Lg C320 Users Manual C320_SVC ENG_101007

LG-C320 to the manual e3475751-5423-4144-b3a9-4de7607efb28

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Service Manual

Internal Use Only

Service Manual
LG-C320

Model : LG-C320

Date: October, 2010 / Issue 1.0

Table Of Contents
1. INTRODUCTION...................................................................5

4.12 Speaker/Speaker Phone path................................................73

1.1 Purpose................................................................................................ 5

4.13 Main microphone.......................................................................78

1.2 Regulatory Information................................................................ 5

4.14 Headset microphone.................................................................80

1.3 Abbreviations.................................................................................... 7

4.15 RF Component.............................................................................82
4.16 RF Path.............................................................................................83

2. PERFORMANCE....................................................................9

4.17 Trouble Shooting of GSM Part...............................................84

2.1 Product Name................................................................................... 9

4.18 Checking Bluetooth Block.......................................................91

2.2 Supporting Standard..................................................................... 9

4.19 Checking FM Radio Block........................................................96

2.3 Main Parts : GSM Solution............................................................ 9
2.4 HW Features.....................................................................................10
2.5 SW Features.....................................................................................12
2.6 HW SPEC. .........................................................................................14

5. DOWNLOAD.......................................................................99
6. BLOCK DIAGRAM............................................................ 112

2.7 C320 Figures....................................................................................15

7. CIRCUIT DIAGRAM......................................................... 123

3. TECHNICAL BRIEF..............................................................16

8. BGA Pin Map................................................................... 137

3.1 General Description......................................................................16
3.2 Power management.....................................................................28

9. PCB LAYOUT.................................................................... 143

3.3 SUB SYSTEM.....................................................................................32

10. RF CALIBRATION.......................................................... 149

3.4 General Description (RF Part)...................................................40

10.1 Usage of Tachyon for RF Calibration and Test.............. 149

3.5 GSM MODE.......................................................................................41

11. TEST ALONE.................................................................. 152

3.6 OFF-CHIP RF COMPONENTS.....................................................44

11.1 Phone Test Mode..................................................................... 152

3.7 OFF-CHIP COMPONENTS...........................................................46
12. EXPLODED VIEW & REPLACEMENT PART LIST ......... 157
4. TROUBLE SHOOTING........................................................50

11.1 EXPLODED VIEW....................................................................... 157

4.1 Power ON Troubleshooting.......................................................50

11.2 Replacement Parts.................................................................. 159

4.2 Charger Troubleshooting...........................................................52

11.3 Accessory.................................................................................... 175

4.3 USB Troubleshooting...................................................................54
4.4 USIM Detect Troubleshooting..................................................56
4.5 Camera Troubleshooting............................................................58
4.6 Main side view LED Troubleshooting....................................60
4.7 Slide Key side view LED Troubleshooting............................61
4.8 LCD Troubleshooting...................................................................63
4.9 Vibrator Troubleshooting...........................................................65
4.10 Receiver Path................................................................................67
4.11 Headset path................................................................................70

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

--

LGE Internal Use Only

LGE Internal Use Only

--

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

1. INTRODUCTION

Introduction
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features
of this model.

1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services. System
users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users are
responsible for programming and configuring the equipment to prevent unauthorized use. The
manufacturer does not warrant that this product is immune from the above case but will prevent
unauthorized use of common carrier telecommunication service of facilities accessed through or connected
to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.

D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,
note that unauthorized alternations or repair may affect the regulatory status of the system and may void
any remaining warranty.

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

--

LGE Internal Use Only

1. INTRODUCTION

G
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.

F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the
information is ESD handling:

sign. Following

• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is also
grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

LGE Internal Use Only

--

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

1. INTRODUCTION
1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC

Automatic Power Control

BB

Baseband

BER

Bit Error Ratio

CC-CV

Constant Current – Constant Voltage

DAC

Digital to Analog Converter

DCS

Digital Communication System

dBm

dB relative to 1 milli watt

DSP

Digital Signal Processing

EEPROM

Electrical Erasable Programmable Read-Only Memory

ESD

Electrostatic Discharge

FPCB

Flexible Printed Circuit Board

GMSK

Gaussian Minimum Shift Keying

GPIB

General Purpose Interface Bus

GSM

Global System for Mobile Communications

IPUI

International Portable User Identity

IF

Intermediate Frequency

LCD

Liquid Crystal Display

LDO

Low Drop Output

LED

Light Emitting Diode

OPLL

Offset Phase Locked Loop

ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

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Only for training and service purposes

6/140

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ʹΠΡΪΣΚΘΙΥ͑ι ͣͨ͑͡͡ͽ͸͑ͶΝΖΔΥΣΠΟΚΔΤ͑͟ͺΟΔ͑͑͟ͲΝΝ͑ΣΚΘΙΥ͑ΣΖΤΖΣΧΖΕ͑͟
΀ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ

LGE Internal Use Only

1. INTRODUCTION

1. INTRODUCTION
PAM

Power Amplifier Module

PCB

Printed Circuit Board

PGA

Programmable Gain Amplifier

PLL

Phase Locked Loop

PSTN

Public Switched Telephone Network

RF

Radio Frequency

RLR

Receiving Loudness Rating

RMS

Root Mean Square

RTC

Real Time Clock

SAW

Surface Acoustic Wave

SIM

Subscriber Identity Module

SLR

Sending Loudness Rating

SRAM

Static Random Access Memory

PSRAM

Pseudo SRAM

STMR

Side Tone Masking Rating

TA

Travel Adapter

TDD

Time Division Duplex

TDMA

Time Division Multiple Access

UART

Universal Asynchronous Receiver/Transmitter

VCO

Voltage Controlled Oscillator

VCTCXO

Voltage Control Temperature Compensated Crystal Oscillator

WAP

Wireless Application Protocol

ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

LGE Internal Use Only

7/140
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ʹΠΡΪΣΚΘΙΥ͑ι ͣͨ͑͡͡ͽ͸͑ͶΝΖΔΥΣΠΟΚΔΤ͑͟ͺΟΔ͑͑͟ͲΝΝ͑ΣΚΘΙΥ͑ΣΖΤΖΣΧΖΕ͑͟
΀ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

2. PERFORMANCE
2.1 Product Name
C320 : EGSM/GSM850/DCS/PCS
(GPRS Class 12 / EDGE Class 12)

2.2 Supporting Standard
Item
Supporting Standard

Frequency Range

Application Standard

Feature
EGSM/GSM850/DCS1800/PCS1900
with seamless handover
Phase
Phase 2+(include
2+(includeAMR)
AMR)
SIM Toolkit
C-E 1, 2, 3, C-E
Toolkit: Class 1, 2,: 3,
Class
EGSM TX : 880 – 915 MHz
EGSM RX : 925 – 960 MHz
GSM850 TX
: 824 – 849 MHz
GSM850 RX
: 869 – 894 MHz
DCS1800 TX
: 1710 – 1785 MHz
DCS1800 RX
: 1805 – 1880 MHz
PCS1900 TX
: 1850 – 1910 MHz
PCS1900 RX
: 1930 – 1990 MHz
WAP 2.0, JAVA 2.0

Comment

2.3 Main Parts : GSM Solution
Item
Digital Baseband
Analog Baseband
RF Chip

Part Name
ESC6270 : Qualcomm
ESC6270 : Qualcomm
ESC6270 : Qualcomm

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

--

Comment

LGE Internal Use Only

2. PERFORMANCE

2.4 HW Features
Item
Form Factor
Battery

Size
Weight
Volume
PCB
Stand by time
Charging time
Talk time
RX sensitivity

TX
output
power

GSM/
GPRS
EDGE

GPRS compatibility
EDGE compatibility
SIM card type
Display

Feature
Slide type
1) Capacity
Standard : Li-Ion, 900 mAh
2) Packing Type : Soft Pack
Standard : 91 x 63 x 15.9 mm
115.6g
TBD
Stag type, 10 Layers , 0.8t
Up to 300 hrs
Up to 3 hrs
2G Up to 3.4hr
EGSM
: -105 dBm
GSM850
: -105 dBm
DCS 1800
: -105 dBm
PCS 1900
: -105 dBm
EGSM
: 33dBm
GSM850
: 33 dBm
DCS 1800
: 30 dBm
PCS 1900
: 30 dBm
GSM 900
: 27 dBm
GSM 850
: 27 dBm
DCS 1800
: 26 dBm
PCS 1900
: 26 dBm
GPRS Class 12
EDGE Class 12
Plug-In SIM
3V /1.8V
2.4” TFT QVGA landscape

Built-in Camera
Status Indicator
Keypad

2M FF SOC Camera
Yes

ANT
System connector
Ear Phone Jack
PC synchronization
Memory

Main : Internal Fixed Type
5 Pin
3.5Phi, 4 Pole, Stereo
Yes
NAND Flash : 2Gbit
SDRAM : 1Gbit
FR, EFR, HR,AMR
Built in Data & Fax support
Built in Vibrator
V2.1 + EDR
SW Decoded 64Poly

Speech coding
Data & Fax
Vibrator
BlueTooth
MIDI(for Buzzer
Function)

LGE Internal Use Only

-410 -

Comment

With Battery

@ Paging Period 5
@
@ Tx=Max(2G)

Class4 (EGSM)
Class4 (GSM850)
Class1 (PCS)
Class1 (DCS)
E2 (GSM900)
E2 (GSM850)
E2 (PCS)
E2 (DCS)

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

Music Player
Video Player
Camcorder
Voice Recording
Speaker Phone mode
Support
Travel Adapter
CDROM
Stereo Headset
Data Cable
T-Flash
(External Memory)

MP3/AAC/AAC+/WMA
PEG4, H.263,H.264 30fps@QVGA
WMV 15fps@QCIF
MPEG4, 15fps@QVGA
Yes
Yes
Yes
No
Yes
Yes
Yes

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 11 -

LGE Internal Use Only

2. PERFORMANCE

2.5 SW Features
Item
RSSI
Battery Charging
Key Volume
Audio Volume
Time / Date Display
Multi-Language
Quick Access Mode
PC Sync
Speed Dial
Profile
CLIP / CLIR
Phone Book
Last Dial Number

Feature

English / Chinese Trad. / Chinese Simp.
/ Thai / Korean / Malay / Indonesian /
Vietnamese

Dialing / Contact / Menu /
Message / Camera
Yes
Yes
Yes
Yes
Name + 5 Numbers + 1 Memo + 2
e-mail + 3 Group Select + Picture +
Ringtone + Anniversary day
Yes

Last Received
Number
Last Missed Number

Yes

Search by Number
/ Name
Group
Fixed Dial Number
Service Dial Number
Own Number

Name and Number
Yes
Yes
No
Yes

Voice Memo
Call Reminder
Network Selection

Yes
Yes
Automatic

Mute
Call Divert
Call Barring
Call Charge (AoC)
Call Duration
SMS (EMS)

Yes
Yes
Yes
Yes
Yes
Yes (1000+SIM)

SMS Over GPRS
EMS Melody / Picture
Send / Receive / Save
MMS MPEG4
Send / Receive / Save
Long Message

Yes
Yes
(Receive only)
Yes

LGE Internal Use Only

Comment

0 ~ 7 Levels
0 ~ 3 Levels
0 ~ 7 Level
1 ~ 20 Level
Yes
Yes

Yes

PC suite 4
Voice mail center -> 1 key
not same with feature phone setting
1000 + SIM
Total Call DB Max 100
LDN (SIM) N/A
Total Call DB Max 100
LDN (SIM) N/A
Total Call DB Max 100
LDN (SIM) N/A

30

Read only
(add/edit/delete are not supported)
Support voice recorder

EMS : Release4
(Except Text align)

MAX 1000 Characters

SMS 7pages

6

- 12 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

Cell Broadcast
Download
Game
Calendar
Memo
World Clock
Unit Convert
Stop Watch
Wall Paper
WAP Browser
Download Melody /
Wallpaper
SIM Lock
SIM Toolkit
MMS
EONS
CPHS
ENS
Camera
JAVA

Yes
Over the WAP
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Over WAP 2.0
Yes

Voice Dial
IrDa
Bluetooth

No
No
Yes

FM radio

Yes

GPRS
EDGE
Hold / Retrieve
Conference Call
DTMF
Memo pad
TTY
AMR
SyncML
IM
Email

Yes
Yes
Yes
Yes
Yes
Yes
No
Yes
No
Yes
Yes

100

Obigo
Over WAP

Yes
Yes
Yes
No
Yes
No
Yes
Yes

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

Operator Dependent
R99
Obigo +LG MMS Client
V4.2
2M FF
CLDC V1.1 / MIDP V2.1
Download Over WAP

BT 2.1+EDR
HFP/HSP/A2DP&AVRCP
/OPP/BPP/PBAP/SPP/
Class 12
Class 12
Max. 6

JAVA midlet (neustar)

- 13 -

LGE Internal Use Only

2. PERFORMANCE

2.6 HW SPEC.
1) GSM transceiver specification
Item
Phase Error
Frequency Error
EMC(Radiated Spurious Emission
Disturbance)
Transmitter Output power and Burst
Timing
Burst Timing
Spectrum due to modulation out to less
than 1800kHz offset

Spectrum due to modulation out to
larger than 1800kHz offset to the edge
of the transmit band

Spectrum due to switching transient
Reference Sensitivity – TCH/FS
Usable receiver input level range
Intermodulation rejection – Speech
channels

Specification
Rms : 5°
Peak : 20 °
GSM : 0.1 ppm
DCS/PCS : 0.1 ppm
GSM/DCS : < -28dBm
GSM : 5dBm – 33dBm ± 3dB
DCS/PCS : 0dBm – 30dBm ± 3dB
<3.69us
200kHz : -36dBm
600kHz : -51dBm/-56dBm
GSM :
1800-3000kHz :< -63dBc(-46dBm)
3000kHz-6000kHz : <-65dBc(-46dBm)
6000kHz < : < -71dBc(-46dBm)
DCS :
1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm
Class II(RBER) : -105dBm(2.439%)
0.012(-15 - -40dBm)
± 800kHz, ± 1600kHz
: -98dBm/-96dBm (2.439%)

AM Suppression
T GSM : -31dBm
- DCS : -29dBm

-98dBm/-96dBm (2.439%)

Timing Advance

± 0.5T

LGE Internal Use Only

- 14 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

2.7 C320 Figures

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 15 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.
TECHNICAL BRIEF
2. Base Band Technical Description
3.1 General Description
QSC6270 (3G disable)has all eight major functional blocks as like Figure 3.1

Figure 3.1 QSC6270(3G disable) Base band block

LGE Internal Use Only

- 16 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. TECHNICAL BRIEF

3.1.1 Processor
The QSC6270(3Gdisable) device integrates multiple processors on-chip: one ARM microprocessor and two
DSP processors. Each processor is part of a functional subsystem:
 The micro subsystem includes the ARM926EJ-S microprocessor.
 The modem subsystem includes the QDSP4u8 digital signal processor (mDSP).
 The application subsystem includes the QDSP4u8 application digital signal processor(aDSP).

Figure 3.1.1 Processors and bus architecture

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 17 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.1.2 Memory support (and LCD interface)
3.1.2
Memory support (and LCD interface)
The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2.
The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2.
EBI1 supports high-speed synchronous dynamic devices. Its memory controller supports the new mobile
EBI1 supports
high-speed
synchronous
devices. Its memory
controller
supports
the new
mobile DDR
DDR SDRAM
memories
with itsdynamic
higher bandwidth
and ability
to run at
high clock
frequencies.
This
SDRAM interface
memoriessupports
with its higher
bandwidth and ability
to run atand
highlow-latency
clock frequencies.
This interface
the high-bandwidth,
high-density,
requirements
of thesupports
QSC’s
advanced on-chip
capabilities
such as therequirements
ARM9 processor,
graphics,
and video
the high-bandwidth,
high-density,
and low-latency
of thehighperformance
QSC’s advanced on-chip
capabilities
such
applications.
as the ARM9 processor, highperformance graphics, and video applications.
EBI2
interface
intended
to support
memory
devices
suchsuch
as NAND
flash and
EBI2isisthe
theslower
slowerspeed
speed
interface
intended
to support
memory
devices
as NAND
flashasynchronous
and
SRAM, peripheral
devices
suchperipheral
as LCDs, and
the UBM
receiver
for multicast
or broadcast
(QSC6270
only).
asynchronous
SRAM,
devices
such
as LCDs,
and the UBM
receiver reception
for multicast
or
In addition,
EBI2 is reception
required to(QSC6270
support a only).
synchronous-burst
AADisNOR
flash to
a NOR/DDR
SDRAM memory
broadcast
In addition, EBI2
required
toenable
support
a synchronous-burst
configuration
because
simultaneous
mode SDRAM
(NOR, SDRAM)
is not
supported on
the EBI1
bus.
AAD NOR
flashthe
to enable
a NOR/DDR
memory
configuration
because
the
simultaneous mode
(NOR, SDRAM) is not supported on the EBI1 bus.
The ARM926EJ-S microprocessor is a cached processor and all its accesses to external memory use burst
techniques
of four or
eight 32-bit words
when the
memoryand
region
is declared
cacheable/bufferable.
To take
The ARM926EJ-S
microprocessor
is a cached
processor
all its
accessestotobeexternal
memory use burst
advantage
of
this
QSC
higher
performance
feature,
data
from
memories
must
satisfy
the
requirements
for
these
techniques of four or eight 32-bit words when the memory region is declared to be
burst accesses.
cacheable/bufferable. To take advantage of this QSC higher performance feature, data from
memories must satisfy the requirements for these burst accesses.

EBI1
CLK
CKE
_CS
_RAS

SDRAM
512Mbit
)

_CAS
_WED
DQM
ADDR
DQ

External
Memory
( MICRO SD)

EBI2

DDR_M_CLK_N
DDR_CKE[0]
_

NAND
_CS_
_N

DDR_CS[0]_N
_
DDR_RAS_N
DDR_CAS_N
DDR_WE_N
_ _

DDR_D[0:15]

ALE

NAND
_UB_N

CLE

NAN
D_OE_N
NAN
D_WE_N
NAND
_BSY_N

DDR_DQM[0:1]
_
DDR_A[0:13]

QSC6270
(3G disable)

_CE

NAND
_LB_N

NAND_WP
_N
NAN
D_DATA
[ 0: 15]

_RE
_WE

NAND Flash
(1Gbit)

RY_BY
_WP
IO[ 1: 16]

SIM_CLK

MSD_D[0:3]

_ _
SIM_RST_N

MSD_CMD

SIM_DATA

MSD_CLK

MUSIM_DM
MUSIM_DP

USIM
(SIM PLUS)

Figure 3.1.2.1 The memory control blocks of C320

LGE Internal Use Only

- 18 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. TECHNICAL BRIEF

LDO_LCD_2.8V
LDO_LCD_1.8V
LCD_RST
EBI2_WE_N
LCD_ADS
LCD_CS_N
EBI2_DATA[15:0]
LCD_IF(2:1)

QVGA Main
LCD
(2.4", 320x240)

QSC6270
(3G disable)
WLED_PWR

Figure 3.1.2.2 The LCD interfaces of C320

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 19 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.1.3 Connectivity
QSC6270 has connectivity features as below
– USB-OTG; USB LS, FS, and HS (2.0 compliant)
– I2C compatible for peripheral controls (1.8 V)
– UART: up to 4 Mbps
– Bluetooth 2.0 support via external SoC
– WLAN via external device (SDIO)
– NFC via external module (I2C)
– FM radio via external module (I2C)
– USIM, SIM, and USB-UICC support; 1.8 and 3 V
– Keypad interface
– SPI (master only) for peripheral support
– Two secure digital controllers — WLAN and secure digital (SD) cards

QSC6270

Figure 3.1.3 The connectivity of BL20

LGE Internal Use Only

- 20 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. TECHNICAL BRIEF

3.1.4 GPIOs
QSC6270 (3G disable has 78 configurable I/O pins

HALL_SENS_DET
BT_RST_N
BT_WAKEUP_HOST
MUSIM_DP
MUSIM_DM
WLAN_CLK
WLAN_SDIO[3]
WLAN_SDIO[2]
WLAN_SDIO[1]
WLAN_SDIO[0]
WLAN_CMD

BT_PWR_ON
LCD_IF_MODE[0]
HS_JACK_DET
WLAN_BT_REG_ON
LCD_RST_N

WLAN_RST_N

BL_LCD_CAM_LDO_I2C_SDA
BL_LCD_CAM_LDO_I2C_SCL
MUIC_AUD_FM_I2C_SCL
MUIC_AUD_FM_I2C_SDA

MUIC_INT_N

CHG_STS_N
CHG_EN_N

High : BT UART
Low : UART Comm

BL_LCD_CAM_LDO_EN

UART_BT_SEL

Figure 3.1.4 GPIOs of C320

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 21 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.1.5 Air interfaces
The supported air-interface standards and features include: (See the RF technical description)
 GSM/GPRS/EDGE Specification Release 4 (3GPP R4)
 Enhanced GPS position location using gpsOne (with RGR6240 IC)
 Integrated gpsOne functionality, featuring enhancements by SnapTrack®, Inc., to enable a wide variety of
location-based services and applications, including points of interest, personal navigation, and friend finder
 Simultaneous-GPS (processes GPS using dedicated circuitry while voice and/or data signals continue to be
processed separately)
 1024x searcher, direct facility termination (DFT) accelerator, off-chip RAM for measured data storage

3.1.6 Internal base band functions
Several baseband circuits within the QSC6270(3G disable)device provide functions that are necessary only to
make the device operate properly — these functions are not generally used directly by other
handset circuits and functions.
 PLLs and clock generation
 Modes and resets
 Security
 Qfuse
 JTAG/ETM
The clock block includes two PLLs, all phase-locked to the TCXO signal. These PLLs generate several
different stable, low-jitter clock signals that are distributed throughout the QSC device and to external c
omponents as needed.
All the required WCDMA, GSM, GPS(only QSC6270), ARM, QDSP, and most peripheral clocks are derived in
some way from the TCXO (or XO) source for their operating modes, plus the 32.768 kHz
oscillator for their sleep modes

Figure 3.1.6 Clock block basic architecture of QSC6270(3G disable)

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3. TECHNICAL BRIEF

3.1.7 Multimedia
Multimedia topics are as below in QSC6270, including:
 Camera interface and video front-end
 Mobile display processor
 Additional multimedia support: video, audio, graphics, and messaging
3.1.7.1 Camera interface and video front-end
The camera interface (CAMIF) connects the QSC62x0 device directly to a camera sensor. Typical applications
include Qcamera, Qcamcorder, and QvideophoneThe CAMIF delivers the raw 10-bit Bayer pattern data
(preferred) to the video front-end (VFE) that performs the required image processing (RGB-triplet generation,
color-space conversion, auto-white balance, auto exposure, gamma correction, etc.) and prepares the image
for capture or transmission. The QSC device also supports a YUV 4:2:2 input from the sensor
(8-bit, 2:1 MUX YUV or CCIR656 YUV).
The video capabilities of the two QSC devices varies slightly, with the QSC6270 providing higher performance
than the QSC6270 device — greater resolution, higher capture and streaming rates, etc.

