MXCHIP Information Technology EMW3166 Embedded WiFi module User Manual xxxDataSheet

Shanghai MXCHIP Information Technology Co.,Ltd. Embedded WiFi module xxxDataSheet

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EMW3166 User Manual

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Shanghai MXCHIP Information Technology Co., Ltd. Address：Floor 9, Building 5, No. 2145, Putuo District, Shanghai (200333) Telephone：021-52709556 Website：http://mxchip.com/ Track Number: AN00048EN MXCHIP Co., Ltd Version: 0.3 11.17.2016 Category: Application Note Open EMW3166 _Guide For User Design Abstract This note lists the matters need attention in each stage of designing and manufacturing while using MXCHIP module. In order to achieve rapid mass production, application designers need learn this note first. Consider and avoid all possible problems which may happen during designing, manufacturing, firmware programming and testing ahead of time. More Help Please login the website: http://mxchip.com/ to get Mxchip's latest product information. You can also login MiCO Developer Forum: http://mico.io/ to get more recent development information about MiCO. You can also login MiCO Developer Forum: http://easylink.io/ to get more recent development information about FogCloud.

Application Note [Page 1] EMW3166_Guide For User Design Version Record Date Version Update content 9-23-2016V0.1 Initial version. 9-23-2016V0.2 Add reference circuit 11-17-2016V0.3 Update FW download and test method

Application Note [Page 3] EMW3166_Guide For User Design Picture Catalog Figure 1 EMW3166 top view .............................................................................................................................. 4 Figure 2 EMW3166 Hardware block ................................................................................................................... 5 Figure 3 Vertical view .......................................................................................................................................... 6 Figure 4 side view ................................................................................................................................................ 6 Figure 5 Recommended Package for SMT .......................................................................................................... 7 Figure 6 Recommended Circuit Design ............................................................................................................... 8 Figure 7 Minimum Size of Keep-out Zone Around Antenna ............................................................................... 9 Figure 8 Module Position Recommended on Mother Board ............................................................................. 10 Figure 9 U.F.L Connector Size ........................................................................................................................... 11 Figure 10 Development Board Switch Settings ................................................................................................. 12 Figure 11 Hyper Terminal Setting Connection .................................................................................................. 13 Figure 12 Testing Results .................................................................................................................................. 14 Figure 13 Recommended Stencil Aperture ........................................................................................................ 15 Figure 14 Reflow soldering temperature curve ................................................................................................. 16 Table Catalog Table 1 Warehousing Detection Equipment List ............................................................................................... 12

Application Note [Page 4] EMW3166_Guide For User Design 1. IntroductionThis note lists the matters need attention in each stage of designing and manufacturing while using MXCHIP module. In order to achieve rapid mass production, application designers need learn this note first. Consider and avoid all possible problems which may happen during designing, manufacturing, firmware programming and testing ahead of time. Applicative module type: EMW3166 seriesTo note stage: Hardware designingFirmware programmingProduction SMTOTA upgradingBasic features of module: Globally unique MAC ID for each moduleTwo antenna designing types:PCB printed antenna and external one using U.F.L RF connectorPeak current 320mA @ 3.3VIn-built production test modeIn-built OTA modeReflow soldering when SMTEMW3166 top view： Figure 1 EMW3166 top view

Figure 1 EMW3166 top view EMW3166_Guide For User Design Application Note [Page 4]

Application Note [Page 5] EMW3166_Guide For User Design EMW3166 model list: Module model Antenna type Description EMW3166-P PCB printed Antenna Default EMW3166-E External antenna to IPX Optional EMW3166-B PIFA antennaOptional EMW3166 Wi-Fi Module Hardware BlockNetworkProcessorADCFlash1M bytesWLANSubsystem2.4GHz radioU.F.L connectorOn-boardPCB AntFlash 2M bytesPowerMangement3.3V Input26MHzOSC26MHzOSCSRAM256K bytes32.768KHzOSCTimer/PWMUARTI2CGPIOSPISDIOSPI802.11b/g/n MAC/Baseband/radio 100MHzCortex-M4 MCUAntenna Type:

[Page 6] EMW3166 Pin Designation 1.2EMW3166 owns two groups of pins (1X20 + 1X21). The lead pitch is 1mm. EMW3166 has half-hole footprint fit for hand-soldering EMW3166 pinouts: Figure 5 Half-hole package dimension Recommended Footprint Design 1.3Recommended footprint (Unit: mm): Figure 6 Recommended Footprint Pin Arrangement 1.4The general pin description:

