/DVD+R)

* The format that records data through the creation of recorded marks by changing the organic dye material

with a laser beam.

DVD-R

Adhesive layer

Protective layer

Reflective layer

Recording layer(dye)

Disc substrate

DVD+R

Adhesive layer

Protective layer

Reflective layer

Recording layer(dye)

Disc substrate

Adhesive layer

Protective layer

Reflective layer

Dye layer

Substrate

Laser beam

> Disc structure

> Disc structure

[Recording]

Recording is done by changing the organic dye layer and the substrate with a laser when a strong is

applied to a disc, the temperature of the ortanic dye material goes up, the dye is decomposed and the

substrate changes at the same time. At this time, a durable bit is created as is the case with a CD-ROM.

[Playback]

Signals are read with the differences of the reflection of a laser from pits.

30

3) Recording format using phase-change recording material (DVD-RW/DVD+RW)

* Data is recorded by changing the recording layer from the amorphous status to the crystalline status, and

played back by reading the difference of the reflection coefficient.

[ Amorphous : Non-crystalline ]

Substrate

Laser beam

Recording data

(Melting/Quick cooling)

Erasing data

(Heating/Gradual cooling)

Data erased state

(High reflection coefficient) Recorded state

(Low reflection coefficient)

Crystalline status Amorphous status

DVD-RW

Adhesive layer

Protective layer

Reflective layer

Dielectric layer

Recording layer

(Phase change material)

Dielectric layer

Disc substrate

DVD+RW

Adhesive layer

Protective layer

Reflective layer

Dielectric layer

Recording layer

(Phase change material)

Dielectric layer

Disc substrate

> Disc structure

> Recording principles

[Recording]

When a high-power laser is applied to the recording material, it melts and then becomes amorphous with

a low reflection coefficient when it quickly cools off. When a mid-power laser is applied to heat gradually

the recording material and then gradually cools it off, it becomes crystal with a high reflection coefficient.

[Playback]

A low-power laser is used for playback. The amount of reflected light depends on the status (amorphous

or crystalline) of the recording material. This is detected by an optical sensor.

31

4. Writing Pulse Wave Form of DVD+R

For different speed ranges, different write strategies can be used. This document specifies 2 options:

- a pulsed write strategy, where each single mark is created by a number of subsequent separated short

pulses.

- a blocked write strategy, where each single mark is created by one continuous pulse.

1) 1st Method : Using Pulsed Write Strategy

* 3T :

NRZI

T = 3

2Tw

Ttop

dTtop

dTle

Pb

top

top le

Pp

Channel bits

N = 3 : only the top pulse(T ),

first pulse lead-time dT , dT

NRZI

T > 4

2Tw Tw

Ttop Tmp Tmp Tlp

dTtop

dTle

Pb

top

top le

lp

mp

Pp

Channel bits

N > 4 : the top pulse (T ), multi-pulse (T ) and last pulse (T ),

first pulse lead-time dT , dT

Pp : Actual write power

Pb : Bias Power

* > 4T :

32

2) 2st Method : Using Blocked Write Strategy

NRZI

Channel bits 2Tw Tw

dT

top

Ttop

dTle

Pp

Pb

T

mp

lp

T

dPp

0mW PcPb

1.25Tw

3T mark

4T mark

5T mark

Etc.

dTtop,3 dP

p3

Ttop,3

dTle

1.25Tw

PcPb

1.25Tw

1.25Tw

1.25T

w

dTtop,4 dP

p4

Ttop,4 Tlp

Ttop,4

Ttop,4

Tmp

Tmp

Tlp

TlpTmp

N = 3 : T (cm = 3) can be optimized individually.

N > 4 : T (cm 4) + x (N-3) T + T , T = T

P shall be < 0.1mW

top

mp

lp

ww

top

c

Pp : Actual write power

Pb : Bias Power

dPp : Additional power ( Only be applied for the 3T and 4T marks)

Pc : Cooling power (Especially at higher recording speeds, optimum cooling down of the

recording layer after writing a mark may be needed.)

>

33

5. Writing Pulse Wave Form of DVD+RW

NRZI

Channel bits 2Tw Tw

Ttop

dTtop

Pp

Pe

Tmp mp

TdTera

Pp : Actual write power

Pe : Erase Power

Pb : Bias Power

Pb 0mW

T

mp

6. Organization of the Inner Drive Area, Outer Drive Area, Lead-in Zone and

Lead-out Zone

1) Layout of DVD-ROM disc

34

Center

hole

1st transition area

2nd transition area

Clamping

Zone 3rd transtion

area Information Zone

Lead-in Zone

Lead-in

Zone Lead -out

Zone

Diameter 15 mm

Diameter 16 mm

Diameter 22 mm

Diameter 33 mm

Diameter 44 mm

Diameter 120 mm

Data Zone

Read Only Disc

Lead-out Zone

Data Zone Outer Drive

Area

Inner Drive

Area

Inner Disc

Test Zone Outer Disc

Test Zone

Unrecorded Disc

PSN: 23080H 27080H 27480H 28480H 2A480H 30000H 260540H 261940H 262940H 263940H 267940H

in OUT

Disc Center

Rim area

Center

hole

1st transition area

2nd transition area

Clamping

Zone 3rd transtion

area Information Zone

Diameter 15 mm

Diameter 16 mm

Diameter 22 mm

Diameter 33 mm

Diameter 44 mm

Diameter 120 mm

Disc Center

Rim area

Inner Disc

Count Zone Outer Disc

Count Zone

2) Layout of DVD+R disc

> Inner Disc Test Zone : for performing OPC procedures.

> Inner Disc Count Zone : for counting the number of OPC algorithm performed in IDT Zone.

> Outer Disc Test Zone : for performing OPC procedures.

> Outer Disc Count Zone : for counting the mumger of OPC algorithm performed in IDT Zone.

3) Layout of DVD+RW disc

35

> Inner Disc Test Zone : for performing OPC procedures.

> Inner Disc Count Zone : for counting the number of OPC algorithm performed in IDT Zone.

> Outer Disc Test Zone : for performing OPC procedures.

> Outer Disc Count Zone : for counting the number of OPC algorithm performed in IDT Zone.

Lead-in Zone Lead -out Zone

Data Zone

Inner Disc

Test Zone Outer Disc

Test Zone

Unrecorded Disc

PSN: 2A480H 2A7C80H 2DC80H 30000H 260540H 262940H 265940H 266140H

in OUT

Center

hole

1st transition area

2nd transition area

Clamping

Zone 3rd transtion

area Information Zone

Diameter 15 mm

Diameter 16 mm

Diameter 22 mm

Diameter 33 mm

Diameter 44 mm

Diameter 120 mm

Disc Center

Rim area

Inner Disc

Count Zone Outer Disc

Count Zone

36

LightScribe Media

1. LightScribe Media

Center Hole

Screen Printed Imaging Layer

Clear Protective Coating

Reflective/Thermal Layer

Dye Data Layer

Polycarbonate

Substrate

DiscOD

Label Zone

Control Feature Zone

Clamping/Logo Zone

37

2. Hardware Block Diagram of LightScribe Label Printing

Host

PC

(Spindle)

uP

(DSP)

Power

Drive

Analog

Signal

Processor

MECHANISM

Optical

Pick-up

Optical

Encoder

(Sled)

(Track)

(Tilt)

(Focus)

RFOUT

Spindle Motor

Step Motor

Track Actuator

Tilt Actuator

Focus Actuator

Laser Power Reference

Write Strategy Control

Buffer

Memory

SERVO Signals

RF Cell Signals

Laser Power Monitor Signal

Optical FG

CIrcuit

38

3. MD Assy For LightScribe

Optical Encoder Unit

OPU ID Movement Range : L=21um

39

4. Optical Encoder Assy

Codewheel

Direction of

radial play

CODEWHEEL

OR

CODESTRIP

FFC

3PIN SIGNAL

PROCESSING

CIRCUITRY

R

VLED

VCC

CH A

CH B

CH B

GND

GND

Vcc

OFG

Encoder PCB

PIN 6

VCC

PIN 5

CH A

PIN 4

GND

PIN 3

VLED

PIN 2

GND

PIN 1

CH B

PIN 6

VCC

PIN 5

CH A

PIN 4

GND

PIN 3

VLED

PIN 2

GND

PIN 1

CH B

Optical Encoder IC

Schematic of Enc PCB

40

DVD & CD DATA PROCESSING

1. Data Processing Flow

Command

Data

Status

RF EQ & AGC SERVO

DSP Encoder & Decoder & CSS

RF data slice EFM demodulator

CiRC error correction

Audio DAC

Buffer/Memory controller

CSS controller

Atapi interface control

Data PLL

Servo ADC

Focus/tracking

control output

Sled control output

CAV Spindle control

P-up

Unit

(HOP-7632TS)

IC101

RF AMP

(R2S35002) CD

DVD

IC301

(R8J32007)

TE/CSO GEN

FE GEN

DRAM

U-COM

SRAM

IC302

Flash ROM

41

R8J32007 HOST DVD

PLAYER

(EMPEG2 B/D)

Scrambled MPEG Data

Change the "KEY"

KEY Management Control

2. Copy Protection and Regional Code Management Block

Block Diagram

Brief Process

1. Regional Code for DVD Disc

– DVD-ROM drive transfers the regional code of the control data to host by the command of host, the DVD

player of host reads the regional code, and plays title in the case of allowed regional code only.

2. Management of DVD Disc for the scrambled of data

(1) DVD-ROM and DVD player of host generate the “KEY 1” respectively, transfer to opposite part, the

“KEY 2” is received, recognizes the data transfer or not with this value, and generates the bus key

encoded the data.

(2) Encoded “Disc Key” and “Title Key” host is transfer with the bus Key.

(3) DVD player of host reads the key value, and uses the value to restore the scrambled data.

* Refer to the next page for the details.

42

3. About Prevention the DVD-ROM from to be copy

A data is able to encode and record in the disc, if a copyright holder wants to prevent the disc from copying.

In case of a disc enhanced movie of 3 titles......

DISC KEY (2048 Bytes) is used to encode the whole contents in the disc and TITLE

KEY (5 Bytes) is used to encode the title respectively.

So, the data is encoded and stored in a disc through the unknown algorithms

with a disc key and title key. (At this time, the disc key and title key are stored

in a disc.)

…As above, the disc is able to copy when the disc key and title key are

opened.

Then, ROM-DRIVE encodes the disc key and title key and transfers to MPEG-

2 board.

If you want to play the disc prevented from the copy......

First of all, ROM-DRIVE and MPEG-2 board identify with each other through the procedure as described

below.

1. Drive and host gives and takes the ID of 2bit. This ID is AGID (Authentication Grant ID).

The various decoder boards are attached to the host, in these, AGID sets the MPEG-2 board and drive.

2. After the AGID is set, MPEG-2 board generates the challenge key (10 Byte) and transfers to drive. The

board and drive generate key 1 (5Byte) with the challenge key respectively. (Of course, the Algorithm

generating the key 1 is not known.)

3. Compare with the generated key 1, if it corresponds each other, the first step of authentication is

completed. This is a course to identify the MPEG-2 board with a drive.

4. The second step of authentication is a course to identify a drive with the MPEG-2 board.

The dirve generates a challenge key and transfers it to the MPEG-2 board. The dirve and MPEG-2 board

generate the key 2 (5Byte) with the challenge key, compare with each other, and if it corresponds and the

secondary step of authentication is completed.

5. As above, the identification is completed.

6. The dirve and MPEG-2 board generate the Bus key with the key 1 and key 2 and own it.

7. Dirve encodes the disc key and title key with this Bus key and transfers to the MPEG-2 board.

8. The MPEG-2 board reads the encoded disc key and title key with the Bus key only.

9. MPEG-2 board lets data read from the drive to decode with the read disc key and title key and makes into

the video signal by decoding.

ROM-DRIVE

AGID HOST

MPEG-2

BOARD

Challenge key

encoded disc key, title key

43

4. About the DVD-ROM Regional Code

DISC ROM - DRIVE MPEG-2 BOARD VGA CARD MONITOR

1

CAN

U.S.A

MIX

CUB

BHS

PRI. VIR

1

BMG

GRL

2

2ZAF

ISO

SWZ

FIN

POI

FST

LTU

BIR

UKR

TUR

FGY

JRN

TKM

AFG

PAK

CHN

MMR

MNG

RUS

KOR JPN

HKG

MAC TWN

PHL

6

3

21

5

5

4

1

MDI

MNP

GUM

PLW

PNG

NZL

AUS

4

The disc has

the regional

code of 8 bit.

Example)

The disc

manufactured

in the U.S.A,

has the

number one.

Transfer to

MPEG-2 board

reading the

regional code.