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3. TECHNICAL BRIEF

3.1.7.2 Mobile display processor
The MDP is a hardware accelerator primarily responsible for transferring an updated image from the QSC
memory subsystem to the LCD module. The transferring of an updated image is an operation that is shared
between software, video processing, and graphics processing, so a common block helps to reduce
redundant circuitry. The MDP is designed with the assumption that the LCD panel has an embedded LCD
controller and a frame buffer. The image transfer is then the copying of the image from the QSC memory
system to the frame buffer within the LCD module.
While the MDP is transferring an image to the LCD module, it can perform a final set of operations to the
image. The set of operations that the MDP can perform has been chosen to maximize the efficiency of the
QSC memory subsystems, typically removing two or more copy operations of the image to and from
memory.
The MDP reduces redundant circuitry and offloads the ARM and aDSP from memory-transfer operations and
a certain set of graphics and video operations

Figure 3.1.7.2.1 MDP-to-LCD interface functional block diagram

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3. TECHNICAL BRIEF

VLDO_LCD_2V8

R102

R101

1

1

VLDO_LCD_1V8

CN102
1
2

LCD_VSYNC_OUT
LCD_MAKER_ID
LCD_DATA[0]
LCD_DATA[1]
LCD_DATA[2]
LCD_DATA[3]

3
4
5
6
7
8

LCD_DATA[4]
LCD_DATA[5]

9

LCD_DATA[6]
LCD_DATA[7]
LCD_DATA[8]
LCD_DATA[9]
LCD_DATA[10]
LCD_DATA[11]
LCD_DATA[12]
LCD_DATA[13]
LCD_DATA[14]
LCD_DATA[15]

11

10
12
13
14
15
16
17
18
19
20
21

LCD_RD
LCD_WR_N
LCD_RS
LCD_CS_N

22
23
24

LCD_RST_N

25

LCD_IF_MODE[1]
LCD_IF_MODE[0]

26
27
28
29
30

C101

C102

0.1u

0.1u

WLED5
WLED4
WLED3
WLED2
WLED1
WLED_VOUT

31
32
33
34
35

Figure 3.1.7.2.2 The LCD interface of C320

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3. TECHNICAL BRIEF

3.1.8 UART
̰ One universal asynchronous receiver transmitter (UART) port that supports low-speed, full-speed,
and high-speed modes
̰ Serial data port communications that conform to the RS-232 interface protocol
̰ Used for data transport during Bluetooth operation (BTS402x™ SoC required)
̰ Other possible uses:
– Test and debug
– External keypad
– Ringer
– Load/upgrade system software
̰ Separate FIFOs for Rx and Tx
̰ Supporting circuits include:
– Interrupt control
– Clock source
– Bit-rate generator (BRG)
– Microprocessor interface
̰ Flow control is not available on UART2 (behind USIM)

3.1.9 USB
̰ Each USB link has a host and a peripheral; the host is responsible for initiating and controlling bus traffic
̰ The USB specification requires PCs to act as hosts, and other devices such as printers, keyboards, mice, etc.,
to act as peripherals
̰ USB 2.0 implementation defines three modes
- Low-speed (LS): 1.5 Mbps
- Full-speed (FS): 12 Mbps
- High-speed (HS): 480 Mbps
̰ The QSC62x0 is compliant with the USB 2.0 specification
- All three modes are supported when acting as a host
- FS and HS are supported when acting as a peripheral
̰ The QSC62x0 has two USB controllers
- Primary USB controller
- Secondary USB controller
̰ The primary USB controller is supplemented by an integrated physical layer (PHY)

3.1.10 HKADC
The HKADC includes an analog multiplexer that selects an input for the sample and
hold circuit. One of three inputs can be selected:
HKAIN1, pin R22 – an external connection that is available as a general-purpose input,
though it is often used to monitor the power amplifier(s) temperature.
An on-chip connection to the power management circuit’s analog multiplexer output. This allows monitoring of:
-. Key power supply nodes such as VBAT, VCHG, etc.
-. Multipurpose pins (when configured as analog inputs)
-. A few on-chip parameters such as the die temperature or VREF

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3. TECHNICAL BRIEF

QSC6270HKADC Block diagram

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3. TECHNICAL BRIEF

3.2 Power management
3.2.1 Input power management
 Valid external supply attachment and removal detection
 Unregulated (closed-loop) external charger supply as input power source
 Integrated PFET charging pass transistor; eliminated sense resistor
 Support for lithium-ion and lithium-ion polymer main batteries; nickel-based batteries are not supported
 Trickle, constant current, constant voltage, and pulse charging of the main battery
 Autonomous charging option – driven by an on-chip state machine without software intervention
 Software-controlled charging option – backwards-compatible with previous QSC and PM products
 Coin-cell battery (including charging)
 Battery-voltage detectors with programmable thresholds
 VDD collapse protection
 Charger-current regulation and real-time monitoring for overcurrent protection
 Charger-transistor protection by thermal control
 Control drivers for the internal charging PFET and external battery PFET
 Voltage, current, and thermal control loops
 Automated recovery from sudden momentary power loss (requires external32.768 kHz crystal)

Figure 3.2.1 Input circuits schematic diagram

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3. TECHNICAL BRIEF

3.2.2 Output voltage regulation
The QSC62x0 device includes all the regulated voltages needed for most low-cost wireless
handset applications (and many other applications). Independent regulated power sources are
required for various electronic functions to avoid signal corruption between diverse circuits,
support power-management sequencing, and meet different voltage-level requirements. Sixteen
voltage regulators are provided — all programmable, all derived from a common bandgap reference circuit.
Three major types of voltage regulator circuits are on-chip:
 Three positive voltage switched-mode power supply (SMPS) circuits
- One boost converter (rated for 600 mA)
- Three buck converters (rated for 500 mA each)
 Thirteen positive voltage linear regulators
- Four rated for 300 mA
- Six rated for 150 mA
- Three rated for 50 mA
 One negative voltage charge pump rated for 200 mA, referred to as a negative charge pump(NCP)
Each regulator has two logic-OR input bits; a logic high at either input enables that regulator:
 A master bit that enables all regulators according to their default condition
 A dedicated bit that enables only that regulator
The master enable reduces the number of write cycles needed when switching between the phone’s
sleep and active modes.
Additional comments that apply to regulator functions:
 If a regulator’s default condition is on, that regulator will power on automatically at QSC startup.
 The MSMP regulator must be on to allow internal communications between major functional blocks.
 Each regulator and SMPS can provide more than its rated output current, though some
performance characteristics might be degraded.
 All regulated output voltages are programmable.
 All regulators can be set to a low-power mode except the VREG_USB_3P3 and VREG_NCP circuits

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3. TECHNICAL BRIEF

Table 3.2.2 Voltage regulator summary

1. All regulator names are based on their intended use, though some may be used to power alternate
functions. For example, the USIM regulator is intended to power an external SIM card but may be used to
power other circuits (or not used at all).
2. Each current listed in this table is its regulator's rated value – the current at which the regulator meets all its
performance specifications. Higher currents are allowed, but higher input voltages may be required and
some performance characteristics may become degraded. See the appropriate regulator sections for details.
3. VREG_MSMP powers key internal circuits and should be kept on at its default voltage setting.
4. All regulators have default output voltage settings, even if they default to an off condition.

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3.2.3 Charging control
C320 use single Charger.
- Single charger has five mode like “ OFF / TRICKLE / ISET / USB500 / FACTORY mode”.
- Single Charger is working as ISET mode in case of CC(Constant Current), CV(Constant Voltage) mode,
as USB 500mode in case of USB Charging.
- FACTORY mode is working only for Factory use.

p‹“Œ

kš—“ˆ Œ‹Guv{GŠˆ™Ž•Ž
jˆ™Ž•Ž

ylTŠˆ™Ž•Ž

kš—“ˆ Œ‹GŠˆ™Ž•ŽGŠ–”—“Œ›Œ‹
j–”—“Œ›Œ‹

CHG_STS_N

DNI

VBUS_LDO_4V9

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

MUIC_IO_M
MUIC_IO_P
MUIC_ACC_ID

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3. TECHNICAL BRIEF

3.3 SUB SYSTEM
3.3.1 KEY PAD
C320 have a key-coder IC that supports eight sense lines, or columns, and eight keypad rows.
The device scans and encodes 64 matrix – addressed keys on keypads . Key press and release events are stored
in a FIFO buffer with 16 event lengths for uploading to a host processor. The event data stored will indicate the
sequence of events and which keys set pressed or released.

VREG_MSME_1V8

25pF

25pF

25pF

LGE Internal Use Only

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KEY_COL6
KEY_COL7

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3. TECHNICAL BRIEF

3.3.2 External memory interface
The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2.
EBI1 supports high-speed synchronous dynamic devices. Its memory controller supports the new mobile DDR
SDRAM memories with its higher bandwidth and ability to run at high clock frequencies. This interface supports
the high-bandwidth, high-density, and low-latency requirements of the QSC’s advanced on-chip capabilities
such as the ARM9 processor, highperformance graphics, and video applications.
EBI2 is the slower speed interface intended to support memory devices such as NAND flash and asynchronous
SRAM, peripheral devices such as LCDs, and the UBM receiver for multicast or broadcast reception (QSC6270
only). In addition, EBI2 is required to support a synchronous-burst AAD NOR flash to enable a NOR/DDR SDRAM
memory configuration because the simultaneous mode (NOR, SDRAM) is not supported on the EBI1 bus.
EBI1 Features
EBI1 is a high-performance external memory interface for the QSC62x0 digital block that supports DDR SDRAM
devices Specifically, the following memory devices are supported on EBI1:
̰ SDRAM
-16-bit low-power DDR SDRAM
-Minimum size per chip-select: 16 MB (128 Mbit)
-Maximum size per chip-select: 128 MB (1 Gbit, 1 k columns only)
Characteristics of the EBI1 clock are listed below:
-Maximum clock rate is 92 MHz, defined by the AMSS software.
-The EBI1 memory controller clock is synchronous to the bus clock (HCLK).
EBI2 Features
EBI2 is used to interface with slower memory and peripheral devices (NAND flash, burst NOR, LCDs, etc.).
The following EBI2 devices are supported:
̰ NAND flash
-8/16 bit, single-level cell (SLC)/multi-level cell (MLC) 512/2048-byte page devices
-DMA support
-Boot-up capability from the above devices
̰ Burst NOR flash
-16-bit multiplexed AAD burst NOR devices
̰ 8/16/18-bit (write only) LCD devices (both Motorola and Intel style)
Characteristics of the EBI2 clock are listed below:
̰ The maximum clock rate is 46 MHz, defined by the AMSS software.
̰ The EBI2 memory controller operates at HCLK/2.
̰ Broadcasting and multicasting (QSC6270 only, with MBP1600 IC) are based on:
-Wideband MediaFLO™, DBV-H, and ISDB-T
Asynchronous/burst controller (EBI1 and EBI2)
The external memory controller (xmem_ctlr) forms the asynchronous/burst controller for both EBI1 and EBI2 in
the QSC62x0 device. The controller is generic in terms of its software programmable options and can be
customized when used for EBI1 and EBI2. This block has been enhanced in the QSC62x0 device to support 32-bit
burst memories and byte masking during write operations.
.

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3.3.3 Camera Interface ( 2M CAMERA )
3.3.3.1 2M CAMERA
C320 Installed a 2M Pixel Camera. Below picture shows the camera board to board connector and
camera I/F signal.

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8

3

7

4

6

5

9

2

8

3

7

4

6

5

9

2

10

1

9

2

8

3

7

4

6

10

1

5

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Only for training and service purposes

10

1

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3. TECHNICAL BRIEF

3.3.4 LCD Module (LQ024Q3UX01 : SHARP)
The DM24-DSM04 model is a Color TFT LCD supplied by LG Innotek.
This main Module has a 2.4 inch diagonally measured active display area with 320(RGB) X 240 resolution.
Each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes.
Main LCD color is determined with 262k colors signal for each pixel.
The DM24-DSM04 has been designed to apply the interface method that enables low power, high speed, and
high contrast. The DM24-DSM04 is intended to support applications where thin thickness and low power are
critical factors and graphic displays are important
GENERAL DESCRIPTION

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PIN DESCRIPTION
Input Signal and Power : Pin Description ( Input Pin : 35 )

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3. TECHNICAL BRIEF

LGE Internal Use Only

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3. TECHNICAL BRIEF

3.3.5 Audio Signal Processing & Interface
Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal
from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (QSC6270). This
transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset. The downlink
path amplifies the signal from DBB chip (QSC6270) and outputs it to receiver (or speaker).
The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. The outputs
earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_OP, LINE_ON) are differential outputs. Earphone2 (HPH_L,
HPH_R) is a single-ended output stage designed to drive a headset speaker. The microphone interface consists
of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier.

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G

3.4 GENERAL DESCRIPTION (RF Part)
The RF platform of C320 supports four communication bands (GSM850 / GSM900 / GSM1800 / GSM1900).
The all the RF blocks can be divided into two main parts, which are a GSM, and an antenna switch Mode.
The simplified block diagram is shown in Figure 3.4

3.4 Block diagram of RF part
[Figure 1.1]

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G

3.5 GSM MODE
The EDGE/GPRS/GSM transceiver use a digital interface that is shared between receive and transmit data.
The receive interface is based on I and Q data and the transmitter interface is based on envelop and
frequency data.
The quad band EDGE/GSM/GPRS transceiver has the following general features:
Power class
GMSK low bands: Class 4 (33 dBm)
GMSK high bands: Class 1 (30 dBm)
8PSK low bands: Class E2 (27 dBm)
8PSK high bands: Class E2 (26 dBm)
Multi slot class 12 (4+4=5)
Dual Transfer Mode (DTM) class 9 (3+2=5)
Zero-IF receiver
-Polar modulation transmitter

3.5.1 GSM RECEIVER
The RF receiver designs are leveraged from previous-generation RTR devices, including the latest innovations.
All ESC receiver paths are discussed in this section.
The ZIF receive signal paths support multiband, multimode applications:
Quad-band GSM:
Low-band
GSM 850 (869 to 894 MHz) and GSM 900 (925 to 960 MHz)
High-band
DCS1800 (1805 to 1880 MHz) and PCS1900 (1930 to 1990 MHz)
The on-chip receive signal paths are functionally identical for each mode (GSM or EDGE) and each band type
(low or high). The external circuitry includes the antenna switch module and a filter function.
All RF Rx inputs use a differential configuration to maximize common-mode rejection, Tx isolation, out-ofband suppression, and second-order intermodulation performance. The first of two quadrature
downconverters accepts inputs from two LNAs (only one is active at a time). An example application could
support the following bands using these two LNAs:
GSM 1900
GSM 850

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G
The second downconverter accepts inputs from another two LNAs (again, just one is active at time) and is
dedicated to GSM 900 and GSM 1800 operation.
The two downconverter outputs drive analog baseband filters and buffer circuits that are programmed to
support the active operating mode’s waveforms (GSM or EDGE). The analog baseband signals are then
digitized by analog-to-digital converters (ADCs) whose outputs are routed to the digital baseband circuits for
further processing.
Numerous secondary Rx functions are also integrated: Rx frequency synthesizers (each having their own PLL
and VCO circuits), LO generation and distribution circuits, reference and clock circuits for the ADCs, and
various interface, control, and status circuits. Power reduction features (such as selective circuit powerdown,
gain control, and bias control) extend handset standby time.
Like the Tx LO, all Rx LO circuits are completely integrated. All received LO signals are generated by the onchip Rx VCOs under control of their PLLs.

[Figure 3.5.1] QSC GSM receiver signal paths functional diagram

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G
3.5.2 GSM TRANSMITTER
The RF transmitters are leveraged from previous-generation RTR™ devices, including the latest innovations.
The ESC transmitter paths and Tx power-detector input are discussed in this section. It provides the zero-IF
(ZIF) transmit signal paths for multiband, multimode applications:
Quad-band GSM:
Low-band
GSM 850 (869 to 894 MHz) and GSM 900 (925 to 960 MHz)
High-band
DCS1800 (1805 to 1880 MHz) and PCS1900 (1930 to 1990 MHz)
The transmit signal paths include a shared set of baseband amplifiers, a dedicated quadrature upconversion
for each band-type (low and high), gain control RF amplification, and multiple output driver amplifiers for
each band-type. Two GSM output drivers support one low-band and one high-band type (but each GSM
band-type is dual-band). The GSM transmitters in polar PA configuration are also supported by a PA envelope
control path, plus the ability to route LO signals to the transmit chains for test and calibration purposes. In
linear PA configuration, phase and envelope paths are combined inside the ESC and amplified using a
multistage linear PA.
Numerous secondary Tx functions are also integrated: a reference for the transmit DACs, the Tx phase-locked
loop (PLL), the Tx OSC circuit, the Tx LO generation and distribution circuits, an RMS Tx power detector, and
various interface, control, and status circuits.
The RF transmitter interfaces internally with the baseband circuits for its analog baseband input and status
and control signaling. Power reduction features controlled by baseband circuits (such as selective circuit
powerdown, gain control, and transmit puncturing) extend handset talk time. The driver amplifier outputs
are routed externally to the final stages of the transmit chains, culminating with the antenna switch whose
output drives the antenna.
Sophisticated Tx LO circuits implement the frequency plan and are completely integrated on-chip. All Tx LO
signals are generated by the on-chip Tx OSC under the control of its PLL.