[Page 7] EMW3166 Table 1 EMW3166 pin arrangement Pins Name Type I/O level Functions Note 1 - - - NC 2 PB2 I/O FT GPIO BOOT1 √ 3 - - - NC 4 PB15 I/O FT SPI2_MOSI GPIO TIM12_CH2 I2S2_SD √ 5 PB12 I/O FT SPI2_NSS GPIO CAN2_RX I2S2_WS √ 6 PB13 I/O FT SPI2_SCK GPIO CAN2_TX I2S2_CK √ 7 PB14 I/O FT SPI2_MISO GPIO TIM12_CH1 √ 8 PC6 I/O FT UART6_TXD GPIO TIM3_CH1 I2S2_MCK ×DEBUG_OUT 9 PA15 I/O FT GPIO JTDI TIM2_CH1 USART1_TXD ×（EasyLink） 10 VBAT S - VBAT × 11 - - - NC 12 PC7 I/O FT UART6_RXD GPIO TIM3_CH2 I2S2_CK ×DEBUG_IN 13 NRST I/O FT RESET × 14 PC0 I TC GPIO WAKEUP √ 15 - - - NC 16 PC13 I/O FT GPIO √ 17 PB8 I/O FT I2C1_SCL GPIO TIM4_CH3 CAN1_RX √

[Page 8] EMW3166 Pins Name Type I/O level Functions Note 18 PB9 I/O FT I2C1_SDA GPIO TIM4_CH4 CAN1_TX √ 19 PB10 I/O FT GPIO TIM2_CH3 I2S2_CK √ 20 GND S - GND × 21 GND S - GND × 22 - - - NC 23 - - - NC 24 - - - NC 25 PA14 I/O FT SWCLK × 26 PA13 I/O FT SWDIO × 27 PB3 I/O FT GPIO TIM2_CH2 USART1_RXD √ 28 - - - NC 29 PB7 I/O FT UART1_RXD GPIO TIM4_CH2 I2C1_SDA √USER_UART_RX30 PB6 I/O FT UART1_TXD GPIO TIM4_CH1 I2C1_SCL √USER_UART_TX31 PB4 I/O FT GPIO JTRST TIM3_CH1 √ 32 - - - NC 33 PA10 I/O FT USB_ID GPIO TIM1_CH3 √ 34 PA5 I/O TC GPIO ADC1_5 √ 35 PA11 I/O FT USB_DM GPIO TIM1_CH4 UART1_CTS √ 36 PA12 I/O FT USB_DP GPIO TIM1_ETR UART1_RTS ×（BOOT）

[Page 9] EMW3166 Pins Name Type I/O level Functions Note 37 PB0 I/O FT GPIO ADC1_8 ×（STATUS） 38 PA4 I/O TC GPIO ADC1_4 √ 39 VDD S - 3.3V × 40 VDD S - 3.3V × 41 ANT - - ANT × Notes: 1. PIN10, PIN39, PIN40 need connect to VDD 3V3 power and PIN20, PIN21 connects to GND.2. PIN8 and PIN12 are used for secondary burning, ATE and QC auto detection.3. PIN29 and PIN30 are used as serial communication port for application.4. “S” indicates “power supply”, “I” indicates “input pin”, “I/O” indicates “input/output pin”.5. “FT” indicates the maximum tolerance input voltage is 5V. The maximum tolerance voltage could not be overVCC when configured as analog I/O or RTC.6. TC=standard 3.6V I/O.7. PIN4~7 could not be used as the other functions except for the SPI1 interface of on-board flash.8. Take SWD (PIN25, PIN26) as the replacement of JTAG to debug or download firmware.9. “√” indicates the pin which could be used for customized applications, while “×” could not be used besides twogroups “serial” and one group “SPI”.10. Please refer to MXCHIP for more support.Important Note: If developers build an application based on MICO system, they can define or modify the function forevery pin on EMW3166. The pin arrangement of the firmware MXCHIP developed could take the Application Note as a reference.

Application Note [Page 10] EMW3166_Guide For User Design 2. Hardware design attention Mechanical dimensions 2.1EMW3166mechanical dimension of vertical view: Figure 3 Vertical view EMW3166 mechanical dimension of side view: Figure 4 side view Recommended package design 2.2The figure followed below is the recommended package design MXCHIP suggested while designing the baseplate. The solder window has the same size of the pad.

