Lg C320 Users Manual C320_SVC ENG_101007
LG-C320 to the manual e3475751-5423-4144-b3a9-4de7607efb28
2015-01-26
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Service Manual
Internal Use Only
Service Manual
LG-C320
Model : LG-C320
Date: October, 2010 / Issue 1.0
Table Of Contents
1. INTRODUCTION...................................................................5
4.12 Speaker/Speaker Phone path................................................73
1.1 Purpose................................................................................................ 5
4.13 Main microphone.......................................................................78
1.2 Regulatory Information................................................................ 5
4.14 Headset microphone.................................................................80
1.3 Abbreviations.................................................................................... 7
4.15 RF Component.............................................................................82
4.16 RF Path.............................................................................................83
2. PERFORMANCE....................................................................9
4.17 Trouble Shooting of GSM Part...............................................84
2.1 Product Name................................................................................... 9
4.18 Checking Bluetooth Block.......................................................91
2.2 Supporting Standard..................................................................... 9
4.19 Checking FM Radio Block........................................................96
2.3 Main Parts : GSM Solution............................................................ 9
2.4 HW Features.....................................................................................10
2.5 SW Features.....................................................................................12
2.6 HW SPEC. .........................................................................................14
5. DOWNLOAD.......................................................................99
6. BLOCK DIAGRAM............................................................ 112
2.7 C320 Figures....................................................................................15
7. CIRCUIT DIAGRAM......................................................... 123
3. TECHNICAL BRIEF..............................................................16
8. BGA Pin Map................................................................... 137
3.1 General Description......................................................................16
3.2 Power management.....................................................................28
9. PCB LAYOUT.................................................................... 143
3.3 SUB SYSTEM.....................................................................................32
10. RF CALIBRATION.......................................................... 149
3.4 General Description (RF Part)...................................................40
10.1 Usage of Tachyon for RF Calibration and Test.............. 149
3.5 GSM MODE.......................................................................................41
11. TEST ALONE.................................................................. 152
3.6 OFF-CHIP RF COMPONENTS.....................................................44
11.1 Phone Test Mode..................................................................... 152
3.7 OFF-CHIP COMPONENTS...........................................................46
12. EXPLODED VIEW & REPLACEMENT PART LIST ......... 157
4. TROUBLE SHOOTING........................................................50
11.1 EXPLODED VIEW....................................................................... 157
4.1 Power ON Troubleshooting.......................................................50
11.2 Replacement Parts.................................................................. 159
4.2 Charger Troubleshooting...........................................................52
11.3 Accessory.................................................................................... 175
4.3 USB Troubleshooting...................................................................54
4.4 USIM Detect Troubleshooting..................................................56
4.5 Camera Troubleshooting............................................................58
4.6 Main side view LED Troubleshooting....................................60
4.7 Slide Key side view LED Troubleshooting............................61
4.8 LCD Troubleshooting...................................................................63
4.9 Vibrator Troubleshooting...........................................................65
4.10 Receiver Path................................................................................67
4.11 Headset path................................................................................70
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
--
LGE Internal Use Only
LGE Internal Use Only
--
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
Introduction
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features
of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services. System
users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users are
responsible for programming and configuring the equipment to prevent unauthorized use. The
manufacturer does not warrant that this product is immune from the above case but will prevent
unauthorized use of common carrier telecommunication service of facilities accessed through or connected
to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,
note that unauthorized alternations or repair may affect the regulatory status of the system and may void
any remaining warranty.
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
--
LGE Internal Use Only
1. INTRODUCTION
G
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the
information is ESD handling:
sign. Following
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is also
grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.
LGE Internal Use Only
--
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC
Automatic Power Control
BB
Baseband
BER
Bit Error Ratio
CC-CV
Constant Current – Constant Voltage
DAC
Digital to Analog Converter
DCS
Digital Communication System
dBm
dB relative to 1 milli watt
DSP
Digital Signal Processing
EEPROM
Electrical Erasable Programmable Read-Only Memory
ESD
Electrostatic Discharge
FPCB
Flexible Printed Circuit Board
GMSK
Gaussian Minimum Shift Keying
GPIB
General Purpose Interface Bus
GSM
Global System for Mobile Communications
IPUI
International Portable User Identity
IF
Intermediate Frequency
LCD
Liquid Crystal Display
LDO
Low Drop Output
LED
Light Emitting Diode
OPLL
Offset Phase Locked Loop
ͽͶ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑ΟΝΪ
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6/140
--
ʹΠΡΪΣΚΘΙΥ͑ι ͣͨ͑͡͡ͽ͑ͶΝΖΔΥΣΠΟΚΔΤ͑͟ͺΟΔ͑͑͟ͲΝΝ͑ΣΚΘΙΥ͑ΣΖΤΖΣΧΖΕ͑͟
ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
PAM
Power Amplifier Module
PCB
Printed Circuit Board
PGA
Programmable Gain Amplifier
PLL
Phase Locked Loop
PSTN
Public Switched Telephone Network
RF
Radio Frequency
RLR
Receiving Loudness Rating
RMS
Root Mean Square
RTC
Real Time Clock
SAW
Surface Acoustic Wave
SIM
Subscriber Identity Module
SLR
Sending Loudness Rating
SRAM
Static Random Access Memory
PSRAM
Pseudo SRAM
STMR
Side Tone Masking Rating
TA
Travel Adapter
TDD
Time Division Duplex
TDMA
Time Division Multiple Access
UART
Universal Asynchronous Receiver/Transmitter
VCO
Voltage Controlled Oscillator
VCTCXO
Voltage Control Temperature Compensated Crystal Oscillator
WAP
Wireless Application Protocol
ͽͶ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑ΟΝΪ
LGE Internal Use Only
7/140
--
ʹΠΡΪΣΚΘΙΥ͑ι ͣͨ͑͡͡ͽ͑ͶΝΖΔΥΣΠΟΚΔΤ͑͟ͺΟΔ͑͑͟ͲΝΝ͑ΣΚΘΙΥ͑ΣΖΤΖΣΧΖΕ͑͟
ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2. PERFORMANCE
2.1 Product Name
C320 : EGSM/GSM850/DCS/PCS
(GPRS Class 12 / EDGE Class 12)
2.2 Supporting Standard
Item
Supporting Standard
Frequency Range
Application Standard
Feature
EGSM/GSM850/DCS1800/PCS1900
with seamless handover
Phase
Phase 2+(include
2+(includeAMR)
AMR)
SIM Toolkit
C-E 1, 2, 3, C-E
Toolkit: Class 1, 2,: 3,
Class
EGSM TX : 880 – 915 MHz
EGSM RX : 925 – 960 MHz
GSM850 TX
: 824 – 849 MHz
GSM850 RX
: 869 – 894 MHz
DCS1800 TX
: 1710 – 1785 MHz
DCS1800 RX
: 1805 – 1880 MHz
PCS1900 TX
: 1850 – 1910 MHz
PCS1900 RX
: 1930 – 1990 MHz
WAP 2.0, JAVA 2.0
Comment
2.3 Main Parts : GSM Solution
Item
Digital Baseband
Analog Baseband
RF Chip
Part Name
ESC6270 : Qualcomm
ESC6270 : Qualcomm
ESC6270 : Qualcomm
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
--
Comment
LGE Internal Use Only
2. PERFORMANCE
2.4 HW Features
Item
Form Factor
Battery
Size
Weight
Volume
PCB
Stand by time
Charging time
Talk time
RX sensitivity
TX
output
power
GSM/
GPRS
EDGE
GPRS compatibility
EDGE compatibility
SIM card type
Display
Feature
Slide type
1) Capacity
Standard : Li-Ion, 900 mAh
2) Packing Type : Soft Pack
Standard : 91 x 63 x 15.9 mm
115.6g
TBD
Stag type, 10 Layers , 0.8t
Up to 300 hrs
Up to 3 hrs
2G Up to 3.4hr
EGSM
: -105 dBm
GSM850
: -105 dBm
DCS 1800
: -105 dBm
PCS 1900
: -105 dBm
EGSM
: 33dBm
GSM850
: 33 dBm
DCS 1800
: 30 dBm
PCS 1900
: 30 dBm
GSM 900
: 27 dBm
GSM 850
: 27 dBm
DCS 1800
: 26 dBm
PCS 1900
: 26 dBm
GPRS Class 12
EDGE Class 12
Plug-In SIM
3V /1.8V
2.4” TFT QVGA landscape
Built-in Camera
Status Indicator
Keypad
2M FF SOC Camera
Yes
ANT
System connector
Ear Phone Jack
PC synchronization
Memory
Main : Internal Fixed Type
5 Pin
3.5Phi, 4 Pole, Stereo
Yes
NAND Flash : 2Gbit
SDRAM : 1Gbit
FR, EFR, HR,AMR
Built in Data & Fax support
Built in Vibrator
V2.1 + EDR
SW Decoded 64Poly
Speech coding
Data & Fax
Vibrator
BlueTooth
MIDI(for Buzzer
Function)
LGE Internal Use Only
-410 -
Comment
With Battery
@ Paging Period 5
@
@ Tx=Max(2G)
Class4 (EGSM)
Class4 (GSM850)
Class1 (PCS)
Class1 (DCS)
E2 (GSM900)
E2 (GSM850)
E2 (PCS)
E2 (DCS)
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
Music Player
Video Player
Camcorder
Voice Recording
Speaker Phone mode
Support
Travel Adapter
CDROM
Stereo Headset
Data Cable
T-Flash
(External Memory)
MP3/AAC/AAC+/WMA
PEG4, H.263,H.264 30fps@QVGA
WMV 15fps@QCIF
MPEG4, 15fps@QVGA
Yes
Yes
Yes
No
Yes
Yes
Yes
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 11 -
LGE Internal Use Only
2. PERFORMANCE
2.5 SW Features
Item
RSSI
Battery Charging
Key Volume
Audio Volume
Time / Date Display
Multi-Language
Quick Access Mode
PC Sync
Speed Dial
Profile
CLIP / CLIR
Phone Book
Last Dial Number
Feature
English / Chinese Trad. / Chinese Simp.
/ Thai / Korean / Malay / Indonesian /
Vietnamese
Dialing / Contact / Menu /
Message / Camera
Yes
Yes
Yes
Yes
Name + 5 Numbers + 1 Memo + 2
e-mail + 3 Group Select + Picture +
Ringtone + Anniversary day
Yes
Last Received
Number
Last Missed Number
Yes
Search by Number
/ Name
Group
Fixed Dial Number
Service Dial Number
Own Number
Name and Number
Yes
Yes
No
Yes
Voice Memo
Call Reminder
Network Selection
Yes
Yes
Automatic
Mute
Call Divert
Call Barring
Call Charge (AoC)
Call Duration
SMS (EMS)
Yes
Yes
Yes
Yes
Yes
Yes (1000+SIM)
SMS Over GPRS
EMS Melody / Picture
Send / Receive / Save
MMS MPEG4
Send / Receive / Save
Long Message
Yes
Yes
(Receive only)
Yes
LGE Internal Use Only
Comment
0 ~ 7 Levels
0 ~ 3 Levels
0 ~ 7 Level
1 ~ 20 Level
Yes
Yes
Yes
PC suite 4
Voice mail center -> 1 key
not same with feature phone setting
1000 + SIM
Total Call DB Max 100
LDN (SIM) N/A
Total Call DB Max 100
LDN (SIM) N/A
Total Call DB Max 100
LDN (SIM) N/A
30
Read only
(add/edit/delete are not supported)
Support voice recorder
EMS : Release4
(Except Text align)
MAX 1000 Characters
SMS 7pages
6
- 12 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
Cell Broadcast
Download
Game
Calendar
Memo
World Clock
Unit Convert
Stop Watch
Wall Paper
WAP Browser
Download Melody /
Wallpaper
SIM Lock
SIM Toolkit
MMS
EONS
CPHS
ENS
Camera
JAVA
Yes
Over the WAP
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Over WAP 2.0
Yes
Voice Dial
IrDa
Bluetooth
No
No
Yes
FM radio
Yes
GPRS
EDGE
Hold / Retrieve
Conference Call
DTMF
Memo pad
TTY
AMR
SyncML
IM
Email
Yes
Yes
Yes
Yes
Yes
Yes
No
Yes
No
Yes
Yes
100
Obigo
Over WAP
Yes
Yes
Yes
No
Yes
No
Yes
Yes
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Operator Dependent
R99
Obigo +LG MMS Client
V4.2
2M FF
CLDC V1.1 / MIDP V2.1
Download Over WAP
BT 2.1+EDR
HFP/HSP/A2DP&AVRCP
/OPP/BPP/PBAP/SPP/
Class 12
Class 12
Max. 6
JAVA midlet (neustar)
- 13 -
LGE Internal Use Only
2. PERFORMANCE
2.6 HW SPEC.
1) GSM transceiver specification
Item
Phase Error
Frequency Error
EMC(Radiated Spurious Emission
Disturbance)
Transmitter Output power and Burst
Timing
Burst Timing
Spectrum due to modulation out to less
than 1800kHz offset
Spectrum due to modulation out to
larger than 1800kHz offset to the edge
of the transmit band
Spectrum due to switching transient
Reference Sensitivity – TCH/FS
Usable receiver input level range
Intermodulation rejection – Speech
channels
Specification
Rms : 5°
Peak : 20 °
GSM : 0.1 ppm
DCS/PCS : 0.1 ppm
GSM/DCS : < -28dBm
GSM : 5dBm – 33dBm ± 3dB
DCS/PCS : 0dBm – 30dBm ± 3dB
<3.69us
200kHz : -36dBm
600kHz : -51dBm/-56dBm
GSM :
1800-3000kHz :< -63dBc(-46dBm)
3000kHz-6000kHz : <-65dBc(-46dBm)
6000kHz < : < -71dBc(-46dBm)
DCS :
1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm
Class II(RBER) : -105dBm(2.439%)
0.012(-15 - -40dBm)
± 800kHz, ± 1600kHz
: -98dBm/-96dBm (2.439%)
AM Suppression
T GSM : -31dBm
- DCS : -29dBm
-98dBm/-96dBm (2.439%)
Timing Advance
± 0.5T
LGE Internal Use Only
- 14 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2.7 C320 Figures
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.
TECHNICAL BRIEF
2. Base Band Technical Description
3.1 General Description
QSC6270 (3G disable)has all eight major functional blocks as like Figure 3.1
Figure 3.1 QSC6270(3G disable) Base band block
LGE Internal Use Only
- 16 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.1.1 Processor
The QSC6270(3Gdisable) device integrates multiple processors on-chip: one ARM microprocessor and two
DSP processors. Each processor is part of a functional subsystem:
The micro subsystem includes the ARM926EJ-S microprocessor.
The modem subsystem includes the QDSP4u8 digital signal processor (mDSP).
The application subsystem includes the QDSP4u8 application digital signal processor(aDSP).
Figure 3.1.1 Processors and bus architecture
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 17 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.1.2 Memory support (and LCD interface)
3.1.2
Memory support (and LCD interface)
The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2.
The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2.
EBI1 supports high-speed synchronous dynamic devices. Its memory controller supports the new mobile
EBI1 supports
high-speed
synchronous
devices. Its memory
controller
supports
the new
mobile DDR
DDR SDRAM
memories
with itsdynamic
higher bandwidth
and ability
to run at
high clock
frequencies.
This
SDRAM interface
memoriessupports
with its higher
bandwidth and ability
to run atand
highlow-latency
clock frequencies.
This interface
the high-bandwidth,
high-density,
requirements
of thesupports
QSC’s
advanced on-chip
capabilities
such as therequirements
ARM9 processor,
graphics,
and video
the high-bandwidth,
high-density,
and low-latency
of thehighperformance
QSC’s advanced on-chip
capabilities
such
applications.
as the ARM9 processor, highperformance graphics, and video applications.
EBI2
interface
intended
to support
memory
devices
suchsuch
as NAND
flash and
EBI2isisthe
theslower
slowerspeed
speed
interface
intended
to support
memory
devices
as NAND
flashasynchronous
and
SRAM, peripheral
devices
suchperipheral
as LCDs, and
the UBM
receiver
for multicast
or broadcast
(QSC6270
only).
asynchronous
SRAM,
devices
such
as LCDs,
and the UBM
receiver reception
for multicast
or
In addition,
EBI2 is reception
required to(QSC6270
support a only).
synchronous-burst
AADisNOR
flash to
a NOR/DDR
SDRAM memory
broadcast
In addition, EBI2
required
toenable
support
a synchronous-burst
configuration
because
simultaneous
mode SDRAM
(NOR, SDRAM)
is not
supported on
the EBI1
bus.
AAD NOR
flashthe
to enable
a NOR/DDR
memory
configuration
because
the
simultaneous mode
(NOR, SDRAM) is not supported on the EBI1 bus.
The ARM926EJ-S microprocessor is a cached processor and all its accesses to external memory use burst
techniques
of four or
eight 32-bit words
when the
memoryand
region
is declared
cacheable/bufferable.
To take
The ARM926EJ-S
microprocessor
is a cached
processor
all its
accessestotobeexternal
memory use burst
advantage
of
this
QSC
higher
performance
feature,
data
from
memories
must
satisfy
the
requirements
for
these
techniques of four or eight 32-bit words when the memory region is declared to be
burst accesses.
cacheable/bufferable. To take advantage of this QSC higher performance feature, data from
memories must satisfy the requirements for these burst accesses.
EBI1
CLK
CKE
_CS
_RAS
SDRAM
512Mbit
)
_CAS
_WED
DQM
ADDR
DQ
External
Memory
( MICRO SD)
EBI2
DDR_M_CLK_N
DDR_CKE[0]
_
NAND
_CS_
_N
DDR_CS[0]_N
_
DDR_RAS_N
DDR_CAS_N
DDR_WE_N
_ _
DDR_D[0:15]
ALE
NAND
_UB_N
CLE
NAN
D_OE_N
NAN
D_WE_N
NAND
_BSY_N
DDR_DQM[0:1]
_
DDR_A[0:13]
QSC6270
(3G disable)
_CE
NAND
_LB_N
NAND_WP
_N
NAN
D_DATA
[ 0: 15]
_RE
_WE
NAND Flash
(1Gbit)
RY_BY
_WP
IO[ 1: 16]
SIM_CLK
MSD_D[0:3]
_ _
SIM_RST_N
MSD_CMD
SIM_DATA
MSD_CLK
MUSIM_DM
MUSIM_DP
USIM
(SIM PLUS)
Figure 3.1.2.1 The memory control blocks of C320
LGE Internal Use Only
- 18 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
LDO_LCD_2.8V
LDO_LCD_1.8V
LCD_RST
EBI2_WE_N
LCD_ADS
LCD_CS_N
EBI2_DATA[15:0]
LCD_IF(2:1)
QVGA Main
LCD
(2.4", 320x240)
QSC6270
(3G disable)
WLED_PWR
Figure 3.1.2.2 The LCD interfaces of C320
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 19 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.1.3 Connectivity
QSC6270 has connectivity features as below
– USB-OTG; USB LS, FS, and HS (2.0 compliant)
– I2C compatible for peripheral controls (1.8 V)
– UART: up to 4 Mbps
– Bluetooth 2.0 support via external SoC
– WLAN via external device (SDIO)
– NFC via external module (I2C)
– FM radio via external module (I2C)
– USIM, SIM, and USB-UICC support; 1.8 and 3 V
– Keypad interface
– SPI (master only) for peripheral support
– Two secure digital controllers — WLAN and secure digital (SD) cards
QSC6270
Figure 3.1.3 The connectivity of BL20
LGE Internal Use Only
- 20 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.1.4 GPIOs
QSC6270 (3G disable has 78 configurable I/O pins
HALL_SENS_DET
BT_RST_N
BT_WAKEUP_HOST
MUSIM_DP
MUSIM_DM
WLAN_CLK
WLAN_SDIO[3]
WLAN_SDIO[2]
WLAN_SDIO[1]
WLAN_SDIO[0]
WLAN_CMD
BT_PWR_ON
LCD_IF_MODE[0]
HS_JACK_DET
WLAN_BT_REG_ON
LCD_RST_N
WLAN_RST_N
BL_LCD_CAM_LDO_I2C_SDA
BL_LCD_CAM_LDO_I2C_SCL
MUIC_AUD_FM_I2C_SCL
MUIC_AUD_FM_I2C_SDA
MUIC_INT_N
CHG_STS_N
CHG_EN_N
High : BT UART
Low : UART Comm
BL_LCD_CAM_LDO_EN
UART_BT_SEL
Figure 3.1.4 GPIOs of C320
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 21 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.1.5 Air interfaces
The supported air-interface standards and features include: (See the RF technical description)
GSM/GPRS/EDGE Specification Release 4 (3GPP R4)
Enhanced GPS position location using gpsOne (with RGR6240 IC)
Integrated gpsOne functionality, featuring enhancements by SnapTrack®, Inc., to enable a wide variety of
location-based services and applications, including points of interest, personal navigation, and friend finder
Simultaneous-GPS (processes GPS using dedicated circuitry while voice and/or data signals continue to be
processed separately)
1024x searcher, direct facility termination (DFT) accelerator, off-chip RAM for measured data storage
3.1.6 Internal base band functions
Several baseband circuits within the QSC6270(3G disable)device provide functions that are necessary only to
make the device operate properly — these functions are not generally used directly by other
handset circuits and functions.
