Lg C320 Users Manual C320_SVC ENG_101007
LG-C320 to the manual e3475751-5423-4144-b3a9-4de7607efb28
2015-01-26
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Service Manual Internal Use Only Service Manual LG-C320 Model : LG-C320 Date: October, 2010 / Issue 1.0 Table Of Contents 1. INTRODUCTION...................................................................5 4.12 Speaker/Speaker Phone path................................................73 1.1 Purpose................................................................................................ 5 4.13 Main microphone.......................................................................78 1.2 Regulatory Information................................................................ 5 4.14 Headset microphone.................................................................80 1.3 Abbreviations.................................................................................... 7 4.15 RF Component.............................................................................82 4.16 RF Path.............................................................................................83 2. PERFORMANCE....................................................................9 4.17 Trouble Shooting of GSM Part...............................................84 2.1 Product Name................................................................................... 9 4.18 Checking Bluetooth Block.......................................................91 2.2 Supporting Standard..................................................................... 9 4.19 Checking FM Radio Block........................................................96 2.3 Main Parts : GSM Solution............................................................ 9 2.4 HW Features.....................................................................................10 2.5 SW Features.....................................................................................12 2.6 HW SPEC. .........................................................................................14 5. DOWNLOAD.......................................................................99 6. BLOCK DIAGRAM............................................................ 112 2.7 C320 Figures....................................................................................15 7. CIRCUIT DIAGRAM......................................................... 123 3. TECHNICAL BRIEF..............................................................16 8. BGA Pin Map................................................................... 137 3.1 General Description......................................................................16 3.2 Power management.....................................................................28 9. PCB LAYOUT.................................................................... 143 3.3 SUB SYSTEM.....................................................................................32 10. RF CALIBRATION.......................................................... 149 3.4 General Description (RF Part)...................................................40 10.1 Usage of Tachyon for RF Calibration and Test.............. 149 3.5 GSM MODE.......................................................................................41 11. TEST ALONE.................................................................. 152 3.6 OFF-CHIP RF COMPONENTS.....................................................44 11.1 Phone Test Mode..................................................................... 152 3.7 OFF-CHIP COMPONENTS...........................................................46 12. EXPLODED VIEW & REPLACEMENT PART LIST ......... 157 4. TROUBLE SHOOTING........................................................50 11.1 EXPLODED VIEW....................................................................... 157 4.1 Power ON Troubleshooting.......................................................50 11.2 Replacement Parts.................................................................. 159 4.2 Charger Troubleshooting...........................................................52 11.3 Accessory.................................................................................... 175 4.3 USB Troubleshooting...................................................................54 4.4 USIM Detect Troubleshooting..................................................56 4.5 Camera Troubleshooting............................................................58 4.6 Main side view LED Troubleshooting....................................60 4.7 Slide Key side view LED Troubleshooting............................61 4.8 LCD Troubleshooting...................................................................63 4.9 Vibrator Troubleshooting...........................................................65 4.10 Receiver Path................................................................................67 4.11 Headset path................................................................................70 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes -- LGE Internal Use Only LGE Internal Use Only -- Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 1. INTRODUCTION Introduction 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use. B. Incidence of Harm If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done. C. Changes in Service A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service. D. Maintenance Limitations Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty. Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes -- LGE Internal Use Only 1. INTRODUCTION G E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F. Pictures The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different. G. Interference and Attenuation A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems. H. Electrostatic Sensitive Devices ATTENTION Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the information is ESD handling: sign. Following • Service personnel should ground themselves by using a wrist strap when exchange system boards. • When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. • Use a suitable, grounded soldering iron. • Keep sensitive parts in these protective packages until these are used. • When returning system boards or parts like EEPROM to the factory, use the protective package as described. LGE Internal Use Only -- Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 1. INTRODUCTION 1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: APC Automatic Power Control BB Baseband BER Bit Error Ratio CC-CV Constant Current – Constant Voltage DAC Digital to Analog Converter DCS Digital Communication System dBm dB relative to 1 milli watt DSP Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory ESD Electrostatic Discharge FPCB Flexible Printed Circuit Board GMSK Gaussian Minimum Shift Keying GPIB General Purpose Interface Bus GSM Global System for Mobile Communications IPUI International Portable User Identity IF Intermediate Frequency LCD Liquid Crystal Display LDO Low Drop Output LED Light Emitting Diode OPLL Offset Phase Locked Loop ͽͶ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑ΟΝΪ Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 6/140 -- ʹΠΡΪΣΚΘΙΥ͑ι ͣͨ͑͡͡ͽ͑ͶΝΖΔΥΣΠΟΚΔΤ͑͟ͺΟΔ͑͑͟ͲΝΝ͑ΣΚΘΙΥ͑ΣΖΤΖΣΧΖΕ͑͟ ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ LGE Internal Use Only 1. INTRODUCTION 1. INTRODUCTION PAM Power Amplifier Module PCB Printed Circuit Board PGA Programmable Gain Amplifier PLL Phase Locked Loop PSTN Public Switched Telephone Network RF Radio Frequency RLR Receiving Loudness Rating RMS Root Mean Square RTC Real Time Clock SAW Surface Acoustic Wave SIM Subscriber Identity Module SLR Sending Loudness Rating SRAM Static Random Access Memory PSRAM Pseudo SRAM STMR Side Tone Masking Rating TA Travel Adapter TDD Time Division Duplex TDMA Time Division Multiple Access UART Universal Asynchronous Receiver/Transmitter VCO Voltage Controlled Oscillator VCTCXO Voltage Control Temperature Compensated Crystal Oscillator WAP Wireless Application Protocol ͽͶ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑ΟΝΪ LGE Internal Use Only 7/140 -- ʹΠΡΪΣΚΘΙΥ͑ι ͣͨ͑͡͡ͽ͑ͶΝΖΔΥΣΠΟΚΔΤ͑͟ͺΟΔ͑͑͟ͲΝΝ͑ΣΚΘΙΥ͑ΣΖΤΖΣΧΖΕ͑͟ ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 2. PERFORMANCE 2. PERFORMANCE 2.1 Product Name C320 : EGSM/GSM850/DCS/PCS (GPRS Class 12 / EDGE Class 12) 2.2 Supporting Standard Item Supporting Standard Frequency Range Application Standard Feature EGSM/GSM850/DCS1800/PCS1900 with seamless handover Phase Phase 2+(include 2+(includeAMR) AMR) SIM Toolkit C-E 1, 2, 3, C-E Toolkit: Class 1, 2,: 3, Class EGSM TX : 880 – 915 MHz EGSM RX : 925 – 960 MHz GSM850 TX : 824 – 849 MHz GSM850 RX : 869 – 894 MHz DCS1800 TX : 1710 – 1785 MHz DCS1800 RX : 1805 – 1880 MHz PCS1900 TX : 1850 – 1910 MHz PCS1900 RX : 1930 – 1990 MHz WAP 2.0, JAVA 2.0 Comment 2.3 Main Parts : GSM Solution Item Digital Baseband Analog Baseband RF Chip Part Name ESC6270 : Qualcomm ESC6270 : Qualcomm ESC6270 : Qualcomm Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes -- Comment LGE Internal Use Only 2. PERFORMANCE 2.4 HW Features Item Form Factor Battery Size Weight Volume PCB Stand by time Charging time Talk time RX sensitivity TX output power GSM/ GPRS EDGE GPRS compatibility EDGE compatibility SIM card type Display Feature Slide type 1) Capacity Standard : Li-Ion, 900 mAh 2) Packing Type : Soft Pack Standard : 91 x 63 x 15.9 mm 115.6g TBD Stag type, 10 Layers , 0.8t Up to 300 hrs Up to 3 hrs 2G Up to 3.4hr EGSM : -105 dBm GSM850 : -105 dBm DCS 1800 : -105 dBm PCS 1900 : -105 dBm EGSM : 33dBm GSM850 : 33 dBm DCS 1800 : 30 dBm PCS 1900 : 30 dBm GSM 900 : 27 dBm GSM 850 : 27 dBm DCS 1800 : 26 dBm PCS 1900 : 26 dBm GPRS Class 12 EDGE Class 12 Plug-In SIM 3V /1.8V 2.4” TFT QVGA landscape Built-in Camera Status Indicator Keypad 2M FF SOC Camera Yes ANT System connector Ear Phone Jack PC synchronization Memory Main : Internal Fixed Type 5 Pin 3.5Phi, 4 Pole, Stereo Yes NAND Flash : 2Gbit SDRAM : 1Gbit FR, EFR, HR,AMR Built in Data & Fax support Built in Vibrator V2.1 + EDR SW Decoded 64Poly Speech coding Data & Fax Vibrator BlueTooth MIDI(for Buzzer Function) LGE Internal Use Only -410 - Comment With Battery @ Paging Period 5 @ @ Tx=Max(2G) Class4 (EGSM) Class4 (GSM850) Class1 (PCS) Class1 (DCS) E2 (GSM900) E2 (GSM850) E2 (PCS) E2 (DCS) Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 2. PERFORMANCE Music Player Video Player Camcorder Voice Recording Speaker Phone mode Support Travel Adapter CDROM Stereo Headset Data Cable T-Flash (External Memory) MP3/AAC/AAC+/WMA PEG4, H.263,H.264 30fps@QVGA WMV 15fps@QCIF MPEG4, 15fps@QVGA Yes Yes Yes No Yes Yes Yes Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 11 - LGE Internal Use Only 2. PERFORMANCE 2.5 SW Features Item RSSI Battery Charging Key Volume Audio Volume Time / Date Display Multi-Language Quick Access Mode PC Sync Speed Dial Profile CLIP / CLIR Phone Book Last Dial Number Feature English / Chinese Trad. / Chinese Simp. / Thai / Korean / Malay / Indonesian / Vietnamese Dialing / Contact / Menu / Message / Camera Yes Yes Yes Yes Name + 5 Numbers + 1 Memo + 2 e-mail + 3 Group Select + Picture + Ringtone + Anniversary day Yes Last Received Number Last Missed Number Yes Search by Number / Name Group Fixed Dial Number Service Dial Number Own Number Name and Number Yes Yes No Yes Voice Memo Call Reminder Network Selection Yes Yes Automatic Mute Call Divert Call Barring Call Charge (AoC) Call Duration SMS (EMS) Yes Yes Yes Yes Yes Yes (1000+SIM) SMS Over GPRS EMS Melody / Picture Send / Receive / Save MMS MPEG4 Send / Receive / Save Long Message Yes Yes (Receive only) Yes LGE Internal Use Only Comment 0 ~ 7 Levels 0 ~ 3 Levels 0 ~ 7 Level 1 ~ 20 Level Yes Yes Yes PC suite 4 Voice mail center -> 1 key not same with feature phone setting 1000 + SIM Total Call DB Max 100 LDN (SIM) N/A Total Call DB Max 100 LDN (SIM) N/A Total Call DB Max 100 LDN (SIM) N/A 30 Read only (add/edit/delete are not supported) Support voice recorder EMS : Release4 (Except Text align) MAX 1000 Characters SMS 7pages 6 - 12 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 2. PERFORMANCE Cell Broadcast Download Game Calendar Memo World Clock Unit Convert Stop Watch Wall Paper WAP Browser Download Melody / Wallpaper SIM Lock SIM Toolkit MMS EONS CPHS ENS Camera JAVA Yes Over the WAP Yes Yes Yes Yes Yes Yes Yes Over WAP 2.0 Yes Voice Dial IrDa Bluetooth No No Yes FM radio Yes GPRS EDGE Hold / Retrieve Conference Call DTMF Memo pad TTY AMR SyncML IM Email Yes Yes Yes Yes Yes Yes No Yes No Yes Yes 100 Obigo Over WAP Yes Yes Yes No Yes No Yes Yes Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes Operator Dependent R99 Obigo +LG MMS Client V4.2 2M FF CLDC V1.1 / MIDP V2.1 Download Over WAP BT 2.1+EDR HFP/HSP/A2DP&AVRCP /OPP/BPP/PBAP/SPP/ Class 12 Class 12 Max. 6 JAVA midlet (neustar) - 13 - LGE Internal Use Only 2. PERFORMANCE 2.6 HW SPEC. 1) GSM transceiver specification Item Phase Error Frequency Error EMC(Radiated Spurious Emission Disturbance) Transmitter Output power and Burst Timing Burst Timing Spectrum due to modulation out to less than 1800kHz offset Spectrum due to modulation out to larger than 1800kHz offset to the edge of the transmit band Spectrum due to switching transient Reference Sensitivity – TCH/FS Usable receiver input level range Intermodulation rejection – Speech channels Specification Rms : 5° Peak : 20 ° GSM : 0.1 ppm DCS/PCS : 0.1 ppm GSM/DCS : < -28dBm GSM : 5dBm – 33dBm ± 3dB DCS/PCS : 0dBm – 30dBm ± 3dB <3.69us 200kHz : -36dBm 600kHz : -51dBm/-56dBm GSM : 1800-3000kHz :< -63dBc(-46dBm) 3000kHz-6000kHz : <-65dBc(-46dBm) 6000kHz < : < -71dBc(-46dBm) DCS : 1800-3000kHz :< -65dBc(-51dBm) 6000kHz < : < -73dBc(-51dBm) 400kHz : -19dBm/-22dBm(5/0), -23dBm 600kHz : -21dBm/-24dBm(5/0), -26dBm Class II(RBER) : -105dBm(2.439%) 0.012(-15 - -40dBm) ± 800kHz, ± 1600kHz : -98dBm/-96dBm (2.439%) AM Suppression T GSM : -31dBm - DCS : -29dBm -98dBm/-96dBm (2.439%) Timing Advance ± 0.5T LGE Internal Use Only - 14 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 2. PERFORMANCE 2.7 C320 Figures Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 15 - LGE Internal Use Only 3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 2. Base Band Technical Description 3.1 General Description QSC6270 (3G disable)has all eight major functional blocks as like Figure 3.1 Figure 3.1 QSC6270(3G disable) Base band block LGE Internal Use Only - 16 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.1.1 Processor The QSC6270(3Gdisable) device integrates multiple processors on-chip: one ARM microprocessor and two DSP processors. Each processor is part of a functional subsystem: The micro subsystem includes the ARM926EJ-S microprocessor. The modem subsystem includes the QDSP4u8 digital signal processor (mDSP). The application subsystem includes the QDSP4u8 application digital signal processor(aDSP). Figure 3.1.1 Processors and bus architecture Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 17 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.1.2 Memory support (and LCD interface) 3.1.2 Memory support (and LCD interface) The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2. The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2. EBI1 supports high-speed synchronous dynamic devices. Its memory controller supports the new mobile EBI1 supports high-speed synchronous devices. Its memory controller supports the new mobile DDR DDR SDRAM memories with itsdynamic higher bandwidth and ability to run at high clock frequencies. This SDRAM interface memoriessupports with its higher bandwidth and ability to run atand highlow-latency clock frequencies. This interface the high-bandwidth, high-density, requirements of thesupports QSC’s advanced on-chip capabilities such as therequirements ARM9 processor, graphics, and video the high-bandwidth, high-density, and low-latency of thehighperformance QSC’s advanced on-chip capabilities such applications. as the ARM9 processor, highperformance graphics, and video applications. EBI2 interface intended to support memory devices suchsuch as NAND flash and EBI2isisthe theslower slowerspeed speed interface intended to support memory devices as NAND flashasynchronous and SRAM, peripheral