Application Note [Page 11 EMW3166_Guide For User Design Figure 5 Recommended Package for SMT DC power design 2.3 Peak current of EMW3166 is about 320mA. The DC/DC power chip MXCHIP recommended should be whosemaximum output current is over 600mA. DC/DC gets more superiority on power conversion than LDO.When using DC/DC power chip, except for the requirements of output voltage (3.3V) and maximum current(600mA), application designer should pay more attention on the arrangement of wires. For instance, device shouldbe compact enough, the ground of input and output should be well connected and the feedback signal should be faraway from the inductance and the Schottky diode. Please refer to the datasheet of DC/DC power chip for moreinformation.When using LDO power chip, application designer need notice on the maximum current (600mA) and heatdissipation.1.4 Recommended circuit designSet the GND apart from power supply when designing layout to avoid the instantaneous peak current when poweron.

Application Note [Page 12]EMW3166_Guide For User Design RF design 2.52.5.1 PCB antenna design When integrating the WiFi module with on board PCB printed antenna, make sure the area around the antenna end the module protrudes at least 15mm from the mother board PCB and any metal enclosure. The area under the antenna end of the module should be keep clear of metallic components, connectors, sensors, traces and other materials that can interfere with the radio signal. Figure 7 Minimum Size of Keep-out Zone Around Antenna Areas on the mother board MXCHIP recommended showed below can reduce the noise to PCB antenna and radio signal. UserPadUserPadUser padModel NumberPCB Antenna positionLeft headromm areaRightheadromm areaFront headrommareaAntenna headromm area distance with user padBack headromm areaObserve headromm areaFront headromm area

Application Note [Page 13]EMW3166_Guide For User Design Figure 8 Module Position Recommended on Mother Board 2.5.2 T U.F.L RF Connector Make sure the connector is matched when choosing the external antenna. Mechanical dimensions of U.F.L RF connector shows as followed.

Application Note [Page 14]EMW3166_Guide For User Design Figure 9 U.F.L Connector Size ESD design 2.6ESD grade of module: Human Body Model (HBM) sensitivity is 2000V, Charged Device Model (CDM) sensitivity is 500V. If a higher ESD level is required, the pins that may be connected to the outside should be reserved place for the ESD protection device. If the module connects the mother board by outside leads, application designers should notice the EMI problems. Using shield cable or reserving the position for common mode choke to solve this problem.

Application Note [Page 15]EMW3166_Guide For User Design 3. Firmware programming and warehousing detection method Receiving Inspection Device List 3.1Auxiliary Equipment list shows below: Table 1 Warehousing Detection Auxiliary Equipment List Auxiliary Equipment Quantity PC 1（pcs） Fixture 1（pcs） EMWE-3166-A V1.0 Development Board 1（pcs） Note: It is not for sale in above the table Auxiliary Equipment.Application software and firmware: FT230XS (drivers on PC), download link: http://www.ftdichip.com/Drivers/VCP.htm Programming firmware should be confirmed by both MXCHIP FAE and guests. Its size is 512kbytes. The set of the three toggle switches on EMWE-3166-A V1.0 development board: Figure 10 Development Board Switch Settings Collection 3.2Connect the fixture to the EMWE-3166-A V1.0 development board by the pin header. Connect the EMWE-3166-A V1.0 development board to PC by USB Mini cable. Red led lights if connected. Warehousing detection 3.33.3.1 Software setting Software：Hyper Terminal Find the COM number where EMW3166 connect with PC in “device manager”.

Application Note [Page 16]EMW3166_Guide For User Design Set as followed: Figure 11 Hyper Terminal Setting Connection 3.3.2 Module testing Click “connect” in “Hyper Terminal” to connect the PC to EMWE-3166-A V1.0 development board. Place the module on the fixture. Press down the handle. 3.3.3 Testing result It lists the testing result from serial on “Hyper Terminal”. The message includes: bootloader version, library version, application version, driver version, MAC address, APs’ name and signal strength. Set portsBitData bitsparitystopdata flow controlNoneNoneResetEnsure Cancel ApplyProperty

Application Note [Page 17] EMW3166_Guide For User Design Figure 12 Testing Results Statements 3.4MXCHIP has the obligation to guarantee there is no quality problem for the module delivered at eachbatch. If problems are found while sampling module, customer has the right to require MXCHIP to give a timelyreplacement. If problems are found after welding the module on mother board without any warehousing detection,MXCHIP is only responsible for the compensation of module. MXCHIP has the obligation to assist solving various technical problems, without retaining any MVA/BINfile of customer. Customer has the obligation to record every firmware version during the firmware developing work anduse the proper firmware for production. versionLiblary versionApplication versionDriver versionMAC AddressHotspot Namesignal strength

Application Note [Page 19] EMW3166_Guide For User Design Figure 14 Reflow soldering temperature curve

