MMB Research Z357PA20 ZIGBEE RADIO MODULE User Manual

MMB Research Inc. ZIGBEE RADIO MODULE

User Manual

Page 1Rev 1.1 MMB Networks 2013 MMB Module Data Sheet
MMB Networks EM357 ZigBee Module
Z357PA20-SMT, Z357PA21-SMT Document Rev 1.1
The MMB Networks EM357 ZigBee Module is a drop-in ZigBee
Smart Energy solution. Preloaded with MMB Research’s RapidSE
ZigBee Smart Energy application or RapidHA Home Automation
application, it offers hardware vendors an easy way to integrate
a fully-implemented, automated ZigBee Smart Energy or ZigBee
Home Automation platform into their existing devices.
MMB Networks offers a variety of hardware and software
development tools to facilitate integration. For more information,
please visit http://www.mmbnetworks.com
Contents
1 | General Information ......................................................................................................................2
2 | Memory ...........................................................................................................................................2
3 | Module Pinout ................................................................................................................................2
3.1 | Debug and Programming Interface .........................................................................................................................3
4 | Electrical Specications ................................................................................................................ 3
4.1 | Absolute Maximum Ratings ..........................................................................................................................................3
4.2 | Recommended Operating Conditions ...................................................................................................................3
4.3 | DC Electrical Characteristics ...........................................................................................................................................4
5 | RF Specications ............................................................................................................................4
5.1 | Receive Specifications .......................................................................................................................................................4
5.2 | Transmit Specifications .....................................................................................................................................................5
6 | Functional Specications ............................................................................................................. 5
6.1 | Serial Ports .................................................................................................................................................................................5
6.2 | GPIO ..............................................................................................................................................................................................6
6.3 | Analog to Digital Converter (ADC) ............................................................................................................................7
7 | Mechanical Specications ............................................................................................................8
7.1 | Physical Dimensions ...........................................................................................................................................................8
7.4 | Labelling .....................................................................................................................................................................................9
8 | Soldering Temperature Time Prole for reow soldering (Lead-free solder).....................9
9 | Regulatory Approvals .................................................................................................................10
9.1 | FCC ..............................................................................................................................................................................................10
9.2 | Industry Canada (IC) .......................................................................................................................................................10
10 | Ordering Information ...............................................................................................................11
Page 2Rev 1.1 MMB Networks 2013 MMB Module Data Sheet
1 | General Information
Note that some of the specifications refer to either EM357 or Module. Please note specifications cited as EM357 are taken
from the EM357 datasheet (this should also be noted where referred to). Module means measurements taken with our
production module.
2 | Memory
3 | Module Pinout
SKU RAM (kB) On-Chip Flash (kB) Serial Flash (kB)
Z357A.1.0 12 192 512
Module Pad Function EM357 GPIO (EM357 Pin Number)
1VCC (3.3 VDC) CLK
2 nCTS/SPI Slave PB3 (19)
3 nRTS/SPI Select PB4 (20)
4 nReset, active low (12)
5 PTI_EN PA4 (26)
6 PTI_DATA PA5 (27)
7 JTDO PC2 (33)
8 JTCK (32)
9 JTDI PC3 (34)
10 JTMS PC4 (35)
11 JRST PCO (40)
12 RXD, SPI Slave In PB2 (31)
13 Module Controlled Handshake Line PA6 (29)
14 TXD, SPI Slave Out PB1 (30)
15 GND
Page 3Rev 1.1 MMB Networks 2013 MMB Module Data Sheet
3.1 | Debug and Programming Interface
In order to access the EM357 for programming and debug purposes, it is recommended that the designer incorporate
Ember’s 10-pin InSight Port connector. This will allow Ember’s InSight Adapter (ISA3) to be used. Contact Ember for details
regarding the InSight Port connector and ISA3.
The following table shows a pin mapping between Ember’s 10-pin InSight Port connector and the module, and the graphic
to the right displays the layout of the InSight Port connector.
