Lg C320 Users Manual C320_SVC ENG_101007

LG-C320 to the manual e3475751-5423-4144-b3a9-4de7607efb28

2015-01-26

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Service Manual Model : LG-C320

Internal Use Only

Service Manual

LG-C320

Date: October, 2010 / Issue 1.0

- 3 -

Only for training and service purposes

LGE Internal Use Only

Table Of Contents

1. INTRODUCTION ..................................................................5

1.1 Purpose ............................................................................................... 5

1.2 Regulatory Information ............................................................... 5

1.3 Abbreviations ................................................................................... 7

2. PERFORMANCE ...................................................................9

2.1 Product Name .................................................................................. 9

2.2 Supporting Standard .................................................................... 9

2.3 Main Parts : GSM Solution ........................................................... 9

2.4 HW Features ....................................................................................10

2.5 SW Features ....................................................................................12

2.6 HW SPEC. .........................................................................................14

2.7 C320 Figures ...................................................................................15

3. TECHNICAL BRIEF .............................................................16

3.1 General Description .....................................................................16

3.2 Power management ....................................................................28

3.3 SUB SYSTEM ....................................................................................32

3.4 General Description (RF Part) ..................................................40

3.5 GSM MODE ......................................................................................41

3.6 OFF-CHIP RF COMPONENTS ....................................................44

3.7 OFF-CHIP COMPONENTS ..........................................................46

4. TROUBLE SHOOTING .......................................................50

4.1 Power ON Troubleshooting ......................................................50

4.2 Charger Troubleshooting ..........................................................52

4.3 USB Troubleshooting ..................................................................54

4.4 USIM Detect Troubleshooting .................................................56

4.5 Camera Troubleshooting ...........................................................58

4.6 Main side view LED Troubleshooting ...................................60

4.7 Slide Key side view LED Troubleshooting ...........................61

4.8 LCD Troubleshooting ..................................................................63

4.9 Vibrator Troubleshooting ..........................................................65

4.10 Receiver Path ...............................................................................67

4.11 Headset path ...............................................................................70

4.12 Speaker/Speaker Phone path ...............................................73

4.13 Main microphone ......................................................................78

4.14 Headset microphone ................................................................80

4.15 RF Component ............................................................................82

4.16 RF Path ............................................................................................83

4.17 Trouble Shooting of GSM Part ..............................................84

4.18 Checking Bluetooth Block ......................................................91

4.19 Checking FM Radio Block .......................................................96

5. DOWNLOAD ......................................................................99

6. BLOCK DIAGRAM ........................................................... 112

7. CIRCUIT DIAGRAM ........................................................ 123

8. BGA Pin Map .................................................................. 137

9. PCB LAYOUT ................................................................... 143

10. RF CALIBRATION ......................................................... 149

10.1 Usage of Tachyon for RF Calibration and Test ............. 149

11. TEST ALONE ................................................................. 152

11.1 Phone Test Mode.....................................................................152

12. EXPLODED VIEW & REPLACEMENT PART LIST ......... 157

11.1 EXPLODED VIEW ...................................................................... 157

11.2 Replacement Parts.................................................................. 159

11.3 Accessory ................................................................................... 175

- 4 -

Only for training and service purposes

- 5 -

Only for training and service purposes

LGE Internal Use Only

1. INTRODUCTION

Introduction

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features

of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,

persons other than your company’s employees, agents, subcontractors, or person working on your

company’s behalf) can result in substantial additional charges for your telecommunications services. System

users are responsible for the security of own system.

There are may be risks of toll fraud associated with your telecommunications system. System users are

responsible for programming and configuring the equipment to prevent unauthorized use. The

manufacturer does not warrant that this product is immune from the above case but will prevent

unauthorized use of common carrier telecommunication service of facilities accessed through or connected

to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing

harm or interruption in service to the telephone network, it should disconnect telephone service until repair

can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these

changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the

telephone company is required to give advanced written notice to the user, allowing the user to take

appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent.

The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,

note that unauthorized alternations or repair may affect the regulatory status of the system and may void

any remaining warranty.

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Only for training and service purposes

1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local

regulatory agencies. In accordance with these agencies, you may be required to provide information such as

the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from

unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following

information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also

grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

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Only for training and service purposes

LGE Internal Use Only

1. INTRODUCTION

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΀ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ

ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ 6/140

1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:

Offset Phase Locked LoopOPLL

Light Emitting DiodeLED

Low Drop OutputLDO

Liquid Crystal DisplayLCD

Intermediate FrequencyIF

International Portable User IdentityIPUI

Global System for Mobile CommunicationsGSM

General Purpose Interface BusGPIB

Gaussian Minimum Shift KeyingGMSK

Flexible Printed Circuit BoardFPCB

Electrostatic DischargeESD

Electrical Erasable Programmable Read-Only MemoryEEPROM

Digital Signal ProcessingDSP

dB relative to 1 milli wattdBm

Digital Communication SystemDCS

Digital to Analog ConverterDAC

Constant Current – Constant VoltageCC-CV

Bit Error RatioBER

BasebandBB

Automatic Power ControlAPC

1. INTRODUCTION

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Only for training and service purposes

1. INTRODUCTION

ʹΠΡΪΣΚΘΙΥ͑ι ͣͨ͑͡͡ͽ͸͑ͶΝΖΔΥΣΠΟΚΔΤ͑͟ͺΟΔ͑͑͟ͲΝΝ͑ΣΚΘΙΥ͑ΣΖΤΖΣΧΖΕ͑͟

΀ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ

ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ 7/140

Wireless Application Protocol

WAP

Voltage Control Temperature Compensated Crystal OscillatorVCTCXO

Voltage Controlled OscillatorVCO

Universal Asynchronous Receiver/TransmitterUART

Time Division Multiple AccessTDMA

Time Division DuplexTDD

Travel AdapterTA

Side Tone Masking RatingSTMR

Pseudo SRAMPSRAM

Static Random Access MemorySRAM

Sending Loudness RatingSLR

Subscriber Identity ModuleSIM

Surface Acoustic WaveSAW

Real Time ClockRTC

Root Mean SquareRMS

Receiving Loudness RatingRLR

Radio FrequencyRF

Public Switched Telephone NetworkPSTN

Phase Locked LoopPLL

Programmable Gain AmplifierPGA

Printed Circuit BoardPCB

Power Amplifier ModulePAM

1. INTRODUCTION

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Only for training and service purposes

LGE Internal Use Only

2. PERFORMANCE

2.1 Product Name

C320 : EGSM/GSM850/DCS/PCS

(GPRS Class 12 / EDGE Class 12)

2.2 Supporting Standard

Item Feature Comment

Supporting Standard EGSM/GSM850/DCS1800/PCS1900

with seamless handover

Phase 2+(include AMR)

SIM Toolkit : Class 1, 2, 3, C-E

Frequency Range EGSM TX : 880 – 915 MHz

EGSM RX : 925 – 960 MHz

GSM850 TX : 824 – 849 MHz

GSM850 RX : 869 – 894 MHz

DCS1800 TX : 1710 – 1785 MHz

DCS1800 RX : 1805 – 1880 MHz

PCS1900 TX : 1850 – 1910 MHz

PCS1900 RX : 1930 – 1990 MHz

Application Standard WAP 2.0, JAVA 2.0

2.3 Main Parts : GSM Solution

Item Part Name Comment

Digital Baseband ESC6270 : Qualcomm

Analog Baseband ESC6270 : Qualcomm

RF Chip ESC6270 : Qualcomm

Phase 2+(include AMR)

SIM Toolkit : Class 1, 2, 3, C-E

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Only for training and service purposes

2. PERFORMANCE

2.4 HW Features

Item Feature Comment

Form Factor Slide type

1) Capacity

Standard : Li-Ion, 900 mAh

Battery

2) Packing Type : Soft Pack

Size Standard : 91 x 63 x 15.9 mm

Weight 115.6g With Battery

Volume TBD

PCB Stag type, 10 Layers , 0.8t

Stand by time Up to 300 hrs @ Paging Period 5

Charging time Up to 3 hrs @

Talk time 2G Up to 3.4hr @ Tx=Max(2G)

RX sensitivity EGSM : -105 dBm

GSM850 : -105 dBm

DCS 1800 : -105 dBm

PCS 1900 : -105 dBm

GSM/

GPRS

EGSM : 33dBm

GSM850 : 33 dBm

DCS 1800 : 30 dBm

PCS 1900 : 30 dBm

Class4 (EGSM)

Class4 (GSM850)

Class1 (PCS)

Class1 (DCS)

output

power

EDGE GSM 900 : 27 dBm

GSM 850 : 27 dBm

DCS 1800 : 26 dBm

PCS 1900 : 26 dBm

E2 (GSM900)

E2 (GSM850)

E2 (PCS)

E2 (DCS)

GPRS compatibility GPRS Class 12

EDGE compatibility EDGE Class 12

SIM card type Plug-In SIM

3V /1.8V

Display 2.4” TFT QVGA landscape

Built-in Camera 2M FF SOC Camera

Status Indicator Yes

Keypad

ANT Main : Internal Fixed Type

System connector 5 Pin

Ear Phone Jack 3.5Phi, 4 Pole, Stereo

PC synchronization Yes

Memory NAND Flash : 2Gbit

SDRAM : 1Gbit

Speech coding FR, EFR, HR,AMR

Data & Fax Built in Data & Fax support

Vibrator Built in Vibrator

BlueTooth V2.1 + EDR

MIDI(for Buzzer

Function)

SW Decoded 64Poly

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Only for training and service purposes

LGE Internal Use Only

2. PERFORMANCE

Music Player MP3/AAC/AAC+/WMA

Video Player PEG4, H.263,H.264 30fps@QVGA

WMV 15fps@QCIF

Camcorder MPEG4, 15fps@QVGA

Voice Recording Yes

Speaker Phone mode

Support

Yes

Travel Adapter Yes

CDROM No

Stereo Headset Yes

Data Cable Yes

T-Flash

(External Memory)

Yes

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Only for training and service purposes

2. PERFORMANCE

2.5 SW Features

Item Feature Comment

RSSI 0 ~ 7 Levels

Battery Charging 0 ~ 3 Levels

Key Volume 0 ~ 7 Level

Audio Volume 1 ~ 20 Level

Time / Date Display Yes

Multi-Language Yes English / Chinese Trad. / Chinese Simp.

/ Thai / Korean / Malay / Indonesian /

Vietnamese

Quick Access Mode Dialing / Contact / Menu /

Message / Camera

PC Sync Yes PC suite 4

Speed Dial Yes Voice mail center -> 1 key

Profile Yes not same with feature phone setting

CLIP / CLIR Yes

Phone Book Name + 5 Numbers + 1 Memo + 2

e-mail + 3 Group Select + Picture +

Ringtone + Anniversary day

1000 + SIM

Last Dial Number Yes Total Call DB Max 100

LDN (SIM) N/A

Last Received

Number

Yes Total Call DB Max 100

LDN (SIM) N/A

Last Missed Number Yes Total Call DB Max 100

LDN (SIM) N/A

Search by Number

/ Name

Name and Number

Group Yes 30

Fixed Dial Number Yes

Service Dial Number No

Own Number Yes Read only

(add/edit/delete are not supported)

Voice Memo Yes Support voice recorder

Call Reminder Yes

Network Selection Automatic

Mute Yes

Call Divert Yes

Call Barring Yes

Call Charge (AoC) Yes

Call Duration Yes

SMS (EMS) Yes (1000+SIM) EMS : Release4

(Except Text align)

SMS Over GPRS Yes

EMS Melody / Picture

Send / Receive / Save

Yes

(Receive only)

MMS MPEG4

Send / Receive / Save

Yes

Long Message MAX 1000 Characters SMS 7pages

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Only for training and service purposes

LGE Internal Use Only

2. PERFORMANCE

Cell Broadcast Yes

Download Over the WAP

Game Yes

Calendar Yes

Memo Yes 100

World Clock Yes

Unit Convert Yes

Stop Watch Yes

Wall Paper Yes

WAP Browser Over WAP 2.0 Obigo

Download Melody /

Wallpaper

Yes Over WAP

SIM Lock Yes Operator Dependent

SIM Toolkit Yes R99

MMS Yes Obigo +LG MMS Client

EONS No

CPHS Yes V4.2

ENS No

Camera Yes 2M FF

JAVA Yes CLDC V1.1 / MIDP V2.1

Download Over WAP

Voice Dial No

IrDa No

Bluetooth Yes BT 2.1+EDR

HFP/HSP/A2DP&AVRCP

/OPP/BPP/PBAP/SPP/

FM radio Yes

GPRS Yes Class 12

EDGE Yes Class 12

Hold / Retrieve Yes

Conference Call Yes Max. 6

DTMF Yes

Memo pad Yes

TTY No

AMR Yes

SyncML No

IM Yes JAVA midlet (neustar)

Email Yes

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Only for training and service purposes

2. PERFORMANCE

2.6 HW SPEC.

1) GSM transceiver specification

Item Specification

Phase Error Rms : 5°

Peak : 20 °

Frequency Error GSM : 0.1 ppm

DCS/PCS : 0.1 ppm

EMC(Radiated Spurious Emission

Disturbance) GSM/DCS : < -28dBm

Transmitter Output power and Burst

Timing

GSM : 5dBm – 33dBm ± 3dB

DCS/PCS : 0dBm – 30dBm ± 3dB

Burst Timing <3.69us

Spectrum due to modulation out to less

than 1800kHz offset

200kHz : -36dBm

600kHz : -51dBm/-56dBm

Spectrum due to modulation out to

larger than 1800kHz offset to the edge

of the transmit band

GSM :

1800-3000kHz :< -63dBc(-46dBm)

3000kHz-6000kHz : <-65dBc(-46dBm)

6000kHz < : < -71dBc(-46dBm)

DCS :

1800-3000kHz :< -65dBc(-51dBm)

6000kHz < : < -73dBc(-51dBm)

Spectrum due to switching transient 400kHz : -19dBm/-22dBm(5/0), -23dBm

600kHz : -21dBm/-24dBm(5/0), -26dBm

Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)

Usable receiver input level range 0.012(-15 - -40dBm)

Intermodulation rejection – Speech

channels

± 800kHz, ± 1600kHz

: -98dBm/-96dBm (2.439%)

AM Suppression

TGSM : -31dBm

- DCS : -29dBm

-98dBm/-96dBm (2.439%)

Timing Advance ± 0.5T

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Only for training and service purposes

LGE Internal Use Only

2. PERFORMANCE

2.7 C320 Figures

- 16 -

Only for training and service purposes

3. TECHNICAL BRIEF

2. Base Band Technical Description

3.1 General Description

QSC6270 (3G disable)has all eight major functional blocks as like Figure 3.1

Figure 3.1 QSC6270(3G disable) Base band block

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Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

3.1.1 Processor

The QSC6270(3Gdisable) device integrates multiple processors on-chip: one ARM microprocessor and two

DSP processors. Each processor is part of a functional subsystem:

The micro subsystem includes the ARM926EJ-S microprocessor.

The modem subsystem includes the QDSP4u8 digital signal processor (mDSP).

The application subsystem includes the QDSP4u8 application digital signal processor(aDSP).

Figure 3.1.1 Processors and bus architecture

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Only for training and service purposes

3. TECHNICAL BRIEF

3.1.2 Memory support (and LCD interface)

The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2.

EBI1 supports high-speed synchronous dynamic devices. Its memory controller supports the new mobile

DDR SDRAM memories with its higher bandwidth and ability to run at high clock frequencies. This

interface supports the high-bandwidth, high-density, and low-latency requirements of the QSC’s

advanced on-chip capabilities such as the ARM9 processor, highperformance graphics, and video

applications.

EBI2 is the slower speed interface intended to support memory devices such as NAND flash and

asynchronous SRAM, peripheral devices such as LCDs, and the UBM receiver for multicast or

broadcast reception (QSC6270 only). In addition, EBI2 is required to support a synchronous-burst

AAD NOR flash to enable a NOR/DDR SDRAM memory configuration because the simultaneous mode

(NOR, SDRAM) is not supported on the EBI1 bus.

The ARM926EJ-S microprocessor is a cached processor and all its accesses to external memory use burst

techniques of four or eight 32-bit words when the memory region is declared to be

cacheable/bufferable. To take advantage of this QSC higher performance feature, data from

memories must satisfy the requirements for these burst accesses.

Figure 3.1.2.1 The memory control blocks of C320

QSC6270

NAND Flash

(1Gbit)

SDRAM

512Mbit)

NAND_DATA[ 0: 15]

NAND__CS__N

NAND_LB_N

NAND_UB_N

NAND_OE_N

NAND_WE_N

NAND_BSY_N

NAND_WP_N

_CE

ALE

CLE

_RE

_WE

RY_BY

_WP

IO[1: 16]

DDR_A[0:13]

DDR_M_CLK_N

DDR_CKE[0]_

DDR_CS[0]_N_

DDR_RAS_N

DDR_CAS_N

DDR_WE_N_ _

DDR_DQM[0:1]_

DDR_D[0:15]

CLK

CKE

_CS

_RAS

_CAS

_WED

DQM

ADDR

EBI1 EBI2

(3G disable)

USIM

(SIM PLUS)

SIM_CLK

_ _

SIM_DATA

MUSIM_DM

MUSIM_DP

SIM_RST_N

External

Memory

( MICRO SD)

MSD_D[0:3]

MSD_CMD

MSD_CLK

3.1.2 Memory support (and LCD interface)

The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2.

EBI1 supports high-speed synchronous dynamic devices. Its memory controller supports the new mobile DDR

SDRAM memories with its higher bandwidth and ability to run at high clock frequencies. This interface supports

the high-bandwidth, high-density, and low-latency requirements of the QSC’s advanced on-chip capabilities such

as the ARM9 processor, highperformance graphics, and video applications.

EBI2 is the slower speed interface intended to support memory devices such as NAND ﬂash and asynchronous

SRAM, peripheral devices such as LCDs, and the UBM receiver for multicast or broadcast reception (QSC6270 only).

In addition, EBI2 is required to support a synchronous-burst AAD NOR ﬂash to enable a NOR/DDR SDRAM memory

conﬁguration because the simultaneous mode (NOR, SDRAM) is not supported on the EBI1 bus.

The ARM926EJ-S microprocessor is a cached processor and all its accesses to external memory use burst

techniques of four or eight 32-bit words when the memory region is declared to be cacheable/buﬀerable. To take

advantage of this QSC higher performance feature, data from memories must satisfy the requirements for these

burst accesses.