devices suchperipheral as LCDs, and the UBM receiver for multicast or broadcast (QSC6270 only). asynchronous SRAM, devices such as LCDs, and the UBM receiver reception for multicast or In addition, EBI2 is reception required to(QSC6270 support a only). synchronous-burst AADisNOR flash to a NOR/DDR SDRAM memory broadcast In addition, EBI2 required toenable support a synchronous-burst configuration because simultaneous mode SDRAM (NOR, SDRAM) is not supported on the EBI1 bus. AAD NOR flashthe to enable a NOR/DDR memory configuration because the simultaneous mode (NOR, SDRAM) is not supported on the EBI1 bus. The ARM926EJ-S microprocessor is a cached processor and all its accesses to external memory use burst techniques of four or eight 32-bit words when the memoryand region is declared cacheable/bufferable. To take The ARM926EJ-S microprocessor is a cached processor all its accessestotobeexternal memory use burst advantage of this QSC higher performance feature, data from memories must satisfy the requirements for these techniques of four or eight 32-bit words when the memory region is declared to be burst accesses. cacheable/bufferable. To take advantage of this QSC higher performance feature, data from memories must satisfy the requirements for these burst accesses. EBI1 CLK CKE _CS _RAS SDRAM 512Mbit ) _CAS _WED DQM ADDR DQ External Memory ( MICRO SD) EBI2 DDR_M_CLK_N DDR_CKE[0] _ NAND _CS_ _N DDR_CS[0]_N _ DDR_RAS_N DDR_CAS_N DDR_WE_N _ _ DDR_D[0:15] ALE NAND _UB_N CLE NAN D_OE_N NAN D_WE_N NAND _BSY_N DDR_DQM[0:1] _ DDR_A[0:13] QSC6270 (3G disable) _CE NAND _LB_N NAND_WP _N NAN D_DATA [ 0: 15] _RE _WE NAND Flash (1Gbit) RY_BY _WP IO[ 1: 16] SIM_CLK MSD_D[0:3] _ _ SIM_RST_N MSD_CMD SIM_DATA MSD_CLK MUSIM_DM MUSIM_DP USIM (SIM PLUS) Figure 3.1.2.1 The memory control blocks of C320 LGE Internal Use Only - 18 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF LDO_LCD_2.8V LDO_LCD_1.8V LCD_RST EBI2_WE_N LCD_ADS LCD_CS_N EBI2_DATA[15:0] LCD_IF(2:1) QVGA Main LCD (2.4", 320x240) QSC6270 (3G disable) WLED_PWR Figure 3.1.2.2 The LCD interfaces of C320 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 19 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.1.3 Connectivity QSC6270 has connectivity features as below – USB-OTG; USB LS, FS, and HS (2.0 compliant) – I2C compatible for peripheral controls (1.8 V) – UART: up to 4 Mbps – Bluetooth 2.0 support via external SoC – WLAN via external device (SDIO) – NFC via external module (I2C) – FM radio via external module (I2C) – USIM, SIM, and USB-UICC support; 1.8 and 3 V – Keypad interface – SPI (master only) for peripheral support – Two secure digital controllers — WLAN and secure digital (SD) cards QSC6270 Figure 3.1.3 The connectivity of BL20 LGE Internal Use Only - 20 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.1.4 GPIOs QSC6270 (3G disable has 78 configurable I/O pins HALL_SENS_DET BT_RST_N BT_WAKEUP_HOST MUSIM_DP MUSIM_DM WLAN_CLK WLAN_SDIO[3] WLAN_SDIO[2] WLAN_SDIO[1] WLAN_SDIO[0] WLAN_CMD BT_PWR_ON LCD_IF_MODE[0] HS_JACK_DET WLAN_BT_REG_ON LCD_RST_N WLAN_RST_N BL_LCD_CAM_LDO_I2C_SDA BL_LCD_CAM_LDO_I2C_SCL MUIC_AUD_FM_I2C_SCL MUIC_AUD_FM_I2C_SDA MUIC_INT_N CHG_STS_N CHG_EN_N High : BT UART Low : UART Comm BL_LCD_CAM_LDO_EN UART_BT_SEL Figure 3.1.4 GPIOs of C320 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 21 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.1.5 Air interfaces The supported air-interface standards and features include: (See the RF technical description) GSM/GPRS/EDGE Specification Release 4 (3GPP R4) Enhanced GPS position location using gpsOne (with RGR6240 IC) Integrated gpsOne functionality, featuring enhancements by SnapTrack®, Inc., to enable a wide variety of location-based services and applications, including points of interest, personal navigation, and friend finder Simultaneous-GPS (processes GPS using dedicated circuitry while voice and/or data signals continue to be processed separately) 1024x searcher, direct facility termination (DFT) accelerator, off-chip RAM for measured data storage 3.1.6 Internal base band functions Several baseband circuits within the QSC6270(3G disable)device provide functions that are necessary only to make the device operate properly — these functions are not generally used directly by other handset circuits and functions. PLLs and clock generation Modes and resets Security Qfuse JTAG/ETM The clock block includes two PLLs, all phase-locked to the TCXO signal. These PLLs generate several different stable, low-jitter clock signals that are distributed throughout the QSC device and to external c omponents as needed. All the required WCDMA, GSM, GPS(only QSC6270), ARM, QDSP, and most peripheral clocks are derived in some way from the TCXO (or XO) source for their operating modes, plus the 32.768 kHz oscillator for their sleep modes Figure 3.1.6 Clock block basic architecture of QSC6270(3G disable) LGE Internal Use Only - 22 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.1.7 Multimedia Multimedia topics are as below in QSC6270, including: Camera interface and video front-end Mobile display processor Additional multimedia support: video, audio, graphics, and messaging 3.1.7.1 Camera interface and video front-end The camera interface (CAMIF) connects the QSC62x0 device directly to a camera sensor. Typical applications include Qcamera, Qcamcorder, and QvideophoneThe CAMIF delivers the raw 10-bit Bayer pattern data (preferred) to the video front-end (VFE) that performs the required image processing (RGB-triplet generation, color-space conversion, auto-white balance, auto exposure, gamma correction, etc.) and prepares the image for capture or transmission. The QSC device also supports a YUV 4:2:2 input from the sensor (8-bit, 2:1 MUX YUV or CCIR656 YUV). The video capabilities of the two QSC devices varies slightly, with the QSC6270 providing higher performance than the QSC6270 device — greater resolution, higher capture and streaming rates, etc. Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 23 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.1.7.2 Mobile display processor The MDP is a hardware accelerator primarily responsible for transferring an updated image from the QSC memory subsystem to the LCD module. The transferring of an updated image is an operation that is shared between software, video processing, and graphics processing, so a common block helps to reduce redundant circuitry. The MDP is designed with the assumption that the LCD panel has an embedded LCD controller and a frame buffer. The image transfer is then the copying of the image from the QSC memory system to the frame buffer within the LCD module. While the MDP is transferring an image to the LCD module, it can perform a final set of operations to the image. The set of operations that the MDP can perform has been chosen to maximize the efficiency of the QSC memory subsystems, typically removing two or more copy operations of the image to and from memory. The MDP reduces redundant circuitry and offloads the ARM and aDSP from memory-transfer operations and a certain set of graphics and video operations Figure 3.1.7.2.1 MDP-to-LCD interface functional block diagram LGE Internal Use Only - 24 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF VLDO_LCD_2V8 R102 R101 1 1 VLDO_LCD_1V8 CN102 1 2 LCD_VSYNC_OUT LCD_MAKER_ID LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3] 3 4 5 6 7 8 LCD_DATA[4] LCD_DATA[5] 9 LCD_DATA[6] LCD_DATA[7] LCD_DATA[8] LCD_DATA[9] LCD_DATA[10] LCD_DATA[11] LCD_DATA[12] LCD_DATA[13] LCD_DATA[14] LCD_DATA[15] 11 10 12 13 14 15 16 17 18 19 20 21 LCD_RD LCD_WR_N LCD_RS LCD_CS_N 22 23 24 LCD_RST_N 25 LCD_IF_MODE[1] LCD_IF_MODE[0] 26 27 28 29 30 C101 C102 0.1u 0.1u WLED5 WLED4 WLED3 WLED2 WLED1 WLED_VOUT 31 32 33 34 35 Figure 3.1.7.2.2 The LCD interface of C320 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 25 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.1.8 UART ̰ One universal asynchronous receiver transmitter (UART) port that supports low-speed, full-speed, and high-speed modes ̰ Serial data port communications that conform to the RS-232 interface protocol ̰ Used for data transport during Bluetooth operation (BTS402x™ SoC required) ̰ Other possible uses: – Test and debug – External keypad – Ringer – Load/upgrade system software ̰ Separate FIFOs for Rx and Tx ̰ Supporting circuits include: – Interrupt control – Clock source – Bit-rate generator (BRG) – Microprocessor interface ̰ Flow control is not available on UART2 (behind USIM) 3.1.9 USB ̰ Each USB link has a host and a peripheral; the host is responsible for initiating and controlling bus traffic ̰ The USB specification requires PCs to act as hosts, and other devices such as printers, keyboards, mice, etc., to act as peripherals ̰ USB 2.0 implementation defines three modes - Low-speed (LS): 1.5 Mbps - Full-speed (FS): 12 Mbps - High-speed (HS): 480 Mbps ̰ The QSC62x0 is compliant with the USB 2.0 specification - All three modes are supported when acting as a host - FS and HS are supported when acting as a peripheral ̰ The QSC62x0 has two USB controllers - Primary USB controller - Secondary USB controller ̰ The primary USB controller is supplemented by an integrated physical layer (PHY) 3.1.10 HKADC The HKADC includes an analog multiplexer that selects an input for the sample and hold circuit. One of three inputs can be selected: HKAIN1, pin R22 – an external connection that is available as a general-purpose input, though it is often used to monitor the power amplifier(s) temperature. An on-chip connection to the power management circuit’s analog multiplexer output. This allows monitoring of: -. Key power supply nodes such as VBAT, VCHG, etc. -. Multipurpose pins (when configured as analog inputs) -. A few on-chip parameters such as the die temperature or VREF LGE Internal Use Only - 26 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF QSC6270HKADC Block diagram Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 27 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.2 Power management 3.2.1 Input power management Valid external supply attachment and removal detection Unregulated (closed-loop) external charger supply as input power source Integrated PFET charging pass transistor; eliminated sense resistor Support for lithium-ion and lithium-ion polymer main batteries; nickel-based batteries are not supported Trickle, constant current, constant voltage, and pulse charging of the main battery Autonomous charging option – driven by an on-chip state machine without software intervention Software-controlled charging option – backwards-compatible with previous QSC and PM products Coin-cell battery (including charging) Battery-voltage detectors with programmable thresholds VDD collapse protection Charger-current regulation and real-time monitoring for overcurrent protection Charger-transistor protection by thermal control Control drivers for the internal charging PFET and external battery PFET Voltage, current, and thermal control loops Automated recovery from sudden momentary power loss (requires external32.768 kHz crystal) Figure 3.2.1 Input circuits schematic diagram LGE Internal Use Only - 28 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.2.2 Output voltage regulation The QSC62x0 device includes all the regulated voltages needed for most low-cost wireless handset applications (and many other applications). Independent regulated power sources are required for various electronic functions to avoid signal corruption between diverse circuits, support power-management sequencing, and meet different voltage-level requirements. Sixteen voltage regulators are provided — all programmable, all derived from a common bandgap reference circuit. Three major types of voltage regulator circuits are on-chip: Three positive voltage switched-mode power supply (SMPS) circuits - One boost converter (rated for 600 mA) - Three buck converters (rated for 500 mA each) Thirteen positive voltage linear regulators - Four rated for 300 mA - Six rated for 150 mA - Three rated for 50 mA One negative voltage charge pump rated for 200 mA, referred to as a negative charge pump(NCP) Each regulator has two logic-OR input bits; a logic high at either input enables that regulator: A master bit that enables all regulators according to their default condition A dedicated bit that enables only that regulator The master enable reduces the number of write cycles needed when switching between the phone’s sleep and active modes. Additional comments that apply to regulator functions: If a regulator’s default condition is on, that regulator will power on automatically at QSC startup. The MSMP regulator must be on to allow internal communications between major functional blocks. Each regulator and SMPS can provide more than its rated output current, though some performance characteristics might be degraded. All regulated output voltages are programmable. All regulators can be set to a low-power mode except the VREG_USB_3P3 and VREG_NCP circuits Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 29 - LGE Internal Use Only 3. TECHNICAL BRIEF Table 3.2.2 Voltage regulator summary 1. All regulator names are based on their intended use, though some may be used to power alternate functions. For example, the USIM regulator is intended to power an external SIM card but may be used to power other circuits (or not used at all). 2. Each current listed in this table is its regulator's rated value – the current at which the regulator meets all its performance specifications. Higher currents are allowed, but higher input voltages may be required and some performance characteristics may become degraded. See the appropriate regulator sections for details. 3. VREG_MSMP powers key internal circuits and should be kept on at its default voltage setting. 4. All regulators have default output voltage settings, even if they default to an off condition. LGE Internal Use Only - 30 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.2.3 Charging control C320 use single Charger. - Single charger has five mode like “ OFF / TRICKLE / ISET / USB500 / FACTORY mode”. - Single Charger is working as ISET mode in case of CC(Constant Current), CV(Constant Voltage) mode, as USB 500mode in case of USB Charging. - FACTORY mode is working only for Factory use. p k Guv{G j ylT k GG j CHG_STS_N DNI VBUS_LDO_4V9 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes MUIC_IO_M MUIC_IO_P MUIC_ACC_ID - 31 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.3 SUB SYSTEM 3.3.1 KEY PAD C320 have a key-coder IC that supports eight sense lines, or columns, and eight keypad rows. The device scans and encodes 64 matrix – addressed keys on keypads . Key press and release events are stored in a FIFO buffer with 16 event lengths for uploading to a host processor. The event data stored will indicate the sequence of events and which keys set pressed or released. VREG_MSME_1V8 25pF 25pF 25pF LGE Internal Use Only - 32 - KEY_COL6 KEY_COL7 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.3.2 External memory interface The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2. EBI1 supports high-speed synchronous dynamic devices. Its memory controller supports the new mobile DDR SDRAM memories with its higher bandwidth and ability to run at high clock frequencies. This interface supports the high-bandwidth, high-density, and low-latency requirements of the QSC’s advanced on-chip capabilities such as the ARM9 processor, highperformance graphics, and video applications. EBI2 is the slower speed interface intended to support memory devices such as NAND flash and asynchronous SRAM, peripheral devices such as LCDs, and the UBM receiver for multicast or broadcast reception (QSC6270 only). In addition, EBI2 is required to support a synchronous-burst AAD NOR flash to enable a NOR/DDR SDRAM memory configuration because the simultaneous mode (NOR, SDRAM) is not supported on the EBI1 bus. EBI1 Features EBI1 is a high-performance external memory interface for the QSC62x0 digital block that supports DDR SDRAM devices Specifically, the following memory devices are supported on EBI1: ̰ SDRAM -16-bit low-power DDR SDRAM -Minimum size per chip-select: 16 MB (128 Mbit) -Maximum size per chip-select: 128 MB (1 Gbit, 1 k columns only) Characteristics of the EBI1 clock are listed below: -Maximum clock rate is 92 MHz, defined by the AMSS software. -The EBI1 memory controller clock is synchronous to the bus clock (HCLK). EBI2 Features EBI2 is used to interface with slower memory and peripheral devices (NAND flash, burst NOR, LCDs, etc.). The following EBI2 devices are supported: ̰ NAND flash -8/16 bit, single-level cell (SLC)/multi-level cell (MLC) 512/2048-byte page devices -DMA support -Boot-up capability from the above devices ̰ Burst NOR flash -16-bit multiplexed AAD burst NOR devices ̰ 8/16/18-bit (write only) LCD devices (both Motorola and Intel style) Characteristics of the EBI2 clock are listed below: ̰ The maximum clock rate is 46 MHz, defined by the AMSS software. ̰ The EBI2 memory controller operates at HCLK/2. ̰ Broadcasting and multicasting (QSC6270 only, with MBP1600 IC) are based on: -Wideband MediaFLO™, DBV-H, and ISDB-T Asynchronous/burst controller (EBI1 and EBI2) The external memory controller (xmem_ctlr) forms the asynchronous/burst controller for both EBI1 and EBI2 in the QSC62x0 device. The controller is generic in terms of its software programmable options and can be customized when used for EBI1 and EBI2. This block has been enhanced in the QSC62x0 device to support 32-bit burst memories and byte masking during write operations. . Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 33 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.3.3 Camera Interface ( 2M CAMERA ) 3.3.3.1 2M CAMERA C320 Installed a 2M Pixel Camera. Below picture shows the camera board to board connector and camera I/F signal. LGE Internal Use Only - 34 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 8 3 7 4 6 5 9 2 8 3 7 4 6 5 9 2 10 1 9 2 8 3 7 4 6 10 1 5 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 10 1 - 35 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.3.4 LCD Module (LQ024Q3UX01 : SHARP) The DM24-DSM04 model is a Color TFT LCD supplied by LG Innotek. This main Module has a 2.4 inch diagonally measured active display area with 320(RGB) X 240 resolution. Each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes. Main LCD color is determined with 262k colors signal for each pixel. The DM24-DSM04 has been designed to apply the interface method that enables low power, high speed, and high contrast. The DM24-DSM04 is intended to support applications where thin thickness and low power are critical factors and graphic displays are important GENERAL DESCRIPTION LGE Internal Use Only - 36 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF PIN DESCRIPTION Input Signal and Power : Pin Description ( Input Pin : 35 ) Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 37 - LGE Internal Use Only 3. TECHNICAL BRIEF LGE Internal Use Only - 38 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.3.5 Audio Signal Processing & Interface Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (QSC6270). This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset. The downlink path amplifies the signal from DBB chip (QSC6270) and outputs it to receiver (or speaker). The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. The outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_OP, LINE_ON) are differential outputs. Earphone2 (HPH_L, HPH_R) is a single-ended output stage designed to drive a headset speaker. The microphone interface consists of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier. Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 39 - LGE Internal Use Only 3. TECHNICAL BRIEF G 3.4 GENERAL DESCRIPTION (RF Part) The RF platform of C320 supports four communication bands (GSM850 / GSM900 / GSM1800 / GSM1900). The all the RF blocks can be divided into two main parts, which are a GSM, and an antenna switch Mode. The simplified block diagram is shown in Figure 3.4 3.4 Block diagram of RF part [Figure 1.1] LGE Internal Use Only - 40 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF G 3.5 GSM MODE The EDGE/GPRS/GSM transceiver use a digital interface that is shared between receive and transmit data. The receive interface is based on I and Q data and the transmitter interface is based on envelop and frequency data. The quad band EDGE/GSM/GPRS transceiver has the following general features: Power class GMSK low bands: Class 4 (33 dBm) GMSK high bands: Class 1 (30 dBm) 8PSK low bands: Class E2 (27 dBm) 8PSK high bands: Class E2 (26 dBm) Multi slot class 12 (4+4=5) Dual Transfer Mode (DTM) class 9 (3+2=5) Zero-IF receiver -Polar modulation transmitter 3.5.1 GSM RECEIVER The RF receiver designs are leveraged from previous-generation RTR devices, including the latest innovations. All ESC receiver paths are discussed in this section. The ZIF receive signal paths support multiband, multimode applications: Quad-band GSM: Low-band GSM 850 (869 to 894 MHz) and GSM 900 (925 to 960 MHz) High-band DCS1800 (1805 to 1880 MHz) and PCS1900 (1930 to 1990 MHz) The on-chip receive signal paths are functionally identical for each mode (GSM or EDGE) and each band type (low or high). The external circuitry includes the antenna switch module and a filter function. All RF Rx inputs use a differential configuration to maximize common-mode rejection, Tx isolation, out-ofband suppression, and second-order intermodulation performance. The first of two quadrature downconverters accepts inputs from two LNAs (only one is active at a time). An example application could support the following bands using these two LNAs: GSM 1900 GSM 850 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 41 - LGE Internal Use Only 3. TECHNICAL BRIEF G The second downconverter accepts inputs from another two LNAs (again, just one is active at time) and is dedicated to GSM 900 and GSM 1800 operation. The two downconverter outputs drive analog baseband filters and buffer circuits that are programmed to support the active operating mode’s waveforms (GSM or EDGE). The analog baseband signals are then digitized by analog-to-digital converters (ADCs) whose outputs are routed to the digital baseband circuits for further processing. Numerous secondary Rx functions are also integrated: Rx frequency synthesizers (each having their own PLL and VCO circuits), LO generation and distribution circuits, reference and clock circuits for the ADCs, and various interface, control, and status circuits. Power reduction features (such as selective circuit powerdown, gain control, and bias control) extend handset standby time. Like the Tx LO, all Rx LO circuits are completely integrated. All received LO signals are generated by the onchip Rx VCOs under control of their PLLs. [Figure 3.5.1] QSC GSM receiver signal paths functional diagram LGE Internal Use Only - 42 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF G 3.5.2 GSM TRANSMITTER The RF transmitters are leveraged from previous-generation RTR™ devices, including the latest innovations. The ESC transmitter paths and Tx power-detector input are discussed in this section. It provides the zero-IF (ZIF) transmit signal paths for multiband, multimode applications: Quad-band GSM: Low-band GSM 850 (869 to 894 MHz) and GSM 900 (925 to 960 MHz) High-band DCS1800 (1805 to 1880 MHz) and PCS1900 (1930 to 1990 MHz) The transmit signal paths include a shared set of baseband amplifiers, a dedicated quadrature upconversion for each band-type (low and high), gain control RF amplification, and multiple output driver amplifiers for each band-type. Two GSM output drivers support one low-band and one high-band type (but each GSM band-type is dual-band). The GSM transmitters in polar PA configuration are also supported by a PA envelope control path, plus the ability to route LO signals to the transmit chains for test and calibration purposes. In linear PA configuration, phase and envelope paths are combined inside the ESC and amplified using a multistage linear PA. Numerous secondary Tx functions are also integrated: a reference for the transmit DACs, the Tx phase-locked loop (PLL), the Tx OSC circuit, the Tx LO generation and distribution circuits, an RMS Tx power detector, and various interface, control, and status circuits. The RF transmitter interfaces internally with the baseband circuits for its analog baseband input and status and control signaling. Power reduction features controlled by baseband circuits (such as selective circuit powerdown, gain control, and transmit puncturing) extend handset talk time. The driver amplifier outputs are routed externally to the final stages of the transmit chains, culminating with the antenna switch whose output drives the antenna. Sophisticated Tx LO circuits implement the frequency plan and are completely integrated on-chip. All Tx LO signals are generated by the on-chip Tx OSC under the control of its PLL. [Figure 3.5.2] QSC GSM transmitter signal paths functional diagram Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 43 - LGE Internal Use Only 3. TECHNICAL BRIEF G 3.6 OFF-CHIP RF COMPONENTS 3.6.1 D5008 (FL101: FEM) Low-loss SAW frontend module for mobile telephone system Covering GSM850, GSM900, GSM1800 and GSM1900 bands Integration of Tx low pass filters, switch, de-coder and diplexing network between GSM Filters Integration of GSM850, GSM900, GSM1800 and GSM1900 Rx SAWs Balanced outputs of all Rx ports Integration of ESD protection at Ant port to 8kV acc. IEC-61000-4-2 (contact discharge) [Figure 3.6.1] Block diagram of FEM [Table 3.6.1] Control table of FEM LGE Internal Use Only - 44 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF G 3.6.2 GSM850/EGSM/DCS/PCS Dual band Transmit Power Amplifier (U101: SKY77336) The dual band PA is operating to transmit for low band (GSM-850, GSM-900) and high band (GSM-1800, GSM1900). Operating mode is selected and controlled by the ESC6270 (GSM_PA_BAND). [Figure 3.6.2] Block diagram of GSM PAM Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 45 - LGE Internal Use Only 3. TECHNICAL BRIEF G 3.7 OFF-CHIP COMPONENTS 3.7.1 Bluetooth (BCM2070) Bluetooth block of LG-C320 consists of a BCM2070 chip-set, an external crystal oscillator(26MHz), and a Bluetooth chip antenna (2.4GHz). QSC6270_3G disable, which is main HW solution of LG-C320 Model, doesn’t include BT baseband core. Instead, Bluetooth chipset, BCM2070, contains stand-alone baseband processor (V2.1+EDR) as well as BT RF block. An external crystal oscillator (26MHz) is used to provide reference frequency to BCM2070. Figure 3.7 shows the Bluetooth system architecture in the LG-C320. [Figure 3.7] Bluetooth system architecture LGE Internal Use Only - 46 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF G [Table 3.7] Bluetooth Connection(GPIO) with QSC6270 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 47 - LGE Internal Use Only 3. TECHNICAL BRIEF G 3.7.2 FM Receiver (TEA5991) The TEA5991 is a single chip FM stereo radio with RDS and RBDS decoder. The radio can be connected to a headphone antenna and can tune from 70-108 MHz to cover the European, US, Chinese and Japanese FM band. The radio delivers stereo audio output to an external amplifier. The radio can be controlled with a high level command based interface through a I2C or SPI-bus. [Figure3.7.2] shows the FM Radio system architecture in the LGC320. Ear-Jack HP_EAR_R FM_ANT FM TEA5991 HP_EAR_L FM_R FM_L FM_I2C_SDA FM_I2C_SDL G HP_R AUDIO ESC6270 HP_L SUBSYSTEM [Figure3.7.2] FM Radio system architecture [Figure3.7.2.1] Pin Descriptions LGE Internal Use Only - 48 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF G SYMBOL HVQFN WLCSP DESCRIPTION AGND 1 RFI 2 E1 RF input RFGND 3 D1 RF ground NC 4 - BUSSEL2 5 A1 Bus Selection pin 2 BUSSEL1 6 C1 Bus Selection pin 1 RST 7 A2 Reset, used for operating mode change SEN 8 B1 Chip Select for SPI bus SCL 9 A3 Serial Bus Clock SDA 10 A4 Serial Bus Data FREF 11 VREFDIG 12 VDD 13 DGND 14 AUDOR 15 D6 Audio output signal right AUDOL 16 E6 Audio output signal left NC 17 - Not connected VCC 18 F6 Analog supply voltage GPIO2 19 F5 General Purpose I/O 2; Dataout for 4-wire SPI-bus F1 Analog ground not connected A5 Reference frequency (32.768 kHz) A6 Reference voltage for digital I/Os B6 Digital supply voltage C6 Digital ground [Table 3.7.2] pin description Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 49 - LGE Internal Use Only 4. TROUBLE SHOOTING Power ON Troubleshooting 4. TROUBLE SHOOTING 5. Base band part 4.1 Power ON Troubleshooting Power On sequence is : PWR key press PM_ON_SW_N Î QSC6270 KPDPWR_N pin(AA2) go to low(Main BOARD R205) Î QSC6270 Power Up Î VREG_MSMC_1.2V(C261), VREG_MSME_1.8V(C209), VREG_MSMP_2.6V(C414), VREG_RFRX2_1.3V(C232), VREG_TCXO_2.85V(C275) power up and system reset assert to QSC6270 Î Phone booting and PS_HOLD assert to QSC6270 START Battery voltage. higher than 3.20V? No Change or charging the Battery Yes Replaced with normal LCD module, and then Booting is OK? Yes Go to LCD Troubleshooting No TP1_R205 go to low When Power key press? No Check the Key Dome Yes TP2_VREG_MSMC_1.2V(L201) TP3_VREG_RF1_2.3V(L202) TP4_VREG_RF1_1.4V(L203) power up? No Change the main board Yes Change the main board LGE Internal Use Only - 50 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING TP1 PM_ONSW_N TP2 Power ON Troubleshooting TP3 TP4 VREG_RF2_1V4|VREG_RF2 TP1 TP2 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes TP4 TP3 - 51 - LGE Internal Use Only 4. TROUBLE SHOOTING Charger Troubleshooting 4.2 Charger Troubleshooting ൯ Charging Procedure - Connect TA or USB Cable - Control the charging current by QSC6270(disable 3G) - Charging current flows into the battery ත Troubleshooting Setup ත Check Point ත Troubleshooting Procedure - Connection of TA or USB Cable - Charging current path - Battery - Connect TA and battery to the phone - Check the charger (TA or USB Cable) connector - Check the charging current Path - Check the battery START Check the pin and battery Connect terminals of I/O connector Connection OK? No Change I/O connector Yes Is the TA voltage TP1_5.1V(FL401)? No Change TA Yes Is it charging properly? Yes END No Change the main board [ Charger Troubleshooting Flow ] LGE Internal Use Only - 52 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING Charger Troubleshooting TP1 FL401 TP1 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 53 - LGE Internal Use Only 4. TROUBLE SHOOTING USB Troubleshooting 4.3 USB Troubleshooting USB Initial sequence is : Isert USB Cable Î USB_VBUS +5V Check Î IC400 triggered USB IF work START No Cable is insert physically? Change CN400 Yes Is TP1_FL401(VBUS) voltage 5.1V? No Change CN401 Yes TP2_C409(LDO4.9V) OUTPUT is about 5V? No Change the U401 Yes Is IC401 OUTPUT is TP3_C265(USB_ DM,USB_DP) signal OK? No Change the IC401 Yes Change the main board [ USB Troubleshooting Flow ] LGE Internal Use Only - 54 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING USB Troubleshooting TP3 TP1 TP1 FL401 TP2 VBUS_LDO_4V9 TP2 TP3 TP3 kt kw Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 55 - LGE Internal Use Only 4. TROUBLE SHOOTING USIM Troubleshooting 4.4 USIM Detect Troubleshooting USIM Initial sequence is : VREG_USIM_2.85V go to 1.8V or 3.0V Æ USIM_CLK,USIM_RST,USIM_DATA triggered Æ USIM IF work START Re-insert the SIM card Work well ? Yes END No TP1(Vreg_USIM) is 1.8V or 3.0V ? TP2(USIM_CLK) & TP3(RST) is run ? No Check J301 Yes Work well ? Change the SIM card Yes No Work well ? No Change the Main board Yes END LGE Internal Use Only - 56 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING USIM Troubleshooting TP1 TP2 MUSIM_DM TP3 MUSIM_DP TP1 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes TP2 - 57 - TP3 LGE Internal Use Only 4. TROUBLE SHOOTING Camera Troubleshooting 4.5 Camera Troubleshooting Camera control signals are generated by QSC6270. START Check the camera connection to the socket and reconnect the camera Camera is OK? Yes END No CAM_AVDD_2.8V CAM_VDD_1.8V (TP1, TP2) No Chang the Main board Yes Check the CAM_MCLK TP4 No Check the CAM_PCLK TP3 No Camera is OK Yes Change the Main board Change the Camera Module END No Change the Main board LGE Internal Use Only - 58 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING Camera Troubleshooting Camera Troubleshooting TP4 TP4 TP3 TP3 TP1 TP2 TP1 TP2 TP3 TP1 TP2 TP3 TP4 TP4 CAM_70MHz PCLK CAM_24MHz MCLK CAM_70MHz PCLK CAM_24MHz MCLK Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 