PLLs and clock generation
Modes and resets
Security
Qfuse
JTAG/ETM
The clock block includes two PLLs, all phase-locked to the TCXO signal. These PLLs generate several
different stable, low-jitter clock signals that are distributed throughout the QSC device and to external c
omponents as needed.
All the required WCDMA, GSM, GPS(only QSC6270), ARM, QDSP, and most peripheral clocks are derived in
some way from the TCXO (or XO) source for their operating modes, plus the 32.768 kHz
oscillator for their sleep modes
Figure 3.1.6 Clock block basic architecture of QSC6270(3G disable)
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3. TECHNICAL BRIEF
3.1.7 Multimedia
Multimedia topics are as below in QSC6270, including:
Camera interface and video front-end
Mobile display processor
Additional multimedia support: video, audio, graphics, and messaging
3.1.7.1 Camera interface and video front-end
The camera interface (CAMIF) connects the QSC62x0 device directly to a camera sensor. Typical applications
include Qcamera, Qcamcorder, and QvideophoneThe CAMIF delivers the raw 10-bit Bayer pattern data
(preferred) to the video front-end (VFE) that performs the required image processing (RGB-triplet generation,
color-space conversion, auto-white balance, auto exposure, gamma correction, etc.) and prepares the image
for capture or transmission. The QSC device also supports a YUV 4:2:2 input from the sensor
(8-bit, 2:1 MUX YUV or CCIR656 YUV).
The video capabilities of the two QSC devices varies slightly, with the QSC6270 providing higher performance
than the QSC6270 device — greater resolution, higher capture and streaming rates, etc.
Copyright © 2010 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL BRIEF
3.1.7.2 Mobile display processor
The MDP is a hardware accelerator primarily responsible for transferring an updated image from the QSC
memory subsystem to the LCD module. The transferring of an updated image is an operation that is shared
between software, video processing, and graphics processing, so a common block helps to reduce
redundant circuitry. The MDP is designed with the assumption that the LCD panel has an embedded LCD
controller and a frame buffer. The image transfer is then the copying of the image from the QSC memory
system to the frame buffer within the LCD module.
While the MDP is transferring an image to the LCD module, it can perform a final set of operations to the
image. The set of operations that the MDP can perform has been chosen to maximize the efficiency of the
QSC memory subsystems, typically removing two or more copy operations of the image to and from
memory.
The MDP reduces redundant circuitry and offloads the ARM and aDSP from memory-transfer operations and
a certain set of graphics and video operations
Figure 3.1.7.2.1 MDP-to-LCD interface functional block diagram
LGE Internal Use Only
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Only for training and service purposes
3. TECHNICAL BRIEF
VLDO_LCD_2V8
R102
R101
1
1
VLDO_LCD_1V8
CN102
1
2
LCD_VSYNC_OUT
LCD_MAKER_ID
LCD_DATA[0]
LCD_DATA[1]
LCD_DATA[2]
LCD_DATA[3]
3
4
5
6
7
8
LCD_DATA[4]
LCD_DATA[5]
9
LCD_DATA[6]
LCD_DATA[7]
LCD_DATA[8]
LCD_DATA[9]
LCD_DATA[10]
LCD_DATA[11]
LCD_DATA[12]
LCD_DATA[13]
LCD_DATA[14]
LCD_DATA[15]
11
10
12
13
14
15
16
17
18
19
20
21
LCD_RD
LCD_WR_N
LCD_RS
LCD_CS_N
22
23
24
LCD_RST_N
25
LCD_IF_MODE[1]
LCD_IF_MODE[0]
26
27
28
29
30
C101
C102
0.1u
0.1u
WLED5
WLED4
WLED3
WLED2
WLED1
WLED_VOUT
31
32
33
34
35
Figure 3.1.7.2.2 The LCD interface of C320
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LGE Internal Use Only
3. TECHNICAL BRIEF
3.1.8 UART
̰ One universal asynchronous receiver transmitter (UART) port that supports low-speed, full-speed,
and high-speed modes
̰ Serial data port communications that conform to the RS-232 interface protocol
̰ Used for data transport during Bluetooth operation (BTS402x™ SoC required)
̰ Other possible uses:
– Test and debug
– External keypad
– Ringer
– Load/upgrade system software
̰ Separate FIFOs for Rx and Tx
̰ Supporting circuits include:
– Interrupt control
– Clock source
– Bit-rate generator (BRG)
– Microprocessor interface
̰ Flow control is not available on UART2 (behind USIM)
3.1.9 USB
̰ Each USB link has a host and a peripheral; the host is responsible for initiating and controlling bus traffic
̰ The USB specification requires PCs to act as hosts, and other devices such as printers, keyboards, mice, etc.,
to act as peripherals
̰ USB 2.0 implementation defines three modes
- Low-speed (LS): 1.5 Mbps
- Full-speed (FS): 12 Mbps
- High-speed (HS): 480 Mbps
̰ The QSC62x0 is compliant with the USB 2.0 specification
- All three modes are supported when acting as a host
- FS and HS are supported when acting as a peripheral
̰ The QSC62x0 has two USB controllers
- Primary USB controller
- Secondary USB controller
̰ The primary USB controller is supplemented by an integrated physical layer (PHY)
3.1.10 HKADC
The HKADC includes an analog multiplexer that selects an input for the sample and
hold circuit. One of three inputs can be selected:
HKAIN1, pin R22 – an external connection that is available as a general-purpose input,
though it is often used to monitor the power amplifier(s) temperature.
An on-chip connection to the power management circuit’s analog multiplexer output. This allows monitoring of:
-. Key power supply nodes such as VBAT, VCHG, etc.
-. Multipurpose pins (when configured as analog inputs)
-. A few on-chip parameters such as the die temperature or VREF
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3. TECHNICAL BRIEF
QSC6270HKADC Block diagram
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Only for training and service purposes
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3. TECHNICAL BRIEF
3.2 Power management
3.2.1 Input power management
Valid external supply attachment and removal detection
Unregulated (closed-loop) external charger supply as input power source
Integrated PFET charging pass transistor; eliminated sense resistor
Support for lithium-ion and lithium-ion polymer main batteries; nickel-based batteries are not supported
Trickle, constant current, constant voltage, and pulse charging of the main battery
Autonomous charging option – driven by an on-chip state machine without software intervention
Software-controlled charging option – backwards-compatible with previous QSC and PM products
Coin-cell battery (including charging)
Battery-voltage detectors with programmable thresholds
VDD collapse protection
Charger-current regulation and real-time monitoring for overcurrent protection
Charger-transistor protection by thermal control
Control drivers for the internal charging PFET and external battery PFET
Voltage, current, and thermal control loops
Automated recovery from sudden momentary power loss (requires external32.768 kHz crystal)
Figure 3.2.1 Input circuits schematic diagram
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3. TECHNICAL BRIEF
3.2.2 Output voltage regulation
The QSC62x0 device includes all the regulated voltages needed for most low-cost wireless
handset applications (and many other applications). Independent regulated power sources are
required for various electronic functions to avoid signal corruption between diverse circuits,
support power-management sequencing, and meet different voltage-level requirements. Sixteen
voltage regulators are provided — all programmable, all derived from a common bandgap reference circuit.
Three major types of voltage regulator circuits are on-chip:
Three positive voltage switched-mode power supply (SMPS) circuits
- One boost converter (rated for 600 mA)
- Three buck converters (rated for 500 mA each)
Thirteen positive voltage linear regulators
- Four rated for 300 mA
- Six rated for 150 mA
- Three rated for 50 mA
One negative voltage charge pump rated for 200 mA, referred to as a negative charge pump(NCP)
Each regulator has two logic-OR input bits; a logic high at either input enables that regulator:
A master bit that enables all regulators according to their default condition
A dedicated bit that enables only that regulator
The master enable reduces the number of write cycles needed when switching between the phone’s
sleep and active modes.
Additional comments that apply to regulator functions:
If a regulator’s default condition is on, that regulator will power on automatically at QSC startup.
The MSMP regulator must be on to allow internal communications between major functional blocks.
Each regulator and SMPS can provide more than its rated output current, though some
performance characteristics might be degraded.
All regulated output voltages are programmable.
All regulators can be set to a low-power mode except the VREG_USB_3P3 and VREG_NCP circuits
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3. TECHNICAL BRIEF
Table 3.2.2 Voltage regulator summary
1. All regulator names are based on their intended use, though some may be used to power alternate
functions. For example, the USIM regulator is intended to power an external SIM card but may be used to
power other circuits (or not used at all).
2. Each current listed in this table is its regulator's rated value – the current at which the regulator meets all its
performance specifications. Higher currents are allowed, but higher input voltages may be required and
some performance characteristics may become degraded. See the appropriate regulator sections for details.
3. VREG_MSMP powers key internal circuits and should be kept on at its default voltage setting.
4. All regulators have default output voltage settings, even if they default to an off condition.
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3. TECHNICAL BRIEF
3.2.3 Charging control
C320 use single Charger.
- Single charger has five mode like “ OFF / TRICKLE / ISET / USB500 / FACTORY mode”.
- Single Charger is working as ISET mode in case of CC(Constant Current), CV(Constant Voltage) mode,
as USB 500mode in case of USB Charging.
- FACTORY mode is working only for Factory use.
p
k Guv{G
j
ylT
k GG
j
CHG_STS_N
DNI
VBUS_LDO_4V9
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
MUIC_IO_M
MUIC_IO_P
MUIC_ACC_ID
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3. TECHNICAL BRIEF
3.3 SUB SYSTEM
3.3.1 KEY PAD
C320 have a key-coder IC that supports eight sense lines, or columns, and eight keypad rows.
The device scans and encodes 64 matrix – addressed keys on keypads . Key press and release events are stored
in a FIFO buffer with 16 event lengths for uploading to a host processor. The event data stored will indicate the
sequence of events and which keys set pressed or released.
VREG_MSME_1V8
25pF
25pF
25pF
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- 32 -
KEY_COL6
KEY_COL7
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Only for training and service purposes
3. TECHNICAL BRIEF
3.3.2 External memory interface
The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2.
EBI1 supports high-speed synchronous dynamic devices. Its memory controller supports the new mobile DDR
SDRAM memories with its higher bandwidth and ability to run at high clock frequencies. This interface supports
the high-bandwidth, high-density, and low-latency requirements of the QSC’s advanced on-chip capabilities
such as the ARM9 processor, highperformance graphics, and video applications.
EBI2 is the slower speed interface intended to support memory devices such as NAND flash and asynchronous
SRAM, peripheral devices such as LCDs, and the UBM receiver for multicast or broadcast reception (QSC6270
only). In addition, EBI2 is required to support a synchronous-burst AAD NOR flash to enable a NOR/DDR SDRAM
memory configuration because the simultaneous mode (NOR, SDRAM) is not supported on the EBI1 bus.
EBI1 Features
EBI1 is a high-performance external memory interface for the QSC62x0 digital block that supports DDR SDRAM
devices Specifically, the following memory devices are supported on EBI1:
̰ SDRAM
-16-bit low-power DDR SDRAM
-Minimum size per chip-select: 16 MB (128 Mbit)
-Maximum size per chip-select: 128 MB (1 Gbit, 1 k columns only)
Characteristics of the EBI1 clock are listed below:
-Maximum clock rate is 92 MHz, defined by the AMSS software.
-The EBI1 memory controller clock is synchronous to the bus clock (HCLK).
EBI2 Features
EBI2 is used to interface with slower memory and peripheral devices (NAND flash, burst NOR, LCDs, etc.).
The following EBI2 devices are supported:
̰ NAND flash
-8/16 bit, single-level cell (SLC)/multi-level cell (MLC) 512/2048-byte page devices
-DMA support
-Boot-up capability from the above devices
̰ Burst NOR flash
-16-bit multiplexed AAD burst NOR devices
̰ 8/16/18-bit (write only) LCD devices (both Motorola and Intel style)
Characteristics of the EBI2 clock are listed below:
̰ The maximum clock rate is 46 MHz, defined by the AMSS software.
̰ The EBI2 memory controller operates at HCLK/2.
̰ Broadcasting and multicasting (QSC6270 only, with MBP1600 IC) are based on:
-Wideband MediaFLO™, DBV-H, and ISDB-T
Asynchronous/burst controller (EBI1 and EBI2)
The external memory controller (xmem_ctlr) forms the asynchronous/burst controller for both EBI1 and EBI2 in
the QSC62x0 device. The controller is generic in terms of its software programmable options and can be
customized when used for EBI1 and EBI2. This block has been enhanced in the QSC62x0 device to support 32-bit
burst memories and byte masking during write operations.
.
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3. TECHNICAL BRIEF
3.3.3 Camera Interface ( 2M CAMERA )
3.3.3.1 2M CAMERA
C320 Installed a 2M Pixel Camera. Below picture shows the camera board to board connector and
camera I/F signal.
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3. TECHNICAL BRIEF
8
3
7
4
6
5
9
2
8
3
7
4
6
5
9
2
10
1
9
2
8
3
7
4
6
10
1
5
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10
1
- 35 -
LGE Internal Use Only
3. TECHNICAL BRIEF
3.3.4 LCD Module (LQ024Q3UX01 : SHARP)
The DM24-DSM04 model is a Color TFT LCD supplied by LG Innotek.
This main Module has a 2.4 inch diagonally measured active display area with 320(RGB) X 240 resolution.
Each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes.
Main LCD color is determined with 262k colors signal for each pixel.
The DM24-DSM04 has been designed to apply the interface method that enables low power, high speed, and
high contrast. The DM24-DSM04 is intended to support applications where thin thickness and low power are
critical factors and graphic displays are important
GENERAL DESCRIPTION
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3. TECHNICAL BRIEF
PIN DESCRIPTION
Input Signal and Power : Pin Description ( Input Pin : 35 )
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Only for training and service purposes
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3. TECHNICAL BRIEF
LGE Internal Use Only
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3. TECHNICAL BRIEF
3.3.5 Audio Signal Processing & Interface
Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal
from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (QSC6270). This
transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset. The downlink
path amplifies the signal from DBB chip (QSC6270) and outputs it to receiver (or speaker).
The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. The outputs
earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_OP, LINE_ON) are differential outputs. Earphone2 (HPH_L,
HPH_R) is a single-ended output stage designed to drive a headset speaker. The microphone interface consists
of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier.
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3. TECHNICAL BRIEF
G
3.4 GENERAL DESCRIPTION (RF Part)
The RF platform of C320 supports four communication bands (GSM850 / GSM900 / GSM1800 / GSM1900).
The all the RF blocks can be divided into two main parts, which are a GSM, and an antenna switch Mode.
The simplified block diagram is shown in Figure 3.4
3.4 Block diagram of RF part
[Figure 1.1]
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3. TECHNICAL BRIEF
G
3.5 GSM MODE
The EDGE/GPRS/GSM transceiver use a digital interface that is shared between receive and transmit data.
The receive interface is based on I and Q data and the transmitter interface is based on envelop and
frequency data.
The quad band EDGE/GSM/GPRS transceiver has the following general features:
Power class
GMSK low bands: Class 4 (33 dBm)
GMSK high bands: Class 1 (30 dBm)
8PSK low bands: Class E2 (27 dBm)
8PSK high bands: Class E2 (26 dBm)
Multi slot class 12 (4+4=5)
Dual Transfer Mode (DTM) class 9 (3+2=5)
Zero-IF receiver
-Polar modulation transmitter
3.5.1 GSM RECEIVER
The RF receiver designs are leveraged from previous-generation RTR devices, including the latest innovations.
All ESC receiver paths are discussed in this section.
The ZIF receive signal paths support multiband, multimode applications:
Quad-band GSM:
Low-band
GSM 850 (869 to 894 MHz) and GSM 900 (925 to 960 MHz)
High-band
DCS1800 (1805 to 1880 MHz) and PCS1900 (1930 to 1990 MHz)
The on-chip receive signal paths are functionally identical for each mode (GSM or EDGE) and each band type
(low or high). The external circuitry includes the antenna switch module and a filter function.
All RF Rx inputs use a differential configuration to maximize common-mode rejection, Tx isolation, out-ofband suppression, and second-order intermodulation performance. The first of two quadrature
downconverters accepts inputs from two LNAs (only one is active at a time). An example application could
support the following bands using these two LNAs:
GSM 1900
GSM 850
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3. TECHNICAL BRIEF
G
The second downconverter accepts inputs from another two LNAs (again, just one is active at time) and is
dedicated to GSM 900 and GSM 1800 operation.
The two downconverter outputs drive analog baseband filters and buffer circuits that are programmed to
support the active operating mode’s waveforms (GSM or EDGE). The analog baseband signals are then
digitized by analog-to-digital converters (ADCs) whose outputs are routed to the digital baseband circuits for
further processing.
Numerous secondary Rx functions are also integrated: Rx frequency synthesizers (each having their own PLL
and VCO circuits), LO generation and distribution circuits, reference and clock circuits for the ADCs, and
various interface, control, and status circuits. Power reduction features (such as selective circuit powerdown,
gain control, and bias control) extend handset standby time.
Like the Tx LO, all Rx LO circuits are completely integrated. All received LO signals are generated by the onchip Rx VCOs under control of their PLLs.
[Figure 3.5.1] QSC GSM receiver signal paths functional diagram
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3. TECHNICAL BRIEF
G
3.5.2 GSM TRANSMITTER
The RF transmitters are leveraged from previous-generation RTR™ devices, including the latest innovations.
The ESC transmitter paths and Tx power-detector input are discussed in this section. It provides the zero-IF
(ZIF) transmit signal paths for multiband, multimode applications:
Quad-band GSM:
Low-band
GSM 850 (869 to 894 MHz) and GSM 900 (925 to 960 MHz)
High-band
DCS1800 (1805 to 1880 MHz) and PCS1900 (1930 to 1990 MHz)
The transmit signal paths include a shared set of baseband amplifiers, a dedicated quadrature upconversion
for each band-type (low and high), gain control RF amplification, and multiple output driver amplifiers for
each band-type. Two GSM output drivers support one low-band and one high-band type (but each GSM
band-type is dual-band). The GSM transmitters in polar PA configuration are also supported by a PA envelope
control path, plus the ability to route LO signals to the transmit chains for test and calibration purposes. In
linear PA configuration, phase and envelope paths are combined inside the ESC and amplified using a
multistage linear PA.
Numerous secondary Tx functions are also integrated: a reference for the transmit DACs, the Tx phase-locked
loop (PLL), the Tx OSC circuit, the Tx LO generation and distribution circuits, an RMS Tx power detector, and
various interface, control, and status circuits.
The RF transmitter interfaces internally with the baseband circuits for its analog baseband input and status
and control signaling. Power reduction features controlled by baseband circuits (such as selective circuit
powerdown, gain control, and transmit puncturing) extend handset talk time. The driver amplifier outputs
are routed externally to the final stages of the transmit chains, culminating with the antenna switch whose
output drives the antenna.
Sophisticated Tx LO circuits implement the frequency plan and are completely integrated on-chip. All Tx LO
signals are generated by the on-chip Tx OSC under the control of its PLL.
[Figure 3.5.2] QSC GSM transmitter signal paths functional diagram
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LGE Internal Use Only
3. TECHNICAL BRIEF
G
3.6 OFF-CHIP RF COMPONENTS
3.6.1 D5008 (FL101: FEM)
Low-loss SAW frontend module for mobile telephone system
Covering GSM850, GSM900, GSM1800 and GSM1900 bands
Integration of Tx low pass filters, switch, de-coder and diplexing network between GSM Filters
Integration of GSM850, GSM900, GSM1800 and GSM1900 Rx SAWs
Balanced outputs of all Rx ports
Integration of ESD protection at Ant port to 8kV acc. IEC-61000-4-2 (contact discharge)
[Figure 3.6.1] Block diagram of FEM
[Table 3.6.1] Control table of FEM
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3. TECHNICAL BRIEF
G
3.6.2 GSM850/EGSM/DCS/PCS Dual band Transmit Power Amplifier
(U101: SKY77336)
The dual band PA is operating to transmit for low band (GSM-850, GSM-900) and high band (GSM-1800,
GSM1900). Operating mode is selected and controlled by the ESC6270 (GSM_PA_BAND).