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Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

QSC6270

(3G disable)

QVGA Main

LCD

(2.4", 320x240)

EBI2_DATA[15:0]

LCD_ADS

LCD_CS_N

EBI2_WE_N

LCD_RST

LDO_LCD_2.8V

WLED_PWR

LCD_IF(2:1)

LDO_LCD_1.8V

Figure 3.1.2.2 The LCD interfaces of C320

- 20 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.1.3 Connectivity

QSC6270 has connectivity features as below

– USB-OTG; USB LS, FS, and HS (2.0 compliant)

– I2C compatible for peripheral controls (1.8 V)

– UART: up to 4 Mbps

– Bluetooth 2.0 support via external SoC

– WLAN via external device (SDIO)

– NFC via external module (I2C)

– FM radio via external module (I2C)

– USIM, SIM, and USB-UICC support; 1.8 and 3 V

– Keypad interface

– SPI (master only) for peripheral support

– Two secure digital controllers — WLAN and secure digital (SD) cards

Figure 3.1.3 The connectivity of BL20

QSC6270

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Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

Figure 3.1.4 GPIOs of C320

3.1.4 GPIOs

QSC6270 (3G disable has 78 configurable I/O pins

UART_BT_SEL

MUIC_INT_N

CHG_EN_N

BT_WAKEUP_HOST

CHG_STS_N

HALL_SENS_DET

MUIC_AUD_FM_I2C_SCL

MUIC_AUD_FM_I2C_SDA

BL_LCD_CAM_LDO_I2C_SCL

HS_JACK_DET

WLAN_BT_REG_ON

WLAN_CLK

LCD_IF_MODE[0]

BL_LCD_CAM_LDO_I2C_SDA

WLAN_RST_N

BL_LCD_CAM_LDO_EN

BT_RST_N

WLAN_CMD

LCD_RST_N

WLAN_SDIO[3]

WLAN_SDIO[0]

WLAN_SDIO[1]

WLAN_SDIO[2]

BT_PWR_ON

MUSIM_DM

MUSIM_DP

Low : UART Comm

High : BT UART

- 22 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.1.5 Air interfaces

The supported air-interface standards and features include: (See the RF technical description)

GSM/GPRS/EDGE Specification Release 4 (3GPP R4)

Enhanced GPS position location using gpsOne (with RGR6240 IC)

Integrated gpsOne functionality, featuring enhancements by SnapTrack®, Inc., to enable a wide variety of

location-based services and applications, including points of interest, personal navigation, and friend finder

Simultaneous-GPS (processes GPS using dedicated circuitry while voice and/or data signals continue to be

processed separately)

1024x searcher, direct facility termination (DFT) accelerator, off-chip RAM for measured data storage

3.1.6 Internal base band functions

Several baseband circuits within the QSC6270(3G disable)device provide functions that are necessary only to

make the device operate properly — these functions are not generally used directly by other

handset circuits and functions.

PLLs and clock generation

Modes and resets

Security

Qfuse

JTAG/ETM

The clock block includes two PLLs, all phase-locked to the TCXO signal. These PLLs generate several

different stable, low-jitter clock signals that are distributed throughout the QSC device and to external c

omponents as needed.

All the required WCDMA, GSM, GPS(only QSC6270), ARM, QDSP, and most peripheral clocks are derived in

some way from the TCXO (or XO) source for their operating modes, plus the 32.768 kHz

oscillator for their sleep modes

Figure 3.1.6 Clock block basic architecture of QSC6270(3G disable)

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Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

3.1.7 Multimedia

Multimedia topics are as below in QSC6270, including:

Camera interface and video front-end

Mobile display processor

Additional multimedia support: video, audio, graphics, and messaging

3.1.7.1 Camera interface and video front-end

The camera interface (CAMIF) connects the QSC62x0 device directly to a camera sensor. Typical applications

include Qcamera, Qcamcorder, and QvideophoneThe CAMIF delivers the raw 10-bit Bayer pattern data

(preferred) to the video front-end (VFE) that performs the required image processing (RGB-triplet generation,

color-space conversion, auto-white balance, auto exposure, gamma correction, etc.) and prepares the image

for capture or transmission. The QSC device also supports a YUV 4:2:2 input from the sensor

(8-bit, 2:1 MUX YUV or CCIR656 YUV).

The video capabilities of the two QSC devices varies slightly, with the QSC6270 providing higher performance

than the QSC6270 device — greater resolution, higher capture and streaming rates, etc.

- 24 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.1.7.2 Mobile display processor

The MDP is a hardware accelerator primarily responsible for transferring an updated image from the QSC

memory subsystem to the LCD module. The transferring of an updated image is an operation that is shared

between software, video processing, and graphics processing, so a common block helps to reduce

redundant circuitry. The MDP is designed with the assumption that the LCD panel has an embedded LCD

controller and a frame buffer. The image transfer is then the copying of the image from the QSC memory

system to the frame buffer within the LCD module.

While the MDP is transferring an image to the LCD module, it can perform a final set of operations to the

image. The set of operations that the MDP can perform has been chosen to maximize the efficiency of the

QSC memory subsystems, typically removing two or more copy operations of the image to and from

memory.

The MDP reduces redundant circuitry and offloads the ARM and aDSP from memory-transfer operations and

a certain set of graphics and video operations

Figure 3.1.7.2.1 MDP-to-LCD interface functional block diagram

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Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

Figure 3.1.7.2.2 The LCD interface of C320

C102

0.1u0.1u

C101

CN102

101R

201R 1

VLDO_LCD_1V8 VLDO_LCD_2V8

LCD_MAKER_ID

LCD_RD

WLED3

WLED2

WLED1

LCD_VSYNC_OUT

LCD_RS

LCD_DATA[7]

LCD_DATA[6]

LCD_DATA[5]

LCD_DATA[4]

LCD_DATA[3]

LCD_DATA[2]

LCD_DATA[1]

LCD_DATA[0]

LCD_WR_N

LCD_CS_N

LCD_RST_N

LCD_DATA[15]

LCD_DATA[14]

LCD_DATA[13]

LCD_DATA[12]

LCD_DATA[11]

LCD_DATA[10]

LCD_DATA[9]

LCD_DATA[8]

LCD_IF_MODE[0]

WLED4

WLED5

LCD_IF_MODE[1]

WLED_VOUT

- 26 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.1.8 UART

̰One universal asynchronous receiver transmitter (UART) port that supports low-speed, full-speed,

and high-speed modes

̰Serial data port communications that conform to the RS-232 interface protocol

̰Used for data transport during Bluetooth operation (BTS402x™ SoC required)

̰Other possible uses:

– Test and debug

– External keypad

– Ringer

– Load/upgrade system software

̰Separate FIFOs for Rx and Tx

̰Supporting circuits include:

– Interrupt control

– Clock source

– Bit-rate generator (BRG)

– Microprocessor interface

̰Flow control is not available on UART2 (behind USIM)

3.1.9 USB

̰Each USB link has a host and a peripheral; the host is responsible for initiating and controlling bus traffic

̰The USB specification requires PCs to act as hosts, and other devices such as printers, keyboards, mice, etc.,

to act as peripherals

̰USB 2.0 implementation defines three modes

- Low-speed (LS): 1.5 Mbps

- Full-speed (FS): 12 Mbps

- High-speed (HS): 480 Mbps

̰The QSC62x0 is compliant with the USB 2.0 specification

- All three modes are supported when acting as a host

- FS and HS are supported when acting as a peripheral

̰The QSC62x0 has two USB controllers

- Primary USB controller

- Secondary USB controller

̰The primary USB controller is supplemented by an integrated physical layer (PHY)

3.1.10 HKADC

The HKADC includes an analog multiplexer that selects an input for the sample and

hold circuit. One of three inputs can be selected:

HKAIN1, pin R22 – an external connection that is available as a general-purpose input,

though it is often used to monitor the power amplifier(s) temperature.

An on-chip connection to the power management circuit’s analog multiplexer output. This allows monitoring of:

-. Key power supply nodes such as VBAT, VCHG, etc.

-. Multipurpose pins (when configured as analog inputs)

-. A few on-chip parameters such as the die temperature or VREF

- 27 -

Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

QSC6270HKADC Block diagram

- 28 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.2 Power management

3.2.1 Input power management

Valid external supply attachment and removal detection

Unregulated (closed-loop) external charger supply as input power source

Integrated PFET charging pass transistor; eliminated sense resistor

Support for lithium-ion and lithium-ion polymer main batteries; nickel-based batteries are not supported

Trickle, constant current, constant voltage, and pulse charging of the main battery

Autonomous charging option – driven by an on-chip state machine without software intervention

Software-controlled charging option – backwards-compatible with previous QSC and PM products

Coin-cell battery (including charging)

Battery-voltage detectors with programmable thresholds

VDD collapse protection

Charger-current regulation and real-time monitoring for overcurrent protection

Charger-transistor protection by thermal control

Control drivers for the internal charging PFET and external battery PFET

Voltage, current, and thermal control loops

Automated recovery from sudden momentary power loss (requires external32.768 kHz crystal)

Figure 3.2.1 Input circuits schematic diagram

- 29 -

Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

3.2.2 Output voltage regulation

The QSC62x0 device includes all the regulated voltages needed for most low-cost wireless

handset applications (and many other applications). Independent regulated power sources are

required for various electronic functions to avoid signal corruption between diverse circuits,

support power-management sequencing, and meet different voltage-level requirements. Sixteen

voltage regulators are provided — all programmable, all derived from a common bandgap reference circuit.

Three major types of voltage regulator circuits are on-chip:

Three positive voltage switched-mode power supply (SMPS) circuits

- One boost converter (rated for 600 mA)

- Three buck converters (rated for 500 mA each)

Thirteen positive voltage linear regulators

- Four rated for 300 mA

- Six rated for 150 mA

- Three rated for 50 mA

One negative voltage charge pump rated for 200 mA, referred to as a negative charge pump(NCP)

Each regulator has two logic-OR input bits; a logic high at either input enables that regulator:

A master bit that enables all regulators according to their default condition

A dedicated bit that enables only that regulator

The master enable reduces the number of write cycles needed when switching between the phone’s

sleep and active modes.

Additional comments that apply to regulator functions:

If a regulator’s default condition is on, that regulator will power on automatically at QSC startup.

The MSMP regulator must be on to allow internal communications between major functional blocks.

Each regulator and SMPS can provide more than its rated output current, though some

performance characteristics might be degraded.

All regulated output voltages are programmable.

All regulators can be set to a low-power mode except the VREG_USB_3P3 and VREG_NCP circuits

- 30 -

Only for training and service purposes

3. TECHNICAL BRIEF

Table 3.2.2 Voltage regulator summary

1. All regulator names are based on their intended use, though some may be used to power alternate

functions. For example, the USIM regulator is intended to power an external SIM card but may be used to

power other circuits (or not used at all).

2. Each current listed in this table is its regulator's rated value – the current at which the regulator meets all its

performance specifications. Higher currents are allowed, but higher input voltages may be required and

some performance characteristics may become degraded. See the appropriate regulator sections for details.

3. VREG_MSMP powers key internal circuits and should be kept on at its default voltage setting.

4. All regulators have default output voltage settings, even if they default to an off condition.

- 31 -

Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

3.2.3 Charging control

C320 use single Charger.

- Single charger has five mode like “ OFF / TRICKLE / ISET / USB500 / FACTORY mode”.

- Single Charger is working as ISET mode in case of CC(Constant Current), CV(Constant Voltage) mode,

as USB 500mode in case of USB Charging.

- FACTORY mode is working only for Factory use.

p

j

j

ylT

kGG

kGuv{G

VBUS_LDO_4V9

CHG_STS_N

MUIC_IO_M

MUIC_IO_P

MUIC_ACC_ID

- 32 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.3 SUB SYSTEM

3.3.1 KEY PAD

C320 have a key-coder IC that supports eight sense lines, or columns, and eight keypad rows.

The device scans and encodes 64 matrix – addressed keys on keypads . Key press and release events are stored

in a FIFO buffer with 16 event lengths for uploading to a host processor. The event data stored will indicate the

sequence of events and which keys set pressed or released.

25pF

VREG_MSME_1V8

KEY_COL7

KEY_COL6

- 33 -

Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

̰SDRAM

-16-bit low-power DDR SDRAM

-Minimum size per chip-select: 16 MB (128 Mbit)

-Maximum size per chip-select: 128 MB (1 Gbit, 1 k columns only)

Characteristics of the EBI1 clock are listed below:

-Maximum clock rate is 92 MHz, defined by the AMSS software.

-The EBI1 memory controller clock is synchronous to the bus clock (HCLK).

EBI2 Features

EBI2 is used to interface with slower memory and peripheral devices (NAND flash, burst NOR, LCDs, etc.).

The following EBI2 devices are supported:

̰NAND flash

-8/16 bit, single-level cell (SLC)/multi-level cell (MLC) 512/2048-byte page devices

-DMA support

-Boot-up capability from the above devices

̰Burst NOR flash

-16-bit multiplexed AAD burst NOR devices

̰8/16/18-bit (write only) LCD devices (both Motorola and Intel style)

Characteristics of the EBI2 clock are listed below:

̰The maximum clock rate is 46 MHz, defined by the AMSS software.

̰The EBI2 memory controller operates at HCLK/2.

̰Broadcasting and multicasting (QSC6270 only, with MBP1600 IC) are based on:

-Wideband MediaFLO™, DBV-H, and ISDB-T

Asynchronous/burst controller (EBI1 and EBI2)

The external memory controller (xmem_ctlr) forms the asynchronous/burst controller for both EBI1 and EBI2 in

the QSC62x0 device. The controller is generic in terms of its software programmable options and can be

customized when used for EBI1 and EBI2. This block has been enhanced in the QSC62x0 device to support 32-bit

burst memories and byte masking during write operations.

3.3.2 External memory interface

The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2.

EBI1 supports high-speed synchronous dynamic devices. Its memory controller supports the new mobile DDR

SDRAM memories with its higher bandwidth and ability to run at high clock frequencies. This interface supports

the high-bandwidth, high-density, and low-latency requirements of the QSC’s advanced on-chip capabilities

such as the ARM9 processor, highperformance graphics, and video applications.

EBI2 is the slower speed interface intended to support memory devices such as NAND flash and asynchronous

SRAM, peripheral devices such as LCDs, and the UBM receiver for multicast or broadcast reception (QSC6270

only). In addition, EBI2 is required to support a synchronous-burst AAD NOR flash to enable a NOR/DDR SDRAM

memory configuration because the simultaneous mode (NOR, SDRAM) is not supported on the EBI1 bus.

EBI1 Features

EBI1 is a high-performance external memory interface for the QSC62x0 digital block that supports DDR SDRAM

devices Specifically, the following memory devices are supported on EBI1:

- 34 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.3.3 Camera Interface ( 2M CAMERA )

3.3.3.1 2M CAMERA

C320 Installed a 2M Pixel Camera. Below picture shows the camera board to board connector and

camera I/F signal.

- 35 -

Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

- 36 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.3.4 LCD Module (LQ024Q3UX01 : SHARP)

The DM24-DSM04 model is a Color TFT LCD supplied by LG Innotek.

This main Module has a 2.4 inch diagonally measured active display area with 320(RGB) X 240 resolution.

Each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes.

Main LCD color is determined with 262k colors signal for each pixel.

The DM24-DSM04 has been designed to apply the interface method that enables low power, high speed, and

high contrast. The DM24-DSM04 is intended to support applications where thin thickness and low power are

critical factors and graphic displays are important

GENERAL DESCRIPTION

- 37 -

Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

Input Signal and Power : Pin Description ( Input Pin : 35 )

PIN DESCRIPTION

- 38 -

Only for training and service purposes

3. TECHNICAL BRIEF

- 39 -

Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

3.3.5 Audio Signal Processing & Interface

Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal

from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (QSC6270). This

transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset. The downlink

path amplifies the signal from DBB chip (QSC6270) and outputs it to receiver (or speaker).

The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. The outputs

earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_OP, LINE_ON) are differential outputs. Earphone2 (HPH_L,

HPH_R) is a single-ended output stage designed to drive a headset speaker. The microphone interface consists

of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier.

- 40 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.4 GENERAL DESCRIPTION

The RF platform of C320 supports four communication bands (GSM850 / GSM900 / GSM1800 / GSM1900).

The all the RF blocks can be divided into two main parts, which are a GSM, and an antenna switch Mode.

The simplified block diagram is shown in Figure 3.4

[Figure 1.1] Block diagram of RF part

(RF Part)

3.4

- 41 -

Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

3.5 GSM MODE

The EDGE/GPRS/GSM transceiver use a digital interface that is shared between receive and transmit data.

The receive interface is based on I and Q data and the transmitter interface is based on envelop and

frequency data.

The quad band EDGE/GSM/GPRS transceiver has the following general features:

Power class

GMSK low bands: Class 4 (33 dBm)

GMSK high bands: Class 1 (30 dBm)

8PSK low bands: Class E2 (27 dBm)

8PSK high bands: Class E2 (26 dBm)

Multi slot class 12 (4+4=5)

Dual Transfer Mode (DTM) class 9 (3+2=5)

Zero-IF receiver

-Polar modulation transmitter

3.5.1 GSM RECEIVER

The RF receiver designs are leveraged from previous-generation RTR devices, including the latest innovations.

All ESC receiver paths are discussed in this section.

The ZIF receive signal paths support multiband, multimode applications:

Quad-band GSM:

Low-band

GSM 850 (869 to 894 MHz) and GSM 900 (925 to 960 MHz)

High-band

DCS1800 (1805 to 1880 MHz) and PCS1900 (1930 to 1990 MHz)

The on-chip receive signal paths are functionally identical for each mode (GSM or EDGE) and each band type

(low or high). The external circuitry includes the antenna switch module and a filter function.

All RF Rx inputs use a differential configuration to maximize common-mode rejection, Tx isolation, out-of-

band suppression, and second-order intermodulation performance. The first of two quadrature

downconverters accepts inputs from two LNAs (only one is active at a time). An example application could

support the following bands using these two LNAs:

GSM 1900

GSM 850

- 42 -

Only for training and service purposes

3. TECHNICAL BRIEF

The second downconverter accepts inputs from another two LNAs (again, just one is active at time) and is

dedicated to GSM 900 and GSM 1800 operation.

The two downconverter outputs drive analog baseband filters and buffer circuits that are programmed to

support the active operating mode’s waveforms (GSM or EDGE). The analog baseband signals are then

digitized by analog-to-digital converters (ADCs) whose outputs are routed to the digital baseband circuits for

further processing.

Numerous secondary Rx functions are also integrated: Rx frequency synthesizers (each having their own PLL

and VCO circuits), LO generation and distribution circuits, reference and clock circuits for the ADCs, and

various interface, control, and status circuits. Power reduction features (such as selective circuit powerdown,

gain control, and bias control) extend handset standby time.

Like the Tx LO, all Rx LO circuits are completely integrated. All received LO signals are generated by the on-

chip Rx VCOs under control of their PLLs.

[Figure 3.5.1] QSC GSM receiver signal paths functional diagram

- 43 -

Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

3.5.2 GSM TRANSMITTER

The RF transmitters are leveraged from previous-generation RTR™ devices, including the latest innovations.