59 - LGE Internal Use Only 4. TROUBLE SHOOTING Main side view LED Troubleshooting 4.6 Main side view LED Troubleshooting MAIN Key Pad LED is on as below : Key pressing Æ LED_CON go down low (below 0.8v) Æ MAIN Key Backlight LED On START Key press +VPWR is above 3.2V? No Check battery Yes When the LCD is on, TP1 is below 0.8v No Change QSC6270 Yes LED ON ? No Change LED Yes END LGE Internal Use Only - 60 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING Slide Key side view LED Troubleshooting 4.7 Slide Key side view LED Troubleshooting Sub Key Pad Slide is on as below : Key pressing Æ LED_CON go down low (below 0.8v) Æ Sub Key Backlight LED On START Key press +VPWR is above 3.2V? No Check battery Yes When the LCD is on, TP2 is below 0.8v? No Change the FPCB or KEY PCB Yes LED ON ? No Change the MAIN PCB Yes END Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 61 - LGE Internal Use Only 4. TROUBLE SHOOTING Slide Key side view Troubleshooting MAIN TP1 LED TP1 SLIDE LED SUB KEY B/L WLED_VOUT LD103 TP2 LD104 LD105 LD106 LD107 LD108 R107 R108 R105 R106 R109 R110 10 10 10 10 10 10 SLIDE_KEY_LED VA101 TP2 LGE Internal Use Only - 62 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING LCD Troubleshooting 4.8 LCD Troubleshooting LCD control signals are generated by QSC6270. The signal path is : QSC6270 Æ CN102 Æ LCD Module START Press END key Key LED is on? No Move to KEY LED Troubleshooting Yes Disconnect and reconnect The LCD connector (Slide PCB CN102,CN101) LCD display OK? Yes END No Change the FPCB LCD display OK? Yes END No Change SUB PCB LCD display OK? Yes END No Change the Main Board Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 63 - LGE Internal Use Only 4. TROUBLE SHOOTING LCD Troubleshooting [Slide Side view placement] LGE Internal Use Only - 64 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING Vibrator Troubleshooting 4.9 Vibrator Troubleshooting Vibrator is operate when DC motor driver is enabled. START Operate the Vibrator CN803(Main B/d) and CN101(motor_FPCB) are well connected ? No Reconnect Board to FPCB connector Yes Wired Vibrator to FPCB ”VIB”? No Solder the wire on to FPCB Yes LINMOT_P above 3.0V or LINMOT_M below 1V? Yes Change vibrator or Change the Main PCB No Change vibrator or Change the Main PCB No Change the FPCB working? Yes END Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 65 - LGE Internal Use Only 4. TROUBLE SHOOTING F_SUB_FPCB to Main PCB Connector(CN101) Motor Pad(CN101) 22 1 Main to F_SUB_FPCB Connector(CN803) LGE Internal Use Only - 66 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.10 Receiver Path QSC6270(3G disable) EAROP(EARON) Æ TP1_CN801(Main to Slide FPCB Connector) 2,3 PIN Æ TP2_CN103(=Slide FPCB to Main PCB Connector) 2, 3 PIN Æ TP3_FB101, FB102(of F_SLIDE_ FPCB) TP4_CN101(= Receiver Pad of F_SLIDE_ FPCB ) START Connect the phone to network Equipment and setup call Setup 1KHz tone out Can you hear the tone? Yes END No The sine wave appears at Receiver Pad(TP4) Yes Re-Solder Receiver Change the Receiver Yes Change F_SLIDE_FPCB Yes Re-Solder FB101,FB102 Change F_SLIDE_FPCB Yes Re-Connect CN103 Change F_SLIDE_FPCB No The sine wave appears at TP3_FB101, FB102? No The sine wave appears at TP2_CN103 2,3 PIN? No The sine wave appears at TP1_CN801 2,3 PIN? No Change the QSC6270 Change the Main PCB Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 67 - LGE Internal Use Only 4. TROUBLE SHOOTING LCD_DATA[7] LCD_DATA[6] LCD_DATA[5] LCD_DATA[4] 15pF LCD_MAKER_ID LCD_RST_N LCD_VSYNC_OUT RCV_P RCV_N 15pF TP1 VCOIN 1 TP1 27 Main to Slide FPCB Connector(CN801) 15pF LGE Internal Use Only - 68 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING TP4_Receiver PAD=CN101 TP3_FB102 TP3_FB101 TP3 RCV_P RCV_N 100n 1 FB102 100n 2 TP4 VA102 VA101 39pF 39pF C102 TP3 C101 TP4 CN101 FB101 Can be Changed to TVS or ECLAMP CN103 1 54 2 RCV_N 3 RCV_P 53 TP2 LCD_MAKER_ID 52 LCD_DATA[15] 4 51 5 50 LCD_DATA[14] TP2 Slide FPCB to Main PCB Connector(CN103) Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 69 - 1 27 LGE Internal Use Only 4. TROUBLE SHOOTING 4.11 Headset path QSC6270(3G disable) HPH_OUT_L_P/N Æ TP1_C506,C507 Æ IC501(Audio Sub System) Æ TP2_R504,R505 Æ TP3_FB504, FB505 Æ J501(=3.5pi Ear-jack) START Connect the phone to network equipment and setup call. Setup 1KHz tone out and insert headset. Can you hear the tone? Yes END No Sine wave appears at TP3_FB504, FB505 Yes Re-solder or Change J501 Change the Main PCB Yes Re-solder the FB504, FB505 Change the Main PCB Yes Change the IC501 No Sine wave appears at TP2_R504, R505? No Sine wave appears at TP1_C506, C507? No Change the Main board LGE Internal Use Only - 70 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING TP3_FB505 TP3_FB504 TP2_R505 HS_MIC_P|Hook_ADC HS_OUT_L HS_OUT_R FM_ANT TP2_R504 TP2 TP3 TP2 TP3 NC HS_GND Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 71 - LGE Internal Use Only 4. TROUBLE SHOOTING HS_R HS_L SPK_N SPK_P TP1 SPK_OUT_P SPK_OUT_N TP1 HS_OUT_L HS_OUT_R GND MUIC_AUD_FM_I2C_SCL MUIC_AUD_FM_I2C_SDA WM9093 is possible to 1.8 & 2.6 IO When HPVDD is 1.8V TP1_C507 TP1_C506 LGE Internal Use Only Audio Sub system IC501 - 72 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.12 Speaker/Speaker Phone path QSC6270 LINE_OUT_L_P/LINE_OUT_R_N ÆTP1_C508, C509Æ Audio Sub System(IC501) Æ TP2_FB507, FB508 Æ TP3_CN803 1/2, 3/4 PIN(=Main to F_SUB_FPCB Connector) Æ TP4_CN101 1,2 PIN(=F_SUB_FPCB to Main PCB Connector) Æ TP5_CN102(= Speaker Pad of F_SUB_FPCB) START Connect the phone to network Equipment and setup call Setup 1KHz tone out Can you hear the tone? Yes END No Sine wave appears at TP5_Speaker Pad Yes Re-Solder Speaker Pad Change the Speaker Yes Change the F_SUB FPCB Yes Re-Connect the CN101 Change the F_SUB FPCB Yes Change the Main PCB Yes Change the IC501 No Sine wave appears at TP4_CN101 1,2 PIN No Sine wave appears at TP3_CN803 1/2, 3/4 PIN No Sine wave appears at TP2_FB507, FB508 No Sine wave appears at TP1_C508, C509 No Change the QSC6270 Change the Main board Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 73 - LGE Internal Use Only 4. TROUBLE SHOOTING HS_R HS_L SPK_N SPK_P TP2 TP2 TP1 SPK_OUT_P SPK_OUT_N HS_OUT_L HS_OUT_R TP1 GND MUIC_AUD_FM_I2C_SCL MUIC_AUD_FM_I2C_SDA WM9093 is possible to 1.8 & 2.6 IO When HPVDD is 1.8V TP1_C509 TP1_C508 LGE Internal Use Only Audio Sub System(IC501) TP2_FB507 - 74 - TP2_FB508 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING TP3 TP3 TP3 1 10 Main to F_SUB_FPCB Connector(CN803) Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 75 - LGE Internal Use Only 4. TROUBLE SHOOTING CN101 G1 G2 1 SPK_OUT_P SPK_OUT_N MOTOR_POWER_N VBAT 20 2 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 G3 MSD_D[2] MSD_D[3] MSD_CMD 19 TP4 3 VREG_MICROSD_3V0 MSD_CLK MSD_D[0] MSD_D[1] G4 TP4 1 10 F_SUB_FPCB to Main PCB Connector(CN101) LGE Internal Use Only - 76 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING TP5 CN102 1 SPK_OUT_P 2 SPK_OUT_N Can be Changed to TVS or ECLAMP TP5_CN102(=Speaker Pad) Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 77 - LGE Internal Use Only 4. TROUBLE SHOOTING 4.13 Main microphone MIC501 Æ VMIC_BIAS_P(TP1_C526) Æ MAIN_MIC_P(TP2_C261) Æ MIC1P PAD of QSC6270(3G disable) START Make a call MIC_BIAS(TP1_C526) is about 1.8V? No Change the Main board Yes Make sound to MIC Sine wave appears at TP2_C261? No Change the MIC Yes Change the Main board LGE Internal Use Only No Work well? - 78 - Yes END Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING TP2 MAIN_MIC_P MAIN_MIC_GND TP1 TP2_C261 TP1_C526 MIC501 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 79 - LGE Internal Use Only 4. TROUBLE SHOOTING 4.14 Headset microphone 3.5 pie Headset ÆHS_MIC_BIAS(TP1_R502) Æ HS_MIC_P(TP2_FB503) Æ HS_MIC_P(TP3_C263) Æ MIC2P PAD of QSC6270(3G disable) START Insert Headset & Make a call TP1_R502 is About 1.8V ? No Change the LDO(U501) Change the Main board No Re-Solder FB503 Change the MAIN board No Re-Solder C263 Change the MAIN board Yes Sine wave appears at TP2_FB503? Yes Sine wave appears at TP3_C263? Yes Change the Headset Change the MAIN board LGE Internal Use Only - 80 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING TP3 HS_GND VREG_MSMP_2V6 ´ëüǰ : EUSY0407501 RP183K181D is possible to 1.8 & 2.6 IO TP1 HS_JACK_DET TP2 HS_MIC_P|Hook_ADC HS_OUT_L NC HS_OUT_R FM_ANT HS_GND TP2_FB503 TP1_R502 U501 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 81 - TP3_C263 LGE Internal Use Only 4. TROUBLE SHOOTING 㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬ 㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG 4.15 RF RFComponent Component MAIN board Bottom U201 X202 FL101 SW101 U101 Reference Description Reference Description U201 QSC6270 3G disable FL101 FEM X202 XO SW101 RF connector U101 GSM(EDGE) TX PAM RF component (GSM) LGE Internal Use Only - 82 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬ 㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G G 4.16 Path 4.16 RF RF Path 4.16.1 GSM path TX Path RX Path Tx/RX Path Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 83 - LGE Internal Use Only 㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬ 㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G G 4. TROUBLE SHOOTING 4.17 Trouble Shooting of GSM Part (GSM850/GSM900/1800/1900) 㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬ 㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G G = LGE Internal Use Only - 84 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING START Setup Test Equipnment Cell power = -74dbm EGSM CH: 38 DCS1800 CH: 698 PCS1900 CH: 661 GSM850 CH: 190 Check M/S & FEM (SW101 & FL101) Check Rx Part Check Tx Part END Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 85 - LGE Internal Use Only 㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬ 4. TROUBLE SHOOTING 㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G G 4.17.1 Checking Front-End Module Block 4.17.1 Checking Front-End Module Block Setup Test Equipnment Cell power = -74dbm EGSM CH: 38 DCS1800 CH: 698 PCS1900 CH: 661 GSM850 CH: 190 Check TP3=2.85V? No Check U201 Yes Check the logic in each Mood TP1~TP2 high level 2.85V ≥ Vcc ≥ L4V? No Replace FL101 Yes END LGE Internal Use Only - 86 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 51 TP4 ANT_FEED 51 51 TP1 TP2 51 850, 900,1800,1900MHz TP3R109 51 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 51 51 51 - 87 - LGE Internal Use Only 4. TROUBLE SHOOTING 㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌H 㡸G 㵲㡸G ㍌ 4.17.2 Checking GSM Rx part START Check TP1~TP3 Signal exist? No Check FEM & Soldeing of TPs Yes Rx still has problem? 51 51 51 51 No GSM Rx is OK Yes Re-download & calibration TP1 RX_GSM850_M RX_GSM850_P TP2 TP3 RX_DCS1800_M RX_DCS1800_P TP4 LGE Internal Use Only - 88 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬ 4. TROUBLE SHOOTING 㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G G 4.17.3 Checking GSM Tx part 4.17.3 Checking GSM Tx part Setup Test Equipnment Cell power = -60dbm Tx Power Level Set GSM850/GSM900 = 5, DCS/PCS = 0 Yes Yes Is the level of TP4 same to Table 4.17.3 No Check U201 Yes TP2, 30dBm over? TP3, 33dBm over? No Yes Yes Check TP1, GSM850, EGSM 32dBm DCS,PCS 29dBm over? Remove U101 and check The power of pin1, pin8 (on board) No The power of pin1, pin8 No Check U201 Yes Re-download & calibration Replace U101 Table 4.17.3 GPAM Logic Control Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 89 - LGE Internal Use Only 4. TROUBLE SHOOTING 㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬ 㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G G LGE Internal Use Only - 90 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬ 㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G G 4.18 Checking Bluetooth Block 4.18.1 BLUETOOTH RF components ANT FL701 U703 X702 RF component ( BT ) - Main board bottom - Reference Description ANT BT Pattern ANT U703 BT module_BCM2070 FL701 Band pass filter X702 26Mhz crystal Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 91 - LGE Internal Use Only 4. TROUBLE SHOOTING 㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬ 㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G G 4.18.2 BLUETOOTH SIGNAL PATH Bluetooth Signal PATH (Main board bottom) Bluetooth T/Rx PATH LGE Internal Use Only - 92 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬ 4. TROUBLE SHOOTINGG 㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G 4.18.3 BLUETOOTH Trouble shooting 4.18.3 BLUETOOTH Trouble shooting START Check TP1, TP2 Signal exist? No Change the main board Yes Check TP3 IS clock OK? No Check X700 Yes Check TP4 Signal exist? No Check U700 Yes Change the main board TP# TP description TP1 VREG_MSMP_2.6V TP2 VREG_MSME_1.8V TP3 BT_CLK(26Mhz) TP4 BT_ANT_OUT Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 93 - LGE Internal Use Only 4. TROUBLE SHOOTING 㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬ 㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G G {w[G {wX {wYG {wZG Connectivity_ANT_PAD WLAN_BT_ANT_FEED BT_ANT_FEED LGE Internal Use Only - 94 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬ 㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G G {wX When power class 1.5 is used, R307 is populated and R308 is depopulated. (Vice versa for power class 2) TP1 Class{wY 1.5 TP2 RTC_32K BT_ANT_FEED RTC_32K768 must have 1% tolerance {w[G TP4 can be removed BT_RST_N BT_PWR_ON D4 E4 C4 A4 RTC_32K768 TP3 26MHz BT_PCM_OUT BT_PCM_IN BT_PCM_CLK BT_PCM_SYNC BT_UART_RX BT_UART_TX BT_UART_CTS BT_UART_RTS BT_WAKEUP BT_WAKEUP_HOST {wZ [BT main clk : 26MHz] Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 95 - LGE Internal Use Only 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬ 4.㝘⪌HG TROUBLE SHOOTING 㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G G 4.19 Checking FM Radio Block 4.19.1 FM Signal Path |^WX LGE Internal Use Only Reference Description U701 TEA5991(FM module) - 96 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.19.2 FM Trouble shooting START TP1, TP2 Check the Sianal No Change the main board Yes TP3 Check the Signal No Change the Ear Jack Yes TP4 Check the Signal No Change the U601 Yes Change the main board Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 97 - LGE Internal Use Only 4. TROUBLE SHOOTING 㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬ 㡸G 㵲㡸G ㍌G 㛺㏩⏼␘U TP1XUXUX TP2 {wYG TP3 {wZG {w[G TP4 VREG_MSMP_2.6V TP2 VREG_MSME_1.8V TP3 FM_ANT_IN TP4 FM_OUT_AUDIO signal RTC_32K TP1 MUIC_AUD_FM_I2C_SDA TP description MUIC_AUD_FM_I2C_SCL TP# VREG_MSME_1V8 VREG_MSMP_2V6 TP2 TP4 FM_R FM_L FM_ANT TP3 TP1 Close to QSC Close to ANT LGE Internal Use Only - 98 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 5. DOWNLOAD 5. DOWNLOAD 5. DOWNLOAD DOWNLOAD LG-C320 LG-C320 Copyright © 2010 LG Electronics. Inc. All right reserved. LGE Internal Use Only Only for training and service purposes 99 -- -164 LGE Use Only Copyright © 2010 LG Electronics. Inc. AllInternal right reserved. Only for training and service purposes 5. DOWNLOAD 5. DOWNLOAD LG-C320 LG-C320 LG-C320 LGE Internal Copyright © Use 2010Only LG Electronics. Inc. All right reserved. Only for training and service purposes 100 ---165 Copyright © 2010 LG Electronics.LGE Inc.Internal All rightUse reserved. Only Only for training and service purposes 5. DOWNLOAD 5. DOWNLOAD LG-C320 LG-C320 Copyright © 2010 LG Electronics. Inc. All right reserved. LGE Internal Use Only Only for training and service purposes 101 -- 166 LGEAllInternal Use Only Copyright © 2010 LG Electronics. Inc. right reserved. Only for training and service purposes 5. DOWNLOAD 5. DOWNLOAD LG-C320 LG-C320 LG-C320 LGE Internal Copyright © Use 2010Only LG Electronics. Inc. All right reserved. Only for training and service purposes 102 ---167 Copyright © 2010 LG Electronics.LGE Inc.Internal All rightUse reserved. Only Only for training and service purposes 5. DOWNLOAD 5. DOWNLOAD LG-C320 Copyright © 2010 LG Electronics. Inc. All right reserved. LGE Internal Use Only Only for training and service purposes 103 -- 168 LGEAllInternal Use Only Copyright © 2010 LG Electronics. Inc. right reserved. Only for training and service purposes 5. DOWNLOAD LGE Internal Copyright © Use 2010Only LG Electronics. Inc. All right reserved. Only for training and service purposes 5. DOWNLOAD 104 ---169 Copyright © 