MXCHIP Information Technology EMW3081 Embedded WiFi Module User Manual DS0005E EMW3162

Shanghai MXCHIP Information Technology Co.,Ltd. Embedded WiFi Module DS0005E EMW3162

user manual

Overview Features z Support 802.11 b/g/n standard，Consists of a Cortex-M3 microcontroller, WLAN MAC, Base Band and RF. z 512 KB SRAM ,2 MB SDRAM and 2 MB FLASH configuration z Operating Voltage：DC 3.3V z When uses 20MHz bandwidth, the maximum transmission rate reached 72.2Mbps z When uses 40MHz bandwidth, the maximum transmission rate reached 150Mbps z Wi-Fi related features  Support 802.11 b/g/n and compatible  Wi-Fi supports WPS  Support Wi-Fi directly connected  Support Station, Soft AP  Support EasyLink  Having designed for IoT applications to optimize the TCP/IP protocol stack  PCB Antenna or IPX Antenna is optional z Peripheral：  1x HS UART  1x I2C  1x SPI  1x SWD  4x PWM  Up to 15 GPIOs z Working environment temperature：-20℃ to +85℃ Applications: z Smart LED z Smart transportation z Smart home furnishing and intelligent home appliances z Instrument z Medical care z Industrial automation z Smart Security z Smarter Energy Module model Product model Antenna model IntroductionEMW3081-P PCB antenna DefaultEMW3081-E IPX antenna OptionalDate Sheet EMW3081 Embedded Wi-Fi module Version：1.0 Date：2016-2-23 Number：
Copyright statement: Without permission, prohibition of the use or copying any content of this manual in whole or in part, and this applies especially to brand, model name, part number and diagram.
 1 Content Overview .................................................................................................................................................................................. 11.Product summary ......................................................................................................................................................... 41.1.Pinouts ................................................................................................................................................................. 51.2.Pins Definition ................................................................................................................................................... 62.Electrical Parameters ................................................................................................................................................... 82.1Operating Conditions ..................................................................................................................................... 82.2Power Parameters ............................................................................................................................................ 82.3Operating Environment .................................................................................................................................. 92.4ESD ........................................................................................................................................................................ 93.RF Parameters .............................................................................................................................................................. 113.1.General Specification .................................................................................................................................... 114.Antenna Information................................................................................................................................................. 124.1.Antenna type ................................................................................................................................................... 124.2.PCB antenna design requirements ........................................................................................................... 124.3.Approved External Antenna Specification ............................................................................................. 134.4.U.F.L RF Connector ......................................................................................................................................... 155.The assembly information and manufacturing guidance ............................................................................ 165.1.Mechanical dimensions ................................................................................................................................ 165.2.Use guidelines(Please read carefully) ...................................................................................................... 175.3.The matters needing attention .................................................................................................................. 195.4.MSL/Storage Condition ................................................................................................................................ 205.5.Recommended Reflow Profile ................................................................................................................... 206.Label ................................................................................................................................................................................ 227.Firmware encrypt ....................................................................................................................................................... 238.FCC Statement ............................................................................................................................................................. 249.Sales Information and Technical Support .......................................................................................................... 27Diagram Content Figure 2.DIP package dimension ............................................................................................................................... 5Figure 3. Stamp hole packages dimension ............................................................................................................ 5Table1. EMW3081 Pins definition ............................................................................................................................. 6Table 2. Input voltage range ....................................................................................................................................... 8