The ESC transmitter paths and Tx power-detector input are discussed in this section. It provides the zero-IF

(ZIF) transmit signal paths for multiband, multimode applications:

Quad-band GSM:

Low-band

GSM 850 (869 to 894 MHz) and GSM 900 (925 to 960 MHz)

High-band

DCS1800 (1805 to 1880 MHz) and PCS1900 (1930 to 1990 MHz)

The transmit signal paths include a shared set of baseband amplifiers, a dedicated quadrature upconversion

for each band-type (low and high), gain control RF amplification, and multiple output driver amplifiers for

each band-type. Two GSM output drivers support one low-band and one high-band type (but each GSM

band-type is dual-band). The GSM transmitters in polar PA configuration are also supported by a PA envelope

control path, plus the ability to route LO signals to the transmit chains for test and calibration purposes. In

linear PA configuration, phase and envelope paths are combined inside the ESC and amplified using a

multistage linear PA.

Numerous secondary Tx functions are also integrated: a reference for the transmit DACs, the Tx phase-locked

loop (PLL), the Tx OSC circuit, the Tx LO generation and distribution circuits, an RMS Tx power detector, and

various interface, control, and status circuits.

The RF transmitter interfaces internally with the baseband circuits for its analog baseband input and status

and control signaling. Power reduction features controlled by baseband circuits (such as selective circuit

powerdown, gain control, and transmit puncturing) extend handset talk time. The driver amplifier outputs

are routed externally to the final stages of the transmit chains, culminating with the antenna switch whose

output drives the antenna.

Sophisticated Tx LO circuits implement the frequency plan and are completely integrated on-chip. All Tx LO

signals are generated by the on-chip Tx OSC under the control of its PLL.

[Figure 3.5.2] QSC GSM transmitter signal paths functional diagram

- 44 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.6 OFF-CHIP RF COMPONENTS

3.6.1 D5008 (FL101: FEM)

Low-loss SAW frontend module for mobile telephone system

Covering GSM850, GSM900, GSM1800 and GSM1900 bands

Integration of Tx low pass filters, switch, de-coder and diplexing network between GSM Filters

Integration of GSM850, GSM900, GSM1800 and GSM1900 Rx SAWs

Balanced outputs of all Rx ports

Integration of ESD protection at Ant port to 8kV acc. IEC-61000-4-2 (contact discharge)

[Figure 3.6.1] Block diagram of FEM

[Table 3.6.1] Control table of FEM

- 45 -

Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

3.6.2 GSM850/EGSM/DCS/PCS Dual band Transmit Power Amplifier

(U101: SKY77336)

The dual band PA is operating to transmit for low band (GSM-850, GSM-900) and high band (GSM-1800,

GSM1900). Operating mode is selected and controlled by the ESC6270 (GSM_PA_BAND).

[Figure 3.6.2] Block diagram of GSM PAM

- 46 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.7 OFF-CHIP COMPONENTS

3.7.1 Bluetooth (BCM2070)

Bluetooth block of LG-C320 consists of a BCM2070 chip-set, an external crystal oscillator(26MHz), and a

Bluetooth chip antenna (2.4GHz). QSC6270_3G disable, which is main HW solution of LG-C320 Model, doesn’t

include BT baseband core. Instead, Bluetooth chipset, BCM2070, contains stand-alone baseband processor

(V2.1+EDR) as well as BT RF block. An external crystal oscillator (26MHz) is used to provide reference

frequency to BCM2070.

Figure 3.7 shows the Bluetooth system architecture in the LG-C320.

[Figure 3.7] Bluetooth system architecture

- 47 -

Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

[Table 3.7] Bluetooth Connection(GPIO) with QSC6270

- 48 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.7.2 FM Receiver (TEA5991)

The TEA5991 is a single chip FM stereo radio with RDS and RBDS decoder. The radio can be connected to a

headphone antenna and can tune from 70-108 MHz to cover the European, US, Chinese and Japanese FM

band. The radio delivers stereo audio output to an external amplifier. The radio can be controlled with a high

level command based interface through a I2C or SPI-bus.

[Figure3.7.2] shows the FM Radio system architecture in the LGC320.

[Figure3.7.2] FM Radio system architecture

[Figure3.7.2.1] Pin Descriptions

ESC6270

AUDIO

SUBSYSTEM

TEA5991

FM_R

FM_L

FM_I2C_SDA

FM_I2C_SDL

HP_R

HP_L

Ear-Jack

FM_ANT

HP_EAR_R

HP_EAR_L

- 49 -

Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

SYMBOL HVQFN WLCSP DESCRIPTION

AGND 1 F1 Analog ground

RFI 2 E1 RF input

RFGND 3 D1 RF ground

NC 4 - not connected

BUSSEL2 5 A1 Bus Selection pin 2

BUSSEL1 6 C1 Bus Selection pin 1

RST 7 A2 Reset, used for operating mode change

SEN 8 B1 Chip Select for SPI bus

SCL 9 A3 Serial Bus Clock

SDA 10 A4 Serial Bus Data

FREF 11 A5 Reference frequency (32.768 kHz)

VREFDIG 12 A6 Reference voltage for digital I/Os

VDD 13 B6 Digital supply voltage

DGND 14 C6 Digital ground

AUDOR 15 D6 Audio output signal right

AUDOL 16 E6 Audio output signal left

NC 17 - Not connected

VCC 18 F6 Analog supply voltage

GPIO2 19 F5 General Purpose I/O 2; Dataout for 4-wire SPI-bus

[Table 3.7.2] pin description

- 50 -

Only for training and service purposes

4. TROUBLE SHOOTING

Power ON Troubleshooting

5. Base band part

4.1 Power ON Troubleshooting

Power On sequence is :

PWR key press PM_ON_SW_N ÎQSC6270 KPDPWR_N pin(AA2) go to low(Main BOARD R205) ÎQSC6270

Power Up ÎVREG_MSMC_1.2V(C261), VREG_MSME_1.8V(C209), VREG_MSMP_2.6V(C414),

VREG_RFRX2_1.3V(C232), VREG_TCXO_2.85V(C275) power up and system reset assert to QSC6270 ÎPhone

booting and PS_HOLD assert to QSC6270

START

Battery voltage. higher

than 3.20V? Change or charging the Battery

Yes

Change the main board

Replaced

with normal LCD module,

and then Booting is OK? Go to LCD Troubleshooting

Yes

TP1_R205 go to low

When Power key press? Check the Key Dome

Yes

TP2_VREG_MSMC_1.2V(L201)

TP3_VREG_RF1_2.3V(L202)

TP4_VREG_RF1_1.4V(L203)

power up?

Change the main board

Yes

- 51 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

Power ON Troubleshooting

TP3TP4TP2TP1

VREG

RF2

1V4

VREG

RF2

NO_MP

TP1

TP2

TP3

TP4

- 52 -

Only for training and service purposes

4. TROUBLE SHOOTING

൯Charging Procedure

- Connect TA or USB Cable

- Control the charging current by QSC6270(disable 3G)

- Charging current flows into the battery

තCheck Point

- Connection of TA or USB Cable

- Charging current path

- Battery

තTroubleshooting Setup

- Connect TA and battery to the phone

තTroubleshooting Procedure

- Check the charger (TA or USB Cable) connector

- Check the charging current Path

- Check the battery

4.2 Charger Troubleshooting

Charger Troubleshooting

Check the pin and battery

Connect terminals of I/O

connector

Connection OK? Change I/O connector

Yes

Change the main board

Is the TA voltage TP1_5.1V(FL401)? Change TA

Yes

Is it charging properly? END

Yes

START

[ Charger Troubleshooting Flow ]

- 53 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

Charger Troubleshooting

FL401

TP1

- 54 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.3 USB Troubleshooting

USB Initial sequence is : Isert USB Cable ÎUSB_VBUS +5V Check ÎIC400 triggered USB IF work

USB Troubleshooting

START

Cable is insert

physically? Change CN400

Yes

Change the main board

Is TP1_FL401(VBUS) voltage 5.1V? Change CN401

Yes

TP2_C409(LDO4.9V)

OUTPUT is about 5V? Change the U401

Yes

Is IC401 OUTPUT is TP3_C265(USB_

DM,USB_DP) signal OK? Change the IC401

Yes

[ USB Troubleshooting Flow ]

- 55 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

USB Troubleshooting

TP1 TP2

TP3

FL401

VBUS_LDO_4V9

TP3 TP3

TP2

TP1

- 56 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.4 USIM Detect Troubleshooting

USIM Initial sequence is :

VREG_USIM_2.85V go to 1.8V or 3.0V ÆUSIM_CLK,USIM_RST,USIM_DATA triggered ÆUSIM IF work

USIM Troubleshooting

Re-insert the SIM card

Work well ?

END

Yes

Work well ? Change the Main board

START

Change the SIM card

Yes

TP1(Vreg_USIM) is 1.8V or 3.0V ?

TP2(USIM_CLK) & TP3(RST) is run ?

Yes

Check J301

Work well ? Yes

- 57 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

USIM Troubleshooting

TP1 TP3TP2

MUSIM_DM MUSIM_DP

TP3

TP1

TP2

- 58 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.5 Camera Troubleshooting

Camera control signals are generated by QSC6270.

Camera Troubleshooting

START

CAM_AVDD_2.8V

CAM_VDD_1.8V (TP1, TP2) Chang the Main board

Yes

Change the Main board

Check the CAM_MCLK

TP4 Change the Main board

Check the CAM_PCLK

TP3 Change the Camera Module

Camera is OK END

Yes

Check the camera connection to the

socket and reconnect the camera

Camera is OK? END

Yes

- 59 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

CAM_70MHz PCLK CAM_24MHz MCLK

Camera Troubleshooting

TP1 TP2

TP3

TP4

CAM_70MHz PCLK CAM_24MHz MCLK

Camera Troubleshooting

TP1 TP2

TP3

TP4

TP1

TP2

TP3

TP4

TP4TP3

- 60 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.6 Main side view LED Troubleshooting

MAIN Key Pad LED is on as below :

Key pressing ÆLED_CON go down low (below 0.8v) ÆMAIN Key Backlight LED On

Main side view LED Troubleshooting

START

+VPWR is above 3.2V? Check battery

Yes

END

Change QSC6270

LED ON ? Change LED

Yes

Key press

When the LCD is on,

TP1 is below 0.8v

Yes

- 61 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

4.7 Slide Key side view LED Troubleshooting

Sub Key Pad Slide is on as below :

Key pressing ÆLED_CON go down low (below 0.8v) ÆSub Key Backlight LED On

Slide Key side view LED Troubleshooting

START

+VPWR is above 3.2V? Check battery

Yes

END

Change the FPCB

or KEY PCB

LED ON ? Change the MAIN PCB

Yes

Key press

When the LCD is on,

TP2 is below 0.8v?

Yes

- 62 -

Only for training and service purposes

4. TROUBLE SHOOTING

Slide Key side view Troubleshooting

LED

TP1

LED

TP2

TP1

LD103 LD104 LD105 LD108LD106 LD107

R107 R108

10 10

R105 R106

10 10

R109 R110

VA101

SLIDE_KEY_LED

WLED_VOUT

SUB KEY B/L

MAIN

SLIDE

TP2

- 63 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

4.8 LCD Troubleshooting

LCD control signals are generated by QSC6270.

The signal path is : QSC6270 ÆCN102 ÆLCD Module

LCD Troubleshooting

Press END key

Key LED is on?

Yes

Change the Main Board

Move to KEY LED Troubleshooting

LCD display OK? END

START

Disconnect and reconnect

The LCD connector

(Slide PCB CN102,CN101)

LCD display OK?

Yes

Yes END

Change the FPCB

Change SUB PCB

LCD display OK? Yes END

- 64 -

Only for training and service purposes

4. TROUBLE SHOOTING

[Slide Side view placement]

LCD Troubleshooting

- 65 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

4.9 Vibrator Troubleshooting

Vibrator is operate when DC motor driver is enabled.

Vibrator Troubleshooting

Operate the Vibrator

CN803(Main B/d)

and CN101(motor_FPCB) are well

connected ?

Yes

END

Reconnect Board to FPCB connector

Wired

Vibrator to FPCB

”VIB”?

Solder the wire on to FPCB

START

LINMOT_P

above 3.0V or LINMOT_M

below 1V?

Yes Change vibrator or

Change the Main PCB

Yes

Change the FPCB

working? No Change vibrator or

Change the Main PCB

Yes

- 66 -

Only for training and service purposes

4. TROUBLE SHOOTING

F_SUB_FPCB to Main PCB Connector(CN101)

Main to F_SUB_FPCB Connector(CN803)

Motor Pad(CN101)

- 67 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

4.10 Receiver Path

QSC6270(3G disable) EAROP(EARON) ÆTP1_CN801(Main to Slide FPCB Connector) 2,3 PIN

ÆTP2_CN103(=Slide FPCB to Main PCB Connector) 2, 3 PIN ÆTP3_FB101, FB102(of F_SLIDE_ FPCB)

TP4_CN101(= Receiver Pad of F_SLIDE_ FPCB )

Connect the phone to network

Equipment and setup call

Setup 1KHz tone out

Can you hear the tone? END

Yes

Change the QSC6270

Change the Main PCB

The sine wave appears at

Receiver Pad(TP4)

Re-Solder Receiver

Change the Receiver

Yes

START

The sine wave appears at

TP3_FB101, FB102? Change F_SLIDE_FPCB

Yes

The sine wave appears at

TP2_CN103 2,3 PIN?

Re-Solder FB101,FB102

Change F_SLIDE_FPCB

Yes

The sine wave appears at

TP1_CN801 2,3 PIN?

Re-Connect CN103

Change F_SLIDE_FPCB

Yes

- 68 -

Only for training and service purposes

4. TROUBLE SHOOTING

Main to Slide FPCB Connector(CN801)

TP1

15pF

VCOIN

RCV_P

RCV_N

LCD_DATA[4]

LCD_DATA[5]

LCD_DATA[6]

LCD_DATA[7]

LCD_VSYNC_OUT

LCD_RST_N

LCD_MAKER_ID

TP1

- 69 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

TP4_Receiver PAD=CN101

127

Slide FPCB to Main PCB

Connector(CN103)

TP3_FB101

TP3_FB102

TP2

FB102 100n

1C Fp

101C Fp93

CN101

1AV

FB101 100n

RCV_N

RCV_P

Can be Changed to TVS or ECLAMP

CN103

505

514

523

532

541

LCD_MAKER_IDRCV_N

RCV_P LCD_DATA[15]

LCD_DATA[14]

TP3

TP4

TP2

- 70 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.11 Headset path

QSC6270(3G disable) HPH_OUT_L_P/N ÆTP1_C506,C507 ÆIC501(Audio Sub System) Æ

TP2_R504,R505 ÆTP3_FB504, FB505 ÆJ501(=3.5pi Ear-jack)

Connect the phone to network

equipment and setup call.

Setup 1KHz tone out and insert headset.

Can you hear the tone? END

Yes

Change the Main board

Sine wave appears at

TP3_FB504, FB505

Re-solder or Change J501

Change the Main PCB

Yes

START

Sine wave appears at

TP2_R504, R505?

Re-solder the FB504, FB505

Change the Main PCB

Yes

Sine wave appears at

TP1_C506, C507? Change the IC501

Yes

- 71 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

TP3_FB504

TP3_FB505

TP2_R504

TP2_R505

HS_GND

HS_MIC_P|Hook_ADC

FM_ANT

HS_OUT_R

HS_OUT_L

TP2

TP3

- 72 -

Only for training and service purposes

4. TROUBLE SHOOTING

Audio Sub system IC501TP1_C506TP1_C507

GND

HS_R

SPK_N

SPK_P

MUIC_AUD_FM_I2C_SCL

MUIC_AUD_FM_I2C_SDA

SPK_OUT_

SPK_OUT_P

HS_OUT_R

HS_OUT_L

HS_L

WM9093 is possible to 1.8 & 2.6 IO When HPVDD is 1.8V

TP1

- 73 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

4.12 Speaker/Speaker Phone path

QSC6270 LINE_OUT_L_P/LINE_OUT_R_N ÆTP1_C508, C509ÆAudio Sub System(IC501) ÆTP2_FB507, FB508 Æ

TP3_CN803 1/2, 3/4 PIN(=Main to F_SUB_FPCB Connector) ÆTP4_CN101 1,2 PIN(=F_SUB_FPCB to Main PCB

Connector) ÆTP5_CN102(= Speaker Pad of F_SUB_FPCB)

Connect the phone to network

Equipment and setup call

Setup 1KHz tone out

Can you hear the tone? END

Yes

Change the QSC6270

Change the Main board

Sine wave appears at

TP5_Speaker Pad

Re-Solder Speaker Pad

Change the Speaker

Yes

START

Sine wave appears at

TP4_CN101 1,2 PIN Change the F_SUB FPCB

Yes

Sine wave appears at

TP3_CN803 1/2, 3/4 PIN

Re-Connect the CN101

Change the F_SUB FPCB

Yes

Sine wave appears at

TP2_FB507, FB508 Change the Main PCB

Yes

Sine wave appears at

TP1_C508, C509 Change the IC501

Yes

- 74 -

Only for training and service purposes

4. TROUBLE SHOOTING

TP1_C508

Audio Sub

System(IC501)

TP1_C509 TP2_FB507 TP2_FB508

GND

HS_R

SPK_N

SPK_P

MUIC_AUD_FM_I2C_SCL

MUIC_AUD_FM_I2C_SDA

SPK_OUT_

SPK_OUT_P

HS_OUT_R

HS_OUT_L

HS_L

WM9093 is possible to 1.8 & 2.6 IO When HPVDD is 1.8V

TP1

TP2

- 75 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

TP3

Main to F_SUB_FPCB

Connector(CN803)

110

TP3

- 76 -

Only for training and service purposes

4. TROUBLE SHOOTING

F_SUB_FPCB to Main PCB

Connector(CN101)

TP4

CN101

1110

129

138

147

156

165

174

183

192

201

G1 G2

G3 G4

MOTOR_POWER_N

SPK_OUT_P

SPK_OUT_N

MSD_D[3]

MSD_D[2]

MSD_D[1]

MSD_CMD

VBAT

MSD_D[0]

MSD_CLK

VREG_MICROSD_3V0

TP4

- 77 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

TP5_CN102(=Speaker Pad)

CN102

SPK_OUT_P

SPK_OUT_N

Can be Changed to TVS or ECLAMP

TP5

- 78 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.13 Main microphone

MIC501 ÆVMIC_BIAS_P(TP1_C526) ÆMAIN_MIC_P(TP2_C261) ÆMIC1P PAD of QSC6270(3G disable)

Make a call

MIC_BIAS(TP1_C526)

is about 1.8V?

Yes

Change the Main board

Sine wave appears at

TP2_C261? Change the MIC

START

Make sound to MIC

Yes

Change the Main board Work well? Yes END

- 79 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

MIC501

TP1_C526

TP2_C261

DNG_CIM

TP2

TP1

- 80 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.14 Headset microphone

3.5 pie Headset ÆHS_MIC_BIAS(TP1_R502) ÆHS_MIC_P(TP2_FB503) ÆHS_MIC_P(TP3_C263)

ÆMIC2P PAD of QSC6270(3G disable)

Insert Headset & Make a call

TP1_R502 is About 1.8V ? Change the LDO(U501)

Change the Main board

Yes

Change the Headset

Change the MAIN board

Sine wave appears at

TP2_FB503?