[Figure 3.5.2] QSC GSM transmitter signal paths functional diagram
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G
3.6 OFF-CHIP RF COMPONENTS
3.6.1 D5008 (FL101: FEM)
Low-loss SAW frontend module for mobile telephone system
Covering GSM850, GSM900, GSM1800 and GSM1900 bands
Integration of Tx low pass filters, switch, de-coder and diplexing network between GSM Filters
Integration of GSM850, GSM900, GSM1800 and GSM1900 Rx SAWs
Balanced outputs of all Rx ports
Integration of ESD protection at Ant port to 8kV acc. IEC-61000-4-2 (contact discharge)

[Figure 3.6.1] Block diagram of FEM

[Table 3.6.1] Control table of FEM

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G
3.6.2 GSM850/EGSM/DCS/PCS Dual band Transmit Power Amplifier
(U101: SKY77336)
The dual band PA is operating to transmit for low band (GSM-850, GSM-900) and high band (GSM-1800,
GSM1900). Operating mode is selected and controlled by the ESC6270 (GSM_PA_BAND).

[Figure 3.6.2] Block diagram of GSM PAM

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G
3.7 OFF-CHIP COMPONENTS
3.7.1 Bluetooth (BCM2070)
Bluetooth block of LG-C320 consists of a BCM2070 chip-set, an external crystal oscillator(26MHz), and a
Bluetooth chip antenna (2.4GHz). QSC6270_3G disable, which is main HW solution of LG-C320 Model, doesn’t
include BT baseband core. Instead, Bluetooth chipset, BCM2070, contains stand-alone baseband processor
(V2.1+EDR) as well as BT RF block. An external crystal oscillator (26MHz) is used to provide reference
frequency to BCM2070.
Figure 3.7 shows the Bluetooth system architecture in the LG-C320.

[Figure 3.7] Bluetooth system architecture

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G

[Table 3.7] Bluetooth Connection(GPIO) with QSC6270

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G
3.7.2 FM Receiver (TEA5991)
The TEA5991 is a single chip FM stereo radio with RDS and RBDS decoder. The radio can be connected to a
headphone antenna and can tune from 70-108 MHz to cover the European, US, Chinese and Japanese FM
band. The radio delivers stereo audio output to an external amplifier. The radio can be controlled with a high
level command based interface through a I2C or SPI-bus.
[Figure3.7.2] shows the FM Radio system architecture in the LGC320.
Ear-Jack

HP_EAR_R

FM_ANT

FM
TEA5991

HP_EAR_L

FM_R
FM_L
FM_I2C_SDA
FM_I2C_SDL

G

HP_R

AUDIO

ESC6270

HP_L

SUBSYSTEM

[Figure3.7.2] FM Radio system architecture

[Figure3.7.2.1] Pin Descriptions

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3. TECHNICAL BRIEF

G
SYMBOL

HVQFN

WLCSP

DESCRIPTION

AGND

1

RFI

2

E1

RF input

RFGND

3

D1

RF ground

NC

4

-

BUSSEL2

5

A1

Bus Selection pin 2

BUSSEL1

6

C1

Bus Selection pin 1

RST

7

A2

Reset, used for operating mode change

SEN

8

B1

Chip Select for SPI bus

SCL

9

A3

Serial Bus Clock

SDA

10

A4

Serial Bus Data

FREF

11

VREFDIG

12

VDD

13

DGND

14

AUDOR

15

D6

Audio output signal right

AUDOL

16

E6

Audio output signal left

NC

17

-

Not connected

VCC

18

F6

Analog supply voltage

GPIO2

19

F5

General Purpose I/O 2; Dataout for 4-wire SPI-bus

F1

Analog ground

not connected

A5

Reference frequency (32.768 kHz)

A6

Reference voltage for digital I/Os

B6

Digital supply voltage

C6

Digital ground

[Table 3.7.2] pin description

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 49 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Power ON Troubleshooting

4. TROUBLE SHOOTING
5. Base band part

4.1 Power ON Troubleshooting
Power On sequence is :
PWR key press PM_ON_SW_N Î QSC6270 KPDPWR_N pin(AA2) go to low(Main BOARD R205) Î QSC6270
Power Up Î VREG_MSMC_1.2V(C261), VREG_MSME_1.8V(C209), VREG_MSMP_2.6V(C414),
VREG_RFRX2_1.3V(C232), VREG_TCXO_2.85V(C275) power up and system reset assert to QSC6270 Î Phone
booting and PS_HOLD assert to QSC6270

START

Battery voltage. higher
than 3.20V?

No

Change or charging the Battery

Yes
Replaced
with normal LCD module,
and then Booting is OK?

Yes

Go to LCD Troubleshooting

No
TP1_R205 go to low
When Power key press?

No

Check the Key Dome

Yes
TP2_VREG_MSMC_1.2V(L201)
TP3_VREG_RF1_2.3V(L202)
TP4_VREG_RF1_1.4V(L203)
power up?

No

Change the main board

Yes
Change the main board

LGE Internal Use Only

- 50 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

TP1

PM_ONSW_N

TP2

Power ON Troubleshooting
TP3

TP4

VREG_RF2_1V4|VREG_RF2

TP1

TP2

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

TP4

TP3

- 51 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Charger Troubleshooting
4.2 Charger Troubleshooting
൯ Charging Procedure
- Connect TA or USB Cable
- Control the charging current by QSC6270(disable 3G)
- Charging current flows into the battery

ත Troubleshooting Setup

ත Check Point

ත Troubleshooting Procedure

- Connection of TA or USB Cable
- Charging current path
- Battery

- Connect TA and battery to the phone

- Check the charger (TA or USB Cable) connector
- Check the charging current Path
- Check the battery

START

Check the pin and battery
Connect terminals of I/O
connector

Connection OK?

No

Change I/O connector

Yes
Is the TA voltage TP1_5.1V(FL401)?

No

Change TA

Yes
Is it charging properly?

Yes

END

No
Change the main board

[ Charger Troubleshooting Flow ]

LGE Internal Use Only

- 52 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

Charger Troubleshooting

TP1

FL401

TP1

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 53 -

LGE Internal Use Only

4. TROUBLE SHOOTING

USB Troubleshooting
4.3 USB Troubleshooting
USB Initial sequence is : Isert USB Cable Î USB_VBUS +5V Check Î IC400 triggered USB IF work

START

No

Cable is insert
physically?

Change CN400

Yes

Is TP1_FL401(VBUS) voltage 5.1V?

No

Change CN401

Yes
TP2_C409(LDO4.9V)
OUTPUT is about 5V?

No

Change the U401

Yes
Is IC401 OUTPUT is TP3_C265(USB_
DM,USB_DP) signal OK?

No

Change the IC401

Yes
Change the main board

[ USB Troubleshooting Flow ]

LGE Internal Use Only

- 54 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

USB Troubleshooting

TP3
TP1

TP1

FL401

TP2

VBUS_LDO_4V9

TP2

TP3

TP3

kt

kw

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 55 -

LGE Internal Use Only

4. TROUBLE SHOOTING

USIM Troubleshooting
4.4 USIM Detect Troubleshooting
USIM Initial sequence is :
VREG_USIM_2.85V go to 1.8V or 3.0V Æ USIM_CLK,USIM_RST,USIM_DATA triggered Æ USIM IF work

START

Re-insert the SIM card

Work well ?

Yes

END

No
TP1(Vreg_USIM) is 1.8V or 3.0V ?
TP2(USIM_CLK) & TP3(RST) is run ?

No

Check J301

Yes
Work well ?

Change the SIM card

Yes

No
Work well ?

No

Change the Main board

Yes
END

LGE Internal Use Only

- 56 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

USIM Troubleshooting

TP1
TP2
MUSIM_DM

TP3
MUSIM_DP

TP1

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

TP2

- 57 -

TP3

LGE Internal Use Only

4. TROUBLE SHOOTING

Camera Troubleshooting
4.5 Camera Troubleshooting
Camera control signals are generated by QSC6270.

START

Check the camera connection to the
socket and reconnect the camera

Camera is OK?

Yes

END

No
CAM_AVDD_2.8V
CAM_VDD_1.8V (TP1, TP2)

No

Chang the Main board

Yes
Check the CAM_MCLK
TP4

No

Check the CAM_PCLK
TP3

No

Camera is OK

Yes

Change the Main board

Change the Camera Module

END

No
Change the Main board

LGE Internal Use Only

- 58 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

Camera Troubleshooting
Camera Troubleshooting
TP4
TP4
TP3
TP3

TP1

TP2

TP1

TP2
TP3

TP1

TP2

TP3

TP4

TP4

CAM_70MHz PCLK

CAM_24MHz MCLK

CAM_70MHz PCLK

CAM_24MHz MCLK

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 59 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Main side view LED Troubleshooting
4.6 Main side view LED Troubleshooting
MAIN Key Pad LED is on as below :
Key pressing Æ LED_CON go down low (below 0.8v) Æ MAIN Key Backlight LED On

START

Key press

+VPWR is above 3.2V?

No

Check battery

Yes
When the LCD is on,
TP1 is below 0.8v

No

Change QSC6270

Yes
LED ON ?

No

Change LED

Yes
END

LGE Internal Use Only

- 60 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

Slide Key side view LED Troubleshooting
4.7 Slide Key side view LED Troubleshooting
Sub Key Pad Slide is on as below :
Key pressing Æ LED_CON go down low (below 0.8v) Æ Sub Key Backlight LED On

START

Key press

+VPWR is above 3.2V?

No

Check battery

Yes
When the LCD is on,
TP2 is below 0.8v?

No

Change the FPCB
or KEY PCB

Yes
LED ON ?

No

Change the MAIN PCB

Yes
END

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 61 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Slide Key side view Troubleshooting

MAIN

TP1
LED

TP1

SLIDE
LED

SUB KEY B/L
WLED_VOUT

LD103

TP2

LD104

LD105

LD106

LD107

LD108

R107

R108

R105

R106

R109

R110

10

10

10

10

10

10

SLIDE_KEY_LED
VA101

TP2

LGE Internal Use Only

- 62 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

LCD Troubleshooting
4.8 LCD Troubleshooting
LCD control signals are generated by QSC6270.
The signal path is : QSC6270 Æ CN102 Æ LCD Module

START

Press END key

Key LED is on?

No

Move to KEY LED Troubleshooting

Yes
Disconnect and reconnect
The LCD connector
(Slide PCB CN102,CN101)

LCD display OK?

Yes

END

No
Change the FPCB

LCD display OK?

Yes

END

No
Change SUB PCB

LCD display OK?

Yes

END

No
Change the Main Board

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 63 -

LGE Internal Use Only

4. TROUBLE SHOOTING
LCD Troubleshooting

[Slide Side view placement]

LGE Internal Use Only

- 64 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

Vibrator Troubleshooting
4.9 Vibrator Troubleshooting
Vibrator is operate when DC motor driver is enabled.

START

Operate the Vibrator

CN803(Main B/d)
and CN101(motor_FPCB) are well
connected ?

No

Reconnect Board to FPCB connector

Yes
Wired
Vibrator to FPCB
”VIB”?

No

Solder the wire on to FPCB

Yes
LINMOT_P
above 3.0V or LINMOT_M
below 1V?

Yes

Change vibrator or
Change the Main PCB

No

Change vibrator or
Change the Main PCB

No
Change the FPCB

working?
Yes
END

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 65 -

LGE Internal Use Only

4. TROUBLE SHOOTING

F_SUB_FPCB to Main PCB Connector(CN101)

Motor Pad(CN101)

22
1

Main to F_SUB_FPCB Connector(CN803)

LGE Internal Use Only

- 66 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.10 Receiver Path
QSC6270(3G disable) EAROP(EARON) Æ TP1_CN801(Main to Slide FPCB Connector) 2,3 PIN
Æ TP2_CN103(=Slide FPCB to Main PCB Connector) 2, 3 PIN Æ TP3_FB101, FB102(of F_SLIDE_ FPCB)
TP4_CN101(= Receiver Pad of F_SLIDE_ FPCB )

START

Connect the phone to network
Equipment and setup call
Setup 1KHz tone out

Can you hear the tone?

Yes

END

No
The sine wave appears at
Receiver Pad(TP4)

Yes

Re-Solder Receiver
Change the Receiver

Yes

Change F_SLIDE_FPCB

Yes

Re-Solder FB101,FB102
Change F_SLIDE_FPCB

Yes

Re-Connect CN103
Change F_SLIDE_FPCB

No
The sine wave appears at
TP3_FB101, FB102?
No
The sine wave appears at
TP2_CN103 2,3 PIN?
No
The sine wave appears at
TP1_CN801 2,3 PIN?
No
Change the QSC6270
Change the Main PCB

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 67 -

LGE Internal Use Only

4. TROUBLE SHOOTING

LCD_DATA[7]
LCD_DATA[6]
LCD_DATA[5]
LCD_DATA[4]
15pF
LCD_MAKER_ID

LCD_RST_N
LCD_VSYNC_OUT

RCV_P

RCV_N
15pF

TP1
VCOIN

1
TP1

27

Main to Slide FPCB Connector(CN801)

15pF

LGE Internal Use Only

- 68 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

TP4_Receiver PAD=CN101

TP3_FB102

TP3_FB101

TP3

RCV_P
RCV_N

100n

1

FB102

100n

2

TP4

VA102

VA101

39pF

39pF
C102

TP3

C101

TP4

CN101

FB101

Can be Changed to TVS or ECLAMP

CN103
1

54

2

RCV_N
3

RCV_P

53

TP2

LCD_MAKER_ID
52

LCD_DATA[15]

4

51

5

50

LCD_DATA[14]

TP2
Slide FPCB to Main PCB
Connector(CN103)

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 69 -

1

27

LGE Internal Use Only

4. TROUBLE SHOOTING

4.11 Headset path
QSC6270(3G disable) HPH_OUT_L_P/N Æ TP1_C506,C507 Æ IC501(Audio Sub System) Æ
TP2_R504,R505 Æ TP3_FB504, FB505 Æ J501(=3.5pi Ear-jack)

START

Connect the phone to network
equipment and setup call.
Setup 1KHz tone out and insert headset.

Can you hear the tone?

Yes

END

No
Sine wave appears at
TP3_FB504, FB505

Yes

Re-solder or Change J501
Change the Main PCB

Yes

Re-solder the FB504, FB505
Change the Main PCB

Yes

Change the IC501

No
Sine wave appears at
TP2_R504, R505?
No
Sine wave appears at
TP1_C506, C507?
No
Change the Main board

LGE Internal Use Only

- 70 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

TP3_FB505
TP3_FB504

TP2_R505

HS_MIC_P|Hook_ADC
HS_OUT_L
HS_OUT_R
FM_ANT

TP2_R504

TP2

TP3

TP2

TP3

NC

HS_GND

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 71 -

LGE Internal Use Only

4. TROUBLE SHOOTING

HS_R
HS_L
SPK_N
SPK_P

TP1

SPK_OUT_P
SPK_OUT_N

TP1

HS_OUT_L
HS_OUT_R

GND

MUIC_AUD_FM_I2C_SCL
MUIC_AUD_FM_I2C_SDA
WM9093 is possible to 1.8 & 2.6 IO When HPVDD is 1.8V

TP1_C507 TP1_C506

LGE Internal Use Only

Audio Sub system IC501

- 72 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.12 Speaker/Speaker Phone path
QSC6270 LINE_OUT_L_P/LINE_OUT_R_N ÆTP1_C508, C509Æ Audio Sub System(IC501) Æ TP2_FB507, FB508 Æ
TP3_CN803 1/2, 3/4 PIN(=Main to F_SUB_FPCB Connector) Æ TP4_CN101 1,2 PIN(=F_SUB_FPCB to Main PCB
Connector) Æ TP5_CN102(= Speaker Pad of F_SUB_FPCB)

START
Connect the phone to network
Equipment and setup call
Setup 1KHz tone out

Can you hear the tone?

Yes

END

No
Sine wave appears at
TP5_Speaker Pad

Yes

Re-Solder Speaker Pad
Change the Speaker

Yes

Change the F_SUB FPCB

Yes

Re-Connect the CN101
Change the F_SUB FPCB

Yes

Change the Main PCB

Yes

Change the IC501

No
Sine wave appears at
TP4_CN101 1,2 PIN
No
Sine wave appears at
TP3_CN803 1/2, 3/4 PIN
No
Sine wave appears at
TP2_FB507, FB508
No
Sine wave appears at
TP1_C508, C509
No
Change the QSC6270
Change the Main board

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 73 -

LGE Internal Use Only

4. TROUBLE SHOOTING

HS_R
HS_L
SPK_N
SPK_P

TP2
TP2

TP1

SPK_OUT_P
SPK_OUT_N

HS_OUT_L
HS_OUT_R

TP1
GND

MUIC_AUD_FM_I2C_SCL
MUIC_AUD_FM_I2C_SDA
WM9093 is possible to 1.8 & 2.6 IO When HPVDD is 1.8V

TP1_C509 TP1_C508

LGE Internal Use Only

Audio Sub
System(IC501)

TP2_FB507

- 74 -

TP2_FB508

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

TP3
TP3

TP3

1

10

Main to F_SUB_FPCB
Connector(CN803)

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 75 -

LGE Internal Use Only

4. TROUBLE SHOOTING

CN101
G1

G2

1

SPK_OUT_P
SPK_OUT_N

MOTOR_POWER_N
VBAT

20

2

18

4

17

5

16

6

15

7

14

8

13

9

12

10

11
G3

MSD_D[2]
MSD_D[3]
MSD_CMD

19

TP4

3

VREG_MICROSD_3V0
MSD_CLK

MSD_D[0]
MSD_D[1]

G4

TP4

1
10

F_SUB_FPCB to Main PCB
Connector(CN101)

LGE Internal Use Only

- 76 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

TP5
CN102
1

SPK_OUT_P

2

SPK_OUT_N

Can be Changed to TVS or ECLAMP

TP5_CN102(=Speaker Pad)

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 77 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.13 Main microphone
MIC501 Æ VMIC_BIAS_P(TP1_C526) Æ MAIN_MIC_P(TP2_C261) Æ MIC1P PAD of QSC6270(3G disable)

START

Make a call

MIC_BIAS(TP1_C526)
is about 1.8V?

No

Change the Main board

Yes
Make sound to MIC

Sine wave appears at
TP2_C261?

No

Change the MIC

Yes
Change the Main board

LGE Internal Use Only

No

Work well?

- 78 -

Yes

END

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

TP2

MAIN_MIC_P
MAIN_MIC_GND

TP1

TP2_C261

TP1_C526

MIC501

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 79 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.14 Headset microphone
3.5 pie Headset ÆHS_MIC_BIAS(TP1_R502) Æ HS_MIC_P(TP2_FB503) Æ HS_MIC_P(TP3_C263)
Æ MIC2P PAD of QSC6270(3G disable)

START

Insert Headset & Make a call

TP1_R502 is About 1.8V ?

No

Change the LDO(U501)
Change the Main board

No

Re-Solder FB503
Change the MAIN board

No

Re-Solder C263
Change the MAIN board

Yes
Sine wave appears at
TP2_FB503?
Yes
Sine wave appears at
TP3_C263?
Yes
Change the Headset
Change the MAIN board

LGE Internal Use Only

- 80 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

TP3

HS_GND

VREG_MSMP_2V6
´ëüǰ : EUSY0407501

RP183K181D is possible to 1.8 & 2.6 IO

TP1

HS_JACK_DET

TP2
HS_MIC_P|Hook_ADC
HS_OUT_L
NC
HS_OUT_R
FM_ANT

HS_GND

TP2_FB503

TP1_R502

U501

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 81 -

TP3_C263

LGE Internal Use Only

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG
4.15 RF
RFComponent
Component
MAIN board Bottom

U201

X202

FL101

SW101
U101

Reference

Description

Reference

Description

U201

QSC6270 3G disable

FL101

FEM

X202

XO

SW101

RF connector

U101

GSM(EDGE) TX PAM

RF component (GSM)

LGE Internal Use Only

- 82 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
4.16
Path
4.16 RF
RF Path
4.16.1 GSM path

TX Path

RX Path

Tx/RX Path

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 83 -

LGE Internal Use Only

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G

4. TROUBLE SHOOTING

4.17 Trouble Shooting of GSM Part
(GSM850/GSM900/1800/1900)

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G

=

LGE Internal Use Only

- 84 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

START

Setup Test Equipnment
Cell power = -74dbm
EGSM CH: 38
DCS1800 CH: 698
PCS1900 CH: 661
GSM850 CH: 190

Check M/S & FEM
(SW101 & FL101)

Check
Rx Part

Check
Tx Part

END

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 85 -

LGE Internal Use Only

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
4. TROUBLE SHOOTING
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
4.17.1 Checking Front-End Module Block
4.17.1 Checking Front-End Module Block

Setup Test Equipnment
Cell power = -74dbm
EGSM CH: 38
DCS1800 CH: 698
PCS1900 CH: 661
GSM850 CH: 190

Check TP3=2.85V?