 2 Table 3. Rated voltage parameters ........................................................................................................................... 8Table 4. EMW3081 power parameters ..................................................................................................................... 8Table 5. Temperature and humidity conditions ................................................................................................... 9Tab le 6 .E SD parameter s ................................................................................................................................................ 9Tab le 7 .RF Standard ...................................................................................................................................................... 11Figure 4. EWM3081-P .................................................................................................................................................. 12Figure 5. EMW3081-E .................................................................................................................................................. 12Figure 6. PCB antenna minimum clearance zone（Unit: mm） ................................................................... 13Figure 7. External antenna connector size diagram ......................................................................................... 15Figure 8. Side View（Unit: mm） ............................................................................................................................ 16Figure 9. Vertical View（Unit: mm） ...................................................................................................................... 16Figure 10. Left View（Unit: mm） ........................................................................................................................... 16Table 11. Temperature and humidity indicator CARDS ................................................................................... 18Figure 12. Storage Condition .................................................................................................................................... 20Figure 13. Temperature Curve .................................................................................................................................. 21 Table Content Table1. EMW3081 Pins definition ........................................................................................................................... 6Table 2. Input voltage range ..................................................................................................................................... 8Table 3. Rated voltage parameters ......................................................................................................................... 8Table 4. EMW3081 power parameters ................................................................................................................... 8
 3 Table 5. Temperature and humidity conditions ................................................................................................. 9Table 6.ESD parameters .............................................................................................................................................. 9Tab le 7 .RF Standard .................................................................................................................................................... 11
 4 1. Product summary EMW3081 is a low-power and high performance embedded Wi-Fi module, which highly integrates ARM-Cortex M3, WLAN MAC/baseband/RF, and built-in 512KB SRAM and 2MB SDRAM，EMW3162 is 3.3V single-power supply，supports stamp hole SMT or DIP，and supports serial transmission and development two times，peripheral： 1x HS UART / 1x SPI /1x I2C / 4x PWM / Up to 15 GPIOs. EMW3081 runs the MiCO iot operating system ， and supports two times development of Configuration， The user can use the MiCO TCP/IP protocol stack, multiple security encryption algorithm to achieve a variety of embedded Wi-Fi application。We also provide a series of independent firmware to meet different application scenarios，Such as UART-Wi-Fi transparent transmission, EasyLink configuration, access a variety of cloud services。 The figure is a block diagram of the hardware module EMW 3081，Mainly it includes four parts： z The main nuclear of Cortex-M3 z WLAN MAC/BB/RF/ANT z Controllers and peripherals z Power Management Description: （1） Cortex-M3 CPU，The max Operating frequency up to 166MHz，Internal integrates 512KB SRAM，2MB SDRAM，Supports high-speed UART，I2C，SPI，PWM，and Multiple GPIOs. （2） 2MB off-chip SPI Flash for customers to develop custom firmware （3） Support PCB antenna and external antenna IPEX （4） Input voltage range : DC 3.3V