Re-Solder FB503

Change the MAIN board

Yes

Sine wave appears at

TP3_C263?

Re-Solder C263

Change the MAIN board

START

Yes

- 81 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

TP1_R502 TP2_FB503

TP3_C263U501

DNG

TP3

VREG_MSMP_2V6

HS_GND

HS_MIC_P|Hook_ADC

FM_ANT

HS_OUT_R

HS_OUT_L

HS_JACK_DET

´ëÃ¼Ç° : EUSY0407501

RP183K181D is possible to 1.8 & 2.6 IO

TP1

TP2

- 82 -

Only for training and service purposes

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG

4.15 RF Component

MAIN board Bottom

RF component (GSM)

Reference Description Reference Description

U201 QSC6270 3G disable FL101 FEM

X202 XO SW101 RF connector

U101 GSM(EDGE) TX PAM

FL101

SW101

U101

X202

U201

4.15 RF Component

- 83 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G

4.16 RF Path

4.16.1 GSM path

X Path

RX Path

x/RX Path

4.16 RF Path

- 84 -

Only for training and service purposes

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G

4.17 Trouble Shooting of GSM Part

(GSM850/GSM900/1800/1900)

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G

- 85 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

Setup Test Equipnment

Cell power = -74dbm

EGSM CH: 38

DCS1800 CH: 698

PCS1900 CH: 661

GSM850 CH: 190

Check M/S & FEM

(SW101 & FL101)

Check

Rx Part

Check

Tx Part

START

END

- 86 -

Only for training and service purposes

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G

4.17.1 Checking Front-End Module Block

Setup Test Equipnment

Cell power = -74dbm

EGSM CH: 38

DCS1800 CH: 698

PCS1900 CH: 661

GSM850 CH: 190

Check TP3=2.85V? Check U201

Yes

END

Check the logic in each

Mood TP1~TP2 high level

2.85V ≥ Vcc ≥ L4V?

Replace FL101

Yes

4.17.1 Checking Front-End Module Block

- 87 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G

51

51

51

51

51 51 51

51

850, 900,1800,1900MHz

R109

ANT_FEED

TP4

TP1

TP2

TP3

- 88 -

Only for training and service purposes

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G

51 51 51 51

RX_DCS1800_M

RX_DCS1800_P

RX_GSM850_M

RX_GSM850_P

TP1

TP2

TP3

TP4

4.17.2 Checking GSM Rx part

Check TP1~TP3

Signal exist?

Yes

Re-download & calibration

Rx still has problem?

Check FEM & Soldeing of TPs

GSM Rx is OK

Yes

START

- 89 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G

4.17.3 Checking GSM Tx part

Table 4.17.3 GPAM Logic Control

Setup Test Equipnment

Cell power = -60dbm

Tx Power Level Set

GSM850/GSM900 = 5,

DCS/PCS = 0

Is the level of TP4 same

to Table 4.17.3

TP2, 30dBm over?

TP3, 33dBm over?

Check TP1,

GSM850, EGSM 32dBm

DCS,PCS 29dBm over?

Re-download & calibration

Yes

Check U201

Remove U101 and check

The power of pin1, pin8 (on board)

The power of pin1, pin8

Replace U101

Check U201

Yes

4.17.3 Checking GSM Tx part

- 90 -

Only for training and service purposes

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G

- 91 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G

4.18 Checking Bluetooth Block

4.18.1 BLUETOOTH RF components

RF component ( BT )

- Main board bottom -

Reference Description

ANT BT Pattern ANT

U703 BT module_BCM2070

FL701 Band pass filter

X702 26Mhz crystal

U703

X702

FL701

ANT

- 92 -

Only for training and service purposes

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G

4.18.2 BLUETOOTH SIGNAL PATH

Bluetooth Signal PATH (Main board bottom)

Bluetooth T/Rx PATH

- 93 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G

4.18.3 BLUETOOTH Trouble shooting

TP# TP description

TP1 VREG_MSMP_2.6V

TP2 VREG_MSME_1.8V

TP3 BT_CLK(26Mhz)

TP4 BT_ANT_OUT

START

Check TP1, TP2

Signal exist? Change the main board

Yes

Change the main board

Check TP3

IS clock OK? Check X700

Yes

Check TP4

Signal exist? Check U700

Yes

4.18.3 BLUETOOTH Trouble shooting

- 94 -

Only for training and service purposes

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G

{wX

{wYG

{wZG

{w[G

WLAN_BT_ANT_FEED

BT_ANT_FEED

Connectivity_ANT_PAD

- 95 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G

[BT main clk : 26MHz]

{wX

{wY

{wZ

{w[G

26MHz

RTC_32K

BT_WAKEUP

BT_PCM_CLK

BT_PCM_OUT

BT_PCM_IN

BT_PCM_SYNC

BT_UART_RTS

BT_UART_CTS

BT_WAKEUP_HOST

BT_RST_N

BT_ANT_FEED

RTC_32K768

BT_UART_RX

BT_UART_TX

BT_PWR_ON

must have 1% tolerance

can be removed

When power class 1.5 is used, R307 is populated and R308 is depopulated.

(Vice versa for power class 2)

Class 1.5

TP1

TP3

TP4

TP2

- 96 -

Only for training and service purposes

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G

4.19 Checking FM Radio Block

4.19.1 FM Signal Path

Reference Description

U701 TEA5991(FM module)

|^WX

- 97 -

Only for training and service purposes

LGE Internal Use Only

4. TROUBLE SHOOTING

START

TP1, TP2 Check the Sianal Change the main board

Yes

Change the main board

TP3 Check the Signal Change the Ear Jack

Yes

TP4 Check the Signal Change the U601

Yes

4.19.2 FM Trouble shooting

- 98 -

Only for training and service purposes

4. TROUBLE SHOOTING

㝘⪌HG 㵬㦤G 㠄⸬㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UU㝘⪌HG 㵬㦤G 㠄⸬

㡸G 㵲㡸G ㍌G 㛺㏩⏼␘UG G

TP# TP description

TP1 VREG_MSMP_2.6V

TP2 VREG_MSME_1.8V

TP3 FM_ANT_IN

TP4 FM_OUT_AUDIO signal

XUXU

{wYG

{wZG

{w[G

VREG_MSME_1V8

VREG_MSMP_2V6

FM_R

ADS_C2I_MF_DUA_CIUM

FM_L

FM_ANT

Close to QSC

Close to ANT

TP2

TP4

TP1

TP3

TP1

TP2

TP3

TP4

- 99 -

Only for training and service purposes

LGE Internal Use Only

5. DOWNLOAD

- 164 -

Only for training and service purposes

5. DOWNLOAD

LG-C320

- 100 -

Only for training and service purposes

- 165 -

Only for training and service purposes

LGE Internal Use Only

5. DOWNLOAD

LG-C320

5. DOWNLOAD

- 101 -

Only for training and service purposes

LGE Internal Use Only

- 166 -

Only for training and service purposes

5. DOWNLOAD

LG-C320

5. DOWNLOAD

- 102 -

Only for training and service purposes

- 167 -

Only for training and service purposes

LGE Internal Use Only

5. DOWNLOAD

LG-C320

5. DOWNLOAD

- 103 -

Only for training and service purposes

LGE Internal Use Only

- 168 -

Only for training and service purposes

5. DOWNLOAD

LG-C320

5. DOWNLOAD

- 104 -

Only for training and service purposes

- 169 -

Only for training and service purposes

LGE Internal Use Only

5. DOWNLOAD

- 105 -

Only for training and service purposes

LGE Internal Use Only

- 170 -

Only for training and service purposes

5. DOWNLOAD

- 106 -

Only for training and service purposes

- 171 -

Only for training and service purposes

LGE Internal Use Only

5. DOWNLOAD

- 107 -

Only for training and service purposes

LGE Internal Use Only

- 172 -

Only for training and service purposes

5. DOWNLOAD

- 108 -

Only for training and service purposes

- 173 -

Only for training and service purposes

LGE Internal Use Only

5. DOWNLOAD

- 109 -

Only for training and service purposes

LGE Internal Use Only

- 174 -

Only for training and service purposes

5. DOWNLOAD

LG-C320

LG-C320LG-C320

5. DOWNLOAD

- 110 -

Only for training and service purposes

- 175 -

Only for training and service purposes

LGE Internal Use Only

5. DOWNLOAD

LG-C320 LG-C320

LG-C320

5. DOWNLOAD

- 111 -

Only for training and service purposes

LGE Internal Use Only

- 176 -

Only for training and service purposes

5. DOWNLOAD

LG-C320

5. DOWNLOAD

- 112 -

Only for training and service purposes

6. BLOCK DIAGRAM

- 113 -

Only for training and service purposes

LGE Internal Use Only

6. BLOCK DIAGRAM

ESC6270_BB/RF

ESC6270 POWER

51#F653#KZ#Eorfn#Gldjudp#=#Srzhu#b4#

VDD_CORE

VREG_MSMC_1V2

TA (5PIN)

5.1V,700mA

VBAT

Charger IC

USB_VBUS

ESC6270

POWER

VSW_RF2 ( 500mA)

VSW_MSMC ( 500mA)

VSW_RF1 ( 500mA) VDD_RFRX

VDD_RFTX

VREG_RFRX2_1V3

VREG_RFTX2_1V3

MU_IC VREG_MPLL (150mA)

VREG CDC2 (150mA)

VDD_P1

VDD_P2

VDD_RFA

VREG_RFA_2V2 VREG_RF1_2V3

VREG_RF2_1V4

VBUS_LDO_4.9V

VBAT

Battery

900mAh

VREG_RFA (300mA)

VREG

CDC2 (150mA)

VREG_RX2 (150mA)

VREG_TX2 (150mA)

VDD_P5

VDD_P6

VREG_MSME_1V8

VREG MSMP 2V6

MCP

SDRAM (1.8V , MAX 180mA )

NAND (1.8V , MAX 30mA )

VREG_MSME (300mA)

KEYCODE IC(1.8V, ?mA)

HALL IC(1.8V, )

VREG_MSMP ( 300mA)

FM RADIO

VREG_GP1 (150mA)

BT only MODULE

1.8V(, mA

2.6V( , mA

VIB_DRV_N

MOTOR MOTOR_POWER_N

MICRO SD slot

(3 0V MAX mA )

VREG_TCXO ( 50mA)

VREG GP2 ( 300mA)

VREG_USB_2.6V ( 50mA)

VREG_USB_3.3V ( 50mA)

VREG_MICROSD_3V0

2.6V( , mA

BACKUP Battery VCOIN (3.0V, )

VCOIN

USIM SLOT (2.85V )

VREG_USIM_2V85

MICRO SD slot

, ,

MAX

)

VREG_USIM (150mA)

VREG

GP2 ( 300mA)

- 114 -

Only for training and service purposes

6. BLOCK DIAGRAM

VBAT

51#F653#KZ#Eorfn#Gldjudp#=#Srzhu#b5#

VBAT

RT9396

(SUB PMIC)

LDO1(150m A )

LDO2( 150mA )

VLDO_CAM_2V8

VLDO_CAM_1V8

VLDO LCD 2V8

LCD_2.8V(, mA

LCD _1.8V( , mA

2.4” LCD MODULE

2MEGA CAMERA

WLED ( ,120mA )

WLEDOUT( 4.8V, 450mA )

LDO3(300m A )

VLDO_LCD_1V8

VLDO

LCD

2V8

LDO4( 500mA )

CAM_2.8V(, mA

CAM _1.8V( , mA

WLED_VOUT

GSM PAM (TQM7M5012)

VBAT

VREG_MSME_1.8V

AUDIO SUB SYSTEM

1.8V(, mA

VDD

WIFI/BT/FM MODULE

WIFI_TCXO

LDO(150mA)

LDO(150mA) EAR_JACK DET.

VDD_TCXO

OPTION

WIFI(, mA

BT( , mA

VREG_MSMP_2V6

- 115 -

Only for training and service purposes

LGE Internal Use Only

6. BLOCK DIAGRAM

EBI2_D ATA [0: 15]

NAND

CS1

61#F653#KZ#Eorfn#Gldjudp#=#EE

Memory

(H8BCS0SIOBAR)

NAND

CS1

EBI2 _ALE

EBI2 _CLE

EBI2_OE_N

EBI2_ WE_N

NAND _READY

RESOUT_N

SDRAM

DATA

[

]

VREG _MSME_1.8V

CAMERA

CAM

MCLK

LCD _VSYNC_OUT

CAM_PCLK

CAM _DATA [2: 9]

CAM_HSYNC/VSYNC

MEGA _CAM_RESET _N

I 2C _SCL/SDA

From PMIC

MEGA _CAM _PWDN

VBAT

CAM_

2 Gb NAND

1 Gb SDRAM

SDRAM

DATA

[

]

SDRAM_ADDR [0:14]

SDRAM _CLK

SDRAM _CS_N(0)

SDRAM_ADV_N

SDRAM_ OE _N

SDRAM_WE_N

SDRAM _CLK (0)

LCD

EBI2_DATA [0: 15]

LCD_ MAKER _ID

EBI2_WE_N / EBI2_OE_N

LCD _CS_N

LCD_ADS

LCD_ RESET_N

LCD_IF_MODE

LCD _LDO_2.8 V

LCD

CHARGE

PUMP

WLED _1:3

MLED_OUT

VBAT

LDO_EN

From QSC

LCD _LDO_1.8 V

I2C_SDA , I2C_SCL

LDO

SDRAM _DQM[0 :3]

MICRO SD

CONNECTOR

BT _PCM_SYNC

PCM

BT_UART_ TXD

BT_UART_RXD

BT_UART_ CTS

BT_UART_RTS

MICROSD_ DATA [0: 3]

MICROSD_CMD/CLK

MICRO_DETECT_N

VREG_MICROSD_3.0V

BT _ANT

From BT chip ANT .

MSME_1.8V

MSMP_2.6V

QSC6270

SIM

CONNECTOR

USIM _DATA / CLK / RESET_ _N

VREG_USIM_2.85V

BLUE TOOTH

PCM

BT _PCM_OUT

BT _PCM_CLK

BT_WAKEUP _MSM

MSM_WAKEUP_BT

BT_ RESET_N

I2C COMM.

BT _ REG _ ON

KEYCODE

Crystal

MHZ

KEYCODE_INTERRUPT

KEYCODE RESET

32.768KHz

From SLEEP_CLK

Of QSC6270

QWERTY

KEY_ROW[0:7]

DC MOTOR VBAT

MOTOR DRIVE

32.768KHz

Oscillator

XTAL_IN

XTAL_OUT

19. 2MHz

MMP_XTAL _OUT

QSC GPIO

MUIC_FM_AUDIO_I2C _SDA(GPIO49_P1_1.8V)

_SCL(GPIO 50_P1_1.8V )

MUIC /AUDIO

FM RADIO

MUIC_INT(GPIO 10_P1_ 1.8V)

I2C_SDA(GPIO 70_P3_2.85 V)

I2C _SCL(GPIO71_P 3_2.85V)

MUIC_FM_AUDIO_I2C

CP_

MSME_1.8V

MSMP_2.6V

FM RADIO

Charge Pump

KEYCODE

RESET

KEYCODE__I2C

WLAN_SDIO[0:3]

WLAN_COMMEND

WLAN_CLK

BT _UART_ TXD

BT_UART _RXD

BT _UART_ CTS

VBAT

WLAN&BT ANT

KEY &

NAVI _KEY

KEY_COL[0:7]

JTAG

JTAG_TDI

JTAG_TCK

JTAG_TMS

JTAG_TDO

JTAG_TRST_N

JTAG_RTCK

HALL _IC

SLIDE_DETECT

VREG _MSME_1.8V

SLIDE KEY

LED VBAT

QWETY KEY

LED VBAT

WIFI &BT

MODULE

BT _PCM_SYNC

BT _PCM_IN

BT _PCM_OUT

BT _PCM_CLK

UART

RTS

BT_WAKEUP _MSM

MSM_WAKEUP_BT

RESET

Crystal

MHZ

32 768KH

WLAN&BT ANT

From WLAN&BT chip ANT .

AUDIO

SUB

S S

HP_EAR_R

HP_EAR_L

To. MMI CON.

I2C_SCL

I2C_SDA

MUIC_AUDIO_

I2C_SDA / SCL

MUIC_INT

BOOST_5V MUIC

USB_VBUS

USB+/-

USB _ID

5PIN

MICRO

MMI

CONN.