No

Check U201

Yes
Check the logic in each
Mood TP1~TP2 high level
2.85V ≥ Vcc ≥ L4V?

No

Replace FL101

Yes
END

LGE Internal Use Only

- 86 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING
51

TP4

ANT_FEED

51
51

TP1
TP2

51
850, 900,1800,1900MHz

TP3R109

51

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

51

51 51

- 87 -

LGE Internal Use Only

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌H
㡸G 㵲㡸G ㍌
4.17.2 Checking GSM Rx part

START

Check TP1~TP3
Signal exist?

No

Check FEM & Soldeing of TPs

Yes

Rx still has problem?

51 51 51 51
No

GSM Rx is OK

Yes
Re-download & calibration

TP1

RX_GSM850_M

RX_GSM850_P

TP2

TP3

RX_DCS1800_M

RX_DCS1800_P

TP4

LGE Internal Use Only

- 88 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
4. TROUBLE SHOOTING
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
4.17.3 Checking GSM Tx part
4.17.3 Checking GSM Tx part

Setup Test Equipnment
Cell power = -60dbm
Tx Power Level Set
GSM850/GSM900 = 5,
DCS/PCS = 0
Yes

Yes

Is the level of TP4 same
to Table 4.17.3

No

Check U201

Yes
TP2, 30dBm over?
TP3, 33dBm over?

No

Yes

Yes
Check TP1,
GSM850, EGSM 32dBm
DCS,PCS 29dBm over?

Remove U101 and check
The power of pin1, pin8 (on board)

No

The power of pin1, pin8

No

Check U201

Yes
Re-download & calibration

Replace U101

Table 4.17.3 GPAM Logic Control

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 89 -

LGE Internal Use Only

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G

LGE Internal Use Only

- 90 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
4.18 Checking Bluetooth Block
4.18.1 BLUETOOTH RF components

ANT

FL701
U703
X702
RF component ( BT )
- Main board bottom -

Reference

Description

ANT

BT Pattern ANT

U703

BT module_BCM2070

FL701

Band pass filter

X702

26Mhz crystal

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 91 -

LGE Internal Use Only

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
4.18.2 BLUETOOTH SIGNAL PATH

Bluetooth Signal PATH (Main board bottom)

Bluetooth T/Rx PATH

LGE Internal Use Only

- 92 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
4. TROUBLE
SHOOTINGG
㡸G 㵲㡸G
㍌G 㛺㏩⏼␘UG
G
4.18.3 BLUETOOTH Trouble shooting
4.18.3 BLUETOOTH Trouble shooting

START

Check TP1, TP2
Signal exist?

No

Change the main board

Yes
Check TP3
IS clock OK?

No

Check X700

Yes
Check TP4
Signal exist?

No

Check U700

Yes
Change the main board

TP#

TP description

TP1

VREG_MSMP_2.6V

TP2

VREG_MSME_1.8V

TP3

BT_CLK(26Mhz)

TP4

BT_ANT_OUT

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 93 -

LGE Internal Use Only

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G

{w[G

{wX

{wYG

{wZG

Connectivity_ANT_PAD
WLAN_BT_ANT_FEED

BT_ANT_FEED

LGE Internal Use Only

- 94 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
{wX
When power class 1.5 is used, R307 is populated and R308 is depopulated.
(Vice versa for power class 2)

TP1

Class{wY
1.5
TP2
RTC_32K

BT_ANT_FEED

RTC_32K768

must have 1% tolerance

{w[G
TP4

can be removed
BT_RST_N
BT_PWR_ON

D4
E4
C4
A4

RTC_32K768

TP3

26MHz

BT_PCM_OUT
BT_PCM_IN
BT_PCM_CLK
BT_PCM_SYNC
BT_UART_RX
BT_UART_TX
BT_UART_CTS
BT_UART_RTS

BT_WAKEUP
BT_WAKEUP_HOST

{wZ

[BT main clk : 26MHz]

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 95 -

LGE Internal Use Only

㵬㦤G
㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
4.㝘⪌HG
TROUBLE
SHOOTING
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
4.19 Checking FM Radio Block
4.19.1 FM Signal Path

|^WX

LGE Internal Use Only

Reference

Description

U701

TEA5991(FM module)

- 96 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.19.2 FM Trouble shooting

START

TP1, TP2 Check the Sianal

No

Change the main board

Yes

TP3 Check the Signal

No

Change the Ear Jack

Yes

TP4 Check the Signal

No

Change the U601

Yes
Change the main board

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 97 -

LGE Internal Use Only

4. TROUBLE SHOOTING
㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘U

TP1XUXUX
TP2

{wYG

TP3
{wZG

{w[G

TP4

VREG_MSMP_2.6V

TP2

VREG_MSME_1.8V

TP3

FM_ANT_IN

TP4

FM_OUT_AUDIO signal

RTC_32K

TP1

MUIC_AUD_FM_I2C_SDA

TP description

MUIC_AUD_FM_I2C_SCL

TP#

VREG_MSME_1V8
VREG_MSMP_2V6

TP2

TP4
FM_R
FM_L
FM_ANT

TP3

TP1

Close to QSC

Close to ANT

LGE Internal Use Only

- 98 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

5. DOWNLOAD

5. DOWNLOAD

5. DOWNLOAD
DOWNLOAD

LG-C320

LG-C320

Copyright
© 2010
LG Electronics. Inc. All right reserved.
LGE
Internal
Use Only
Only for training and service purposes

99 -- -164

LGE
Use Only
Copyright © 2010 LG Electronics. Inc.
AllInternal
right reserved.
Only for training and service purposes

5. DOWNLOAD

5. DOWNLOAD

LG-C320

LG-C320

LG-C320

LGE Internal
Copyright
© Use
2010Only
LG Electronics. Inc. All right reserved.
Only for training and service purposes

100 ---165

Copyright © 2010 LG Electronics.LGE
Inc.Internal
All rightUse
reserved.
Only
Only for training and service purposes

5. DOWNLOAD

5. DOWNLOAD

LG-C320

LG-C320

Copyright
© 2010
LG Electronics. Inc. All right reserved.
LGE
Internal
Use Only
Only for training and service purposes

101 -- 166

LGEAllInternal
Use Only
Copyright © 2010 LG Electronics. Inc.
right reserved.
Only for training and service purposes

5. DOWNLOAD

5. DOWNLOAD

LG-C320

LG-C320

LG-C320

LGE Internal
Copyright
© Use
2010Only
LG Electronics. Inc. All right reserved.
Only for training and service purposes

102 ---167

Copyright © 2010 LG Electronics.LGE
Inc.Internal
All rightUse
reserved.
Only
Only for training and service purposes

5. DOWNLOAD

5. DOWNLOAD

LG-C320

Copyright
© 2010
LG Electronics. Inc. All right reserved.
LGE
Internal
Use Only
Only for training and service purposes

103 -- 168

LGEAllInternal
Use Only
Copyright © 2010 LG Electronics. Inc.
right reserved.
Only for training and service purposes

5. DOWNLOAD

LGE Internal
Copyright
© Use
2010Only
LG Electronics. Inc. All right reserved.
Only for training and service purposes

5. DOWNLOAD

104 ---169

Copyright © 2010 LG Electronics.LGE
Inc.Internal
All rightUse
reserved.
Only
Only for training and service purposes

5. DOWNLOAD

5. DOWNLOAD

Copyright
© 2010
LG Electronics. Inc. All right reserved.
LGE
Internal
Use Only
Only for training and service purposes

105 -- 170

LGEAllInternal
Use Only
Copyright © 2010 LG Electronics. Inc.
right reserved.
Only for training and service purposes

5. DOWNLOAD

LGE Internal
Copyright
© Use
2010Only
LG Electronics. Inc. All right reserved.
Only for training and service purposes

5. DOWNLOAD

106 ---171

Copyright © 2010 LG Electronics.LGE
Inc.Internal
All rightUse
reserved.
Only
Only for training and service purposes

5. DOWNLOAD

5. DOWNLOAD

Copyright
© 2010
LG Electronics. Inc. All right reserved.
LGE
Internal
Use Only
Only for training and service purposes

107 -- 172

LGEAllInternal
Use Only
Copyright © 2010 LG Electronics. Inc.
right reserved.
Only for training and service purposes

5. DOWNLOAD

LGE Internal
Copyright
© Use
2010Only
LG Electronics. Inc. All right reserved.
Only for training and service purposes

5. DOWNLOAD

108 ---173

Copyright © 2010 LG Electronics.LGE
Inc.Internal
All rightUse
reserved.
Only
Only for training and service purposes

5. DOWNLOAD

5. DOWNLOAD

LG-C320
LG-C320

LG-C320

LG-C320
LG-C320

LG-C320

LG-C320 LG-C320

Copyright
© 2010
LG Electronics. Inc. All right reserved.
LGE
Internal
Use Only
Only for training and service purposes

109 -- 174

LGEAllInternal
Use Only
Copyright © 2010 LG Electronics. Inc.
right reserved.
Only for training and service purposes

5. DOWNLOAD

5. DOWNLOAD

LG-C320 LG-C320

LG-C320

LG-C320

LG-C320

LGE Internal
Copyright
© Use
2010Only
LG Electronics. Inc. All right reserved.
Only for training and service purposes

LG-C320

LG-C320

110 ---175

Copyright © 2010 LG Electronics.LGE
Inc.Internal
All rightUse
reserved.
Only
Only for training and service purposes

5. DOWNLOAD

5. DOWNLOAD

LG-C320

LG-C20

LG-C20
LG-C20

Copyright
© 2010
LG Electronics. Inc. All right reserved.
LGE
Internal
Use Only
Only for training and service purposes

111 -- 176

LGEAllInternal
Use Only
Copyright © 2010 LG Electronics. Inc.
right reserved.
Only for training and service purposes

6. BLOCK DIAGRAM

6. BLOCK DIAGRAM

LGE Internal Use Only

- 112 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. BLOCK DIAGRAM

51#F653#KZ#Eorfn#Gldjudp#=#Srzhu#b4#
ESC6270_BB/RF

ESC6270 POWER
ESC6270_POWER
VSW_MSMC ( 500mA)

TA (5PIN)
5.1V,700mA

USB_VBUS

VSW_RF1 ( 500mA)

Charger IC

VBAT

VSW_RF2 ( 500mA)

VREG_MSMC_1V2

VDD_CORE
VREG_RFRX2_1V3
VREG_RFTX2_1V3

VREG_RF1_2V3

VDD_RFRX
VDD_RFTX

VREG_RFA_2V2
VDD_RFA

VBUS_LDO_4.9V
MU_IC

VREG_RF2_1V4

VBAT

VDD_P1

VREG_MPLL (150mA)

VDD_P2

VREG CDC2 (150mA)
VREG_CDC2

Battery
900mAh

VREG_RX2 (150mA)

VDD_P5

VREG_TX2 (150mA)

VDD_P6

VREG_RFA (300mA)

VREG_MSME (300mA)

VREG_MSMP ( 300mA)

VREG_MSME_1V8

VREG_MSMP_2V6

MCP
SDRAM (1.8V , MAX

180mA )

NAND (1.8V , MAX

30mA )

HALL IC(1.8V, )

KEYCODE IC(1.8V, ?mA)

FM RADIO
1.8V(,
MOTOR

MOTOR_POWER_N

VIB_DRV_N

mA

2.6V( , mA
BT only MODULE

VREG_GP1 (150mA)

1.8V(,

VREG_USB_2.6V ( 50mA)

mA

2.6V( , mA

VREG_USB_3.3V ( 50mA)
VREG_TCXO ( 50mA)

VREG GP2 ( 300mA)
VREG_GP2

BACKUP Battery

VCOIN

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

VCOIN (3.0V, )

VREG_USIM (150mA)

- 113 -

VREG_MICROSD_3V0
VREG_USIM_2V85

MICRO SD slot (3.0V
(3 0V , , MAX

mA )

USIM SLOT (2.85V )

LGE Internal Use Only

6. BLOCK DIAGRAM

51#F653#KZ#Eorfn#Gldjudp#=#Srzhu#b5#
VBAT
RT9396

LDO1(150m A )

(SUB PMIC)

LDO2( 150mA )

2.4” LCD MODULE

VLDO_CAM_2V8

LCD_2.8V(,

VLDO_CAM_1V8

2MEGA CAMERA

VLDO LCD 2V8
VLDO_LCD_2V8

LDO3(300m A )

CAM_2.8V(,

VLDO_LCD_1V8

LDO4( 500mA )

mA

CAM _1.8V( , mA

WLED_VOUT

WLEDOUT( 4.8V, 450mA )

mA

LCD _1.8V( , mA

WLED ( ,120mA )

GSM PAM (TQM7M5012)

VBAT
AUDIO SUB SYSTEM
1.8V(,

VREG_MSME_1.8V

mA

VDD

LDO(150mA)

EAR_JACK DET.
VDD_TCXO

LDO(150mA)

WIFI_TCXO
WIFI/BT/FM MODULE
WIFI(,

VREG_MSMP_2V6

LGE Internal Use Only

OPTION

mA

BT( , mA

- 114 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. BLOCK DIAGRAM

61#F653#KZ#Eorfn#Gldjudp#=#EE
EBI2_DATA [ 0:15]
NAND CS1_N
NAND_
N
VREG _MSME _1. 8V

From PMIC

CAM _MCLK
CAM _PCLK

EBI2 _ALE

CAM _DATA [2:9]

EBI2 _CLE

CAM_HSYNC/VSYNC

EBI2_OE_N

Memory
2 Gb NAND
+
1 Gb SDRAM

2M
CAMERA

MEGA _CAM _RESET_N

EBI2_WE_N

( H8BCS0SIOBAR)

CAM_ I 2C _SCL/SDA

NAND _READY

MEGA _CAM _PWDN

RESOUT_N

LCD _VSYNC _OUT

SDRAM DATA [0: 31]
SDRAM_DATA

VBAT

LCD_IF_MODE

SDRAM _ADDR[0:14]

LCD _LDO_2.8V

LCD_MAKER _ID

SDRAM _CLK

LCD _LDO_1.8V

LCD_RESET_N

SDRAM _CS_N(0)

SDRAM_ OE _N

EBI2_DATA [0:15]

SDRAM _WE_N

LCD _CS _N

SDRAM _CLK (0)

LCD_ADS

WLED _1:3

LCD

EBI2_WE_N / EBI2_OE_N

SDRAM_ADV_N

LDO

CHARGE
PUMP

MLED_OUT

LDO_EN
I2C_SDA , I2C_SCL

From QSC

SDRAM _DQM[0:3]
BT _UART _TXD
BT_UART _RXD
MSME_1. 8V

MICRO_DETECT_N

BT _UART _RTS

BLUE TOOTH

MICRO SD
CONNECTOR

MICROSD_CMD/CLK

BT _PCM_SYNC

BT _ANT

From BT chip ANT .

MICROSD_DATA [0:3]

BT _UART _CTS

MSMP_2. 6V

BT _PCM
PCM _IN
IN

USIM _DATA / CLK / RESET
_ _N

BT _PCM_OUT
BT _PCM_CLK
BT_WAKEUP _MSM

Crystal
From SLEEP_CLK
Of QSC6270

BT _ REG _ ON

QSC6270

WLAN_SDIO[0:3]
WLAN_COMMEND

MSME_1. 8V

WLAN_CLK

MSMP_2. 6V

BT _UART _TXD
BT_UART _RXD

KEYCODE_INTERRUPT

KEYCODE
IC

KEYCODE RESET
KEYCODE__RESET
KEYCODE__I2C

XTAL _IN

VBAT

WLAN&BT ANT

KEY_ROW[0:7]

KEY_COL[0:7]

QWERTY
KEY &
NAVI _KEY

MUIC_FM_AUDIO_I2C _SDA(GPIO49_P1_1.8V)

MUIC /AUDIO
FM RADIO

32.768KHz
Oscillator

XTAL _OUT

MMP_XTAL _OUT

FM RADIO
Charge
Pump

19.2MHz
XO

BT _UART _CTS

MUIC_FM_AUDIO_I2C _SCL(GPIO 50_P1_1.8V)
MUIC_INT(GPIO 10_P1_1.8V)

QSC GPIO

CP_ I2C_SDA(GPIO 70_P3_2.85V)
CP_ I 2C _SCL(GPIO71_P3_2.85V)

BT _UART _RTS

WIFI &BT
MODULE

BT _PCM_SYNC

SLIDE_DETECT

HALL _IC

VREG _MSME_1. 8V

BT _PCM _IN
BT _PCM_OUT
BT _PCM_CLK

From SLEEP_CLK
Of QSC6270

I2C COMM.

VREG_USIM_2.85V

BT_RESET_N

32.768KHz

VBAT

From WLAN&BT chip ANT .

SIM
CONNECTOR

DC MOTOR

MOTOR DRIVE

MSM_WAKEUP_BT

26 MHZ

VREG_MICROSD_3.0V

Crystal

BT_WAKEUP _MSM

26 MHZ

MSM_WAKEUP_BT

SLIDE KEY
_
LED

VBAT

QWETY KEY
_
LED

VBAT

JTAG_TDI
JTAG_TCK
JTAG_TMS
JTAG_TRST_N
JTAG_TDO
JTAG_RTCK

JTAG

BT RESET N
BT_RESET_N

32 768KH
32.768KHz

BT_ REG _ ON

USB D +/-

VBAT

UART1_RX/TX

OPTION

USB_VBUS

MUIC

BOOST_5V

MUIC_AUDIO_ I2C_SCL
HP_EAR_R

To. MMI CON.

HP_EAR_L

SPK +/-

AUDIO
SUB
S S
SYSTEM
( WM9093ECS-R )

MUIC_AUDIO_ I 2C_SDA
SPK _R/L
HP_R/ L

USB _ID

MUIC_INT

5PIN
MICRO
MMI
CONN.