[Figure 3.6.2] Block diagram of GSM PAM
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LGE Internal Use Only
3. TECHNICAL BRIEF
G
3.7 OFF-CHIP COMPONENTS
3.7.1 Bluetooth (BCM2070)
Bluetooth block of LG-C320 consists of a BCM2070 chip-set, an external crystal oscillator(26MHz), and a
Bluetooth chip antenna (2.4GHz). QSC6270_3G disable, which is main HW solution of LG-C320 Model, doesn’t
include BT baseband core. Instead, Bluetooth chipset, BCM2070, contains stand-alone baseband processor
(V2.1+EDR) as well as BT RF block. An external crystal oscillator (26MHz) is used to provide reference
frequency to BCM2070.
Figure 3.7 shows the Bluetooth system architecture in the LG-C320.
[Figure 3.7] Bluetooth system architecture
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3. TECHNICAL BRIEF
G
[Table 3.7] Bluetooth Connection(GPIO) with QSC6270
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Only for training and service purposes
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3. TECHNICAL BRIEF
G
3.7.2 FM Receiver (TEA5991)
The TEA5991 is a single chip FM stereo radio with RDS and RBDS decoder. The radio can be connected to a
headphone antenna and can tune from 70-108 MHz to cover the European, US, Chinese and Japanese FM
band. The radio delivers stereo audio output to an external amplifier. The radio can be controlled with a high
level command based interface through a I2C or SPI-bus.
[Figure3.7.2] shows the FM Radio system architecture in the LGC320.
Ear-Jack
HP_EAR_R
FM_ANT
FM
TEA5991
HP_EAR_L
FM_R
FM_L
FM_I2C_SDA
FM_I2C_SDL
G
HP_R
AUDIO
ESC6270
HP_L
SUBSYSTEM
[Figure3.7.2] FM Radio system architecture
[Figure3.7.2.1] Pin Descriptions
LGE Internal Use Only
- 48 -
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3. TECHNICAL BRIEF
G
SYMBOL
HVQFN
WLCSP
DESCRIPTION
AGND
1
RFI
2
E1
RF input
RFGND
3
D1
RF ground
NC
4
-
BUSSEL2
5
A1
Bus Selection pin 2
BUSSEL1
6
C1
Bus Selection pin 1
RST
7
A2
Reset, used for operating mode change
SEN
8
B1
Chip Select for SPI bus
SCL
9
A3
Serial Bus Clock
SDA
10
A4
Serial Bus Data
FREF
11
VREFDIG
12
VDD
13
DGND
14
AUDOR
15
D6
Audio output signal right
AUDOL
16
E6
Audio output signal left
NC
17
-
Not connected
VCC
18
F6
Analog supply voltage
GPIO2
19
F5
General Purpose I/O 2; Dataout for 4-wire SPI-bus
F1
Analog ground
not connected
A5
Reference frequency (32.768 kHz)
A6
Reference voltage for digital I/Os
B6
Digital supply voltage
C6
Digital ground
[Table 3.7.2] pin description
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 49 -
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4. TROUBLE SHOOTING
Power ON Troubleshooting
4. TROUBLE SHOOTING
5. Base band part
4.1 Power ON Troubleshooting
Power On sequence is :
PWR key press PM_ON_SW_N Î QSC6270 KPDPWR_N pin(AA2) go to low(Main BOARD R205) Î QSC6270
Power Up Î VREG_MSMC_1.2V(C261), VREG_MSME_1.8V(C209), VREG_MSMP_2.6V(C414),
VREG_RFRX2_1.3V(C232), VREG_TCXO_2.85V(C275) power up and system reset assert to QSC6270 Î Phone
booting and PS_HOLD assert to QSC6270
START
Battery voltage. higher
than 3.20V?
No
Change or charging the Battery
Yes
Replaced
with normal LCD module,
and then Booting is OK?
Yes
Go to LCD Troubleshooting
No
TP1_R205 go to low
When Power key press?
No
Check the Key Dome
Yes
TP2_VREG_MSMC_1.2V(L201)
TP3_VREG_RF1_2.3V(L202)
TP4_VREG_RF1_1.4V(L203)
power up?
No
Change the main board
Yes
Change the main board
LGE Internal Use Only
- 50 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
TP1
PM_ONSW_N
TP2
Power ON Troubleshooting
TP3
TP4
VREG_RF2_1V4|VREG_RF2
TP1
TP2
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
TP4
TP3
- 51 -
LGE Internal Use Only
4. TROUBLE SHOOTING
Charger Troubleshooting
4.2 Charger Troubleshooting
൯ Charging Procedure
- Connect TA or USB Cable
- Control the charging current by QSC6270(disable 3G)
- Charging current flows into the battery
ත Troubleshooting Setup
ත Check Point
ත Troubleshooting Procedure
- Connection of TA or USB Cable
- Charging current path
- Battery
- Connect TA and battery to the phone
- Check the charger (TA or USB Cable) connector
- Check the charging current Path
- Check the battery
START
Check the pin and battery
Connect terminals of I/O
connector
Connection OK?
No
Change I/O connector
Yes
Is the TA voltage TP1_5.1V(FL401)?
No
Change TA
Yes
Is it charging properly?
Yes
END
No
Change the main board
[ Charger Troubleshooting Flow ]
LGE Internal Use Only
- 52 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Charger Troubleshooting
TP1
FL401
TP1
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 53 -
LGE Internal Use Only
4. TROUBLE SHOOTING
USB Troubleshooting
4.3 USB Troubleshooting
USB Initial sequence is : Isert USB Cable Î USB_VBUS +5V Check Î IC400 triggered USB IF work
START
No
Cable is insert
physically?
Change CN400
Yes
Is TP1_FL401(VBUS) voltage 5.1V?
No
Change CN401
Yes
TP2_C409(LDO4.9V)
OUTPUT is about 5V?
No
Change the U401
Yes
Is IC401 OUTPUT is TP3_C265(USB_
DM,USB_DP) signal OK?
No
Change the IC401
Yes
Change the main board
[ USB Troubleshooting Flow ]
LGE Internal Use Only
- 54 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
USB Troubleshooting
TP3
TP1
TP1
FL401
TP2
VBUS_LDO_4V9
TP2
TP3
TP3
kt
kw
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 55 -
LGE Internal Use Only
4. TROUBLE SHOOTING
USIM Troubleshooting
4.4 USIM Detect Troubleshooting
USIM Initial sequence is :
VREG_USIM_2.85V go to 1.8V or 3.0V Æ USIM_CLK,USIM_RST,USIM_DATA triggered Æ USIM IF work
START
Re-insert the SIM card
Work well ?
Yes
END
No
TP1(Vreg_USIM) is 1.8V or 3.0V ?
TP2(USIM_CLK) & TP3(RST) is run ?
No
Check J301
Yes
Work well ?
Change the SIM card
Yes
No
Work well ?
No
Change the Main board
Yes
END
LGE Internal Use Only
- 56 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
USIM Troubleshooting
TP1
TP2
MUSIM_DM
TP3
MUSIM_DP
TP1
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
TP2
- 57 -
TP3
LGE Internal Use Only
4. TROUBLE SHOOTING
Camera Troubleshooting
4.5 Camera Troubleshooting
Camera control signals are generated by QSC6270.
START
Check the camera connection to the
socket and reconnect the camera
Camera is OK?
Yes
END
No
CAM_AVDD_2.8V
CAM_VDD_1.8V (TP1, TP2)
No
Chang the Main board
Yes
Check the CAM_MCLK
TP4
No
Check the CAM_PCLK
TP3
No
Camera is OK
Yes
Change the Main board
Change the Camera Module
END
No
Change the Main board
LGE Internal Use Only
- 58 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Camera Troubleshooting
Camera Troubleshooting
TP4
TP4
TP3
TP3
TP1
TP2
TP1
TP2
TP3
TP1
TP2
TP3
TP4
TP4
CAM_70MHz PCLK
CAM_24MHz MCLK
CAM_70MHz PCLK
CAM_24MHz MCLK
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 59 -
LGE Internal Use Only
4. TROUBLE SHOOTING
Main side view LED Troubleshooting
4.6 Main side view LED Troubleshooting
MAIN Key Pad LED is on as below :
Key pressing Æ LED_CON go down low (below 0.8v) Æ MAIN Key Backlight LED On
START
Key press
+VPWR is above 3.2V?
No
Check battery
Yes
When the LCD is on,
TP1 is below 0.8v
No
Change QSC6270
Yes
LED ON ?
No
Change LED
Yes
END
LGE Internal Use Only
- 60 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Slide Key side view LED Troubleshooting
4.7 Slide Key side view LED Troubleshooting
Sub Key Pad Slide is on as below :
Key pressing Æ LED_CON go down low (below 0.8v) Æ Sub Key Backlight LED On
START
Key press
+VPWR is above 3.2V?
No
Check battery
Yes
When the LCD is on,
TP2 is below 0.8v?
No
Change the FPCB
or KEY PCB
Yes
LED ON ?
No
Change the MAIN PCB
Yes
END
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 61 -
LGE Internal Use Only
4. TROUBLE SHOOTING
Slide Key side view Troubleshooting
MAIN
TP1
LED
TP1
SLIDE
LED
SUB KEY B/L
WLED_VOUT
LD103
TP2
LD104
LD105
LD106
LD107
LD108
R107
R108
R105
R106
R109
R110
10
10
10
10
10
10
SLIDE_KEY_LED
VA101
TP2
LGE Internal Use Only
- 62 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
LCD Troubleshooting
4.8 LCD Troubleshooting
LCD control signals are generated by QSC6270.
The signal path is : QSC6270 Æ CN102 Æ LCD Module
START
Press END key
Key LED is on?
No
Move to KEY LED Troubleshooting
Yes
Disconnect and reconnect
The LCD connector
(Slide PCB CN102,CN101)
LCD display OK?
Yes
END
No
Change the FPCB
LCD display OK?
Yes
END
No
Change SUB PCB
LCD display OK?
Yes
END
No
Change the Main Board
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 63 -
LGE Internal Use Only
4. TROUBLE SHOOTING
LCD Troubleshooting
[Slide Side view placement]
LGE Internal Use Only
- 64 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Vibrator Troubleshooting
4.9 Vibrator Troubleshooting
Vibrator is operate when DC motor driver is enabled.
START
Operate the Vibrator
CN803(Main B/d)
and CN101(motor_FPCB) are well
connected ?
No
Reconnect Board to FPCB connector
Yes
Wired
Vibrator to FPCB
”VIB”?
No
Solder the wire on to FPCB
Yes
LINMOT_P
above 3.0V or LINMOT_M
below 1V?
Yes
Change vibrator or
Change the Main PCB
No
Change vibrator or
Change the Main PCB
No
Change the FPCB
working?
Yes
END
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 65 -
LGE Internal Use Only
4. TROUBLE SHOOTING
F_SUB_FPCB to Main PCB Connector(CN101)
Motor Pad(CN101)
22
1
Main to F_SUB_FPCB Connector(CN803)
LGE Internal Use Only
- 66 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.10 Receiver Path
QSC6270(3G disable) EAROP(EARON) Æ TP1_CN801(Main to Slide FPCB Connector) 2,3 PIN
Æ TP2_CN103(=Slide FPCB to Main PCB Connector) 2, 3 PIN Æ TP3_FB101, FB102(of F_SLIDE_ FPCB)
TP4_CN101(= Receiver Pad of F_SLIDE_ FPCB )
START
Connect the phone to network
Equipment and setup call
Setup 1KHz tone out
Can you hear the tone?
Yes
END
No
The sine wave appears at
Receiver Pad(TP4)
Yes
Re-Solder Receiver
Change the Receiver
Yes
Change F_SLIDE_FPCB
Yes
Re-Solder FB101,FB102
Change F_SLIDE_FPCB
Yes
Re-Connect CN103
Change F_SLIDE_FPCB
No
The sine wave appears at
TP3_FB101, FB102?
No
The sine wave appears at
TP2_CN103 2,3 PIN?
No
The sine wave appears at
TP1_CN801 2,3 PIN?
No
Change the QSC6270
Change the Main PCB
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 67 -
LGE Internal Use Only
4. TROUBLE SHOOTING
LCD_DATA[7]
LCD_DATA[6]
LCD_DATA[5]
LCD_DATA[4]
15pF
LCD_MAKER_ID
LCD_RST_N
LCD_VSYNC_OUT
RCV_P
RCV_N
15pF
TP1
VCOIN
1
TP1
27
Main to Slide FPCB Connector(CN801)
15pF
LGE Internal Use Only
- 68 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
TP4_Receiver PAD=CN101
TP3_FB102
TP3_FB101
TP3
RCV_P
RCV_N
100n
1
FB102
100n
2
TP4
VA102
VA101
39pF
39pF
C102
TP3
C101
TP4
CN101
FB101
Can be Changed to TVS or ECLAMP
CN103
1
54
2
RCV_N
3
RCV_P
53
TP2
LCD_MAKER_ID
52
LCD_DATA[15]
4
51
5
50
LCD_DATA[14]
TP2
Slide FPCB to Main PCB
Connector(CN103)
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 69 -
1
27
LGE Internal Use Only
4. TROUBLE SHOOTING
4.11 Headset path
QSC6270(3G disable) HPH_OUT_L_P/N Æ TP1_C506,C507 Æ IC501(Audio Sub System) Æ
TP2_R504,R505 Æ TP3_FB504, FB505 Æ J501(=3.5pi Ear-jack)
START
Connect the phone to network
equipment and setup call.
Setup 1KHz tone out and insert headset.
Can you hear the tone?
Yes
END
No
Sine wave appears at
TP3_FB504, FB505
Yes
Re-solder or Change J501
Change the Main PCB
Yes
Re-solder the FB504, FB505
Change the Main PCB
Yes
Change the IC501
No
Sine wave appears at
TP2_R504, R505?
No
Sine wave appears at
TP1_C506, C507?
No
Change the Main board
LGE Internal Use Only
- 70 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
TP3_FB505
TP3_FB504
TP2_R505
HS_MIC_P|Hook_ADC
HS_OUT_L
HS_OUT_R
FM_ANT
TP2_R504
TP2
TP3
TP2
TP3
NC
HS_GND
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 71 -
LGE Internal Use Only
4. TROUBLE SHOOTING
HS_R
HS_L
SPK_N
SPK_P
TP1
SPK_OUT_P
SPK_OUT_N
TP1
HS_OUT_L
HS_OUT_R
GND
MUIC_AUD_FM_I2C_SCL
MUIC_AUD_FM_I2C_SDA
WM9093 is possible to 1.8 & 2.6 IO When HPVDD is 1.8V
TP1_C507 TP1_C506
LGE Internal Use Only
Audio Sub system IC501
- 72 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.12 Speaker/Speaker Phone path
QSC6270 LINE_OUT_L_P/LINE_OUT_R_N ÆTP1_C508, C509Æ Audio Sub System(IC501) Æ TP2_FB507, FB508 Æ
TP3_CN803 1/2, 3/4 PIN(=Main to F_SUB_FPCB Connector) Æ TP4_CN101 1,2 PIN(=F_SUB_FPCB to Main PCB
Connector) Æ TP5_CN102(= Speaker Pad of F_SUB_FPCB)
START
Connect the phone to network
Equipment and setup call
Setup 1KHz tone out
Can you hear the tone?
Yes
END
No
Sine wave appears at
TP5_Speaker Pad
Yes
Re-Solder Speaker Pad
Change the Speaker
Yes
Change the F_SUB FPCB
Yes
Re-Connect the CN101
Change the F_SUB FPCB
Yes
Change the Main PCB
Yes
Change the IC501
No
Sine wave appears at
TP4_CN101 1,2 PIN
No
Sine wave appears at
TP3_CN803 1/2, 3/4 PIN
No
Sine wave appears at
TP2_FB507, FB508
No
Sine wave appears at
TP1_C508, C509
No
Change the QSC6270
Change the Main board
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 73 -
LGE Internal Use Only
4. TROUBLE SHOOTING
HS_R
HS_L
SPK_N
SPK_P
TP2
TP2
TP1
SPK_OUT_P
SPK_OUT_N
HS_OUT_L
HS_OUT_R
TP1
GND
MUIC_AUD_FM_I2C_SCL
MUIC_AUD_FM_I2C_SDA
WM9093 is possible to 1.8 & 2.6 IO When HPVDD is 1.8V
TP1_C509 TP1_C508
LGE Internal Use Only
Audio Sub
System(IC501)
TP2_FB507
- 74 -
TP2_FB508
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
TP3
TP3
TP3
1
10
Main to F_SUB_FPCB
Connector(CN803)
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 75 -
LGE Internal Use Only
4. TROUBLE SHOOTING
CN101
G1
G2
1
SPK_OUT_P
SPK_OUT_N
MOTOR_POWER_N
VBAT
20
2
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
G3
MSD_D[2]
MSD_D[3]
MSD_CMD
19
TP4
3
VREG_MICROSD_3V0
MSD_CLK
MSD_D[0]
MSD_D[1]
G4
TP4
1
10
F_SUB_FPCB to Main PCB
Connector(CN101)
LGE Internal Use Only
- 76 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
TP5
CN102
1
SPK_OUT_P
2
SPK_OUT_N
Can be Changed to TVS or ECLAMP
TP5_CN102(=Speaker Pad)
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 77 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.13 Main microphone
MIC501 Æ VMIC_BIAS_P(TP1_C526) Æ MAIN_MIC_P(TP2_C261) Æ MIC1P PAD of QSC6270(3G disable)
START
Make a call
MIC_BIAS(TP1_C526)
is about 1.8V?
No
Change the Main board
Yes
Make sound to MIC
Sine wave appears at
TP2_C261?
No
Change the MIC
Yes
Change the Main board
LGE Internal Use Only
No
Work well?
- 78 -
Yes
END
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
TP2
MAIN_MIC_P
MAIN_MIC_GND
TP1
TP2_C261
TP1_C526
MIC501
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 79 -
LGE Internal Use Only
4. TROUBLE SHOOTING
4.14 Headset microphone
3.5 pie Headset ÆHS_MIC_BIAS(TP1_R502) Æ HS_MIC_P(TP2_FB503) Æ HS_MIC_P(TP3_C263)
Æ MIC2P PAD of QSC6270(3G disable)
START
Insert Headset & Make a call
TP1_R502 is About 1.8V ?
No
Change the LDO(U501)
Change the Main board
No
Re-Solder FB503
Change the MAIN board
No
Re-Solder C263
Change the MAIN board
Yes
Sine wave appears at
TP2_FB503?
Yes
Sine wave appears at
TP3_C263?
Yes
Change the Headset
Change the MAIN board
LGE Internal Use Only
- 80 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
TP3
HS_GND
VREG_MSMP_2V6
´ëüǰ : EUSY0407501
RP183K181D is possible to 1.8 & 2.6 IO
TP1
HS_JACK_DET
TP2
HS_MIC_P|Hook_ADC
HS_OUT_L
NC
HS_OUT_R
FM_ANT
HS_GND
TP2_FB503
TP1_R502
U501
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 81 -
TP3_C263
LGE Internal Use Only
4. TROUBLE SHOOTING
㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG
4.15 RF
RFComponent
Component
MAIN board Bottom
U201
X202
FL101
SW101
U101
Reference
Description
Reference
Description
U201
QSC6270 3G disable
FL101
FEM
X202
XO
SW101
RF connector
U101
GSM(EDGE) TX PAM
RF component (GSM)
LGE Internal Use Only
- 82 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
4.16
Path
4.16 RF
RF Path
4.16.1 GSM path
TX Path
RX Path
Tx/RX Path
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 83 -
LGE Internal Use Only
㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
4. TROUBLE SHOOTING
4.17 Trouble Shooting of GSM Part
(GSM850/GSM900/1800/1900)
㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
=
LGE Internal Use Only
- 84 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
START
Setup Test Equipnment
Cell power = -74dbm
EGSM CH: 38
DCS1800 CH: 698
PCS1900 CH: 661
GSM850 CH: 190
Check M/S & FEM
(SW101 & FL101)
Check
Rx Part
Check
Tx Part
END
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 85 -
LGE Internal Use Only
㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
4. TROUBLE SHOOTING
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
4.17.1 Checking Front-End Module Block
4.17.1 Checking Front-End Module Block
Setup Test Equipnment
Cell power = -74dbm
EGSM CH: 38
DCS1800 CH: 698
PCS1900 CH: 661
GSM850 CH: 190
Check TP3=2.85V?