USB D +/-

UART1_RX/TX

VBAT

MUIC_AUDIO_

RESET

BT_ REG _ ON

768KH

From SLEEP_CLK

Of QSC6270

OPTION

TEM

( WM9093ECS-R )

SPK_R/L

HP_R/L

SPK +/-

MIC

MIC_BIAS

RCV R / L

R ADIO

FM RADIO I2C MSME_1.8V

MSMP_2.6V

32.768KHz From SLEEP_CLK

Of QSC6270

FM ANT

FM RIGHT / LEFT

- 116 -

Only for training and service purposes

6. BLOCK DIAGRAM

71#F653#KZ#Eorfn#Gldjudp#=#UIbJVP

- 117 -

Only for training and service purposes

LGE Internal Use Only

6. BLOCK DIAGRAM

81#F653#KZ#Eorfn#Gldjudp#=#Frqqhfwlylw|+EW2ZLIL2IP,brswlrq

VDD_TCXO

JACKEAR

- 118 -

Only for training and service purposes

6. BLOCK DIAGRAM

81#F653#KZ#Eorfn#Gldjudp#=#Frqqhfwlylw|+EW2IP,

E t l XO

erna

l XO

AR_JACK

- 119 -

Only for training and service purposes

LGE Internal Use Only

6. BLOCK DIAGRAM

91#F653#KZ#Eorfn#Gldjudp#=#Phpru|

HYNIX MCP

(H8BCSOSIOBAR)

SD D[0:3]

AND

NAND_ LB_N

NAND_UB_N

_CE

ALE

CLE

MSD_CMD

MSD_CLK

NAND Flash

(2Gbit)

NAND_WE_N

NAND_BSY_N

NAND_WP_N

_WE

RY_BY

_WP

External

Memory

(MICRO SD)

ESC6270

ATA

[

]

IO[1:16]

DDR_M_CLK_N

CLK

SDRAM

CKE[0]

DDR_CS[0]_N_

DDR_RAS_N

DDR_CAS_N

CKE

_CS

_RAS

CAS

SDRAM

(1Gbit)

[0:13]

DDR_WE_N_ _

DDR_DQM[0:1]_

CAS

_WED

DQM USIM

(SIM PLUS)

SIM_CLK

_ _

ATA

SIM_RST_N

DDR _ D[0:15]

ADDR

MUSIM_DM

MUSIM_DP

- 120 -

Only for training and service purposes

6. BLOCK DIAGRAM

:1#F653#KZ#Eorfn#Gldjudp#=#Dxglr

HSED_BIAS

MIC1P

MICBIAS

MIC1P

MIC1N

LINE IN L P

MIC1N

FM_L

TEA5991

MIC2N

_ _ _

LINE_IN_R_N

MIC2N

FM_R

TEA5991

ESC6270

MIC2P

RXIN+

RCV+

MIC2P

HPH_OUT_L_P

RXIN+

RXIN-

IN1+

IN1

EAROP

EARON

RCV+

RCV- HPR

HPL

HS_OUT_R

HS_OUT_L

HS_L

HS_R

WM9093

IN2+

IN2

LINE_OUT_L_P

LINE OUT R N

HPH_OUT_R_N

IN1

SPK_P

SPK_N

IN2

LINE

OUT

GPIO

SCL

SDA

SPK_OUT_P

SPK_OUT_N

MUIC_AUD_FM_I2C_SCL

OUT+

OUT-

MUIC_AUD_FM_I2C_SDA

- 121 -

Only for training and service purposes

LGE Internal Use Only

6. BLOCK DIAGRAM

;1#F653#KZ#Eorfn#Gldjudp#=#YLVXDO+#OFG#)#FDPHUD#,

CAM PCLK

CAM_MCLK

CAM_I2C_SCL

CAM_I2C_SDA

2M Camera

Hynics sensor

Bayer RGB Output

C2FK-H313P

CAM_DATA[0~7]

CAM_HSYNC

CAM_VSYNC

CAM_PWDN

CAM_RST_N

RT9396GQW

VBAT

VLDO_CAM_2V8

VLDO_CAM_1V8

BL_LCD_CAM_LDO_EN

QSC6270

LCD DATA[0~15]

VREG_MSMP_2.6V

2.4” TFT LCD

QVGA

LCD

DATA[0~15]

LCD_RS

LCD_RST_N

LCD_CS_N

LCD_WR_N

LCD RD

RT9396GQW

VLDO_LCD_2V8

VLDO_LCD_1V8

VBAT

CPU I/F

DM24-DSM04

LCD

LCD_VSYNC_OUT

LCD_MAKER_ID

RT9396GQW

5channel

WLED_OUT

WLED2

WLED3

WLED4

WLED1

BL_LCD_CAM_LDO_EN

WLED5

- 122 -

Only for training and service purposes

- 123 -

7. CIRCUIT DIAGRAM

Only for training and service purposes

850, 900,1800,1900MHz

R109

ANT_FEED

RX_DCS1800_M

RX_DCS1800_P

RX_GSM850_M

RX_GSM850_P

ANTENNA SWITCH MODULE LOGIC

MODE

ANT_SEL1

GSM850/EGSM TX

PCN/PCS TX

GSM850 RX

EGSM RX

PCN RX

GSM_PA_BAND

6 dB

ANT_SEL0

PCS RX

6 dB

1-2-1-3_ESC-Quad EDGE

7. CIRCUIT DIAGRAM

- 124 -

Only for training and service purposes

VBAT

19.2MHz

32.768KHz

VREG_MSMP_2V6

GSM_PA_RAMP

NE_AP_MSG

GND

DNAB_AP_MSG

GSM_LB_TX

GSM_HB_TX

N_NISER_MSM

DLOH_SP

VSW_RF1

VSW_RF2

VSW_MSMC

VREG_RFRX2_1V3

VREG_RFTX2_1V3

DEL_YEK_NIAM

VREG_RFA_2V2

NI_CDA_OX

XO_ADC_IN

K23_CTR

N_WSNO_MP

P_SAIB_CIMV

VCOIN

VREG_RF1_2V3|VREG_RF1

VREG_RF2_1V4|VREG_RF2

UART_TX

CDA_KOOH

RX_EGSM_M

RX_EGSM_P

RX_PCS1900_M

RX_PCS1900_P

RX_DCS1800_M

RX_DCS1800_P

RX_GSM850_M

RX_GSM850_P

DEL_YEK_EDILS

N_REWOP_ROTOM

XTAL_19M_OUT

TUO_M91_LATX

XTAL_19M_IN

NI_M91_LATX

TP_UART_TX

TP_UART_RX

BT_UART_RX

BT_UART_TX

UART_RX

DI_TAB

UART_BT_SW

- Normal Audio Power : +VPWR

2-2-2-1_ESC_ESC6270

- 125 -

7. CIRCUIT DIAGRAM

Only for training and service purposes

VREG_MSME_1V8

1GND

VCHAR

ON_SW

VBAT

PWR

URXD

UTXD

3G2.5G

DNG_SH

HS_GND|GND

MAIN_MIC_GND|GND

DNG_CIM_NIAM

VBAT

MSM_RESIN_N

PS_HOLD

UART_BT_SEL

PM_ONSW_N

MUIC_INT_N

JTAG_RTCK

JTAG_TCK

JTAG_TDI

JTAG_TDO

JTAG_TMS

JTAG_TRST_N

NAND_OE_N|LCD_RD

CHG_EN_N

BT_WAKEUP_HOST

RESOUT_N|NAND_WP_N

DDR_A[14]|DDR_BA[00]

DDR_A[15]|DDR_BA[01]

XT_TRAU

NAND_D[00]|LCD_DATA[0]

NAND_D[01]|LCD_DATA[1]

NAND_D[02]|LCD_DATA[2]

NAND_D[03]|LCD_DATA[3]

NAND_D[04]|LCD_DATA[4]

NAND_D[05]|LCD_DATA[5]

NAND_D[06]|LCD_DATA[6]

NAND_D[07]|LCD_DATA[7]

NAND_D[08]|LCD_DATA[8]

NAND_D[09]|LCD_DATA[9]

NAND_D[10]|LCD_DATA[10]

NAND_D[11]|LCD_DATA[11]

NAND_D[12]|LCD_DATA[12]

NAND_D[13]|LCD_DATA[13]

NAND_D[14]|LCD_DATA[14]

NAND_D[15]|LCD_DATA[15]

NAND_WE_N|LCD_WR_N

CHG_STS_N

HALL_SENS_DET

R_MF

MUIC_AUD_FM_I2C_SCL

MUIC_AUD_FM_I2C_SDA

BL_LCD_CAM_LDO_I2C_SCL

L_MF

USB_VBUS

HS_JACK_DET

WLAN_BT_REG_ON

WLAN_CLK

LCD_IF_MODE[0]

BL_LCD_CAM_LDO_I2C_SDA

WLAN_RST_N

BL_LCD_CAM_LDO_EN

BT_RST_N

WLAN_CMD

LCD_RST_N

P_CIM_NIAM

WLAN_SDIO[3]

WLAN_SDIO[0]

WLAN_SDIO[1]

WLAN_SDIO[2]

TP_UART_TX

TP_UART_RX

XR_TRAU

BT_PWR_ON

MUSIM_DM

MUSIM_DP

Low : UART Comm

High : BT UART

NET Conn

2-2-2-1_ESC_ESC6270

7. CIRCUIT DIAGRAM

- 126 -

Only for training and service purposes

DDR_D[00]

DDR_M_CLK_N

NAND_BSY_N

DDR_DQM[1]

NAND_UB_N

NAND_OE_N

NAND_LB_N

NAND_CS_N

DDR_WE_N

DDR_CAS_N

DDR_DQS[1]

DDR_DQS[0]

DDR_DQM[0]

DDR_CS[0]_N

DDR_CKE[0]

DDR_D[09]

DDR_D[08]

DDR_D[07]

DDR_D[06]

DDR_D[05]

DDR_D[04]

DDR_D[03]

DDR_A[13]

DDR_A[12]

DDR_A[11]

DDR_A[10]

DDR_A[09]

DDR_A[08]

DDR_A[07]

DDR_A[06]

DDR_A[05]

DDR_A[04]

DDR_D[02]

DDR_A[03]

DDR_A[02]

DDR_D[14]

DDR_D[13]

DDR_D[12]

DDR_D[11]

DDR_D[10]

DDR_D[01]

DDR_RAS_N

DDR_A[01]

DDR_A[00]

NAND_WP_N

DDR_BA[00]

DDR_BA[01]

DDR_D[15]

NAND_D[00]

NAND_D[01]

NAND_D[02]

NAND_D[03]

NAND_D[04]

NAND_D[05]

NAND_D[06]

NAND_D[07]

NAND_D[08]

NAND_D[09]

NAND_D[10]

NAND_D[11]

NAND_D[12]

NAND_D[13]

NAND_D[14]

NAND_D[15]

NAND_WE_N

DDR_M_CLK_P

MUSIM_DM MUSIM_DP

MCP2-1_2G_1G DDRx16_hynix

ENSY0024301

3-3-1_6P_USIM

- 127 -

7. CIRCUIT DIAGRAM

Only for training and service purposes

VBUS_LDO_4V9

IND

CHG_STS_N

MUIC_IO_M

MUIC_IO_P

MUIC_ACC_ID

BAT_ID

4-2-3-2

4-2-1-4

4-3-1-3

4-5-2-1

7. CIRCUIT DIAGRAM

- 128 -

Only for training and service purposes

VREG_MSMP_2V6

GND

HS_GND

HS_R

SPK_N

SPK_P

MUIC_AUD_FM_I2C_SCL

MUIC_AUD_FM_I2C_SDA

SPK_OUT_N

SPK_OUT_P

HS_MIC_P|Hook_ADC

FM_ANT

HS_OUT_R

HS_OUT_L

HS_JACK_DET

HS_L

5-1-2-1

5-4-1-1

´ëÃ¼Ç° : EUSY0407501

RP183K181D is possible to 1.8 & 2.6 IO

WM9093 is possible to 1.8 & 2.6 IO When HPVDD is 1.8V

4-4-2-3

Only for training and service purposes

7. CIRCUIT DIAGRAM

R603

BL_LCD_CAM_LDO_I2C_SCL

BL_LCD_CAM_LDO_I2C_SDA

WLED1

6CH+4LDO,PWM

6-2-2-1

- 130 -

Only for training and service purposes

VREG_MSME_1V8

VREG_MSMP_2V6

26MHz

K23_CTR

RTC_32K

BT_WAKEUP

BT_PCM_CLK

BT_PCM_OUT

BT_PCM_IN

BT_PCM_SYNC

BT_UART_RTS

BT_UART_CTS

BT_WAKEUP_HOST

FM_R

LCS_C2I_MF_DUA_CIUM

ADS_C2I_MF_DUA_CIUM

FM_L

FM_ANT

BT_RST_N

WLAN_BT_ANT_FEED

BT_ANT_FEED

RTC_32K768

BT_UART_RX

BT_UART_TX

BT_PWR_ON

Close to QSC

Close to ANT

VFM_PWR

VREG_MSME_1V8 VREG_MSME_1V8

Connectivity_ANT_PAD

VFM_PWRQCT

QCT

must have 1% tolerance

can be removed

When power class 1.5 is used, R307 is populated and R308 is depopulated.

(Vice versa for power class 2)

Class 1.5

QCT

IFX

VBT_WIFI_IO_2V6

QCT

IFX

VBAT

VREG_MSMP_2V6

VBAT

VPM_IO_2V62

7. CIRCUIT DIAGRAM

- 131 -

7. CIRCUIT DIAGRAM

Only for training and service purposes

15pF

25pF

VREG_MSME_1V8

15pF

VREG_MSMP_2V6

GND

PM_ONSW_N

VREG_MSME_1V8

VCOIN

RCV_P

RCV_N

KEY_ROW0

KEY_ROW1

KEY_ROW2

KEY_ROW3

LCD_RD

LCD_DATA[4]

LCD_DATA[5]

LCD_DATA[6]

LCD_DATA[7]

LCD_DATA[8]

LCD_DATA[9]

LCD_DATA[10]

LCD_DATA[11]

HALL_SENS_DET

LCD_VSYNC_OUT

LCD_IF_MODE[1]

LCD_IF_MODE[0]

VLDO_LCD_1V8

VLDO_LCD_2V8

SLIDE_KEY_LED

WLED4

WLED5

KEY_COL7

KEY_COL6

KEY_COL5

LCD_RST_N

WLED1

WLED2

WLED3

WLED_VOUT

KEY_ROW7

KEY_ROW5

KEY_COL4

KEY_ROW6

KEY_COL3

KEY_COL0

KEY_COL1

KEY_COL2

KEY_ROW4

LCD_MAKER_ID

VREG_LCD_2V8

SYM

'&.

SPACE

@&/

?&:TEXT

SHIFTENTERM&;N&0

B&9V&8

"&,

C&7X&=Z&+

FNBACKL&}

PO&&

K&{J&#

H&6G&5F&4D&'

S&]

A&[

8-1-1-1

I&^U&*Y&3T&2R&1

E&%

W&$

CAM

DOWN

7. CIRCUIT DIAGRAM

- 132 -

Only for training and service purposes

VBAT

MOTOR_POWER_N

MSD_D[2]

MSD_D[3]

MSD_D[0]

MSD_D[1]

MSD_CMD

3-2-1-3_push_1.50T

- 133 -

7. CIRCUIT DIAGRAM

Only for training and service purposes

KB105

KB101 KB102 KB103 KB104

KB109KB108KB107KB106

KB111KB110

LD103 LD104 LD105 LD108LD106 LD107

R107 R108

10 10

R105 R106

10 10

R109 R110

VA101

C102

0.1u0.1u

C101

VA102

16 15 14 13 12 11 10 9 87654321

CN102

CN101

2625

2724

2823

2922

3021

3120

3219

3318

3417

3516

3615

3714

3813

3912

4011

4110

429

438

447

456

465

474

483

492

501

1101R

201R 1

VLDO_LCD_1V8 VLDO_LCD_2V8

LCD_MAKER_ID

LCD_RD

WLED3

WLED2

WLED1

LCD_VSYNC_OUT

LCD_RS

KEY_COL7

KEY_COL6

KEY_COL5

KEY_ROW0

KEY_ROW1

KEY_ROW2

KEY_ROW3

SLIDE_KEY_LED

LCD_DATA[7]

LCD_DATA[6]

LCD_DATA[5]

LCD_DATA[4]

LCD_DATA[3]

LCD_DATA[2]

LCD_DATA[1]

LCD_DATA[0]

LCD_WR_N

LCD_CS_N

LCD_RST_N

LCD_DATA[15]

LCD_DATA[14]

LCD_DATA[13]

LCD_DATA[12]

LCD_DATA[11]

LCD_DATA[10]

LCD_DATA[9]

LCD_DATA[8]

LCD_IF_MODE[0]

WLED4

WLED5

PM_ONSW_N

LCD_IF_MODE[1]

WLED_VOUT

VLDO_LCD_2V8

VLDO_LCD_1V8

POWER KEY

SUB PCB KEY

DOWN

RIGHT

LEFT

Multi.

Widget

TALK

RSK

LSK

END

SUB KEY B/L

Slide KEY PCB to Slide FPCB

ENBY0040501(GB042-50P-H10-E3000,SOCKET)

KEY PCB

LCD FILTER, ZIP CONNECTOR

7. CIRCUIT DIAGRAM

- 134 -

Only for training and service purposes

2.2uC103

R101

4.7K

M101

12 11 10 98 7 6 5 4 3 2 1

CN102

2625

2724

2823

2922

3021

3120

3219

3318

3417

3516

3615

3714

3813

3912

4011

4110

429

438

447

456

465

474

483

492

501

CN103

2827

2926

3025

3124

3223

3322

3421

3520

3619

3718

3817

3916

4015

4114

4312

4411

4510

469

478

487

496

505

514

523

532

541 FB102 100n

101AV

ZD101

201C Fp93

101C Fp93

CN101

201AV

FB101 100n

GND

KEY_ROW2

KEY_ROW1

KEY_ROW0

LCD_MAKER_ID

LCD_MAKER_IDRCV_N

RCV_N

RCV_P

LCD_RD

WLED3

WLED2

WLED1

KEY_COL5

LCD_VSYNC_OUT

LCD_RS

KEY_COL6

KEY_ROW3

KEY_COL7

VCOIN

LCD_DATA[7]

LCD_DATA[6]

LCD_DATA[5]

LCD_DATA[4]

LCD_DATA[3]

LCD_DATA[2]

LCD_DATA[1]

LCD_DATA[0]

LCD_WR_N

LCD_CS_N

LCD_RST_N

LCD_IF_MODE[0]

LCD_IF_MODE[1]

PM_ONSW_N

WLED_VOUT

SLIDE_KEY_LED

WLED5

WLED4

LCD_DATA[15]

LCD_DATA[14]

LCD_DATA[13]

LCD_DATA[12]

LCD_DATA[11]

LCD_DATA[10]

LCD_DATA[9]

LCD_DATA[8]

VLDO_LCD_2V8

VLDO_LCD_1V8

BACKUP BAT.(SUPER CAP.)