Receiving

data from the

MPEG-2

board and

output

through the

monitor

If the board is setting to the regional

code 1 for the U.S.A. ...

Check the received regional code to

number 1, all or not, transfer the

data to VGA card in accordance with

only a case among the three case.

Regional code

INTERNAL STRUCTURE OF THE PICK-UP

1. Block Diagram of the PICK-UP(HOP-7632TS)

44

45

16 15 14 13 12 11 10

26 27 28 29 30 31 32

917

8

7

6

5

4

3

2

1

Tilt-

C3

R1

R4

CD-LD

DVD-LD

R2

FB2

FB1

CD-VR

DVD-VR

GND EF4

EF1

VA

VB

VEF2

VREP

VRFN

VD

VCC

VS

VC2

VEF3

SW

C15

C14

C6 C5

C9

C10

Rth

R7

R8

R14

Rd

C12

C13

FB3

C2

C1

IC2(LDD)

IC2(FM)

IC3(OEIC)

VSO

18 OUT2

19 OUT2

20 VSO

21 VSO

22 GND

23 OUT1

24 OUT1

25 VSO

NC

NC

BUSY

SEN

SDIO

SCLK

MON1

VSL

CLK

CLKB

GND

GND

NRZB

NRZ

RWB

VSA

RSET

EN

AGND

ISLOP

IAPC

Rfreq

SLG

44 Tilt+

43 TR-

42 TR+

41 AF-

40 AF+

39 GND(FM)

38 FM

37 VREF

36 SEL

35 VCC(FM)

34 ENA

33 IAPC

32 SLG

31 VSA5

30 VSL25

29 CLK

28 CLKB

27 GND(LDD)

26 NRZB

25 NRZ

24 GND(LDD)

23 MONITOR

22 RWB

21 SDIO

20 SCLK

19 BUSY

18 SEN

17 VSO

16 Vcc(FM)

15 GND(OEIC,TEMP)

14 RF-

13 RF+

12 E2+F2

11 C

10 A

9E1+F1

8E4+F4

7D

6B

5E3+F3

4GAINSW

3Vc(OEIC)

2Vcc(OEIC)

1GND(OEIC,TEMP)

54

2

1

6

7

7F4 F1

F3 F2

E4 E1

DA

BC

E3 E2

8

9

10

11

12

13

14

6

5

4

3

2

1

3

Behind View DVD-LD : 1st Vendor : Rd = 82k

DVD-LD : 2nd Vendor : Rd = 5.6k

8

45

2. Pick up Pin Assignment

No. Signal Name I/O Signal Description

1 GND(OEIC,TEMP) Ground for OEIC

2 Vcc(OEIC) I Power supply for OEIC

3 Vc(OEIC) I Reference voltage input for OEIC

4 GAINSW I OEIC output gain control (High:Low gain, Middle:Middle gain, Low:High gain)

5 E3+F3 O Single OEIC output EF3

6 B O Single OEIC output B

7 D O Single OEIC output D

8 E4+F4 O Single OEIC output EF4

9 E1+F1 O Single OEIC output EF1

10 A O Single OEIC output A

11 C O Single OEIC output C

12 E2+F2 O Single OEIC output EF2

13 RF+ O Single OEIC RF positive differential output

14 RF- O Single OEIC RF negative differential output

15 GND(OEIC.TEMP) O Ground for OEIC and TEMP

16 TEMP O Output voltage for controlling temperature

17 VSO I Supply voltage for the output drivers only

18 SEN I Serial control enable (H=enable, L=disable)

19 BUSY O Goes high when serial transfer to timing menory is active

20 SCLK I Serial control clock

21 SDIO I/O Serial data for parameters and control ; in/out

22 RWB I Write enable for NRZ laser data (L=write, H=read)

23 MONITOR O Monitor output

24 GND(LDD) Ground connection for LD Driver-IC

25 NRZ I NRZ laser data (H=mark, L=space) (LVDS+)

26 NRZB I NRZ laser data (H=mark, L=space) (LVDS-)

27 GND(LDD) Ground connection for LD Driver-IC

28 CLKB I CLOCK for NRZ code input (LVDS-)

29 CLK I CLOCK for NRZ code input(LVDS+)

30 VSL25 I Supply voltage for 2.5V logic

31 VSA5 I Supply voltage for PLL only

32 SLG I Land/groove input serects the power register set (H=land, L=groove)

33 IAPC I A low inpedance current input ; 100xIAPC frow to the output

34 ENA I Fast chip enable input

35 VCC(FM) I Power supply for FM

36 SEL I Low: selects DVDFMOUT

High: selects CDFMOUT

37 VREF I APC amplifier reference voltage input

38 FM O APC amplifier output

39 GND(FM) Ground connection for FM

40 AF+ I Focusing Actuator drive signal+

41 AF- I Focusing Actuator drive signal-

42 TR+ I Tracking Actuator drive signal+

43 TR- I Tracking Actuator drive signal-

44 Tilt+ I Tilting Actuator drive signal+

45 Tilt- I Tilting Actuator drive signal-

3. Signal detection of the P/U

1) Focus Error Signal ==> (A+C)-(B+D)

This signal is generated in RF IC (IC101 : R2S35002) and controls the pick-up’s up and down to focus on

Disc.

2) Tracking Error Signal (DPP Method) ==> {(A+D)-(B+C)}- kx {(EF1+EF4)-(EF2+EF3)}

This signal is generated in RF IC (IC101 : R2S35002) and controls the pick-up’s left and right shift to find

to track on Disc.

3) RF Signal ==> (A+B+C+D)

This signal is converted to DATA signal in DSP IC (IC301 : R8J32007).

46

Pick-Up module

Photo Diode Tracking

Focusing

Infrared Iaser

k[(F+H) - (E+G)]

(A+D) - (B+C)

(A+D) - (B+C) - k[(F+H) - (E+G)]

Offset

TE

Tp

Sub2

Main

Tp/2 Sub1

Track Center

F,E

D,C

A,B

H,G

47

WGATE

RFPDSH

Optical

Pick-up

LD

Driver

Write

Strategy

FsDAC

WDAC

IAPC

R160

LPF

&

Gain

WFPDSH

FMON

RWAPC

buffe

r

2.5VREF

Buffer

S/H

B/H

+

-

13 S/H MU

X

AM

P

APCDAC

(REDA/WRDA)

SCLK, SDATA, WDEN

12

99

810

28

29

126

127

CN101 IC101 (R2S35002))

IC301 (R8J32007)

BCNT

5

6TCPH

32 134

175

R106

R105

C106

25,26,28

120,121,123

108

C105

DESCRIPTION OF CIRCUIT

1. ALPC (Automatic Laser Power Control) Circuit

1-1. Block Diagram

48

1-2. ALPC (Automatic Laser Power Control) Circuit

ALPC function DVD/CD anlaog front-end IC(IC101 R2S35002) is for constant power control purpose. Based on the

accurate power sensor(FMON) in P/U, ALPC feedback loop maintains constant power level against laser diode’s

temperature variation.

The ALPC loop amplifies(10x) the FMON signal to enhance the accuracy of read power level control. Swithching of

amplification is made by combination of a logical WGATE signal and a logical RWAPC signal.

There are two set of APCDAC, which are used at different term to monitor different power level. Generally, the one is used

at reading and the other one is used at writing. The logical WGATE signal which is switched between reading and writing

changes the two APCDAC.

The ALPC loop supplies same currency (IAPC) to Laser Diode Driver(LDD) during reading and writing.

There is another ALPC which controls Full-Scale-DAC (FsDAC). FsDAC determines scale of WDAC of Laser Diode Driver.

MPU monitors write-power level of FMON signal and changes FsDAC directly to maintain constant write-power level. There

are two write power signal. The one is based on S/H signal and the other one is based on B/H(Bottom-Hold) signal. The

write power levels are monitored as digital levlels which are converted by built-in Anlog-Digital Converter in DSP. The MPU

monitors each write power level and calculates proper setting of FsDAC, and changes value through serial interface

between LDD and DSP.

49

2. Focus Circuit

2-1. Block Diagram

Disc

Motor unit Optical

Pick-up

HOP-7632TS

A,B,C,D

A,B,C,D

(EF1~EF4)

(A+C)-(B+D)

(A+C)-(B+D)+K[(EF1+EF3)-(EF2+EF4)]

HAVC

LS

to

V14 FE

FE

FE

R102

C405

R103

C406

GND

GND

ADC

Focusing

Compensator

DAC

FOD

FOD

R329

R2S30202FP

IC601

FACT+

FACT-

FACT+

FACT-

IC101

R2S35002

IC301

R8J32007

EN1

EN2

CTL1

CTL2

C335

REF 1.65V

FOIN

A+B+C+D

LPF G

HAVC

LS

to

0.8V

PE

PE

3

LPF G2

169

170

180

40

42

20

21

34

35

2-2. Focus Servo

The aim of Focus Servo is to maintain the distance between object lens of P/U and disc surface, so that the

detected RF signal(A, B, C, D, EF1, EF2, EF3, EF4) can be maximized.

Focus Error Signal(FE) generates from focus error detection block in RF IC(R2S35002) using Conventional

Astigmatism Detection method, Differential Astigmatism Detection method.

Focus Gain and path can be changed at the RF IC(R2S35002) according to the disc, and the resulting output

FE(R2S35002 2pin) is input to DSP IC(R2S35002 169pin).

The Focus Search operation is using FE, PE Signal, therefore check FE, PE signals when Focusing is failed.

The role of DSP IC(R8J32007) is Focus Digital Controller. The operation path is as follows;

FE Signal is input to DSP IC(R8J32007 169pin), and after A/D Conversion, Digital Equalizer Block and D/A

Conversion in R8J32006FP, the output signal FOD(R8J32007 180pin) is input to Drive IC(R2S30202FP 40pin).

The drive output signal FACT+/FACT- generated according FOIN(R2S30202FP 40pin), and drives focus

actuator in the P/U unit.

50

3. Tracking & Sled Circuit

3-1-1. Block Diagram (Tracking Following)

Disc

Motor unit Optical

Pick-up

HOP-7632TS

A,B,C,D

(EF1~EF4) TE

TE

R101

C101

GND

TE

ADC

Tracking

Compensator

DAC

TRD

TACT+

TACT-

IC101

R2S35002

IC301

R8J32007

MPPO

(A+D)-(B+C)

G

HAVC

LS

to

V14

1

173

181

L

P

F

L

P

F

SPPO

(A+D)-(B+C)-K[(EF1+EF4)-(EF2+EF3)]

Sled

Compensator

DAC

SL2

183

SL1

182

A+

A-

B+

B-

SLED MOTOR

Unit

(CN601)

TRD

R330

IC601

R2S30202FP

TACT+

TACT-

EN1

EN2

CTL1

CTL2

REF

C604 1.65V

TOIN

39

42

20

21

36

37

SL2

2

SL13

SL1IN

SL2IN

A-

B-

8

10

A+

B+

6

9

SL2N

SL1N

SL2P

SL1P

C336

1.65V

C338

C337

R372

1.65V

R374

R373

R332

R331

3-1-2. Block Diagram (Seek)

51

Disc

Motor unit Optical

Pick-up

HOP-7632TS

SUMF

RFIP

RFIN

(EF1~EF4)

A,B,C,D

TACT+

TACT-

IC101

R2S35002

MPPO

(A+D)-(B+C)

G

HAVC

LS

to

V14

1

L

P

F

L

P

F

SPPO

[(EF1+EF4)-(EF2+EF3)]

A+

A-

B+

B-

SLED MOTOR

Unit

A+B+C+D

G

HAVC

LS

to

V14

L

P

F

L

P

F

38

79

80

81

EQ

MIRR

DET

AGC TOP

HOLD

63 62

BOTTOM

HOLD

-

+

-

+

TE1

MIRRTOPH MIRRBOTH

C128

GND

MIRR

VREF1

VREF1

SL2

D

A

C

Tracking

Compensator

IC301

R8J32007

173

Sled

Compensator

A

D

C

149

M

U

X

Short

Seek

Algorithm

Loog

Seek

Algorithm

D

A

C

182

181

183

TRD

SL1

Track Counter

and Timer

R101

C101

GND

MIRR

TE1

TE

IP2MIRR

C127

GND

52

3-2-1. Tracking Servo

The aim of tracking servo is to make laser beam trace the data track on disc.

Tracking Error(TE) Signal is generated from tracking error detected block in R2S35002 using DPP(Differential

Push-Pull) Method and DPD (Differential Phase Detection) Method.

DPP Method uses not only main beam(A, B, C, D) but also side beam(EF1~EF4) for correcting DC offset

generated in Push-Pull Method.