No
Check U201
Yes
Check the logic in each
Mood TP1~TP2 high level
2.85V ≥ Vcc ≥ L4V?
No
Replace FL101
Yes
END
LGE Internal Use Only
- 86 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
51
TP4
ANT_FEED
51
51
TP1
TP2
51
850, 900,1800,1900MHz
TP3R109
51
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
51
51 51
- 87 -
LGE Internal Use Only
4. TROUBLE SHOOTING
㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌H
㡸G 㵲㡸G ㍌
4.17.2 Checking GSM Rx part
START
Check TP1~TP3
Signal exist?
No
Check FEM & Soldeing of TPs
Yes
Rx still has problem?
51 51 51 51
No
GSM Rx is OK
Yes
Re-download & calibration
TP1
RX_GSM850_M
RX_GSM850_P
TP2
TP3
RX_DCS1800_M
RX_DCS1800_P
TP4
LGE Internal Use Only
- 88 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
4. TROUBLE SHOOTING
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
4.17.3 Checking GSM Tx part
4.17.3 Checking GSM Tx part
Setup Test Equipnment
Cell power = -60dbm
Tx Power Level Set
GSM850/GSM900 = 5,
DCS/PCS = 0
Yes
Yes
Is the level of TP4 same
to Table 4.17.3
No
Check U201
Yes
TP2, 30dBm over?
TP3, 33dBm over?
No
Yes
Yes
Check TP1,
GSM850, EGSM 32dBm
DCS,PCS 29dBm over?
Remove U101 and check
The power of pin1, pin8 (on board)
No
The power of pin1, pin8
No
Check U201
Yes
Re-download & calibration
Replace U101
Table 4.17.3 GPAM Logic Control
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 89 -
LGE Internal Use Only
4. TROUBLE SHOOTING
㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
LGE Internal Use Only
- 90 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
4.18 Checking Bluetooth Block
4.18.1 BLUETOOTH RF components
ANT
FL701
U703
X702
RF component ( BT )
- Main board bottom -
Reference
Description
ANT
BT Pattern ANT
U703
BT module_BCM2070
FL701
Band pass filter
X702
26Mhz crystal
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 91 -
LGE Internal Use Only
4. TROUBLE SHOOTING
㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
4.18.2 BLUETOOTH SIGNAL PATH
Bluetooth Signal PATH (Main board bottom)
Bluetooth T/Rx PATH
LGE Internal Use Only
- 92 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
4. TROUBLE
SHOOTINGG
㡸G 㵲㡸G
㍌G 㛺㏩⏼␘UG
G
4.18.3 BLUETOOTH Trouble shooting
4.18.3 BLUETOOTH Trouble shooting
START
Check TP1, TP2
Signal exist?
No
Change the main board
Yes
Check TP3
IS clock OK?
No
Check X700
Yes
Check TP4
Signal exist?
No
Check U700
Yes
Change the main board
TP#
TP description
TP1
VREG_MSMP_2.6V
TP2
VREG_MSME_1.8V
TP3
BT_CLK(26Mhz)
TP4
BT_ANT_OUT
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 93 -
LGE Internal Use Only
4. TROUBLE SHOOTING
㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
{w[G
{wX
{wYG
{wZG
Connectivity_ANT_PAD
WLAN_BT_ANT_FEED
BT_ANT_FEED
LGE Internal Use Only
- 94 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
{wX
When power class 1.5 is used, R307 is populated and R308 is depopulated.
(Vice versa for power class 2)
TP1
Class{wY
1.5
TP2
RTC_32K
BT_ANT_FEED
RTC_32K768
must have 1% tolerance
{w[G
TP4
can be removed
BT_RST_N
BT_PWR_ON
D4
E4
C4
A4
RTC_32K768
TP3
26MHz
BT_PCM_OUT
BT_PCM_IN
BT_PCM_CLK
BT_PCM_SYNC
BT_UART_RX
BT_UART_TX
BT_UART_CTS
BT_UART_RTS
BT_WAKEUP
BT_WAKEUP_HOST
{wZ
[BT main clk : 26MHz]
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 95 -
LGE Internal Use Only
㵬㦤G
㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
4.㝘⪌HG
TROUBLE
SHOOTING
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G
G
4.19 Checking FM Radio Block
4.19.1 FM Signal Path
|^WX
LGE Internal Use Only
Reference
Description
U701
TEA5991(FM module)
- 96 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.19.2 FM Trouble shooting
START
TP1, TP2 Check the Sianal
No
Change the main board
Yes
TP3 Check the Signal
No
Change the Ear Jack
Yes
TP4 Check the Signal
No
Change the U601
Yes
Change the main board
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 97 -
LGE Internal Use Only
4. TROUBLE SHOOTING
㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬
㡸G 㵲㡸G ㍌G 㛺㏩⏼␘U
TP1XUXUX
TP2
{wYG
TP3
{wZG
{w[G
TP4
VREG_MSMP_2.6V
TP2
VREG_MSME_1.8V
TP3
FM_ANT_IN
TP4
FM_OUT_AUDIO signal
RTC_32K
TP1
MUIC_AUD_FM_I2C_SDA
TP description
MUIC_AUD_FM_I2C_SCL
TP#
VREG_MSME_1V8
VREG_MSMP_2V6
TP2
TP4
FM_R
FM_L
FM_ANT
TP3
TP1
Close to QSC
Close to ANT
LGE Internal Use Only
- 98 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
5. DOWNLOAD
DOWNLOAD
LG-C320
LG-C320
Copyright
© 2010
LG Electronics. Inc. All right reserved.
LGE
Internal
Use Only
Only for training and service purposes
99 -- -164
LGE
Use Only
Copyright © 2010 LG Electronics. Inc.
AllInternal
right reserved.
Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
LG-C320
LG-C320
LG-C320
LGE Internal
Copyright
© Use
2010Only
LG Electronics. Inc. All right reserved.
Only for training and service purposes
100 ---165
Copyright © 2010 LG Electronics.LGE
Inc.Internal
All rightUse
reserved.
Only
Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
LG-C320
LG-C320
Copyright
© 2010
LG Electronics. Inc. All right reserved.
LGE
Internal
Use Only
Only for training and service purposes
101 -- 166
LGEAllInternal
Use Only
Copyright © 2010 LG Electronics. Inc.
right reserved.
Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
LG-C320
LG-C320
LG-C320
LGE Internal
Copyright
© Use
2010Only
LG Electronics. Inc. All right reserved.
Only for training and service purposes
102 ---167
Copyright © 2010 LG Electronics.LGE
Inc.Internal
All rightUse
reserved.
Only
Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
LG-C320
Copyright
© 2010
LG Electronics. Inc. All right reserved.
LGE
Internal
Use Only
Only for training and service purposes
103 -- 168
LGEAllInternal
Use Only
Copyright © 2010 LG Electronics. Inc.
right reserved.
Only for training and service purposes
5. DOWNLOAD
LGE Internal
Copyright
© Use
2010Only
LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
104 ---169
Copyright © 2010 LG Electronics.LGE
Inc.Internal
All rightUse
reserved.
Only
Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
Copyright
© 2010
LG Electronics. Inc. All right reserved.
LGE
Internal
Use Only
Only for training and service purposes
105 -- 170
LGEAllInternal
Use Only
Copyright © 2010 LG Electronics. Inc.
right reserved.
Only for training and service purposes
5. DOWNLOAD
LGE Internal
Copyright
© Use
2010Only
LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
106 ---171
Copyright © 2010 LG Electronics.LGE
Inc.Internal
All rightUse
reserved.
Only
Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
Copyright
© 2010
LG Electronics. Inc. All right reserved.
LGE
Internal
Use Only
Only for training and service purposes
107 -- 172
LGEAllInternal
Use Only
Copyright © 2010 LG Electronics. Inc.
right reserved.
Only for training and service purposes
5. DOWNLOAD
LGE Internal
Copyright
© Use
2010Only
LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
108 ---173
Copyright © 2010 LG Electronics.LGE
Inc.Internal
All rightUse
reserved.
Only
Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
LG-C320
LG-C320
LG-C320
LG-C320
LG-C320
LG-C320
LG-C320 LG-C320
Copyright
© 2010
LG Electronics. Inc. All right reserved.
LGE
Internal
Use Only
Only for training and service purposes
109 -- 174
LGEAllInternal
Use Only
Copyright © 2010 LG Electronics. Inc.
right reserved.
Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
LG-C320 LG-C320
LG-C320
LG-C320
LG-C320
LGE Internal
Copyright
© Use
2010Only
LG Electronics. Inc. All right reserved.
Only for training and service purposes
LG-C320
LG-C320
110 ---175
Copyright © 2010 LG Electronics.LGE
Inc.Internal
All rightUse
reserved.
Only
Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
LG-C320
LG-C20
LG-C20
LG-C20
Copyright
© 2010
LG Electronics. Inc. All right reserved.
LGE
Internal
Use Only
Only for training and service purposes
111 -- 176
LGEAllInternal
Use Only
Copyright © 2010 LG Electronics. Inc.
right reserved.
Only for training and service purposes
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
LGE Internal Use Only
- 112 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. BLOCK DIAGRAM
51#F653#KZ#Eorfn#Gldjudp#=#Srzhu#b4#
ESC6270_BB/RF
ESC6270 POWER
ESC6270_POWER
VSW_MSMC ( 500mA)
TA (5PIN)
5.1V,700mA
USB_VBUS
VSW_RF1 ( 500mA)
Charger IC
VBAT
VSW_RF2 ( 500mA)
VREG_MSMC_1V2
VDD_CORE
VREG_RFRX2_1V3
VREG_RFTX2_1V3
VREG_RF1_2V3
VDD_RFRX
VDD_RFTX
VREG_RFA_2V2
VDD_RFA
VBUS_LDO_4.9V
MU_IC
VREG_RF2_1V4
VBAT
VDD_P1
VREG_MPLL (150mA)
VDD_P2
VREG CDC2 (150mA)
VREG_CDC2
Battery
900mAh
VREG_RX2 (150mA)
VDD_P5
VREG_TX2 (150mA)
VDD_P6
VREG_RFA (300mA)
VREG_MSME (300mA)
VREG_MSMP ( 300mA)
VREG_MSME_1V8
VREG_MSMP_2V6
MCP
SDRAM (1.8V , MAX
180mA )
NAND (1.8V , MAX
30mA )
HALL IC(1.8V, )
KEYCODE IC(1.8V, ?mA)
FM RADIO
1.8V(,
MOTOR
MOTOR_POWER_N
VIB_DRV_N
mA
2.6V( , mA
BT only MODULE
VREG_GP1 (150mA)
1.8V(,
VREG_USB_2.6V ( 50mA)
mA
2.6V( , mA
VREG_USB_3.3V ( 50mA)
VREG_TCXO ( 50mA)
VREG GP2 ( 300mA)
VREG_GP2
BACKUP Battery
VCOIN
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
VCOIN (3.0V, )
VREG_USIM (150mA)
- 113 -
VREG_MICROSD_3V0
VREG_USIM_2V85
MICRO SD slot (3.0V
(3 0V , , MAX
mA )
USIM SLOT (2.85V )
LGE Internal Use Only
6. BLOCK DIAGRAM
51#F653#KZ#Eorfn#Gldjudp#=#Srzhu#b5#
VBAT
RT9396
LDO1(150m A )
(SUB PMIC)
LDO2( 150mA )
2.4” LCD MODULE
VLDO_CAM_2V8
LCD_2.8V(,
VLDO_CAM_1V8
2MEGA CAMERA
VLDO LCD 2V8
VLDO_LCD_2V8
LDO3(300m A )
CAM_2.8V(,
VLDO_LCD_1V8
LDO4( 500mA )
mA
CAM _1.8V( , mA
WLED_VOUT
WLEDOUT( 4.8V, 450mA )
mA
LCD _1.8V( , mA
WLED ( ,120mA )
GSM PAM (TQM7M5012)
VBAT
AUDIO SUB SYSTEM
1.8V(,
VREG_MSME_1.8V
mA
VDD
LDO(150mA)
EAR_JACK DET.
VDD_TCXO
LDO(150mA)
WIFI_TCXO
WIFI/BT/FM MODULE
WIFI(,
VREG_MSMP_2V6
LGE Internal Use Only
OPTION
mA
BT( , mA
- 114 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. BLOCK DIAGRAM
61#F653#KZ#Eorfn#Gldjudp#=#EE
EBI2_DATA [ 0:15]
NAND CS1_N
NAND_
N
VREG _MSME _1. 8V
From PMIC
CAM _MCLK
CAM _PCLK
EBI2 _ALE
CAM _DATA [2:9]
EBI2 _CLE
CAM_HSYNC/VSYNC
EBI2_OE_N
Memory
2 Gb NAND
+
1 Gb SDRAM
2M
CAMERA
MEGA _CAM _RESET_N
EBI2_WE_N
( H8BCS0SIOBAR)
CAM_ I 2C _SCL/SDA
NAND _READY
MEGA _CAM _PWDN
RESOUT_N
LCD _VSYNC _OUT
SDRAM DATA [0: 31]
SDRAM_DATA
VBAT
LCD_IF_MODE
SDRAM _ADDR[0:14]
LCD _LDO_2.8V
LCD_MAKER _ID
SDRAM _CLK
LCD _LDO_1.8V
LCD_RESET_N
SDRAM _CS_N(0)
SDRAM_ OE _N
EBI2_DATA [0:15]
SDRAM _WE_N
LCD _CS _N
SDRAM _CLK (0)
LCD_ADS
WLED _1:3
LCD
EBI2_WE_N / EBI2_OE_N
SDRAM_ADV_N
LDO
CHARGE
PUMP
MLED_OUT
LDO_EN
I2C_SDA , I2C_SCL
From QSC
SDRAM _DQM[0:3]
BT _UART _TXD
BT_UART _RXD
MSME_1. 8V
MICRO_DETECT_N
BT _UART _RTS
BLUE TOOTH
MICRO SD
CONNECTOR
MICROSD_CMD/CLK
BT _PCM_SYNC
BT _ANT
From BT chip ANT .
MICROSD_DATA [0:3]
BT _UART _CTS
MSMP_2. 6V
BT _PCM
PCM _IN
IN
USIM _DATA / CLK / RESET
_ _N
BT _PCM_OUT
BT _PCM_CLK
BT_WAKEUP _MSM
Crystal
From SLEEP_CLK
Of QSC6270
BT _ REG _ ON
QSC6270
WLAN_SDIO[0:3]
WLAN_COMMEND
MSME_1. 8V
WLAN_CLK
MSMP_2. 6V
BT _UART _TXD
BT_UART _RXD
KEYCODE_INTERRUPT
KEYCODE
IC
KEYCODE RESET
KEYCODE__RESET
KEYCODE__I2C
XTAL _IN
VBAT
WLAN&BT ANT
KEY_ROW[0:7]
KEY_COL[0:7]
QWERTY
KEY &
NAVI _KEY
MUIC_FM_AUDIO_I2C _SDA(GPIO49_P1_1.8V)
MUIC /AUDIO
FM RADIO
32.768KHz
Oscillator
XTAL _OUT
MMP_XTAL _OUT
FM RADIO
Charge
Pump
19.2MHz
XO
BT _UART _CTS
MUIC_FM_AUDIO_I2C _SCL(GPIO 50_P1_1.8V)
MUIC_INT(GPIO 10_P1_1.8V)
QSC GPIO
CP_ I2C_SDA(GPIO 70_P3_2.85V)
CP_ I 2C _SCL(GPIO71_P3_2.85V)
BT _UART _RTS
WIFI &BT
MODULE
BT _PCM_SYNC
SLIDE_DETECT
HALL _IC
VREG _MSME_1. 8V
BT _PCM _IN
BT _PCM_OUT
BT _PCM_CLK
From SLEEP_CLK
Of QSC6270
I2C COMM.
VREG_USIM_2.85V
BT_RESET_N
32.768KHz
VBAT
From WLAN&BT chip ANT .
SIM
CONNECTOR
DC MOTOR
MOTOR DRIVE
MSM_WAKEUP_BT
26 MHZ
VREG_MICROSD_3.0V
Crystal
BT_WAKEUP _MSM
26 MHZ
MSM_WAKEUP_BT
SLIDE KEY
_
LED
VBAT
QWETY KEY
_
LED
VBAT
JTAG_TDI
JTAG_TCK
JTAG_TMS
JTAG_TRST_N
JTAG_TDO
JTAG_RTCK
JTAG
BT RESET N
BT_RESET_N
32 768KH
32.768KHz
BT_ REG _ ON
USB D +/-
VBAT
UART1_RX/TX
OPTION
USB_VBUS
MUIC
BOOST_5V
MUIC_AUDIO_ I2C_SCL
HP_EAR_R
To. MMI CON.
HP_EAR_L
SPK +/-
AUDIO
SUB
S S
SYSTEM
( WM9093ECS-R )
MUIC_AUDIO_ I 2C_SDA
SPK _R/L
HP_R/ L
USB _ID
MUIC_INT
5PIN
MICRO
MMI
CONN.
