MMB Research CSB04PA1X MMB Networks ZigBee/Thread/BLE Module User Manual

MMB Research Inc. MMB Networks ZigBee/Thread/BLE Module

User Manual

Page 1Rev 0.3 © MMB Networks 2018 CSB04PA1x Module Data SheetPre-loaded with RapidConnect rmware Ensures compatibility with latest Zigbee, Thread and BLE specicationsMMB Networks EFR32 Zigbee/Thread/BLE ModuleCSB04PA10 / PA11 Document Rev 0.3The MMB Networks CSB04PA1x family is the latest generation Zigbee, Thread, and BLE capable module. Based on the EFR32 multi-protocol IC from Silicon Labs, the CSB04PA1x are drop-in Zigbee 3.0, Thread and BLE 5.0 solutions. Preloaded with MMB Networks’ RapidConnect Home Automation application, it oers hardware vendors an easy way to integrate a fully-implemented, automated Zigbee, Thread or BLE Home Automation platform into their existing devices.MMB Networks oers a variety of hardware and software development tools to facilitate integration. For more information, please visit http://www.mmbnetworks.comFeatures Benets+19, and +10dBm transmit power options Power and price optimized to meet end product transmit power requirementsBuilt on Silicon Labs EFR32 Wireless Gecko Family Industry leading 802.15.4 MCU ensures best-in-class performanceCertied application layer, onboard stack, antenna and regulatory approvalsProvides rapid time-to-market and short implementation timeUp to 121 dB link budget Delivers unmatched range for dicult installationsSMD Chip Antenna or U.FL RF connector options Allows for external antennas where required15.88mm x 12.6mm x 2.4mm module size Tiny module size will t in the most miniature applications15 GPIO (General Purpose Input/Output) connections Flexibility to drive simple to complex devicesPreliminary Information
Page 2Rev 0.3 © MMB Networks 2018 CSB04PA1x Module Data SheetContents1 | General Information ......................................................................................................................................................32 | Memory .............................................................................................................................................................................. 33 | Module Pinout .................................................................................................................................................................33.1 | Debug and Programming Interface ................................................................................................................44 | Electrical Specications ................................................................................................................................................44.1 | Absolute Maximum Ratings ............................................................................................................................... 44.2 | Recommended Operating Conditions ........................................................................................................... 44.3 | DC Electrical Characteristics ...............................................................................................................................54.3.1 | Typical Transmit Performance Curves (Supply Current vs. Tx Power Setting) ...............................55 | RF Specications .............................................................................................................................................................65.1 | Receive Specications ..........................................................................................................................................65.2 | Transmit Specications ........................................................................................................................................65.2.1 | Typical Transmit Performance Curves (Output Power vs. Tx Power Setting) .................................76 | Functional Specications .............................................................................................................................................76.1 | Serial Ports ................................................................................................................................................................ 