Application Note [Page 20] EMW3166_Guide For User Design 5. Mass production testing and firmware upgradingIn addition to considering the product features, application designer need to think over how to do test and upgrade firmware when developing. Mass production test 5.1Avoid finding problem after installing the PCB boards in machine 5.1.1 EMSP command way Connect the module to the MCU of the mother board by serial port and use the EMSP command. Choose one triggering way---- set one combination key, to send the test command from the MCU. The test command could be one EMSP command used to scan the APs around or connect one specified AP. The way can test both of the serial function and the RF function. 5.1.2 Limited development firmware Connect the module to the MCU of the mother board by serial port. Add the test command in the firmware when developing. The test command could be one command from serial port used to scan the APs and return the results by serial port. The way can test both of the serial function and the RF function by using the same triggering way. 5.1.3 Full development firmware Full development works for the whole application of the project. Test method could be flexible in the way. It can set a specific way to test every function of the module. The application determines the specific test details. Upgrading 5.2Upgrading by OTA is recommended. OTA-over the air, is one wireless upgrading way. The upgrading method is offered by MXCHIP. Several application cases are provided as referenced. Firmware could be upgraded to the latest version by OTA with this upgrading method applied.

Application Note [Page 21] EMW3166_Guide For User Design 6. Firmware encryptIn order to make sure the firmware could not be modified after programming in the module, firmware must be encrypted with the bootloader drivers and the chip ID MXCHIP offered. Bootloader driver is used to drive the device in the module and integrated with one AES encryption way. The application part of the firmware must be combined with the bootloader driver to generate one MVA/bin file after adding the chip ID details which can be used to identify MXCHIP module. Check the official website for more information.

Application Note [Page 22] EMW3166_Guide For User Design 7. Sales and technical support informationIf you need to buy this product, please call MXCHIP during the working hours. (Monday ~ Friday ： A.M. 9:00~12:00; P.M. 1:00~6:00) Telephone: +86-021-52655026 Address: 9th Floor, 5# building, Lane 2145, Jinshajiang Road, Putuo District, Shanghai Post Code: 200333 Email: sales@mxchip.com Company email: http://www.mxchip.com For the latest information about products, please refer to: http://www.mxchip.com Related technical support please contact: a. Wireless network technology support:+86 (21) 52655026-812, Email: support@mxchip.com.b. Technical support for development tools:+86 (21) 52655026-822, Email: support@mxchip.com.

Application Note [Page 23]EMW3166_Guide For User Design 8. FCC Statement FCC identification number is not visible when the device is installed inside another device, then theoutside of the device into which the device is installed must also display a label referring to the encloseddevice. This exterior label can use wording such as the following: “Contains FCC ID:P53- EMW3166”This device complies with part 15 of the FCC Rules. Operation is subject to thefollowing two conditions:(1) This device may not cause harmful interference, and(2) This device must accept any interference received, including interference that may cause undesiredoperation. Changes or modifications not expressly approved by the party responsible for compliancecould void the user's authority to operate the equipment.NOTE: This equipment has been tested and found to comply with the limits for a Class B digitaldevice, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonableprotection against harmful interference in a residential installation. This equipment generates, uses andcan radiate radio frequency energy and, if not installed and used in accordance with the instructions,may cause harmful interference to radio communications. However, there is no guarantee thatinterference will not occur in a particular installation. If this equipment does cause harmful interferenceto radio or television reception, which can be determined byturning the equipment off and on, the useris encouraged to try to correct the interference by one ormore of the following measures:This transmitter must not be co‐located or operating in conjunction with any other antenna or transmitter.This device must be installed and operated with a minimum distance of 20 cm between the radiator anduser body. -- Reorient or relocate the receiving antenna.-- Increase the separation between the equipment and receiver.--Connect the equipment into an outlet on a circuit different from that to whichthe receiver is connected.-- Consult the dealer or an experienced radio/TV technician for help.Note 1: Compliance of this device in all final host configurations is the responsibility of the Grantee.OEM integrators are responsible to satisfy RF exposure requirements.Note 2: Any modifications made to the module will void the Grant of Certification, this module is limited to OEMinstallation only and must not be sold to end-users, end-user has no manual instructions to remove or install thedevice, only software or operating procedure shall be placed in the end-user operating manual of final products.Note 3: The device must not transmit simultaneously with any other antenna or transmitter.Note 4: To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Since this may depend on the details of how the module is integrated with the host, Shanghai MXCHIP Information Technology Co., Ltd. shall provide guidance to the host manufacturer for compliance with the Part 15B requirements.The transmitter module must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the host product.Shanghai MXCHIP Information Technology Co., Ltd.is responsible for the compliance of the module in all final hosts.FCC Radiation Exposure StatementThis device complies with FCC RF radiation exposure limits set forth for an uncontrolled environment.