I2C_SDA / SCL
FM RADIO I2C
FM RIGHT / LEFT
MIC_BIAS
USB +/-
MIC
MSME_1.8V
FM
R ADIO
MSMP_2.6V
32.768KHz
From SLEEP_CLK
Of QSC6270
FM ANT
RCV R / L
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 115 -
LGE Internal Use Only
6. BLOCK DIAGRAM
71#F653#KZ#Eorfn#Gldjudp#=#UIbJVP
LGE Internal Use Only
- 116 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. BLOCK DIAGRAM
81#F653#KZ#Eorfn#Gldjudp#=#Frqqhfwlylw|+EW2ZLIL2IP,brswlrq
EAR_
_JACK
VDD_TCXO
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 117 -
LGE Internal Use Only
6. BLOCK DIAGRAM
81#F653#KZ#Eorfn#Gldjudp#=#Frqqhfwlylw|+EW2IP,
E
EAR_JACK
E t
External
l XO
LGE Internal Use Only
- 118 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. BLOCK DIAGRAM
91#F653#KZ#Eorfn#Gldjudp#=#Phpru|
HYNIX MCP
( H8BCSOSIOBAR)
_CE
NAND Flash
(2Gbit)
ALE
NAND_ LB_N
CLE
NAND_UB_N
_RE
RE
_WE
RY_BY
_WP
IO[1:16]
SDRAM
(1Gbit)
NAND_WE_N
External
Memory
(MICRO SD)
NAND_WP_N
NAND_DATA[0:15]
CKE
DDR_CKE[0]
_
_CS
DDR_CS[0]_N
_
_RAS
DDR_RAS_N
_CAS
CAS
DDR_CAS_N
_WED
DDR_WE_N
_ _
DQ
MSD_CLK
NAND_BSY_N
DDR_M_CLK_N
ADDR
MSD_CMD
NAND_OE_N
CLK
DQM
MSD_D[0:3]
NAND_
_CS_
_N
ESC6270
SIM_CLK
DDR_DQM[0:1]
_
_
_
SIM_RST_N
DDR _ A[0:13]
SIM _DATA
MUSIM_DM
DDR _ D[0:15]
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
USIM
(SIM PLUS)
MUSIM_DP
- 119 -
LGE Internal Use Only
6. BLOCK DIAGRAM
:1#F653#KZ#Eorfn#Gldjudp#=#Dxglr
MICBIAS
HSED_BIAS
MIC1P
MIC1P
MIC1N
MIC1N
FM_L
LINE_IN_L_P
TEA5991
FM_R
LINE_IN_R_N
MIC2N
MIC2N
MIC2P
MIC2P
ESC6270
EAROP
EARON
HPH_OUT_L_P
HPH_OUT_R_N
RCV+
RXIN+
RCV-
RXIN-
HS_L
HS_R
HPR
HPL
HS_OUT_R
HS_OUT_L
IN1+
IN1
IN1-
WM9093
LINE_OUT_L_P
LINE OUT R N
LINE_OUT_R_N
SPK_P
SPK_N
IN2+
IN2
IN2OUT+
GPIO
GPIO
LGE Internal Use Only
MUIC_AUD_FM_I2C_SCL
MUIC_AUD_FM_I2C_SDA
SCL
OUT-
SPK_OUT_P
SPK_OUT_N
SDA
- 120 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. BLOCK DIAGRAM
;1#F653#KZ#Eorfn#Gldjudp#=#YLVXDO+#OFG#)#FDPHUD#,
CAM_I2C_SDA
CAM_I2C_SCL
CAM_MCLK
CAM_PCLK
2M Camera
Hynics sensor
Bayer RGB Output
CAM_RST_N
CAM_PWDN
C2FK-H313P
CAM_VSYNC
VBAT
VLDO_CAM_1V8
VLDO_CAM_2V8
RT9396GQW
CAM_HSYNC
CAM_DATA[0~7]
BL_LCD_CAM_LDO_EN
QSC6270
VREG_MSMP_2.6V
LCD DATA[0~15]
LCD_DATA[0~15]
VLDO_LCD_2V8
LCD_RS
VLDO_LCD_1V8
LCD_RST_N
LCD_CS_N
LCD_WR_N
2.4” TFT LCD
QVGA
CPU I/F
LCD RD
LCD_RD
LCD_VSYNC_OUT
DM24-DSM04
LCD_MAKER_ID
VBAT
WLED_OUT
RT9396GQW
5channel
WLED1
WLED2
WLED3
WLED4
WLED5
BL_LCD_CAM_LDO_EN
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 121 -
LGE Internal Use Only
LGE Internal Use Only
- 122 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
1-2-1-3_ESC-Quad EDGE
ANTENNA SWITCH MODULE LOGIC
RX_GSM850_M
ANT_SEL0
ANT_SEL1
GSM850/EGSM TX
RX_GSM850_P
PCN/PCS TX
ANT_FEED
GSM850 RX
EGSM RX
PCN RX
PCS RX
RX_DCS1800_M
RX_DCS1800_P
ANT_FEED
850, 900,1800,1900MHz
6 dB
R109
GSM_PA_BAND
MODE
6 dB
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 123 -
LGE Internal Use Only
7. CIRCUIT DIAGRAM
2-2-2-1_ESC_ESC6270
VMIC_BIAS_P
MSM_RESIN_N
SLIDE_KEY_LED
MAIN_KEY_LED
MOTOR_POWER_N
HOOK_ADC
XTAL_19M_OUT
GND
XTAL_19M_IN
RTC_32K
PS_HOLD
PM_ONSW_N
GSM_PA_EN
GSM_PA_BAND
32.768KHz
BAT_ID
XO_ADC_IN
XO_ADC_IN
VREG_RF2_1V4|VREG_RF2
RX_DCS1800_M
RX_DCS1800_P
RX_GSM850_M
RX_GSM850_P
RX_PCS1900_M
RX_PCS1900_P
RX_EGSM_M
RX_EGSM_P
GSM_HB_TX
GSM_LB_TX
GSM_PA_RAMP
VREG_RFRX2_1V3
- Normal Audio Power : +VPWR
VREG_RFA_2V2
VSW_RF1
VREG_RF1_2V3|VREG_RF1
VSW_RF2
VREG_RF2_1V4|VREG_RF2
VSW_MSMC
VCOIN
VREG_RFTX2_1V3
VBAT
VREG_MSMP_2V6
19.2MHz
XTAL_19M_IN
TP_UART_TX
TP_UART_RX
XTAL_19M_OUT
UART_TX
UART_RX
BT_UART_TX
UART_BT_SW
BT_UART_RX
LGE Internal Use Only
- 124 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
VBAT
PM_ONSW_N
USB_VBUS
TP_UART_TX
TP_UART_RX
UTXD
URXD
PWR
VBAT
ON_SW
VCHAR
TX
RX
GND
HS_GND|GND
3G
UART_TX
UART_RX
MAIN_MIC_P
MAIN_MIC_GND
2.5G
MAIN_MIC_GND|GND
HS_GND
12
11
10
9
8
7
6
5
4
3
2
1
VREG_MSME_1V8
FM_L
FM_R
UART_BT_SEL
JTAG_TCK
JTAG_TMS
JTAG_TRST_N
JTAG_TDO
JTAG_TDI
PS_HOLD
MSM_RESIN_N
JTAG_RTCK
2-2-2-1_ESC_ESC6270
HALL_SENS_DET
BT_RST_N
BT_WAKEUP_HOST
MUSIM_DP
MUSIM_DM
WLAN_CLK
WLAN_SDIO[3]
WLAN_SDIO[2]
WLAN_SDIO[1]
WLAN_SDIO[0]
WLAN_CMD
NET Conn
RESOUT_N|NAND_WP_N
DDR_A[14]|DDR_BA[00]
DDR_A[15]|DDR_BA[01]
BT_PWR_ON
LCD_IF_MODE[0]
HS_JACK_DET
WLAN_BT_REG_ON
LCD_RST_N
WLAN_RST_N
NAND_D[00]|LCD_DATA[0]
BL_LCD_CAM_LDO_I2C_SDA
BL_LCD_CAM_LDO_I2C_SCL
MUIC_AUD_FM_I2C_SCL
MUIC_AUD_FM_I2C_SDA
NAND_D[01]|LCD_DATA[1]
MUIC_INT_N
NAND_D[02]|LCD_DATA[2]
NAND_D[03]|LCD_DATA[3]
NAND_D[04]|LCD_DATA[4]
NAND_D[05]|LCD_DATA[5]
NAND_D[06]|LCD_DATA[6]
NAND_D[07]|LCD_DATA[7]
NAND_D[08]|LCD_DATA[8]
NAND_D[09]|LCD_DATA[9]
NAND_D[10]|LCD_DATA[10]
CHG_STS_N
CHG_EN_N
NAND_D[11]|LCD_DATA[11]
NAND_D[12]|LCD_DATA[12]
NAND_D[13]|LCD_DATA[13]
NAND_D[14]|LCD_DATA[14]
NAND_D[15]|LCD_DATA[15]
NAND_WE_N|LCD_WR_N
NAND_OE_N|LCD_RD
High : BT UART
Low : UART Comm
BL_LCD_CAM_LDO_EN
UART_BT_SEL
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 125 -
LGE Internal Use Only
7. CIRCUIT DIAGRAM
3-3-1_6P_USIM
ENSY0024301
MCP2-1_2G_1G DDRx16_hynix
MUSIM_DM
DDR_A[00]
DDR_A[01]
DDR_A[02]
DDR_A[03]
DDR_A[04]
DDR_A[05]
DDR_A[06]
DDR_A[07]
DDR_A[08]
DDR_A[09]
DDR_A[10]
DDR_A[11]
DDR_A[12]
DDR_A[13]
DDR_D[00]
DDR_D[01]
DDR_D[02]
DDR_D[03]
DDR_D[04]
DDR_D[05]
DDR_D[06]
DDR_D[07]
DDR_D[08]
DDR_D[09]
DDR_D[10]
DDR_D[11]
DDR_D[12]
DDR_D[13]
DDR_D[14]
DDR_D[15]
DDR_DQM[0]
DDR_DQM[1]
DDR_DQS[0]
DDR_DQS[1]
DDR_M_CLK_N
DDR_M_CLK_P
DDR_CKE[0]
DDR_BA[00]
DDR_BA[01]
DDR_RAS_N
DDR_CAS_N
DDR_WE_N
DDR_CS[0]_N
LGE Internal Use Only
MUSIM_DP
NAND_D[00]
NAND_D[01]
NAND_D[02]
NAND_D[03]
NAND_D[04]
NAND_D[05]
NAND_D[06]
NAND_D[07]
NAND_D[08]
NAND_D[09]
NAND_D[10]
NAND_D[11]
NAND_D[12]
NAND_D[13]
NAND_D[14]
NAND_D[15]
NAND_WE_N
NAND_OE_N
NAND_LB_N
NAND_UB_N
NAND_CS_N
NAND_BSY_N
NAND_WP_N
- 126 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
4-2-3-2
4-2-1-4
MUIC_IO_M
MUIC_IO_P
MUIC_ACC_ID
4-5-2-1
4-3-1-3
CHG_STS_N
VBUS_LDO_4V9
DNI
BAT_ID
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 127 -
LGE Internal Use Only
7. CIRCUIT DIAGRAM
5-1-2-1
5-4-1-1
VREG_MSMP_2V6
4-4-2-3
´ëüǰ : EUSY0407501
SPK_OUT_P
SPK_OUT_N
HS_R
HS_L
HS_OUT_L
HS_OUT_R
SPK_N
SPK_P
RP183K181D is possible to 1.8 & 2.6 IO
GND
HS_JACK_DET
MUIC_AUD_FM_I2C_SCL
MUIC_AUD_FM_I2C_SDA
WM9093 is possible to 1.8 & 2.6 IO When HPVDD is 1.8V
HS_MIC_P|Hook_ADC
HS_OUT_L
NC
HS_OUT_R
FM_ANT
HS_GND
LGE Internal Use Only
- 128 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
6-2-2-1
6CH+4LDO,PWM
R603
WLED1
8
3
7
4
6
5
9
2
10
1
BL_LCD_CAM_LDO_I2C_SCL
BL_LCD_CAM_LDO_I2C_SDA
8
3
7
4
6
5
9
2
9
2
8
3
7
4
6
- 129 -
10
1
5
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10
1
LGE Internal Use Only
RTC_32K
Connectivity_ANT_PAD
MUIC_AUD_FM_I2C_SDA
MUIC_AUD_FM_I2C_SCL
7. CIRCUIT DIAGRAM
VREG_MSME_1V8
VREG_MSMP_2V6
WLAN_BT_ANT_FEED
BT_ANT_FEED
FM_R
FM_L
FM_ANT
Close to QSC
Close to ANT
VREG_MSME_1V8
QCT
VREG_MSME_1V8
VFM_PWR
QCT
VFM_PWR
When power class 1.5 is used, R307 is populated and R308 is depopulated.
(Vice versa for power class 2)
Class 1.5
RTC_32K
RTC_32K768
must have 1% tolerance
can be removed
BT_RST_N
BT_PWR_ON
BT_ANT_FEED
RTC_32K768
26MHz
BT_WAKEUP
D4
E4
C4
A4
BT_PCM_OUT
BT_PCM_IN
BT_PCM_CLK
BT_PCM_SYNC
BT_UART_RX
BT_UART_TX
BT_UART_CTS
BT_UART_RTS
BT_WAKEUP_HOST
VBAT
VBT_WIFI_IO_2V6
LGE Internal Use Only
QCT
VBAT
IFX
VBAT
QCT
VREG_MSMP_2V6
IFX
VPM_IO_2V62
- 130 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
LCD_MAKER_ID
8-1-1-1
LCD_RST_N
LCD_VSYNC_OUT
VREG_MSMP_2V6
15pF
RCV_N
15pF
RCV_P
LCD_DATA[7]
LCD_DATA[6]
LCD_DATA[5]
LCD_DATA[4]
HALL_SENS_DET
15pF
VCOIN
15pF
LCD_DATA[11]
LCD_DATA[10]
LCD_DATA[9]
LCD_DATA[8]
GND
VREG_LCD_2V8
VLDO_LCD_2V8
VLDO_LCD_1V8
WLED1
15pF
WLED2
LCD_RD
VREG_MSME_1V8
WLED3
WLED4
WLED5
SLIDE_KEY_LED
15pF
KEY_ROW0
WLED_VOUT
KEY_ROW1
KEY_ROW2
DOWN
PM_ONSW_N
KEY_ROW3
KEY_COL5
KEY_ROW5
KEY_COL4
KEY_ROW7
UP
KEY_ROW7
KEY_COL6
LCD_IF_MODE[1]
KEY_COL7
LCD_IF_MODE[0]
VREG_MSME_1V8
KEY_ROW6
KEY_ROW5
KEY_ROW4
KEY_ROW3
KEY_ROW2
KEY_ROW1
KEY_ROW0
Q
W&$
E&%
R&1
T&2
Y&3
U&*
O&&
P
A&[
S&]
D&'
F&4
G&5
H&6
K&{
L&}
BACK
FN
Z&+
X&=
C&7
KEY_COL0
KEY_COL1
J&#
KEY_COL2
I&^
25pF
25pF
V&8
KEY_COL3
@&/
B&9
N&0
'&.
SPACE
M&;
SYM
ENTER
CAM
SHIFT
TEXT
?&:
25pF
KEY_COL6
KEY_COL7
"&,
KEY_COL4
25pF
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 131 -
LGE Internal Use Only
7. CIRCUIT DIAGRAM
3-2-1-3_push_1.50T
MSD_D[2]
MSD_D[3]
MSD_CMD
MSD_D[0]
MOTOR_POWER_N
MSD_D[1]
VBAT
LGE Internal Use Only
- 132 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
16
15
14
13
12
11
10
9
7
8
6
5
4
3
2
1
KEY PCB
L
K
L
K
LCD FILTER, ZIP CONNECTOR
Slide KEY PCB to Slide FPCB
ENBY0040501(GB042-50P-H10-E3000,SOCKET)
VLDO_LCD_1V8
J
CN101
LCD_DATA[7]
LCD_DATA[6]
LCD_DATA[5]
LCD_DATA[4]
LCD_DATA[3]
LCD_DATA[2]
LCD_DATA[1]
LCD_DATA[0]
LCD_RS
LCD_RD
LCD_WR_N
LCD_CS_N
I
LCD_RST_N
LCD_VSYNC_OUT
KEY_ROW0
KEY_ROW1
KEY_ROW2
KEY_ROW3
KEY_COL5
KEY_COL6
KEY_COL7
H
1
50
2
49
3
48
4
47
5
46
6
45
7
44
8
43
9
42
10
41
11
40
12
39
13
38
14
37
15
36
16
35
17
34
18
33
19
32
20
31
21
30
22
29
23
28
24
27
25
26
R102
R101
1
1
J
VLDO_LCD_2V8
CN102
1
LCD_MAKER_ID
LCD_DATA[15]
LCD_DATA[14]
LCD_DATA[13]
LCD_DATA[12]
LCD_DATA[11]
LCD_DATA[10]
LCD_DATA[9]
LCD_DATA[8]
2
LCD_VSYNC_OUT
3
4
LCD_MAKER_ID
LCD_DATA[0]
LCD_DATA[1]
LCD_DATA[2]
LCD_DATA[3]
VLDO_LCD_2V8
VLDO_LCD_1V8
LCD_IF_MODE[0]
LCD_IF_MODE[1]
WLED1
WLED2
WLED3
WLED4
WLED5
SLIDE_KEY_LED
PM_ONSW_N
WLED_VOUT
5
6
7
I
8
LCD_DATA[4]
LCD_DATA[5]
9
LCD_DATA[6]
LCD_DATA[7]
LCD_DATA[8]
LCD_DATA[9]
LCD_DATA[10]
LCD_DATA[11]
LCD_DATA[12]
LCD_DATA[13]
LCD_DATA[14]
LCD_DATA[15]
11
10
12
13
14
15
16
17
18
19
20
H
21
LCD_RD
LCD_WR_N
LCD_RS
LCD_CS_N
22
23
24
LCD_RST_N
25
26
LCD_IF_MODE[1]
LCD_IF_MODE[0]
27
28
29
30
C101
C102
0.1u
0.1u
G
WLED5
WLED4
WLED3
WLED2
WLED1
WLED_VOUT
31
32
33
G
34
35
F
F
SUB KEY B/L
SUB PCB KEY
E
E
WLED_VOUT
KEY_ROW3
KEY_ROW2
LD103
LD104
LD105
LD106
LD107
LD108
KEY_ROW1
POWER KEY
D
KEY_ROW0
KB101
KB102
KB103
R107
R108
R105
R106
R109
R110
10
10
10
10
10
10
D
KB104
SLIDE_KEY_LED
KB105
KEY_COL5
PM_ONSW_N
C
END
VA102
KEY_COL6
LEFT
Widget
KB106
KB107
Multi. TALK
KB110
KEY_COL7
DOWN
RSK
RIGHT
KB108
KB109
UP
OK
VA101
C
KB111
LSK
B
B
A
A
16
15
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
14
13
12
11
10
9
8
- 133 -
7
6
5
4
3
2
1
LGE Internal Use Only
7. CIRCUIT DIAGRAM
12
9
10
11
8
7
6
5
4
3
2
1
L
L
SLIDE FPCB
K
Slide FPCB to KEY PCB(Slide)
Slide FPCB to Main PCB
(54Pin)
J
K
MAIN RECEIVER
ENBY0040401 (50Pin)
CN102
4
51
5
50
6
49
RCV_P
LCD_DATA[15]
LCD_DATA[14]
LCD_DATA[13]
VCOIN
LCD_DATA[7]
LCD_DATA[12]
7
48
8
47
9
46
10
45
LCD_DATA[6]
LCD_DATA[10]
KEY_ROW0
KEY_ROW1
KEY_ROW2
KEY_ROW3
KEY_COL5
KEY_COL6
KEY_COL7
LCD_DATA[9]
LCD_DATA[4]
LCD_DATA[3]
LCD_DATA[8]
11
H
LCD_RST_N
LCD_VSYNC_OUT
LCD_DATA[11]
LCD_DATA[5]
44
LCD_DATA[2]
12
43
LCD_DATA[1]
LCD_DATA[0]
5
46
6
45
7
44
8
43
9
42
10
41
11
40
12
39
13
38
14
37
15
36
16
35
17
34
18
33
19
32
20
31
21
30
22
29
23
28
24
27
25
26
CN101
RCV_P
LCD_MAKER_ID
LCD_DATA[15]
LCD_DATA[14]
LCD_DATA[13]
LCD_DATA[12]
LCD_DATA[11]
LCD_DATA[10]
RCV_N
LCD_DATA[9]
LCD_DATA[8]
VLDO_LCD_2V8
VLDO_LCD_1V8
LCD_IF_MODE[0]
LCD_IF_MODE[1]
WLED1
WLED2
WLED3
WLED4
WLED5
SLIDE_KEY_LED
PM_ONSW_N
FB101
100n
1
FB102
100n
2
I
Can be Changed to TVS or ECLAMP
H
WLED_VOUT
VLDO_LCD_2V8
13
42
14
41
15
40
16
39
17
38
18
37
19
36
20
35
21
34
22
33
23
32
24
31
25
30
26
29
27
28
VLDO_LCD_1V8
LCD_RS
WLED1
LCD_RD
WLED2
LCD_WR_N
WLED3
LCD_CS_N
WLED4
LCD_RST_N
WLED5
LCD_VSYNC_OUT
G
47
VA102
52
48
4
VA101
3
49
3
39pF
I
LCD_MAKER_ID
50
2
39pF
53
RCV_N
1
C102
2
LCD_DATA[7]
LCD_DATA[6]
LCD_DATA[5]
LCD_DATA[4]
LCD_DATA[3]
LCD_DATA[2]
LCD_DATA[1]
LCD_DATA[0]
LCD_RS
LCD_RD
LCD_WR_N
LCD_CS_N
54
C101
CN103
1
J
SLIDE_KEY_LED
KEY_ROW0
G
WLED_VOUT
KEY_ROW1
KEY_ROW2
PM_ONSW_N
KEY_ROW3
KEY_COL5
KEY_COL6
LCD_IF_MODE[1]
KEY_COL7
BACKUP BAT.(SUPER CAP.)