77 | Mechanical Specications ...........................................................................................................................................87.1 | Module Physical Dimensions and Host PCB Antenna Keep-out ...........................................................87.2 | Recommended Land Pattern (Surface Mount) ...........................................................................................97.3 | RF Connector Dimensions ............................................................................................................................... 107.4 | Label Drawings .................................................................................................................................................... 108 | Soldering Temperature Time Prole for reow soldering (Lead-free solder) ......................................... 119 | Regulatory Approvals................................................................................................................................................. 119.1 | Federal Communications Commission (FCC - US) ...................................................................... 119.2 | Industry Canada (IC) .......................................................................................................................................... 139.3 | RoHS Compliance .................................................................................................................................. 149.4 | FCC & IC Compliance ............................................................................................................................ 1410 | Revision History ......................................................................................................................................................... 1411 | Ordering Information .............................................................................................................................................. 15Preliminary Information
Page 3Rev 0.3 © MMB Networks 2018 CSB04PA1x Module Data Sheet1 | General InformationNote that some of the specications refer to either the “EFR32MG13” chip or the “Module”. Specications cited as EFR32 are taken from the EFR32MG13 datasheet (this should also be noted where referred to). Module means measurements taken with our production module.2 | Memory3 | Module PinoutModule Pad FunctionEFR32 Pin Name (number)Mini Simplicity Debug Interface ADC Capable1 2.4GHz antenna line out 2G4RF_IOP (12)2 Module Ground3 EFR32 GPIO, Port D #13 PD13 (14) Yes4 EFR32 GPIO, Port D #14 PD14 (15) Yes5 EFR32 GPIO, Port D #15 PD15 (16) Yes6 EFR32 GPIO, Port A #1 PA1 (18) UART1_RX Yes7 EFR32 GPIO, Port A #0 PA0 (17) UART1_TX Yes8 Digital I/O Power Supply IOVDD (30)9 EFR32 GPIO, Port B #11 PB11 (19) Yes10 EFR32 GPIO, Port B #12 PB12 (20) PTI_DATA Yes11 Module Ground12 Module Ground13 Module Ground14 EFR32 GPIO, Port B #13 PB13 (21) PTI_FRAME Yes15 EFR32 GPIO, Port B #14 PB14 (23) Yes16 EFR32 GPIO, Port B #15 PB15 (24) Yes17 Module Ground GND18 Module Main Power VAEM19 Module Ground20 EFR32 GPIO, Port C #10 PC10 (31) Yes21 EFR32 GPIO, Port C #11 PC11 (32) Yes22 Module Ground23 Reset input, active low RESETn (8) RESET_N24 EFR32 GPIO, Port F #0 PF0 (1) SW_CLK Yes25 EFR32 GPIO, Port F #1 PF1 (2) SW_DIO Yes26 EFR32 GPIO, Port F #2 PF2 (3) SW_O Yes27 Module Ground28 RFGND129 RFGND2Preliminary InformationRAM (kB) On-Chip Flash (kB)64 512