I2C_SDA / SCL
FM RADIO I2C

FM RIGHT / LEFT
MIC_BIAS

USB +/-

MIC

MSME_1.8V

FM
R ADIO

MSMP_2.6V
32.768KHz

From SLEEP_CLK
Of QSC6270

FM ANT
RCV R / L

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 115 -

LGE Internal Use Only

6. BLOCK DIAGRAM
71#F653#KZ#Eorfn#Gldjudp#=#UIbJVP

LGE Internal Use Only

- 116 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. BLOCK DIAGRAM

81#F653#KZ#Eorfn#Gldjudp#=#Frqqhfwlylw|+EW2ZLIL2IP,brswlrq

EAR_
_JACK

VDD_TCXO

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 117 -

LGE Internal Use Only

6. BLOCK DIAGRAM

81#F653#KZ#Eorfn#Gldjudp#=#Frqqhfwlylw|+EW2IP,

E
EAR_JACK

E t
External
l XO

LGE Internal Use Only

- 118 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. BLOCK DIAGRAM

91#F653#KZ#Eorfn#Gldjudp#=#Phpru|

HYNIX MCP
( H8BCSOSIOBAR)
_CE

NAND Flash
(2Gbit)

ALE

NAND_ LB_N

CLE

NAND_UB_N

_RE
RE
_WE
RY_BY
_WP
IO[1:16]

SDRAM
(1Gbit)

NAND_WE_N

External
Memory
(MICRO SD)

NAND_WP_N
NAND_DATA[0:15]

CKE

DDR_CKE[0]
_

_CS

DDR_CS[0]_N
_

_RAS

DDR_RAS_N

_CAS
CAS

DDR_CAS_N

_WED

DDR_WE_N
_ _

DQ

MSD_CLK

NAND_BSY_N

DDR_M_CLK_N

ADDR

MSD_CMD

NAND_OE_N

CLK

DQM

MSD_D[0:3]

NAND_
_CS_
_N

ESC6270

SIM_CLK

DDR_DQM[0:1]
_

_
_
SIM_RST_N

DDR _ A[0:13]

SIM _DATA
MUSIM_DM

DDR _ D[0:15]

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

USIM
(SIM PLUS)

MUSIM_DP

- 119 -

LGE Internal Use Only

6. BLOCK DIAGRAM

:1#F653#KZ#Eorfn#Gldjudp#=#Dxglr

MICBIAS

HSED_BIAS

MIC1P

MIC1P

MIC1N

MIC1N

FM_L

LINE_IN_L_P

TEA5991

FM_R

LINE_IN_R_N

MIC2N

MIC2N

MIC2P

MIC2P

ESC6270
EAROP
EARON
HPH_OUT_L_P
HPH_OUT_R_N

RCV+

RXIN+

RCV-

RXIN-

HS_L
HS_R

HPR
HPL

HS_OUT_R
HS_OUT_L

IN1+
IN1
IN1-

WM9093
LINE_OUT_L_P
LINE OUT R N
LINE_OUT_R_N

SPK_P
SPK_N

IN2+
IN2
IN2OUT+

GPIO
GPIO

LGE Internal Use Only

MUIC_AUD_FM_I2C_SCL
MUIC_AUD_FM_I2C_SDA

SCL

OUT-

SPK_OUT_P
SPK_OUT_N

SDA

- 120 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. BLOCK DIAGRAM

;1#F653#KZ#Eorfn#Gldjudp#=#YLVXDO+#OFG#)#FDPHUD#,

CAM_I2C_SDA
CAM_I2C_SCL
CAM_MCLK
CAM_PCLK

2M Camera
Hynics sensor
Bayer RGB Output

CAM_RST_N
CAM_PWDN

C2FK-H313P

CAM_VSYNC

VBAT
VLDO_CAM_1V8
VLDO_CAM_2V8

RT9396GQW

CAM_HSYNC
CAM_DATA[0~7]

BL_LCD_CAM_LDO_EN

QSC6270
VREG_MSMP_2.6V

LCD DATA[0~15]
LCD_DATA[0~15]

VLDO_LCD_2V8

LCD_RS
VLDO_LCD_1V8

LCD_RST_N
LCD_CS_N
LCD_WR_N

2.4” TFT LCD
QVGA
CPU I/F

LCD RD
LCD_RD
LCD_VSYNC_OUT

DM24-DSM04

LCD_MAKER_ID

VBAT
WLED_OUT

RT9396GQW
5channel

WLED1
WLED2
WLED3
WLED4
WLED5
BL_LCD_CAM_LDO_EN

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 121 -

LGE Internal Use Only

LGE Internal Use Only

- 122 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

7. CIRCUIT DIAGRAM

1-2-1-3_ESC-Quad EDGE
ANTENNA SWITCH MODULE LOGIC
RX_GSM850_M

ANT_SEL0

ANT_SEL1

GSM850/EGSM TX
RX_GSM850_P

PCN/PCS TX

ANT_FEED

GSM850 RX
EGSM RX
PCN RX
PCS RX
RX_DCS1800_M

RX_DCS1800_P
ANT_FEED

850, 900,1800,1900MHz

6 dB

R109
GSM_PA_BAND

MODE

6 dB

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 123 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

2-2-2-1_ESC_ESC6270

VMIC_BIAS_P

MSM_RESIN_N

SLIDE_KEY_LED
MAIN_KEY_LED
MOTOR_POWER_N
HOOK_ADC

XTAL_19M_OUT

GND

XTAL_19M_IN

RTC_32K

PS_HOLD

PM_ONSW_N

GSM_PA_EN
GSM_PA_BAND

32.768KHz

BAT_ID

XO_ADC_IN

XO_ADC_IN

VREG_RF2_1V4|VREG_RF2

RX_DCS1800_M
RX_DCS1800_P
RX_GSM850_M
RX_GSM850_P
RX_PCS1900_M
RX_PCS1900_P

RX_EGSM_M
RX_EGSM_P

GSM_HB_TX
GSM_LB_TX

GSM_PA_RAMP

VREG_RFRX2_1V3

- Normal Audio Power : +VPWR

VREG_RFA_2V2

VSW_RF1
VREG_RF1_2V3|VREG_RF1
VSW_RF2
VREG_RF2_1V4|VREG_RF2
VSW_MSMC
VCOIN

VREG_RFTX2_1V3

VBAT

VREG_MSMP_2V6

19.2MHz

XTAL_19M_IN
TP_UART_TX
TP_UART_RX

XTAL_19M_OUT

UART_TX

UART_RX
BT_UART_TX

UART_BT_SW
BT_UART_RX

LGE Internal Use Only

- 124 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

7. CIRCUIT DIAGRAM

VBAT
PM_ONSW_N
USB_VBUS
TP_UART_TX
TP_UART_RX

UTXD
URXD
PWR
VBAT
ON_SW
VCHAR
TX
RX
GND

HS_GND|GND

3G

UART_TX

UART_RX

MAIN_MIC_P
MAIN_MIC_GND

2.5G

MAIN_MIC_GND|GND
HS_GND

12
11
10
9
8
7
6
5
4
3
2
1

VREG_MSME_1V8
FM_L
FM_R

UART_BT_SEL

JTAG_TCK
JTAG_TMS
JTAG_TRST_N
JTAG_TDO

JTAG_TDI
PS_HOLD
MSM_RESIN_N
JTAG_RTCK

2-2-2-1_ESC_ESC6270

HALL_SENS_DET
BT_RST_N
BT_WAKEUP_HOST
MUSIM_DP
MUSIM_DM
WLAN_CLK
WLAN_SDIO[3]
WLAN_SDIO[2]
WLAN_SDIO[1]
WLAN_SDIO[0]
WLAN_CMD

NET Conn
RESOUT_N|NAND_WP_N
DDR_A[14]|DDR_BA[00]
DDR_A[15]|DDR_BA[01]

BT_PWR_ON
LCD_IF_MODE[0]
HS_JACK_DET
WLAN_BT_REG_ON
LCD_RST_N

WLAN_RST_N

NAND_D[00]|LCD_DATA[0]
BL_LCD_CAM_LDO_I2C_SDA
BL_LCD_CAM_LDO_I2C_SCL
MUIC_AUD_FM_I2C_SCL
MUIC_AUD_FM_I2C_SDA

NAND_D[01]|LCD_DATA[1]
MUIC_INT_N

NAND_D[02]|LCD_DATA[2]
NAND_D[03]|LCD_DATA[3]
NAND_D[04]|LCD_DATA[4]
NAND_D[05]|LCD_DATA[5]
NAND_D[06]|LCD_DATA[6]
NAND_D[07]|LCD_DATA[7]
NAND_D[08]|LCD_DATA[8]
NAND_D[09]|LCD_DATA[9]
NAND_D[10]|LCD_DATA[10]

CHG_STS_N
CHG_EN_N

NAND_D[11]|LCD_DATA[11]
NAND_D[12]|LCD_DATA[12]
NAND_D[13]|LCD_DATA[13]
NAND_D[14]|LCD_DATA[14]
NAND_D[15]|LCD_DATA[15]
NAND_WE_N|LCD_WR_N

NAND_OE_N|LCD_RD
High : BT UART
Low : UART Comm

BL_LCD_CAM_LDO_EN

UART_BT_SEL

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 125 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

3-3-1_6P_USIM
ENSY0024301

MCP2-1_2G_1G DDRx16_hynix
MUSIM_DM

DDR_A[00]
DDR_A[01]
DDR_A[02]
DDR_A[03]
DDR_A[04]
DDR_A[05]
DDR_A[06]
DDR_A[07]
DDR_A[08]
DDR_A[09]
DDR_A[10]
DDR_A[11]
DDR_A[12]
DDR_A[13]
DDR_D[00]
DDR_D[01]
DDR_D[02]
DDR_D[03]
DDR_D[04]
DDR_D[05]
DDR_D[06]
DDR_D[07]
DDR_D[08]
DDR_D[09]
DDR_D[10]
DDR_D[11]
DDR_D[12]
DDR_D[13]
DDR_D[14]
DDR_D[15]
DDR_DQM[0]
DDR_DQM[1]
DDR_DQS[0]
DDR_DQS[1]
DDR_M_CLK_N
DDR_M_CLK_P
DDR_CKE[0]
DDR_BA[00]
DDR_BA[01]
DDR_RAS_N
DDR_CAS_N
DDR_WE_N
DDR_CS[0]_N

LGE Internal Use Only

MUSIM_DP

NAND_D[00]
NAND_D[01]
NAND_D[02]
NAND_D[03]
NAND_D[04]
NAND_D[05]
NAND_D[06]
NAND_D[07]
NAND_D[08]
NAND_D[09]
NAND_D[10]
NAND_D[11]
NAND_D[12]
NAND_D[13]
NAND_D[14]
NAND_D[15]

NAND_WE_N
NAND_OE_N
NAND_LB_N
NAND_UB_N

NAND_CS_N

NAND_BSY_N
NAND_WP_N

- 126 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

7. CIRCUIT DIAGRAM

4-2-3-2
4-2-1-4

MUIC_IO_M
MUIC_IO_P
MUIC_ACC_ID

4-5-2-1

4-3-1-3

CHG_STS_N

VBUS_LDO_4V9

DNI

BAT_ID

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 127 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

5-1-2-1

5-4-1-1
VREG_MSMP_2V6

4-4-2-3
´ëüǰ : EUSY0407501

SPK_OUT_P
SPK_OUT_N
HS_R
HS_L
HS_OUT_L
HS_OUT_R

SPK_N
SPK_P

RP183K181D is possible to 1.8 & 2.6 IO

GND
HS_JACK_DET

MUIC_AUD_FM_I2C_SCL
MUIC_AUD_FM_I2C_SDA
WM9093 is possible to 1.8 & 2.6 IO When HPVDD is 1.8V

HS_MIC_P|Hook_ADC
HS_OUT_L
NC
HS_OUT_R
FM_ANT

HS_GND

LGE Internal Use Only

- 128 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

7. CIRCUIT DIAGRAM

6-2-2-1

6CH+4LDO,PWM

R603

WLED1

8

3

7

4

6

5

9

2

10

1

BL_LCD_CAM_LDO_I2C_SCL
BL_LCD_CAM_LDO_I2C_SDA

8

3

7

4

6

5

9

2

9

2

8

3

7

4

6

- 129 -

10

1

5

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10

1

LGE Internal Use Only

RTC_32K

Connectivity_ANT_PAD

MUIC_AUD_FM_I2C_SDA

MUIC_AUD_FM_I2C_SCL

7. CIRCUIT DIAGRAM

VREG_MSME_1V8
VREG_MSMP_2V6

WLAN_BT_ANT_FEED

BT_ANT_FEED

FM_R
FM_L
FM_ANT

Close to QSC
Close to ANT

VREG_MSME_1V8

QCT

VREG_MSME_1V8

VFM_PWR

QCT

VFM_PWR

When power class 1.5 is used, R307 is populated and R308 is depopulated.
(Vice versa for power class 2)

Class 1.5

RTC_32K

RTC_32K768

must have 1% tolerance
can be removed
BT_RST_N
BT_PWR_ON

BT_ANT_FEED

RTC_32K768

26MHz

BT_WAKEUP

D4
E4
C4
A4

BT_PCM_OUT
BT_PCM_IN
BT_PCM_CLK
BT_PCM_SYNC
BT_UART_RX
BT_UART_TX
BT_UART_CTS
BT_UART_RTS

BT_WAKEUP_HOST

VBAT
VBT_WIFI_IO_2V6

LGE Internal Use Only

QCT

VBAT

IFX

VBAT

QCT

VREG_MSMP_2V6

IFX

VPM_IO_2V62

- 130 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

7. CIRCUIT DIAGRAM

LCD_MAKER_ID

8-1-1-1

LCD_RST_N
LCD_VSYNC_OUT

VREG_MSMP_2V6

15pF
RCV_N
15pF

RCV_P

LCD_DATA[7]
LCD_DATA[6]
LCD_DATA[5]
LCD_DATA[4]

HALL_SENS_DET

15pF

VCOIN
15pF
LCD_DATA[11]
LCD_DATA[10]
LCD_DATA[9]
LCD_DATA[8]

GND

VREG_LCD_2V8
VLDO_LCD_2V8
VLDO_LCD_1V8
WLED1

15pF

WLED2
LCD_RD

VREG_MSME_1V8

WLED3
WLED4
WLED5
SLIDE_KEY_LED
15pF



KEY_ROW0

WLED_VOUT

KEY_ROW1
KEY_ROW2

DOWN

PM_ONSW_N

KEY_ROW3
KEY_COL5

KEY_ROW5
KEY_COL4
KEY_ROW7

UP

KEY_ROW7

KEY_COL6

LCD_IF_MODE[1]

KEY_COL7

LCD_IF_MODE[0]

VREG_MSME_1V8

KEY_ROW6
KEY_ROW5
KEY_ROW4
KEY_ROW3
KEY_ROW2
KEY_ROW1
KEY_ROW0

Q

W&$

E&%

R&1

T&2

Y&3

U&*

O&&

P

A&[

S&]

D&'

F&4

G&5

H&6

K&{

L&}

BACK

FN

Z&+

X&=

C&7

KEY_COL0

KEY_COL1

J&#

KEY_COL2

I&^

25pF

25pF

V&8

KEY_COL3

@&/

B&9

N&0
'&.

SPACE

M&;

SYM

ENTER

CAM

SHIFT

TEXT

?&:

25pF

KEY_COL6
KEY_COL7

"&,

KEY_COL4

25pF

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 131 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

3-2-1-3_push_1.50T

MSD_D[2]
MSD_D[3]
MSD_CMD

MSD_D[0]

MOTOR_POWER_N

MSD_D[1]

VBAT

LGE Internal Use Only

- 132 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

7. CIRCUIT DIAGRAM

16

15

14

13

12

11

10

9

7

8

6

5

4

3

2

1

KEY PCB

L

K

L

K

LCD FILTER, ZIP CONNECTOR

Slide KEY PCB to Slide FPCB
ENBY0040501(GB042-50P-H10-E3000,SOCKET)

VLDO_LCD_1V8

J

CN101

LCD_DATA[7]
LCD_DATA[6]
LCD_DATA[5]
LCD_DATA[4]
LCD_DATA[3]
LCD_DATA[2]
LCD_DATA[1]
LCD_DATA[0]
LCD_RS
LCD_RD
LCD_WR_N
LCD_CS_N

I

LCD_RST_N
LCD_VSYNC_OUT
KEY_ROW0
KEY_ROW1
KEY_ROW2
KEY_ROW3
KEY_COL5
KEY_COL6
KEY_COL7

H

1

50

2

49

3

48

4

47

5

46

6

45

7

44

8

43

9

42

10

41

11

40

12

39

13

38

14

37

15

36

16

35

17

34

18

33

19

32

20

31

21

30

22

29

23

28

24

27

25

26

R102

R101

1

1

J

VLDO_LCD_2V8

CN102
1

LCD_MAKER_ID
LCD_DATA[15]
LCD_DATA[14]
LCD_DATA[13]
LCD_DATA[12]
LCD_DATA[11]
LCD_DATA[10]
LCD_DATA[9]
LCD_DATA[8]

2

LCD_VSYNC_OUT

3
4

LCD_MAKER_ID
LCD_DATA[0]
LCD_DATA[1]
LCD_DATA[2]
LCD_DATA[3]

VLDO_LCD_2V8
VLDO_LCD_1V8
LCD_IF_MODE[0]
LCD_IF_MODE[1]
WLED1
WLED2
WLED3
WLED4
WLED5
SLIDE_KEY_LED
PM_ONSW_N
WLED_VOUT

5
6
7

I

8

LCD_DATA[4]
LCD_DATA[5]

9

LCD_DATA[6]
LCD_DATA[7]
LCD_DATA[8]
LCD_DATA[9]
LCD_DATA[10]
LCD_DATA[11]
LCD_DATA[12]
LCD_DATA[13]
LCD_DATA[14]
LCD_DATA[15]

11

10
12
13
14
15
16
17
18
19
20

H

21

LCD_RD
LCD_WR_N
LCD_RS
LCD_CS_N

22
23
24

LCD_RST_N

25
26

LCD_IF_MODE[1]
LCD_IF_MODE[0]

27
28
29
30

C101

C102

0.1u

0.1u

G

WLED5
WLED4
WLED3
WLED2
WLED1
WLED_VOUT

31
32
33

G

34
35

F

F

SUB KEY B/L

SUB PCB KEY

E

E

WLED_VOUT
KEY_ROW3
KEY_ROW2
LD103

LD104

LD105

LD106

LD107

LD108

KEY_ROW1

POWER KEY

D

KEY_ROW0
KB101

KB102

KB103

R107

R108

R105

R106

R109

R110

10

10

10

10

10

10

D

KB104

SLIDE_KEY_LED

KB105

KEY_COL5

PM_ONSW_N

C

END
VA102

KEY_COL6

LEFT

Widget

KB106

KB107

Multi. TALK
KB110

KEY_COL7

DOWN

RSK

RIGHT

KB108

KB109

UP

OK

VA101

C

KB111

LSK

B

B

A

A
16

15

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

14

13

12

11

10

9

8

- 133 -

7

6

5

4

3

2

1

LGE Internal Use Only

7. CIRCUIT DIAGRAM

12

9

10

11

8

7

6

5

4

3

2

1

L

L

SLIDE FPCB

K

Slide FPCB to KEY PCB(Slide)

Slide FPCB to Main PCB
(54Pin)

J

K

MAIN RECEIVER

ENBY0040401 (50Pin)

CN102

4

51

5

50

6

49

RCV_P

LCD_DATA[15]
LCD_DATA[14]
LCD_DATA[13]

VCOIN
LCD_DATA[7]

LCD_DATA[12]
7

48

8

47

9

46

10

45

LCD_DATA[6]

LCD_DATA[10]

KEY_ROW0
KEY_ROW1
KEY_ROW2
KEY_ROW3
KEY_COL5
KEY_COL6
KEY_COL7

LCD_DATA[9]

LCD_DATA[4]
LCD_DATA[3]

LCD_DATA[8]
11

H

LCD_RST_N
LCD_VSYNC_OUT

LCD_DATA[11]

LCD_DATA[5]

44

LCD_DATA[2]
12

43

LCD_DATA[1]
LCD_DATA[0]

5

46

6

45

7

44

8

43

9

42

10

41

11

40

12

39

13

38

14

37

15

36

16

35

17

34

18

33

19

32

20

31

21

30

22

29

23

28

24

27

25

26

CN101

RCV_P

LCD_MAKER_ID
LCD_DATA[15]
LCD_DATA[14]
LCD_DATA[13]
LCD_DATA[12]
LCD_DATA[11]
LCD_DATA[10]

RCV_N

LCD_DATA[9]
LCD_DATA[8]
VLDO_LCD_2V8
VLDO_LCD_1V8
LCD_IF_MODE[0]
LCD_IF_MODE[1]
WLED1
WLED2
WLED3
WLED4
WLED5
SLIDE_KEY_LED
PM_ONSW_N

FB101

100n

1

FB102

100n

2

I
Can be Changed to TVS or ECLAMP

H

WLED_VOUT

VLDO_LCD_2V8
13

42

14

41

15

40

16

39

17

38

18

37

19

36

20

35

21

34

22

33

23

32

24

31

25

30

26

29

27

28

VLDO_LCD_1V8

LCD_RS

WLED1

LCD_RD

WLED2

LCD_WR_N

WLED3

LCD_CS_N

WLED4

LCD_RST_N

WLED5

LCD_VSYNC_OUT

G

47

VA102

52

48

4

VA101

3

49

3

39pF

I

LCD_MAKER_ID

50

2

39pF

53

RCV_N

1

C102

2

LCD_DATA[7]
LCD_DATA[6]
LCD_DATA[5]
LCD_DATA[4]
LCD_DATA[3]
LCD_DATA[2]
LCD_DATA[1]
LCD_DATA[0]
LCD_RS
LCD_RD
LCD_WR_N
LCD_CS_N

54

C101

CN103
1

J

SLIDE_KEY_LED

KEY_ROW0

G

WLED_VOUT

KEY_ROW1
KEY_ROW2

PM_ONSW_N

KEY_ROW3
KEY_COL5
KEY_COL6

LCD_IF_MODE[1]

KEY_COL7

BACKUP BAT.(SUPER CAP.)