 5 1.1. Pinouts EMW3081 uses DIP packages and stamps hole packages interface design，DIP packages（figure 2）can effectively reduce the risk of quality of secondary patch；Stamp hole packages（figure 3） facilitate customers to debug and easy installation, designed to provide customers diversity selection. Windows and solder pads have the same size，recommended SMT stencil thickness is 0.12mm-0.14mm. Figure2.DIPpackagedimensionFigure3.Stampholepackagesdimension
 6 1.2. Pins Definition Table1.EMW3081PinsdefinitionPin Number Name Type Function 1，3 PE4/SWCLK I/O SWCLK 2，4 PE3/SWDIO I/O SWDIO 5，6 NC NC 7 PA3/UART0_RTS I/O USER_UART_RTS（either UART or IO） 8 PA5/UART0_CTS I/O USER_UART_CTS（either UART or IO） 9 PA7/UART0_TXD I/O USER_UART_TX（either UART or IO） 10 PA6/UART0_RXD I/O USER_UART_RX（either UART or IO） 11 CHIP_EN I CHIP_EN(Module enabled, active high) 12 PC0/SPI0_CS/PWM I/O SPI0_CS（IO not available when used as SPI or PWM）13 PC3/SPI0_MISO/PWM I/O SPI0_MISO（O not available when used as SPI or PWM）14 PC2/SPI0_MOSI/PWM I/O SPI0_MOSI（O not available when used as SPI or PWM）15 PC1/SPI0_CLK/PWM I/O SPI0_CLK（O not available when used as SPI or PWM）16 VDD S VDD 17 GND S GND 18 NC NC 19 PC4/I2C1_SDA/BOOT I/O BOOT 20 PC5/I2CI_SCL/STATUS I/O STATUS 21,24 PB0/DEBUG_TXD I/O DEBUG_OUT（either DEBUG or IO） 22,25 PB1/DEBUG_RXD I/O DEBUG_IN（either DEBUG or IO） 23 PB_3/ELINK I/O ELINK z S indicates power pin，I/O indicates GPIO； z NC indicates not connect，Customers do not use this pin； z I indicates Input； z The bold italic indicates standard functions definition for this pin
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 8 2. Electrical Parameters 2.1 Operating Conditions EMW3081 input voltage falls below the minimum rated voltage will cause instability. Must note this point when designed power supply. Table2.InputvoltagerangeSymbol Description Condition Detail Min Typ Max Unit VDD Power supply 3.0 3.3 3.6 V Stresses above the absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table3.RatedvoltageparametersSymbol Description Min Typ Unit VDD The input voltage of Module power supply –0.3 3.6 V VIN The pin’s input voltage of GPIO −0.3 3.6 V 2.2 Power Parameters Table4.EMW3081powerparametersCondition Current（3V3） Description Deep sleep 16 uA Waked up by low power timer and GPIO triggering Sleep 19 mA Stay connected but no data transfer Only CPU operation mode 33 mA CPU clock at 166MHZ, UART/SPI/I2C is available, Wi-Fi is unavailable 11n RX mode 61 mA CPU clock at 166MHZ, UART/SPI/I2C is available, Wi-Fi operates in 11n RX data reception mode
 9 11n TX(when power transmission is 13 dBm) 260mA CPU clock at 166MHZ, UART/SPI/I2C is available, Wi-Fi operates in 11n TX data transmission mode Note: The test data at different firmware versions may be different. 2.3 Operating Environment Table5.Temp eratu reandhumidityconditionsSymbol Name Range Unit TSTG Storage temperature -40 to +85 ℃ TA Operate temperature -20 to +85 ℃ Humidity Noncondensing , relative humidity 95 % 2.4 ESD Table6.ESDparametersSymbol Ratings Conditions Class Max Unit VESD(HBM) Electrostatic discharge voltage (human body model) TA= +25 °C conforming to JESD22-A114 2 2000V VESD(CDM) Electrostatic discharge voltage (charge device model) TA = +25 °C conformingto JESD22-C101 II 500
 10
 11 3. RF Parameters 3.1. General Specification Table7.RFStandardproject Instructions Operating Frequency 2.412~2.462GHz Wi-Fi Standard IEEE802.11b/g/n Date Transmission Rate 20MHz 11b：1,2,5.5,11Mbps 11g : 6,9,12,18,24,36,48,54Mbps 11n : MCS0~7, 72.2Mbps (Channel 1~11) 40MHz 11n：MCS0~7, 150Mbps (Channel 3~9) Antenna type PCB antenna(default) IPX external antenna (optional)
 12 4. Antenna Information 4.1. Antenna type EMW3081 have two antenna types: PCB built-in antenna and external antenna, the models are EMW3081-P and EMW3081-E. Figure4.EWM3081‐P Figure5.EMW3081‐E4.2. PCB antenna design requirements Components are strictly forbidden to place in the surrounding 15mm of PCB antenna area in module. Such the shaded area need away from metal devices, sensors, interference sources and other materials may cause signal interference。
 13 Figure6.PCBantennaminimumclearancezone（Unit:mm）4.3. Approved External Antenna Specification Model Name:IPEX1.13-2.4G Brass Pipe Antenna-L32 Manufacture Name: Shenzhen Zhengda Letter Communications Equipment Co.,Ltd NO. NAME DESCRIPTION QUANTITY PART NUMBER1 Cable L =32±2mm 1 1301-0010 2 Brass Pipe 4.4*23mm 1 1113-0004
 14 3 IPEX 20278-113R 1 1101-0001 Gain: <2.0dBi Impedance: 50OHM Frequency Range: 2400-2500MHz VSWR <2.0 To meet requirements of design, External Antenna must satisfy parameters above.
 15 4.4. U.F.L RF Connector Figure7.Externalantennaconnectorsizediagram
 16 5. The assembly information and manufacturing guidance 5.1. Mechanical dimensions Figure8.SideView（Unit:mm） Figure9.VerticalView（Unit:mm） Figure10.LeftView（Unit:mm）
 17 5.2. Use guidelines(Please read carefully) z Stamps Wi-Fi modules from MXCHIP must be soldered with SMT machine. After unpacking and burn the firmware patch must be completed within 24, or to re-vacuum packaging, Must be baking before patching the modules  SMT need machine: （1）Reflow soldering SMT machine （2）The AOI detector （3）6-8 mm diameter suction nozzle  baking need equipment: （1）Cabinet baking box （2）The antistatic, high temperature resistant tray （3）The antistatic high temperature resistant gloves z Storage conditions as follows： （1）Moisture bag must be stored in a temperature < 30 ° C, humidity 85% RH of the environment. （2）Dry packing products, the guarantee period should be from 6 months from the date of Packing seal. （3）Sealed packaging is equipped with humidity indicator card, as shown in Figure 11.