4 | Electrical Specications
4.1 | Absolute Maximum Ratings
4.2 | Recommended Operating Conditions
Ember InSight Port Pin Module Pin
1 10, 18 (VCC)
2 25 (PC2 / JTDO / SWO)
3 28 (PC0 / JRST)
4 26 (PC3 / JTDI)
5 1, 11, 19, 22, 32 (GND)
6 24 (JTCK)
7 27 (PC4 / JTMS / SWDIO)
8 17, 23 (nReset)
9 7 (PA4/PTI_EN)
10 6 (PA5/PTI_DATA)
Parameter Minimum Maximum Units
Supply Voltage (VCC) 0 3.6 V
Voltage on any GPIO ([PA[0:7], PB[0:7], PC[0:7]), JTCK, nReset -0.3 VCC + 0.3 V
Voltage on any GPIO pin (PA4, PA5, PB5, PB6, PB7, PC1) when used as an input to
the general purpose ADC with the low voltage range selected -0.3 2 V
Ambient Operating Temperature -40 85 °C
Parameter Minimum Typical Maximum Units
Supply Voltage (VCC) 2.7 3.3 3.6 V
Temperature Range -40 85 °C
1 2
3 4
5 6
7 8
9 10
VBRD
PC0 (nJRST)
GND
PC4 (JTMS/SWDIO)
PA4 (PTI_EN)
PC2 (JTDO/SWO)
PC3 (JTDI)
JCLK/SWCLK
nRESET
PA5 (PTI_DATA)
Page 4Rev 1.1 MMB Networks 2013 MMB Module Data Sheet
5 | RF Specications
5.1 | Receive Specifications
Module Receive Characteristics
Parameter Test Condition Min Typical Max Units
Receive sensitivity 1% PER as per IEEE 802.15.4 -107 -106 -100 dBm
Parameter Test Condition Minimum Typical Maximum Units
Deep sleep current
At 25 °C, VCC = 3.3v, shutdown
mode 0.65 TBD μA
Idle current
At 25 °C, VCC = 3.3v, sleep
mode 13 mA
RX current At 25 °C, VCC = 3.3v 32 mA
TX current
At 25 °C, VCC = 3.3v, normal
mode, 20 dBm 175 235 mA
Low Schmitt switching threshold
Schmitt input threshold going
from high to low 0.42 x VCC 0.5 x VCC V
High Schmitt switching threshold
Schmitt input threshold going
from low to high 0.62 x VCC 0.8 x VCC V
Input current for logic 0 -0.5 μA
Input current for logic 1 0.5 μA
Input pull-up resistor value 24 29 34 kΩ
Input pull-down resistor value 24 29 34 kΩ
Output voltage for logic 0 0 0.18 x VCC V
Output voltage for logic 1 0.82 x VCC VCC V
Output source current (standard
current pad) 4 mA
Output sink current (standard
current pad) 4 mA
Output source current, high current
pad: PA6, PA7, PB6, PB7, PC0 8 mA
Output sink current, high current
pad: PA6, PA7, PB6, PB7, PC0 8 mA
Total output current (for I/O Pads) 40 mA
4.3 | DC Electrical Characteristics
Page 5Rev 1.1 MMB Networks 2013 MMB Module Data Sheet
EM357 Receive Characteristics
This table lists the key parameters of the integrated IEEE 802.15.4-2003 receiver on the EM357. This information is taken
from the Ember EM357 Datasheet. This document is available at:
http://www.silabs.com/Support%20Documents/TechnicalDocs/EM35x.pdf
Note: Receive measurements were collected with Ember’s EM35x Ceramic Balun Reference Design (Version A0) at
2440MHz. The Typical number indicates one standard deviation above the mean, measured at room temperature (25°C).
The Min and Max numbers were measured over process corners at room temperature.
5.2 | Transmit Specifications
6 | Functional Specications
6.1 | Serial Ports
Refer to the EM357 data sheet for functionality and associated GPIO pin outs.
Note: The module pin out table in section 2 of this document provides a cross reference between the MMB PA module
pins and the EM357 GPIO.
6.1.1 | SC1 Serial Controller (UART, SPI, TWI)
The SC1 module provides UART, SPI (master or slave), or TWI (master) serial communications.
Serial Controller Features
The SPI master controller has the following features: (*Note: the SPI master controller data is provided to show the hardware
capability. RapidSE is configured as a SPI Slave, not Master)
• Full duplex operation
• Programmable clock frequency (12 MHz max.)