LCD_IF_MODE[0]
GND
F
F
M101
R101
VCOIN
4.7K
C103
ZD101
2.2u
E
E
D
D
C
C
B
B
A
A
12
LGE Internal Use Only
11
10
9
8
7
6
- 134 -
5
4
3
2
1
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
12
11
10
9
8
7
6
5
4
3
2
1
L
L
K
K
J
J
MODULE FPCB
I
I
SPK Common Circuit
From Module FPCB to Main PCB Connector
BUSEON 16pi 3.0t 0.8W
ELCO8000_0610 Update
CN101
H
G1
SPK_OUT_P
SPK_OUT_N
20
2
19
3
18
4
17
5
16
6
15
7
MSD_D[2]
MSD_D[3]
MSD_CMD
SPK_OUT_P
VREG_MICROSD_3V0
MSD_CLK
SPK_OUT_N
CN102
1
2
14
8
MOTOR_POWER_N
VBAT
H
G2
1
13
9
MSD_D[0]
MSD_D[1]
12
10
11
G3
G4
G
G
Can be Changed to TVS or ECLAMP
MICRO SD
PUSH PUSH 1.32t
NORMAL TYPE
F
F
VB101
S101
1
G7 G5 G3 G1
MSD_D[2]
MSD_D[3]
MSD_CMD
VREG_MICROSD_3V0
MSD_CLK
E
MSD_D[0]
MSD_D[1]
VIBRATOR
1
C1
2
C2
3
C3
4
C4
5
C5
6
C6
7
C7
8
C8
G6 G4 G2
VBAT
CD
2
15
MOTOR_POWER_N
LG Innoteck/ Sodering 17mm
E
16
COM
D
D
C
C
B
B
A
A
12
11
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10
9
8
7
6
- 135 -
5
4
3
2
1
LGE Internal Use Only
LGE Internal Use Only
- 136 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA Pin Map
1.8.BGA
BGAPIN
Pin MAP
Map
QSC6270 3G disableٛ- U200 (bottom view)
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 137 -
LGE Internal Use Only
8. BGA Pin Map
H8BCS0SI0BAR-46M (MCP,NAND) – U300 (EUSY0347506)
LGE Internal Use Only
- 138 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA Pin Map
BCM2070B2KUBXG (bluetooth) – U700 (EUSY0418701)
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 139 -
LGE Internal Use Only
8. BGA Pin Map
RT8963WSC (Multiplexer Mini/Micro USB Interface)– IC400 (EUSY0424801)
LGE Internal Use Only
- 140 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA Pin Map
WM9093 (Ultra Low Power Audio Subsystem)– IC500 (EUSY0403901)
20-bump CSP package; Top View
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 141 -
LGE Internal Use Only
8. BGA Pin Map
TEA5991(FM Tuner)– U701 (EUSY0385901)
LGE Internal Use Only
- 142 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT
54
C609
C607
CN801
FB508 C511
R270
R604
C614
C612
C613
R811
C611
R813
27
R603
U601 Charge Pump+Dual LDO
- Can not use LCD Display,
LCD Backlight, Slide Detection
R271
U601
R810
FB502
C615
C610
C504
C503
C508
C509
C506
C507
C523
C802
C517
FB507 C510
C608
IC501
U801
C801
C524
5
D
IC501 Audio Sub System
- Can not use Sound,Headset
FB506
28
1
C518
C516
C515
R506
R507
C514
U801 Hall IC
- Can not use Slide Detection
CN801 FPCB Conn
- Can not use LCD, Receiver,Sub Key,
Sub key LEDs, Vibrator, Power On
VA266
VA802 R806
C269
C803
C268
6
5
C804
C805 VA803
VA801
10
1
C N 802
TP201
C N 260
TP202
VA804 R805
R801
R802
LD801
LD802
LD801/802 Main Key LED
- Can not use LED
KB801
KB821
KB812
KB822
KB802
KB813
KB804
KB805
KB806
KB807
KB814
KB815
K B 816
KB810
KB803
KB817
KB824
KB825
KB827
KB826
KB808
KB819
KB811
KB809
KB820
KB818
KB829
KB823
KB828
KB830
KB837
KB834
K B 838
KB832
K B 839
KB831
KB833
KB836
C320_MAIN_SPFY0235601_1.1_TOP
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 143 -
LGE Internal Use Only
9. PCB LAYOUT
C709
FL811
C707
FL803
FL810
C706
FL804
FL802
FL805
FB701
C604
R803
VA808
6
1
F
E
D
C
B
A
C708
VA809
VA810
U701
VA505
TP701
TP702
VA522
L501
R266
R509
R505
FB505 C519
R508
FB504
FB503
C502
R502
C501
C505
C521
IC401 MUIC
- Can not use USB, UART, Headset
VA504
D
C409
C405
C401
VA602 R269
VA601 R268
VA603
R303
R304
R302
C309
L810
C305
A
B
C
F
D
E
J
H
G
L
K
N
M
T
P
R307
R308
ZD310
ZD308
C312
C404
F L401
C247
ZD307
R309
ZD306
R310
R406
U401
12
ZD305
R407
R272
R273
A
1
F
C
B
D
E
H
G
J
L
K
N
P
M
T
R
U
V
W
Y
AA
AB
AC
U201 QSC6270 (BB & Power chipset)
- Can not power on
- No LCD Display
- No Service
C267
C214
C212
C213
C226
C220
C228
L207
L206
C231
C230
C233
C234
C235
C238
L205
C298
23
L204
L118
L103
C126
L111
L104
C104
C101
L101
L102
C102
C137
L115
L116
C107
C114
L107
L108
C118
C266
C251
C242
R260
C291
R261
C290
C275
C241
C203
C202
R201
PT201
X 202
C240
X202 XO
- Can not BootRF Rx/Tx
- No Power.
C227
C237
C250
FL808
C249
R205
C296
C207
C224
C210
C209
C261
C262
C525
VA508
R808
R1
VA509
C 526
X 201
C297
C252
L109
C232
C236
C256
C117
L203
C239
R282
R281
C 201
C229
R206
C 257
L201
U201
C253
C 206
C254
C281
C255
C219
L202
C280
L208
R265
D201
R311
R405
C410
C 412
C411
R402
C215
C217
C208
R264
10
Q
ZD311
C308
C216
C218
C306
R262
C246
C 258
C211
C221
C 205
C 259
C289
R284
U803
C276
C248
R283
C301
C807
C302
R807
C806
C739
C303
R809
C304
R301
C113
C740
R404
R403
R102
C121
R104
C119
C127
FL101
U101 GSM PAM
- Tx power No service
L1113
C135
C134
TP262
J301
R109
U 101
C122
L110
TP263
C123
L114
TP264
C417
C413
C130
L801
L802
L117
C110
L805
L806
L119
L803
L804
C109
C115
ANT101
C133
C132
C 414
C 415
Z D 402
L112
TP710
TP260
R112
C129
C128
C120
R107
L105
C105
C111
R110
R111
C112
CN402
SW101
FL101 FEM
- GSM RX Sensitivity & TX Power
- No service
R103
R114
R113
C143
C722
C724
C416
MIC501
CN403 USB Conn
- Can not use USB
U401 Single Charger
- Can not use Charging, Booting
C260
C742
L811
FB501
1
C406
C310
CN403
C
C704
TP705
TP706
C717
A
B
TP703
FB702
11
5
1
C737
T P709
C N 401
R401
T P708
20
C407
C710
TP704
C601
R511
C264
R219
C299
C403
D 202
C 225
C 244
R207
R263
R814
C223
C222
C245
C307
C311
VA260
VA261
VA262
VA263
VA264 VA401
VA265
MIC501 Mic.
- Can not use Mic
C263
R501
R503
C734
R708
C243
TP802
FL809
FL806
F
E
D
C
B
A
FB703
1
J301 USIM Conn.
- Can not detect USIM
IC401
C408
R713
FL807
C726
U 703
R702
7
CN402 Battery Conn
- Can not use Battery, Power On
C265
C715
TP707
C741
R601
C602
Q501
R510
C606
C605
U501
C402
R715
R714
R709
R710
R712
R711
R705
C721
C720
C723
U803 Analog Switch
- Can not use UART, BT
U802
C725
X702
J501
J501 Ear-Jack
- Can not use Ear-Mic
U301
R703
C735
C736
X702 BT X-Tal
- Can not use BT
R706
R707
F L701
U703 BT Chip.
- Can not use BT
VA503
T P 60 1
T P 60 2
C733
C N 803
ZD606
C204
ZD607
VA201
U301 Memory
- Can not Boot
X201 Sleep Cystal
- No Service
R504
C714
R602
FL603
C738
R704
C728
C 730
C731
C732
C729
C 727
L702
C 719
L701
CN803 FPCB Conn
- Can not use SD-card, Vibrator,
Speaker
S601 Camera Socket
- Can not use Camera
VA502 C520
VA501
S601
VA604
C705
C716
U704
R267
FL601
X 701
C718
C 712
C703
U702
C701
FL602
C603
L703
C713
ANT102
C320_MAIN_SPFY0235601_1.1_BOT
LGE Internal Use Only
- 144 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT
KB111
KB103
LD108
KB108
LD104
KB102
KB101
KB107
LD106
KB109
KB110
KB104
LD105
LD103
LD107
KB106
KB105
LD107/LD108/LD106/LD104/LD105/LD103
Sub Key LED
- Can not use LED
C320_KEY_SPEY0068201_10_TOP
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 145 -
LGE Internal Use Only
9. PCB LAYOUT
CN102
25
CN102 LCD Connector
- Can not use LCD Display, LCD Backlight
CN101
R102
C102
C101
R101
50
CN101 FPCB Connector
- Can not use LCD, Sub key Operation,
Sub Key LED, Receiver
R1 1 0
R 10 7
R108
R 10 9
R 10 6
R105
VA101
26
VA102
C320_KEY_SPEY0068201_10_BOT
LGE Internal Use Only
- 146 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT
R101
ZD101
M101
C103
C101
VA101
CN101
C102
FB102
VA102
FB101
25
CN102
26
50
27
CN103
28
54
CN103 FPCB Connector
- Can not use LCD, Sub key Operation,
Sub Key LED, Receiver
CN102 FPCB Conn
- Can not use LCD, Sub key Operation,
Sub Key LED, Receiver
C320_F_SLIDE_SPCY0246901_10_TOP
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 147 -
LGE Internal Use Only
20
CN102
10
S101
CN101
CN101 FPCB Conn
- Can not use SD-card, Vibrator, Speaker
VB101
11
9. PCB LAYOUT
S301 MicroSD Socket
- Can not use MicroSD
C320_F_SUB_SPCY0247101_10_BOT
LGE Internal Use Only
- 148 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. RF CALIBRATION
10. RF CALIBRATION
10.1 Usage of Tachyon for RF Calibration and Test
10.1.1 Preparation work for setting RF cable loss
Procedure
1. Click “Hecaton.exe” in below directory to set RF cable loss on test equipment.
“C:\LGE\Tachyon\Utilities”
2. After selecting “Select File” button, select right RF cable loss file corresponding to RF cable that you use.
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 149 -
LGE Internal Use Only
10. RF CALIBRATION
10.1.2 Basic Setting of Tachyon for RF Calibration & Test
[ System Option Setting]
[ User Model Selection]
Procedure
1. Click “Tachyon_xxx.exe” in below directory to execute Tachyon program. “C:\LGE\Tachyon\”
2. Click “System Option Setting” icon in the menu to set COM port.
Select “UART Port” that can communicate with phone in the Shield Box 1 message.
Click the “OK” button.
3. Click “User Model Selection” icon in the menu to set model configuration.
Do double-click model/buyer name that you want to calibrate and test.
Click the “Select” button.
LGE Internal Use Only
- 150 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. RF CALIBRATION
10.1.3 Log of RF Calibration and Test
Contents
On Running, log window is created in upper area.
It displays logs of phone commands and measurements for RF calibration and test.
The result files are saved in below directory
- “C:\LGE\Tachyon\Report\CalData\” : the file of RF calibration result
- “C:\LGE\Tachyon\Report\TestData\” : the file of RF test result
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 151 -
LGE Internal Use Only
11. TEST ALONE
Phone Test11.
Mode
: LG-C320
TEST
ALONE
11.1 Phone Test Mode
1. Enter the Engineer Menu
2. Tap 1. Device Test
3. Tap 1. Auto ALL Test
LGE Internal Use Only
- 152 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. TEST ALONE
Phone Test Mode Scenario
Item
(1) Key Press, External
Memory, and SIM
card Test Start
Order
1.Key, External Memory,
and SIM card Test
2. IF OK, tab “LSK”
Button.
It means “PASS”
Description
Key Test
Press all keys for test
- UP key
- Down key
- Right key
- Left key
………..
…….
….
External memory and
SD card is inserted
then Sing of
“SIM Pass” and
“SD Pass” is green.
Phone Test Mode Scenario
Item
(2) Sound
Order
Description
1. Sound On
Ringtone (MP3) is played
regularly
2. IF OK, tab “LSK”
Button.
It means “PASS”
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Press “LSK” button (Left top Key)
Move to next step
- 153 -
LGE Internal Use Only
11. TEST ALONE
wG{GtGz
Item
(3) Vibrator Test
Order
Description
1.Vibrator On
2. IF OK, tab “LSK”
Button.
It means “PASS”
Press “LSK” button (Left top Key)
Move to next step
wG{GtGz
Item
(4) Slide On/Off Test
Order
Description
1.Move Slide Up and
Down
Slide UP status
2. IF OK, tab “LSK”
Button.
It means “PASS”
LGE Internal Use Only
Slide Down status
Press “LSK” button (Left top Key)
Move to next step`
- 154 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. TEST ALONE
wG{GtGz
Item
(5) Camera Test
Order
Description
1. Camera Off
2. Camera Auto On
( Preview )
3. Photo Shot by press
“OK” key
4. Photo Save
5. Record video
6. Video Save
7. Call Photo
If OK , Press “LSK” key
(Left top Key)
8. Call Video
9. Preview
10. IF OK, tab “LSK”
Button. It means
“PASS”
wG{GtGz
Item
(6) Loopback Test
Order
Description
1.Loopback On
2. Speak something
3. After 2 Sec, listen the
voice
4. IF OK, tab “LSK”
Button.
It means “PASS”
Press “LSK” button (Left top Key)
TEST END
5. The TEST END
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 155 -
LGE Internal Use Only
LGE Internal Use Only
- 156 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 EXPLODED VIEW
ACGT00
ACGU00
SURY00
SACY00
SVLM00
MCCH00
AHFY00
GMEY01
GMEY02
SAEY00
ADCA01
ABFZ01
ABGZ01
ACGK00
ACGA00
ACGM00
SAFY00
MBJZ00
MCBA01
GMEY00
ABFZ00
GMEY01
SVCY00
ABGZ00
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
ADCA00
SPKY00
SUMY00
MCBA00
SNGF00
- 157 -
SBPL00
Location
ACGA00
SBPL00
ABFZ00
ACGM00
SNGF00
MBJZ00
GMEY00
ABGZ00
ABGZ01
ACGT00
AHFY00
SURY00
ABFZ01
ACGK00
ACGU00
GMEY01
GMEY02
MCCH00
SACY00
SAEY00
ADCA01
SVLM00
SAFY00
SVCY00
SPKY00
MCBA00
ADCA00
MCBA01
SUMY00
Description
Cover Assembly,Battery
Mobile Phone Battery Li-Ion
Bracket Assembly
Cover Assembly,Rear
Antenna,Helical
Button
Screw,Machine
Button Assembly
Button Assembly
Cover Assembly,Upper
HINGE ASSY
Receiver
BRACKET ASSY
Cover Assembly,Front
Cover Assembly,Lower
Screw,Machine
Screw,Machine
Cap,Screw
PCB Assembly,Flexible
PCB Assembly,Keypad
Dome Assembly,Metal
LCD,Module-TFT
PCB Assembly,Main
Camera Module
PCB,Sidekey
Can,Shield
Dome Assembly,Metal
Can,Shield
Microphone,Condenser
LGE Internal Use Only
LGE Internal Use Only
- 158 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.2 Replacement Parts
Level LocationNo.
1
Note: This Chapter is used for reference, Part order is ordered
by SBOM standard on GCSC
Description
PartNumber
Spec
AAD000000 Addition Assembly
- AAAY0524401
LG-C320 BOOWA ZZ:Without Color -
Remark
2
ACGA00
Cover Assembly,Battery
- ACGA0048201
LG-C320i IDNWA WA:White -
3
MCJA00
Cover,Battery
MCJA0120401
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
3
MPBN00
Damper,Speaker
MPBN0093201
COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , ,
2
MFL053800 Manual,Operation
MFL67003501
COMPLEX LGC320.ABOOWA ZZ:Without Color LGC320 manual for
BOO
1
AGF000000 Package Assembly
- AGF75960001
LGC320.ABOOWA ZZ:Without Color LGC320 BOO(TR3/STD
UB/1160*1160 Pallet/600ea)
2
MAY084000 Box,Unit
MAY64811601
COMPLEX LGC320.ABOOWA ZZ:Without Color LGC320 BOO(TR3
STD UB)
2
MAF086500 BAG,VINYL(PE)
MBAD0005204
LG-LX260 SPRAG AG,ZZ,COMPLEX, (empty), , , , ,
2
AGJ000000 PALLET ASSY
- APLY0002405
KP110 OPTBK BK,ZZ,TR3 Australia(600ea) Pallet Assy
3
MBEC00
BOX,CARTON
MBEC0002002
KG270 CIS BK,ZZ,BOX, TW
3
MCCL00
Cap,Box
MCCL0000402
COMPLEX KG270 CIS ZZ:Without Color BOX,TW, PBO PBOTW
3
MPCY00
Pallet
MPCY0015703
COMPLEX TU500 TELBK SV:Silver
COMPLEX,(empty),1160,1160,126,
3
MSCA00
SLEEVE,BOX
MSCA0000701
MG230d CLA TS,ZZ,BOX, TW
2
MAY047100 Box,Master
MBEE0059803
COMPLEX KP100 GBRLA ZZ:Without Color -
2
MEZ003500 Label,Barcode
MLAC0004541
COMPLEX HB620 KPNBK ZZ:Without Color -
2
MEZ047200 LABEL,MASTER BOX
MLAJ0004402
CG300 CGR DG,ZZ,LABEL,MASTER BOX(for CGR TDR 2VER.
mbox_label)
2
MEZ000000 LABEL
MLAZ0050901
KU990 GBRBK BK,ZZ,PRINTING, (empty), , , , ,
- APEY0988401
LG-C320 BOOWA WA,ZZ,
MLAA0062311
COMPLEX KB770 DEUBK ZZ:Without Color -
1
2
APEY00
PHONE
MEZ002100 Label,Approval
2
ACGY00
COVER ASSY,EMS
- ACGY0088801
LG-C320 BOOWA WA,ZZ,
3
ABFZ00
Bracket Assembly
- ABFZ0028101
LG-C320 BOOWA ZZ:Without Color -
4
MEV000000 Insulator
MIDZ0281601
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,
,,,
4
MCQ049800 Damper,Motor
MPBJ0079001
COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , ,
4
MJN000000 Tape
MTAZ0358201
COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , ,
4
MCQ015700 Damper,Connector
MPBU0114101
COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , ,
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 159 -
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo.
3
4
ACGM00
Description
Cover Assembly,Rear
MJN061100 Tape,Protect
PartNumber
Spec
- ACGM0168401
LG-C320i IDNWA ZZ:Without Color -
MJN67687301
COMPLEX LGC320I.AIDNWA GN:Green -
4
MBJZ00
Button
MBJZ0041901
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
4
MCCE00
Cap,Receptacle
MCCE0061601
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
4
MCJN00
Cover,Rear
MCJN0127401
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
4
MDAY00
Decor
MDAY0086001
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
4
MLAB
LABEL,A/S
MLAB0001102
C2000 CGRSV SV,WA,C2000 USASV DIA 4.0
4
MPBJ00
Damper,Motor
MPBJ0078101
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
4
MPBN00
Damper,Speaker
MPBN0091501
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
4
MPBT00
Damper,Camera
MPBT0098901
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
4
MPBZ00
Damper
MPBZ0337301
COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , ,
4
MTAK00
Tape,Camera
MTAK0041901
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
4
MWAE00
Window,Camera
MWAE0065101
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
3
GEMY00
Screw,Machine
GMEY0010601
GMEY0010601 BH + 1.4mM 2.5mM MSWR FZB N - KUMGANG
SCREW CO., LTD
3
ACGQ00
Cover Assembly,Slide
- ACGQ0056601
LG-C320 BOOWA WA:White -
4
ABGZ00
Button Assembly
ABGZ0006901
LG-C320i IDNWA ZZ:Without Color MAIN
4
ABGZ01
Button Assembly
ABGZ0007001
LG-C320i IDNWA ZZ:Without Color SUB
4
ACGT00
Cover Assembly,Upper
- ACGT0009101
LG-C320i IDNWA ZZ:Without Color LG-C320i IDNWA
5
AJX00
Window Assembly,LCD
- AJX73205001
LGC320.ABOOWA ZZ:Without Color -
MWAC0151901
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
6
MKC043300 Window,LCD
5
MCJX00
Cover,Upper
- MCJX0011301
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
6
MICE00
INSERT,NUT
MICE0016901
MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,
5
MFBZ00
Filter
MFBZ0025001
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
5
MPBG00
Damper,LCD
MPBG0113001
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
5
MTAD00
Tape,Window
MTAD0133501
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
5
MTAZ
TAPE
MTAZ0113701
LG-KV5900 BK,ZZ,20X7
4
MJN061101 Tape,Protect
MTAB0440401
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,
,,,
4
MJN061100 Tape,Protect
MTAB0423001
COMPLEX LG-C320i IDNWA ZZ:Without Color -
4
MJN061102 Tape,Protect
MTAB0422301
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
AHFY0002101
LG-MN240 MTP LS,ZZ,Slide
4
AHFY00
LGE Internal Use Only
HINGE ASSY
- 160 -
Remark
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo.