2010 LG Electronics.LGE Inc.Internal All rightUse reserved. Only Only for training and service purposes 5. DOWNLOAD 5. DOWNLOAD Copyright © 2010 LG Electronics. Inc. All right reserved. LGE Internal Use Only Only for training and service purposes 105 -- 170 LGEAllInternal Use Only Copyright © 2010 LG Electronics. Inc. right reserved. Only for training and service purposes 5. DOWNLOAD LGE Internal Copyright © Use 2010Only LG Electronics. Inc. All right reserved. Only for training and service purposes 5. DOWNLOAD 106 ---171 Copyright © 2010 LG Electronics.LGE Inc.Internal All rightUse reserved. Only Only for training and service purposes 5. DOWNLOAD 5. DOWNLOAD Copyright © 2010 LG Electronics. Inc. All right reserved. LGE Internal Use Only Only for training and service purposes 107 -- 172 LGEAllInternal Use Only Copyright © 2010 LG Electronics. Inc. right reserved. Only for training and service purposes 5. DOWNLOAD LGE Internal Copyright © Use 2010Only LG Electronics. Inc. All right reserved. Only for training and service purposes 5. DOWNLOAD 108 ---173 Copyright © 2010 LG Electronics.LGE Inc.Internal All rightUse reserved. Only Only for training and service purposes 5. DOWNLOAD 5. DOWNLOAD LG-C320 LG-C320 LG-C320 LG-C320 LG-C320 LG-C320 LG-C320 LG-C320 Copyright © 2010 LG Electronics. Inc. All right reserved. LGE Internal Use Only Only for training and service purposes 109 -- 174 LGEAllInternal Use Only Copyright © 2010 LG Electronics. Inc. right reserved. Only for training and service purposes 5. DOWNLOAD 5. DOWNLOAD LG-C320 LG-C320 LG-C320 LG-C320 LG-C320 LGE Internal Copyright © Use 2010Only LG Electronics. Inc. All right reserved. Only for training and service purposes LG-C320 LG-C320 110 ---175 Copyright © 2010 LG Electronics.LGE Inc.Internal All rightUse reserved. Only Only for training and service purposes 5. DOWNLOAD 5. DOWNLOAD LG-C320 LG-C20 LG-C20 LG-C20 Copyright © 2010 LG Electronics. Inc. All right reserved. LGE Internal Use Only Only for training and service purposes 111 -- 176 LGEAllInternal Use Only Copyright © 2010 LG Electronics. Inc. right reserved. Only for training and service purposes 6. BLOCK DIAGRAM 6. BLOCK DIAGRAM LGE Internal Use Only - 112 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 6. BLOCK DIAGRAM 51#F653#KZ#Eorfn#Gldjudp#=#Srzhu#b4# ESC6270_BB/RF ESC6270 POWER ESC6270_POWER VSW_MSMC ( 500mA) TA (5PIN) 5.1V,700mA USB_VBUS VSW_RF1 ( 500mA) Charger IC VBAT VSW_RF2 ( 500mA) VREG_MSMC_1V2 VDD_CORE VREG_RFRX2_1V3 VREG_RFTX2_1V3 VREG_RF1_2V3 VDD_RFRX VDD_RFTX VREG_RFA_2V2 VDD_RFA VBUS_LDO_4.9V MU_IC VREG_RF2_1V4 VBAT VDD_P1 VREG_MPLL (150mA) VDD_P2 VREG CDC2 (150mA) VREG_CDC2 Battery 900mAh VREG_RX2 (150mA) VDD_P5 VREG_TX2 (150mA) VDD_P6 VREG_RFA (300mA) VREG_MSME (300mA) VREG_MSMP ( 300mA) VREG_MSME_1V8 VREG_MSMP_2V6 MCP SDRAM (1.8V , MAX 180mA ) NAND (1.8V , MAX 30mA ) HALL IC(1.8V, ) KEYCODE IC(1.8V, ?mA) FM RADIO 1.8V(, MOTOR MOTOR_POWER_N VIB_DRV_N mA 2.6V( , mA BT only MODULE VREG_GP1 (150mA) 1.8V(, VREG_USB_2.6V ( 50mA) mA 2.6V( , mA VREG_USB_3.3V ( 50mA) VREG_TCXO ( 50mA) VREG GP2 ( 300mA) VREG_GP2 BACKUP Battery VCOIN Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes VCOIN (3.0V, ) VREG_USIM (150mA) - 113 - VREG_MICROSD_3V0 VREG_USIM_2V85 MICRO SD slot (3.0V (3 0V , , MAX mA ) USIM SLOT (2.85V ) LGE Internal Use Only 6. BLOCK DIAGRAM 51#F653#KZ#Eorfn#Gldjudp#=#Srzhu#b5# VBAT RT9396 LDO1(150m A ) (SUB PMIC) LDO2( 150mA ) 2.4” LCD MODULE VLDO_CAM_2V8 LCD_2.8V(, VLDO_CAM_1V8 2MEGA CAMERA VLDO LCD 2V8 VLDO_LCD_2V8 LDO3(300m A ) CAM_2.8V(, VLDO_LCD_1V8 LDO4( 500mA ) mA CAM _1.8V( , mA WLED_VOUT WLEDOUT( 4.8V, 450mA ) mA LCD _1.8V( , mA WLED ( ,120mA ) GSM PAM (TQM7M5012) VBAT AUDIO SUB SYSTEM 1.8V(, VREG_MSME_1.8V mA VDD LDO(150mA) EAR_JACK DET. VDD_TCXO LDO(150mA) WIFI_TCXO WIFI/BT/FM MODULE WIFI(, VREG_MSMP_2V6 LGE Internal Use Only OPTION mA BT( , mA - 114 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 6. BLOCK DIAGRAM 61#F653#KZ#Eorfn#Gldjudp#=#EE EBI2_DATA [ 0:15] NAND CS1_N NAND_ N VREG _MSME _1. 8V From PMIC CAM _MCLK CAM _PCLK EBI2 _ALE CAM _DATA [2:9] EBI2 _CLE CAM_HSYNC/VSYNC EBI2_OE_N Memory 2 Gb NAND + 1 Gb SDRAM 2M CAMERA MEGA _CAM _RESET_N EBI2_WE_N ( H8BCS0SIOBAR) CAM_ I 2C _SCL/SDA NAND _READY MEGA _CAM _PWDN RESOUT_N LCD _VSYNC _OUT SDRAM DATA [0: 31] SDRAM_DATA VBAT LCD_IF_MODE SDRAM _ADDR[0:14] LCD _LDO_2.8V LCD_MAKER _ID SDRAM _CLK LCD _LDO_1.8V LCD_RESET_N SDRAM _CS_N(0) SDRAM_ OE _N EBI2_DATA [0:15] SDRAM _WE_N LCD _CS _N SDRAM _CLK (0) LCD_ADS WLED _1:3 LCD EBI2_WE_N / EBI2_OE_N SDRAM_ADV_N LDO CHARGE PUMP MLED_OUT LDO_EN I2C_SDA , I2C_SCL From QSC SDRAM _DQM[0:3] BT _UART _TXD BT_UART _RXD MSME_1. 8V MICRO_DETECT_N BT _UART _RTS BLUE TOOTH MICRO SD CONNECTOR MICROSD_CMD/CLK BT _PCM_SYNC BT _ANT From BT chip ANT . MICROSD_DATA [0:3] BT _UART _CTS MSMP_2. 6V BT _PCM PCM _IN IN USIM _DATA / CLK / RESET _ _N BT _PCM_OUT BT _PCM_CLK BT_WAKEUP _MSM Crystal From SLEEP_CLK Of QSC6270 BT _ REG _ ON QSC6270 WLAN_SDIO[0:3] WLAN_COMMEND MSME_1. 8V WLAN_CLK MSMP_2. 6V BT _UART _TXD BT_UART _RXD KEYCODE_INTERRUPT KEYCODE IC KEYCODE RESET KEYCODE__RESET KEYCODE__I2C XTAL _IN VBAT WLAN&BT ANT KEY_ROW[0:7] KEY_COL[0:7] QWERTY KEY & NAVI _KEY MUIC_FM_AUDIO_I2C _SDA(GPIO49_P1_1.8V) MUIC /AUDIO FM RADIO 32.768KHz Oscillator XTAL _OUT MMP_XTAL _OUT FM RADIO Charge Pump 19.2MHz XO BT _UART _CTS MUIC_FM_AUDIO_I2C _SCL(GPIO 50_P1_1.8V) MUIC_INT(GPIO 10_P1_1.8V) QSC GPIO CP_ I2C_SDA(GPIO 70_P3_2.85V) CP_ I 2C _SCL(GPIO71_P3_2.85V) BT _UART _RTS WIFI &BT MODULE BT _PCM_SYNC SLIDE_DETECT HALL _IC VREG _MSME_1. 8V BT _PCM _IN BT _PCM_OUT BT _PCM_CLK From SLEEP_CLK Of QSC6270 I2C COMM. VREG_USIM_2.85V BT_RESET_N 32.768KHz VBAT From WLAN&BT chip ANT . SIM CONNECTOR DC MOTOR MOTOR DRIVE MSM_WAKEUP_BT 26 MHZ VREG_MICROSD_3.0V Crystal BT_WAKEUP _MSM 26 MHZ MSM_WAKEUP_BT SLIDE KEY _ LED VBAT QWETY KEY _ LED VBAT JTAG_TDI JTAG_TCK JTAG_TMS JTAG_TRST_N JTAG_TDO JTAG_RTCK JTAG BT RESET N BT_RESET_N 32 768KH 32.768KHz BT_ REG _ ON USB D +/- VBAT UART1_RX/TX OPTION USB_VBUS MUIC BOOST_5V MUIC_AUDIO_ I2C_SCL HP_EAR_R To. MMI CON. HP_EAR_L SPK +/- AUDIO SUB S S SYSTEM ( WM9093ECS-R ) MUIC_AUDIO_ I 2C_SDA SPK _R/L HP_R/ L USB _ID MUIC_INT 5PIN MICRO MMI CONN. I2C_SDA / SCL FM RADIO I2C FM RIGHT / LEFT MIC_BIAS USB +/- MIC MSME_1.8V FM R ADIO MSMP_2.6V 32.768KHz From SLEEP_CLK Of QSC6270 FM ANT RCV R / L Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 115 - LGE Internal Use Only 6. BLOCK DIAGRAM 71#F653#KZ#Eorfn#Gldjudp#=#UIbJVP LGE Internal Use Only - 116 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 6. BLOCK DIAGRAM 81#F653#KZ#Eorfn#Gldjudp#=#Frqqhfwlylw|+EW2ZLIL2IP,brswlrq EAR_ _JACK VDD_TCXO Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 117 - LGE Internal Use Only 6. BLOCK DIAGRAM 81#F653#KZ#Eorfn#Gldjudp#=#Frqqhfwlylw|+EW2IP, E EAR_JACK E t External l XO LGE Internal Use Only - 118 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 6. BLOCK DIAGRAM 91#F653#KZ#Eorfn#Gldjudp#=#Phpru| HYNIX MCP ( H8BCSOSIOBAR) _CE NAND Flash (2Gbit) ALE NAND_ LB_N CLE NAND_UB_N _RE RE _WE RY_BY _WP IO[1:16] SDRAM (1Gbit) NAND_WE_N External Memory (MICRO SD) NAND_WP_N NAND_DATA[0:15] CKE DDR_CKE[0] _ _CS DDR_CS[0]_N _ _RAS DDR_RAS_N _CAS CAS DDR_CAS_N _WED DDR_WE_N _ _ DQ MSD_CLK NAND_BSY_N DDR_M_CLK_N ADDR MSD_CMD NAND_OE_N CLK DQM MSD_D[0:3] NAND_ _CS_ _N ESC6270 SIM_CLK DDR_DQM[0:1] _ _ _ SIM_RST_N DDR _ A[0:13] SIM _DATA MUSIM_DM DDR _ D[0:15] Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes USIM (SIM PLUS) MUSIM_DP - 119 - LGE Internal Use Only 6. BLOCK DIAGRAM :1#F653#KZ#Eorfn#Gldjudp#=#Dxglr MICBIAS HSED_BIAS MIC1P MIC1P MIC1N MIC1N FM_L LINE_IN_L_P TEA5991 FM_R LINE_IN_R_N MIC2N MIC2N MIC2P MIC2P ESC6270 EAROP EARON HPH_OUT_L_P HPH_OUT_R_N RCV+ RXIN+ RCV- RXIN- HS_L HS_R HPR HPL HS_OUT_R HS_OUT_L IN1+ IN1 IN1- WM9093 LINE_OUT_L_P LINE OUT R N LINE_OUT_R_N SPK_P SPK_N IN2+ IN2 IN2OUT+ GPIO GPIO LGE Internal Use Only MUIC_AUD_FM_I2C_SCL MUIC_AUD_FM_I2C_SDA SCL OUT- SPK_OUT_P SPK_OUT_N SDA - 120 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 6. BLOCK DIAGRAM ;1#F653#KZ#Eorfn#Gldjudp#=#YLVXDO+#OFG#)#FDPHUD#, CAM_I2C_SDA CAM_I2C_SCL CAM_MCLK CAM_PCLK 2M Camera Hynics sensor Bayer RGB Output CAM_RST_N CAM_PWDN C2FK-H313P CAM_VSYNC VBAT VLDO_CAM_1V8 VLDO_CAM_2V8 RT9396GQW CAM_HSYNC CAM_DATA[0~7] BL_LCD_CAM_LDO_EN QSC6270 VREG_MSMP_2.6V LCD DATA[0~15] LCD_DATA[0~15] VLDO_LCD_2V8 LCD_RS VLDO_LCD_1V8 LCD_RST_N LCD_CS_N LCD_WR_N 2.4” TFT LCD QVGA CPU I/F LCD RD LCD_RD LCD_VSYNC_OUT DM24-DSM04 LCD_MAKER_ID VBAT WLED_OUT RT9396GQW 5channel WLED1 WLED2 WLED3 WLED4 WLED5 BL_LCD_CAM_LDO_EN Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 121 - LGE Internal Use Only LGE Internal Use Only - 122 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 7. CIRCUIT DIAGRAM 1-2-1-3_ESC-Quad EDGE ANTENNA SWITCH MODULE LOGIC RX_GSM850_M ANT_SEL0 ANT_SEL1 GSM850/EGSM TX RX_GSM850_P PCN/PCS TX ANT_FEED GSM850 RX EGSM RX PCN RX PCS RX RX_DCS1800_M RX_DCS1800_P ANT_FEED 850, 900,1800,1900MHz 6 dB R109 GSM_PA_BAND MODE 6 dB Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 123 - LGE Internal Use Only 7. CIRCUIT DIAGRAM 2-2-2-1_ESC_ESC6270 VMIC_BIAS_P MSM_RESIN_N SLIDE_KEY_LED MAIN_KEY_LED MOTOR_POWER_N HOOK_ADC XTAL_19M_OUT GND XTAL_19M_IN RTC_32K PS_HOLD PM_ONSW_N GSM_PA_EN GSM_PA_BAND 32.768KHz BAT_ID XO_ADC_IN XO_ADC_IN VREG_RF2_1V4|VREG_RF2 RX_DCS1800_M RX_DCS1800_P RX_GSM850_M RX_GSM850_P RX_PCS1900_M RX_PCS1900_P RX_EGSM_M RX_EGSM_P GSM_HB_TX GSM_LB_TX GSM_PA_RAMP VREG_RFRX2_1V3 - Normal Audio Power : +VPWR VREG_RFA_2V2 VSW_RF1 VREG_RF1_2V3|VREG_RF1 VSW_RF2 VREG_RF2_1V4|VREG_RF2 VSW_MSMC VCOIN VREG_RFTX2_1V3 VBAT VREG_MSMP_2V6 19.2MHz XTAL_19M_IN TP_UART_TX TP_UART_RX XTAL_19M_OUT UART_TX UART_RX BT_UART_TX UART_BT_SW BT_UART_RX LGE Internal Use Only - 124 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 7. CIRCUIT DIAGRAM VBAT PM_ONSW_N USB_VBUS TP_UART_TX TP_UART_RX UTXD URXD PWR VBAT ON_SW VCHAR TX RX GND HS_GND|GND 3G UART_TX UART_RX MAIN_MIC_P MAIN_MIC_GND 2.5G MAIN_MIC_GND|GND HS_GND 12 11 10 9 8 7 6 5 4 3 2 1 VREG_MSME_1V8 FM_L FM_R UART_BT_SEL JTAG_TCK JTAG_TMS JTAG_TRST_N JTAG_TDO JTAG_TDI PS_HOLD MSM_RESIN_N JTAG_RTCK 2-2-2-1_ESC_ESC6270 HALL_SENS_DET BT_RST_N BT_WAKEUP_HOST MUSIM_DP MUSIM_DM WLAN_CLK WLAN_SDIO[3] WLAN_SDIO[2] WLAN_SDIO[1] WLAN_SDIO[0] WLAN_CMD NET Conn RESOUT_N|NAND_WP_N DDR_A[14]|DDR_BA[00] DDR_A[15]|DDR_BA[01] BT_PWR_ON LCD_IF_MODE[0] HS_JACK_DET WLAN_BT_REG_ON LCD_RST_N WLAN_RST_N NAND_D[00]|LCD_DATA[0] BL_LCD_CAM_LDO_I2C_SDA BL_LCD_CAM_LDO_I2C_SCL MUIC_AUD_FM_I2C_SCL MUIC_AUD_FM_I2C_SDA NAND_D[01]|LCD_DATA[1] MUIC_INT_N NAND_D[02]|LCD_DATA[2] NAND_D[03]|LCD_DATA[3] NAND_D[04]|LCD_DATA[4] NAND_D[05]|LCD_DATA[5] NAND_D[06]|LCD_DATA[6] NAND_D[07]|LCD_DATA[7] NAND_D[08]|LCD_DATA[8] NAND_D[09]|LCD_DATA[9] NAND_D[10]|LCD_DATA[10] CHG_STS_N CHG_EN_N NAND_D[11]|LCD_DATA[11] NAND_D[12]|LCD_DATA[12] NAND_D[13]|LCD_DATA[13] NAND_D[14]|LCD_DATA[14] NAND_D[15]|LCD_DATA[15] NAND_WE_N|LCD_WR_N NAND_OE_N|LCD_RD High : BT UART Low : UART Comm BL_LCD_CAM_LDO_EN UART_BT_SEL Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 125 - LGE Internal Use Only 7. CIRCUIT DIAGRAM 3-3-1_6P_USIM ENSY0024301 MCP2-1_2G_1G DDRx16_hynix MUSIM_DM DDR_A[00] DDR_A[01] DDR_A[02] DDR_A[03] DDR_A[04] DDR_A[05] DDR_A[06] DDR_A[07] DDR_A[08] DDR_A[09] DDR_A[10] DDR_A[11] DDR_A[12] DDR_A[13] DDR_D[00] DDR_D[01] DDR_D[02] DDR_D[03] DDR_D[04] DDR_D[05] DDR_D[06] DDR_D[07] DDR_D[08] DDR_D[09] DDR_D[10] DDR_D[11] DDR_D[12] DDR_D[13] DDR_D[14] DDR_D[15] DDR_DQM[0] DDR_DQM[1] DDR_DQS[0] DDR_DQS[1] DDR_M_CLK_N DDR_M_CLK_P DDR_CKE[0] DDR_BA[00] DDR_BA[01] DDR_RAS_N DDR_CAS_N DDR_WE_N DDR_CS[0]_N LGE Internal Use Only MUSIM_DP NAND_D[00] NAND_D[01] NAND_D[02] NAND_D[03] NAND_D[04] NAND_D[05] NAND_D[06] NAND_D[07] NAND_D[08] NAND_D[09] NAND_D[10] NAND_D[11] NAND_D[12] NAND_D[13] NAND_D[14] NAND_D[15] NAND_WE_N NAND_OE_N NAND_LB_N NAND_UB_N NAND_CS_N NAND_BSY_N NAND_WP_N - 126 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 7. CIRCUIT DIAGRAM 4-2-3-2 4-2-1-4 MUIC_IO_M MUIC_IO_P MUIC_ACC_ID 4-5-2-1 4-3-1-3 CHG_STS_N VBUS_LDO_4V9 DNI BAT_ID Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 127 - LGE Internal Use Only 7. CIRCUIT DIAGRAM 5-1-2-1 5-4-1-1 VREG_MSMP_2V6 4-4-2-3 ´ëüǰ : EUSY0407501 SPK_OUT_P SPK_OUT_N HS_R HS_L HS_OUT_L HS_OUT_R SPK_N SPK_P RP183K181D is possible to 1.8 & 2.6 IO GND HS_JACK_DET MUIC_AUD_FM_I2C_SCL MUIC_AUD_FM_I2C_SDA WM9093 is possible to 1.8 & 2.6 IO When HPVDD is 1.8V HS_MIC_P|Hook_ADC HS_OUT_L NC HS_OUT_R FM_ANT HS_GND LGE Internal Use Only - 128 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 7. CIRCUIT DIAGRAM 6-2-2-1 6CH+4LDO,PWM R603 WLED1 8 3 7 4 6 5 9 2 10 1 BL_LCD_CAM_LDO_I2C_SCL BL_LCD_CAM_LDO_I2C_SDA 8 3 7 4 6 5 9 2 9 2 8 3 7 4 6 - 129 - 10 1 5 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 10 1 LGE Internal Use Only RTC_32K Connectivity_ANT_PAD MUIC_AUD_FM_I2C_SDA MUIC_AUD_FM_I2C_SCL 7. CIRCUIT DIAGRAM VREG_MSME_1V8 VREG_MSMP_2V6 WLAN_BT_ANT_FEED BT_ANT_FEED FM_R FM_L FM_ANT Close to QSC Close to ANT VREG_MSME_1V8 QCT VREG_MSME_1V8 VFM_PWR QCT VFM_PWR When power class 1.5 is used, R307 is populated and R308 is depopulated. (Vice versa for power class 2) Class 1.5 RTC_32K RTC_32K768 must have 1% tolerance can be removed BT_RST_N BT_PWR_ON BT_ANT_FEED RTC_32K768 26MHz BT_WAKEUP D4 E4 C4 A4 BT_PCM_OUT BT_PCM_IN BT_PCM_CLK BT_PCM_SYNC BT_UART_RX BT_UART_TX BT_UART_CTS BT_UART_RTS BT_WAKEUP_HOST VBAT VBT_WIFI_IO_2V6 LGE Internal Use Only QCT VBAT IFX VBAT QCT VREG_MSMP_2V6 IFX VPM_IO_2V62 - 130 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 7. CIRCUIT DIAGRAM LCD_MAKER_ID 8-1-1-1 LCD_RST_N LCD_VSYNC_OUT VREG_MSMP_2V6 15pF RCV_N 15pF RCV_P LCD_DATA[7] LCD_DATA[6] LCD_DATA[5] LCD_DATA[4] HALL_SENS_DET 15pF VCOIN 15pF LCD_DATA[11] LCD_DATA[10] LCD_DATA[9] LCD_DATA[8] GND VREG_LCD_2V8 VLDO_LCD_2V8 VLDO_LCD_1V8 WLED1 15pF WLED2 LCD_RD VREG_MSME_1V8 WLED3 WLED4 WLED5 SLIDE_KEY_LED 15pFKEY_ROW0 WLED_VOUT KEY_ROW1 KEY_ROW2 DOWN PM_ONSW_N KEY_ROW3 KEY_COL5 KEY_ROW5 KEY_COL4 KEY_ROW7 UP KEY_ROW7 KEY_COL6 LCD_IF_MODE[1] KEY_COL7 LCD_IF_MODE[0] VREG_MSME_1V8 KEY_ROW6 KEY_ROW5 KEY_ROW4 KEY_ROW3 KEY_ROW2 KEY_ROW1 KEY_ROW0 Q W&$ E&% R&1 T&2 Y&3 U&* O&& P A&[ S&] D&' F&4 G&5 H&6 K&{ L&} BACK FN Z&+ X&= C&7 KEY_COL0 KEY_COL1 J KEY_COL2 I&^ 25pF 25pF V&8 KEY_COL3 @&/ B&9 N&0 '&. SPACE M&; SYM ENTER CAM SHIFT TEXT ?&: 25pF KEY_COL6 KEY_COL7 "&, KEY_COL4 25pF Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 131 - LGE Internal Use Only 7. CIRCUIT DIAGRAM 3-2-1-3_push_1.50T MSD_D[2] MSD_D[3] MSD_CMD MSD_D[0] MOTOR_POWER_N MSD_D[1] VBAT LGE Internal Use Only - 132 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 7. CIRCUIT DIAGRAM 16 15 14 13 12 11 10 9 7 8 6 5 4 3 2 1 KEY PCB L K L K LCD FILTER, ZIP CONNECTOR Slide KEY PCB to Slide FPCB ENBY0040501(GB042-50P-H10-E3000,SOCKET) VLDO_LCD_1V8 J CN101 LCD_DATA[7] LCD_DATA[6] LCD_DATA[5] LCD_DATA[4] LCD_DATA[3] LCD_DATA[2] LCD_DATA[1] LCD_DATA[0] LCD_RS LCD_RD LCD_WR_N LCD_CS_N I LCD_RST_N LCD_VSYNC_OUT KEY_ROW0 KEY_ROW1 KEY_ROW2 KEY_ROW3 KEY_COL5 KEY_COL6 KEY_COL7 H 1 50 2 49 3 48 4 47 5 46 6 45 7 44 8 43 9 42 10 41 11 40 12 39 13 38 14 37 15 36 16 35 17 34 18 33 19 32 20 31 21 30 22 29 23 28 24 27 25 26 R102 R101 1 1 J VLDO_LCD_2V8 CN102 1 LCD_MAKER_ID LCD_DATA[15] LCD_DATA[14] LCD_DATA[13] LCD_DATA[12] LCD_DATA[11] LCD_DATA[10] LCD_DATA[9] LCD_DATA[8] 2 LCD_VSYNC_OUT 3 4 LCD_MAKER_ID LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3] VLDO_LCD_2V8 VLDO_LCD_1V8 LCD_IF_MODE[0] LCD_IF_MODE[1] WLED1 WLED2 WLED3 WLED4 WLED5 SLIDE_KEY_LED PM_ONSW_N WLED_VOUT 5 6 7 I 8 LCD_DATA[4] LCD_DATA[5] 9 LCD_DATA[6] LCD_DATA[7] LCD_DATA[8] LCD_DATA[9] LCD_DATA[10] LCD_DATA[11] LCD_DATA[12] LCD_DATA[13] LCD_DATA[14] LCD_DATA[15] 11 10 12 13 14 15 16 17 18 19 20 H 21 LCD_RD LCD_WR_N LCD_RS LCD_CS_N 22 23 24 LCD_RST_N 25 26 LCD_IF_MODE[1] LCD_IF_MODE[0] 27 28 29 30 C101 C102 0.1u 0.1u G WLED5 WLED4 WLED3 WLED2 WLED1 WLED_VOUT 31 32 33 G 34 35 F F SUB KEY B/L SUB PCB KEY E E WLED_VOUT KEY_ROW3 KEY_ROW2 LD103 LD104 LD105 LD106 LD107 LD108 KEY_ROW1 POWER KEY D KEY_ROW0 KB101 KB102 KB103 R107 R108 R105 R106 R109 R110 10 10 10 10 10 10 D KB104 SLIDE_KEY_LED KB105 KEY_COL5 PM_ONSW_N C END VA102 KEY_COL6 LEFT Widget KB106 KB107 Multi. TALK KB110 KEY_COL7 DOWN RSK RIGHT KB108 KB109 UP OK VA101 C KB111 LSK B B A A 16 15 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 14 13 12 11 10 9 8 - 133 - 7 6 5 4 3 2 1 LGE Internal Use Only 7. CIRCUIT DIAGRAM 12 9 10 11 8 7 6 5 4 3 2 1 L L SLIDE FPCB K Slide FPCB to KEY PCB(Slide) Slide FPCB to Main PCB (54Pin) J K MAIN RECEIVER ENBY0040401 (50Pin) CN102 4 51 5 50 6 49 RCV_P LCD_DATA[15] LCD_DATA[14] LCD_DATA[13] VCOIN LCD_DATA[7] LCD_DATA[12] 7 48 8 47 9 46 10 45 LCD_DATA[6] LCD_DATA[10] KEY_ROW0 KEY_ROW1 KEY_ROW2 KEY_ROW3 KEY_COL5 KEY_COL6 KEY_COL7 LCD_DATA[9] LCD_DATA[4] LCD_DATA[3] LCD_DATA[8] 11 H LCD_RST_N LCD_VSYNC_OUT LCD_DATA[11] LCD_DATA[5] 44 LCD_DATA[2] 12 43 LCD_DATA[1] LCD_DATA[0] 5 46 6 45 7 44 8 43 9 42 10 41 11 40 12 39 13 38 14 37 15 36 16 35 17 34 18 33 19 32 20 31 21 30 22 29 23 28 24 27 25 26 CN101 RCV_P LCD_MAKER_ID LCD_DATA[15] LCD_DATA[14] LCD_DATA[13] LCD_DATA[12] LCD_DATA[11] LCD_DATA[10] RCV_N LCD_DATA[9] LCD_DATA[8] VLDO_LCD_2V8 VLDO_LCD_1V8 LCD_IF_MODE[0] LCD_IF_MODE[1] WLED1 WLED2 WLED3 WLED4 WLED5 SLIDE_KEY_LED PM_ONSW_N FB101 100n 1 FB102 100n 2 I Can be Changed to TVS or ECLAMP H WLED_VOUT VLDO_LCD_2V8 13 42 14 41 15 40 16 39 17 38 18 37 19 36 20 35 21 34 22 33 23 32 24 31 25 30 26 29 27 28 VLDO_LCD_1V8 LCD_RS WLED1 LCD_RD WLED2 LCD_WR_N WLED3 LCD_CS_N WLED4 LCD_RST_N WLED5 LCD_VSYNC_OUT G 47 VA102 52 48 4 VA101 3 49 3 39pF I LCD_MAKER_ID 50 2 39pF 53 RCV_N 1 C102 2 LCD_DATA[7] LCD_DATA[6] LCD_DATA[5] LCD_DATA[4] LCD_DATA[3] LCD_DATA[2] LCD_DATA[1] LCD_DATA[0] LCD_RS LCD_RD LCD_WR_N LCD_CS_N 54 C101 CN103 1 J SLIDE_KEY_LED KEY_ROW0 G WLED_VOUT KEY_ROW1 KEY_ROW2 PM_ONSW_N KEY_ROW3 KEY_COL5 KEY_COL6 LCD_IF_MODE[1] KEY_COL7 BACKUP BAT.