LCD_IF_MODE[0]

GND

F

F
M101
R101

VCOIN

4.7K
C103

ZD101

2.2u

E

E

D

D

C

C

B

B

A

A

12

LGE Internal Use Only

11

10

9

8

7

6

- 134 -

5

4

3

2

1

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

7. CIRCUIT DIAGRAM

12

11

10

9

8

7

6

5

4

3

2

1

L

L

K

K

J

J

MODULE FPCB

I

I

SPK Common Circuit

From Module FPCB to Main PCB Connector

BUSEON 16pi 3.0t 0.8W
ELCO8000_0610 Update

CN101

H

G1

SPK_OUT_P
SPK_OUT_N

20

2

19

3

18

4

17

5

16

6

15

7

MSD_D[2]
MSD_D[3]
MSD_CMD

SPK_OUT_P

VREG_MICROSD_3V0
MSD_CLK

SPK_OUT_N

CN102
1
2

14

8

MOTOR_POWER_N
VBAT

H

G2

1

13

9

MSD_D[0]
MSD_D[1]

12

10

11
G3

G4

G

G

Can be Changed to TVS or ECLAMP

MICRO SD
PUSH PUSH 1.32t
NORMAL TYPE

F

F
VB101

S101

1

G7 G5 G3 G1

MSD_D[2]
MSD_D[3]
MSD_CMD
VREG_MICROSD_3V0
MSD_CLK

E

MSD_D[0]
MSD_D[1]

VIBRATOR

1

C1

2

C2

3

C3

4

C4

5

C5

6

C6

7

C7

8

C8

G6 G4 G2

VBAT

CD

2

15

MOTOR_POWER_N

LG Innoteck/ Sodering 17mm

E

16
COM

D

D

C

C

B

B

A

A

12

11

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10

9

8

7

6

- 135 -

5

4

3

2

1

LGE Internal Use Only

LGE Internal Use Only

- 136 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

8. BGA Pin Map

1.8.BGA
BGAPIN
Pin MAP
Map
QSC6270 3G disableٛ- U200 (bottom view)

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 137 -

LGE Internal Use Only

8. BGA Pin Map

H8BCS0SI0BAR-46M (MCP,NAND) – U300 (EUSY0347506)

LGE Internal Use Only

- 138 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

8. BGA Pin Map

BCM2070B2KUBXG (bluetooth) – U700 (EUSY0418701)

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 139 -

LGE Internal Use Only

8. BGA Pin Map

RT8963WSC (Multiplexer Mini/Micro USB Interface)– IC400 (EUSY0424801)

LGE Internal Use Only

- 140 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

8. BGA Pin Map

WM9093 (Ultra Low Power Audio Subsystem)– IC500 (EUSY0403901)
20-bump CSP package; Top View

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 141 -

LGE Internal Use Only

8. BGA Pin Map

TEA5991(FM Tuner)– U701 (EUSY0385901)

LGE Internal Use Only

- 142 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

9. PCB LAYOUT

54

C609
C607

CN801

FB508 C511

R270
R604
C614

C612

C613

R811

C611

R813

27

R603

U601 Charge Pump+Dual LDO
- Can not use LCD Display,
LCD Backlight, Slide Detection

R271

U601

R810

FB502

C615

C610

C504

C503

C508

C509

C506

C507

C523

C802

C517
FB507 C510

C608

IC501

U801

C801

C524

5

D

IC501 Audio Sub System
- Can not use Sound,Headset

FB506
28

1

C518

C516

C515

R506

R507

C514

U801 Hall IC
- Can not use Slide Detection

CN801 FPCB Conn
- Can not use LCD, Receiver,Sub Key,
Sub key LEDs, Vibrator, Power On

VA266
VA802 R806

C269

C803

C268
6

5

C804

C805 VA803

VA801
10

1

C N 802

TP201

C N 260

TP202

VA804 R805

R801

R802

LD801

LD802

LD801/802 Main Key LED
- Can not use LED
KB801

KB821

KB812

KB822

KB802

KB813

KB804

KB805

KB806

KB807

KB814

KB815

K B 816

KB810

KB803

KB817

KB824

KB825

KB827

KB826

KB808

KB819

KB811

KB809

KB820

KB818

KB829
KB823

KB828

KB830

KB837

KB834

K B 838

KB832

K B 839

KB831

KB833

KB836

C320_MAIN_SPFY0235601_1.1_TOP

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 143 -

LGE Internal Use Only

9. PCB LAYOUT

C709

FL811
C707

FL803

FL810

C706

FL804

FL802

FL805

FB701

C604

R803

VA808

6

1

F
E
D
C
B
A

C708

VA809

VA810

U701

VA505

TP701
TP702

VA522
L501
R266

R509
R505

FB505 C519
R508

FB504
FB503
C502

R502

C501

C505

C521

IC401 MUIC
- Can not use USB, UART, Headset

VA504

D

C409

C405

C401

VA602 R269
VA601 R268
VA603

R303

R304

R302

C309

L810

C305

A

B

C

F

D

E

J

H

G

L

K

N

M

T

P

R307
R308
ZD310
ZD308

C312

C404

F L401

C247
ZD307

R309
ZD306

R310

R406

U401

12

ZD305

R407
R272
R273

A
1

F

C

B

D

E

H

G

J

L

K

N

P

M

T

R

U

V

W

Y

AA

AB

AC

U201 QSC6270 (BB & Power chipset)
- Can not power on
- No LCD Display
- No Service

C267
C214
C212
C213

C226

C220
C228

L207
L206

C231

C230
C233

C234
C235

C238

L205

C298

23

L204
L118
L103

C126
L111

L104

C104

C101
L101

L102

C102

C137
L115

L116

C107

C114
L107

L108

C118

C266

C251

C242

R260

C291

R261

C290

C275

C241

C203
C202

R201

PT201

X 202

C240

X202 XO
- Can not BootRF Rx/Tx
- No Power.

C227

C237

C250
FL808

C249
R205
C296

C207
C224
C210
C209
C261
C262

C525

VA508

R808
R1

VA509

C 526

X 201

C297

C252

L109

C232
C236
C256

C117

L203

C239

R282
R281

C 201

C229

R206

C 257

L201

U201

C253

C 206

C254

C281

C255

C219

L202

C280

L208

R265

D201

R311

R405
C410

C 412

C411

R402

C215

C217

C208

R264

10

Q

ZD311

C308

C216

C218

C306

R262

C246

C 258

C211

C221

C 205

C 259

C289

R284

U803

C276

C248

R283

C301

C807

C302

R807

C806

C739
C303

R809

C304

R301

C113

C740
R404
R403

R102

C121

R104

C119

C127

FL101

U101 GSM PAM
- Tx power No service

L1113
C135
C134

TP262

J301

R109

U 101

C122
L110

TP263

C123
L114

TP264

C417
C413

C130
L801

L802

L117

C110

L805

L806

L119

L803

L804

C109

C115

ANT101

C133

C132

C 414

C 415

Z D 402

L112

TP710

TP260

R112

C129

C128

C120

R107

L105

C105

C111

R110

R111

C112

CN402

SW101

FL101 FEM
- GSM RX Sensitivity & TX Power
- No service

R103

R114

R113

C143

C722

C724
C416

MIC501

CN403 USB Conn
- Can not use USB
U401 Single Charger
- Can not use Charging, Booting

C260

C742

L811

FB501
1

C406

C310

CN403

C

C704

TP705
TP706

C717

A
B

TP703

FB702
11

5
1

C737

T P709

C N 401

R401

T P708

20

C407

C710
TP704

C601
R511

C264

R219

C299

C403

D 202

C 225

C 244

R207

R263

R814

C223

C222

C245

C307

C311

VA260

VA261

VA262

VA263

VA264 VA401

VA265

MIC501 Mic.
- Can not use Mic

C263

R501

R503

C734

R708

C243

TP802

FL809

FL806

F
E
D
C
B
A

FB703

1

J301 USIM Conn.
- Can not detect USIM

IC401

C408

R713

FL807

C726

U 703

R702

7

CN402 Battery Conn
- Can not use Battery, Power On

C265

C715

TP707

C741

R601

C602

Q501

R510

C606

C605

U501

C402

R715

R714

R709

R710

R712

R711

R705

C721

C720

C723

U803 Analog Switch
- Can not use UART, BT

U802

C725

X702

J501

J501 Ear-Jack
- Can not use Ear-Mic

U301

R703
C735

C736

X702 BT X-Tal
- Can not use BT

R706

R707

F L701

U703 BT Chip.
- Can not use BT

VA503

T P 60 1

T P 60 2

C733

C N 803
ZD606

C204

ZD607

VA201

U301 Memory
- Can not Boot
X201 Sleep Cystal
- No Service

R504

C714

R602

FL603

C738

R704

C728

C 730

C731

C732

C729

C 727

L702

C 719

L701

CN803 FPCB Conn
- Can not use SD-card, Vibrator,
Speaker

S601 Camera Socket
- Can not use Camera

VA502 C520
VA501

S601

VA604

C705

C716

U704

R267

FL601

X 701

C718

C 712

C703

U702

C701

FL602

C603

L703

C713

ANT102

C320_MAIN_SPFY0235601_1.1_BOT

LGE Internal Use Only

- 144 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

9. PCB LAYOUT

KB111

KB103

LD108

KB108

LD104

KB102
KB101

KB107

LD106

KB109

KB110

KB104

LD105

LD103

LD107

KB106

KB105

LD107/LD108/LD106/LD104/LD105/LD103
Sub Key LED
- Can not use LED

C320_KEY_SPEY0068201_10_TOP

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 145 -

LGE Internal Use Only

9. PCB LAYOUT

CN102

25

CN102 LCD Connector
- Can not use LCD Display, LCD Backlight

CN101
R102

C102

C101

R101

50

CN101 FPCB Connector
- Can not use LCD, Sub key Operation,
Sub Key LED, Receiver

R1 1 0

R 10 7

R108

R 10 9

R 10 6

R105

VA101

26

VA102

C320_KEY_SPEY0068201_10_BOT

LGE Internal Use Only

- 146 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

9. PCB LAYOUT

R101

ZD101

M101

C103

C101

VA101

CN101

C102

FB102
VA102

FB101

25

CN102
26

50
27

CN103
28

54

CN103 FPCB Connector
- Can not use LCD, Sub key Operation,
Sub Key LED, Receiver

CN102 FPCB Conn
- Can not use LCD, Sub key Operation,
Sub Key LED, Receiver

C320_F_SLIDE_SPCY0246901_10_TOP

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 147 -

LGE Internal Use Only

20

CN102

10

S101

CN101

CN101 FPCB Conn
- Can not use SD-card, Vibrator, Speaker

VB101

11

9. PCB LAYOUT

S301 MicroSD Socket
- Can not use MicroSD

C320_F_SUB_SPCY0247101_10_BOT

LGE Internal Use Only

- 148 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. RF CALIBRATION

10. RF CALIBRATION
10.1 Usage of Tachyon for RF Calibration and Test
10.1.1 Preparation work for setting RF cable loss

Procedure
1. Click “Hecaton.exe” in below directory to set RF cable loss on test equipment.
“C:\LGE\Tachyon\Utilities”
2. After selecting “Select File” button, select right RF cable loss file corresponding to RF cable that you use.

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 149 -

LGE Internal Use Only

10. RF CALIBRATION

10.1.2 Basic Setting of Tachyon for RF Calibration & Test

[ System Option Setting]

[ User Model Selection]

Procedure
1. Click “Tachyon_xxx.exe” in below directory to execute Tachyon program. “C:\LGE\Tachyon\”
2. Click “System Option Setting” icon in the menu to set COM port.
Select “UART Port” that can communicate with phone in the Shield Box 1 message.
Click the “OK” button.
3. Click “User Model Selection” icon in the menu to set model configuration.
Do double-click model/buyer name that you want to calibrate and test.
Click the “Select” button.

LGE Internal Use Only

- 150 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. RF CALIBRATION

10.1.3 Log of RF Calibration and Test

Contents
On Running, log window is created in upper area.
It displays logs of phone commands and measurements for RF calibration and test.
The result files are saved in below directory
- “C:\LGE\Tachyon\Report\CalData\” : the file of RF calibration result
- “C:\LGE\Tachyon\Report\TestData\” : the file of RF test result

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 151 -

LGE Internal Use Only

11. TEST ALONE

Phone Test11.
Mode
: LG-C320
TEST
ALONE
11.1 Phone Test Mode
1. Enter the Engineer Menu
2. Tap 1. Device Test
3. Tap 1. Auto ALL Test

LGE Internal Use Only

- 152 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. TEST ALONE

Phone Test Mode Scenario
Item
(1) Key Press, External
Memory, and SIM
card Test Start

Order
1.Key, External Memory,
and SIM card Test

2. IF OK, tab “LSK”
Button.
It means “PASS”

Description
 Key Test

Press all keys for test
- UP key
- Down key
- Right key
- Left key
………..
…….
….

External memory and
SD card is inserted
then Sing of
“SIM Pass” and
“SD Pass” is green.

Phone Test Mode Scenario
Item
(2) Sound

Order

Description

1. Sound On

Ringtone (MP3) is played
regularly

2. IF OK, tab “LSK”
Button.
It means “PASS”

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

Press “LSK” button (Left top Key)
Move to next step

- 153 -

LGE Internal Use Only

11. TEST ALONE

w–•ŒG{Œš›Gt–‹ŒGzŠŒ•ˆ™–
Item
(3) Vibrator Test

Order

Description

1.Vibrator On

2. IF OK, tab “LSK”
Button.
It means “PASS”

Press “LSK” button (Left top Key)
Move to next step

w–•ŒG{Œš›Gt–‹ŒGzŠŒ•ˆ™–
Item
(4) Slide On/Off Test

Order

Description

1.Move Slide Up and
Down

Slide UP status

2. IF OK, tab “LSK”
Button.
It means “PASS”

LGE Internal Use Only

Slide Down status

Press “LSK” button (Left top Key)
Move to next step`

- 154 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. TEST ALONE

w–•ŒG{Œš›Gt–‹ŒGzŠŒ•ˆ™–
Item
(5) Camera Test

Order

Description

1. Camera Off
2. Camera Auto On
( Preview )
3. Photo Shot by press
“OK” key
4. Photo Save
5. Record video
6. Video Save
7. Call Photo
If OK , Press “LSK” key
(Left top Key)
8. Call Video
9. Preview
10. IF OK, tab “LSK”
Button. It means
“PASS”

w–•ŒG{Œš›Gt–‹ŒGzŠŒ•ˆ™–
Item
(6) Loopback Test

Order

Description

1.Loopback On
2. Speak something
3. After 2 Sec, listen the
voice

4. IF OK, tab “LSK”
Button.
It means “PASS”

Press “LSK” button (Left top Key)
TEST END

5. The TEST END

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 155 -

LGE Internal Use Only

LGE Internal Use Only

- 156 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 EXPLODED VIEW
ACGT00

ACGU00

SURY00
SACY00
SVLM00

MCCH00

AHFY00
GMEY01

GMEY02
SAEY00

ADCA01

ABFZ01
ABGZ01
ACGK00

ACGA00

ACGM00

SAFY00

MBJZ00

MCBA01

GMEY00

ABFZ00

GMEY01
SVCY00

ABGZ00

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

ADCA00

SPKY00
SUMY00

MCBA00
SNGF00

- 157 -

SBPL00

Location
ACGA00
SBPL00
ABFZ00
ACGM00
SNGF00
MBJZ00
GMEY00
ABGZ00
ABGZ01
ACGT00
AHFY00
SURY00
ABFZ01
ACGK00
ACGU00
GMEY01
GMEY02
MCCH00
SACY00
SAEY00
ADCA01
SVLM00
SAFY00
SVCY00
SPKY00
MCBA00
ADCA00
MCBA01
SUMY00

Description
Cover Assembly,Battery
Mobile Phone Battery Li-Ion
Bracket Assembly
Cover Assembly,Rear
Antenna,Helical
Button
Screw,Machine
Button Assembly
Button Assembly
Cover Assembly,Upper
HINGE ASSY
Receiver
BRACKET ASSY
Cover Assembly,Front
Cover Assembly,Lower
Screw,Machine
Screw,Machine
Cap,Screw
PCB Assembly,Flexible
PCB Assembly,Keypad
Dome Assembly,Metal
LCD,Module-TFT
PCB Assembly,Main
Camera Module
PCB,Sidekey
Can,Shield
Dome Assembly,Metal
Can,Shield
Microphone,Condenser

LGE Internal Use Only

LGE Internal Use Only

- 158 -

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.2 Replacement Parts

Level LocationNo.
1

Note: This Chapter is used for reference, Part order is ordered
by SBOM standard on GCSC

Description

PartNumber

Spec

AAD000000 Addition Assembly

- AAAY0524401

LG-C320 BOOWA ZZ:Without Color -

Remark

2

ACGA00

Cover Assembly,Battery

- ACGA0048201

LG-C320i IDNWA WA:White -

3

MCJA00

Cover,Battery

MCJA0120401

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

3

MPBN00

Damper,Speaker

MPBN0093201

COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , ,

2

MFL053800 Manual,Operation

MFL67003501

COMPLEX LGC320.ABOOWA ZZ:Without Color LGC320 manual for
BOO

1

AGF000000 Package Assembly

- AGF75960001

LGC320.ABOOWA ZZ:Without Color LGC320 BOO(TR3/STD
UB/1160*1160 Pallet/600ea)

2

MAY084000 Box,Unit

MAY64811601

COMPLEX LGC320.ABOOWA ZZ:Without Color LGC320 BOO(TR3
STD UB)

2

MAF086500 BAG,VINYL(PE)

MBAD0005204

LG-LX260 SPRAG AG,ZZ,COMPLEX, (empty), , , , ,

2

AGJ000000 PALLET ASSY

- APLY0002405

KP110 OPTBK BK,ZZ,TR3 Australia(600ea) Pallet Assy

3

MBEC00

BOX,CARTON

MBEC0002002

KG270 CIS BK,ZZ,BOX, TW

3

MCCL00

Cap,Box

MCCL0000402

COMPLEX KG270 CIS ZZ:Without Color BOX,TW, PBO PBOTW

3

MPCY00

Pallet

MPCY0015703

COMPLEX TU500 TELBK SV:Silver
COMPLEX,(empty),1160,1160,126,

3

MSCA00

SLEEVE,BOX

MSCA0000701

MG230d CLA TS,ZZ,BOX, TW

2

MAY047100 Box,Master

MBEE0059803

COMPLEX KP100 GBRLA ZZ:Without Color -

2

MEZ003500 Label,Barcode

MLAC0004541

COMPLEX HB620 KPNBK ZZ:Without Color -

2

MEZ047200 LABEL,MASTER BOX

MLAJ0004402

CG300 CGR DG,ZZ,LABEL,MASTER BOX(for CGR TDR 2VER.
mbox_label)

2

MEZ000000 LABEL

MLAZ0050901

KU990 GBRBK BK,ZZ,PRINTING, (empty), , , , ,

- APEY0988401

LG-C320 BOOWA WA,ZZ,

MLAA0062311

COMPLEX KB770 DEUBK ZZ:Without Color -

1
2

APEY00

PHONE

MEZ002100 Label,Approval

2

ACGY00

COVER ASSY,EMS

- ACGY0088801

LG-C320 BOOWA WA,ZZ,

3

ABFZ00

Bracket Assembly

- ABFZ0028101

LG-C320 BOOWA ZZ:Without Color -

4

MEV000000 Insulator

MIDZ0281601

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,
,,,

4

MCQ049800 Damper,Motor

MPBJ0079001

COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , ,

4

MJN000000 Tape

MTAZ0358201

COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , ,

4

MCQ015700 Damper,Connector

MPBU0114101

COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , ,

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 159 -

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo.
3
4

ACGM00

Description
Cover Assembly,Rear

MJN061100 Tape,Protect

PartNumber

Spec

- ACGM0168401

LG-C320i IDNWA ZZ:Without Color -

MJN67687301

COMPLEX LGC320I.AIDNWA GN:Green -

4

MBJZ00

Button

MBJZ0041901

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4

MCCE00

Cap,Receptacle

MCCE0061601

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4

MCJN00

Cover,Rear

MCJN0127401

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4

MDAY00

Decor

MDAY0086001

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4

MLAB

LABEL,A/S

MLAB0001102

C2000 CGRSV SV,WA,C2000 USASV DIA 4.0

4

MPBJ00

Damper,Motor

MPBJ0078101

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4

MPBN00

Damper,Speaker

MPBN0091501

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4

MPBT00

Damper,Camera

MPBT0098901

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4

MPBZ00

Damper

MPBZ0337301

COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , ,

4

MTAK00

Tape,Camera

MTAK0041901

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4

MWAE00

Window,Camera

MWAE0065101

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

3

GEMY00

Screw,Machine

GMEY0010601

GMEY0010601 BH + 1.4mM 2.5mM MSWR FZB N - KUMGANG
SCREW CO., LTD

3

ACGQ00

Cover Assembly,Slide

- ACGQ0056601

LG-C320 BOOWA WA:White -

4

ABGZ00

Button Assembly

ABGZ0006901

LG-C320i IDNWA ZZ:Without Color MAIN

4

ABGZ01

Button Assembly

ABGZ0007001

LG-C320i IDNWA ZZ:Without Color SUB

4

ACGT00

Cover Assembly,Upper

- ACGT0009101

LG-C320i IDNWA ZZ:Without Color LG-C320i IDNWA

5

AJX00

Window Assembly,LCD

- AJX73205001

LGC320.ABOOWA ZZ:Without Color -

MWAC0151901

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

6

MKC043300 Window,LCD

5

MCJX00

Cover,Upper

- MCJX0011301

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

6

MICE00

INSERT,NUT

MICE0016901

MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,

5

MFBZ00

Filter

MFBZ0025001

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

5

MPBG00

Damper,LCD

MPBG0113001

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

5

MTAD00

Tape,Window

MTAD0133501

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

5

MTAZ

TAPE

MTAZ0113701

LG-KV5900 BK,ZZ,20X7

4

MJN061101 Tape,Protect

MTAB0440401

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,
,,,

4

MJN061100 Tape,Protect

MTAB0423001

COMPLEX LG-C320i IDNWA ZZ:Without Color -

4

MJN061102 Tape,Protect

MTAB0422301

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

AHFY0002101

LG-MN240 MTP LS,ZZ,Slide

4

AHFY00

LGE Internal Use Only

HINGE ASSY

- 160 -

Remark

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo.