Description
PartNumber
Spec
Remark
4
ABFZ01
BRACKET ASSY
- ABFZ0023401
LG-MN240 MTP LS,ZZ,
5
MBFZ00
BRACKET
MBFZ0043001
LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , ,
5
MTAB00
TAPE,PROTECTION
MTAB0381101
LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , ,
4
ACGK00
Cover Assembly,Front
- ACGK0169801
LG-C320i IDNWA ZZ:Without Color LG-C320i IDNWA
5
MCJK00
Cover,Front
- MCJK0135101
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
6
MICE00
INSERT,NUT
MICE0016903
MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,
5
MPBZ01
Damper
MPBZ0320601
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
5
MPBZ00
Damper
MPBZ0320801
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
5
MPBZ02
Damper
MPBZ0366401
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
4
ACGU00
Cover Assembly,Lower
- ACGU0007201
LG-C320i IDNWA ZZ:Without Color LG-C320i IDNWA
5
MCJY00
Cover,Lower
MCJY0008701
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
5
MMAA00
MAGNET,SWITCH
MMAA0011201
LG-LU1600 LGTWW WW,ZZ,COMPLEX, (empty), , , , ,
5
MPBZ01
PAD
MPBZ0260601
LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , ,
5
MPBZ
PAD
MPBZ0260901
LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , ,
5
MPBZ02
Damper
MPBZ0320401
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
4
GMEY01
Screw,Machine
GMEY0017801
GMEY0017801 BH + 1.4mM 1.4mM MSWR FZB N - KUMGANG
SCREW CO., LTD
4
GMEY02
Screw,Machine
GMEY0019201
GMEY0019201 FH + 1.4mM 1.8mM SWCH FZW N N KUMGANG
SCREW CO., LTD
4
MCCH00
Cap,Screw
MCCH0165101
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
4
MEV000002 Insulator
MEV63651701
COMPLEX LGC320.ABOOWA BL:Blue insulator, FPCB
4
MDS000000 Gasket
MGAZ0112501
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
4
MEV000001 INSULATOR
MIDZ0259401
LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , ,
4
MCQ000000 Damper
MPBZ0357401
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,
,,,
6
MJN000000 Tape
MTAZ0368001
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,
,,,
6
MCQ015700 Damper,Connector
MPBU0113901
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,
,,,
ADCA0118401
LG-C320i IDNWA ZZ:Without Color LG-C320i IDNWA
MPBZ0349901
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,
,,,
6
5
ADCA01
Dome Assembly,Metal
MCQ000000 Damper
5
ACKA00
Can Assembly,Shield
- ACKA0035801
LG-C320i IDNWA ZZ:Without Color -
6
MCBA00
Can,Shield
MCBA0086901
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
MIDZ0284101
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),
5
MEV000000 Insulator
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 161 -
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo.
Description
PartNumber
Spec
5
ADCA00
Dome Assembly,Metal
- ADCA0118501
LG-C320i IDNWA ZZ:Without Color MAIN
6
MPBZ00
PAD
MPBZ0337101
LG-C320i IDNWA WA,ZZ,COMPLEX, (empty), , , , ,
5
MPBU00
Damper,Connector
MPBU0113801
COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,
,,,
MLAZ0038301
LG-VX6000 SV,ZZ,PID Label 4 Array
MCBA0059201
COMPLEX GD350 CLP ZZ:Without Color -
5
6
MEZ000000 LABEL
MCBA01
LGE Internal Use Only
Can,Shield
- 162 -
Remark
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.2 Replacement Parts
Level LocationNo.
Description
4
EBR070500 PCB Assembly,Flexible
5
EBR070400
6
EAX010700 PCB,Flexible
6
EBR070200
7
CN101
7
S101
6
EBR070300
4
4
4
6
Note: This Chapter is used for reference, Part order is ordered
by SBOM standard on GCSC
PartNumber
Spec
Remark
- EBR72655001
LGC320.ABOOWA FLEXIBLE 1.0
- EBR72681501
LGC320.ABOOWA FLEXIBLE 1.0
SPCY0247101
SPCY0247101 LG-C320i IDNWA,FLEXIBLE,E,POLYI,0.15
mm,DOUBLE SI FLEX CO., LTD
PCB Assembly,
Flexible,SMT Bottom
- EBR72655201
LGC320.ABOOWA FLEXIBLE 1.0
Connector,BtoB
ENBY0052901
55909-0274 20P 0.40MM STRAIGHT MALE SMD R/TP 1.5M HANKOOK MOLEX
Socket,Card
ENSY0023601
SCHA4B0402 Micro-SD 8P ANGLE SMD R/TP - ALPS ELECTRIC
KOREA CO.,LTD.
PCB Assembly,
Flexible,SMT Top
EBR72681601
LGC320.ABOOWA FLEXIBLE 1.0
EAU010000 Motor,DC
SJMY0007104
3V 80mA 0A 12KRPM 0RPM 0SEC 0GF.CM 0OHM
EAB010100 Speaker Module
SUSY0027617
SI-C320-P LG-C320i IDNWA BUJEON ELECTRONICS CO., LTD
SNGF0064202
ACD-00094 3.0,-2 dBd,GSM Quad carrier type,QUAD,-2.0,50,3.0
MOBITECH CORPORATION
BFAA0127401
BFAA0127401 ; ,BLACK , , , BLACK , , , NISSHA PRINTING CO.,
LTD
SNGF00
PCB Assembly,
Flexible,SMT
Antenna,Helical
RAB040100 Film,Inmold
4
SURY00
Receiver
SURY0010114
BWBR1207L-04B-P 30mW 32OHM 105DB 0HZTO0HZ WIRE BUJEON ELECTRONICS CO., LTD
4
SACY00
PCB Assembly,Flexible
- SACY0127201
LG-C320 BOOWA FLEXIBLE 1.0
5
SACE00
PCB Assembly,
Flexible,SMT
- SACE0114501
LG-C320 BOOWA FLEXIBLE 1.0
SPCY0246901
SPCY0246901 LG-C320i IDNWA,FLEXIBLE,D,POLYI,.12
mm,DOUBLE SI FLEX CO., LTD
6
EAX010700 PCB,Flexible
6
SACC00
PCB Assembly,
Flexible,SMT Bottom
SACC0085002
LG-C320 BOOWA FLEXIBLE 1.0
6
SACD00
PCB Assembly,
Flexible,SMT Top
- SACD0098702
LG-C320 BOOWA FLEXIBLE 1.0
SEVY0005201
EVLC5S02050 5.5V 0% 50F 1.0*0.5*0.6 - SMD R/TP AMOTECH
CO., LTD.
7
C101,C102 Varistor
7
FB101,
FB102
Inductor,Multilayer,Chip
ELCH0004727
1005GC2TR10J00 100NH 5% 0V 100mA 2.3OHM 600MHZ 8 NON
SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.
7
CN102
Connector,BtoB
ENBY0040401
GB042-50P-H10-E3000 50P 0.4MM STRAIGHT PLUG SMD R/TP
1M - LS Mtron Ltd.
7
VA101,
VA102
Varistor
SEVY0003901
EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP
AMOTECH CO., LTD.
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 163 -
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo.
Description
PartNumber
Spec
Connector,BtoB
ENBY0042601
GB042-54P-H10 54P 0.40MM STRAIGHT MALE SMD R/TP 1M - LS
Mtron Ltd.
C103
Capacitor,Ceramic,Chip
ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP .
SAMSUNG ELECTRO-MECHANICS CO., LTD.
7
M101
Capacitor Assembly
SMZY0023501
PAS311HR-VG1 3.8 Backup Capacitor 0.03F,Module Assembly,
KOREA TAIYO YUDEN.CO., LTD.
7
ZD101
Diode,TVS
EDTY0008601
PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1 PROTEK
DEVICES INC.
7
R101
Resistor,Chip
ERHY0000254
MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
4
SAEY00
PCB Assembly,Keypad
- SAEY0074701
LG-C320 BOOWA KEYPAD 1.0
5
EBR070900
PCB Assembly,
Keypad,Insert
- EBR72665301
LGC320.ABOOWA KEYPAD 1.0
5
SAEE
PCB Assembly,
Keypad,SMT
- SAEE0039402
LG-C320 BOOWA KEYPAD 1.1
6
SAEC
PCB Assembly,
Keypad,SMT Bottom
- SAEC0038302
LG-C320 BOOWA KEYPAD 1.0
7
CN103
7
7
R101,R102 Resistor,Chip
ERHZ0000434
MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
7
C101,C102 Capacitor,Ceramic,Chip
ECCH0002001
C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C 1005 R/TP
- TDK CORPORATION
ENBY0040501
GB042-50S-H10-E3000 50P 0.4MM STRAIGHT SOCKET SMD R/TP
1M - LS Mtron Ltd.
7
CN101
Connector,BtoB
7
CN102
Connector,FFC/FPC/PIC ENQY0014901
7
R105,R106,R
107,R108,R1 Resistor,Chip
09,R110
GF032-35S-E2000 35P 0.30MM FPC STRAIGHT BOTH SMD R/TP
LOCKING - LS Mtron Ltd.
ERHZ0000402
MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
7
VA101,
VA102
Varistor
SEVY0003901
EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP
AMOTECH CO., LTD.
6
SAED
PCB Assembly,
Keypad,SMT Top
- SAED0037602
LG-C320 BOOWA KEYPAD 1.0
7
LD103,
LD104,
LD105,
LD106,
LD107,
LD108
LED,Chip
EDLH0014803
SSC-WH107 WHITE 2.7~3.1 20mA 100~230mcd x, y 64mW 1608
R/TP 2P - SEOUL SEMICONDUCTOR CO.,LTD
6
SPEY00
PCB,Keypad
SPEY0068201
SPEY0068201 LG-C320i IDNWA,KEYPAD,D,FR-4,.8 mm,BUILD-UP
4 UNITECH PRINTED CIRCUIT BOARD CORP.
4
SVLM00
LCD,Module-TFT
SVLM0038101
DM24-DSM04
Main,2.4,320*240,54.3*46.8*1.7t,262K,TFT,TM,S6D05A0,Landscape
Type,16bit IF,For Bar Type Phone, LG Display Co. Ltd.
3
SAFY00
PCB Assembly,Main
- SAFY0399101
LG-C320 MAIN 1.0
LGE Internal Use Only
Remark
- 164 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo.
4
5
SAFB00
Description
PCB Assembly,
Main,Insert
RAA050100 RESIN,PC
PartNumber
Spec
- SAFB0126901
LG-C320 BOOWA MAIN 1.1
BRAH0001301
UF-1060,; , , , ,[empty]
Remark
5
SVCY00
Camera Module
SVCY0026901
C2FK-H313A C2FK-H313A 2M FF, Hynix(1/5"), 7x7x4.1t, Socket LG
Innotek.com
5
SPKY00
PCB,Sidekey
SPKY0094301
SPKY0094301 LG-C320i IDNWA,SIDEKEY,C,POLYI,0.18
mm,DOUBLE SI FLEX CO., LTD
4
SAFF00
PCB Assembly,
Main,SMT
- SAFF0298001
LG-C320 MAIN 1.0
5
SAFC00
PCB Assembly,
Main,SMT Bottom
- SAFC0162201
LG-C320 BOOWA MAIN 1.2
6
S601
Card Socket
ENSY0022201
CAM-H88 24,ETC,mm,7*7,1.3M (1/5") Socket Type MITSUMI
ELECTRIC CO.,LTD.
6
L207
Inductor,Multilayer,Chip
ELCH0004729
1005GC2T56NJ00 56NH 5% 0V 200mA 1.6OHM 900MHZ 8 NON
SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.
6
C103
Capacitor,Ceramic,Chip
ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP .
SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
C735
Capacitor,Ceramic,Chip
ECCH0000110
MCH155A100D 10pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION
6
C120,C739 Capacitor,Ceramic,Chip
ECCH0000112
MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
C301,C303,C
304,C404,C4 Capacitor,Ceramic,Chip
07
ECCH0000115
MCH155A220JK 22pF 5% 50V NP0 -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION
6
C110
Capacitor,Ceramic,Chip
ECCH0000117
CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C 1005 R/TP 0.5
SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
C143
Capacitor,Ceramic,Chip
ECCH0000195
GRM1555C1H3R9C 3.9pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP
- MURATA MANUFACTURING CO.,LTD.
C417,C525 Capacitor,Ceramic,Chip
ECCH0000120
MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
Capacitor,Ceramic,Chip
ECCH0000137
C1005X7R1H331KT000F 0.33nF 10% 50V X7R -55TO+125C 1005
R/TP - TDK KOREA COOPERATION
Varistor
SEVY0003901
EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP
AMOTECH CO., LTD.
6
6
C708
6
VA101,
VA102
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 165 -
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo.
Description
PartNumber
Spec
6
C208,C211,C
212,C213,C2
14,C215,C21
6,C217,C218
,C219,C220,
C221,C222,C
223,C229,C2 Capacitor,Ceramic,Chip
31,C235,C23
6,C305,C306
,C307,C308,
C309,C310,C
605,C606,C7
01,C709
ECCH0009101
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -55TO+85C 0603
R/TP - TDK CORPORATION
6
C101,C102 Capacitor,Ceramic,Chip
ECCH0002001
C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C 1005 R/TP
- TDK CORPORATION
6
C105,C117,C
118,C122,C1
Capacitor,Ceramic,Chip
30,C135,C51
9,C520,C521
ECZH0000830
C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C 1005
R/TP - TDK KOREA COOPERATION
6
C230,C233 Capacitor,Ceramic,Chip
ECCH0006201
C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -55TO+85C 1608
R/TP - TDK CORPORATION
6
C121,C225,C
246,C252,C2 Capacitor,Ceramic,Chip
54,C255
ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608 R/TP
0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
C226,C227,C
237,C244,C2
Capacitor,Ceramic,Chip
57,C258,C25
9
ECCH0007802
CV105X5R475M10AT 4.7uF 20% 10V X5R -55TO+85C 1608 R/TP KYOCERA CORP.
6
C234,C240,C
Capacitor,Ceramic,Chip
241,C243
ECCH0009103
C0603C0G1H101JT00NN 100pF 5% 50V X7R -55TO+125C 0603
R/TP - TDK CORPORATION
6
C242,C253,C
256,C298,C7
Capacitor,Ceramic,Chip
21,C725,C72
6
ECCH0009106
C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C 0603 R/TP TDK CORPORATION
6
C127
Capacitor,Ceramic,Chip
ECCH0009110
C0603X7R0J223KT 22nF 10% 6.3V X7R -55TO+125C 0603 R/TP TDK CORPORATION
6
C129
Capacitor,Ceramic,Chip
ECCH0009226
GRM0335C1E390J 39pF 5% 25V X7R -55TO+125C 0603 R/TP MURATA MANUFACTURING CO.,LTD.
6
C128
Capacitor,Ceramic,Chip
ECCH0009228
GRM033R61A472K 4700pF 10% 25V X5R -55TO+85C 0603 R/TP MURATA MANUFACTURING CO.,LTD.
6
C722,C723 Capacitor,Ceramic,Chip
ECCH0009514
MCH032A(AN)100DK 10pF 0.5PF 25V X7R -55TO+125C 0603 R/TP
- ROHM.
6
C602,C603 Capacitor,Ceramic,Chip
ECCH0010501
GRM1555C1H7R5D 7.5pF C0G TYPE(No X7R) MURATA
MANUFACTURING CO.,LTD.
6
C412,C414,C
Capacitor,TA,Conformal
415
ECTH0002002
F981A336MSA 33F 20% 10V 3.3A -55TO+85C 6OHM
2.2X1.1X1.1MM - SMD R/TP NICHICON CORPORATION, EAST
JAPAN SALES OFFICE
LGE Internal Use Only
- 166 -
Remark
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo.
Description
PartNumber
Spec
Remark
6
C526
Capacitor,TA,Conformal
ECTH0004807
TCM1A106M8R 10F 20% 10V 500mA -55TO+85C 15OHM - - SMD
R/TP ROHM.
6
C113
Capacitor,Ceramic,Chip
ECZH0000802
C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP TDK KOREA COOPERATION
C232,C260,C
Capacitor,Ceramic,Chip
267
ECCH0000122
MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION
Capacitor,Ceramic,Chip
ECZH0000816
C1005C0G1H120JT000F 12pF 5% 50V NP0 -55TO+125C 1005
R/TP - TDK KOREA COOPERATION
C102,C104,C
Capacitor,Ceramic,Chip
107
ECCH0000701
C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0 -55TO+125C 1005
R/TP - TDK CORPORATION
Diode,TVS
EDTY0009101
ESD9X5.0ST5G 5V 6.2 12.3V 8.7A 107W SOD528 R/TP 2P 1 ON
SEMICONDUCTOR
6
6
6
C740
6
VA504,
ZD606,
ZD607
6
C126
Capacitor,Ceramic,Chip
ECZH0000846
C1005C0G1H8R2CT000F 8.2pF 0.25PF 50V NP0 -55TO+125C 1005
R/TP - TDK KOREA COOPERATION
6
C114
Capacitor,Ceramic,Chip
ECZH0001002
C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -55TO+125C 1005
R/TP - TDK KOREA COOPERATION
6
C706,C707 Capacitor,Ceramic,Chip
ECZH0001210
C1005Y5V1A474ZT000F 470nF -20TO+80% 10V Y5V -30TO+85C
1005 R/TP - TDK KOREA COOPERATION
6
C134,C312,C
401,C409,C4 Capacitor,Ceramic,Chip
11
ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005 R/TP
- TDK KOREA COOPERATION
6
C204,C261,C
262,C263,C2
64,C266,C27 Capacitor,Ceramic,Chip
6,C299,C302
,C405,C413
ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP
- MURATA MANUFACTURING CO.,LTD.
Diode,TVS
EDTY0010101
ESD9B5.0ST5G ESD9B5.0ST5G,SOD-923,5 V,300 mW,R/TP,15pF
SCG HONG KONG SAR LTD.
C403,C408 Capacitor,Ceramic,Chip
ECZH0003503
GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608 R/TP MURATA MANUFACTURING CO.,LTD.
Capacitor,Ceramic,Chip
ECZH0003504
GRM188R71E104K 100nF 10% 25V X7R -55TO+125C 1608 R/TP MURATA MANUFACTURING CO.,LTD.
Filter,Bead
SFBH0000903
HB-1M1005-601JT 600 ohm 1.0*0.5*0.5 SMD R/TP 2P CERATECH
CORPORATION
6
C806,C807 Capacitor,Ceramic,Chip
ECZH0004402
MCH153C104ZK 0.1uF 10% 16V NP0 -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION
6
C101,C102 Varistor
SEVY0005201
EVLC5S02050 5.5V 0% 50F 1.0*0.5*0.6 - SMD R/TP AMOTECH
CO., LTD.
6
6
ZD305,
ZD306,
ZD307,
ZD308,
ZD310,
ZD311
6
C402
6
FB501,
FB703
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 167 -
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo.
6
VA508,
VA509,
VA601,
VA602,
VA603,
VA604
Description
Varistor
PartNumber
Spec
SEVY0003801
EVLC18S02015 18V 0% 15F 1.0*0.5*0.6 NONE SMD R/TP
AMOTECH CO., LTD.
6
C228,C245,C
Capacitor,Ceramic,Chip
734
ECZH0025920
GRM033R71C102K 1nF 10% 16V X7R -55TO+125C 1608 R/TP MURATA MANUFACTURING CO.,LTD.
6
C109,C705,C
Capacitor,Ceramic,Chip
742
ECZH0000813
C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C 1005 R/TP TDK KOREA COOPERATION
6
D202
Diode,Switching
EDSY0011901
SDB310Q 340mV 30V 200mA 1A 0SEC 150mW EMD2 R/TP 2P 1
AUK CORP
6
D201
Diode,Switching
EDSY0017702
SDB0530 360mV 30V 500mA 3A 0SEC 200mW SOD323 R/TP 2P 1
AUK CORP
6
ZD101
Diode,TVS
EDTY0008601
PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1 PROTEK
DEVICES INC.