ENBY0040401 (50Pin)

(54Pin)

Slide FPCB to Main PCB Slide FPCB to KEY PCB(Slide)

SLIDE FPCB

MAIN RECEIVER

Can be Changed to TVS or ECLAMP

- 135 -

7. CIRCUIT DIAGRAM

Only for training and service purposes

CN102

CN101

1110

129

138

147

156

165

174

183

192

201

G1 G2

G3 G4

VB101

S101

1 15

G5 G3 G1 CD

G6 G4 G2 COM

12 11 10 98 7 6 5 4 3 2 1

MOTOR_POWER_N

SPK_OUT_P

SPK_OUT_N

MSD_D[3]

MSD_D[2]

MSD_D[1]

MSD_CMD

VBAT

MSD_D[0]

MSD_CLK

VREG_MICROSD_3V0

Can be Changed to TVS or ECLAMP

SPK Common Circuit

From Module FPCB to Main PCB Connector BUSEON 16pi 3.0t 0.8W

VIBRATOR

NORMAL TYPE

PUSH PUSH 1.32t

MICRO SD

MODULE FPCB

ELCO8000_0610 Update

LG Innoteck/ Sodering 17mm

- 136 -

Only for training and service purposes

- 137 -

Only for training and service purposes

LGE Internal Use Only

8. BGA PIN MAP

1. BGA PIN MAP

QSC6270 3G disableٛ- U200 (bottom view)

- 138 -

Only for training and service purposes

8. BGA PIN MAP

H8BCS0SI0BAR-46M (MCP,NAND) – U300 (EUSY0347506)

- 139 -

Only for training and service purposes

LGE Internal Use Only

8. BGA PIN MAP

BCM2070B2KUBXG (bluetooth) – U700 (EUSY0418701)

- 140 -

Only for training and service purposes

RT8963WSC (Multiplexer Mini/Micro USB Interface)– IC400 (EUSY0424801)

8. BGA PIN MAP

- 141 -

Only for training and service purposes

LGE Internal Use Only

8. BGA PIN MAP

WM9093 (Ultra Low Power Audio Subsystem)– IC500 (EUSY0403901)

20-bump CSP package; Top View

- 142 -

Only for training and service purposes

8. BGA PIN MAP

TEA5991(FM Tuner)– U701 (EUSY0385901)

- 143 -

9. PCB LAYOUT

Only for training and service purposes

6 0

KB809

KB836

KB811

KB820

KB818

KB837

516

C613

C609

806

R603

VA802

VA804

KB808

KB819

KB828

KB833

CN801

C510

C511

605R 805C

KB803

KB831

IC501

KB802

KB813

KB812

KB822

KB823

KB832

KB829

VA803

C805

LD801

R271

C614

R604

R270

C803 C804

R806

R802

R805

C611 C612

U601

016

8BK

706

KB807

KB817

KB826

KB806

KB827

KB805

KB815

KB825

KB804

KB814

KB824

KB834

FB502

05C

FB506

FB508

C524

FB507

C517

C515

R507

905C

325C

LD802

C268

C269

R801

VA801

C801

C802

TP202

662

TP201

KB801

KB810

KB821

KB830

C320_MAIN_SPFY0235601_1.1_TOP

LD801/802 Main Key LED

- Can not use LED

U801 Hall IC

- Can not use Slide Detection

IC501 Audio Sub System

- Can not use Sound,Headset

U601 Charge Pump+Dual LDO

- Can not use LCD Display,

LCD Backlight, Slide Detection

CN801 FPCB Conn

- Can not use LCD, Receiver,Sub Key,

Sub key LEDs, Vibrator, Power On

9. PCB LAYOUT

- 144 -

Only for training and service purposes

1102

132

U201

R403

TP701

FB702

D201

C725

X702

03C

C740

R404

U702

407

727C

U802

5AV

708C

J301

FL803

C246

C311

L202

C243

C262

C261

C240

TP 901

U701

C709

106

C309

R272

R273

142

C203

ANT102

R505

R405

C137

VA502

FB504

R504

FB505

FB503

C502

C501

C 803C

R406

R407

C410

C219

C213

C214

C212

C220

C236

C239

C232

C238

C107

FL101

11R

SW101

L109

J501

CN403

C233

C227

C117

C121

C120

C119

C724

637C

307

C722

TP710

562A

14C

C413

TP702

C716

C713

C710

07L

TP707 TP705TP706

TP703

TP704

C742

307

C717

C704

307

C739

262A

14C

C417

FL808

308NC

606DZ

507

608C

103C

203C

42C

908

MIC501

C247

R307

FL805

237

7C 8

037C

L810

L811

ZD311

R308

C312

ZD310

ZD308

R309

R310

R311

ZD306

ZD307

ZD305

517R

417

08LF

TP802

R808

382R

308

672

C224

FL804

808

018

908

C714

R602

C715

FB701

406

U704

C741 C737

837

VA602

VA603

VA601 R268

R269

C223

418R

R205

362R

C207

25C

C211

C210

525C

C209

42C

C249

FL811

FL802

R803

C305

R281

R282

C250

702

92C

ANT101

TP262

511

FL810

S601

206

R302

R262

C245

C208

L208

C255

02D

C254

L203

C256

352C

L201

C252

C298

TP260

TP263

TP264

608L

106

C601

U301

102R

C706

C707

306L

R601

R511

R303 R304

222C

572

152C

R260

R261

VA501

125C

206

C114

111R

211C

C134

VA505

C708

VA522

762R

L501

R509

C520

VA503

R508

C519

U501

305

FB501

712C

662C

C113

C291

01L

701L

C290

L1113

C135

R109

108L

IC401

C404

L118 C101

501L

111C

R502

C265 C407

912

C505

C403

104

04C

C408

C402

204R

C104

401L

C102

511L

C228

011

C226

C260

R265

R264

C267

C230

C235

C234

C229

C231

L207

602

L206

C237

L205

L204

621C

L111

21C

R112

C143

R114

C123

221C

L114

4NC

C280

C281

401R

R103

C130

231C

L112

C320_MAIN_SPFY0235601_1.1_BOT

U301 Memory

- Can not Boot

J501 Ear-Jack

- Can not use Ear-Mic

IC401 MUIC

- Can not use USB, UART, Headset

CN403 USB Conn

- Can not use USB

U401 Single Charger

- Can not use Charging, Booting

U201 QSC6270 (BB & Power chipset)

- Can not power on

- No LCD Display

- No Service

X202 XO

- Can not BootRF Rx/Tx

- No Power.

FL101 FEM

- GSM RX Sensitivity & TX Power

- No service

U101 GSM PAM

- Tx power No service

S601 Camera Socket

- Can not use Camera

CN803 FPCB Conn

- Can not use SD-card, Vibrator,

Speaker

X201 Sleep Cystal

- No Service

U703 BT Chip.

- Can not use BT

X702 BT X-Tal

- Can not use BT

U803 Analog Switch

- Can not use UART, BT

CN402 Battery Conn

- Can not use Battery, Power On

J301 USIM Conn.

- Can not detect USIM

MIC501 Mic.

- Can not use Mic

- 145 -

9. PCB LAYOUT

Only for training and service purposes

KB103

KB102

KB105

LD104

LD105

KB108

KB109

KB110

LD108

KB101

LD106

KB104

KB111

KB106

KB107

C320_KEY_SPEY0068201_10_TOP

LD107/LD108/LD106/LD104/LD105/LD103

Sub Key LED

- Can not use LED

9. PCB LAYOUT

- 146 -

Only for training and service purposes

2650

CN101

R101

R102

1AV

C101C102

CN102

C320_KEY_SPEY0068201_10_BOT

CN102 LCD Connector

- Can not use LCD Display, LCD Backlight

CN101 FPCB Connector

- Can not use LCD, Sub key Operation,

Sub Key LED, Receiver

- 147 -

9. PCB LAYOUT

Only for training and service purposes

C320_F_SLIDE_SPCY0246901_10_TOP

28 54

CN102

CN103

101

FB101

VA101

VA102

FB102

01R

301C

1DZ

M101

01C201C

CN102 FPCB Conn

- Can not use LCD, Sub key Operation,

Sub Key LED, Receiver

CN103 FPCB Connector

- Can not use LCD, Sub key Operation,

Sub Key LED, Receiver

9. PCB LAYOUT

- 148 -

Only for training and service purposes

VB101

01N

C320_F_SUB_SPCY0247101_10_BOT

CN101 FPCB Conn

- Can not use SD-card, Vibrator, Speaker

S301 MicroSD Socket

- Can not use MicroSD

- 149 -

Only for training and service purposes

LGE Internal Use Only

10. RF CALIBRATION

10.1 Usage of Tachyon for RF Calibration and Test

10.1.1 Preparation work for setting RF cable loss

Procedure

1. Click “Hecaton.exe” in below directory to set RF cable loss on test equipment.

“C:\LGE\Tachyon\Utilities”

2. After selecting “Select File” button, select right RF cable loss ﬁle corresponding to RF cable that you use.

- 150 -

Only for training and service purposes

10. RF CALIBRATION

10.1.2 Basic Setting of Tachyon for RF Calibration & Test

Procedure

1. Click “Tachyon_xxx.exe” in below directory to execute Tachyon program. “C:\LGE\Tachyon\”

2. Click “System Option Setting” icon in the menu to set COM port.

Select “UART Port” that can communicate with phone in the Shield Box 1 message.

Click the “OK” button.

3. Click “User Model Selection” icon in the menu to set model conﬁguration.

Do double-click model/buyer name that you want to calibrate and test.

Click the “Select” button.

[ System Option Setting] [ User Model Selection]

- 151 -

Only for training and service purposes

LGE Internal Use Only

10. RF CALIBRATION

10.1.3 Log of RF Calibration and Test

Contents

On Running, log window is created in upper area.

It displays logs of phone commands and measurements for RF calibration and test.

The result ﬁles are saved in below directory

- “C:\LGE\Tachyon\Report\CalData\” : the ﬁle of RF calibration result

- “C:\LGE\Tachyon\Report\TestData\” : the ﬁle of RF test result

- 152 -

Only for training and service purposes

11. TEST ALONE

Phone Test Mode : LG-C320

1. Enter the Engineer Menu

2. Tap 1. Device Test

3. Tap 1. Auto ALL Test

11.1 Phone Test Mode

11. TEST ALONE

- 153 -

Only for training and service purposes

LGE Internal Use Only

11. TEST ALONE

Phone Test Mode Scenario

Item Order Description

(1) Key Press, External

Memory, and SIM

card Test Start

1.Key, External Memory,

and SIM card Test

2. IF OK, tab “LSK”

Button.

It means “PASS”

Key Test

Press all keys for test

- UP key

- Down key

- Right key

- Left key

………..

…….

….

External memory and

SD card is inserted

then Sing of

“SIM Pass” and

“SD Pass” is green.

Phone Test Mode Scenario

Item Order Description

(2) Sound 1. Sound On

2. IF OK, tab “LSK”

Button.

It means “PASS”

Ringtone (MP3) is played

regularly

Press “LSK” button (Left top Key)

Move to next step

- 154 -

Only for training and service purposes

11. TEST ALONE

wG{GtGz

Item Order Description

(3) Vibrator Test 1.Vibrator On

2. IF OK, tab “LSK”

Button.

It means “PASS”

Press “LSK” button (Left top Key)

Move to next step

wG{GtGz

Item Order Description

(4) Slide On/Off Test 1.Move Slide Up and

Down

2. IF OK, tab “LSK”

Button.

It means “PASS”

Slide UP status

Press “LSK” button (Left top Key)

Move to next step`

Slide Down status

- 155 -

Only for training and service purposes

LGE Internal Use Only

11. TEST ALONE

wG{GtGz

Item Order Description

(5) Camera Test 1. Camera Off

2. Camera Auto On

( Preview )

3. Photo Shot by press

“OK” key

4. Photo Save

5. Record video

6. Video Save

7. Call Photo

If OK , Press “LSK” key

(Left top Key)

8. Call Video

9. Preview

10. IF OK, tab “LSK”

Button. It means

“PASS”

wG{GtGz

Item Order Description

(6) Loopback Test 1.Loopback On

2. Speak something

3. After 2 Sec, listen the

voice

4. IF OK, tab “LSK”

Button.

It means “PASS”

5. The TEST END

Press “LSK” button (Left top Key)

TEST END

- 156 -

Only for training and service purposes

- 157 -

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.1 EXPLODED VIEW

Only for training and service purposes

ACGT00

SVLM00

SAEY00

ABGZ01

ACGK00

GMEY01

SAFY00

SVCY00

MCBA01

ABFZ00

ACGM00

MBJZ00 GMEY00

ACGA00

SNGF00 SBPL00

ABGZ00 ADCA00 SUMY00

SPKY00

MCBA00

ADCA01

ABFZ01

SURY00

SACY00

GMEY01

ACGU00

AHFY00 MCCH00

GMEY02

Location

ACGA00

SBPL00

ABFZ00

ACGM00

SNGF00

MBJZ00

GMEY00

ABGZ00

ABGZ01

ACGT00

AHFY00

SURY00

ABFZ01

ACGK00

ACGU00

GMEY01

GMEY02

MCCH00

SACY00

SAEY00

ADCA01

SVLM00

SAFY00

SVCY00

SPKY00

MCBA00

ADCA00

MCBA01

SUMY00

Description

Cover Assembly,Battery

Mobile Phone Battery Li-Ion

Bracket Assembly

Cover Assembly,Rear

Antenna,Helical

Button

Screw,Machine

Button Assembly

Cover Assembly,Upper

HINGE ASSY

Receiver

BRACKET ASSY

Cover Assembly,Front

Cover Assembly,Lower

Screw,Machine

Cap,Screw

PCB Assembly,Flexible

PCB Assembly,Keypad

Dome Assembly,Metal

LCD,Module-TFT

PCB Assembly,Main

Camera Module

PCB,Sidekey

Can,Shield

Dome Assembly,Metal

Can,Shield

Microphone,Condenser

- 158 -

Only for training and service purposes

- 159 -

Only for training and service purposes

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

by SBOM standard on GCSC

Level LocationNo. Description PartNumber Spec Remark

1 AAD000000 Addition Assembly - AAAY0524401 LG-C320 BOOWA ZZ:Without Color -

2 ACGA00 Cover Assembly,Battery - ACGA0048201 LG-C320i IDNWA WA:White -

3 MCJA00 Cover,Battery MCJA0120401 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

3 MPBN00 Damper,Speaker MPBN0093201 COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , ,

2 MFL053800 Manual,Operation MFL67003501 COMPLEX LGC320.ABOOWA ZZ:Without Color LGC320 manual for

BOO

1 AGF000000 Package Assembly - AGF75960001 LGC320.ABOOWA ZZ:Without Color LGC320 BOO(TR3/STD

UB/1160*1160 Pallet/600ea)

2 MAY084000 Box,Unit MAY64811601 COMPLEX LGC320.ABOOWA ZZ:Without Color LGC320 BOO(TR3

STD UB)

2 MAF086500 BAG,VINYL(PE) MBAD0005204 LG-LX260 SPRAG AG,ZZ,COMPLEX, (empty), , , , ,

2 AGJ000000 PALLET ASSY - APLY0002405 KP110 OPTBK BK,ZZ,TR3 Australia(600ea) Pallet Assy

3 MBEC00 BOX,CARTON MBEC0002002 KG270 CIS BK,ZZ,BOX, TW

3 MCCL00 Cap,Box MCCL0000402 COMPLEX KG270 CIS ZZ:Without Color BOX,TW, PBO PBOTW

3 MPCY00 Pallet MPCY0015703 COMPLEX TU500 TELBK SV:Silver

COMPLEX,(empty),1160,1160,126,

3 MSCA00 SLEEVE,BOX MSCA0000701 MG230d CLA TS,ZZ,BOX, TW

2 MAY047100 Box,Master MBEE0059803 COMPLEX KP100 GBRLA ZZ:Without Color -

2 MEZ003500 Label,Barcode MLAC0004541 COMPLEX HB620 KPNBK ZZ:Without Color -

2 MEZ047200 LABEL,MASTER BOX MLAJ0004402 CG300 CGR DG,ZZ,LABEL,MASTER BOX(for CGR TDR 2VER.

mbox_label)

2 MEZ000000 LABEL MLAZ0050901 KU990 GBRBK BK,ZZ,PRINTING, (empty), , , , ,

1 APEY00 PHONE - APEY0988401 LG-C320 BOOWA WA,ZZ,

2 MEZ002100 Label,Approval MLAA0062311 COMPLEX KB770 DEUBK ZZ:Without Color -

2 ACGY00 COVER ASSY,EMS - ACGY0088801 LG-C320 BOOWA WA,ZZ,

3 ABFZ00 Bracket Assembly - ABFZ0028101 LG-C320 BOOWA ZZ:Without Color -

4 MEV000000 Insulator MIDZ0281601 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,

, , ,

4 MCQ049800 Damper,Motor MPBJ0079001 COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , ,

4 MJN000000 Tape MTAZ0358201 COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , ,

4 MCQ015700 Damper,Connector MPBU0114101 COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , ,

12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered

- 160 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

3 ACGM00 Cover Assembly,Rear - ACGM0168401 LG-C320i IDNWA ZZ:Without Color -

4 MJN061100 Tape,Protect MJN67687301 COMPLEX LGC320I.AIDNWA GN:Green -

4 MBJZ00 Button MBJZ0041901 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4 MCCE00 Cap,Receptacle MCCE0061601 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4 MCJN00 Cover,Rear MCJN0127401 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4 MDAY00 Decor MDAY0086001 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4 MLAB LABEL,A/S MLAB0001102 C2000 CGRSV SV,WA,C2000 USASV DIA 4.0

4 MPBJ00 Damper,Motor MPBJ0078101 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4 MPBN00 Damper,Speaker MPBN0091501 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4 MPBT00 Damper,Camera MPBT0098901 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4 MPBZ00 Damper MPBZ0337301 COMPLEX LG-C320i IDNWA WA:White COMPLEX, (empty), , , , ,

4 MTAK00 Tape,Camera MTAK0041901 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4 MWAE00 Window,Camera MWAE0065101 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

3 GEMY00 Screw,Machine GMEY0010601 GMEY0010601 BH + 1.4mM 2.5mM MSWR FZB N - KUMGANG

SCREW CO., LTD

3 ACGQ00 Cover Assembly,Slide - ACGQ0056601 LG-C320 BOOWA WA:White -

4 ABGZ00 Button Assembly ABGZ0006901 LG-C320i IDNWA ZZ:Without Color MAIN

4 ABGZ01 Button Assembly ABGZ0007001 LG-C320i IDNWA ZZ:Without Color SUB

4 ACGT00 Cover Assembly,Upper - ACGT0009101 LG-C320i IDNWA ZZ:Without Color LG-C320i IDNWA

5 AJX00 Window Assembly,LCD - AJX73205001 LGC320.ABOOWA ZZ:Without Color -

6 MKC043300 Window,LCD MWAC0151901 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

5 MCJX00 Cover,Upper - MCJX0011301 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

6 MICE00 INSERT,NUT MICE0016901 MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,

5 MFBZ00 Filter MFBZ0025001 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

5 MPBG00 Damper,LCD MPBG0113001 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

5 MTAD00 Tape,Window MTAD0133501 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

5 MTAZ TAPE MTAZ0113701 LG-KV5900 BK,ZZ,20X7

4 MJN061101 Tape,Protect MTAB0440401 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,

, , ,

4 MJN061100 Tape,Protect MTAB0423001 COMPLEX LG-C320i IDNWA ZZ:Without Color -

4 MJN061102 Tape,Protect MTAB0422301 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4 AHFY00 HINGE ASSY AHFY0002101 LG-MN240 MTP LS,ZZ,Slide

- 161 -

Only for training and service purposes

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

4 ABFZ01 BRACKET ASSY - ABFZ0023401 LG-MN240 MTP LS,ZZ,

5 MBFZ00 BRACKET MBFZ0043001 LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , ,

5 MTAB00 TAPE,PROTECTION MTAB0381101 LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , ,

4 ACGK00 Cover Assembly,Front - ACGK0169801 LG-C320i IDNWA ZZ:Without Color LG-C320i IDNWA

5 MCJK00 Cover,Front - MCJK0135101 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

6 MICE00 INSERT,NUT MICE0016903 MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,

5 MPBZ01 Damper MPBZ0320601 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

5 MPBZ00 Damper MPBZ0320801 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

5 MPBZ02 Damper MPBZ0366401 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4 ACGU00 Cover Assembly,Lower - ACGU0007201 LG-C320i IDNWA ZZ:Without Color LG-C320i IDNWA

5 MCJY00 Cover,Lower MCJY0008701 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

5 MMAA00 MAGNET,SWITCH MMAA0011201 LG-LU1600 LGTWW WW,ZZ,COMPLEX, (empty), , , , ,

5 MPBZ01 PAD MPBZ0260601 LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , ,

5 MPBZ PAD MPBZ0260901 LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , ,

5 MPBZ02 Damper MPBZ0320401 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4 GMEY01 Screw,Machine GMEY0017801 GMEY0017801 BH + 1.4mM 1.4mM MSWR FZB N - KUMGANG

SCREW CO., LTD

4 GMEY02 Screw,Machine GMEY0019201 GMEY0019201 FH + 1.4mM 1.8mM SWCH FZW N N KUMGANG

SCREW CO., LTD

4 MCCH00 Cap,Screw MCCH0165101 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4 MEV000002 Insulator MEV63651701 COMPLEX LGC320.ABOOWA BL:Blue insulator, FPCB

4 MDS000000 Gasket MGAZ0112501 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

4 MEV000001 INSULATOR MIDZ0259401 LG-MN240 MTP LS,ZZ,COMPLEX, (empty), , , , ,

4 MCQ000000 Damper MPBZ0357401 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,

, , ,

6 MJN000000 Tape MTAZ0368001 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,

, , ,

6 MCQ015700 Damper,Connector MPBU0113901 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,

, , ,

6 ADCA01 Dome Assembly,Metal ADCA0118401 LG-C320i IDNWA ZZ:Without Color LG-C320i IDNWA

5 MCQ000000 Damper MPBZ0349901 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,

, , ,

5 ACKA00 Can Assembly,Shield - ACKA0035801 LG-C320i IDNWA ZZ:Without Color -

6 MCBA00 Can,Shield MCBA0086901 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

5 MEV000000 Insulator MIDZ0284101 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX,(empty),

- 162 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

5 ADCA00 Dome Assembly,Metal - ADCA0118501 LG-C320i IDNWA ZZ:Without Color MAIN

6 MPBZ00 PAD MPBZ0337101 LG-C320i IDNWA WA,ZZ,COMPLEX, (empty), , , , ,

5 MPBU00 Damper,Connector MPBU0113801 COMPLEX LG-C320i IDNWA ZZ:Without Color COMPLEX, (empty), ,

, , ,

5 MEZ000000 LABEL MLAZ0038301 LG-VX6000 SV,ZZ,PID Label 4 Array

6 MCBA01 Can,Shield MCBA0059201 COMPLEX GD350 CLP ZZ:Without Color -

- 163 -

Only for training and service purposes

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

by SBOM standard on GCSC

Level LocationNo. Description PartNumber Spec Remark

4 EBR070500 PCB Assembly,Flexible - EBR72655001 LGC320.ABOOWA FLEXIBLE 1.0

5 EBR070400 PCB Assembly,

Flexible,SMT - EBR72681501 LGC320.ABOOWA FLEXIBLE 1.0

6 EAX010700 PCB,Flexible SPCY0247101 SPCY0247101 LG-C320i IDNWA,FLEXIBLE,E,POLYI,0.15

mm,DOUBLE SI FLEX CO., LTD

6 EBR070200 PCB Assembly,

Flexible,SMT Bottom - EBR72655201 LGC320.ABOOWA FLEXIBLE 1.0

7 CN101 Connector,BtoB ENBY0052901 55909-0274 20P 0.40MM STRAIGHT MALE SMD R/TP 1.5M -

HANKOOK MOLEX

7 S101 Socket,Card ENSY0023601 SCHA4B0402 Micro-SD 8P ANGLE SMD R/TP - ALPS ELECTRIC

KOREA CO.,LTD.