 18 Table11.Temp eratu reandhumidityindicatorCARDSz Humidity indicator CARDS and baking several ways as follow:  When opened, if the temperature and humidity indicator CARDS read 30%, 40%, 50%, three colors are blue, to continue to bake for 2 hours for module;  When opened, if the humidity indicator CARDS read 30% color ring into pink, need to continue to bake module 4 hours;  When opened, if the humidity indicator CARDS read into 30%, 40%, color ring into pink, need to continue to bake for 6 hours module;  When opened, if the humidity indicator CARDS read into 30%, 40%, 50% are pink color ring, need to continue to bake for 12 hours module;  When opened, if the humidity indicator CARDS read into 10%, 20%, 30% ,40%are pink
 19 color ring, need to continue to bake for 14 hours module; z Baking parameters are as follows:  Baking temperature: 125 ℃ + / - 5 ℃;  Set the alarm temperature as 130 ℃;  Under the condition of natural cooling < 36 ℃, SMT placement can be made;  Dry times: 1 times; z If opened the time more than 3 months, please ban the use of SMT process welding this batch module, zedoary because PCB process, more than 3 months bonding pad oxidation, SMT is likely to cause virtual welding, welding, the resulting problems we do not assume corresponding responsibility. z Please to ESD（static discharge，static electricity discharge） protection module before SMT; z Please according to the SMT reflow soldering curve, peak temperature 245 ℃, reflow soldering temperature curve as shown in figure 11，section 5.5. z For the first time in order to ensure the qualified rate of reflow soldering, first SMT please extraction 10% product to visual analysis, AOI inspection, to ensure that the furnace temperature control, device adsorption method, the rationality of the put way; Suggestions：when batch production per hour 5-10 pieces of visual analysis, AOI test. 5.3. The matters needing attention z In the entire production, Each station of the operator must wear anti-static gloves; z When baking, no more than baking time; z When roasting, it is forbidden to join explosive, flammable, corrosive substances; z When baking, high temperature module application tray in the oven, keep the air circulation between each module, at the same time avoid direct contact with the oven wall module; z Baking, please will bake the door is closed, the guarantee baking box sealing, prevent leakage, temperature influence the baking effect;
 20 z Don't open the door, as far as possible when baking box running if must open, shortening the time of can open the door as far as possible; z After baking, must be natural cooling modules to < 36 ℃ before wear anti-static gloves out, so as not to burn. z Operation, forbidden module bottom touch water or dirt; z Temperature and humidity control level for Level3, storage and baking conditions based on IPC/JEDEC J - STD - 020. 5.4. MSL/Storage Condition Figure12.StorageCondition5.5. Recommended Reflow Profile Reflow times<= 2times (Max.)
 21 Figure13.Temp eratu reCurve
 22 6. Label Label of EMW3081-E Label of EMW3081-P Label of Location
 23 7. Firmware encrypt Firmware version : 0000.0000.AL10 In order to make sure the firmware could not be modified after programming in the module by unauthorized party, firmware must be encrypted with the bootloader drivers and the chip ID MXCHIP offered. Bootloaderdriver is used to drive the device in the module and integrated with one AES encryption way. The application part of the firmware must be combined with the bootloader driver to generate one MVA/bin file after adding the chip ID details which can be used to identify MXCHIP module. Check the official website for more information. Note: Unauthorized party is forbidden from modification. Everyone cannot change new firmware by anyway , otherwise it will cause bad work.
 24 8. FCC Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. Such modifications could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. RF Exposure Information This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm
 25 between the radiator & your body. This module is only used into fixed host applications. The module is only for integration in fixed applications. Label Information to the End User by the OEM or Integrators This Module used affixed label with FCC ID: P53-EMW3081. If the FCC ID of this module is not visible when it is installed inside another device, then the outside of the device into which the module is installed must be label with "Contains FCC ID: P53-EMW3081". The labels above must be included in the application for equipment Authorization; This module complies with Part 15 of the FCC rules, but the usage of module by integrator (OEM) is subject to and fully informed of the following conditions: Integrator (OEM) is Responsible for ensuring host complying with the according FCC rules, when module collocates with other radiators operating individually or simultaneously. This includes compliance for the summation of all emissions from all output occupying the same or overlapping frequency ranges, as defined by the applicable FCC rules. Necessary actions by integrator (OEM) on final host devices with compliance and authorization: The integrator shall not use any other antennas except the approved one or same type with same in and out of band characteristics, otherwise additional approvals are necessary.
 26 Changes or modification unapproved on module may break compliance, otherwise additional approvals are performed. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product.
 27 9. Sales Information and Technical Support If you need to get the latest information on this product or our buy this product，please call us during the working hours. Office hours： From Monday to Friday, morning 9:00~12:00, afternoon 13:00~18:00 Telephone: +86-21-52655026 Contact address: 9F, 5 Building, No.2145 Jinshajiang Road, Shanghai, China Postcode : 200333 Email: sales@mxchip.com

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