Page 4Rev 0.3 © MMB Networks 2018 CSB04PA1x Module Data Sheet3.1 | Debug and Programming InterfaceIn order to access the EFR32 for programming and debug purposes, it is recommended that the designer incorporate Silcon Labs 10-pin Mini Simplicity connector. The following table shows a pin mapping between Silicon Labs 10-pin Mini Simplicity connector and the module, and the graphic to the right displays the layout of the Mini Simplicity connector.4 | Electrical Specications4.1 | Absolute Maximum RatingsParameter Minimum Maximum UnitsSupply Voltage (VCC) 0 3.6 VVoltage on any GPIO -0.3 VCC + 0.3 VAmbient Operating Temperature (standard version) -40 85 °CStorage Temperature -50 150 °C4.2 | Recommended Operating ConditionsSilicon Labs Simplicity Studio Port Pin Module Pad1 8 (Digital I/O Power Supply)2 17 (Module Ground)3 23 (Reset input, active low)4 6 (EFR32 GPIO, Port A #1)5 7 (EFR32 GPIO, Port A #0)6 26 (EFR32 GPIO, Port F #2)7 25 (EFR32 GPIO, Port F #1)8 24 (EFR32 GPIO, Port F #0)9 14 (EFR32 GPIO, Port B #13)10 10 (EFR32 GPIO, Port B #12)Parameter Minimum Typical Maximum UnitsSupply Voltage (VCC) 2.0 3.3 3.6 VTemperature Range -40 85 °C1 23 45 67 89 10VAEMRSTVCOM_TXSWDIOPTI_FRAMEGNDVCOM_RXSWOSWCLKPTI_DATAPreliminary Information
Page 5Rev 0.3 © MMB Networks 2018 CSB04PA1x Module Data Sheet4.3 | DC Electrical Characteristics4.3.1 | Typical Transmit Performance Curve (Supply Current vs. Tx Power)Note: The graph above is for the PA10 variant. For the PA11 module, the maximum output power is limited to 10.5dBmParameter Test Condition Minimum Typical Maximum UnitsTX CurrentAt 25 °C, VCC = 3.3v, normal mode, 19 dBm 138 mAAt 25 °C, VCC = 3.3v, normal mode, 10 dBm 49 mARX CurrentAt 25 °C, VCC = 3.3v, normal mode, 2.4 GHz, CPU asleep 6 mAAt 25 °C, VCC = 3.3v, normal mode, 2.4 GHz, CPU running 14 mADeep Sleep CurrentAt 25 °C, VCC = 3.3v, shutdown mode. Full RAM retention and RTCC running from LFXO (EM2 mode) 2.3 μA020406080100120140012345678910 11 12 13 14 15 16 17 18 19 20Icc(mA)PowerSettingSupply Current(mA)vs.TXPowerSettingPreliminary Information
Page 6Rev 0.3 © MMB Networks 2018 CSB04PA1x Module Data Sheet5 | RF Specications5.1 | Receive Specications Note: The Typical number indicates one standard deviation above the mean, measured at room temperature (25°C). The Min and Max numbers were measured over process corners at room temperature.Parameter Test Condition Min Typical Max UnitsFrequency range 2400 2483.5 MHzSensitivity - Zigbee and Thread1% PER, 20 byte packet dened by IEEE 802.15.4-2003 -102 dBmSensitivity - Bluetooth Low Energy0.1% BER. Signal is reference signal1, bit rate=125kbps -103 dBm0.1% BER. Signal is reference signal1, bit rate=500kbps -99 dBm0.1% BER. Signal is reference signal1, bit rate=1Mbps -95 dBm0.1% BER. Signal is reference signal1, bit rate=2Mbps -91 dBmNotes:1. Reference signal is dened 2GFSK at -67dBm, Modulation index=0.5, BT=0.5, desired data=PRBS9, interferer data=PRBS15, frequency accuracy better than 1 ppm 5.2 | Transmit SpecicationsParameter Test Condition Min Typical Max Units802.15.4 output power at highest power setting, general limit1CSB04PA10219.2 dBmCSB04PA11210.5 dBm802.15.4 Channel 26 output powerCSB04PA10-CHP 15 dBmCSB04PA11-CHP 10.5 dBmCSB04PA1X-RFC38dBmBLE output power at highest power setting, general limit1CSB04PA10219.2 `` dBmCSB04PA11210.5 dBmBLE Channel 26 output powerCSB04PA10-CHP 19.2 dBmCSB04PA10-RFC 15 dBmCSB04PA11210.5 dBmNotes:1. RF channel 26 operates at special reduced power levels.2. If antenna conguration (CHP- chip antenna or RFC - RF connector) is not specied then value applies to both congurations. 3. 1X includes CSB04PA10, and PA11 variantsPreliminary Information
Page 7Rev 0.3 © MMB Networks 2018 CSB04PA1x Module Data Sheet5.2.1 | Typical Transmit Performance Curves (Output Power vs. Tx Power Setting)Note: The graph above is for the PA10 variant. For the PA11 module, the maximum output power is limited to 10.5 dBm.6 | Functional Specications6.1 | Serial PortsRefer to the EFR32MG13 data sheet for functionality and associated GPIO pinouts. Note: The module pinout table in section 3 of this document provides a cross reference between the MMB module pins and the EFR32 GPIO.Note 2: The RapidConnect rmware supports UART communication with a baud rate of 115.2kbps. However, MMB can modify this conguration as necessary through a Non-Recurring Engineering engagement.024681012141618200246810 12 14 16 18 20Output Power(dBm)PowerSettingOutputPower(dBm)vs.TXPowerSettingPreliminary Information