6 EBR070300 PCB Assembly,

Flexible,SMT Top EBR72681601 LGC320.ABOOWA FLEXIBLE 1.0

4 EAU010000 Motor,DC SJMY0007104 3V 80mA 0A 12KRPM 0RPM 0SEC 0GF.CM 0OHM

4 EAB010100 Speaker Module SUSY0027617 SI-C320-P LG-C320i IDNWA BUJEON ELECTRONICS CO., LTD

4 SNGF00 Antenna,Helical SNGF0064202 ACD-00094 3.0,-2 dBd,GSM Quad carrier type,QUAD,-2.0,50,3.0

MOBITECH CORPORATION

6 RAB040100 Film,Inmold BFAA0127401 BFAA0127401 ; ,BLACK , , , BLACK , , , NISSHA PRINTING CO.,

LTD

4 SURY00 Receiver SURY0010114 BWBR1207L-04B-P 30mW 32OHM 105DB 0HZTO0HZ WIRE -

BUJEON ELECTRONICS CO., LTD

4 SACY00 PCB Assembly,Flexible - SACY0127201 LG-C320 BOOWA FLEXIBLE 1.0

5 SACE00 PCB Assembly,

Flexible,SMT - SACE0114501 LG-C320 BOOWA FLEXIBLE 1.0

6 EAX010700 PCB,Flexible SPCY0246901 SPCY0246901 LG-C320i IDNWA,FLEXIBLE,D,POLYI,.12

mm,DOUBLE SI FLEX CO., LTD

6 SACC00 PCB Assembly,

Flexible,SMT Bottom SACC0085002 LG-C320 BOOWA FLEXIBLE 1.0

6 SACD00 PCB Assembly,

Flexible,SMT Top - SACD0098702 LG-C320 BOOWA FLEXIBLE 1.0

7 C101,C102 Varistor SEVY0005201 EVLC5S02050 5.5V 0% 50F 1.0*0.5*0.6 - SMD R/TP AMOTECH

CO., LTD.

7FB101,

FB102 Inductor,Multilayer,Chip ELCH0004727 1005GC2TR10J00 100NH 5% 0V 100mA 2.3OHM 600MHZ 8 NON

SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.

7 CN102 Connector,BtoB ENBY0040401 GB042-50P-H10-E3000 50P 0.4MM STRAIGHT PLUG SMD R/TP

1M - LS Mtron Ltd.

7VA101,

VA102 Varistor SEVY0003901 EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP

AMOTECH CO., LTD.

12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered

- 164 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

7 CN103 Connector,BtoB ENBY0042601 GB042-54P-H10 54P 0.40MM STRAIGHT MALE SMD R/TP 1M - LS

Mtron Ltd.

7 C103 Capacitor,Ceramic,Chip ECCH0000198 CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP .

SAMSUNG ELECTRO-MECHANICS CO., LTD.

7 M101 Capacitor Assembly SMZY0023501 PAS311HR-VG1 3.8 Backup Capacitor 0.03F,Module Assembly,

KOREA TAIYO YUDEN.CO., LTD.

7 ZD101 Diode,TVS EDTY0008601 PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1 PROTEK

DEVICES INC.

7 R101 Resistor,Chip ERHY0000254 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

4 SAEY00 PCB Assembly,Keypad - SAEY0074701 LG-C320 BOOWA KEYPAD 1.0

5 EBR070900 PCB Assembly,

Keypad,Insert - EBR72665301 LGC320.ABOOWA KEYPAD 1.0

5 SAEE PCB Assembly,

Keypad,SMT - SAEE0039402 LG-C320 BOOWA KEYPAD 1.1

6 SAEC PCB Assembly,

Keypad,SMT Bottom - SAEC0038302 LG-C320 BOOWA KEYPAD 1.0

7 R101,R102 Resistor,Chip ERHZ0000434 MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

7 C101,C102 Capacitor,Ceramic,Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C 1005 R/TP

- TDK CORPORATION

7 CN101 Connector,BtoB ENBY0040501 GB042-50S-H10-E3000 50P 0.4MM STRAIGHT SOCKET SMD R/TP

1M - LS Mtron Ltd.

7 CN102 Connector,FFC/FPC/PIC ENQY0014901 GF032-35S-E2000 35P 0.30MM FPC STRAIGHT BOTH SMD R/TP

LOCKING - LS Mtron Ltd.

R105,R106,R

107,R108,R1

09,R110

Resistor,Chip ERHZ0000402 MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

7VA101,

VA102 Varistor SEVY0003901 EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP

AMOTECH CO., LTD.

6 SAED PCB Assembly,

Keypad,SMT Top - SAED0037602 LG-C320 BOOWA KEYPAD 1.0

LD103,

LD104,

LD105,

LD106,

LD107,

LD108

LED,Chip EDLH0014803 SSC-WH107 WHITE 2.7~3.1 20mA 100~230mcd x, y 64mW 1608

R/TP 2P - SEOUL SEMICONDUCTOR CO.,LTD

6 SPEY00 PCB,Keypad SPEY0068201 SPEY0068201 LG-C320i IDNWA,KEYPAD,D,FR-4,.8 mm,BUILD-UP

4 UNITECH PRINTED CIRCUIT BOARD CORP.

4 SVLM00 LCD,Module-TFT SVLM0038101

DM24-DSM04

Main,2.4,320*240,54.3*46.8*1.7t,262K,TFT,TM,S6D05A0,Landscape

Type,16bit IF,For Bar Type Phone, LG Display Co. Ltd.

3 SAFY00 PCB Assembly,Main - SAFY0399101 LG-C320 MAIN 1.0

- 165 -

Only for training and service purposes

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

4 SAFB00 PCB Assembly,

Main,Insert - SAFB0126901 LG-C320 BOOWA MAIN 1.1

5 RAA050100 RESIN,PC BRAH0001301 UF-1060,; , , , ,[empty]

5 SVCY00 Camera Module SVCY0026901 C2FK-H313A C2FK-H313A 2M FF, Hynix(1/5"), 7x7x4.1t, Socket LG

Innotek.com

5 SPKY00 PCB,Sidekey SPKY0094301 SPKY0094301 LG-C320i IDNWA,SIDEKEY,C,POLYI,0.18

mm,DOUBLE SI FLEX CO., LTD

4 SAFF00 PCB Assembly,

Main,SMT - SAFF0298001 LG-C320 MAIN 1.0

5 SAFC00 PCB Assembly,

Main,SMT Bottom - SAFC0162201 LG-C320 BOOWA MAIN 1.2

6 S601 Card Socket ENSY0022201 CAM-H88 24,ETC,mm,7*7,1.3M (1/5") Socket Type MITSUMI

ELECTRIC CO.,LTD.

6 L207 Inductor,Multilayer,Chip ELCH0004729 1005GC2T56NJ00 56NH 5% 0V 200mA 1.6OHM 900MHZ 8 NON

SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.

6 C103 Capacitor,Ceramic,Chip ECCH0000198 CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP .

SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 C735 Capacitor,Ceramic,Chip ECCH0000110 MCH155A100D 10pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP -

ROHM Semiconductor KOREA CORPORATION

6 C120,C739 Capacitor,Ceramic,Chip ECCH0000112 MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

C301,C303,C

304,C404,C4

Capacitor,Ceramic,Chip ECCH0000115 MCH155A220JK 22pF 5% 50V NP0 -55TO+125C 1005 R/TP -

ROHM Semiconductor KOREA CORPORATION

6 C110 Capacitor,Ceramic,Chip ECCH0000117 CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C 1005 R/TP 0.5

SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 C143 Capacitor,Ceramic,Chip ECCH0000195 GRM1555C1H3R9C 3.9pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP

- MURATA MANUFACTURING CO.,LTD.

6 C417,C525 Capacitor,Ceramic,Chip ECCH0000120 MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 C708 Capacitor,Ceramic,Chip ECCH0000137 C1005X7R1H331KT000F 0.33nF 10% 50V X7R -55TO+125C 1005

R/TP - TDK KOREA COOPERATION

6VA101,

VA102 Varistor SEVY0003901 EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP

AMOTECH CO., LTD.

- 166 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

C208,C211,C

212,C213,C2

14,C215,C21

6,C217,C218

,C219,C220,

C221,C222,C

223,C229,C2

31,C235,C23

6,C305,C306

,C307,C308,

C309,C310,C

605,C606,C7

01,C709

Capacitor,Ceramic,Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -55TO+85C 0603

R/TP - TDK CORPORATION

6 C101,C102 Capacitor,Ceramic,Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C 1005 R/TP

- TDK CORPORATION

C105,C117,C

118,C122,C1

30,C135,C51

9,C520,C521

Capacitor,Ceramic,Chip ECZH0000830 C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C 1005

R/TP - TDK KOREA COOPERATION

6 C230,C233 Capacitor,Ceramic,Chip ECCH0006201 C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -55TO+85C 1608

R/TP - TDK CORPORATION

C121,C225,C

246,C252,C2

54,C255

Capacitor,Ceramic,Chip ECCH0007803 CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608 R/TP

0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD.

C226,C227,C

237,C244,C2

57,C258,C25

Capacitor,Ceramic,Chip ECCH0007802 CV105X5R475M10AT 4.7uF 20% 10V X5R -55TO+85C 1608 R/TP -

KYOCERA CORP.

6C234,C240,C

241,C243 Capacitor,Ceramic,Chip ECCH0009103 C0603C0G1H101JT00NN 100pF 5% 50V X7R -55TO+125C 0603

R/TP - TDK CORPORATION

C242,C253,C

256,C298,C7

21,C725,C72

Capacitor,Ceramic,Chip ECCH0009106 C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C 0603 R/TP -

TDK CORPORATION

6 C127 Capacitor,Ceramic,Chip ECCH0009110 C0603X7R0J223KT 22nF 10% 6.3V X7R -55TO+125C 0603 R/TP -

TDK CORPORATION

6 C129 Capacitor,Ceramic,Chip ECCH0009226 GRM0335C1E390J 39pF 5% 25V X7R -55TO+125C 0603 R/TP -

MURATA MANUFACTURING CO.,LTD.

6 C128 Capacitor,Ceramic,Chip ECCH0009228 GRM033R61A472K 4700pF 10% 25V X5R -55TO+85C 0603 R/TP -

MURATA MANUFACTURING CO.,LTD.

6 C722,C723 Capacitor,Ceramic,Chip ECCH0009514 MCH032A(AN)100DK 10pF 0.5PF 25V X7R -55TO+125C 0603 R/TP

- ROHM.

6 C602,C603 Capacitor,Ceramic,Chip ECCH0010501 GRM1555C1H7R5D 7.5pF C0G TYPE(No X7R) MURATA

MANUFACTURING CO.,LTD.

6C412,C414,C

415 Capacitor,TA,Conformal ECTH0002002

F981A336MSA 33F 20% 10V 3.3A -55TO+85C 6OHM

2.2X1.1X1.1MM - SMD R/TP NICHICON CORPORATION, EAST

JAPAN SALES OFFICE

- 167 -

Only for training and service purposes

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

6 C526 Capacitor,TA,Conformal ECTH0004807 TCM1A106M8R 10F 20% 10V 500mA -55TO+85C 15OHM - - SMD

R/TP ROHM.

6 C113 Capacitor,Ceramic,Chip ECZH0000802 C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP -

TDK KOREA COOPERATION

6C232,C260,C

267 Capacitor,Ceramic,Chip ECCH0000122 MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005 R/TP -

ROHM Semiconductor KOREA CORPORATION

6 C740 Capacitor,Ceramic,Chip ECZH0000816 C1005C0G1H120JT000F 12pF 5% 50V NP0 -55TO+125C 1005

R/TP - TDK KOREA COOPERATION

6C102,C104,C

107 Capacitor,Ceramic,Chip ECCH0000701 C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0 -55TO+125C 1005

R/TP - TDK CORPORATION

VA504,

ZD606,

ZD607

Diode,TVS EDTY0009101 ESD9X5.0ST5G 5V 6.2 12.3V 8.7A 107W SOD528 R/TP 2P 1 ON

SEMICONDUCTOR

6 C126 Capacitor,Ceramic,Chip ECZH0000846 C1005C0G1H8R2CT000F 8.2pF 0.25PF 50V NP0 -55TO+125C 1005

R/TP - TDK KOREA COOPERATION

6 C114 Capacitor,Ceramic,Chip ECZH0001002 C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -55TO+125C 1005

R/TP - TDK KOREA COOPERATION

6 C706,C707 Capacitor,Ceramic,Chip ECZH0001210 C1005Y5V1A474ZT000F 470nF -20TO+80% 10V Y5V -30TO+85C

1005 R/TP - TDK KOREA COOPERATION

C134,C312,C

401,C409,C4

Capacitor,Ceramic,Chip ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005 R/TP

- TDK KOREA COOPERATION

C204,C261,C

262,C263,C2

64,C266,C27

6,C299,C302

,C405,C413

Capacitor,Ceramic,Chip ECZH0003103 GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP

- MURATA MANUFACTURING CO.,LTD.

ZD305,

ZD306,

ZD307,

ZD308,

ZD310,

ZD311

Diode,TVS EDTY0010101 ESD9B5.0ST5G ESD9B5.0ST5G,SOD-923,5 V,300 mW,R/TP,15pF

SCG HONG KONG SAR LTD.

6 C403,C408 Capacitor,Ceramic,Chip ECZH0003503 GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608 R/TP -

MURATA MANUFACTURING CO.,LTD.

6 C402 Capacitor,Ceramic,Chip ECZH0003504 GRM188R71E104K 100nF 10% 25V X7R -55TO+125C 1608 R/TP -

MURATA MANUFACTURING CO.,LTD.

6FB501,

FB703 Filter,Bead SFBH0000903 HB-1M1005-601JT 600 ohm 1.0*0.5*0.5 SMD R/TP 2P CERATECH

CORPORATION

6 C806,C807 Capacitor,Ceramic,Chip ECZH0004402 MCH153C104ZK 0.1uF 10% 16V NP0 -55TO+125C 1005 R/TP -

ROHM Semiconductor KOREA CORPORATION

6 C101,C102 Varistor SEVY0005201 EVLC5S02050 5.5V 0% 50F 1.0*0.5*0.6 - SMD R/TP AMOTECH

CO., LTD.

- 168 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

VA508,

VA509,

VA601,

VA602,

VA603,

VA604

Varistor SEVY0003801 EVLC18S02015 18V 0% 15F 1.0*0.5*0.6 NONE SMD R/TP

AMOTECH CO., LTD.

6C228,C245,C

734 Capacitor,Ceramic,Chip ECZH0025920 GRM033R71C102K 1nF 10% 16V X7R -55TO+125C 1608 R/TP -

MURATA MANUFACTURING CO.,LTD.

6C109,C705,C

742 Capacitor,Ceramic,Chip ECZH0000813 C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C 1005 R/TP -

TDK KOREA COOPERATION

6 D202 Diode,Switching EDSY0011901 SDB310Q 340mV 30V 200mA 1A 0SEC 150mW EMD2 R/TP 2P 1

AUK CORP

6 D201 Diode,Switching EDSY0017702 SDB0530 360mV 30V 500mA 3A 0SEC 200mW SOD323 R/TP 2P 1

AUK CORP

6 ZD101 Diode,TVS EDTY0008601 PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1 PROTEK

DEVICES INC.

C207,C209,C

210,C275,C4

06,C501,C50

Capacitor,Ceramic,Chip ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP -

MURATA MANUFACTURING CO.,LTD.

6 L501 Inductor,Multilayer,Chip ELCH0001444 0402AF-101XJEW 0402AF-101XJLW,100 nH,J,1005,R/TP,chip coil

COILCRAFT SINGAPORE PTE LTD.

6 L101,L102 Inductor,Multilayer,Chip ELCH0004701 1005GC2T12NJ00 12H 5% 0V 250mA 0.48OHM 2.1GHZ 8 NON

SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.

6 L109,L111 Inductor,Multilayer,Chip ELCH0004705 1005GC2T8N2J00 8.2NH 5% 0V 250mA 0.37OHM 2.8GHZ 8 NON

SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.

6L107,L108,

L115,L116 Inductor,Multilayer,Chip ELCH0004708 1005GC2T2N7S00 2.7NH 5% 0V 200mA 1.3OHM 1GHZ 8 NON

SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.