Description

PartNumber

Spec

Remark

4

ABFZ01

BRACKET ASSY

- ABFZ0023401

LG-MN240 MTP LS,ZZ,

5

MBFZ00

BRACKET

MBFZ0043001

LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , ,

5

MTAB00

TAPE,PROTECTION

MTAB0381101

LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , ,

4

ACGK00

Cover Assembly,Front

- ACGK0169801

LG-C320i IDNWA ZZ:Without Color LG-C320i IDNWA

5

MCJK00

Cover,Front

- MCJK0135101

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

6

MICE00

INSERT,NUT

MICE0016903

MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,

5

MPBZ01

Damper

MPBZ0320601

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

5

MPBZ00

Damper

MPBZ0320801

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

5

MPBZ02

Damper

MPBZ0366401

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4

ACGU00

Cover Assembly,Lower

- ACGU0007201

LG-C320i IDNWA ZZ:Without Color LG-C320i IDNWA

5

MCJY00

Cover,Lower

MCJY0008701

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

5

MMAA00

MAGNET,SWITCH

MMAA0011201

LG-LU1600 LGTWW WW,ZZ,COMPLEX, (empty), , , , ,

5

MPBZ01

PAD

MPBZ0260601

LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , ,

5

MPBZ

PAD

MPBZ0260901

LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , ,

5

MPBZ02

Damper

MPBZ0320401

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4

GMEY01

Screw,Machine

GMEY0017801

GMEY0017801 BH + 1.4mM 1.4mM MSWR FZB N - KUMGANG
SCREW CO., LTD

4

GMEY02

Screw,Machine

GMEY0019201

GMEY0019201 FH + 1.4mM 1.8mM SWCH FZW N N KUMGANG
SCREW CO., LTD

4

MCCH00

Cap,Screw

MCCH0165101

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4

MEV000002 Insulator

MEV63651701

COMPLEX LGC320.ABOOWA BL:Blue insulator, FPCB

4

MDS000000 Gasket

MGAZ0112501

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4

MEV000001 INSULATOR

MIDZ0259401

LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , ,

4

MCQ000000 Damper

MPBZ0357401

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,
,,,

6

MJN000000 Tape

MTAZ0368001

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,
,,,

6

MCQ015700 Damper,Connector

MPBU0113901

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,
,,,

ADCA0118401

LG-C320i IDNWA ZZ:Without Color LG-C320i IDNWA

MPBZ0349901

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,
,,,

6
5

ADCA01

Dome Assembly,Metal

MCQ000000 Damper

5

ACKA00

Can Assembly,Shield

- ACKA0035801

LG-C320i IDNWA ZZ:Without Color -

6

MCBA00

Can,Shield

MCBA0086901

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

MIDZ0284101

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

5

MEV000000 Insulator

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 161 -

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo.