ECCH0004904
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP MURATA MANUFACTURING CO.,LTD.
Inductor,Multilayer,Chip
ELCH0001444
0402AF-101XJEW 0402AF-101XJLW,100 nH,J,1005,R/TP,chip coil
COILCRAFT SINGAPORE PTE LTD.
6
L101,L102 Inductor,Multilayer,Chip
ELCH0004701
1005GC2T12NJ00 12H 5% 0V 250mA 0.48OHM 2.1GHZ 8 NON
SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.
6
L109,L111 Inductor,Multilayer,Chip
ELCH0004705
1005GC2T8N2J00 8.2NH 5% 0V 250mA 0.37OHM 2.8GHZ 8 NON
SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.
6
L107,L108,
Inductor,Multilayer,Chip
L115,L116
ELCH0004708
1005GC2T2N7S00 2.7NH 5% 0V 200mA 1.3OHM 1GHZ 8 NON
SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.
Inductor,Multilayer,Chip
ELCH0004721
1005GC2T2N2S00 2.2NH 5% 0V 300mA 0.13OHM 7GHZ 8 NON
SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.
L114,L204,
Inductor,Multilayer,Chip
L205
ELCH0004715
1005GC2T27NJ00 27NH 5% 0V 200mA 0.9OHM 1.4GHZ 8 NON
SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.
6
6
6
6
C207,C209,C
210,C275,C4
Capacitor,Ceramic,Chip
06,C501,C50
2
L501
L110
6
FB101,
FB102
Inductor,Multilayer,Chip
ELCH0004727
1005GC2TR10J00 100NH 5% 0V 100mA 2.3OHM 600MHZ 8 NON
SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.
6
L118
Inductor,Multilayer,Chip
ELCH0004730
1005GC2T33NJ00 33NH 5% 0V 200mA 1OHM 1.3GHZ 8 NON
SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.
L801,L802,
L803,L804, Inductor,Multilayer,Chip
L805,L806
ELCH0005019
HK100568NJ 68NH 5% 0V 8A 1.2GOHM 700mHZ 180m NON
SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN CO.,LTD
Inductor,Wire Wound,
chip
ELCP0008013
MIPSZ2012D2R2 MIPSZ2012D2R2,2.2 uH,N,2.0X1.2X1.0,R/TP FDK
CORPORATION.
L201,L202, Inductor,Wire Wound,
L203
chip
ELCP0008014
MIPSZ2012D4R7 MIPSZ2012D4R7,4.7 uH,N,2.0X1.2X1.0,R/TP FDK
CORPORATION.
ENBY0053001
51338-0274 20P 0.40MM STRAIGHT FEMALE SMD R/TP 1.5M HANKOOK MOLEX
6
6
6
6
L208
CN803
LGE Internal Use Only
Connector,BtoB
- 168 -
Remark
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo.
6
6
J501
Description
Jack,Phone
C201,C205,C
Capacitor,Ceramic,Chip
206,C311
PartNumber
Spec
Remark
ENJE0007601
KJA-PH-0-0176 1P 4P ANGLE R/TP 4mM BLACK 6P - KSD CO.,
LTD
ECCH0005604
GRM188R60J106M 10000000 pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm
MURATA MANUFACTURING CO.,LTD.
6
CN401
connector,I/O
ENRY0008801
GU073-5P-SD-E1500 GU073-5P-SD-E1500,5,mm,ANGLE LS Mtron
Ltd.
6
J301
Card Socket
ENSY0025901
GCA26A-8S-H16-M-E1000 SIM 8P ANGLE SMD R/TP - LS Mtron
Ltd.
6
SW101
Connector,RF
ENWY0008701
MS-156C NONE STRAIGHT SOCKET SMD T/REEL AU 50OHM
400mDB HIROSE KOREA CO.,LTD
6
CN402
Connector,Terminal
Block
ENZY0028601
04-9248-003-017-829+ 3P 2.50MM STRAIGHT SMD R/TP KYOCERA ELCO KOREA SALES CO.,LTD.
6
Q501
FET
EQFP0007601
KTJ6131E P-CHANNEL MOSFET -30V +-20 -0.05A 20OHM 100mW
ESM R/TP 3P KEC CORPORAITION
ECCH0007804
CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005 R/TP
0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
C251,C720,C
Capacitor,Ceramic,Chip
724
6
R703
Resistor,Chip
ERHY0000128
MCR01MZP5F1502 15KOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R406
Resistor,Chip
ERHY0000185
MCR01MZP5F8200 820OHM 1% 1/16W 1005 R/TP - ROHM.
6
R110,R111 Resistor,Chip
ERHY0000241
MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R307,R308,R
309,R310,R3 Resistor,Chip
11
ERHY0000275
MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R205
Resistor,Chip
ERHY0003201
MCR01MZP5F1001 1KOHM 1% 1/16W 1005 R/TP - ROHM.
6
R262
Resistor,Chip
ERHY0009505
MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP - ROHM
Semiconductor KOREA CORPORATION
ECZH0000803
C1005C0G1H020CT000F 2pF 0.25PF 50V NP0 -55TO+125C 1005
R/TP - TDK KOREA COOPERATION
6
C115,C265 Capacitor,Ceramic,Chip
6
R207
Resistor,Chip
ERHZ0000486
MCR01MZP5J473 47KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R107
Resistor,Chip
ERHY0009586
MCR006YZPF2201 2.2KOHM 1% 1/20W 0603 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R263
Resistor,Chip
ERHY0024201
MCR01MZP5F6041 6040 ohm,1/16W,F,1005,R/TP ROHM.
6
R404
Resistor,Chip
ERHZ0000201
MCR01MZP5F1000 100OHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R201,R260 Resistor,Chip
ERHZ0000204
MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R510,R511 Resistor,Chip
ERHZ0000205
MCR01MZP5F1004 1MOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
L103,L104,
Inductor,Multilayer,Chip
L117
ELCH0004706
1005GC2T10NJ00 10NH 5% 0V 250mA 0.42OHM 2.5GHZ 8 NON
SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 169 -
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo.
6
6
6
Description
PartNumber
Spec
ERHZ0000206
MCR01MZP5F10R0 10OHM 0.1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
Resistor,Chip
ERHZ0000213
MCR01MZP5F1203 120KOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
R103,R104,R
Resistor,Chip
112,R113
ERHZ0000219
MCR01MZP5F1500 150OHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
R601,R602 Resistor,Chip
R807
6
R405
Resistor,Chip
ERHZ0000236
MCR01MZP5F2001 2KOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R403
Resistor,Chip
ERHZ0000318
MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R272,R302,R
303,R304,R5 Resistor,Chip
01
ERHZ0000405
MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R282,R402 Resistor,Chip
ERHZ0000406
MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R101,R102 Resistor,Chip
ERHZ0000434
MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
Resistor,Chip
ERHZ0000438
MCR01MZP5J203 20KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R219,R266,R
267,R268,R2
Resistor,Chip
69,R401,R50
2
ERHZ0000443
MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R808,R809 Resistor,Chip
ERHZ0000465
MCR01MZP5J332 3.3KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R102,R114 Resistor,Chip
ERHZ0000473
MCR01MZP5J390 39OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
ECCH0000143
MCH155CN102KK 1nF 10% 50V X7R -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION
ERHZ0000484
MCR01MZP5J471 470OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
6
6
R301
C119
Capacitor,Ceramic,Chip
R264,R265 Resistor,Chip
6
R273
Resistor,Chip
ERHZ0000490
MCR01MZP5J510 51OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
U802
IC,Bus Controller
EUSY0300008
PP2106M3 1.8/2.6V 1mA - MLF R/TP 28P - G5 CORPORATION
6
U803
IC,Analog Switch
EUSY0347001
DG2735DN-T1-E4 MiniQFN-10L ,10 PIN,R/TP ,1.8X1.4X0.55,0.6
Dual SPDT Analog Switch ,; ,IC,Analog Switch VISHAY
INTERTECHNOLOGY ASIA PTE LTD
6
U301
IC,MCP,NAND
EUSY0347506
H8BCS0SI0BAR-46M NAND/2G SDRAM/1G 1.7VTO1.9V
14.0x10.0x1.2 TR 149P - - - HYNIX SEMICONDUCTOR INC.
6
U501
IC,LDO Voltage
Regulator
EUSY0355501
RP103K181D-TR-F 1.7V TO 5.25V 1.85V 400mW DFN R/TP 4P RICOH COMPANY, LTD.
6
U701
Module,Assembly
EUSY0385901
TEA5991UK TEA5991_UK,WL-CSP(BSC),20,R/TP,FM Tuner
(RDS),2.6*2.6*0.64 ST-Ericsson Asia Pacific Pte Ltd
LGE Internal Use Only
- 170 -
Remark
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo.
Description
PartNumber
Spec
Remark
6
U401
IC,Voltage Reference
EUSY0410801
RT9524 DFN,10,R/TP,DFN Cal Test Mode Single Charger IC for
Micro USB,IC,ChargerIC,Charger RICHTEK TECHNOLOGY CORP.
6
U703
IC,Bluetooth
EUSY0418701
BCM2070B2KUBXG 2.3VTO5.5V 158.4mW WLBGA R/TP 42P BROADCOM ASIA DISTRIBUTION PTE LTD
ELCH0004703
1005GC2T1N0S00 1005GC2T1N0S00,1 nH,S ,1005 ,R/TP , PILKOR
ELECTRONICS LTD.
6
L112,L119 Inductor,Multilayer,Chip
6
U201
IC,Digital Baseband
Processor,GSM
EUSY0423201
ESC6270 0VTO0V 0W BGA R/TP 424P - QUALCOMM
INCORPORATED.
6
IC401
IC,Analog Multiplexer
EUSY0424801
RT8963WS WLCSP,20,R/TP,MUIC-Basic,USB
HS,UART,Audio,IC,Analog MultiplexerIC,Analog Multiplexer
RICHTEK TECHNOLOGY CORP.
6
X702
Crystal
EXXY0024401
TSX-3225 26MHZ 26MHZ 10PPM 10pF NA SMD R/TP SEIKO
EPSON CORP
6
X202
Crystal
EXXY0025101
DSX321G - 10PPM - - - SMD P/TP DAISHINKU CORPORATION.
6
R261
Resistor,Chip
ERHZ0000222
MCR01MZP5F1503 150KOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R281
Resistor,Chip
ERHY0000279
91K ohm,1/16W,J,1005,R/TP
6
X201
Crystal
EXXY0026901
Q13FC1350000300 32.768KHZ 20PPM 0F NONE SMD R/TP
EPSON TOYOCOM CORP
6
C239
Capacitor,Ceramic,Chip
ECZH0001116
C1005X7R1H271KT000F 270pF 10% 50V X7R -55TO+125C 1005
R/TP - TDK KOREA COOPERATION
SAFO0000501
AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM_1005_DNI
6
R702,R705,R
706,R707,R7
08,R709,R71 PCB ASSY,MAIN,PAD
0,R711,R712 SHORT
,R713,R714,
R715
SAFP0000401
LG-LU3000 LGTBK,MAIN,A,
6
R109,R283,R
Wire Pad,Short
803
SAFP0000501
LG-VS760 VRZ
ELCH0004710
1005GC2T15NJ00 15NH 5% 0V 250mA 0.53OHM 2GHZ 8 NON
SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.
6
6
R284,R814 Wire Pad,Open
L1113,L206 Inductor,Multilayer,Chip
6
PT201
Thermistor
SETY0007301
NCP15WF104F03RC NTC,100000 ohm,SMD,4250K+/1%,100K,1%,0.1mA,4250K+/-1%,SMD,R/TP MURATA
MANUFACTURING CO.,LTD.
6
VA201
Varistor
SEVY0001001
EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMD R/TP
AMOTECH CO., LTD.
6
C137
Capacitor,Ceramic,Chip
ECCH0000196
MCH155A0R75C 0.75pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP ROHM Semiconductor KOREA CORPORATION
6
VA401
Varistor
SEVY0003601
ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE SMD R/TP
INNOCHIPS TECHNOLOGY
6
VA264,
VA265
Varistor
SEVY0005403
ICVS0518270FR 18V 0% 27F 1.0X0.5X0.55 NONE SMD R/TP
INNOCHIPS TECHNOLOGY
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 171 -
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo.
Description
PartNumber
Spec
6
FL101
Filter,Separator,FEM
SFAY0011101
D5008 - - - D5008,850.900 ,1800.1900 ,3.8 dB,4.1 dB, dB, dB,4532
,4.5X3.2 Size Quad Band FEM EPCOS PTE LTD.
6
FB503,
FB504,
FB505
Filter,Bead
SFBH0008102
BLM15HD182SN1 1800 1.0x0.5x0.5MM SMD R/TP 2P MURATA
MANUFACTURING CO.,LTD.
6
FL701
Filter,Ceramic
SFCY0000901
LFB212G45SG8A166 BPF 2.45KHZ 100Hz SMD R/TP 4P MURATA
MANUFACTURING CO.,LTD.
6
FL806,
FL807,
FL808,
FL809
Filter,EMI/Power
SFEY0012401
ICVE10054E250R101FR ESD/EMI 0HZ 25pF 0H SMD R/TP
INNOCHIPS TECHNOLOGY
6
FL802,
FL803,
FL804,
FL805,
FL810,
FL811
Filter,EMI/Power
SFEY0013201
EVRC14S03Q030100R ESD/EMI 0HZ 15pF 0H SMD R/TP
AMOTECH CO., LTD.
6
FL601,
FL602,
FL603
Filter,EMI/Power
SFEY0013701
EVRC18S03Q015100R ESD/EMI 330HZ 15F 0H SMD R/TP
AMOTECH CO., LTD.
6
FL401
Filter,EMI/Power
SFEY0015301
NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TP MURATA
MANUFACTURING CO.,LTD.
6
U101
IC,Power Amplifier
SMPY0019101
SKY77336 SKY77336,dBm,%,A,dBc,dB,5x5,SMD,Polar Edge for
QCT SKYWORKS SOLUTIONS INC.
6
SUMY00
Microphone,Condenser
SUMY0010610
SPM0410LR5H-QB SPM0410LR5H-QB,UNIT,42
dB,4.72*3.76*1.25,mems TDMA Improve KNOWLES ACOUSTICS
5
SAFD00
PCB Assembly,
Main,SMT Top
- SAFD0159501
LG-C320 BOOWA MAIN 1.0
6
EAX010000 PCB,Main
SPFY0235601
SPFY0235601 FR-4 Staggered via STAGGERED-10 0.8 LG-C320i
IDNWA,MAIN,D,FR-4,0.8 mm,STAGGERED-10,MAIN UNITECH
PRINTED CIRCUIT BOARD CORP.
6
C417,C525 Capacitor,Ceramic,Chip
ECCH0000120
MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
Capacitor,Ceramic,Chip
ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP .
SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
C207,C209,C
210,C275,C4
Capacitor,Ceramic,Chip
06,C501,C50
2
ECCH0004904
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP MURATA MANUFACTURING CO.,LTD.
6
C251,C720,C
Capacitor,Ceramic,Chip
724
ECCH0007804
CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005 R/TP
0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
C103
LGE Internal Use Only
- 172 -
Remark
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo.
Description
PartNumber
Spec
Remark
6
C208,C211,C
212,C213,C2
14,C215,C21
6,C217,C218
,C219,C220,
C221,C222,C
223,C229,C2 Capacitor,Ceramic,Chip
31,C235,C23
6,C305,C306
,C307,C308,
C309,C310,C
605,C606,C7
01,C709
ECCH0009101
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -55TO+85C 0603
R/TP - TDK CORPORATION
6
C722,C723 Capacitor,Ceramic,Chip
ECCH0009514
MCH032A(AN)100DK 10pF 0.5PF 25V X7R -55TO+125C 0603 R/TP
- ROHM.
6
C105,C117,C
118,C122,C1
Capacitor,Ceramic,Chip
30,C135,C51
9,C520,C521
ECZH0000830
C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C 1005
R/TP - TDK KOREA COOPERATION
6
C134,C312,C
401,C409,C4 Capacitor,Ceramic,Chip
11
ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005 R/TP
- TDK KOREA COOPERATION
6
C506,C507 Capacitor,Ceramic,Chip
ECZH0001217
GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C 1005 BK-DUP
- MURATA MANUFACTURING CO.,LTD.
6
C204,C261,C
262,C263,C2
64,C266,C27 Capacitor,Ceramic,Chip
6,C299,C302
,C405,C413
ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP
- MURATA MANUFACTURING CO.,LTD.
6
C508,C509 Capacitor,Ceramic,Chip
ECZH0003126
GRM155R71A393K - - - - -55TO+125C - - - MURATA
MANUFACTURING CO.,LTD.
Capacitor,Ceramic,Chip
ECZH0025916
GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C 0603 R/TP MURATA MANUFACTURING CO.,LTD.
6
C268
6
LD801,
LD802
LED,Chip
EDLH0013701
WHITE 2.9~3.2 20mA X(0.264~0.311) Y(0.248~0.315) 110mW
3.8*1.0*0.4t 3810 R/TP 2P -
6
CN801
Connector,BtoB
ENBY0042701
GB042-54S-H10 54P 0.4MM STRAIGHT SOCKET SMD R/TP 1M LS Mtron Ltd.
6
CN260
Connector,BtoB
ENBY0045201
AXT610124 10P 0.4MM STRAIGHT HEADER SMD R/TP 1M - BJ
PANASONIC ELECTRONIC PARTS CO.,LTD
6
R101
Resistor,Chip
ERHY0000254
MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R105,R106,R
107,R108,R1 Resistor,Chip
09,R110
ERHZ0000402
MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R282,R402 Resistor,Chip
ERHZ0000406
MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 173 -
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo.
6
Description
R506,R507 Resistor,Chip
PartNumber
Spec
ERHZ0000435
MCR01MZP5J200 20OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
U601
IC,Charge Pump
EUSY0344403
RT9396GQW QFN,24,R/TP,4CH+2LDO,IC,Sub PMICIC,Sub PMIC
RICHTEK TECHNOLOGY CORP.
6
IC501
IC,Audio Sub System
EUSY0403901
WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P - WOLFSON
MICROELECTRONICS PLC
6
U801
Sensor,Accelerator
EUSY0408901
S-5711ACDL 2.5 to 3.3 Y R/TP 4P - SEIKO INSTRUMENTS INC
6
R284,R814 Wire Pad,Open
SAFO0000501
AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM_1005_DNI
6
R109,R283,
Wire Pad,Short
R803
SAFP0000501
LG-VS760 VRZ
6
VA101,
VA102
Varistor
SEVY0003901
EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP
AMOTECH CO., LTD.
6
VA264,
VA265
Varistor
SEVY0005403
ICVS0518270FR 18V 0% 27F 1.0X0.5X0.55 NONE SMD R/TP
INNOCHIPS TECHNOLOGY
6
FB501,
FB703
Filter,Bead
SFBH0000903
HB-1M1005-601JT 600 ohm 1.0*0.5*0.5 SMD R/TP 2P CERATECH
CORPORATION
6
FB502
Filter,Bead
SFBH0001501
HH-1M1608-121JT 120 ohm 1.6*0.8*0.8 SMD R/TP 2P CERATECH
CORPORATION
6
FB507,
FB508
Filter,Bead
SFBH0009801
HH-1M1005-601JT 600Ohm 1.0 * 0.5 * 0.5 SMD P/TP 2P
CERATECH CORPORATION
LGE Internal Use Only
- 174 -
Remark
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.3 Accessory
Level LocationNo.
2
SBPL00
Note: This Chapter is used for reference, Part order is ordered
by SBOM standard on GCSC
Description
PartNumber
Mobile Phone Battery LiSBPL0098901
Ion
Spec
Remark
LGIP-430N-WW-LGC LGIP-430N-WW-LGC,3.7 V,900 mAh,1
CELL,PRISMATIC ,463450,innerpack, WW LG CHEMICAL
2
EAB010200 Earphone,Stereo
SGEY0003744
EMB-LGE004MSKB 3mW 16OHM 115DB 85HZTO126HZ 1M
BLACK 3.5 L TYPE STEREO 4POLE PLUG - CRESYN CO.,LTD
2
EAY060000 Adapters
SSAD0033602
STA-U34AR STA-U34AR,100-240V,5060 Hz,5.1 V,0.7 A,C-Tick,ACDC ADAPTOR SUNLIN ELECTRONICS CO.,LTD
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 175 -
LGE Internal Use Only
Source Exif Data:
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