• Programmable clock polarity and clock phase
Parameter Test Condition Min Typical Max Units
Frequency range 2400 2500 MHz
Relative frequency error (2x40
ppm required by IEEE 802.15.4-
2003) -120 120 ppm
Relative timing error (2x40 ppm
required by IEEE 802.15.4-2003) -120 120 ppm
Linear RSSI range As defined by IEEE 802.15.4-2003 40 dB
RSSI Range -90 -40 dB
Parameter Test Condition Min Typical Max Units
Output Power at highest power
setting 20 21 21.5 dBm
Error vector magnitude as per IEEE
802.15.4 5 15 %
Carrier frequency error -40 40 ppm
PSD Mask relative 3.5 MHz distance from carrier -20 dB
PSD Mask absolute 3.5 MHz distance from carrier -30 dBm
Page 6Rev 1.1 MMB Networks 2013 MMB Module Data Sheet
• Selectable data shift direction (either LSB or MSB first)
• Receive and transmit FIFOs
• Receive and transmit DMA channels
• The following signals can be made available on the GPIO pins:
ʳ MOSI (serial data out)
ʳ MISO (serial data in)
ʳ MCLK (serial clock out)
The SPI slave controller has the following features:
• Full duplex operation
• Up to 4 Mbps data transfer rate
• Programmable clock polarity and clock phase
• Selectable data shift direction (either LSB or MSB first)
• Slave select input
• The following signals can be made available on the GPIO pins:
ʳ MOSI (serial data in)
ʳ MISO (serial data out)
ʳ SCLK (serial clock in)
ʳ nSSEL (slave select)
The TWI master controller has the following features:
• Uses only two bidirectional GPIO pins
• Programmable clock frequency (up to 400 kHz)
• Supports 7-bit and 10-bit addressing
• Compatible with Philips I2C-bus slave devices
• The following signals can be made available on the GPIO pins:
ʳ SDA (bidirectional serial data)
ʳ SCL (bidirectional serial clock)
The SC1 UART supports the following features:
• Baud rate (300 bps up to 921.6 kbps) (*Note: these values are provided to show the hardware capability. RapidSE does not
provide the ability to modify the baud rate from the default value of 115.2 kbps. However, MMB can adjust it as necessary
through a Non-Recurring Engineering engagement)
• Data bits (7 or 8)
• Parity bits (none, odd, or even)
• Stop bits (1 or 2)
• False start bit and noise filtering
• Receive and transmit FIFOs
• Optional CTS/RTS flow control
• Receiver and transmit DMA channels
• GPIO signals:
ʳ TXD (serial data out)
ʳ RXD (serial data in)
ʳ nRTS (optional)
ʳ nCTS (optional)
6.2 | GPIO
The EM357 has multi-purpose GPIO pins that may be individually configured as:
• General purpose output
• General purpose open-drain output
• Alternate output controlled by a peripheral device
• Alternate open-drain output controlled by a peripheral device
• Analog
Page 7Rev 1.1 MMB Networks 2013 MMB Module Data Sheet
• General purpose input
• General purpose input with pull-up or pull-down resistor
6.3 | Analog to Digital Converter (ADC)
The ADC is a first-order sigma-delta converter with the following features:
• Resolution of up to 14 bits
• Sample times as fast as 5.33 μs (188 kHz)
• Differential and single-ended conversions from six external and four internal sources
• One voltage range (differential): -VREF to +VREF
• Choice of internal or external VREF
• internal VREF may be output to PB0 or external VREF may be derived from PB0
• Digital offset and gain correction
• Dedicated DMA channel with one-shot and continuous operating modes
Parameter Min Typical Max Units
Conversion time 32 4096 μs
VREF 1.17 1.2 1.23 V
VREF output current 1 mA
VREF load capacitance 10 nF
External VREF voltage range 1.1 1.2 1.3 V
External VREF input impedance 1 M Ohm
Minimum input voltage (input buffer disabled) 0 V
Minimum input voltage (input buffer enabled) 0.1 V
Maximum input voltage (input buffer disabled) VREF V
Maximum input voltage (input buffer enabled) VCC – 0.1 V
Single-ended signal range (input buffer disabled) 0 VREF V
Single-ended signal range (input buffer enabled) 0.1 VCC – 0.1 V
Differential signal range (input buffer disabled) =-VREF =+VREF V
Differential signal range (input buffer enabled) =- VCC + 0.1 +VCC – 0.1 V
Common mode range (input buffer disabled) 0 VREF V
Common mode range (input buffer enabled) VCC/2 V
Input referred ADC offset -10 10 mV
Input impedance (1 MHz sample clock) 1 M Ohm
Input impedance (6 MHz sample clock) 0.5 M Ohm
Input impedance (Not Sampling) 10 M Ohm
Page 8Rev 1.1 MMB Networks 2013 MMB Module Data Sheet
7 | Mechanical Specications
7.1 | Physical Dimensions
Symbol Description Distance
L Length of the module 34.2 mm
W Width of the module 15 mm
H Height of the module 2.88 mm
A1 Pitch 1.27 mm
A2 Distance centre of pad to PCB edge 6 mm
A3 Distance center of pad to PCB edge 3.7 mm
A Length of keep-out zone 7.55 mm
B Width of keep-out zone 6.2 mm
C Keep-out zone from corner of PCB 5 mm (minimum)
D Keep-out zone from corner of PCB 5 mm (minimum)
Page 9Rev 1.1 MMB Networks 2013 MMB Module Data Sheet
7.4 | Labelling
11mm
11mm
8 | Soldering Temperature Time Prole for reow soldering (Lead-free solder)
150˚C - 190˚C
220˚C
30 +20/-10s
90 ±30s
230˚C - 240˚C max
Temp
[ ˚C ]
Time [ s ]
Maximum reflow cycles: 2
Opposite-side reflow is prohibited due to the module weight. You must not place the module on the bottom / underside
of your PCB and re-flow.