(SUPER CAP.) LCD_IF_MODE[0] GND F F M101 R101 VCOIN 4.7K C103 ZD101 2.2u E E D D C C B B A A 12 LGE Internal Use Only 11 10 9 8 7 6 - 134 - 5 4 3 2 1 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 7. CIRCUIT DIAGRAM 12 11 10 9 8 7 6 5 4 3 2 1 L L K K J J MODULE FPCB I I SPK Common Circuit From Module FPCB to Main PCB Connector BUSEON 16pi 3.0t 0.8W ELCO8000_0610 Update CN101 H G1 SPK_OUT_P SPK_OUT_N 20 2 19 3 18 4 17 5 16 6 15 7 MSD_D[2] MSD_D[3] MSD_CMD SPK_OUT_P VREG_MICROSD_3V0 MSD_CLK SPK_OUT_N CN102 1 2 14 8 MOTOR_POWER_N VBAT H G2 1 13 9 MSD_D[0] MSD_D[1] 12 10 11 G3 G4 G G Can be Changed to TVS or ECLAMP MICRO SD PUSH PUSH 1.32t NORMAL TYPE F F VB101 S101 1 G7 G5 G3 G1 MSD_D[2] MSD_D[3] MSD_CMD VREG_MICROSD_3V0 MSD_CLK E MSD_D[0] MSD_D[1] VIBRATOR 1 C1 2 C2 3 C3 4 C4 5 C5 6 C6 7 C7 8 C8 G6 G4 G2 VBAT CD 2 15 MOTOR_POWER_N LG Innoteck/ Sodering 17mm E 16 COM D D C C B B A A 12 11 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 10 9 8 7 6 - 135 - 5 4 3 2 1 LGE Internal Use Only LGE Internal Use Only - 136 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 8. BGA Pin Map 1.8.BGA BGAPIN Pin MAP Map QSC6270 3G disableٛ- U200 (bottom view) Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 137 - LGE Internal Use Only 8. BGA Pin Map H8BCS0SI0BAR-46M (MCP,NAND) – U300 (EUSY0347506) LGE Internal Use Only - 138 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 8. BGA Pin Map BCM2070B2KUBXG (bluetooth) – U700 (EUSY0418701) Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 139 - LGE Internal Use Only 8. BGA Pin Map RT8963WSC (Multiplexer Mini/Micro USB Interface)– IC400 (EUSY0424801) LGE Internal Use Only - 140 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 8. BGA Pin Map WM9093 (Ultra Low Power Audio Subsystem)– IC500 (EUSY0403901) 20-bump CSP package; Top View Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 141 - LGE Internal Use Only 8. BGA Pin Map TEA5991(FM Tuner)– U701 (EUSY0385901) LGE Internal Use Only - 142 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 9. PCB LAYOUT 54 C609 C607 CN801 FB508 C511 R270 R604 C614 C612 C613 R811 C611 R813 27 R603 U601 Charge Pump+Dual LDO - Can not use LCD Display, LCD Backlight, Slide Detection R271 U601 R810 FB502 C615 C610 C504 C503 C508 C509 C506 C507 C523 C802 C517 FB507 C510 C608 IC501 U801 C801 C524 5 D IC501 Audio Sub System - Can not use Sound,Headset FB506 28 1 C518 C516 C515 R506 R507 C514 U801 Hall IC - Can not use Slide Detection CN801 FPCB Conn - Can not use LCD, Receiver,Sub Key, Sub key LEDs, Vibrator, Power On VA266 VA802 R806 C269 C803 C268 6 5 C804 C805 VA803 VA801 10 1 C N 802 TP201 C N 260 TP202 VA804 R805 R801 R802 LD801 LD802 LD801/802 Main Key LED - Can not use LED KB801 KB821 KB812 KB822 KB802 KB813 KB804 KB805 KB806 KB807 KB814 KB815 K B 816 KB810 KB803 KB817 KB824 KB825 KB827 KB826 KB808 KB819 KB811 KB809 KB820 KB818 KB829 KB823 KB828 KB830 KB837 KB834 K B 838 KB832 K B 839 KB831 KB833 KB836 C320_MAIN_SPFY0235601_1.1_TOP Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 143 - LGE Internal Use Only 9. PCB LAYOUT C709 FL811 C707 FL803 FL810 C706 FL804 FL802 FL805 FB701 C604 R803 VA808 6 1 F E D C B A C708 VA809 VA810 U701 VA505 TP701 TP702 VA522 L501 R266 R509 R505 FB505 C519 R508 FB504 FB503 C502 R502 C501 C505 C521 IC401 MUIC - Can not use USB, UART, Headset VA504 D C409 C405 C401 VA602 R269 VA601 R268 VA603 R303 R304 R302 C309 L810 C305 A B C F D E J H G L K N M T P R307 R308 ZD310 ZD308 C312 C404 F L401 C247 ZD307 R309 ZD306 R310 R406 U401 12 ZD305 R407 R272 R273 A 1 F C B D E H G J L K N P M T R U V W Y AA AB AC U201 QSC6270 (BB & Power chipset) - Can not power on - No LCD Display - No Service C267 C214 C212 C213 C226 C220 C228 L207 L206 C231 C230 C233 C234 C235 C238 L205 C298 23 L204 L118 L103 C126 L111 L104 C104 C101 L101 L102 C102 C137 L115 L116 C107 C114 L107 L108 C118 C266 C251 C242 R260 C291 R261 C290 C275 C241 C203 C202 R201 PT201 X 202 C240 X202 XO - Can not BootRF Rx/Tx - No Power. C227 C237 C250 FL808 C249 R205 C296 C207 C224 C210 C209 C261 C262 C525 VA508 R808 R1 VA509 C 526 X 201 C297 C252 L109 C232 C236 C256 C117 L203 C239 R282 R281 C 201 C229 R206 C 257 L201 U201 C253 C 206 C254 C281 C255 C219 L202 C280 L208 R265 D201 R311 R405 C410 C 412 C411 R402 C215 C217 C208 R264 10 Q ZD311 C308 C216 C218 C306 R262 C246 C 258 C211 C221 C 205 C 259 C289 R284 U803 C276 C248 R283 C301 C807 C302 R807 C806 C739 C303 R809 C304 R301 C113 C740 R404 R403 R102 C121 R104 C119 C127 FL101 U101 GSM PAM - Tx power No service L1113 C135 C134 TP262 J301 R109 U 101 C122 L110 TP263 C123 L114 TP264 C417 C413 C130 L801 L802 L117 C110 L805 L806 L119 L803 L804 C109 C115 ANT101 C133 C132 C 414 C 415 Z D 402 L112 TP710 TP260 R112 C129 C128 C120 R107 L105 C105 C111 R110 R111 C112 CN402 SW101 FL101 FEM - GSM RX Sensitivity & TX Power - No service R103 R114 R113 C143 C722 C724 C416 MIC501 CN403 USB Conn - Can not use USB U401 Single Charger - Can not use Charging, Booting C260 C742 L811 FB501 1 C406 C310 CN403 C C704 TP705 TP706 C717 A B TP703 FB702 11 5 1 C737 T P709 C N 401 R401 T P708 20 C407 C710 TP704 C601 R511 C264 R219 C299 C403 D 202 C 225 C 244 R207 R263 R814 C223 C222 C245 C307 C311 VA260 VA261 VA262 VA263 VA264 VA401 VA265 MIC501 Mic. - Can not use Mic C263 R501 R503 C734 R708 C243 TP802 FL809 FL806 F E D C B A FB703 1 J301 USIM Conn. - Can not detect USIM IC401 C408 R713 FL807 C726 U 703 R702 7 CN402 Battery Conn - Can not use Battery, Power On C265 C715 TP707 C741 R601 C602 Q501 R510 C606 C605 U501 C402 R715 R714 R709 R710 R712 R711 R705 C721 C720 C723 U803 Analog Switch - Can not use UART, BT U802 C725 X702 J501 J501 Ear-Jack - Can not use Ear-Mic U301 R703 C735 C736 X702 BT X-Tal - Can not use BT R706 R707 F L701 U703 BT Chip. - Can not use BT VA503 T P 60 1 T P 60 2 C733 C N 803 ZD606 C204 ZD607 VA201 U301 Memory - Can not Boot X201 Sleep Cystal - No Service R504 C714 R602 FL603 C738 R704 C728 C 730 C731 C732 C729 C 727 L702 C 719 L701 CN803 FPCB Conn - Can not use SD-card, Vibrator, Speaker S601 Camera Socket - Can not use Camera VA502 C520 VA501 S601 VA604 C705 C716 U704 R267 FL601 X 701 C718 C 712 C703 U702 C701 FL602 C603 L703 C713 ANT102 C320_MAIN_SPFY0235601_1.1_BOT LGE Internal Use Only - 144 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 9. PCB LAYOUT KB111 KB103 LD108 KB108 LD104 KB102 KB101 KB107 LD106 KB109 KB110 KB104 LD105 LD103 LD107 KB106 KB105 LD107/LD108/LD106/LD104/LD105/LD103 Sub Key LED - Can not use LED C320_KEY_SPEY0068201_10_TOP Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 145 - LGE Internal Use Only 9. PCB LAYOUT CN102 25 CN102 LCD Connector - Can not use LCD Display, LCD Backlight CN101 R102 C102 C101 R101 50 CN101 FPCB Connector - Can not use LCD, Sub key Operation, Sub Key LED, Receiver R1 1 0 R 10 7 R108 R 10 9 R 10 6 R105 VA101 26 VA102 C320_KEY_SPEY0068201_10_BOT LGE Internal Use Only - 146 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 9. PCB LAYOUT R101 ZD101 M101 C103 C101 VA101 CN101 C102 FB102 VA102 FB101 25 CN102 26 50 27 CN103 28 54 CN103 FPCB Connector - Can not use LCD, Sub key Operation, Sub Key LED, Receiver CN102 FPCB Conn - Can not use LCD, Sub key Operation, Sub Key LED, Receiver C320_F_SLIDE_SPCY0246901_10_TOP Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 147 - LGE Internal Use Only 20 CN102 10 S101 CN101 CN101 FPCB Conn - Can not use SD-card, Vibrator, Speaker VB101 11 9. PCB LAYOUT S301 MicroSD Socket - Can not use MicroSD C320_F_SUB_SPCY0247101_10_BOT LGE Internal Use Only - 148 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 10. RF CALIBRATION 10. RF CALIBRATION 10.1 Usage of Tachyon for RF Calibration and Test 10.1.1 Preparation work for setting RF cable loss Procedure 1. Click “Hecaton.exe” in below directory to set RF cable loss on test equipment. “C:\LGE\Tachyon\Utilities” 2. After selecting “Select File” button, select right RF cable loss file corresponding to RF cable that you use. Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 149 - LGE Internal Use Only 10. RF CALIBRATION 10.1.2 Basic Setting of Tachyon for RF Calibration & Test [ System Option Setting] [ User Model Selection] Procedure 1. Click “Tachyon_xxx.exe” in below directory to execute Tachyon program. “C:\LGE\Tachyon\” 2. Click “System Option Setting” icon in the menu to set COM port. Select “UART Port” that can communicate with phone in the Shield Box 1 message. Click the “OK” button. 3. Click “User Model Selection” icon in the menu to set model configuration. Do double-click model/buyer name that you want to calibrate and test. Click the “Select” button. LGE Internal Use Only - 150 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 10. RF CALIBRATION 10.1.3 Log of RF Calibration and Test Contents On Running, log window is created in upper area. It displays logs of phone commands and measurements for RF calibration and test. The result files are saved in below directory - “C:\LGE\Tachyon\Report\CalData\” : the file of RF calibration result - “C:\LGE\Tachyon\Report\TestData\” : the file of RF test result Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 151 - LGE Internal Use Only 11. TEST ALONE Phone Test11. Mode : LG-C320 TEST ALONE 11.1 Phone Test Mode 1. Enter the Engineer Menu 2. Tap 1. Device Test 3. Tap 1. Auto ALL Test LGE Internal Use Only - 152 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 11. TEST ALONE Phone Test Mode Scenario Item (1) Key Press, External Memory, and SIM card Test Start Order 1.Key, External Memory, and SIM card Test 2. IF OK, tab “LSK” Button. It means “PASS” Description Key Test Press all keys for test - UP key - Down key - Right key - Left key ……….. ……. …. External memory and SD card is inserted then Sing of “SIM Pass” and “SD Pass” is green. Phone Test Mode Scenario Item (2) Sound Order Description 1. Sound On Ringtone (MP3) is played regularly 2. IF OK, tab “LSK” Button. It means “PASS” Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes Press “LSK” button (Left top Key) Move to next step - 153 - LGE Internal Use Only 11. TEST ALONE wG{GtGz Item (3) Vibrator Test Order Description 1.Vibrator On 2. IF OK, tab “LSK” Button. It means “PASS” Press “LSK” button (Left top Key) Move to next step wG{GtGz Item (4) Slide On/Off Test Order Description 1.Move Slide Up and Down Slide UP status 2. IF OK, tab “LSK” Button. It means “PASS” LGE Internal Use Only Slide Down status Press “LSK” button (Left top Key) Move to next step` - 154 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 11. TEST ALONE wG{GtGz Item (5) Camera Test Order Description 1. Camera Off 2. Camera Auto On ( Preview ) 3. Photo Shot by press “OK” key 4. Photo Save 5. Record video 6. Video Save 7. Call Photo If OK , Press “LSK” key (Left top Key) 8. Call Video 9. Preview 10. IF OK, tab “LSK” Button. It means “PASS” wG{GtGz Item (6) Loopback Test Order Description 1.Loopback On 2. Speak something 3. After 2 Sec, listen the voice 4. IF OK, tab “LSK” Button. It means “PASS” Press “LSK” button (Left top Key) TEST END 5. The TEST END Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 155 - LGE Internal Use Only LGE Internal Use Only - 156 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 12. EXPLODED VIEW & REPLACEMENT PART LIST 12.1 EXPLODED VIEW ACGT00 ACGU00 SURY00 SACY00 SVLM00 MCCH00 AHFY00 GMEY01 GMEY02 SAEY00 ADCA01 ABFZ01 ABGZ01 ACGK00 ACGA00 ACGM00 SAFY00 MBJZ00 MCBA01 GMEY00 ABFZ00 GMEY01 SVCY00 ABGZ00 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes ADCA00 SPKY00 SUMY00 MCBA00 SNGF00 - 157 - SBPL00 Location ACGA00 SBPL00 ABFZ00 ACGM00 SNGF00 MBJZ00 GMEY00 ABGZ00 ABGZ01 ACGT00 AHFY00 SURY00 ABFZ01 ACGK00 ACGU00 GMEY01 GMEY02 MCCH00 SACY00 SAEY00 ADCA01 SVLM00 SAFY00 SVCY00 SPKY00 MCBA00 ADCA00 MCBA01 SUMY00 Description Cover Assembly,Battery Mobile Phone Battery Li-Ion Bracket Assembly Cover Assembly,Rear Antenna,Helical Button Screw,Machine Button Assembly Button Assembly Cover Assembly,Upper HINGE ASSY Receiver BRACKET ASSY Cover Assembly,Front Cover Assembly,Lower Screw,Machine Screw,Machine Cap,Screw PCB Assembly,Flexible PCB Assembly,Keypad Dome Assembly,Metal LCD,Module-TFT PCB Assembly,Main Camera Module PCB,Sidekey Can,Shield Dome Assembly,Metal Can,Shield Microphone,Condenser LGE Internal Use Only LGE Internal Use Only - 158 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 12. EXPLODED VIEW & REPLACEMENT PART LIST 12.2 Replacement Parts Level LocationNo. 