The remaining procedure of TE signal processing in R8J32007 is similar to Focus Servo.

The role of DSP IC(R8J32007) is Tracking Digital Controller.

TE Signal is input to DSP IC(R8J32007 173pin), and after A/D Conversion, Digital Equalizer Block and D/A

Conversion in R8J32007, the output signal TRD(R8J32007 181pin) is input to Drive IC(39pin).

The drive output signal TACT+/TACT- generated according TOIN(R2S30202FP 39pin), and drives tracking

actuator in the P/U unit.

3-2-2. Sled Servo

The working distance of tracking actuator is too short to cover whole disc radius.

Sled Servo make P/U move by little and little so that the laser beam keep tracing the data track on disc

continuously when tracking actuator reaches the working limit.

TE Signal is input to DSP IC(R8J32007 173pin), and after A/D Conversion, Digital Tracking Equalizer Block,

Digital Sled Compensator Block and D/A Conversion in R8J32007, the output signal SL1, SL2(R8J32007 182,

183pin) is input to Drive IC (R2S30202FP SL1:3 pin, SL2:2pin) after Low-Pass filtering.

4. Spindle Circuit

4-1-1. Block Diagram(FGCAV Servo)

53

Disc

Motor unit

Optical

Pick-up

HOP-7632TS

XCO

Control Clock

Generator

IC301

R8J32007 107

M

U

X

P

W

M

SPD

211

Motor Kick

REG

CAV FD

+

CAV PD

SFG

VCK4M

VCK4M 106

R349

C349

R375

1.65V

SPD

IC601

R2S30202FP

U

V

CTL1

CTL2

DAVC 1.65

1

20

21

12

13

19

42

SPD

SFG

CTL2

CTL1

SPIN

FG

W14

XCI

213

R361

3.3V

X301

33.8688MHz

4-1-2. FG CAV Servo

1) CD 48x CAV : CD-ROM, CD-R

2) CD 40x CAV : CD-RW

3) DVD 8x CAV : DVD+RW

4) DVD 10x CAV : DVD+R

5) DVD 12x CAV : DVD-ROM DL

6) DVD 16x CAV : DVD-ROM

7) DVD 16x PCAV : DVD+R

When drive read PRESS CD, Closed Session CD-R/RW, the spindle motor is controlled using FG CAV Spindle

Servo. FG signal(R2S30202FP 19pin) input to SFG in DSP IC(R8J32007 213pin).

The spindle controller in DSP IC uses SFG as spindle rotation frequency feedback, therefore the FG CAV

Spindle Servo doesn't work well if FG generation is abnormal.

The spindle controller PWM output signal SPD(R8J32007 211pin) input to SPIN in Drive IC(R2S30202FP 1pin)

after Low-Pass Filtering.

The PWM output signal U, V, W signal(R2S30202FP 12, 13, 14pin) drives Spindle Motor without using a

sensor, and FG pulse output is generated as 18 pulses/rotation.

4-2-1. Block Diagram (Wobble CLV Servo)

54

Disc

Motor unitOptical

Pick-up

HOP-7632TS

IC101

R2S35002

HPF

S

/

H

-

+

C174

C173

C171

C172

WBLSH

C116

87

88

89

90

92

93

94

95

HPF AGC2

HPFBPF AGC3

HPF

HPF 37

31

WBLS

GND

H

18 19

AGC1

20

VREF

WAG1 WAG2 WAG3

SA

SB

SC

SD

MA

MB

MC

MD

+

-

C117 C118

ADO

BCO

IC301

R8J32007

M

U

X

P

W

M

SPD

PH

SP

211

Motor Kick

REG

154

R349

R375

C349

1.65V

1.65V

SPD

WOBSIG

4-2-2. Wobble CLV Servo

CD-R : 4x, 8x, 16x, 24x, 32x, 40x, 48x

/CD-RW : 4x, 10x, 16x, 24x, 32x

/DVD-R : 2x, 4x, 8x, 16x(PCAV)

/DVD-R DL : 2x, 4x

/DVD-RW : 1x, 2x, 4x, 6x

/DVD+R : 2.4x, 4x, 8x, 12x, 16x(PCAV)

/DVD+R DL : 2.4x, 4x, 6x

/DVD-RAM : 2x, 3x, 3-5x(PCAV)

/DVD+RW : 2.4x, 4x, 8x

When drive write DVD-RAM/R/RW/+R/+RW/CD-R/CD-RW, the spindle motor is controlled using Wobble CLV

Spindle Servo.

The WOBSIG signal(R2S35002 37pin) input to DSP IC(R8J32007 154pin). The DSP Controller in R8J32007

uses WOBSIG as linear velocity feed back, therefore the Wobble CLV Spindle Servo doesn’t work well when

WOBSIG signal is abnormal.

The spindle controller PWM output signal SPD (R8J32007 211pin) input to SPIN in Drive IC(R2S30202FP 1pin)

after Low-Pass Filtering.

The PWM output signal U,V, W signal(R2S30202FP 12, 13, 14pin) drives Spindle Motor without using a sensor.

MAJOR IC INTERNAL BLOCK DIAGRAM AND PIN DESCRIPTION

IC101 (R2S35002) : RF AMP Analog Signal Processor

Pin Assignment

55

75

PORT13

74

PORT12

PORT11

PORT10

73

AGHPF1

72

AGHPF2

71

VDD1(3.3V)

70

EQOP

69

EQON

68

GND1

67

IREFE

66

EQFCF

65 64

SUBO/LPPMON

63

SUBI/LPPSIG

62

TOPH

61

BOTH

60

MIRRHPF

59

MIRRTOPH

58

MIRRBOTH

57

VDD4(3.3V)

56

MRSTB

55

SDEN

54

SDATA

53

SCLK

52 51

50 MCLK

DFT

49

IP1/LPPOUT

48

IP2/MIRR

47

WGATE

46

PORT07

PORT06

PORT05

PORT04

PORT03

PORT02

PORT01

PORT00

45

LO_ZB/SPDSH

44

43

BLANK

42

41

40

39

GND4

38

MPDSH/SPDSH

37

RFPDSH

36

WFPDSH

35

IDGATE

34

33

SPBLVL/TISH2

32

LNDTRK

31 WBLSH

30

29

28

27

WOBSIG

26

RFHLD/TISH1

76

77

SUMF/SUMF2

(5V)VCC1

AGFR

AGFU

78

RFIN

79

SRVREF

80

FVREFO

81

IREFT

82

VREF1

83

HAVC

84

SA

85

SB

86

SC

87

SD

88

89

(3.3V)VDD2

90

MA

91

MB

92

MD

93

GND2

94

AIN1

95

AIN2

96

MC

97

AIN3

98

SIGM

99

100

AWOBSIG

FE

PE

TE

GND5

BCENT

PHBETA/TCE

BHBETA/TIE

(3.3V)VDD3

(3.3V)VDD5

FVREF

FMD

GND3

(EQOS/RRF/WRF/LPPMON/)ATEST

(5V)VCC2

LDOUT

VRDC3N

VRDC

VRDC2N/PWRMON

VRDCN

WAG1

WAG2

WAG3

WOBFCF

R2S35002

(TOP VIEW)

BHC

LE

RFIP

Block Diagram

56

RFIP

RFIN

Pick

I/F

0.068u

0.068u

IDGATE

TISH1

AGFU

AGFR

EQ-

AUTO

RF

LPP

Wobble F0-CNT

AGC3BPFSUB

AGC1

DPD

TE BALANCE

FE

FE

RECD

SAV

MIRR

DEFECT

TIE

R-OPC

OPC

APC

Serial

Cont.

Reg.

VREF

Power

Cont.

Programm

able I/O

port

SIGM

PE

HFSUM

BALANCE

AGC2 COMP

EQ

HP3

RF

AGC

HP2

ID

DET

S/H

S/H

S/H

WRF

MUX

RF SLIM/SUB

(RGA)

M

U

X

M

U

X

M

U

X

M

U

X

AGHPF2

RFHLD/

SPDSH

LO_ZB/

IREFE

EQFCF

EQOP

EQON

MA

MB

MC

MD

SA

SB

SC

SD

HAVC

MPDSH/

WOB

main

sub

4

4

2

SUBO/LPPMON

SUBI/LPPSIG

BHC

IP1/LPPOUT

D

WOBSIG

WAG3

WAG1

WAG2

WBLSH

MCLK

TE

FE

PE

HFPE

mclk

IREFT

RRF

WRF

BLANK

TOPH

BOTH

DFT

RECD

SPBLVL/TISH2

PHBETA/TCE

BHBETA/TIE

MRSTB

SDEN

SCLK

SDATA

BCENT

SPBLVL

SIGM

each blocks

WGATE

WGATE

RFPDSH

FMD

FVREF

PWRMON

VRDCN

VRDC

LDOUT

BHOUT

0.068u

0.033u

0.12U

0.12U

0.1U

12k

(*2)

3300p 0.1u

0.47u

D

D

D

LO_ZB/SPDSH

pin

D

D

D

D

D

D

D

D

D

D

D/A

D

SUBP.N

IP2/MIRR

D

SUBW

BPO

to MIRR.DEFECT

EQOP/N

BPO

2200p

SPDSH

RFHLD/TISH1 pin

VRDC2N/

RFHLD/TISH1 pin

GND2

VDD1

GND3

VDD2

GND4

VDD3

GND5

VDD4

VDD5

GND1

vCC2

DDD

VREF1

...Combined pin

...digital pin

D

...digital/analog pin

D/A

power 5V

power 3.3V(VDD)

4700p

15,000p

VREF1

GCAOUT

MIRRTOPH

MIRRBOTH

MIRRHPF

pick-up I/F

reference level

AWOBSIG

WOBFCF

VREF1

LO_ZB/SPDSH

PWWMON

D

LNDTRK

mclk

mclk

mclk

SHPE

ATEST

SUMF/

SUMF2

8200p

680k

3.3u

*3300P/0.068u

0.47u

0.1u 0.033u

0.033u

(*1), (*2)...1% Resistor

toLPF,A/D

toLPF,A/D

toLPF,A/D

toLPF,A/D

toLPF,A/D

toLPF,A/D

to LPF,A/D

*HPF fc=1kHz

to A/D

*3300p

Lo-Z function by IDGATE.

fast mode 3.3us

Lo-Z function by IDGATE.

0.1u

20k(*1)

LPPMON/EQOS/RRF/WRF

EQOS

VFREFO

10u

VREF1

SRVREF

power 3.3V

VHALH(=VDD/2)

VREF1(=2.1V)

FVREFO(=2.5V)

MPP SPP

to LE

MPP

SPP

SUMF2

to WRF

SUMF2

In the case of

analog APC

vCC1

LE toLPF,A/D

IP2/MIRR pin

MIRR

MIRR

AGHPF1

0.1u

0.1u

0.1u

0.1u

0.1u

0.1u

0.1u

0.1u

0.01u

0.01u

PORT00~07.10~13

D

12

AIN1~3

3

VRDC3N

..