Page 8Rev 0.3 © MMB Networks 2018 CSB04PA1x Module Data Sheet7 | Mechanical Specications7.1 | Module Physical Dimensions and Host PCB Antenna Keep-out Symbol Description DistanceL Length of the module 15.88 mmW Width of the module 12.60 mmH Height of the module 2.88 mmL1 Second keep-out length 2.27 mmL2 First keep-out length 6.43mmL3Length from module centre to edge of rst keep-out 2.65 mmW1 Second keep-out width 17.41mmW2Distance from edge of rst keep-out to edge of second keep-out 4.41mmW3 First keep-out width 7.62mmW4Width from module centre to edge of rst keep-out 5.4 mmNote: The above table and recommendation apply to CSB04PA1x-CHP products only. Copper keep-out regions apply to all PCB layers. CSB04PA1x-RFC have identical dimensions but do not require an antenna keep-out.The CSB04PA1x family of devices use a System on Module (SOM) package process technology.Preliminary Information
Page 9Rev 0.3 © MMB Networks 2018 CSB04PA1x Module Data Sheet7.2 | Recommended Land Pattern (Surface Mount)The diagram below shows the recommended dimensions and arrangement of the pads for the module. The PCB upon which the module will be mounted should not include any non-ground traces or vias on the top layer directly under the module. All copper features other than the module mounting pads, including ground vias, should be tented or covered with soldermask to avoid coming in contact with the module’s traces and producing unexpected behavior. If it is absolutely necessary to include traces and/or vias under the module due to space constraints, then a customer can elect to do so at their own risk. MMB can provide a Hardware Designer Package to show the module’s footprint and drill locations, which must not line up with the daughtercard’s drill locations.Note: Green box is the size of the top metal layer. Orange is the opening in the soldermask layer.Symbol Description DistanceF1 Distance pad centre to pad centre (vertical: pad 21 to 22) 2.93 mmF2 Distance pad centre to pad centre (vertical: pad 13 to 14) 1.67 mmF3 Distance pad centre to pad centre (horizontal: pad 21 to 22) 3.77 mmF4 Distance pad centre to pad centre (horizontal: pad 13 to 14) 1.69 mmF5 Distance pad centre to RFGND centre (vertical: pad 27 to 28) 0.26 mmF6 Distance pad centre to RFGND centre (horizontal: pad 27 to 28) 2.90mmF7 Pitch (pad to pad) 1.02 mmF8 Pitch (RFGND pad to RFGND pad) 3.52mmF9 RFGND pad metal and soldermask width 1.47mmF10 RFGND pad metal and soldermask length 2.78mmF11 Module width 12.60 mmF12 Module length 15.88 mmF13 Width between silkscreen corners 12.90 mmF14 Length between silkscreen corners 16.18 mmF15 Size of silkscreen corner line 1 mmPreliminary Information
Page 10Rev 0.3 © MMB Networks 2018 CSB04PA1x Module Data Sheet7.3 | RF Connector DimensionsThe diagram below shows the dimensions for the RF connector. This connector appears on the -RFC variants only.7.4 | Label DrawingsNote: Label Drawing will be added upon completion of certicationPreliminary Information
Page 11Rev 0.3 © MMB Networks 2018 CSB04PA1x Module Data Sheet8 | Soldering Temperature Time Prole for reow soldering (Lead-free solder)Maximum reow cycles: 2Opposite-side reow is prohibited due to the module weight. You must not place the module on the bottom / underside of your PCB and re-ow.9 | Regulatory Approvals9.1 | Federal Communications Commission (FCC - US)Note: this section applies to CSB04PA10-CHP and CSB04PA10-RFC devices only.9.1.1 | Approved AntennaeFor the CSB04PA10-CHP modules using the onboard chip antenna, the approved 802.15.4 power level settings are 19.2 dBm for channels 11-25 and 15 dBm for channel 26. The approved BLE power level settings are 19.2dBm for both connected and advertising modes. The onboard chip antenna is Inpaq ACA-2012-A1-CC-S with a gain of 1.72dBi and 50Ω impedance.For the CSB04PA10-RFC modules using the approved external antenna, the approved 802.15.4 power level settings are 19.2 dBm for channels 11-25 and 8 dBm for channel 26. The approved BLE power level settings are 19.2dBm for connected mode and 15dBm for advertising modes. The CSB04PA1x-RFC devices have been approved with the following external FCC approved antennas: Mag Layers EDA-1713-2G4C1-A2, and Bondale G-RA0K13200284-SZ478 with a gain of 5dBi and nominal impedance of 50Ω.9.1.2 | FCC NoticeThe CSB04PA1x-CHP and CSB04PA1x-RFC devices comply with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. To comply with FCC RF Exposure requirements, users of this device must ensure that the module be installed and/or congured to operate with a separation distance of 20cm or more from all persons. Usage of Channel 26 at full power will result in non-compliance to FCC standards. MMB recommends avoiding use of channel 26 and if necessary only use with a reduced power setting. For further details please contact MMB.Preliminary Information