1 Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Description PartNumber Spec AAD000000 Addition Assembly - AAAY0524401 LG-C320 BOOWA ZZ:Without Color - Remark 2 ACGA00 Cover Assembly,Battery - ACGA0048201 LG-C320i IDNWA WA:White - 3 MCJA00 Cover,Battery MCJA0120401 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 3 MPBN00 Damper,Speaker MPBN0093201 COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , , 2 MFL053800 Manual,Operation MFL67003501 COMPLEX LGC320.ABOOWA ZZ:Without Color LGC320 manual for BOO 1 AGF000000 Package Assembly - AGF75960001 LGC320.ABOOWA ZZ:Without Color LGC320 BOO(TR3/STD UB/1160*1160 Pallet/600ea) 2 MAY084000 Box,Unit MAY64811601 COMPLEX LGC320.ABOOWA ZZ:Without Color LGC320 BOO(TR3 STD UB) 2 MAF086500 BAG,VINYL(PE) MBAD0005204 LG-LX260 SPRAG AG,ZZ,COMPLEX, (empty), , , , , 2 AGJ000000 PALLET ASSY - APLY0002405 KP110 OPTBK BK,ZZ,TR3 Australia(600ea) Pallet Assy 3 MBEC00 BOX,CARTON MBEC0002002 KG270 CIS BK,ZZ,BOX, TW 3 MCCL00 Cap,Box MCCL0000402 COMPLEX KG270 CIS ZZ:Without Color BOX,TW, PBO PBOTW 3 MPCY00 Pallet MPCY0015703 COMPLEX TU500 TELBK SV:Silver COMPLEX,(empty),1160,1160,126, 3 MSCA00 SLEEVE,BOX MSCA0000701 MG230d CLA TS,ZZ,BOX, TW 2 MAY047100 Box,Master MBEE0059803 COMPLEX KP100 GBRLA ZZ:Without Color - 2 MEZ003500 Label,Barcode MLAC0004541 COMPLEX HB620 KPNBK ZZ:Without Color - 2 MEZ047200 LABEL,MASTER BOX MLAJ0004402 CG300 CGR DG,ZZ,LABEL,MASTER BOX(for CGR TDR 2VER. mbox_label) 2 MEZ000000 LABEL MLAZ0050901 KU990 GBRBK BK,ZZ,PRINTING, (empty), , , , , - APEY0988401 LG-C320 BOOWA WA,ZZ, MLAA0062311 COMPLEX KB770 DEUBK ZZ:Without Color - 1 2 APEY00 PHONE MEZ002100 Label,Approval 2 ACGY00 COVER ASSY,EMS - ACGY0088801 LG-C320 BOOWA WA,ZZ, 3 ABFZ00 Bracket Assembly - ABFZ0028101 LG-C320 BOOWA ZZ:Without Color - 4 MEV000000 Insulator MIDZ0281601 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), , ,,, 4 MCQ049800 Damper,Motor MPBJ0079001 COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , , 4 MJN000000 Tape MTAZ0358201 COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , , 4 MCQ015700 Damper,Connector MPBU0114101 COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , , Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 159 - LGE Internal Use Only 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 3 4 ACGM00 Description Cover Assembly,Rear MJN061100 Tape,Protect PartNumber Spec - ACGM0168401 LG-C320i IDNWA ZZ:Without Color - MJN67687301 COMPLEX LGC320I.AIDNWA GN:Green - 4 MBJZ00 Button MBJZ0041901 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 4 MCCE00 Cap,Receptacle MCCE0061601 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 4 MCJN00 Cover,Rear MCJN0127401 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 4 MDAY00 Decor MDAY0086001 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 4 MLAB LABEL,A/S MLAB0001102 C2000 CGRSV SV,WA,C2000 USASV DIA 4.0 4 MPBJ00 Damper,Motor MPBJ0078101 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 4 MPBN00 Damper,Speaker MPBN0091501 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 4 MPBT00 Damper,Camera MPBT0098901 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 4 MPBZ00 Damper MPBZ0337301 COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , , 4 MTAK00 Tape,Camera MTAK0041901 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 4 MWAE00 Window,Camera MWAE0065101 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 3 GEMY00 Screw,Machine GMEY0010601 GMEY0010601 BH + 1.4mM 2.5mM MSWR FZB N - KUMGANG SCREW CO., LTD 3 ACGQ00 Cover Assembly,Slide - ACGQ0056601 LG-C320 BOOWA WA:White - 4 ABGZ00 Button Assembly ABGZ0006901 LG-C320i IDNWA ZZ:Without Color MAIN 4 ABGZ01 Button Assembly ABGZ0007001 LG-C320i IDNWA ZZ:Without Color SUB 4 ACGT00 Cover Assembly,Upper - ACGT0009101 LG-C320i IDNWA ZZ:Without Color LG-C320i IDNWA 5 AJX00 Window Assembly,LCD - AJX73205001 LGC320.ABOOWA ZZ:Without Color - MWAC0151901 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 6 MKC043300 Window,LCD 5 MCJX00 Cover,Upper - MCJX0011301 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 6 MICE00 INSERT,NUT MICE0016901 MECH_COMMON ZY,ZZ,PRESS, STS, , , , , 5 MFBZ00 Filter MFBZ0025001 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 5 MPBG00 Damper,LCD MPBG0113001 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 5 MTAD00 Tape,Window MTAD0133501 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 5 MTAZ TAPE MTAZ0113701 LG-KV5900 BK,ZZ,20X7 4 MJN061101 Tape,Protect MTAB0440401 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), , ,,, 4 MJN061100 Tape,Protect MTAB0423001 COMPLEX LG-C320i IDNWA ZZ:Without Color - 4 MJN061102 Tape,Protect MTAB0422301 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), AHFY0002101 LG-MN240 MTP LS,ZZ,Slide 4 AHFY00 LGE Internal Use Only HINGE ASSY - 160 - Remark Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec Remark 4 ABFZ01 BRACKET ASSY - ABFZ0023401 LG-MN240 MTP LS,ZZ, 5 MBFZ00 BRACKET MBFZ0043001 LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , , 5 MTAB00 TAPE,PROTECTION MTAB0381101 LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , , 4 ACGK00 Cover Assembly,Front - ACGK0169801 LG-C320i IDNWA ZZ:Without Color LG-C320i IDNWA 5 MCJK00 Cover,Front - MCJK0135101 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 6 MICE00 INSERT,NUT MICE0016903 MECH_COMMON ZY,ZZ,PRESS, STS, , , , , 5 MPBZ01 Damper MPBZ0320601 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 5 MPBZ00 Damper MPBZ0320801 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 5 MPBZ02 Damper MPBZ0366401 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 4 ACGU00 Cover Assembly,Lower - ACGU0007201 LG-C320i IDNWA ZZ:Without Color LG-C320i IDNWA 5 MCJY00 Cover,Lower MCJY0008701 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 5 MMAA00 MAGNET,SWITCH MMAA0011201 LG-LU1600 LGTWW WW,ZZ,COMPLEX, (empty), , , , , 5 MPBZ01 PAD MPBZ0260601 LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , , 5 MPBZ PAD MPBZ0260901 LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , , 5 MPBZ02 Damper MPBZ0320401 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 4 GMEY01 Screw,Machine GMEY0017801 GMEY0017801 BH + 1.4mM 1.4mM MSWR FZB N - KUMGANG SCREW CO., LTD 4 GMEY02 Screw,Machine GMEY0019201 GMEY0019201 FH + 1.4mM 1.8mM SWCH FZW N N KUMGANG SCREW CO., LTD 4 MCCH00 Cap,Screw MCCH0165101 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 4 MEV000002 Insulator MEV63651701 COMPLEX LGC320.ABOOWA BL:Blue insulator, FPCB 4 MDS000000 Gasket MGAZ0112501 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 4 MEV000001 INSULATOR MIDZ0259401 LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , , 4 MCQ000000 Damper MPBZ0357401 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), , ,,, 6 MJN000000 Tape MTAZ0368001 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), , ,,, 6 MCQ015700 Damper,Connector MPBU0113901 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), , ,,, ADCA0118401 LG-C320i IDNWA ZZ:Without Color LG-C320i IDNWA MPBZ0349901 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), , ,,, 6 5 ADCA01 Dome Assembly,Metal MCQ000000 Damper 5 ACKA00 Can Assembly,Shield - ACKA0035801 LG-C320i IDNWA ZZ:Without Color - 6 MCBA00 Can,Shield MCBA0086901 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), MIDZ0284101 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty), 5 MEV000000 Insulator Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 161 - LGE Internal Use Only 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec 5 ADCA00 Dome Assembly,Metal - ADCA0118501 LG-C320i IDNWA ZZ:Without Color MAIN 6 MPBZ00 PAD MPBZ0337101 LG-C320i IDNWA WA,ZZ,COMPLEX, (empty), , , , , 5 MPBU00 Damper,Connector MPBU0113801 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), , ,,, MLAZ0038301 LG-VX6000 SV,ZZ,PID Label 4 Array MCBA0059201 COMPLEX GD350 CLP ZZ:Without Color - 5 6 MEZ000000 LABEL MCBA01 LGE Internal Use Only Can,Shield - 162 - Remark Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 12. EXPLODED VIEW & REPLACEMENT PART LIST 12.2 Replacement Parts Level LocationNo. Description 4 EBR070500 PCB Assembly,Flexible 5 EBR070400 6 EAX010700 PCB,Flexible 6 EBR070200 7 CN101 7 S101 6 EBR070300 4 4 4 6 Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC PartNumber Spec Remark - EBR72655001 LGC320.ABOOWA FLEXIBLE 1.0 - EBR72681501 LGC320.ABOOWA FLEXIBLE 1.0 SPCY0247101 SPCY0247101 LG-C320i IDNWA,FLEXIBLE,E,POLYI,0.15 mm,DOUBLE SI FLEX CO., LTD PCB Assembly, Flexible,SMT Bottom - EBR72655201 LGC320.ABOOWA FLEXIBLE 1.0 Connector,BtoB ENBY0052901 55909-0274 20P 0.40MM STRAIGHT MALE SMD R/TP 1.5M HANKOOK MOLEX Socket,Card ENSY0023601 SCHA4B0402 Micro-SD 8P ANGLE SMD R/TP - ALPS ELECTRIC KOREA CO.,LTD. PCB Assembly, Flexible,SMT Top EBR72681601 LGC320.ABOOWA FLEXIBLE 1.0 EAU010000 Motor,DC SJMY0007104 3V 80mA 0A 12KRPM 0RPM 0SEC 0GF.CM 0OHM EAB010100 Speaker Module SUSY0027617 SI-C320-P LG-C320i IDNWA BUJEON ELECTRONICS CO., LTD SNGF0064202 ACD-00094 3.0,-2 dBd,GSM Quad carrier type,QUAD,-2.0,50,3.0 MOBITECH CORPORATION BFAA0127401 BFAA0127401 ; ,BLACK , , , BLACK , , , NISSHA PRINTING CO., LTD SNGF00 PCB Assembly, Flexible,SMT Antenna,Helical RAB040100 Film,Inmold 4 SURY00 Receiver SURY0010114 BWBR1207L-04B-P 30mW 32OHM 105DB 0HZTO0HZ WIRE BUJEON ELECTRONICS CO., LTD 4 SACY00 PCB Assembly,Flexible - SACY0127201 LG-C320 BOOWA FLEXIBLE 1.0 5 SACE00 PCB Assembly, Flexible,SMT - SACE0114501 LG-C320 BOOWA FLEXIBLE 1.0 SPCY0246901 SPCY0246901 LG-C320i IDNWA,FLEXIBLE,D,POLYI,.12 mm,DOUBLE SI FLEX CO., LTD 6 EAX010700 PCB,Flexible 6 SACC00 PCB Assembly, Flexible,SMT Bottom SACC0085002 LG-C320 BOOWA FLEXIBLE 1.0 6 SACD00 PCB Assembly, Flexible,SMT Top - SACD0098702 LG-C320 BOOWA FLEXIBLE 1.0 SEVY0005201 EVLC5S02050 5.5V 0% 50F 1.0*0.5*0.6 - SMD R/TP AMOTECH CO., LTD. 7 C101,C102 Varistor 7 FB101, FB102 Inductor,Multilayer,Chip ELCH0004727 1005GC2TR10J00 100NH 5% 0V 100mA 2.3OHM 600MHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 7 CN102 Connector,BtoB ENBY0040401 GB042-50P-H10-E3000 50P 0.4MM STRAIGHT PLUG SMD R/TP 1M - LS Mtron Ltd. 7 VA101, VA102 Varistor SEVY0003901 EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP AMOTECH CO., LTD. Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 163 - LGE Internal Use Only 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec Connector,BtoB ENBY0042601 GB042-54P-H10 54P 0.40MM STRAIGHT MALE SMD R/TP 1M - LS Mtron Ltd. C103 Capacitor,Ceramic,Chip ECCH0000198 CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD. 7 M101 Capacitor Assembly SMZY0023501 PAS311HR-VG1 3.8 Backup Capacitor 0.03F,Module Assembly, KOREA TAIYO YUDEN.CO., LTD. 7 ZD101 Diode,TVS EDTY0008601 PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1 PROTEK DEVICES INC. 7 R101 Resistor,Chip ERHY0000254 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 4 SAEY00 PCB Assembly,Keypad - SAEY0074701 LG-C320 BOOWA KEYPAD 1.0 5 EBR070900 PCB Assembly, Keypad,Insert - EBR72665301 LGC320.ABOOWA KEYPAD 1.0 5 SAEE PCB Assembly, Keypad,SMT - SAEE0039402 LG-C320 BOOWA KEYPAD 1.1 6 SAEC PCB Assembly, Keypad,SMT Bottom - SAEC0038302 LG-C320 BOOWA KEYPAD 1.0 7 CN103 7 7 R101,R102 Resistor,Chip ERHZ0000434 MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 7 C101,C102 Capacitor,Ceramic,Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C 1005 R/TP - TDK CORPORATION ENBY0040501 GB042-50S-H10-E3000 50P 0.4MM STRAIGHT SOCKET SMD R/TP 1M - LS Mtron Ltd. 7 CN101 Connector,BtoB 7 CN102 Connector,FFC/FPC/PIC ENQY0014901 7 R105,R106,R 107,R108,R1 Resistor,Chip 09,R110 GF032-35S-E2000 35P 0.30MM FPC STRAIGHT BOTH SMD R/TP LOCKING - LS Mtron Ltd. ERHZ0000402 MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 7 VA101, VA102 Varistor SEVY0003901 EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP AMOTECH CO., LTD. 6 SAED PCB Assembly, Keypad,SMT Top - SAED0037602 LG-C320 BOOWA KEYPAD 1.0 7 LD103, LD104, LD105, LD106, LD107, LD108 LED,Chip EDLH0014803 SSC-WH107 WHITE 2.7~3.1 20mA 100~230mcd x, y 64mW 1608 R/TP 2P - SEOUL SEMICONDUCTOR CO.,LTD 6 SPEY00 PCB,Keypad SPEY0068201 SPEY0068201 LG-C320i IDNWA,KEYPAD,D,FR-4,.8 mm,BUILD-UP 4 UNITECH PRINTED CIRCUIT BOARD CORP. 4 SVLM00 LCD,Module-TFT SVLM0038101 DM24-DSM04 Main,2.4,320*240,54.3*46.8*1.7t,262K,TFT,TM,S6D05A0,Landscape Type,16bit IF,For Bar Type Phone, LG Display Co. Ltd. 3 SAFY00 PCB Assembly,Main - SAFY0399101 LG-C320 MAIN 1.0 LGE Internal Use Only Remark - 164 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 4 5 SAFB00 Description PCB Assembly, Main,Insert RAA050100 RESIN,PC PartNumber Spec - SAFB0126901 LG-C320 BOOWA MAIN 1.1 BRAH0001301 UF-1060,; , , , ,[empty] Remark 5 SVCY00 Camera Module SVCY0026901 C2FK-H313A C2FK-H313A 2M FF, Hynix(1/5"), 7x7x4.1t, Socket LG Innotek.com 5 SPKY00 PCB,Sidekey SPKY0094301 SPKY0094301 LG-C320i IDNWA,SIDEKEY,C,POLYI,0.18 mm,DOUBLE SI FLEX CO., LTD 4 SAFF00 PCB Assembly, Main,SMT - SAFF0298001 LG-C320 MAIN 1.0 5 SAFC00 PCB Assembly, Main,SMT Bottom - SAFC0162201 LG-C320 BOOWA MAIN 1.2 6 S601 Card Socket ENSY0022201 CAM-H88 24,ETC,mm,7*7,1.3M (1/5") Socket Type MITSUMI ELECTRIC CO.,LTD. 6 L207 Inductor,Multilayer,Chip ELCH0004729 1005GC2T56NJ00 56NH 5% 0V 200mA 1.6OHM 900MHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 6 C103 Capacitor,Ceramic,Chip ECCH0000198 CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD. 6 C735 Capacitor,Ceramic,Chip ECCH0000110 MCH155A100D 10pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION 6 C120,C739 Capacitor,Ceramic,Chip ECCH0000112 MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 C301,C303,C 304,C404,C4 Capacitor,Ceramic,Chip 07 ECCH0000115 MCH155A220JK 22pF 5% 50V NP0 -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION 6 C110 Capacitor,Ceramic,Chip ECCH0000117 CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C 1005 R/TP 0.5 SAMSUNG ELECTRO-MECHANICS CO., LTD. 6 C143 Capacitor,Ceramic,Chip ECCH0000195 GRM1555C1H3R9C 3.9pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - MURATA MANUFACTURING CO.,LTD. C417,C525 Capacitor,Ceramic,Chip ECCH0000120 MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA CORPORATION Capacitor,Ceramic,Chip ECCH0000137 C1005X7R1H331KT000F 0.33nF 10% 50V X7R -55TO+125C 1005 R/TP - TDK KOREA COOPERATION Varistor SEVY0003901 EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP AMOTECH CO., LTD. 6 6 C708 6 VA101, VA102 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 165 - LGE Internal Use Only 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec 6 C208,C211,C 212,C213,C2 14,C215,C21 6,C217,C218 ,C219,C220, C221,C222,C 223,C229,C2 Capacitor,Ceramic,Chip 31,C235,C23 6,C305,C306 ,C307,C308, C309,C310,C 605,C606,C7 01,C709 ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -55TO+85C 0603 R/TP - TDK CORPORATION 6 C101,C102 Capacitor,Ceramic,Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C 1005 R/TP - TDK CORPORATION 6 C105,C117,C 118,C122,C1 Capacitor,Ceramic,Chip 30,C135,C51 9,C520,C521 ECZH0000830 C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA COOPERATION 6 C230,C233 Capacitor,Ceramic,Chip ECCH0006201 C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -55TO+85C 1608 R/TP - TDK CORPORATION 6 C121,C225,C 246,C252,C2 Capacitor,Ceramic,Chip 54,C255 ECCH0007803 CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD. 6 C226,C227,C 237,C244,C2 Capacitor,Ceramic,Chip 57,C258,C25 9 ECCH0007802 CV105X5R475M10AT 4.7uF 20% 10V X5R -55TO+85C 1608 R/TP KYOCERA CORP. 6 C234,C240,C Capacitor,Ceramic,Chip 241,C243 ECCH0009103 C0603C0G1H101JT00NN 100pF 5% 50V X7R -55TO+125C 0603 R/TP - TDK CORPORATION 6 C242,C253,C 256,C298,C7 Capacitor,Ceramic,Chip 21,C725,C72 6 ECCH0009106 C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C 0603 R/TP TDK CORPORATION 6 C127 Capacitor,Ceramic,Chip ECCH0009110 C0603X7R0J223KT 22nF 10% 6.3V X7R -55TO+125C 0603 R/TP TDK CORPORATION 6 C129 Capacitor,Ceramic,Chip ECCH0009226 GRM0335C1E390J 39pF 5% 25V X7R -55TO+125C 0603 R/TP MURATA MANUFACTURING CO.,LTD. 6 C128 Capacitor,Ceramic,Chip ECCH0009228 GRM033R61A472K 4700pF 10% 25V X5R -55TO+85C 0603 R/TP MURATA MANUFACTURING CO.,LTD. 6 C722,C723 Capacitor,Ceramic,Chip ECCH0009514 MCH032A(AN)100DK 10pF 0.5PF 25V X7R -55TO+125C 0603 R/TP - ROHM. 6 C602,C603 Capacitor,Ceramic,Chip ECCH0010501 GRM1555C1H7R5D 7.5pF C0G TYPE(No X7R) MURATA MANUFACTURING CO.,LTD. 6 C412,C414,C Capacitor,TA,Conformal 415 ECTH0002002 F981A336MSA 33F 20% 10V 3.3A -55TO+85C 6OHM 2.2X1.1X1.1MM - SMD R/TP NICHICON CORPORATION, EAST JAPAN SALES OFFICE LGE Internal Use Only - 166 - Remark Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec Remark 6 C526 Capacitor,TA,Conformal ECTH0004807 TCM1A106M8R 10F 20% 10V 500mA -55TO+85C 15OHM - - SMD R/TP ROHM. 6 C113 Capacitor,Ceramic,Chip ECZH0000802 C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP TDK KOREA COOPERATION C232,C260,C Capacitor,Ceramic,Chip 267 ECCH0000122 MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION Capacitor,Ceramic,Chip ECZH0000816 C1005C0G1H120JT000F 12pF 5% 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA COOPERATION C102,C104,C Capacitor,Ceramic,Chip 107 ECCH0000701 C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK CORPORATION Diode,TVS EDTY0009101 ESD9X5.0ST5G 5V 6.2 12.3V 8.7A 107W SOD528 R/TP 2P 1 ON SEMICONDUCTOR 6 6 6 C740 6 VA504, ZD606, ZD607 6 C126 Capacitor,Ceramic,Chip ECZH0000846 C1005C0G1H8R2CT000F 8.2pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA COOPERATION 6 C114 Capacitor,Ceramic,Chip ECZH0001002 C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA COOPERATION 6 C706,C707 Capacitor,Ceramic,Chip ECZH0001210 C1005Y5V1A474ZT000F 470nF -20TO+80% 10V Y5V -30TO+85C 1005 R/TP - TDK KOREA COOPERATION 6 C134,C312,C 401,C409,C4 Capacitor,Ceramic,Chip 11 ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005 R/TP - TDK KOREA COOPERATION 6 C204,C261,C 262,C263,C2 64,C266,C27 Capacitor,Ceramic,Chip 6,C299,C302 ,C405,C413 ECZH0003103 GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP - MURATA MANUFACTURING CO.,LTD. Diode,TVS EDTY0010101 ESD9B5.0ST5G ESD9B5.0ST5G,SOD-923,5 V,300 mW,R/TP,15pF SCG HONG KONG SAR LTD. C403,C408 Capacitor,Ceramic,Chip ECZH0003503 GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608 R/TP MURATA MANUFACTURING CO.,LTD. Capacitor,Ceramic,Chip ECZH0003504 GRM188R71E104K 100nF 10% 25V X7R -55TO+125C 1608 R/TP MURATA MANUFACTURING CO.,LTD. Filter,Bead SFBH0000903 HB-1M1005-601JT 600 ohm 1.0*0.5*0.5 SMD R/TP 2P CERATECH CORPORATION 6 C806,C807 Capacitor,Ceramic,Chip ECZH0004402 MCH153C104ZK 0.1uF 10% 16V NP0 -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION 6 C101,C102 Varistor SEVY0005201 EVLC5S02050 5.5V 0% 50F 1.0*0.5*0.6 - SMD R/TP AMOTECH CO., LTD. 6 6 ZD305, ZD306, ZD307, ZD308, ZD310, ZD311 6 C402 6 FB501, FB703 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 167 - LGE Internal Use Only 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 VA508, VA509, VA601, VA602, VA603, VA604 Description Varistor PartNumber Spec SEVY0003801 EVLC18S02015 18V 0% 15F 1.0*0.5*0.6 NONE SMD R/TP AMOTECH CO., LTD. 6 C228,C245,C Capacitor,Ceramic,Chip 734 ECZH0025920 GRM033R71C102K 1nF 10% 16V X7R -55TO+125C 1608 R/TP MURATA MANUFACTURING CO.,LTD. 6 C109,C705,C Capacitor,Ceramic,Chip 742 ECZH0000813 C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C 1005 R/TP TDK KOREA COOPERATION 6 D202 Diode,Switching EDSY0011901 SDB310Q 340mV 30V 200mA 1A 0SEC 150mW EMD2 R/TP 2P 1 AUK CORP 6 D201 Diode,Switching EDSY0017702 SDB0530 360mV 30V 500mA 3A 0SEC 200mW SOD323 R/TP 2P 1 AUK CORP 6 ZD101 Diode,TVS EDTY0008601 PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1 PROTEK DEVICES INC. ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP MURATA MANUFACTURING CO.,LTD. Inductor,Multilayer,Chip ELCH0001444 0402AF-101XJEW 0402AF-101XJLW,100 nH,J,1005,R/TP,chip coil COILCRAFT SINGAPORE PTE LTD. 6 L101,L102 Inductor,Multilayer,Chip ELCH0004701 1005GC2T12NJ00 12H 5% 0V 250mA 0.48OHM 2.1GHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 6 L109,L111 Inductor,Multilayer,Chip ELCH0004705 1005GC2T8N2J00 8.2NH 5% 0V 250mA 0.37OHM 2.8GHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 6 L107,L108, Inductor,Multilayer,Chip L115,L116 ELCH0004708 1005GC2T2N7S00 2.7NH 5% 0V 200mA 1.3OHM 1GHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. Inductor,Multilayer,Chip ELCH0004721 1005GC2T2N2S00 2.2NH 5% 0V 300mA 0.13OHM 7GHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. L114,L204, Inductor,Multilayer,Chip L205 ELCH0004715 1005GC2T27NJ00 27NH 5% 0V 200mA 0.9OHM 1.4GHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 6 6 6 6 C207,C209,C 210,C275,C4 Capacitor,Ceramic,Chip 06,C501,C50 2 L501 L110 6 FB101, FB102 Inductor,Multilayer,Chip ELCH0004727 1005GC2TR10J00 100NH 5% 0V 100mA 2.3OHM 600MHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 6 L118 Inductor,Multilayer,Chip ELCH0004730 1005GC2T33NJ00 33NH 5% 0V 200mA 1OHM 1.3GHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. L801,L802, L803,L804, Inductor,Multilayer,Chip L805,L806 ELCH0005019 HK100568NJ 68NH 5% 0V 8A 1.2GOHM 700mHZ 180m NON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN CO.,LTD Inductor,Wire Wound, chip ELCP0008013 MIPSZ2012D2R2 MIPSZ2012D2R2,2.2 uH,N,2.0X1.2X1.0,R/TP FDK CORPORATION. L201,L202, Inductor,Wire Wound, L203 chip ELCP0008014 MIPSZ2012D4R7 MIPSZ2012D4R7,4.7 uH,N,2.0X1.2X1.0,R/TP FDK CORPORATION. ENBY0053001 51338-0274 20P 0.40MM STRAIGHT FEMALE SMD R/TP 1.5M HANKOOK MOLEX 6 6 6 6 L208 CN803 LGE Internal Use Only Connector,BtoB - 168 - Remark Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 6 J501 Description Jack,Phone C201,C205,C Capacitor,Ceramic,Chip 206,C311 PartNumber Spec Remark ENJE0007601 KJA-PH-0-0176 1P 4P ANGLE R/TP 4mM BLACK 6P - KSD CO., LTD ECCH0005604 GRM188R60J106M 10000000 pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATA MANUFACTURING CO.,LTD. 6 CN401 connector,I/O ENRY0008801 GU073-5P-SD-E1500 GU073-5P-SD-E1500,5,mm,ANGLE LS Mtron Ltd. 6 J301 Card Socket ENSY0025901 GCA26A-8S-H16-M-E1000 SIM 8P ANGLE SMD R/TP - LS Mtron Ltd. 6 SW101 Connector,RF ENWY0008701 MS-156C NONE STRAIGHT SOCKET SMD T/REEL AU 50OHM 400mDB HIROSE KOREA CO.,LTD 6 CN402 Connector,Terminal Block ENZY0028601 04-9248-003-017-829+ 3P 2.50MM STRAIGHT SMD R/TP KYOCERA ELCO KOREA SALES CO.,LTD. 6 Q501 FET EQFP0007601 KTJ6131E P-CHANNEL MOSFET -30V +-20 -0.05A 20OHM 100mW ESM R/TP 3P KEC CORPORAITION ECCH0007804 CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD. 6 C251,C720,C Capacitor,Ceramic,Chip 724 6 R703 Resistor,Chip ERHY0000128 MCR01MZP5F1502 15KOHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R406 Resistor,Chip ERHY0000185 MCR01MZP5F8200 820OHM 1% 1/16W 1005 R/TP - ROHM. 6 R110,R111 Resistor,Chip ERHY0000241 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R307,R308,R 309,R310,R3 Resistor,Chip 11 ERHY0000275 MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R205 Resistor,Chip ERHY0003201 MCR01MZP5F1001 1KOHM 1% 1/16W 1005 R/TP - ROHM. 6 R262 Resistor,Chip ERHY0009505 MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP - ROHM Semiconductor KOREA CORPORATION ECZH0000803 C1005C0G1H020CT000F 2pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA COOPERATION 6 C115,C265 Capacitor,Ceramic,Chip 6 R207 Resistor,Chip ERHZ0000486 MCR01MZP5J473 47KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R107 Resistor,Chip ERHY0009586 MCR006YZPF2201 2.2KOHM 1% 1/20W 0603 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R263 Resistor,Chip ERHY0024201 MCR01MZP5F6041 6040 ohm,1/16W,F,1005,R/TP ROHM. 6 R404 Resistor,Chip ERHZ0000201 MCR01MZP5F1000 100OHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R201,R260 Resistor,Chip ERHZ0000204 MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R510,R511 Resistor,Chip ERHZ0000205 MCR01MZP5F1004 1MOHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 L103,L104, Inductor,Multilayer,Chip L117 ELCH0004706 1005GC2T10NJ00 10NH 5% 0V 250mA 0.42OHM 2.5GHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 169 - LGE Internal Use Only 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 6 6 Description PartNumber Spec ERHZ0000206 MCR01MZP5F10R0 10OHM 0.1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION Resistor,Chip ERHZ0000213 MCR01MZP5F1203 120KOHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION R103,R104,R Resistor,Chip 112,R113 ERHZ0000219 MCR01MZP5F1500 150OHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION R601,R602 Resistor,Chip R807 6 R405 Resistor,Chip ERHZ0000236 MCR01MZP5F2001 2KOHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R403 Resistor,Chip ERHZ0000318 MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R272,R302,R 303,R304,R5 Resistor,Chip 01 ERHZ0000405 MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R282,R402 Resistor,Chip ERHZ0000406 MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R101,R102 Resistor,Chip ERHZ0000434 MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION Resistor,Chip ERHZ0000438 MCR01MZP5J203 20KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R219,R266,R 267,R268,R2 Resistor,Chip 69,R401,R50 2 ERHZ0000443 MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R808,R809 Resistor,Chip ERHZ0000465 MCR01MZP5J332 3.3KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R102,R114 Resistor,Chip ERHZ0000473 MCR01MZP5J390 39OHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION ECCH0000143 MCH155CN102KK 1nF 10% 50V X7R -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION ERHZ0000484 MCR01MZP5J471 470OHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 6 6 R301 C119 Capacitor,Ceramic,Chip R264,R265 Resistor,Chip 6 R273 Resistor,Chip ERHZ0000490 MCR01MZP5J510 51OHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 U802 IC,Bus Controller EUSY0300008 PP2106M3 1.8/2.6V 1mA - MLF R/TP 28P - G5 CORPORATION 6 U803 IC,Analog Switch EUSY0347001 DG2735DN-T1-E4 MiniQFN-10L ,10 PIN,R/TP ,1.8X1.4X0.55,0.6 Dual SPDT Analog Switch ,; ,IC,Analog Switch VISHAY INTERTECHNOLOGY ASIA PTE LTD 6 U301 IC,MCP,NAND EUSY0347506 H8BCS0SI0BAR-46M NAND/2G SDRAM/1G 1.7VTO1.9V 14.0x10.0x1.2 TR 149P - - - HYNIX SEMICONDUCTOR INC. 6 U501 IC,LDO Voltage Regulator EUSY0355501 RP103K181D-TR-F 1.7V TO 5.25V 1.85V 400mW DFN R/TP 4P RICOH COMPANY, LTD. 6 U701 Module,Assembly EUSY0385901 TEA5991UK TEA5991_UK,WL-CSP(BSC),20,R/TP,FM Tuner (RDS),2.6*2.6*0.64 ST-Ericsson Asia Pacific Pte Ltd LGE Internal Use Only - 170 - Remark Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec Remark 6 U401 IC,Voltage Reference EUSY0410801 RT9524 DFN,10,R/TP,DFN Cal Test Mode Single Charger IC for Micro USB,IC,ChargerIC,Charger RICHTEK TECHNOLOGY CORP. 6 U703 IC,Bluetooth EUSY0418701 BCM2070B2KUBXG 2.3VTO5.5V 158.4mW WLBGA R/TP 42P BROADCOM ASIA DISTRIBUTION PTE LTD ELCH0004703 1005GC2T1N0S00 1005GC2T1N0S00,1 nH,S ,1005 ,R/TP , PILKOR ELECTRONICS LTD. 6 L112,L119 Inductor,Multilayer,Chip 6 U201 IC,Digital Baseband Processor,GSM EUSY0423201 ESC6270 0VTO0V 0W BGA R/TP 424P - QUALCOMM INCORPORATED. 6 IC401 IC,Analog Multiplexer EUSY0424801 RT8963WS WLCSP,20,R/TP,MUIC-Basic,USB HS,UART,Audio,IC,Analog MultiplexerIC,Analog Multiplexer RICHTEK TECHNOLOGY CORP. 6 X702 Crystal EXXY0024401 TSX-3225 26MHZ 26MHZ 10PPM 10pF NA SMD R/TP SEIKO EPSON CORP 6 X202 Crystal EXXY0025101 DSX321G - 10PPM - - - SMD P/TP DAISHINKU CORPORATION. 6 R261 Resistor,Chip ERHZ0000222 MCR01MZP5F1503 150KOHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R281 Resistor,Chip ERHY0000279 91K ohm,1/16W,J,1005,R/TP 6 X201 Crystal EXXY0026901 Q13FC1350000300 32.768KHZ 20PPM 0F NONE SMD R/TP EPSON TOYOCOM CORP 6 C239 Capacitor,Ceramic,Chip ECZH0001116 C1005X7R1H271KT000F 270pF 10% 50V X7R -55TO+125C 1005 R/TP - TDK KOREA COOPERATION SAFO0000501 AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM_1005_DNI 6 R702,R705,R 706,R707,R7 08,R709,R71 PCB ASSY,MAIN,PAD 0,R711,R712 SHORT ,R713,R714, R715 SAFP0000401 LG-LU3000 LGTBK,MAIN,A, 6 R109,R283,R Wire Pad,Short 803 SAFP0000501 LG-VS760 VRZ ELCH0004710 1005GC2T15NJ00 15NH 5% 0V 250mA 0.53OHM 2GHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 6 6 R284,R814 Wire Pad,Open L1113,L206 Inductor,Multilayer,Chip 6 PT201 Thermistor SETY0007301 NCP15WF104F03RC NTC,100000 ohm,SMD,4250K+/1%,100K,1%,0.1mA,4250K+/-1%,SMD,R/TP MURATA MANUFACTURING CO.,LTD. 6 VA201 Varistor SEVY0001001 EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMD R/TP AMOTECH CO., LTD. 6 C137 Capacitor,Ceramic,Chip ECCH0000196 MCH155A0R75C 0.75pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION 6 VA401 Varistor SEVY0003601 ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE SMD R/TP INNOCHIPS TECHNOLOGY 6 VA264, VA265 Varistor SEVY0005403 ICVS0518270FR 18V 0% 27F 1.0X0.5X0.55 NONE SMD R/TP INNOCHIPS TECHNOLOGY Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 171 - LGE Internal Use Only 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec 6 FL101 Filter,Separator,FEM SFAY0011101 D5008 - - - D5008,850.900 ,1800.1900 ,3.8 dB,4.1 dB, dB, dB,4532 ,4.5X3.2 Size Quad Band FEM EPCOS PTE LTD. 6 FB503, FB504, FB505 Filter,Bead SFBH0008102 BLM15HD182SN1 1800 1.0x0.5x0.5MM SMD R/TP 2P MURATA MANUFACTURING CO.,LTD. 6 FL701 Filter,Ceramic SFCY0000901 LFB212G45SG8A166 BPF 2.45KHZ 100Hz SMD R/TP 4P MURATA MANUFACTURING CO.,LTD. 6 FL806, FL807, FL808, FL809 Filter,EMI/Power SFEY0012401 ICVE10054E250R101FR ESD/EMI 0HZ 25pF 0H SMD R/TP INNOCHIPS TECHNOLOGY 6 FL802, FL803, FL804, FL805, FL810, FL811 Filter,EMI/Power SFEY0013201 EVRC14S03Q030100R ESD/EMI 0HZ 15pF 0H SMD R/TP AMOTECH CO., LTD. 6 FL601, FL602, FL603 Filter,EMI/Power SFEY0013701 EVRC18S03Q015100R ESD/EMI 330HZ 15F 0H SMD R/TP AMOTECH CO., LTD. 6 FL401 Filter,EMI/Power SFEY0015301 NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TP MURATA MANUFACTURING CO.,LTD. 6 U101 IC,Power Amplifier SMPY0019101 SKY77336 SKY77336,dBm,%,A,dBc,dB,5x5,SMD,Polar Edge for QCT SKYWORKS SOLUTIONS INC. 6 SUMY00 Microphone,Condenser SUMY0010610 SPM0410LR5H-QB SPM0410LR5H-QB,UNIT,42 dB,4.72*3.76*1.25,mems TDMA Improve KNOWLES ACOUSTICS 5 SAFD00 PCB Assembly, Main,SMT Top - SAFD0159501 LG-C320 BOOWA MAIN 1.0 6 EAX010000 PCB,Main SPFY0235601 SPFY0235601 FR-4 Staggered via STAGGERED-10 0.8 LG-C320i IDNWA,MAIN,D,FR-4,0.8 mm,STAGGERED-10,MAIN UNITECH PRINTED CIRCUIT BOARD CORP. 6 C417,C525 Capacitor,Ceramic,Chip ECCH0000120 MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA CORPORATION Capacitor,Ceramic,Chip ECCH0000198 CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD. 6 C207,C209,C 210,C275,C4 Capacitor,Ceramic,Chip 06,C501,C50 2 ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP MURATA MANUFACTURING CO.,LTD. 6 C251,C720,C Capacitor,Ceramic,Chip 724 ECCH0007804 CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD. 6 C103 LGE Internal Use Only - 172 - Remark Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec Remark 6 C208,C211,C 212,C213,C2 14,C215,C21 6,C217,C218 ,C219,C220, C221,C222,C 223,C229,C2 Capacitor,Ceramic,Chip 31,C235,C23 6,C305,C306 ,C307,C308, C309,C310,C 605,C606,C7 01,C709 ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -55TO+85C 0603 R/TP - TDK CORPORATION 6 C722,C723 Capacitor,Ceramic,Chip ECCH0009514 MCH032A(AN)100DK 10pF 0.5PF 25V X7R -55TO+125C 0603 R/TP - ROHM. 6 C105,C117,C 118,C122,C1 Capacitor,Ceramic,Chip 30,C135,C51 9,C520,C521 ECZH0000830 C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA COOPERATION 6 C134,C312,C 401,C409,C4 Capacitor,Ceramic,Chip 11 ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005 R/TP - TDK KOREA COOPERATION 6 C506,C507 Capacitor,Ceramic,Chip ECZH0001217 GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C 1005 BK-DUP - MURATA MANUFACTURING CO.,LTD. 6 C204,C261,C 262,C263,C2 64,C266,C27 Capacitor,Ceramic,Chip 6,C299,C302 ,C405,C413 ECZH0003103 GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP - MURATA MANUFACTURING CO.,LTD. 6 C508,C509 Capacitor,Ceramic,Chip ECZH0003126 GRM155R71A393K - - - - -55TO+125C - - - MURATA MANUFACTURING CO.,LTD. Capacitor,Ceramic,Chip ECZH0025916 GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C 0603 R/TP MURATA MANUFACTURING CO.,LTD. 6 C268 6 LD801, LD802 LED,Chip EDLH0013701 WHITE 2.9~3.2 20mA X(0.264~0.311) Y(0.248~0.315) 110mW 3.8*1.0*0.4t 3810 R/TP 2P - 6 CN801 Connector,BtoB ENBY0042701 GB042-54S-H10 54P 0.4MM STRAIGHT SOCKET SMD R/TP 1M LS Mtron Ltd. 6 CN260 Connector,BtoB ENBY0045201 AXT610124 10P 0.4MM STRAIGHT HEADER SMD R/TP 1M - BJ PANASONIC ELECTRONIC PARTS CO.,LTD 6 R101 Resistor,Chip ERHY0000254 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R105,R106,R 107,R108,R1 Resistor,Chip 09,R110 ERHZ0000402 MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R282,R402 Resistor,Chip ERHZ0000406 MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 173 - LGE Internal Use Only 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 Description R506,R507 Resistor,Chip PartNumber Spec ERHZ0000435 MCR01MZP5J200 20OHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 U601 IC,Charge Pump EUSY0344403 RT9396GQW QFN,24,R/TP,4CH+2LDO,IC,Sub PMICIC,Sub PMIC RICHTEK TECHNOLOGY CORP. 6 IC501 IC,Audio Sub System EUSY0403901 WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P - WOLFSON MICROELECTRONICS PLC 6 U801 Sensor,Accelerator EUSY0408901 S-5711ACDL 2.5 to 3.3 Y R/TP 4P - SEIKO INSTRUMENTS INC 6 R284,R814 Wire Pad,Open SAFO0000501 AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM_1005_DNI 6 R109,R283, Wire Pad,Short R803 SAFP0000501 LG-VS760 VRZ 6 VA101, VA102 Varistor SEVY0003901 EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP AMOTECH CO., LTD. 6 VA264, VA265 Varistor SEVY0005403 ICVS0518270FR 18V 0% 27F 1.0X0.5X0.55 NONE SMD R/TP INNOCHIPS TECHNOLOGY 6 FB501, FB703 Filter,Bead SFBH0000903 HB-1M1005-601JT 600 ohm 1.0*0.5*0.5 SMD R/TP 2P CERATECH CORPORATION 6 FB502 Filter,Bead SFBH0001501 HH-1M1608-121JT 120 ohm 1.6*0.8*0.8 SMD R/TP 2P CERATECH CORPORATION 6 FB507, FB508 Filter,Bead SFBH0009801 HH-1M1005-601JT 600Ohm 1.0 * 0.5 * 0.5 SMD P/TP 2P CERATECH CORPORATION LGE Internal Use Only - 174 - Remark Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 12. EXPLODED VIEW & REPLACEMENT PART LIST 12.3 Accessory Level LocationNo. 2 SBPL00 Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Description PartNumber Mobile Phone Battery LiSBPL0098901 Ion Spec Remark LGIP-430N-WW-LGC LGIP-430N-WW-LGC,3.7 V,900 mAh,1 CELL,PRISMATIC ,463450,innerpack, WW LG CHEMICAL 2 EAB010200 Earphone,Stereo SGEY0003744 EMB-LGE004MSKB 3mW 16OHM 115DB 85HZTO126HZ 1M BLACK 3.5 L TYPE STEREO 4POLE PLUG - CRESYN CO.,LTD 2 EAY060000 Adapters SSAD0033602 STA-U34AR STA-U34AR,100-240V,5060 Hz,5.1 V,0.7 A,C-Tick,ACDC ADAPTOR SUNLIN ELECTRONICS CO.,LTD Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 175 - LGE Internal Use Only
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2010:11:01 14:27:40+09:00 Creator Tool : Adobe InDesign CS2 (4.0) Format : application/pdf Title : C320_SVC ENG_101007.indd Producer : Adobe PDF Library 7.0 Trapped : False GTS PDFX Version : PDF/X-1:2001 GTS PDFX Conformance : PDF/X-1a:2001 Has XFA : No Page Count : 174 Creator : Adobe InDesign CS2 (4.0)EXIF Metadata provided by EXIF.tools