Page 10Rev 1.1 MMB Networks 2013 MMB Module Data Sheet
9 | Regulatory Approvals
9.1 | FCC
9.1.1 | FCC Notice
This device (Z357PA20-SMT, Z357PA21-SMT) complies with Part 15 of the FCC rules. Operation is subject to the following
two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired operation.
To comply with FCC RF Exposure requirements, users of this device must ensure that the module be installed and/or
configured to operate with a separation distance of 20cm or more from all persons.
Usage of Channel 26 at full power will result in non-compliance to FCC standards. Manufacturer recommends avoiding use
of channel 26 and if necessary only use with a reduced power setting. For further details please contact Manufacturer.
9.1.2 | Modular Approval
This device (Z357PA20-SMT, Z357PA21-SMT) meets the requirements for modular transmitter approval as detailed in the
FCC public notice DA 00-1407.
It should be noted that:
“While the applicant for a device into which an authorized module is installed is not required to obtain a new authorization
for the module, this does not preclude the possibility that some other form of authorization or testing may be required for
the device (e.g., a WLAN into which an authorized module is installed must still be authorized as a PC peripheral, subject to
the appropriate equipment authorization).”
-- FCC Public Notice DA 00-1407
Caution:
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority
to operate the equipment.
9.1.3 | Labeling Requirements
The user of this device is responsible for meeting the FCC labeling requirements. A clearly visible label on the exterior
enclosure of an incorporating device must list the MMB Research Inc. FCC ID “XFFZ357PA20” and the FCC Notice above
(section 9.1.1).
The exterior label should use the wording “Contains” or “Contains Transmitter Module”. For example:
Contains FCC ID: XFFZ357PA20
or
Contains Transmitter Module FCC ID: XFFZ357PA20
Any similar wording that expresses the same meaning may be used.
9.2 | Industry Canada (IC)
9.2.1 | IC Notice
This device complies with Industry Canada licence-exempt RSS standard(s).
Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes :
(1) l’appareil ne doit pas produire de brouillage, et
(2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en
compromettre le fonctionnement.
Page 11Rev 1.1 MMB Networks 2013 MMB Module Data Sheet
Copyright © 2013 MMB Research Inc. All rights reserved.
The information in this document is subject to change without notice. This document
is believed to be accurate and reliable, but the statements contained herein are
presented without expressed or implied warranty.
MMB Networks is a division of MMB Research Inc.
RapidSE is a trademark of MMB Research Inc.
All other trademarks are the property of their respective holders.
July 2013
25 Prince Arthur Ave.
Toronto, Ontario, Canada
M5R1B2
416.636.3145
info@mmbresearch.com
www.mmbresearch.com
Page 11Rev 1.1 MMB Networks 2013 MMB Module Data Sheet
Copyright © 2013 MMB Research Inc. All rights reserved.
The information in this document is subject to change without notice. This document
is believed to be accurate and reliable, but the statements contained herein are
presented without expressed or implied warranty.
MMB Networks is a division of MMB Research Inc.
RapidSE is a trademark of MMB Research Inc.
All other trademarks are the property of their respective holders.
July 2013
25 Prince Arthur Ave.
Toronto, Ontario, Canada
M5R1B2
416.636.3145
info@mmbresearch.com
www.mmbresearch.com
9.2.2 | Labeling Requirements
The host device shall be properly labelled to identify the modules within the host device. The Industry Canada certification
label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be
labelled to display the Industry Canada certification number of the module, preceded by the words “Contains transmitter
module”, or the word “Contains”, or similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 8365A-Z357PA20
10 | Ordering Information
SKU Interface Option Software Option Security Certicate
Z357PA21-SMT-P-TC Surface Mount Pre-Programmed Test Certificate
Z357PA21-SMT-P-PC Surface Mount Pre-Programmed Production Certificate
Z357PA21-SMT-N Surface Mount No Software N/A

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