6 L110 Inductor,Multilayer,Chip ELCH0004721 1005GC2T2N2S00 2.2NH 5% 0V 300mA 0.13OHM 7GHZ 8 NON

SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.

6L114,L204,

L205 Inductor,Multilayer,Chip ELCH0004715 1005GC2T27NJ00 27NH 5% 0V 200mA 0.9OHM 1.4GHZ 8 NON

SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.

6FB101,

FB102 Inductor,Multilayer,Chip ELCH0004727 1005GC2TR10J00 100NH 5% 0V 100mA 2.3OHM 600MHZ 8 NON

SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.

6 L118 Inductor,Multilayer,Chip ELCH0004730 1005GC2T33NJ00 33NH 5% 0V 200mA 1OHM 1.3GHZ 8 NON

SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.

L801,L802,

L803,L804,

L805,L806

Inductor,Multilayer,Chip ELCH0005019 HK100568NJ 68NH 5% 0V 8A 1.2GOHM 700mHZ 180m NON

SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN CO.,LTD

6 L208 Inductor,Wire Wound,

chip ELCP0008013 MIPSZ2012D2R2 MIPSZ2012D2R2,2.2 uH,N,2.0X1.2X1.0,R/TP FDK

CORPORATION.

6L201,L202,

L203

Inductor,Wire Wound,

chip ELCP0008014 MIPSZ2012D4R7 MIPSZ2012D4R7,4.7 uH,N,2.0X1.2X1.0,R/TP FDK

CORPORATION.

6 CN803 Connector,BtoB ENBY0053001 51338-0274 20P 0.40MM STRAIGHT FEMALE SMD R/TP 1.5M -

HANKOOK MOLEX

- 169 -

Only for training and service purposes

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

6 J501 Jack,Phone ENJE0007601 KJA-PH-0-0176 1P 4P ANGLE R/TP 4mM BLACK 6P - KSD CO.,

LTD

6C201,C205,C

206,C311 Capacitor,Ceramic,Chip ECCH0005604 GRM188R60J106M 10000000 pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm

MURATA MANUFACTURING CO.,LTD.

6 CN401 connector,I/O ENRY0008801 GU073-5P-SD-E1500 GU073-5P-SD-E1500,5,mm,ANGLE LS Mtron

Ltd.

6 J301 Card Socket ENSY0025901 GCA26A-8S-H16-M-E1000 SIM 8P ANGLE SMD R/TP - LS Mtron

Ltd.

6 SW101 Connector,RF ENWY0008701 MS-156C NONE STRAIGHT SOCKET SMD T/REEL AU 50OHM

400mDB HIROSE KOREA CO.,LTD

6 CN402 Connector,Terminal

Block ENZY0028601 04-9248-003-017-829+ 3P 2.50MM STRAIGHT SMD R/TP -

KYOCERA ELCO KOREA SALES CO.,LTD.

6 Q501 FET EQFP0007601 KTJ6131E P-CHANNEL MOSFET -30V +-20 -0.05A 20OHM 100mW

ESM R/TP 3P KEC CORPORAITION

6C251,C720,C

724 Capacitor,Ceramic,Chip ECCH0007804 CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005 R/TP

0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 R703 Resistor,Chip ERHY0000128 MCR01MZP5F1502 15KOHM 1% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R406 Resistor,Chip ERHY0000185 MCR01MZP5F8200 820OHM 1% 1/16W 1005 R/TP - ROHM.

6 R110,R111 Resistor,Chip ERHY0000241 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

R307,R308,R

309,R310,R3

Resistor,Chip ERHY0000275 MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R205 Resistor,Chip ERHY0003201 MCR01MZP5F1001 1KOHM 1% 1/16W 1005 R/TP - ROHM.

6 R262 Resistor,Chip ERHY0009505 MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 C115,C265 Capacitor,Ceramic,Chip ECZH0000803 C1005C0G1H020CT000F 2pF 0.25PF 50V NP0 -55TO+125C 1005

R/TP - TDK KOREA COOPERATION

6 R207 Resistor,Chip ERHZ0000486 MCR01MZP5J473 47KOHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R107 Resistor,Chip ERHY0009586 MCR006YZPF2201 2.2KOHM 1% 1/20W 0603 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R263 Resistor,Chip ERHY0024201 MCR01MZP5F6041 6040 ohm,1/16W,F,1005,R/TP ROHM.

6 R404 Resistor,Chip ERHZ0000201 MCR01MZP5F1000 100OHM 1% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R201,R260 Resistor,Chip ERHZ0000204 MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R510,R511 Resistor,Chip ERHZ0000205 MCR01MZP5F1004 1MOHM 1% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6L103,L104,

L117 Inductor,Multilayer,Chip ELCH0004706 1005GC2T10NJ00 10NH 5% 0V 250mA 0.42OHM 2.5GHZ 8 NON

SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.

- 170 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

6 R601,R602 Resistor,Chip ERHZ0000206 MCR01MZP5F10R0 10OHM 0.1% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R807 Resistor,Chip ERHZ0000213 MCR01MZP5F1203 120KOHM 1% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6R103,R104,R

112,R113 Resistor,Chip ERHZ0000219 MCR01MZP5F1500 150OHM 1% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R405 Resistor,Chip ERHZ0000236 MCR01MZP5F2001 2KOHM 1% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R403 Resistor,Chip ERHZ0000318 MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

R272,R302,R

303,R304,R5

Resistor,Chip ERHZ0000405 MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R282,R402 Resistor,Chip ERHZ0000406 MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R101,R102 Resistor,Chip ERHZ0000434 MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R301 Resistor,Chip ERHZ0000438 MCR01MZP5J203 20KOHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

R219,R266,R

267,R268,R2

69,R401,R50

Resistor,Chip ERHZ0000443 MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R808,R809 Resistor,Chip ERHZ0000465 MCR01MZP5J332 3.3KOHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R102,R114 Resistor,Chip ERHZ0000473 MCR01MZP5J390 39OHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 C119 Capacitor,Ceramic,Chip ECCH0000143 MCH155CN102KK 1nF 10% 50V X7R -55TO+125C 1005 R/TP -

ROHM Semiconductor KOREA CORPORATION

6 R264,R265 Resistor,Chip ERHZ0000484 MCR01MZP5J471 470OHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R273 Resistor,Chip ERHZ0000490 MCR01MZP5J510 51OHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 U802 IC,Bus Controller EUSY0300008 PP2106M3 1.8/2.6V 1mA - MLF R/TP 28P - G5 CORPORATION

6 U803 IC,Analog Switch EUSY0347001

DG2735DN-T1-E4 MiniQFN-10L ,10 PIN,R/TP ,1.8X1.4X0.55,0.6

Dual SPDT Analog Switch ,; ,IC,Analog Switch VISHAY

INTERTECHNOLOGY ASIA PTE LTD

6 U301 IC,MCP,NAND EUSY0347506 H8BCS0SI0BAR-46M NAND/2G SDRAM/1G 1.7VTO1.9V

14.0x10.0x1.2 TR 149P - - - HYNIX SEMICONDUCTOR INC.

6 U501 IC,LDO Voltage

Regulator EUSY0355501 RP103K181D-TR-F 1.7V TO 5.25V 1.85V 400mW DFN R/TP 4P -

RICOH COMPANY, LTD.

6 U701 Module,Assembly EUSY0385901 TEA5991UK TEA5991_UK,WL-CSP(BSC),20,R/TP,FM Tuner

(RDS),2.6*2.6*0.64 ST-Ericsson Asia Pacific Pte Ltd

- 171 -

Only for training and service purposes

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

6 U401 IC,Voltage Reference EUSY0410801 RT9524 DFN,10,R/TP,DFN Cal Test Mode Single Charger IC for

Micro USB,IC,ChargerIC,Charger RICHTEK TECHNOLOGY CORP.

6 U703 IC,Bluetooth EUSY0418701 BCM2070B2KUBXG 2.3VTO5.5V 158.4mW WLBGA R/TP 42P -

BROADCOM ASIA DISTRIBUTION PTE LTD

6 L112,L119 Inductor,Multilayer,Chip ELCH0004703 1005GC2T1N0S00 1005GC2T1N0S00,1 nH,S ,1005 ,R/TP , PILKOR

ELECTRONICS LTD.

6 U201 IC,Digital Baseband

Processor,GSM EUSY0423201 ESC6270 0VTO0V 0W BGA R/TP 424P - QUALCOMM

INCORPORATED.

6 IC401 IC,Analog Multiplexer EUSY0424801

RT8963WS WLCSP,20,R/TP,MUIC-Basic,USB

HS,UART,Audio,IC,Analog MultiplexerIC,Analog Multiplexer

RICHTEK TECHNOLOGY CORP.

6 X702 Crystal EXXY0024401 TSX-3225 26MHZ 26MHZ 10PPM 10pF NA SMD R/TP SEIKO

EPSON CORP

6 X202 Crystal EXXY0025101 DSX321G - 10PPM - - - SMD P/TP DAISHINKU CORPORATION.

6 R261 Resistor,Chip ERHZ0000222 MCR01MZP5F1503 150KOHM 1% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R281 Resistor,Chip ERHY0000279 91K ohm,1/16W,J,1005,R/TP

6 X201 Crystal EXXY0026901 Q13FC1350000300 32.768KHZ 20PPM 0F NONE SMD R/TP

EPSON TOYOCOM CORP

6 C239 Capacitor,Ceramic,Chip ECZH0001116 C1005X7R1H271KT000F 270pF 10% 50V X7R -55TO+125C 1005

R/TP - TDK KOREA COOPERATION

6 R284,R814 Wire Pad,Open SAFO0000501 AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM_1005_DNI

R702,R705,R

706,R707,R7

08,R709,R71

0,R711,R712

,R713,R714,

R715

PCB ASSY,MAIN,PAD

SHORT SAFP0000401 LG-LU3000 LGTBK,MAIN,A,

6R109,R283,R

803 Wire Pad,Short SAFP0000501 LG-VS760 VRZ

6 L1113,L206 Inductor,Multilayer,Chip ELCH0004710 1005GC2T15NJ00 15NH 5% 0V 250mA 0.53OHM 2GHZ 8 NON

SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS LTD.

6 PT201 Thermistor SETY0007301

NCP15WF104F03RC NTC,100000 ohm,SMD,4250K+/-

1%,100K,1%,0.1mA,4250K+/-1%,SMD,R/TP MURATA

MANUFACTURING CO.,LTD.

6 VA201 Varistor SEVY0001001 EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMD R/TP

AMOTECH CO., LTD.

6 C137 Capacitor,Ceramic,Chip ECCH0000196 MCH155A0R75C 0.75pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP -

ROHM Semiconductor KOREA CORPORATION

6 VA401 Varistor SEVY0003601 ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE SMD R/TP

INNOCHIPS TECHNOLOGY

6VA264,

VA265 Varistor SEVY0005403 ICVS0518270FR 18V 0% 27F 1.0X0.5X0.55 NONE SMD R/TP

INNOCHIPS TECHNOLOGY

- 172 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

6 FL101 Filter,Separator,FEM SFAY0011101 D5008 - - - D5008,850.900 ,1800.1900 ,3.8 dB,4.1 dB, dB, dB,4532

,4.5X3.2 Size Quad Band FEM EPCOS PTE LTD.

FB503,

FB504,

FB505

Filter,Bead SFBH0008102 BLM15HD182SN1 1800 1.0x0.5x0.5MM SMD R/TP 2P MURATA

MANUFACTURING CO.,LTD.

6 FL701 Filter,Ceramic SFCY0000901 LFB212G45SG8A166 BPF 2.45KHZ 100Hz SMD R/TP 4P MURATA

MANUFACTURING CO.,LTD.

FL806,

FL807,

FL808,

FL809

Filter,EMI/Power SFEY0012401 ICVE10054E250R101FR ESD/EMI 0HZ 25pF 0H SMD R/TP

INNOCHIPS TECHNOLOGY

FL802,

FL803,

FL804,

FL805,

FL810,

FL811

Filter,EMI/Power SFEY0013201 EVRC14S03Q030100R ESD/EMI 0HZ 15pF 0H SMD R/TP

AMOTECH CO., LTD.

FL601,

FL602,

FL603

Filter,EMI/Power SFEY0013701 EVRC18S03Q015100R ESD/EMI 330HZ 15F 0H SMD R/TP

AMOTECH CO., LTD.

6 FL401 Filter,EMI/Power SFEY0015301 NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TP MURATA

MANUFACTURING CO.,LTD.

6 U101 IC,Power Amplifier SMPY0019101 SKY77336 SKY77336,dBm,%,A,dBc,dB,5x5,SMD,Polar Edge for

QCT SKYWORKS SOLUTIONS INC.

6 SUMY00 Microphone,Condenser SUMY0010610 SPM0410LR5H-QB SPM0410LR5H-QB,UNIT,42

dB,4.72*3.76*1.25,mems TDMA Improve KNOWLES ACOUSTICS

5 SAFD00 PCB Assembly,

Main,SMT Top - SAFD0159501 LG-C320 BOOWA MAIN 1.0

6 EAX010000 PCB,Main SPFY0235601

SPFY0235601 FR-4 Staggered via STAGGERED-10 0.8 LG-C320i

IDNWA,MAIN,D,FR-4,0.8 mm,STAGGERED-10,MAIN UNITECH

PRINTED CIRCUIT BOARD CORP.

6 C417,C525 Capacitor,Ceramic,Chip ECCH0000120 MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 C103 Capacitor,Ceramic,Chip ECCH0000198 CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005 R/TP .

SAMSUNG ELECTRO-MECHANICS CO., LTD.

C207,C209,C

210,C275,C4

06,C501,C50

Capacitor,Ceramic,Chip ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP -

MURATA MANUFACTURING CO.,LTD.

6C251,C720,C

724 Capacitor,Ceramic,Chip ECCH0007804 CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005 R/TP

0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.

- 173 -

Only for training and service purposes

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

C208,C211,C

212,C213,C2

14,C215,C21

6,C217,C218

,C219,C220,

C221,C222,C

223,C229,C2

31,C235,C23

6,C305,C306

,C307,C308,

C309,C310,C

605,C606,C7

01,C709

Capacitor,Ceramic,Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -55TO+85C 0603

R/TP - TDK CORPORATION

6 C722,C723 Capacitor,Ceramic,Chip ECCH0009514 MCH032A(AN)100DK 10pF 0.5PF 25V X7R -55TO+125C 0603 R/TP

- ROHM.

C105,C117,C

118,C122,C1

30,C135,C51

9,C520,C521

Capacitor,Ceramic,Chip ECZH0000830 C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C 1005

R/TP - TDK KOREA COOPERATION

C134,C312,C

401,C409,C4

Capacitor,Ceramic,Chip ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005 R/TP

- TDK KOREA COOPERATION

6 C506,C507 Capacitor,Ceramic,Chip ECZH0001217 GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C 1005 BK-DUP

- MURATA MANUFACTURING CO.,LTD.

C204,C261,C

262,C263,C2

64,C266,C27

6,C299,C302

,C405,C413

Capacitor,Ceramic,Chip ECZH0003103 GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP

- MURATA MANUFACTURING CO.,LTD.

6 C508,C509 Capacitor,Ceramic,Chip ECZH0003126 GRM155R71A393K - - - - -55TO+125C - - - MURATA

MANUFACTURING CO.,LTD.

6 C268 Capacitor,Ceramic,Chip ECZH0025916 GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C 0603 R/TP -

MURATA MANUFACTURING CO.,LTD.

6LD801,

LD802 LED,Chip EDLH0013701 WHITE 2.9~3.2 20mA X(0.264~0.311) Y(0.248~0.315) 110mW

3.8*1.0*0.4t 3810 R/TP 2P -

6 CN801 Connector,BtoB ENBY0042701 GB042-54S-H10 54P 0.4MM STRAIGHT SOCKET SMD R/TP 1M -

LS Mtron Ltd.

6 CN260 Connector,BtoB ENBY0045201 AXT610124 10P 0.4MM STRAIGHT HEADER SMD R/TP 1M - BJ

PANASONIC ELECTRONIC PARTS CO.,LTD

6 R101 Resistor,Chip ERHY0000254 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

R105,R106,R

107,R108,R1

09,R110

Resistor,Chip ERHZ0000402 MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 R282,R402 Resistor,Chip ERHZ0000406 MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

- 174 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

6 R506,R507 Resistor,Chip ERHZ0000435 MCR01MZP5J200 20OHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

6 U601 IC,Charge Pump EUSY0344403 RT9396GQW QFN,24,R/TP,4CH+2LDO,IC,Sub PMICIC,Sub PMIC

RICHTEK TECHNOLOGY CORP.

6 IC501 IC,Audio Sub System EUSY0403901 WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P - WOLFSON

MICROELECTRONICS PLC

6 U801 Sensor,Accelerator EUSY0408901 S-5711ACDL 2.5 to 3.3 Y R/TP 4P - SEIKO INSTRUMENTS INC

6 R284,R814 Wire Pad,Open SAFO0000501 AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM_1005_DNI

6R109,R283,

R803 Wire Pad,Short SAFP0000501 LG-VS760 VRZ

6VA101,

VA102 Varistor SEVY0003901 EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD R/TP

AMOTECH CO., LTD.

6VA264,

VA265 Varistor SEVY0005403 ICVS0518270FR 18V 0% 27F 1.0X0.5X0.55 NONE SMD R/TP

INNOCHIPS TECHNOLOGY

6FB501,

FB703 Filter,Bead SFBH0000903 HB-1M1005-601JT 600 ohm 1.0*0.5*0.5 SMD R/TP 2P CERATECH

CORPORATION

6 FB502 Filter,Bead SFBH0001501 HH-1M1608-121JT 120 ohm 1.6*0.8*0.8 SMD R/TP 2P CERATECH

CORPORATION

6FB507,

FB508 Filter,Bead SFBH0009801 HH-1M1005-601JT 600Ohm 1.0 * 0.5 * 0.5 SMD P/TP 2P

CERATECH CORPORATION

- 175 -

Only for training and service purposes

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

by SBOM standard on GCSC

Level LocationNo. Description PartNumber Spec Remark

2 SBPL00 Mobile Phone Battery Li-

Ion SBPL0098901 LGIP-430N-WW-LGC LGIP-430N-WW-LGC,3.7 V,900 mAh,1

CELL,PRISMATIC ,463450,innerpack, WW LG CHEMICAL

2 EAB010200 Earphone,Stereo SGEY0003744 EMB-LGE004MSKB 3mW 16OHM 115DB 85HZTO126HZ 1M

BLACK 3.5 L TYPE STEREO 4POLE PLUG - CRESYN CO.,LTD

2 EAY060000 Adapters SSAD0033602 STA-U34AR STA-U34AR,100-240V,5060 Hz,5.1 V,0.7 A,C-Tick,AC-

DC ADAPTOR SUNLIN ELECTRONICS CO.,LTD

12.3 Accessory Note: This Chapter is used for reference, Part order is ordered

Lg C320 Users Manual C320_SVC ENG_101007

LG-C320 to the manual e3475751-5423-4144-b3a9-4de7607efb28

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