Page 12Rev 0.3 © MMB Networks 2018 CSB04PA1x Module Data SheetThis equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment o and on, the user is encouraged to try to correct the interference by one of the following measures:• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit dierent from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.9.1.3 | Modular Approval The CSB04PA1x-CHP and CSB04PA1x-RFC devices meet the requirements for modular transmitter approval as detailed in the FCC public notice DA 00-1407. It should be noted that: “While the applicant for a device into which an authorized module is installed is not required to obtain a new authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for the device (e.g., a WLAN into which an authorized module is installed must still be authorized as a PC peripheral, subject to the appropriate equipment authorization).” -- FCC Public Notice DA 00-1407 Caution: Changes or modications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.NOTE:This module is intended for an OEM integrator. The OEM integrator is responsible for the compliance to all the rules that apply to the product into which this certied RF module is integrated. Additional testing and certication may be necessary when multiple modules are used.A 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such conguration, the FCC radiation exposure limits set forth for a population/uncontrolled environment can be satised. Further RF exposure shall be re-evaluated to the scenario of portable, and collocated use. USER MANUAL OF THE END PRODUCT:In the user manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satised.The end user has to also be informed that any changes or modications not expressly approved by the manufacturer could void the user’s authority to operate this equipment.Preliminary Information
Page 13Rev 0.3 © MMB Networks 2018 CSB04PA1x Module Data Sheet9.1.4 | Labeling Requirements The user of this device is responsible for meeting the FCC labeling requirements. A clearly visible label on the exterior enclosure of an incorporating device must list the MMB Research Inc. FCC ID “XFF-CSB04PA1X” and the FCC Notice above (section 9.1.1). The exterior label should use the wording “Contains” or “Contains Transmitter Module”. For example:Contains FCC ID: XFF-CSB04PA1XorContains Transmitter Module FCC ID: XFF-CSB04PA1XAny similar wording that expresses the same meaning may be used. If the labelling area is smaller than the palm of the hand, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.LABEL OF THE END PRODUCT:The nal end product must be labeled in a visible area with the following “Contains TX FCC ID: XFF-CSB04PA1X”. If the labelling area is larger than the palm of the hand, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.9.2 | Industry Canada (IC) Note: this section applies to CSB04PA10-CHP and CSB04PA10-RFC devices only.9.2.1 | Approved AntennaeThis radio transmitter IC: 8365A-CSB04PA1X has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. Antenna Type Manufacturer ModelMaximum Gain (dBi)Nominal Impedance (Ω)Integral Chip Antenna Inpaq ACA-2012-A1-CC-S 1.72 50Dipole AntennaMag-Layers Scientic-Technics Co. Ltd. EDA-1713-2G4C1-A2 5 50Dipole Antenna Bondale G-RA0K13200284-SZ478 5 50For the CSB04PA10-CHP modules using the onboard chip antenna, the approved 802.15.4 power level settings are 19.2 dBm for channels 11-25 and 15 dBm for channel 26. The approved BLE power level settings are 19.2dBm for both connected and advertising modes. For the CSB04PA10-RFC modules using the approved external antenna, the approved 802.15.4 power level settings are 19.2 dBm for channels 11-25 and 8 dBm for channel 26. The approved BLE power level settings are 19.2dBm for connected mode and 15dBm for advertising modes. Preliminary Information