57

•Pin Functions

pin Name pin No. Type max. voltage Function

TE 1 Analog-Output Tracking error output terminal

FE 2 Analog-Output Focus error output terimnal

PE 3 Analog-Output PE output terminal

LE 4 Analog-Output Lens error output terminal

BCENT 5 Analog-Output OPC center signal output terminal

PHBETA/TCE 6 Analog-Output OPC top hold level signal and APC write sampleing

signal output terminal/tilt servo detecting output terminal

BHBETA/TIE 7 Analog-Output OPC bottom hold level signal and R-OPC sampleing

signal output terminal/tilt servo detecting output terminal

VCC2 8 Power Power supply connected terminal(5V)

FVREF 9 Analog-Input VDD Reference voltage for APC input terminal

FMD 10 Analog-Input VDD APC monitor diode input terminal

VDD3 11 Power Power supply connected terminal(3.3V)

LDOUT 12 Analog-Output Terminal to control laser drivers for APC read system

VRDC3N 13 External-components required Terminal to connect laser driver control filters for APC

read

VRDC2N/PWRMON 14 External-components required Terminal to connect laser driver control filters for APC

read/ SH monitor output terminal

VRDCN 15 External-components required Terminal to connect laser driver control filters for APC

read

VRDC 16 External-components required Terminal to connect laser driver control filters for APC

read

GND3 17 Ground Ground connected terminal

WAG1 18 External-capacitor required Terminal to connect WOBBLE AGC detector capacitor

WAG2 19 External-capacitor required

WAG3 20 External-capacitor required

WOBFCF 21 External-capacitor required WOB-BPF f0 auto-adjustment external capacitor

connected terminal

VDD5 22 Power Power supply connected terminal(3.3V)

ATEST 23 Analog-Output Renesas analog test signal output terminal

AWOBSIG 24 Analog-Output Analog-level WOBBLE signal output terminal

GND5 25 Ground Ground connected terminal

LNDTRK 26 Digital-Inputpull-up VDD Balans adjustment mode selection

SPBLVL/TISH2 27 Digital-Inputpull-up VDD R-OPC WRF signal sampling pulse input terminal

/Tilt servo detecting sampling pulse input terminal

RFPDSH 28 Digital-Input putpull-up VDD APC read system sampling pulse input terminal

WFPDSH 29 Digital-Input putpull-up VDD APC write system sampling pulse input terminal

MPDSH/SPDSH 30 Digital-Input putpull-up VDD Pickup input sampling pulse input terminal

WBLSH 31 Digital-Input putpull-up VDD WOBBLE sampling pulse input terminal

WGATE 32 Digital-Input putpull-up VDD Read/write control input terminal

RFHLD/TISH1 33 Digital-Input putpull-up VDD RF hold control signal input terminal /Tilt servo detecting

sampling pulse input terminal

IDGATE 34 Digital-Input putpull-up VDD ID select pulse input terminal

LO_ZB/SPDSH 35 Digital-Input putpull-up VDD Low-z (reversal) pulse input terminal

/Pickup input sampling pulse input terminal

58

pin Name pin No. Type max. voltage Function

BLANK 36 Digital-Output Record/non-record detecting/BD detecting output

terminal

WOBSIG 37 Digital-Output WOBBLE signal output terminal

IP2/MIRR 38 Digital-Output ID detection/Mirror detection output terminal

IP1/LPPOUT 39 Digital-Output ID detection/LPP detection output terminal

DFT 40 Digital-Output Defect detection output terminal

GND4 41 Ground Ground connected terminal (Digital)

PORT00 42 Digital-Input/Output VDD I/O Port

PORT01 43 default input mode

PORT02 44 No pull-up

PORT03 45

PORT04 46

PORT05 47

PORT06 48

PORT07 49

MCLK 50 Digital/Analog-Input VDD Main clock input terminal

No pull-up Equalizer fc auto-adjustment control clock input terminal.

LPP output pulse width control clock input terminal.

WOB-BPF f0 auto-tracking clock input terminal.

PORT10 51 Digital-Input/Output VDD I/O Port

PORT11 52 default input mode

PORT12 53 No pull-up

PORT13 54

SCLK 55 Digital-Input pull-up VDD Serial I/F clock input terminal

SDATA 56 Digital-Input/Output pull-up VDD Serial I/F data input/output terminal

SDEN 57 Digital-Input pull-up VDD Serial I/F enable input terminal

MRSTB 58 Digital-Input pull-up VDD Master reset (reversal) input terminal

VDD4 59 Power Power supply connected terminal(3.3V)(digital)

BHC 60 External-capacitor required External capacitor for LPP bottom hold terminal

MIRRHPF 61 External-capacitor required Terminal to connect Mirror envelope detector HPF

capacitor

MIRRBOTH 62 External-capacitor required Terminal to connect Mirror envelope detector bottom

hold capacitor

MIRRTOPH 63 External-capacitor required Terminal to connect Mirror envelope detector top hold

capacitor

BOTH 64 External-capacitor required Terminal to connect envelope bottom hold capacitor

TOPH 65 External-capacitor required Terminal to connect envelope top hold capacitor

GND1 66 Ground Ground connected terminal

EQOP 67 Differential-Output RF equalizer differential output terminal

EQON 68

VDD1 69 Power Power supply connected terminal(3.3V)

SUBI/LPPSIG 70 Analog-Input VDD ID detecting HPF input terminal/LPP detecting HPF input

terminal

59

pin Name pin No. Type max. voltage Function

SUBO/LPPMON 71 Analog-Output ID detecting HPF output terminal/LPP detecting HPF

output terminal

EQFCF 72 External-capacitor required Terminal to connect RF-equalizer fc auto-adjustment

external capacitor

IREFE 73 External-resistor required Terminal to connect RF-equalizer fc setting external

resistor

AGHPF2 74 External-capacitor required Terminal to connect AGC high pass filter capacitor

AGHPF1 75

AGFU 76 External-capacitor required AGC filter connecting terminal

AGFR 77 External-capacitor required

VCC1 78 Power Power supply connected terminal(5V)

SUMF/SUMF2 79 Analog-Input/ /External-capacitor required VDD SUM RF input/SUM differential amp. DC filter

connected terminal

RFIP 80 Differential-Input VDD RF differential input terminal

RFIN 81

SRVREF 82 Analog-Input VDD DSP supply voltage (3.3V) input terminal

FVREFO 83 Analog-Output 2.5V reference bias voltage output terminal

IREFT 84 External-resistor required Terminal to connect reference current setting external

resistor

VREF1 85 Analog-Output 2.1V reference bias voltage output terminal

HAVC 86 Analog-Input VCC Pickup reference voltage input terminal

SA 87 Analog-Input VCC Sub beam 4D input terminal

SB 88 Analog-Input

SC 89 Analog-Input

SD 90 Analog-Input

VDD2 91 Power Power supply connected terminal(3.3V)

MA 92 Analog-Input VCC Main beam 4D input terminal

MB 93 Analog-Input

MC 94 Analog-Input

MD 95 Analog-Input

GND2 96 Ground Ground connected terminal

AIN1 97 Analog-Input VDD Analog input terminal

AIN2 98 Analog-Input

AIN3 99 Analog-Input

SIGM 100 Analog-Output Analog signal monitoring output terminal

60

IC301 (R8J32007FPV) : Encoder, Decoder & DSP Singal Processor

1.1 Pin Layout

CPU15

A17

EFG

SFG

TLD

SPD

LDD

LE D

GPIO04

ICUIN8

ICUIN6

ICUIN7

TESTB1

TESTB2

MRSTB

VSSIO

VCCIO

VCC

PTEST3

VDDAA

PTEST2

VSSA

REXT

VDDAA

PTEST1

VSSA

VINP

VDDAA

VINN

VSSA

VCCA

VCCA

DAVC

TVDN

TVDP

TRD

FOD

GAD1

GAD0

BCENT

TIB H

TCPH

LPSA

TE

ATZC

SIGM

PE

FE

VSSA

VSSA

VCCA

W1LPF0

W1LPF1

W1LPF2

216

215

214

213

212

211

210

209

208

207

206

205

204

203

202

201

200

199

198

197

196

195

194

193

192

191

190

189

188

187

186

185

184

183

182

181

180

179

178

177

176

175

174

173

172

171

170

169

168

167

166

165

164

163

V

SSR 1 162 W2LPF0

V

CCR 2 161 W2LPF1

CPU14 3 160 W2LPF2

CPU13 4 159

V

DDA

A

CPU12 5 158

V

SSA

A

V

SSIO 6 157 DEFECT

V

CCIO 7 156 BL AN

K

V

CCR

Q

8155 LN DTR

K

CPU11 9 154 WOBSIG

CPU10 10 153 LOWZB

V

SSR

Q

11 152 ID GATE

CPU9 12 151 RFHLD

CPU8 13 150 IP1LP PIN

CPRDB 14 149 IP2M IRR

UCS0B 15 148

V

CCIO

A1 16 147

V

SSIO

CPU0 17 146

V

DD

CPU1 18 145

V

SS

CPU2 19 144

V

SS

A

CPU3 20 143 NRZI

CPU4 21 142 NRZIB

V

SSR

Q

22 141 DCLKB

CPU5 23 140 DCL

K

CPU6 24 139

V

CC

A

CPU7 25 138 WRGATEB

V

CCR

Q

26 137 SRFH

V

SS 27 136 SRFL

V

DD 28 135 WRSTOP

A16 29 134 WRGATE2

A15 30 133

V

CCIO

V

SSIO 31 132

V

SSIO

V

CCIO 32 131

V

SS

A14 33 130

V

DD

A13 34 129 WBLSH

A12 35 128 MPDSH

A11 36 127 WFPDSH

A10 37 126 RFPDSH

A9 38 125 TCSHSPBLV

A20 39 124 LDB USY

CPWRB 40 123 WDEN

V

DD 41 122 RFDEN

V

SS 42 121 SDAT

A

A19 43 120 SCL

K

A18 44 119 FEMC

K

A8 45 118 TRST

A7 46 117 TDO

A6 47 116 TDI

A5 48 115 TC

K

A4 49 114 TMS

A3 50 113 TEST3

V

SSIO 51 112 TEST2

V

CCIO 52 111 TEST1

V

CCR 53 110 TEST0

V

SSR 54 109 DOUT

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

101

102

103

104

105

106

107

108

A2

GPIO05

VSSIO

VCCIO

HRSTB

DATA7

DATA8

DATA6

DATA9

DATA5

DAT A10

DATA4

DAT A11

DATA3

DAT A12

DATA2

DAT A13

VDD

VSS

VSSIO

VCCIO

DATA1

DAT A14

DATA0

DAT A15

DREQ

ZIOWB

ZIORB

IORDY

DACKB

HIN TRQ

IOCS16B

VSSIO

VCCIO

DA1

PDIA GB

DA0

DA2

CS1FXB

CS3FXB

DASPB

GPIO07

GPIO06

ROUT

VCCA

LOU T

ADIP VR1

ADIP VRT

ADIPINP

VSSA

VSSA

XCO

XCI

VCCA

R8J32007

Top View

1.2 Block Diagram

61

Data

WPLL

ADIP

Detector

Detector

Counter

PRML

PLL

Generator

Demodulate

Servo

CD-ROM

Decoder

DVD

PI-ECU

DVD

PO-ECU

DRAM

MCIF

ATAPI

AUDIO

DRAM

Interface

Clock

Generator

Test

Control

VINP

VINN

REXT

PTEST [2:0]

IP1LPPIN

IP2MIRR

LOWZB

IDGATE

RFHLD

W1LPF[2:0]

ADC

ADC

ADIPVRT

LPP

Wobble

WOBSIG

Jitter CD-DSP

CAV

AUDIO

NRZI,NRZIB LVDS

DCLK,DCLKB

WGATEB

WRGATE2

SRFH

WRSTOP

Sample

Hold

WBLSH

MPDSH

WFPDSH

RFPDSH

CD-ROM

CD

Encoder

Modulator

DAC

ADC

FE

PE

TE

LPSA

FOD

DAVC

TRD

XCI

TRST(NMI)

TCK(SCK)

TDI(SCI)

TDO(SCO)

TMS

XCO

Serial I/F

SDATA

RFDEN

SCLK

WDEN

LDBUSY

FEMCK

TEST[3:0]

MRSTB

TESTB[1:2]

ROUT

DOUT

LOUT

DVD

Descramble

DVD

Scramble

Auth

BCA

SSEQ

MSEQ

RA[12.10:0]

DWE

RD[15:0]

DRAS

DCAS

RAMCL

DQMU

DQML

DACKB

CS3FXB

DREQ

CS1FXB

PDIAGB

DASPB

DA2

IOCS16B

IORDY

ZIOWB

HINTRQ

HRSTB

ZIORB

DATA [15:0]

DA1

DA0

SFG

ATZC

DERECT

BLANK

EFG

LED

LNDTRK

LDD

TLD

TCSHSPBLV

DCKE

W2LPF[2:0]

H8S

CPU

ADC

GAD1

ADGATEB

INT0B

FOK

CPWRB

CPRDB

UCS2B

A[20:0]

CPU[15:0]

INT1B

INT2B

UCS0B

GPIO05(UCS1B)

CPRDB

CPWRB

A[20:1]

CPU[15:0]

GPIO06(CSEL)

GPIO07(HEATRUN)

ICUIN6(EJECTSW)

ICUIN7(ACTFLG)

GPIO04(A[0])

SDRAM

16Mbit

ZCS

UCS3B

INT3B

SRFL

TCPH

TIBH

BCENT

FAD0(VRDC2N)

TVDP

TVDN

ADC

WAI T

ICUIN8(LOADIN)