Description

PartNumber

Spec

5

ADCA00

Dome Assembly,Metal

- ADCA0118501

LG-C320i IDNWA ZZ:Without Color MAIN

6

MPBZ00

PAD

MPBZ0337101

LG-C320i IDNWA WA,ZZ,COMPLEX, (empty), , , , ,

5

MPBU00

Damper,Connector

MPBU0113801

COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,
,,,

MLAZ0038301

LG-VX6000 SV,ZZ,PID Label 4 Array

MCBA0059201

COMPLEX GD350 CLP ZZ:Without Color -

5
6

MEZ000000 LABEL
MCBA01

LGE Internal Use Only

Can,Shield

- 162 -

Remark

Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.2 Replacement Parts
Level LocationNo. Description 4 EBR070500 PCB Assembly,Flexible 5 EBR070400 6 EAX010700 PCB,Flexible 6 EBR070200 7 CN101 7 S101 6 EBR070300 4 4 4 6 Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC PartNumber Spec Remark - EBR72655001 LGC320.ABOOWA FLEXIBLE 1.0 - EBR72681501 LGC320.ABOOWA FLEXIBLE 1.0 SPCY0247101 SPCY0247101 LG-C320i IDNWA,FLEXIBLE,E,POLYI,0.15 mm,DOUBLE SI FLEX CO., LTD PCB Assembly, Flexible,SMT Bottom - EBR72655201 LGC320.ABOOWA FLEXIBLE 1.0 Connector,BtoB ENBY0052901 55909-0274 20P 0.40MM STRAIGHT MALE SMD R/TP 1.5M HANKOOK MOLEX Socket,Card ENSY0023601 SCHA4B0402 Micro-SD 8P ANGLE SMD R/TP - ALPS ELECTRIC KOREA CO.,LTD. PCB Assembly, Flexible,SMT Top EBR72681601 LGC320.ABOOWA FLEXIBLE 1.0 EAU010000 Motor,DC SJMY0007104 3V 80mA 0A 12KRPM 0RPM 0SEC 0GF.CM 0OHM EAB010100 Speaker Module SUSY0027617 SI-C320-P LG-C320i IDNWA BUJEON ELECTRONICS CO., LTD SNGF0064202 ACD-00094 3.0,-2 dBd,GSM Quad carrier type,QUAD,-2.0,50,3.0 MOBITECH CORPORATION BFAA0127401 BFAA0127401 ; ,BLACK , , , BLACK , , , NISSHA PRINTING CO., LTD SNGF00 PCB Assembly, Flexible,SMT Antenna,Helical RAB040100 Film,Inmold 4 SURY00 Receiver SURY0010114 BWBR1207L-04B-P 30mW 32OHM 105DB 0HZTO0HZ WIRE BUJEON ELECTRONICS CO., LTD 4 SACY00 PCB Assembly,Flexible - SACY0127201 LG-C320 BOOWA FLEXIBLE 1.0 5 SACE00 PCB Assembly, Flexible,SMT - SACE0114501 LG-C320 BOOWA FLEXIBLE 1.0 SPCY0246901 SPCY0246901 LG-C320i IDNWA,FLEXIBLE,D,POLYI,.12 mm,DOUBLE SI FLEX CO., LTD 6 EAX010700 PCB,Flexible 6 SACC00 PCB Assembly, Flexible,SMT Bottom SACC0085002 LG-C320 BOOWA FLEXIBLE 1.0 6 SACD00 PCB Assembly, Flexible,SMT Top - SACD0098702 LG-C320 BOOWA FLEXIBLE 1.0 SEVY0005201 EVLC5S02050 5.5V 0% 50F 1.0*0.5*0.6 - SMD R/TP AMOTECH CO., LTD. 7 C101,C102 Varistor 7 FB101, FB102 Inductor,Multilayer,Chip ELCH0004727 1005GC2TR10J00 100NH 5% 0V 100mA 2.3OHM 600MHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 7 CN102 Connector,BtoB ENBY0040401 GB042-50P-H10-E3000 50P 0.4MM STRAIGHT PLUG SMD R/TP 1M - LS Mtron Ltd. 7 VA101, VA102 Varistor SEVY0003901 EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP AMOTECH CO., LTD. Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 163 - LGE Internal Use Only 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec Connector,BtoB ENBY0042601 GB042-54P-H10 54P 0.40MM STRAIGHT MALE SMD R/TP 1M - LS Mtron Ltd. C103 Capacitor,Ceramic,Chip ECCH0000198 CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD. 7 M101 Capacitor Assembly SMZY0023501 PAS311HR-VG1 3.8 Backup Capacitor 0.03F,Module Assembly, KOREA TAIYO YUDEN.CO., LTD. 7 ZD101 Diode,TVS EDTY0008601 PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1 PROTEK DEVICES INC. 7 R101 Resistor,Chip ERHY0000254 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 4 SAEY00 PCB Assembly,Keypad - SAEY0074701 LG-C320 BOOWA KEYPAD 1.0 5 EBR070900 PCB Assembly, Keypad,Insert - EBR72665301 LGC320.ABOOWA KEYPAD 1.0 5 SAEE PCB Assembly, Keypad,SMT - SAEE0039402 LG-C320 BOOWA KEYPAD 1.1 6 SAEC PCB Assembly, Keypad,SMT Bottom - SAEC0038302 LG-C320 BOOWA KEYPAD 1.0 7 CN103 7 7 R101,R102 Resistor,Chip ERHZ0000434 MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 7 C101,C102 Capacitor,Ceramic,Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C 1005 R/TP - TDK CORPORATION ENBY0040501 GB042-50S-H10-E3000 50P 0.4MM STRAIGHT SOCKET SMD R/TP 1M - LS Mtron Ltd. 7 CN101 Connector,BtoB 7 CN102 Connector,FFC/FPC/PIC ENQY0014901 7 R105,R106,R 107,R108,R1 Resistor,Chip 09,R110 GF032-35S-E2000 35P 0.30MM FPC STRAIGHT BOTH SMD R/TP LOCKING - LS Mtron Ltd. ERHZ0000402 MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 7 VA101, VA102 Varistor SEVY0003901 EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP AMOTECH CO., LTD. 6 SAED PCB Assembly, Keypad,SMT Top - SAED0037602 LG-C320 BOOWA KEYPAD 1.0 7 LD103, LD104, LD105, LD106, LD107, LD108 LED,Chip EDLH0014803 SSC-WH107 WHITE 2.7~3.1 20mA 100~230mcd x, y 64mW 1608 R/TP 2P - SEOUL SEMICONDUCTOR CO.,LTD 6 SPEY00 PCB,Keypad SPEY0068201 SPEY0068201 LG-C320i IDNWA,KEYPAD,D,FR-4,.8 mm,BUILD-UP 4 UNITECH PRINTED CIRCUIT BOARD CORP. 4 SVLM00 LCD,Module-TFT SVLM0038101 DM24-DSM04 Main,2.4,320*240,54.3*46.8*1.7t,262K,TFT,TM,S6D05A0,Landscape Type,16bit IF,For Bar Type Phone, LG Display Co. Ltd. 3 SAFY00 PCB Assembly,Main - SAFY0399101 LG-C320 MAIN 1.0 LGE Internal Use Only Remark - 164 - Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 4 5 SAFB00 Description PCB Assembly, Main,Insert RAA050100 RESIN,PC PartNumber Spec - SAFB0126901 LG-C320 BOOWA MAIN 1.1 BRAH0001301 UF-1060,; , , , ,[empty] Remark 5 SVCY00 Camera Module SVCY0026901 C2FK-H313A C2FK-H313A 2M FF, Hynix(1/5"), 7x7x4.1t, Socket LG Innotek.com 5 SPKY00 PCB,Sidekey SPKY0094301 SPKY0094301 LG-C320i IDNWA,SIDEKEY,C,POLYI,0.18 mm,DOUBLE SI FLEX CO., LTD 4 SAFF00 PCB Assembly, Main,SMT - SAFF0298001 LG-C320 MAIN 1.0 5 SAFC00 PCB Assembly, Main,SMT Bottom - SAFC0162201 LG-C320 BOOWA MAIN 1.2 6 S601 Card Socket ENSY0022201 CAM-H88 24,ETC,mm,7*7,1.3M (1/5") Socket Type MITSUMI ELECTRIC CO.,LTD. 6 L207 Inductor,Multilayer,Chip ELCH0004729 1005GC2T56NJ00 56NH 5% 0V 200mA 1.6OHM 900MHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 6 C103 Capacitor,Ceramic,Chip ECCH0000198 CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD. 6 C735 Capacitor,Ceramic,Chip ECCH0000110 MCH155A100D 10pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION 6 C120,C739 Capacitor,Ceramic,Chip ECCH0000112 MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 C301,C303,C 304,C404,C4 Capacitor,Ceramic,Chip 07 ECCH0000115 MCH155A220JK 22pF 5% 50V NP0 -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION 6 C110 Capacitor,Ceramic,Chip ECCH0000117 CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C 1005 R/TP 0.5 SAMSUNG ELECTRO-MECHANICS CO., LTD. 6 C143 Capacitor,Ceramic,Chip ECCH0000195 GRM1555C1H3R9C 3.9pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - MURATA MANUFACTURING CO.,LTD. C417,C525 Capacitor,Ceramic,Chip ECCH0000120 MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA CORPORATION Capacitor,Ceramic,Chip ECCH0000137 C1005X7R1H331KT000F 0.33nF 10% 50V X7R -55TO+125C 1005 R/TP - TDK KOREA COOPERATION Varistor SEVY0003901 EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP AMOTECH CO., LTD. 6 6 C708 6 VA101, VA102 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 165 - LGE Internal Use Only 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec 6 C208,C211,C 212,C213,C2 14,C215,C21 6,C217,C218 ,C219,C220, C221,C222,C 223,C229,C2 Capacitor,Ceramic,Chip 31,C235,C23 6,C305,C306 ,C307,C308, C309,C310,C 605,C606,C7 01,C709 ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -55TO+85C 0603 R/TP - TDK CORPORATION 6 C101,C102 Capacitor,Ceramic,Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C 1005 R/TP - TDK CORPORATION 6 C105,C117,C 118,C122,C1 Capacitor,Ceramic,Chip 30,C135,C51 9,C520,C521 ECZH0000830 C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA COOPERATION 6 C230,C233 Capacitor,Ceramic,Chip ECCH0006201 C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -55TO+85C 1608 R/TP - TDK CORPORATION 6 C121,C225,C 246,C252,C2 Capacitor,Ceramic,Chip 54,C255 ECCH0007803 CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD. 6 C226,C227,C 237,C244,C2 Capacitor,Ceramic,Chip 57,C258,C25 9 ECCH0007802 CV105X5R475M10AT 4.7uF 20% 10V X5R -55TO+85C 1608 R/TP KYOCERA CORP. 6 C234,C240,C Capacitor,Ceramic,Chip 241,C243 ECCH0009103 C0603C0G1H101JT00NN 100pF 5% 50V X7R -55TO+125C 0603 R/TP - TDK CORPORATION 6 C242,C253,C 256,C298,C7 Capacitor,Ceramic,Chip 21,C725,C72 6 ECCH0009106 C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C 0603 R/TP TDK CORPORATION 6 C127 Capacitor,Ceramic,Chip ECCH0009110 C0603X7R0J223KT 22nF 10% 6.3V X7R -55TO+125C 0603 R/TP TDK CORPORATION 6 C129 Capacitor,Ceramic,Chip ECCH0009226 GRM0335C1E390J 39pF 5% 25V X7R -55TO+125C 0603 R/TP MURATA MANUFACTURING CO.,LTD. 6 C128 Capacitor,Ceramic,Chip ECCH0009228 GRM033R61A472K 4700pF 10% 25V X5R -55TO+85C 0603 R/TP MURATA MANUFACTURING CO.,LTD. 6 C722,C723 Capacitor,Ceramic,Chip ECCH0009514 MCH032A(AN)100DK 10pF 0.5PF 25V X7R -55TO+125C 0603 R/TP - ROHM. 6 C602,C603 Capacitor,Ceramic,Chip ECCH0010501 GRM1555C1H7R5D 7.5pF C0G TYPE(No X7R) MURATA MANUFACTURING CO.,LTD. 6 C412,C414,C Capacitor,TA,Conformal 415 ECTH0002002 F981A336MSA 33F 20% 10V 3.3A -55TO+85C 6OHM 2.2X1.1X1.1MM - SMD R/TP NICHICON CORPORATION, EAST JAPAN SALES OFFICE LGE Internal Use Only - 166 - Remark Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec Remark 6 C526 Capacitor,TA,Conformal ECTH0004807 TCM1A106M8R 10F 20% 10V 500mA -55TO+85C 15OHM - - SMD R/TP ROHM. 6 C113 Capacitor,Ceramic,Chip ECZH0000802 C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP TDK KOREA COOPERATION C232,C260,C Capacitor,Ceramic,Chip 267 ECCH0000122 MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION Capacitor,Ceramic,Chip ECZH0000816 C1005C0G1H120JT000F 12pF 5% 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA COOPERATION C102,C104,C Capacitor,Ceramic,Chip 107 ECCH0000701 C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK CORPORATION Diode,TVS EDTY0009101 ESD9X5.0ST5G 5V 6.2 12.3V 8.7A 107W SOD528 R/TP 2P 1 ON SEMICONDUCTOR 6 6 6 C740 6 VA504, ZD606, ZD607 6 C126 Capacitor,Ceramic,Chip ECZH0000846 C1005C0G1H8R2CT000F 8.2pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA COOPERATION 6 C114 Capacitor,Ceramic,Chip ECZH0001002 C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA COOPERATION 6 C706,C707 Capacitor,Ceramic,Chip ECZH0001210 C1005Y5V1A474ZT000F 470nF -20TO+80% 10V Y5V -30TO+85C 1005 R/TP - TDK KOREA COOPERATION 6 C134,C312,C 401,C409,C4 Capacitor,Ceramic,Chip 11 ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005 R/TP - TDK KOREA COOPERATION 6 C204,C261,C 262,C263,C2 64,C266,C27 Capacitor,Ceramic,Chip 6,C299,C302 ,C405,C413 ECZH0003103 GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP - MURATA MANUFACTURING CO.,LTD. Diode,TVS EDTY0010101 ESD9B5.0ST5G ESD9B5.0ST5G,SOD-923,5 V,300 mW,R/TP,15pF SCG HONG KONG SAR LTD. C403,C408 Capacitor,Ceramic,Chip ECZH0003503 GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608 R/TP MURATA MANUFACTURING CO.,LTD. Capacitor,Ceramic,Chip ECZH0003504 GRM188R71E104K 100nF 10% 25V X7R -55TO+125C 1608 R/TP MURATA MANUFACTURING CO.,LTD. Filter,Bead SFBH0000903 HB-1M1005-601JT 600 ohm 1.0*0.5*0.5 SMD R/TP 2P CERATECH CORPORATION 6 C806,C807 Capacitor,Ceramic,Chip ECZH0004402 MCH153C104ZK 0.1uF 10% 16V NP0 -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION 6 C101,C102 Varistor SEVY0005201 EVLC5S02050 5.5V 0% 50F 1.0*0.5*0.6 - SMD R/TP AMOTECH CO., LTD. 6 6 ZD305, ZD306, ZD307, ZD308, ZD310, ZD311 6 C402 6 FB501, FB703 Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 167 - LGE Internal Use Only 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 VA508, VA509, VA601, VA602, VA603, VA604 Description Varistor PartNumber Spec SEVY0003801 EVLC18S02015 18V 0% 15F 1.0*0.5*0.6 NONE SMD R/TP AMOTECH CO., LTD. 6 C228,C245,C Capacitor,Ceramic,Chip 734 ECZH0025920 GRM033R71C102K 1nF 10% 16V X7R -55TO+125C 1608 R/TP MURATA MANUFACTURING CO.,LTD. 6 C109,C705,C Capacitor,Ceramic,Chip 742 ECZH0000813 C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C 1005 R/TP TDK KOREA COOPERATION 6 D202 Diode,Switching EDSY0011901 SDB310Q 340mV 30V 200mA 1A 0SEC 150mW EMD2 R/TP 2P 1 AUK CORP 6 D201 Diode,Switching EDSY0017702 SDB0530 360mV 30V 500mA 3A 0SEC 200mW SOD323 R/TP 2P 1 AUK CORP 6 ZD101 Diode,TVS EDTY0008601 PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1 PROTEK DEVICES INC. ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP MURATA MANUFACTURING CO.,LTD. Inductor,Multilayer,Chip ELCH0001444 0402AF-101XJEW 0402AF-101XJLW,100 nH,J,1005,R/TP,chip coil COILCRAFT SINGAPORE PTE LTD. 6 L101,L102 Inductor,Multilayer,Chip ELCH0004701 1005GC2T12NJ00 12H 5% 0V 250mA 0.48OHM 2.1GHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 6 L109,L111 Inductor,Multilayer,Chip ELCH0004705 1005GC2T8N2J00 8.2NH 5% 0V 250mA 0.37OHM 2.8GHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 6 L107,L108, Inductor,Multilayer,Chip L115,L116 ELCH0004708 1005GC2T2N7S00 2.7NH 5% 0V 200mA 1.3OHM 1GHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. Inductor,Multilayer,Chip ELCH0004721 1005GC2T2N2S00 2.2NH 5% 0V 300mA 0.13OHM 7GHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. L114,L204, Inductor,Multilayer,Chip L205 ELCH0004715 1005GC2T27NJ00 27NH 5% 0V 200mA 0.9OHM 1.4GHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 6 6 6 6 C207,C209,C 210,C275,C4 Capacitor,Ceramic,Chip 06,C501,C50 2 L501 L110 6 FB101, FB102 Inductor,Multilayer,Chip ELCH0004727 1005GC2TR10J00 100NH 5% 0V 100mA 2.3OHM 600MHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 6 L118 Inductor,Multilayer,Chip ELCH0004730 1005GC2T33NJ00 33NH 5% 0V 200mA 1OHM 1.3GHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. L801,L802, L803,L804, Inductor,Multilayer,Chip L805,L806 ELCH0005019 HK100568NJ 68NH 5% 0V 8A 1.2GOHM 700mHZ 180m NON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN CO.,LTD Inductor,Wire Wound, chip ELCP0008013 MIPSZ2012D2R2 MIPSZ2012D2R2,2.2 uH,N,2.0X1.2X1.0,R/TP FDK CORPORATION. L201,L202, Inductor,Wire Wound, L203 chip ELCP0008014 MIPSZ2012D4R7 MIPSZ2012D4R7,4.7 uH,N,2.0X1.2X1.0,R/TP FDK CORPORATION. ENBY0053001 51338-0274 20P 0.40MM STRAIGHT FEMALE SMD R/TP 1.5M HANKOOK MOLEX 6 6 6 6 L208 CN803 LGE Internal Use Only Connector,BtoB - 168 - Remark Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 6 J501 Description Jack,Phone C201,C205,C Capacitor,Ceramic,Chip 206,C311 PartNumber Spec Remark ENJE0007601 KJA-PH-0-0176 1P 4P ANGLE R/TP 4mM BLACK 6P - KSD CO., LTD ECCH0005604 GRM188R60J106M 10000000 pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATA MANUFACTURING CO.,LTD. 6 CN401 connector,I/O ENRY0008801 GU073-5P-SD-E1500 GU073-5P-SD-E1500,5,mm,ANGLE LS Mtron Ltd. 6 J301 Card Socket ENSY0025901 GCA26A-8S-H16-M-E1000 SIM 8P ANGLE SMD R/TP - LS Mtron Ltd. 6 SW101 Connector,RF ENWY0008701 MS-156C NONE STRAIGHT SOCKET SMD T/REEL AU 50OHM 400mDB HIROSE KOREA CO.,LTD 6 CN402 Connector,Terminal Block ENZY0028601 04-9248-003-017-829+ 3P 2.50MM STRAIGHT SMD R/TP KYOCERA ELCO KOREA SALES CO.,LTD. 6 Q501 FET EQFP0007601 KTJ6131E P-CHANNEL MOSFET -30V +-20 -0.05A 20OHM 100mW ESM R/TP 3P KEC CORPORAITION ECCH0007804 CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD. 6 C251,C720,C Capacitor,Ceramic,Chip 724 6 R703 Resistor,Chip ERHY0000128 MCR01MZP5F1502 15KOHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R406 Resistor,Chip ERHY0000185 MCR01MZP5F8200 820OHM 1% 1/16W 1005 R/TP - ROHM. 6 R110,R111 Resistor,Chip ERHY0000241 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R307,R308,R 309,R310,R3 Resistor,Chip 11 ERHY0000275 MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R205 Resistor,Chip ERHY0003201 MCR01MZP5F1001 1KOHM 1% 1/16W 1005 R/TP - ROHM. 6 R262 Resistor,Chip ERHY0009505 MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP - ROHM Semiconductor KOREA CORPORATION ECZH0000803 C1005C0G1H020CT000F 2pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA COOPERATION 6 C115,C265 Capacitor,Ceramic,Chip 6 R207 Resistor,Chip ERHZ0000486 MCR01MZP5J473 47KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R107 Resistor,Chip ERHY0009586 MCR006YZPF2201 2.2KOHM 1% 1/20W 0603 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R263 Resistor,Chip ERHY0024201 MCR01MZP5F6041 6040 ohm,1/16W,F,1005,R/TP ROHM. 6 R404 Resistor,Chip ERHZ0000201 MCR01MZP5F1000 100OHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R201,R260 Resistor,Chip ERHZ0000204 MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R510,R511 Resistor,Chip ERHZ0000205 MCR01MZP5F1004 1MOHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 L103,L104, Inductor,Multilayer,Chip L117 ELCH0004706 1005GC2T10NJ00 10NH 5% 0V 250mA 0.42OHM 2.5GHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 169 - LGE Internal Use Only 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 6 6 Description PartNumber Spec ERHZ0000206 MCR01MZP5F10R0 10OHM 0.1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION Resistor,Chip ERHZ0000213 MCR01MZP5F1203 120KOHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION R103,R104,R Resistor,Chip 112,R113 ERHZ0000219 MCR01MZP5F1500 150OHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION R601,R602 Resistor,Chip R807 6 R405 Resistor,Chip ERHZ0000236 MCR01MZP5F2001 2KOHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R403 Resistor,Chip ERHZ0000318 MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R272,R302,R 303,R304,R5 Resistor,Chip 01 ERHZ0000405 MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R282,R402 Resistor,Chip ERHZ0000406 MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R101,R102 Resistor,Chip ERHZ0000434 MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION Resistor,Chip ERHZ0000438 MCR01MZP5J203 20KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R219,R266,R 267,R268,R2 Resistor,Chip 69,R401,R50 2 ERHZ0000443 MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R808,R809 Resistor,Chip ERHZ0000465 MCR01MZP5J332 3.3KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R102,R114 Resistor,Chip ERHZ0000473 MCR01MZP5J390 39OHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION ECCH0000143 MCH155CN102KK 1nF 10% 50V X7R -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION ERHZ0000484 MCR01MZP5J471 470OHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 6 6 R301 C119 Capacitor,Ceramic,Chip R264,R265 Resistor,Chip 6 R273 Resistor,Chip ERHZ0000490 MCR01MZP5J510 51OHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 U802 IC,Bus Controller EUSY0300008 PP2106M3 1.8/2.6V 1mA - MLF R/TP 28P - G5 CORPORATION 6 U803 IC,Analog Switch EUSY0347001 DG2735DN-T1-E4 MiniQFN-10L ,10 PIN,R/TP ,1.8X1.4X0.55,0.6 Dual SPDT Analog Switch ,; ,IC,Analog Switch VISHAY INTERTECHNOLOGY ASIA PTE LTD 6 U301 IC,MCP,NAND EUSY0347506 H8BCS0SI0BAR-46M NAND/2G SDRAM/1G 1.7VTO1.9V 14.0x10.0x1.2 TR 149P - - - HYNIX SEMICONDUCTOR INC. 6 U501 IC,LDO Voltage Regulator EUSY0355501 RP103K181D-TR-F 1.7V TO 5.25V 1.85V 400mW DFN R/TP 4P RICOH COMPANY, LTD. 6 U701 Module,Assembly EUSY0385901 TEA5991UK TEA5991_UK,WL-CSP(BSC),20,R/TP,FM Tuner (RDS),2.6*2.6*0.64 ST-Ericsson Asia Pacific Pte Ltd LGE Internal Use Only - 170 - Remark Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec Remark 6 U401 IC,Voltage Reference EUSY0410801 RT9524 DFN,10,R/TP,DFN Cal Test Mode Single Charger IC for Micro USB,IC,ChargerIC,Charger RICHTEK TECHNOLOGY CORP. 6 U703 IC,Bluetooth EUSY0418701 BCM2070B2KUBXG 2.3VTO5.5V 158.4mW WLBGA R/TP 42P BROADCOM ASIA DISTRIBUTION PTE LTD ELCH0004703 1005GC2T1N0S00 1005GC2T1N0S00,1 nH,S ,1005 ,R/TP , PILKOR ELECTRONICS LTD. 6 L112,L119 Inductor,Multilayer,Chip 6 U201 IC,Digital Baseband Processor,GSM EUSY0423201 ESC6270 0VTO0V 0W BGA R/TP 424P - QUALCOMM INCORPORATED. 6 IC401 IC,Analog Multiplexer EUSY0424801 RT8963WS WLCSP,20,R/TP,MUIC-Basic,USB HS,UART,Audio,IC,Analog MultiplexerIC,Analog Multiplexer RICHTEK TECHNOLOGY CORP. 6 X702 Crystal EXXY0024401 TSX-3225 26MHZ 26MHZ 10PPM 10pF NA SMD R/TP SEIKO EPSON CORP 6 X202 Crystal EXXY0025101 DSX321G - 10PPM - - - SMD P/TP DAISHINKU CORPORATION. 6 R261 Resistor,Chip ERHZ0000222 MCR01MZP5F1503 150KOHM 1% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R281 Resistor,Chip ERHY0000279 91K ohm,1/16W,J,1005,R/TP 6 X201 Crystal EXXY0026901 Q13FC1350000300 32.768KHZ 20PPM 0F NONE SMD R/TP EPSON TOYOCOM CORP 6 C239 Capacitor,Ceramic,Chip ECZH0001116 C1005X7R1H271KT000F 270pF 10% 50V X7R -55TO+125C 1005 R/TP - TDK KOREA COOPERATION SAFO0000501 AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM_1005_DNI 6 R702,R705,R 706,R707,R7 08,R709,R71 PCB ASSY,MAIN,PAD 0,R711,R712 SHORT ,R713,R714, R715 SAFP0000401 LG-LU3000 LGTBK,MAIN,A, 6 R109,R283,R Wire Pad,Short 803 SAFP0000501 LG-VS760 VRZ ELCH0004710 1005GC2T15NJ00 15NH 5% 0V 250mA 0.53OHM 2GHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD. 6 6 R284,R814 Wire Pad,Open L1113,L206 Inductor,Multilayer,Chip 6 PT201 Thermistor SETY0007301 NCP15WF104F03RC NTC,100000 ohm,SMD,4250K+/1%,100K,1%,0.1mA,4250K+/-1%,SMD,R/TP MURATA MANUFACTURING CO.,LTD. 6 VA201 Varistor SEVY0001001 EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMD R/TP AMOTECH CO., LTD. 6 C137 Capacitor,Ceramic,Chip ECCH0000196 MCH155A0R75C 0.75pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION 6 VA401 Varistor SEVY0003601 ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE SMD R/TP INNOCHIPS TECHNOLOGY 6 VA264, VA265 Varistor SEVY0005403 ICVS0518270FR 18V 0% 27F 1.0X0.5X0.55 NONE SMD R/TP INNOCHIPS TECHNOLOGY Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 171 - LGE Internal Use Only 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec 6 FL101 Filter,Separator,FEM SFAY0011101 D5008 - - - D5008,850.900 ,1800.1900 ,3.8 dB,4.1 dB, dB, dB,4532 ,4.5X3.2 Size Quad Band FEM EPCOS PTE LTD. 6 FB503, FB504, FB505 Filter,Bead SFBH0008102 BLM15HD182SN1 1800 1.0x0.5x0.5MM SMD R/TP 2P MURATA MANUFACTURING CO.,LTD. 6 FL701 Filter,Ceramic SFCY0000901 LFB212G45SG8A166 BPF 2.45KHZ 100Hz SMD R/TP 4P MURATA MANUFACTURING CO.,LTD. 6 FL806, FL807, FL808, FL809 Filter,EMI/Power SFEY0012401 ICVE10054E250R101FR ESD/EMI 0HZ 25pF 0H SMD R/TP INNOCHIPS TECHNOLOGY 6 FL802, FL803, FL804, FL805, FL810, FL811 Filter,EMI/Power SFEY0013201 EVRC14S03Q030100R ESD/EMI 0HZ 15pF 0H SMD R/TP AMOTECH CO., LTD. 6 FL601, FL602, FL603 Filter,EMI/Power SFEY0013701 EVRC18S03Q015100R ESD/EMI 330HZ 15F 0H SMD R/TP AMOTECH CO., LTD. 6 FL401 Filter,EMI/Power SFEY0015301 NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TP MURATA MANUFACTURING CO.,LTD. 6 U101 IC,Power Amplifier SMPY0019101 SKY77336 SKY77336,dBm,%,A,dBc,dB,5x5,SMD,Polar Edge for QCT SKYWORKS SOLUTIONS INC. 6 SUMY00 Microphone,Condenser SUMY0010610 SPM0410LR5H-QB SPM0410LR5H-QB,UNIT,42 dB,4.72*3.76*1.25,mems TDMA Improve KNOWLES ACOUSTICS 5 SAFD00 PCB Assembly, Main,SMT Top - SAFD0159501 LG-C320 BOOWA MAIN 1.0 6 EAX010000 PCB,Main SPFY0235601 SPFY0235601 FR-4 Staggered via STAGGERED-10 0.8 LG-C320i IDNWA,MAIN,D,FR-4,0.8 mm,STAGGERED-10,MAIN UNITECH PRINTED CIRCUIT BOARD CORP. 6 C417,C525 Capacitor,Ceramic,Chip ECCH0000120 MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM Semiconductor KOREA CORPORATION Capacitor,Ceramic,Chip ECCH0000198 CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD. 6 C207,C209,C 210,C275,C4 Capacitor,Ceramic,Chip 06,C501,C50 2 ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP MURATA MANUFACTURING CO.,LTD. 6 C251,C720,C Capacitor,Ceramic,Chip 724 ECCH0007804 CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD. 6 C103 LGE Internal Use Only - 172 - Remark Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. Description PartNumber Spec Remark 6 C208,C211,C 212,C213,C2 14,C215,C21 6,C217,C218 ,C219,C220, C221,C222,C 223,C229,C2 Capacitor,Ceramic,Chip 31,C235,C23 6,C305,C306 ,C307,C308, C309,C310,C 605,C606,C7 01,C709 ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -55TO+85C 0603 R/TP - TDK CORPORATION 6 C722,C723 Capacitor,Ceramic,Chip ECCH0009514 MCH032A(AN)100DK 10pF 0.5PF 25V X7R -55TO+125C 0603 R/TP - ROHM. 6 C105,C117,C 118,C122,C1 Capacitor,Ceramic,Chip 30,C135,C51 9,C520,C521 ECZH0000830 C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA COOPERATION 6 C134,C312,C 401,C409,C4 Capacitor,Ceramic,Chip 11 ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005 R/TP - TDK KOREA COOPERATION 6 C506,C507 Capacitor,Ceramic,Chip ECZH0001217 GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C 1005 BK-DUP - MURATA MANUFACTURING CO.,LTD. 6 C204,C261,C 262,C263,C2 64,C266,C27 Capacitor,Ceramic,Chip 6,C299,C302 ,C405,C413 ECZH0003103 GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP - MURATA MANUFACTURING CO.,LTD. 6 C508,C509 Capacitor,Ceramic,Chip ECZH0003126 GRM155R71A393K - - - - -55TO+125C - - - MURATA MANUFACTURING CO.,LTD. Capacitor,Ceramic,Chip ECZH0025916 GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C 0603 R/TP MURATA MANUFACTURING CO.,LTD. 6 C268 6 LD801, LD802 LED,Chip EDLH0013701 WHITE 2.9~3.2 20mA X(0.264~0.311) Y(0.248~0.315) 110mW 3.8*1.0*0.4t 3810 R/TP 2P - 6 CN801 Connector,BtoB ENBY0042701 GB042-54S-H10 54P 0.4MM STRAIGHT SOCKET SMD R/TP 1M LS Mtron Ltd. 6 CN260 Connector,BtoB ENBY0045201 AXT610124 10P 0.4MM STRAIGHT HEADER SMD R/TP 1M - BJ PANASONIC ELECTRONIC PARTS CO.,LTD 6 R101 Resistor,Chip ERHY0000254 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R105,R106,R 107,R108,R1 Resistor,Chip 09,R110 ERHZ0000402 MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 R282,R402 Resistor,Chip ERHZ0000406 MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 173 - LGE Internal Use Only 12. EXPLODED VIEW & REPLACEMENT PART LIST Level LocationNo. 6 Description R506,R507 Resistor,Chip PartNumber Spec ERHZ0000435 MCR01MZP5J200 20OHM 5% 1/16W 1005 R/TP - ROHM Semiconductor KOREA CORPORATION 6 U601 IC,Charge Pump EUSY0344403 RT9396GQW QFN,24,R/TP,4CH+2LDO,IC,Sub PMICIC,Sub PMIC RICHTEK TECHNOLOGY CORP. 6 IC501 IC,Audio Sub System EUSY0403901 WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P - WOLFSON MICROELECTRONICS PLC 6 U801 Sensor,Accelerator EUSY0408901 S-5711ACDL 2.5 to 3.3 Y R/TP 4P - SEIKO INSTRUMENTS INC 6 R284,R814 Wire Pad,Open SAFO0000501 AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM_1005_DNI 6 R109,R283, Wire Pad,Short R803 SAFP0000501 LG-VS760 VRZ 6 VA101, VA102 Varistor SEVY0003901 EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP AMOTECH CO., LTD. 6 VA264, VA265 Varistor SEVY0005403 ICVS0518270FR 18V 0% 27F 1.0X0.5X0.55 NONE SMD R/TP INNOCHIPS TECHNOLOGY 6 FB501, FB703 Filter,Bead SFBH0000903 HB-1M1005-601JT 600 ohm 1.0*0.5*0.5 SMD R/TP 2P CERATECH CORPORATION 6 FB502 Filter,Bead SFBH0001501 HH-1M1608-121JT 120 ohm 1.6*0.8*0.8 SMD R/TP 2P CERATECH CORPORATION 6 FB507, FB508 Filter,Bead SFBH0009801 HH-1M1005-601JT 600Ohm 1.0 * 0.5 * 0.5 SMD P/TP 2P CERATECH CORPORATION LGE Internal Use Only - 174 - Remark Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes 12. EXPLODED VIEW & REPLACEMENT PART LIST 12.3 Accessory Level LocationNo. 2 SBPL00 Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Description PartNumber Mobile Phone Battery LiSBPL0098901 Ion Spec Remark LGIP-430N-WW-LGC LGIP-430N-WW-LGC,3.7 V,900 mAh,1 CELL,PRISMATIC ,463450,innerpack, WW LG CHEMICAL 2 EAB010200 Earphone,Stereo SGEY0003744 EMB-LGE004MSKB 3mW 16OHM 115DB 85HZTO126HZ 1M BLACK 3.5 L TYPE STEREO 4POLE PLUG - CRESYN CO.,LTD 2 EAY060000 Adapters SSAD0033602 STA-U34AR STA-U34AR,100-240V,5060 Hz,5.1 V,0.7 A,C-Tick,ACDC ADAPTOR SUNLIN ELECTRONICS CO.,LTD Copyright © 2010 LG Electronics. Inc. All right reserved. Only for training and service purposes - 175 - LGE Internal Use Only

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Manifest Placed Resolution Unit : Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches
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Create Date                     : 2010:10:07 16:43:02+09:00
Modify Date                     : 2010:11:01 14:27:40+09:00
Metadata Date                   : 2010:11:01 14:27:40+09:00
Creator Tool                    : Adobe InDesign CS2 (4.0)
Format                          : application/pdf
Title                           : C320_SVC ENG_101007.indd
Producer                        : Adobe PDF Library 7.0
Trapped                         : False
GTS PDFX Version                : PDF/X-1:2001
GTS PDFX Conformance            : PDF/X-1a:2001
Has XFA                         : No
Page Count                      : 174
Creator                         : Adobe InDesign CS2 (4.0)
EXIF Metadata provided by EXIF.tools

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