Page 14Rev 0.3 © MMB Networks 2018 CSB04PA1x Module Data Sheet9.2.2 | IC NoticeThis device complies with Industry Canada licence-exempt RSS standard(s).Operation is subject to the following two conditions: (1) this device may not cause interference, and(2) this device must accept any interference, including interference that may cause undesired operation of the device.Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.L’exploitation est autorisée aux deux conditions suivantes : (1) l’appareil ne doit pas produire de brouillage, et (2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.9.2.3 | Labeling RequirementsThe host device shall be properly labelled to identify the modules within the host device. The Industry Canada certication label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the Industry Canada certication number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows:Contains transmitter module IC: 8365A-CSB04PA1XContient le émetteur radio IC: 8365A-CSB04PA1X 9.2.4 | Additional NoticeThis module is intended for an OEM integrator. The OEM integrator is responsible for the compliance to all the rules that apply to the product into which this certied RF module is integrated. Additional testing and certication may be necessary when multiple modules are used. A 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such conguration, the FCC radiation exposure limits set forth for a population/uncontrolled environment can be satised. Further RF exposure shall be re-evaluated to the scenario of portable, and collocated use.9.3 | RoHS ComplianceThe CSB04PA1X devices do not contain any substances in excess of the maximum concentration allowed by Directive 2002/95/EC. The module is RoHS compliant.9.4 | FCC & IC ComplianceIn the event that conditions as described in the manual cannot be met, then the FCC and ISED authorizations are no longer considered valid and the FCC ID and IC certication number cannot be used on the nal product. In these circumstances, the integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and ISED authorization.10 | Revision HistoryRevision Date Comments0.3 2018/07/30Added section 9 forregulatory statements for FCC&IC, Updated 5.2 to include BLE transmit specications. 0.2 2018/05/xx Added BLE5.0 support, other minor typos.0.1 2018/05/07 Initial draftPreliminary Information
Page 15Rev 0.2 © MMB Networks 2018 CSB04PA1x Module Data SheetCopyright © 2018 MMB Research Inc. All rights reserved.The information in this document is subject to change without notice. This document is believed to be accurate and reliable, but the statements contained herein are presented without expressed or implied warranty.MMB Networks is a division of MMB Research Inc RapidSE, RapidHA, and RapidConnect are trademarks of MMB Research Inc. All other trademarks are the property of their respective holders.May 2018500 -243 College StreetToronto, Ontario, CanadaM5T 1R5416.636.3145info@mmbnetworks.comwww.mmbnetworks.com11 | Ordering InformationHardware SKURegulatory ApprovalsRF Output Option StatusCSB04PA10-CHP-N FCC/IC Chip Antenna Engineering SamplesCSB04PA10-PIN-X N/A1Module Pad 1 Engineering SamplesCSB04PA10-RFC-N FCC/IC RF Connector Engineering SamplesCSB04PA11-CHP-D FCC/IC, TBD Chip Antenna Engineering SamplesCSB04PA11-PIN-X N/A1Module Pad 1 Engineering SamplesCSB04PA11-RFC-D FCC/IC, TBD RF Connector Engineering SamplesNotes: 1. The PIN variant of the module has no regulatory approvals. Host manufacturers who decide to use this variant are responsible for full certication of the product. The above table provides the HW SKU which forms the rst part of the complete part number. The complete part number takes the format: CSB04PA1x-yyy-r-zzz. Where r is the regulatory region (E=Europe, N=North America, D=Dual), and zzz represents a three digit programming code.Contact your local MMB sales representative to determine the correct programming code for your application.Preliminary Information

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