DAC

SIGM

SPD

ADIPINP

ADIPVR1

Cmp

62

1.3 Pin Table

Pin no Pin Name

1 VSSR

2 VCCR

3 CPU14

4 CPU13

5 CPU12

6 VSSIO

7 VCCIO

8 VCCRQ

9 CPU11

10 CPU10

11 VSSRQ

12 CPU9

13 CPU8

14 CPRDB

15 USC0B

16 A1

17 CPU0

18 CPU1

19 CPU2

20 CPU3

21 CPU4

22 VSSRQ

23 CPU5

24 CPU6

25 CPU7

26 VCCRQ

27 VSS

28 VDD

29 A16

30 A15

31 VSSIO

32 VCCIO

33 A14

34 A13

35 A12

36 A11

37 A10

38 A9

39 A20

40 CPWRB

41 VDD

42 VSS

43 A19

44 A18

45 A8

46 A7

47 A6

48 A5

49 A4

50 A3

51 VSSIO

52 VCCIO

53 VCCR

54 VSSR

Pin no Pin Name

55 A2

56 GPIO05

57 VSSIO

58 VCCIO

59 HRSTB

60 DATA7

61 DATA8

62 DATA6

63 DATA9

64 DATA5

65 DATA10

66 DATA4

67 DATA11

68 DATA3

69 DATA12

70 DATA2

71 DATA13

72 VDD

73 VSS

74 VSSIO

75 VCCIO

76 DATA1

77 DATA14

78 DATA0

79 DATA15

80 DREQ

81 ZIOWB

82 ZIORB

83 IORDY

84 DACKB

85 HINTRQ

86 IOCS16B

87 VSSIO

88 VCCIO

89 DA1

90 PDIAGB

91 DA0

92 DA2

93 CS1FXB

94 CS3FXB

95 DASPB

96 CPIO07

97 CPIO06

98 ROUT

99 VCCA

100 LOUT

101 ADIPVR1

102 ADIPVRT

103 ADIPINP

104 VSSA

105 VSSA

106 XCO

107 XCI

108 VCCA

Pin no Pin Name

109 DOUT

110 TEST0

111 TEST1

112 TEST2

113 TEST3

114 TMS

115 TCK

116 TDI

117 TDO

118 TRST

119 FEMCK

120 SCLK

121 SDATA

122 RFDEN

123 WDEN

124 LDBUSY

125 TCSHSPBLV

126 RFPDSH

127 WFPDSH

128 MPDSH

129 WBLSH

130 VDD

131 VSS

132 VSSIO

133 VCCIO

134 WRGATE2

135 WRSTOP

136 SRFL

137 SRFH

138 WRGATEB

139 VCCA

140 DCLK

141 DCLKB

142 NRZIB

143 NRZI

144 VSSA

145 VSS

146 VDD

147 VSSIO

148 VCCIO

149 IP2MIRR

150 IP1LPPIN

151 RFHLD

152 IDGATE

153 LOWZB

154 WOBSIG

155 LNDTRK

156 BLANK

157 DEFECT

158 VSSAA

159 VDDAA

160 W2LPF2

161 W2LPF1

162 W2LPF0

Pin no Pin Name

163 W1LPF2

164 W1LPF1

165 W1LPF0

166 VCCA

167 VSSA

168 VSSA

169 FE

170 PE

171 SIGM

172 ATZC

173 TE

174 LPSA

175 TCPH

176 TIBH

177 BCENT

178 GAD0

179 GAD1

180 FOD

181 TRD

182 TVDP

183 TVDN

184 DAVC

185 VCCA

186 VCCA

187 VSSA

188 VINN

189 VDDAA

190 VINP

191 VSSA

192 PTEST1

193 VDDAA

194 REXT

195 VSSA

196 PTEST2

197 VDDAA

198 PTEST3

199 VCC

200 VCCIO

201 VSSIO

202 MRSTB

203 TESTB2

204 TESTB1

205 ICUIN7

206 ICUIN6

207 ICUIN8

208 GPIO04

209 LED

210 LDD

211 SPD

212 TLD

213 SFG

214 EFG

215 A17

216 CPU15

63

1.4 Pin Functions

It corresponds to the following signs as a pin I/O specification.

AI : Analog Input

AO : Analog Output

AIO : Analog Input/Output

I : Standard Input

IU : Standard Input with Pull Up

O : Standard Output

TO : Standard Three State Output

IO : Standard Input/Output

IOU : Standard Input/Output with Pull Up

5I : 5V Tolerant Input

5O : 5V Tolerant Output

5TO : 5V Tolerant Three State Output

5IO : 5V Tolerant Input/Output

PW : Power Supply Pin

GND : Earth Pin

Data PLL/PRML Pin List

Pin Name Pin No. I/O destination Function

VINP 190 AI AFE RF signal normal phase input pin

VINN 188 RF signal counter phase input pin

REXT 194 AO External Resistance Resistor connect pin for reference current generation

PTEST1 192 AO External Resistance PRML/Data PLL moniter D/A output pin

PTEST2 196 PRML/Data PLL moniter D/A output pin

PTEST3 198 Data PLL VCO control voltage monitor pin

Wpll Pin List

Pin Name Pin No. I/O destination Function

W1LPF0 165 AO External Components Write PLL1 filter connect pin (0)

W1LPF1 164 Write PLL1 filter connect pin (1)

W1LPF2 163 Write PLL1 filter connect pin (2)

W2LPF0 162 AO External Components Write PLL2 filter connect pin (0)

W2LPF1 161 Write PLL2 filter connect pin (1)

W2LPF2 160 Write PLL2 filter connect pin (2)

64

Servo Pin List

Pin Name Pin No. I/O destination Function

BLANK 156 I AFE Blank signal input

(also connected to the H8S interrupt port INT5)

DEFECT 157 I AFE Defect (scratch detect) signal

SFG 213 IU DRVR Spindle FG pulse

(also input to the H8S interrupt port INT4)

EFG 214 I PU Spindle FG pulse for Light Scribe

(also input to the H8S interrupt port INT4)

TLD 212 TO DRVR Tilt drive signal (PWM output)

SPD 211 TO DRVR Spindle drive signal (PWM output)

LDD 210 TO DRVR Loading drive signal (PWM output)

LED 209 TO PU LPS_LED control signal (PWM output)

ATZC 172 AI AFE Tracking Zero Cross input signal

FE 169 AI AFE Focus error: sampled at 352.8 kHz

PE 170 AI AFE Laser power error: sampled at 352.8 kHz

SIGM 171 AI AFE Signal monitor: sampled at 88.2/176.4 kHz

TE 173 AI AFE Tracking error: sampled at 352.8 kHz

LPSA 174 AI AFE Lens positioning/lens error: sampled at 88.2 kHz

TCPH 175 AI AFE Tracking center/BETA top hold: sampled at 44.1/176.4 kHz

TIBH 176 AI AFE Tilt error/BETA bottom hold: sampled at 44.1/176.4 kHz

BCENT 177 AI AFE BETA center: sampled at 176.4 kHz

GAD1 179 AI General AD input: sampled at 88.2 kHz

GAD0(VRDC2N) 178 AI General AD input: sampled at 176.4 kHz

FOD 180 AO DRVR Focus control signal

TRD 181 AO DRVR Tracking control signal

TVDP 182 AO DRVR Sled drive signal (normal phase)

TVDN 183 Sled drive signal (counter phase)

DAVC 184 AO DRVR Servo system Vcc/2 voltage output pin

65

ATAPI Interface Pin List

Pin Name Pin No. I/O destination Function

HRSTB 59 5I ATAPI ATAPI-IF control signal (host reset signal)

DA2 92 5I ATAPI ATAPI-IF register address signal

DA1 89

DA0 91

DATA[15:0] 79,77,71, 5IO ATAPI ATAPI- IF data bus

69,67,65,

63,61,60,

62,64,66,

68,70,76,

78

DREQ 80 5TO ATAPI ATAPI-IF DMA request signal

ZIOWB 81 5I ATAPI ATAPI-IF write strobe pulse

ZIORB 82 5I ATAPI ATAPI-IF read strobe pulse

IORDY 83 5TO ATAPI ATAPI-IF control signal (drive Ready)

DACKB 84 5I ATAPI ATAPI-IF DMA acknowledge

HINTRQ 85 5TO ATAPI ATAPI-IF drive interrupt signal

IOCS16B 86 5TO ATAPI ATAPI-IF control signal (16-bit transfer)

PDIAGB 90 5IO ATAPI ATAPI-IF control signal

CS1FXB 93 5I ATAPI ATAPI-IF register chip select signal

CS3FXB 94

DASPB 95 5IO ATAPI ATAPI-IF control signal

66

Encoder Interface Pin List

Serial Communication Interface Pin List

Pin Name Pin No. I/O destination Function

IP1LPPIN 150 I AFE PID area identification signal/LPP input signal

IP2MIRR 149 I AFE PID area identification signal/MIRR signal

WOBSIG 154 I AFE Wobble signal input

LOWZB 153 O AFE Input impedance switch control signal/SPDSH; running

OPC sampling pulse (Pit top)

IDGATE 152 O AFE ID/data switch signal

RFHLD 151 O AFE VFO3 holding signal and track center signal sample &

hold signal

WRGATE2 134 O AFE Write gate signal output

WBLSH 129 O AFE Wobble signal sampling pulse

MPDSH 128 O AFE Main beam sampling pulse

WFPDSH 127 O AFE Laser control sampling pulse

(Front monitor write/erase block)

RFPDSH 126 O AFE Laser control sampling pulse

(Front monitor read block)

TCSHSPBLV 125 O AFE VFO1 track center signal sample & hold pulse;

/SPBLVL running OPC sampling pulse (Pit end)

WRGATEB 138 O PU Write gate signal

SRFH 137 O PU I- V amplifier gain switch (HI side)

/I- V amplifier gain switch (for binary)

SRFL 136 I- V amplifier gain switch (Low side)

WRSTOP 135 I PU Write stop gate signal

LNDTRK 155 O AFE/PU Land/groove switch

NRZI 143 AO PU NRZI output after modulation (normal phase)

NRZIB 142 NRZI output after modulation (counter phase)

DCLK 140 AO PU NRZI sync clock (counter phase)

DCLKB 141 NRZI sync clock (normal phase)

ADIPVR1 101 AO External Cpmponents AD related pin for ADIP detection

ADIPVRT 102 AO External Cpmponents AD related pin for ADIP detection

ADIPINP 103 AI AFE ADIP detect input pin

Pin Name Pin No. I/O destination Function

LDBUSY 124 IO LDD LDD serial IF busy also functions as the CPU general port 1-0

WDEN 123 O LDD LDD microcomputer I/F (transfer enable signal)

RFDEN 122 O AFE AFE microcomputer I/F (transfer enablesignal)

SDATA 121 IO AFE/LDD AFE/LDD microcomputer I/F (transfer data signal 3Vsystem)

SCLK 120 O AFE/LDD AFE/LDD microcomputer I/F (transfer clock signal)

67

Audio Interface Pin List

Pin Name Pin No. I/O destination Function

DOUT 109 IO ATAPI Digital output pin,also functions as the CPU general port 1-2

ROUT 98 AO ATAPI Audio Lch & Rch output

LOUT 100

Clock Generator Pin List

Pin Name Pin No. I/O destination Function

FEMCK 119 O AFE Front End LSI clock

XCO 106 O X’tal Crystal oscillation 33.8688MHz

XCI 107 I X’tal Crystal oscillation 33.8688MHz

Flash/SRAM Pin List

Pin Name Pin No. I/O destination Function

UCS0B 15 O Flash H8S / CS0

CPWRB 40 O Flash / SRAM H8S / WRB

CPRDB 14 O Flash / SRAM H8S / RDB

A[20:1] 39,43,44, O Flash / SRAM H8S / A[20:1]

215,29,30,

33,34,35,

36,37,38,

45,46,47,

48,49,50,

55,16

CPU[15:1] 216,3,4, IO Flash / SRAM H8S / D[15:0]

5,9,10, CPU[0] can also function as the CPU general port 0-4

(multiplexed).

12,13,25,

24,23,21,

20,19,18

17

H8S Micro-Processor Pin List

CPU

Pin Name Pin No. I/O destination Function

ICUIN7(ACTFLG) 205 IU DRVR CPU interrupt port INT7: Pick up protect flag

ICUIN6(EJECTSW) 206 I Eject Switch CPU interrupt port INT6: EJECTSW interrupt request

ICUIN8(LOADIN) 207 IO Load Switch CPU general port1-1 also connected to the CPU interrupt

port INT8: Loader in sensor

GPIO07(HEATRUN) 96 5IO ATAPI CPU general port 0-7 :Off heat run test input

GPIO06(CSEL) 97 5IO ATAPI CPU general port 0-6 ATAPI CSEL

GPIO04(A0) 208 IO SRAM CPU general port 0-4, also functions as H8S / A0

GPIO05(UCS1B) 56 IO SRAM CPU general port 0-5, also functions as H8S / CS1

68

LSI/TEST Control Pin List

Pin Name Pin No. I/O destination Function

MRSTB 202 I RESET IC Master reset input

TESTB2 203 I Test select

TESTB1 204

TMS 114 IU E10emulator Test data switch for E10emulator

TCK 115 IOU E10emulator Test clock for E10 emulator

It can function as a SCI serial clock output port when E10

emulator is not used (multiplexed).

TDI 116 IU E10emulator Test data input for E10 emulator

It can function as a SCI serial data input port when E10

emulator is not used (multiplexed).

TDO 117 O E10emulator Test data output for E10 emulator

It can function as a SCI serial data output port when E10

emulator is not used (multiplexed).

TRST 118 I E10emulator Test reset for E10 emulator

/Non-mask CPU interrupt port(falling edge sense)

TEST0 110 IO User test/CPU general port2

TEST1 111 Test monitor can be set as the following table by a register

TEST2 112

TEST3 113

T*SEL[3:0] TEST0 TEST1 TEST2 TEST3

0 Servo monitor 0 Servo monitor 1 Servo monitor 2 Servo monitor 3

1 WPLL monitor 0 WPLL monitor 1 WPLL monitor 2 WPLL monitor 3

2 Audio 0 Audio 1 Audio 2 Audio 3

3 DVD modulation 0 DVD modulation 1 DVD modulation 2 DVD modulation 0

4 DVD-R/CD-R DVD-R/CD-R DVD-R/CD-R DVD-R/CD-R

monitor 0 monitor1 monitor 2 monitor 3

5 DVD+RW monitor 0 DVD+RW monitor1 DVD+RW monitor 2 DVD+RW monitor 3

6 PI/C1 PI/C1 PI/C1 PI/C1

7 PO/C2 PO/C2 PO/C2 PO/C2

8 DEMO 0 DEMO 1 DEMO 2 DEMO 3

9- - - -

10 CLVCK CLVCK CLVCK CLVCK

11 BLEND BLEND BLEND BLEND

12 PRML monitor 0 PRML monitor 1 PRML monitor 2 PRML monitor 3

13 Data PLL monitor 0 Data PLL monitor 1 Data PLL monitor 2 Data PLL monitor 3

14 RAMCON monitor 0 RAMCON monitor 1 RAMCOM monitor 2 RAMCON monitor 3

15 MIF monitor 0 MIF monitor 1 MIF monitor 2 MIF monitor 3

16 WOBREF monitor 0 WOBREF monitor 1 WOBREF monitor 2 WOBREF monitor 3

T*SEL can be set for each of pins TEST3, TEST2, TEST1, and TEST0, respectively.

69

Power Supply/GND Pin List

Pin Name Pin No. I/O Function

VDD 28,41,72, PW DSP core power supply (1.5V)

130,146

VCCR 2,53 PW SDRAM power supply (3.3V)

VCCRQ 8,26 SDRAM I/O power supply (3.3V)

VDDAA 159 PW 1.5V system analog power supply (1.5V) WPLL1,2

189,193,197 1.5V system analog power supply (1.5V) PRML A/D Data PLL

VCCA 99 PW Analog power supply (3.3V):AUDIO / ADIP

108 Analog power supply (3.3V):PLL multiplication

139 Analog power supply (3.3V):LVDS

166 Analog power supply (3.3V):WPLL1,2

185 Analog power supply (3.3V):Servo A/D D/A

186 Analog power supply (3.3V):PRML A/D Data PLL

VCC 199 PW Digital power supply (3.3V):PRML A/D Data PLL

VCCIO 7,32,52, PW DSP I/O power supply (3.3V)

58,75,88,

133,148,200

VSS 27,42,73, GND DSP core GND

131,145

VSSR 1,54 GND SDRAM GND

VSSRQ 11,22 GND SDRAM I/O GND

VSSA 104 GND Analog GND:AUDIO / ADIP

105 Analog GND:PLL multiplication

144 Analog GND:LVDS

167 Analog GND:WPLL1,2

168 Analog GND:Servo A/D D/A

187,191,195 Analog GND:PRML A/D Data PLL

VSSAA 158 GND 1.5V system analog GND:WPLL1,2

VSSIO 6,31,51, GND DSP I/O GND

57,74,87, Connected SDRAM I/O GND through 6,31pin

132,147,201

70

No Pin name Function

1 SPIN Spindle control voltage input

2 SL1IN Slide control voltage input1

3 SL2IN Slide control voltage input2

4 SPLIM Input terminal for spindle current limit

5 VM2 Motor Power Supply 2(for Slide)

6 SL2+ Slide non-inverted output2

7 GND GND

8 SL2- Slide inverted output2

9 SL1+ Slide non-inverted output1

10 SL1- Slide inverted outptut1

11 GND GND

12 U Motor drive output U

13 V Motor drive output V

14 W Motor drive output W

15 ACTFLG Pickup protect flag output

16 COMMON Motor common

17 TEST Test terminal (*1)

18 SLLIM Input terminal for slide current limit

19 FG Frequency generator output

20 EN1 Input terminal for enable 1

21 EN2 Input terminal for enable 2

No Pin name Function

42 REF Reference voltage input

41 LOIN Loading control input

40 FOIN Focus control voltage input

39 TOIN Tracking control voltage input

38 TLIN Tilt control voltage input

37 TL- Tilt inverted output

36 TL+ Tilt non-inverted output

35 FO- Focus inverted output

34 FO+ Focus non-inverted output

33 GND GND

32 5VCC 5V Power Supply (for FS,TS,TL)

31 TO+ Tracking non-inverted output

30 TO- Tracking inverted output

29 GND GND

28 LO- Loading inverted outptut

27 LO+ Loading non-inverted output

26 VM3 Power Supply3(for Loading)

25 ACTRST Pickup protect Reset (*2)

24 STTH Reference voltage for spindle start up

23 SPGS Input terminal for gain select SPM

22 VM1 Motor Power Supply 1(for Spindle)

Pin Function

*1) Please connect 17terninal (TEST) to GND or open, for TEST.

*2) Please connect 25terminal(ACTRST) to 5VCC, When the Pick-up protection circuit is not used.

IC601 (R2S30202FP) : SPINDLE MOTOR AND 6CH ACTUATOR DRIVER

Pin Layout

142SPIN REF

241SL1IN LOIN

340SL2IN FOIN

439SPLIM TOIN

538VM2 TLIN

637SL2+ TL-

736GND TL+

835SL2- FO-

934SL1+ FO+

10 33SL1- GND

11 32GND

R2S3

0202FP

5VCC

12 31U TO+

13 30V TO-

14 29W GND

15 28ACTFLG LO-

16 27COMMON LO+

17 26TEST VM3

18 25SLLIM ACTRST

19 24FG STTH

20 23EN1 SPGS

21 22EN2 VM1

Package outline : 42 PIN POWER SSOP (42P9R-K)

Block Diagram

71

STM

M

SWICHING

Commutation PWM

CIRCUIT

SPM

V/V converter

+-

CTL

SLIDE2

V/V converter

+

-

CTL

+

-

CTL

SL1+

SL1-

SL1IN

SL2+

SL2-

SL2IN

REF

SPIN

FG

U

V

W

FOIN

FO+

FO-

TRIN

TR+

TR-

VM2

SLIDE1

V/V converter

PWM

CIRCUIT PWM

CIRCUIT

Current

sense

Current

sense

Current

sense

GND

GND

DSP

DSP

DSP

DSP

DSP

DSP

DSP

BTLAMP

CurrentchopperPWM

Currentc

hopperPWM

SPLIM

DSP

5VCC

SLLIM

commutation

STARTER

CLK

TLIN

TL+

TL-

STTH

Current gain

0.88 A/V

BTLAMP

BTLAMP

OUTPUT Ron

1ohm

OUTPUT Ron

1.5ohm

OUTPUT Ron

1.5ohm

OUTPUT Ron

1.5ohm

OUTPUT Ron

1.8 ohm

6.4MHz

Frequency

75KHz Frequency

75KHz

Frequency

150KHz

Current gain

0.88 A/V

Current gain

3A/V

0.6A/V

OUTPUT Ron

1.8 ohm

For /FO/TR/TILT

VM1

GND

BACK EMF

DETECTER

TSD

SINCurrent chopperPWM

For SPINDLE

For SLIDE

7-13.2V

7-13.2V

4.5-5.5V

FG(x3)

Reverse detect

Voltage gain

x12 Voltage gain

x12 Voltage gain

x12

LO+

LO-

VM3

DSP

M

OUTPUT Ron

1.5ohm

GND

H Bridge

+ -

EN 1 DSP

EN 2 DSP

For LOADING

4.5-5.5V

7-13.2V

TEST

SPGS

Gain Select

(SPM)

ENABLE

COMMON

ACTRST

ACTFLG

DSP

DSP Pickup Protect

TEST mode

72

Input/Output circuit diagram

SPIN, SL1IN, SL2IN

LOIN

FOIN, TOIN,TLIN

TEST

REF EN1, EN2

SPGS ACTFLG,FG ACTRST

VM1, U, V, W VM2, SL1+, SL1-, SL2+, SL2-

5VCC, FO+, FO-, TO+, TO-, TL+, TL- VM3, LO+, LO-

5VCC 5VCC 5VCC 5VCC

5VCC 5VCC 5VCC

VM1 VM2

VM3

5VCC

U V W SL1+ SL1- SL2-SL2+

LO-LO+

FO-FO+ TO-TO+ TL-TL+

(Temperature monitor)

5VCC

5VCC

10k

25k

100 100

100 100 100 100

17k

35k

COMMON

VM1

U

COMMON 100

TROUBLESHOOTING GUIDE

73

MPU & DSP

IC301

MPU & DSP

IC301

MPU & DSP

IC301

AFE

IC101

AFE

IC101

Pickup

LD

Driver Front

Monitor

IC102

AFE

IC101

#6

Pin#79

Pin#110

Pin#203

Pin#

87-90

#2

#1

#3

C137 Pin#21

#10

#12

FFC

FFC

17,18,20,21

FFC

FFC

Pickup

Pickup

FFC

Setting

Setting

FE:R102,C405

Pin#175

pin#98

LD

Driver

TE:R101,C101

PE:R103,C406

(01) Laser Power Adjust (using RD Power/WR Power/Erase Power)

(02) High Frequency/NRZI skew Adjust

(03) Data Slice/Equalizer Boost/Raw Slice/ Equalizer Frequency Adjust

(04) Circuit Offset Adjust

(05) Focus Amp. Adjust for DVD-Dual

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

Pin#

87-90

#2

#40

FFC

Slider FPC

Slider, #6,8-10

Focus:#34-35

DVD-Dual Disc

Setting

FE:R102,C405

R329,C335

MPU & DSP

IC301

74

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

All Disc

Pin#

87-90

FFC

Setting

FE:R102,C405

Focus:#34-35

R329,

C335 #40

All Disc

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

All Disc

Pin#

87-90

Setting

FE:R102,C405

Tracking:#30-31

Focus:#34-35

TE:R101,C101

R329,C335 #40

R330,C336 #39

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

Pin#

87-90

#1

#2

PE:R103,C406

#3

#2

#1

FFC

Setting

TE:R101,C101

Tracking

#30-31

Slider FPC

Slider:#6,8-10

Slider FPC

Slider:#6,8-10

R330

C336

#39

(06) Focus Amp. and Total Amp. Adjust

(07) Tracking Amp. Adjust

(08) Servo Loop Gain Adjust

FFC

75

DVD-RAM Disc

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

Pin#

80-81

#171 #100

FFC

Setting

SIGM:R148, C151

Slider FPC

Slider:#6, 8-10

DVD-RAM Disc

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

Pin#

87-90,80-81

#67,68

FFC

Setting

C341,343

Slider FPC

Slider:#6, 8-10

DVD-RAM Disc

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

Pin#

87-90,80-81

#100

FFC

Setting

SIGM:R148,C151

Slider FPC

Slider:#6, 8-10

(09) Unwritten Slice Level Adjust for DVD-RAM

(12) Focus Offset Adjust for DVD-RAM (Data Error pulse)

(11) Focus Offset Adjust for DVD-RAM (PID Amp)

DVD-ROM Disc

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

Pin#

87-90,80-81

#2

FFC

Setting

FE:R102,C405

Slider FPC

Slider:#6, 8-10

(10) Focus Offset Adjust for DVD-ROM, CD-R/RW

76

Slider FPC

Slider:#6,8-10

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

DVD-R/RW Disc

Pin#

87-90, 80-81

Pin#

87-90,80-81

FFC

Setting

TE:R101, C101

TRD:R330,C336

TILT: #36-37

#39

#181

#1

Tracking: #30-31

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup DVD-R/RW Disc

FFC

Setting

FE:R102, C405

FE:#34-35

FE

R329, C335 #40

#2

(14) Tilt Adjust for DVD-R/RW, DVD+R/RW, CD-R/RW

(15) Focus Deviation Adjust

Pin#

87-90,80-81

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

DVD-R/RW Disc

FFC

Setting

TE:R101, C101

Tracking:#30-31

Slider FPC

Slider:#6, 8-10

R330, C336

TRD:

#39

#1

#181

(16) Focus Offset Adjust for DVD-R/RW, DVD+R/RW, CD-R/RW

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup DVD-RAM Disc

Pin#

87-90,80-81

FFC

Setting

TCE:R106, C106

Slider FPC

Slider:#6, 8-10

TIE:R107,C107

#6

#7

(13) Tilt Adjust for DVD-RAM

77

MPU & DSP

IC301

MPU & DSP

IC301

Driver

IC601

Pickup

FFC

FFC

(Temp.Information)

putemp

#178

Spindle

SPD:R349, C349

#211 #1 Pin#

12-14

#19

#213 FG

Pin#

87-90,80-81

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

DVD+R Disc

FFC

Setting

WobSIG

Slider FPC

Slider:#6, 8-10

#154 #37

Pin#

87-90,80-81

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

DVD-R/RW Disc

FFC

Setting

C341, 343

Slider FPC

Slider:#6,8-10

#67,68

#39

(17) Lens Sensitivity Adjust

(18) Spindle Offset Adjust

(19) ADIP BPF/Read Timing Adjust for DVD+R/RW

(20) Focus Offset Adjust for DVD-R/RW, DVD+R/RW(DID)

78

AFE

IC101

Driver

IC601

Slider/

Spindle

Spindle FFC

Slider FPC

Slider:#6,8-10

Pin#

87-90

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

All Disc

FFC

Setting

FE:R102,C405

Focus:#34-35

Tracking:#30-31

Slider FPC

Slider:#6,8-10

TE:R101,C101

PE:R103,C406

R329,C335 FOD

TRD

R330, C336

#40

#1

#3

#2

#43

#39

(21) RTZ TimeOut Fail

(22) Focus Servo/Tracking Servo Fail

79

No. Error Code Contents of fail Fail Analysis Block Diagram

SSB Byte8,9

1 28xx LP Adjust NG. 1) Check Pickup FFC Connection. No.01

2) Check solder of IC101circumference.

(pin#6, 10, 12, L150, L151)

3) Check solder of IC102.

4) Exchange Pickup(LDD, Front Monitor).

5) Exchange IC101(AFE).

6) Exchange IC301(MPU & DSP).

2 48xx High Frequency Adjust NG. 1) Check Pickup FFC Connection. No.02

2) Exchange Pickup (LDD part).

3) Exchange IC301(DSP).

3 5Exx NRZi Skew Adjust NG. 1) Check Pickup FFC Connection No.02

2) Exchange Pickup (LDD part).

3) Exchange IC301(MPU & DSP).

4 4C0x to 4C4x Data Slice Adjust NG. 1) Check solder of IC101circumference. No.03

(pin# 79, L150, L151)

2) Exchange IC101(AFE).

3) Exchange IC301(MPU & DSP).

5 4C5x to 4C7x EQ Boost Adjust NG. 1) Check solder of IC101circumference.

(pin# 79, L150, L151)

2) Exchange IC101(AFE).

3) Exchange IC301(MPU & DSP).

6 4C80 RAW Slice Level Adjust NG. 1) Check solder of IC101circumference.

(pin# 79, L150, L151)

2) Exchange IC101(AFE).

3) Exchange IC301(MPU & DSP).

7 4CAx EQ Auto Frequency Adjust NG. 1) Check solder of IC101circumference.

(pin# 79, L150, L151)

2) Exchange IC101(AFE).

3) Exchange IC301(MPU & DSP).

Detail Error Code & Fail Analysis

1. Laser Power Initial Adjust

(Exchange

low/high byte)

Byte8: xxh

Byte9: 28h

80

No. Error Code Contents of fail Fail Analysis Block Diagram

SSB Byte21,22

1 42xx Circuit Offset Adjust NG. 1) Check Pickup FFC Connection. No.04

2) Check solder of IC101circumference .

(pin#,1,2,3 pin#87-90,

FE_Servo: R102, C405

TE_Servo: R101, C101

PE_Servo: R103, C406)

3) Exchange IC101(AFE).

4) Exchange Pickup.

5) Exchange IC301(MPU & DSP).

2 452x Focus Amp Adjust NG. 1) Check DVD-Dual Disc. No.05

(DVD-DL Only) 2) Check Pickup FCC Connection.

3) Check solder of IC101circumference.

(pin#1,2,3 pin#87-90,

FE_Servo: R102, C405)

4) Check Slider FPC Connection.

5) Exchange IC101(AFE).

6) Exchange IC601(Driver).

7) Exchange IC301(MPU & DSP).

3 450x Focus Amp Adjust NG. 1) Check Pickup FFC Connection. No.06

451x Total Amp Adjust NG. 2) Check solder of IC101circumference.

454x (pin#1,2,3 pin#87-90,

FE_Servo: R102, C405

PE_Servo: R103, C406)

3) Exchange Pickup.

4) Exchange IC101(AFE).

5) Exchange IC301(MPU & DSP).

4 458x Tracking Amp Adjust NG. 1) Check Pickup FFC Connection. No.07

2) Exchange Pickup.

3) Check solder of IC101circumference.

(pin#1,2,3 pin#87-90,

TE_Servo: R101, C101)

4) Exchange IC101(AFE).

5) Exchange IC301(MPU & DSP).

5 47xx Servo Loop Gain Adjust NG. 47XA: Disc Unmatch(Exchange Disc). No.08

1) Check Pickup FFC Connection.

2) Exchange Pickup (Signal Noisy).

3) Check solder of IC101circumference.

(pin#1,2,3 pin#87-90,

FE_Servo: R102, C405

TE_Servo: R101, C101)

4) Exchange IC101(AFE).

5) Exchange IC301(MPU & DSP).

6 49xx Unwritten Slice Level Adjust NG. 4906: RAM Disc NG (Exchange Disc). N0.09

(RAM Only) 1) Check solder of IC101circumference.

(pin#1,2,3 pin#87-90)

2) Exchange IC101(AFE).

3) Exchange IC301(MPU & DSP).

2. Adjusting Error during Disc Load Sequence (Lead in Error)

81

No. Error Code Contents of fail Fail Analysis Block Diagram

SSB Byte21,22

7 4Axx Focus Offset Adjust NG. 4A08: Disc Unmatch(Exchange Disc). No.10

(DVD-ROM,CD-R/RW) 1) Check Pickup FFC Connection.

2) Exchange Pickup.

3) Exchange IC301(MPU & DSP).

8 4A5x Focus Offset Adjust NG. 1) RAM Disc NG (Exchange RAM Disc) No.11

4A6x (RAM Only for PID) 2) Exchange Pickup

3) Exchange IC101(AFE)

4) Exchange IC301(MPU & DSP)

9 4A8x Focus Offset Adjust NG. 4A88: RAM Disc NG (Exchange RAM Disc). No.12

(RAM Only for Data) 1) Exchange Pickup.

2) Exchange IC101(AFE).

3) Exchange IC301(MPU & DSP)

10 4B0x Tilt Adjust NG(RAM Only). 1) Check Pickup FFC Connection. No.13

2) Exchange Pickup.

3) Check solder of IC101circumference.

(pin#6,7 R106, C106, R107, C107)

4) Exchange IC101(AFE).

5) Exchange IC301(MPU & DSP).

11 4B8x Tilt Adjust NG(DVD-/+ R/RW). 1) Check Pickup FFC Connection. No.14

2) Exchange Pickup.

3) Check solder of IC601 circumference.

4) Exchange IC601.

5) Check solder of IC301 circumference.

6) Exchange IC301

7) Exchange Slider Motor.

12 4CCx Data Slice Adjust NG. 1) Exchange Pickup. No.12

(RAM Only) 2) Exchange IC101(AFE).

3) Exchange IC301(MPU & DSP).

13 4Dxx Focus Deviation Adjust NG. 1) Check Pickup FFC Connection. No.15

2) Exchange Pickup.

3) Check solder of IC301circumference.

4) Exchange IC301(MPU & DSP).

14 182x Home Position Adjust NG. 1) Check FFC Connection. No.21

01xx (DVD-SL Only) 2) Check Slider FPC Connection.

3) Exchange Slider Motor.

4) Check solder of IC101circumference.

5) Exchange IC101(AFE).

15 52xx Focus Offset Adjust NG. 1) Check Pickup FFC Connection. No.16

(DVD-R/RW, +R/RW) 2) Exchange Pickup.

3) Check solder of IC101circumference.

(pin#1,2,3 pin#87-90,

TE_Servo: R101, C101)

4) Exchange IC101(AFE).

82

No. Error Code Contents of fail Fail Analysis Block Diagram

SSB Byte21,22

16 54xx DPP Amp Adjust NG. 1) Check Pickup FFC Connection. No.07

(CD Disc Only) 2) Exchange Pickup.

3) Check solder of IC101circumference.

(pin#1,2,3 pin#87-90,

TE_Servo: R101, C101)

4) Exchange IC101(AFE).

5) Exchange IC301(MPU & DSP).

17 55xx Lens Shift/ Tilt Adjust NG. 1) Check Pickup FFC Connection. No.14

(CD Disc Only) 2) Exchange Pickup.

3) Check solder of IC601 circumference.

4) Exchange IC601.

5) Check solder of IC301 circumference.

6) Exchange IC301

7) Excahange Slider Motor

18 56xx Focus Level Adjust NG. 1) Check Pickup FFC Connection. No.06

2) Exchange Pickup.

3) Check solder of IC101circumference.

(pin#1,2,3 pin#87-90,

PE_Servo: R103, C406)

4) Exchange IC101(AFE).

5) Exchange IC301(MPU & DSP).

19 57xx HFPE Amp/Gain Adjust NG. 1) Check Pickup FFC Connection. No.13

2) Exchange Pickup.

3) Check solder of IC101circumference.

(pin#6,7 R106, C106, R107, C107)

4) Exchange IC101(AFE).

5) Exchange IC301(MPU & DSP).

20 58xx Lens Sensitivity Adjust NG. 1) Check Pickup FFC Connection. No.17

2) Exchange Pickup.

3) Check solder of IC301circumference.

4) Exchange IC301(MPU & DSP).

21 59xx Spindle Offset Adjust NG. 1) Check Spindle FFC Connection. No.18

2) Check solder of IC601circumference.

(pin#12-14)

3) Exchange IC601(Driver).

4) Exchange Spindle Motor.

5) Check solder of IC301circumference.

6) Exchange IC301(MPU & DSP).

83

No. Error Code Contents of fail Fail Analysis Block Diagram

SSB Byte21,22

22 5Axx ADIP read timing Adjust NG. 5A01: Check DVD+R Disc (Exchange Disc) . No.19

1) Check Pickup FFC Connection.

2) Exchange Pickup.

3) Exchange IC101(AFE).

4) Exchange IC301(MPU & DSP).

5) Exchange IC601(Driver)

23 5Cxx Signal Amp Error. 1) Check Pickup FFC Connection. No.06

2) Exchange Pickup.

3) Check solder of IC101circumference.

(pin#1,2,3 pin#87-90,

PE_Servo: R103, C406)

4) Exchange IC101(AFE).

5) Exchange IC301(MPU & DSP).

24 5Dxx Focus Offset Adjust NG. 1) Check Pickup FFC Connection. No.20

(DVD-R/RW,+R/RW in Data) 2) Exchange Pickup.

3) Check solder of IC101circumference.

4) Exchange IC101.

5) Check solder of IC701circumference.

6) Exchange IC301(MPU & DSP).

7) Exchange Slider Motor.

84

No. Error Code Contents of fail Fail Analysis Block Diagram

SSB Byte21,22

1 2503,2504 RTZ Timeout(Sled Timeout). 1) Check Slider FPC Connection. No.21

2) Check solder of IC601 circumference .

(pin#2-3, 6, 8-10)

3) Exchange IC601.

4) Exchange Slider Motor.

2 2020,2021 Focus Fail. 1) Check Pickup FFC Connection. No.22

2) Exchange Pickup.

3) Check solder of IC601circumference.

4) Exchange IC601(Driver)

5) Check solder of IC101circumference.

(pin#1,2,3pin#87-90,

FE_Servo: R102, C405)

6) Exchange IC101(AFE).

3 2101,2102 Tracking Fail. 1) Check Pickup FFC Connection. No.22

2) Exchange Pickup.

3) Check solder of IC601circumference.

4) Exchange IC601(Driver).

5) Check solder of IC101circumference.

(pin#1,2,3 pin#87-90,

TE_Servo: R101, C101).

6) Exchange IC101(AFE).

4 2000~2010 Spindle Fail. 1) Check Spindle FFC Connection. No.18

2) Check solder of IC601circumference.

(pin#12-14)

3) Exchange IC601(Driver).

4) Exchange Spindle Motor.

5) Check solder of IC301circumference.

6) Exchange IC301(MPU & DSP).

3. Loading Sequence Error (Lead in Error)

IC701

1.5V

REG

IC701

2.8V

REG

12V

DRV IC601 R2S30202FP

VM1 #22 Motor power supply 1(Spindle)

VM2 #05 Motor power supply 2(Slide)

IC301 DSP (R8J32007)

#028 VCC Core Power]

#041 VDD [Core Power]

#072 VDD [Core Power]

#130 VDD [Core Power]

#146 VDD [Core Power]

CN101 P/U (LDD) Vso5V #29

IC101 AFE(R2S35002)

VCC1 #08 Power (5.0V)

VCC2 #78 Power (5.0V)

IC102 LM258-D VCC #08

(ON SEMIconductor) OP-amp

Audio Output

Q901 Tr(UMC5N)/Q902 Tr(UMG4N)

CN101 P/U

OEIC(Vcc) #44 & FM(Vcc) #11

CN101 P/U Vsa5(Vcc) #15

Light Scribe Encoder Module Vcc 5V

Front PWB Led Control Vcc 5V

IC601 DRV 5VCC(#32)/VM3(#26)

CN101 P/U LDD Vsl2.8(Vcc) #16

IC101 AFE (R2S35002)

VDD1 #69 Power

VDD2 #91 Power

VDD3 #11 Power

VDD4 #59 Power

VDD5 #22 Power

SRVREF #82 Power

IC301 DSP (R8J32007)

VCCA #186 3.3V

VCCA #166 3.3V

IC301 DSP (R8J32007)

Audio VCCA #99 3.3V

IC302 Flash Memory Fujitsu/Mcronics

IC301 DSP (R8J32007)

#58 VCCIO [DSP I/O]

#75 VCCIO [DSP I/O]

#88 VCCIO [DSP I/O]

#108 VCCA [Analog]

#133 VCCIO [DSP I/O]

#139 VCCA [Analog]

#148 VCCIO [DSP I/O]

#185 VCCA [Analog]

#200 VCCIO [DSP I/O]

#53 VCCR [SDRAM]

#52 VCCIO [DSP I/O]

#32 VCCIO [DSP I/O]

#26 VCCRQ [SDRAM I/O]

#08 VCCRQ [SDRAM I/O]

#07 VCCIO [DSP I/O]

#02 VCCR [SDRAM]

12V

Vso

S705 OPEN

5V

2.5(2.8)

3.3A

3.3A

3.3A-2

3.3D

S713 OPEN

5VR

L151

L150

L602

L601

R354

0

UMC5N

Vin=5.00 V

V0=3.30 V

Pc= W

Vin=5.00 V

V0=2.80 V

Torex Regurator

IC703 XCM403AA03SR

miniSMDC150F/24

(Raychem)

L305

L710

1.5D

1.5A

IC703

2.8V

REG

IC703

3.3V

REG

SW701

Poly SW

5V in

miniSMDC150F/24

(Raychem)

SW702

Poly SW

S707 OPEN

S706 OPEN

S704 OPEN

5VP

S714 OPEN

S708 OPEN

S709 OPEN

L304

L301

Tr

Q631

UMC5N

Tr

Q651

Vin=5.00 V

V0=2.80 V

Pc= W

Vin=2.80 V

V0=1.50 V

Torex Regurator

IC701 XCM403AA02SR

S715 OPEN

IC301 DSP (R8J32007)

#189 VDDAA [Analog Power]

#193 VDDAA [Analog Power]

#197 VDDAA [Analog Power]

IC301 DSP (R8J32007)

#159 VDDAA [Analog Power]

85 86

JR6 Power Supply System Diagram * Ver1.0 It created based on the PLT circuit diagram.

87

No Circuit/IC Signal Signal/Level mesurement-point (IC-pin or Device)

1 Power supply Line-12V 12V CN801-41

2 Line-5V 5V CN801-44

3 (IC701) reg-1.5V 1.5V IC701-2

4 reg-2.8V 2.8V IC703-5

5 (IC703) reg-3.3V 3.3V IC703-2

6 Flash-ROM VDD : 3.3V 3.3V 37

7 (IC302) CS Active-Low 26

8 XRD read-CK 28

9 DSP VDD : 1.5V 1.5V 41, 28, 72, 130, 146, 159, 189, 193, 197

10 (IC301) VCC(D) : 3.3V 3.3V 7, 32, 52, 58, 75, 88, 133, 148, 200, 199, 2, 53, 185,

139, 108, 8, 26

11 VCC(A) : 3.3V 3.3V 186, 166, 99

12 Clock-34MHz 33.8688MHz 106, 107

13 MRSTB (3.3V)High 202

14 AFE VCC : 5.0V 5.0V 8, 78

15 (IC101) VDD : 3.3V 3.3V 22, 11, 91, 59, 69, 82

16 OP-amp VCC : 5.0V 5.0V 8

(IC102)

17 7ch-DRV 5VCC : 5V 5V 32

18 (IC601) VM3 : 5V 5V 26

19 VM1, 2 : 12V 12V 5, 22

20 REF : 1.65V 1.65V 42

21 Pick-up VCC(FM) : 5.0V 5.0V 11

22 VCC(OEIC) : 5.0V 5.0V 44

23 VC(OEIC) : 2.1V 2.1V 43

24 VREF : 2.5V 2.5V 9

25 VSL25 : 2.8V 2.8V 16

26 VSA5 : 5.0V 5.0V 15

27 VSO : 5.0V 5.0V 29

* When there are twe or more power supply pins of LSI, it checks by one ramdom pin first.

PCB Poor Analysis - Check list

88

1. Self-Diagnostic Function by LED Blink.

• Basic operation: At JR6, MPU is included in DSP, MPU accesses each peripheral (inside, exterior) device,

and discover a defect by the ability of a read/write of data to be performed correctly. Since MPU operates by

the program with a built-in Flash-ROM, when abnormalities are in MPU, Flash-ROM, and these Data-Bus &

control signals, this self-diagnostic function cannot be used. In such a case, the case where LED does not

light up at all at the time of a power supply injection is almost the case.

• MPU: In DSP Flash-ROM (16Mb) is connected to the exterior Bus of MPU. Even if the MPU-Bus terminal of

Flash-ROM short-circuits, it becomes impossible for MPU to read the right program data from Flash-ROM,

and stops for this reason, turning on LED at all. On the other hand, the own poor device of DSP, and the

open state of IC-pin, when a defect does not influencing Bas of MPU, it can detect correctly and becomes

blink of LED according to those defects.

• DSP: DSP has ATAPI-IF, LDD-serial-IF, AFE-serial-IF, and an AFE control signal as Digital-IF. As Analog-

IF, it has the slice circuit of RF signal from AFE, PLL, the objects ADC and DAC for SERVO, and ADC for

ADIP detection. Among these, own poor Digital of DSP, and AFE-serial-IF can detect by this self-diagnostic

function.

• AFE: Poor detection of AFE is restricted to detection of a limitation-item. Since the greater part of the

function is analog signal processing, AFE serves as a register in AFE, and a check, which accepts it, serial

IF in the logical digital examination from MPU. In addition, serial-IF for AFE control is performed via DSP.

This is writing in the Write command and setting data, and is automatically transmitted to the predetermined

register of DSP. Conversely, when it leads the register information on AFE, the read command can be

written in the predetermined register of DSP, and the value of an AFE register can be read by reading the

read register of DSP after that. Therefore, serial [between the poor register of AFE, and AFE and DSP],

when there is LED blink with poor AFE — the defect of IF or the defect of the register for AFE of DSP is

considered.

•Refer to the contrast table of the number of times of blink of LED, and a poor part.

•The self-diagnostic function by this LED blink is carried out in the state of a set without a PCB independent

or loading Disc.

HW Self- Diagnostic function

89

2. LED does not blink at all at the time of a power supply injection. Eject-SW does not react.

(1) Is it normal to the exterior Bus (Data-Bus, Address-Bus, control signal system) of MPU?

Viewing — check: -- a short circuit, opening, etc.

• The device connected to the exterior Bus of MPU in DSP, and its signal list

=> It repairs, when abnormalities are discovered.

(2) Does the power supply circuit operate normally?

External input 12V, external input 5V, regulator 3.3V, regulator 2.8V, and regulator 1.5V

=>When the abnormalities are discovered, an external power supply, a power supply cable, and Regulator

IC are exchanged.

=> Since a problem is in a load side when not improving, even if it exchanges the above, and attached sheet

JR6 power-supply system figure is made reference, and poor portions, such as a short circuit of a power

supply part, are found out and fixed.

(3) Is the clock of MPU in DSP oscillated correctly?

Checked the ceramic oscillation element’s X301 both-ends and DSP(106)(107) 33.87MHz oscillating.

=> When 3.3V power supply is correctly supplied to DSP and the clock is not oscillating correctly, it is the

defect of MPU, or an oscillation element defect, and part exchange is performed in order of DSP and

X301.

(4) The defect of Flash-ROM

Although the clock of DSP is oscillating correctly and the power supply circuit is also outputting normal

voltage, when LED does not blink at all at the time of a power supply injection and Eject-SW does not react,

either, poor Flash-ROM is the most doubtful.

=> Flash-ROM (IC302) are exchanged.

Note: Before Flash-ROM exchange, the CS signals of the external device of MPU in DSP connection, an

Address signal, and a Data signal are observed on a waveform level, and since the but most amount of work

and the special knowledge which can raise the discovery accuracy of a poor part are necessities,

recommendation is impossible.

(5) Even if it performs the above-mentioned repair, when not improving, the disconnection and the short circuit

which cannot be discovered, can be considered in viewing of PCB. Moreover, partial breakage (although a

clock is oscillated, somewhere in insides do not operate.) of DSP can be considered.

=> When not improving above, the possibility that a PCB pattern is faulty is high, and judges repair to be

difficult.

Peripheral device Flash -ROM

[Bus/Signal] (IC302)

Address A1~A20

Data D0~D15

CS* CS0B

WCK WR

RCK RD

90

3. Motor, Abnormalities in Actuator System

The drive circuit of a motor & actuator consists of the three ICs IC601(R2S30202FP). The work of each IC is

as follows.

(1) IC601(R2S30202FP) : 7ch driver

Spindle motor driver: 180° audio drive Type, an analog input, a PWM drive, a Vm=12V.

Stepping motor driver X2: analog input, a PWM drive (differential), a Vm=12V

Loading motor driver: Input/Output PWM drive, Vm=5V.

Focus actuator driver: analog input / output (differential), a Vm=5V

Tracking actuator driver: analog input / output (differential), Vm=5V

Tilt actuator driver : analog input/output (differential), Vm=5V.

A motor & actuator and its correspondence pin

A control mode setup by the control terminal

Signal/CH SPDL-MT STEP-MT Load-MT Focus-ACT Track-ACT Tilt-ACT

Input (1)SPIN (2)SL1IN (41)LOIN (40)FOIN (39)TOIN (38)TLIN

(3)SL2IN

Reference (42)REF 1.65V

Output (12)U (6)SL2+ (27)LO+ (34)FO+ (31)TO+ (36)TL+

(13)V (8)SL2- (28)LO- (35)FO- (30)TO- (37)TL-

(14)W (9)SL1+

(10)SL1-

EN1(20) EN2(21) SPDL SLED Load Focus/Track/Tilt

Low Low off off off off

Low High off on on off

High Low on on off on

High High on on off on

91

12V

GND

5V

Device

configuration

jumper

MASTER

SLAVE

CSEL

Host IDE

Analog

audio

LED

3.3V

2.8V

1.5V

Flash-ROM

(2MByte)

MBM29LV160BE

or Equivalent

(FUJITSU)

Disc

Loading

motor

Slide

motor

Disc

motor

Unit

mechanism

Tray Detect

SW

Eject

SW

Limit

SW

Analog Front End

R2S35002

100pin-TQTF

(RENESAS)

3.3V/2.8V Reg.IC

XCM403AA03SR

RST

(TOREX)

2.8V/1.5V Reg.IC

XCM403AA02SR

RST

(TOREX)

OPU:HOP-7632TS

(HITACHI ME)

Interface

connector

DVD/CD DSP

(DVD/CD/Servo/ATAPI)

R8J32007FP

256pin LQFP

(RENESAS)

DVD-codec

CD-codec

LPP/ADIP decorder

Servo DSP

ATAPI-IF

Microprocessor

7ch-Driver

R2S30202FP

SPDL/SLED/Fo/Tr/Ti/LD

(RENESAS)

PU

BLOCK DIAGRAM